TW201408152A - Intaglio plate for offset gravure printing and printed wiring board - Google Patents
Intaglio plate for offset gravure printing and printed wiring board Download PDFInfo
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- TW201408152A TW201408152A TW102127361A TW102127361A TW201408152A TW 201408152 A TW201408152 A TW 201408152A TW 102127361 A TW102127361 A TW 102127361A TW 102127361 A TW102127361 A TW 102127361A TW 201408152 A TW201408152 A TW 201408152A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09272—Layout details of angles or corners
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本發明係有關用於凹版平版印刷之凹版、及具有藉由使用此凹版之凹版平版印刷而形成的配線圖案之印刷配線基材。 The present invention relates to a gravure plate for gravure lithography, and a printed wiring substrate having a wiring pattern formed by gravure lithography using the gravure.
近年來,作為建材領域、包裝領域、出版領域、電子領域等生活系統、電氣系統、資訊系統之各式各樣的領域中之工業製品的製造方法,使用凹版平版印刷之情形不斷增多。凹版平版印刷係使用各種油墨、樹脂、導電漿等之各種高黏度的塗布材料,於印刷對象物之表面廣範圍且穩定地印刷具有高解像力、高尺寸精度之優良圖像而採用的技術。 In recent years, gravure lithography has been increasing as a method of manufacturing industrial products in various fields such as a building material field, a packaging field, a publishing field, and an electronic field, such as a living system, an electric system, and an information system. Gravure lithography is a technique in which various high-viscosity coating materials such as various inks, resins, and conductive pastes are used to print an excellent image having high resolution and high dimensional accuracy over a wide range and stably on the surface of a printing object.
第1圖顯示一般之凹版平版印刷的製程。凹版平版印刷係一種轉印印刷方法,其具有:藉由刮墨刀(doctor)、刮墨板(squeegee)或刮刀(scraper)103將油墨102充填於由玻璃、樹脂、金屬等所製作之凹版平版印刷用凹版101的圖案部104內之製程(製程一);一面使具有由矽酮等之樹脂形成表面的轉印層112之轉印體111接觸於已將油墨102充填於圖案部104內之凹版平版印刷用凹版101上一面旋轉,而使油墨塗膜113轉移於轉印層112上之製程(製程二);及將轉印體111壓著 於被印刷體121,進而將殘留於轉印層112上之油墨塗膜113的印刷圖案122轉印於被印刷體121之製程(製程三)。此凹版平版印刷係能於廣範圍內以高解像度及高尺寸精度在被印刷體之表面印刷各種油墨、樹脂、導電漿等的高黏度之塗布材料。 Figure 1 shows the general gravure lithography process. Gravure lithography is a transfer printing method in which an ink 102 is filled in a gravure made of glass, resin, metal, or the like by a doctor, a squeegee, or a scraper 103. The process in the pattern portion 104 of the intaglio plate for lithography 101 (process 1); the transfer body 111 having the transfer layer 112 having a surface formed of a resin such as fluorenone or the like is brought into contact with the ink 102 having been filled in the pattern portion 104. The process of transferring the ink coating film 113 onto the transfer layer 112 by rotating the intaglio plate 100 for gravure lithography (process 2); and pressing the transfer body 111 In the to-be-printed body 121, the printing pattern 122 of the ink coating film 113 remaining on the transfer layer 112 is further transferred to the process of the to-be-printed body 121 (process 3). This gravure lithography system can print various high-viscosity coating materials such as inks, resins, conductive pastes, and the like on the surface of a printed object with high resolution and high dimensional accuracy in a wide range.
於藉由凹版平版印刷且使用導電性油墨、導電性漿等於廣範圍之面積內將IC卡天線(線圈狀之圖案)、太陽能電池背板之導電配線、電磁波屏蔽、觸控面板用之信號擷取配線等高精細地印刷於由聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、丙烯酸、玻璃等所構成之基材上的情況下,要求有下述之功能。 The IC card antenna (coil-like pattern), the conductive wiring of the solar cell backplane, the electromagnetic wave shield, and the signal for the touch panel are embossed by gravure lithography and using a conductive ink or a conductive paste. When high-definition printing such as wiring is performed on a substrate composed of polyethylene terephthalate, polyethylene naphthalate, acrylic, glass, or the like, the following functions are required.
[1]能於廣範圍內進行均勻且穩定之高精細的細線印刷。 [1] It is possible to perform uniform and stable high-definition fine line printing over a wide range.
[2]印刷於被印刷體之細線不會斷線及短路。 [2] The fine lines printed on the printed object are not broken or short-circuited.
[3]能印刷穩定之膜厚的細線。 [3] A thin line that can print a stable film thickness.
為了使用具有上述功能之凹版平版印刷進行細線圖案的量產,需要確實地使填滿於凹版具備之所期圖案部內部的油墨轉移於具有油墨剝離性之轉印層上。此外,為了形成無斷線之細線圖案,需要預先以刮墨刀、刮墨板或刮刀等將油墨充填於所期圖案部內部,並對填滿於此圖案部內部之油墨面進行平整,於與具有油墨剝離性之轉印層的轉印體進行壓著時,以使此油墨面均勻地與轉印體接觸。 In order to mass-produce the fine line pattern using the gravure lithography having the above-described functions, it is necessary to reliably transfer the ink filled in the inside of the desired pattern portion of the intaglio to the transfer layer having the ink releasability. Further, in order to form a fine line pattern without a broken line, it is necessary to fill the inside of the desired pattern portion with a doctor blade, a squeegee or a doctor blade in advance, and to flatten the ink surface filled in the inside of the pattern portion. When the transfer body having the transfer layer having ink releasability is pressed, the ink surface is uniformly brought into contact with the transfer body.
