TW201427900A - 二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及其製品 - Google Patents
二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及其製品 Download PDFInfo
- Publication number
- TW201427900A TW201427900A TW101147695A TW101147695A TW201427900A TW 201427900 A TW201427900 A TW 201427900A TW 101147695 A TW101147695 A TW 101147695A TW 101147695 A TW101147695 A TW 101147695A TW 201427900 A TW201427900 A TW 201427900A
- Authority
- TW
- Taiwan
- Prior art keywords
- cerium oxide
- oxide sol
- metal substrate
- ethane
- triethoxyindenyl
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
- C09D1/02—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1212—Zeolites, glasses
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
- C23C18/127—Preformed particles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
Abstract
本發明提供一種二氧化矽溶膠,該二氧化矽溶膠含有正矽酸四乙酯、二甲基甲醯胺、1,2-二(三乙氧基矽基)乙烷、無水乙醇及鹽酸。本發明還提供一種應用該二氧化矽溶膠進行表面處理的方法及製品。
Description
本發明涉及一種二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及其製品。
鋁合金目前被廣泛應用於航空、航天、汽車及微電子等工業領域。但鋁合金的標準電極電位很低,耐腐蝕差,暴露於自然環境中會引起表面快速腐蝕。
長期以來,為了提高鋁合金基體的耐腐蝕性,通常先對鋁合金基體進行鉻酸鹽處理,再對鋁合金基體進行電泳處理。然,鉻酸鹽由於存在有毒性的Cr6+,易造成環境污染。近年來,人們採用稀土溶液浸泡處理代替鉻酸鹽處理,在鋁合金基體表面形成一稀土氧化物薄膜,以提高鋁合金基體的耐腐蝕性。然,該浸泡處理所需時間較長,稀土溶液的配方複雜,難以廣泛應用於工業生產中。
有鑒於此,提供一種二氧化矽溶膠。
同時,提供一種應用所述二氧化矽溶膠對金屬基體進行表面處理的方法,該方法可提高金屬基體的耐腐蝕性、且無環境污染。
另外,還提供一種經上述表面處理方法製得的製品。
一種二氧化矽溶膠,其含有正矽酸四乙酯、二甲基甲醯胺、1,2-二(三乙氧基矽基)乙烷、無水乙醇及鹽酸。
一種應用二氧化矽溶膠對金屬基體進行表面處理的方法,包括如下步驟:
提供金屬基體;
製備二氧化矽溶膠,該二氧化矽溶膠含有正矽酸四乙酯、二甲基甲醯胺、1,2-二(三乙氧基矽基)乙烷、無水乙醇及鹽酸;
採用該二氧化矽溶膠在該金屬基體上形成一二氧化矽溶膠層;
對該二氧化矽溶膠層進行乾燥處理;
將金屬基體置於400~500℃的溫度下進行熱處理,使二氧化矽溶膠層形成二氧化矽凝膠層,該二氧化矽凝膠層含有由正矽酸四乙酯聚集形成(O-Si-O)n的網路結構、2-二(三乙氧基矽基)乙烷及填充於該網路結構內的奈米級的二氧化矽粒子,2-二(三乙氧基矽基)乙烷與金屬基體鍵合形成的Si-O-M鍵,部分2-二(三乙氧基矽基)乙烷相互連結和/或與正矽酸四乙酯發生交聯。
一種製品,其包括金屬基體及形成於金屬基體上的二氧化矽凝膠層,該二氧化矽凝膠層含有由正矽酸四乙酯聚集形成(O-Si-O)n的網路結構、2-二(三乙氧基矽基)乙烷及填充於該網路結構內的奈米級的二氧化矽粒子,2-二(三乙氧基矽基)乙烷與金屬基體鍵合形成Si-O-M鍵,部分2-二(三乙氧基矽基)乙烷相互連結和/或與正矽酸四乙酯發生交聯。
