TW201426128A - Light source module, backlight module and liquid crystal display device - Google Patents
Light source module, backlight module and liquid crystal display device Download PDFInfo
- Publication number
- TW201426128A TW201426128A TW101151303A TW101151303A TW201426128A TW 201426128 A TW201426128 A TW 201426128A TW 101151303 A TW101151303 A TW 101151303A TW 101151303 A TW101151303 A TW 101151303A TW 201426128 A TW201426128 A TW 201426128A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor
- light
- heat
- printed circuit
- heat dissipation
- Prior art date
Links
Abstract
Description
本發明涉及一種光源模組、背光模組及液晶顯示裝置。The invention relates to a light source module, a backlight module and a liquid crystal display device.
液晶顯示裝置因具有低輻射性、體積輕薄短小及耗電低等特點，已廣泛應用於手機、個人數位助理、筆記型電腦、個人電腦及電視等領域。由於液晶顯示裝置的液晶面板本身不具有發光特性，因此，為達到顯示效果，需要給液晶面板提供一背光模組以向液晶面板提供亮度充分且分佈均勻的平面光，從而實現液晶顯示裝置的顯示功能。Liquid crystal display devices have been widely used in mobile phones, personal digital assistants, notebook computers, personal computers and televisions due to their low radiation, small size, short power consumption and low power consumption. Since the liquid crystal panel of the liquid crystal display device does not have the light-emitting property itself, in order to achieve the display effect, it is necessary to provide a backlight module to the liquid crystal panel to provide planar light with sufficient brightness and uniform distribution to the liquid crystal panel, thereby realizing display of the liquid crystal display device. Features.
通常背光模組主要包括導光板、光源、反射片以及一至多個光學膜片。光源通常為點光源或者線光源，在背光模組中用於提供光線。導光板則用於引導光線的方向，並達到亮度均勻的效果，從而為液晶面板提供分佈均勻的平面光。點光源如發光二極體（LED）因其節能、環保的優點越來越多地被應用於背光模組中用於提供光線，中大尺寸的液晶面板常採用多顆點光源排列成線狀的光源帶（Light bar）來取代傳統的線光源，如冷陰極燈管（CCFL）。Generally, the backlight module mainly includes a light guide plate, a light source, a reflective sheet, and one or more optical films. The light source is usually a point source or a line source for providing light in the backlight module. The light guide plate is used to guide the direction of the light and achieve a uniform brightness, thereby providing a uniform distribution of planar light to the liquid crystal panel. Point light sources such as light-emitting diodes (LEDs) are increasingly used in backlight modules for providing light due to their advantages of energy saving and environmental protection. Medium and large-sized liquid crystal panels are often arranged in a line by using multiple point sources. Light bar replaces traditional line sources such as cold cathode lamps (CCFLs).
同時因應目前對液晶顯示裝置輕薄化的要求，業界常將光源帶組成側光式的背光模組來為液晶顯示裝置提供光源。然而上述光源在使用過程發出的熱量集中，不利用散熱。At the same time, in response to the current demand for thinner and thinner liquid crystal display devices, the industry often uses a light source to form an edge-lit backlight module to provide a light source for the liquid crystal display device. However, the above-mentioned light source concentrates heat generated during use, and does not utilize heat dissipation.
有鑒於此，有必要提供一種一種散熱較好的光源模組。In view of this, it is necessary to provide a light source module with better heat dissipation.
有鑒於此，也有必要提供一種採用上述光源模組的背光模組。In view of this, it is also necessary to provide a backlight module using the above light source module.
有鑒於此，還有必要提供一種採用上述背光模組的液晶顯示裝置。In view of this, it is also necessary to provide a liquid crystal display device using the above backlight module.
一種光源模組，其包括散熱背板及發光條，該發光條包括印刷電路板及多個設置在印刷電路板上的發光二極體。該光源模組還包括半導體製冷片，該半導體製冷片設置在印刷電路板與散熱背板之間，且該半導體製冷片在通入直流電時形成一冷端及一熱端，該冷端直接或者通過熱傳導元件接觸該印刷電路板以吸收發光二極體發光時產生的熱量，該半導體製冷片的熱端直接或者通過熱傳導元件接觸該散熱背板將半導體製冷片熱端釋放的熱量傳遞至該散熱背板。A light source module includes a heat dissipation backplane and a light strip. The light strip includes a printed circuit board and a plurality of light emitting diodes disposed on the printed circuit board. The light source module further includes a semiconductor refrigeration chip disposed between the printed circuit board and the heat dissipation backplane, and the semiconductor refrigeration chip forms a cold end and a hot end when the direct current is applied, the cold end directly or Contacting the printed circuit board with a heat conducting element to absorb heat generated when the light emitting diode emits light, and the hot end of the semiconductor cooling sheet directly or through the heat conducting element contacts the heat dissipating back plate to transfer heat released by the hot end of the semiconductor refrigerating sheet to the heat dissipation Backboard.
