TW201411865A - Method of manufacturing solar cell - Google Patents
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- TW201411865A TW201411865A TW101132149A TW101132149A TW201411865A TW 201411865 A TW201411865 A TW 201411865A TW 101132149 A TW101132149 A TW 101132149A TW 101132149 A TW101132149 A TW 101132149A TW 201411865 A TW201411865 A TW 201411865A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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本發明是有關於一種太陽能電池的製造方法，特別是指一種矽晶太陽能電池的製造方法。 The present invention relates to a method of fabricating a solar cell, and more particularly to a method of fabricating a twinned solar cell.
已知的矽晶太陽能電池結構，主要包含：一基板、一與該基板形成p-n接面的射極層、一位於該射極層上的抗反射層，以及用於傳導電流的一正面電極與一背面電極。其中，該抗反射層的材料例如氮化矽(SiNx)，可用於提升電池正面的入光量。該正面電極包括至少一匯流電極(bus bar electrode)，及數個橫向連接該匯流電極的指狀電極(finger bar electrode)。在製作上，該匯流電極與該等指狀電極可以透過網印金屬漿料而形成，但隨著金屬漿料的價格不斷升高，尤其是導電性較佳的銀漿的價格昂貴，為了降低太陽能電池的生產成本，利用電鍍方式形成電極，可免去使用昂貴的銀漿，因此已成為許多電池製造廠的另一種選擇。 The known twin solar cell structure mainly comprises: a substrate, an emitter layer forming a pn junction with the substrate, an anti-reflection layer on the emitter layer, and a front electrode for conducting current A back electrode. Among them, the material of the anti-reflection layer such as tantalum nitride (SiN x ) can be used to increase the amount of light incident on the front side of the battery. The front electrode includes at least one bus bar electrode and a plurality of finger bar electrodes laterally connected to the bus electrode. In the production, the bus electrode and the finger electrodes can be formed by the screen printing metal paste, but as the price of the metal paste increases, especially the silver paste with better conductivity is expensive, in order to reduce The production cost of solar cells, the use of electroplating to form electrodes, eliminates the use of expensive silver paste, has become an alternative to many battery manufacturers.
而進行電鍍前，必須先於該抗反射層的適當部位開孔，使該射極層的部分表面露出，且開孔形狀相當於匯流電極的形狀。後續以電鍍方式製成該匯流電極，該匯流電極就可以透過開孔而直接接觸該射極層表面，以形成電連接。 Before plating, it is necessary to open a hole in an appropriate portion of the anti-reflection layer to expose a part of the surface of the emitter layer, and the shape of the opening corresponds to the shape of the bus electrode. The bus electrode is subsequently formed by electroplating, and the bus electrode can directly contact the surface of the emitter layer through the opening to form an electrical connection.
雖然電鍍方法可降低生產成本，但尚有其它問題需要克服。因為電池製造完成後，必須另外以焊帶導線(ribbon)焊接於電池的匯流電極上，以將數個電池串接形成電池模 組。而利用電鍍製作正面電極的最大問題在於，當焊帶導線和匯流電極焊接之後，匯流電極和基板之間的附著力不佳，此附著力不佳的可能原因如下：在電鍍前，該抗反射層開孔後仍有殘留的氮化矽存在，此殘留的氮化矽會阻礙該匯流電極之電鍍金屬(通常包含鎳)與該射極層形成鎳矽化合物(Ni Silicide)，造成一不均勻之鎳矽化合物薄膜，因而降低了電鍍形成的匯流電極和矽之間的附著力，再加上焊接焊帶導線時，不可避免地會對電池各層體產生作用力或有其它影響，進而導致匯流電極與基板間的附著力更差，如此一來，該匯流電極容易自該基板上脫落。另一方面，該抗反射層開孔後，也可能因為該射極層表面外露，導致其表面氧化並形成氧化矽，該氧化矽的存在也會影響電鍍金屬與該射極層之間的附著結合力。 Although the plating method can reduce production costs, there are other problems that need to be overcome. After the battery is manufactured, it must be soldered to the bus electrode of the battery with a ribbon to connect several batteries in series to form a battery module. group. The biggest problem with the front electrode made by electroplating is that the adhesion between the bus electrode and the substrate is not good after the soldering wire and the bus electrode are soldered. The possible reasons for the poor adhesion are as follows: before the plating, the anti-reflection There is still residual lanthanum nitride after the opening of the layer, and the residual lanthanum nitride hinders the plating metal (usually containing nickel) of the bus electrode from forming a nickel silicide compound with the emitter layer, resulting in a non-uniformity. The nickel ruthenium compound film, thereby reducing the adhesion between the bus electrode formed by electroplating and the crucible, and in addition to welding the strip conductor, inevitably exerts a force or other influence on the various layers of the battery, thereby causing confluence The adhesion between the electrode and the substrate is even worse, and as a result, the bus electrode is easily detached from the substrate. On the other hand, after the anti-reflection layer is opened, the surface of the emitter layer may be exposed, causing the surface to oxidize and form yttrium oxide. The presence of the yttrium oxide also affects the adhesion between the plating metal and the emitter layer. Binding force.