在金屬基體與電泳漆層之間形成一緻密的二氧化矽凝膠層,可有效阻礙進入電泳漆層中的電解質溶液向金屬基體的方向擴散,如此可提高金屬基體的耐腐蝕性。另外,該二氧化矽溶膠簡單易得,可廣泛應用於工業生產中。
本發明一較佳實施方式的二氧化矽溶膠的主要成分為正矽酸四乙酯(TEOS)、二甲基甲醯胺(DMF)、1,2-二(三乙氧基矽基)乙烷(BTESE)、導電金屬粉體、無水乙醇及鹽酸。其中,TEOS的體積百分含量為30%~40%、DMF的體積百分含量為2%~4%、BTESE的體積百分含量為20%~30%、導電金屬粉體的體積百分含量為5%~10%、無水乙醇的體積百分含量為10%~15%、及鹽酸的體積百分含量為3%~5%。該二氧化矽溶膠的pH值為2~4。
DMF作為絡合劑,與TEOS水解後的中間體絡合,同時還可降低溶膠縮聚的反應速率,可避免二氧化矽溶膠成膜後發生龜裂。
BTESE可提高二氧化矽溶膠形成的膜層的緻密性及成膜後與金屬基體之間的結合力。
鹽酸作為催化劑,提供H3O+離子,使用時促進二氧化矽溶膠成膜。鹽酸還用以調節二氧化矽溶膠的pH值。
該導電金屬粉體可為鋁粉、銻粉或銀粉等,可使二氧化矽溶膠具有導電性。該導電金屬粉體的粒徑為奈米級,以提高導電金屬粉體在二氧化矽溶膠中的分散性、二氧化矽溶膠的導電性、以及使二氧化矽溶膠可形成較薄的膜層。較佳地,該導電金屬粉體的粒徑為30~50nm。
該二氧化矽溶膠藉由如下方式製得:
以TEOS、DMF、BTESE、導電金屬粉體、無水乙醇及鹽酸為原料。其中,TEOS的體積百分含量為30%~40%、DMF的體積百分含量為2%~4%、BTESE的體積百分含量為20%~30%、導電金屬粉體的體積百分含量為5%~10%、無水乙醇的體積百分含量為10%~15%、及鹽酸的體積百分含量為3%~5%。
向無水乙醇中加入TEOS、DMF及BTESE,並攪拌至均勻得一混合液;用鹽酸調節該混合液的pH值至2~4;將導電金屬粉體加入該pH值為2~4的混合液中,並攪拌至均勻後進行過濾,以去除少量的懸浮的雜質,製得所述二氧化矽溶膠。
請參見圖1所示,應用所述二氧化矽溶膠對金屬基體進行表面處理的方法,包括如下步驟:
提供金屬基體11,該金屬基體11的材質可為鋁、鋁合金、鎂或鎂合金等。
在所述金屬基體11表面形成一二氧化矽凝膠層13,其包括如下步驟:
首先,藉由塗布或浸泡的方式,採用該二氧化矽溶膠在該金屬基體11上形成一二氧化矽溶膠層,並將該金屬基體11置於40~50℃溫度下進行真空乾燥10~15min,使二氧化矽溶膠轉化為二氧化矽凝膠。
之後,對該二氧化矽凝膠進行熱處理,其具體操作和工藝參數如下:提供一烘烤爐(未圖示),將烘烤爐加熱至爐內溫度為100~120℃,將金屬基體11置於烘烤爐內並保溫10~15min。再將烘烤爐加熱至爐內溫度為400~500℃並保溫30~50min,最終於所述金屬基體11上形成二氧化矽凝膠層13。所述二氧化矽凝膠層13的厚度為10-100nm,優選為20-30nm。
在該熱處理過程中,BTESE主要與金屬基體11鍵合形成Si-O-M鍵(M為金屬基體11中的金屬元素,如Mg或Al等),可提高二氧化矽凝膠層13與金屬基體11之間的結合力。TEOS部分聚集形成(O-Si-O)n的網路結構,其他形成填充於該網路結構內的奈米級的二氧化矽粒子;部分BTESE還可相互連結和/或與TEOS發生交聯,使所述二氧化矽凝膠層13更緻密,進而提高二氧化矽凝膠層13的耐腐蝕性。該二氧化矽粒子的粒徑為10nm~20nm。
此外,因BTESE的腐蝕電位、極化阻抗高於鋁合金或鎂合金、腐蝕電流密度低於鋁合金或鎂合金,使二氧化矽凝膠層13不易發生腐蝕反應,如此進一步地提高二氧化矽凝膠層13的耐腐蝕性。
對金屬基體11進行電泳處理,在二氧化矽凝膠層13上形成一電泳漆層15,具體操作及工藝參數如下:提供一電泳漆;採用陰極電泳工藝,將所述金屬基體11置於該電泳漆中,以該金屬基體11為陰極,以不銹鋼片為陽極;該電泳處理的電壓為95V~100V,處理時間為2~3 min,處理溫度為24~26 ℃;取出表面形成有電泳漆層15的金屬基體11,並採用自來水沖洗以去除電泳漆層15表面殘留的電泳漆;最後,對電泳漆層15進行固化處理。
本實例中,所述電泳漆含有丙烯酸樹脂、丙烯酸甲酯、異丙醇、二丙酮醇、丁醇、乙醇胺及有機顏料;其中,丙烯酸樹脂的質量百分含量為15~20%,丙烯酸甲酯的質量百分含量為15~20%,異丙醇的質量百分含量為4~6%,二丙酮醇的質量百分含量為3~5%,丁醇的質量百分含量為12~15%,乙醇胺的質量百分含量為7~10%,有機顏料的質量百分含量為10~15%。本實施例中,有機顏料為奎酞。優選地,顏料的粒徑為10μm~25μm。該電泳漆層15的厚度為20μm~50μm。
