TW201446417A - Substrate precession mechanism for CMP polishing head - Google Patents
Substrate precession mechanism for CMP polishing head Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
本文所述之實施例大體係關於一種化學機械研磨承載頭。更特定言之，本文所述之實施例係關於一種用於承載研磨頭之基板進動機制。 The embodiments described herein are directed to a chemical mechanical polishing carrier. More specifically, the embodiments described herein relate to a substrate precession mechanism for carrying a polishing head.
通常藉由在矽基板上順序沉積導電層、半導電層或絕緣層將積體電路形成在基板上。一個製造步驟涉及以下步驟：將填料層沉積在不平坦表面上，且平坦化填料層直到曝露不平坦表面為止。舉例而言，可將導電填料層沉積在經圖案化絕緣層上以填充絕緣層中之溝槽或孔洞。隨後研磨填料層直到曝露絕緣層之凸起圖案為止。在平坦化之後，餘留在絕緣層之凸起圖案之間的導電層之部分形成在基板上之薄膜電路之間提供導電通路之通孔、插塞及線。另外，需要平坦化以平坦化基板表面用於光微影。 The integrated circuit is usually formed on the substrate by sequentially depositing a conductive layer, a semiconductive layer or an insulating layer on the germanium substrate. One manufacturing step involves the steps of depositing a layer of filler on an uneven surface and planarizing the layer of filler until the uneven surface is exposed. For example, a layer of conductive filler can be deposited over the patterned insulating layer to fill trenches or holes in the insulating layer. The filler layer is then ground until the raised pattern of the insulating layer is exposed. After planarization, portions of the conductive layer remaining between the raised patterns of the insulating layer form vias, plugs, and lines that provide conductive paths between the thin film circuits on the substrate. In addition, planarization is required to planarize the surface of the substrate for photolithography.
化學機械研磨(CMP)係一種被接受的平坦化方法。此平坦化方法通常要求將基板安裝在CMP設備之承載頭或研磨頭上。置放基板之曝露表面為抵靠旋轉研磨盤墊或帶墊。 拋光墊可為標準墊或固定磨料墊。標準墊可具有耐用粗糙化表面，而固定磨料墊可具有保持在包容介質中之磨料粒子。承載頭在基板上提供可控制負載以推動基板抵靠拋光墊。承載頭可具有在研磨期間將基板固持在適當位置之固定環。可在研磨期間將包括至少一種化學反應劑及磨料粒子之研磨液體(諸如，漿液)供應至拋光墊之表面。 Chemical mechanical polishing (CMP) is an accepted method of planarization. This planarization method typically requires mounting the substrate on a carrier head or a polishing head of a CMP apparatus. The exposed surface of the substrate is placed against a rotating abrasive pad or tape pad. The polishing pad can be a standard pad or a fixed abrasive pad. The standard pad can have a durable roughened surface, while the fixed abrasive pad can have abrasive particles held in the containment medium. The carrier head provides a controllable load on the substrate to push the substrate against the polishing pad. The carrier head can have a retaining ring that holds the substrate in place during grinding. A grinding liquid (such as a slurry) comprising at least one chemical reactant and abrasive particles can be supplied to the surface of the polishing pad during grinding.
維持基板之均勻移除輪廓係CMP製程之重要態樣。可能希望在極性方向及徑向方向上維持橫跨基板之表面之相對均勻輪廓。因而，採用降低平坦化輪廓之局部不均勻性之方法可為重要的。 Maintaining a uniform removal profile of the substrate is an important aspect of the CMP process. It may be desirable to maintain a relatively uniform profile across the surface of the substrate in the polar and radial directions. Thus, it may be important to employ a method of reducing the local unevenness of the flattened profile.
本文所述之實施例大體係關於一種用於CMP承載頭之基板進動機制。提供一種用於CMP承載頭之基板進動設備。該設備賦能基板進動，該基板進動係在基板之研磨期間基板相對於承載頭之旋轉運動。承載頭與固定環組件可解耦，允許承載頭與固定環組件獨立於彼此移動以在CMP製程期間促進基板進動。 The embodiments described herein are directed to a substrate precession mechanism for a CMP carrier head. A substrate precessing apparatus for a CMP carrier head is provided. The device energizes the substrate precession by the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and the retaining ring assembly are decoupled, allowing the carrier head and retaining ring assembly to move independently of each other to facilitate substrate precession during the CMP process.
在一個實施例中，提供一種用於研磨基板之設備。該設備包含頭組件，以及固定環組件。固定環組件包含內齒輪及設置在頭組件與固定環組件之間的軸承。軸承適於使固定環組件與頭組件解耦。亦提供適於使固定環組件相對於頭組件旋轉之驅動組件。 In one embodiment, an apparatus for polishing a substrate is provided. The device includes a head assembly and a retaining ring assembly. The retaining ring assembly includes an internal gear and a bearing disposed between the head assembly and the retaining ring assembly. The bearing is adapted to decouple the stationary ring assembly from the head assembly. A drive assembly adapted to rotate the stationary ring assembly relative to the head assembly is also provided.
在另一實施例中，提供一種用於研磨頭之固定環組件。該固定環組件包含具有環形上部及環形下部之固定環及 耦接至環形上部之承載環。該固定環組件進一步包含耦接至承載環之軸承夾持器以及耦接至軸承夾持器之內齒輪，該軸承夾持器適於收納軸承。 In another embodiment, a retaining ring assembly for a polishing head is provided. The retaining ring assembly includes a retaining ring having an annular upper portion and a lower annular portion A carrier ring coupled to the upper portion of the ring. The retaining ring assembly further includes a bearing retainer coupled to the carrier ring and an internal gear coupled to the bearing retainer, the bearing retainer being adapted to receive a bearing.
