TW201427790A - Flux for protection elements, fuse element for protection elements, and circuit protection element - Google Patents
Flux for protection elements, fuse element for protection elements, and circuit protection element Download PDFInfo
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- TW201427790A TW201427790A TW102138395A TW102138395A TW201427790A TW 201427790 A TW201427790 A TW 201427790A TW 102138395 A TW102138395 A TW 102138395A TW 102138395 A TW102138395 A TW 102138395A TW 201427790 A TW201427790 A TW 201427790A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/048—Fuse resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
- H01H85/0065—Heat reflective or insulating layer on the fusible element
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- Fuses (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
Abstract
Description
本發明係關於保護元件用助熔劑、具有由該保護元件用助熔劑形成之助熔劑層之保護元件用熔絲元件、以及包括該保護元件用熔絲元件之電氣．電子機器之電路保護元件。 The present invention relates to a flux for a protective element, a fuse element for a protective element having a flux layer formed of the flux for the protective element, and an electrical fuse including the fuse element for the protective element. Circuit protection components for electronic machines.
近幾年，隨著行動機器等的小型電子機器的迅速的普及，構裝於搭載的電源的保護電路之保護元件，亦使用小型薄型者。例如，於二次電池包的保護電路，可良好地利用表面構裝零件(SMD)的保護元件。該等保護元件，感測因被保護機器的過電流所產生的過大發熱，或周圍溫度的異常過熱，以既定條件使熔絲作用將電路阻段之非復原型保護元件。該保護元件，為謀求機器的安全，當保護電路感測到機器所產生的異常，則藉由信號電流使阻抗元件發熱，以該熱使可融性的合金材料所組成的熔絲層熔斷將電路阻斷，或藉由過電流使熔絲層熔斷將電路阻斷。 In recent years, with the rapid spread of small electronic devices such as mobile devices, the protective elements of the protection circuits that are mounted on the mounted power supply are also small and thin. For example, in the protection circuit of the secondary battery pack, the protective member of the surface mount component (SMD) can be favorably utilized. The protection elements sense excessive heat generated by an overcurrent of the protected machine, or abnormal overheating of the ambient temperature, and the non-restorative protection element that causes the fuse to block the circuit under predetermined conditions. The protection element is for the safety of the machine. When the protection circuit senses an abnormality generated by the machine, the impedance element generates heat by the signal current, and the fuse fuses the fuse layer composed of the meltable alloy material. The circuit is blocked, or the fuse is blown by an overcurrent to block the circuit.
為確保該等保護元件的正常的熔斷，於熔絲層的表面塗佈有保護元件用助熔劑。但是，先前的保護元件用助熔劑，由於富於熱流動性，使保護元件暴露於構裝電路基板時之回焊爐等的熱環境下，則塗佈於熔絲層表面的助熔劑有流出， 留下極薄膜層由熔絲層表面消失之情形。助熔劑由熔絲層表面消失，則妨礙熔絲用合金的球狀熔斷，成為未熔斷或因殘留於熔絲用合金表面的氧化物等之拉絲等的熔斷不良的原因。 In order to ensure the normal melting of the protective elements, a flux for the protective element is applied to the surface of the fuse layer. However, the flux for the protective element of the prior art is exposed to the thermal environment of the reflow furnace or the like when the protective element is exposed to the circuit board due to the thermal fluidity, and the flux applied to the surface of the fuse layer flows out. , The situation in which the extremely thin film layer disappears from the surface of the fuse layer is left. When the flux disappears from the surface of the fuse layer, the fuse for the fuse is prevented from being spheroidally blown, and the fuse is not blown or is broken due to a blown wire such as an oxide remaining on the surface of the fuse alloy.
將助熔劑穩定地保持在既定的位置之技術，例如，於日本特開2010-003665號公報(專利文獻1)，揭示有，在於覆蓋保護元件的熔絲層的絕緣蓋構件，設置形成有將助熔劑保持在既定的位置之段部之突條部，使助熔劑與形成為環狀之段部與熔絲階層的中央部接觸塗佈，使用助熔劑與絕緣蓋構件的界面張力保持助熔劑的技術。 A technique of stably holding a flux in a predetermined position, for example, Japanese Laid-Open Patent Publication No. 2010-003665 (Patent Document 1) discloses an insulating cover member covering a fuse layer of a protective member. The flux is held at the ridge portion of the section at a predetermined position, and the flux is applied in contact with the central portion of the fuse layer formed in the annular portion, and the flux is maintained by the interfacial tension between the flux and the insulating cover member. Technology.
[專利文獻1]日本特開2010-003665號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-003665
先前的助熔劑，即使含有觸變劑，由於升溫至回焊溫度(最高溫度250~260℃)，則會失去觸變性而流動，無法保持形狀。因此，為限制在於熱環境下流動化的助熔劑的流出範圍，例如，專利文獻1所記載，需要使用在與熔絲層的中央部相對的絕緣蓋構件設置段部等特定的封裝構造。但是，特別是使用小型薄型封裝時，於絕緣蓋構件的中央部設置段部，則熔絲層熔斷時，由於絕緣蓋構件的段部使內部空間狹隘，而熔融的熔絲用合金被電極部擠出而將電極間架橋、或阻礙熔融的熔絲用合金對電極部之沾濕流動而成為熔斷不良的原因。即， 熔融狀態的熔絲用合金，係藉由表面張力將變熱的電極部沾濕向加熱之電極部集中成圓頂狀而熔斷，但設於蓋構件之段部．突條部限制該形成為圓頂狀的熔融合金的高度，剩餘的熔融合金向周邊溢出將電極間架橋而發生未熔斷的缺點。此外，將封裝的軀體或蓋體的一部分成形為特定形狀時，封裝的構造變複雜而有零件成本變高的缺點。 Even if the flux contains a thixotropic agent, the temperature rises to the reflow temperature (the highest temperature is 250 to 260 ° C), and the thixotropy is lost and flows, and the shape cannot be maintained. Therefore, in order to limit the outflow range of the flux which is fluidized in a hot environment, for example, as described in Patent Document 1, it is necessary to use a specific package structure such as a segment portion provided with an insulating cover member facing the central portion of the fuse layer. However, in particular, when a small-sized thin package is used, a segment portion is provided in a central portion of the insulating cover member, and when the fuse layer is blown, the inner space is narrowed by the segment portion of the insulating cover member, and the molten fuse alloy is subjected to the electrode portion. Extrusion and bridging between the electrodes or the alloy for the fuse that inhibits melting are caused by the wet flow of the electrode portion, which causes a failure in the fusion. which is, The alloy for fuse in the molten state is wetted by the surface tension and the electrode portion which is heated to the heated electrode portion is formed into a dome shape and is melted, but is provided in the segment of the cover member. The ridge portion restricts the height of the molten alloy formed in a dome shape, and the remaining molten alloy overflows to the periphery to bridge the electrodes and cause unmelted defects. Further, when a packaged body or a part of the cover is formed into a specific shape, the structure of the package becomes complicated, and the cost of parts becomes high.
本發明係為解除上述問題而提案，以提供在於使用於表面構裝型的電路保護元件的保護元件用助熔劑，不依保護元件的封裝的軀體或蓋體的形狀，即使該保護元件暴露在助熔劑會熔融的熱環境下，亦不會使塗佈於熔絲層表面的助熔劑，由熔絲層表面流出而失去之保護元件用助熔劑、使用此之保護元件用熔絲、以及電路保護元件為目標。 The present invention has been made to solve the above problems, and to provide a flux for a protective element for use in a surface-protected circuit protection element, not depending on the shape of the body or cover of the package of the protective element, even if the protective element is exposed to help In the hot environment in which the flux melts, the flux applied to the surface of the fuse layer, the flux for protecting the component which is lost from the surface of the fuse layer, the fuse for the protective component, and the circuit protection are not protected. The component is the target.