一種經由上述表面處理方法製得的製品10包括金屬基體11、依次形成於該金屬基體11上的二氧化矽凝膠層13及電泳漆層15。
該二氧化矽凝膠層13含有由TEOS部分聚集形成(O-Si-O)n的網路結構、BTESE、填充於該網路結構內的奈米級的二氧化矽粒子及導電金屬粉體。BTESE主要與金屬基體11鍵合形成Si-O-M鍵(M為金屬基體11中的金屬元素,如Mg或Al等)。TEOS部分聚集形成(O-Si-O)n的網路結構,其他形成填充於該網路結構內的奈米級的二氧化矽粒子;部分BTESE還可相互連結和/或與TEOS發生交聯。
該二氧化矽粒子的粒徑為10nm~20nm。該導電金屬粉體可為鋁粉、錫粉及銦粉等。該導電金屬粉體粒徑為奈米級。較佳地,該導電金屬粉體的粒徑為30~50nm。該所述二氧化矽凝膠層13的厚度為10~100nm,優選為20~30nm。
所述電泳漆層15的厚度為20μm~50μm。
本發明藉由在金屬基體11與電泳漆層15之間形成一緻密的二氧化矽凝膠層13,在電泳過程中,可有效阻礙進入電泳漆層15中的氧氣及電解質溶液擴散至金屬基體11,如此可提高金屬基體11的耐腐蝕性。另外,因二氧化矽凝膠層13中含有導電金屬粉體,可提高該電泳漆層15與金屬基體11之間的結合力,以進一步提高製品的耐腐蝕性。
實施例1
提供一金屬基體11,該金屬基體11的材質為鋁合金。
提供一二氧化矽溶膠。在該二氧化矽溶膠中,TEOS的體積百分含量為38%、DMF的體積百分含量為2%、BTESE的體積百分含量為20%、導電金屬粉體的體積百分含量為5%、無水乙醇的體積百分含量為10%、及鹽酸的體積百分含量為3%。該二氧化矽溶膠的pH值為3.5。
在所述金屬基體11表面形成一二氧化矽凝膠層13,其包括如下步驟:
首先,藉由塗布的方式,在該金屬基體11上形成一二氧化矽溶膠層,並將該金屬基體11置於40℃溫度下進行真空乾燥12min,使二氧化矽溶膠轉化為二氧化矽凝膠。
之後,對該二氧化矽凝膠進行熱處理,將金屬基體11置於烘烤爐內並保溫15min,該烘烤爐的溫度為100℃。再將烘烤爐加熱至爐內溫度為500℃並保溫30min,最終於所述金屬基體11上形成二氧化矽凝膠層13。所述二氧化矽凝膠層13的厚度為20μm。
在該二氧化矽凝膠層13上形成電泳漆層15。形成電泳漆層15過程中,電壓為100V,處理時間為3min,處理溫度為25℃。用以形成該電泳漆層15的電泳漆含有丙烯酸樹脂、丙烯酸甲酯、異丙醇、乙醇及奎酞。
實施例2
實施例2與實施例1相比有如下不同:對二氧化矽凝膠進行熱處理,將金屬基體11置於烘烤爐內並保溫10min,該烘烤爐的溫度為120℃。再將烘烤爐加熱至爐內溫度為400℃並保溫50min,最終於所述金屬基體11上形成二氧化矽凝膠層13。本實施例2的其他條件與實施例1相同。
對比例
對比例與實施例1不同的係金屬基體11與電泳漆層15之間未形成有二氧化矽凝膠層13,其他條件與實施例1相同。
性能測試
將實施例1製得的製品及對比例處理後的金屬基體進行鹽霧測試及耐磨性測試,具體測試方法及結果如下:
(1)鹽霧測試
將實施例1、2製得的製品10及對比例處理後的金屬基體進行35℃中性鹽霧(NaCl濃度為5%)測試。結果表明,由本發明實施例1-2的方法所製備的製品10在168小時後電泳漆層15上未出現腐蝕點,而經對比例的方法處理後的金屬基體在124小時後表面出現腐蝕點。可見,上述製品10具有較好的耐腐蝕性。
(2)採用R180/530TE30型號的槽式振動耐磨測試機,將RKS10K型黃色圓錐體磨料3份,RKK15P型綠色棱錐體磨料1份及FC120洗滌劑適量加入所述槽式振動耐磨測試機內;再分別將實施例1-2製得的製品及對比例處理後的金屬基體置於該槽式振動耐磨測試機內研磨震動2小時。所述槽式振動耐磨測試機、RKS10K型黃色圓錐體磨料、RKK15P型綠色棱錐體磨料及FC120洗滌劑均為德國ROSLER公司供應。
結果表明,由本發明實施例1、2的方法所製得的製品10經上述耐磨性測試後,二氧化矽凝膠層13及電泳漆層15未發生脫落,僅電泳漆層15表面出現少量劃痕。而,經對比例處理後的鋁合金基體上的電泳漆層發生剝落。可見,上述製品10具有較好的耐磨性。
