TW201348651A - Light-emitting apparatus - Google Patents
Light-emitting apparatus Download PDFInfo
- Publication number
- TW201348651A TW201348651A TW101118100A TW101118100A TW201348651A TW 201348651 A TW201348651 A TW 201348651A TW 101118100 A TW101118100 A TW 101118100A TW 101118100 A TW101118100 A TW 101118100A TW 201348651 A TW201348651 A TW 201348651A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- curved surface
- unit
- illuminating device
- emitting diode
- Prior art date
Links
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
本發明係關於一種具有均勻光場之發光裝置。 The present invention relates to a light-emitting device having a uniform light field.
發光二極體是半導體元件中一種被廣泛使用的光源。相較於傳統的白熾燈泡或螢光燈管,發光二極體具有省電及使用壽命較長的特性,因此逐漸取代傳統光源而應用於各種領域,如交通號誌、背光模組、路燈照明、醫療設備等產業。 A light-emitting diode is a widely used light source among semiconductor elements. Compared with traditional incandescent bulbs or fluorescent tubes, LEDs have the characteristics of power saving and long service life, so they gradually replace traditional light sources and are used in various fields, such as traffic signs, backlight modules, street lighting. , medical equipment and other industries.
近年來,隨著發光二極體應用的增加,各種增加發光二極體光摘出效率的方法一一被提出。欲增進光摘出效率所面臨的問題之一,為發光二極體電極間傳輸電流分布不均勻,所造成局部區域中電流密度過高(current crowding)問題。因為兩電極間電流分布不均,使得操作電流增加而導致特定區域的電流密度過高,使發光二極體的總體發光效率降低。 In recent years, as the application of light-emitting diodes has increased, various methods for increasing the light extraction efficiency of light-emitting diodes have been proposed. One of the problems faced in order to improve the efficiency of light extraction is that the current distribution between the electrodes of the light-emitting diodes is uneven, causing current crowding problems in local regions. Because the current distribution between the two electrodes is uneven, the operating current is increased and the current density of the specific region is too high, so that the overall luminous efficiency of the light-emitting diode is lowered.
所述特定區域電流密度過高的情形導致發光二極體的出光呈現集中的現象,即使在發光二極體上做表面粗化或加上反射結構等改良,也僅能提昇一定程度的出光效率,而發光二極體結合到封裝基板進而應用於燈具時,則需要在燈具的結構上形成可使光線均勻分佈的透鏡。 When the current density of the specific region is too high, the light output of the light-emitting diode is concentrated. Even if the surface is roughened or the reflective structure is improved on the light-emitting diode, only a certain degree of light-emitting efficiency can be improved. When the light-emitting diode is coupled to the package substrate and then applied to the lamp, it is necessary to form a lens on the structure of the lamp to uniformly distribute the light.
一種發光裝置,包含:一基座,具有一上表面;複數發光單元形成於基座上表面且排列成一環狀圖案;複數導光單元分別形成於各發光單元之上,其中各導光單元具有一第一弧面及一第二弧面,以將光線摘出。 A light-emitting device comprising: a base having an upper surface; a plurality of light-emitting units formed on an upper surface of the base and arranged in an annular pattern; a plurality of light-guiding units respectively formed on each of the light-emitting units, wherein each light-guiding unit has A first curved surface and a second curved surface are used to extract light.
如圖1A及圖1B所示,係本發明發光裝置之一具體實施例。發光裝置100可例如為一燈泡裝置,包括一基座102具有一上表面102a、一電路板112形成於基座102之上表面102a上、複數發光單元104形成於電路板112上且排列成一環狀圖案、以及複數導光單元106分別形成於複數發光單元104上。發光單元104可例如為一發光二極體封裝元件,而導光單元106包括一用以反射光線之第一弧面106a及一可使光線穿透之第二弧面106b。複數導光單元106之側面可彼此相接或交錯而包圍成一容置空間,頂端則排列成一開口108。各導光單元106係根據一環繞中心C環繞排列,而第一弧面106a係較第二弧面106b接近環繞中心。 1A and 1B are a specific embodiment of a light-emitting device of the present invention. The light emitting device 100 can be, for example, a light bulb device, and includes a base 102 having an upper surface 102a, a circuit board 112 formed on the upper surface 102a of the base 102, and a plurality of light emitting units 104 formed on the circuit board 112 and arranged in a ring. The pattern and the plurality of light guiding units 106 are respectively formed on the plurality of light emitting units 104. The light-emitting unit 104 can be, for example, a light-emitting diode package component, and the light-guiding unit 106 includes a first curved surface 106a for reflecting light and a second curved surface 106b for allowing light to pass through. The sides of the plurality of light guiding units 106 may be connected to each other or staggered to form an accommodating space, and the top ends are arranged as an opening 108. Each of the light guiding units 106 is circumferentially arranged according to a surrounding center C, and the first curved surface 106a is closer to the surrounding center than the second curved surface 106b.
