TW201345002A - Lens and LED package having the same - Google Patents
Lens and LED package having the same Download PDFInfo
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- TW201345002A TW201345002A TW101118802A TW101118802A TW201345002A TW 201345002 A TW201345002 A TW 201345002A TW 101118802 A TW101118802 A TW 101118802A TW 101118802 A TW101118802 A TW 101118802A TW 201345002 A TW201345002 A TW 201345002A
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Abstract
Description
本發明涉及一種透鏡，尤其涉及一種增強發光二極體側向出光的透鏡，本發明還涉及一種具有該種透鏡的發光二極體封裝結構。The present invention relates to a lens, and more particularly to a lens for enhancing lateral light emission of a light-emitting diode, and to a light-emitting diode package structure having the lens.
相較於傳統的發光源，發光二極體（Light Emitting Diode，LED）具有重量輕、體積小、污染低、壽命長等優點，其作為一種新型的發光源，已經被越來越多地應用到各領域當中，如路燈、交通燈、信號燈、射燈及裝飾燈等。Compared with the traditional illumination source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been used as a new type of illumination source. In various fields, such as street lamps, traffic lights, signal lights, spotlights and decorative lights.
現有的發光二極體封裝結構通常包括基板、位於基板上的電極、承載於基板上並與電極電性連接的發光二極體晶片以及覆蓋發光二極體晶片於基板上的封裝膠。然而，由於發光二極體晶片的出光角度大約為120度，且發光二極體晶片的出光強度主要集中出光面正對的中央區域，不能滿足側向出光的特殊要求。The conventional LED package structure generally includes a substrate, an electrode on the substrate, a light-emitting diode chip carried on the substrate and electrically connected to the electrode, and an encapsulant covering the LED substrate on the substrate. However, since the light-emitting diode wafer has an exit angle of about 120 degrees, and the light-emitting intensity of the light-emitting diode wafer mainly concentrates on the central region where the light surface faces, the special requirements for lateral light output cannot be satisfied.
有鑒於此，有必要提供一種增強發光二極體晶片側向出光的透鏡以及具有該種透鏡的發光二極體封裝結構。In view of the above, it is necessary to provide a lens for enhancing lateral light emission of a light-emitting diode wafer and a light-emitting diode package structure having the same.
一種透鏡，包括入光面以及出光面，該出光面包括第一出光部以及位於第一出光部周緣的第二出光部，該第一出光部為光滑的弧形面，該第二出光部為管狀粗糙面；該入光面包括接觸部、位於接觸部中央且向出光面一側凹陷的收容槽、以及由該收容槽底部進一步向出光面一側凹陷形成的空置部。A lens includes a light incident surface and a light exiting surface, the light exiting surface includes a first light exiting portion and a second light exiting portion located at a periphery of the first light emitting portion, wherein the first light exiting portion is a smooth curved surface, and the second light emitting portion is a tubular rough surface; the light incident surface includes a contact portion, a receiving groove recessed in the center of the contact portion and recessed toward the light emitting surface side, and a vacant portion formed by the bottom of the receiving groove further recessed toward the light emitting surface side.
一種發光二極體封裝結構，包括基板、設置在基板上的發光二極體晶粒、以及設置在基板上並罩設發光二極體晶粒的透鏡，所述透鏡包括入光面以及出光面，該出光面包括第一出光部以及位於第一出光部周緣的第二出光部，該第一出光部為光滑的弧形面，該第二出光部為管狀粗糙面，該入光面包括接觸部、位於接觸部中央且向出光面一側凹陷的收容槽、以及由該收容槽底部進一步向出光面一側凹陷形成的空置部，所述接觸部與基板相接合，所述收容槽將設置於基板上的發光二極體收容在內。A light emitting diode package structure includes a substrate, a light emitting diode die disposed on the substrate, and a lens disposed on the substrate and covering the light emitting diode die, wherein the lens includes a light incident surface and a light emitting surface The light-emitting surface includes a first light-emitting portion and a second light-emitting portion located at a periphery of the first light-emitting portion, the first light-emitting portion is a smooth curved surface, and the second light-emitting portion is a tubular rough surface, and the light-incident surface includes a contact a receiving portion that is located at the center of the contact portion and recessed toward the light-emitting surface side, and a vacant portion that is recessed from the bottom of the receiving groove toward the light-emitting surface side, the contact portion is joined to the substrate, and the receiving groove is set The light-emitting diodes on the substrate are housed.
