TW201519982A - Laser processing machine - Google Patents

Laser processing machine Download PDF

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Publication number
TW201519982A
TW201519982A TW103120343A TW103120343A TW201519982A TW 201519982 A TW201519982 A TW 201519982A TW 103120343 A TW103120343 A TW 103120343A TW 103120343 A TW103120343 A TW 103120343A TW 201519982 A TW201519982 A TW 201519982A
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workpiece
laser processing
alignment
laser
arrangement area
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TW103120343A
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TWI556895B (en
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Junichi Matsumoto
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Kataoka Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The subject of the present invention is to reduce the operation time of laser processing steps executed by a laser processing machine. The solution of the present invention is to provide a laser processing machine, which comprises: a plurality of configuration areas (3, 4), each being configured with a to-be-processed object (9), in which, during the same period for performing alignment, which is alignment for measurement of the relative positional relationship between the to-be-processed object (9) included in a specific configuration area (3, 4) and a laser beam irradiation device (1) for irradiating a laser beam onto the to-be-processed object (9), a machining process achieved by irradiating a laser beam from the laser beam irradiation device (1) is performed on the to-be-processed object (9) that is configured in the other configuration area (4, 3) and has finished with the aforementioned alignment.

Description

雷射加工機 Laser processing machine

本發明係關於將雷射光照射在被加工物的任意處來施以加工之雷射加工機。 The present invention relates to a laser processing machine that applies laser light to any portion of a workpiece to be processed.

現今，觸控面板裝置係作為輸入手段被廣泛地採用。觸控面板裝置，係包含觸控面板感測器、得知觸控面板感測器上的接觸位置之控制電路、配線及可撓式印刷基板而成。 Nowadays, touch panel devices are widely used as input means. The touch panel device comprises a touch panel sensor, a control circuit for knowing a contact position on the touch panel sensor, a wiring and a flexible printed substrate.

觸控面板裝置，係安裝於組裝有液晶顯示器或有機EL顯示器等的顯示裝置之各種機器(行動電話終端(尤其所謂的智慧型手機)或可攜式資訊處理終端、電子遊戲機、ATM裝置、售票機、自動販賣機、家電製品等)，且被用作為可對該機器直接輸入之輸入手段。觸控面板感測器中之與顯示裝置的影像顯示區域重疊之區域為透明，並於該區域構成有可檢測對象物的接觸位置之動作區。 The touch panel device is a device mounted on a display device such as a liquid crystal display or an organic EL display (a mobile phone terminal (especially a so-called smart phone) or a portable information processing terminal, an electronic game machine, an ATM device, Ticket machines, vending machines, home appliances, etc.) are used as input means for direct input to the machine. The area of the touch panel sensor that overlaps with the image display area of the display device is transparent, and an action area of the contact position of the detectable object is formed in the area.

觸控面板裝置，因應檢測出觸控面板感測器上的接觸位置之原理，可區分為各種形式。最近，從光學明亮性、創意性、構造簡易、且功能性優異等理由來看， 電容耦合方式的觸控面板裝置乃受到矚目。電容耦合方式係有表面型與投影型，就適合於對應多點辨識(多點觸控)之方面來看，投影型較為有利。 The touch panel device can be distinguished into various forms according to the principle of detecting the contact position on the touch panel sensor. Recently, from the viewpoints of optical brightness, creativity, simple structure, and excellent functionality, A capacitively coupled touch panel device has attracted attention. The capacitive coupling method is a surface type and a projection type, and is suitable for the multi-point identification (multi-touch), and the projection type is advantageous.

投影型電容耦合方式的觸控面板感測器，係以電介質、以及於該電介質的兩側以相異圖型所形成之第一感測器電極及第二感測器電極為要素。第一感測器電極及第二感測器電極，係經由被鋪設於用以支撐此等感測器電極之基材上之動作區外的區域之擷取配線(擷取用的導電體)，而連接於外部的控制電路。 The projection type capacitive coupling type touch panel sensor is characterized by a dielectric and a first sensor electrode and a second sensor electrode formed by different patterns on both sides of the dielectric. The first sensor electrode and the second sensor electrode are drawn through the region outside the action region of the substrate for supporting the sensor electrodes (electrical conductor for extraction) And connected to the external control circuit.

鋪設於動作區之第一感測器電極及第二感測器電極，係使用透明導電材料，但鋪設於非動作區之擷取配線並不須為透明。以往，係藉由將由具有高導電率之金屬等的導電性材料所構成之配線圖型網版印刷於基材上而形成擷取配線(以上內容可參考下述專利文獻1)。 The first sensor electrode and the second sensor electrode laid in the action area are made of a transparent conductive material, but the drawn wiring laid in the non-action area does not need to be transparent. Conventionally, a wiring pattern formed by a conductive material made of a conductive material such as a metal having high conductivity is screen-printed on a substrate to form a drawn wiring (refer to Patent Document 1 below).

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2013-033558號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-033558

至目前為止，以進一步擴大顯示裝置的影像顯示區域，及/或進一步提升創意性者為目的，係要求用 來包圍影像顯示區域的周圍之所謂"邊框"區域的窄化。因此，必須使觸控面板感測器中的非動作區達到小面積化。 So far, for the purpose of further expanding the image display area of the display device, and/or further enhancing the creativity, it is required To narrow the so-called "border" area around the image display area. Therefore, it is necessary to make the non-action area in the touch panel sensor small in area.