為了達成上述功能,例如,於專利文獻1記載有以下內容,即於厚膜印刷、尤其是微細圖像、或全 面圖像等之討厭針孔、斷線之圖案形成中,採用平版方式之多重印刷,藉以防止細線之不連續、印版之塞孔引起的針孔、印刷圖案之伸縮。 In order to achieve the above-described functions, for example, Patent Document 1 discloses that the film is printed on a thick film, particularly a fine image, or In the formation of patterns such as surface images, such as pinholes and broken lines, lithographic multi-printing is employed to prevent the discontinuities of the thin lines, the pinholes caused by the plug holes of the printing plates, and the stretching of the printed pattern.
專利文獻1 日本特開昭55-5856號公報。 Patent Document 1 Japanese Laid-Open Patent Publication No. 55-5856.
然而,專利文獻1記載之方法中,藉由進行多重塗布會使製程及操作變得複雜。此外,針對對充填於凹版之圖案部內部的油墨面進行平整以使此油墨面均勻地接觸於轉印體而確實地轉移至轉印層上之手段,專利文獻1中並無具體揭示。另一方面,若於所欲印刷之配線圖案存在銳角部,則當朝對應於此銳角部之凹版的圖案部內部充填油墨時,因刮墨刀等勾到銳角部,會引起刮墨刀等跳躍或油墨自凹版的洩漏。此外,因轉印體之轉印層朝凹版之圖案部內部的涉入不足,而無法確實地使油墨轉移,乃至產生油墨之取出不良。於凹版平版印刷中,隨著越想形成高精細之細線圖案,此課題就變得越顯著。 However, in the method described in Patent Document 1, the process and the operation are complicated by performing multiple coating. Further, the means for flattening the ink surface filled in the inside of the pattern portion of the intaglio plate so that the ink surface is uniformly contacted with the transfer body and is surely transferred to the transfer layer is not specifically disclosed in Patent Document 1. On the other hand, when there is an acute angle portion in the wiring pattern to be printed, when the ink is filled into the inside of the pattern portion corresponding to the concave plate of the acute angle portion, the doctor blade or the like is hooked to the acute angle portion to cause the doctor blade or the like. Jump or ink leak from the gravure. Further, since the transfer layer of the transfer body is insufficiently involved in the inside of the pattern portion of the intaglio plate, the ink cannot be reliably transferred, and the ink is poorly taken out. In gravure lithography, this problem becomes more conspicuous as the more desirable fine line patterns are formed.
因此,本發明之目的在於,防止刮墨刀等之跳躍或油墨的取出不良,穩定地供給無油墨洩漏、針孔、圖案欠缺之印刷配線基材。 Therefore, an object of the present invention is to prevent a jump in a squeegee or the like or a defect in taking out ink, and to stably supply a printed wiring substrate free from ink leakage, pinholes, and pattern defects.
作為用以解決上述課題之手段,本發明之一局面,係一種凹版平版印刷用凹版,其具有用以形成配線圖案之圖案部,該凹版平版印刷用凹版之特徵為:圖案部中之位於印刷方向的終端或起始端之圖案部的形狀為大致圓弧狀。 As a means for solving the above problems, one aspect of the present invention is a gravure for gravure lithography, which has a pattern portion for forming a wiring pattern, and the gravure for gravure lithography is characterized in that the pattern portion is located in printing The shape of the terminal or the pattern of the starting end of the direction is substantially arc-shaped.
此外,以該圖案部之寬度為10μm以上、5mm以下,且圖案部之曲率半徑為10μm以上、200μm以下為較佳。 Further, the width of the pattern portion is preferably 10 μm or more and 5 mm or less, and the radius of curvature of the pattern portion is preferably 10 μm or more and 200 μm or less.
此外,本發明之另一局面,係一種印刷配線基材,其具有藉由凹版平版印刷而形成之配線圖案,該印刷配線基材之特徵為:配線圖案中之位於印刷方向的終端或起始端之配線圖案的形狀為大致圓弧狀。 Further, another aspect of the present invention is a printed wiring substrate having a wiring pattern formed by gravure lithography, the printed wiring substrate being characterized by a terminal or a starting end of the wiring pattern in the printing direction The shape of the wiring pattern is substantially arcuate.
此外,以該配線圖案之寬度為10μm以上、5mm以下,且配線圖案之曲率半徑為10μm以上、200μm以下為較佳。 Further, the width of the wiring pattern is preferably 10 μm or more and 5 mm or less, and the radius of curvature of the wiring pattern is preferably 10 μm or more and 200 μm or less.
