TW201350862A - Film type probe card - Google Patents
Film type probe card Download PDFInfo
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- TW201350862A TW201350862A TW102113441A TW102113441A TW201350862A TW 201350862 A TW201350862 A TW 201350862A TW 102113441 A TW102113441 A TW 102113441A TW 102113441 A TW102113441 A TW 102113441A TW 201350862 A TW201350862 A TW 201350862A
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- circuit board
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
本發明是有關於一種探針卡，且特別是有關於一種能夠藉由數個膜取代探針，使得此些膜直接地接觸晶圓來測試晶圓之膜式探針卡。 The present invention relates to a probe card, and more particularly to a film probe card capable of testing a wafer by directly replacing the probe with a plurality of films so that the films directly contact the wafer.
一般來說，半導體裝置係藉由一連串之半導體製程來完成，例如是製造半導體晶圓之製程、從半導體晶圓製造數個單元之半導體晶片之製程、電測試晶片篩選(electrical die sorting，EDS)測試製程、封裝具有良好品質之半導體晶片的製程、與最終測試已封裝之半導體晶片之製程。EDS測試製程係決定形成在晶圓上之半導體晶片良好與否，一測試設備係於EDS測試製程中使用，測試設備係藉由提供電性訊號到晶圓上之半導體晶片來決定半導體晶片良好與否。 Generally, a semiconductor device is completed by a series of semiconductor processes, such as a process of manufacturing a semiconductor wafer, a process of manufacturing a semiconductor wafer from a semiconductor wafer, and electrical die sorting (EDS). Testing processes, packaging processes for semiconductor wafers of good quality, and final testing of packaged semiconductor wafers. The EDS test process determines whether the semiconductor wafer formed on the wafer is good or not. A test device is used in the EDS test process. The test device determines the semiconductor wafer by providing an electrical signal to the semiconductor wafer on the wafer. no.
此種測試設備包括一測試機及一探針卡，測試機產生一電性訊號，數個探針(needles)係貼附於探針卡，探針卡係從測試機傳送電性訊號至形成於半導體晶圓上之半導體晶片上之電極。探針卡傳送由測試機所產生之電性訊號至晶圓，或者經由探針與晶圓接觸之方式從晶圓傳送電性訊號至測試機。 The test equipment includes a test machine and a probe card, the test machine generates an electrical signal, and a plurality of probes are attached to the probe card, and the probe card transmits electrical signals from the test machine to form An electrode on a semiconductor wafer on a semiconductor wafer. The probe card transmits the electrical signal generated by the test machine to the wafer, or transmits the electrical signal from the wafer to the testing machine via the probe in contact with the wafer.
第1圖繪示貼附於一般之探針式探針卡之探針110的示意圖，且第2圖繪示具有耦接於印刷電路板(printed circuit board，PCB)130之探針110之探針式探針卡的示意圖。 FIG. 1 is a schematic diagram of a probe 110 attached to a general probe probe card, and FIG. 2 is a schematic diagram of a probe 110 coupled to a printed circuit board (PCB) 130. Schematic diagram of a pin probe card.
請參照第1及2圖，用於與晶圓接觸之部分的探針110係彎折，且探針110係固定於一框架上，如第1圖所示，且探針110係置放於絕緣管120上，以避免探針110發生短路，且探針110係藉由銲接之方式接合於PCB 130之接墊，以電性連接於PCB 130之接墊。接觸晶圓之探針110之尖端係砂磨(sanded)，且探針110係以此方式配置，使得晶圓之接墊對齊於探針110，藉以製造出探針式探針卡。 Referring to Figures 1 and 2, the probe 110 for the portion in contact with the wafer is bent, and the probe 110 is fixed to a frame as shown in Fig. 1, and the probe 110 is placed on the frame. The insulating tube 120 is disposed to avoid short circuit of the probe 110, and the probe 110 is soldered to the pad of the PCB 130 to be electrically connected to the pad of the PCB 130. The tip of the probe 110 that contacts the wafer is sanded, and the probe 110 is configured in such a manner that the pads of the wafer are aligned with the probe 110 to create a probe probe card.