本發明提供一種保護元件用助熔劑，其包含：助熔劑基材，其包含熱熔性樹脂及活性劑；及由無機粒子組成之保持劑。上述助熔劑基材，進一步包含觸變劑。 The present invention provides a flux for a protective element comprising: a flux base material comprising a hot melt resin and an active agent; and a retaining agent composed of inorganic particles. The flux substrate further includes a thixotropic agent.
上述熱熔性樹脂，包含選自由天然松脂、聚合松脂、酸變性松脂及加氫松脂所組成之群之至少一個為佳。 The hot-melt resin preferably contains at least one selected from the group consisting of natural turpentine, polymeric turpentine, acid-modified rosin, and hydrogenated turpentine.
上述活性劑，包含選自由有機酸類、有機酸醯胺鹽類及鹵化氫酸醯胺鹽類所組成之群之至少一個為佳。 The active agent preferably contains at least one selected from the group consisting of organic acids, organic acid guanamine salts, and guanidinium hydrogen halide salts.
上述無機粒子，包含選自由玻璃粉、陶瓷粉、碳酸鈣、滑石粉、二氧化矽、氧化鋁、高嶺土、氧化鈦、雲母及蒙脫土所組成之群之至少一個為佳。 The inorganic particles preferably include at least one selected from the group consisting of glass frit, ceramic powder, calcium carbonate, talc, ceria, alumina, kaolin, titanium oxide, mica, and montmorillonite.
上述無機粒子，體積平均粒徑(D50)以0.01~10μm 的範圍為佳。 The inorganic particles preferably have a volume average particle diameter (D 50 ) in the range of 0.01 to 10 μm.
上述保持材，對上述助熔劑基材以0.5~70質量%的範圍含有為佳。 The above-mentioned holding material is preferably contained in the range of 0.5 to 70% by mass of the flux base material.
此外，本發明提供一種保護元件用熔絲元件，其包括：熔絲層；及設於熔絲層表面的助熔劑層，助熔劑層係由上述保護元件用助熔劑組成。 Further, the present invention provides a fuse element for a protective element comprising: a fuse layer; and a flux layer provided on a surface of the fuse layer, the flux layer being composed of the flux for the protective element.
此外，本發明提供一種電路保護元件，其包括：絕緣基板；設於絕緣基板表面之圖案電極；及電性連接於電極之熔絲元件，上述熔絲元件，具有：熔絲層；及設於熔絲層表面之助熔劑層，助熔劑層係由上述保護元件用助熔劑組成。 In addition, the present invention provides a circuit protection component including: an insulating substrate; a pattern electrode disposed on a surface of the insulating substrate; and a fuse element electrically connected to the electrode, the fuse element having: a fuse layer; The flux layer on the surface of the fuse layer, the flux layer is composed of the flux for the above protective element.
上述電路保護元件，亦可為進一步具有設於絕緣基板表面之阻抗發熱元件之構成。 The circuit protection component may further include an impedance heating element provided on a surface of the insulating substrate.
根據本發明，藉由對保護元件用助熔劑添加由無機粒子所組成之保持劑，將助熔劑塗佈於熔絲層形成熔絲元件時，即使助熔劑在熱環境下融解成液狀時，亦可預防助熔劑由熔絲層流出。因此，無須巧思電路保護元件的構成，即可防止助熔劑流出，可使助熔劑在熔絲元件熔斷時充分作用，使熔絲元件迅速且穩定地熔斷。 According to the present invention, when a flux is applied to a fuse layer to form a fuse element by adding a flux composed of inorganic particles to a flux for a protective element, even if the flux is melted into a liquid state in a hot environment, It is also possible to prevent the flux from flowing out of the fuse layer. Therefore, the flux can be prevented from flowing out without the ingenious circuit protection component, and the flux can be sufficiently acted upon when the fuse element is blown, so that the fuse element is quickly and stably blown.
10‧‧‧熔絲元件 10‧‧‧Fuse components
11‧‧‧熔絲層 11‧‧‧Fuse layer
12‧‧‧助熔劑層 12‧‧‧ Flux layer
30、40‧‧‧電路保護元件 30, 40‧‧‧ circuit protection components
33、43‧‧‧絕緣基板 33, 43‧‧‧Insert substrate
34、44‧‧‧圖案電極 34, 44‧‧‧ pattern electrode
36、46‧‧‧蓋狀蓋體 36, 46‧‧‧ cover-like cover
39、49‧‧‧導電圖案 39, 49‧‧‧ conductive patterns
38、48‧‧‧發熱阻抗體 38, 48‧‧‧Heat resistors
第1圖係示意表示第1實施形態之保護元件用熔絲元件的立體圖。 Fig. 1 is a perspective view schematically showing a fuse element for a protective element according to a first embodiment.
第2圖係示意表示第2實施形態之電路保護元件之構成之 圖，第2圖(a)係上面之示意圖、第2圖(b)係縱剖面圖、第2圖(c)係下面的示意圖。 Fig. 2 is a view schematically showing the configuration of a circuit protection element of a second embodiment; Fig. 2(a) is a schematic view of the upper part, Fig. 2(b) is a longitudinal sectional view, and Fig. 2(c) is a schematic view of the lower part.
第3圖係示意表示第3實施形態之電路保護元件之構成之圖，第3圖(a)係上面之示意圖、第3圖(b)係縱剖面圖、第3圖(c)係下面的示意圖。 Fig. 3 is a view schematically showing the configuration of a circuit protection element according to a third embodiment, wherein Fig. 3(a) is a schematic view of the top, Fig. 3(b) is a longitudinal sectional view, and Fig. 3(c) is a lower view. schematic diagram.
[保護元件用助熔劑] [Fuse for protective components]
本發明的保護元件用助熔劑，包含：助熔劑基材，其包含熱熔性樹脂及活性劑；及由無機粒子組成之保持劑。構成保持劑之無機粒子，係絕緣性且對助熔劑基材不溶不融性為佳。保護元件用助熔劑，在於熔絲元件，塗佈於熔絲層的表面，形成助熔劑層。助熔劑層，具有熔絲層表面的氧化防止作用的同時，亦具有熔絲層因周圍溫度的上升而熔融時使熔融之熔絲層迅速且穩定地熔斷的活性作用。助熔劑基材，係於熔絲層熔融的溫度，最好是藉由熔融或軟化，發揮更優良的活性作用。因此，助熔劑基材的熔點或軟化點，較熔絲層的熔點更低為佳。 The flux for a protective element of the present invention comprises: a flux base material comprising a hot melt resin and an active agent; and a retaining agent composed of inorganic particles. The inorganic particles constituting the retaining agent are insulative and are insoluble and infusible to the flux substrate. A flux for the protective element, which is a fuse element, is applied to the surface of the fuse layer to form a flux layer. The flux layer has an oxidation preventing effect on the surface of the fuse layer, and also has an active action of rapidly and stably melting the molten fuse layer when the fuse layer is melted due to an increase in the ambient temperature. The flux substrate is at a temperature at which the fuse layer is melted, and is preferably melted or softened to exert a more excellent activity. Therefore, the melting point or softening point of the flux substrate is preferably lower than the melting point of the fuse layer.
助熔劑基材，於室溫係固體狀或糊狀。關於本發明之助熔劑，藉由與助熔劑基材一起包含由無機粒子所組成之保持劑，即使助熔劑基材在熱環境下熔融成液態，亦可防止助熔劑基材，由熔絲層的表面流出而失去。此可解釋為助熔劑基材藉由成為液態的助熔劑基材的界面張力保持在保持劑的間隙。藉由防止助熔劑基材由熔絲層的表面流出，助熔劑在熔絲元件熔斷時作用，可使熔絲元件迅速且穩定地熔斷。 The flux substrate is solid or pasty at room temperature. With regard to the flux of the present invention, by including a retaining agent composed of inorganic particles together with the flux base material, the flux base material can be prevented from being formed by the fuse layer even if the flux base material is melted into a liquid state in a hot environment. The surface flows out and is lost. This can be explained by the fact that the flux substrate is maintained in the gap of the retaining agent by the interfacial tension of the flux substrate which becomes a liquid. By preventing the flux substrate from flowing out of the surface of the fuse layer, the flux acts when the fuse element is blown, so that the fuse element can be quickly and stably blown.
