TW201501368A - Method for manufacturing light emitting diode element - Google Patents

Method for manufacturing light emitting diode element Download PDF

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Publication number
TW201501368A
TW201501368A TW102124078A TW102124078A TW201501368A TW 201501368 A TW201501368 A TW 201501368A TW 102124078 A TW102124078 A TW 102124078A TW 102124078 A TW102124078 A TW 102124078A TW 201501368 A TW201501368 A TW 201501368A
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Taiwan
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substrate
light
emitting diode
diode element
mold
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TW102124078A
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Chinese (zh)
Inventor
Chao-Hsiung Chang
Pin-Chuan Chen
Lung-Hsin Chen
Wen-Liang Tseng
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Advanced Optoelectronic Tech
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Publication of TW201501368A publication Critical patent/TW201501368A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)

Abstract

A method for manufacturing a light emitting diode (LED) element includes steps: providing a substrate and forming an extending portion thereon; mounting an LED chip on the extending portion; covering the substrate with a mold, a bottom surface of the mold, a periphery of a top surface of the extending portion, a side surface of the extending portion, and a top surface of the substrate cooperatively defining an injecting channel therebetween, the bottom surface of the mold and center areas of the extending portion cooperatively defining a cavity therebetween, the cavity communicating with the injecting channel; injecting transparent fluid materials to the cavity along the injecting channel to form a lens structure after the transparent fluid materials being solidified, the transparent fluid materials in the injecting channel solidified to form a sealing portion, the sealing portion covering the periphery of the top surface of the extending portion and bending to the top surface of the substrate; removing the mold to obtain the LED element.

Description

發光二極體元件的製造方法Method for manufacturing light-emitting diode element

本發明涉及一種半導體結構，尤其涉及一種發光二極體元件的製造方法。The present invention relates to a semiconductor structure, and more particularly to a method of fabricating a light emitting diode element.

發光二極體(Light Emitting Diode，LED)是一種可將電流轉換成特定波長範圍的光的半導體元件。憑藉其發光效率高、體積小、重量輕、環保等優點，已被廣泛地應用到當前的各個領域當中。A Light Emitting Diode (LED) is a semiconductor component that converts current into light of a specific wavelength range. With its advantages of high luminous efficiency, small size, light weight and environmental protection, it has been widely used in various fields.

傳統的具有透鏡的發光二極體元件通常包括LED封裝結構以及固定於LED封裝結構上的透鏡。對於通過注塑成型的透鏡而言，業界通常先通過與模具腔體貫通的澆道向模具腔體內注射透明材料，待透明材料固化後移除模具並去除澆道處的殘留透明材料形成該透鏡，該種透鏡經由螺絲或卡榫連接固定在LED封裝結構的基板上。然而，由於透鏡與基板之間容易存在間隙，使得發光二極體元件的密封性難以得到保證，進而導致發光二極體元件的使用壽命受到影響。故，需進一步改進。Conventional lensed LED components typically include an LED package structure and a lens that is attached to the LED package structure. For lenses that are injection molded, the industry usually first injects a transparent material into the mold cavity through a runner that penetrates the mold cavity. After the transparent material is cured, the mold is removed and the residual transparent material at the runner is removed to form the lens. The lens is fixed to the substrate of the LED package structure via a screw or a cassette. However, since the gap between the lens and the substrate is likely to exist, the sealing property of the light-emitting diode element is difficult to be ensured, and the service life of the light-emitting diode element is affected. Therefore, further improvement is needed.

有鑒於此，有必要提供一種密封性好的發光二極體元件的製造方法。In view of the above, it is necessary to provide a method of manufacturing a light-emitting diode element having good sealing properties.

