TW201346678A - Laminating method and laminating device of substrate - Google Patents
Laminating method and laminating device of substrate Download PDFInfo
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- TW201346678A TW201346678A TW102110091A TW102110091A TW201346678A TW 201346678 A TW201346678 A TW 201346678A TW 102110091 A TW102110091 A TW 102110091A TW 102110091 A TW102110091 A TW 102110091A TW 201346678 A TW201346678 A TW 201346678A
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本發明係關於一種當將複數個基板貼合時使用之基板之貼合方法及貼合裝置。 The present invention relates to a bonding method and a bonding apparatus for a substrate used when a plurality of substrates are bonded together.
下述專利文獻1中所記載之透視形觸控式感測鍵面板之安裝構造係於觸控面板之一表面上設置透明黏著層，上述觸控面板經由上述透明黏著層而接著於液晶顯示元件上，藉此消除顯示器表面上之光反射、干擾色，從而提昇顯示器之品質(例如，參照專利文獻1)。 The mounting structure of the see-through touch sensing key panel described in the following Patent Document 1 is to provide a transparent adhesive layer on one surface of the touch panel, and the touch panel is followed by the transparent adhesive layer to the liquid crystal display element. In this way, the light reflection and the interference color on the surface of the display are eliminated, thereby improving the quality of the display (for example, refer to Patent Document 1).
[專利文獻1]日本專利特開昭61-131314號公報 [Patent Document 1] Japanese Patent Laid-Open No. 61-131314
於製造如上述先前技術之觸控式感測鍵面板時，若使用光硬化型接著劑來取代透明黏著層而使觸控面板與液晶顯示元件(安裝零件)重疊，則存在接著劑自觸控面板之外周部或液晶顯示元件之外周部溢出之情況。由於光硬化型接著劑自觸控面板之外周部或液晶顯示元件之外周部之溢出，故而產生必需使配置於觸控面板上之其他安裝零件之位置錯開之問題。 When manufacturing the touch-sensitive sensing key panel of the prior art as described above, if a photo-curable adhesive is used instead of the transparent adhesive layer to overlap the touch panel and the liquid crystal display element (mounting component), there is a self-touching adhesive. A case where the periphery of the panel or the periphery of the liquid crystal display element overflows. Since the photo-curable adhesive overflows from the outer peripheral portion of the touch panel or the outer peripheral portion of the liquid crystal display element, it is necessary to shift the position of other mounting components disposed on the touch panel.
又，於向位於觸控面板與液晶顯示元件之間的光硬化型接著劑照射光時，若經由液晶顯示元件之玻璃基板將光照射至接著劑上，則 會出現光產生散射等現象，導致到達接著劑之光之強度變小，從而接著劑難以硬化的問題。 Moreover, when light is irradiated to the photo-curable adhesive between the touch panel and the liquid crystal display element, when light is irradiated onto the adhesive via the glass substrate of the liquid crystal display element, There is a phenomenon in which light is scattered or the like, and the intensity of light reaching the adhesive becomes small, so that the adhesive is hard to be hardened.
又，存在光硬化型接著劑具有當處在含氧之空氣中時接著劑之硬化速度比較慢之特性的情形。於使用此種光硬化型接著劑之情形時，存在為了使接著劑於含氧之環境氣體中硬化而需要某程度之時間的問題。 Further, there is a case where the photocurable type adhesive has a characteristic that the curing speed of the adhesive is relatively slow when it is in an oxygen-containing air. In the case of using such a photocurable adhesive, there is a problem that a certain amount of time is required in order to harden the adhesive in an oxygen-containing ambient gas.
本發明係以應對此種問題作為課題之一例。即，本發明之目的在於：使接著劑自基板之外周部之溢出成為特定之幅度等。 The present invention is an example of a problem in response to such a problem. That is, an object of the present invention is to make the overflow of the adhesive from the outer peripheral portion of the substrate to a specific width or the like.
為了達成此種目的，本發明至少具備以下之構成。 In order to achieve such an object, the present invention has at least the following constitution.
一種基板之貼合方法，其特徵在於：其係將複數個基板貼合者，且包括如下步驟：接著劑塗佈步驟，其係於上述複數個基板中之一接合面上塗佈光硬化型接著劑；重疊步驟，其係經由上述接著劑而使上述複數個基板重疊；及接著劑硬化步驟，其係使位於上述複數個基板之間的上述接著劑硬化；且，位於上述複數個基板之間的上述接著劑係自上述接合面之中央向外周擴散；上述接著劑硬化步驟包含向上述複數個基板照射光之光照射步驟。 A method for bonding a substrate, comprising: bonding a plurality of substrates, and comprising the steps of: an adhesive coating step of applying a photo-curing type to one of the plurality of substrates; a bonding step of superposing the plurality of substrates via the adhesive; and an adhesive hardening step of hardening the adhesive between the plurality of substrates; and being located on the plurality of substrates The above-mentioned adhesive agent is diffused from the center of the bonding surface to the outer periphery, and the adhesive curing step includes a light irradiation step of irradiating the plurality of substrates with light.
一種接著劑硬化裝置，其特徵在於包括：光源；噴射機構，其噴射惰性氣體；及抽吸機構，其抽吸空氣或惰性氣體；且，供上述光源之光出射的出射口之位置係相對於上述噴射機構之噴射孔之位置或上述抽吸機構之抽吸孔之位置而位於上方或下方。 An adhesive hardening device, comprising: a light source; an injection mechanism that injects an inert gas; and a suction mechanism that sucks air or an inert gas; and the position of the exit port for the light from the light source is relative to The position of the injection hole of the injection mechanism or the position of the suction hole of the suction mechanism is located above or below.
一種貼合裝置，其特徵在於包括：接著劑硬化裝置；接著劑塗佈裝置；以及基板重疊裝置，其包含將上述複數個基板中之一上述基板保持於特定之位置的第1保持部、及將另一上述基板保持於特定之位置的第2保持部；且，上述接著劑塗佈裝置將上述接著劑塗佈於上述一基板之接合面，上述基板重疊裝置使塗佈有上述接著劑之上述一 基板與上述另一基板重疊，位於上述重疊之上述一基板與上述另一基板之間的上述接著劑自上述接合面之中央向外周擴散，上述接著劑硬化裝置向上述複數個基板照射上述光。 A bonding apparatus comprising: an adhesive curing device; an adhesive coating device; and a substrate overlapping device including a first holding portion that holds one of the plurality of substrates at a specific position, and a second holding portion that holds the other substrate at a specific position; and the adhesive application device applies the adhesive to a bonding surface of the one substrate, and the substrate overlapping device applies the adhesive One of the above The substrate overlaps with the other substrate, and the adhesive between the one of the stacked substrates and the other substrate is diffused from the center of the bonding surface to the outer periphery, and the adhesive curing device irradiates the plurality of substrates with the light.
1‧‧‧基板(一基板) 1‧‧‧substrate (one substrate)
1a‧‧‧接合面 1a‧‧‧ joint surface
2‧‧‧基板(另一基板) 2‧‧‧Substrate (another substrate)
2a‧‧‧另一基板之接合面 2a‧‧‧ joint surface of another substrate
2b‧‧‧角部 2b‧‧‧ corner
2c‧‧‧中間部 2c‧‧‧Intermediate
2A、2B‧‧‧安裝零件 2A, 2B‧‧‧Installation parts
2C‧‧‧間隙 2C‧‧‧ gap
3‧‧‧接著劑 3‧‧‧Binder
3a‧‧‧第1接著劑 3a‧‧‧1st adhesive
3b‧‧‧第2接著劑 3b‧‧‧2nd adhesive
3c‧‧‧外側側面 3c‧‧‧ outside side
3s‧‧‧間隙 3s‧‧‧ gap
10‧‧‧接著劑塗佈裝置 10‧‧‧Binder coating device
11‧‧‧離子化裝置 11‧‧‧Ionization unit
11a‧‧‧吹出口 11a‧‧‧Blowing out
12‧‧‧框部 12‧‧‧ Frame Department
13‧‧‧支撐台 13‧‧‧Support table
14‧‧‧接著劑噴出裝置 14‧‧‧Battery spray device
15‧‧‧儲存部 15‧‧‧ Storage Department
20‧‧‧基板重疊裝置 20‧‧‧Substrate overlap device
21‧‧‧第1保持部 21‧‧‧1st Maintenance Department
21a‧‧‧保持面 21a‧‧‧ Keep face
22‧‧‧第2保持部 22‧‧‧2nd Maintenance Department
23‧‧‧驅動部 23‧‧‧ Drive Department
24‧‧‧驅動部 24‧‧‧ Drive Department
25‧‧‧移動機構 25‧‧‧Mobile agencies
26‧‧‧定位機構 26‧‧‧ Positioning agency
27‧‧‧支撐部 27‧‧‧Support
28‧‧‧基座 28‧‧‧Base
30‧‧‧接著劑硬化裝置 30‧‧‧Binder hardening device
30a‧‧‧殼體 30a‧‧‧shell
30b‧‧‧側面 30b‧‧‧ side
31‧‧‧噴射孔 31‧‧‧ spray holes
31a‧‧‧配管 31a‧‧‧Pipe
31b‧‧‧流量調整閥 31b‧‧‧Flow adjustment valve
32、32a‧‧‧抽吸孔 32, 32a‧‧‧ suction holes
32b‧‧‧配管 32b‧‧‧Pipe
32c‧‧‧流量調整閥 32c‧‧‧Flow adjustment valve
33‧‧‧出射口 33‧‧‧Outlet
33a‧‧‧光纖 33a‧‧‧Fiber
40‧‧‧保持機構 40‧‧‧ Keeping institutions
A‧‧‧貼合裝置 A‧‧‧Fitting device
G‧‧‧惰性氣體 G‧‧‧Inert gas
L‧‧‧光 L‧‧‧Light
T‧‧‧搬送裝置 T‧‧‧Transporting device
U1‧‧‧第1單元 U1‧‧‧Unit 1
U1a‧‧‧搬入口 U1a‧‧‧ moving in
U2‧‧‧第2單元 U2‧‧‧Unit 2
U2a‧‧‧搬入口 U2a‧‧‧ moving in
U3‧‧‧第3單元 U3‧‧‧Unit 3
U4‧‧‧第4單元 U4‧‧‧Unit 4
U5‧‧‧第5單元 U5‧‧‧Unit 5
X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction
圖1係表示本發明之實施形態之基板之貼合方法及貼合裝置之整體構成的說明圖(俯視圖)。 Fig. 1 is an explanatory view (plan view) showing an overall structure of a bonding method of a substrate and a bonding apparatus according to an embodiment of the present invention.
