TW201533765A - Complex protection device - Google Patents
Complex protection device Download PDFInfo
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- TW201533765A TW201533765A TW103118168A TW103118168A TW201533765A TW 201533765 A TW201533765 A TW 201533765A TW 103118168 A TW103118168 A TW 103118168A TW 103118168 A TW103118168 A TW 103118168A TW 201533765 A TW201533765 A TW 201533765A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
- H02J7/00308—Overvoltage protection
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Abstract
Description
本發明係關於一種複合保護裝置，特別關於具有兩個表面安裝電阻元件及印刷電阻元件設置於其中的一種複合保護裝置，因此一電路及設置於該電路的電路元件可防止過量電壓及過量電流，而且該印刷電阻元件係配置在該表面安裝電阻元件，因此達到產品微型化。 The present invention relates to a composite protection device, and more particularly to a composite protection device having two surface mount resistive elements and printed resistive elements disposed therein, such that a circuit and circuit components disposed on the circuit can prevent excessive voltage and excessive current, Moreover, the printed resistive element is disposed on the surface mount resistive element, thereby achieving miniaturization of the product.
一種非回復型保護裝置，響應於一過熱而運作，該過熱由於一保護設備或環境溫度的過量電流而產生，該非回復型保護裝置係在一指定溫度下運作並且截斷一電子電路。舉例來說，有一個保護器裝置響應於一設備的訊號電流檢測異常而加熱一電阻，並且操作使用產生之熱的一熔絲元件。 A non-return type protection device operates in response to an overheating due to an excessive current in a protective device or ambient temperature, the non-recoverable protection device operating at a specified temperature and intercepting an electronic circuit. For example, a protector device heats a resistor in response to an abnormality in signal current detection of a device and operates a fuse element that uses the generated heat.
韓國專利公開號第10-2001-0006916號揭露了一種保護裝置，具有設置於一保護裝置基板上的低熔點金屬本體電極以及一加熱元件，一低熔點金屬本體係直接形成於該等低熔點金屬本體電極以及該加熱元件上，由一固體助焊劑形成的一內密封部被設置在該低熔點金屬本體，以防止該低熔點金屬本體的表面氧化，以及一外密封部或蓋體，設置於該內密封部的外表面，以在該低熔點金屬本體之斷開期間防止熔體洩漏到該裝置的外面。 Korean Patent Publication No. 10-2001-0006916 discloses a protection device having a low melting point metal body electrode disposed on a substrate of a protection device and a heating element, and a low melting point metal system is directly formed on the low melting point metal An inner seal formed by a solid flux on the body electrode and the heating element is disposed on the low melting metal body to prevent surface oxidation of the low melting metal body, and an outer seal or cover is disposed on the body The outer surface of the inner seal prevents the melt from leaking out of the device during the opening of the low melting metal body.
第13a圖及第13b圖示出了另一種傳統的保護裝置，其中一可熔元件(一低熔點金屬本體)被形成在一電阻(一熱元件)上。 Figures 13a and 13b show another conventional protection device in which a fusible element (a low melting metal body) is formed on a resistor (a thermal element).
參照第13a圖及第13b圖所示，在傳統的保護裝置中，一黏貼 式電阻2被施加至一陶瓷基板1，一絕緣器3、熔絲端子4、一可熔元件5及一殼體6係依序堆疊在該黏貼式電阻2上，且該熔絲端子4的一連接部4a被連接至一電阻端子8。 Referring to Figures 13a and 13b, in a conventional protective device, a sticker The resistor 2 is applied to a ceramic substrate 1, an insulator 3, a fuse terminal 4, a fusible element 5 and a casing 6 are sequentially stacked on the adhesive resistor 2, and the fuse terminal 4 is A connecting portion 4a is connected to a resistor terminal 8.
在這種一傳統保護裝置中，該可熔元件5被設置在該黏貼式電阻2，並且因增加此該保護裝置的厚度。 In such a conventional protection device, the fusible element 5 is disposed on the adhesive resistor 2, and the thickness of the protection device is increased.
再者，當該黏貼式電阻2被使用時，該保護裝置具有弱耐久性，不適合應用於高功率，並且難以應付各種環境。 Furthermore, when the adhesive resistor 2 is used, the protection device has weak durability, is not suitable for application to high power, and is difficult to cope with various environments.
因此，本發明係基於上述問題而被創作，本發明之一目的係提供一種複合保護裝置，表面安裝電阻元件及印刷電阻元件係設置於其中，因此一電路以及設置於該電路的一電路元件可防止過量電壓及過量電流。 Therefore, the present invention has been made based on the above problems, and an object of the present invention is to provide a composite protection device in which a surface mount resistive element and a printed resistive element are disposed, so that a circuit and a circuit component disposed on the circuit can be Prevent excessive voltage and excessive current.
本發明之另一目的係提供一種複合保護裝置，其中該印刷電路板係配置於表面安裝電阻元件之下，因此可達成產品微型化，且該相對電阻元件無需導線而安裝在一基板上，因此一自動化過程可以很輕易地應用。 Another object of the present invention is to provide a composite protection device in which the printed circuit board is disposed under a surface-mounted resistance element, thereby achieving product miniaturization, and the opposite resistance element is mounted on a substrate without wires, An automated process can be easily applied.
本發明之另一目的係提供一種複合保護裝置，其可根據藉由組合具有不同結構的各種電阻元件的一期望電阻值或一電功率來進行較佳設計。 Another object of the present invention is to provide a composite protection device that can be preferably designed according to a desired resistance value or an electric power by combining various resistance elements having different structures.
本發明之另一目的係提供一種複合保護裝置，其中表面電阻元件及印刷電阻元件係設置在一可熔元件的兩側，而且因此熱特性可被改進，若過量電壓施加時，該可熔元件的斷開時間可被縮短，並且一足夠絕緣距離可被取得。 Another object of the present invention is to provide a composite protection device in which a surface resistive element and a printed resistive element are disposed on both sides of a fusible element, and thus thermal characteristics can be improved, and if an excessive voltage is applied, the fusible element The breaking time can be shortened and a sufficient insulation distance can be obtained.
本發明之另一目的係提供一種複合保護裝置，其中表面安裝電阻元件及印刷電阻元件具有共同的端子，因此，可達成結構的簡化及產品的微型化。 Another object of the present invention is to provide a composite protection device in which a surface mount resistive element and a printed resistive element have a common terminal, and thus, simplification of the structure and miniaturization of the product can be achieved.