一種背光模組，其包括光源模組及用以承載固定光源模組的框架，該光源模組包括散熱背板及發光條，該發光條包括印刷電路板及多個設置在印刷電路板上的發光二極體。該光源模組還包括半導體製冷片，該半導體製冷片設置在印刷電路板與散熱背板之間，且該半導體製冷片在通入直流電時形成一冷端及一熱端，該冷端直接或者通過熱傳導元件接觸該印刷電路板以吸收發光二極體發光時產生的熱量，該半導體製冷片的熱端直接或者通過熱傳導元件接觸該散熱背板將半導體製冷片熱端釋放的熱量傳遞至該散熱背板。A backlight module includes a light source module and a frame for supporting the fixed light source module, the light source module includes a heat dissipation back plate and a light bar, and the light bar includes a printed circuit board and a plurality of printed circuit boards Light-emitting diode. The light source module further includes a semiconductor refrigeration chip disposed between the printed circuit board and the heat dissipation backplane, and the semiconductor refrigeration chip forms a cold end and a hot end when the direct current is applied, the cold end directly or Contacting the printed circuit board with a heat conducting element to absorb heat generated when the light emitting diode emits light, and the hot end of the semiconductor cooling sheet directly or through the heat conducting element contacts the heat dissipating back plate to transfer heat released by the hot end of the semiconductor refrigerating sheet to the heat dissipation Backboard.
一種液晶顯示裝置，其包括液晶顯示面板與為該液晶顯示面板提供平面光的背光模組，該背光模組包括光源模組及用以承載固定光源模組的框架，該光源模組包括散熱背板及發光條，該發光條包括印刷電路板及多個設置在印刷電路板上的發光二極體。該光源模組還包括半導體製冷片，該半導體製冷片設置在印刷電路板與散熱背板之間，且該半導體製冷片在通入直流電時形成一冷端及一熱端，該冷端直接或者通過熱傳導元件接觸該印刷電路板以吸收發光二極體發光時產生的熱量，該半導體製冷片的熱端直接或者通過熱傳導元件接觸該散熱背板將半導體製冷片熱端釋放的熱量傳遞至該散熱背板。A liquid crystal display device includes a liquid crystal display panel and a backlight module for providing planar light to the liquid crystal display panel, the backlight module includes a light source module and a frame for supporting the fixed light source module, and the light source module includes a heat dissipation back The board and the light strip comprise a printed circuit board and a plurality of light emitting diodes disposed on the printed circuit board. The light source module further includes a semiconductor refrigeration chip disposed between the printed circuit board and the heat dissipation backplane, and the semiconductor refrigeration chip forms a cold end and a hot end when the direct current is applied, the cold end directly or Contacting the printed circuit board with a heat conducting element to absorb heat generated when the light emitting diode emits light, and the hot end of the semiconductor cooling sheet directly or through the heat conducting element contacts the heat dissipating back plate to transfer heat released by the hot end of the semiconductor refrigerating sheet to the heat dissipation Backboard.
由於本發明在發光條和散熱背板之間設置半導體製冷片，因此半導體製冷片的冷端可有效吸取發光條的發光二極體散發的熱量，並由半導體製冷片的熱端將熱量散發至散熱背板，從而將熱量散發出去。Since the present invention provides a semiconductor refrigerating sheet between the illuminating strip and the heat dissipating backing plate, the cold end of the semiconductor refrigerating sheet can effectively absorb the heat dissipated by the illuminating diode of the illuminating strip, and the heat is radiated to the hot end of the semiconductor refrigerating sheet to Dissipate the backplane to dissipate heat.
請參閱圖1，是本發明背光模組的立體分解示意圖。該背光模組20包括光源模組21、導光板22、反射片23及框架(圖未示)，該框架收容該光源模組21、導光板22、反射片23於其內。Please refer to FIG. 1 , which is a perspective exploded view of a backlight module of the present invention. The backlight module 20 includes a light source module 21, a light guide plate 22, a reflection sheet 23, and a frame (not shown). The frame houses the light source module 21, the light guide plate 22, and the reflection sheet 23 therein.