若可使鋪設於非動作區之擷取配線充分地達到高精細化，則可縮小非動作區及邊框區域。然而，目前的網版印刷法中，難以形成高精細的配線圖型。 If the drawing wiring laid in the non-operating area can be sufficiently refined, the non-operating area and the frame area can be reduced. However, in the current screen printing method, it is difficult to form a high-definition wiring pattern.

若使由導電性材料所構成之導電層成膜於基材的表面，並採用照射雷射光以切削該導電層而形成擷取配線之雷射加工法，則可實現網版印刷法中所無法形成之高精細的配線圖型。 When a conductive layer made of a conductive material is formed on the surface of a substrate, and a laser processing method is employed in which laser light is irradiated to cut the conductive layer to form a drawn wiring, it is impossible to achieve a screen printing method. A high-definition wiring pattern is formed.

雷射加工法的缺點，可列舉出步驟所需之作業時間長。雷射加工時，為了將雷射光精確地照射在基材上的要求位置座標，必須進行用以測量被送入於雷射加工機之基材相對於雷射光照射裝置之相對位置關係之對位(或校正)。對位處理中，一般係對藉由印刷等預先形成於基材之對位標記進行攝影。 The shortcomings of the laser processing method include the long working time required for the steps. In the laser processing, in order to accurately illuminate the laser light at the required position coordinates on the substrate, it is necessary to perform the alignment for measuring the relative positional relationship of the substrate fed to the laser processing machine with respect to the laser light irradiation device. (or correction). In the alignment process, the alignment mark previously formed on the substrate by printing or the like is generally photographed.

然而，成為加工對象之基材，為內含複數個觸控面板感測器之大片的薄膜或薄板。以攝影機對該基材的全區進行掃描之作法，會使雷射加工前的對位不得不耗費較長時間，此點較為不利。 However, the substrate to be processed is a large film or sheet containing a plurality of touch panel sensors. Scanning the entire area of the substrate with a camera causes the alignment before laser processing to take a long time, which is disadvantageous.

再者，若使用網版印刷，則可一次將配線圖型塗布於基材的寬廣面積上。亦即，從每單位時間的量產數量之方面來看，雷射加工法存在著劣於網版印刷法之問題。 Further, if screen printing is used, the wiring pattern can be applied to a wide area of the substrate at a time. That is to say, from the aspect of mass production per unit time, the laser processing method has a problem inferior to the screen printing method.

本發明之期望目的在於縮短由雷射加工機所 進行之雷射加工步驟的作業時間。 The desired object of the present invention is to shorten the laser processing machine The working time of the laser processing step performed.

本發明中，係構成下列雷射加工機，其係具備：分別可配置被加工物之複數個配置區域；在執行對位(alignment)，也就是執行包含被配置在某配置區域之被加工物與將雷射光照射在該被加工物之雷射光照射裝置之相對位置關係的測量之對位(或校正)的同一時期，對被配置在其他配置區域且已結束前述對位之被加工物，執行從雷射光照射裝置照射雷射光之加工處理。 In the present invention, a laser processing machine is provided which has a plurality of arrangement areas in which workpieces can be arranged, and performs alignment, that is, performs processing including workpieces arranged in a certain arrangement area. In the same period of the alignment (or correction) of the measurement of the relative positional relationship of the laser beam irradiating the laser light to the workpiece, the object to be processed placed in the other arrangement area and having finished the alignment is A processing process of irradiating the laser light from the laser light irradiation device is performed.

亦即，在對某被加工物執行雷射加工處理之間，完成對下一個施以雷射加工之被加工物的對位。如此可大幅提高雷射加工機的運轉時間中所佔有之雷射加工處理時間的比率。換言之，可縮短雷射光照射裝置未將雷射光照射在被加工物之閒置時間。並且可增加每單位時間施以雷射加工之被加工物的數量。 That is, between the laser processing of a workpiece, the alignment of the next workpiece subjected to laser processing is completed. This greatly increases the ratio of the laser processing time occupied by the operating time of the laser processing machine. In other words, it is possible to shorten the idle time in which the laser light irradiation device does not irradiate the laser light to the workpiece. Moreover, the number of workpieces subjected to laser processing per unit time can be increased.

於前述對位中，例如藉由攝像感測器拍攝被加工物的表面上所標示之對位標記以確認該位置，並經由此動作來進行被加工物與雷射光照射裝置之相對位置關係的測量。 In the alignment, for example, the alignment mark indicated on the surface of the workpiece is photographed by the image sensor to confirm the position, and the relative positional relationship between the workpiece and the laser light irradiation device is performed through the action. measuring.

雷射加工機的具體型態，可列舉出以下者，其係具備：用以執行被加工物的送出入及前述對位之第一配置區域、用以執行前述加工處理之第二配置區域、以及將前述第一配置區域中已結束前述對位之被加工物輸送至 前述第二配置區域之輸送機構。 The specific type of the laser processing machine includes a first arrangement region for performing the feeding and receiving of the workpiece and the alignment, and a second arrangement region for performing the processing. And conveying the workpiece in the first configuration area that has ended the foregoing alignment to The conveying mechanism of the aforementioned second arrangement area.