上述熱熔性樹脂，包含例如選自由天然松脂、聚 合松脂、酸變性松脂及加氫松脂所組成之群之至少一個為佳。上述活性劑，包含例如選自由有機酸類、有機酸醯胺鹽類及鹵化氫酸醯胺鹽類所組成之群之至少一個為佳。 The above hot-melt resin contains, for example, selected from natural turpentine, poly At least one of a group consisting of rosin, acid-modified rosin, and hydrogenated rosin is preferred. The active agent contains, for example, at least one selected from the group consisting of organic acids, organic acid guanamine salts, and guanidinium hydrogen halide salts.
上述無機粒子，係絕緣性，且對助熔劑基材不溶不融性為佳。上述無機粒子，包含選自由玻璃粉、陶瓷粉、碳酸鈣、滑石粉、二氧化矽、氧化鋁、高嶺土、氧化鈦、雲母及蒙脫土所組成之群之至少一個為佳。上述無機粒子的表面，為容易混合添加於助熔劑基材中，亦可以脂肪酸類、樹脂酸類、蠟類、磷酸化合物、矽烷偶合劑等施以表面修飾。上述無機粒子之體積平均粒徑(D50)以0.01~10μm為佳，以0.01~1.5μm的範圍更佳。無機粒子的體積平均粒徑(D50)為0.01~1.5μm時，不會有粒子分離，分散狀態的穩定性良好而佳。 The inorganic particles are insulative and are insoluble and insoluble to the flux substrate. The inorganic particles preferably include at least one selected from the group consisting of glass frit, ceramic powder, calcium carbonate, talc, ceria, alumina, kaolin, titanium oxide, mica, and montmorillonite. The surface of the inorganic particles may be added to the flux base material for easy mixing, and may be surface-modified with a fatty acid, a resin acid, a wax, a phosphoric acid compound, a decane coupling agent or the like. The volume average particle diameter (D 50 ) of the inorganic particles is preferably 0.01 to 10 μm, more preferably 0.01 to 1.5 μm. When the volume average particle diameter (D 50 ) of the inorganic particles is 0.01 to 1.5 μm, the particles are not separated, and the stability in the dispersed state is good.
關於本發明之保護元件用助熔劑，其他，亦可適宜添加調整流動性的觸變劑、使熔融時之流動性變好的界面活性劑、氧化防止劑等，亦可藉由溶劑稀釋。觸變劑，可使用例如，高級脂肪酸醯胺類、加氫高級脂肪酸酯類、加氫高級脂肪酸類、氣相二氧化矽類等，可良好地使用可以相對較低溫域的溫度70~140℃的範圍調整流動性的觸變劑為佳。觸變劑的具體例，可舉硬脂酸醯胺、十四烷酸異丙酯、二十二酸等。溶劑，可良好地使用石油系烴類、乙二醇酯類、有機酸酯類等的高沸點溶劑。 The flux for the protective element of the present invention may be added with a thixotropic agent for adjusting fluidity, a surfactant for improving fluidity during melting, an oxidation preventive agent, or the like, or may be diluted with a solvent. As the thixotropic agent, for example, a higher fatty acid guanamine, a hydrogenated higher fatty acid ester, a hydrogenated higher fatty acid, a gas phase cerium oxide, or the like can be used, and the temperature can be favorably used in a relatively low temperature range of 70 to 140 ° C. The range of thixotropic agents that adjust the mobility is preferred. Specific examples of the thixotropic agent include decyl stearate, isopropyl myristate, and behenic acid. As the solvent, a high boiling point solvent such as petroleum hydrocarbons, ethylene glycol esters or organic acid esters can be preferably used.
關於本發明之保護元件用助熔劑，包含助熔劑基材及保持劑，助熔劑基材中的調合比例，係例如，熱塑性樹脂10~90質量%，以30~70質量%為佳，活性劑0.1~60質量%， 以5~30質量%為佳。保持劑，對助熔劑基材100質量%，例如可調合0.5~70質量%，以0.5~30質量%的範圍調合為佳。此外，觸變劑，係於助熔劑基材中，以5~40質量%的範圍調合為佳。 The flux for a protective element of the present invention includes a flux base material and a retaining agent, and a blending ratio in the flux base material is, for example, 10 to 90% by mass of the thermoplastic resin, preferably 30 to 70% by mass, and an active agent. 0.1~60% by mass, It is preferably 5 to 30% by mass. The retaining agent is preferably blended in an amount of 0.5 to 70% by mass, for example, in an amount of 0.5 to 30% by mass, based on 100% by mass of the flux base material. Further, the thixotropic agent is preferably added to the flux base material in a range of 5 to 40% by mass.
[保護元件用熔絲元件] [Fuse element for protective components]
本發明之熔絲元件，包括：熔絲層；及設於熔絲層表面之助熔劑層。熔絲元件的形狀，並無限定，例如，板狀體，棒狀體等。助熔劑層，係於熔絲元件配置於電路保護元件時，設於熔絲層表面之中，不會與電路保護元件的電極圖案接觸的表面。 The fuse element of the present invention comprises: a fuse layer; and a flux layer disposed on the surface of the fuse layer. The shape of the fuse element is not limited, and is, for example, a plate-like body, a rod-shaped body, or the like. The flux layer is a surface that is disposed on the surface of the fuse layer and that does not contact the electrode pattern of the circuit protection element when the fuse element is disposed on the circuit protection element.
助熔劑層，係使用上述保護元件用助熔劑形成，例如，可藉由將上述保護元件用助熔劑，以任意的方法，塗佈在熔絲層的表面而形成。 The flux layer is formed using the flux for the protective element described above, and can be formed, for example, by applying the flux to the surface of the fuse layer by an arbitrary method.
助熔劑，可塗佈於熔絲層表面的全面使用，亦可在熔絲層的表面中央部如堆土設置，僅部分轉印。即使是部分轉印，藉由包含於助熔劑之保持劑所形成的推土之頂作用作為支持液狀助熔劑表面的凸狀頂點，可防止助熔劑基材由熔絲層表面流出。此外，藉由部分轉印，滲出的液狀助熔劑基材會在熔絲層的表面自我擴張披覆，故可更有效地進行塗佈作業。藉由防止助熔劑基材由熔絲層表面流出，於熔絲元件熔斷時，助熔劑作用，而可使熔絲元件迅速且穩定地熔斷。 The flux may be applied to the entire surface of the fuse layer, or may be disposed at the central portion of the surface of the fuse layer, such as a pile, and only partially transferred. Even in the case of partial transfer, the topping of the doping formed by the flux-containing retaining agent serves as a convex apex for supporting the surface of the liquid flux, and the flux substrate can be prevented from flowing out from the surface of the fuse layer. Further, by partial transfer, the oozing liquid flux base material self-expands and coats on the surface of the fuse layer, so that the coating operation can be performed more efficiently. By preventing the flux substrate from flowing out of the surface of the fuse layer, the flux acts when the fuse element is blown, and the fuse element can be quickly and stably blown.
可使用於熔絲層之金屬，例如，以20Sn-80Au合金、55Sn-45Sb合金、含有80質量%以上的Pb之Pb-Sn合金等為佳。各元素符號前的數字係表示合金之調合率(重量%)。熔絲層，可為單層、多層之任一，以單層組成為佳。 The metal to be used for the fuse layer is preferably, for example, a 20Sn-80Au alloy, a 55Sn-45Sb alloy, or a Pb-Sn alloy containing 80% by mass or more of Pb. The number before the symbol of each element indicates the blending ratio (% by weight) of the alloy. The fuse layer may be either a single layer or a plurality of layers, and a single layer composition is preferred.