一種發光二極體元件的製造方法，包括步驟：提供一基板，在基板上表面凸伸形成凸出部；設置發光二極體晶片在所述凸出部上；提供模具覆蓋所述基板，所述模具的底面與凸出部上表面邊緣區域、凸出部側面、及基板上表面之間形成澆道，所述模具的底面與凸出部的上表面中部區域之間形成與澆道連通的腔體；沿澆道向所述腔體內注塑透明流體材料並固化該透明流體材料以形成透鏡結構，殘留澆道內的流體材料固化形成透鏡結構的密封部，所述密封部覆蓋該凸出部上表面邊緣區域並自該凸出部上表面邊緣彎折延伸至基板上表面；以及移除模具，形成所述發光二極體元件。A method for manufacturing a light-emitting diode element, comprising the steps of: providing a substrate, projecting a convex portion on a surface of the substrate; providing a light-emitting diode wafer on the protruding portion; and providing a mold to cover the substrate a runner is formed between the bottom surface of the mold and the upper surface edge region of the protrusion, the side surface of the protrusion, and the upper surface of the substrate, and the bottom surface of the mold and the middle portion of the upper surface of the protrusion form a communication with the runner. a cavity; a transparent fluid material is injected into the cavity along the runner and the transparent fluid material is cured to form a lens structure, and the fluid material in the residual runner solidifies to form a sealing portion of the lens structure, the sealing portion covering the protruding portion An upper surface edge region and extending from the upper surface edge of the projection to the upper surface of the substrate; and removing the mold to form the light emitting diode element.

與先前技術相比，本發明提供的發光二極體元件的製造方法，先自基板的上表面形成一凸出部並形成高度差，在利用模具注塑形成透鏡結構時保留固化於澆道的流體材料，使得該透鏡結構的密封部覆蓋凸出部周緣區域並自凸出部周緣彎折延伸至該基板上表面，從而基板與透鏡結構之間的貼合路徑較長且曲折延伸，從而外界水汽不易沿基板與透鏡結構的交接面進入至該發光二極體晶片，增強該發光二極體元件的氣密性，進而保證發光二極體元件的使用壽命。Compared with the prior art, the method for manufacturing a light-emitting diode element provided by the present invention first forms a protrusion from the upper surface of the substrate and forms a height difference, and retains the fluid solidified in the runner when the lens structure is formed by injection molding using a mold. The material is such that the sealing portion of the lens structure covers the peripheral portion of the protruding portion and is bent from the periphery of the protruding portion to the upper surface of the substrate, so that the bonding path between the substrate and the lens structure is long and zigzag extending, thereby external water vapor It is not easy to enter the light-emitting diode wafer along the interface between the substrate and the lens structure, thereby enhancing the airtightness of the light-emitting diode element, thereby ensuring the service life of the light-emitting diode element.

100‧‧‧發光二極體元件100‧‧‧Lighting diode components

10‧‧‧基板10‧‧‧Substrate

11‧‧‧上表面11‧‧‧ upper surface

12‧‧‧下表面12‧‧‧ Lower surface

13‧‧‧凸出部13‧‧‧Protruding

14‧‧‧凹槽14‧‧‧ Groove

20‧‧‧發光二極體晶片20‧‧‧Light Diode Wafer

30‧‧‧模具30‧‧‧Mold

31‧‧‧頂面31‧‧‧ top surface

32‧‧‧底面32‧‧‧ bottom

33‧‧‧第一凹部33‧‧‧First recess

34‧‧‧第二凹部34‧‧‧Second recess

35‧‧‧澆道35‧‧‧Runner

36‧‧‧腔體36‧‧‧ cavity

40‧‧‧透鏡結構40‧‧‧Lens structure

41‧‧‧光學部41‧‧‧Optical Department

42‧‧‧密封部42‧‧‧ Sealing Department

411‧‧‧入光面411‧‧‧Into the glossy surface

412‧‧‧出光面412‧‧‧Glossy surface

圖1至圖4是本發明發光二極體元件的製造方法的中各步驟的示意圖。1 to 4 are schematic views showing respective steps in a method of manufacturing a light-emitting diode element of the present invention.

以下將結合附圖對本發明作進一步的詳細說明。The invention will be further described in detail below with reference to the accompanying drawings.