該光源模組21包括發光條211、半導體製冷片215及散熱背板216。請參閱圖2，N型半導體和P型半導體串聯成的電偶夾置在二陶瓷片之間形成半導體製冷片215。當直流電通過夾置在半導體製冷片215二陶瓷片之間的N型半導體和P型半導體串聯成的電偶時，在電偶的兩端分別吸收熱量和放出熱量。電流由N型半導體流向P型半導體的一端吸收熱量，形成半導體製冷片215的冷端2151。電流由Ｐ型半導體流向Ｎ型半導體的一端釋放熱量，形成半導體製冷片215的熱端2152。該半導體製冷片215的冷端2151會源源不斷的吸收周圍環境中的熱量，熱端2152釋放熱量，冷熱兩端的溫度差可達幾十度。The light source module 21 includes a light-emitting strip 211, a semiconductor cooling sheet 215, and a heat-dissipating backing plate 216. Referring to FIG. 2, a galvanic coupler in which an N-type semiconductor and a P-type semiconductor are connected in series is sandwiched between two ceramic sheets to form a semiconductor refrigerating sheet 215. When the direct current passes through the galvanic couple formed by the N-type semiconductor and the P-type semiconductor sandwiched between the two ceramic sheets of the semiconductor refrigerating sheet 215, heat is absorbed and heat is released at both ends of the galvanic couple. The current is absorbed by the N-type semiconductor current to one end of the P-type semiconductor to form a cold end 2151 of the semiconductor refrigerating sheet 215. The current is discharged from the P-type semiconductor to one end of the N-type semiconductor to form a hot end 2152 of the semiconductor refrigerating sheet 215. The cold end 2151 of the semiconductor refrigerating sheet 215 continuously absorbs heat in the surrounding environment, and the hot end 2152 releases heat, and the temperature difference between the cold and the hot ends can reach several tens of degrees.
該發光條211包括印刷電路板212及多個發光二極體213。該印刷電路板212為直條形，其包括相對設置的第一表面2121和第二表面2122。該多個發光二極體213設置在該印刷電路板212的第一表面2121上。The light bar 211 includes a printed circuit board 212 and a plurality of light emitting diodes 213. The printed circuit board 212 is a straight strip shape including a first surface 2121. and a second surface 2122 that are disposed opposite each other. The plurality of light emitting diodes 213 are disposed on the first surface 2121 of the printed circuit board 212.
該散熱背板216包括底板2161及與底板2161連接的側壁2162，從而該底板2161與側壁2162形成一L型結構。該側壁2162的內表面設置一第一容置槽2163。該底板2161的內表面鄰近該側壁2162處設置第二容置槽2164。該底板2161的內表面遠離該側壁2162處設置第三容置槽2165，從而形成一臺階。該側壁2162背離該第一容置槽2163的外表面設置鋸齒狀凹槽2167，該底板2161背離該第二容置槽2164的外表面也設置鋸齒狀凹槽2167。The heat dissipation backplane 216 includes a bottom plate 2161 and a side wall 2162 connected to the bottom plate 2161 such that the bottom plate 2161 and the side wall 2162 form an L-shaped structure. A first receiving groove 2163 is disposed on an inner surface of the sidewall 2162. A second receiving groove 2164 is disposed on an inner surface of the bottom plate 2161 adjacent to the side wall 2162. The inner surface of the bottom plate 2161 is disposed away from the side wall 2162 to form a third receiving groove 2165, thereby forming a step. The outer surface of the side wall 2162 facing away from the first accommodating groove 2163 is provided with a zigzag groove 2167. The outer surface of the bottom plate 2161 facing away from the second accommodating groove 2164 is also provided with a zigzag groove 2167.
該導光板22包括一出光面221、一與該出光面221相對的底面222以及分別與該出光面、底面221、222相連的多個側面223。本實施例中，該導光板22為矩形，其包括四個側面223。The light guide plate 22 includes a light emitting surface 221, a bottom surface 222 opposite to the light emitting surface 221, and a plurality of side surfaces 223 connected to the light emitting surface and the bottom surface 221 and 222, respectively. In this embodiment, the light guide plate 22 is rectangular and includes four side faces 223.