前述雷射光照射裝置，例如使用可改變照射在被加工物之雷射光光軸的朝向之檢波掃描器而成。 The laser light irradiation device is formed by, for example, a detector scanner that changes the orientation of the optical axis of the laser beam that is irradiated onto the workpiece.

根據本發明，可縮短由雷射加工機所進行之雷射加工步驟的作業時間。 According to the present invention, the working time of the laser processing step by the laser processing machine can be shortened.

1‧‧‧雷射光照射裝置 1‧‧‧Laser light irradiation device

11、12‧‧‧檢波掃描器 11, 12‧‧‧Detector Scanner

2‧‧‧攝像感測器 2‧‧‧Video Sensor

3‧‧‧第一配置區域 3‧‧‧First configuration area

4‧‧‧第二配置區域 4‧‧‧Second configuration area

6、7、81、82‧‧‧輸送機構 6, 7, 81, 82‧‧‧ transport agencies

9‧‧‧被加工物 9‧‧‧Processed objects

第1圖係顯示本發明的一實施形態之雷射加工機之側視圖。 Fig. 1 is a side view showing a laser processing machine according to an embodiment of the present invention.

第2圖係同一雷射加工機之背視圖。 Figure 2 is a back view of the same laser processing machine.

第3圖係同一雷射加工機之側視圖。 Figure 3 is a side view of the same laser processing machine.

第4圖係顯示同一雷射加工機中之雷射光照射裝置的構成之立體圖。 Fig. 4 is a perspective view showing the configuration of a laser beam irradiation device in the same laser processing machine.

第5圖係顯示被加工物上所標示之對位標記的一例之圖。 Fig. 5 is a view showing an example of the alignment mark indicated on the workpiece.

第6圖係示意顯示本發明的變形例之一之側視圖。 Fig. 6 is a side view schematically showing one of the modifications of the present invention.

以下參考圖面來說明本發明的一實施形態。如第1圖至第3圖所示，本實施形態之雷射加工機，沿著水平的X方向具備分別配置有被加工物9之第一配置區域 3及第二配置區域4，於第一配置區域3執行對位，於第二配置區域4執行雷射加工，藉此可對不同個被加工物9同時進行對位(或校正)與雷射加工。 An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 to 3, the laser processing machine according to the present embodiment includes the first arrangement region in which the workpiece 9 is placed along the horizontal X direction. 3 and the second arrangement area 4, performing alignment in the first arrangement area 3, and performing laser processing on the second arrangement area 4, whereby the different workpieces 9 can be simultaneously aligned (or corrected) and laser machining.

從從事作業之作業人員來看，面前側為第一配置區域3，縱深側為第二配置區域4。於第一配置區域3，配設有用以進行對位處理所使用之攝像感測器2。攝像感測器2，例如構成為可暫時拍攝沿著與X軸正交之水平的Y軸擴展之區域之線性攝像機，或是構成為可暫時拍攝於X軸、Y軸兩方向擴展之二維區域之區域攝像機。 From the perspective of the operator who is engaged in the work, the front side is the first arrangement area 3, and the depth side is the second arrangement area 4. In the first arrangement area 3, an imaging sensor 2 for performing alignment processing is disposed. The imaging sensor 2 is configured, for example, as a linear camera that can temporarily capture an area of the Y-axis expansion along a horizontal axis orthogonal to the X-axis, or a two-dimensional image that can be temporarily captured in both the X-axis and the Y-axis. Regional camera for the area.

第一配置區域3，係包含用以將被加工物9，例如觸控面板裝置用的基材薄膜送出入於本雷射加工機之作業的場所22。因此，與第二配置區域4相比，第一配置區域3沿著X軸方向較寬。送出入場所31位於第一配置區域3中的最面前側。攝像感測器2被配置在送出入場所31之最縱深側的端部附近，當被加工物9從送出入場所31往縱深側進入時，以在X軸方向上掃描此(亦即，攝像感測器2相對於被加工物9，相對地在X軸方向上移位)之方式，拍攝該被加工物9表面的大致全區域。 The first arrangement area 3 includes a place 22 for feeding a workpiece 9 such as a base film for a touch panel device into the laser processing machine. Therefore, the first arrangement area 3 is wider along the X-axis direction than the second arrangement area 4. The feeding place 31 is located on the foremost side in the first arrangement area 3. The imaging sensor 2 is disposed in the vicinity of the end portion on the most deep side of the feeding and receiving place 31, and when the workpiece 9 enters from the feeding and receiving position 31 to the depth side, it is scanned in the X-axis direction (that is, imaging) The sensor 2 captures substantially the entire area of the surface of the workpiece 9 so that the sensor 2 is relatively displaced in the X-axis direction.

於第二配置區域4，配設有將雷射光L照射在被加工物9之雷射光照射裝置1。雷射光照射裝置1，例如使用可改變照射在被加工物9之雷射光L之光軸的朝向之檢波掃描器而成。 In the second arrangement region 4, a laser beam irradiation device 1 that irradiates the laser beam L to the workpiece 9 is disposed. The laser light irradiation device 1 is formed by, for example, a detector scanner that changes the orientation of the optical axis of the laser light L irradiated onto the workpiece 9.