基座102內部可具有一驅動單元(圖未示)可將外部的交流電轉化為直流電以供應給電路板112。基座102之上表面102a約略中央位置可另具有一大致位於開口108下方之柱狀散熱單元110,如圖1B所示,電路板112之概略中央位置可具有對應容納柱狀散熱單元110 之裝設口112b,柱狀散熱單元110可一體設置於基座102之上表面102a。基座102可具有貫通上表面102a之複數第一排熱孔102b,而電路板112可具有分別對應複數第一排熱孔102b之複數第二排熱孔112a,柱狀散熱單元110亦具有縱向貫通之第三排熱孔110a。基座102內部之驅動單元所產生的熱可藉由第一排熱孔102b、第二排熱孔112a以及第三排熱孔110a往開口108流動而排出發光裝置100外,而發光單元104所產生的熱也可透過電路板112及柱狀散熱單元110排出發光裝置100外。 The base 102 may have a driving unit (not shown) inside to convert external alternating current into direct current to be supplied to the circuit board 112. The upper surface 102a of the pedestal 102 may have a columnar heat dissipating unit 110 substantially below the opening 108. As shown in FIG. 1B, the schematic central position of the circuit board 112 may have a corresponding columnar heat dissipating unit 110. The mounting portion 112b, the columnar heat dissipating unit 110 can be integrally disposed on the upper surface 102a of the base 102. The pedestal 102 may have a plurality of first heat holes 102b extending through the upper surface 102a, and the circuit board 112 may have a plurality of second heat holes 112a corresponding to the plurality of first heat holes 102b, and the column heat dissipation unit 110 also has a longitudinal direction. The third row of heat holes 110a are penetrated. The heat generated by the driving unit inside the susceptor 102 can be discharged to the outside of the illuminating device 100 by the first heat discharging hole 102b, the second heat discharging hole 112a and the third heat discharging hole 110a flowing to the opening 108, and the light emitting unit 104 The generated heat can also be discharged outside the light emitting device 100 through the circuit board 112 and the columnar heat dissipating unit 110.
如圖1C所示,導光單元106可為一中空體,底部具有一開口106c以容納發光單元104,第一弧面106a上可藉由塗佈反射材料、研磨或鍍膜等方式形成一高反射面。高反射面可形成於導光單元106的內部或外部。第一弧面106a的面積係較第二弧面106b小,發光單元104的光線可直接由第二弧面106b出光,或藉由第一弧面106a一次反射至第二弧面106b出光,或可於第一弧面106a、第二弧面106b間來回反射而由第二弧面106b出光。發光單元104所產生的光線可以各種角度由第二弧面106b出光,使得發光裝置100產生廣域之光場分布。本實施例中的導光單元106之中空體結構僅為舉例說明,導光單元106亦可為一透明的實心體。 As shown in FIG. 1C, the light guiding unit 106 can be a hollow body, and the bottom portion has an opening 106c for accommodating the light emitting unit 104. The first curved surface 106a can form a high reflection by coating a reflective material, grinding or coating. surface. The highly reflective surface may be formed inside or outside the light guiding unit 106. The area of the first curved surface 106a is smaller than the second curved surface 106b, and the light of the light emitting unit 104 may be directly emitted by the second curved surface 106b, or may be reflected by the first curved surface 106a to the second curved surface 106b, or The first curved surface 106a and the second curved surface 106b are reflected back and forth to be emitted by the second curved surface 106b. The light generated by the light emitting unit 104 can be emitted by the second curved surface 106b at various angles, so that the light emitting device 100 generates a wide-area light field distribution. The hollow body structure of the light guiding unit 106 in this embodiment is only an example, and the light guiding unit 106 can also be a transparent solid body.
