TW201403975A - Stacked electrical card connector and method of manufacturing the same - Google Patents
Stacked electrical card connector and method of manufacturing the same Download PDFInfo
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Abstract
Description
本發明有關一種堆疊式電子卡連接器及其製造方法,尤其涉及一種用於手機中連接電子卡與印製電路板的堆疊式電子卡連接器及其製造方法。The present invention relates to a stacked electronic card connector and a manufacturing method thereof, and more particularly to a stacked electronic card connector for connecting an electronic card and a printed circuit board in a mobile phone and a manufacturing method thereof.
隨著科技與經濟的高速發展,人們的生活品質不斷提高,移動電話已經越來越普及,其使用數量不斷增加,安裝於移動電話內用於連接SIM(Subscriber Identity Module)卡的SIM卡連接器也被廣泛使用。然而隨著雙卡雙待技術的推廣,可***多張SIM卡的連接器也被廣泛使用。With the rapid development of technology and economy, people's quality of life continues to improve, mobile phones have become more and more popular, and their use is increasing. SIM card connectors installed in mobile phones for connecting SIM (Subscriber Identity Module) cards It is also widely used. However, with the promotion of dual card dual standby technology, connectors that can insert multiple SIM cards are also widely used.
先前相關技術的堆疊式電子卡連接器,一般其包括絕緣本體、固持於絕緣本體內之導電端子及包覆於絕緣本體外之遮蔽殼體。所述絕緣本體包括第一平板基體、位於第一平板基體下方之第二平板基體、位於第一平板基體和第二平板基體兩側之側牆及位於第一平板基體和第二平板基體後側之限位擋止塊。所述第一平板基體、側牆、限位擋止塊及遮蔽殼體配合界定形成第一收容空間。所述第二平板基體、側牆、限位擋止塊和第一平板基體配合界定形成第二收容空間。所述第一收容空間和第二收容空間皆用於收容SIM卡。所述導電端子包括第一導電端子和第二導電端子,第一導電端子固持於第一平板基體內,第二導電端子固持於第二平板基體內。所述第一導電端子包括第一焊接部,第二導電端子包括第二焊接部;第一焊接部彎折凸伸出第二平板基體之後端,第二焊接部凸伸出第二平板基體之前端。惟,當焊接時,第一平板基體和第二平板基體因受熱將發生形變。The stacked electronic card connector of the prior art generally includes an insulative housing, a conductive terminal held in the insulating body, and a shielding housing that is wrapped around the insulating body. The insulating body includes a first flat substrate, a second flat substrate under the first flat substrate, side walls on both sides of the first flat substrate and the second flat substrate, and a rear side of the first flat substrate and the second flat substrate Limit stop block. The first flat substrate, the side wall, the limiting stop block and the shielding shell cooperate to define a first receiving space. The second flat base, the side wall, the limiting stop and the first flat base are cooperatively defined to form a second receiving space. The first receiving space and the second receiving space are both for receiving a SIM card. The conductive terminal includes a first conductive terminal and a second conductive terminal. The first conductive terminal is retained in the first flat substrate, and the second conductive terminal is retained in the second flat substrate. The first conductive terminal includes a first soldering portion, and the second conductive terminal includes a second soldering portion; the first soldering portion is bent to protrude from a rear end of the second flat substrate, and the second soldering portion protrudes from the second flat substrate front end. However, when soldering, the first flat substrate and the second flat substrate are deformed by heat.
是以,實有必要提供一種新的堆疊式電子卡連接器,以克服上述缺陷。Therefore, it is necessary to provide a new stacked electronic card connector to overcome the above drawbacks.
本發明之目的在於提供一種堆疊式電子卡連接器及其製造方法,其可減小絕緣本體的受熱形變量,甚至避免絕緣本體受熱形變。It is an object of the present invention to provide a stacked electronic card connector and a method of fabricating the same that can reduce the heat shape of the insulating body and even prevent the insulating body from being thermally deformed.