探針式探針卡係藉由上述之方式製造，且整個作業係透過顯微鏡以人工方式進行。因此，製造一個探針卡需花費兩個星期的時間，當探針係與晶圓接觸時，針測行程值(overdrive value)係難以控制，且晶圓之接墊可能在探針與晶圓接觸時刮傷。再者，當形成於晶圓上之接墊具有狹小間距(pitch)時，由於固定探針式探針卡之探針而使其具有與具有狹小間距之接墊相同的間距係困難的，因此測試具有狹小間距之晶圓係困難的。 The probe probe card is manufactured in the manner described above, and the entire operation is performed manually through a microscope. Therefore, it takes two weeks to manufacture a probe card. When the probe system is in contact with the wafer, the overdrive value is difficult to control, and the pads of the wafer may be on the probe and the wafer. Scratch when in contact. Moreover, when the pads formed on the wafer have a narrow pitch, it is difficult to fix the probe of the probe type probe card to have the same pitch as the pads having the narrow pitch. It is difficult to test wafers with narrow pitches.
本發明係提供一種膜式探針卡，其能夠讓一膜直接地接觸一晶圓且測試此晶圓。 The present invention provides a membrane probe card that enables a film to directly contact a wafer and test the wafer.
根據本發明之一方面，一種膜式探針卡係提供，用以讓一膜接觸一晶圓且測試此晶圓。探針卡包括一底塊，耦接於 一或數個軸承與一或數個彈性元件；一壓塊，耦接於該一或數個軸承與該一或數個彈性元件，於具有彈性時垂直移動，壓塊之一底部之一部分對應於膜與晶圓之間的一接觸部分突出；膜形成有數個電極線於一絕緣膜上且藉由一彈性接合劑接合於壓塊之底部之突出部，以在具有彈性時讓此些電極線之數個端接觸晶圓之數個第一接墊；以及一印刷電路板，耦接於底塊，印刷電路板形成有數個第二接墊，且耦接於膜，以讓此些電極線之數個其他端電性連接於此些第二接墊。 In accordance with one aspect of the invention, a membrane probe card is provided for contacting a film with a wafer and testing the wafer. The probe card includes a bottom block coupled to One or several bearings and one or more elastic members; a pressing block coupled to the one or more bearings and the one or more elastic members, vertically moving when elastic, one of the bottom portions of the pressing block corresponding to Forming a contact portion between the film and the wafer; the film is formed with a plurality of electrode wires on an insulating film and joined to the protrusion at the bottom of the compact by an elastic bonding agent to allow the electrodes to have elasticity The plurality of terminals of the line contact the plurality of first pads of the wafer; and a printed circuit board coupled to the bottom block, the printed circuit board is formed with a plurality of second pads and coupled to the film to allow the electrodes A plurality of other ends of the wire are electrically connected to the second pads.
當膜係圍繞突出部且膜之兩端係可耦接於印刷電路板時，該膜係可藉由彈性接合劑接合於壓塊之底部之突出部之一下表面。 When the film system surrounds the protrusion and the two ends of the film are coupled to the printed circuit board, the film can be bonded to the lower surface of one of the protrusions at the bottom of the compact by an elastic bonding agent.
壓塊可包括一第一本體，耦接於該一或數個軸承與該一或數個彈性元件，且在具有彈性時垂直地移動；以及一第二本體，在具有一倒梯形時形成於第一本體之一底部，且包括為平面之一下表面，對應於膜與晶圓之間的接觸部分。第一本體與第二本體可彼此分開地形成或形成為一單一主體。 The compact block may include a first body coupled to the one or more bearings and the one or more elastic members, and vertically moving when elastic; and a second body formed on the inverted trapezoid One of the bottoms of the first body and includes a lower surface of the plane corresponding to the contact portion between the film and the wafer. The first body and the second body may be formed separately from each other or formed as a single body.
膜可包括形成於此些電極線之此些端上之數個凸塊以及形成於此些電極線之其他端上之數個凸塊，形成於此些電極線之此些端上之此些凸塊接觸晶圓之此些第一接墊，形成於此些電極線之其他端上之此些凸塊電性連接於印刷電路板之此些第二接墊。 The film may include a plurality of bumps formed on the ends of the electrode lines and a plurality of bumps formed on the other ends of the electrode lines, forming the plurality of bumps on the ends of the electrode lines The bumps contact the first pads of the wafer, and the bumps formed on the other ends of the electrode lines are electrically connected to the second pads of the printed circuit board.
