TW201408146A - Flexible printed circuit board and production method therefor - Google Patents
Flexible printed circuit board and production method therefor Download PDFInfo
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- TW201408146A TW201408146A TW102116779A TW102116779A TW201408146A TW 201408146 A TW201408146 A TW 201408146A TW 102116779 A TW102116779 A TW 102116779A TW 102116779 A TW102116779 A TW 102116779A TW 201408146 A TW201408146 A TW 201408146A
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- Prior art keywords
- bus bar
- circuit board
- printed circuit
- flexible printed
- connection terminal
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000005304 joining Methods 0.000 claims abstract description 3
- 238000005476 soldering Methods 0.000 claims description 16
- 239000012212 insulator Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 65
- 239000011889 copper foil Substances 0.000 abstract description 59
- 230000008602 contraction Effects 0.000 abstract description 7
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- -1 yttrium imide Chemical class 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/24—Electric supply or control circuits therefor
- B23K11/25—Monitoring devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/10—Spot welding; Stitch welding
- B23K11/11—Spot welding
- B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
本發明係有關一種撓性印刷基板(FPC)及其製造方法，特別是有關謀求提升撓性印刷基板的連接端子(金屬箔)與匯流排的接合強度之撓性印刷基板及其製造方法。 The present invention relates to a flexible printed circuit board (FPC) and a method of manufacturing the same, and, in particular, to a flexible printed circuit board for improving the bonding strength between a connection terminal (metal foil) of a flexible printed circuit board and a bus bar, and a method of manufacturing the same.
以往，在將撓性印刷基板的連接端子和匯流排接合的情況，一般廣泛採用電阻銲。此電阻銲的通電方法係大致區分成直接通電方式與並行通電方式。 Conventionally, in the case where the connection terminals of the flexible printed circuit board and the bus bar are joined, resistance welding is generally widely used. The method of energizing this resistance welding is roughly divided into a direct energization mode and a parallel energization mode.
茲依據圖4及圖5來說明直接通電方式的習知例。此外，為說明方便，撓性印刷基板或電極等之尺寸係放大加以圖示。 A conventional example of the direct energization method will be described with reference to Figs. 4 and 5 . Further, for convenience of explanation, the dimensions of the flexible printed circuit board, the electrodes, and the like are enlarged and shown.
如圖4所示，於厚的金屬製的匯流排(導電板)1上面的一端側部分，載置有由聚醯亞胺製的基座2、銅箔部(連接端子)3及聚醯亞胺製的保護層4所構成的三層構造的撓性印刷基板5的端子部分。又，撓性印刷基板5的銅箔部3係露出和匯流排1對應之部分的下面，該銅箔部3的露出面係與匯流排1的上面接觸。 As shown in FIG. 4, a susceptor 2 made of polyimide, a copper foil part (connection terminal) 3, and a polyfluorene are placed on one end side of the upper surface of the thick metal bus bar (conductive plate) 1. A terminal portion of a flexible printed circuit board 5 having a three-layer structure composed of a protective layer 4 made of an imide. Further, the copper foil portion 3 of the flexible printed circuit board 5 exposes the lower surface of the portion corresponding to the bus bar 1, and the exposed surface of the copper foil portion 3 is in contact with the upper surface of the bus bar 1.
而且，於匯流排1的下面側配設銲接用的電極6，並於匯流排1的上面側將銲接用的電極7配設成與前 述電極6對向。上下一對電極6、7係建構成藉移動機構(未圖示)而可相互獨立地在上下方向移動。 Further, an electrode 6 for welding is disposed on the lower surface side of the bus bar 1, and the electrode 7 for welding is disposed on the upper surface side of the bus bar 1 The electrodes 6 are opposite. The upper and lower electrodes 6 and 7 are configured to be movable in the vertical direction independently of each other by a moving mechanism (not shown).
如圖5所示，在前述基座2中和電極6對應的處所形成電極挿入用的開口部8，臨靠此開口部8內的銅箔部3上面與上側的電極7的前端部接觸。 As shown in FIG. 5, an opening portion 8 for electrode insertion is formed in the susceptor 2 corresponding to the electrode 6, and the upper surface of the copper foil portion 3 in the opening portion 8 is in contact with the front end portion of the upper electrode 7.
然後，利用一對電極6、7將撓性印刷基板5的銅箔部3上面和匯流排1下面以適當壓力挾持的狀態下，透過於一對電極6、7間通電，使得銲接電流在該電極6、7間流動。此時，銲接電流係朝向銅箔部3及匯流排1的厚度方向且沿最短的電流路徑9移動。 Then, the upper surface of the copper foil portion 3 of the flexible printed circuit board 5 and the lower surface of the bus bar 1 are held by an appropriate pressure by a pair of electrodes 6 and 7, and are electrically transmitted between the pair of electrodes 6 and 7, so that the welding current is Flow between the electrodes 6, 7. At this time, the welding current moves toward the thickness direction of the copper foil portion 3 and the bus bar 1 and along the shortest current path 9.
藉此，在撓性印刷基板5的銅箔部3和匯流排1之間實施電阻銲，使得銅箔部3的下面和匯流排1的上面相互地銲接接合。 Thereby, electric resistance welding is performed between the copper foil part 3 of the flexible printed circuit board 5 and the bus bar 1, so that the lower surface of the copper foil part 3 and the upper surface of the bus bar 1 are mutually mutually welded.
其次，依據圖6及圖7來說明並行通電方式的習知例。如圖6所示，於匯流排1的下面側配設撓性印刷基板5，使撓性印刷基板5的銅箔部3的上面與匯流排1的下面進行面接觸。又，在匯流排1的上面側，如圖7所示，將一對電極10、11相互左右分隔地並設。 Next, a conventional example of the parallel energization method will be described with reference to Figs. 6 and 7 . As shown in FIG. 6, the flexible printed circuit board 5 is disposed on the lower surface side of the bus bar 1, and the upper surface of the copper foil portion 3 of the flexible printed circuit board 5 is brought into surface contact with the lower surface of the bus bar 1. Further, on the upper surface side of the bus bar 1, as shown in Fig. 7, the pair of electrodes 10 and 11 are arranged to be spaced apart from each other.
接著，透過在一對電極10、11間通電，使得銲接電流在該電極10，11間流動。此時，銲接電流雖會沿著圖示的電流路徑13移動，但在中途會區分成在銅箔部3的內部移動的電流和在匯流排1的內部移動的電流。 Next, a current is passed between the pair of electrodes 10 and 11, so that a welding current flows between the electrodes 10 and 11. At this time, although the welding current moves along the current path 13 shown in the figure, it is divided into a current that moves inside the copper foil portion 3 and a current that moves inside the bus bar 1 in the middle.
藉此，在撓性印刷基板5的銅箔部3和匯流排1之間實施電阻銲，使銅箔部3的上面和匯流排1的下面相互地銲接接合(例如參照專利文獻1)。 By this, resistance welding is performed between the copper foil portion 3 of the flexible printed circuit board 5 and the bus bar 1, and the upper surface of the copper foil portion 3 and the lower surface of the bus bar 1 are welded to each other (for example, see Patent Document 1).
〔專利文獻1〕 [Patent Document 1]
日本專利特開2002-141660號公報 Japanese Patent Laid-Open Publication No. 2002-141660
上述直接通電方式係如前述，透過隔著撓性印刷基板於相對向的上下一對電極間通電，以於前述連接端子(銅箔部)和匯流排之間進行電阻銲，但此時，由於在撓性印刷基板的上下兩側配設一對電極，故在將撓性印刷基板安裝於例如車載用電池模組的匯流排的上方之情況係變得難以採用。 As described above, the direct current conduction method is performed by electrically connecting between the pair of upper and lower electrodes facing each other via the flexible printed circuit board, and performing resistance welding between the connection terminal (copper foil portion) and the bus bar. Since a pair of electrodes are disposed on the upper and lower sides of the flexible printed circuit board, it is difficult to use the flexible printed circuit board above the bus bar of the in-vehicle battery module.
