TW201507833A - Breaking mechanism - Google Patents
Breaking mechanism Download PDFInfo
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- TW201507833A TW201507833A TW103113578A TW103113578A TW201507833A TW 201507833 A TW201507833 A TW 201507833A TW 103113578 A TW103113578 A TW 103113578A TW 103113578 A TW103113578 A TW 103113578A TW 201507833 A TW201507833 A TW 201507833A
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- edge portion
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- pair
- posture
- holder
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明係關於一種將液晶面板用之貼合玻璃基板及其他脆性材料基板分斷之機構，尤其係關於一種將脆性材料基板之端緣部分斷之機構。 The present invention relates to a mechanism for separating a bonded glass substrate for a liquid crystal panel and other brittle material substrates, and more particularly to a mechanism for partially breaking an edge of a brittle material substrate.
液晶面板大致係藉由將向2塊矩形狀之玻璃基板間封入液晶之構成之大面積之貼合基板(母基板)分斷成特定尺寸而製作。於液晶面板之一玻璃基板上預先形成有分別構成液晶元件之複數個電晶體。然而，上述複數個電晶體係於母基板之階段中，經由自該電晶體引出以用於連接外部之電極端子，利用設置於母基板之側端部(突出部)之短路電極而相互短路，以防止靜電引起之絕緣破壞。於液晶面板之製造製程中將設有短路電極之母基板之側端部分斷去除之技術已眾所周知(例如參照專利文獻1)。 The liquid crystal panel is roughly produced by dividing a bonded substrate (mother substrate) having a large area in which liquid crystal is sealed between two rectangular glass substrates into a specific size. A plurality of transistors each constituting a liquid crystal element are formed in advance on one of the glass substrates of the liquid crystal panel. However, in the stage of the mother substrate, the plurality of electro-crystal systems are taken out from the transistor for connecting external electrode terminals, and short-circuited by short-circuit electrodes provided at side ends (protrusions) of the mother substrate, To prevent insulation damage caused by static electricity. A technique for cutting off the side end portion of the mother substrate provided with the short-circuit electrode in the manufacturing process of the liquid crystal panel is known (for example, refer to Patent Document 1).
具體而言，於專利文獻1中揭示有如下製程：於矩形狀之母基板之距一邊緣特定距離之分斷位置與該邊緣平行地形成劃線之後，沿所形成之劃線進行分斷，藉此，將設有短路電極之側端部去除，進而對分斷後之母基板之端面進行研磨。 Specifically, Patent Document 1 discloses a process in which a line is formed along a line formed by a predetermined distance from a certain edge of a rectangular mother substrate, and a line is formed in parallel with the edge. Thereby, the side end portion provided with the short-circuit electrode is removed, and the end surface of the mother substrate after the division is polished.
又，藉由使夾持有陶瓷基板之夾持構件繞旋轉軸旋轉而將陶瓷基板分割之裝置亦已眾所周知(例如參照專利文獻2)。 Further, a device for dividing a ceramic substrate by rotating a sandwiching member sandwiching a ceramic substrate around a rotating shaft is also known (for example, refer to Patent Document 2).
[專利文獻1]日本專利特開平8-197402號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 8-197402
[專利文獻2]日本專利特開平9-19918號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei 9-19918
於專利文獻1揭示之態樣之情形時，藉由對被分斷去除之部分賦予特定之扭矩而實現分斷。然而，因被分斷去除之部分形成為長邊方向為劃線之延伸方向且另一方面短邊方向上之寬度較劃線之長度短之短條狀，即，因劃線與母基板之邊緣之間之距離與劃線之長度相比相對較短，故而於分斷時無法藉由距離獲得扭矩。因此，為了實現分斷，必須作用足以彌補劃線與邊緣之距離之不足之大小之力。然而，有如下問題：作用之力越大，越容易於分斷位置產生母基板之裂紋或缺口(毛邊等)。又，難以將如上述般之力均勻且瞬間賦予至整個分斷位置，因此，亦有可能作用之力之大小存在局部之不均勻而導致於母基板產生裂紋或缺口。 In the case of the aspect disclosed in Patent Document 1, the breaking is achieved by imparting a specific torque to the portion to be removed. However, the portion that is removed by the break is formed into a short strip shape in which the long side direction is the extending direction of the scribe line and the width in the short side direction is shorter than the length of the scribe line, that is, due to the scribe line and the mother substrate. The distance between the edges is relatively short compared to the length of the scribe line, so the torque cannot be obtained by the distance at the time of breaking. Therefore, in order to achieve the breaking, it is necessary to exert a force sufficient to compensate for the insufficient amount of the distance between the scribe line and the edge. However, there is a problem that the greater the force of action, the easier it is to generate cracks or nicks (burrs, etc.) of the mother substrate at the breaking position. Further, it is difficult to impart the force as described above evenly and instantaneously to the entire breaking position. Therefore, there is a possibility that the magnitude of the force acting may be locally uneven, causing cracks or chipping in the mother substrate.
本發明係鑒於上述問題研究而成者，其目的在於提供一種可良好地將脆性材料基板之側端部分斷之分斷機構。 The present invention has been made in view of the above problems, and an object thereof is to provide a breaking mechanism capable of satisfactorily breaking a side end portion of a brittle material substrate.
為了解決上述問題，技術方案1之發明係一種分斷機構，其特徵在於：其係將預先形成有劃線之基板之端緣部沿上述劃線分斷之機構，且包括夾持上述端緣部之一對夾持體、及變更上述一對夾持體之姿勢之姿勢變更機構，藉由上述姿勢變更機構變更夾持著上述端緣部之上述一對夾持體之姿勢而可進行上述端緣部之分斷，且上述一對夾持體之一者於沿上述端緣部之長邊方向之中央部分具有突起部，為了上述分斷而由上述一對夾持體夾持上述端緣部時，使上述突起部與上述端緣部接觸。 In order to solve the above problems, the invention of claim 1 is a breaking mechanism characterized in that it is a mechanism for dividing an edge portion of a substrate on which a scribe line is formed in advance along the scribe line, and includes clamping the edge The posture changing mechanism of the holder and the posture of changing the posture of the pair of holders can be performed by changing the posture of the pair of holders sandwiching the end edge portion by the posture changing mechanism The edge portion is divided, and one of the pair of holders has a projection at a central portion along the longitudinal direction of the end edge portion, and the end is sandwiched by the pair of holders for the separation In the edge portion, the protruding portion is brought into contact with the end edge portion.