因此，本發明之目的，即在提供一種可降低製造成本、層體間的結合力佳的太陽能電池的製造方法。 Therefore, an object of the present invention is to provide a method for producing a solar cell which can reduce the manufacturing cost and the bonding strength between the layers.
於是，本發明太陽能電池的製造方法，包含：準備一具有一第一表面的基板；於該第一表面上形成一絕緣層，該絕緣層具有數個開口，且該第一表面之對應於該等開口的部位露出；於該絕緣層上且位於該等開口之間的位置形成數個第一電極部；進行熱處理，使該等第一電極部穿過該絕緣層而與該基板的第一表面連接；及 以電鍍方式形成一第二電極部，該第二電極部連接該等第一電極部，並透過該絕緣層之該等開口而與該第一表面連接。 Therefore, the method for manufacturing a solar cell of the present invention comprises: preparing a substrate having a first surface; forming an insulating layer on the first surface, the insulating layer having a plurality of openings, and the first surface corresponds to the And exposing a portion of the opening; forming a plurality of first electrode portions on the insulating layer at a position between the openings; performing heat treatment to pass the first electrode portions through the insulating layer and the first of the substrates Surface connection; and A second electrode portion is formed by electroplating, and the second electrode portion is connected to the first electrode portions and connected to the first surface through the openings of the insulating layer.
本發明還提供另一種製造方法，包含：準備一具有一第一表面的基板；於該第一表面上形成一絕緣層；於該絕緣層上的局部部位形成數個第一電極部；進行熱處理，使該等第一電極部穿過該絕緣層而與該基板的第一表面連接；於該絕緣層形成數個分別位於該等第一電極部之間的開口，使該基板的第一表面之對應於該等開口的部位露出；及以電鍍方式形成一第二電極部，該第二電極部連接該等第一電極部，並透過該絕緣層之該等開口而與該第一表面連接。 The present invention also provides another manufacturing method, comprising: preparing a substrate having a first surface; forming an insulating layer on the first surface; forming a plurality of first electrode portions on a portion of the insulating layer; performing heat treatment The first electrode portion is connected to the first surface of the substrate through the insulating layer; and the insulating layer is formed with a plurality of openings respectively between the first electrode portions to make the first surface of the substrate a portion corresponding to the openings is exposed; and a second electrode portion is formed by electroplating, the second electrode portion is connected to the first electrode portions, and is connected to the first surface through the openings of the insulating layer .
本發明之功效：透過兩種不同的製程形成該等第一電極部與第二電極部，可解決單獨使用電鍍電極所產生與該基板間的附著力不佳的問題，另外可改善單獨使用網印電極所造成的高成本問題。因此本發明兼具低製造成本與電池層體間的結合力佳的優點。 The effect of the invention is that the first electrode portion and the second electrode portion are formed by two different processes, which can solve the problem of poor adhesion between the substrate and the substrate by using the plating electrode alone, and can improve the net use alone. The high cost of printing electrodes. Therefore, the present invention has the advantages of low manufacturing cost and good adhesion between the battery layers.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之二個較佳實施例的詳細說明中，將可清楚的呈現。在本發明被詳細描述前，要注意的是，在以 下的說明內容中，類似的元件是以相同的編號來表示。 The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Before the present invention is described in detail, it is to be noted that In the following description, similar elements are denoted by the same reference numerals.