圖2係表示重疊步驟之局部前視圖。 Figure 2 is a partial front elevational view showing the overlapping step.
圖3係表示接著劑塗佈步驟之說明圖，(a)係離子化時之局部前視圖，(b)係接著劑塗佈時之局部前視圖。 Fig. 3 is an explanatory view showing a step of applying an adhesive, (a) is a partial front view at the time of ionization, and (b) is a partial front view when the adhesive is applied.
圖4係表示接著劑之熟化步驟之說明圖，(a)係整體之局部放大橫切俯視圖，(b)係其前視圖。 Fig. 4 is an explanatory view showing a step of aging the adhesive, wherein (a) is a partially enlarged cross-sectional plan view of the whole, and (b) is a front view thereof.
圖5係表示接著劑硬化步驟之說明圖，(a)係惰性氣體噴射時及空氣抽吸時之局部橫切俯視圖，(b)係接著劑硬化裝置之立體圖。 Fig. 5 is an explanatory view showing a step of curing an adhesive agent, wherein (a) is a partial cross-sectional plan view at the time of inert gas injection and air suction, and (b) is a perspective view of the adhesive curing device.
圖6係表示光之強度之說明圖。 Fig. 6 is an explanatory view showing the intensity of light.
圖7係表示安裝零件之變化例之說明圖。 Fig. 7 is an explanatory view showing a modification of the mounting member.
圖8係表示本發明之實施形態之貼合裝置之具體例的說明圖。 Fig. 8 is an explanatory view showing a specific example of a bonding apparatus according to an embodiment of the present invention.
以下，一面參照圖式一面對本發明之實施形態進行說明。本發明之實施形態包括圖示之內容但並不僅限定於此。圖1係表示本發明之一實施形態之基板之貼合方法、及用於在該方法之實施中使用之貼合裝置A之說明圖，圖1表示整體之俯視圖。圖2表示重疊步驟之局部前視圖。本發明之實施形態之基板之貼合方法中，作為主要之構成包括：於相互對向之複數個基板1、2中之一接合面1a上以特定之形狀塗佈接著劑3的接著劑之塗佈步驟、及經由接著劑3使複數個基板1、2重疊的重疊步驟。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Embodiments of the present invention include the contents of the drawings, but are not limited thereto. Fig. 1 is an explanatory view showing a method of bonding a substrate according to an embodiment of the present invention and a bonding apparatus A used in the practice of the method, and Fig. 1 is a plan view showing the whole. Figure 2 shows a partial front view of the overlapping step. In the method of bonding a substrate according to the embodiment of the present invention, the main component includes an adhesive for applying the adhesive 3 in a specific shape on one of the plurality of substrates 1 and 2 facing each other. The coating step and the overlapping step of overlapping the plurality of substrates 1 and 2 via the adhesive 3 .
作為相互對向之複數個基板1、2，可使用例如：觸控面板等中 使用之包含樹脂膜等之可變形之基板、液晶面板或液晶面板模組等中使用之玻璃基板等。複數個基板1、2具有其一者大於另一者之形狀，各者之平面形狀形成為例如矩形狀。於圖1(a)所示之示例之情形時，較大之矩形狀之觸控面板作為一基板1，自其供給源(未圖示)被依序向貼合裝置A之接著劑塗佈裝置10供給，較小之矩形狀之液晶面板作為另一基板2，自其供給源(未圖示)被依序向貼合裝置A之基板重疊裝置20供給。 As the plurality of substrates 1 and 2 facing each other, for example, a touch panel or the like can be used. A deformable substrate such as a resin film, a glass substrate used in a liquid crystal panel or a liquid crystal panel module, or the like is used. The plurality of substrates 1 and 2 have a shape in which one of them is larger than the other, and the planar shape of each is formed, for example, in a rectangular shape. In the case of the example shown in FIG. 1(a), the larger rectangular touch panel is used as a substrate 1 and is sequentially coated from the supply source (not shown) to the adhesive of the bonding device A. The device 10 supplies a small rectangular liquid crystal panel as the other substrate 2, and is supplied from the supply source (not shown) to the substrate stacking device 20 of the bonding apparatus A in order.
作為接著劑3，可使用光硬化型接著劑等。該光硬化型接著劑係藉由受到例如紫外線或紅外線等光之照射而開始硬化。接著劑3於接著劑塗佈步驟中，藉由接著劑塗佈裝置10，向一基板1之接合面1a噴出，且以特定之形狀進行塗佈。 As the adhesive 3, a photocurable adhesive or the like can be used. The photocurable adhesive is cured by exposure to light such as ultraviolet rays or infrared rays. In the adhesive application step, the adhesive 3 is ejected to the bonding surface 1a of the substrate 1 by the adhesive applicator 10, and is applied in a specific shape.
[接著劑塗佈步驟]圖3係表示本發明之實施形態之基板之貼合方法中的接著劑塗佈步驟之說明圖。於該示例中，圖3(a)係於接著劑3之塗佈前將一基板1之接合面1a離子化時的局部前視圖，圖3(b)係於離子化後塗佈接著劑3時之局部前視圖。即，於接著劑塗佈步驟中，將直接或經由其他構件電性接地之接著劑3塗佈於已離子化之一基板1之接合面1a上。 [Binder Coating Step] FIG. 3 is an explanatory view showing an adhesive application step in the method of bonding a substrate according to the embodiment of the present invention. In this example, FIG. 3(a) is a partial front view of the bonding surface 1a of a substrate 1 before the application of the adhesive 3, and FIG. 3(b) is a coating of the adhesive 3 after ionization. Partial front view of the time. That is, in the adhesive application step, the adhesive 3 which is electrically or directly grounded via another member is applied onto the bonding surface 1a of one of the ionized substrates 1.
關於使一基板1之接合面1a成為經過離子化之接合面之方法(離子化步驟)，如圖3(a)所示，作為接著劑塗佈裝置10，可使用能夠吹送離子之離子化裝置11。作為離子化裝置11，可列舉例如離子化器等，其具有經正離子化或負離子化之空氣之吹出口11a。吹出口11a形成為例如長於一基板1之一邊。首先，使吹出口11a與一基板1之接合面1a(塗佈有接著劑3之接合面)對向。其次，使吹出口11a相對於一基板1相對地移動，藉此遍及一基板1之接合面1a整體，吹送經正離子化或負離子化之空氣。此時，設置包圍一基板1之外周部的框部12。該框部12將離子保留於框部A1之內側。框部12係以包圍一基板1之外周部的狀 態設置於載置一基板1之壓盤等支撐台13之上表面上，使相對於一基板1之接合面1a吹送之的正離子或負離子滯留於接合面1a上。 A method (ionization step) of forming the bonding surface 1a of one substrate 1 as an ionized bonding surface, as shown in FIG. 3(a), as the adhesive application device 10, an ionizing device capable of blowing ions can be used. 11. The ionization apparatus 11 is, for example, an ionizer or the like, and has an air outlet port 11a that is positively ionized or negatively ionized. The air outlet 11a is formed, for example, longer than one side of the substrate 1. First, the air outlet 11a is opposed to the joint surface 1a of one substrate 1 (the joint surface to which the adhesive 3 is applied). Next, the air outlet 11a is relatively moved with respect to the substrate 1, whereby the positively ionized or negatively ionized air is blown over the entire joint surface 1a of the substrate 1. At this time, the frame portion 12 surrounding the outer peripheral portion of the substrate 1 is provided. The frame portion 12 retains ions inside the frame portion A1. The frame portion 12 is surrounded by a peripheral portion of a substrate 1. The state is provided on the upper surface of the support table 13 such as the platen on which the substrate 1 is placed, and the positive ions or negative ions blown to the joint surface 1a of the substrate 1 are retained on the joint surface 1a.
又，於圖3(a)所示之示例中，離子化裝置11之吹出口11a形成為長於一基板1之一邊。又，藉由使吹出口11a向沿著固定於特定之位置上的一基板1之另一邊的方向移動，而遍及一基板1之接合面1a整體，吹送經正離子化之空氣。一基板1亦可無法移動地被固定。再者，作為其他例，雖未圖示，但可以如下方式進行變更：使一基板1之接合面1a相對於固定在特定之位置之離子化裝置11之吹出口11a移動，而使相對之位置變更；或使離子化裝置11之吹出口11a及一基板1兩者一同移動而使相對之位置變更；或自離子化裝置11之吹出口11a吹送經負離子化之空氣；或向另一基板2之接合面2a及一基板1之接合面1a吹送經過不同之離子化之空氣，而使另一基板2與一基板1之間出現電位差等。又，於圖3(a)之示例中，經過離子化之空氣被吹送至一基板1之接合面1a上，但並不限定於此。例如，可於框部3上形成孔部，自作為吹出口之該孔部向框部3之內側噴射經過離子化之空氣，藉此將一基板1之接合面1a離子化。 Further, in the example shown in FIG. 3(a), the air outlet 11a of the ionization device 11 is formed longer than one side of the substrate 1. Further, by moving the air outlet 11a in the direction along the other side of the substrate 1 fixed at a specific position, the positive ionized air is blown over the entire joint surface 1a of the substrate 1. A substrate 1 can also be fixed without being movably. Further, as another example, although not shown, the joint surface 1a of one substrate 1 may be moved relative to the air outlet 11a of the ionization device 11 fixed at a specific position, and the relative position may be changed. Changing; or moving the air outlet 11a of the ionization device 11 together with a substrate 1 to change the relative position; or blowing the negative ionized air from the air outlet 11a of the ionization device 11; or to the other substrate 2 The joint surface 1a of the joint surface 2a and the substrate 1 is blown through the different ionized air, and a potential difference or the like occurs between the other substrate 2 and the substrate 1. Further, in the example of FIG. 3(a), the ionized air is blown onto the joint surface 1a of the substrate 1, but the invention is not limited thereto. For example, a hole portion may be formed in the frame portion 3, and the ionized air may be ejected from the inside of the frame portion 3 from the hole portion as the air outlet to ionize the joint surface 1a of the substrate 1.