10...製品
11...金屬基體
13...二氧化矽凝膠層
15...電泳漆層
圖1為本發明一較佳實施例的製品的示意圖。
10...製品
11...金屬基體
13...二氧化矽凝膠層
15...電泳漆層
Claims (11)
- 一種二氧化矽溶膠,其改良在於:該二氧化矽溶膠含有正矽酸四乙酯、二甲基甲醯胺、1,2-二(三乙氧基矽基)乙烷、無水乙醇及鹽酸。
- 如申請專利範圍第1項所述之二氧化矽溶膠,其中所述二氧化矽溶膠中,正矽酸四乙酯的體積百分含量為30%~40%、二甲基甲醯胺的體積百分含量為2%~4%、2-二(三乙氧基矽基)乙烷的體積百分含量為20%~30%、無水乙醇的體積百分含量為10%~15%、及鹽酸的體積百分含量為3%~5%。
- 如申請專利範圍第1項所述之二氧化矽溶膠,其中該二氧化矽溶膠還含有導電金屬粉體。
- 如申請專利範圍第3項所述之二氧化矽溶膠,其中該導電金屬粉體為鋁粉、銻粉或銀粉。
- 如申請專利範圍第4項所述之二氧化矽溶膠,其中該導電金屬粉體的粒徑為30~50nm。
- 一種應用二氧化矽溶膠對金屬基體進行表面處理的方法,包括如下步驟:
提供金屬基體;
製備二氧化矽溶膠,該二氧化矽溶膠含有正矽酸四乙酯、二甲基甲醯胺、1,2-二(三乙氧基矽基)乙烷、無水乙醇及鹽酸;
在該金屬基體上形成一二氧化矽溶膠層;
對該二氧化矽溶膠層進行乾燥處理;
將金屬基體置於400~500℃的溫度下進行熱處理,使二氧化矽溶膠層形成二氧化矽凝膠層,該二氧化矽凝膠層含有由正矽酸四乙酯聚集形成(O-Si-O)n的網路結構、2-二(三乙氧基矽基)乙烷及填充於該網路結構內的奈米級的二氧化矽粒子,2-二(三乙氧基矽基)乙烷與金屬基體鍵合形成Si-O-M鍵,部分2-二(三乙氧基矽基)乙烷相互連結和/或與正矽酸四乙酯發生交聯。 - 如申請專利範圍第6項所述的表面處理的方法,其中所述二氧化矽溶膠中,正矽酸四乙酯的體積百分含量為30%~40%、二甲基甲醯胺的體積百分含量為2%~4%、2-二(三乙氧基矽基)乙烷的體積百分含量為20%~30%、無水乙醇的體積百分含量為10%~15%、及鹽酸的體積百分含量為3%~5%。
- 如申請專利範圍第6項所述的表面處理的方法,其中該二氧化矽溶膠還含有導電金屬粉體。
- 如申請專利範圍第6項所述的表面處理的方法,其中該表面處理方法還包括在該二氧化矽凝膠層上形成一電泳漆層的步驟。
- 一種由經申請專利範圍第6-9中任一項所述的表面處理的方法製得的製品,該製品包括金屬基體及形成於金屬基體上的二氧化矽凝膠層,其中該二氧化矽凝膠層含有由正矽酸四乙酯聚集形成(O-Si-O)n的網路結構、2-二(三乙氧基矽基)乙烷及填充於該網路結構內的奈米級的二氧化矽粒子,2-二(三乙氧基矽基)乙烷與金屬基體鍵合形成Si-O-M鍵,部分2-二(三乙氧基矽基)乙烷相互連結和/或與正矽酸四乙酯發生交聯。
- 如申請專利範圍第10項所述的製品,其中該二氧化矽粒子的粒徑為10nm~20nm。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210521531.6A CN103848428A (zh) | 2012-12-07 | 2012-12-07 | 二氧化硅溶胶,应用该二氧化硅溶胶对金属基体进行表面处理的方法及其制品 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201427900A true TW201427900A (zh) | 2014-07-16 |
Family
ID=50856606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101147695A TW201427900A (zh) | 2012-12-07 | 2012-12-14 | 二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及其製品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140162052A1 (zh) |
CN (1) | CN103848428A (zh) |
TW (1) | TW201427900A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104974560B (zh) * | 2015-07-10 | 2017-06-30 | 佛山东鹏洁具股份有限公司 | 一种易于清洁且使用寿命长的五金洁具及其生产方法 |