本發明提供的發光二極體元件100 的製造方法，大致包括如下流程：The method for manufacturing the light-emitting diode element 100 provided by the present invention generally includes the following processes:

提供一基板，在基板上表面凸伸形成凸出部；Providing a substrate, protruding on the upper surface of the substrate to form a protrusion;

設置發光二極體晶片在所述凸出部上；Forming a light emitting diode chip on the protruding portion;

提供模具覆蓋所述基板，所述模具的底面與凸出部上表面邊緣區域、凸出部側面、及基板上表面之間形成澆道，所述模具的底面與凸出部的上表面中部區域之間形成與澆道連通的腔體；Providing a mold covering the substrate, a bottom surface of the mold and a surface of the upper surface of the protrusion, a side surface of the protrusion, and a surface of the upper surface of the substrate, a bottom surface of the mold and a middle portion of the upper surface of the protrusion Forming a cavity in communication with the runner;

沿澆道向所述腔體內注塑透明流體材料並固化該透明流體材料以形成透鏡結構，殘留澆道內的流體材料固化形成透鏡結構的密封部，所述密封部覆蓋該凸出部上表面邊緣區域並自該凸出部上表面邊緣彎折延伸至基板上表面；以及Forming a transparent fluid material into the cavity along the runner and curing the transparent fluid material to form a lens structure, the fluid material in the residual runner solidifying to form a sealing portion of the lens structure, the sealing portion covering the upper surface edge of the protrusion The region is bent from the upper surface edge of the projection to the upper surface of the substrate;

移除模具，形成所述發光二極體元件。The mold is removed to form the light emitting diode element.

下面結合圖1至圖4對該流程作詳細說明。The flow will be described in detail below with reference to FIGS. 1 to 4.

首先請參閱圖1，提供一基板10。該基板10為一平整的板體，包括上表面11及與該上表面11相對且平行的下表面12。在上表面11上向上凸伸形成複數相互間隔的凸出部13。相鄰二凸出部13相對的側表面及基板10的上表面共同圍成一凹槽14。本實施例中，所述基板10為印刷電路板，該基板10的上表面11上設置有電路，通過蝕刻的方式自上向下加工基板10，從而使其形成凸出部13及凹槽14。可以理解的，該凸出部13也通過其他方式形成。Referring first to Figure 1, a substrate 10 is provided. The substrate 10 is a flat plate body including an upper surface 11 and a lower surface 12 opposite and parallel to the upper surface 11. Projecting upwardly on the upper surface 11 forms a plurality of mutually spaced projections 13. The opposite side surfaces of the adjacent two protrusions 13 and the upper surface of the substrate 10 collectively define a groove 14. In this embodiment, the substrate 10 is a printed circuit board, and the upper surface 11 of the substrate 10 is provided with a circuit, and the substrate 10 is processed from the top to the bottom by etching, so that the protrusion 13 and the groove 14 are formed. . It will be understood that the projections 13 are also formed by other means.

請參閱圖2，在每一凸出部13上設置一發光二極體晶片20，該發光二極體晶片20通過兩引腳（圖未示）與該凸出部13上的電路形成電性連接並固定至該凸出部13上。Referring to FIG. 2, a light-emitting diode chip 20 is disposed on each of the protrusions 13. The LED body 20 is electrically connected to the circuit on the protrusion 13 through two pins (not shown). Connected and fixed to the projection 13.

請參閱圖3，提供一模具30覆蓋在該基板10上。具體的，該模具30包括一頂面31及與該頂面31相對的底面32。該頂面31為一平面，該底面32與該基板10的上表面11相對。所述模具30 在該底面32上形成複數第一凹部33及與該第一凹部33連通的第二凹部34。該第一凹部33環繞該第二凹部34。該第一凹部33自底面32朝該頂面31方向凹陷形成。Referring to FIG. 3, a mold 30 is provided to cover the substrate 10. Specifically, the mold 30 includes a top surface 31 and a bottom surface 32 opposite the top surface 31. The top surface 31 is a flat surface opposite to the upper surface 11 of the substrate 10. The mold 30 forms a plurality of first recesses 33 and a second recess 34 that communicates with the first recesses 33 on the bottom surface 32. The first recess 33 surrounds the second recess 34. The first recess 33 is recessed from the bottom surface 32 toward the top surface 31.