膜式探針卡可更包括一或數個耦接元件，耦接膜於 印刷電路板，以讓此些電極線之其他端電性連接於印刷電路板之此些第二接墊。 The membrane probe card may further comprise one or several coupling elements, and the coupling membrane is The printed circuit board is configured to electrically connect the other ends of the electrode lines to the second pads of the printed circuit board.
軸承可為一交叉滾子導軌及一交叉球導軌之其中一者。彈性元件之一頂端及一底端之其中一者可藉由一第一耦接元件耦接於壓塊，且彈性元件之頂端及底端之另一者可藉由一第二耦接元件耦接於底塊。 The bearing can be one of a cross roller guide and a cross ball guide. One of the top end and the bottom end of the elastic element can be coupled to the pressing block by a first coupling element, and the other of the top end and the bottom end of the elastic element can be coupled by a second coupling element Connected to the bottom block.
膜式探針卡可更包括一或數個平行控制元件，該一或數個平行控制元件係在控制底塊之一高度來讓膜之一部分平行於印刷電路板時，耦接底塊於印刷電路板，膜之該部分係接合於壓塊之底部之突出部。彈性接合劑可為矽利康膠(silicon adhesives)。 The membrane probe card may further comprise one or several parallel control elements coupled to the bottom block for printing when one of the control blocks is at a height to control one of the portions of the film parallel to the printed circuit board The circuit board, the portion of the film is joined to the projection at the bottom of the compact. The elastic bonding agent can be silicon adhesives.
為了對本發明之上述及其他方面有更佳的瞭解，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下： In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:
110‧‧‧探針 110‧‧‧ probe
120‧‧‧絕緣管 120‧‧‧Insulation tube
130、360‧‧‧印刷電路板 130, 360‧‧‧ Printed circuit board
300‧‧‧膜式探針卡 300‧‧‧membrane probe card
310‧‧‧底塊 310‧‧‧ bottom block
320‧‧‧壓塊、第一本體 320‧‧‧Bucking block, first body
325‧‧‧壓塊、第二本體 325‧‧‧Bucking block, second body
330‧‧‧軸承 330‧‧‧ bearing
333‧‧‧第一LM導引件 333‧‧‧First LM Guide
335‧‧‧第二LM導引件 335‧‧‧Second LM Guide
340‧‧‧彈性元件 340‧‧‧Flexible components
343‧‧‧第一耦接元件 343‧‧‧First coupling element
345‧‧‧第二耦接元件 345‧‧‧Second coupling element
350‧‧‧膜 350‧‧‧ film
355‧‧‧凸塊 355‧‧‧Bumps
363‧‧‧第二接墊 363‧‧‧second mat
370‧‧‧耦接元件 370‧‧‧coupled components
380‧‧‧平行控制元件 380‧‧‧Parallel control elements
本發明之上述及其他的特性與優點將藉由本發明之詳細的範例性實施例且參照所附之圖式來更為清楚。 The above and other features and advantages of the present invention will become more apparent from the detailed description of the embodiments of the invention.
第1圖繪示貼附於一般之探針式探針卡之探針的示意圖；第2圖繪示第1圖之探針式探針卡具有耦接於印刷電路板之探針的示意圖；第3圖繪示根據本發明一實施例之膜式探針卡之上視圖；第4圖繪示第3圖之膜式探針卡之下部的示意圖；第5圖繪示第3圖之膜式探針卡之***圖； 第6圖繪示第3圖之膜式探針卡之放大圖；第7圖繪示第4圖中之膜式探針卡之放大圖；以及第8圖繪示一個或多個平行控制元件耦接於第3圖之膜式探針卡之示意圖。 1 is a schematic view showing a probe attached to a general probe type probe card; and FIG. 2 is a schematic view showing a probe probe card of FIG. 1 having a probe coupled to a printed circuit board; 3 is a top view of a membrane probe card according to an embodiment of the present invention; FIG. 4 is a schematic view showing a lower portion of the membrane probe card of FIG. 3; and FIG. 5 is a view of the membrane of FIG. Explosion diagram of the probe card; 6 is an enlarged view of the membrane probe card of FIG. 3; FIG. 7 is an enlarged view of the membrane probe card of FIG. 4; and FIG. 8 is a diagram showing one or more parallel control elements. A schematic diagram of a membrane probe card coupled to FIG.
為了充分地了解藉由本發明之實施例所達到之操作上之優點及觀點，必需參照所附之繪示有本發明之範例性實施例與其上所說明之內容的圖式。 To fully understand the operational advantages and aspects achieved by the embodiments of the present invention, reference is made to the accompanying drawings in which the exemplary embodiments of the invention are illustrated.