技術方案2之發明係如技術方案1之分斷機構，其特徵在於：利 用上述一對夾持體夾持上述端緣部時，使上述突起部與上述端緣部中設有上述劃線之一側之面接觸。 The invention of claim 2 is the breaking mechanism of the first aspect, characterized in that: When the end edge portion is sandwiched by the pair of holding bodies, the projection portion is brought into contact with a surface on the one side of the end edge portion on which the scribe line is provided.
技術方案3之發明係如技術方案1或2之分斷機構，其特徵在於：上述突起部設置成於俯視時於越接近上述劃線之位置則前端越細之梯形狀。 The invention of claim 3 is characterized in that the protrusion is provided in a trapezoidal shape in which the tip end is tapered toward a position closer to the scribe line in plan view.
技術方案4之發明係如技術方案1至3中任一項之分斷機構，其特徵在於：於上述姿勢變更機構中，保持上述一對夾持體之保持部設為繞特定之轉動軸自由轉動，藉由使特定之升降構件進行升降動作而使上述轉動軸沿圓弧狀之軌跡移動，藉此變更上述一對夾持體之姿勢。 The invention according to any one of claims 1 to 3, wherein in the posture changing mechanism, the holding portion holding the pair of holders is freely formed around a specific rotation axis. By rotating, the specific lifting member is moved up and down to move the rotating shaft along an arcuate path, thereby changing the posture of the pair of holding bodies.
如技術方案1至技術方案4之發明，於設有突起部之一側之夾持體中，藉由使作用於應分斷之基板之端緣部之力集中於該突起部，可穩定且確實地實現不產生裂紋或毛邊等之端緣部之分斷。 According to the inventions of the first aspect to the fourth aspect, in the holder provided with one side of the projection, the force acting on the edge portion of the substrate to be separated is concentrated on the projection, thereby being stable and It is sure to achieve the breakage of the edge portion where cracks or burrs are not generated.
1‧‧‧分斷機構 1‧‧‧disconnecting mechanism
2‧‧‧第1夾持體 2‧‧‧1st holder
3‧‧‧第2夾持體 3‧‧‧2nd clamping body
4‧‧‧姿勢變更機構 4‧‧‧ posture change institution
4a‧‧‧夾持部 4a‧‧‧ gripping department
4b‧‧‧轉動軸 4b‧‧‧Rotary axis
4c‧‧‧動作轉換部 4c‧‧‧Action Conversion Department
4d‧‧‧升降部 4d‧‧‧ Lifting Department
5‧‧‧突起部 5‧‧‧Protruding
6、7‧‧‧樹脂片 6, 7‧‧‧ resin tablets
8‧‧‧導板 8‧‧‧ Guide
9‧‧‧引導體 9‧‧‧Guidance
10‧‧‧基板保持部 10‧‧‧Substrate retention department
11‧‧‧排出路徑 11‧‧‧Drainage path
100‧‧‧分斷處理裝置 100‧‧‧Disconnect processing device
A1‧‧‧圓弧 A1‧‧‧ arc
A2‧‧‧圓弧 A2‧‧‧ arc
AR1‧‧‧箭頭 AR1‧‧‧ arrow
AR2‧‧‧箭頭 AR2‧‧‧ arrow
AR3‧‧‧箭頭 AR3‧‧‧ arrow
AR4‧‧‧箭頭 AR4‧‧‧ arrow
AR5‧‧‧箭頭 AR5‧‧‧ arrow
RE‧‧‧區域 RE‧‧‧Area
SL‧‧‧劃線 SL‧‧‧
W‧‧‧基板 W‧‧‧Substrate
圖1係表示分斷機構1之概略構成之一側視圖。 Fig. 1 is a side view showing a schematic configuration of the breaking mechanism 1.
圖2係分斷機構1之俯視圖。 2 is a plan view of the breaking mechanism 1.
圖3係自Y軸方向正側觀察分斷機構1之側視圖。 Fig. 3 is a side view of the breaking mechanism 1 as viewed from the positive side in the Y-axis direction.
圖4係自Z軸方向負側觀察第1夾持體2之俯視圖。 4 is a plan view of the first holder 2 as seen from the negative side in the Z-axis direction.
圖5係自Y軸方向正側觀察夾持有基板W之狀態之分斷機構1之側視圖。 Fig. 5 is a side view of the breaking mechanism 1 in a state in which the substrate W is sandwiched from the positive side in the Y-axis direction.
圖6係表示利用分斷機構1之基板W之分斷開始時之情形之透視俯視圖。 Fig. 6 is a perspective plan view showing a state in which the division of the substrate W by the breaking mechanism 1 is started.
圖7係表示利用分斷機構1之基板W之分斷中途之情形之透視俯視圖。 Fig. 7 is a perspective plan view showing a state in which the substrate W of the breaking mechanism 1 is separated in the middle.
圖8(a)、(b)係用以對姿勢變更機構4之一例示之態樣與該態樣下之夾持部4a之轉動動作進行說明之概要圖。 8(a) and 8(b) are schematic diagrams for explaining an example of the posture changing mechanism 4 and a turning operation of the grip portion 4a in the aspect.
圖9(a)、(b)係用以對姿勢變更機構4之一例示之態樣與該態樣下之夾持部4a之轉動動作進行說明之概要圖。 FIGS. 9(a) and 9(b) are schematic diagrams for explaining an example of the posture changing mechanism 4 and a turning operation of the grip portion 4a in the aspect.
圖10係表示分斷處理裝置100之主要部分之立體圖。 FIG. 10 is a perspective view showing a main part of the breaking processing device 100.
圖11係表示分斷處理裝置100之主要部分之側視圖。 Fig. 11 is a side view showing the main part of the breaking processing device 100.