接著劑3之塗佈方法可如圖3(b)所示，使用例如分注器等接著劑噴出裝置14。接著劑噴出裝置14包括儲存接著劑3之儲存部15，並使儲存部15電性接地。接著劑3之塗佈形狀如圖1(a)所示，相對於一基板1之接合面1a設置成複數條線狀，於該等複數之接著劑3之間，設置有例如自一基板1之內側向外側延伸之間隙3s。又，間隙3s係自接著劑3之一端部至另一端部連續地形成於複數之接著劑3之間。複數之接著劑3之中，第1接著劑3a係沿著一基板1所具有之軸(於圖示例中為長度方向之軸)而配置，第2接著劑3b係自第1接著劑3a向一基板1之外側以放射狀配置。進而，藉由接著劑塗佈裝置10而完成接著劑3之塗佈的一基板1被依序供給至基板重疊裝置20。 As a method of applying the third agent 3, as shown in Fig. 3(b), an adhesive discharge device 14 such as a dispenser can be used. The subsequent drug ejection device 14 includes a storage portion 15 in which the adhesive 3 is stored, and the storage portion 15 is electrically grounded. As shown in FIG. 1(a), the coating shape of the adhesive 3 is provided in a plurality of lines with respect to the bonding surface 1a of the substrate 1. Between the plurality of adhesives 3, for example, a substrate 1 is provided. The inner side extends to the outside with a gap of 3 s. Further, the gap 3s is continuously formed between the plurality of adhesives 3 from one end to the other end of the adhesive 3. Among the plurality of adhesives 3, the first adhesive 3a is disposed along the axis of the substrate 1 (the axis in the longitudinal direction in the illustrated example), and the second adhesive 3b is from the first adhesive 3a. It is radially arranged on the outer side of one substrate 1. Further, one substrate 1 which completes the application of the adhesive 3 by the adhesive application device 10 is sequentially supplied to the substrate overlapping device 20.
於圖1(a)所示之示例中，將第1接著劑3a沿著一基板1之長度方向之軸而配置於中央附近，且將第2接著劑3b以複數條為單位而分別自第1接著劑3a向一基板1之外部以放射狀配置。再者，作為其他例，雖未圖示，但第1接著劑3a及第2接著劑3b之尺寸、數量及配置可根據一基板1及另一基板2之尺寸或形狀而變更。 In the example shown in FIG. 1( a ), the first adhesive 3 a is disposed in the vicinity of the center along the axis of the longitudinal direction of the substrate 1 , and the second adhesive 3 b is divided into a plurality of units. The adhesive 3a is radially disposed outside the substrate 1. Further, as another example, although not shown, the size, number, and arrangement of the first adhesive 3a and the second adhesive 3b may be changed according to the size or shape of one substrate 1 and the other substrate 2.
此種本發明之實施形態之基板之貼合方法及貼合裝置A係對受離子化之一基板1之接合面1a，塗佈電性接地之接著劑3，藉此，於接著劑3與一基板1之間產生庫倫力(成為接著劑3與一基板1相互牽引之狀態、或接著劑3與一基板1利用電位差而相互牽引之狀態)，從而不間斷地連續塗佈接著劑3。藉由連續塗佈接著劑3，可抑制於接著劑3之塗佈時氣泡混入之情況。其結果，可提昇已貼合之基板1、2之品質。 The bonding method of the substrate and the bonding apparatus A according to the embodiment of the present invention apply an adhesive 3 to the bonding surface 1a of the substrate 1 to be ionized, thereby applying the adhesive 3 to the adhesive 3 A coulombic force is generated between the substrates 1 (a state in which the adhesive 3 and the substrate 1 are pulled together, or a state in which the adhesive 3 and the substrate 1 are pulled from each other by a potential difference), and the adhesive 3 is continuously applied without interruption. By continuously applying the adhesive 3, it is possible to suppress the incorporation of air bubbles during the application of the adhesive 3. As a result, the quality of the bonded substrates 1 and 2 can be improved.
又，因設置有包圍一基板1之框部12，且當離子化步驟中向框部12之內側噴射經過離子化之空氣之情形時，藉由框部12而使離子滯留於一基板1上，故而可向一基板連續地塗佈接著劑3。從而，可進一步抑制於接著劑3之塗佈時氣泡混入之情況。其結果，可進一步提昇已貼合之基板1、2之品質。 Further, when the frame portion 12 surrounding the substrate 1 is provided and the ionized air is ejected toward the inside of the frame portion 12 in the ionization step, the ions are retained on the substrate 1 by the frame portion 12. Therefore, the adhesive 3 can be continuously applied to a substrate. Therefore, it is possible to further suppress the incorporation of air bubbles during the application of the adhesive 3. As a result, the quality of the bonded substrates 1 and 2 can be further improved.
又，因設置有覆蓋一基板1之外周部之框部12，且當向框部12之內側吹送(噴射)離子之情形時，藉由框部12而使離子滯留於一基板1上，故而可向一基板連續地塗佈接著劑3。從而，可進一步抑制於接著劑3之塗佈時氣泡混入之情況。其結果，可進一步提昇已貼合之基板1、2之品質。 Further, when the frame portion 12 covering the outer peripheral portion of the substrate 1 is provided and the ions are blown (sprayed) toward the inside of the frame portion 12, the ions are retained on the substrate 1 by the frame portion 12, so that the ions are retained on the substrate 1 by the frame portion 12, The adhesive 3 can be continuously applied to a substrate. Therefore, it is possible to further suppress the incorporation of air bubbles during the application of the adhesive 3. As a result, the quality of the bonded substrates 1 and 2 can be further improved.
進而，塗佈於一基板1之接合面1a上之接著劑3係設計成複數條線狀，於複數之接著劑3b之間，設置有自一基板1之內側向外側延伸之間隙3s。於已使一基板1與另一基板2重疊時，接著劑3a、3b擴散。因接著劑3之擴散，使得位於複數之接著劑3b之間的間隙3s被堵塞。然而，於間隙3s被堵塞之同時，空氣通過間隙3s向一基板1之外側逸 出。從而，可抑制當接著劑3重疊時氣泡混入之情況。其結果，可進一步提昇已貼合之基板1、2之品質。 Further, the adhesive 3 applied to the bonding surface 1a of the substrate 1 is designed in a plurality of lines, and a gap 3s extending from the inside to the outside of the substrate 1 is provided between the plurality of adhesives 3b. When the substrate 1 and the other substrate 2 have been overlapped, the adhesives 3a and 3b are diffused. Due to the diffusion of the adhesive 3, the gap 3s between the plurality of adhesives 3b is blocked. However, while the gap 3s is blocked, the air escapes to the outside of a substrate 1 through the gap 3s. Out. Thereby, it is possible to suppress the case where bubbles are mixed when the adhesive 3 is overlapped. As a result, the quality of the bonded substrates 1 and 2 can be further improved.
[重疊步驟]於重疊步驟中使用之基板重疊裝置20係如圖2所示，包括：第1保持部21，其將複數個基板1、2中之一基板1裝卸自由地保持於特定之位置；第2保持部22，其將另一基板2裝卸自由地保持於特定之位置；基座28；及支撐部27，其移動自由地支撐第1保持部21與第2保持部22。支撐部27沿著自一基板1向另一基板2之方向延伸。第1保持部21及第2保持部22係至少向相對地接近之方向及分離之方向移動自由地設置。此處，可為第1保持部21或第2保持部22之一者固定，而另一者能夠相對於一者移動。又，亦可為第1保持部21及第2保持部22兩者均能移動。於重疊步驟中，一基板1保持於第1保持部21上，另一基板2保持於第2保持部22上。於一基板1上，藉由接著劑塗佈步驟塗佈有接著劑3。使另一基板2之接合面2a相對於一基板1相對地接近，而與該一基板1之接合面1a重疊。於該重疊時，例如，使接合面1a、2a之整體大致平行地且於接合面整體上均勻地進行加壓。藉由該加壓，使接著劑3自一基板1之接合面1a之中央向外周部擴散。再者，於重疊時，亦可使接合面2a相對於接合面1a傾斜地重疊。又，亦可藉由將特定範圍內之加壓設定得比較大，從而使接著劑3進一步擴散而重疊。詳細而言，於一基板1之接合面1a與另一基板2之接合面2a重疊時，使第1接著劑3a及第2接著劑3b壓扁而相互接近。因第1接著劑3a及第2接著劑3b接近，使得位於間隙3s中之空氣向另一基板2之外側壓出。因將空氣壓出至外側，第1接著劑3a及第2接著劑3b相連，且向較小之另一基板2之外周部擴散，從而形成連續地形成之接著劑3之層。 [Overlap Step] The substrate stacking device 20 used in the overlapping step, as shown in FIG. 2, includes a first holding portion 21 that detachably holds one of the plurality of substrates 1 and 2 at a specific position. The second holding portion 22 detachably holds the other substrate 2 at a specific position, and the susceptor 28 and the support portion 27 movably support the first holding portion 21 and the second holding portion 22. The support portion 27 extends in a direction from one substrate 1 to the other substrate 2. The first holding portion 21 and the second holding portion 22 are movably provided at least in a direction in which they are relatively close to each other and in a direction in which they are separated. Here, one of the first holding portion 21 or the second holding portion 22 may be fixed, and the other one may move relative to one. Further, both the first holding portion 21 and the second holding portion 22 can be moved. In the overlapping step, one substrate 1 is held by the first holding portion 21, and the other substrate 2 is held by the second holding portion 22. On the substrate 1, the adhesive 3 is applied by an adhesive coating step. The bonding surface 2a of the other substrate 2 is relatively close to the substrate 1 and overlaps the bonding surface 1a of the substrate 1. At the time of this superposition, for example, the entire joint surfaces 1a and 2a are pressed substantially uniformly in parallel with the entire joint surface. By this pressurization, the adhesive 3 is diffused from the center to the outer peripheral portion of the joint surface 1a of the substrate 1. Further, when overlapping, the joint surface 2a may be obliquely overlapped with respect to the joint surface 1a. Further, by setting the pressurization in a specific range to be relatively large, the adhesive 3 can be further diffused and overlapped. Specifically, when the bonding surface 1a of one substrate 1 overlaps with the bonding surface 2a of the other substrate 2, the first adhesive 3a and the second adhesive 3b are crushed and brought close to each other. When the first adhesive 3a and the second adhesive 3b are close to each other, the air located in the gap 3s is pushed out to the outside of the other substrate 2. When the air is pushed out to the outside, the first adhesive 3a and the second adhesive 3b are connected to each other and diffused to the outer peripheral portion of the smaller substrate 2 to form a layer of the adhesive 3 which is continuously formed.