下文中，本發明將參照所附圖式詳細地說明。在所有圖式中，相同之參考編號係表示相同之元件。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In all the figures, the same reference numerals are used to refer to the same elements.
第3圖繪示根據本發明一實施例之膜式探針卡300之上視圖、第4圖繪示膜式探針卡300之下部的示意圖、第5圖繪示膜式探針卡300之***圖、第6圖繪示第3圖中之膜式探針卡300之放大圖、且第7圖繪示第4圖中之膜式探針卡300之放大圖。 3 is a top view of a membrane probe card 300 according to an embodiment of the invention, FIG. 4 is a schematic view showing a lower portion of the membrane probe card 300, and FIG. 5 is a schematic view of the membrane probe card 300. The exploded view, Fig. 6 is an enlarged view of the membrane probe card 300 in Fig. 3, and Fig. 7 is an enlarged view of the membrane probe card 300 in Fig. 4.
請參照第3至7圖，膜式探針卡300係讓一膜350與一晶圓(未繪示)接觸，且測試此晶圓，膜式探針卡300可包括底塊310、壓塊320與325、膜350、及印刷電路板(printed circuit board，PCB)360。 Referring to FIGS. 3-7, the membrane probe card 300 contacts a film 350 (not shown) and tests the wafer. The membrane probe card 300 can include a bottom block 310 and a compact. 320 and 325, film 350, and printed circuit board (PCB) 360.
底塊310可耦接於一或多個軸承330以及一或多個彈性元件340。底塊310可耦接且固定於PCB 360。壓塊320與325可耦接於一或多個軸承330與一或多個彈性元件340，且可 在具有彈性時垂直地移動，一或多個軸承330與一或多個彈性元件340係耦接於底塊310。 The bottom block 310 can be coupled to one or more bearings 330 and one or more resilient members 340. The bottom block 310 can be coupled and fixed to the PCB 360. The pressure blocks 320 and 325 can be coupled to one or more bearings 330 and one or more elastic members 340, and can One or more bearings 330 are coupled to the bottom block 310 in one or more resilient members 340 when moved vertically.
軸承330可具有交叉導引結構(cross guide structure)，交叉導引結構具有一第一LM導引件333與一第二LM導引件335。舉例來說，第二LM導引件335耦接且固定於底塊310，且第一LM導引件333耦接於壓塊320與325並垂直地移動，使得壓塊320與325可垂直地移動。舉例來說，具有交叉導引結構之軸承330可為交叉滾子導軌(cross roller guide)或交叉球導軌(cross ball guide)。當軸承330係為交叉滾子導軌時，滾子係形成在第二LM導引件335上以突出並***槽體或與槽體分離，槽體係形成於第一LM導引件333上，藉此讓第一LM導引件333垂直地移動。再者，當軸承330係為交叉球導軌時，球係形成於第二LM導引件335以突出並***槽體或與槽體分離，槽體係形成於第一LM導引件333上，藉此讓第一LM導引件333垂直地移動。既然此技術領域之人員係已熟悉交叉滾子導軌與交叉球導軌之結構與操作，下文將省略其之詳細的說明。再者，軸承330並未限制為交叉滾子導軌或交叉球導軌，且可為其他能夠讓壓塊320與325垂直地移動之元件。 The bearing 330 can have a cross guide structure having a first LM guide 333 and a second LM guide 335. For example, the second LM guide 335 is coupled to and fixed to the bottom block 310, and the first LM guide 333 is coupled to the clamps 320 and 325 and vertically moved, so that the clamps 320 and 325 can be vertically mobile. For example, the bearing 330 having a cross-guide structure can be a cross roller guide or a cross ball guide. When the bearing 330 is a cross roller guide, the roller is formed on the second LM guide 335 to protrude and be inserted into the slot or separated from the slot, and the slot system is formed on the first LM guide 333. This causes the first LM guide 333 to move vertically. Moreover, when the bearing 330 is a cross ball guide, the ball system is formed on the second LM guide 335 to protrude and be inserted into or separated from the groove body, and the groove system is formed on the first LM guide 333. This causes the first LM guide 333 to move vertically. Since the person skilled in the art is familiar with the structure and operation of the cross roller guide and the cross ball guide, detailed description thereof will be omitted below. Moreover, the bearing 330 is not limited to a cross roller guide or a cross ball guide, and may be other components that allow the clamps 320 and 325 to move vertically.