藉由使用本發明之凹版平版印刷用凹版,可防止刮墨刀等之跳躍或油墨的取出不良,形成無油墨洩漏、針孔、圖案欠缺之印刷配線基材。特別是隨著配線圖案之進一步變細,本發明之凹版平版印刷用凹版的效果更為顯著,因此適合於微細之配線圖案的形成。 By using the intaglio plate for gravure lithography of the present invention, it is possible to prevent the squeegee or the like from jumping or the ink from being taken out, and to form a printed wiring substrate free from ink leakage, pinholes, and pattern defects. In particular, as the wiring pattern is further thinned, the gravure for gravure lithography of the present invention is more remarkable, and thus it is suitable for formation of a fine wiring pattern.
101‧‧‧凹版平版印刷用凹版 101‧‧‧ Gravure for gravure lithography
102‧‧‧油墨 102‧‧‧Ink
103‧‧‧刮墨刀、刮墨板或刮刀 103‧‧‧Scraper, squeegee or scraper
104‧‧‧圖案部 104‧‧‧The Department of Patterns
111‧‧‧轉印體 111‧‧‧Transfer body
112‧‧‧轉印層 112‧‧‧Transfer layer
113‧‧‧油墨塗膜 113‧‧‧Ink coating
121‧‧‧被印刷體 121‧‧‧Printed body
122‧‧‧印刷圖案 122‧‧‧Printed pattern
210‧‧‧凹版平版印刷用凹版 210‧‧‧Gravure for gravure lithography
211‧‧‧圖案部 211‧‧‧The Department of Patterns
212‧‧‧終端部 212‧‧‧End Department
310‧‧‧凹版平版印刷用凹版 310‧‧‧ Gravure for gravure lithography
311‧‧‧圖案部 311‧‧‧The Department of Patterns
312‧‧‧起始端部 312‧‧‧ starting end
410‧‧‧凹版平版印刷用凹版 410‧‧‧Gravure for gravure lithography
411‧‧‧圖案部 411‧‧‧The Department of Patterns
412‧‧‧起始端部 412‧‧‧ starting end
413‧‧‧終端部 413‧‧‧End Department
510‧‧‧凹版平版印刷用凹版 510‧‧ ‧ gravure for gravure lithography
511‧‧‧圖案部 511‧‧‧The Department of Patterns
512‧‧‧起始端部 512‧‧‧ starting end
513‧‧‧終端部 513‧‧‧End Department
第1圖為本發明之凹版平版印刷之製程圖。 Figure 1 is a process diagram of gravure lithography of the present invention.
第2圖為顯示本發明之凹版平版印刷用凹版的一實施形態之俯視圖。 Fig. 2 is a plan view showing an embodiment of the intaglio plate for gravure lithography of the present invention.
第3圖為顯示本發明之凹版平版印刷用凹版的一實施形態之俯視圖。 Fig. 3 is a plan view showing an embodiment of the intaglio plate for gravure lithography of the present invention.
第4圖為顯示實施例之凹版平版印刷用凹版之俯視圖。 Fig. 4 is a plan view showing a gravure for gravure lithography of the embodiment.
第5圖為顯示比較例之凹版平版印刷用凹版之俯視圖。 Fig. 5 is a plan view showing a gravure for gravure lithography of a comparative example.
以下,參照圖式對本發明之實施形態進行說明。又,本發明之實施形態不限於以下所記載之實施形態,可根據熟悉該項技藝者之知識增加設計之變更等的變形,加上此種變形後之實施形態也包含於本發明的實施形態之範圍內。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Further, the embodiment of the present invention is not limited to the embodiment described below, and modifications such as changes in design may be added according to the knowledge of those skilled in the art, and the embodiment after the modification is also included in the embodiment of the present invention. Within the scope.
以下,參照第1圖,即前述之一般的凹版平版印刷之製程圖,對本發明之實施形態的凹版平版印刷之製程進行說明。 Hereinafter, the process of gravure lithography according to the embodiment of the present invention will be described with reference to Fig. 1, which is a general process diagram of gravure printing.
首先,如第1圖之製程一所示,於凹版平版印刷用凹版101上載放油墨102,一面利用刮墨刀、刮墨板或刮刀103將油墨102以一定壓力朝圖中的箭頭方向滾動一面移動於凹版平版印刷用凹版101上,藉此將油墨102充填於凹版平版印刷用凹版101之圖案部104內。 First, as shown in the first process of Fig. 1, the ink 102 is placed on the intaglio plate gravure 101, and the ink 102 is rolled by a certain pressure against the arrow in the figure by a doctor blade, a squeegee or a doctor blade 103. The ink 102 is placed on the intaglio plate 100 for gravure printing, whereby the ink 102 is filled in the pattern portion 104 of the intaglio plate 100 for gravure printing.
此時,凹版平版印刷用凹版101之圖案部104係由寬度為10μm~5mm左右,其中以40μm~700μm為較佳,以100μm~400μm為更佳,且深度為5μm~20μm左右的槽所形成。此外,槽與槽之間的距離係10μm~100μm左右,又以20μm~50μm為較佳。在此,若於圖案部中之位在印刷方向的終端之圖案部存在銳角部,則刮墨刀等之油墨充填刃於銳角部發生跳躍,而引起油墨洩漏。藉此,於圖案部之銳角部附近產生島狀的不良。 In this case, the pattern portion 104 of the intaglio plate for gravure lithography has a width of about 10 μm to 5 mm, preferably 40 μm to 700 μm, more preferably 100 μm to 400 μm, and a groove having a depth of about 5 μm to 20 μm. . Further, the distance between the groove and the groove is about 10 μm to 100 μm, and preferably 20 μm to 50 μm. Here, when the pattern portion of the pattern portion has an acute angle portion in the pattern portion of the terminal in the printing direction, the ink filling blade such as the doctor blade jumps at the acute angle portion to cause ink leakage. Thereby, an island-shaped defect occurs in the vicinity of the acute corner portion of the pattern portion.