為實現上述目的,本發明堆疊式電子卡連接器係包括絕緣本體、固持於絕緣本體內之導電端子及包覆於絕緣本體外之遮蔽殼體。所述絕緣本體與遮蔽殼體配合界定形成收容空間,以收容對應之電子卡。所述絕緣本體包括第一平板基體及位於第一平板基體下方之第二平板基體。所述導電端子設有對接部,所述對接部凸伸入收容空間內,以與對應電子卡電性連接。所述堆疊式電子卡連接器還設有用於支撐絕緣本體之支撐件,所述支撐件包括上埋設塊和下埋設塊及連接上埋設塊和下埋設塊之連接部。所述上埋設塊埋設於第一平板基體內,所述下埋設塊埋設於第二平板基體內。To achieve the above object, the stacked electronic card connector of the present invention comprises an insulating body, a conductive terminal held in the insulating body, and a shielding case covered on the outside of the insulating body. The insulative housing and the shielding shell cooperate to define a receiving space for receiving the corresponding electronic card. The insulative housing includes a first flat substrate and a second flat substrate below the first flat substrate. The conductive terminal is provided with an abutting portion, and the abutting portion protrudes into the receiving space to be electrically connected to the corresponding electronic card. The stacked electronic card connector is further provided with a support for supporting the insulative housing, and the support member includes an upper buried block and a lower buried block and a connecting portion connecting the upper buried block and the lower buried block. The upper embedded block is embedded in the first flat substrate, and the lower embedded block is embedded in the second flat substrate.
與先前技術相比,本發明堆疊式電子卡連接器至少具有以下有益效果:在絕緣本體的第一平板基體和第二平板基體之間增設支撐件,在焊接時,支撐件支撐絕緣本體,減小絕緣本體的受熱形變量,甚至避免絕緣本體受熱形變。Compared with the prior art, the stacked electronic card connector of the present invention has at least the following beneficial effects: a support member is added between the first flat substrate and the second flat base of the insulating body, and the support supports the insulating body during soldering, The heat-induced deformation of the small insulating body even prevents the insulating body from being deformed by heat.
以下,將結合圖式詳細介紹本發明堆疊式電子卡連接器100的具體實施方式。在以下描述中,所涉及方位的描述皆以第四圖為參考。Hereinafter, a specific embodiment of the stacked electronic card connector 100 of the present invention will be described in detail with reference to the drawings. In the following description, the description of the orientations referred to is referred to in the fourth figure.
參閱第一圖至第七圖,本實施例中,本發明堆疊式電子卡連接器100為雙層電子卡連接器,即可用於***兩張SIM卡5。所述堆疊式電子卡連接器100包括絕緣本體1、固持於絕緣本體1內之導電端子2、包覆於絕緣本體1外之遮蔽殼體3及用於支撐絕緣本體1且注塑成型於絕緣本體1內之支撐件4。Referring to the first to seventh embodiments, in the present embodiment, the stacked electronic card connector 100 of the present invention is a double-layer electronic card connector, which can be used to insert two SIM cards 5. The stacked electronic card connector 100 includes an insulative housing 1 , a conductive terminal 2 held in the insulative housing 1 , a shielding shell 3 covering the insulative housing 1 , and an insulative housing 1 . Support member 4 in 1.