在被應用於發光二極體封裝結構中時，該透鏡通過空置部內表面對發光二極體晶粒發出的光線進行折射並增加入射至第一出光部上的光線的入射角，從而提高第一出光部對光線的全反射率以將部分光線反射向第二出光部，同時利用第二出光部的粗糙面降低入射至其上的光線的全反射幾率，進而有效提高發光二極體的側向光線出射量，滿足側向出光的特殊要求。When applied to a light emitting diode package structure, the lens refracts light emitted from the light emitting diode die through the inner surface of the vacant portion and increases an incident angle of light incident on the first light exit portion, thereby improving the first The total reflectance of the light exiting portion to the light reflects the partial light to the second light exiting portion, and the rough surface of the second light exiting portion reduces the total reflection probability of the light incident thereon, thereby effectively improving the lateral direction of the light emitting diode. The amount of light emitted to meet the special requirements of lateral light.
下面參照附圖，結合具體實施例對本發明作進一步的描述。The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.
參見圖1，本發明實施方式提供的透鏡10包括出光面11以及入光面12。Referring to FIG. 1 , a lens 10 provided by an embodiment of the present invention includes a light emitting surface 11 and a light incident surface 12 .
該出光面11包括第一出光部110以及位於第一出光部110周緣的第二出光部112。該第一出光部110為光滑的弧形面，該第二出光部112為管狀粗糙面。本實施例中，該第二出光部112上形成有多個環繞所述第一出光部110的凹槽1120以構成所述粗糙面，該種粗糙面用於破壞入射至第二出光部112上的光線的全反射條件，以提高該第二出光部112的光出射效率。該凹槽可為V形凹槽或具有其他剖面形狀的凹槽。此外，該多個凹槽1120可以形成在第二出光部112的部分區域，也可佈滿整個第二出光部112。為達到較高出光效率，本實施例中所述凹槽1120佈滿整個第二出光部112。The light-emitting surface 11 includes a first light-emitting portion 110 and a second light-emitting portion 112 located at a periphery of the first light-emitting portion 110. The first light exiting portion 110 is a smooth curved surface, and the second light exiting portion 112 is a tubular rough surface. In the embodiment, the second light exiting portion 112 is formed with a plurality of grooves 1120 surrounding the first light exiting portion 110 to form the rough surface, and the rough surface is used for destroying the incident light onto the second light exiting portion 112. The total reflection condition of the light ray is to increase the light emission efficiency of the second light exit portion 112. The groove may be a V-shaped groove or a groove having other cross-sectional shapes. In addition, the plurality of grooves 1120 may be formed in a partial region of the second light exit portion 112, or may be entirely covered by the second light exit portion 112. In order to achieve higher light extraction efficiency, the groove 1120 in the embodiment is covered with the entire second light exit portion 112.
該入光面12包括接觸部120、位於接觸部120中央且向出光面11一側凹陷的收容槽122、以及由該收容槽122底部進一步向出光面11一側凹陷形成的空置部124。所述接觸部120與第二出光部112相接，該接觸部120用於與後續支撐透鏡10的承載件相接觸。所述收容槽122用於收容發光二極體晶粒。所述空置部124用於接收來自發光二極體晶粒的光線，並將射向第一出光部110的光線的一部分進行折射以增加入射至第一出光部110上的光線的入射角，從而提高第一出光部110對光線的全反射率。在第一出光部110上發生全反射的光線將被反射向第二出光部112，由於第二出光部112為粗糙面，該粗糙面能夠有效降低入射至第二出光部112上的光線的全反射幾率，使得經由第一出光部110反射的光線在入射至第二出光部112的時候能夠順利出射而不再發生全反射現象，進而有效提高發光二極體的側向光線出射量，滿足側向出光的特殊要求。The light-incident surface 12 includes a contact portion 120, a receiving groove 122 that is recessed toward the light-emitting surface 11 at the center of the contact portion 120, and a vacant portion 124 that is recessed from the bottom of the receiving groove 122 toward the light-emitting surface 11 side. The contact portion 120 is in contact with the second light exit portion 112 for contacting the carrier of the subsequent supporting lens 10. The receiving slot 122 is configured to receive the LED die. The vacant portion 124 is configured to receive light from the illuminating diode die and refract a portion of the light that is incident on the first light exit portion 110 to increase an incident angle of the light incident on the first light exit portion 110, thereby The total reflectance of the first light exiting portion 110 to light is increased. The light that is totally reflected on the first light-emitting portion 110 is reflected to the second light-emitting portion 112. Since the second light-emitting portion 112 is a rough surface, the rough surface can effectively reduce the total light incident on the second light-emitting portion 112. The probability of reflection is such that the light reflected by the first light exiting portion 110 can be smoothly emitted when the second light exiting portion 112 is incident, and the total light reflection phenomenon is no longer generated, thereby effectively increasing the amount of lateral light emitted from the light emitting diode, satisfying the side. Special requirements for light.