本發明之熔絲元件，係設在組入外部電路之電路保護元件使用者。當外部電路發生異常，而外部電路的溫度上升時，熔絲元件將起因於該異常溫度而熔斷，使外部電路的動作緊急停止。斷熔絲元件的溶化溫度，可藉由適宜選擇熔絲層的材料而調整，例如，可設定於247℃以上296℃以下。 The fuse element of the present invention is provided to a user of a circuit protection component incorporated in an external circuit. When an abnormality occurs in the external circuit and the temperature of the external circuit rises, the fuse element is blown due to the abnormal temperature, and the operation of the external circuit is stopped urgently. The melting temperature of the broken fuse element can be adjusted by appropriately selecting the material of the fuse layer, and can be set, for example, at 247 ° C or higher and 296 ° C or lower.
(第1實施形態) (First embodiment)
第1圖係示意表示第1實施形態之保護元件用熔絲元件之立體圖。如第1圖所示，熔絲元件10係板狀體，包括：板狀的熔絲層11；及覆蓋熔絲層11之一方的表面之助熔劑層12。熔絲元件10之厚度，由搭載之電路保護元件的小型化．薄型化的觀點，以64μm~300μm為佳，以80μm~110μm更佳。 Fig. 1 is a perspective view schematically showing a fuse element for a protective element according to a first embodiment. As shown in Fig. 1, the fuse element 10 is a plate-like body including a plate-shaped fuse layer 11 and a flux layer 12 covering one surface of the fuse layer 11. The thickness of the fuse element 10 is miniaturized by the mounted circuit protection component. The viewpoint of thinning is preferably 64 μm to 300 μm, more preferably 80 μm to 110 μm.
助熔劑，只要是具有防止熔絲層11表面的氧化作用的同時，以可發揮使熔絲層11因周圍溫度的上升而熔融時，可使熔融之熔絲層11迅速且穩定地熔斷之活性作用的量塗佈形成之助熔劑層12者，其量並無特別限定。助熔劑層12，例如，可以5~60μm之厚度塗佈。 The flux is capable of rapidly and stably melting the molten fuse layer 11 as long as it has an oxidation preventing action on the surface of the fuse layer 11 and melting the fuse layer 11 due to an increase in the ambient temperature. The amount of the action is applied to the flux layer 12 formed, and the amount thereof is not particularly limited. The flux layer 12 can be applied, for example, in a thickness of 5 to 60 μm.
[電路保護元件] [circuit protection component]
(第2實施形態) (Second embodiment)
第2圖係表示第2實施形態之電路保護元件的構成之圖。第2圖(a)係表示上面之示意圖、第2圖(b)係縱剖面圖、第2圖(c)係表示下面之示意圖。第2圖(a)係相當於第2圖(b)之d-d剖面圖、第2圖(b)係相當於第2圖(a)或(c)之D-D剖面圖。第2圖所示電路保護元件30，包括：絕緣基板33；設於絕緣基板33表面之圖案電極34；接合於圖案電極34，與圖案電極34 電性連接之熔絲元件10；披覆熔絲元件10之蓋狀蓋體36。此外，於絕緣基板33的背面，設有：導電圖案39；及與導電圖案39電性連接之發熱阻抗體38。作為元件熔絲10，表示使用第1圖所示之第1實施形態之熔絲元件10之情形。 Fig. 2 is a view showing the configuration of the circuit protection element of the second embodiment. Fig. 2(a) is a schematic view of the above, Fig. 2(b) is a longitudinal sectional view, and Fig. 2(c) is a schematic view showing the following. Fig. 2(a) corresponds to a d-d cross-sectional view of Fig. 2(b), and Fig. 2(b) corresponds to a D-D cross-sectional view of Fig. 2(a) or (c). The circuit protection component 30 shown in FIG. 2 includes: an insulating substrate 33; a pattern electrode 34 provided on the surface of the insulating substrate 33; bonded to the pattern electrode 34, and the pattern electrode 34 The fuse element 10 is electrically connected; the lid cover 36 of the fuse element 10 is covered. Further, on the back surface of the insulating substrate 33, a conductive pattern 39 and a heat generating resistor 38 electrically connected to the conductive pattern 39 are provided. The element fuse 10 is a case where the fuse element 10 of the first embodiment shown in Fig. 1 is used.
絕緣基板33，係由耐熱性的絕緣基板，例如玻璃環氧基板、BT(Bismalemide Triazine：雙馬來醯亞胺三嗪)基板、特氟龍(註冊商標)基板、陶瓷基板、玻璃基板等組成。絕緣基板33的厚度，例如為0.20mm以上0.40mm以下。 The insulating substrate 33 is made of a heat-resistant insulating substrate such as a glass epoxy substrate, a BT (Bismalemide Triazine) substrate, a Teflon (registered trademark) substrate, a ceramic substrate, or a glass substrate. . The thickness of the insulating substrate 33 is, for example, 0.20 mm or more and 0.40 mm or less.
圖案電極34，係於絕緣基板33的表面以任意圖案形成，經由設於形成在絕緣基板33的側面之半通孔的端子37a、37b與外部電路連接。圖案電極34，係形成對熔絲元件10流放電流，而熔絲元件10熔斷時，成為電性斷開。圖案電極34，係例如由鎢、鉬、鎳、銅、銀、金或鋁等的金屬材料、或該等的合金、或將該等的材料之中的複數材料混合之複合系材料、或該等材料的複合層所組成。 The pattern electrode 34 is formed in an arbitrary pattern on the surface of the insulating substrate 33, and is connected to an external circuit via terminals 37a and 37b provided in a half-via formed in the side surface of the insulating substrate 33. The pattern electrode 34 forms a current for discharging the fuse element 10, and when the fuse element 10 is blown, it is electrically disconnected. The pattern electrode 34 is, for example, a metal material such as tungsten, molybdenum, nickel, copper, silver, gold or aluminum, or a composite material of the alloy or a plurality of materials among the materials, or It consists of a composite layer of materials.
發熱阻抗體38，係經由設於半通孔之端子39a、39b連接組入外部電路之外部電路之異常偵測器。藉由異常偵測器偵測外部電路的異常，經由端子39a、39b及導電圖案39對發熱阻抗體38通電，使發熱阻抗體38的溫度上升。結果，起因於發熱阻抗體38的溫度上升，使熔絲元件10熔斷。再者，導電圖案39，係與熔絲元件10接觸地設於絕緣基板33的表面，可高效地將發熱阻抗體38的溫度傳導至熔絲元件10。於本實施形態，採用將形成於正反面之圖案電極34或導電圖案39經由設於半通孔的端子37a、37b、39a、39b電性連接之構 成，惟亦可取代半通孔，採用貫通絕緣基板33之導體通孔，或以平面電極圖案之表面配線。 The heating resistor 38 is connected to an abnormality detector that is connected to an external circuit of the external circuit via terminals 39a and 39b provided in the half-via. When the abnormality detector detects an abnormality of the external circuit, the heat generating resistor 38 is energized via the terminals 39a and 39b and the conductive pattern 39 to increase the temperature of the heat generating resistor 38. As a result, the fuse element 10 is blown due to an increase in the temperature of the heat generating resistor 38. Further, the conductive pattern 39 is provided on the surface of the insulating substrate 33 in contact with the fuse element 10, and the temperature of the heat generating resistor 38 can be efficiently conducted to the fuse element 10. In the present embodiment, the pattern electrodes 34 or the conductive patterns 39 formed on the front and back surfaces are electrically connected via the terminals 37a, 37b, 39a, and 39b provided in the half via holes. Alternatively, instead of the half-via, the conductor through-holes penetrating the insulating substrate 33 or the surface of the planar electrode pattern may be used.