詳參第二圖至第五圖,所述第一絕緣本體1呈兩層設置,其包括第一平板基體11、位於第一平板基體11下方之第二平板基體12、位於第一平板基體11和第二平板基體12兩側之側牆13及位於第一平板基體11和第二平板基體12後側之限位擋止塊14。所述第一平板基體11略大於第二平板基體12且兩者相對平行設置。所述第一平板基體11和第二平板基體12皆設有複數導電端子收容槽111、121,當SIM卡5***後,SIM卡5抵壓導電端子2,致使導電端子2容置於導電端子收容槽111、121內。所述第二平板基體12底面於側牆13所在兩側設有凹陷部122。所述側牆13連接第一平板基體11和第二平板基體12。所述側牆13後部設有凸台131,中部下端設有卡扣凹槽132。所述限位擋止塊14設有兩個且分離連接於兩側牆13。所述第一平板基體11、側牆13、限位擋止塊14及遮蔽殼體3配合界定形成一第一收容空間110。所述第二平板基體12、側牆13、限位擋止塊14和第一平板基體11配合界定形成一第二收容空間120。所述第一收容空間110和第二收容空間120皆用於收容SIM卡5。Referring to FIG. 2 to FIG. 5 , the first insulative housing 1 is disposed in two layers, and includes a first flat substrate 11 , a second flat substrate 12 located below the first flat substrate 11 , and a first flat substrate 11 . And a side wall 13 on both sides of the second flat base 12 and a limit stop 14 on the rear side of the first flat base 11 and the second flat base 12. The first flat substrate 11 is slightly larger than the second flat substrate 12 and the two are disposed in parallel. The first flat substrate 11 and the second flat substrate 12 are provided with a plurality of conductive terminal receiving grooves 111 and 121. After the SIM card 5 is inserted, the SIM card 5 presses the conductive terminal 2, so that the conductive terminal 2 is received in the conductive terminal. The inside of the storage slots 111 and 121. The bottom surface of the second flat substrate 12 is provided with a recess 122 on both sides of the side wall 13 . The side wall 13 connects the first flat substrate 11 and the second flat substrate 12. The rear wall 13 is provided with a boss 131 at the rear, and a buckle recess 132 is provided at the lower end of the middle portion. The limiting stop block 14 is provided with two and is separately connected to the side walls 13 . The first flat base body 11 , the side wall 13 , the limiting stop block 14 and the shielding shell 3 are cooperatively defined to form a first receiving space 110 . The second flat base 12 , the side wall 13 , the limiting stop 14 and the first flat base 11 are cooperatively defined to form a second receiving space 120 . The first receiving space 110 and the second receiving space 120 are both for receiving the SIM card 5 .
所述導電端子2注塑成型於絕緣本體1內,其分為第一導電端子21和第二導電端子22。所述第一導電端子21固持於第一平板基體11內,其包括延伸出絕緣本體1外之第一焊接部211及懸空於導電端子收容槽111上方之第一對接部212。所述第二導電端子22固持於第二平板基體12內,其包括延伸出絕緣本體1外之第二焊接部221及懸空於導電端子收容槽112上方之第二對接部222。所述第一焊接部211彎折凸伸出第二平板基體12之後端,第二焊接部221凸伸出第二平板基體12之前端。所述第一對接部212與第二對接部222皆朝向絕緣本體1之後端斜向上延伸而分別凸伸入第一收容空間110和第二收容空間120。當***SIM卡5時,第一對接部212與第二對接部222對SIM卡5起引導作用,有利於SIM卡5的***。當SIM卡5***第一收容空間110後,SIM卡5抵壓第一導電端子21之第一對接部212,致使第一對接部212變形而容置於導電端子收容槽111內。當SIM卡5***第二收容空間120後,SIM卡5抵壓第二導電端子22之第二對接部222,致使第二對接部222變形而容置於導電端子收容槽121內。The conductive terminal 2 is injection molded into the insulative housing 1 and is divided into a first conductive terminal 21 and a second conductive terminal 22. The first conductive terminal 21 is held in the first flat substrate 11 and includes a first soldering portion 211 extending outside the insulating body 1 and a first mating portion 212 suspended above the conductive terminal receiving slot 111. The second conductive terminal 22 is held in the second flat substrate 12 , and includes a second soldering portion 221 extending from the outside of the insulative housing 1 and a second mating portion 222 suspended above the conductive terminal receiving slot 112 . The first soldering portion 211 is bent and protruded from the rear end of the second flat substrate 12, and the second soldering portion 221 protrudes from the front end of the second flat substrate 12. The first abutting portion 212 and the second abutting portion 222 extend obliquely upward toward the rear end of the insulative housing 1 and protrude into the first receiving space 110 and the second receiving space 120 respectively. When the SIM card 5 is inserted, the first docking portion 212 and the second docking portion 222 guide the SIM card 5, facilitating the insertion of the SIM card 5. After the SIM card 5 is inserted into the first receiving space 110, the SIM card 5 presses the first butting portion 212 of the first conductive terminal 21, so that the first butting portion 212 is deformed and received in the conductive terminal receiving groove 111. After the SIM card 5 is inserted into the second receiving space 120, the SIM card 5 presses the second butting portion 222 of the second conductive terminal 22, so that the second butting portion 222 is deformed and received in the conductive terminal receiving groove 121.