因此,本發明之凹版平版印刷用凹版之圖案部,例如,如第2圖所示,於使用具有圖案部211之凹版平版印刷用凹版210使刮墨刀朝Y方向移動之情況下,圖案部211中之Y方向的終端部212成為圓弧狀。 藉此,可防止刮墨刀之跳躍,可減少位於印刷方向之終端的圖案部附近所產生之島狀不良。 Therefore, in the pattern portion of the intaglio plate for gravure lithography of the present invention, for example, as shown in Fig. 2, when the squeegee is moved in the Y direction using the intaglio 210 for gravure lithography having the pattern portion 211, the pattern portion The terminal portion 212 in the Y direction of 211 has an arc shape. Thereby, it is possible to prevent the squeegee from jumping, and it is possible to reduce the island-like defect occurring in the vicinity of the pattern portion of the terminal located in the printing direction.
圖案部211中之Y方向的終端部212之形狀,係以由可防止刮墨刀之跳躍的圓弧狀、加工成圓角之形狀、橢圓弧形等之任意曲線所構成之大致圓弧狀為較佳。此外,於圖案部211中之Y方向的終端部212之形狀為大致圓弧狀的情形下,以其曲率半徑(R)為10μm~200μm為較佳,又以20μm~150μm為更佳。例如,於第2圖所示例子之情況下,圖案部211中之Y方向的終端部212為圓弧狀,因此,以構成終端部212之曲線整體的曲率半徑(R)為10μm~200μm為較佳,又以20μm~150μm為更佳。此外,於圖案部211中之Y方向 的終端部212為加工成圓角之形狀的情況下,以構成終端部212之曲線中的被形成為圓角之角的曲率半徑(R)為10μm~200μm為較佳,又以20μm~150μm為更佳。 The shape of the end portion 212 in the Y direction in the pattern portion 211 is substantially arc-shaped by an arbitrary curve such as an arc shape that can prevent the squeegee from jumping, a shape that is rounded, an elliptical arc shape, or the like. It is better. Further, in the case where the shape of the end portion 212 in the Y direction in the pattern portion 211 is substantially arcuate, the radius of curvature (R) is preferably 10 μm to 200 μm, and more preferably 20 μm to 150 μm. For example, in the case of the example shown in FIG. 2, the end portion 212 in the Y direction of the pattern portion 211 has an arc shape. Therefore, the radius of curvature (R) of the entire curve constituting the end portion 212 is 10 μm to 200 μm. Preferably, it is more preferably 20 μm to 150 μm. Further, the Y direction in the pattern portion 211 When the terminal portion 212 is formed into a rounded shape, the radius of curvature (R) of the corner formed in the end portion 212 is preferably 10 μm to 200 μm, and is preferably 20 μm to 150 μm. For better.
此外,圖案部211中之Y方向的終端部212之形狀,係將凹版平版印刷用凹版210之上面的形狀形成為圓弧狀。另一方面,圖案部211中之Y方向的終端部212之側截面的形狀,並無特別限制,可舉出以約90度構成角部之形狀、以鈍角構成角部的形狀,加工成圓角而以大致圓弧狀所構成之形狀等。 Further, the shape of the end portion 212 in the Y direction in the pattern portion 211 is formed into an arc shape by the shape of the upper surface of the intaglio plate gravure 210. On the other hand, the shape of the side cross section of the end portion 212 in the Y direction in the pattern portion 211 is not particularly limited, and a shape in which the corner portion is formed at about 90 degrees and a corner portion at an obtuse angle is formed into a circle. A shape formed by a substantially arc shape at an angle.
這裡,印刷方向係指將轉移至轉印體之轉印層表面的油墨塗膜轉印於被印刷體時之轉印體的移動方向。此印刷方向係與使充填於凹版平版印刷用凹版之圖案部的油墨轉移至轉印體之轉印層表面時之轉印體的移動方向相同。此外,凹版平版印刷用凹版之圖案部的印刷方向之終端,係指配置於轉印體之移動方向的最下游側之凹部的位置。換言之,該位置係指最後與轉印體接觸之凹版平版印刷用凹版的凹部之位置。此外,亦稱此終端為終端部。 Here, the printing direction refers to a moving direction of the transfer body when the ink coating film transferred to the surface of the transfer layer of the transfer body is transferred to the object to be printed. This printing direction is the same as the moving direction of the transfer body when the ink filled in the pattern portion of the intaglio plate for gravure printing is transferred to the surface of the transfer layer of the transfer body. Further, the terminal end in the printing direction of the pattern portion of the intaglio plate for gravure lithography means the position of the concave portion disposed on the most downstream side in the moving direction of the transfer body. In other words, the position refers to the position of the concave portion of the intaglio plate for gravure lithography which is finally in contact with the transfer body. In addition, this terminal is also referred to as a terminal unit.