一方面，上述並行通電方式係透過在並設於撓性印刷基板的單面側的一對電極間通電，以於前述連接端子和匯流排之間進行電阻銲，此時，銲接電流多會直接流進匯流排內，故而容易短路，因此需避免，若將匯流排的厚度設為薄至例如0.2mm程度以下，則難以充分確保與前述連接端子之接合強度。 On the other hand, the parallel energization method is performed by electrically connecting a pair of electrodes provided on one side of the flexible printed circuit board to perform resistance welding between the connection terminal and the bus bar. Since it flows into the bus bar, it is easy to short-circuit. Therefore, if the thickness of the bus bar is as thin as, for example, about 0.2 mm or less, it is difficult to sufficiently ensure the bonding strength with the connection terminal.
上述直接通電方式和並行通電方式全都在接合具有銅箔等之薄的金屬層(連接端子)的撓性印刷基板和厚的金屬製的匯流排之際為廻避意外的熔斷，而採用在短時間熱負荷少的精密電阻銲。 The above-described direct energization method and parallel energization method are all used in a short time when a flexible printed circuit board having a thin metal layer (connection terminal) such as copper foil and a thick metal bus bar are joined to avoid accidental melting. Precision resistance welding with less heat load.
但是，依據精密電阻銲的接合部終究是薄的連接端子與厚的匯流排之銲接界面，故兩者的厚度差大。因 此，該接合部的強度係因應厚度而起因於接合強度最差的金屬層，為此，接合部的破斷幾乎是發生在金屬層側。 However, since the joint portion of the precision electric resistance welding is a welding interface between the thin connecting terminal and the thick bus bar, the thickness difference between the two is large. because Therefore, the strength of the joint portion is caused by the metal layer having the worst joint strength depending on the thickness. For this reason, the breakage of the joint portion occurs almost on the side of the metal layer.
例如，在將以電壓監視為主目的之撓性印刷基板利用電阻銲對作為二次電池模組零件的匯流排接合的情況，於剝離強度試驗等所產生的破壞部係限定為撓性印刷基板側的金屬層。因此，就薄膜層所成的撓性印刷基板而言，在構造上難以實現前述接合部的高強度化。 For example, when a flexible printed circuit board mainly for voltage monitoring is bonded to a bus bar as a secondary battery module component by electric resistance welding, the breaking portion generated by a peel strength test or the like is limited to a flexible printed circuit board. Side metal layer. Therefore, in the flexible printed circuit board formed of the film layer, it is difficult to achieve high strength of the joint portion.
因此，在將撓性印刷基板用作車輛搭載用的電池模組之情況為，依車輛振動、熱伸縮(尺寸差)，撓性印刷基板的金屬層(連接端子)之接合強度降低至所期望以下，其結果為，具有所謂使撓性印刷基板的機能及品質降低的問題。 Therefore, when the flexible printed circuit board is used as a battery module for vehicle mounting, the joint strength of the metal layer (connection terminal) of the flexible printed circuit board is lowered to the desired level depending on vehicle vibration and thermal expansion (differential size). As a result, there is a problem that the function and quality of the flexible printed circuit board are lowered.
於是，有鑑於上述實情，為提高撓性印刷基板和匯流排的接合強度使對振動等之耐性提升，而衍生出應解決的技術課題，本發明即以解決此課題為目的。 Therefore, in view of the above-described circumstances, in order to improve the joint strength between the flexible printed circuit board and the bus bar and to improve the resistance to vibration or the like, a technical problem to be solved is derived, and the present invention has been made to solve the problem.
本發明係為達成上述目的而提案者，請求項1記載的發明係提供一種撓性印刷基板，係具有具備接合於匯流排的連接端子的電路部，該撓性印刷基板之特徵為：將孔眼固定於前述電路部的連接端子，並對該孔眼和前述匯流排間、前述孔眼和前述連接端子間及該連接端子和前述匯流排間各自利用銲接接合。 The present invention provides a flexible printed circuit board having a circuit portion having a connection terminal bonded to a bus bar, the flexible printed circuit board being characterized by: The connection terminal is fixed to the circuit portion, and is welded to the hole and the bus bar, between the hole and the connection terminal, and between the connection terminal and the bus bar.
依據此構成，於電路部的連接端子安裝由黃銅等之金屬材所成的孔眼。然後將孔眼和匯流排間、孔眼和連接端子間及連接端子和匯流排間利用銲接接合。因此不同 於習知構造，由於孔眼和匯流排間也被以高強度結合，故全體而言，撓性印刷基板和匯流排的接合強度比習知技術還要增大。 According to this configuration, an eyelet made of a metal material such as brass is attached to the connection terminal of the circuit portion. Then, the hole and the bus bar, the eyelet and the connection terminal, and the connection terminal and the bus bar are joined by soldering. So different In the conventional structure, since the hole and the bus bar are also joined with high strength, the joint strength of the flexible printed circuit board and the bus bar is increased as compared with the prior art.
請求項2記載的發明係提供一種撓性印刷基板的製造方法，係為具有具備接合於匯流排的連接端子的電路部之撓性印刷基板的製造方法，其特徵為具備：將孔眼固定於前述電路部的連接端子之步驟；將前述撓性印刷基板載置於前述匯流排，使前述孔眼及前述連接端子接觸於該匯流排的單面之步驟；將一對電極的一電極推抵於前述孔眼，並將另一電極推抵於前述匯流排的單面，且利用配設在一對電極間的推桿將前述電路部的連接端子按壓於前述匯流排之步驟；及於一對電極間通電而對前述孔眼和前述匯流排間、前述孔眼和前述連接端子間、及該連接端子和前述匯流排間分別藉由銲接接合的步驟。 The invention of claim 2 provides a method of manufacturing a flexible printed circuit board, comprising: a method of manufacturing a flexible printed circuit board including a circuit portion connected to a connection terminal of a bus bar, characterized in that the aperture is fixed to the foregoing a step of connecting the terminals of the circuit portion; placing the flexible printed circuit board on the bus bar, contacting the eyelet and the connection terminal with a single surface of the bus bar; and pushing one electrode of the pair of electrodes against the foregoing a step of pushing the other electrode against one side of the bus bar, and pressing the connection terminal of the circuit portion to the bus bar by a push rod disposed between the pair of electrodes; and between the pair of electrodes The step of energizing the bonding between the hole and the bus bar, between the hole and the connecting terminal, and between the connecting terminal and the bus bar are respectively performed by soldering.
依據此製造方法，將已預先固定孔眼的撓性印刷基板載置於匯流排，使前述連接端子和孔眼與匯流排的單面接觸。然後使一對電極的一電極推抵於孔眼，使另一電極推抵於匯流排的單面，並以配設在一對電極間之推桿將前述連接端子一邊按壓於匯流排一邊在一對電極間通電。 According to this manufacturing method, the flexible printed circuit board having the holes fixed in advance is placed on the bus bar, and the connection terminals and the holes are brought into contact with one surface of the bus bar. Then, one electrode of the pair of electrodes is pushed against the hole, and the other electrode is pushed against one side of the bus bar, and the connecting terminal is pressed against the bus bar by a push rod disposed between the pair of electrodes. Apply electricity to the electrodes.
如此一來，透過銲接孔眼和匯流排間、孔眼和連接端子間以及連接端子和匯流排間的3個處所，可同時地實現確保孔眼和匯流排間之所要的銲接強度、孔眼和連接端子間、以及連接端子和匯流排間的低電阻銲接。 In this way, the desired welding strength, the hole and the connecting terminal between the hole and the bus bar can be simultaneously achieved through the welding hole and the bus bar, between the eyelet and the connecting terminal, and between the connecting terminal and the bus bar. And low resistance welding between the connection terminal and the bus bar.