請一併參閱圖3，該光源模組21組裝時，該散熱背板216的側壁2162的第一容置槽2163內收容有半導體製冷片215，且該半導體製冷片215的熱端2152通過導熱膠帶218黏接在該第一容置槽2163的底部。該散熱背板216的底板2161的第二容置槽2164內收容另一半導體製冷片215，該另一半導體製冷片215的熱端2152通過導熱膠帶218黏接在該第二容置槽2164的底部。該發光條211固定在散熱背板216的側壁2162，則該收容在第一容置槽2163內的半導體製冷片215的冷端抵接該發光條211的印刷電路板212的第二表面2122，收容在第二容置槽2164內的另一半導體製冷片215的冷端鄰近發光條211設置，位於發光條211的下方。該發光條211可通過螺絲鎖固方式固定在散熱背板216的側壁2162，也可以通過黏接方式固定在散熱背板216的側壁2162。本實施例中，發光條211通過螺絲鎖固，且該第一容置槽2163內並排設置三個半導體製冷片215，每兩個半導體製冷片215之間間隔有一間隙，螺絲穿過印刷電路板212後在每二半導體製冷片215之間的間隙處固定在散熱背板216的側壁2162。As shown in FIG. 3 , when the light source module 21 is assembled, the first accommodating groove 2163 of the sidewall 2162 of the heat dissipation back plate 216 receives the semiconductor refrigerating sheet 215, and the hot end 2152 of the semiconductor refrigerating sheet 215 is thermally conductive. The tape 218 is adhered to the bottom of the first receiving groove 2163. Another semiconductor refrigerating sheet 215 is received in the second receiving groove 2164 of the bottom plate 2161 of the heat dissipating back plate 216. The hot end 2152 of the other semiconductor refrigerating sheet 215 is adhered to the second receiving groove 2164 by the thermal conductive tape 218. bottom. The light-emitting strip 211 is fixed to the sidewall 2162 of the heat-dissipating back plate 216, and the cold end of the semiconductor refrigerating sheet 215 received in the first receiving groove 2163 abuts the second surface 2122 of the printed circuit board 212 of the light-emitting strip 211. The cold end of the other semiconductor refrigerating sheet 215 housed in the second accommodating groove 2164 is disposed adjacent to the illuminating strip 211 and is located below the illuminating strip 211. The light-emitting strip 211 can be fixed to the side wall 2162 of the heat-dissipating back plate 216 by screwing, or can be fixed to the side wall 2162 of the heat-dissipating back plate 216 by adhesive bonding. In this embodiment, the light-emitting strips 211 are locked by screws, and three semiconductor cooling fins 215 are arranged side by side in the first accommodating groove 2163, and a gap is formed between each two semiconductor cooling fins 215, and the screws pass through the printed circuit board. 212 is then secured to the sidewall 2162 of the heat dissipation backplane 216 at a gap between each of the two semiconductor fins 215.
請一併參閱圖4，該背光模組20組裝時，將光源模組固定在框架內，本實施例中，可通過螺絲鎖固的方式將光源模組21的散熱背板216固定在框架上，反射片23及導光板22依次放入框架，並使得該反射片對應該第三容置槽2165，該導光板22的底面222鄰近反射片23，該導光板22位於反射片23上，且導光板22位於該底板2161因第三容置槽2165所形成的臺階上。且該發光條211的發光二極體213鄰近該導光板22的一側面223設置，則該側面223作為該導光板22的入光面。As shown in FIG. 4, when the backlight module 20 is assembled, the light source module is fixed in the frame. In this embodiment, the heat dissipation back plate 216 of the light source module 21 can be fixed on the frame by screw locking. The reflective sheet 23 and the light guide plate 22 are sequentially placed in the frame, and the reflective sheet corresponds to the third accommodating groove 2165. The bottom surface 222 of the light guide plate 22 is adjacent to the reflective sheet 23, and the light guide plate 22 is located on the reflective sheet 23, and The light guide plate 22 is located on the step formed by the bottom plate 2161 by the third receiving groove 2165. The light-emitting diode 213 of the light-emitting strip 211 is disposed adjacent to a side surface 223 of the light guide plate 22, and the side surface 223 serves as a light-incident surface of the light guide plate 22.
由於該背光模組20在發光條211和散熱背板216之間設置有半導體製冷片215，因此半導體製冷片215的冷端2151有效吸收發光條211所釋放出的熱量，並通過半導體製冷片215的熱端2152傳遞至散熱背板216釋放出去，因此，散熱效果較佳。Since the backlight module 20 is provided with the semiconductor refrigerating sheet 215 between the light-emitting strip 211 and the heat-dissipating backing plate 216, the cold end 2151 of the semiconductor refrigerating sheet 215 effectively absorbs the heat released by the light-emitting strip 211 and passes through the semiconductor refrigerating sheet 215. The hot end 2152 is transferred to the heat dissipation backing plate 216 for release, so that the heat dissipation effect is better.