發熱阻抗體38，係例如由鎢、銀、鈀、釕、鉛、硼、鋁等的金屬材料、或該等的合金或氧化物、複數材料的複合系材料、或該等材料的複合層所組成。於發熱阻抗體38的表面，亦可施以絕緣塗層。 The heat-resistant resistor 38 is, for example, a metal material such as tungsten, silver, palladium, rhodium, lead, boron, or aluminum, or a composite material of the alloy or oxide, a plurality of materials, or a composite layer of the materials. composition. An insulating coating may be applied to the surface of the heat-resistant resistor 38.
蓋狀蓋體36，係將絕緣基板33及熔絲元件10由上方披覆保持所期望的空間即可，形狀．材質並無限定，可例如由圓頂狀樹脂薄膜材、塑膠材、陶瓷材所組成。 The lid-shaped cover 36 is formed by holding the insulating substrate 33 and the fuse element 10 from above to maintain a desired space. The material is not limited, and may be composed of, for example, a dome-shaped resin film material, a plastic material, or a ceramic material.
本發明的電路保護元件，係組入外部電路使用者。當外部電路發生異常，使外部電路的溫度上升，則起因於該異常溫度，熔絲元件10會熔斷，而將外部電路的動作緊急停止。 The circuit protection component of the present invention is incorporated into an external circuit user. When an abnormality occurs in the external circuit and the temperature of the external circuit rises, the fuse element 10 is blown due to the abnormal temperature, and the operation of the external circuit is stopped urgently.
電路保護元件30之製造方法之一例，具有：準備於表面設有圖案電極34之絕緣基板33，具有熔絲層11及披覆熔絲層11之一方的表面的助熔劑層12之熔絲元件10之步驟(St10)；經由焊錫材料使圖案電極34與熔絲元件10接觸的狀態，加熱至焊錫材料的熔融溫度，將圖案電極34與熔絲元件10接合電性連接之接合步驟(St20)；將熔絲元件10以蓋狀蓋體36覆蓋封裝之封裝步驟(St30)。 An example of a method of manufacturing the circuit protection element 30 includes: an insulating substrate 33 provided with a pattern electrode 34 on its surface, and a fuse element having a fuse layer 11 and a surface of the flux layer 12 covering one surface of the fuse layer 11 Step 10 (St10); a state in which the pattern electrode 34 is brought into contact with the fuse element 10 via a solder material, heated to a melting temperature of the solder material, and a bonding step of electrically connecting the pattern electrode 34 and the fuse element 10 (St20) The package step (St30) of covering the package with the fuse element 10 with the cover-like cover 36.
使用於接合步驟(St20)之加熱手段並無特別限定，只要是可加熱至接合圖案電極34與熔絲元件10之焊錫材料的溫度的手段，以任何方法、裝置均可。例如，可良好地使用以高溫批次爐的加熱，使用加熱盤的加熱，使用回焊爐的加 熱等。在於接合步驟(St20)，由於會加熱至較接合熔絲元件10與圖案電極34之焊錫材料的熔點高的溫度，故有使設於熔絲元件10之助熔劑層12之助熔劑基材熔融的可能性，但由於在助熔劑層12包含保持劑，故可防止助熔劑基材的流出。 The heating means used in the bonding step (St20) is not particularly limited as long as it can be heated to the temperature of the solder material of the bonding pattern electrode 34 and the fuse element 10, and any method or apparatus can be used. For example, it is possible to use the heating of a high temperature batch furnace well, the heating using a heating plate, and the use of a reflow furnace. Hot, etc. In the bonding step (St20), since the temperature is higher than the melting point of the solder material of the bonding fuse element 10 and the pattern electrode 34, the flux substrate provided on the flux layer 12 of the fuse element 10 is melted. The possibility, but since the flux layer 12 contains a retaining agent, the outflow of the flux substrate can be prevented.
再者，在於本實施形態，表示作為熔絲元件10使用預先設置助熔劑層12者製造電路保護元件30之方法，惟亦可在於接合步驟(St20)，僅將不具有助熔劑層12之熔絲層11接合在圖案電極34，之後在封裝步驟(St30)之前，設置於熔絲層11的表面上塗佈助熔劑形成助熔劑層12之助熔劑塗佈步驟(St21)。電路保護元件30，雖然熔絲元件10不會熔斷，但有使助熔劑層12暴露在會熔融的高溫環境下的可能性，因此，藉由本發明的助熔劑形成助熔劑層12，藉由包含於助熔劑之保持劑，將熔融的助熔劑基材保持在熔絲層11表面，故可防止助熔劑層12在熔絲元件10之溶斷前消失。 Further, in the present embodiment, a method of manufacturing the circuit protection element 30 using the flux layer 12 in advance as the fuse element 10 is shown, but it is also possible to use the bonding step (St20) to melt only the flux layer 12. The wire layer 11 is bonded to the pattern electrode 34, and then a flux coating step (St21) of applying a flux to form the flux layer 12 on the surface of the fuse layer 11 before the packaging step (St30). The circuit protection component 30, although the fuse element 10 is not blown, has the possibility of exposing the flux layer 12 to a high temperature environment which will melt, and therefore, the flux layer 12 is formed by the flux of the present invention, by including In the flux retaining agent, the molten flux substrate is held on the surface of the fuse layer 11, so that the flux layer 12 can be prevented from disappearing before the fuse element 10 is dissolved.
(第3實施形態) (Third embodiment)
第3圖係表示第3實施形態之電路保護元件之構成之圖。第3圖(a)係上面的示意圖、第3圖(b)係縱剖面圖、第3圖(c)係下面的示意圖。第3圖(a)係相當於第3圖(b)之d-d剖面圖、第3圖(b)係相當於第3圖(a)或(c)之D-D剖面圖。示於第3圖之電路保護元件40，包括：絕緣基板43；設於絕緣基板43表面之圖案電極44；接合於圖案電極44，與圖案電極44電性連接之熔絲元件10；及覆蓋熔絲元件10之蓋狀蓋體46。此外，於絕緣基板43表面的熔絲元件10之下側，設有導電圖案49，及與導電圖案49電性連接之發熱阻抗體48。熔絲元件10與圖 案電極44接合，則成與阻抗發熱體48接觸的狀態。在於第3圖，表示作為熔絲元件10，使用第1圖所示之第1實施形態之熔絲元件10之情形。 Fig. 3 is a view showing the configuration of the circuit protection element of the third embodiment. Fig. 3(a) is a schematic view of the upper part, Fig. 3(b) is a longitudinal sectional view, and Fig. 3(c) is a schematic view of the lower part. Fig. 3(a) corresponds to a d-d cross-sectional view of Fig. 3(b), and Fig. 3(b) corresponds to a D-D cross-sectional view of Fig. 3(a) or (c). The circuit protection component 40 shown in FIG. 3 includes: an insulating substrate 43; a pattern electrode 44 disposed on the surface of the insulating substrate 43; a fuse element 10 bonded to the pattern electrode 44 and electrically connected to the pattern electrode 44; A lid-like cover 46 of the wire element 10. Further, on the lower side of the fuse element 10 on the surface of the insulating substrate 43, a conductive pattern 49 and a heat generating resistor 48 electrically connected to the conductive pattern 49 are provided. Fuse element 10 and figure When the case electrode 44 is joined, it is in a state of being in contact with the impedance heat generating body 48. Fig. 3 shows a case where the fuse element 10 of the first embodiment shown in Fig. 1 is used as the fuse element 10.