更具體來說，雷射光照射裝置1，如第4圖所示，係以：使從雷射振盪器14所供給之雷射光L反射之 檢波掃描器11、12，以及將經由檢波掃描器11、12之雷射光L聚光並照射在被加工物9之聚光透鏡13為要素。檢波掃描器11、12，為使雷射光L反射之檢波反射鏡112、122藉由馬達(伺服馬達、步進馬達等)111、121而轉動者。藉由改變檢波反射鏡112、122的方向，可使雷射光L的光軸移位。本實施形態中，係同時具備將雷射光L的光軸改變為X軸方向之X軸檢波掃描器11，以及將雷射光L的光軸改變為Y軸方向之Y軸檢波掃描器12，故可在X軸方向及Y軸方向上二維地控制被加工物9表面之雷射光L的照射位置。聚光透鏡13例如可構成為FQ透鏡。 More specifically, the laser light irradiation device 1, as shown in Fig. 4, reflects the laser light L supplied from the laser oscillator 14 The detector scanners 11 and 12 and the condensing lens 13 that condenses the laser light L passing through the detector scanners 11 and 12 and irradiates the workpiece 9 are used as elements. The detector scanners 11, 12 are rotated by motors (servo motors, stepping motors, etc.) 111, 121 for detecting mirrors 112, 122 for reflecting the laser light L. The optical axis of the laser light L can be shifted by changing the direction of the detector mirrors 112, 122. In the present embodiment, the X-axis detecting scanner 11 that changes the optical axis of the laser light L to the X-axis direction and the Y-axis detecting scanner 12 that changes the optical axis of the laser light L to the Y-axis direction are provided. The irradiation position of the laser light L on the surface of the workpiece 9 can be two-dimensionally controlled in the X-axis direction and the Y-axis direction. The condensing lens 13 can be configured, for example, as an FQ lens.

如第2圖所示，本實施形態中，係沿著Y軸方向排列配置複數座(圖示的例子中為兩座)雷射光照射裝置1。藉由各雷射光照射裝置1，可對沿著Y軸方向擴展之被加工物9的寬廣範圍施以雷射加工。此等雷射光照射裝置1，被支撐於以在第二配置區域4內沿著X軸方向延伸之方式橫向架設之邊框5。邊框5，可藉由驅動裝置，例如線性馬達而沿著Y軸方向移動。 As shown in Fig. 2, in the present embodiment, a plurality of laser light irradiation devices 1 (two in the illustrated example) are arranged side by side in the Y-axis direction. Each of the laser beam irradiation devices 1 can perform laser processing on a wide range of the workpiece 9 that is expanded in the Y-axis direction. These laser light irradiation devices 1 are supported by a frame 5 that is laterally stretched so as to extend in the X-axis direction in the second arrangement region 4. The bezel 5 can be moved in the Y-axis direction by a driving device such as a linear motor.

被加工物9，藉由輸送機構6、7而在第一配置區域3及第二配置區域4之間移動。輸送機構6、7係以：支撐被加工物9之支撐體61、71，例如可吸附被加工物9之機台(承載台)，以及使該支撐體至少在X軸方向上移動之驅動裝置，例如線性馬達為要素。 The workpiece 9 is moved between the first arrangement area 3 and the second arrangement area 4 by the transport mechanisms 6 and 7. The conveying mechanisms 6 and 7 are: a supporting body 61, 71 for supporting the workpiece 9, for example, a machine table (loading table) capable of adsorbing the workpiece 9, and a driving device for moving the supporting body at least in the X-axis direction For example, a linear motor is an element.

尤其，本實施形態中，係配置相互獨立之第 一輸送機構6及第二輸送機構7。第一輸送機構6及第二輸送機構7的支撐體61、71，均具有可載置被加工物9之充分的X軸方向尺寸(寬度尺寸)及Y軸方向尺寸(縱深尺寸)，但第二輸送機構7之支撐體71的寬度尺寸較第一輸送機構6之支撐體61的該尺寸稍小。此外，第二輸送機構7的支撐體71，例如可經由液壓缸或氣壓缸等使該高度位置移位。並且，第一輸送機構6的下方形成空間，第二輸送機構7的支撐體71可通過該空間。亦即，兩支撐體61、71，在分別支撐被加工物9之狀態下，可一邊相互錯開一邊沿著X軸方向獨立地移動。 In particular, in this embodiment, the configuration is independent of each other. A transport mechanism 6 and a second transport mechanism 7. The support bodies 61 and 71 of the first transport mechanism 6 and the second transport mechanism 7 each have a sufficient X-axis direction dimension (width dimension) and a Y-axis direction dimension (depth dimension) on which the workpiece 9 can be placed, but The width of the support body 71 of the second transport mechanism 7 is slightly smaller than the size of the support body 61 of the first transport mechanism 6. Further, the support body 71 of the second transport mechanism 7 can be displaced by, for example, a hydraulic cylinder or a pneumatic cylinder. Further, a space is formed below the first conveying mechanism 6, and the support body 71 of the second conveying mechanism 7 can pass through the space. In other words, the two supporting bodies 61 and 71 are independently movable in the X-axis direction while being displaced from each other in a state in which the workpieces 9 are supported.