該第一凹部33的內徑大於凸出部13的外徑，對應的凸出部13頂端收容在第一凹部33的中部，該第一凹部33的底面間隔地位於相應凸出部13上表面邊緣區域的上方30，該第一凹部33的側面與該凸出部13的側面間隔設置，該模具30對應凹槽14處的底面32位於凸出部13上表面所處水平面的下方。該第一凹部33與凸出部13上表面邊緣區域、凸出部13的側面、以及基板10的上表面11之間形成一澆道35，所述澆道35的剖面大致呈“Z”型。該第二凹部34自第一凹部33的底面進一步朝頂面31凹陷形成。所述第二凹部34的表面為凹曲面，該第二凹部34的最大外徑略小於凸出部13的外徑。所述第二凹部34與對應的凸出部13的上表面中部區域相對設置並形成一腔體36用以注塑形成一透鏡結構40。The inner diameter of the first recessed portion 33 is larger than the outer diameter of the protruding portion 13. The top end of the corresponding protruding portion 13 is received in the middle of the first recessed portion 33. The bottom surface of the first recessed portion 33 is spacedly located on the upper surface of the corresponding protruding portion 13. Above the edge region 30, the side surface of the first recess 33 is spaced apart from the side surface of the protrusion portion 13. The bottom surface 32 of the mold 30 corresponding to the groove 14 is located below the horizontal plane where the upper surface of the protrusion portion 13 is located. A runner 35 is formed between the first recess 33 and the upper surface edge region of the projection 13, the side surface of the projection 13, and the upper surface 11 of the substrate 10. The runner 35 has a substantially "Z" shape. . The second recess 34 is further recessed from the bottom surface of the first recess 33 toward the top surface 31. The surface of the second recess 34 is a concave curved surface, and the maximum outer diameter of the second recess 34 is slightly smaller than the outer diameter of the protrusion 13 . The second recess 34 is disposed opposite to the central portion of the upper surface of the corresponding protrusion 13 and defines a cavity 36 for injection molding a lens structure 40.

沿該澆道35向該腔體36中注塑透明流體材料，該流體材料填充該腔體36、澆道35及凹槽14後固化形成該透鏡結構40。同時該澆道35處固化的流體材料覆蓋該凸出部13與凹槽14的連接處並自該凸出部13周緣彎折延伸至該凹槽14。A transparent fluid material is injected into the cavity 36 along the runner 35. The fluid material fills the cavity 36, the runner 35 and the recess 14 and solidifies to form the lens structure 40. At the same time, the fluid material solidified at the runner 35 covers the joint of the projection 13 and the groove 14 and is bent from the periphery of the projection 13 to the groove 14.

請參閱圖4，移除該模具30，沿所述凹槽14切割基板形成多個發光二極體元件100。所述透鏡結構40貼設於該基板10的上表面11。Referring to FIG. 4, the mold 30 is removed, and the substrate is cut along the groove 14 to form a plurality of light emitting diode elements 100. The lens structure 40 is attached to the upper surface 11 of the substrate 10 .

具體的，該透鏡結構40包括一光學部41及自光學部靠近基板10的底端沿水平方向凸設的密封部42。該光學部41包括一接合面411及與該入光面411相對的出光面412。該接合面411為平面，該接合面411的面積略小於凸出部13上表面的面積並貼設於凸出部13上表面的中部區域上。所述出光面412為曲面，該出光面412的形狀與第二凹部34表面的形狀相同。本實施例中，該出光面412為球面。該密封部42包括注塑透明流體材料過程中殘留並固化於澆道35及凹槽14中的流體材料。該密封部42覆蓋該凸出部13與凹槽14的連接處並自該凸出部13周緣彎折延伸至該凹槽14。可以理解的是，該透鏡結構40內可包含有螢光粉（圖未示），該螢光粉可包含石榴石基螢光粉、矽酸鹽基螢光粉、原矽酸鹽基螢光粉、硫化物基螢光粉、硫代鎵酸鹽基螢光粉、氮氧化物基螢光粉和氮化物基螢光粉中的一種或多種。Specifically, the lens structure 40 includes an optical portion 41 and a sealing portion 42 protruding from the optical portion near the bottom end of the substrate 10 in a horizontal direction. The optical portion 41 includes a joint surface 411 and a light exit surface 412 opposite to the light incident surface 411. The joint surface 411 is a flat surface, and the joint surface 411 has an area slightly smaller than the area of the upper surface of the projection portion 13 and is attached to the central portion of the upper surface of the projection portion 13. The light-emitting surface 412 is a curved surface, and the shape of the light-emitting surface 412 is the same as the shape of the surface of the second concave portion 34. In this embodiment, the light-emitting surface 412 is a spherical surface. The seal portion 42 includes fluid material that remains in the process of injection molding the transparent fluid material and solidifies in the runners 35 and grooves 14. The sealing portion 42 covers the joint of the protruding portion 13 and the groove 14 and is bent from the periphery of the protruding portion 13 to the groove 14 . It can be understood that the lens structure 40 may include a phosphor powder (not shown), and the phosphor powder may include garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor. One or more of powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, oxynitride-based phosphor powder, and nitride-based phosphor powder.