圖案電極44，係於絕緣基板43的表面以任意圖案形成，經由設於形成在絕緣基板43側面之半通孔之端子47a、47b與外部電路連接。圖案電極44，係形成對熔絲元件10流放電流，而熔絲元件10熔斷時，為為電性斷開。此外，發熱阻抗體48係經由設於半通孔之端子49a、49b連接組入外部電路之異常偵測器。藉由異常偵測器偵測外部電路的異常，經由端子49a、49b及導電圖案49對發熱阻抗體48通電，使發熱阻抗體48的溫度上升。結果，起因於發熱阻抗體48的溫度上升，使熔絲元件10熔斷。 The pattern electrode 44 is formed in an arbitrary pattern on the surface of the insulating substrate 43, and is connected to an external circuit via terminals 47a and 47b provided in a half-via formed in the side surface of the insulating substrate 43. The pattern electrode 44 is formed to discharge current to the fuse element 10, and is electrically disconnected when the fuse element 10 is blown. Further, the heating resistor 48 is connected to an abnormality detector incorporated in an external circuit via terminals 49a and 49b provided in the half-via. The abnormality detector detects an abnormality of the external circuit, energizes the heat generating resistor 48 via the terminals 49a and 49b and the conductive pattern 49, and raises the temperature of the heat generating resistor 48. As a result, the fuse element 10 is blown due to an increase in the temperature of the heat generating resistor 48.
第3實施形態之電路保護元件40，與第2實施形態之電路保護元件30，只有發熱阻抗體48設於絕緣基板的表面上之點不同。再者，作為第2實施形態及第3實施形態，表示包括發熱阻抗體之電路保護元件，惟本發明之電路保護元件，亦可為不具有發熱阻抗體之構成。 The circuit protection element 40 of the third embodiment differs from the circuit protection element 30 of the second embodiment in that the heat generating resistor 48 is provided on the surface of the insulating substrate. Further, as the second embodiment and the third embodiment, the circuit protection element including the heat generating resistor is shown. However, the circuit protection element of the present invention may have a configuration without a heat generating resistor.
[實施例] [Examples]
[評估試驗1] [Evaluation Test 1]
作為評估試驗1，準備僅由助熔劑基材A構成之供試助熔劑1-1，及對100質量%的助熔劑基材A，調合10質量%的保持劑(無定形粒狀CaCO3，第1表所示之體積平均粒徑(D50))之供試助熔劑1-2~1-8，再者，準備僅由助熔劑基材B構成之供試助熔劑1-9，進行分散穩定性、回焊2次後的外觀、熔斷動 作的評估。 As evaluation test 1, a test flux 1-1 composed only of the flux base material A was prepared, and 10% by mass of a retaining agent (amorphous granular CaCO 3 was blended with respect to 100% by mass of the flux base material A, The test fluxes 1-2 to 1-8 of the volume average particle diameter (D 50 ) shown in Table 1 are prepared, and further, the test fluxes 1-9 composed of only the flux base material B are prepared. Dispersion stability, appearance after reflow soldering 2, evaluation of fusing action.
(助熔劑基材A) (flux substrate A)
助熔劑基材A，係以如下調合量混合各成分而調製。 The flux base material A was prepared by mixing the components in the following blending amounts.
(助熔劑基材B) (flux substrate B)
助熔劑基材B，係以如下調合量混合各成分而調製。 The flux base material B was prepared by mixing the components in the following blending amounts.
(分散穩定性) (dispersion stability)
將各供試助熔劑分別對試管填充20ml，觀察以80℃靜置48小時之後的外觀，如下評估。將結果示於第1表。 Each test flux was filled with 20 ml of a test tube, and the appearance after standing at 80 ° C for 48 hours was observed and evaluated as follows. The results are shown in the first table.
A：良好、 B：微量沈澱、 C：粒子分離。 A: Good, B: microprecipitation, C: particle separation.
(回焊2次後的外觀) (appearance after reflowing 2 times)
準備將各供試助熔劑0.75mg使用於第2圖所示之第2實施形態之電路保護元件30之供試電路保護元件，將各供試電路保護元件以180℃預熱60秒，以回焊溫度225℃30秒、以內峰溫度250℃12秒以內的溫度輪廓，通過2次回焊爐之後，確認塗佈於熔絲層之助熔劑是否流出至絕緣基板33的表面，如下評估。將結果示於第1表。 0.75 mg of each test flux was used for the test circuit protection element of the circuit protection element 30 of the second embodiment shown in Fig. 2, and each test circuit protection element was preheated at 180 ° C for 60 seconds. The welding temperature was 225 ° C for 30 seconds, and the temperature profile within the inner peak temperature of 250 ° C for 12 seconds passed through the secondary reflow furnace, and it was confirmed whether or not the flux applied to the fuse layer flowed out to the surface of the insulating substrate 33 as follows. The results are shown in the first table.
A：沒有助熔劑的流出、 B：有助熔劑的流出。 A: There is no fluxing out, B: There is flux outflow.
(熔斷動作) (fuse action)
準備將各供試助熔劑0.75mg使用於第2圖所示之第2實施形態之電路保護元件30之供試電路保護元件，對電路保護元件30之阻抗發熱元件38施加7W計測直到熔絲元件10熔斷之動作時間。同時，確認是否可正常地熔斷(正常或不合格)。將結果示於第1表。 0.75 mg of each test flux is used for the test circuit protection element of the circuit protection element 30 of the second embodiment shown in Fig. 2, and 7W measurement is applied to the impedance heating element 38 of the circuit protection element 30 until the fuse element 10 blow action time. Also, confirm if it can be blown normally (normal or unqualified). The results are shown in the first table.
由第1表所示結果可知，不包含保持劑的供試助熔劑1-1及1-9，確認到助熔劑會流出。再者，包含觸變劑之供試助熔劑1-1，雖然熔斷動作正常，但由於有助熔劑的流出，故將使用條件趨嚴時，例如長期高溫保管之後的動作或持續規 格下限附近的動作時，容易發生熔斷不良或熔斷時間變長等的不適。此外，助熔劑流出而擴散到構裝的電路基板，則會使灰塵等的異物附著，容易引起絕緣不良等的不適。此外，由第1表所示結果，關於本發明之助熔劑之保持材的粒徑，以體積平均粒徑為0.01~10μm的無機粒子不會粒子分離而佳，其中以0.01~1.5μm者，不會粒子分離，且分散狀態的穩定性良好，而最適於調合糊狀的助熔劑。 As is apparent from the results shown in the first table, the test fluxes 1-1 and 1-9 which did not contain the retaining agent were confirmed to have flowed out of the flux. Further, the test flux 1-1 containing a thixotropic agent has a normal fusing action, but since the flux is discharged, the use condition or the continuous rule after long-term high-temperature storage is tightened. When the operation is performed near the lower limit of the grid, it is easy to cause discomfort such as a blow failure or a long melting time. Further, when the flux flows out and spreads to the circuit board to be mounted, foreign matter such as dust adheres, and discomfort such as insulation failure is likely to occur. Further, as a result of the first table, the particle diameter of the flux of the flux of the present invention is preferably such that the inorganic particles having a volume average particle diameter of 0.01 to 10 μm are not separated by particles, and among them, 0.01 to 1.5 μm. It does not separate particles and has good stability in a dispersed state, and is most suitable for blending a paste-like flux.
[評估試驗2] [Evaluation Test 2]
作為評估試驗2，準備僅由與評估試驗1同樣地調製之助熔劑基材A所構成之供試助熔劑2-1、及對100質量%助熔劑基材A，調合第2表所記載的含量及種類之保持劑之供試助熔劑2-2~2-13，進行作業性、進行回焊2次後的外觀、熔斷動作的評估。 In the evaluation test 2, the test flux 2-1 composed of the flux base material A prepared in the same manner as the evaluation test 1 and the 100% by mass flux base material A were prepared and blended in the second table. The test fluxes 2-2 to 2-13 of the content and type of the retaining agent were evaluated for the workability and the appearance and the fusing action after the reflow soldering twice.
(作業性) (workability)
使用可調節塗佈溫度之塗佈機塗佈各供試助熔劑，如下評估作業性。將結果示於第2表。 Each of the test fluxes was coated using a coater capable of adjusting the coating temperature, and workability was evaluated as follows. The results are shown in the second table.