在又一實施例中，提供一種操作研磨設備之方法。該方法包含以下步驟：提供研磨頭組件及固定環組件。固定環組件與研磨頭組件解耦。該方法亦提供以下步驟：以第一速度旋轉研磨頭及以大於第一速度之第二速度旋轉固定環組件。 In yet another embodiment, a method of operating a grinding apparatus is provided. The method includes the steps of providing a polishing head assembly and a retaining ring assembly. The retaining ring assembly is decoupled from the grinding head assembly. The method also provides the steps of rotating the polishing head at a first speed and rotating the stationary ring assembly at a second speed greater than the first speed.
100‧‧‧習知承載頭/承載頭 100‧‧‧Study carrier head/carrier head
102‧‧‧頭組件 102‧‧‧ head components
104‧‧‧固定環組件 104‧‧‧Fixed ring assembly
106‧‧‧外殼 106‧‧‧Shell
110‧‧‧軸承夾持器 110‧‧‧bearing holder
112‧‧‧內齒輪 112‧‧‧Internal gear
120‧‧‧固定環 120‧‧‧Fixed ring
130‧‧‧軸承 130‧‧‧ bearing
140‧‧‧承載環 140‧‧‧ Carrying ring
201‧‧‧基板 201‧‧‧Substrate
208‧‧‧承載主體 208‧‧‧bearer
213‧‧‧緊固件 213‧‧‧fasteners
214‧‧‧齒 214‧‧‧ teeth
216‧‧‧上部 216‧‧‧ upper
218‧‧‧軸承收納區域 218‧‧‧ bearing storage area
222‧‧‧上環 222‧‧‧Sheung Wan
224‧‧‧下環 224‧‧‧The ring
226‧‧‧基板保持表面 226‧‧‧Substrate holding surface
228‧‧‧內表面 228‧‧‧ inner surface
232‧‧‧第一環形表面 232‧‧‧First annular surface
234‧‧‧第二環形表面 234‧‧‧second annular surface
236‧‧‧球軸承 236‧‧‧Ball bearings
242‧‧‧環形下部 242‧‧‧Lower ring
244‧‧‧環形上部 244‧‧‧ring upper part
250‧‧‧可撓膜 250‧‧‧Flexible film
256‧‧‧托架 256‧‧‧ bracket
258‧‧‧蓋環 258‧‧ ‧ cover ring
259‧‧‧頂表面 259‧‧‧ top surface
260‧‧‧致動器 260‧‧‧ actuator
261‧‧‧轉軸 261‧‧‧ shaft
262‧‧‧蝸桿驅動件 262‧‧‧ worm drive
264‧‧‧蝸輪 264‧‧‧ worm gear
265‧‧‧第一端 265‧‧‧ first end
266‧‧‧驅動軸 266‧‧‧ drive shaft
267‧‧‧第二端 267‧‧‧ second end
268‧‧‧正齒輪 268‧‧‧Spur gear
269‧‧‧區域 269‧‧‧Area
270‧‧‧軸編碼器 270‧‧‧shaft encoder
272‧‧‧輸送線 272‧‧‧ conveyor line
274‧‧‧壓力源 274‧‧‧Pressure source
280‧‧‧外殼組件 280‧‧‧Shell assembly
282‧‧‧側壁 282‧‧‧ side wall
284‧‧‧軸承 284‧‧‧ bearing
286‧‧‧底部 286‧‧‧ bottom
290‧‧‧驅動組件 290‧‧‧Drive components
292‧‧‧傳動件 292‧‧‧ Transmission parts
306‧‧‧旋轉方向 306‧‧‧Rotation direction
308‧‧‧旋轉 308‧‧‧Rotate
為了可以詳細理解本發明之上述特徵結構，可參照實施例對簡要概述於上之本發明進行更加詳細的描述，該等實施例中之一些實施例圖示於隨附圖式中。然而應注意的是，隨附圖式僅圖示本發明之典型實施例且因此不被視為限制本發明之範疇，因為本發明可允許其他等效實施例。 For a more detailed understanding of the above-described features of the present invention, the present invention will be described in more detail with reference to the embodiments of the invention. FIG. It is to be understood, however, that the appended claims
第1圖係具有經解耦固定環組件之承載頭的部分剖視圖。 Figure 1 is a partial cross-sectional view of a carrier head having a decoupled retaining ring assembly.
第2圖係第1圖之承載頭之局部透視圖。 Figure 2 is a partial perspective view of the carrier head of Figure 1.
第3圖係固定環組件及基板之示意性仰視圖。 Figure 3 is a schematic bottom view of the retaining ring assembly and the substrate.
為了促進理解，在可能的地方使用相同的元件符號指示諸圖所共有之相同元件。可以預期，一個實施例之元件及特徵結構可有利地併入其他實施例而無需進一步詳述。 To promote understanding, the same element symbols are used where possible to indicate the same elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
本文所述之實施例大體係關於一種用於CMP承載頭之基板進動機制。提供一種用於承載頭之基板進動設備。 該設備賦能基板進動，該基板進動係在基板之研磨期間基板相對於承載頭之旋轉運動。承載頭與固定環組件可解耦且獨立於彼此移動以在CMP製程期間促進基板進動。 The embodiments described herein are directed to a substrate precession mechanism for a CMP carrier head. A substrate preloading device for a carrier head is provided. The device energizes the substrate precession by the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and the retaining ring assembly are decoupled and move independently of each other to facilitate substrate precession during the CMP process.