本發明之再另一目的係提供一種複合保護裝置，其中一斷開感測部係形成於一導電層，因此當過量電壓時，一可熔元件的斷開可被有效地進行。 Still another object of the present invention is to provide a composite protection device in which a disconnection sensing portion is formed on a conductive layer, so that when an excessive voltage is applied, the disconnection of a fusible element can be efficiently performed.
根據本發明的一態樣，係提供一種複合保護裝置，包括：一基板，具有形成於其上之熔絲端子、第一電阻端子及第二電阻端子，以及連接該等第一電阻端子及該等第二電阻端子的連接端子；一可熔元件，連接至該等熔絲端子；一第一表面安裝電阻元件，連接至該等第一電阻端子；一第二表面安裝電阻元件，連接至該等第二電阻端子；一開關元件，當過量電壓施加時，控制流至該第一表面安裝電阻元件及該第二表面安裝電阻元件的電流；一第一絕緣層，形成於該等連接端子上；以及一導電層，形成於該第一絕緣層上，其中，一斷開感測部係提供於該導電層上，藉由自該第一表面安裝電阻元件及該第二表面安裝電阻元件產生的熱而熔化，誘導該可熔元件的斷開。 According to an aspect of the present invention, a composite protection device includes: a substrate having a fuse terminal formed thereon, a first resistance terminal, and a second resistance terminal, and connecting the first resistance terminals and the a connection terminal of the second resistance terminal; a fusible element connected to the fuse terminals; a first surface mount resistance element connected to the first resistance terminals; and a second surface mount resistance element connected to the a second resistance terminal; a switching element that controls current flowing to the first surface mount resistor element and the second surface mount resistor element when an excess voltage is applied; a first insulating layer formed on the connection terminals And a conductive layer formed on the first insulating layer, wherein a disconnection sensing portion is provided on the conductive layer, and the resistive component is mounted from the first surface and the second surface mount resistive component is generated The heat melts and induces the disconnection of the fusible element.
在該複合保護裝置中，該導電層更包含一導電部，從該斷開感測部的一側延伸，並連接該可熔元件及該第一表面安裝電阻元件。 In the composite protection device, the conductive layer further includes a conductive portion extending from one side of the disconnection sensing portion and connecting the fusible element and the first surface mount resistive element.
在該複合保護裝置中，該導電層更包含一熱傳導層，從該斷開感測部另一側延伸，並連接該可熔元件及該第二表面安裝電阻元件。 In the composite protection device, the conductive layer further includes a heat conduction layer extending from the other side of the disconnection sensing portion and connecting the fusible element and the second surface mount resistance element.
在該複合保護裝置中，該斷開感測部恰好係設置在該可熔元件之下，並具有比該導電部及該熱傳導層更大的一寬度。 In the composite protection device, the disconnection sensing portion is disposed just below the fusible element and has a larger width than the conductive portion and the thermally conductive layer.
在該複合保護裝置中，該斷開感測部恰好係設置在該可熔元件之下，並在該可熔元件的縱向方向上突出。 In the composite protection device, the disconnection sensing portion is disposed just below the fusible element and protrudes in the longitudinal direction of the fusible element.
在該複合保護裝置中，該斷開感測部係形成為一圓形形狀或一橢圓形形狀。 In the composite protection device, the disconnection sensing portion is formed in a circular shape or an elliptical shape.
該複合保護裝置中更包括：至少一印刷電阻元件，連接至該等第一電阻端子及該等第二電阻端子中的至少一，並連接至該第一表面安裝電阻 元件及該第二表面安裝電阻元件中的至少一；以及一第二絕緣層，配置在該導電層及該至少一印刷電阻元件之間。 The composite protection device further includes: at least one printed resistive element connected to at least one of the first resistance terminal and the second resistance terminals, and connected to the first surface mount resistor At least one of the component and the second surface mount resistive element; and a second insulating layer disposed between the conductive layer and the at least one printed resistive element.
在該複合保護裝置中，該至少一印刷電阻元件包括一第一印刷電阻元件，恰好係配置在該第一表面安裝電阻元件之下，以及一第二印刷電阻元件，恰好係配置在該第二表面安裝電阻元件之下。 In the composite protection device, the at least one printed resistive element includes a first printed resistive element disposed just below the first surface mount resistive element, and a second printed resistive element disposed just in the second Surface mounted resistor element.
在該複合保護裝置中，該可熔元件、該第一表面安裝電阻元件、該第二表面安裝電阻元件、該第一印刷電阻元件及第二印刷電阻元件係設置於該第二絕緣層上；以及一孔洞，形成於該第二絕緣層上，使得該可熔元件及該導電層透過該孔洞而連接。 In the composite protection device, the fusible element, the first surface mount resistive element, the second surface mount resistive element, the first printed resistive element and the second printed resistive element are disposed on the second insulating layer; And a hole formed on the second insulating layer, so that the fusible element and the conductive layer are connected through the hole.
在該複合保護裝置中，該第二絕緣層包括一第一絕緣部，恰好係配置於該第一印刷電阻元件之下，以及一第二絕緣部，恰好係配置於該第二印刷電阻元件之下，其中：該第一絕緣部及該第二絕緣部係彼此分離的；以及該可熔元件連接該斷開感測部。 In the composite protection device, the second insulating layer includes a first insulating portion disposed just below the first printed resistive element, and a second insulating portion disposed just in the second printed resistive element. Lower, wherein: the first insulating portion and the second insulating portion are separated from each other; and the fusible element is connected to the disconnection sensing portion.
根據如上述之本發明的複合保護裝置，因此能夠提供安裝有表面安裝電阻元件及印刷電阻元件的一種複合保護裝置，因此一電路及安裝在該電路上的電路元件可被保護，免於受到過量電壓及過量電流。 According to the composite protection device of the present invention as described above, it is therefore possible to provide a composite protection device in which a surface mount resistive element and a printed resistive element are mounted, so that a circuit and circuit components mounted on the circuit can be protected from excessive Voltage and excess current.