所述遮蔽殼體3由一金屬板衝壓彎折形成,其包括一本體部31及位於本體部31兩側之側部32。所述本體部31前端設有向上翹起之導引部311,導引部311導引SIM卡5***第一收容空間110。所述側部32相對於絕緣本體1之卡扣凹槽132設置有向內且向前延伸之卡扣彈片321。所述兩側部32底端設有向內彎折且相向延伸之扣持部322。所述側部32的寬度略大於絕緣本體1之側牆13的寬度,兩側部32的距離亦略大於兩側牆13的距離。所述遮蔽殼體3自絕緣本體1之前端向後端組裝。詳參第一圖和第六圖,組裝完成後,兩側部32分別包覆於側牆13外,因此,遮蔽殼體3與絕緣本體1於左右方向穩定固持。本體部31抵持住側牆13之頂面,扣持部322卡扣住絕緣本體1之凹陷部122。因此,遮蔽殼體3與絕緣本體1於上下方向穩定固持。側部32之後端抵持住側牆13之凸台131,卡扣彈片321容置於卡扣凹槽132內且抵持住卡扣凹槽132之前端面。因此,遮蔽殼體3與絕緣本體1於前後方向穩定固持。至此,遮蔽殼體3與絕緣本體1穩定固持。The shielding shell 3 is formed by stamping and bending a metal plate, and includes a body portion 31 and side portions 32 on both sides of the body portion 31. The front end of the main body portion 31 is provided with a guiding portion 311 which is tilted upward, and the guiding portion 311 guides the SIM card 5 into the first receiving space 110. The side portion 32 is provided with an inwardly and forwardly extending snap tab 321 with respect to the latching recess 132 of the insulative housing 1 . The bottom ends of the two side portions 32 are provided with a buckle portion 322 which is bent inward and extends toward each other. The width of the side portion 32 is slightly larger than the width of the side wall 13 of the insulative housing 1, and the distance between the side portions 32 is also slightly larger than the distance between the side walls 13. The shielding shell 3 is assembled from the front end to the rear end of the insulating body 1. Referring to the first and sixth figures in detail, after the assembly is completed, the two side portions 32 are respectively wrapped around the side wall 13, so that the shielding case 3 and the insulative housing 1 are stably held in the left-right direction. The body portion 31 abuts against the top surface of the side wall 13 , and the fastening portion 322 catches the recess portion 122 of the insulative housing 1 . Therefore, the shield case 3 and the insulative housing 1 are stably held in the up and down direction. The rear end of the side portion 32 abuts against the boss 131 of the side wall 13 , and the snap tab 321 is received in the latching recess 132 and abuts against the front end surface of the latching recess 132 . Therefore, the shield case 3 and the insulative housing 1 are stably held in the front-rear direction. So far, the shielding case 3 and the insulating body 1 are stably held.