參閱圖1、2、3，本發明製造方法之第一較佳實施例，用於製造一太陽能電池，該太陽能電池包含：一基板1、一絕緣層2、數個第一電極部3、二個第二電極部4，以及數個第三電極部5。 Referring to Figures 1, 2 and 3, a first preferred embodiment of the manufacturing method of the present invention is for manufacturing a solar cell comprising: a substrate 1, an insulating layer 2, a plurality of first electrode portions 3, two The second electrode portion 4 and the plurality of third electrode portions 5.
本實施例的基板1為矽基板，並具有相反的一第一表面11與一第二表面12。該第一表面11為該基板1或該太陽能電池的受光面，該第二表面12為背面。實際上該基板1包括一基板本體，以及一位於該基板本體的表面處的射極層。該基板本體與該射極層的導電性相反，其中一個為p型半導體，另一個為n型半導體，藉此形成p-n接面。但由於該基板1的層體結構與層體數量非本發明的改良重點，在此不再詳細說明。 The substrate 1 of this embodiment is a germanium substrate and has a first surface 11 and a second surface 12 opposite thereto. The first surface 11 is the light receiving surface of the substrate 1 or the solar cell, and the second surface 12 is a back surface. The substrate 1 actually includes a substrate body and an emitter layer at the surface of the substrate body. The substrate body is opposite in conductivity to the emitter layer, one of which is a p-type semiconductor and the other is an n-type semiconductor, thereby forming a p-n junction. However, since the layer structure and the number of layers of the substrate 1 are not the improvement points of the present invention, they will not be described in detail herein.
該絕緣層2大致呈整面鋪設地位於該基板1的第一表面11上，但該絕緣層2局部開孔而具有數個開口21，該等開口21排列成左右兩列(即沿一第一方向排成兩列)，每一列的開口21呈現前後向間隔排列(即每一列的開口21沿一第二方向間隔排列)。該絕緣層2的材料例如氮化矽(SiNx)，可作為抗反射層，以提升光線入射量，並且能鈍化該基板1的表面，從而降低載子表面複合速率(Surface Recombination Velocity，簡稱SRV)。 The insulating layer 2 is disposed substantially on the first surface 11 of the substrate 1 , but the insulating layer 2 is partially perforated and has a plurality of openings 21 arranged in two columns (ie, along the first One row is arranged in two rows), and the openings 21 of each column are arranged in a front-rear arrangement (ie, the openings 21 of each column are arranged in a second direction). The material of the insulating layer 2, for example, silicon nitride (SiN x), can be used as anti-reflection layer, in order to enhance the amount of incident light, and can be passivated surface of the substrate 1, thereby reducing the carrier surface recombination velocity (Surface Recombination Velocity, referred SRV ).
本實施例的該等第一電極部3與該等第二電極部4共同形成兩個左右間隔且前後向延伸的匯流電極30，且這兩個匯流電極30分別對應前述兩列的該等開口21的位置。 具體來說，本實施例的每一匯流電極30包括數個前後間隔的第一電極部3，以及一前後向延伸並疊置連接於該等第一電極部3上方的第二電極部4。每一匯流電極30的該等第一電極部3位於同一列的該等開口21之間的位置，而每一匯流電極30的該第二電極部4連接該等第一電極部3，並透過該絕緣層1的該等開口21而與該基板1的該第一表面11連接。於本實施例中，該太陽能電池的一射極層(圖未示)設置於該第一表面11(受光面)處，因此每一匯流電極30與該射極層連接。本實施例的每一第二電極部4都包括依序由下往上疊置的一鎳導線41、一銅導線42與一錫導線43。其中，該錫導線43也可以使用銀導線來取代。 The first electrode portions 3 of the present embodiment and the second electrode portions 4 together form two bus electrodes 30 spaced apart from each other and extending forward and backward, and the two bus electrodes 30 respectively correspond to the openings of the two columns. 21 location. Specifically, each of the bus electrodes 30 of the present embodiment includes a plurality of first electrode portions 3 spaced apart from each other, and a second electrode portion 4 extending forward and backward and connected above the first electrode portions 3. The first electrode portions 3 of each of the bus electrodes 30 are located between the openings 21 of the same row, and the second electrode portion 4 of each of the bus electrodes 30 is connected to the first electrode portions 3 and is transparent. The openings 21 of the insulating layer 1 are connected to the first surface 11 of the substrate 1. In this embodiment, an emitter layer (not shown) of the solar cell is disposed on the first surface 11 (light receiving surface), and thus each bus electrode 30 is connected to the emitter layer. Each of the second electrode portions 4 of the present embodiment includes a nickel wire 41, a copper wire 42 and a tin wire 43 which are sequentially stacked from bottom to top. Among them, the tin wire 43 can also be replaced with a silver wire.