本實施例中，為達到較好的增強側向出光的效果，所述空置部124的內表面被設置為橢球面，該橢球面的短軸位於收容槽122底部所處的平面上，該橢球面的長軸與收容槽122底部所處的平面垂直。該種設置情況下，橢球面具有較大曲率的長軸端正對第一出光部110，從而該橢球面的長軸端能夠有效的增大經由橢球面折射後而入射至第一出光部110上的光線的入射角，進而提高第一出光部110對光線進行全反射的幾率，使得一部分原本射向第一出光部110的光線能夠被反射向第二出光部112，以提升第二出光部112的出光量。相應的，橢球面具有較小曲率的短軸端正對第二出光部112，使得原本就射向第二出光部112的光線在到達第二出光部112時的入射角較小，從而確保原本射向第二出光部112的光線能夠儘量避免全反射現象的發生而順利經由第二出光部112出射。In this embodiment, in order to achieve a better effect of enhancing the lateral light output, the inner surface of the vacant portion 124 is disposed as an ellipsoidal surface, and the short axis of the ellipsoidal surface is located on a plane at the bottom of the receiving groove 122, the ellipsoid The long axis of the spherical surface is perpendicular to the plane in which the bottom of the receiving groove 122 is located. In this arrangement, the long-axis end of the ellipsoidal surface having a large curvature faces the first light-emitting portion 110, so that the long-axis end of the ellipsoidal surface can be effectively increased to be incident on the first light-emitting portion 110 after being refracted through the ellipsoidal surface. The incident angle of the light ray further increases the probability that the first light exiting portion 110 totally reflects the light, so that a portion of the light originally incident on the first light exiting portion 110 can be reflected to the second light exiting portion 112 to enhance the second light exiting portion 112. The amount of light emitted. Correspondingly, the short axis end of the ellipsoidal surface having a small curvature faces the second light exiting portion 112, so that the incident angle of the light originally incident on the second light exiting portion 112 when reaching the second light exiting portion 112 is small, thereby ensuring the original shot. The light to the second light exit portion 112 can be smoothly transmitted through the second light exit portion 112 as much as possible while avoiding the occurrence of the total reflection phenomenon.
所述空置部124與收容槽122底部的交界面處形成圓形開口1240。進一步的，為達到最佳效果，還可將所述橢球面的半長軸長度L設置在所述圓形開口1240半徑R的1.5~2.5倍之間，也即1.5R≦L≦2.5R，該種情況設置下，能夠將發光二極體晶粒的光線有效導至側向，使得側向出光的光強度為正向出光的2~10倍。A circular opening 1240 is formed at the interface between the vacant portion 124 and the bottom of the receiving groove 122. Further, for the best effect, the semi-major axis length L of the ellipsoid may be set between 1.5 and 2.5 times the radius R of the circular opening 1240, that is, 1.5R≦L≦2.5R, In this case, the light of the light-emitting diode crystal grains can be effectively guided to the lateral direction, so that the light intensity of the lateral light output is 2 to 10 times that of the positive light output.
請參見圖2，本發明實施例還提供一種具有上述透鏡10的發光二極體封裝結構20。該發光二極體封裝結構20包括基板21、設置在基板21上的發光二極體晶粒22、以及設置在基板21上並罩設發光二極體晶粒22的透鏡10。Referring to FIG. 2, an embodiment of the present invention further provides a light emitting diode package structure 20 having the lens 10 described above. The light emitting diode package structure 20 includes a substrate 21, a light emitting diode die 22 disposed on the substrate 21, and a lens 10 disposed on the substrate 21 and covering the light emitting diode die 22.
所述基板21承載透鏡10，所述透鏡10的接觸部120與基板21相接合，所述收容槽122將設置於基板21上的發光二極體晶粒22收容在內。The substrate 21 carries a lens 10, and the contact portion 120 of the lens 10 is bonded to the substrate 21, and the receiving groove 122 houses the light-emitting diode die 22 disposed on the substrate 21.
本實施例中，所述發光二極體晶粒22的頂面與收容槽122的底部齊平。從而，使得發光二極體晶粒22正對收容槽122底部的空置部124。In this embodiment, the top surface of the LED die 22 is flush with the bottom of the receiving slot 122. Thereby, the light emitting diode die 22 faces the vacant portion 124 at the bottom of the receiving groove 122.