圖1係表示本發明之實施形態之分斷機構1之概略構成之一側視圖。圖2係分斷機構1之俯視圖。本發明之實施形態之分斷機構1係將矩形狀之脆性材料基板(以下，僅稱為基板)W之端緣部分斷去除之機構。基板W例如為玻璃基板，亦可係作為液晶面板之母基板之向2塊矩形狀之玻璃基板間封入液晶之構成之大面積之貼合基板等。 Fig. 1 is a side view showing a schematic configuration of a breaking mechanism 1 according to an embodiment of the present invention. 2 is a plan view of the breaking mechanism 1. The breaking mechanism 1 according to the embodiment of the present invention is a mechanism for cutting off the edge portion of a rectangular brittle material substrate (hereinafter, simply referred to as a substrate) W. The substrate W is, for example, a glass substrate, or a bonded substrate having a large area in which liquid crystal is sealed between two rectangular glass substrates as a mother substrate of the liquid crystal panel.
分斷機構1主要包括：第1夾持體2與第2夾持體3，其等構成一對夾持體且均為短條狀；夾持部4a，其實現利用第1夾持體2與第2夾持體3夾持基板W之夾持動作；及夾持部4a進行轉動動作時之轉動軸4b。夾持部4a與轉動軸4b構成姿勢變更機構4，該姿勢變更機構4一體地變更夾持著基板W之狀態之第1夾持體2與第2夾持體3之姿勢。 The breaking mechanism 1 mainly includes a first holding body 2 and a second holding body 3, and the like, and a pair of clamping bodies are formed in a short strip shape, and the clamping portion 4a realizes the use of the first clamping body 2 The clamping operation of sandwiching the substrate W with the second holding body 3; and the rotating shaft 4b when the clamping portion 4a is rotated. The grip portion 4a and the rotation shaft 4b constitute a posture changing mechanism 4 that integrally changes the postures of the first holder 2 and the second holder 3 in a state in which the substrate W is sandwiched.
於分斷機構1中，在利用未圖示之保持構件保持著基板W之狀態下，該基板W之端緣部大致被夾持於均為俯視下為短條狀且為水平姿勢之第1夾持體2與第2夾持體3之間。然後，藉由於上述夾持狀態下驅動姿勢變更機構4而使第1夾持體2與第2夾持體3之姿勢變更，藉此對該端緣部賦予扭矩。上述扭矩發揮作用後，該端緣部自基板W被分斷。 In the state in which the substrate W is held by the holding member (not shown), the edge portion of the substrate W is substantially sandwiched in a short strip shape in plan view and is the first in a horizontal posture. Between the holder 2 and the second holder 3. Then, the posture of the first holder 2 and the second holder 3 is changed by the driving posture changing mechanism 4 in the above-described gripping state, thereby applying torque to the end portion. After the above torque acts, the end portion is separated from the substrate W.
再者，於圖1及圖2中，標註右手系之XYZ座標(之後之圖中亦同樣)，該右手系之XYZ座標中將水平面內之第1夾持體2及第2夾持體3之延伸方向(即，作為去除作為對象之基板W之端緣部之延伸方向)設為X軸方向，將在水平面內與X軸方向正交之方向設為Y軸方向，將垂 直方向設為Z軸方向。而且，圖1係指自X軸方向正側觀察分斷機構1之側視圖。再者，於圖2中，示出姿勢變更機構4於3個部位和第1夾持體2與第2夾持體3連接之態樣，但其只不過為例示，利用姿勢變更機構4之第1夾持體2與第2夾持體3之支持態樣並不限定於此。 In addition, in FIGS. 1 and 2, the XYZ coordinates of the right-handed system are also indicated (the same applies to the following figures), and the first clamping body 2 and the second clamping body 3 in the horizontal plane are included in the XYZ coordinates of the right-handed system. The extending direction (that is, the direction in which the edge portion of the substrate W to be removed is removed) is set to the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is set to the Y-axis direction. The straight direction is set to the Z-axis direction. Further, Fig. 1 is a side view of the breaking mechanism 1 as viewed from the positive side in the X-axis direction. In addition, in FIG. 2, the posture changing mechanism 4 is connected to the second holder 3 at three locations, but the posture changing mechanism 4 is used as an example. The support aspect of the first holder 2 and the second holder 3 is not limited thereto.
繼而，對本實施形態之分斷機構1之詳細構成及利用分斷機構1之基板W之分斷態樣進行說明。 Next, the detailed configuration of the breaking mechanism 1 of the present embodiment and the breaking pattern of the substrate W by the breaking mechanism 1 will be described.
圖3係自Y軸方向正側觀察分斷機構1之側視圖。圖4係自Z軸方向負側觀察第1夾持體2之俯視圖。圖5係自Y軸方向正側觀察夾持有基板W之狀態之分斷機構1之側視圖。圖6係表示利用分斷機構1之基板W之分斷開始時之情形之透視俯視圖。圖7係表示利用分斷機構1之基板W之分斷中途之情形之透視俯視圖。 Fig. 3 is a side view of the breaking mechanism 1 as viewed from the positive side in the Y-axis direction. 4 is a plan view of the first holder 2 as seen from the negative side in the Z-axis direction. Fig. 5 is a side view of the breaking mechanism 1 in a state in which the substrate W is sandwiched from the positive side in the Y-axis direction. Fig. 6 is a perspective plan view showing a state in which the division of the substrate W by the breaking mechanism 1 is started. Fig. 7 is a perspective plan view showing a state in which the substrate W of the breaking mechanism 1 is separated in the middle.
首先，如圖1及圖6所示，關於基板W之作為去除對象之端緣部，於分斷之前預先在距邊緣特定距離之位置上形成有劃線SL。上述劃線SL之形成係藉由金剛石刻刀(diamond point)或刀輪等眾所周知之劃線形成構件而實現。 First, as shown in FIG. 1 and FIG. 6, regarding the edge portion of the substrate W to be removed, a scribe line SL is formed in advance at a position at a certain distance from the edge before the division. The formation of the scribe line SL is achieved by a well-known scribe line forming member such as a diamond point or a cutter wheel.