A：可以80℃以下的塗佈溫度塗佈、 B：可以80℃以上的塗佈溫度塗佈、 C：即使以80℃以上的塗佈溫度亦無法塗佈。 A: It can be applied at a coating temperature of 80 ° C or lower. B: It can be applied at a coating temperature of 80 ° C or higher. C: It cannot be coated even at a coating temperature of 80 ° C or higher.
(回焊2次後的外觀) (appearance after reflowing 2 times)
以與評估試驗1同樣的方法，使用各供試用助熔劑準備電路保護元件，評估回焊2次後的外觀。將結果示於第2表。 In the same manner as in Evaluation Test 1, the circuit protection element was prepared using each of the test fluxes, and the appearance after reflowing was evaluated twice. The results are shown in the second table.
(熔斷動作) (fuse action)
以與評估試驗1同樣的方法，使用各供試用助熔劑準備電 路保護元件，進行熔斷動作的評估。將結果示於第2表。 Prepare electricity using each test flux in the same manner as in Evaluation Test 1. Road protection component for evaluation of the blown action. The results are shown in the second table.
由第2表所示結果，可知關於本發明之助熔劑的保持材，對助熔劑基材以0.5~70質量%的範圍混合使用為佳，其中以含量為5~30質量%的添加範圍，可以80℃以下的低溫作塗佈機塗佈而佳。 From the results shown in the second table, it is understood that the flux of the fluxing agent of the present invention is preferably used in a range of 0.5 to 70% by mass in the flux base material, and the content is in the range of 5 to 30% by mass. It can be applied as a coater at a low temperature of 80 ° C or lower.
[確認試驗] [confirmation test]
作為確認試驗，準備與評估試驗1同樣地調製之助熔劑基材A、對100質量%的助熔劑基材A，以第3表所記載的調合量調合第3表所記載的種類的保持劑之實施例1-3、3-1~3-19， 進行回焊2次後的外觀、熔斷動作之評估。關於實施例1~3的助熔劑的調製方法，具體說明如下。 In the confirmation test, the flux base material A prepared in the same manner as in the evaluation test 1 and the flux base material A prepared in the third table were prepared in the same manner as in the third table. Embodiment 1-3, 3-1~3-19, Evaluation of the appearance and the fusing action after reflowing twice. The preparation method of the flux of Examples 1 to 3 will be specifically described below.
(實施例1) (Example 1)
實施例1之保護元件用助熔劑，係將含有酸變性加氫聚合松脂所組成之熱熔性樹脂53質量%、由硬脂酸醯胺化合物所組成之觸變劑20質量%、癸二酸及癸二酸二環己基胺鹽所組成之活性劑17質量%、二甘醇單酯系高沸點溶劑10質量%均勻混練之助熔劑基材，對助熔劑基材100質量%以調合量10質量%添加由體積平均粒徑(D50)為1~1.5μm之無定形粒狀碳酸鈣所組成之保持材而調製。 The flux for a protective element of Example 1 is a mass% of a hot-melt resin containing acid-denatured hydrogenated rosin, and a thixotropic agent consisting of a thiamine stearate compound of 20% by mass and sebacic acid. And 17% by mass of the active agent composed of the sebacic acid dicyclohexylamine salt and 10% by mass of the diethylene glycol monoester-based high-boiling solvent, and the flux base material is uniformly kneaded to the flux substrate by 100% by mass. The % by mass is prepared by adding a retaining material composed of amorphous granular calcium carbonate having a volume average particle diameter (D 50 ) of 1 to 1.5 μm.
(實施例2) (Example 2)
實施例2之保護元件用助熔劑，係將含有酸變性加氫聚合松脂所組成之熱熔性樹脂53質量%、由硬脂酸氨基化合物所組成之觸變劑20質量%、癸二酸及癸二酸二環己基胺鹽所組成之活性劑17質量%、二甘醇單酯系高沸點溶劑10質量%均勻混練之助熔劑基材，對助熔劑基材100質量%以調合量20質量%添加由體積平均粒徑(D50)為0.3μm的球狀二氧化矽所組成之保持材而調製。 The flux for a protective element of Example 2 is a mass% of a hot-melt resin containing acid-denatured hydrogenated rosin, 20% by mass of a thixotropic agent composed of a stearic acid amino compound, and azelaic acid. 17% by mass of active agent composed of dicyclohexylamine sebacate, 10% by mass of diethylene glycol monoester-based high-boiling solvent, flux base material uniformly blended with 100% by mass of flux base material % was prepared by adding a holding material composed of spherical cerium oxide having a volume average particle diameter (D 50 ) of 0.3 μm.
(實施例3) (Example 3)
實施例3之保護元件用助熔劑，係將含有酸變性加氫聚合松脂所組成之熱熔性樹脂53質量%、由硬脂酸氨基化合物所組成之觸變劑20質量%、癸二酸及癸二酸二環己基胺鹽所組成之活性劑17質量%、二甘醇單酯系高沸點溶劑10質量%均勻混練之助熔劑基材，對助熔劑基材100質量%以調合量30質量% 添加由體積平均粒徑(D50)為1~1.5μm的無定形粒狀氧化鋁所組成之保持材而調製。 The flux for a protective element of Example 3 is a mass% of a hot-melt resin containing acid-denatured hydrogenated rosin, 20% by mass of a thixotropic agent composed of a stearic acid amino compound, and azelaic acid. 17% by mass of active agent composed of dicyclohexylamine sebacate, 10% by mass of diethylene glycol monoester-based high-boiling solvent, flux base material uniformly blended with 100% by mass of flux base material % is prepared by adding a holding material composed of amorphous granular alumina having a volume average particle diameter (D 50 ) of 1 to 1.5 μm.
(回焊2次後的外觀) (appearance after reflowing 2 times)
以與評估試驗1同樣的方法，使用各供試用助熔劑準備電路保護元件，評估回焊2次後的外觀。將結果示於第3表。 In the same manner as in Evaluation Test 1, the circuit protection element was prepared using each of the test fluxes, and the appearance after reflowing was evaluated twice. The results are shown in Table 3.
(熔斷動作) (fuse action)
以與評估試驗1同樣的方法，使用各供試用助熔劑準備電路保護元件，進行熔斷動作的評估。將結果示於第3表。 In the same manner as in Evaluation Test 1, the circuit protection element was prepared using each of the test fluxes, and the fusing operation was evaluated. The results are shown in Table 3.
如第3表所示，使用實施例1~3、實施例3-1~3-19 之助熔劑之電路保護元件，於2次回焊後助熔劑均無流出至絕緣基板，且可知可以數十秒正常地熔斷。 As shown in Table 3, Examples 1 to 3 and Examples 3-1 to 3-19 were used. The circuit protection component of the flux does not flow out to the insulating substrate after two reflows, and it can be known that it can be blown normally for several tens of seconds.
[實施例4] [Example 4]
實施例4之電路保護元件，係使用實施例1至實施例3之任意一個保護元件用助熔劑之電路保護元件，具有第2圖所示之第2實施形態之構成。如第2圖所示，包括：於上下面設置複數Ag合金製之圖案電極34之氧化鋁．陶瓷製絕緣基板33；與圖案電極34電性連接而設於絕緣基板33下面之阻抗發熱元件38；與絕緣基板33之上面的圖案電極34電性連接之熔絲層11；於該熔絲層11上面塗佈設置助熔劑之助熔劑層12；及覆蓋包含助熔劑層12之熔絲元件10之上部固著於絕緣基板33之液晶聚合物製之蓋狀蓋體36。雖並無特別圖示，阻抗發熱元件38之表面施以玻璃材之上鈾。 The circuit protection element of the fourth embodiment is a circuit protection element using a flux for any one of the first to third embodiments, and has a configuration of the second embodiment shown in Fig. 2. As shown in FIG. 2, the aluminum oxide of the pattern electrode 34 made of a plurality of Ag alloys is disposed on the upper and lower sides. a ceramic insulating substrate 33; an impedance heating element 38 electrically connected to the pattern electrode 34 and disposed under the insulating substrate 33; a fuse layer 11 electrically connected to the pattern electrode 34 on the upper surface of the insulating substrate 33; and the fuse layer 11 is coated with a flux layer 12 provided with a flux; and a lid-like lid body 36 made of a liquid crystal polymer having an upper portion of the fuse element 10 including the flux layer 12 and fixed to the insulating substrate 33. Although not specifically illustrated, the surface of the impedance heating element 38 is coated with uranium over the glass.