詳參第四圖至第五圖,所述支撐件4一般由耐熱性較好的材料(如金屬、熱固性樹脂、耐熱性橡膠等)製成複數個,每個支撐件4包括一上埋設塊41、一下埋設塊42及一連接上埋設塊41和下埋設塊42之連接部43。所述上埋設塊41注塑成型於絕緣本體1之第一平板基體11內。所述下埋設塊42注塑成型於絕緣本體1之第二平板基體12內。其他實施方式中,絕緣本體1設置有凹槽以收容上埋設塊41和下埋設塊42。在保證支撐作用不受影響的情況下,所述連接部43與上埋設塊41和下埋設塊42之連接處進行打薄或切割處理,使連接部43與上埋設塊41和下埋設塊42儘量易於斷裂。在其他實施方式中,連接部43與上埋設塊41和下埋設塊42之間亦可以用膠水簡單連接,或者用其他易於連接部43脫落的方法連接。本實施例中,所述支撐件4設有四個,四支撐件4分別位於導電端子2之外側。在焊接時,四支撐件4將支撐絕緣本體1,減小絕緣本體1的受熱形變量,甚至避免絕緣本體1受熱形變。在焊接完成後,使用SIM卡5(或者相應之電子卡模型)***第二收容空間120,抵推連接部43致其脫落,丟棄連接部43。然後,該堆疊式電子卡連接器100將可以實現兩SIM卡5與電路板的連接。在其他實施方式中,所述支撐件(未圖示)亦可僅設置一個,其包括一上埋設塊(未圖示)、一下埋設塊(未圖示)及複數連接且支撐上、下埋設塊的連接部(未圖示)。焊接前,支撐件插設於第二收容空間120內且抵接於第一平板基體11和第二平板基體12之間(所述上埋設塊抵接於第一平板基體11,所述下埋設塊抵接第二平板基體12),而實現絕緣本體1的受熱形變量的減小。焊接完成後,將支撐件從第二收容空間120中取出。Referring to the fourth to fifth figures, the support member 4 is generally made of a plurality of materials (such as metal, thermosetting resin, heat-resistant rubber, etc.) having good heat resistance, and each support member 4 includes an upper buried block. 41. The buried block 42 and a connecting portion 43 connecting the upper buried block 41 and the lower buried block 42. The upper embedded block 41 is injection molded into the first flat substrate 11 of the insulative housing 1 . The lower embedded block 42 is injection molded into the second flat substrate 12 of the insulative housing 1 . In other embodiments, the insulative housing 1 is provided with a recess to receive the upper embedding block 41 and the lower embedding block 42. In the case where the supporting action is not affected, the connection portion 43 and the connection between the upper embedded block 41 and the lower embedded block 42 are thinned or cut, and the connecting portion 43 and the upper buried block 41 and the lower buried block 42 are connected. Try to break as easily as possible. In other embodiments, the connecting portion 43 and the upper embedded block 41 and the lower embedded block 42 may be simply connected by glue or connected by other methods in which the connecting portion 43 is easily detached. In this embodiment, the support member 4 is provided with four, and the four support members 4 are respectively located on the outer sides of the conductive terminals 2. During welding, the four support members 4 will support the insulative housing 1, reducing the heat-receiving variables of the insulative housing 1, and even avoiding the thermal deformation of the insulative housing 1. After the welding is completed, the SIM card 5 (or the corresponding electronic card model) is inserted into the second accommodating space 120, and the connecting portion 43 is pushed to fall off, and the connecting portion 43 is discarded. Then, the stacked electronic card connector 100 will enable the connection of the two SIM cards 5 to the circuit board. In other embodiments, the support member (not shown) may be provided with only one, including an upper embedded block (not shown), a lower buried block (not shown), and a plurality of connections and supporting the upper and lower burying. The connection part of the block (not shown). Before the welding, the support member is inserted into the second receiving space 120 and abuts between the first flat substrate 11 and the second flat substrate 12 (the upper embedded block abuts the first flat substrate 11 and the lower embedded The block abuts the second flat substrate 12) to achieve a reduction in the heat shape variable of the insulative housing 1. After the welding is completed, the support member is taken out from the second receiving space 120.
以上為本發明堆疊式電子卡連接器100的結構介紹,以下將詳細介紹本發明堆疊式電子卡連接器100的製造方法。The above is a description of the structure of the stacked electronic card connector 100 of the present invention. The method of manufacturing the stacked electronic card connector 100 of the present invention will be described in detail below.