請求項3記載的發明係提供一種撓性印刷基 板的製造方法，係為具有具備接合於匯流排的連接端子的電路部之撓性印刷基板的製造方法，其特徵為具備：將孔眼固定於前述電路部的連接端子之步驟；將前述撓性印刷基板載置於前述匯流排，使前述孔眼及前述連接端子接觸於該匯流排的單面之步驟；在前述孔眼和前述匯流排間介設絶緣體的狀態下，將一對電極的一電極推抵於前述孔眼，並將另一電極推抵於前述匯流排的單面，且利用配設在一對電極間的推桿將前述電路部的連接端子按壓於前述匯流排之步驟；在一對電極間通電，對前述孔眼和前述連接端子間及該連接端子和前述匯流排間利用銲接接合之步驟；及銲接後，去除前述絶緣體並對前述孔眼和前述匯流排間利用銲接接合之步驟。 The invention described in claim 3 provides a flexible printing base A method of manufacturing a flexible printed circuit board having a circuit portion connected to a connection terminal of a bus bar, comprising: a step of fixing an eyelet to a connection terminal of the circuit portion; and the flexibility a printed circuit board is placed on the bus bar, and the hole and the connection terminal are in contact with a single surface of the bus bar; and an electrode of the pair of electrodes is placed in a state in which an insulator is interposed between the hole and the bus bar; Pushing against the hole, pushing the other electrode against one side of the bus bar, and pressing the connection terminal of the circuit portion to the bus bar by a push rod disposed between the pair of electrodes; Conducting a connection between the electrodes, a step of soldering the gap between the hole and the connecting terminal, and between the connecting terminal and the bus bar; and after soldering, removing the insulator and using a solder joint between the hole and the bus bar .
依據此製造方法，將已預先固定孔眼的撓性印刷基板載置於匯流排，使連接端子和孔眼接觸於匯流排的單面。接著在孔眼和匯流排間介設絶緣體的狀態下，將一對電極的一電極推抵於孔眼，將另一電極推抵於匯流排的單面，並以配設在一對電極間的推桿使撓性印刷基板的連接端子一邊按壓於匯流排一邊在一對電極間通電，藉以銲接孔眼和連接端子間、及連接端子和匯流排間的2個處所。銲接後，去除絶緣體並藉由銲接將孔眼和匯流排間接合。 According to this manufacturing method, the flexible printed circuit board having the holes fixed in advance is placed on the bus bar, and the connection terminals and the eyelets are brought into contact with one side of the bus bar. Then, in a state in which an insulator is interposed between the hole and the bus bar, one electrode of the pair of electrodes is pushed against the hole, and the other electrode is pushed against one side of the bus bar, and is disposed between the pair of electrodes. The pusher pushes the connection terminal of the flexible printed circuit board between the pair of electrodes while pressing the bus bar, thereby soldering the space between the hole and the connection terminal, and between the connection terminal and the bus bar. After soldering, the insulator is removed and the holes and busbars are joined by soldering.
就此製造方法而言，在銲接時藉由使絶緣體介設孔眼和匯流排間，可促進銲接電流的一部分從孔眼朝連接端子側分流，為此，能更有效率地實現孔眼和連接端子間及連接端子和匯流排間利用低電阻銲進行接合。 With this manufacturing method, a part of the welding current can be shunted from the hole toward the connection terminal side by interposing the hole between the hole and the bus bar at the time of welding, and the hole and the connection terminal can be more efficiently realized. And the connection terminal and the bus bar are joined by low resistance welding.
請求項1記載的發明，即便是形成薄的匯流排，撓性印刷基板和匯流排的接合強度仍大幅地提升，故而即使是例如作為車載用電池模組將撓性印刷基板接合匯流排的情況，亦無因振動、熱伸縮而導致前述接合強度降低之虞，可長期間穩定地維持撓性印刷基板的機能及品質。 According to the invention of claim 1, even if a thin bus bar is formed, the bonding strength between the flexible printed circuit board and the bus bar is greatly improved, and the flexible printed circuit board is bonded to the bus bar, for example, as a vehicle battery module. Further, since the joint strength is not lowered due to vibration or thermal expansion and contraction, the function and quality of the flexible printed circuit board can be stably maintained for a long period of time.
又，銲接於匯流排的單面側之本發明的撓性印刷基板可將連接端子和孔眼間以及連接端子和匯流排間一起銲接，可藉電阻銲更容易且高強度安裝於車載用電池的上方。 Moreover, the flexible printed circuit board of the present invention soldered to the single-sided side of the bus bar can weld the connection terminal and the eyelet, and between the connection terminal and the bus bar, and can be easily mounted on the vehicle battery by electric resistance welding. Above.
請求項2記載的發明係可同時地實現確保孔眼和匯流排間之所要的銲接強度、孔眼和連接端子間以及在連接端子和匯流排間利用低電阻銲進行接合，故即便形成薄的匯流排，撓性印刷基板和匯流的接合強度仍大幅地提升，沒有因振動、熱伸縮而導致前述接合強度降低之虞，因而，可容易地量產能長期間維持高機能及品質的撓性印刷基板。 According to the invention of claim 2, it is possible to simultaneously ensure the required welding strength between the eyelet and the bus bar, the hole and the connection terminal, and the joint between the connection terminal and the bus bar by low-resistance welding, so that even a thin bus bar is formed. In addition, the joint strength between the flexible printed circuit board and the confluent flow is greatly improved, and the joint strength is not deteriorated by vibration or thermal expansion and contraction. Therefore, it is possible to easily maintain a high-performance and high-quality flexible printed circuit board for a long period of time.
請求項3記載的發明係藉由使絶緣體介設孔眼和匯流排間，使得從孔眼朝連接端子側分流的銲接電流之比例增加，可更有效率地實現孔眼和連接端子間及連接端子和匯流排間利用低電阻銲進行接合，可更加提升連接端子和匯流排之接合強度。 According to the invention of claim 3, the ratio of the welding current shunted from the hole toward the connection terminal side is increased by interposing the hole between the hole and the bus bar, so that the hole and the connection terminal and the connection terminal can be more efficiently realized. The busbars are joined by low-resistance welding to further improve the joint strength between the connection terminals and the busbars.
1、21‧‧‧匯流排 1, 21‧‧ ‧ busbar
2、22‧‧‧基座 2, 22‧‧‧ base
3、23‧‧‧銅箔部(電路部的連接端子) 3, 23‧‧‧ Copper foil part (connection terminal of circuit part)
4、24‧‧‧保護層 4, 24‧‧ ‧ protective layer
5、25‧‧‧撓性印刷基板 5, 25‧‧‧Flexible printed circuit board
26‧‧‧孔眼 26‧‧‧ Eyes
6、7‧‧‧電極 6, 7‧‧‧ electrodes
10、11‧‧‧電極 10, 11‧‧‧ electrodes
27、28‧‧‧電極 27, 28‧‧‧ electrodes
8‧‧‧開口部 8‧‧‧ openings
29‧‧‧推桿 29‧‧‧Put
30‧‧‧電流路徑 30‧‧‧ Current path
9、13‧‧‧路徑 9, 13 ‧ ‧ path
30a、30b‧‧‧路徑 30a, 30b‧‧ path
〔圖1〕係概念地顯示本發明的實施例之撓性印刷基板的正面說明圖 FIG. 1 is a front view showing conceptually showing a flexible printed circuit board according to an embodiment of the present invention.
〔圖2〕係圖1的平面說明圖。 FIG. 2 is a plan explanatory view of FIG. 1. FIG.
