TW201338997A - Transfer apparatus and transfer method - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/0093—Attachments or auxiliary devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/44—Typewriters or selective printing mechanisms having dual functions or combined with, or coupled to, apparatus performing other functions
- B41J3/46—Printing mechanisms combined with apparatus providing a visual indication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- Manufacturing Of Printed Wiring (AREA)
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Abstract
Description
本發明係關於一種用以將承載於承載體表面之圖案或薄膜轉印於基板上之轉印裝置及轉印方法。尤其，係關於一種基於承載於承載體之對準標記之拍攝結果而進行基板與承載體之位置對準之技術者。 The present invention relates to a transfer device and a transfer method for transferring a pattern or film carried on a surface of a carrier onto a substrate. In particular, it relates to a technique for aligning the substrate with the carrier based on the result of the imaging of the alignment marks carried on the carrier.
作為於基板表面形成圖案或薄膜之技術，例如，有使作為被轉印物之圖案或薄膜暫時承載於平板狀之承載體(例如玻璃板)之表面，且使其密著於基板表面而將被轉印物轉印於基板表面之技術。在如此之轉印技術中，為將被轉印物適當地轉印於基板表面之特定位置，需要使承載體與基板之間之相對位置對準之對準處理。 As a technique for forming a pattern or a film on the surface of a substrate, for example, a pattern or a film which is a transfer target is temporarily carried on a surface of a flat carrier (for example, a glass plate), and is adhered to the surface of the substrate. A technique in which a transferred object is transferred onto a surface of a substrate. In such a transfer technique, in order to appropriately transfer the object to be transferred to a specific position on the surface of the substrate, alignment processing for aligning the relative positions between the carrier and the substrate is required.
作為可利用於如此之用途之對準技術，例如有日本特開2004-151653號公報中揭示者。在該技術中，在應黏合之2片基板各自之表面上預先形成對準標記，且基於以拍攝機構(例如CCD相機)拍攝之圖像對該等進行對準處理。具體而言，在以使對準標記形成面彼此對向之方式配置兩基板之狀態下，介隔透明之一基板進行對準標記之拍攝。且，基於自所拍攝之圖像檢測之兩對準標記之位置關係，調整基板間之相對位置。該技術為關於黏合2片基板時之對準處理者，且為可適宜地應用於藉由將一基板置換為承載體，使承載被轉印物之承載體重合於基板之特定位置而轉印被轉印物時之位置對準之技術。 As an alignment technique which can be utilized for such a use, for example, it is disclosed in Japanese Laid-Open Patent Publication No. 2004-151653. In this technique, alignment marks are formed in advance on the respective surfaces of the two substrates to be bonded, and alignment processing is performed based on images taken by a photographing mechanism (for example, a CCD camera). Specifically, in a state in which the two substrates are arranged such that the alignment mark forming faces face each other, the alignment of the alignment marks is performed through the transparent one substrate. Further, the relative position between the substrates is adjusted based on the positional relationship of the two alignment marks detected from the captured image. This technique is an alignment processor for bonding two substrates, and is suitably applied to transfer a carrier by transferring a substrate to a specific position of the substrate by replacing a substrate with a carrier. The technique of aligning the position of the object to be transferred.
在如此之轉印技術中，為根據拍攝結果高精度地進行對準標記之位置檢測，必須將拍攝機構之焦點對準對準標記。然而，根據基板、承載體及被轉印物之光學特性或該等之位置關係，有難以確保良好之拍攝環境之情形。例如來自配置於對準標記之背後之基板之反射光量，根據基板之材質或表面狀態、承載體與基板之距離等變化，藉此自對準標記入射至拍攝機構之光量較大地變動。又，例如，尤其利用與被轉印物相同之材料形成對準標記時，有使用光學特性鄰近承載體者作為其材料之情形。 In such a transfer technique, in order to accurately detect the position of the alignment mark in accordance with the result of the photographing, it is necessary to align the focus of the photographing mechanism with the alignment mark. However, depending on the optical characteristics of the substrate, the carrier, and the material to be transferred or the positional relationship between the substrates, it is difficult to ensure a good shooting environment. For example, the amount of reflected light from the substrate disposed behind the alignment mark varies depending on the material or surface state of the substrate, the distance between the carrier and the substrate, and the like, whereby the amount of light incident on the imaging means from the alignment mark largely fluctuates. Further, for example, when an alignment mark is formed by using the same material as the material to be transferred, there is a case where an optical property is used adjacent to the carrier as a material thereof.