工作時，該發光二極體晶片20與凸出部13上的電路形成電性連接，該發光二極體晶片20發出的光線進入光學部41後自出光面412出射。由於密封部42自凸出部13上表面的邊緣向外凸伸，覆蓋在凸出部13上表面的體積微小，因此對發光二極體晶片20發光特性的影響可忽略不計。During operation, the LED chip 20 is electrically connected to the circuit on the protruding portion 13. The light emitted by the LED wafer 20 enters the optical portion 41 and exits from the light exit surface 412. Since the sealing portion 42 protrudes outward from the edge of the upper surface of the projection 13, the volume of the upper surface of the projection 13 is small, so that the influence on the light-emitting characteristics of the LED 20 is negligible.

與先前技術相比，本案在製造發光二極體元件100的過程中，先自基板10的上表面形成一凸出部13及與該凸出部13之間形成高度差的凹槽14，在利用模具30注塑形成透鏡結構40時保留固化於澆道35的流體材料，使得該透鏡結構40的密封部42覆蓋凸出部13與凹槽14的連接處並自凸出部周緣彎折延伸至該凹槽14，從而基板10與透鏡結構40之間的貼合路徑較長且曲折延伸，從而外界水汽不易沿基板10與透鏡結構40的交接面進入至該發光二極體晶片20，增強該發光二極體元件100的氣密性，進而保證發光二極體元件100的使用壽命。Compared with the prior art, in the process of manufacturing the LED component 100, a protrusion 13 is formed from the upper surface of the substrate 10 and a groove 14 is formed between the protrusion 13 and the height difference. When the lens structure 40 is injection molded by the mold 30, the fluid material solidified on the runner 35 remains, so that the sealing portion 42 of the lens structure 40 covers the joint of the projection 13 and the groove 14 and is bent from the periphery of the projection to The groove 14 is such that the bonding path between the substrate 10 and the lens structure 40 is long and zigzag extending, so that external water vapor is less likely to enter the light-emitting diode wafer 20 along the interface between the substrate 10 and the lens structure 40, and the The airtightness of the light-emitting diode element 100 ensures the service life of the light-emitting diode element 100.

綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限製本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

無no

10‧‧‧基板 10‧‧‧Substrate

13‧‧‧凸出部 13‧‧‧Protruding

14‧‧‧凹槽 14‧‧‧ Groove

20‧‧‧發光二極管晶片 20‧‧‧LED chip

30‧‧‧模具 30‧‧‧Mold

31‧‧‧頂面 31‧‧‧ top surface

32‧‧‧底面 32‧‧‧ bottom

33‧‧‧第一凹部 33‧‧‧First recess

34‧‧‧第二凹部 34‧‧‧Second recess

35‧‧‧澆道 35‧‧‧Runner

36‧‧‧腔體 36‧‧‧ cavity

Claims (9)