以下依循步驟來說明使用本雷射加工機之雷射加工步驟。首先，於目前時點中，如第1圖所示，係假定第一輸送機構6的支撐體61位於第一配置區域3中的送出入場所31，第二輸送機構7的支撐體71位於第二配置區域4。作業人員將支撐於支撐體61且已完成雷射加工之被加工物9卸下，並將應進行雷射加工之新的被加工物9載置並吸附於該支撐體。 The following steps are followed to illustrate the laser processing steps using this laser processing machine. First, in the present time point, as shown in Fig. 1, it is assumed that the support body 61 of the first transport mechanism 6 is located in the feed-in place 31 in the first arrangement area 3, and the support body 71 of the second transport mechanism 7 is located in the second stage. Configure area 4. The worker removes the workpiece 9 supported by the support 61 and has completed the laser processing, and places and adsorbs the new workpiece 9 to be subjected to the laser processing to the support.

接著於該第一配置區域3內，使該支撐體61從送出入場所31進入於縱深側。此時該支撐體61通過攝像感測器2的正下方，攝像感測器2拍攝被支撐於支撐體61之被加工物9的表面而執行對位。 Next, in the first arrangement area 3, the support body 61 is moved from the feeding place 31 to the depth side. At this time, the support body 61 passes directly under the image pickup sensor 2, and the image pickup sensor 2 captures the surface of the workpiece 9 supported by the support body 61 to perform alignment.

於對位中，係拍攝預先藉由印刷等標示於被加工物9的表面之對位標記91、92，檢測該拍攝影像中之對位標記91、92的位置座標，並測量被加工物9在X 軸方向及/或Y軸方向上伸長或縮短何種程度、被加工物9繞著垂直的Z軸方向旋轉何種程度、及/或被加工物9表面上之對位標記92的印刷位置的誤差為何種程度(若考量被加工物9的尺寸為一定，則藉由與被加工物9四方的邊緣之關係，或是與標示於被加工物9角落之對位標記91之關係，可得知對位標記92的印刷位置偏離)等。 In the alignment, the alignment marks 91 and 92 which are previously marked on the surface of the workpiece 9 by printing or the like are photographed, the position coordinates of the registration marks 91 and 92 in the captured image are detected, and the workpiece 9 is measured. At X What is the extent of elongation or shortening in the axial direction and/or the Y-axis direction, how much the workpiece 9 is rotated about the vertical Z-axis direction, and/or the printing position of the alignment mark 92 on the surface of the workpiece 9 The degree of error (if the size of the workpiece 9 is determined to be constant, the relationship with the edge of the workpiece 9 or the alignment mark 91 marked on the corner of the workpiece 9 is obtained. It is known that the printing position of the alignment mark 92 is deviated or the like.

第5圖係例示對位標記91、92。對位標記91、92，被標示於被加工物9的角落(尤其是對角)，或是被標示於每個被加工物9所包含之各單元(一個單元對應於一個製品(觸控面板裝置))。 Fig. 5 illustrates alignment marks 91, 92. The alignment marks 91, 92 are indicated on the corners (especially diagonal) of the workpiece 9, or are indicated in each unit included in each workpiece 9 (one unit corresponds to one article (touch panel) Device)).

依據攝像感測器2之測量結果，於第二配置區域4中所執行之雷射加工處理中，可使用在由檢波掃描器11、12所決定之雷射光L的照射位置座標之修正。此外，當支撐體61、71可在Y軸方向上移位或是可繞著Z軸水平地旋轉時，亦可因應該測量結果，沿著Y軸方向，修正用來支撐被加工物9之支撐體61、71相對於雷射光照射裝置1之相對位置，或是繞著Z軸旋轉來修正。 According to the measurement result of the imaging sensor 2, in the laser processing performed in the second arrangement area 4, the correction of the irradiation position coordinates of the laser light L determined by the detector scanners 11, 12 can be used. In addition, when the support bodies 61, 71 can be displaced in the Y-axis direction or can be horizontally rotated about the Z-axis, the workpieces 9 can be modified along the Y-axis direction according to the measurement result. The support bodies 61, 71 are corrected relative to the relative position of the laser light irradiation device 1, or rotated about the Z axis.

在第一配置區域3中之被加工物9的送出入及對位中，於第二配置區域4中，係進行將雷射光L照射在由第二輸送機構7的支撐體71所支撐之被加工物9之雷射加工。雷射加工，例如藉由雷射光L切削被設置在被加工物9之導電層93而形成配線圖型。 In the feeding and aligning of the workpiece 9 in the first arrangement area 3, in the second arrangement area 4, the laser light L is irradiated to the support supported by the support body 71 of the second transport mechanism 7. Laser processing of the workpiece 9. The laser processing is performed by, for example, cutting the conductive layer 93 of the workpiece 9 by laser light L to form a wiring pattern.