此外,凹版平版印刷用凹版101係以表面平整為較佳。藉此,可進行印刷卻不會發生油墨朝凹版表面之洩漏。此外,還可抑制刮墨刀等之缺口等。這裡,凹版平版印刷用凹版101之表面係指凹版平版印刷用凹版101中的與刮墨刀、刮墨板或刮刀103接觸之表面、或者凹版平版印刷用凹版101之圖案部104(槽)的內側表 面。又,凹版平版印刷用凹版101之表面可藉由粗面研磨加工、鏡面研磨加工、超精密研磨加工(研磨或拋光)進行平整。 Further, the intaglio plate 100 for gravure lithography preferably has a flat surface. Thereby, printing can be performed without leakage of ink toward the surface of the intaglio. Further, it is possible to suppress a notch or the like of the doctor blade or the like. Here, the surface of the intaglio plate for gravure lithography refers to the surface of the intaglio plate gravure 101 for contact with the doctor blade, the squeegee or the blade 103, or the pattern portion 104 (groove) of the intaglio plate 100 for gravure lithography. Inside table surface. Further, the surface of the intaglio plate for gravure lithography can be flattened by rough grinding, mirror polishing, or ultra-precision polishing (grinding or polishing).
作為凹版平版印刷用凹版101之圖案部104的形成方法,可舉出蝕刻法、電鑄法、噴砂法等。自這些之形成方法的加工性之觀點考慮,以凹版平版印刷用凹版101係玻璃或銅、鎳等之金屬為較佳。此外,以表面形成鉻或碳之耐擦性塗膜為較佳。 As a method of forming the pattern portion 104 of the intaglio plate 100 for gravure lithography, an etching method, an electroforming method, a sand blast method, or the like can be given. From the viewpoint of workability of the formation method of these, it is preferable to use a gravure 101-type glass for gravure lithography, a metal such as copper or nickel. Further, it is preferable to form a scratch-resistant coating film of chromium or carbon on the surface.
此外,自需要將油墨102充填於凹版平版印刷用凹版101之圖案部104內且刮除凹版平版印刷用凹版101上之油墨102的角度考慮,要求刮墨刀、刮墨板或刮刀103具有某種程度之撓度。藉此,以刮墨刀、刮墨板或刮刀103係不鏽鋼等之金屬或聚胺基甲酸酯等的樹脂、陶瓷為較佳。 Further, from the viewpoint of filling the ink portion 102 in the pattern portion 104 of the intaglio plate gravure 101 and scraping the ink 102 on the intaglio plate gravure 101, it is required that the doctor blade, the doctor blade or the doctor blade 103 have a certain Degree of deflection. Therefore, it is preferable to use a metal such as a doctor blade, a squeegee or a doctor blade 103, or a resin such as a polyurethane or a ceramic such as a polyurethane.
其次,如第1圖之製程二所示,使具有轉印層112之轉印體111於圖案部104充填有油墨102之凹版平版印刷用凹版101上旋轉及移動,將凹版平版印刷用凹版101之圖案部104內的油墨102轉印於轉印層112上,於轉印層112上形成油墨塗膜113。作為形成轉印層112之材料,可使用公知之材料,其中又以矽酮橡膠為較佳。 Next, as shown in the second process of Fig. 1, the transfer body 111 having the transfer layer 112 is rotated and moved on the intaglio plate gravure 101 in which the pattern portion 104 is filled with the ink 102, and the intaglio plate for gravure lithography is used. The ink 102 in the pattern portion 104 is transferred onto the transfer layer 112, and an ink coating film 113 is formed on the transfer layer 112. As the material for forming the transfer layer 112, a known material can be used, and among them, an anthrone rubber is preferable.
此時,為了形成無針孔、圖案欠缺之配線圖案,需要使轉印層112之表面與充填於凹版平版印刷用凹版101之圖案部104的油墨102面在接觸面內均勻地接觸。然而,若於位在印刷方向之起始端之圖案部存在 銳角部,則轉印體之轉印層於銳角部附近不會掉落圖案部內部,進而會產生油墨取出不良而引起之針孔、圖案欠缺。 At this time, in order to form a wiring pattern having no pinholes or a pattern, it is necessary to uniformly contact the surface of the transfer layer 112 with the surface of the ink 102 filled in the pattern portion 104 of the intaglio plate gravure 101 in the contact surface. However, if there is a pattern portion at the beginning of the printing direction In the acute corner portion, the transfer layer of the transfer body does not fall inside the pattern portion in the vicinity of the acute corner portion, and pinholes and patterns are defective due to ink removal failure.
因此,本發明之凹版平版印刷用凹版之圖案部,例如,如第3圖所示,於使用具有圖案部311之凹版平版印刷用凹版310使轉印體朝Y方向移動之情況下,圖案部311中之Y方向的起始端部312成為加工成圓角的形狀。藉此,轉印體之轉印層充分掉落圖案部內部,所以可減輕油墨取出不良。 Therefore, in the pattern portion of the intaglio plate for gravure printing of the present invention, for example, as shown in Fig. 3, when the transfer body is moved in the Y direction by using the intaglio plate for gravure lithography having the pattern portion 311, the pattern portion The start end portion 312 in the Y direction of 311 is shaped into a rounded shape. Thereby, the transfer layer of the transfer body is sufficiently dropped inside the pattern portion, so that the ink removal failure can be reduced.