一種發光二極體元件的製造方法，包括步驟：
提供一基板，在基板上表面凸伸形成凸出部；
設置發光二極體晶片在所述凸出部上；
提供模具覆蓋所述基板，所述模具的底面與凸出部上表面邊緣區域、凸出部側面、及基板上表面之間形成澆道，所述模具的底面與凸出部的上表面中部區域之間形成與澆道連通的腔體；
沿澆道向所述腔體內注塑透明流體材料並固化該透明流體材料以形成透鏡結構，殘留澆道內的流體材料固化形成透鏡結構的密封部，所述密封部覆蓋該凸出部上表面邊緣區域並自該凸出部上表面邊緣彎折延伸至基板上表面；以及
移除模具，形成所述發光二極體元件。A method of manufacturing a light emitting diode element, comprising the steps of:
Providing a substrate, protruding on the upper surface of the substrate to form a protrusion;
Forming a light emitting diode chip on the protruding portion;
Providing a mold covering the substrate, a bottom surface of the mold and a surface of the upper surface of the protrusion, a side surface of the protrusion, and a surface of the upper surface of the substrate, a bottom surface of the mold and a middle portion of the upper surface of the protrusion Forming a cavity in communication with the runner;
Forming a transparent fluid material into the cavity along the runner and curing the transparent fluid material to form a lens structure, the fluid material in the residual runner solidifying to form a sealing portion of the lens structure, the sealing portion covering the upper surface edge of the protrusion And extending from the upper surface edge of the projection to the upper surface of the substrate; and removing the mold to form the light emitting diode element. 如申請專利範圍第1項所述之發光二極體元件的製造方法，其中，所述透鏡結構包括光學部，所述光學部貼設於凸出部上表面中部區域並覆蓋所述發光二極體晶片，所述密封部自光學部靠近基板的底端沿水平方向向外凸伸形成。The method of manufacturing the light-emitting diode element according to the first aspect of the invention, wherein the lens structure comprises an optical portion, the optical portion is attached to a central portion of the upper surface of the protruding portion and covers the light-emitting diode In the bulk wafer, the sealing portion is formed to protrude outward in the horizontal direction from the bottom end of the optical portion near the substrate. 如申請專利範圍第1項所述之發光二極體元件的製造方法，其中，所述光學部靠近基板側的底面面積小於凸出部的表面面積。The method of manufacturing a light-emitting diode element according to claim 1, wherein an area of a bottom surface of the optical portion close to the substrate side is smaller than a surface area of the protruding portion. 如申請專利範圍第1項所述之發光二極體元件的製造方法，其中，所述模具包括形成於底面的第一凹部和第二凹部，第一凹部與對應的凸出部上表面邊緣區域、凸出部的側面以及基板的上表面相對間隔設置並形成所述澆道，所述第二凹部與對應凸出部上表面中部區域間隔設置形成所述腔體。The method of manufacturing the light-emitting diode element according to claim 1, wherein the mold comprises a first concave portion and a second concave portion formed on the bottom surface, and the first concave portion and the corresponding convex portion upper surface edge region The side surface of the protrusion and the upper surface of the substrate are spaced apart from each other to form the runner, and the second recess is spaced apart from the central portion of the upper surface of the corresponding protrusion to form the cavity. 如申請專利範圍第4項所述之發光二極體元件的製造方法，其中，所述第一凹部自模具底面沿遠離基板的方向凹陷形成，所述第一凹部的內徑大於凸出部的外徑。The method for manufacturing a light-emitting diode element according to claim 4, wherein the first concave portion is recessed from a bottom surface of the mold in a direction away from the substrate, and an inner diameter of the first concave portion is larger than a convex portion. Outer diameter. 如申請專利範圍第4項所述之發光二極體元件的製造方法，其中，所述第二凹部自第一凹部的底面沿遠離基板的方向進一步凹陷形成，所述第二凹部的內表面為凹曲面，所述第二凹部的最大外徑小於所述凸出部的外徑。The method for manufacturing a light-emitting diode element according to claim 4, wherein the second concave portion is further recessed from a bottom surface of the first concave portion in a direction away from the substrate, and an inner surface of the second concave portion is a concave curved surface, the second outer diameter of the second recess being smaller than the outer diameter of the protruding portion. 如申請專利範圍第4項所述之發光二極體元件的製造方法，其中，所述光學部包括一入光面及與該入光面相對的出光面，所述出光面的形狀與第二凹部表面的形狀相同。The method of manufacturing the light-emitting diode element according to the fourth aspect of the invention, wherein the optical portion includes a light incident surface and a light exit surface opposite to the light incident surface, the shape of the light exit surface and the second The shape of the surface of the recess is the same. 如申請專利範圍第1項所述之發光二極體元件的製造方法，其中，所述凸出部通過蝕刻基板形成。The method of manufacturing a light-emitting diode element according to claim 1, wherein the protruding portion is formed by etching a substrate. 如申請專利範圍第1項所述之發光二極體元件的製造方法，其中，所述透鏡結構中包含有螢光粉。
The method for producing a light-emitting diode element according to claim 1, wherein the lens structure includes a phosphor powder.
TW102124078A 2013-06-27 2013-07-04 Method for manufacturing light emitting diode element TW201501368A (en)

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