在雷射加工及對位均完成時，將對位完畢的被加工物9從第一配置區域3輸送至第二配置區域4，並 且將雷射加工完畢的被加工物9從第二配置區域4輸送至第一配置區域3。亦即，第一輸送機構6的支撐體61從第一配置區域3移動至第二配置區域4，第二輸送機構7的支撐體71從第二配置區域4移動至第一配置區域3。此時，由於需將兩者的支撐體61、71相互錯開，所以將第二輸送機構7之支撐體71的高度位置，從第1圖的實線所示之雷射光L之焦點附近的高度位置，降低至第1圖的虛線所示之可潛入於第一輸送機構6的支撐體61下方之高度位置。然後一邊將該支撐體71從第二配置區域4移動至第一配置區域3，一邊將另一方的支撐體71從第一配置區域3移動至第二配置區域4。 When the laser processing and the alignment are completed, the aligned workpiece 9 is transported from the first arrangement area 3 to the second arrangement area 4, and The workpiece 9 that has been subjected to the laser processing is transported from the second arrangement area 4 to the first arrangement area 3. That is, the support body 61 of the first transport mechanism 6 moves from the first arrangement area 3 to the second arrangement area 4, and the support body 71 of the second transport mechanism 7 moves from the second arrangement area 4 to the first arrangement area 3. At this time, since the support bodies 61 and 71 of the two are to be shifted from each other, the height position of the support body 71 of the second conveyance mechanism 7 is higher than the focus of the laser light L shown by the solid line in FIG. The position is lowered to the height position below the support 61 of the first conveying mechanism 6 as indicated by the broken line in FIG. Then, while the support body 71 is moved from the second arrangement region 4 to the first arrangement region 3, the other support body 71 is moved from the first arrangement region 3 to the second arrangement region 4.

如第3圖所示，當第一輸送機構6的支撐體61移動至第二配置區域4，且該支撐體61以及由其所支撐之被加工物9位於雷射光照射裝置1的下方時，係開始進行從雷射光照射裝置1將雷射光照射在該被加工物9之雷射加工。如先前所說明般，於雷射加工時，係反映對該被加工物9所執行之對位的測量結果，來修正檢波掃描器11、12所指向之雷射光L的照射位置座標。以及/或者修正用來支撐被加工物9之支撐體61相對於雷射光照射裝置1之相對位置(沿著Y軸方向或是繞著Z軸旋轉)。 As shown in FIG. 3, when the support body 61 of the first conveying mechanism 6 is moved to the second arrangement region 4, and the support body 61 and the workpiece 9 supported thereby are located below the laser light irradiation device 1, The laser processing of irradiating the laser light to the workpiece 9 from the laser light irradiation device 1 is started. As described above, at the time of laser processing, the measurement result of the alignment performed on the workpiece 9 is reflected to correct the irradiation position coordinates of the laser light L to which the detector scanners 11 and 12 are directed. And/or correcting the relative position of the support body 61 for supporting the workpiece 9 with respect to the laser light irradiation device 1 (rotating along the Y-axis direction or around the Z-axis).

相對的，當第二輸送機構7的支撐體移動至第一配置區域3，且該支撐體71以及由其所支撐之被加工物9到達送出入場所31時，作業人員將完成雷射加工之該被加工物9卸下，並將應進行雷射加工之新的被加工 物9載置並吸附於該支撐體。於送出入場所31中，如第3圖的虛線所示，並不會阻礙作業人員將支撐體71的高度位置上升至用以進行被加工物9的送出入之適當的高度。 In contrast, when the support body of the second transport mechanism 7 moves to the first arrangement area 3, and the support body 71 and the workpiece 9 supported thereby reach the feed-in place 31, the operator will complete the laser processing. The workpiece 9 is unloaded, and a new processed laser processing should be performed. The object 9 is placed and adsorbed on the support. In the feeding-in/out place 31, as shown by the broken line in FIG. 3, the worker is not prevented from raising the height position of the support body 71 to an appropriate height for feeding the workpiece 9.

接著於該第一配置區域3內，使該支撐體71從送出入場所31進入於縱深側。此時該支撐體71通過攝像感測器2的正下方，攝像感測器2拍攝被支撐於支撐體71之被加工物9的表面而執行對位。 Next, in the first arrangement region 3, the support body 71 is moved from the feeding place 31 to the depth side. At this time, the support body 71 passes directly under the image pickup sensor 2, and the image pickup sensor 2 captures the surface of the workpiece 9 supported by the support body 71 to perform alignment.

在第一配置區域3中之被加工物9的送出入及對位中，於第二配置區域4中，係進行將雷射光L照射在由第一輸送機構6的支撐體61所支撐之被加工物9之雷射加工。 In the feeding and aligning of the workpiece 9 in the first arrangement area 3, in the second arrangement area 4, the laser light L is irradiated to the support supported by the support body 61 of the first transport mechanism 6. Laser processing of the workpiece 9.

在雷射加工及對位均完成時，將對位完畢的被加工物9從第一配置區域3輸送至第二配置區域4，並且將雷射加工完畢的被加工物9從第二配置區域4輸送至第一配置區域3。亦即，第二輸送機構7的支撐體71從第一配置區域3移動至第二配置區域4，第一輸送機構6的支撐體61從第二配置區域4移動至第一配置區域3。此時，由於需將兩者的支撐體61、71相互錯開，所以在第一配置區域3中若使第二輸送機構7的支撐體71上升，則可將此降低至可潛入於第一輸送機構6的支撐體61下方之高度位置。然後一邊將該支撐體71從第一配置區域3移動至第二配置區域4，一邊將另一方的支撐體61從第二配置區域4移動至第一配置區域3。 When the laser processing and the alignment are completed, the aligned workpiece 9 is transported from the first arrangement area 3 to the second arrangement area 4, and the laser processed workpiece 9 is removed from the second arrangement area. 4 is delivered to the first configuration area 3. That is, the support body 71 of the second transport mechanism 7 moves from the first arrangement area 3 to the second arrangement area 4, and the support body 61 of the first transport mechanism 6 moves from the second arrangement area 4 to the first arrangement area 3. At this time, since the support bodies 61 and 71 of the two are to be shifted from each other, if the support body 71 of the second transport mechanism 7 is raised in the first arrangement region 3, the lower support can be lowered to the first transport. The height position below the support 61 of the mechanism 6. Then, while the support body 71 is moved from the first arrangement area 3 to the second arrangement area 4, the other support body 61 is moved from the second arrangement area 4 to the first arrangement area 3.