一或多個彈性元件340可耦接於壓塊320與325以及底塊310之間，以於垂直方向中提供彈性。舉例來說，彈性元件340之頂端可藉由一第一耦接元件343來耦接於壓塊320與325，且彈性元件340之底端可藉由一第二耦接元件345來耦接 於底塊310。然而，耦接之方式並未限制為此處所述之方式，但彈性元件340之底端可耦接於壓塊320與325，且彈性元件340之頂端可耦接於底塊310。雖然於第5圖中係繪示彈性元件340具有一彈簧形狀，彈性元件340並未限制為此形狀，且可具有其他形狀而能夠於垂直方向中提供彈性。 One or more resilient members 340 can be coupled between the blocks 320 and 325 and the bottom block 310 to provide resiliency in a vertical direction. For example, the top end of the elastic element 340 can be coupled to the pressing blocks 320 and 325 by a first coupling element 343, and the bottom end of the elastic element 340 can be coupled by a second coupling element 345. At the bottom block 310. However, the manner of coupling is not limited to the manner described herein, but the bottom end of the elastic member 340 can be coupled to the pressing blocks 320 and 325, and the top end of the elastic member 340 can be coupled to the bottom block 310. Although the elastic member 340 has a spring shape as shown in FIG. 5, the elastic member 340 is not limited to this shape, and may have other shapes to provide elasticity in the vertical direction.
也就是說，在膜式探針卡300之情況中，壓塊320與325可在利用軸承330與彈性元件340時具有彈性來精確地於垂直方向中移動。再者，既然彈性元件340可簡單地從底塊310與壓塊320與325拆除，在膜藉由耦接彈性元件340來接觸於晶圓時，簡單地控制針測行程值(overdrive value)係有可能的，彈性元件340係在有需要時與底塊310以及壓塊320與325具有適當的彈性係數。 That is, in the case of the membrane probe card 300, the pressure blocks 320 and 325 can have elasticity when using the bearing 330 and the elastic member 340 to accurately move in the vertical direction. Moreover, since the elastic member 340 can be simply removed from the bottom block 310 and the pressure blocks 320 and 325, the overdrive value is simply controlled when the film contacts the wafer by coupling the elastic member 340. It is possible that the resilient member 340 has a suitable spring rate with the bottom block 310 and the pressure blocks 320 and 325 as needed.
壓塊320與325可具有突出部於其底部上，對應於膜350與晶圓之接觸部分。舉例來說，壓塊320與325可包括一第一本體320與一第二本體325，且第一本體320與第二本體325可分開地形成且耦接於彼此，或者可形成為單一主體。第一本體320可耦接於一或多個軸承330與一或多個彈性元件340，並可在具有彈性時垂直地移動。第二本體325可形成於第一本體320之底部上，且可具有形成為平面之底部，對應於膜350與晶圓之間的接觸部分。舉例來說，第二本體325可具有倒梯形且可形成在第一本體320之底部上。然而，第二本體325並不限為倒梯形且可具有各種形狀。 The briquettes 320 and 325 can have protrusions on their bottoms that correspond to the portions of the film 350 that are in contact with the wafer. For example, the briquettes 320 and 325 can include a first body 320 and a second body 325, and the first body 320 and the second body 325 can be formed separately and coupled to each other, or can be formed as a single body. The first body 320 can be coupled to one or more bearings 330 and one or more resilient members 340 and can move vertically when resilient. The second body 325 may be formed on the bottom of the first body 320 and may have a bottom formed in a plane corresponding to a contact portion between the film 350 and the wafer. For example, the second body 325 can have an inverted trapezoidal shape and can be formed on the bottom of the first body 320. However, the second body 325 is not limited to an inverted trapezoid and may have various shapes.