一般而言，可將變化壓力施加至膜構件之各個徑向區以產生可將基板夾持至CMP頭之背面壓力。可使壓力橫跨區域變化以在每一徑向區中提供預定移除輪廓。然而，調整徑向區中之壓力不完全調整極性方向上之不均勻性。膜構件之不均勻性可致使基板中之不均勻移除輪廓。因而，在研磨製程中提供「極性不對稱」可移除或降低移除輪廓中之局部不均勻性之影響。 In general, varying pressures can be applied to the various radial zones of the membrane member to create a back pressure that can clamp the substrate to the CMP head. The pressure can be varied across the area to provide a predetermined removal profile in each radial zone. However, adjusting the pressure in the radial zone does not completely adjust the non-uniformity in the polarity direction. The unevenness of the film member can cause uneven removal of the profile in the substrate. Thus, providing "polar asymmetry" in the polishing process can remove or reduce the effects of localized inhomogeneities in the removal profile.
本文所述之實施例大體係關於研磨300mm基板而提供。然而，本文所述之實施例可適於研磨其他大小之基板(諸如，100mm或450mm基板)。可適於受益於本文所述之實施例之CMP頭係可為購自加州聖克拉拉市之應用材料公司(Applied Materials,Inc.)之TITAN HEADTM或TITAN CONTOUR。然而，可以預期，可購自其他製造商之承載頭可適於採用本文所述之實施例。 The large system of embodiments described herein is provided for grinding a 300 mm substrate. However, the embodiments described herein may be suitable for grinding substrates of other sizes, such as 100 mm or 450 mm substrates. CMP may be adapted to benefit from the first embodiment in the system described herein may be commercially available from Applied Materials of Santa Clara, California company's (Applied Materials, Inc.) The TITAN HEAD TM or TITAN CONTOUR. However, it is contemplated that carrier heads that are commercially available from other manufacturers may be adapted to employ the embodiments described herein.
第1圖係習知承載頭100之部分剖視圖。承載頭100包括外殼106、頭組件102及固定環組件104。外殼106大體可為圓形之形狀且可連接至驅動軸(未圖示)以在研磨期間經由該驅動軸旋轉。可存在延伸穿過外殼106用於承載頭100之氣動控制之通道(未圖示)。承載頭100亦包括固定環組件104，該固定環組件104包括固定環120、承載環140、軸承夾持器110及內齒輪112。軸承130可使頭組件102與固定 環組件104解耦。 Figure 1 is a partial cross-sectional view of a conventional carrier head 100. The carrier head 100 includes a housing 106, a head assembly 102, and a retaining ring assembly 104. The outer casing 106 can be generally circular in shape and can be coupled to a drive shaft (not shown) for rotation therethrough during grinding. There may be a passage (not shown) extending through the outer casing 106 for pneumatic control of the carrier head 100. The carrier head 100 also includes a retaining ring assembly 104 that includes a retaining ring 120, a carrier ring 140, a bearing retainer 110, and an internal gear 112. Bearing 130 allows head assembly 102 to be secured The ring assembly 104 is decoupled.
第2圖係第1圖之具有頭組件102及經解耦固定環組件104之承載頭100之局部透視圖。頭組件102可包含外殼106，該外殼106大體可為圓形之形狀且可連接至驅動軸(未圖示)以在研磨期間經由該驅動軸旋轉。可存在延伸穿過外殼106用於承載頭100之氣動控制之通道(未圖示)。承載主體208可撓性耦接至外殼106且與外殼106共旋轉。承載主體208亦可耦接至可撓膜250，該可撓膜250可適於在CMP製程期間夾持基板201。可撓膜250可界定用於夾持基板201之複數個可加壓腔室。 2 is a partial perspective view of the carrier head 100 having the head assembly 102 and the decoupled retaining ring assembly 104 of FIG. The head assembly 102 can include a housing 106 that can be generally circular in shape and connectable to a drive shaft (not shown) for rotation therethrough during grinding. There may be a passage (not shown) extending through the outer casing 106 for pneumatic control of the carrier head 100. The carrier body 208 is flexibly coupled to and rotatably coupled to the housing 106. The carrier body 208 can also be coupled to the flexible film 250, which can be adapted to clamp the substrate 201 during the CMP process. The flexible membrane 250 can define a plurality of pressurizable chambers for holding the substrate 201.
如先前所述，固定環組件104可包含固定環組件120、承載環140、軸承夾持器110及內齒輪112。承載環140可為大體環狀結構。承載環140可具有環形上部244及環形下部242。環形上部244可設置成毗鄰於軸承夾持器110且在軸承夾持器110下方。環形下部242可設置成毗鄰固定環120且在固定環120上方。承載環140可具有穿過該承載環140設置之凹穴或孔洞以容納緊固設備(諸如，螺釘或螺栓(未圖示))以耦接軸承夾持器110、承載環140及固定環120。 As previously described, the retaining ring assembly 104 can include a retaining ring assembly 120, a carrier ring 140, a bearing retainer 110, and an internal gear 112. The carrier ring 140 can be a generally annular structure. The carrier ring 140 can have an annular upper portion 244 and an annular lower portion 242. The annular upper portion 244 can be disposed adjacent to the bearing holder 110 and below the bearing holder 110. The annular lower portion 242 can be disposed adjacent the stationary ring 120 and above the stationary ring 120. The carrier ring 140 can have a recess or hole disposed through the carrier ring 140 to receive a fastening device, such as a screw or bolt (not shown) to couple the bearing holder 110, the carrier ring 140, and the retaining ring 120 .