需要說明的是，該等匯流電極30的數量不限於兩個，也可以為一個或三個。 It should be noted that the number of the bus electrodes 30 is not limited to two, and may be one or three.
該等第三電極部5呈左右延伸地位於該絕緣層2上，該等第三電極部5互相平行且與該等匯流電極30連接，而且第三電極部5的長度方向與匯流電極30的長度方向垂直。該等第三電極部5就是一般所稱的finger bar electrode，每一第三電極部5的寬度w1小於每一匯流電極30的寬度w2。 The third electrode portions 5 are located on the insulating layer 2 so as to extend left and right. The third electrode portions 5 are parallel to each other and connected to the bus electrodes 30, and the length direction of the third electrode portion 5 and the bus electrode 30 are The length direction is vertical. The third electrode portions 5 are generally referred to as finger bar electrodes, and the width w1 of each of the third electrode portions 5 is smaller than the width w2 of each of the bus electrodes 30.
當然，該電池還具有一電連接該基板1的第二表面12(即背面)的背面電極(圖未示)，該背面電極與該等第一電極部3、第二電極部4及第三電極部5配合將電池產生的電能傳輸到外部。但由於該背面電極非本發明的改良重點，所以不再說明。 Of course, the battery further has a back electrode (not shown) electrically connected to the second surface 12 (ie, the back surface) of the substrate 1, the back electrode and the first electrode portion 3, the second electrode portion 4, and the third portion. The electrode portion 5 cooperates to transfer electric energy generated by the battery to the outside. However, since the back electrode is not an improvement point of the present invention, it will not be described.
參閱圖1、3、4、5，本實施例之太陽能電池的製造方法包含： Referring to Figures 1, 3, 4, and 5, the method for manufacturing a solar cell of the present embodiment includes:
(1)步驟61：準備具有該第一表面11的該基板1，該基板1已事先藉由擴散製程形成p型與n型半導體，從而形成p-n接面，也因此於該基板1的表面處形成該太陽能電池之該射極層(圖未示)。 (1) Step 61: preparing the substrate 1 having the first surface 11, the substrate 1 having previously formed a p-type and an n-type semiconductor by a diffusion process, thereby forming a pn junction, and thus at the surface of the substrate 1 The emitter layer (not shown) of the solar cell is formed.
(2)步驟62：於該第一表面11上形成該絕緣層2，本步驟可利用物理氣相沉積(PVD)或化學氣相沉積(CVD)等方式，先於該第一表面11上形成連續完整的絕緣層2薄膜，再於預定形成該等匯流電極30的部位進行開孔製程，以形成該絕緣層2的該等開口21，進而使該第一表面11之對應於該等開口21的部位露出。其中，該開孔製程可以利用雷射燒蝕的方式進行，但不限於此。需要說明的是，由於本實施例欲製作出兩個匯流電極30，因此該等開口21排成兩列，當只製作一個匯流電極30時，就只需要製作一列開口21。 (2) Step 62: forming the insulating layer 2 on the first surface 11, the step may be formed on the first surface 11 by means of physical vapor deposition (PVD) or chemical vapor deposition (CVD). A continuous and complete insulating layer 2 film is further subjected to an opening process at a portion where the bus electrodes 30 are to be formed to form the openings 21 of the insulating layer 2, so that the first surface 11 corresponds to the openings 21 The part is exposed. Wherein, the opening process can be performed by laser ablation, but is not limited thereto. It should be noted that since the two bus electrodes 30 are to be fabricated in this embodiment, the openings 21 are arranged in two rows. When only one bus electrode 30 is formed, only one row of openings 21 needs to be formed.
(3)步驟63：於該絕緣層2上且位於該等開口21之間的位置形成該等第一電極部3。本實施例是配合具有適當網孔設計的網版，利用網印方式將金屬導電漿料塗布於該絕緣層2上以形成第一電極部3。其中，該金屬導電漿料例如銀漿，但不限於此。 (3) Step 63: The first electrode portions 3 are formed on the insulating layer 2 at positions between the openings 21. In this embodiment, a screen is provided with a suitable mesh design, and a metal conductive paste is applied onto the insulating layer 2 by a screen printing method to form the first electrode portion 3. Here, the metal conductive paste is, for example, a silver paste, but is not limited thereto.