於圖2所示之示例中，第1保持部21之位置被固定。首先，藉由設置於第2保持部22上之升降用驅動部23之動作，使保持於第2保持部22上之另一基板2向保持於第1保持部21上之一基板1接近。其次，使 另一基板2之接合面2a重疊於塗佈有接著劑3之一基板1之接合面1a。接著，一面使接合面1a、2a之整體維持大致平行一面於接合面整體上均勻地進行加壓。再者，作為另一例，亦可藉由設置於第1保持部21上之升降用驅動部23之動作，使保持於第1保持部21上之一基板1向保持於第2保持部22上之另一基板2接近。 In the example shown in FIG. 2, the position of the first holding portion 21 is fixed. First, the other substrate 2 held by the second holding portion 22 is brought closer to the substrate 1 held by the first holding portion 21 by the operation of the elevation driving portion 23 provided in the second holding portion 22. Secondly, make The bonding surface 2a of the other substrate 2 is overlapped with the bonding surface 1a on which the substrate 1 of one of the adhesives 3 is applied. Next, the entire joint surfaces 1a and 2a are uniformly parallelized while maintaining the entire joint surfaces 1a and 2a. Further, as another example, the substrate 1 held by the first holding portion 21 may be held by the second holding portion 22 by the operation of the elevation driving portion 23 provided in the first holding portion 21. The other substrate 2 is close.
而且，本發明之實施形態之基板之貼合方法可包括：於重疊步驟之後，使位於複數個基板1、2之間的接著劑3硬化的接著劑硬化步驟。進而，於重疊步驟與接著劑硬化步驟之間，可包括擴大複數個基板1、2與接著劑3之接觸面積的熟化步驟。 Moreover, the bonding method of the substrate according to the embodiment of the present invention may include an adhesive hardening step of hardening the adhesive 3 between the plurality of substrates 1 and 2 after the overlapping step. Further, between the overlapping step and the adhesive hardening step, a curing step of enlarging the contact areas of the plurality of substrates 1, 2 and the adhesive 3 may be included.
[熟化步驟]圖4係表示本發明之實施形態之基板之貼合方法中的接著劑3之熟化步驟之說明圖，圖4(a)表示整體上之局部放大橫切俯視圖，圖4(b)表示其前視圖。接著劑3之熟化步驟包括使一基板1與另一基板2之相對位置移位的基板移位步驟。於該基板移位步驟中，基板1、2之相對位置之移位之方向可列舉例如：以通過一基板1或另一基板2之中央之軸為旋轉軸的特定之旋轉方向(θ方向)、或是沿著一基板1及另一基板2之一邊之直線方向(X方向或Y方向)。又，根據需要，亦可使基板1、2之相對位置在基板1、2之厚度方向上移位。再者，旋轉方向之中心並不限定於基板1、2之中央，只要為基板上，則可以任何位置作為中心。又，直線方向係包含於徑方向中。該徑方向係指例如自基板上之第1位置呈直線地或曲線地朝向與第1位置不同之第2位置的方向。因此，於旋轉方向中，包括以基板1、2之中央以外之其他位置作為旋轉軸的特定之旋轉方向。徑方向除了直線方向以外，還包括相對於一邊交叉之方向。於基板重疊裝置20中，第1保持部21及第2保持部22係以相對於上述旋轉方向或直線方向等方向相對地移動自由之方式設置。又，亦可為第1保持部及第2保持部之一者之位置被固定，而另一者係移動自由地設置。可使保持於第1保持部21上之一基 板1與保持於第2保持部22上之另一基板2中之一者或兩者向θ方向旋轉移動、或向X方向或Y方向等方向移動。進而，可一面保持熟化後之接著劑3之狀態，一面使熟化步驟之後之一基板1與另一基板2之相對位置恢復至熟化步驟之前之相對位置(恢復步驟)。又，基板重疊裝置20包括使該基板1、2之相對位置移位之驅動部24。 [Curing Step] FIG. 4 is an explanatory view showing a step of curing the adhesive 3 in the bonding method of the substrate according to the embodiment of the present invention, and FIG. 4(a) is a partially enlarged cross-sectional plan view of the whole, and FIG. 4(b) ) indicates its front view. The aging step of the subsequent agent 3 includes a substrate shifting step of displacing the relative positions of one substrate 1 and the other substrate 2. In the substrate shifting step, the direction in which the relative positions of the substrates 1 and 2 are displaced may be, for example, a specific rotation direction (θ direction) in which the axis passing through the center of one substrate 1 or the other substrate 2 is the rotation axis. Or along a linear direction (X direction or Y direction) of one of the substrate 1 and the other substrate 2. Further, the relative positions of the substrates 1 and 2 may be displaced in the thickness direction of the substrates 1 and 2 as needed. Further, the center of the rotation direction is not limited to the center of the substrates 1 and 2, and any position may be the center as long as it is on the substrate. Further, the linear direction is included in the radial direction. The radial direction is, for example, a direction that is linearly or curved from a first position on the substrate toward a second position that is different from the first position. Therefore, in the rotation direction, a specific rotation direction including the position other than the center of the substrates 1 and 2 is included as the rotation axis. The radial direction includes a direction intersecting with respect to one side in addition to the linear direction. In the substrate stacking device 20, the first holding portion 21 and the second holding portion 22 are provided to be relatively movable in a direction such as the rotation direction or the linear direction. Further, the position of one of the first holding portion and the second holding portion may be fixed, and the other may be moved freely. One of the first holding portions 21 can be held One or both of the plate 1 and the other substrate 2 held by the second holding portion 22 are rotationally moved in the θ direction or in the X direction or the Y direction. Further, while maintaining the state of the adhesive 3 after aging, the relative position of one of the substrates 1 and the other substrate 2 after the aging step can be restored to the relative position before the aging step (recovery step). Further, the substrate overlapping device 20 includes a driving portion 24 that shifts the relative positions of the substrates 1 and 2.
於圖4(a)所示之示例中，第2保持部22之位置被固定，藉由設置於第1保持部21上之例如導軌或XY平台等移動機構25與水平移動用之驅動部24之動作，使保持一基板1之第1保持部21相對於另一基板2向θ方向旋轉或者向X方向或Y方向呈直線地移動。再者，作為另一例，如圖4(b)所示，亦可於第2保持部22上設置移動機構25與水平移動用之驅動部24，藉由其等之動作，使保持於第2保持部22上之另一基板2相對於保持在第1保持部21上之一基板1向θ方向旋轉，或者向X方向或Y方向呈直線地移動；或是於第1保持部21及第2保持部22兩者上分別設置水平移動用之驅動部，藉由其等之動作，使第1保持部21與第2保持部22相互向θ方向旋轉移動，或者向X方向或Y方向呈直線地移動。 In the example shown in FIG. 4( a ), the position of the second holding portion 22 is fixed, and the moving mechanism 25 such as a guide rail or an XY stage and the driving unit 24 for horizontal movement are provided on the first holding portion 21 . In the operation, the first holding portion 21 holding the one substrate 1 is rotated in the θ direction with respect to the other substrate 2 or linearly moved in the X direction or the Y direction. Further, as another example, as shown in FIG. 4(b), the moving mechanism 25 and the driving unit 24 for horizontal movement may be provided in the second holding portion 22, and the second holding portion 22 may be held in the second portion by the operation of the second holding portion 22. The other substrate 2 on the holding portion 22 is rotated in the θ direction with respect to one of the substrates 1 held by the first holding portion 21, or linearly moved in the X direction or the Y direction, or in the first holding portion 21 and (2) The driving unit for horizontal movement is provided in each of the holding portions 22, and the first holding portion 21 and the second holding portion 22 are rotationally moved in the θ direction or in the X direction or the Y direction by the operation thereof. Move in a straight line.
又，接著劑3之熟化步驟可包括於基板移位步驟之後進行之放置步驟，該放置步驟係以上下移動自由地支撐複數個基板1、2之中配置於上方之另一基板2。放置步驟將已重疊之基板1、2跨及特定之期間之間而保持於上下(Z)方向及相對於上下方向交叉之XYθ方向上的特定之位置。作為該特定之期間，可列舉例如：上述接著劑3形成穩定之狀態(例如，接著劑3之形狀穩定之狀態)之前的時間段等。為了進行放置步驟，基板重疊裝置20包括：定位機構26，其將已重疊之基板1、2定位於XYθ方向上的特定之位置；及控制部，其解除第2保持部22對另一基板2之保持。該控制部例如於經過放置步驟之後，使另一基板2脫離第2保持部22，而鬆開另一基板2。又，於放置步驟中，亦 可於第1保持部21保持一基板1且第2保持部22保持另一基板2之狀態下，持續藉由第1保持部21或第2保持部22之自重對接著劑3進行加壓。又，於放置步驟中，亦可將第2保持部自另一基板2解除，持續藉由一基板1或另一基板2之自重對接著劑3進行加壓。 Further, the aging step of the adhesive 3 may include a placing step performed after the substrate shifting step of movably supporting the other substrate 2 disposed above the plurality of substrates 1 and 2. The placing step holds the overlapped substrates 1 and 2 between the upper and lower (Z) directions and the specific positions in the XYθ direction intersecting with the vertical direction. The specific period of time is, for example, a period before the formation of the adhesive 3 in a stable state (for example, a state in which the shape of the adhesive 3 is stable). In order to perform the placing step, the substrate overlapping device 20 includes a positioning mechanism 26 that positions the overlapped substrates 1 and 2 at a specific position in the XYθ direction, and a control unit that releases the second holding portion 22 to the other substrate 2 Keep it. The control unit, for example, removes the other substrate 2 from the second holding portion 22 after the placing step, and releases the other substrate 2. Also, in the placing step, In the state where the first holding portion 21 holds one substrate 1 and the second holding portion 22 holds the other substrate 2, the adhesive 3 is continuously pressurized by the weight of the first holding portion 21 or the second holding portion 22. Further, in the placing step, the second holding portion may be released from the other substrate 2, and the adhesive 3 may be pressurized by the weight of one substrate 1 or the other substrate 2.