如第1圖所示，當第二輸送機構7的支撐體71移動至第二配置區域4，且該支撐體71以及由其所支撐之被加工物9位於雷射光照射裝置1的下方時，係將該支撐體71的高度位置上升至雷射光L之焦點附近的高度位置，並開始進行從雷射光照射裝置1將雷射光照射在該被加工物9之雷射加工。如先前所說明般，於雷射加工時，係反映對該被加工物9所執行之對位的測量結果，來修正檢波掃描器11、12所指向之雷射光L的照射位置座標。以及/或者修正用來支撐被加工物9之支撐體71相對於雷射光照射裝置1之相對位置(沿著Y軸方向或是繞著Z軸旋轉)。 As shown in FIG. 1, when the support body 71 of the second transport mechanism 7 is moved to the second arrangement region 4, and the support body 71 and the workpiece 9 supported thereby are located below the laser light irradiation device 1, The height position of the support body 71 is raised to a height position near the focus of the laser light L, and laser processing for irradiating the laser beam to the workpiece 9 from the laser light irradiation device 1 is started. As described above, at the time of laser processing, the measurement result of the alignment performed on the workpiece 9 is reflected to correct the irradiation position coordinates of the laser light L to which the detector scanners 11 and 12 are directed. And/or correcting the relative position of the support body 71 for supporting the workpiece 9 with respect to the laser light irradiation device 1 (rotating along the Y-axis direction or around the Z-axis).

相對的，當第一輸送機構6的支撐體61移動至第一配置區域3，且該支撐體61以及由其所支撐之被加工物9到達送出入場所31時，作業人員將完成雷射加工之該被加工物9卸下，並將應進行雷射加工之新的被加工物9載置並吸附於該支撐體61。 In contrast, when the support body 61 of the first conveying mechanism 6 moves to the first arrangement area 3, and the support body 61 and the workpiece 9 supported thereby reach the delivery location 31, the operator will complete the laser processing. The workpiece 9 is removed, and a new workpiece 9 to be subjected to laser processing is placed and adsorbed on the support 61.

以下重複進行上述步驟，依序對多數個被加工物9依序施以雷射加工。 The above steps are repeated as follows, and a plurality of workpieces 9 are sequentially subjected to laser processing in order.

本實施形態中，係構成下列雷射加工機，亦即，具備分別可配置被加工物9之複數個配置區域3、4，在執行對位，也就是執行包含被配置在某配置區域3、4之被加工物9與將雷射光照射在該被加工物9之雷射光照射裝置1之相對位置關係的測量之對位的同一時期，對被配置在其他配置區域4、3且已結束前述對位之 被加工物9，執行從雷射光照射裝置1照射雷射光之加工處理。 In the present embodiment, the laser processing machine is configured to have a plurality of arrangement areas 3 and 4 in which the workpiece 9 can be disposed, and the alignment is performed, that is, the execution includes the arrangement in the arrangement area 3, In the same period of the measurement of the relative positional relationship between the workpieces 9 and the laser beam irradiation device 1 of the workpiece 9, the pair of workpieces 9 are disposed in the other arrangement regions 4 and 3 and have ended the foregoing. Counterpoint The workpiece 9 performs processing for irradiating the laser light from the laser light irradiation device 1.

根據本實施形態，在對某被加工物9執行雷射加工處理之間，完成對下一個施以雷射加工之被加工物9的對位，如此可大幅提高雷射加工機的運轉時間中所佔有之雷射加工處理時間的比率。換言之，可縮短雷射光照射裝置1未將雷射光照射在被加工物9之閒置時間。並且可縮短雷射加工步驟的作業時間，增加每單位時間施以雷射加工之被加工物9的數量。 According to the present embodiment, the alignment of the workpiece 9 to be subjected to the laser processing is completed between the processing of the laser processing of a workpiece 9, so that the operation time of the laser processing machine can be greatly improved. The ratio of the processing time of the laser processing. In other words, it is possible to shorten the idle time in which the laser light irradiation device 1 does not irradiate the laser light to the workpiece 9. Moreover, the working time of the laser processing step can be shortened, and the number of workpieces 9 subjected to laser processing per unit time can be increased.