已形成上述劃線SL之基板W係於將形成有劃線SL之一側設為上表面側(Z軸方向正側)之狀態下，自與姿勢變更機構4相反之一側(自Y軸方向正側)***至第1夾持體2與第2夾持體3之間。當***基板W時，姿勢變更機構4之夾持部4a係使上述基板W之邊緣與劃線SL之形成位置之間之部分由第1夾持體2與第2夾持體3夾持。於上述夾持狀態下，自第1夾持體2與第2夾持體3分別對基板W作用特定大小之力(按壓力)。 The substrate W on which the scribe line SL is formed is one side opposite to the posture changing mechanism 4 in a state where one side of the scribe line SL is formed on the upper surface side (positive side in the Z-axis direction) (from the Y-axis) The positive side of the direction is inserted between the first holder 2 and the second holder 3. When the substrate W is inserted, the nip portion 4a of the posture changing mechanism 4 sandwiches the portion between the edge of the substrate W and the position at which the scribe line SL is formed by the first holder 2 and the second holder 3. In the above-described nip state, a force (pressing force) of a specific magnitude is applied to the substrate W from the first holder 2 and the second holder 3, respectively.
再者，夾持部4a之夾持動作、即第1夾持體2與第2夾持體3之接近及分開，既可藉由兩者同時移位而實現，亦可例如藉由如下構成而實現：只有位於Z軸方向正側之一夾持體(若為圖1之情形則為第1夾持體 2)可進行動作，而另一夾持體(若為圖1之情形則為第2夾持體3)相對於夾持部4a固定地設置。換言之，夾持部4a亦可謂將第1夾持體2與第2夾持體3以能夠開合兩者之間隙部分之方式保持之部位。 Further, the clamping operation of the nip portion 4a, that is, the approach and separation of the first holder 2 and the second holder 3 can be achieved by simultaneously shifting the two, or by, for example, And realized: only one of the clamping bodies on the positive side in the Z-axis direction (if the case of FIG. 1 is the first clamping body) 2) The operation can be performed, and the other holder (the second holder 3 in the case of Fig. 1) is fixedly disposed with respect to the nip portion 4a. In other words, the nip portion 4a may be a portion that holds the first holder 2 and the second holder 3 so that the gap portion between the first holder 2 and the second holder 3 can be opened and closed.
其中，如圖3及圖4所示，或者，進而亦如圖1及圖2中虛線所示，於第1夾持體2中，於與第2夾持體3之對向面而且X軸方向(長邊方向)之中央部分且Y軸方向之正側之端緣部設有突起部5。突起部5例如由橡膠等彈性體所形成。而且，其厚度(Z軸方向之尺寸)一樣即可，但其俯視形狀(在水平姿勢下俯視之情形時之形狀)與其為矩形狀，倒不如較佳設置成朝向Y軸方向之正側之前端部在與劃線SL越近之位置前端越細之梯形狀。 Here, as shown in FIG. 3 and FIG. 4, or as shown by a broken line in FIG. 1 and FIG. 2, in the first holder 2, the opposite side to the second holder 3 and the X-axis A projection portion 5 is provided at a central portion of the direction (longitudinal direction) and at an edge portion of the positive side in the Y-axis direction. The protrusion 5 is formed, for example, of an elastic body such as rubber. Further, the thickness (the dimension in the Z-axis direction) may be the same, but the shape of the plan view (the shape in a plan view in a horizontal posture) is rectangular, and it is preferably set to the positive side in the Y-axis direction. The front end portion has a tapered shape at the front end of the position closer to the scribe line SL.
另一方面，於第2夾持體3中，如圖1及圖3所示，於與第1夾持體2之對向面之大致整面附設有樹脂片6。 On the other hand, in the second holder 3, as shown in FIGS. 1 and 3, a resin sheet 6 is attached to substantially the entire surface of the opposing surface of the first holder 2.
因此，嚴格而言，本實施形態之分斷機構1中之基板W之夾持係如圖5所示，於設置於第1夾持體2之突起部5與設置於第2夾持體3之樹脂片6之間進行。 Therefore, strictly speaking, the holding mechanism of the substrate W in the breaking mechanism 1 of the present embodiment is provided in the protruding portion 5 of the first holding body 2 and the second holding body 3 as shown in FIG. The resin sheet 6 is carried out.
此時，自第2夾持體3之一側作用於基板W之力，具體而言，自樹脂片6作用於基板W之按壓力因樹脂片6在X軸方向上一樣地設置而在X軸方向上均勻。相對於此，於第1夾持體2之一側，與基板W接觸之部位僅為突起部5，因此，按壓力僅自突起部5作用於基板W。此時，自第1夾持體2之一側作用於基板W之按壓力集中於突起部5之部位，因此，成為如圖6所示應力集中於基板W之與突起部5之前端側接近之區域RE之狀態。 At this time, the force acting on the substrate W from one side of the second holding body 3, specifically, the pressing force acting on the substrate W from the resin sheet 6 is set in the X-axis direction by the resin sheet 6 in the X direction. Uniform in the direction of the axis. On the other hand, on the one side of the first holder 2, the portion in contact with the substrate W is only the protrusion portion 5, and therefore, only the protrusion portion 5 acts on the substrate W under the pressing force. At this time, since the pressing force acting on the substrate W from one side of the first holding body 2 is concentrated on the projection portion 5, the stress is concentrated on the substrate W as shown in FIG. 6 and is close to the front end side of the projection portion 5. The status of the area RE.