固定環120可由兩個環(下環224及上環222)形成。下環224與上環222可耦接在一起。當下環224與上環222結合時，兩個環在其毗鄰表面上之內徑及外徑處具有大體相同尺寸，使得下環224與上環222在其結合處形成齊平表面。 The retaining ring 120 can be formed from two rings (the lower ring 224 and the upper ring 222). The lower ring 224 and the upper ring 222 can be coupled together. When the lower ring 224 is combined with the upper ring 222, the two rings have substantially the same size at the inner and outer diameters on their adjacent surfaces such that the lower ring 224 and the upper ring 222 form a flush surface at their junction.
在經配置用於300mm基板之實施例中，基板201 可具有約11.811吋之外徑。在一個實施例中，下環224之內徑可在約11.830吋與約11.870吋之間，諸如11.852吋。在此實施例中，基板201外徑與下環224內徑之間的齒輪比可為約0.99654。在另一實施例中，下環224之內徑可在約11.890吋與約11.950吋之間，諸如約11.912吋。在此實施例中，基板201外徑與下環224內徑之間的齒輪比可為約0.99152。 In an embodiment configured for a 300 mm substrate, substrate 201 It may have an outer diameter of about 11.811 inches. In one embodiment, the inner diameter of the lower ring 224 can be between about 11.830 inches and about 11.870 inches, such as 11.852 inches. In this embodiment, the gear ratio between the outer diameter of the substrate 201 and the inner diameter of the lower ring 224 can be about 0.99654. In another embodiment, the inner diameter of the lower ring 224 can be between about 11.890 inches and about 11.950 inches, such as about 11.912 inches. In this embodiment, the gear ratio between the outer diameter of the substrate 201 and the inner diameter of the lower ring 224 can be about 0.99152.
在某些實施例中，下環224與上環222可藉由接合材料(未圖示)在其毗鄰表面附接。下環224與上環222之間的界面可防止將漿液材料截獲在固定環120中。接合材料可為黏接材料，諸如緩慢固化或快速固化環氧樹脂。高溫環氧樹脂可阻止在CMP製程期間接合材料由於高溫而退化。在某些實施例中，環氧樹脂包括聚醯胺及脂肪胺。 In some embodiments, the lower ring 224 and the upper ring 222 can be attached at their adjacent surfaces by a bonding material (not shown). The interface between the lower ring 224 and the upper ring 222 prevents the slurry material from being trapped in the retaining ring 120. The bonding material can be an adhesive material such as a slow curing or fast curing epoxy. High temperature epoxy resins prevent the bonding material from degrading due to high temperatures during the CMP process. In certain embodiments, the epoxy resin comprises polyamine and a fatty amine.
上環222可具有可適於與可撓膜250耦接且提供支撐給可撓膜250之內表面228。上環222可由與下環224相比剛性更高之材料(諸如，例如不銹鋼、鉬、鋁之金屬，陶瓷材料，或其他示例性材料)形成。 The upper ring 222 can have an inner surface 228 that can be adapted to couple with the flexible membrane 250 and provide support to the flexible membrane 250. The upper ring 222 may be formed of a material that is more rigid than the lower ring 224, such as, for example, stainless steel, molybdenum, aluminum, ceramic materials, or other exemplary materials.
下環224可設置成毗鄰上環222且在該上環222下方。下環224可具有可適於在CMP製程期間保持基板201之基板保持表面226。下環224可由在CMP製程中具有化學惰性之材料(諸如，塑膠，例如，聚苯硫(PPS))形成。下環224亦可適於提供耐久性及低磨損率。下環224可為可足夠壓縮的，使得基板201邊緣抵靠下環224之接觸不致使基板201碎裂或破裂。然而，下環224不應如此有彈性以致固定環120上之向下壓力致使在CMP製程期間擠出下環224。 The lower ring 224 can be disposed adjacent to and below the upper ring 222. Lower ring 224 can have a substrate holding surface 226 that can be adapted to hold substrate 201 during a CMP process. Lower ring 224 may be formed from a material that is chemically inert in the CMP process, such as a plastic, such as polyphenylene sulfide (PPS). The lower ring 224 can also be adapted to provide durability and low wear rates. The lower ring 224 can be sufficiently compressible that the contact of the edge of the substrate 201 against the lower ring 224 does not cause the substrate 201 to chip or rupture. However, the lower ring 224 should not be so resilient that the downward pressure on the retaining ring 120 causes the lower ring 224 to be extruded during the CMP process.
軸承夾持器110可為大體環狀的。軸承夾持器110可設置成毗鄰承載環140之環形上部244且在該環形上部244上方。軸承夾持器110可藉由緊固件213(諸如，螺釘或螺栓)耦接至承載環140。軸承夾持器110可由諸如金屬(例如，不銹鋼、鉬、鋁)、陶瓷材料或其他示例性材料之材料形成。軸承夾持器110之上部216可為內齒輪112提供支撐。軸承夾持器110可包含可與內齒輪112之複數個孔洞(未圖示)對準之複數個孔洞(未圖示)。軸承收納區域218可適於收納軸承130。 Bearing retainer 110 can be generally annular. The bearing retainer 110 can be disposed adjacent the annular upper portion 244 of the carrier ring 140 and above the annular upper portion 244. Bearing retainer 110 can be coupled to carrier ring 140 by fasteners 213 such as screws or bolts. Bearing retainer 110 may be formed from a material such as metal (eg, stainless steel, molybdenum, aluminum), ceramic materials, or other exemplary materials. The upper portion 216 of the bearing retainer 110 can provide support for the internal gear 112. Bearing retainer 110 can include a plurality of holes (not shown) that can be aligned with a plurality of holes (not shown) of internal gear 112. The bearing receiving region 218 can be adapted to receive the bearing 130.