第一實施方式,包括如下步驟:The first embodiment includes the following steps:
(a).提供由金屬板衝壓形成之導電端子2;(a) providing a conductive terminal 2 formed by stamping a metal plate;
(b).提供由耐熱性好的材料製成之支撐件4,所述支撐件4包括上埋設塊41、下埋設塊42及連接上埋設塊41和下埋設塊42之連接部43;(b) providing a support member 4 made of a heat-resistant material, the support member 4 includes an upper embedded block 41, a lower embedded block 42 and a connecting portion 43 connecting the upper buried block 41 and the lower embedded block 42;
(c).將導電端子2和支撐件4注塑成型於絕緣本體1內,所述絕緣本體1包括第一平板基體11及位於第一平板基體11下方之第二平板基體12,所述上埋設塊41埋設於第一平板基體11內,所述下埋設塊42埋設於第二平板基體12內;(c). The conductive terminal 2 and the support member 4 are injection molded into the insulative housing 1. The insulative housing 1 includes a first flat substrate 11 and a second flat substrate 12 located below the first flat substrate 11. The block 41 is embedded in the first flat substrate 11, and the lower embedded block 42 is embedded in the second flat substrate 12;
(d).提供遮蔽殼體3,將遮蔽殼體3組裝扣持於絕緣本體1外;(d) providing a shielding shell 3, the shielding housing 3 is assembled and held outside the insulating body 1;
(e).將導電端子2焊接於電路板(未圖示)上;(e) soldering the conductive terminal 2 to a circuit board (not shown);
(f).提供板狀物件(未圖示),將板狀物件***由第一平板基體11和第二平板基體12界定形成之第二收容空間120內,抵斷支撐件4之連接部43。(f). A plate-like member (not shown) is provided, and the plate-like member is inserted into the second receiving space 120 defined by the first flat substrate 11 and the second flat substrate 12, and the connecting portion 43 of the supporting member 4 is broken. .
第二實施方式,包括如下步驟:The second embodiment includes the following steps:
(a).提供由金屬板衝壓形成之導電端子2;(a) providing a conductive terminal 2 formed by stamping a metal plate;
(b).將導電端子2注塑成型於絕緣本體1內,所述絕緣本體1包括第一平板基體11及位於第一平板基體11下方之第二平板基體12,所述第一平板基體11和第二平板基體12界定形成第二收容空間120;(b) injection molding the conductive terminal 2 into the insulative housing 1, the insulative housing 1 comprising a first flat substrate 11 and a second flat substrate 12 under the first flat substrate 11, the first flat substrate 11 and The second flat substrate 12 defines a second receiving space 120;
(c).提供遮蔽殼體3,將遮蔽殼體3組裝扣持於絕緣本體1外;(c) providing a shielding shell 3, and assembling the shielding shell 3 to the outside of the insulating body 1;
(d).提供由耐熱性好的材料製成之支撐件(未圖示),所述支撐件插設於第二收容空間120內且抵接於第一平板基體11和第二平板基體12之間;(d) providing a support member (not shown) made of a heat-resistant material, the support member being inserted into the second receiving space 120 and abutting the first flat substrate 11 and the second flat substrate 12 between;
(e).將導電端子2焊接於電路板上;(e) soldering the conductive terminal 2 to the circuit board;
(f).將支撐件從第二收容空間120取出。(f). The support member is taken out from the second receiving space 120.
在絕緣本體1的第一平板基體11和第二平板基體12之間增設支撐件4,在焊接時,支撐件4支撐絕緣本體1,減小絕緣本體1的受熱形變量,甚至避免絕緣本體1受熱形變。A support member 4 is added between the first flat substrate 11 and the second flat base 12 of the insulative housing 1. When soldering, the support member 4 supports the insulative housing 1 to reduce the heat deformation of the insulative housing 1 and even avoid the insulative body 1 Deformed by heat.
以上所述僅為本發明的一種實施方式,不係全部的實施方式,本領域普通技術人員通過閱讀本發明說明書而對本發明技術方案採取的任何等效的變化,均為本發明的申請專利範圍所涵蓋。The above description is only one embodiment of the present invention, and not all of the embodiments, any equivalent changes taken by those skilled in the art by reading the specification of the present invention are the scope of patent application of the present invention. Covered.