(4)步驟64：進行熱處理，本實施例的熱處理為高溫燒結(firing)。由於該等第一電極部3由金屬漿料形成，在燒結過程中，該等第一電極部3的材料可以侵蝕該絕緣層2之SiNx 材料，進而穿過該絕緣層2而連接該基板1的第一表面11，以和該射極層(圖未示)形成電連接。 (4) Step 64: heat treatment is performed, and the heat treatment of this embodiment is high temperature sintering. Since the first electrode portions 3 are formed of a metal paste, the materials of the first electrode portions 3 may erode the SiN x material of the insulating layer 2 during the sintering process, and then connect the substrate through the insulating layer 2 The first surface 11 of 1 is electrically connected to the emitter layer (not shown).
(5)步驟65：接著以電鍍方式在該等第一電極部3上方形成該等第二電極部4，該等第二電極部4一方面連接於該等第一電極部3上方，另一方面有局部填充於該等絕緣層2的開口21中，進而與該第一表面11連接。本實施例的每一個第二電極部4都包含鎳、銅、錫三種材料，因此在電鍍時是依序電鍍該鎳導線41、該銅導線42與該錫導線43。使用複合材料的優點在於：鎳可直接接觸該基板1的表面，鎳與矽基板之間有較佳的附著性；銅具有良好的導電性；錫與後續焊接的焊帶導線(ribbon)之間具有較佳的焊接結合力。另外，該錫導線43也可以使用銀導線取代，因為銀與焊帶導線間的焊接結合力亦佳，同時銀也具有優良導電性。由以上說明也可知，本實施例的該等第二電極部4的材質可以異於該等第一電極部3的材質。 (5) Step 65: The second electrode portions 4 are formed on the first electrode portions 3 by electroplating, and the second electrode portions 4 are connected to the first electrode portions 3 on the one hand, and the other The aspect is partially filled in the opening 21 of the insulating layer 2 and further connected to the first surface 11. Each of the second electrode portions 4 of the present embodiment contains three materials of nickel, copper, and tin. Therefore, the nickel wire 41, the copper wire 42 and the tin wire 43 are sequentially plated during plating. The advantage of using the composite material is that nickel can directly contact the surface of the substrate 1, and the nickel and the ruthenium substrate have better adhesion; the copper has good conductivity; between the tin and the subsequently soldered ribbon. Has a better welding bond. In addition, the tin wire 43 can also be replaced by a silver wire because the solder bonding force between the silver and the tape lead is also good, and silver also has excellent conductivity. As can be seen from the above description, the material of the second electrode portions 4 of the present embodiment may be different from the material of the first electrode portions 3.
參閱圖1、2、3，本發明的方法，進一步還包含形成該等第三電極部5的步驟。該等第三電極部5可以利用網印方式形成，若所有的第三電極部5都選用與該等第一電極部3相同的材料時，就可以透過一次網印同時製成第一電極部3與第三電極部5，當然，在高溫燒結時，該等第三電極部5的材料也會穿過該絕緣層2而連接該基板1的第一表面11。製成該等第一電極部3與第三電極部5後，後續電鍍該等第二電極部4時，也會同時於該等第三電極部5的上方電鍍導電層，此時該電池的指狀電極實際上是由第 三電極部5與其上方的電鍍層共同構成。在此情況下，由網印形成的下層部分可以先印得比較細以節省漿料，再透過上層的電鍍層來補足指狀電極整體的導電性。 Referring to Figures 1, 2, and 3, the method of the present invention further includes the step of forming the third electrode portions 5. The third electrode portions 5 can be formed by screen printing. If all of the third electrode portions 5 are made of the same material as the first electrode portions 3, the first electrode portion can be formed by one screen printing at the same time. 3 and the third electrode portion 5, of course, at the time of high-temperature sintering, the material of the third electrode portion 5 also passes through the insulating layer 2 to connect the first surface 11 of the substrate 1. After the first electrode portion 3 and the third electrode portion 5 are formed, when the second electrode portions 4 are subsequently plated, the conductive layer is also plated over the third electrode portions 5 at the same time. The finger electrode is actually made of The three electrode portion 5 is formed in common with the plating layer above it. In this case, the lower portion formed by the screen printing can be printed first to save the slurry, and then the upper plating layer can be used to complement the conductivity of the entire finger electrode.