於圖4(a)、(b)所示之示例中，作為定位機構26，表示有與另一基板2之各邊對應之、可進行位置之調整的定位導引器。該定位導引器可與第2保持部22一體地或分開地設置。又，第2保持部22可沿著定位導引器之內表面而向上下(Z)方向移動地支撐另一基板2。再者，作為另一例，雖未圖示，但作為定位機構26，可使定位導引器與第2保持部22一體地設置。又，作為定位機構26，亦可利用CCD(Charge Coupled Device，電荷耦合元件)相機來辨認形成於另一基板2上之對準標記而進行定位。 In the example shown in FIGS. 4(a) and 4(b), as the positioning mechanism 26, a positioning guide that can adjust the position corresponding to each side of the other substrate 2 is shown. The positioning guide can be provided integrally or separately from the second holding portion 22. Further, the second holding portion 22 can support the other substrate 2 so as to be movable in the up-down (Z) direction along the inner surface of the positioning guide. Further, as another example, although not shown, the positioning guide 26 may be provided integrally with the second holding portion 22 as the positioning mechanism 26. Further, as the positioning mechanism 26, an alignment mark formed on the other substrate 2 can be recognized by a CCD (Charge Coupled Device) camera and positioned.
此種本發明之實施形態之基板之貼合方法及貼合裝置A可於經由接著劑3使複數個基板1、2重疊之後，使一基板1與另一基板2相對地旋轉或直線地移動，藉此使重疊後之接著劑3之厚度均一化、且使接著劑3之擴散程度擴大。從而，於已貼合之基板1、2之接合面內，可消除接著劑3之厚度產生梯度之情況(厚度不均)。又，可控制接著劑3之膜厚而謀求基板1、2之間的間隙之均一化。 In the bonding method of the substrate and the bonding apparatus A according to the embodiment of the present invention, after the plurality of substrates 1 and 2 are stacked via the adhesive 3, one substrate 1 and the other substrate 2 are relatively rotated or linearly moved. Thereby, the thickness of the adhesive 3 after the overlap is made uniform, and the degree of diffusion of the adhesive 3 is enlarged. Therefore, in the joint surface of the bonded substrates 1 and 2, the gradient of the thickness of the adhesive 3 (thickness unevenness) can be eliminated. Moreover, the film thickness of the adhesive 3 can be controlled, and the gap between the substrates 1 and 2 can be made uniform.
尤其是於熟化步驟中，存在欲藉由恢復步驟而使接著劑3在其表面張力或內部應力的作用下恢復成熟化步驟前的形狀之情形。然而，恢復步驟後之接著劑3之擴散面積相對於熟化步驟前之接著劑3之擴散面積變大。因此，可使接著劑3之厚度簡單地均一化。其結果，可消除已貼合之基板1、2之厚度不均。又，可控制接著劑3之膜厚而謀求基板1、2之間的間隙之均一化。 Particularly in the ripening step, there is a case where the adhesive 3 is to be restored to the shape before the ripening step by the surface tension or internal stress by the recovery step. However, the diffusion area of the adhesive 3 after the recovery step becomes larger than the diffusion area of the adhesive 3 before the ripening step. Therefore, the thickness of the adhesive 3 can be simply uniformized. As a result, the thickness unevenness of the bonded substrates 1 and 2 can be eliminated. Moreover, the film thickness of the adhesive 3 can be controlled, and the gap between the substrates 1 and 2 can be made uniform.
[接著劑硬化步驟]圖5係表示本發明之實施形態的基板之貼合方法中之接著劑硬化步驟之說明圖，圖5(a)係惰性氣體噴射時及空氣抽 吸時之局部之橫切俯視圖，圖5(b)係接著劑硬化裝置30之立體圖。接著劑硬化步驟包括加壓步驟，該加壓步驟係經由一基板1或另一基板2而使接著劑3擴大至一基板1之外周部或另一基板2之外周部。又，接著劑硬化步驟包括光照射步驟，該光照射步驟係向位於複數個基板1、2之間的接著劑3之外側側面3c照射紫外線等光L。光L之出射方向係配置在相對於與另一基板2相向之一基板1之接合面1a傾斜的方向。即，光L之出射方向係相對於與第2保持部22相向且保持一基板1的第1保持部21之保持面21a傾斜的方向。進而，接著劑硬化步驟包括向接著劑3之外側側面3c噴射惰性氣體G的氣體噴射步驟、及抽吸接著劑3之外側之空氣的空氣抽吸步驟。 [Binder curing step] FIG. 5 is an explanatory view showing an adhesive curing step in the bonding method of the substrate according to the embodiment of the present invention, and FIG. 5(a) shows an inert gas injection and air pumping. A partial cross-sectional view of the suction time, and FIG. 5(b) is a perspective view of the adhesive curing device 30. The subsequent hardening step includes a pressurizing step of expanding the adhesive 3 to the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2 via a substrate 1 or another substrate 2. Further, the adhesive curing step includes a light irradiation step of irradiating light L such as ultraviolet rays to the outer side surface 3c of the adhesive 3 located between the plurality of substrates 1 and 2. The direction in which the light L is emitted is arranged in a direction inclined with respect to the joint surface 1a of the substrate 1 facing the other substrate 2. In other words, the direction in which the light L is emitted is a direction in which the holding surface 21a of the first holding portion 21 of the substrate 1 is inclined with respect to the second holding portion 22 and held. Further, the adhesive hardening step includes a gas injection step of injecting the inert gas G to the outer side surface 3c of the adhesive 3, and an air suction step of sucking the air outside the adhesive 3.
於接著劑硬化步驟中之加壓步驟中，可使用與上述重疊步驟中使用之基板重疊裝置20相同或不同的裝置。以下，使用上述圖2來記載將基板重疊裝置20用於加壓步驟中之情形。基板加壓裝置與基板重疊裝置20同樣地包括：第1保持部21，其將複數個基板1、2之中一基板1裝卸自由地保持於特定之位置；及第2保持部22，其將另一基板2裝卸自由地保持於特定之位置。第1保持部21及第2保持部22係至少向相對接近之方向及分離之方向移動自由地設置。此處，可為第1保持部21或第2保持部22中之一者被固定，而另一者能夠相對於一者移動。又，亦可為第1保持部21及第2保持部22兩者均能移動。於加壓步驟中，一基板1保持於第1保持部21上，另一基板2保持於第2保持部22上。使一基板1之接合面1a與另一基板2之接合面2a相對地接近，對接著劑3進行加壓而使其擴大至一基板1或另一基板2之外周部。於該加壓步驟中，例如，使接合面1a、2a之整體大致平行且於接合面整體上均勻地進行加壓。藉由該加壓，接著劑3向外周部進一步擴散。此時，接著劑3到達一基板1之外周部或另一基板2之外周部。 In the pressurizing step in the adhesive hardening step, the same or different device as the substrate overlapping device 20 used in the above overlapping step can be used. Hereinafter, the case where the substrate overlapping device 20 is used in the pressurizing step will be described using FIG. 2 described above. Similarly to the substrate stacking device 20, the substrate pressurizing device includes a first holding portion 21 that detachably holds one of the plurality of substrates 1 and 2 at a specific position, and a second holding portion 22 that will The other substrate 2 is detachably held at a specific position. The first holding portion 21 and the second holding portion 22 are provided to be movable at least in a direction in which they are relatively close to each other and in a direction in which they are separated. Here, one of the first holding portion 21 or the second holding portion 22 may be fixed, and the other one may move relative to one. Further, both the first holding portion 21 and the second holding portion 22 can be moved. In the pressurizing step, one substrate 1 is held by the first holding portion 21, and the other substrate 2 is held by the second holding portion 22. The bonding surface 1a of one substrate 1 is brought into close contact with the bonding surface 2a of the other substrate 2, and the adhesive 3 is pressurized to be expanded to the outer peripheral portion of one substrate 1 or the other substrate 2. In this pressurizing step, for example, the entire joint surfaces 1a and 2a are substantially parallel and uniformly pressurized on the entire joint surface. By this pressurization, the adhesive 3 is further diffused to the outer peripheral portion. At this time, the adhesive 3 reaches the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2.
接著劑硬化步驟中使用之貼合裝置A之接著劑硬化裝置30包括惰 性氣體G之噴射機構及抽吸機構。惰性氣體G係自噴射機構中之複數個噴射孔31向另一基板2之外周部噴射。接著劑3之外側之空氣係自抽吸機構中之抽吸孔32被抽吸。複數個噴射孔31與複數個抽吸孔32係沿著另一基板2之外周部並排地配置。噴射孔31亦可配置於複數個抽吸孔32之間。詳細而言，複數個噴射孔31係以與另一基板2所具有之2個角部2b間之中間部2c對向之方式比較多地配置。複數個抽吸孔32相對於另一基板2所具有之2個角部2b間之中央部，比較多地配置於角部2b側。進而，抽吸機構較佳為將抽吸孔32a配置於與另一基板2之角部2b附近對向之位置。 The adhesive hardening device 30 of the bonding device A used in the subsequent hardening step includes inertia The injection mechanism and suction mechanism of the gas G. The inert gas G is ejected from the plurality of injection holes 31 in the ejection mechanism to the outer peripheral portion of the other substrate 2. The air on the outside of the subsequent agent 3 is sucked from the suction hole 32 in the suction mechanism. The plurality of injection holes 31 and the plurality of suction holes 32 are arranged side by side along the outer peripheral portion of the other substrate 2. The injection hole 31 may also be disposed between the plurality of suction holes 32. Specifically, the plurality of injection holes 31 are arranged in a relatively large manner so as to face the intermediate portion 2c between the two corner portions 2b of the other substrate 2. The plurality of suction holes 32 are disposed on the side of the corner portion 2b in a relatively large portion with respect to the central portion between the two corner portions 2b of the other substrate 2. Further, it is preferable that the suction mechanism 32 has the suction hole 32a disposed at a position facing the vicinity of the corner portion 2b of the other substrate 2.