如圖1D所示,發光單元104可包括一封裝基板114、一或複數藍光發光二極體晶粒118、一或複數紅光發光二極體晶粒120、覆蓋於藍光發光二極體晶粒118及紅光發光二極體晶粒120上之一封裝膠體122、以及形成於封裝膠體122表面上之一層波長轉換單元124。藉由藍光發光二極體晶粒118、紅光發光二極體晶粒120以及波長轉換單元124之混光可產生用以照明之白光。 As shown in FIG. 1D, the light emitting unit 104 may include a package substrate 114, one or a plurality of blue light emitting diode crystal grains 118, one or a plurality of red light emitting diode crystal grains 120, and cover the blue light emitting diode crystal grains. 118 and one of the encapsulating colloids 122 on the red light emitting diode die 120 and a layer wavelength converting unit 124 formed on the surface of the encapsulant 122. The white light for illumination can be generated by the light mixing of the blue light emitting diode die 118, the red light emitting diode die 120, and the wavelength converting unit 124.
雖然本發明已說明如上,然其並非用以限制本發明之範圍、實施順序、或使用之材料與製程方法。對於本發明所作之各種修飾與變更,皆不脫本發明之精神與範圍。 Although the invention has been described above, it is not intended to limit the scope of the invention, the order of implementation, or the materials and process methods used. Various modifications and variations of the present invention are possible without departing from the spirit and scope of the invention.
100‧‧‧發光裝置 100‧‧‧Lighting device
102‧‧‧基座 102‧‧‧Base
102a‧‧‧上表面 102a‧‧‧ upper surface
102b‧‧‧第一排熱孔 102b‧‧‧ first row of hot holes
104‧‧‧發光單元 104‧‧‧Lighting unit
106‧‧‧導光單元 106‧‧‧Light guide unit
106a‧‧‧第一弧面 106a‧‧‧First curved surface
106b‧‧‧第二弧面 106b‧‧‧second curved surface
106c‧‧‧開口 106c‧‧‧ openings
108‧‧‧開口 108‧‧‧ openings
110‧‧‧柱狀散熱單元 110‧‧‧column heat sink
110a‧‧‧第三排熱孔 110a‧‧‧ third row of hot holes
112‧‧‧電路板 112‧‧‧Circuit board
112a‧‧‧第二排熱孔 112a‧‧‧Second row of hot holes
112b‧‧‧裝設口 112b‧‧‧Installation
114‧‧‧封裝基板 114‧‧‧Package substrate
118‧‧‧藍光發光二極體晶粒 118‧‧‧Blue Light Emitting Diode Grains
120‧‧‧紅光發光二極體晶粒 120‧‧‧Red light emitting diode crystal
122‧‧‧封裝膠體 122‧‧‧Package colloid
124‧‧‧波長轉換單元 124‧‧‧wavelength conversion unit
C‧‧‧環繞中心 C‧‧‧ Surrounding Center
第1A圖係顯示本發明發光裝置之一具體實施例之側視剖面圖。 Fig. 1A is a side cross-sectional view showing a specific embodiment of a light-emitting device of the present invention.
第1B圖係本發明發光裝置之上視剖面圖。 Fig. 1B is a top cross-sectional view of the light-emitting device of the present invention.
第1C圖係本發明發光裝置之導光單元示意圖。 1C is a schematic view of a light guiding unit of the light-emitting device of the present invention.
第1D圖係本發明發光裝置之發光單元示意圖。 Fig. 1D is a schematic view of a light-emitting unit of the light-emitting device of the present invention.