〔圖3〕係概念地顯示圖1的孔眼部分之斷面說明圖。 Fig. 3 is a cross-sectional explanatory view conceptually showing the hole portion of Fig. 1.
〔圖4〕係顯示直接通電方式之習知例的撓性印刷基板之正面說明圖。 Fig. 4 is a front explanatory view showing a flexible printed circuit board of a conventional example of direct energization.
〔圖5〕係圖4的平面說明圖。 Fig. 5 is a plan explanatory view of Fig. 4.
〔圖6〕係顯示並行通電方式之習知例的撓性印刷基板之正面說明圖。 Fig. 6 is a front explanatory view showing a flexible printed circuit board of a conventional example of a parallel energization method.
〔圖7〕係圖6的平面說明圖。 Fig. 7 is a plan explanatory view of Fig. 6.
本發明為達成在不形成薄的匯流排之下提高撓性印刷基板和匯流的接合強度使提升對於振動、熱伸縮之耐性之目的，其特徵為：在具有具備接合於匯流排的連接端子之電路部的撓性印刷基板中，將孔眼固定於前述電路部的連接端子並在該孔眼和前述匯流排間、前述孔眼和前述連接端子間及該連接端子和前述匯流排間各自利用銲接進行接合。 The present invention is characterized in that it has the purpose of improving the bonding strength of the flexible printed circuit board and the confluent flow without forming a thin bus bar, and improving the resistance to vibration and thermal expansion and contraction, and is characterized in that it has a connection terminal having a connection to the bus bar. In the flexible printed circuit board of the circuit portion, the eyelet is fixed to the connection terminal of the circuit portion, and the bonding is performed between the hole and the bus bar, between the hole and the connection terminal, and between the connection terminal and the bus bar. .
在本發明中，於銲接前預先將由黃銅等的金屬所構成的孔眼固定於撓性印刷基板的端子部。然後將撓性印刷基板載置於匯流排的單面使連接端子及孔眼接觸於匯流排，將一對電極的一電極推抵於孔眼，另一電極推抵於匯流排的單面，並以配設在一對電極間之推桿將連接端子一邊按壓於匯流排一邊使用並行式通電系統(參照圖1)進行電阻銲。 In the present invention, an eyelet made of a metal such as brass is fixed to a terminal portion of the flexible printed circuit board before soldering. Then, the flexible printed circuit board is placed on one side of the bus bar so that the connection terminal and the eyelet are in contact with the bus bar, one electrode of the pair of electrodes is pushed against the hole, and the other electrode is pushed against the single side of the bus bar, and The push rod disposed between the pair of electrodes performs resistance welding using a parallel type energization system (see FIG. 1) while pressing the connection terminal to the bus bar.
亦即，在使固定於撓性印刷基板的孔眼和其外周區域的連接端子接觸於匯流排的單面之狀態下，將各個 電阻銲用的電極推抵於孔眼部分和匯流排單面，並以推桿將連接端子一邊按壓於匯流排一邊通電，藉以將孔眼和匯流排間、孔眼和連接端子間及連接端子和匯流排間分別利用銲接加以接合。 In other words, in a state in which the connection terminals fixed to the aperture of the flexible printed circuit board and the outer peripheral region thereof are in contact with one side of the bus bar, The electrode for electric resistance welding is pushed against the hole portion and the single side of the bus bar, and the connecting terminal is energized by pressing the connecting terminal to the bus bar, so that the hole and the bus bar, the hole and the connecting terminal, and the connecting terminal and the bus bar are connected. They are joined by welding.
本發明係同時地進行確保孔眼和匯流排間之所要的銲接強度，孔眼和連接端子間，以及連接端子和匯流排間的低電阻銲，即使是例如在車載用電池模組的匯流排接合撓性印刷基板的情況，對車輛振動、熱伸縮仍具有高的耐久性。此外，就銲接接合方式以外的單純的機械連接方式而言，難以獲得可耐振動、熱伸縮之構造。 The present invention simultaneously performs the required welding strength between the eyelet and the busbar, the low-resistance welding between the eyelet and the connecting terminal, and between the connecting terminal and the busbar, even if the busbar joint of the vehicle battery module is bonded, for example. In the case of a printed circuit board, it has high durability against vibration and thermal expansion of the vehicle. Further, in the case of a simple mechanical connection method other than the solder joint method, it is difficult to obtain a structure that can withstand vibration and heat expansion and contraction.
依據本發明的通電系統，在孔眼和匯流排間可穩定地確保既定值以上的銲接強度，而且，在孔眼和連接端子間及連接端子和匯流排間可容易地實現低電阻的銲接接合。 According to the energization system of the present invention, the welding strength of a predetermined value or more can be stably ensured between the hole and the bus bar, and the low-resistance solder joint can be easily realized between the hole and the connection terminal and between the connection terminal and the bus bar.
又，在撓性印刷基板側所設置的一對電極之間，設有無需通電的推桿。藉由此推桿，促進電流從孔眼部分朝撓性印刷基板的連接端子分流，以在連接端子和匯流排之母材間進行低電阻銲。推桿係設定成形成比銲接電極還小徑，且基於推桿的按壓力比基於電極的按壓力的壓力還高。 Further, a push rod that does not need to be energized is provided between the pair of electrodes provided on the flexible printed circuit board side. With this pusher, the current is shunted from the eyelet portion toward the connection terminal of the flexible printed circuit board to perform low resistance welding between the connection terminal and the base material of the bus bar. The pusher is set to form a smaller diameter than the welding electrode, and the pressing force based on the push rod is higher than the pressing force based on the pressing force of the electrode.
因此，藉電極的推抵而作用於孔眼的壓力與藉推桿的推壓而作用於連接端子的壓力之平衡，將孔眼部分的接觸電阻和連接端子部分的接觸電阻作最佳控制，可作成更加促進銲接電流朝前述連接端子分流的構造。 Therefore, the pressure acting on the aperture by the pushing of the electrode and the pressure acting on the connection terminal by the pushing of the push rod can optimally control the contact resistance of the aperture portion and the contact resistance of the connection terminal portion. The configuration in which the welding current is branched toward the aforementioned connection terminal is further promoted.
此時，以推桿按壓孔眼之外周區域的適當處所使連接端子按壓並接觸於匯流排單面之際，各別地檢出孔 眼和匯流排間的接觸電阻與連接端子和匯流排間的接觸電阻。 At this time, when the push rod is pressed against a suitable portion of the outer peripheral region of the eyelet to press the contact terminal and contact the single side of the bus bar, the respective check holes are respectively detected. The contact resistance between the eye and the bus bar and the contact resistance between the connection terminal and the bus bar.
然後，因應孔眼或連接端子的大小、接觸面積、材質等的設計事項設定成前述各接觸電阻的大小具有既定的差。藉此，可一邊維持孔眼和匯流排間的高強度銲接一邊更確實地銲接連接端子和匯流排間。 Then, depending on the design of the size of the eyelet or the connection terminal, the contact area, the material, and the like, the size of each of the contact resistances described above is set to have a predetermined difference. Thereby, it is possible to more reliably weld the connection terminal and the bus bar while maintaining the high-strength welding between the hole and the bus bar.
本發明的製造方法亦可採用於銲接通電時使絶緣物介設孔眼和匯流排間之所謂兩階段方式。藉此，從孔眼朝連接端子側分流之銲接電流的比例增加，更加有效率地在孔眼和連接端子間及連接端子和匯流排間實施低電阻銲。 The manufacturing method of the present invention can also be applied to a so-called two-stage manner in which an insulator is interposed between an eyelet and a bus bar when the welding is energized. Thereby, the ratio of the welding current shunted from the hole toward the connection terminal side is increased, and the low-resistance welding is more efficiently performed between the hole and the connection terminal and between the connection terminal and the bus bar.