噴射孔31係由與噴射機構連接之配管31a所構成。其構成為：於作為複數個噴射孔31之上游側之配管31a之中途，分別連接有流量調整閥31b，利用控制器(未圖示)對流量調整閥31b進行動作控制，藉此可個別地調整惰性氣體G之噴射量。抽吸孔32、32a係由與抽吸機構連接之配管32b所構成。其構成為：於作為複數個抽吸孔32、32a之上游側之配管32b之中途，分別連接有流量調整閥32c，利用控制器(未圖示)對流量調整閥32c進行動作控制，藉此可個別地調整惰性氣體G之噴射量與抽吸孔32、32a之抽吸量。 The injection hole 31 is constituted by a pipe 31a connected to the injection mechanism. The flow rate adjustment valve 31b is connected to each of the pipes 31a on the upstream side of the plurality of injection holes 31, and the flow rate adjustment valve 31b is operated and controlled by a controller (not shown). The amount of injection of the inert gas G is adjusted. The suction holes 32, 32a are constituted by a pipe 32b connected to the suction mechanism. The flow rate adjustment valve 32c is connected to each of the pipes 32b on the upstream side of the plurality of suction holes 32 and 32a, and the flow rate adjustment valve 32c is controlled by a controller (not shown). The amount of injection of the inert gas G and the amount of suction of the suction holes 32, 32a can be individually adjusted.
進而，接著劑硬化裝置30包括殼體30a、及自殼體30a之內部向外部出射光源(未圖示)之光L之出射口33，於光照射步驟中，光L自出射口33照射至到達一基板1之外周部或另一基板2之外周部的接著劑3之外側側面3c。照射有光L之接著劑3自外側側面3c起內側之一部分區域硬化而形成暫時硬化狀態，從而接著劑3變得難以流動。光L可為擴散光也可為使用透鏡等聚集之光。照射光L之時機可任意地設定為接著劑3到達另一基板2之外周部之前、或已到達時等。又，基板(一基板1或另一基板2)與光L之出射方向所成之角度可任意地決定。 Further, the adhesive agent curing device 30 includes a casing 30a and an exit port 33 for emitting light L of a light source (not shown) from the inside of the casing 30a. In the light irradiation step, the light L is irradiated from the exit port 33 to The outer side surface 3c of the adhesive 3 reaches the outer peripheral portion of one substrate 1 or the outer peripheral portion of the other substrate 2. The adhesive agent 3 irradiated with the light L hardens from a portion on the inner side from the outer side surface 3c to form a temporarily hardened state, so that the adhesive 3 becomes difficult to flow. The light L may be diffused light or light collected using a lens or the like. The timing at which the light L is irradiated can be arbitrarily set to be before or after the adhesive 3 reaches the outer peripheral portion of the other substrate 2. Further, the angle formed by the substrate (one substrate 1 or the other substrate 2) and the direction in which the light L is emitted can be arbitrarily determined.
當接著劑3到達另一基板2之外周部之時間於另一基板2之外周部 之各位置上實質上相同之情形時，角度設定為0°或90°，且於接著劑3到達另一基板2之外周部之時間點照射光L，藉此，接著劑3變得更加難以流動。當接著劑3到達另一基板2之外周部之時間於另一基板2之外周部之各位置上不同之情形時，亦可於接著劑3到達另一基板2之外周部之前照射光L。於該情形時，在接著劑3到達另一基板2之外周部之時間點，光L照射至接著劑3上，故而接著劑3變得更加難以流動。再者，於將角度設定為0°，且於接著劑3到達另一基板2之外周部之時間點照射光L之情形時，未到達另一基板2之外周部之接著劑3受到光L之照射，故而存在該接著劑3無法到達另一基板2之外周部之情形。又，於將角度設定為90°之情形時，在周方向上之、另一基板2之外周部之各位置上，接著劑3或較快地到達、或較慢地到達另一基板2之外周部，故而存在難以謀求照射光L之時機之情形。又，於接著劑3之厚度比較大之情形時，就光L之強度而言，一基板1側之接著劑3上之光L之強度相對於另一基板2側之接著劑上之光L之強度而言比較小，從而存在無法使接著劑之流動性充分下降之情形。 When the adhesive 3 reaches the outer periphery of the other substrate 2 at the outer periphery of the other substrate 2 When the positions are substantially the same, the angle is set to 0° or 90°, and the light L is irradiated at the time point when the adhesive 3 reaches the outer periphery of the other substrate 2, whereby the adhesive 3 becomes more difficult. flow. When the time when the adhesive 3 reaches the outer peripheral portion of the other substrate 2 is different at each position of the outer peripheral portion of the other substrate 2, the light L may be irradiated before the adhesive 3 reaches the outer peripheral portion of the other substrate 2. In this case, when the adhesive 3 reaches the outer peripheral portion of the other substrate 2, the light L is irradiated onto the adhesive 3, so that the adhesive 3 becomes more difficult to flow. Further, when the angle L is set to 0° and the light L is irradiated at the time point when the adhesive 3 reaches the outer peripheral portion of the other substrate 2, the adhesive 3 that has not reached the outer peripheral portion of the other substrate 2 receives the light L. Since the irradiation 3 does not reach the outer peripheral portion of the other substrate 2, there is a case where the adhesive 3 cannot reach the outer peripheral portion of the other substrate 2. Further, when the angle is set to 90°, the adhesive 3 arrives at a faster position or a slower reach of the other substrate 2 at each position of the outer peripheral portion of the other substrate 2 in the circumferential direction. In the outer peripheral portion, there is a case where it is difficult to obtain the timing of the irradiation of the light L. Further, in the case where the thickness of the adhesive 3 is relatively large, the intensity of the light L on the substrate 1 side is higher than the light L on the adhesive on the other substrate 2 side in terms of the intensity of the light L. The strength is relatively small, and there is a case where the fluidity of the adhesive cannot be sufficiently lowered.
於圖6中，表示有在周方向上接著劑3於另一者之外周部之各位置上不同之情形時的、光L之照射角度與光L之強度的關係。光L為擴散光。如圖6所示，光L於自接著劑3之外側側面3c朝向內側特定之距離X的區域內，具有特定之強度。於將光L之照射角度設定為約30°至約40°(銳角)之情形時，距離X成為例如約1 mm。藉由設定成該角度，可使接著劑3之內側的光L之強度比較大，從而接著劑3變得更加難以流動。又，可使接著劑3於另一基板2之外周部附近形成暫時硬化狀態。再者，光L之照射角度可根據接著劑3之厚度而適當變更。殼體30a之出射口33係在接著劑3之厚度方向上不同於噴射機構之噴射孔31之位置或抽吸機構之抽吸孔32之位置，且配置於其等之上方或下方。詳細而言，接著劑3之厚度方向上之噴射孔31之位置、抽吸孔32之位 置係相對於出射口33而配置於一基板1側。噴射孔31之位置及抽吸孔32之位置係位於出射口33之位置與一基板1之位置之間。殼體30a包括具有噴射孔31、抽吸孔32及出射口33之側面30b。該殼體30a之側面30b由短軸及長軸形成為特定之形狀。又，於側面30b之長軸方向上，比較多的噴射孔31配置於側面30b之中央部側，相對於噴射孔31，比較多的抽吸孔32配置於側面30b之端部側。出射口33係由與光源連接之光纖33a所構成。 Fig. 6 shows the relationship between the irradiation angle of the light L and the intensity of the light L when the adhesive 3 is different in each of the outer peripheral portions of the other in the circumferential direction. Light L is diffused light. As shown in FIG. 6, the light L has a specific strength in a region from the outer side surface 3c of the adhesive 3 toward the inner side by a specific distance X. In the case where the irradiation angle of the light L is set to about 30 to about 40 (an acute angle), the distance X becomes, for example, about 1 mm. By setting this angle, the intensity of the light L inside the adhesive 3 can be made relatively large, and the adhesive 3 becomes more difficult to flow. Further, the adhesive 3 can be formed in a temporarily hardened state in the vicinity of the outer peripheral portion of the other substrate 2. Further, the irradiation angle of the light L can be appropriately changed depending on the thickness of the adhesive 3. The exit port 33 of the casing 30a is different from the position of the injection hole 31 of the injection mechanism or the suction hole 32 of the suction mechanism in the thickness direction of the adhesive 3, and is disposed above or below it. In detail, the position of the injection hole 31 in the thickness direction of the adhesive 3 and the position of the suction hole 32 The arrangement is disposed on one substrate 1 side with respect to the exit port 33. The position of the injection hole 31 and the position of the suction hole 32 are located between the position of the ejection opening 33 and the position of a substrate 1. The housing 30a includes a side surface 30b having an injection hole 31, a suction hole 32, and an exit port 33. The side surface 30b of the casing 30a is formed into a specific shape by a short axis and a long axis. Further, in the longitudinal direction of the side surface 30b, a relatively large number of injection holes 31 are disposed on the central portion side of the side surface 30b, and a relatively large number of suction holes 32 are disposed on the end side of the side surface 30b with respect to the injection hole 31. The exit port 33 is constituted by an optical fiber 33a connected to a light source.
於圖5(b)所示之示例中，出射口33沿著複數個噴射孔31或複數個抽吸孔32之排列方向而延伸。文，複數個噴射孔31或複數個抽吸孔32排列之方向係相對於自出射口33朝向噴射孔31或抽吸孔32之方向交叉的方向。再者，作為另一例，雖未圖示，但亦可將複數個出射口33沿著複數個噴射孔31或複數個抽吸孔32排列之方向並排地配置。 In the example shown in FIG. 5(b), the exit opening 33 extends along the direction in which the plurality of injection holes 31 or the plurality of suction holes 32 are arranged. The direction in which the plurality of injection holes 31 or the plurality of suction holes 32 are arranged is in a direction intersecting the direction from the ejection opening 33 toward the injection hole 31 or the suction hole 32. Further, as another example, although not shown, a plurality of the ejection openings 33 may be arranged side by side in the direction in which the plurality of ejection holes 31 or the plurality of suction holes 32 are arranged.