於分斷機構1中，在以上述態樣施加了按壓力之狀態下將基板W分斷。具體而言，於姿勢變更機構4中，夾持部4a設置成可繞轉動軸4b轉動，若為圖1所示之情形，則藉由使轉動軸4b沿箭頭AR1所示之方向移動而使夾持部4a繞轉動軸4b轉動，使第1夾持體2及第2夾持體3 之姿勢自水平姿勢變化為夾持部4a所存在之Y軸方向負側變低之姿勢。藉此，扭矩沿箭頭AR1之方向作用於基板W之端緣部。如此，隨著該轉動動作開始，以存在於應力集中之區域RE之劃線SL之長邊方向中央部分為起點，龜裂開始沿劃線SL伸展。同時，自該起點部分起依序地，龜裂亦於厚度方向上伸展。藉此，如圖7所示，朝向X軸正負兩方向，沿劃線SL進行基板W之分斷。 In the breaking mechanism 1, the substrate W is divided in a state where the pressing force is applied in the above-described manner. Specifically, in the posture changing mechanism 4, the nip portion 4a is provided to be rotatable about the rotation shaft 4b, and if it is in the case shown in Fig. 1, the rotation shaft 4b is moved in the direction indicated by the arrow AR1. The clamping portion 4a is rotated about the rotation shaft 4b to make the first holder 2 and the second holder 3 The posture changes from the horizontal posture to a posture in which the negative side of the Y-axis direction in which the nip portion 4a exists is lowered. Thereby, the torque acts on the edge portion of the substrate W in the direction of the arrow AR1. As a result of the start of the turning operation, the crack starts to extend along the scribe line SL with the center portion in the longitudinal direction of the scribe line SL existing in the region RE where the stress is concentrated as the starting point. At the same time, the cracks also extend in the thickness direction from the starting point portion. Thereby, as shown in FIG. 7, the division of the substrate W is performed along the scribe line SL in both the positive and negative directions of the X-axis.
而且，如上述般突起部5之Y軸方向正側之前端部分較佳為梯形狀係為了使作用於區域RE之應力更強，且使沿劃線SL之龜裂之延展更容易產生。 Further, as described above, the front end portion of the projection portion 5 on the positive side in the Y-axis direction is preferably formed in a trapezoidal shape so that the stress acting on the region RE is stronger, and the elongation of the crack along the scribe line SL is more likely to occur.
若厚度方向上之龜裂之延展於劃線SL之長邊方向中央部分至兩端部分之整個範圍內進行，則由第1夾持體2與第2夾持體3夾持之基板W之端緣部完全自基板W被分斷。 When the crack in the thickness direction extends over the entire range from the central portion to the both end portions in the longitudinal direction of the scribe line SL, the substrate W sandwiched between the first holder 2 and the second holder 3 The edge portion is completely separated from the substrate W.
於上述態樣之分斷之情形時，施加至基板W之端緣部之扭矩集中地作用於突起部5，藉此自劃線SL起之龜裂伸展自該突起部之附近起依序產生。因此，如同在未設置突起部5而在第1夾持體2之一側亦與第2夾持體3同樣地均勻地附設樹脂片且自第1夾持體2之一側亦遍及端緣部整體均等地作用力之情形時無法實現分斷一樣，即使僅作用較小之扭矩，亦能實現基板W不產生裂紋或毛邊等之確實之分斷。其原因在於：若夾持時賦予之力之大小相同，則設置突起部5之情形時力作用之部位處之壓力會變大，因此，相反而言，若設有突起部5，即使賦予之力較小，亦可作用足以實現分斷之壓力。 In the case of the division of the above-described aspect, the torque applied to the edge portion of the substrate W is concentrated on the projection 5, whereby the crack extension from the scribe line SL is sequentially generated from the vicinity of the projection. . Therefore, as in the case where the projections 5 are not provided, the resin sheet is uniformly attached to the one side of the first holder 2 in the same manner as the second holder 3, and the edge is also spread from one side of the first holder 2 In the case where the whole portion is equally movable, the breaking can not be achieved, and even if only a small torque is applied, the substrate W can be prevented from being cracked or burrs. The reason for this is that if the force applied during the clamping is the same, the pressure at the portion where the force acts when the protrusion 5 is provided becomes large. Therefore, if the protrusion 5 is provided, even if it is provided The force is small, and it can also be used to achieve the pressure of breaking.
而且，只要使龜裂自中央部分起依序伸展即可，因此，無需遍及基板W之端緣部整體一次作用較強之能量，故而即使將使夾持部4a繞轉動軸4b轉動之速度設為慢於上述設置樹脂片之情形，亦實現基板W不產生裂紋或毛邊等之確實之分斷。 Further, as long as the cracks are sequentially extended from the center portion, it is not necessary to apply a strong energy to the entire end portion of the substrate W at a time, so that the speed at which the nip portion 4a is rotated about the rotation shaft 4b is set. In the case where the resin sheet is disposed slower than the above, the substrate W is also prevented from being cracked or surely broken.
再者，至此之說明之前提係以如下態樣夾持基板W，即，將劃線 SL之形成面設為上表面側，第1夾持體2自上方接近於基板W且第2夾持體3自下方接近於基板W，但此並非必需之態樣。於本實施形態中，設有突起部5之第1夾持體2配置於劃線SL之形成面之一側即可。因此，亦可為如下態樣：與圖1等相反地將分斷機構1構成為在下側包含第1夾持體2且在上側包含第2夾持體3，將基板W以使劃線SL之形成面為下表面側之狀態***至第1夾持體2與第2夾持體3之間，而進行分斷。於上述情形時，使轉動軸4b沿圖1中箭頭AR2所示之方向移動即可。 Furthermore, the description so far is to hold the substrate W in the following manner, that is, to scribe The formation surface of the SL is the upper surface side, and the first holder 2 is close to the substrate W from above and the second holder 3 is close to the substrate W from below, but this is not essential. In the present embodiment, the first holder 2 in which the protrusions 5 are provided may be disposed on one side of the formation surface of the scribe line SL. Therefore, the breaking mechanism 1 may be configured such that the first holding body 2 is included on the lower side and the second holding body 3 is included on the upper side, and the substrate W is made to have a scribe line SL as opposed to FIG. 1 and the like. The formation surface is placed on the lower surface side and inserted between the first holder 2 and the second holder 3 to be separated. In the above case, the rotation shaft 4b is moved in the direction indicated by the arrow AR2 in Fig. 1.