另一方面，該等第三電極部5也可以利用電鍍方式形成，若第三電極部5選用與第二電極部4相同的材料時，則可以一次電鍍完成。由於電鍍材料不會蝕穿該絕緣層2，因此必須在步驟62中，同時在該絕緣層2之預定形成該等第三電極部5的部位進行開孔，以使電鍍的第三電極部5可直接披覆連接在該基板1的第一表面11上。以電鍍方式形成第三電極部5，可降低整體製程的漿料用量。 On the other hand, the third electrode portions 5 may be formed by plating, and when the third electrode portion 5 is made of the same material as the second electrode portion 4, plating can be performed once. Since the plating material does not etch through the insulating layer 2, it is necessary to perform the opening at the portion of the insulating layer 2 where the third electrode portions 5 are to be formed in the step 62 so that the third electrode portion 5 is plated. It may be directly attached to the first surface 11 of the substrate 1. Forming the third electrode portion 5 by electroplating can reduce the amount of slurry in the overall process.
此外，該等第三電極部5也可以僅有其中幾個與該等第一電極部3以同樣的製程形成，其它的第三電極部5以不同於第一電極部3的製程形成。類似地，該等第三電極部5也可以僅有其中幾個與該等第二電極部4以同樣的製程形成，其它的第三電極部5以不同於第二電極部4的製程來形成。具體而言，該等第三電極部5的其中幾個可以使用網印方式形成，其它則以電鍍方式形成。 Further, only some of the third electrode portions 5 may be formed in the same process as the first electrode portions 3, and the other third electrode portions 5 may be formed in a different process from the first electrode portion 3. Similarly, only some of the third electrode portions 5 may be formed in the same process as the second electrode portions 4, and the other third electrode portions 5 may be formed in a process different from the second electrode portion 4. . Specifically, some of the third electrode portions 5 may be formed by screen printing, and others may be formed by electroplating.
當然，該電池的製造方法中，還包含形成圖未示出的背面電極的步驟，該背面電極可以使用網印或電鍍方式形成。但由於該背面電極的製法非本發明的改良重點，所以不再說明。 Of course, the method of manufacturing the battery further includes the step of forming a back electrode not shown, which may be formed by screen printing or plating. However, since the method of manufacturing the back electrode is not an improvement of the present invention, it will not be described.
參閱圖5、6，補充說明的是，在網印形成該等第一電極部3時，該等第一電極部3的漿料塗布寬度可以如圖5的第4個流程圖所示，約略與該絕緣層2的該等開口21的 邊界對齊，但也可以如圖6所示，該等第一電極部3的塗布寬度較小，使得每一匯流電極30中的任兩相鄰的第一電極部3的間距w3大於該兩相鄰的第一電極部3之間的開口21的寬度w4。此設計的目的在於：避免漿料塗布範圍過寬時，部分漿料會流入該等開口21中，如此會造成分流現象(shunting effect)，進而降低光電流並影響電池效能。 Referring to FIGS. 5 and 6, in addition, when the first electrode portions 3 are formed on the screen, the slurry coating width of the first electrode portions 3 can be as shown in the fourth flowchart of FIG. With the openings 21 of the insulating layer 2 The boundaries are aligned, but as shown in FIG. 6, the coating width of the first electrode portions 3 is small, such that the pitch w3 of any two adjacent first electrode portions 3 in each bus electrode 30 is larger than the two phases. The width w4 of the opening 21 between the adjacent first electrode portions 3. The purpose of this design is to prevent some of the slurry from flowing into the openings 21 when the slurry coating range is too wide, which may cause a shunting effect, thereby reducing the photocurrent and affecting the battery performance.
綜上所述，本發明的匯流電極30透過兩種製程形成，該等第一電極部3利用網印配合熱處理而形成，與該基板1之間的結合力佳，可解決單獨使用電鍍電極所產生與該基板1間的附著力不佳的問題。而第二電極部4利用電鍍方式形成，可以減少使用導電漿料以降低生產成本。因此本發明同時顧及製造成本與層體結合力的考量，本發明兼具製造成本低與層體結合力佳的優點。 In summary, the bus electrode 30 of the present invention is formed by two processes, and the first electrode portions 3 are formed by screen printing and heat treatment, and the bonding force with the substrate 1 is good, and the plating electrode can be used alone. There is a problem that adhesion to the substrate 1 is poor. On the other hand, the second electrode portion 4 is formed by electroplating, and the use of the conductive paste can be reduced to reduce the production cost. Therefore, the present invention takes into consideration both the manufacturing cost and the layer bonding force, and the invention has the advantages of low manufacturing cost and good layer bonding strength.