圖案部311中之Y方向的起始端部312之形狀,係以由可減輕油墨取出不良的圓弧狀、加工成圓角之形狀、橢圓弧形等之任意曲線所構成之大致圓弧狀、或八角形等之多角形的一部分所構成之形狀為較佳。此外,於圖案部311中之Y方向的起始端部312之形狀為大致圓弧狀的情況下,以其曲率半徑(R)為10μm~200μm為較佳,以20μm~150μm為更佳。例如,於第3圖所示例子之情況下,圖案部311中之Y方向的起始端部312為加工成圓角之形狀,因此,以構成起始端部312之曲線中的加工成圓角之角的曲率半徑(R)為10μm~200μm為較佳,又以20μm~150μm為更佳。此外,於圖案部311中之Y方向的起始端部312為圓弧狀之情況下,以構成起始端部312之曲線整體的曲率半徑(R)為10μm~200μm為較佳,又以20μm~150μm為更佳。 The shape of the starting end portion 312 in the Y direction of the pattern portion 311 is substantially arc-shaped, which is formed by an arbitrary curve such as an arc shape that can reduce ink removal failure, a shape that is rounded, an elliptical arc shape, or the like. A shape formed by a part of a polygon such as an octagon or the like is preferable. Further, when the shape of the starting end portion 312 in the Y direction in the pattern portion 311 is substantially arcuate, the radius of curvature (R) is preferably 10 μm to 200 μm, more preferably 20 μm to 150 μm. For example, in the case of the example shown in FIG. 3, the start end portion 312 of the pattern portion 311 in the Y direction is a shape that is rounded, and therefore, is rounded in the curve constituting the start end portion 312. The radius of curvature (R) of the corner is preferably from 10 μm to 200 μm, more preferably from 20 μm to 150 μm. Further, when the start end portion 312 of the pattern portion 311 in the Y direction is an arc shape, the radius of curvature (R) of the entire curve constituting the start end portion 312 is preferably 10 μm to 200 μm, and is preferably 20 μm. 150 μm is more preferred.
此外,圖案部311中之Y方向的起始端部312之形狀,係使凹版平版印刷用凹版310之上面的形狀成為加工成圓角的形狀。另一方面,圖案部311中之Y方向的起始端部312之側截面的形狀,並無特別限制,可舉出以約90度構成角部之形狀、以鈍角構成角部的形狀,加工成圓角而以大致圓弧狀所構成之形狀等。 Further, the shape of the starting end portion 312 in the Y direction in the pattern portion 311 is such that the shape of the upper surface of the intaglio plate for gravure lithography is formed into a rounded shape. On the other hand, the shape of the side cross section of the starting end portion 312 in the Y direction in the pattern portion 311 is not particularly limited, and a shape in which the corner portion is formed at about 90 degrees and a corner portion at an obtuse angle is formed. A shape formed by a rounded shape and a substantially arc shape.
這裡,凹版平版印刷用凹版之圖案部的印刷方向之起始端,係指配置於轉印體之移動方向的最下游側之凹部的位置。換言之,該位置係指最初與轉印體接觸之凹版平版印刷用凹版的凹部之位置。此外,亦稱此起始端為起始端部。 Here, the starting end of the printing direction of the pattern portion of the intaglio plate for gravure lithography means the position of the concave portion disposed on the most downstream side in the moving direction of the transfer body. In other words, the position refers to the position of the concave portion of the intaglio plate for gravure lithography which is initially in contact with the transfer body. In addition, this starting end is also referred to as the starting end.
最後,如第1圖之製程三所示,使轉印體111滾動而將油墨塗膜113轉印於被印刷體121上,藉以形成印刷圖案122,獲得印刷配線基材。又,本發明中,凹版平版印刷用凹版之圖案部的特徵為,印刷方向之終端部或起始端部之形狀為大致圓弧狀,此以外之部分,例如連結圖案部之印刷方向的終端部及起始端部之中心部,可為寬度比印刷方向之終端部或起始端部狹窄的形狀或彎曲的形狀,又,也可為自中心部分叉成單數或複數個圖案之形狀。 Finally, as shown in the third process of FIG. 1, the transfer body 111 is rolled to transfer the ink coating film 113 onto the object to be printed 121, whereby the printed pattern 122 is formed, and a printed wiring substrate is obtained. Further, in the present invention, the pattern portion of the intaglio plate for gravure lithography is characterized in that the shape of the end portion or the starting end portion in the printing direction is a substantially arc shape, and the other portions are, for example, the end portion of the printing direction in which the pattern portion is connected. And the central portion of the starting end portion may be a shape having a narrower width or a curved end than the end portion or the starting end portion of the printing direction, or may be a shape of a single number or a plurality of patterns from the center portion.