再者，於圖1等中，於第1夾持體2之與第2夾持體3之對向面且突起部5以外之部分亦附設有樹脂片7。此係為了避免第1夾持體2之突起部5以外之部位與基板W接觸等而使基板W受損等，對上述態樣下之分斷而言，並非必需之態樣。其中，以上述態樣設置樹脂片7之情形時，使用較突起部5之構成材料軟之材料，且以小於突起部5之厚度設置。其原因在於：即使為突起部5之厚度因彈性而變小，使得樹脂片7亦與基板W接觸之狀態，亦可使將基板W分斷時針對基板W自第1夾持體2之一側施加至基板W之力集中於突起部5。 Further, in FIG. 1 and the like, a resin sheet 7 is also attached to a portion of the first holder 2 that faces the opposing surface of the second holder 3 and beyond the protrusions 5. In order to prevent the substrate W from being damaged by contact with the substrate W or the like other than the protruding portion 5 of the first holder 2, it is not necessary for the division under the above-described aspect. In the case where the resin sheet 7 is provided in the above-described manner, a material which is softer than the constituent material of the protrusion 5 is used, and is provided in a thickness smaller than the thickness of the protrusion 5. The reason for this is that even if the thickness of the protrusions 5 is reduced by elasticity, the resin sheet 7 is in contact with the substrate W, and one of the first holders 2 can be made for the substrate W when the substrate W is separated. The force applied to the substrate W on the side is concentrated on the protrusion 5.
負責上述第1夾持體2與第2夾持體3之姿勢變更之姿勢變更機構4之具體構成考慮有多種構成。圖8及圖9係用以對姿勢變更機構4之一例示之態樣與該態樣下之夾持部4a之轉動動作進行說明之概要圖。再者，於圖8及圖9中，雖將第1夾持體2與第2夾持體3、夾持部4a等之形狀相對於圖1等適當進行變更，但上述複數個部位之功能全部與到至此所說明之部位相同。又，關於突起部5或樹脂片6、7，因與姿勢變更機構4之動作本身沒有關係，故而省略圖示。 The specific configuration of the posture changing mechanism 4 that is responsible for the posture change of the first holding body 2 and the second holding body 3 is considered to have various configurations. 8 and 9 are schematic views for explaining an example of one of the posture changing mechanisms 4 and a turning operation of the grip portion 4a in the same manner. In addition, in FIGS. 8 and 9, the shape of the first holder 2, the second holder 3, the nip 4a, and the like are appropriately changed with respect to FIG. 1 and the like, but the functions of the plurality of parts are described. All are the same as those described so far. Further, the protrusions 5 or the resin sheets 6 and 7 are not related to the operation of the posture changing mechanism 4, and thus the illustration thereof is omitted.
圖8(a)所示之姿勢變更機構4除包含上述夾持部4a與轉動軸4b以外，還包含動作轉換部4c與升降部4d。升降部4d係例如氣缸等於鉛垂 方向(Z軸方向)自由升降之構成要素，動作轉換部4c係將轉動軸4b與升降部4d之間連結之構成要素，設置成可相對於轉動軸4b與設在升降部4d之未圖示之轉動軸之各者轉動。 The posture changing mechanism 4 shown in Fig. 8(a) includes the operation switching portion 4c and the elevation portion 4d in addition to the above-described sandwiching portion 4a and the rotation shaft 4b. The lifting portion 4d is, for example, a cylinder equal to plumb In the direction (Z-axis direction), the operation conversion unit 4c is a component that connects the rotation shaft 4b and the elevation unit 4d so as to be non-illustratable with respect to the rotation shaft 4b and the elevation unit 4d. Each of the rotating shafts rotates.
於具有上述構成之姿勢變更機構4中，伴隨升降部4d之鉛垂方向之移動，動作轉換部4c之姿勢發生變化，藉此轉動軸4b在圖8(b)所示之圓弧A1上移動。即，動作轉換部4c發揮將升降部4d之升降動作轉換為轉動軸4b之圓弧上之移動動作之作用。如上述般，轉動軸4b之移動直接導致夾持部4a與第1夾持體2及第2夾持體3之姿勢變化。 In the posture changing mechanism 4 having the above configuration, the posture of the operation switching portion 4c changes in accordance with the movement of the elevation portion 4d in the vertical direction, whereby the rotation shaft 4b moves on the arc A1 shown in Fig. 8(b). . In other words, the motion converting unit 4c functions to convert the lifting operation of the lifting portion 4d into a moving motion on the circular arc of the rotating shaft 4b. As described above, the movement of the rotation shaft 4b directly causes the posture of the sandwiching portion 4a and the first holder 2 and the second holder 3 to change.
而且，姿勢變更機構4中之基板W之分斷係藉由使姿勢變更機構4自圖8(a)及圖8(b)中實線所示之狀態變化為圖8(b)中一點鏈線所示之狀態而實現。即，若於由第1夾持體2與第2夾持體3夾持有基板W之狀態下使升降部4d如箭頭AR3所示般下降，則產生動作轉換部4c之姿勢變化與伴隨該姿勢變化之轉動軸4b在圓弧A1上之移動，第1夾持體2與第2夾持體3自水平姿勢變化為夾持部4a所在之一側變低之姿勢。藉此將由第1夾持體2與第2夾持體3夾持之部分分斷。 Further, the division of the substrate W in the posture changing mechanism 4 is changed from the state indicated by the solid line in FIGS. 8(a) and 8(b) to the point chain in FIG. 8(b) by the posture changing mechanism 4. This is achieved by the state shown by the line. In other words, when the lifting/lowering portion 4d is lowered as indicated by an arrow AR3 in a state in which the substrate W is sandwiched between the first holder 2 and the second holder 3, the posture change of the operation switching unit 4c is accompanied by The rotation axis 4b of the posture change moves on the circular arc A1, and the first holder 2 and the second holder 3 change from the horizontal posture to the posture in which one side of the nip portion 4a is lowered. Thereby, the portion sandwiched by the first holder 2 and the second holder 3 is separated.
再者，姿勢變更機構4之各部之配置關係並不限於圖8所示之關係。例如，於圖8(b)中，動作轉換部4c成為水平姿勢，但此並非必需之態樣，只要係轉動軸4b在特定之圓弧A1上移動之構成，則在第1夾持體2與第2夾持體3之姿勢變化之範圍內，動作轉換部4c亦可不採取水平姿勢。 In addition, the arrangement relationship of each part of the posture changing mechanism 4 is not limited to the relationship shown in FIG. For example, in FIG. 8(b), the motion conversion unit 4c is in a horizontal posture. However, this is not essential, and the first holder 2 is provided as long as the rotation shaft 4b is moved over the specific arc A1. The motion conversion unit 4c may not take a horizontal posture within a range in which the posture of the second holder 3 changes.