軸承130可耦接在軸承夾持器110與承載主體208之間。軸承130可包含可耦接至軸承夾持器110之軸承收納區域218且設置成毗鄰該軸承收納區域218之第一環形表面232。第二環形表面234可耦接至承載主體208且設置成毗鄰該承載主體208。複數個球軸承236可設置在第一環形表面232與第二環形表面234之間且可適於使頭組件102與固定環組件104解耦。軸承130可提供額外旋轉自由度給承載頭100。額外旋轉自由度允許固定環組件104獨立於頭組件102旋轉。 Bearing 130 can be coupled between bearing holder 110 and carrier body 208. The bearing 130 can include a first annular surface 232 that can be coupled to the bearing receiving region 218 of the bearing retainer 110 and disposed adjacent the bearing receiving region 218. The second annular surface 234 can be coupled to the carrier body 208 and disposed adjacent to the carrier body 208. A plurality of ball bearings 236 can be disposed between the first annular surface 232 and the second annular surface 234 and can be adapted to decouple the head assembly 102 from the stationary ring assembly 104. Bearing 130 can provide additional rotational freedom to carrier head 100. The additional rotational freedom allows the retaining ring assembly 104 to rotate independently of the head assembly 102.
內齒輪112可為大體環狀的。內齒輪112可由諸如金屬(例如，不銹鋼、鉬、鋁)、陶瓷材料或其他示例性材料之材料形成。內齒輪112可設置成毗鄰軸承夾持器110之上部216且與該上部216耦接。複數個孔洞(未圖示)可設置成穿過內齒輪112且適於收納緊固件(未圖示)，該緊固件可適於將內齒輪112固定至軸承夾持器110。複數個齒214 可包含內齒輪112之內表面。 The internal gear 112 can be generally annular. Internal gear 112 may be formed from a material such as a metal (eg, stainless steel, molybdenum, aluminum), a ceramic material, or other exemplary materials. The internal gear 112 can be disposed adjacent to and coupled to the upper portion 216 of the bearing holder 110. A plurality of holes (not shown) may be provided through the internal gear 112 and adapted to receive a fastener (not shown) that may be adapted to secure the internal gear 112 to the bearing holder 110. Multiple teeth 214 The inner surface of the inner gear 112 can be included.
在某些實施例中，驅動組件290可經配置以提供獨立於頭組件102之旋轉之旋轉運動給固定環組件104。驅動組件290包括蓋環258、托架256、致動器260、轉軸261及蝸桿驅動件262。驅動組件290致動可致使固定環組件104相對於頭組件102旋轉之傳動件292。 In certain embodiments, the drive assembly 290 can be configured to provide rotational motion independent of the rotation of the head assembly 102 to the stationary ring assembly 104. The drive assembly 290 includes a cover ring 258, a bracket 256, an actuator 260, a rotating shaft 261, and a worm drive member 262. The drive assembly 290 actuates a transmission member 292 that causes the stationary ring assembly 104 to rotate relative to the head assembly 102.
蓋環258可設置成毗鄰承載主體208之一部分且在該部分上方。蓋環258可耦接至承載主體208，使得蓋環258以及耦接至該蓋環258之元件以與頭組件102相同的旋轉方式移動。托架256可設置在蓋環258之頂表面259上方且耦接至該頂表面259。托架256可適於將致動器260支撐在固定位置中。致動器260(諸如，氣動馬達)可經由輸送線272耦接至壓力源274。壓力源274可適於經由輸送線272提供壓縮氣體或流體給致動器260。轉軸261自致動器260延伸且蝸桿驅動件262可耦接至轉軸261。致動器260大體施加旋轉運動給轉軸261且致使蝸桿驅動件262旋轉。 A cover ring 258 can be disposed adjacent to and above a portion of the carrier body 208. The cover ring 258 can be coupled to the carrier body 208 such that the cover ring 258 and the components coupled to the cover ring 258 move in the same rotational manner as the head assembly 102. A bracket 256 can be disposed over the top surface 259 of the cover ring 258 and coupled to the top surface 259. Bracket 256 can be adapted to support actuator 260 in a fixed position. An actuator 260, such as a pneumatic motor, can be coupled to the pressure source 274 via a delivery line 272. Pressure source 274 may be adapted to provide compressed gas or fluid to actuator 260 via delivery line 272. The rotating shaft 261 extends from the actuator 260 and the worm driving member 262 can be coupled to the rotating shaft 261. The actuator 260 generally imparts a rotational motion to the rotating shaft 261 and causes the worm drive member 262 to rotate.
可由蝸桿驅動件262致動傳動件292。傳動件292包含蝸輪264、正齒輪268、驅動軸266及軸編碼器270。蝸輪264可設置成圍繞驅動軸266之第一端265。蝸輪264可耦接至蝸桿驅動件262且適於將蝸桿驅動件262之旋轉運動轉移至驅動軸266。正齒輪268可設置成圍繞在與內齒輪112之齒214大體上平行之區域269處之蝸輪264下方的驅動軸266。正齒輪268可將驅動軸266之旋轉運動轉移至內齒輪112。因此，固定環組件104可獨立於頭組件102之旋轉而旋 轉。 The transmission member 292 can be actuated by the worm drive member 262. The transmission member 292 includes a worm gear 264, a spur gear 268, a drive shaft 266, and a shaft encoder 270. The worm gear 264 can be disposed to surround the first end 265 of the drive shaft 266. The worm gear 264 can be coupled to the worm drive 262 and adapted to transfer rotational motion of the worm drive 262 to the drive shaft 266. The spur gear 268 can be disposed to surround the drive shaft 266 below the worm gear 264 at a region 269 that is substantially parallel with the teeth 214 of the internal gear 112. Spur gear 268 can transfer rotational motion of drive shaft 266 to internal gear 112. Therefore, the retaining ring assembly 104 can be rotated independently of the rotation of the head assembly 102. turn.