本發明之印刷配線基材係藉由使用上述本發明之凹版平版印刷用凹版的凹版平版印刷而製作。首先,使充填於本發明之凹版平版印刷用凹版的圖案部之油墨轉移至轉印體之轉印層上。接著,使形成之油墨塗膜轉印於基材上,藉此,於基材上形成印刷圖案。 The printed wiring substrate of the present invention is produced by gravure lithography using the gravure for gravure lithography of the present invention described above. First, the ink filled in the pattern portion of the intaglio plate for gravure printing of the present invention is transferred onto the transfer layer of the transfer body. Next, the formed ink coating film is transferred onto the substrate, whereby a printed pattern is formed on the substrate.
形成於基材上之印刷圖案,其中位於印刷方向之終端的配線圖案的形狀為大致圓弧狀。如此,本發明之印刷配線基材,位於印刷方向之終端的配線圖案的形狀為大致圓弧狀,因此具備無油墨洩漏引起之島狀不良的高精細之配線圖案。又,配線圖案之形狀相當於凹版平版印刷用凹版的圖案部之形狀,因此,配線圖案之寬度係10μm~5mm左右,以40μm~700μm為較佳,以100μm~400μm為更佳。此外,於印刷圖案中之位在印刷方向之終端的配線圖案的形狀為大致圓弧狀的情況下,以其曲率半徑(R)為10μm~200μm為較佳,以20μm~150μm為更佳。 A printed pattern formed on a substrate, wherein a shape of the wiring pattern at the terminal end in the printing direction is substantially arcuate. As described above, in the printed wiring board of the present invention, since the wiring pattern located at the end of the printing direction has a substantially arc shape, it has a high-definition wiring pattern which is free from island defects due to ink leakage. Further, since the shape of the wiring pattern corresponds to the shape of the pattern portion of the intaglio plate for gravure printing, the width of the wiring pattern is about 10 μm to 5 mm, preferably 40 μm to 700 μm, and more preferably 100 μm to 400 μm. Further, in the case where the shape of the wiring pattern at the end of the printing direction in the printing direction is substantially arcuate, the radius of curvature (R) is preferably 10 μm to 200 μm, more preferably 20 μm to 150 μm.
又,形成於基材上之印刷圖案,其中位於印刷方向之起始端的配線圖案的形狀為大致圓弧狀。如此,本發明之印刷配線基材,位於印刷方向之起始端的配線圖案的形狀為大致圓弧狀,因此具備無針孔、圖案缺口的高精細之配線圖案。又,配線圖案之形狀相當於凹版平版印刷用凹版的圖案部之形狀,因此,配線圖案之寬度係10μm~5mm左右,以40μm~700μm為較佳,以100μm~400μm為更佳。此外,於印刷圖案中之位在印刷方向之起始端的配線圖案的形狀為大致圓弧狀的情況下,以其曲率半徑(R)為10μm~200μm為較佳,以20μm~150μm為更佳 Further, in the printed pattern formed on the substrate, the shape of the wiring pattern located at the beginning of the printing direction is substantially arcuate. As described above, in the printed wiring board of the present invention, the wiring pattern located at the beginning of the printing direction has a substantially arc shape, and thus has a high-definition wiring pattern having no pinholes or pattern notches. Further, since the shape of the wiring pattern corresponds to the shape of the pattern portion of the intaglio plate for gravure printing, the width of the wiring pattern is about 10 μm to 5 mm, preferably 40 μm to 700 μm, and more preferably 100 μm to 400 μm. Further, when the shape of the wiring pattern at the start end of the printing direction in the printing pattern is substantially arc-shaped, the radius of curvature (R) is preferably 10 μm to 200 μm, more preferably 20 μm to 150 μm.
首先,準備2種類之具備測試用的圖案部之凹版平版印刷用凹版。第4圖顯示實施例之凹版平版印 刷用凹版之概略構成。實施例用之凹版平版印刷用凹版410係使用縱長120mm、橫寬120mm、高度3mm之玻璃,且利用蝕刻形成圖案部411者。圖案部411之寬度為300μm。圖案部411之深度為10μm。印刷方向(Y方向)之起始端部412及終端部413係成為圓弧狀。 First, two kinds of intaglio plates for gravure lithography having a pattern portion for testing are prepared. Figure 4 shows the gravure lithographic printing of the embodiment The brush is constructed with a rough outline. In the gravure plate for gravure lithography used in the examples, a glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm was used, and the pattern portion 411 was formed by etching. The width of the pattern portion 411 is 300 μm. The depth of the pattern portion 411 is 10 μm. The start end portion 412 and the end portion 413 in the printing direction (Y direction) are formed in an arc shape.
接著,第5圖顯示比較例之凹版平版印刷用凹版。比較例之凹版平版印刷用凹版510係使用縱長120mm、橫寬120mm、高度3mm之玻璃,且利用蝕刻形成圖案部511者。圖案部511之寬度為300μm。圖案部511之深度為10μm。印刷方向(Y方向)之起始端部512及終端部513係由銳角所構成。 Next, Fig. 5 shows a gravure for gravure lithography of a comparative example. In the gravure 510 for gravure printing of a comparative example, the glass of the longitudinal length of 120 mm, the width of the width of 120 mm, and the height of 3 mm was used, and the pattern part 511 was formed by etching. The width of the pattern portion 511 is 300 μm. The depth of the pattern portion 511 is 10 μm. The start end portion 512 and the end portion 513 in the printing direction (Y direction) are constituted by acute angles.