[實施例5] [Example 5]
實施例5之電路保護元件，係使用實施例1至實施例3之任意一個保護元件用助熔劑之電路保護元件，具有第3圖所示之第3實施形態之構成。如第3圖所示，包括：於上下面設置複數Ag合金製圖案電極49之氧化鋁．陶瓷製之基底基板43；與圖案電極49電性連接設於絕緣基板43上面之阻抗發熱元件48；與該阻抗發熱元件48抵接與絕緣基板43上面之圖案電極49電性連接之熔絲層11；於該熔絲層11之上面塗佈設置之助熔劑之助熔劑層12；及覆蓋包含該助熔劑層12之熔絲元件10之上部固著於絕緣基板43之液晶聚合物製之蓋狀蓋體46。雖並無特別圖示，阻抗發熱元件23之表面施以玻璃材之上鈾。 The circuit protection element of the fifth embodiment is a circuit protection element using a flux for any one of the first to third embodiments, and has a configuration of the third embodiment shown in Fig. 3. As shown in FIG. 3, the aluminum oxide of the pattern electrode 49 made of a plurality of Ag alloys is disposed on the upper and lower sides. a base substrate 43 made of ceramic; an impedance heating element 48 electrically connected to the upper surface of the insulating substrate 43; and a fuse layer electrically connected to the pattern electrode 49 on the insulating substrate 43 a flux layer 12 on which a flux is disposed on the fuse layer 11; and a cover made of a liquid crystal polymer covering the upper portion of the fuse element 10 including the flux layer 12 and fixed to the insulating substrate 43 Shaped cover 46. Although not specifically shown, the surface of the resistance heating element 23 is applied with uranium over the glass.
本發明的保護元件用助熔劑及使用此之電路保護元件，可與其他的表面構裝零件一起安裝於保護基板，以回焊工法等的一口氣焊錫構裝，利用於電池包等的2次電池之保護裝置。 The flux for a protective element of the present invention and the circuit protection member using the same can be mounted on a protective substrate together with other surface-mounting components, and can be used in a one-shot solder assembly such as a reflow method, and used twice for a battery pack or the like. Battery protection device.
10‧‧‧熔絲元件 10‧‧‧Fuse components
11‧‧‧熔絲層 11‧‧‧Fuse layer
12‧‧‧助熔劑層 12‧‧‧ Flux layer
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012245144A JP5807969B2 (en) | 2012-11-07 | 2012-11-07 | Flux composition for protective element and circuit protective element using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201427790A true TW201427790A (en) | 2014-07-16 |
| TWI586472B TWI586472B (en) | 2017-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102138395A TWI586472B (en) | 2012-11-07 | 2013-10-24 | A flux for the protection element, a fuse element for the protection element, and a circuit protection element |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5807969B2 (en) |
| KR (1) | KR101925669B1 (en) |
| CN (1) | CN104781901B (en) |
| TW (1) | TWI586472B (en) |
| WO (1) | WO2014073356A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9972991B2 (en) | 2016-05-20 | 2018-05-15 | Polytronics Technology Corp. | Protection device and circuit protection apparatus containing the same |
| US10181715B2 (en) | 2016-10-05 | 2019-01-15 | Polytronics Technology Corp. | Protection device and circuit protection apparatus containing the same |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6527323B2 (en) * | 2014-11-11 | 2019-06-05 | デクセリアルズ株式会社 | Flux sheet, flux, fuse element, fuse element, protection element, short circuit element and switching element |
| KR101684083B1 (en) * | 2015-03-31 | 2016-12-07 | 울산대학교 산학협력단 | Micro fuse for protecting over current and a method of manufacturing thereof |
| JP6534122B2 (en) * | 2015-12-28 | 2019-06-26 | パナソニックＩｐマネジメント株式会社 | Resin flux solder paste and mounting structure |
| CN108274160A (en) * | 2018-03-01 | 2018-07-13 | 合肥安力电力工程有限公司 | A kind of scaling powder and preparation method thereof for electronic product production |
| CN110549036A (en) * | 2018-06-03 | 2019-12-10 | 湖北鹏林新材料科技有限公司 | Organic soldering flux and preparation method thereof |
| JP7349954B2 (en) * | 2020-04-13 | 2023-09-25 | ショット日本株式会社 | protection element |
| EP3926647A3 (en) * | 2020-06-15 | 2022-03-16 | Littelfuse, Inc. | A method for thin-film coating packaging of device having meltable and wetting links |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59223199A (en) * | 1983-06-02 | 1984-12-14 | Nippon Steel Corp | Fused flux for submerged arc welding |
| JPH02177210A (en) * | 1988-12-28 | 1990-07-10 | Fujikura Ltd | Soldering paste for circuit board |
| JP2750910B2 (en) * | 1989-07-25 | 1998-05-18 | 内橋エステック株式会社 | Alloy type thermal fuse |
| JPH05169296A (en) * | 1991-12-20 | 1993-07-09 | Nippon Steel Corp | Low hydrogen type coated electrode |
| CN1050928C (en) * | 1997-11-18 | 2000-03-29 | 四川仪表六厂 | Temp. safety device |
| JP2001243863A (en) * | 2000-02-25 | 2001-09-07 | Uchihashi Estec Co Ltd | Fuse with flux |
| JP2004265617A (en) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | Protective element |
| JP2004265618A (en) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | Protection element |
| JP5301298B2 (en) * | 2009-01-21 | 2013-09-25 | デクセリアルズ株式会社 | Protective element |
| JP5305523B2 (en) * | 2009-07-31 | 2013-10-02 | エヌイーシー ショット コンポーネンツ株式会社 | Protective element |
| CN101764002B (en) * | 2009-12-25 | 2014-01-01 | 上海神沃电子有限公司 | Fluxing agent as well as preparation method and application thereof |
| CN101944463B (en) * | 2010-08-31 | 2012-11-28 | 广东风华高新科技股份有限公司 | Film sheet fuse and preparation method thereof |
-
2012
- 2012-11-07 JP JP2012245144A patent/JP5807969B2/en active Active
-
2013
- 2013-10-18 CN CN201380058080.XA patent/CN104781901B/en active Active
- 2013-10-18 KR KR1020157011242A patent/KR101925669B1/en active IP Right Grant
- 2013-10-18 WO PCT/JP2013/078359 patent/WO2014073356A1/en active Application Filing
- 2013-10-24 TW TW102138395A patent/TWI586472B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9972991B2 (en) | 2016-05-20 | 2018-05-15 | Polytronics Technology Corp. | Protection device and circuit protection apparatus containing the same |
| US10181715B2 (en) | 2016-10-05 | 2019-01-15 | Polytronics Technology Corp. | Protection device and circuit protection apparatus containing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101925669B1 (en) | 2018-12-05 |
| KR20150082254A (en) | 2015-07-15 |
| WO2014073356A1 (en) | 2014-05-15 |
| CN104781901B (en) | 2018-02-23 |
| JP5807969B2 (en) | 2015-11-10 |
| CN104781901A (en) | 2015-07-15 |
| JP2014091162A (en) | 2014-05-19 |
| TWI586472B (en) | 2017-06-11 |
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