而且，圖9示出第1夾持體2與第2夾持體3之配置位置與圖8所示之情形顛倒之情形。上述情形亦於藉由升降部4d進行升降、轉動軸4b亦可於圓弧A2上移動之方面相同。而且，姿勢變更機構4中之基板W之分斷係藉由使姿勢變更機構4自圖9(a)及圖9(b)中實線所示之狀態變化為圖9(b)中一點鏈線所示之狀態而實現。即，若在由第1夾持體2與第2夾持體3夾持有基板W之狀態下使升降部4d如箭頭AR4所示般上 升，則產生動作轉換部4c之姿勢變化與伴隨該姿勢變化之轉動軸4b在圓弧A2上之移動，第1夾持體2與第2夾持體3自水平姿勢變化為夾持部4a所存在之一側變高之姿勢。藉此，將由第1夾持體2與第2夾持體3夾持之部分分斷。 Further, Fig. 9 shows a situation in which the arrangement positions of the first holder 2 and the second holder 3 are reversed as shown in Fig. 8. The above situation is also the same in that the lifting portion 4d is raised and lowered, and the rotating shaft 4b is also movable on the circular arc A2. Further, the division of the substrate W in the posture changing mechanism 4 is changed from the state indicated by the solid line in FIGS. 9(a) and 9(b) to the point chain in FIG. 9(b) by the posture changing mechanism 4. This is achieved by the state shown by the line. In other words, when the substrate W is sandwiched between the first holder 2 and the second holder 3, the elevation portion 4d is as shown by the arrow AR4. When the lift is applied, the posture change of the motion conversion unit 4c and the movement of the rotation shaft 4b accompanying the posture change on the arc A2 are generated, and the first holder 2 and the second holder 3 are changed from the horizontal posture to the grip portion 4a. There is a posture in which one side becomes high. Thereby, the portion sandwiched by the first holder 2 and the second holder 3 is divided.
圖10及圖11分別係表示具備以如上述般之原理進行基板W之端緣部之分斷之分斷機構1之分斷處理裝置100之主要部分之立體圖與側視圖。於圖10及圖11中，例示出包含構成為在下側設有第1夾持體2且在上側設有第2夾持體3之分斷機構1之分斷處理裝置100。尤其，圖11例示出姿勢變更機構4處於執行分斷時之狀態時之情形(其中，省略基板W)。 10 and FIG. 11 are respectively a perspective view and a side view showing a main part of the breaking processing device 100 including the breaking mechanism 1 for dividing the edge portion of the substrate W as described above. In FIGS. 10 and 11 , the breaking processing device 100 including the breaking mechanism 1 in which the first holding body 2 is provided on the lower side and the second holding body 3 is provided on the upper side is exemplified. In particular, FIG. 11 exemplifies a case where the posture changing mechanism 4 is in a state in which the cutting is performed (in which the substrate W is omitted).
分斷處理裝置100除包含分斷機構1以外，還包含保持基板W之基板保持部10、及用以將已被分斷之基板W之端緣部排出之排出路徑11。基板保持部10與排出路徑11均沿分斷機構1之延伸方向設置。而且，排出路徑11係於以下情形時使用之路徑：分斷後，將仍然夾持於第1夾持體2與第2夾持體3之間之基板W之端緣部解除上述夾持狀態而予以排出。 In addition to the breaking mechanism 1, the breaking processing device 100 further includes a substrate holding portion 10 that holds the substrate W, and a discharge path 11 for discharging the edge portion of the substrate W that has been separated. Both the substrate holding portion 10 and the discharge path 11 are provided along the extending direction of the breaking mechanism 1. Further, the discharge path 11 is a path that is used in a case where the edge portion of the substrate W that is still sandwiched between the first holder 2 and the second holder 3 is released from the nip state after the division. Discharge it.
而且，於圖10中，為了便於圖示，對分斷機構1與作為其附隨物之基板保持部10及排出路徑11僅示出1組，但在實際之分斷處理裝置100中，2組(一對)分斷機構1以特定之間隔對向配置。即，於分斷處理裝置100中，能夠於在相互分開之2個基板保持部10中以2個部位支持有基板W之狀態下，將基板W之對向之2個部位之端緣部同時並行地分斷。或者，分斷處理裝置100亦可設為如下態樣：包含使基板W在水平面內旋轉90°之機構，對矩形狀之基板W中存在2組之對向之端緣部之組依序分斷。 Further, in FIG. 10, for the sake of convenience of illustration, only one set is shown for the breaking mechanism 1 and the substrate holding portion 10 and the discharge path 11 as their attachments, but in the actual breaking processing device 100, 2 The group (pair) of the breaking mechanisms 1 are arranged at a specific interval. In the disconnection processing apparatus 100, in the state in which the substrate W is supported at two locations in the two substrate holding portions 10 which are separated from each other, the edge portions of the two portions facing the substrate W can be simultaneously simultaneously Break in parallel. Alternatively, the breaking processing device 100 may be configured to include a mechanism for rotating the substrate W by 90° in the horizontal plane, and to sequentially group the groups of the opposite ends of the two groups of the rectangular substrate W. Broken.
於分斷處理裝置100、進而於姿勢變更機構4之長邊方向之端部 附近設有用以在分斷動作時導引姿勢變更機構4之導板8(其中，於圖11中省略圖示)。更詳細而言，於導板8設有圓弧狀之貫通孔，另一方面，於姿勢變更機構4之長邊方向端部，2個引導體9以自該貫通孔突出之態樣設置。引導體9係於姿勢變更機構4進行分斷動作時，描繪圖11中箭頭AR5所示之圓弧狀之軌跡而移動。導板8之貫通孔形成為與上述引導體9之軌跡一致。因此，分斷時之姿勢變更機構4之動作範圍被限制為貫通孔中之引導體9能夠移動之範圍。藉此，於分斷處理裝置100中，實現穩定且具有再現性之分斷動作。 The cutting processing device 100 and the end portion of the posture changing mechanism 4 in the longitudinal direction A guide plate 8 for guiding the posture changing mechanism 4 during the breaking operation is provided in the vicinity (the illustration is omitted in FIG. 11). More specifically, the guide plate 8 is provided with an arc-shaped through hole, and on the other hand, at the end portion in the longitudinal direction of the posture changing mechanism 4, the two guide bodies 9 are provided in such a manner as to protrude from the through hole. When the posture changing mechanism 4 performs the breaking operation, the guiding body 9 moves in an arc-shaped trajectory indicated by an arrow AR5 in Fig. 11 . The through hole of the guide plate 8 is formed to coincide with the trajectory of the above-described guide body 9. Therefore, the range of operation of the posture changing mechanism 4 at the time of the division is limited to the range in which the guide body 9 in the through hole can move. Thereby, in the breaking processing device 100, a stable and reproducible breaking operation is realized.