茲針對本發明的較佳實施例作詳細說明。本實施例係適用在具有具備藉銲接接合於匯流排的銅箔部(連接端子)之電路部的三層構造的撓性印刷基板者，係連接端子和孔眼部分之間以及連接端子和匯流排之間一起藉由電阻銲而接合者。 The preferred embodiments of the present invention are described in detail. The present embodiment is applied to a flexible printed circuit board having a three-layer structure including a circuit portion joined to a copper foil portion (connection terminal) of a bus bar by soldering, and a connection terminal and an eyelet portion, and a connection terminal and a bus bar. The two are joined together by resistance welding.
此時，以一對電極的一電極將孔眼部分按壓於匯流排側，使最適當的壓力作用於孔眼部分，並以前述推桿將撓性印刷基板按壓於匯流排側，使最適當的壓力作用於撓性印刷基板的連接端子。 At this time, the hole portion is pressed against the bus bar side by one electrode of the pair of electrodes, the most appropriate pressure is applied to the hole portion, and the flexible printed circuit board is pressed against the bus bar side by the push rod to make the most appropriate pressure. A connection terminal that acts on a flexible printed circuit board.
然後，一邊考慮孔眼、連接端子及匯流排等之構件的大小、材質等之設計事項一邊適切地設定作用於孔眼部分的壓力和接觸面積、及作用於連接端子的壓力和接觸面積。 Then, the pressure and the contact area acting on the hole portion and the pressure and the contact area acting on the connection terminal are appropriately set in consideration of the design of the size, material, and the like of the member such as the eyelet, the connection terminal, and the bus bar.
藉此，建構成適切地控制孔眼和匯流排間的 接觸電阻、及連接端子和匯流排間的接觸電阻，促進電流從孔眼部分朝連接端子分流。 Thereby, the construction constitutes an appropriate control between the aperture and the busbar The contact resistance, and the contact resistance between the connection terminal and the bus bar, facilitate current shunting from the aperture portion toward the connection terminal.
如此一來，朝連接端子供給的銲接電流增大，可確保基於精密電阻銲之高強度且低電阻的撓性印刷基板和匯流排之充分的接合強度。 As a result, the welding current supplied to the connection terminal is increased, and sufficient joint strength of the high-strength and low-resistance flexible printed circuit board and the bus bar based on precision electric resistance welding can be ensured.
圖1中，首先，在銲接前，將金屬製的孔眼26於銲接前預先固定在與撓性印刷基板25中的連接端子對應之處所。 In Fig. 1, first, before the welding, the metal eyelet 26 is fixed in advance to the connection terminal of the flexible printed circuit board 25 before soldering.
此時，電路部的連接端子之銅箔部23的個數可為單數或複數，將孔眼26固定於各銅箔部23。之後，使孔眼26和銅箔部23間以及該銅箔部23和匯流排21間利用電阻銲進行接合。 At this time, the number of the copper foil portions 23 of the connection terminals of the circuit portion may be singular or plural, and the eyelet 26 is fixed to each of the copper foil portions 23. Thereafter, the hole 26 and the copper foil portion 23 and the copper foil portion 23 and the bus bar 21 are joined by electric resistance welding.
圖1係說明本實施例的撓性印刷基板25和匯流排21之銲接接合的狀態之正面說明圖。 Fig. 1 is a front explanatory view showing a state in which the flexible printed circuit board 25 and the bus bar 21 of the present embodiment are welded to each other.
圖1中，厚金屬板的匯流排21被支撐手段(未圖示)所支撐，於匯流排21上面的一端側，設有由聚醯亞胺製的基座22、銅箔部23及聚醯亞胺製的保護層24所構成之三層構造的撓性印刷基板25。前述保護層24未形成在和匯流排21對應的部分。因此，未有保護層24之處所的銅箔部23的下面側露出於外部，該銅箔部23的露出面之一部分係與匯流排21的上面面接觸。 In Fig. 1, a bus bar 21 of a thick metal plate is supported by a supporting means (not shown), and a base 22 made of polyimide, a copper foil portion 23, and a polycondensation are provided on one end side of the upper surface of the bus bar 21. A flexible printed circuit board 25 having a three-layer structure composed of a protective layer 24 made of yttrium imide. The aforementioned protective layer 24 is not formed at a portion corresponding to the bus bar 21. Therefore, the lower surface side of the copper foil portion 23 where the protective layer 24 is not exposed is exposed to the outside, and one of the exposed faces of the copper foil portion 23 is in contact with the upper surface of the bus bar 21.
又，在撓性印刷基板25中未形成保護層24的處所，開設有圓形的孔眼孔(未圖示)。在該孔眼孔係如圖2所示，安裝有形成環狀之金屬製的孔眼26。於孔眼26之外周面的一部分(圖1中的孔眼26之右側外周面的下 部)，前述銅箔部23的一端部(圖1中的左端部)以可導通地接觸著。 Further, in the flexible printed circuit board 25, a space in which the protective layer 24 is not formed is provided with a circular eyelet hole (not shown). In the perforation, as shown in Fig. 2, an eyelet 26 made of a ring-shaped metal is attached. a part of the outer peripheral surface of the eyelet 26 (the outer peripheral surface of the right side of the eyelet 26 in Fig. 1) The one end portion (the left end portion in FIG. 1) of the copper foil portion 23 is electrically connected to each other.
再者，孔眼26的下面側部分係與匯流排21的上面可導通地接觸著。孔眼26的材質方面，例如可採選黃銅等之銅系金屬，但除此以外的良導電性的金屬材料當然亦可採選。 Further, the lower side portion of the eyelet 26 is in conductive contact with the upper surface of the bus bar 21. For the material of the perforation 26, for example, a copper-based metal such as brass may be used, but a good conductive metal material other than the above may of course be used.
於匯流排21的上面側，一對電極27、28相互左右分隔地並設。圖2中左側的電極27的前端部係與孔眼26上面之右側圓弧部的中央位置，亦即相對於該圓弧部中的電極28可在最近的位置導通地接觸著。又，右側的電極28係配置在撓性印刷基板25的右側近旁，電極28的前端部係與匯流排21的上面可導通地接觸著。 On the upper side of the bus bar 21, a pair of electrodes 27, 28 are disposed to be spaced apart from each other. The front end portion of the electrode 27 on the left side in Fig. 2 is centrally positioned with the right circular arc portion on the upper surface of the eyelet 26, that is, in contact with the electrode 28 in the circular arc portion at the nearest position. Further, the electrode 28 on the right side is disposed in the vicinity of the right side of the flexible printed circuit board 25. The front end portion of the electrode 28 is in conductive contact with the upper surface of the bus bar 21.
再者，在連結電極27和電極28的中間區域之大致中央位置設有推桿29。推桿29的前端設定成可將撓性印刷基板25的基座22上面朝下方按壓。此外，推桿29對基座22的接觸壓力、接觸面積、接觸位置係設定變更成因應設計事項以獲得所要的接觸電阻。前述電極27、28及推桿29係建構成可藉未圖示的上下移動機構在上下方向移動。 Further, a push rod 29 is provided at a substantially central position of the intermediate portion between the connection electrode 27 and the electrode 28. The front end of the push rod 29 is set so that the upper surface of the base 22 of the flexible printed circuit board 25 can be pressed downward. Further, the contact pressure, the contact area, and the contact position setting of the push rod 29 with respect to the susceptor 22 are changed to suit the design matter to obtain the desired contact resistance. The electrodes 27 and 28 and the push rod 29 are configured to be movable in the vertical direction by a vertical movement mechanism (not shown).