此種本發明之實施形態的基板之貼合方法及貼合裝置A係藉由重疊步驟而使位於複數個基板1、2之間的光硬化型接著劑3自複數個基板1、2中之一者的接合面1a之中央向外周擴散，於接著劑硬化步驟中經由一基板1或另一基板2對接著劑3進行加壓，從而使接著劑3到達一基板1之外周部或另一基板2之外周部。藉由光照射步驟，向該接著劑3之外側側面3c照射光L，藉此可儘量減少自基板1之外周部或基板2之外周部溢出的接著劑3之溢出量。從而，可使接著劑3自基板1之外周部或基板2之外周部之溢出成為特定之幅度。其結果，接著劑自觸控面板或液晶顯示元件等之外周部之溢出得以抑制，故而可抑制配置於觸控面板上之液晶顯示元件以外之其他安裝零件之位置偏離等問題的產生。 In the bonding method of the substrate and the bonding apparatus A according to the embodiment of the present invention, the photo-curable adhesive 3 located between the plurality of substrates 1 and 2 is formed from the plurality of substrates 1 and 2 by the overlapping step. The center of one of the joint faces 1a is diffused to the outer periphery, and the adhesive 3 is pressurized via a substrate 1 or another substrate 2 in the adhesive hardening step, so that the adhesive 3 reaches the outer periphery of one substrate 1 or another The outer periphery of the substrate 2. By irradiating the light L to the outer side surface 3c of the adhesive 3 by the light irradiation step, the amount of overflow of the adhesive 3 overflowing from the outer peripheral portion of the substrate 1 or the outer peripheral portion of the substrate 2 can be minimized. Therefore, the overflow of the adhesive 3 from the outer peripheral portion of the substrate 1 or the outer peripheral portion of the substrate 2 can be made to have a specific width. As a result, the overflow of the adhesive from the outer peripheral portion of the touch panel or the liquid crystal display element can be suppressed, so that the problem of the positional deviation of other mounting components other than the liquid crystal display element disposed on the touch panel can be suppressed.
圖7係表示安裝零件之變化例之說明圖。存在使作為安裝零件2A之液晶顯示元件與液晶顯示元件以外之其他安裝零件2B鄰接地配置之情形。於鄰接之安裝零件2A與其他安裝零件2B之間，設置有相對 於安裝零件2A之大小、或其他安裝零件2B之大小而言較小的間隙2C。該間隙2C亦可根據需要而設置。於接著劑自基板2或安裝零件之基板1溢出之情形時，在使其他安裝零件2B相對於安裝零件2A鄰接地配置時，必需使其他安裝零件2B沿著基板2之面移動溢出之接著劑之量。但是，存在使其他安裝零件之配線對準形成於基板2上之配線而接觸之情形。若使其他安裝零件移動接著劑之溢出量，則存在該電性接觸變得困難之情形。又，存在如下情形：於在基板2上之面內配置安裝零件2A、其他安裝零件2B時，因使其他安裝零件2B移動接著劑之溢出量，會使其他安裝零件2B自基板2露出。然而，藉由抑制如上所述之接著劑之溢出，可進行例如電性接觸，又，接著劑自安裝零件之溢出得到抑制。於安裝零件2A具有配線之情形時，亦可與其他安裝零件2B同樣地進行電性接觸。 Fig. 7 is an explanatory view showing a modification of the mounting member. There is a case where the liquid crystal display element as the mounting component 2A is disposed adjacent to the mounting component 2B other than the liquid crystal display element. Between the adjacent mounting part 2A and the other mounting part 2B, there is a relative The gap 2C is small in size of the mounting part 2A or the size of the other mounting part 2B. This gap 2C can also be set as needed. When the adhesive agent overflows from the substrate 2 or the substrate 1 on which the component is mounted, when the other mounting component 2B is disposed adjacent to the mounting component 2A, it is necessary to move the other mounting component 2B along the surface of the substrate 2 to overflow the adhesive. The amount. However, there is a case where the wiring of other mounting parts is brought into contact with the wiring formed on the substrate 2. If the amount of overflow of the adhesive is moved by other mounting parts, there is a case where the electrical contact becomes difficult. In addition, when the mounting component 2A and the other mounting component 2B are placed in the surface of the substrate 2, the other mounting component 2B is exposed from the substrate 2 by moving the adhesive amount of the other mounting component 2B. However, by suppressing the overflow of the adhesive as described above, for example, electrical contact can be performed, and the overflow of the adhesive from the mounted component can be suppressed. When the mounting part 2A has wiring, it can also make electrical contact similarly to other mounting parts 2B.
又，於上述例中，接著劑可使用將基板2上之配線與安裝零件2A、B所具有之配線電性連接之具有導電性的接著劑。例如，藉由抑制具有導電性之接著劑自安裝零件2A、2B之溢出，可抑制自具有配線之安裝零件2A溢出之具有導電性之接著劑與其他安裝零件2B之配線電性連接之情況。 Further, in the above example, the adhesive may be an electrically conductive adhesive that electrically connects the wiring on the substrate 2 to the wiring of the mounting components 2A and B. For example, by suppressing the overflow of the conductive adhesive from the mounting parts 2A and 2B, it is possible to suppress the electrical connection between the conductive adhesive overflowing from the wiring-attached mounting member 2A and the wiring of the other mounting component 2B.
尤其是於光L之出射方向係相對於與具有較大之形狀之另一基板2相向、且具有較小之形狀的一基板1之接合面1a傾斜的方向之情形時，可不使光L透過另一基板2而照射至接著劑3上從而使接著劑3暫時硬化。其結果，可將不通過會導致光L之散射等產生之玻璃基板而到達接著劑3的光L之強度維持得比較大，而使接著劑3硬化。 In particular, when the outgoing direction of the light L is in a direction inclined with respect to the joint surface 1a of the substrate 1 which is opposed to the other substrate 2 having a large shape and has a small shape, the light L may not be transmitted. The other substrate 2 is irradiated onto the adhesive 3 to temporarily cure the adhesive 3. As a result, the strength of the light L that reaches the adhesive 3 without passing through the glass substrate which causes scattering of the light L or the like can be maintained relatively large, and the adhesive 3 can be cured.
進而，於接著劑硬化步驟包括抽吸接著劑3之外側之空氣的空氣抽吸步驟之情形時，藉由位於接著劑3之外側的空氣之抽吸，使接著劑3之外側之環境氣體自空氣置換成惰性氣體G。因此，可更積極地促進接著劑3之外側側面3c之硬化。 Further, in the case where the adhesive hardening step includes the air suction step of sucking the air on the outer side of the adhesive 3, the ambient gas on the outer side of the adhesive 3 is self-primed by the suction of the air on the outer side of the adhesive 3. The air is replaced by an inert gas G. Therefore, the hardening of the outer side surface 3c of the adhesive 3 can be more actively promoted.
另外，塗佈於接合面1a之中央附近的接著劑3會隨著基板1、2之重疊而自基板1、2之中央向外周擴散。然而，即便精心設計接著劑3之塗佈形狀或黏度等，亦存在如下傾向：自基板1、2之中央向外周擴散的接著劑3之外側側面3c分別較快地到達於基板1、2之外周部相對向之邊之中央部，但於到達基板1、2之角部2b附近為止則需要比較長之時間。因此，存在例如於基板1、2之接合面內之中央部附近、基板1、2之1邊之中央部附近的接著劑3之厚度比較大，而於基板1、2之角部2b附近的接著劑3之厚度比較小之情形。於該情形時，於基板1、2之間接著劑3之厚度存在差異，故而存在會於整體上產生塗佈不均之問題。 Further, the adhesive 3 applied in the vicinity of the center of the joint surface 1a spreads from the center of the substrates 1 and 2 to the outer periphery as the substrates 1 and 2 overlap. However, even if the coating shape or viscosity of the adhesive 3 is carefully designed, there is a tendency that the outer side surface 3c of the adhesive 3 diffused from the center of the substrates 1 and 2 to the outer periphery reaches the substrates 1 and 2 relatively quickly. The outer peripheral portion faces the center portion of the side, but it takes a relatively long time until it reaches the vicinity of the corner portion 2b of the substrates 1 and 2. Therefore, for example, the thickness of the adhesive 3 in the vicinity of the central portion in the joint surface of the substrates 1 and 2 and the vicinity of the central portion of one of the substrates 1 and 2 is relatively large, and is near the corner portion 2b of the substrates 1 and 2. The thickness of the subsequent agent 3 is relatively small. In this case, there is a difference in the thickness of the adhesive 3 between the substrates 1 and 2, so that there is a problem that uneven coating occurs as a whole.
因此，於接著劑硬化步驟中，接著劑3係藉由接著劑硬化裝置30而硬化。該接著劑硬化裝置30包括惰性氣體G之噴射機構。該惰性氣體G係自噴射機構之複數個噴射孔31向另一基板2噴射。又，於複數個上述噴射孔31係沿著另一基板2之外周部並排地配置之情形時，配合於接著劑3之擴散狀況或厚度之分佈，對於接著劑3之擴散比較快且接著劑3比較厚的區域，更多地噴射惰性氣體G，藉此使較厚區域內之接著劑3之外側側面3c比較快地硬化，從而可抑制接著劑3之外側側面3c自另一基板2之外周部溢出。即，可更積極地促進接著劑3之硬化而抑制接著劑3之溢出。 Therefore, in the adhesive hardening step, the adhesive 3 is hardened by the adhesive curing device 30. The adhesive hardening device 30 includes an injection mechanism of the inert gas G. The inert gas G is ejected from the plurality of injection holes 31 of the injection mechanism to the other substrate 2. Further, when a plurality of the injection holes 31 are arranged side by side along the outer peripheral portion of the other substrate 2, the diffusion of the adhesive 3 or the thickness distribution is applied, and the diffusion of the adhesive 3 is faster and the adhesive is applied. 3, in a relatively thick region, more inert gas G is sprayed, whereby the outer side surface 3c of the adhesive 3 in the thicker region is hardened relatively quickly, so that the outer side surface 3c of the adhesive 3 can be suppressed from the other substrate 2 The outer part overflows. That is, the hardening of the adhesive 3 can be more actively promoted to suppress the overflow of the adhesive 3.