CN105038336B (zh) * | 2015-07-10 | 2017-06-30 | 佛山东鹏洁具股份有限公司 | 一种涂覆于基材表面的无机纳米涂料及其制备和使用方法 |
CN107117622A (zh) * | 2017-04-01 | 2017-09-01 | 武汉理工大学 | 厚度可控在曲面生长二氧化硅薄膜材料的方法 |
CN108598051B (zh) * | 2018-04-11 | 2019-12-10 | 杭州牛墨科技有限公司 | 一种高导热的石墨烯碳纳米浆料及其制备方法 |
US11809648B2 (en) * | 2022-01-28 | 2023-11-07 | Tpk Advanced Solutions Inc. | Touch sensor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61197072A (ja) * | 1985-02-27 | 1986-09-01 | Kansai Paint Co Ltd | 塗膜形成方法 |
FR2680583B1 (fr) * | 1991-08-22 | 1993-10-08 | Commissariat A Energie Atomique | Materiau presentant des proprietes antireflet, hydrophobes et de resistance a l'abrasion et procede de depot d'une couche antireflet, hydrophobe et resistante a l'abrasion sur un substrat. |
US7070859B2 (en) * | 2002-06-21 | 2006-07-04 | Teijin Chemicals, Ltd. | Acrylic resin composition organosiloxane resin composition and laminate comprising the same |
US20050008861A1 (en) * | 2003-07-08 | 2005-01-13 | Nanoproducts Corporation | Silver comprising nanoparticles and related nanotechnology |
US8455088B2 (en) * | 2005-12-23 | 2013-06-04 | Boston Scientific Scimed, Inc. | Spun nanofiber, medical devices, and methods |
WO2009069111A2 (en) * | 2007-11-26 | 2009-06-04 | Dublin Institute Of Technology | Sol-gel coating compositions and their process of preparation |
-
2012
- 2012-12-07 CN CN201210521531.6A patent/CN103848428A/zh active Pending
- 2012-12-14 TW TW101147695A patent/TW201427900A/zh unknown
- 2012-12-20 US US13/721,654 patent/US20140162052A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN103848428A (zh) | 2014-06-11 |
US20140162052A1 (en) | 2014-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103628050B (zh) | 一种在金属表面制备石墨烯/硅烷复合薄膜的方法 | |
TW201427900A (zh) | 二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及其製品 | |