100...堆疊式電子卡連接器100. . . Stacked electronic card connector
1...絕緣本體1. . . Insulating body
11...第一平板基體11. . . First flat substrate
110...第一收容空間110. . . First containment space
111、121...導電端子收容槽111, 121. . . Conductive terminal receiving slot
12...第二平板基體12. . . Second flat substrate
120...第二收容空間120. . . Second containment space
122...凹陷部122. . . Depression
13...側牆13. . . Side wall
131...凸台131. . . Boss
132...卡扣凹槽132. . . Buckle groove
14...限位擋止塊14. . . Limit stop block
2...導電端子2. . . Conductive terminal
21...第一導電端子twenty one. . . First conductive terminal
211...第一焊接部211. . . First weld
212...第一對接部212. . . First docking
22...第二導電端子twenty two. . . Second conductive terminal
221...第二焊接部221. . . Second weld
222...第二對接部222. . . Second docking
3...遮蔽殼體3. . . Shaded housing
31...本體部31. . . Body part
311...導引部311. . . Guide
32...側部32. . . Side
321...卡扣彈片321. . . Buckle shrapnel
322...扣持部322. . . Buckle department
4...支撐件4. . . supporting item
41...上埋設塊41. . . Buried block
42...下埋設塊42. . . Buried block
43...連接部43. . . Connection
5...SIM卡5. . . SIM card
第一圖係本發明堆疊式電子卡連接器之立體組合圖。The first figure is a perspective assembled view of the stacked electronic card connector of the present invention.
第二圖係本發明堆疊式電子卡連接器遮蔽殼體分離之示意圖。The second figure is a schematic diagram of the separation of the shielded housing of the stacked electronic card connector of the present invention.
第三圖係本發明堆疊式電子卡連接器遮蔽殼體分離之另一視角示意圖。The third figure is another perspective view of the separation of the shielded housing of the stacked electronic card connector of the present invention.
第四圖係本發明堆疊式電子卡連接器之立體分解圖。The fourth figure is an exploded perspective view of the stacked electronic card connector of the present invention.
第五圖係本發明堆疊式電子卡連接器之另一視角立體分解圖。The fifth figure is another perspective exploded view of the stacked electronic card connector of the present invention.
第六圖係本發明堆疊式電子卡連接器連接部脫落後之示意圖。The sixth figure is a schematic view of the stacked electronic card connector of the present invention after the connection portion is detached.
第七圖係本發明堆疊式電子卡連接器***兩張SIM卡之示意圖。The seventh figure is a schematic diagram of inserting two SIM cards into the stacked electronic card connector of the present invention.
100...堆疊式電子卡連接器100. . . Stacked electronic card connector
1...絕緣本體1. . . Insulating body
2...導電端子2. . . Conductive terminal
221...第二焊接部221. . . Second weld
3...遮蔽殼體3. . . Shaded housing
32...側部32. . . Side
4...支撐件4. . . supporting item
Claims (10)
絕緣本體,其包括第一平板基體及位於第一平板基體下方之第二平板基體;
導電端子,固持於絕緣本體內,其設有對接部;
遮蔽殼體,包覆於絕緣本體外,所述絕緣本體與遮蔽殼體配合界定形成收容空間,以收容對應之電子卡,所述對接部凸伸入收容空間內,以與對應電子卡電性連接;及
支撐件,用於支撐絕緣本體,其包括固持於絕緣本體內之上埋設塊和下埋設塊;
其中,所述上埋設塊埋設於第一平板基體內,所述下埋設塊埋設於第二平板基體內。A stacked electronic card connector comprising:
An insulating body comprising a first flat substrate and a second flat substrate under the first flat substrate;
The conductive terminal is fixed in the insulating body, and is provided with an abutting portion;
The shielding shell is wrapped on the outside of the insulating body, and the insulating body and the shielding shell cooperate to define a receiving space for receiving the corresponding electronic card, and the butting portion protrudes into the receiving space to correspond to the corresponding electronic card And a support member for supporting the insulating body, comprising: a buried block and a buried block supported on the insulating body;
The upper embedded block is embedded in the first flat substrate, and the lower buried block is embedded in the second flat substrate.