進而，於接著劑硬化步驟中，接著劑硬化裝置30包括抽吸機構。接著劑3之外側之空氣係自抽吸機構之複數個抽吸孔32被抽吸。又，於複數個抽吸孔32係沿著另一基板2之外周部並排地配置之情形時，對於接著劑3之擴散比較慢且接著劑3比較薄之區域，使自抽吸孔32之抽吸更強烈，藉此，較薄區域內之接著劑3之外側側面3c被向另一基板2之外周部牽引。因此，可使接著劑3之厚度均一化，從而可抑制接著劑3之塗佈不均。 Further, in the adhesive hardening step, the adhesive hardening device 30 includes a suction mechanism. The air on the outside of the subsequent agent 3 is sucked from a plurality of suction holes 32 of the suction mechanism. Further, when a plurality of suction holes 32 are arranged side by side along the outer peripheral portion of the other substrate 2, the diffusion of the adhesive 3 is relatively slow and the area of the adhesive 3 is relatively thin, so that the self-suction hole 32 is The suction is stronger, whereby the outer side surface 3c of the adhesive 3 in the thinner region is pulled toward the outer periphery of the other substrate 2. Therefore, the thickness of the adhesive 3 can be made uniform, and coating unevenness of the adhesive 3 can be suppressed.
又，複數個基板1、2中之另一基板2具備矩形狀之平面形狀，於抽吸機構之抽吸孔32a配置於另一基板2之角部2b之情形時，接著劑3之外側側面3c被向抽吸孔32牽引。因此，可使接著劑3到達基板2之角部2b。其結果，可抑制接著劑3之塗佈不均。 Further, the other of the plurality of substrates 1 and 2 has a rectangular planar shape, and when the suction hole 32a of the suction mechanism is disposed at the corner portion 2b of the other substrate 2, the outer side of the adhesive 3 is provided. 3c is pulled toward the suction hole 32. Therefore, the adhesive 3 can be made to reach the corner portion 2b of the substrate 2. As a result, coating unevenness of the adhesive 3 can be suppressed.
再者，於圖1所示之示例中，在藉由接著劑硬化裝置30完成接著劑3之硬化(暫時硬化)之後，已貼合之基板1、2被供給至使接著劑3之整體硬化的正式硬化步驟(未圖示)。於正式硬化步驟中，經由基板1、2中之一者，對接著劑3整個面照射光，且根據需要而加熱，藉此，接著劑3得到硬化。 Further, in the example shown in FIG. 1, after the hardening (temporary hardening) of the adhesive 3 is completed by the adhesive curing device 30, the bonded substrates 1, 2 are supplied to harden the entire adhesive 3 The formal hardening step (not shown). In the main hardening step, the entire surface of the adhesive 3 is irradiated with light through one of the substrates 1 and 2, and heated as necessary, whereby the adhesive 3 is cured.
[貼合裝置之具體例]圖8係表示本發明之實施形態之貼合裝置A之具體例之說明圖。貼合裝置A包括第1單元U1、第2單元U2、第3單元U3，於第1單元U1、第2單元U2、第3單元U3之間，設置有搬送基板1、2之搬送裝置T。第1單元U1具有供將自一基板1之供給源所搬入之一基板1搬入的搬入口U1a。第1單元U1中，朝向自搬入口U1a搬入之一基板1而設有接著劑塗佈裝置10。第2單元U2具有供將自另一基板2之供給源所搬入之另一基板2搬入的搬入口U2a，且包括基板重疊裝置20。即，第2單元U2包括：第1保持部21，其保持自第1單元U1藉由搬送裝置T搬送之一基板1；及第2保持部22，其保持自搬入口U2a搬入之另一基板2。第3單元U3可包括將重疊之基板1、2保持於XYθ方向上之特定位置的保持機構40。進而，亦可包括第4單元U4，且於第4單元U4中，包括具有用以使接著劑3硬化(暫時硬化)之光照射裝置的接著劑硬化裝置30。又，亦可包括第5單元U5，且於第5單元U5中，包括向接著劑3整個面照射光而使其正式硬化之接著劑硬化裝置(未圖示)。保持機構40係由與定位機構26相同之、與基板1、2之各邊對應且可進行位置之調整的定位導引器等所構成，且係以與自第2單元U2朝向第3單元U3之搬送裝置T與自第3單元U3朝向第4單元U4之搬送裝 置T的移動連動之方式構成。 [Specific Example of Bonding Apparatus] Fig. 8 is an explanatory view showing a specific example of the bonding apparatus A according to the embodiment of the present invention. The bonding apparatus A includes a first unit U1, a second unit U2, and a third unit U3. The conveying unit T for conveying the substrates 1 and 2 is provided between the first unit U1, the second unit U2, and the third unit U3. The first unit U1 has a transfer inlet U1a for carrying in one of the substrates 1 carried from the supply source of the substrate 1. In the first unit U1, the adhesive application device 10 is provided to carry one of the substrates 1 toward the inlet U1a. The second unit U2 includes a carry-in port U2a for carrying in another substrate 2 loaded from a supply source of the other substrate 2, and includes a substrate stacking device 20. In other words, the second unit U2 includes the first holding unit 21 that holds one of the substrates 1 transported from the first unit U1 by the transport device T, and the second holding unit 22 that holds the other substrate carried in from the carry-in U2a. 2. The third unit U3 may include a holding mechanism 40 that holds the overlapped substrates 1, 2 at a specific position in the XYθ direction. Further, the fourth unit U4 may be included, and the fourth unit U4 includes an adhesive curing device 30 having a light irradiation device for curing (temporarily curing) the adhesive 3. Further, the fifth unit U5 may be included, and the fifth unit U5 includes an adhesive curing device (not shown) that irradiates light to the entire surface of the adhesive 3 to be completely cured. The holding mechanism 40 is constituted by a positioning guide that is the same as the positioning mechanism 26 and that can adjust the position corresponding to each side of the substrates 1 and 2, and is oriented from the second unit U2 toward the third unit U3. The transport device T and the transport from the third unit U3 toward the fourth unit U4 The method of moving the T movement is set.
以上，參照圖式對本發明之實施形態進行了詳細敘述，但具體之構成並不限於該等實施形態，不脫離本發明之主旨之範圍內的設計之變更等亦包含於本發明中。上述各圖所示之實施形態只要其目的及構成等不特別地矛盾或存在問題，便可將彼此之記載內容組合。又，各圖之記載內容係可成為分別獨立之實施形態者，本發明之實施形態並不限定於將各圖組合之一個實施形態。 The embodiments of the present invention have been described in detail above with reference to the drawings. However, the specific configuration is not limited to the embodiments, and the design changes and the like within the scope of the gist of the present invention are also included in the present invention. The embodiments shown in the above figures can be combined with each other as long as the purpose, configuration, and the like are not particularly contradictory or problematic. Further, the description of each drawing may be an independent embodiment, and the embodiment of the present invention is not limited to the embodiment in which each drawing is combined.
1‧‧‧基板(一基板) 1‧‧‧substrate (one substrate)
1a‧‧‧接合面 1a‧‧‧ joint surface
2‧‧‧基板(另一基板) 2‧‧‧Substrate (another substrate)
2a‧‧‧另一基板之接合面 2a‧‧‧ joint surface of another substrate
3‧‧‧接著劑 3‧‧‧Binder
20‧‧‧基板重疊裝置 20‧‧‧Substrate overlap device
21‧‧‧第1保持部 21‧‧‧1st Maintenance Department
21a‧‧‧保持面 21a‧‧‧ Keep face
22‧‧‧第2保持部 22‧‧‧2nd Maintenance Department
23‧‧‧驅動部 23‧‧‧ Drive Department
27‧‧‧支撐部 27‧‧‧Support
28‧‧‧基座 28‧‧‧Base
30‧‧‧接著劑硬化裝置 30‧‧‧Binder hardening device
30a‧‧‧殼體 30a‧‧‧shell
30b‧‧‧側面 30b‧‧‧ side
31‧‧‧噴射孔 31‧‧‧ spray holes
33‧‧‧出射口 33‧‧‧Outlet
G‧‧‧惰性氣體 G‧‧‧Inert gas
L‧‧‧光 L‧‧‧Light
X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction
Claims (26)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012068425A JP2013200430A (en) | 2012-03-23 | 2012-03-23 | Substrate sticking method and substrate sticking device |
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| Publication Number | Publication Date |
|---|---|
| TW201346678A true TW201346678A (en) | 2013-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102110091A TW201346678A (en) | 2012-03-23 | 2013-03-21 | Laminating method and laminating device of substrate |
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| Country | Link |
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| JP (1) | JP2013200430A (en) |
| CN (1) | CN103317819A (en) |
| TW (1) | TW201346678A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104004457A (en) * | 2014-06-03 | 2014-08-27 | 苏州桐力光电技术服务有限公司 | Bonding method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2015037121A1 (en) * | 2013-09-13 | 2015-03-19 | 東北パイオニアＥｇ株式会社 | Attaching device |
| CN103552354B (en) * | 2013-10-29 | 2016-08-17 | 深圳市联得自动化装备股份有限公司 | Applying method and equipment |
| CN103770386B (en) * | 2014-02-11 | 2016-01-27 | 欧派家居集团股份有限公司 | Panel and adhering method thereof |
| KR101613283B1 (en) * | 2014-09-15 | 2016-04-19 | 손창민 | Manufacturing method of radiant heat blocking fire-resistant glass |
| CN109555766B (en) * | 2018-10-30 | 2021-04-30 | 信利半导体有限公司 | Full-lamination manufacturing method of display module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4059782B2 (en) * | 2003-02-12 | 2008-03-12 | 富士フイルム株式会社 | Method and apparatus for curing ultraviolet curable resin |
| JP4710368B2 (en) * | 2005-03-18 | 2011-06-29 | 富士フイルム株式会社 | Coating film curing method and apparatus |
| JP5124537B2 (en) * | 2009-07-17 | 2013-01-23 | オリジン電気株式会社 | Bonding member manufacturing method and bonding member manufacturing apparatus |
| JP2012058417A (en) * | 2010-09-07 | 2012-03-22 | Hitachi Plant Technologies Ltd | Assembly system of 3d display panel device with touch panel |
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| CN104004457A (en) * | 2014-06-03 | 2014-08-27 | 苏州桐力光电技术服务有限公司 | Bonding method |
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| CN103317819A (en) | 2013-09-25 |
| JP2013200430A (en) | 2013-10-03 |
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