需要說明的是，當所述凹槽1120佈滿整個第二出光部112時，該凹槽1120可分別跟與第二出光部112相鄰的第一出光部110、接觸部120相接，以提高整個第二出光部112的出光效率。該實施例中關於基板21與發光二極體晶粒22之間的電連接關係可為打線連接、覆晶封裝等。此外，本實施例僅用於說明透鏡10結構及透鏡10與發光二極體晶粒22的配合關係，關於發光二極體的其他封裝結構，在此不再贅述。It should be noted that when the groove 1120 is full of the second light exiting portion 112, the groove 1120 can be respectively connected to the first light exiting portion 110 and the contact portion 120 adjacent to the second light exiting portion 112 to The light extraction efficiency of the entire second light exit portion 112 is increased. The electrical connection relationship between the substrate 21 and the LED die 22 in this embodiment may be a wire bonding, a flip chip package or the like. In addition, this embodiment is only used to describe the structure of the lens 10 and the matching relationship between the lens 10 and the LED die 22, and other packaging structures of the LED are not described herein.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10．．．透鏡10. . . lens
11．．．出光面11. . . Glossy surface
110．．．第一出光部110. . . First light exit
112．．．第二出光部112. . . Second light exit
1120．．．凹槽1120. . . Groove
12．．．入光面12. . . Glossy surface
120．．．接觸部120. . . Contact
122．．．收容槽122. . . Storage slot
124．．．空置部124. . . Vacant department
1240．．．開口1240. . . Opening
20．．．發光二極體封裝結構20. . . Light emitting diode package structure
21．．．基板twenty one. . . Substrate
22．．．發光二極體晶粒twenty two. . . Light-emitting diode grain
圖1為本發明實施方式提供的透鏡的結構示意圖。FIG. 1 is a schematic structural diagram of a lens according to an embodiment of the present invention.
圖2為本發明實施方式提供的發光二極體封裝結構的示意圖。FIG. 2 is a schematic diagram of a light emitting diode package structure according to an embodiment of the present invention.
10．．．透鏡10. . . lens
11．．．出光面11. . . Glossy surface
110．．．第一出光部110. . . First light exit
112．．．第二出光部112. . . Second light exit
1120．．．凹槽1120. . . Groove
12．．．入光面12. . . Glossy surface
120．．．接觸部120. . . Contact
122．．．收容槽122. . . Storage slot
124．．．空置部124. . . Vacant department
1240．．．開口1240. . . Opening
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210117576.7A CN103378277B (en) | 2012-04-20 | 2012-04-20 | Lens and there is the package structure for LED of this kind of lens |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201345002A true TW201345002A (en) | 2013-11-01 |
| TWI478401B TWI478401B (en) | 2015-03-21 |
Family
ID=49463105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101118802A TWI478401B (en) | 2012-04-20 | 2012-05-25 | Lens and led package having the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103378277B (en) |
| TW (1) | TWI478401B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725028B (en) * | 2015-05-26 | 2021-04-21 | 南韓商Ｌｇ伊諾特股份有限公司 | Light emitting module |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159059A (en) * | 2015-04-13 | 2016-11-23 | 弘凯光电(深圳)有限公司 | LED encapsulation structure and manufacture method thereof |
| CN106523980B (en) * | 2015-09-11 | 2020-09-25 | 上海三思电子工程有限公司 | LED signal lamp |
| CN106524079A (en) * | 2015-09-11 | 2017-03-22 | 上海三思电子工程有限公司 | Lens and LED lamp using same |
| TWI626771B (en) * | 2016-07-26 | 2018-06-11 | 宏齊科技股份有限公司 | Light emitting diode unit and slim planar light source module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US563836A (en) * | 1896-07-14 | blondel | ||
| JP5209634B2 (en) * | 2007-10-11 | 2013-06-12 | 株式会社クラレ | Surface light source element array and image display device |
| JP2011023204A (en) * | 2009-07-15 | 2011-02-03 | Sharp Corp | Light-emitting device, luminous flux control member, and lighting device having light-emitting device |
| CN102022690B (en) * | 2009-09-11 | 2014-03-12 | 玉晶光电股份有限公司 | Optical lens |
| CN102410490B (en) * | 2010-09-21 | 2013-08-14 | 富士迈半导体精密工业（上海）有限公司 | Lens and light source module |
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2012
- 2012-04-20 CN CN201210117576.7A patent/CN103378277B/en not_active Expired - Fee Related
- 2012-05-25 TW TW101118802A patent/TWI478401B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725028B (en) * | 2015-05-26 | 2021-04-21 | 南韓商Ｌｇ伊諾特股份有限公司 | Light emitting module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103378277A (en) | 2013-10-30 |
| TWI478401B (en) | 2015-03-21 |
| CN103378277B (en) | 2015-11-18 |
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