請參閱圖5，是本發明液晶顯示裝置的示意圖。該液晶顯示裝置2包括液晶面板29及相對該液晶面板29設置的背光模組，該背光模組可採用上述實施例中的背光模組20。Please refer to FIG. 5, which is a schematic diagram of a liquid crystal display device of the present invention. The liquid crystal display device 2 includes a liquid crystal panel 29 and a backlight module disposed opposite to the liquid crystal panel 29. The backlight module 20 can be the backlight module 20 in the above embodiment.
然而，本案的背光模組不限於上述實施方式所述，例如，該背光模組中光源模組的數量可根據需要變更設計，可以為二或者二以上，並使得發光二極體鄰近導光板側面設置，鄰近發光二極體的導光板側面即為入光面。However, the backlight module of the present invention is not limited to the above embodiments. For example, the number of the light source modules in the backlight module may be changed according to requirements, and may be two or more, and the light emitting diodes are adjacent to the side of the light guide plate. The side surface of the light guide plate adjacent to the light emitting diode is a light incident surface.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
20．．．背光模組20. . . Backlight module
21．．．光源模組twenty one. . . Light source module
211．．．發光條211. . . Light strip
212．．．印刷電路板212. . . A printed circuit board
2121．．．第一表面2121. . . First surface
2122．．．第二表面2122. . . Second surface
213．．．發光二極體213. . . Light-emitting diode
215．．．半導體製冷片215. . . Semiconductor refrigeration chip
2151．．．冷端2151. . . Cold end
2152．．．熱端2152. . . Hot end
216．．．散熱背板216. . . Thermal backplane
2161．．．底板2161. . . Bottom plate
2162．．．側壁2162. . . Side wall
2163．．．第一容置槽2163. . . First accommodating slot
2164．．．第二容置槽2164. . . Second receiving slot
2165．．．第三容置槽2165. . . Third receiving slot
2167．．．鋸齒狀凹槽2167. . . Serrated groove
218．．．導熱膠帶218. . . Thermal tape
22．．．導光板twenty two. . . Light guide
221．．．出光面221. . . Glossy surface
222．．．底面222. . . Bottom
223．．．側面223. . . side
23．．．反射片twenty three. . . A reflective sheet
2．．．液晶顯示裝置2. . . Liquid crystal display device
29．．．液晶面板29. . . LCD panel
圖1是本發明的背光模組的一較佳實施方式立體分解示意圖。1 is a perspective exploded view of a preferred embodiment of a backlight module of the present invention.
圖2是圖1所示的背光模組的半導體製冷片的示意圖。2 is a schematic view of a semiconductor refrigerating sheet of the backlight module shown in FIG. 1.
圖3是圖1所示的背光模組的光源模組的組裝示意圖。3 is a schematic view showing the assembly of the light source module of the backlight module shown in FIG. 1.
圖4是圖1所示的背光模組的組裝示意圖。4 is a schematic view showing the assembly of the backlight module shown in FIG. 1.
圖5是本發明的液晶顯示裝置的示意圖。Fig. 5 is a schematic view of a liquid crystal display device of the present invention.
20．．．背光模組20. . . Backlight module
21．．．光源模組twenty one. . . Light source module
211．．．發光條211. . . Light strip
212．．．印刷電路板212. . . A printed circuit board
2121．．．第一表面2121. . . First surface
2122．．．第二表面2122. . . Second surface
213．．．發光二極體213. . . Light-emitting diode
215．．．半導體製冷片215. . . Semiconductor refrigeration chip
2151．．．冷端2151. . . Cold end
2152．．．熱端2152. . . Hot end
216．．．散熱背板216. . . Thermal backplane
2161．．．底板2161. . . Bottom plate
2162．．．側壁2162. . . Side wall
2163．．．第一容置槽2163. . . First accommodating slot
2164．．．第二容置槽2164. . . Second receiving slot
2165．．．第三容置槽2165. . . Third receiving slot
2167．．．鋸齒狀凹槽2167. . . Serrated groove
218．．．導熱膠帶218. . . Thermal tape
22．．．導光板twenty two. . . Light guide
221．．．出光面221. . . Glossy surface
222．．．底面222. . . Bottom
223．．．側面223. . . side
23．．．反射片twenty three. . . A reflective sheet
Claims (13)
A liquid crystal display device comprising a liquid crystal display panel and a backlight module for providing planar light to the liquid crystal display panel, wherein the backlight module adopts the backlight module according to any one of claims 7-12 .