該等情形時，有較難以充足之光量及對比度拍攝對準標記之情形。尤其，在聚焦未完成之狀態下，自所拍攝之圖像辨識對準標記自身較難，藉此，有無法適當地進行拍攝機構之聚焦而對基板與承載體之位置對準帶來障礙之情形。包含揭示於上述專利文獻1者，在先前之技術中，未進行對如此之問題之對應。 In such cases, it is difficult to capture the alignment mark with a sufficient amount of light and contrast. In particular, in the state where the focus is not completed, it is difficult to recognize the alignment mark itself from the captured image, whereby the focus of the imaging mechanism cannot be properly performed and the alignment of the substrate and the carrier is hindered. situation. Including the one disclosed in the above Patent Document 1, in the prior art, the correspondence to such a problem is not performed.
本發明係鑑於上述問題而完成者，目的在於提供一種在將承載於承載體之被轉印物轉印於基板上之技術中，在難以確保良好之拍攝環境之情形下，仍可高精度地進行基板與承載體之位置對準之技術。 The present invention has been made in view of the above problems, and an object thereof is to provide a technique for transferring a transfer object carried on a carrier onto a substrate, and it is possible to accurately ensure a good shooting environment. A technique of aligning the substrate with the carrier.
本發明之一態樣之特徵為，其係將作為被轉印物之圖案或薄膜轉印於基板上之轉印裝置，且為達成上述目的，具 備：保持機構，其係將於一表面承載所應轉印於上述基板上之上述被轉印物及特定之對準標記之承載體與上述基板相互分離地、且以使上述承載體之上述一表面與上述基板對向之狀態加以保持；拍攝機構，其係自與上述承載體之上述一表面相反之表面側，介隔上述承載體拍攝上述對準標記；圖像處理機構，其係根據上述拍攝機構拍攝之圖像，藉由圖像處理檢測上述對準標記；及對準機構，其係基於檢測出之上述對準標記，調整上述基板與上述承載體之相對位置；且上述拍攝機構具有用以將焦點對準上述對準標記之聚焦調整機構，該聚焦調整機構基於由上述圖像處理機構實施對比度增強處理後之上述對準標記之圖像進行聚焦。 An aspect of the present invention is characterized in that it is a transfer device that transfers a pattern or a film as a transfer object onto a substrate, and in order to achieve the above object, And a holding mechanism for carrying the transfer object and the specific alignment mark carrier to be transferred onto the substrate on a surface and the substrate from the substrate, and the carrier is a surface is held in a state opposite to the substrate; the photographing mechanism is formed on the surface side opposite to the surface of the carrier, and the alignment mark is formed by interposing the carrier; the image processing mechanism is based on The image captured by the photographing mechanism detects the alignment mark by image processing; and the alignment mechanism adjusts a relative position of the substrate and the carrier based on the detected alignment mark; and the photographing mechanism There is provided a focus adjustment mechanism for focusing the alignment mark, and the focus adjustment mechanism performs focusing based on the image of the alignment mark after the contrast enhancement processing is performed by the image processing mechanism.
又，本發明之另一態樣之特徵為，其係將作為被轉印物之圖案或薄膜轉印於基板上之轉印方法，且為達成上述目的，具備：配置工序，其係在將於一表面上承載上述被轉印物之承載體與上述基板相互分離之狀態下，將上述承載體之上述一表面朝向上述基板而對向配置；聚焦工序，其係利用配置於與上述承載體之上述一表面相反之表面側之拍攝機構，介隔上述承載體拍攝承載於上述承載體之上述一表面之對準標記，且基於該拍攝結果將上述拍攝機構之焦點對準上述對準標記；對準工序，其係在將上述拍攝機構之焦點對準上述對準標記之狀態下，拍攝上述對準標記與形成於上述基板上之基板側對準標記，且基於該拍攝結果調整上述基板與上述承載體之相對位置；及轉印工序， 其係使經調整相對位置之上述基板與上述承載體相互密著，而將上述被轉印物自上述承載體向上述基板轉印；且在上述聚焦工序中，對拍攝上述對準標記之圖像進行對比度增強處理，並根據該處理後之圖像檢測上述對準標記。 According to still another aspect of the present invention, a transfer method of transferring a pattern or a film of a transfer target onto a substrate is provided, and in order to achieve the above object, there is provided an arrangement step of a state in which the carrier carrying the transfer target is separated from the substrate on one surface, the one surface of the carrier is disposed facing the substrate, and the focusing step is disposed on the carrier The photographing mechanism on the surface side opposite to the surface is configured to capture an alignment mark carried on the surface of the carrier body via the carrier, and focus the photographing mechanism on the alignment mark based on the photographing result; An alignment process of capturing the alignment mark and the substrate-side alignment mark formed on the substrate while the focus of the imaging mechanism is in focus with the alignment mark, and adjusting the substrate based on the imaging result The relative position of the above carrier; and the transfer process, And the substrate and the carrier are adjusted to be in contact with each other, and the transferred material is transferred from the carrier to the substrate; and in the focusing process, the alignment mark is captured. The contrast enhancement processing is performed, and the alignment mark is detected based on the processed image.