其次，針對實施例的作用作說明。此外，在對流排21和撓性印刷基板25進行電阻銲之前，孔眼26係作成預先藉由孔眼開孔器固定在形成於性印刷基板25的孔眼孔。 Next, the action of the embodiment will be described. Further, before the convection row 21 and the flexible printed circuit board 25 are subjected to electric resistance welding, the eyelet 26 is fixed to the eyelet hole formed in the printed circuit board 25 by an aperture boring device in advance.
首先，於匯流排21上進行將撓性印刷基板25精密電阻銲之際，如圖1所示，在匯流排21的上面側設定 撓性印刷基板25、電極27、28及推桿29。亦即，於圖2中的匯流排21上面之左端側載置撓性印刷基板25的端子側部分，使銅箔部23的下面與匯流排21的上面可導通地接觸，並在匯流排21的上面側使一對電極27、28相互左右分隔地並設。 First, when the flexible printed circuit board 25 is precisely resistance-welded on the bus bar 21, as shown in FIG. 1, the upper surface side of the bus bar 21 is set. The flexible printed circuit board 25, the electrodes 27 and 28, and the push rod 29. That is, the terminal side portion of the flexible printed circuit board 25 is placed on the left end side of the upper surface of the bus bar 21 in FIG. 2 so that the lower surface of the copper foil portion 23 is in conductively contact with the upper surface of the bus bar 21, and is in the bus bar 21 The upper side of the pair of electrodes 27 and 28 are disposed to be spaced apart from each other.
此時，左側的電極27設定成其前端部以適當壓可與孔眼26上面的右側圓弧部導通地接觸，且右側的電極28設定成其前端部以適當壓可與匯流排21的上面導通地接觸。 At this time, the electrode 27 on the left side is set such that its front end portion is in conduction contact with the right circular arc portion on the upper surface of the eyelet 26 with an appropriate pressure, and the electrode 28 on the right side is set such that its front end portion is electrically connected to the upper surface of the bus bar 21 with appropriate pressure. Ground contact.
再者，連結電極27和電極28的中間區域，在例如其大致中央位置配設推桿29。此推桿29設定成其前端部以適宜壓力可按壓撓性印刷基板25的基座22上面。 Further, in the intermediate portion of the connection electrode 27 and the electrode 28, a push rod 29 is disposed at, for example, a substantially central portion thereof. The pusher 29 is set such that its front end portion presses the upper surface of the base 22 of the flexible printed circuit board 25 with a suitable pressure.
之後，透過在一對電極27、28間通電，進行撓性印刷基板25和匯流排21的電阻銲。此時，在一對電極27、28間流通的電流係於中途分岐成在前述銅箔部23內及匯流排21內在別的路徑移動。 Thereafter, electric conduction between the pair of electrodes 27 and 28 is performed to perform resistance welding of the flexible printed circuit board 25 and the bus bar 21. At this time, the current flowing between the pair of electrodes 27 and 28 is branched in the middle of the copper foil portion 23 and the bus bar 21 to move in another path.
亦即，前述電流的路徑30在中途分成兩個，其中的一個匯流排21側之路徑係由符號30a所示的路徑。此電流路徑30a係僅經由孔眼26和匯流排21者，係將相對於孔眼26和匯流排21之電極27的前端接觸點與相對於匯流排21之電極28的前端接觸點各自在匯流排21內部對應的2點連結之路徑，在和匯流排21的平面方向平行的方向中成為最短距離。 That is, the path 30 of the aforementioned current is divided into two in the middle, and the path on the side of the bus bar 21 is a path indicated by the symbol 30a. The current path 30a is only via the eyelet 26 and the bus bar 21, and the front end contact point of the electrode 27 with respect to the eyelet 26 and the bus bar 21 and the front end contact point of the electrode 28 with respect to the bus bar 21 are each in the bus bar 21 The path corresponding to the two-point connection inside is the shortest distance in the direction parallel to the plane direction of the bus bar 21.
又，前述電流之路徑30的其他銅箔部23側之分岐路徑係由符號30b所示的路徑。此電流路徑30b係於 孔眼26的厚度方向流動的銲接電流之一部分從孔眼26的外周面在與其接觸的銅箔部23的端部分岐而在該銅箔部23的內部流動的路徑，且其在和推桿29的前端接觸點對應的位置流過匯流排21的厚度方向後，和前述匯流排21側的路徑在中途合流。 Further, the branching path on the other copper foil portion 23 side of the current path 30 is a path indicated by reference numeral 30b. This current path 30b is tied to One of the welding currents flowing in the thickness direction of the eyelet 26 is a path which flows from the outer peripheral surface of the eyelet 26 at the end portion of the copper foil portion 23 which is in contact therewith and flows inside the copper foil portion 23, and which is in the push rod 29 After the position corresponding to the front end contact point flows through the thickness direction of the bus bar 21, the path on the side of the bus bar 21 merges in the middle.
透過使一對電極27、28間通電，而供予撓性印刷基板25的銅箔部23充分的電流以實施精密電阻銲。 By energizing the pair of electrodes 27 and 28, a sufficient current is supplied to the copper foil portion 23 of the flexible printed circuit board 25 to perform precision resistance welding.
如此，本實施例係於銲接前預先將由黃銅等之金屬所構成的孔眼26固定於撓性印刷基板25的端子部，利用設置在撓性印刷基板25側之一對電極27、28以並行通電方式進行電阻銲。 As described above, in the present embodiment, the eyelet 26 made of a metal such as brass is fixed to the terminal portion of the flexible printed circuit board 25 in advance, and the pair of electrodes 27 and 28 are provided in parallel on the side of the flexible printed circuit board 25 in parallel. Resistance welding is performed by energization.
亦即，將孔眼26的外周區域的銅箔部23以推桿29按壓並接觸於匯流排21，於此狀態下通電而進行電阻銲者。其結果，可一邊維持孔眼26和匯流排21間之高強度一邊使銅箔部23和匯流排21間確實地銲接。 In other words, the copper foil portion 23 of the outer peripheral region of the eyelet 26 is pressed by the push rod 29 and brought into contact with the bus bar 21, and is energized in this state to perform resistance welding. As a result, the copper foil portion 23 and the bus bar 21 can be surely welded while maintaining the high strength between the eyelet 26 and the bus bar 21.
本實施例為，透過在孔眼26和匯流排21間、孔眼21和銅箔部23間及銅箔部23和匯流排21間的3個處所分別銲接而接合，即便是形成薄的匯流排，整體在撓性印刷基板25和匯流排21之接合強度仍大幅增大。 In the present embodiment, the bonding is performed by welding between the hole 26 and the bus bar 21, between the eyelet 21 and the copper foil portion 23, and between the copper foil portion 23 and the bus bar 21, even if a thin bus bar is formed. The joint strength between the flexible printed circuit board 25 and the bus bar 21 is still greatly increased.
因此，即使是例如在使用撓性印刷基板25作為車載用2次電池模組的情況，對於在車輛產生的振動、熱伸縮也可長期間穩定地保持使用耐久性。 Therefore, for example, when the flexible printed circuit board 25 is used as the in-vehicle secondary battery module, the durability of use can be stably maintained for a long period of time during vibration and thermal expansion and contraction of the vehicle.
由本實施例的並行型的通電系統，不僅在孔眼26部分和匯流排21之間可確保所要的銲接強度，在銅箔部23和匯流排21之間還可良好地實施低電阻銲。 According to the parallel type energization system of the present embodiment, not only the desired welding strength can be ensured between the portion of the eyelet 26 and the bus bar 21, but also low resistance welding can be favorably performed between the copper foil portion 23 and the bus bar 21.