此外，有可能提供一種複合保護裝置，其中印刷電阻元件係配置於表面安裝電阻元件之下，因此可達成產品微型化，且各別的電阻元件無需導線而安裝在一基板上，因此一自動化過程可以很容易地應用。 In addition, it is possible to provide a composite protection device in which a printed resistive element is disposed under a surface mount resistive element, so that product miniaturization can be achieved, and individual resistive elements are mounted on a substrate without wires, thus an automated process Can be easily applied.
此外，有可能提供一種複合保護裝置，其可根據藉由組合具有不同結構的各種電阻元件的一期望電阻值或一電功率來進行較佳設計。 Furthermore, it is possible to provide a composite protection device that can be preferably designed according to a desired resistance value or an electric power by combining various resistance elements having different structures.
此外，有可能提供一種複合保護裝置，其中表面電阻元件及印刷電阻元件係設置在一可熔元件的兩側，而且因此熱特性可被改進，若過量電壓施加時，該可熔元件的斷開時間可被縮短，並且一足夠絕緣距離可被取得。 Furthermore, it is possible to provide a composite protection device in which a surface resistive element and a printed resistive element are disposed on both sides of a fusible element, and thus thermal characteristics can be improved, and if the excess voltage is applied, the fusible element is disconnected The time can be shortened and a sufficient insulation distance can be obtained.
此外，有可能提供一種複合保護裝置，其中表面安裝電阻元件及印刷電阻元件具有共同的端子，因此，可達成結構的簡化及產品的微型化。 Further, it is possible to provide a composite protection device in which a surface mount resistive element and a printed resistive element have a common terminal, and therefore, simplification of the structure and miniaturization of the product can be achieved.
此外，有可能提供一種複合保護裝置，其中一斷開感測部係形成於一導電層，因此當過量電壓時，一可熔元件的斷開可被有效地進行。 Further, it is possible to provide a composite protection device in which a disconnection sensing portion is formed on a conductive layer, so that when an excessive voltage is applied, the disconnection of a fusible element can be efficiently performed.
1‧‧‧陶瓷基板 1‧‧‧ceramic substrate
2‧‧‧黏貼式電阻 2‧‧‧Adhesive resistance
3‧‧‧絕緣器 3‧‧‧Insulator
4‧‧‧熔絲端子 4‧‧‧Fuse terminals
4a‧‧‧連接部 4a‧‧‧Connecting Department
5‧‧‧可熔元件 5‧‧‧ fusible components
6‧‧‧殼體 6‧‧‧Shell
8‧‧‧電阻端子 8‧‧‧Resistance terminal
8a‧‧‧電阻端子 8a‧‧‧Resistance terminals
10‧‧‧可熔元件 10‧‧‧ fusible components
11‧‧‧前端區域 11‧‧‧ front end area
12‧‧‧中間區域 12‧‧‧Intermediate area
13‧‧‧後端區域 13‧‧‧ Backend area
20‧‧‧第一表面安裝電阻元件 20‧‧‧First surface mount resistor element
20a‧‧‧第二表面安裝電阻元件 20a‧‧‧Second surface mount resistor element
21‧‧‧元件本體 21‧‧‧Component body
22‧‧‧電阻層 22‧‧‧resistance layer
22a‧‧‧線圈 22a‧‧‧ coil
23‧‧‧端子部 23‧‧‧ Terminals
24‧‧‧塗佈層 24‧‧‧ Coating layer
25‧‧‧第一印刷電阻元件 25‧‧‧First printed resistive element
25a‧‧‧第二印刷電阻元件 25a‧‧‧Second printed resistive element
30‧‧‧開關元件 30‧‧‧Switching elements
31‧‧‧電晶體 31‧‧‧Optoelectronics
32‧‧‧二極體 32‧‧‧ diode
33‧‧‧控制單元 33‧‧‧Control unit
40‧‧‧第一連接端子 40‧‧‧First connection terminal
40a‧‧‧第二連接端子 40a‧‧‧second connection terminal
41‧‧‧第一絕緣層 41‧‧‧First insulation
42‧‧‧導電層 42‧‧‧ Conductive layer
42a‧‧‧第二絕緣層 42a‧‧‧Second insulation
42b‧‧‧導電部 42b‧‧‧Electrical Department
42c‧‧‧斷開感測部 42c‧‧‧Disconnected Sensing Department
43‧‧‧第二絕緣層 43‧‧‧Second insulation
43a‧‧‧第一絕緣部 43a‧‧‧First insulation
43b‧‧‧第二絕緣部 43b‧‧‧Second insulation
44‧‧‧孔洞 44‧‧‧ hole
45‧‧‧焊膏 45‧‧‧ solder paste
50‧‧‧熔絲端子 50‧‧‧Fuse terminals
50a‧‧‧熔絲端子 50a‧‧‧Fuse terminal
55‧‧‧第一端子 55‧‧‧First terminal
55a‧‧‧第二端子 55a‧‧‧second terminal
60a‧‧‧第一電阻端子 60a‧‧‧First resistance terminal
60b‧‧‧第一電阻端子 60b‧‧‧First resistance terminal
60c‧‧‧第二電阻端子 60c‧‧‧second resistance terminal
60d‧‧‧第二電阻端子 60d‧‧‧second resistance terminal
61‧‧‧表面安裝電阻端子部 61‧‧‧Surface mounted resistor terminal
62‧‧‧印刷電阻端子部 62‧‧‧Printed resistor terminal
63‧‧‧連接部 63‧‧‧Connecting Department
A-A‧‧‧線段 A-A‧‧ ‧ line segment
B-B‧‧‧線段 B-B‧‧ ‧ line segment
C-C‧‧‧線段 C-C‧‧‧ line segment
S‧‧‧基板 S‧‧‧Substrate
本發明之上述和其它目的、特徵及其它優點將在結合以下附圖的詳細說明而可以更清楚地理解，其中： The above and other objects, features and other advantages of the present invention will become more <RTIgt;
第1圖係根據本發明在使用一複合保護裝置的電路圖。 Figure 1 is a circuit diagram of a composite protection device in accordance with the present invention.
第2圖係根據本發明的一具體實施例之複合保護裝置的平面圖。 Figure 2 is a plan view of a composite protection device in accordance with an embodiment of the present invention.
第3a圖係根據本發明的一具體實施例之複合保護裝置的透視圖。 Figure 3a is a perspective view of a composite protection device in accordance with an embodiment of the present invention.