在如上所述般構成之發明中，對拍攝對準標記而形成之圖像進行對比度增強處理。藉此，即使在起因於例如光量不充足或對準標記與承載體之間光學特性之差較小而圖像對比度較低之情形下，仍可容易地進行對準標記之檢測。 In the invention constructed as described above, the image formed by photographing the alignment mark is subjected to contrast enhancement processing. Thereby, even in the case where, for example, the amount of light is insufficient or the difference in optical characteristics between the alignment mark and the carrier is small and the image contrast is low, the detection of the alignment mark can be easily performed.
有因進行對比度增強而導致甚至增強拍攝結果所含之雜訊之虞。然而，由於預先已知對準標記之形狀或尺寸，故藉由使該等已知之資訊反映於檢測，可排除雜訊之影響。又，在聚焦之階段，並不一定需要對準標記之位置或其圖像濃度等之定量資訊，可判定是否為可根據圖像穩定地檢測對準標記之狀態即可。據此，藉由基於針對所拍攝之圖像進行對比度增強之結果進行聚焦，即使在並非良好之拍攝環境之環境下，仍可良好地進行基於對準標記之圖像之拍攝機構之聚焦。因此，在本發明中，基於在焦點對準之狀態下所拍攝之對準標記之圖像，可高精度地進行基板與承載體之位置對準。 There is a tendency to enhance the contrast caused by the contrast enhancement. However, since the shape or size of the alignment mark is known in advance, the influence of the noise can be eliminated by reflecting the known information on the detection. Further, at the stage of focusing, quantitative information such as the position of the alignment mark or its image density is not necessarily required, and it is possible to determine whether or not the state of the alignment mark can be stably detected from the image. According to this, by focusing on the result of contrast enhancement for the captured image, the focus of the imaging mechanism based on the image of the alignment mark can be performed well even in an environment that is not a good shooting environment. Therefore, in the present invention, the alignment of the substrate and the carrier can be performed with high precision based on the image of the alignment mark captured in the in-focus state.
在該等發明中，例如，可進行包含增強與對準標記之形狀對應之空間頻率成分之處理之對比度增強處理。若在所拍攝之圖像中明瞭顯示有對準標記，則圖像中大量包含與對準標記之形狀對應之空間頻率成分。如上所述，由於對準標記之形狀或尺寸為已知，故其空間頻率成分亦為已 知。因此，藉由進行特別增強該等成分之處理，例如擷取該成分之濾波處理，更容易自包含雜訊成分之圖像選擇性地檢測與對準標記對應之成分。 In these inventions, for example, a contrast enhancement process including a process of enhancing a spatial frequency component corresponding to the shape of the alignment mark can be performed. If an alignment mark is clearly displayed in the captured image, the image contains a large amount of spatial frequency components corresponding to the shape of the alignment mark. As described above, since the shape or size of the alignment mark is known, the spatial frequency component is also know. Therefore, by particularly enhancing the processing of the components, for example, by filtering the components, it is easier to selectively detect the components corresponding to the alignment marks from the image containing the noise components.
且，例如藉由對濾波處理後之對準標記之圖像資料乘以大於1之係數，可進一步擴大與對準標記對應之信號與雜訊位準之差，從而可進一步增強圖像之對準標記之對比度。 Moreover, for example, by multiplying the image data of the alignment mark after the filtering process by a coefficient greater than 1, the difference between the signal and the noise level corresponding to the alignment mark can be further expanded, thereby further enhancing the image pair. The contrast of the quasi-marker.