CN104031433B (zh) | 低导电鳞片石墨烯复合材料,其制备方法及其应用 | |
CN108817377B (zh) | 一种导电片状银包铜粉的制备方法 | |
Liu et al. | Corrosion protection of silane coatings modified by carbon nanotubes on stainless steel | |
JP5638935B2 (ja) | 金属微粒子分散液、透明導電性被膜形成用塗布液及び透明導電性被膜付基材 | |
LU100919B1 (en) | Metal-CNT composite, production method and materials therefor | |
JP2021185259A (ja) | 電気工学薄層の製造のための室温方法、その使用、及びこの方法で得られる薄層発熱システム | |
CN103305068A (zh) | 一种提高镁合金或铝合金氧化膜耐腐蚀性能的表面处理液及处理方法 | |
Zhang et al. | Robust superhydrophobic SiO2/epoxy composite coating prepared by one-step spraying method for corrosion protection of aluminum alloy: Experimental and theoretical studies | |
CN111117309A (zh) | 一种纳米封闭剂及其制备方法 | |
CN101892487B (zh) | 冷轧低碳钢板表面形成复合结构层的耐腐蚀处理方法 | |
Li et al. | Corrosion resistance and forming mechanism of the lauric acid/graphene composite films on aluminum alloy by electrodeposition | |
Tang et al. | Fabrication of ZnO–GO hybrid for enhancement of chemically bonded phosphate ceramic coatings corrosion protection performance on AISI304L stainless steel | |
CN111204782A (zh) | 亚硝酸根插层水滑石材料、水性树脂复合涂层及制备方法 | |
Huang et al. | Development of self-healing sol-gel anticorrosion coating with pH-responsive 1H-benzotriazole-inbuilt zeolitic imidazolate framework decorated with silica shell | |
Afsharimani et al. | Improving corrosion protection of Mg alloys (AZ31B) using graphene‐based hybrid coatings | |
TW201404716A (zh) | 二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及製品 | |
JP2015059271A (ja) | 表面品質に優れた多段階金属複合体の製造方法 | |
JP2009199775A (ja) | 白色導電粉末とその製造方法および用途 | |
KR20160012403A (ko) | 투명 전도성 그래핀 나노복합체 박막 및 이의 제조방법 | |
CN114621655A (zh) | 防腐涂层的制备方法、涂料、冠醚配合物作为防腐蚀涂料添加剂的应用 | |
KR101302720B1 (ko) | 두 가지 크기의 실리카 나노입자를 함유한 내스크래치성 실리카 보호막 형성용 코팅 조성물 및 이의 제조방법 | |
Wang et al. | Preparation and characterization of Ni–P/Ni3. 1B composite alloy coatings | |
TW201428029A (zh) | 聚二甲基矽氧烷溶膠,應用該聚二甲基矽氧烷溶膠對金屬基體進行表面處理的方法及製品 |