第3b圖係根據本發明的一具體實施例之複合保護裝置的分解圖。 Figure 3b is an exploded view of a composite protection device in accordance with an embodiment of the present invention.
第4a圖及第4b圖係根據本發明的電阻元件之剖面圖。 Figures 4a and 4b are cross-sectional views of a resistive element in accordance with the present invention.
第5a圖係沿著第3a圖中的A-A線段的剖面圖。 Figure 5a is a cross-sectional view taken along line A-A of Figure 3a.
第5b圖係沿著第3a圖中的B-B線段的剖面圖。 Figure 5b is a cross-sectional view taken along line B-B of Figure 3a.
第6圖示出當過量電流被施加到一主電路時的一可熔元件之斷開的電路圖。 Fig. 6 is a circuit diagram showing the disconnection of a fusible element when an excessive current is applied to a main circuit.
第7圖係示出當過量電壓被施加到該主電路時的可熔元件之斷開的電路圖。 Fig. 7 is a circuit diagram showing the disconnection of the fusible element when an excessive voltage is applied to the main circuit.
第8圖係示出當過量電壓被施加到該主電路時的可熔元件之斷開的平面圖。 Fig. 8 is a plan view showing the disconnection of the fusible element when an excessive voltage is applied to the main circuit.
第9圖係第3a圖沿著線段C-C的剖視圖，示出當過量電壓被施加到主電路時的可熔元件之斷開。 Figure 9 is a cross-sectional view along line C-C of Figure 3a showing the disconnection of the fusible element when excess voltage is applied to the main circuit.
第10圖係示出根據本發明的另一具體實施例之複合保護裝置的分解透視圖。 Figure 10 is an exploded perspective view showing a composite protection device in accordance with another embodiment of the present invention.
第11圖係示出根據本發明的另一具體實施例之複合保護裝置的分解透視圖。 Figure 11 is an exploded perspective view showing a composite protection device in accordance with another embodiment of the present invention.
第12圖係示出根據本發明的又一具體實施例的複合保護裝置之電路圖。 Figure 12 is a circuit diagram showing a composite protection device in accordance with still another embodiment of the present invention.
第13a圖示出具有形成在一電阻上的一可熔元件於其中之一習知保護裝置的平面圖。 Figure 13a shows a plan view of one of the conventional protective devices having a fusible element formed on a resistor.
第13b圖示出具有形成在一電阻上的一可熔元件於其中之一習知保護裝置的剖面圖。 Figure 13b shows a cross-sectional view of one of the conventional protective devices having a fusible element formed on a resistor.
在下文中，本發明的較佳具體實施例將參照附圖進行詳細說明。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
請參照第1圖，根據本發明的一複合保護裝置，係藉由斷開連接到一主電路中的一可熔元件10，來在異常狀態下保護連接到該主電路的一電路及元件。 Referring to FIG. 1, a composite protection device according to the present invention protects a circuit and components connected to the main circuit in an abnormal state by disconnecting a fusible element 10 connected to a main circuit.
根據本發明之複合保護裝置的主電路並不在種類上作限制，舉例來說，該主電路可以是對一電池進行充電的一充電電路。 The main circuit of the composite protection device according to the present invention is not limited in kind. For example, the main circuit may be a charging circuit for charging a battery.
該可熔元件10及一電池係被連接，而且一充電器及該可熔元件10被連接在該主電路上。詳細而言，連接到該可熔元件10的複數個電阻元件20,20a,25,25a以及連接該等電阻元件20,20a,25,25a的一開關元件30被提供在該主電路上。 The fusible element 10 and a battery are connected, and a charger and the fusible element 10 are connected to the main circuit. In detail, a plurality of resistive elements 20, 20a, 25, 25a connected to the fusible element 10 and a switching element 30 connecting the resistive elements 20, 20a, 25, 25a are provided on the main circuit.
該開關元件30可以示例性地包括一二極體32、一電晶體31，以及一控制單元33，該控制單元33施加一控制信號來啟動該電晶體31，以便在過量電壓施加時控制流向該等電阻元件20,20a,25,25a的電流。 The switching element 30 can illustratively include a diode 32, a transistor 31, and a control unit 33 that applies a control signal to activate the transistor 31 to control flow to the excess voltage application. The current of the equal resistance elements 20, 20a, 25, 25a.
首先，若過量電流被施加至該主電路，該可熔元件10係由於此過量電流所產生的熱而斷開，因此保護了該電路及該等電路元件。 First, if an excessive current is applied to the main circuit, the fusible element 10 is broken due to the heat generated by the excess current, thereby protecting the circuit and the circuit elements.
再者，若過量電壓被施加至該主電路，該可熔元件10係由於自該等電阻元件20,20a,25,25a所產生的熱而斷開，因此保護了該電路及該電路元件。 Furthermore, if an excessive voltage is applied to the main circuit, the fusible element 10 is broken due to heat generated from the resistive elements 20, 20a, 25, 25a, thereby protecting the circuit and the circuit element.
參照第2圖至第3b圖，根據本發明的複合保護裝置包括一基板S，該可熔元件10、該等電阻元件20,20a,25,25a及該開關元件30係設置在該基板S上。該等電阻元件20,20a,25,25a包括表面安裝電阻元件20,20a以及印刷電阻元件25,25a。 Referring to Figures 2 to 3b, the composite protection device according to the present invention includes a substrate S, the fusible element 10, the resistance elements 20, 20a, 25, 25a and the switching element 30 are disposed on the substrate S. . The resistive elements 20, 20a, 25, 25a comprise surface mount resistive elements 20, 20a and printed resistive elements 25, 25a.
為了設置該可熔元件10及該等電阻元件20,20a,25,25a在該基板S上，該等熔絲端子50,50a、該等第一電阻端子60a,60b及該等第二電阻端子60c,60d、一第一連接端子40、一第二連接端子40a、一第一連接端子55以及一第二連接端子55a係形成在該基板S上。 In order to provide the fusible element 10 and the resistive elements 20, 20a, 25, 25a on the substrate S, the fuse terminals 50, 50a, the first resistance terminals 60a, 60b and the second resistance terminals 60c, 60d, a first connection terminal 40, a second connection terminal 40a, a first connection terminal 55, and a second connection terminal 55a are formed on the substrate S.