又，例如，可一方面多階段地變更設定拍攝機構之聚焦位置，且每當該變更設定時進行對準標記之拍攝，而在對應於對該等拍攝結果進行對比度增強處理之圖像中、包含最多與對準標記之形狀對應之空間頻率成分者之位置，調整拍攝機構之聚焦位置。藉此，將拍攝機構之聚焦位置調整為最鮮明地拍攝對準標記之位置，且在以後之拍攝中，可在焦點對準對準標記之狀態下進行拍攝。藉此，對準標記之位置檢測精度提高，從而可高精度地進行基於位置檢測結果之基板與承載體之位置對準。 Further, for example, the focus position of the setting photographing mechanism may be changed in multiple stages on the one hand, and the photographing of the alignment mark may be performed every time the setting is changed, and in the image corresponding to the contrast enhancement processing corresponding to the photographing result, The position of the focus frequency component corresponding to the shape of the alignment mark is included, and the focus position of the photographing mechanism is adjusted. Thereby, the focus position of the photographing mechanism is adjusted to the position where the alignment mark is most vividly photographed, and in the subsequent photographing, the photographing can be performed with the in-focus alignment mark being in focus. Thereby, the position detection accuracy of the alignment mark is improved, and the positional alignment of the substrate and the carrier based on the position detection result can be performed with high precision.
即，在如此將拍攝機構之焦點對準對準標記之狀態下，拍攝機構拍攝承載於承載體之對準標記與形成於基板上之基板側對準標記。且，基於承載體之對準標記與基板側對準標記之相對位置之檢測結果，調整基板與承載體之相對位置，藉此可高精度地進行基板與承載體之位置對準。 That is, in a state in which the focus of the photographing mechanism is aligned with the alignment mark, the photographing mechanism photographs the alignment mark carried on the carrier and the substrate-side alignment mark formed on the substrate. Further, based on the detection result of the relative position of the alignment mark of the carrier and the substrate-side alignment mark, the relative position of the substrate and the carrier is adjusted, whereby the positional alignment between the substrate and the carrier can be performed with high precision.
另，在上述發明中，例如，可在將基板與承載體對向配置之前，在承載體之一主表面上利用與被轉印物相同之材料而與被轉印物一起形成對準標記。如此，由於基於與被 轉印物一起形成之對準標記將基板與承載體位置對準，故作為結果，可高精度地調整被轉印物與基板之位置關係。藉此，達成將被轉印物轉印於基板上之適當位置之最終目的。 Further, in the above invention, for example, an alignment mark may be formed together with the object to be transferred by using the same material as the material to be transferred on one main surface of the carrier before the substrate and the carrier are opposed to each other. So, based on The alignment marks formed by the transfer materials align the substrate with the carrier, and as a result, the positional relationship between the transfer target and the substrate can be adjusted with high precision. Thereby, the ultimate goal of transferring the transferred material to an appropriate position on the substrate is achieved.
藉由以與被轉印物相同之材料形成對準標記，作為對準標記之識別之難度將依存於被轉印物之材料。因此，雖亦可能有根據材料未必可獲得良好之對比度之情形，但藉由應用本發明，在如此之情形下仍可適當地進行聚焦。且，基於如此焦點對準之狀態下所拍攝之對準標記之圖像，可高精度地進行基板與承載體之位置對準。 By forming the alignment mark with the same material as the object to be transferred, the difficulty of the identification as the alignment mark depends on the material of the object to be transferred. Therefore, although there may be cases where a good contrast is not necessarily obtained depending on the material, by applying the present invention, focusing can be appropriately performed under such circumstances. Further, based on the image of the alignment mark captured in such a state of being in focus, the alignment of the substrate and the carrier can be performed with high precision.
根據本發明，藉由基於針對拍攝對準標記之圖像進行對比度增強之結果進行拍攝機構之聚焦，在並非良好之拍攝環境下仍可適當地進行聚焦。且，基於如此進行聚焦之狀態下所拍攝之對準標記之圖像，在本發明中，可高精度地進行基板與承載體之間之位置對準。 According to the present invention, focusing of the photographing mechanism is performed based on the result of contrast enhancement based on the image for photographing the alignment mark, and focusing can be appropriately performed in a not-good shooting environment. Further, in the present invention, the alignment between the substrate and the carrier can be performed with high precision based on the image of the alignment mark captured in the state in which the focus is thus performed.