軸編碼器270可設置在驅動軸266上之正齒輪268下方。軸編碼器270(諸如，機電裝置)可將驅動軸266之旋轉運動轉換成類比或數位碼。軸編碼器270可耦接至控制器(未圖示)，該控制器可耦接至致動器260。控制器可適於控制固定環104相對於頭組件102旋轉之旋轉速度。 A shaft encoder 270 can be disposed below the spur gear 268 on the drive shaft 266. A shaft encoder 270, such as an electromechanical device, can convert the rotational motion of the drive shaft 266 into an analog or digital code. The shaft encoder 270 can be coupled to a controller (not shown) that can be coupled to the actuator 260. The controller can be adapted to control the rotational speed of the stationary ring 104 relative to the head assembly 102.
外殼組件280可設置在承載主體208之一部分中且可適於收納驅動軸266。外殼組件280可具有底部286及複數個側壁282。驅動軸266之第二端267可設置在外殼組件280內。複數個軸承284亦可設置在外殼組件280內。複數個軸承284可設置在外殼組件280之側壁282與驅動軸266之間。複數個軸承284可使驅動軸266耦接至外殼組件280且允許驅動軸266相對於外殼組件280之旋轉運動。 The housing assembly 280 can be disposed in a portion of the carrier body 208 and can be adapted to receive the drive shaft 266. The housing assembly 280 can have a bottom 286 and a plurality of side walls 282. The second end 267 of the drive shaft 266 can be disposed within the outer casing assembly 280. A plurality of bearings 284 may also be disposed within the outer casing assembly 280. A plurality of bearings 284 can be disposed between the sidewall 282 of the housing assembly 280 and the drive shaft 266. A plurality of bearings 284 can couple drive shaft 266 to housing assembly 280 and allow rotational movement of drive shaft 266 relative to housing assembly 280.
在某些實施例中，可以大於可旋轉頭組件102之旋轉速度之一速度驅動固定環組件104。舉例而言，在60秒CMP研磨製程期間，可以達到約60rpm至約120rpm之一速度旋轉頭組件102。在此實例中，固定環組件104之旋轉速度可大於可促使基板進動之研磨頭之旋轉速度。可設想固定環組件104可在相對於頭組件102之旋轉方向之相同的相反方向上旋轉。此外，基板進動可受研磨基板201所抵靠之拋光墊之旋轉方向影響。 In some embodiments, the retaining ring assembly 104 can be driven at a speed greater than one of the rotational speeds of the rotatable head assembly 102. For example, the spin head assembly 102 can be reached at a speed of from about 60 rpm to about 120 rpm during a 60 second CMP polishing process. In this example, the rotational speed of the retaining ring assembly 104 can be greater than the rotational speed of the abrading head that can cause the substrate to precess. It is contemplated that the retaining ring assembly 104 can rotate in the same opposite direction relative to the direction of rotation of the head assembly 102. In addition, the substrate precession may be affected by the direction of rotation of the polishing pad against which the polishing substrate 201 abuts.
第3圖係固定環組件104及基板201之示意性仰視圖。固定環組件104之內徑可大於基板201之外徑。固定環組件104之旋轉方向306促使基板201在一方向上相對於頭 組件(未圖示)(諸如，頭組件102(參見第2圖))旋轉308。基板201相對於頭組件之旋轉308可定義為先前論述之基板進動。 3 is a schematic bottom view of the retaining ring assembly 104 and the substrate 201. The inner diameter of the retaining ring assembly 104 can be greater than the outer diameter of the substrate 201. The direction of rotation 306 of the retaining ring assembly 104 causes the substrate 201 to be oriented relative to the head in one direction A component (not shown), such as head assembly 102 (see FIG. 2), is rotated 308. The rotation 308 of the substrate 201 relative to the head assembly can be defined as substrate pre-existing as previously discussed.
如先前所述，基板進動係由基板201經歷之相對於頭組件102上之膜250之旋轉或滑動程度。吾人相信促使基板進動可在給定研磨時間內「平均而消除(average out)」基板移除輪廓中之任何可能的局部不均勻性。吾人相信由基板進動產生之極性不對稱導致關於膜250或拋光墊中之局部不均勻性的平均化效果。局部不均勻性可導致不平坦移除輪廓且因此降低局部不均勻性之影響可非常有利。 As previously described, the substrate precession is experienced by the substrate 201 relative to the extent of rotation or sliding of the film 250 on the head assembly 102. It is believed that promoting substrate precession "averages out" any possible local inhomogeneities in the substrate removal profile for a given polishing time. It is believed that the asymmetry of polarity resulting from precession of the substrate results in an averaging effect on local inhomogeneities in the film 250 or polishing pad. Local inhomogeneities can be very advantageous in terms of unevenly removing the profile and thus reducing the effects of localized inhomogeneities.
吾人亦相信可由基板201外徑與固定環組件104內徑之間的關係規定基板進動。可按照齒輪比描述基板201外徑與固定環組件104內徑之間的關係。固定環組件104內徑與基板201外徑之間的較小齒輪比將導致基板進動增加。 It is also believed that the substrate can be precessed by the relationship between the outer diameter of the substrate 201 and the inner diameter of the retaining ring assembly 104. The relationship between the outer diameter of the substrate 201 and the inner diameter of the stationary ring assembly 104 can be described in terms of a gear ratio. A smaller gear ratio between the inner diameter of the retaining ring assembly 104 and the outer diameter of the substrate 201 will result in increased substrate precession.