該等熔絲端子50,50a、該等第一電阻端子60a,60b及該等第二電阻端子60c,60d係設置以使彼此在一同平面上分開。 The fuse terminals 50, 50a, the first resistance terminals 60a, 60b and the second resistance terminals 60c, 60d are arranged to be separated from each other in a plane.
該可熔元件10係設置在該等熔絲端子50,50a上。 The fusible element 10 is disposed on the fuse terminals 50, 50a.
一第一表面安裝電阻元件20及一第一印刷電阻元件25係設置在該等第一電阻端子60a,60b上，而且一第二表面安裝電阻元件20a及一第二印刷電阻元件25a係設置在該等第二電阻端子60c,60d上。 A first surface mount resistive element 20 and a first printed resistive element 25 are disposed on the first resistive terminals 60a, 60b, and a second surface mount resistive element 20a and a second printed resistive element 25a are disposed The second resistance terminals 60c, 60d are provided.
該第一連接端子40及該第二連接端子40a用於連接該等第一電阻端子60a,60b及該等第二電阻端子60c,60d。該第一連接端子40連接該第一電阻端子60b及該第二電阻端子60d，而且該第二連接端子40a連接該第一電阻端子60a及該第二電阻端子60c。 The first connection terminal 40 and the second connection terminal 40a are used to connect the first resistance terminals 60a, 60b and the second resistance terminals 60c, 60d. The first connection terminal 40 is connected to the first resistance terminal 60b and the second resistance terminal 60d, and the second connection terminal 40a is connected to the first resistance terminal 60a and the second resistance terminal 60c.
該第一端子55係連接至該第一電阻端子60b，而且該第二端子55a係連接至該第二電阻端子60c。 The first terminal 55 is connected to the first resistance terminal 60b, and the second terminal 55a is connected to the second resistance terminal 60c.
該可熔元件10係連接至該等熔絲端子50,50a，並且若過量電流 被施加至該主電路時，該可熔元件10被斷開並保護該電路及該等電路元件。 The fusible element 10 is connected to the fuse terminals 50, 50a, and if excessive current When applied to the main circuit, the fusible element 10 is disconnected and protects the circuit and the circuit elements.
該可熔元件10可以示例性地由一種具有120~300℃熔點的金屬或合金所形成。 The fusible element 10 can be exemplarily formed of a metal or alloy having a melting point of 120 to 300 °C.
當過量電壓施加時，該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a產生熱量，因此用於斷開該可熔元件10。該第一安裝電阻元件20及該第二表面安裝電阻元件20a可配置在該可熔元件10的兩側。 The first surface mount resistive element 20 and the second surface mount resistive element 20a generate heat when an excessive voltage is applied, and thus serve to break the fusible element 10. The first mounting resistor element 20 and the second surface mount resistor element 20a may be disposed on both sides of the fusible element 10.
各該第一表面安裝電阻元件20及第二表面安裝電阻元件20a可包括由陶瓷所形成的一元件本體21、形成在該元件本體21兩端的端子部23、形成在該元件本體21之上表面的一電阻層22，以及保護該電阻層22的一塗佈層24(參照第4a圖)。 Each of the first surface mount resistive element 20 and the second surface mount resistive element 20a may include an element body 21 formed of ceramic, a terminal portion 23 formed at both ends of the element body 21, and an upper surface formed on the element body 21 A resistive layer 22, and a coating layer 24 protecting the resistive layer 22 (see Figure 4a).
此外，各該第一表面安裝電阻元件20及第二表面安裝電阻元件20a可為一電阻性元件，包括一元件本體21、形成在該元件本體21兩端的端子部23，以及纏繞在該元件本體21外圓周表面上的一線圈22a(參照第4b圖)。 In addition, each of the first surface mount resistive element 20 and the second surface mount resistive element 20a may be a resistive element including an element body 21, a terminal portion 23 formed at both ends of the element body 21, and wound around the element body. A coil 22a on the outer circumferential surface of 21 (refer to Fig. 4b).
然而，本發明的具體實施例並不局限於此，且各該第一表面安裝電阻元件20及第二表面安裝電阻元件20a可為設置有螺旋槽的電阻元件或其它種類的電阻元件(例如一MELF型電阻元件及一晶片型電阻元件)中的一者。 However, the specific embodiment of the present invention is not limited thereto, and each of the first surface mount resistive element 20 and the second surface mount resistive element 20a may be a resistive element provided with a spiral groove or other kind of resistive element (for example, One of a MELF type resistance element and a wafer type resistance element).
當過量電壓被施加時，該第一印刷電阻元件25及該第二印刷電阻元件25a產生熱，因此用於提供此熱至該可熔元件10，以與該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a相同的方式。 When the excess voltage is applied, the first printed resistive element 25 and the second printed resistive element 25a generate heat, thereby providing the heat to the fusible element 10 to mount the resistive element 20 with the first surface The second surface mount resistor element 20a is in the same manner.
該第一印刷電阻元件25及該第二印刷電阻元件25a可被配置在該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a之下，更詳細而言，在該端子部23及該元件本體21間所形成的空間中。 The first printed resistive element 25 and the second printed resistive element 25a may be disposed under the first surface mount resistive element 20 and the second surface mount resistive element 20a, and more particularly, in the terminal portion 23 and In the space formed between the element bodies 21.
一第一絕緣層41、一導電層42及一第二絕緣層43係依序堆疊在該第一連接端子40及該第二連接端子40a之上。 A first insulating layer 41, a conductive layer 42 and a second insulating layer 43 are sequentially stacked on the first connection terminal 40 and the second connection terminal 40a.
該第一絕緣層41用於使該第一連接端子40及該第二連接端子40a與該導電層42彼此電性隔離。 The first insulating layer 41 is used to electrically isolate the first connection terminal 40 and the second connection terminal 40a from the conductive layer 42.
該導電層42用於使該可熔元件10電性連接至該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a與該第一印刷電阻元件25及該第二印刷電阻元件25a，並且係配置使得該導電層42的一端係連接至該第一端子55，以及該導電層42的另一端與該第二端子55a的連接被中斷。再者，該導電層42可以藉由塗佈一銀漿至該第一絕緣層41之上表面而形成。 The conductive layer 42 is configured to electrically connect the fusible element 10 to the first surface mount resistive element 20 and the second surface mount resistive element 20a and the first printed resistive element 25 and the second printed resistive element 25a, And being configured such that one end of the conductive layer 42 is connected to the first terminal 55, and the other end of the conductive layer 42 is disconnected from the second terminal 55a. Furthermore, the conductive layer 42 can be formed by coating a silver paste onto the upper surface of the first insulating layer 41.