膜350係形成有數個電極線於一絕緣膜上，且可藉由一彈性接合劑來接合於壓塊320與325之底部的突出部，也就是第二本體325之底部，使得此些電極線之數端係在具有彈性時與晶圓之第一接墊接觸。當膜350係利用彈性接合劑接合於第二本體325之底部時，具有均勻平坦度之一彈性層係在彈性接合劑固化時形成於膜350與第二本體325之底部之間。既然彈性層具有均勻平坦度，此些電極線之數個端及晶圓之第一接墊可同時互相接觸。再者，既然彈性層提供彈性，當壓力向下提供時，在接觸點之穩定的相互接觸與避免第一接墊之傷害係有可能的。彈性接合劑可為矽利康膠(silicon adhesives)。然而，彈性接合劑並不限於為矽利康膠且可為各種具有能夠接合膜350於第二本體325之底部且形成彈性層的膠體。 The film 350 is formed with a plurality of electrode lines on an insulating film, and can be joined to the protrusions at the bottom of the pressing blocks 320 and 325 by an elastic bonding agent, that is, the bottom of the second body 325, so that the electrode lines The end of the number is in contact with the first pad of the wafer when it is elastic. When the film 350 is bonded to the bottom of the second body 325 with an elastic bonding agent, one of the elastic layers having uniform flatness is formed between the film 350 and the bottom of the second body 325 when the elastic bonding agent is cured. Since the elastic layer has uniform flatness, the plurality of ends of the electrode lines and the first pads of the wafer can simultaneously contact each other. Furthermore, since the elastic layer provides elasticity, it is possible to stably contact each other at the contact point and to avoid damage to the first pad when the pressure is provided downward. The elastic bonding agent can be silicon adhesives. However, the elastic bonding agent is not limited to being a selecon gum and may be various colloids having a film capable of bonding the film 350 to the bottom of the second body 325 and forming an elastic layer.
如第7圖中所示，膜350可耦接於壓塊320與325，以圍繞底部之突出部，也就是第二本體325之底部，且膜350之兩端可耦接於PCB 360，使得此些電極線之數個其他端與第二接墊363可彼此電性連接。然而，膜350可不與PCB 360直接接觸，但可經由撓性印刷電路板(flexible PCB，FPCB)連接於PCB 360。也就是說，形成於膜350上之此些電極線之此些其他端與形成於FPCB上之數個電極線之數個端可彼此電性連接，且FPCB之此些電極線之數個其他端與第PCB 360之第二接墊363可彼此電性連接。 As shown in FIG. 7, the film 350 can be coupled to the pressing blocks 320 and 325 to surround the protrusion of the bottom portion, that is, the bottom of the second body 325, and the two ends of the film 350 can be coupled to the PCB 360, so that The other ends of the electrode lines and the second pads 363 can be electrically connected to each other. However, the film 350 may not be in direct contact with the PCB 360, but may be connected to the PCB 360 via a flexible printed circuit (FPCB). That is, the other ends of the electrode lines formed on the film 350 and the plurality of ends of the plurality of electrode lines formed on the FPCB can be electrically connected to each other, and the other of the electrode lines of the FPCB The second pads 363 of the end and the third PCB 360 can be electrically connected to each other.
膜可具有凸塊355在此些電極線之此些端上來與晶 圓之第一接墊接觸，如第7圖所示。也就是說，凸塊355可形成在電極線與晶圓之第一接墊之接觸點上。根據將進行測試之晶圓之第一接墊的形狀，凸塊355可具有各種形狀。舉例來說，當晶圓之第一接墊係形成一列時，如第7圖之左下中所示，膜350可具有排成一列之凸塊來與晶圓之上排接觸，且具有排成一列之凸塊來與晶圓之下排接觸。如同另一例子，當晶圓之第一接墊係形成為兩列時，如第7圖之右下中所示，膜350可具有排成兩列之凸塊來與晶圓之兩個上排接觸，且具有排成兩列之凸塊來與晶圓之兩個下排接觸。 The film may have bumps 355 on the ends of the electrode lines to form crystals The first contact of the circle is in contact, as shown in Figure 7. That is, the bumps 355 can be formed on the contact points of the electrode lines and the first pads of the wafer. The bumps 355 can have various shapes depending on the shape of the first pads of the wafer to be tested. For example, when the first pads of the wafer are formed into a column, as shown in the lower left of FIG. 7, the film 350 may have bumps arranged in a row to contact the upper row of the wafer, and have the rows arranged. A column of bumps is in contact with the lower row of wafers. As another example, when the first pads of the wafer are formed in two columns, as shown in the lower right of FIG. 7, the film 350 may have two rows of bumps on the wafer and two on the wafer. The rows are in contact and have bumps arranged in two columns to contact the two lower rows of wafers.