吾人進一步相信以大於頭組件102之速度的速度驅動固定環組件104可進一步促使基板進動。在一個實施例中，約60rpm之頭組件102旋轉速度結合約11.852吋之固定環組件104內徑可提供約90°之基板進動。在另一實施例中，約90rpm之頭組件102旋轉速度結合約11.852吋之固定環組件104內徑可提供約135°之基板進動。在另一實施例中，約120rpm之頭組件102旋轉速度結合約11.852吋之固定環組件104內徑可提供約100°°之基板進動。上述實施例之齒輪比可為約0.99654。在上述實施例中，固定環組件104可以大於頭組件102之旋轉速度之旋轉速度共旋轉或反旋轉。 It is further believed that driving the retaining ring assembly 104 at a greater speed than the speed of the head assembly 102 can further facilitate precession of the substrate. In one embodiment, the rotational speed of the head assembly 102 at about 60 rpm in combination with the inner diameter of the retaining ring assembly 104 of about 11.852 inches provides a substrate precession of about 90 degrees. In another embodiment, the rotational speed of the head assembly 102 at about 90 rpm in combination with the inner diameter of the retaining ring assembly 104 of about 11.852 inches provides a substrate precession of about 135°. In another embodiment, a rotational speed of the head assembly 102 of about 120 rpm in combination with an inner diameter of the fixed ring assembly 104 of about 11.852 inches provides a substrate precession of about 100°. The gear ratio of the above embodiment may be about 0.99654. In the above embodiment, the retaining ring assembly 104 can be co-rotated or reverse rotated at a rotational speed greater than the rotational speed of the head assembly 102.
在一個實施例中，約60rpm之頭組件102旋轉速度結合約11.912吋之固定環組件104內徑可提供約180°之基板進動。在另一實施例中，約90rpm頭組件102旋轉速度結合約11.912吋之固定環組件104內徑可提供約270°之基板進動。在另一實施例中，約120rpm之頭組件102旋轉速度結合約11.912吋之固定環組件104內徑可提供約360°之基板進動。上述實施例之齒輪比可為約0.99152。在上述實施例中，固定環組件104可以大於頭組件102之旋轉速度之旋轉速度共旋轉或反旋轉。 In one embodiment, a rotational speed of the head assembly 102 of about 60 rpm in combination with an inner diameter of the fixed ring assembly 104 of about 11.912 inches provides a substrate precession of about 180 degrees. In another embodiment, a rotational speed of about 90 rpm head assembly 102 in combination with an inner diameter of the fixed ring assembly 104 of about 11.912 inches provides a substrate precession of about 270°. In another embodiment, a rotational speed of the head assembly 102 of about 120 rpm in combination with an inner diameter of the fixed ring assembly 104 of about 11.912 inches provides a substrate precession of about 360 degrees. The gear ratio of the above embodiment may be about 0.99152. In the above embodiment, the retaining ring assembly 104 can be co-rotated or reverse rotated at a rotational speed greater than the rotational speed of the head assembly 102.
儘管上文針對本發明之實施例，但可在不脫離本發明之基本範疇的情況下設計本發明之其他實施例與進一步實施例，且本發明之範疇由以下申請專利範圍決定。 While the invention has been described with respect to the embodiments of the present invention, other embodiments and further embodiments of the invention may be devised without departing from the scope of the invention.
100‧‧‧習知承載頭/承載頭 100‧‧‧Study carrier head/carrier head
102‧‧‧頭組件 102‧‧‧ head components
104‧‧‧固定環組件 104‧‧‧Fixed ring assembly
106‧‧‧外殼 106‧‧‧Shell
110‧‧‧軸承夾持器 110‧‧‧bearing holder
112‧‧‧內齒輪 112‧‧‧Internal gear
120‧‧‧固定環 120‧‧‧Fixed ring
130‧‧‧軸承 130‧‧‧ bearing
140‧‧‧承載環 140‧‧‧ Carrying ring
201‧‧‧基板 201‧‧‧Substrate
208‧‧‧承載主體 208‧‧‧bearer
213‧‧‧緊固件 213‧‧‧fasteners
214‧‧‧齒 214‧‧‧ teeth
216‧‧‧上部 216‧‧‧ upper
218‧‧‧軸承收納區域 218‧‧‧ bearing storage area
222‧‧‧上環 222‧‧‧Sheung Wan
224‧‧‧下環 224‧‧‧The ring
226‧‧‧基板保持表面 226‧‧‧Substrate holding surface
228‧‧‧內表面 228‧‧‧ inner surface
232‧‧‧第一環形表面 232‧‧‧First annular surface
234‧‧‧第二環形表面 234‧‧‧second annular surface
236‧‧‧球軸承 236‧‧‧Ball bearings
242‧‧‧環形下部 242‧‧‧Lower ring
244‧‧‧環形上部 244‧‧‧ring upper part
250‧‧‧可撓膜 250‧‧‧Flexible film
256‧‧‧托架 256‧‧‧ bracket
258‧‧‧蓋環 258‧‧ ‧ cover ring
259‧‧‧頂表面 259‧‧‧ top surface
260‧‧‧致動器 260‧‧‧ actuator
261‧‧‧轉軸 261‧‧‧ shaft
262‧‧‧蝸桿驅動件 262‧‧‧ worm drive
264‧‧‧蝸輪 264‧‧‧ worm gear
265‧‧‧第一端 265‧‧‧ first end
266‧‧‧驅動軸 266‧‧‧ drive shaft
267‧‧‧第二端 267‧‧‧ second end
268‧‧‧正齒輪 268‧‧‧Spur gear
269‧‧‧區域 269‧‧‧Area
270‧‧‧軸編碼器 270‧‧‧shaft encoder
272‧‧‧輸送線 272‧‧‧ conveyor line
274‧‧‧壓力源 274‧‧‧Pressure source
280‧‧‧外殼組件 280‧‧‧Shell assembly
282‧‧‧側壁 282‧‧‧ side wall
284‧‧‧軸承 284‧‧‧ bearing
286‧‧‧底部 286‧‧‧ bottom
290‧‧‧驅動組件 290‧‧‧Drive components
292‧‧‧傳動件 292‧‧‧ Transmission parts
Claims (20)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/827,629 US20140273756A1 (en) | 2013-03-14 | 2013-03-14 | Substrate precession mechanism for cmp polishing head |