100‧‧‧發光裝置 100‧‧‧Lighting device
102‧‧‧基座 102‧‧‧Base
102a‧‧‧上表面 102a‧‧‧ upper surface
102b‧‧‧第一排熱孔 102b‧‧‧ first row of hot holes
104‧‧‧發光單元 104‧‧‧Lighting unit
106‧‧‧導光單元 106‧‧‧Light guide unit
106a‧‧‧第一弧面 106a‧‧‧First curved surface
106b‧‧‧第二弧面 106b‧‧‧second curved surface
108‧‧‧開口 108‧‧‧ openings
110‧‧‧柱狀散熱單元 110‧‧‧column heat sink
112‧‧‧電路板 112‧‧‧Circuit board
112a‧‧‧第二排熱孔 112a‧‧‧Second row of hot holes
C‧‧‧環繞中心 C‧‧‧ Surrounding Center
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101118100A TWI551822B (en) | 2012-05-21 | 2012-05-21 | Light-emitting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101118100A TWI551822B (en) | 2012-05-21 | 2012-05-21 | Light-emitting apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201348651A true TW201348651A (en) | 2013-12-01 |
TWI551822B TWI551822B (en) | 2016-10-01 |
Family
ID=50157327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101118100A TWI551822B (en) | 2012-05-21 | 2012-05-21 | Light-emitting apparatus |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI551822B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI597452B (en) * | 2016-05-25 | 2017-09-01 | 潘文莘 | Led illumination device and light-guiding cover thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0921515A4 (en) * | 1997-03-31 | 2001-09-26 | Idec Izumi Corp | Display and lighting device |
RU2468289C2 (en) * | 2006-07-28 | 2012-11-27 | Конинклейке Филипс Электроникс Н.В. | Lighting module with similar directions of heat and light propagation |
CN201221735Y (en) * | 2008-06-13 | 2009-04-15 | 李金传 | Light guiding structure |
JP5624608B2 (en) * | 2009-04-24 | 2014-11-12 | スリーエム イノベイティブプロパティズカンパニー | Light assembly |
WO2011100193A1 (en) * | 2010-02-12 | 2011-08-18 | Cree, Inc. | Lighting device with heat dissipation elements |
US9310030B2 (en) * | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
CN201751675U (en) * | 2010-04-20 | 2011-02-23 | 杭州威利广光电科技股份有限公司 | LED (light-emitting diode) bulb |
US20120012865A1 (en) * | 2010-07-19 | 2012-01-19 | Jianhua Li | Led array package with a high thermally conductive plate |
-
2012
- 2012-05-21 TW TW101118100A patent/TWI551822B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI597452B (en) * | 2016-05-25 | 2017-09-01 | 潘文莘 | Led illumination device and light-guiding cover thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI551822B (en) | 2016-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8757845B2 (en) | Wide angle based indoor lighting lamp | |
JP6928823B2 (en) | Light emitting module and lighting equipment | |
US20160054502A1 (en) | Light-emitting module | |
TW201538887A (en) | Lighting-emitting diode assembly and LED bulb using the same | |
US20120256198A1 (en) | Led package structure for increasing the light uniforming effect | |
JP2015130434A (en) | Light-emitting device, light source for illumination and luminaire | |
TWI464915B (en) | Coated diffuser cap for led illumination device | |
TWI551822B (en) | Light-emitting apparatus | |
JP2013531357A (en) | Single chamber lighting device | |
KR20110076682A (en) | The lighting device using light emission diode | |
JP2015185367A (en) | Illuminating device | |
JP2013149690A (en) | Light-emitting device and illuminating device | |
KR101185533B1 (en) | Production method of line type led lighting unit and line type led lighting unit by this production method | |
KR101304875B1 (en) | Lighting device | |
KR101082924B1 (en) | Traffic light using led lighting source | |
JP2016058650A (en) | Light emission device, light source for illumination and luminaire | |
CN103453348B (en) | Light-emitting device | |
TWM452457U (en) | Light emitting diode package structure | |
TWI521174B (en) | Light-emitting-diode lamp | |
JP2018010800A (en) | Light-emitting device and light source for illumination | |
TWI613394B (en) | Headlamp module | |
KR102127448B1 (en) | Light Emitting Device package | |
JP2017050433A (en) | Light-emitting device and luminaire | |
TW201317492A (en) | LED illumination device | |
KR101212477B1 (en) | Lens using pattern for improving yellow band and lighting apparatus having thereof |