於第7圖中，既然一絕緣層係形成於電極線之一上部，電極線係未繪示出來。雖然未繪示於第7圖中，在第7圖之左下或右下中，上方的凸塊可經由向上形成之電極線來電性連接於PCB 360之第二接墊363，且下方的凸塊可經由向下形成之電極線來電性連接於PCB 360之第二接墊363。膜350可具有形成於此些電極線之此些其他端上之凸塊，電性連接於PCB 360之第二接墊363。也就是說，形成在膜350上之此些電極線之此些其他端上，位置及間距(pitch)係相同於第二接墊363之位置及間距的凸塊可形成。當膜350並非直接地接觸PCB 360且經由FPCB接觸PCB 360時，位置及間距係相同於第二接墊363之位置及間距的凸塊可形成在形成於FPCB上之此些電極線之此些其他端上。 In Fig. 7, since an insulating layer is formed on one of the electrode lines, the electrode lines are not shown. Although not shown in FIG. 7, in the lower left or lower right of FIG. 7, the upper bumps may be electrically connected to the second pads 363 of the PCB 360 via the upwardly formed electrode lines, and the bumps below The second pad 363 of the PCB 360 can be electrically connected to the electrode line formed downward. The film 350 may have bumps formed on the other ends of the electrode lines, and electrically connected to the second pads 363 of the PCB 360. That is to say, on the other ends of the electrode lines formed on the film 350, bumps having the same position and pitch as the position and pitch of the second pads 363 can be formed. When the film 350 does not directly contact the PCB 360 and contacts the PCB 360 via the FPCB, the bumps having the same position and spacing as the position and spacing of the second pads 363 may be formed on the electrode lines formed on the FPCB. On the other end.
在第6圖中，膜350係耦接於PCB 360，使得形成 於膜350上之此些電極線之此些其他端係電性連接於PCB 360之第二接墊363。在第6圖中所示之狀態中，一或多個耦接元件370可耦接於第6圖中所示之膜350之頂部，以讓此些電極線之此些其他端與PCB 360之第二接墊363可彼此穩定的接觸。也就是說，一或多個耦接元件370向下壓膜350來使其與PCB 360耦接，使得此些電極線之此些其他端與PCB 360之第二接墊363可更為穩定的彼此接觸。當膜350未直接接觸PCB 360且經由FPCB接觸PCB 360時，一或多個耦接元件370可耦接於FPCB之頂部。 In FIG. 6, the film 350 is coupled to the PCB 360 to form The other ends of the electrode lines on the film 350 are electrically connected to the second pads 363 of the PCB 360. In the state shown in FIG. 6, one or more coupling elements 370 can be coupled to the top of the film 350 shown in FIG. 6 to allow the other ends of the electrode lines to be connected to the PCB 360. The second pads 363 can be in stable contact with each other. That is, the one or more coupling elements 370 press the film 350 down to couple it with the PCB 360, so that the other ends of the electrode lines and the second pads 363 of the PCB 360 can be more stable. Contact each other. When the film 350 does not directly contact the PCB 360 and contacts the PCB 360 via the FPCB, one or more coupling elements 370 can be coupled to the top of the FPCB.
當藉由具有上述結構之膜式探針卡300來測試晶圓時，以第3圖作為參考而言，晶圓係擺置而面向膜式探針卡300之底面，且壓塊320與325係向下壓以讓藉由彈性接合劑接合於第二本體325之膜350接觸晶圓之第一接墊，藉此執行測試。 When the wafer is tested by the membrane probe card 300 having the above structure, with reference to FIG. 3 as a reference, the wafer is placed facing the bottom surface of the membrane probe card 300, and the clamps 320 and 325 are used. The test is performed by pressing down to allow the film 350 bonded to the second body 325 by the elastic bonding agent to contact the first pad of the wafer.
第8圖繪示一個或多個平行控制元件380耦接於膜式探針卡300之示意圖。 FIG. 8 is a schematic diagram showing one or more parallel control elements 380 coupled to the membrane probe card 300.