絕緣本體;
導電端子,固持於絕緣本體內,其設有對接部;
遮蔽殼體,包覆於絕緣本體外,所述絕緣本體與遮蔽殼體配合界定形成收容空間,以收容對應之電子卡,所述對接部凸伸入收容空間內,以與對應電子卡電性連接;及
支撐件,用於支撐絕緣本體,其包括固持於絕緣本體內之上埋設塊、下埋設塊及連接上埋設塊和下埋設塊之連接部。A stacked electronic card connector comprising:
Insulating body
The conductive terminal is fixed in the insulating body, and is provided with an abutting portion;
The shielding shell is wrapped on the outside of the insulating body, and the insulating body and the shielding shell cooperate to define a receiving space for receiving the corresponding electronic card, and the butting portion protrudes into the receiving space to correspond to the corresponding electronic card And a support member for supporting the insulative housing, comprising: a buried portion on the insulating body, a buried block, and a connecting portion connecting the buried block and the lower buried block.
(a).提供由金屬板衝壓形成之導電端子;
(b).提供由耐熱性好的材料製成之支撐件,所述支撐件包括上埋設塊、下埋設塊及連接上埋設塊和下埋設塊之連接部;
(c).將導電端子和支撐件注塑成型於絕緣本體內,所述絕緣本體包括第一平板基體及位於第一平板基體下方之第二平板基體,所述上埋設塊埋設於第一平板基體內,所述下埋設塊埋設於第二平板基體內;
(d).提供遮蔽殼體,將遮蔽殼體組裝扣持於絕緣本體外;
(e).將導電端子焊接於電路板上;
(f).提供板狀物件,將板狀物件***由第一平板基體和第二平板基體界定形成之第二收容空間內,抵斷支撐件之連接部。A method for manufacturing a stacked electronic card connector includes the following steps:
(a) providing a conductive terminal formed by stamping a metal plate;
(b) providing a support member made of a heat-resistant material, the support member comprising an upper buried block, a lower buried block, and a connecting portion connecting the upper buried block and the lower buried block;
(c) injection molding the conductive terminal and the support member into the insulating body, the insulating body comprising a first flat substrate and a second flat substrate under the first flat substrate, the upper buried block being embedded in the first flat base In the body, the lower buried block is embedded in the second flat substrate;
(d) providing a shielding shell, and clamping the shielding shell assembly to the outside of the insulating body;
(e) soldering the conductive terminals to the circuit board;
(f) providing a plate-like member that is inserted into the second receiving space defined by the first flat substrate and the second flat substrate to break the joint of the support.
(a).提供由金屬板衝壓形成之導電端子;
(b).將導電端子注塑成型於絕緣本體內,所述絕緣本體包括第一平板基體及位於第一平板基體下方之第二平板基體,所述第一平板基體和第二平板基體界定形成第二收容空間;
(c).提供遮蔽殼體,將遮蔽殼體組裝扣持於絕緣本體外;
(d).提供由耐熱性好的材料製成之支撐件,所述支撐件插設於第二收容空間內且抵接於第一平板基體和第二平板基體之間;
(e).將導電端子焊接於電路板上;
(f).將支撐件從第二收容空間取出。A method for manufacturing a stacked electronic card connector includes the following steps:
(a) providing a conductive terminal formed by stamping a metal plate;
(b) injection molding the conductive terminal into the insulating body, the insulating body comprising a first flat substrate and a second flat substrate under the first flat substrate, wherein the first flat substrate and the second flat substrate are defined Second containment space;
(c) providing a shielding shell, and clamping the shielding shell assembly to the outside of the insulating body;
(d) providing a support member made of a heat-resistant material, the support member is inserted into the second receiving space and abuts between the first flat substrate and the second flat substrate;
(e) soldering the conductive terminals to the circuit board;
(f). The support member is taken out from the second receiving space.
Priority Applications (1)
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TW101123807A TW201403975A (en) | 2012-07-03 | 2012-07-03 | Stacked electrical card connector and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW101123807A TW201403975A (en) | 2012-07-03 | 2012-07-03 | Stacked electrical card connector and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
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TW201403975A true TW201403975A (en) | 2014-01-16 |
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2012
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