該導電層42可以包括一斷開感測部42c；一導電部42b，從該斷開感測部42c的一側延伸，並透過該第一端子55電性連接該可熔元件10及該第一表面安裝電阻元件20；以及一傳熱導部42a，從該斷開感測部42c的另一側延伸，並物理地接觸該第二表面安裝電阻元件20a。 The conductive layer 42 may include a disconnection sensing portion 42c. A conductive portion 42b extends from one side of the disconnection sensing portion 42c and is electrically connected to the fusible element 10 and the first through the first terminal 55. A surface mount resistive element 20; and a heat transfer guide 42a extending from the other side of the disconnection sensing portion 42c and physically contacting the second surface mount resistive element 20a.
該斷開感測部42c表示剛好安裝在該可熔元件10下之導電層42的一區域，並且用於導致熔化以及由於自該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a產生熱而熔化之可熔元件10的結合。 This disconnection sensing portion 42c is mounted in an area immediately represents lower conductive layer of the fusible element 10 42, and for causing the first surface to melt, and the mounting element 20 and the resistance of the second resistor element to a mounting surface from 20a produces a combination of heat and melted fusible elements 10.
再者，該斷開感測部42c可具有比該導電部42b及該熱傳導部42a更大的寬度，並且在該可熔元件10的縱向方向上突出。這樣做的原因是，使得傳遞熱的量與該斷開感應測部42c的面積呈等比例地增加，因此該可熔元件10的熔化變得容易。 Furthermore, the disconnection sensing portion 42c may have a larger width than the conductive portion 42b and the heat conducting portion 42a, and protrude in the longitudinal direction of the fusible element 10. The reason for this is that the amount of heat transfer is increased in proportion to the area of the disconnection sensing portion 42c, so that the melting of the fusible element 10 becomes easy.
該斷開感測部42c可形成一圓形形狀，該圓形形狀的前部以及後部係形成為一半圓形狀或一橢圓形狀，並且一詳細描述將提供在後面。 The disconnection sensing portion 42c may form a circular shape in which the front and rear portions are formed in a semicircular shape or an elliptical shape, and a detailed description will be provided later.
該第二絕緣層43用於使該導電層42與該第一表面安裝電阻元件20、該第二表面安裝電阻元件20a、該第一印刷電阻元件25以及該第二印刷電阻元件25a電性隔離。 The second insulating layer 43 is configured to electrically isolate the conductive layer 42 from the first surface mount resistive element 20, the second surface mount resistive element 20a, the first printed resistive element 25, and the second printed resistive element 25a. .
該可熔元件10、該第一表面安裝電阻元件20、該第二表面安裝 電阻元件20a、該第一印刷電阻元件25及第二印刷電阻元件25a係安裝在該第二絕緣層43上。 The fusible element 10, the first surface mount resistive element 20, the second surface mount The resistive element 20a, the first printed resistive element 25, and the second printed resistive element 25a are mounted on the second insulating layer 43.
一孔洞44形成在該第二絕緣層43上，使得該可熔元件10及該導電層42，特別是該斷開感測部42c，可以透過該孔洞44相連。 A hole 44 is formed in the second insulating layer 43, so that the fusible element 10 and the conductive layer 42, particularly the disconnection sensing portion 42c, can be connected through the hole 44.
該孔洞44可被形成為具有對應於該斷開感測部42c的尺寸及形狀。 The hole 44 may be formed to have a size and shape corresponding to the disconnection sensing portion 42c.
請參照第5a圖，該導電層42的斷開感測部42c係透過該孔洞44而露出，並且藉由塗佈一導電材料(例如一焊膏45)至該斷開感測部42c的露出表面而連接至該可熔元件10。 Referring to FIG. 5a, the opening sensing portion 42c of the conductive layer 42 is exposed through the hole 44, and is exposed by applying a conductive material (for example, a solder paste 45) to the opening sensing portion 42c. The surface is connected to the fusible element 10.
當過量電壓施加至該主電路時，電流流過該可熔元件10、該導電層42以及該第一端子55。 When an excessive voltage is applied to the main circuit, current flows through the fusible element 10, the conductive layer 42, and the first terminal 55.
請參照第5a圖及第3b圖，施加至該可熔元件10的電流可在該可熔元件10的中間被分流，並且經由該導電層42流至該第一端子55。施加至該第一端子55電流流經該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a，其中該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a利用該第一連接端子40和該第二連接端子40a來並聯連接，然後再流至該第二端子55a。由於該第一印刷電阻元件25與該第一表面安裝電阻元件20共同具有該等第一電阻端子60a,60b，且該第二印刷電阻元件25a與該第二表面安裝電阻元件20a共同具有該等第二電阻端子60c,60d，該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a並聯連接，且該第一印刷電阻元件25和該第二印刷電阻元件25a並聯連接，並且施加到第一端子55的電流被分流，流至該第一表面安裝電阻元件20、該第二表面安裝電阻元件20a、該第一印刷電阻元件25和該第二印刷電阻元件25a，然後再連接在該第二端子55a。 Referring to FIGS. 5a and 3b, the current applied to the fusible element 10 can be shunted in the middle of the fusible element 10 and flowed through the conductive layer 42 to the first terminal 55. Current applied to the first terminal 55 flows through the first surface mount resistive element 20 and the second surface mount resistive element 20a, wherein the first surface mount resistive element 20 and the second surface mount resistive element 20a utilize the first The connection terminal 40 and the second connection terminal 40a are connected in parallel and then flow to the second terminal 55a. Since the first printed resistive element 25 and the first surface mount resistive element 20 have the first resistive terminals 60a, 60b together, the second printed resistive element 25a and the second surface mount resistive element 20a have the same a second resistance terminal 60c, 60d, the first surface mount resistive element 20 and the second surface mount resistive element 20a are connected in parallel, and the first printed resistive element 25 and the second printed resistive element 25a are connected in parallel and applied to The current of the first terminal 55 is shunted to the first surface mount resistive element 20, the second surface mount resistive element 20a, the first printed resistive element 25 and the second printed resistive element 25a, and then connected thereto. The second terminal 55a.