| US13/827,629 | 2013-03-14 |
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| Publication Number | Publication Date |
|---|---|
| TW201446417A true TW201446417A (en) | 2014-12-16 |
| TWI617393B TWI617393B (en) | 2018-03-11 |
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| TW103107644A TWI617393B (en) | 2013-03-14 | 2014-03-06 | Substrate precession mechanism for cmp polishing head |
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| US (1) | US20140273756A1 (en) |
| JP (1) | JP6581964B2 (en) |
| KR (1) | KR102243725B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9381613B2 (en) * | 2013-03-13 | 2016-07-05 | Applied Materials, Inc. | Reinforcement ring for carrier head |
| US20140273756A1 (en) * | 2013-03-14 | 2014-09-18 | Chih Hung Chen | Substrate precession mechanism for cmp polishing head |
| JP7051332B2 (en) | 2017-08-23 | 2022-04-11 | キヤノン株式会社 | Organic compounds and photoelectric conversion elements |
| KR102459832B1 (en) * | 2017-11-22 | 2022-10-28 | 주식회사 케이씨텍 | Carrier |
| TWI639486B (en) * | 2018-05-31 | 2018-11-01 | 國立清華大學 | Omni-directional integrated conditioner device |
| JP2023516875A (en) | 2020-11-10 | 2023-04-21 | アプライド マテリアルズ インコーポレイテッド | Polishing head with localized wafer pressure |
| US20230381917A1 (en) * | 2022-05-27 | 2023-11-30 | Applied Materials, Inc. | Clamping retainer for chemical mechanical polishing |
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| JP2008229846A (en) * | 1995-10-09 | 2008-10-02 | Ebara Corp | Device and method for polishing, and top ring |
| JP3724869B2 (en) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | Polishing apparatus and method |
| JPH10156712A (en) * | 1996-11-29 | 1998-06-16 | Oki Electric Ind Co Ltd | Wafer polishing device |
| JP2000334655A (en) | 1999-05-26 | 2000-12-05 | Matsushita Electric Ind Co Ltd | Cmp working device |
| JP2001298006A (en) * | 2000-04-17 | 2001-10-26 | Ebara Corp | Polishing device |
| US7198561B2 (en) * | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
| US6527625B1 (en) * | 2000-08-31 | 2003-03-04 | Multi-Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a soft backed polishing head |
| CN1852787A (en) * | 2000-08-31 | 2006-10-25 | 多平面技术公司 | Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
| JP2004106173A (en) * | 2002-08-29 | 2004-04-08 | Fujikoshi Mach Corp | Double-sided polishing device |
| KR100502362B1 (en) * | 2003-08-05 | 2005-07-21 | 두산디앤디 주식회사 | Semiconductor wafer polishing system having combined mechanism for conditioner carrier |
| US7338569B2 (en) * | 2004-09-29 | 2008-03-04 | Agere Systems Inc. | Method and system of using offset gage for CMP polishing pad alignment and adjustment |
| JPWO2006038259A1 (en) * | 2004-09-30 | 2008-07-31 | 株式会社ルネサステクノロジ | Method of manufacturing semiconductor device |
| US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
| US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| KR101022277B1 (en) * | 2009-02-25 | 2011-03-21 | 그린스펙(주) | Carrier head structure for polishing apparatus of silicon bare wafers |
| JP5303491B2 (en) * | 2010-02-19 | 2013-10-02 | 信越半導体株式会社 | Polishing head and polishing apparatus |
| US20130288577A1 (en) * | 2012-04-27 | 2013-10-31 | Applied Materials, Inc. | Methods and apparatus for active substrate precession during chemical mechanical polishing |
| US20140273756A1 (en) * | 2013-03-14 | 2014-09-18 | Chih Hung Chen | Substrate precession mechanism for cmp polishing head |
-
2013
- 2013-03-14 US US13/827,629 patent/US20140273756A1/en not_active Abandoned
-
2014
- 2014-02-24 CN CN201480014938.7A patent/CN105190845B/en active Active
- 2014-02-24 KR KR1020157029484A patent/KR102243725B1/en active IP Right Grant
- 2014-02-24 WO PCT/US2014/018069 patent/WO2014158548A1/en active Application Filing
- 2014-02-24 JP JP2016500364A patent/JP6581964B2/en active Active
- 2014-03-06 TW TW103107644A patent/TWI617393B/en active
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|---|---|
| TWI617393B (en) | 2018-03-11 |
| US20140273756A1 (en) | 2014-09-18 |
| JP6581964B2 (en) | 2019-09-25 |
| CN105190845B (en) | 2019-02-22 |
| KR102243725B1 (en) | 2021-04-23 |
| JP2016515303A (en) | 2016-05-26 |
| WO2014158548A1 (en) | 2014-10-02 |
| CN105190845A (en) | 2015-12-23 |
| KR20150132842A (en) | 2015-11-26 |
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