為了使用此2種類之凹版平版印刷用凹版,於聚對苯二甲酸乙二酯基材上形成由導電性銀漿構成之配線圖案,進行了凹版平版印刷。 In order to use these two types of intaglio for gravure lithography, a wiring pattern made of a conductive silver paste was formed on a polyethylene terephthalate substrate, and gravure lithography was performed.
聚對苯二甲酸乙二酯基材係使用厚度為188μm、縱長為120mm、橫寬為120mm者。此外,作為導電性銀漿係使用以流變測量裝置所測得的、角速度10rad/秒下的黏度為9.5Pa.s之油墨。此外,油墨剝離性之轉印體係使用將以金陽社製之矽酮橡膠作為主體的橡膠硬度(JIS A)為45度,且橡膠厚度為0.6mm之素材捲繞成圓筒者。此外,刮墨刀係使用MDC社製之標準型刮墨刀。 The polyethylene terephthalate substrate used was a thickness of 188 μm, a length of 120 mm, and a width of 120 mm. Further, as the conductive silver paste, an ink having a viscosity of 9.5 Pa.s at an angular velocity of 10 rad/sec as measured by a rheometer was used. In addition, the ink-repellent transfer system was obtained by winding a material having a rubber hardness (JIS A) of a ketone rubber manufactured by Jinyang Co., Ltd. as a main body and having a rubber thickness of 0.6 mm. Further, the doctor blade used a standard type doctor blade manufactured by MDC.
凹版平版印刷裝置係使用一般所使用之印刷裝置。印刷條件為,設刮墨刀速度為50mm/秒,轉印體速度為50mm/秒,轉印體與凹版平版印刷用凹版之接觸 寬度、轉印體與聚對苯二甲酸乙二酯基材的接觸寬度一律為10mm。 The gravure lithography apparatus uses a printing apparatus generally used. The printing conditions were such that the speed of the doctor blade was 50 mm/sec, the speed of the transfer body was 50 mm/sec, and the transfer body was in contact with the intaglio plate for gravure lithography. The width, the contact width of the transfer body and the polyethylene terephthalate substrate were uniformly 10 mm.
實施例及比較例之印刷配線基材,係藉由以下之製程所製作。首先,藉由刮墨刀將上述導電性銀漿充填於所準備之凹版平版印刷用凹版810的圖案部。接著,於充填有油墨之凹版平版印刷用凹版上,使上述轉印體朝凹版平版印刷用凹版之印刷方向(Y方向)旋轉及移動,於矽酮橡膠上形成導電性銀漿的塗膜。最後,使形成有導電性銀漿之塗膜的轉印體朝聚對苯二甲酸乙二酯基材之印刷方向旋轉及移動,將導電性銀漿之塗膜轉印於聚對苯二甲酸乙二酯基材上,進而形成配線圖案。 The printed wiring substrates of the examples and the comparative examples were produced by the following processes. First, the conductive silver paste is filled in the pattern portion of the prepared intaglio plate 810 for gravure printing by a doctor blade. Next, on the intaglio for gravure lithography filled with ink, the transfer body is rotated and moved in the printing direction (Y direction) of the intaglio plate for gravure printing to form a coating film of conductive silver paste on the fluorenone rubber. Finally, the transfer body of the coating film on which the conductive silver paste is formed is rotated and moved in the printing direction of the polyethylene terephthalate substrate, and the coating film of the conductive silver paste is transferred to the polyterephthalic acid. A wiring pattern is further formed on the ethylene glycol substrate.
於上述條件下,以實施例及比較例之各個凹版平版印刷用凹版進行凹版平版印刷,各製作20片實施例及比較例之印刷配線基材。實施例之印刷配線基材的配線圖案無針孔、油墨洩漏,配線圖案為良好之形狀。另一方面,確認了比較例之印刷配線基材的配線圖案,在印刷方向的起始端有針孔,於終端具有油墨洩漏引起之島狀異常。 Under the above conditions, intaglio lithography was performed on each gravure for gravure lithography of the examples and the comparative examples, and 20 printed wiring substrates of the examples and the comparative examples were produced. The wiring pattern of the printed wiring substrate of the example has no pinholes and ink leakage, and the wiring pattern has a good shape. On the other hand, the wiring pattern of the printed wiring board of the comparative example was confirmed, and there was a pinhole at the beginning of the printing direction, and there was an island-like abnormality due to ink leakage at the terminal.
藉由使用本發明之凹版平版印刷用凹版,可製作具備無針孔及島狀異常之良好配線圖案的印刷配線基材。 By using the intaglio plate for gravure lithography of the present invention, a printed wiring substrate having a good wiring pattern without pinholes and island-like abnormalities can be produced.
210‧‧‧凹版平版印刷用凹版 210‧‧‧Gravure for gravure lithography
211‧‧‧圖案部 211‧‧‧The Department of Patterns
212‧‧‧終端部 212‧‧‧End Department
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JP3474715B2 (en) * | 1996-10-02 | 2003-12-08 | 松下電器産業株式会社 | Intaglio for intaglio offset printing |
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US8101231B2 (en) * | 2007-12-07 | 2012-01-24 | Cabot Corporation | Processes for forming photovoltaic conductive features from multiple inks |
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