由於電流流經該第一表面電阻元件20、該第二表面電阻元件 20a、該第一印刷電阻元件25及該第二印刷電阻元件25a，所以該第一表面電阻元件20、該第二表面電阻元件20a、該第一印刷電阻元件25及該第二印刷電阻元件25a在該可熔元件10的兩端產生熱，且此熱藉由熱輻射加熱該可熔元件10，且藉由熱傳導並透過該熱傳導部42a以及該導電層42之導電部42b來加熱該可熔元件10，且因此斷開該可熔元件10。然而，在該導電層42中可省略該熱傳導部42a Since the current flows through the first surface resistive element 20, the second surface resistive element 20a, the first printed resistive element 25 and the second printed resistive element 25a, so the first surface resistive element 20, the second surface resistive element 20a, the first printed resistive element 25 and the second printed resistive element 25a Heat is generated at both ends of the fusible element 10, and the heat heats the fusible element 10 by heat radiation, and heats the fusible by heat conduction and transmission through the heat conducting portion 42a and the conductive portion 42b of the conductive layer 42. Element 10, and thus the fusible element 10 is disconnected. However, the heat conduction portion 42a may be omitted in the conductive layer 42
請參照第5b圖，該第一表面安裝元件20及該第一印刷電組元件25係連接至該等第一電組端子60a,60b。 Referring to FIG. 5b, the first surface mount component 20 and the first printed electrical component 25 are connected to the first electrical group terminals 60a, 60b.
各該第一電阻端子60a,60b可包括：一表面安裝電組端子部61，連接至該第一表面電阻元件20；一印刷電阻端子部62，連接至該第一印刷電阻元件25；以及一連接部63，連接該表面安裝電阻端子部61及該印刷電阻端子部62。該表面安裝電阻端子部61、該印刷電阻端子部62以及該連接部63可一體地形成。 Each of the first resistance terminals 60a, 60b may include: a surface mount electrical group terminal portion 61 connected to the first surface resistive element 20; a printed resistor terminal portion 62 connected to the first printed resistive element 25; The connection portion 63 connects the surface mount resistance terminal portion 61 and the printed resistance terminal portion 62. The surface mount resistor terminal portion 61, the printed resistor terminal portion 62, and the connection portion 63 may be integrally formed.
該第一印刷電阻元件25係透過印刷法而由在該等第一電阻端子60,60a及該第二絕緣層43的一薄膜所形成，並且被配置於形成在該第一表面安裝電阻元件20下的一空間，因此該複合保護裝置的整體厚度不會增加。 The first printed resistive element 25 is formed by a film on the first resistance terminals 60, 60a and the second insulating layer 43 by a printing method, and is disposed on the first surface mount resistive element 20 The next space, so the overall thickness of the composite protection device does not increase.
因此，雖然設置了該等表面安裝電阻元件及該等印刷電阻元件，仍可以達成產品微型化。 Therefore, although the surface mount resistor elements and the printed resistor elements are provided, product miniaturization can be achieved.
再者，由於該等印刷電阻元件劃分的電流或電壓，熱特性得到改善，因此該可熔元件的斷開時間可以縮短。 Furthermore, since the thermal characteristics are improved by the current or voltage divided by the printed resistive elements, the turn-off time of the fusible element can be shortened.
再者，由於該第一及第二表面安裝電阻元件20,20a以及第一和第二印刷電阻元件25,25a設置在一起時具有不同的結構和形狀，具有各種功率和高功率一保護裝置可被製造。 Furthermore, since the first and second surface mount resistive elements 20, 20a and the first and second printed resistive elements 25, 25a are arranged together with different structures and shapes, a power and high power protection device can be used. Made.
此外，由於根據本發明的第一表面安裝電阻元件20、第二表面 安裝電阻元件20a、該第一印刷電阻元件25及該第二印刷電阻元件25a無需導線而被安裝在基板S上，故一自動化過程可以輕易地被應用。 Furthermore, due to the first surface mount resistive element 20, the second surface according to the present invention The mounting resistor element 20a, the first printed resistor element 25, and the second printed resistor element 25a are mounted on the substrate S without wires, so an automated process can be easily applied.
參照第6圖所示，當浪湧電流係瞬間施加至該主電路，或者當過電流是連續地施加至該主電路時，該可熔元件10被所產生的熱斷開。 Referring to Fig. 6, when a surge current is instantaneously applied to the main circuit, or when an overcurrent is continuously applied to the main circuit, the fusible element 10 is broken by the generated heat.
在此，由於該可熔元件10的一前端區域11被斷開，且該主電路係被中斷，以防止該主電路的損害或***。 Here, since a front end region 11 of the fusible element 10 is disconnected, the main circuit is interrupted to prevent damage or explosion of the main circuit.
參照第7圖至第9圖，若偏離參考電壓的過量電壓係施加至該主電路，如上所述，該開關元件30控制流向該等電阻元件20,20a,25,25a的電流(參照第1圖)。 Referring to FIGS. 7 to 9, if an excessive voltage deviating from the reference voltage is applied to the main circuit, as described above, the switching element 30 controls the current flowing to the resistance elements 20, 20a, 25, 25a (refer to the first Figure).
該可熔元件10包括：接觸該斷開感測部42c的一中間區域12；自該中間區域12向前延伸的一前端區域11；以及自該中間區域12向後延伸的一後端區域13，而且該前端區域11及該後端區域13中的至少其一由於電流引入該等電阻元件20,20a,25,25a產生的熱而斷開，因此保護電路。 The fusible element 10 includes: an intermediate portion 12 contacting the disconnection sensing portion 42c; a front end region 11 extending forward from the intermediate portion 12; and a rear end region 13 extending rearward from the intermediate portion 12, Moreover, at least one of the front end region 11 and the rear end region 13 is disconnected by the heat generated by the introduction of the resistance elements 20, 20a, 25, 25a, thereby protecting the circuit.
更詳細而言，在該可熔元件10中，該中間區域12是由傳導熱以及輻射熱而加熱，因此接收比不直接接觸的斷開感測部42之前端區域11及後端區域13更大量的熱量(參照圖3a)。 In more detail, in the fusible element 10, the intermediate portion 12 is heated by conduction heat and radiant heat, and thus receives a larger amount than the front end region 11 and the rear end region 13 of the disconnection sensing portion 42 which is not in direct contact. Heat (see Figure 3a).