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210568882.2A CN103899976A (en) | 2012-12-25 | 2012-12-25 | Light source module, backlight module and liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201426128A true TW201426128A (en) | 2014-07-01 |
Family
ID=50991472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101151303A TW201426128A (en) | 2012-12-25 | 2012-12-28 | Light source module, backlight module and liquid crystal display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103899976A (en) |
| TW (1) | TW201426128A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206819010U (en) * | 2017-04-01 | 2017-12-29 | 深圳市大疆创新科技有限公司 | A kind of backlight module, display device and UAS |
| CN107027271B (en) * | 2017-04-28 | 2019-04-30 | 深圳市华星光电技术有限公司 | Liquid crystal display television cooling system and LCD TV |
| US10477735B2 (en) | 2017-04-28 | 2019-11-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation system for use with liquid crystal television and liquid crystal television |
| CN107608133B (en) * | 2017-09-22 | 2021-06-29 | 武汉天马微电子有限公司 | Backlight module and display device |
| CN109637356B (en) * | 2019-01-07 | 2024-04-26 | 成都京东方显示科技有限公司 | Backboard and display device using same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06242731A (en) * | 1993-02-17 | 1994-09-02 | Kuroda Denki Kk | Back light device for display surface |
| JP2006156231A (en) * | 2004-11-30 | 2006-06-15 | Harison Toshiba Lighting Corp | Backlight |
| CN101546063A (en) * | 2008-03-27 | 2009-09-30 | 深圳帝光电子有限公司 | Ultra thin type LCD use backlight module taking LED as light source |
| CN201827771U (en) * | 2010-09-15 | 2011-05-11 | 康佳集团股份有限公司 | Backlight module group and liquid crystal television |
| CN202082747U (en) * | 2011-05-26 | 2011-12-21 | 深圳市华星光电技术有限公司 | Display device and backlight module |
| CN102418880B (en) * | 2011-09-23 | 2015-04-01 | 广州创维平面显示科技有限公司 | Backlight module |
| CN202546687U (en) * | 2012-05-09 | 2012-11-21 | 京东方科技集团股份有限公司 | Heat dissipation device of LED (light emitting diode) light bar, backlight module and display device |
| CN102679243B (en) * | 2012-05-15 | 2014-10-08 | 深圳市华星光电技术有限公司 | Backlight module and display device |
-
2012
- 2012-12-25 CN CN201210568882.2A patent/CN103899976A/en active Pending
- 2012-12-28 TW TW101151303A patent/TW201426128A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN103899976A (en) | 2014-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101398499B1 (en) | Backlight unit and display device | |
| US7287879B2 (en) | Thermal module and backlight system using the same | |
| TWI475297B (en) | Backlight module and thermal design thereof | |
| JP6157738B2 (en) | Backlight module and liquid crystal display module using the backlight module | |
| CN100580528C (en) | LCD and back light module thereof | |
| TWI402577B (en) | Backlight module and display device with two-sided light emitting structure | |
| US8194208B2 (en) | Backlight module with a heat conductive block | |
| US20130051067A1 (en) | Backlight Module with Connecting Circuits | |
| US9229155B2 (en) | Side-edge backlight module | |
| TW201426128A (en) | Light source module, backlight module and liquid crystal display device | |
| WO2014067173A1 (en) | Led lamp bar and backlight module using same | |
| US7427148B1 (en) | Light modules | |
| US8746947B2 (en) | Backlight module, LCD device and light source of backlight module | |
| TWM435618U (en) | Light-emitting module and display apparatus | |
| TW201426127A (en) | Light source module, backlight module and liquid crystal display device | |
| TWI412701B (en) | Heat sinking sheet metal member and applications of the same | |
| CN107608133B (en) | Backlight module and display device | |
| JP2009169204A (en) | Liquid crystal display | |
| TWI385449B (en) | Backlight module and display module | |
| KR100706756B1 (en) | structure of A LCD using a peltier element | |
| WO2013078739A1 (en) | Liquid crystal display device, and backlight module and heat dissipation method thereof | |
| US20100123848A1 (en) | Led module and liquid crystal display having the same | |
| US9389354B2 (en) | Backlight module | |
| WO2016037376A1 (en) | Side-incident type backlight module and liquid crystal display device | |
| CN109375420A (en) | Backlight module |