請參照第3至8圖，當測試晶圓時，耦接於第二本體325之底部的膜350係需要平行於PCB 360，以讓晶圓之第一接墊與此些電極線之此些端可同時互相接觸。平行控制元件380控制耦接於第二本體325之底部的膜350與PCB 360維持彼此相互平行。也就是說，平行控制元件380可控制PCB 360之上表面與壓塊310之下表面之間的高度。舉例來說，平行控制元件380可為螺栓。在此情況中，當螺栓係向右轉動時，在PCB 360之上表面與壓塊310之下表面之間的高度係可減少。當螺栓係向左轉 動時，在PCB 360之上表面與壓塊310之下表面之間的高度係可增加。 Referring to FIGS. 3-8, when the wafer is tested, the film 350 coupled to the bottom of the second body 325 needs to be parallel to the PCB 360 so that the first pad of the wafer and the electrode lines are the same. The ends can be in contact with each other at the same time. The parallel control element 380 controls the film 350 and the PCB 360 coupled to the bottom of the second body 325 to remain parallel to each other. That is, the parallel control element 380 can control the height between the upper surface of the PCB 360 and the lower surface of the compact 310. For example, the parallel control element 380 can be a bolt. In this case, when the bolt is rotated to the right, the height between the upper surface of the PCB 360 and the lower surface of the compact 310 can be reduced. When the bolt is turned left At the time of movement, the height between the upper surface of the PCB 360 and the lower surface of the compact 310 can be increased.
如上所述，在PCB 360之上表面與壓塊310之左下表面之間的高度以及在PCB 360之上表面與壓塊310之右下表面之間的高度係藉由一或多個平行控制元件380來控制，藉此保持耦接於第二本體325之底部的膜350與PCB 360彼此平行。 As described above, the height between the upper surface of the PCB 360 and the lower left surface of the compact 310 and the height between the upper surface of the PCB 360 and the lower right surface of the compact 310 are controlled by one or more parallel control elements. The 380 is controlled to thereby maintain the film 350 coupled to the bottom of the second body 325 and the PCB 360 parallel to each other.
既然根據本實施例之膜式探針卡藉由讓一膜直接與晶圓接觸來測試晶圓，形成探針係沒有必要的，藉此簡化製程且減少製造時間。再者，當藉由軸承與彈性元件來準確地於垂直方向中移動，膜式探針卡可進行測試，且藉由在膜與晶圓接觸時來根據彈性係數選擇彈性元件，膜式探針卡可簡單地控制針測行程值。再者，在膜式探針卡之情況中，藉由利用彈性接合劑來接合膜於壓塊之下表面，使得膜係在維持平的狀態且接著可穩定與晶圓接觸時接合於壓塊之下表面。 Since the membrane probe card according to the present embodiment tests the wafer by directly contacting a film with the wafer, it is not necessary to form a probe system, thereby simplifying the process and reducing the manufacturing time. Furthermore, when the bearing and the elastic member are accurately moved in the vertical direction, the film probe card can be tested, and the elastic probe is selected according to the elastic coefficient when the film is in contact with the wafer, the membrane probe The card simply controls the needle stroke value. Furthermore, in the case of a membrane probe card, the film is bonded to the lower surface of the compact by using an elastic bonding agent so that the film is bonded to the compact while maintaining a flat state and then stably contacting the wafer. Under the surface.
綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
300‧‧‧膜式探針卡 300‧‧‧membrane probe card
310‧‧‧底塊 310‧‧‧ bottom block
320‧‧‧壓塊、第一本體 320‧‧‧Bucking block, first body
330‧‧‧軸承 330‧‧‧ bearing
333‧‧‧第一LM導引件 333‧‧‧First LM Guide
335‧‧‧第二LM導引件 335‧‧‧Second LM Guide
340‧‧‧彈性元件 340‧‧‧Flexible components
360‧‧‧印刷電路板 360‧‧‧Printed circuit board
370‧‧‧耦接元件 370‧‧‧coupled components
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020120043176A KR101189649B1 (en) | 2012-04-25 | 2012-04-25 | Film type probe card |
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| Publication Number | Publication Date |
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| TW201350862A true TW201350862A (en) | 2013-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102113441A TW201350862A (en) | 2012-04-25 | 2013-04-16 | Film type probe card |
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| KR (1) | KR101189649B1 (en) |
| TW (1) | TW201350862A (en) |
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| US6343940B1 (en) | 2000-06-19 | 2002-02-05 | Advantest Corp | Contact structure and assembly mechanism thereof |
| KR100548803B1 (en) | 2003-11-03 | 2006-02-02 | (주)티에스이 | Probe pin block of probe card |
| KR101108479B1 (en) | 2009-12-15 | 2012-01-31 | 주식회사 프로이천 | Probe apparatus for wafer solder bump |
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