又，透過設定在一對電極27、28間的推桿29，將孔眼26外周側的銅箔部23往下壓使銅箔部23下面以適當壓和匯流排21上面接觸，但此時，孔眼26和匯流排21間的接觸電阻以測定器檢出，並且銅箔部23和匯流排26間的接觸電阻也以測定器檢出。 Further, the copper foil portion 23 on the outer peripheral side of the eyelet 26 is pressed downward by the pusher 29 disposed between the pair of electrodes 27 and 28, so that the lower surface of the copper foil portion 23 is in contact with the upper surface of the bus bar 21 with an appropriate pressure. The contact resistance between the eyelet 26 and the bus bar 21 was detected by the measuring device, and the contact resistance between the copper foil portion 23 and the bus bar 26 was also detected by the measuring device.
接著，透過算出所檢出的雙方的接觸電阻之差，調整此值成為適當值，使銅箔部23和匯流排21間銲接，可確實地獲得所要的接合強度。 Then, by calculating the difference between the contact resistances of the two detected, the value is adjusted to an appropriate value, and the copper foil portion 23 and the bus bar 21 are welded to each other, whereby the desired joint strength can be surely obtained.
在本實施例中，於一對電極27、28之間設置不通電的推桿29，以該推桿29將銅箔部23按壓於匯流排21上面。藉此，從孔眼26部分朝向撓性印刷基板25的銅箔部23分流的電流量之比例增大，在母材的銅箔部23和匯流排之間可更有效率地實施電阻銲。 In the present embodiment, a push rod 29 that is not energized is provided between the pair of electrodes 27 and 28, and the copper foil portion 23 is pressed against the upper surface of the bus bar 21 by the push rod 29. Thereby, the ratio of the amount of current shunted from the portion of the eyelet 26 toward the copper foil portion 23 of the flexible printed circuit board 25 is increased, and electric resistance welding can be performed more efficiently between the copper foil portion 23 of the base material and the bus bar.
此時，推桿29作成比一對的銲接用電極27、28還小徑的棒構件，且推桿29的按壓力設定成比銲接電極27、28僅高了既定值的高壓力。藉此，可更加促進朝向銅箔部23之銲接電流的分流作用。 At this time, the push rod 29 is formed as a rod member having a smaller diameter than the pair of welding electrodes 27 and 28, and the pressing force of the push rod 29 is set to a high pressure which is higher than the welding electrodes 27 and 28 by a predetermined value. Thereby, the shunting action of the welding current toward the copper foil portion 23 can be further promoted.
本發明的撓性印刷基板25的製造方法除了前述的孔眼26和匯流排21直接接觸的單發方式外，亦可採選兩階段方式。此兩階段方式是指在孔眼26和匯流排21間介設橡膠片等之絶緣體的狀態下，於孔眼26和銅箔部23之間以及銅箔部23和匯流排21之間可電性導通地連接以進行銲接，在銲接完了後去除前述絶緣體並經由銅箔部23將孔眼26和匯流排21銲接並接合的方式。 The method for manufacturing the flexible printed circuit board 25 of the present invention can be selected in a two-stage manner in addition to the single-shot method in which the above-mentioned eyelet 26 and the bus bar 21 are in direct contact. The two-stage method is to electrically connect between the eyelet 26 and the copper foil portion 23 and between the copper foil portion 23 and the bus bar 21 in a state in which an insulator such as a rubber sheet is interposed between the eyelet 26 and the bus bar 21. The ground is joined for welding, and after the welding is completed, the insulator is removed and the eyelet 26 and the bus bar 21 are welded and joined via the copper foil portion 23.
亦即，將已固定孔眼26的撓性印刷基板25 載置於匯流排21，使銅箔部23和孔眼26接觸匯流排21的單面，在孔眼26和匯流排21間介設絶緣體(未圖示)的狀態下將電極27推抵於孔眼26，使電極28推抵於匯流排21的單面，並以配設在電極27、28間的推桿29使銅箔部23一邊按壓於匯流排21一邊在電極27、28間通電，藉以將孔眼26和銅箔部23間及銅箔部23和匯流排間銲接。銲接後，去除絶緣體並在孔眼26和匯流排21間進行銲接接合。 That is, the flexible printed circuit board 25 to which the eyelet 26 has been fixed The copper foil portion 23 and the eyelet 26 are placed on one side of the bus bar 21, and the electrode 27 is pushed against the hole in a state in which an insulator (not shown) is interposed between the hole 26 and the bus bar 21. 26, the electrode 28 is pushed against the single surface of the bus bar 21, and the pusher bar 29 disposed between the electrodes 27 and 28 causes the copper foil portion 23 to be pressed between the electrodes 27 and 28 while being pressed against the bus bar 21, thereby The hole 26 and the copper foil portion 23 and the copper foil portion 23 and the bus bar are welded. After soldering, the insulator is removed and solder joints are made between the eyelet 26 and the bus bar 21.
在此製造方法中，透過使絶緣體介設孔眼26和匯流排21間，因為可促進銲接電流從孔眼26朝銅箔部23側分流的作用，故更加有效率地實現孔眼26和銅箔部23間及銅箔部23和匯流排21間之低電阻銲的接合。 In this manufacturing method, by interposing the insulator between the hole 26 and the bus bar 21, since the welding current can be promoted to be branched from the eyelet 26 toward the copper foil portion 23, the hole 26 and the copper foil portion 23 can be more efficiently realized. The joining between the low-resistance welding between the copper foil portion 23 and the bus bar 21 is performed.
依據本實施例，因為對撓性印刷基板25的銅箔部23和匯流排21供給充分的電流而實施電阻銲，故而撓性印刷基板25的銅箔部23下面和匯流排21上面相互以高的接合力結合。 According to the present embodiment, since the electric resistance is performed by supplying a sufficient current to the copper foil portion 23 and the bus bar 21 of the flexible printed circuit board 25, the lower surface of the copper foil portion 23 of the flexible printed circuit board 25 and the upper surface of the bus bar 21 are high. The bonding force is combined.
又，在電阻銲時，流通電流的銅箔部23的下面之大致全區域被按壓於匯流排21上面，銅箔部23對匯流排21的面接觸區域增加。因此，電流從孔眼26朝銅箔部23側分流的移動量增加，可良好地進行銅箔部23和匯流排21之母材間銲接。 Further, at the time of electric resistance welding, substantially the entire area of the lower surface of the copper foil portion 23 through which the current flows is pressed against the upper surface of the bus bar 21, and the surface contact area of the copper foil portion 23 with respect to the bus bar 21 is increased. Therefore, the amount of movement of the current from the orifice 26 to the side of the copper foil portion 23 is increased, and the welding between the base material of the copper foil portion 23 and the bus bar 21 can be favorably performed.
又，在撓性印刷基板25的上側面設有推桿29，由於對撓性印刷基板25和匯流排21按壓，故在孔眼26部分和匯流排21間可確實地執行良好的低電阻接合，並確實地執行在銅箔部23和匯流排21之間良好的低電阻接合。 Further, the pusher 29 is provided on the upper surface of the flexible printed circuit board 25, and the flexible printed circuit board 25 and the bus bar 21 are pressed, so that good low-resistance bonding can be reliably performed between the hole 26 portion and the bus bar 21. A good low-resistance joint between the copper foil portion 23 and the bus bar 21 is surely performed.
如以上，依據本發明，即便是形成薄的匯流 排，撓性印刷基板和匯流的接合強度大幅提升。因此，即使是在匯流排上接合撓性印刷基板作為例如車載用電池模組的情況，亦無因振動、熱伸縮而導致前述接合強度降低之虞，可長期地穩定維持撓性印刷基板之機能及品質。 As above, according to the present invention, even a thin confluence is formed The joint strength of the row, the flexible printed substrate and the confluence is greatly improved. Therefore, even when the flexible printed circuit board is bonded to the bus bar as, for example, a battery module for a vehicle, there is no possibility that the joint strength is lowered due to vibration or thermal expansion and contraction, and the function of the flexible printed circuit board can be stably maintained for a long period of time. And quality.