本發明並不限定於以上詳細說明之實施形態。尤其在第一配置區域3與第二配置區域4之間輸送被加工物9之輸送機構，並不限定於上述實施形態。例如，如第6圖所示，當被加工物9形成為可被多重地捲繞於輥(或捲軸)81之薄膜狀時，亦可採用下列型態，亦即藉由其他輥82來捲取從該輥81所拉出之被加工物9以使被加工物9移位，並且將該被加工物9的各部分依序送入於第一配置區域3及第二配置區域4，並在第一配置區域3進行對位，在第二配置區域4進行雷射之型態。 The invention is not limited to the embodiments described in detail above. In particular, the transport mechanism for transporting the workpiece 9 between the first arrangement area 3 and the second arrangement area 4 is not limited to the above embodiment. For example, as shown in Fig. 6, when the workpiece 9 is formed into a film shape which can be wound multiple times on the roller (or reel) 81, the following types can also be employed, that is, by the other rollers 82. The workpiece 9 pulled out from the roller 81 is taken to displace the workpiece 9, and the respective portions of the workpiece 9 are sequentially fed into the first arrangement area 3 and the second arrangement area 4, and The alignment is performed in the first arrangement area 3, and the laser type is performed in the second arrangement area 4.

本變形例中，與上述實施形態相同，在與位於第一配置區域3之被加工物9的部分成為對位的對象之同一時期，位於第二配置區域4之被加工物9的部分係接受雷射加工。被送入於第二配置區域4之被加工物9的部分，為在第一配置區域3中已完成對位處理之部分。 In the present modification, as in the above-described embodiment, the portion of the workpiece 9 located in the second arrangement region 4 is accepted at the same time as the object to be aligned with the portion of the workpiece 9 located in the first arrangement region 3. Laser processing. The portion of the workpiece 9 that is fed into the second arrangement area 4 is the portion where the alignment processing has been completed in the first arrangement area 3.

本變形例中，拉出輥81及捲取輥82係成為 輸送機構的構成主體。此等輥81、82，係發揮沿著行進方向使作為被加工物9之薄膜一次以既定尺寸進行間距傳送而移動之功能。 In the present modification, the pull-out roller 81 and the take-up roller 82 are The main body of the conveying mechanism. These rollers 81 and 82 function to move the film as the workpiece 9 at a predetermined size and to move at a pitch along the traveling direction.

其他各部的具體構成，在不脫離本發明之主旨的範圍內，可進行種種的變形。 The specific configuration of the other parts can be variously modified without departing from the spirit and scope of the invention.

[產業上之可應用性] [Industrial Applicability]

本發明可適用在將雷射光照射在被加工物的任意處來施以加工之雷射加工機。 The present invention can be applied to a laser processing machine that applies laser light to any place of a workpiece to be processed.

1‧‧‧雷射光照射裝置 1‧‧‧Laser light irradiation device

2‧‧‧攝像感測器 2‧‧‧Video Sensor

3‧‧‧第一配置區域 3‧‧‧First configuration area

4‧‧‧第二配置區域 4‧‧‧Second configuration area

5‧‧‧框架 5‧‧‧Frame

6、7‧‧‧輸送機構 6, 7‧‧‧ transport agencies

9‧‧‧被加工物 9‧‧‧Processed objects

31‧‧‧送出入場所 31‧‧‧Send in and out of the place

61、71‧‧‧支撐體 61, 71‧‧‧ Support

Claims (4)

一種雷射加工機，其係具備：分別可配置被加工物之複數個配置區域；在執行對位(alignment)，也就是執行包含被配置在某配置區域之被加工物與將雷射光照射在該被加工物之雷射光照射裝置之相對位置關係的測量之對位的同一時期，對被配置在其他配置區域且已結束前述對位之被加工物，執行從雷射光照射裝置照射雷射光之加工處理。 A laser processing machine comprising: a plurality of arrangement areas respectively arrangable for a workpiece; and performing alignment, that is, performing processing including a workpiece disposed in a certain arrangement area and irradiating the laser light In the same period of the alignment of the measurement of the relative positional relationship of the laser beam irradiation device of the workpiece, the laser beam is irradiated from the laser beam irradiation device to the workpiece disposed in the other arrangement region and having finished the alignment. Processing. 如請求項1所述之雷射加工機，其中於前述對位中，是藉由攝像感測器拍攝被加工物的表面上所標示之對位標記以確認該位置，並經由此動作來進行被加工物與雷射光照射裝置之相對位置關係的測量。 The laser processing machine according to claim 1, wherein in the alignment, the alignment mark marked on the surface of the workpiece is photographed by the image sensor to confirm the position, and the action is performed. Measurement of the relative positional relationship between the workpiece and the laser light irradiation device. 如請求項1所述之雷射加工機，其係具備：用以執行前述對位之第一配置區域、用以執行前述加工處理之第二配置區域、以及將前述第一配置區域中已結束前述對位之被加工物輸送至前述第二配置區域之輸送機構。 The laser processing machine according to claim 1, further comprising: a first arrangement area for performing the foregoing alignment, a second arrangement area for performing the foregoing processing, and ending the first configuration area The object to be processed in the preceding position is transported to the transport mechanism of the second arrangement area. 如請求項1所述之雷射加工機，其中前述雷射光照射裝置，係使用可改變照射在被加工物之雷射光光軸的朝向之檢波掃描器。 A laser processing machine according to claim 1, wherein said laser light irradiation means uses a scanning scanner which changes the orientation of the optical axis of the laser beam irradiated to the workpiece.
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