因此，當該可熔元件10被加熱時，該中間區域12比該前端區域11及後端區域13更早被熔化，藉由表面張力而結合，然後再從該前端區域11及該後端區域13分離。 Therefore, when the fusible element 10 is heated, the intermediate portion 12 is melted earlier than the front end region 11 and the rear end region 13, joined by surface tension, and then from the front end region 11 and the rear end region 13 separation.
於此，該斷開感測部42c係形成一圓形或一橢圓形。這樣做的原因是，均勻的分子力在離心方向上作用於該圓形斷開感測部42c的熔化中間區域12，因此結合力增加，而且該中間區域12被更有效地與該前端區域11及該後端區域13分離。 Here, the disconnection sensing portion 42c is formed in a circular shape or an elliptical shape. The reason for this is that a uniform molecular force acts on the melted intermediate portion 12 of the circular disconnection sensing portion 42c in the centrifugal direction, so that the bonding force is increased, and the intermediate portion 12 is more effectively associated with the front end region 11 And the back end area 13 is separated.
請參照第10圖，在另一個具體實施例的一種複合保護裝置中， 沒有孔洞形成在一第二絕緣層43，且該第二絕緣層43可以被分成兩部分，不同於如第1圖至第9圖中所示之前一個具體實施例的複合保護裝置。 Referring to FIG. 10, in another composite protection device of another embodiment, No holes are formed in a second insulating layer 43, and the second insulating layer 43 can be divided into two parts, unlike the composite protective device of the previous embodiment as shown in Figs. 1 to 9.
更詳細而言，該第二絕緣層43可以包括剛好設置在一第一印刷電阻元件25下的一第一絕緣部43a，以及剛好設置在一第二印刷電阻元件25a下的一第二絕緣部43b。 In more detail, the second insulating layer 43 may include a first insulating portion 43a disposed just under the first printed resistive element 25, and a second insulating portion disposed just below the second printed resistive element 25a. 43b.
第一絕緣部43a及該第二絕緣部43b係彼此分離，並且一可熔元件10透過第該一絕緣部43a及該第二絕緣部43b間的一間隔空間而接觸一斷開感測部42c。 The first insulating portion 43a and the second insulating portion 43b are separated from each other, and a fusible element 10 is in contact with a disconnecting sensing portion 42c through a space between the insulating portion 43a and the second insulating portion 43b. .
參照第11圖，在根據另一具體實施例的複合保護裝置中，一第二絕緣層及印刷電阻元件係被省略，不同於根據第1圖至第9圖中所示之前一具體實施例的複合保護裝置。 Referring to FIG. 11, in a composite protection device according to another embodiment, a second insulating layer and a printed resistive element are omitted, unlike the previous embodiment according to FIGS. 1 through 9. Composite protection device.
因此，一第一表面安裝電阻元件20、一可熔元件10以及一第二表面安裝電阻元件20a係直接設置在一導電層42上。 Therefore, a first surface mount resistive element 20, a fusible element 10, and a second surface mount resistive element 20a are disposed directly on a conductive layer 42.
參照第12圖，在根據又一具體實施例的複合保護裝置中，一第一表面安裝電阻元件20及一第一印刷電阻元件25可以被並聯連接，一第二表面安裝電阻元件20a及一第二印刷電阻元件25a可以被並聯連接，而且該第一表面安裝電阻元件20及該第二表面安裝電阻元件20a可以串聯連接，並且該第一印刷電阻元件25及該第二印刷電阻元件25a可以被串聯連接，不同於根據第1圖中所示之前一具體實施例的複合保護裝置。 Referring to FIG. 12, in a composite protection device according to still another embodiment, a first surface mount resistive element 20 and a first printed resistive element 25 may be connected in parallel, and a second surface mount resistive element 20a and a first The two printed resistive elements 25a may be connected in parallel, and the first surface mount resistive element 20 and the second surface mount resistive element 20a may be connected in series, and the first printed resistive element 25 and the second printed resistive element 25a may be The series connection is different from the composite protection device according to the previous embodiment shown in Fig. 1.
綜上所述，在依據本發明之一具體實施例的一複合保護裝置之電流及電壓為異常狀態中，複數個電阻元件可並聯及串聯地被組合。 In summary, in the abnormal state in which the current and voltage of a composite protection device according to an embodiment of the present invention are abnormal, a plurality of resistance elements can be combined in parallel and in series.
為了說明之目的，雖然本發明在上文中已以較佳實施例揭露，然而熟習本項技術者將理解的是，舉凡所有不脫離本發明揭露在申請專利範圍之範疇及精神的各種修改、添加及置換都是可能的。 For the purpose of illustration, the present invention has been disclosed in the foregoing preferred embodiments of the present invention, and it is understood by those skilled in the art that various modifications and additions may be made without departing from the scope and spirit of the invention. And replacement is possible.
10‧‧‧可熔元件 10‧‧‧ fusible components
11‧‧‧前端區域 11‧‧‧ front end area
12‧‧‧中間區域 12‧‧‧Intermediate area
13‧‧‧後端區域 13‧‧‧ Backend area
20‧‧‧第一表面安裝電阻元件 20‧‧‧First surface mount resistor element
20a‧‧‧第二表面安裝電阻元件 20a‧‧‧Second surface mount resistor element
25‧‧‧第一印刷電阻元件 25‧‧‧First printed resistive element
25a‧‧‧第二印刷電阻元件 25a‧‧‧Second printed resistive element
30‧‧‧開關元件 30‧‧‧Switching elements
31‧‧‧電晶體 31‧‧‧Optoelectronics
32‧‧‧二極體 32‧‧‧ diode
33‧‧‧控制單元 33‧‧‧Control unit
Claims (10)
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|---|---|---|---|
| KR20140024265A KR101504132B1 (en) | 2014-02-28 | 2014-02-28 | The complex protection device of blocking the abnormal state of current and voltage |
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| TW201533765A true TW201533765A (en) | 2015-09-01 |
| TWI547967B TWI547967B (en) | 2016-09-01 |
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| JP5301298B2 (en) * | 2009-01-21 | 2013-09-25 | デクセリアルズ株式会社 | Protective element |
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