又，本發明的撓性印刷基板不僅可容易地安裝於車載用電池的上方，即使不形成薄的匯流排，也可充分確保撓性印刷基板的接續端子和匯流排之接合強度。 Moreover, the flexible printed circuit board of the present invention can be easily attached not only to the upper side of the vehicle battery, but also can sufficiently ensure the joint strength between the connection terminal of the flexible printed circuit board and the bus bar without forming a thin bus bar.
特別是在撓性印刷基板的電阻銲時，以配設在一對電極間的推桿將撓性印刷基板的連接端子一邊按壓於匯流排一邊在一對電極間通電以進行電阻銲，藉此從孔眼在連接端子側分岐移動的電流量增加。其結果，更加層提升撓性印刷基板的連接端子和匯流排之銲接接合的強度。 In particular, in the electric resistance welding of the flexible printed circuit board, the connection terminal of the flexible printed circuit board is pressed against the bus bar while being pressed between the pair of electrodes to perform electric resistance welding between the pair of electrodes. The amount of current that moves from the eyelet on the side of the connection terminal increases. As a result, the strength of the solder joint of the connection terminal of the flexible printed circuit board and the bus bar is further increased.
亦即，針對前述連接端子和孔眼部分間及連接端子和匯流排間，係將其等一起通電並銲接接合。然後，檢出作用於孔眼部分的壓力和因應接觸面的接觸電阻與作用於連接端子的壓力和因應接觸面的接觸電阻雙方，使雙方的接觸電阻適宜平衡，藉以適切地控制連接端子對匯流排的銲接電阻，可更加促進電流從孔眼部分朝電路部的連接端子分流的作用。 That is, the connection terminal and the hole portion and the connection terminal and the bus bar are electrically connected and soldered together. Then, the pressure acting on the hole portion and the contact resistance of the contact surface and the contact pressure corresponding to the contact surface and the contact resistance of the contact surface are detected, so that the contact resistance of both sides is properly balanced, thereby appropriately controlling the connection terminal to the bus bar The welding resistance can further promote the effect of current shunting from the hole portion to the connection terminal of the circuit portion.
藉此，朝母材的連接端子供給的銲接電流更加增大，可更有效地確保基於精密電阻銲之高強度且低電阻的撓性印刷基板和匯流排之充分的接合強度。 Thereby, the welding current supplied to the connection terminal of the base material is further increased, and the sufficient joint strength of the high-strength and low-resistance flexible printed circuit board and the bus bar based on precision electric resistance welding can be more effectively ensured.
此外，本發明只要不逸脫本發明的精神下可進行各種改變，而且本發明當然可及於該改變者。 Further, the present invention can be variously modified as long as it does not depart from the spirit of the present invention, and the present invention is of course applicable to the changer.
本發明不限為三層構造的撓性印刷基板，只要是具有具備接合於匯流排的連接端子之連接端子的撓性印刷基板則全部可利用。 The present invention is not limited to a flexible printed circuit board having a three-layer structure, and any flexible printed circuit board having a connection terminal provided with a connection terminal connected to the bus bar can be used.
又，亦可廣泛應用於車輛用的電子零件以外的各種資料機器用或精密機器用的電子零件等。 Moreover, it can also be widely used for various data equipments other than electronic parts for vehicles, and electronic parts for precision machines.
21‧‧‧匯流排 21‧‧‧ Busbar
22‧‧‧基座 22‧‧‧ pedestal
23‧‧‧銅箔部(電路部的連接端子) 23‧‧‧Copper part (connection terminal of circuit part)
24‧‧‧保護層 24‧‧‧Protective layer
25‧‧‧撓性印刷基板 25‧‧‧Flexible printed circuit board
26‧‧‧孔眼 26‧‧‧ Eyes
27‧‧‧電極 27‧‧‧Electrode
28‧‧‧電極 28‧‧‧Electrode
29‧‧‧推桿 29‧‧‧Put
30‧‧‧電流路徑 30‧‧‧ Current path
30a‧‧‧路徑 30a‧‧‧ Path
30b‧‧‧路徑 30b‧‧‧ Path
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012176921A JP5647194B2 (en) | 2012-08-09 | 2012-08-09 | Flexible printed circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201408146A true TW201408146A (en) | 2014-02-16 |
| TWI495407B TWI495407B (en) | 2015-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102116779A TWI495407B (en) | 2012-08-09 | 2013-05-10 | Flexible printed circuit board and method of manufacturing the same |
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| Country | Link |
|---|---|
| JP (1) | JP5647194B2 (en) |
| CN (1) | CN103766012B (en) |
| DE (1) | DE112013000132T5 (en) |
| TW (1) | TWI495407B (en) |
| WO (1) | WO2014024524A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6513453B2 (en) * | 2015-03-31 | 2019-05-15 | 株式会社ユーシン | Door lock device and method of manufacturing door lock device |
| CN106552990B (en) * | 2016-09-13 | 2019-03-01 | 武汉理工大学 | A kind of inside micro-bonding method of patch potentiometer |
| US11695189B2 (en) * | 2020-01-09 | 2023-07-04 | Samsung Sdi Co., Ltd. | Battery system with flexible printed circuit |
| DE102021117573B4 (en) | 2021-07-07 | 2023-04-13 | Tdk Electronics Ag | Method of making an electrical connection to an electronic component and a chip assembly |
| DE102023200233A1 (en) | 2023-01-12 | 2024-07-18 | Robert Bosch Gesellschaft mit beschränkter Haftung | Process for forming a material bond |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1141753A (en) * | 1997-07-18 | 1999-02-12 | Harness Sogo Gijutsu Kenkyusho:Kk | Electrical junction box |
| JPH1146426A (en) * | 1997-07-28 | 1999-02-16 | Harness Sogo Gijutsu Kenkyusho:Kk | Electric connection box |
| JP2000263248A (en) * | 1999-03-16 | 2000-09-26 | Harness Syst Tech Res Ltd | Welding method |
| JP2002078150A (en) * | 2000-08-25 | 2002-03-15 | Sumitomo Wiring Syst Ltd | Electric junction box |
| JP2002208788A (en) * | 2001-01-12 | 2002-07-26 | Rohm Co Ltd | Circuit board and its manufacturing method |
| JP4135516B2 (en) * | 2003-01-23 | 2008-08-20 | ソニー株式会社 | Lead terminal and power supply |
| JP3776907B2 (en) * | 2003-11-21 | 2006-05-24 | ローム株式会社 | Circuit board |
| CN101998764B (en) * | 2009-08-20 | 2012-08-08 | 中达电通股份有限公司 | Matrix MOV circuit board structure and manufacturing method thereof |
| KR101075304B1 (en) * | 2009-10-09 | 2011-10-19 | 삼성에스디아이 주식회사 | Battery pack and manufacture method thereof |
-
2012
- 2012-08-09 JP JP2012176921A patent/JP5647194B2/en active Active
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2013
- 2013-04-23 CN CN201380002840.5A patent/CN103766012B/en not_active Expired - Fee Related
- 2013-04-23 DE DE112013000132.2T patent/DE112013000132T5/en not_active Ceased
- 2013-04-23 WO PCT/JP2013/061875 patent/WO2014024524A1/en active Application Filing
- 2013-05-10 TW TW102116779A patent/TWI495407B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014036131A (en) | 2014-02-24 |
| WO2014024524A1 (en) | 2014-02-13 |
| DE112013000132T5 (en) | 2014-08-21 |
| JP5647194B2 (en) | 2014-12-24 |
| CN103766012A (en) | 2014-04-30 |
| CN103766012B (en) | 2017-05-24 |
| TWI495407B (en) | 2015-08-01 |
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