如以上所說明般，根據本實施形態，於夾持有預先形成有劃線之基板之較劃線更靠邊緣側之端緣部之狀態下藉由對該端緣部作用扭矩而將該端緣部沿劃線自基板分斷之機構中，於一對夾持體中之一個夾持體之與基板之接觸部分設置俯視梯形狀之突起部，使自該夾持體之一側作用於基板之力集中於該突起部，藉此，可穩定且確實地實現不產生裂紋或毛邊等之分斷。 As described above, according to the present embodiment, the end portion of the substrate on which the scribe line is formed is sandwiched by the edge portion on the edge side, and the end portion is biased by the torque. In the mechanism in which the edge portion is separated from the substrate by the scribe line, a protrusion portion of the trapezoidal shape is disposed at a contact portion of the one of the pair of clamping bodies with the substrate so as to act on one side of the clamping body The force of the substrate is concentrated on the projections, whereby the breakage of cracks or burrs or the like can be stably and surely achieved.
1‧‧‧分斷機構 1‧‧‧disconnecting mechanism
2‧‧‧第1夾持體 2‧‧‧1st holder
3‧‧‧第2夾持體 3‧‧‧2nd clamping body
4‧‧‧姿勢變更機構 4‧‧‧ posture change institution
4a‧‧‧夾持部 4a‧‧‧ gripping department
4b‧‧‧轉動軸 4b‧‧‧Rotary axis
5‧‧‧突起部 5‧‧‧Protruding
6、7‧‧‧樹脂片 6, 7‧‧‧ resin tablets
AR1‧‧‧箭頭 AR1‧‧‧ arrow
AR2‧‧‧箭頭 AR2‧‧‧ arrow
SL‧‧‧劃線 SL‧‧‧
W‧‧‧基板 W‧‧‧Substrate
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013178357A JP6217245B2 (en) | 2013-08-29 | 2013-08-29 | Splitting mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201507833A true TW201507833A (en) | 2015-03-01 |
| TWI620633B TWI620633B (en) | 2018-04-11 |
Family
ID=52670602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103113578A TWI620633B (en) | 2013-08-29 | 2014-04-14 | Breaking mechanism |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6217245B2 (en) |
| KR (1) | KR20150026763A (en) |
| CN (1) | CN104418493B (en) |
| TW (1) | TWI620633B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI667210B (en) * | 2016-03-29 | 2019-08-01 | 日商三星鑽石工業股份有限公司 | Sap material removing device and method |
| TWI778113B (en) * | 2017-08-29 | 2022-09-21 | 日商三星鑽石工業股份有限公司 | Inclined breaking device and breaking method for brittle material substrate |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058603B (en) * | 2015-08-12 | 2017-03-08 | 深圳市华星光电技术有限公司 | Shearing device |
| KR102525334B1 (en) * | 2016-03-03 | 2023-04-27 | 주식회사 탑 엔지니어링 | Scribing apparatus |
| KR102010756B1 (en) * | 2017-10-25 | 2019-08-19 | 주식회사 탑 엔지니어링 | Dummy removing device and scribing apparatus having the same |
| KR102122427B1 (en) * | 2019-01-09 | 2020-06-12 | 한국미쯔보시다이아몬드공업(주) | Apparatus for removing edged material |
| JP2021129077A (en) * | 2020-02-17 | 2021-09-02 | 三菱電機株式会社 | Jig for dividing board and printed wiring board |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0674153B2 (en) * | 1991-11-07 | 1994-09-21 | 旭硝子株式会社 | Method and apparatus for cutting glass plate |
| JPH0725633A (en) * | 1993-07-09 | 1995-01-27 | Kanegafuchi Chem Ind Co Ltd | Method and device for deviding glass plate |
| JPH0919918A (en) * | 1995-07-07 | 1997-01-21 | Sony Corp | Dividing device |
| JP3473532B2 (en) * | 2000-01-11 | 2003-12-08 | 株式会社村田製作所 | Substrate dividing device |
| JP4915294B2 (en) * | 2007-06-15 | 2012-04-11 | 東芝三菱電機産業システム株式会社 | Method for dividing glass substrate used for manufacturing integrated thin film solar cell |
| WO2012108391A1 (en) * | 2011-02-09 | 2012-08-16 | 旭硝子株式会社 | Glass plate cutting method and glass plate cutting device |
| CN202430118U (en) * | 2011-12-27 | 2012-09-12 | 国家纳米技术与工程研究院 | Glass breaking pliers for processing glass |
-
2013
- 2013-08-29 JP JP2013178357A patent/JP6217245B2/en not_active Expired - Fee Related
-
2014
- 2014-04-09 KR KR20140042572A patent/KR20150026763A/en not_active Application Discontinuation
- 2014-04-14 TW TW103113578A patent/TWI620633B/en not_active IP Right Cessation
- 2014-04-25 CN CN201410171697.9A patent/CN104418493B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI667210B (en) * | 2016-03-29 | 2019-08-01 | 日商三星鑽石工業股份有限公司 | Sap material removing device and method |
| TWI778113B (en) * | 2017-08-29 | 2022-09-21 | 日商三星鑽石工業股份有限公司 | Inclined breaking device and breaking method for brittle material substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015044722A (en) | 2015-03-12 |
| TWI620633B (en) | 2018-04-11 |
| KR20150026763A (en) | 2015-03-11 |
| CN104418493B (en) | 2019-07-05 |
| JP6217245B2 (en) | 2017-10-25 |
| CN104418493A (en) | 2015-03-18 |
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