參閱圖2、3、7、8，本發明太陽能電池的製造方法之第二較佳實施例，與該第一較佳實施例大致相同，不同的地方在於步驟順序。本實施例是先於未開孔的絕緣層2上形成該等第一電極部3之後，再進行該絕緣層2的開孔製程。至於本實施例形成各層體的方式皆與該第一較佳實施例相同，因此其具體方式不再說明，以下只說明本實施例的步驟順序。 Referring to Figures 2, 3, 7, and 8, a second preferred embodiment of the method of fabricating a solar cell of the present invention is substantially the same as the first preferred embodiment, with the exception of the sequence of steps. In this embodiment, after the first electrode portions 3 are formed on the insulating layer 2 which is not opened, the opening process of the insulating layer 2 is performed. The manner in which the layers are formed in this embodiment is the same as that in the first preferred embodiment, and therefore the specific manner is not described. Only the sequence of steps of the embodiment will be described below.
(1)步驟71：準備該具有該第一表面11的基板1。 (1) Step 71: Prepare the substrate 1 having the first surface 11.
(2)步驟72：於該第一表面11上形成絕緣層2，此時該絕緣層2尚未開孔。 (2) Step 72: Forming the insulating layer 2 on the first surface 11, at which time the insulating layer 2 is not yet opened.
(3)步驟73：於該絕緣層2上的局部部位形成該等第一 電極部3。 (3) Step 73: forming the first part on the local portion of the insulating layer 2 Electrode portion 3.
(4)步驟74：進行熱處理，使該等第一電極部3藉由其侵蝕能力而穿過該絕緣層2，進而與該基板1的第一表面11連接。 (4) Step 74: heat treatment is performed so that the first electrode portions 3 pass through the insulating layer 2 by their etching ability, and are further connected to the first surface 11 of the substrate 1.
(5)步驟75：於該絕緣層2形成開口21，且開口21的形成位置分別位於該等第一電極部3之間，並因此使該基板1的第一表面11之對應於該等開口21的部位露出。 (5) Step 75: forming an opening 21 in the insulating layer 2, and forming the opening 21 between the first electrode portions 3, respectively, and thus making the first surface 11 of the substrate 1 correspond to the openings The part of 21 is exposed.
(6)步驟76：以電鍍方式形成該第二電極部4，該第二電極部4連接該等第一電極部3，並透過該絕緣層2之該等開口21而與該基板1的第一表面11連接。同樣地，本實施例製成的第二電極部4可以包含一鎳導線41、一銅導線42與一錫導線43，該錫導線43也可以使用銀導線來取代。 (6) Step 76: forming the second electrode portion 4 by electroplating, the second electrode portion 4 connecting the first electrode portions 3, and transmitting the openings 21 of the insulating layer 2 to the substrate 1 A surface 11 is connected. Similarly, the second electrode portion 4 fabricated in this embodiment may include a nickel wire 41, a copper wire 42 and a tin wire 43, which may also be replaced with a silver wire.
本實施例進一步還包含形成數個第三電極部5的步驟。本實施例的第三電極部5同樣可以使用網印或電鍍方式形成。使用網印方式時，第三電極部5可以與第一電極部3一同網印並燒結，後續電鍍該等第二電極部4時，也可以同時於該等第三電極部5上方電鍍導電層。此作法的優點如同該第一較佳實施例所述，可將指狀電極的下方網印的較細以節省漿料，再透過上層的電鍍層來補足指狀電極整體的導電性。 This embodiment further includes a step of forming a plurality of third electrode portions 5. The third electrode portion 5 of the present embodiment can also be formed by screen printing or electroplating. When the screen printing method is used, the third electrode portion 5 can be screen printed and sintered together with the first electrode portion 3. When the second electrode portions 4 are subsequently plated, the conductive layer can be simultaneously plated over the third electrode portions 5. . The advantage of this method is as described in the first preferred embodiment. The lower portion of the finger electrode can be screen printed to save the slurry, and the upper layer of the plating layer can be used to complement the conductivity of the entire finger electrode.
若使用電鍍方式形成該等第三電極部5，則於上述的步驟75必須同時在該絕緣層2之預定形成該等第三電極部5的部位進行開孔，步驟76則可同時電鍍形成第二電極部4與第三電極部5，使第三電極部5可直接披覆連接在該基板 1的第一表面11上。 If the third electrode portions 5 are formed by electroplating, in the above step 75, it is necessary to simultaneously open the portions of the insulating layer 2 where the third electrode portions 5 are to be formed, and the step 76 can be simultaneously formed by electroplating. The second electrode portion 4 and the third electrode portion 5 allow the third electrode portion 5 to be directly attached to the substrate On the first surface 11 of 1.
本實施例可以製作出與該第一較佳實施例相同的電池結構，並達到相同的功效，在此不再說明。 This embodiment can produce the same battery structure as the first preferred embodiment and achieve the same effect, which will not be described here.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
1‧‧‧基板 1‧‧‧Substrate
11‧‧‧第一表面 11‧‧‧ first surface
12‧‧‧第二表面 12‧‧‧ second surface
2‧‧‧絕緣層 2‧‧‧Insulation
21‧‧‧開口 21‧‧‧ openings
30‧‧‧匯流電極 30‧‧‧Concurrent electrode
3‧‧‧第一電極部 3‧‧‧First electrode section
4‧‧‧第二電極部 4‧‧‧Second electrode section
41‧‧‧鎳導線 41‧‧‧ Nickel wire
42‧‧‧銅導線 42‧‧‧ copper wire
43‧‧‧錫導線 43‧‧‧ tin wire
5‧‧‧第三電極部 5‧‧‧ third electrode
61~65‧‧‧步驟 61~65‧‧‧Steps
71~76‧‧‧步驟 71~76‧‧‧Steps
w1‧‧‧第三電極部的寬度 W1‧‧‧The width of the third electrode
w2‧‧‧匯流電極的寬度 W2‧‧‧ Width of the bus electrode
w3‧‧‧第一電極部的間距 W3‧‧‧ Spacing of the first electrode part
w4‧‧‧開口的寬度 W4‧‧‧ width of opening
圖1是一太陽能電池的俯視示意圖，顯示本發明太陽能電池的製造方法之一第一較佳實施例所製造的電池；圖2是沿圖1中A-A線所取的剖面示意圖，但圖2只示意圖1的其中三個第一電極部；圖3是沿圖1中B-B線所取的剖視示意圖；圖4是該第一較佳實施例的步驟流程方塊圖；圖5是該第一較佳實施例的各步驟的流程示意圖；圖6是一類似於圖5的第4個流程的示意圖，但圖6中的第一電極部的寬度較小；圖7是本發明太陽能電池的製造方法之一第二較佳實施例的步驟流程方塊圖；及圖8是該第二較佳實施例的各步驟的流程示意圖。 1 is a top plan view of a solar cell, showing a battery manufactured by a first preferred embodiment of the method for fabricating a solar cell of the present invention; FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, but FIG. Figure 3 is a cross-sectional view taken along line BB of Figure 1; Figure 4 is a block flow diagram of the first preferred embodiment; Figure 5 is a first block diagram of the first preferred embodiment; Schematic diagram of each step of the preferred embodiment; FIG. 6 is a schematic diagram similar to the fourth flow of FIG. 5, but the width of the first electrode portion in FIG. 6 is small; FIG. 7 is a manufacturing method of the solar cell of the present invention. A flow chart of the steps of a second preferred embodiment; and FIG. 8 is a flow chart of the steps of the second preferred embodiment.
1‧‧‧基板 1‧‧‧Substrate
11‧‧‧第一表面 11‧‧‧ first surface
2‧‧‧絕緣層 2‧‧‧Insulation
21‧‧‧開口 21‧‧‧ openings
30‧‧‧匯流電極 30‧‧‧Concurrent electrode
3‧‧‧第一電極部 3‧‧‧First electrode section
4‧‧‧第二電極部 4‧‧‧Second electrode section
41‧‧‧鎳導線 41‧‧‧ Nickel wire
42‧‧‧銅導線 42‧‧‧ copper wire
43‧‧‧錫導線 43‧‧‧ tin wire
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