圖1係顯示裝備本發明之轉印裝置之印刷裝置之概略立體圖，為明示裝置內部之構成，而在卸下裝置外罩之狀態下進行圖示。又，圖2係模式性顯示圖1所示之印刷裝置之剖面之圖。再者，圖3係顯示圖1之裝置之電性構成之方塊圖。該印刷裝置100使自裝置之正面側搬入裝置內部之橡皮布之上表面密著於自裝置之左側面側搬入裝置內部之版PP之下表面後剝離，藉此利用形成於版PP之下表面上之圖 案，使橡皮布上之塗佈層圖案化而形成圖案層(圖案化處理)。又，印刷裝置100使經圖案化處理之橡皮布之上表面密著於自裝置之右側面側搬入裝置內部之基板SB之下表面後剝離，藉此將形成於該橡皮布上之圖案層轉印於基板SB之下表面上(轉印處理)。另，在圖1及其後說明之各圖中，為明確裝置各部之配置關係，將版PP及基板SB之搬運方向設為「X方向」，且將自圖1之右手側朝向左手側之水平方向稱為「+X方向」，將反方向稱為「-X方向」。又，將與X方向正交之水平方向中、裝置之正面側稱為「+Y方向」，且將裝置之背面側稱為「-Y方向」。再者，將鉛直方向之上方向及下方向分別稱為「+Z方向」及「-Z方向」。 Fig. 1 is a schematic perspective view showing a printing apparatus equipped with a transfer device of the present invention, showing the inside of the apparatus, and showing the state in which the apparatus cover is removed. 2 is a view schematically showing a cross section of the printing apparatus shown in FIG. 1. Furthermore, Fig. 3 is a block diagram showing the electrical configuration of the device of Fig. 1. In the printing apparatus 100, the upper surface of the blanket which is carried into the apparatus from the front side of the apparatus is adhered to the lower surface of the plate PP which is carried into the apparatus from the left side of the apparatus, and then peeled off, thereby being formed on the lower surface of the plate PP. Picture on In the case, the coating layer on the blanket is patterned to form a pattern layer (patterning treatment). Further, the printing apparatus 100 causes the upper surface of the patterned blanket to be adhered to the lower surface of the substrate SB inside the apparatus from the right side of the apparatus, and then peeled off, thereby transferring the pattern layer formed on the blanket. It is printed on the lower surface of the substrate SB (transfer process). In addition, in FIG. 1 and each of the drawings described later, in order to clarify the arrangement relationship between the respective devices, the conveyance direction of the plate PP and the substrate SB is set to "X direction", and the right hand side of FIG. 1 is directed to the left hand side. The horizontal direction is called "+X direction", and the reverse direction is called "-X direction". Further, in the horizontal direction orthogonal to the X direction, the front side of the device is referred to as "+Y direction", and the back side of the device is referred to as "-Y direction". In addition, the upper direction and the lower direction in the vertical direction are referred to as "+Z direction" and "-Z direction", respectively.
在該印刷裝置100中，石材板1上設置有裝置各部(搬運部2、上載台部3、對準部4、下載台部5、推壓部7、預對準部8、除電部9)，控制部6控制裝置各部。 In the printing apparatus 100, the stone board 1 is provided with each part of the apparatus (the conveying unit 2, the loading table unit 3, the aligning unit 4, the downloading table unit 5, the pressing unit 7, the pre-aligning unit 8, and the static eliminating unit 9). The control unit 6 controls each unit of the device.
搬運部2為在X方向搬運版PP及基板SB之裝置，且如下般構成。在該搬運部2中，自石材板1之上表面之右後角部及左後角部直立設置有2根支架(圖示省略)。且，以相互連結該等2根支架之上端部之方式，於左右方向、即X方向延伸設置有滾珠螺桿機構21。在該滾珠螺桿機構21中，滾珠螺桿(圖示省略)於X方向延伸，在其一端上，連結有梭水平驅動用之馬達M21之旋轉軸(圖示省略)。又，相對滾珠螺桿之中央部螺合滾珠螺桿支架(圖示省略)，且於該等滾珠螺桿支架之(+Y)側面安裝有X方向上延伸設置之梭保持板22。 The transport unit 2 is a device that transports the plate PP and the substrate SB in the X direction, and is configured as follows. In the transport unit 2, two brackets (not shown) are erected from the right rear corner portion and the left rear corner portion of the upper surface of the stone panel 1. Further, the ball screw mechanism 21 is extended in the left-right direction, that is, in the X direction so that the upper ends of the two brackets are connected to each other. In the ball screw mechanism 21, a ball screw (not shown) extends in the X direction, and a rotation shaft (not shown) of the motor M21 for shuttle horizontal driving is coupled to one end thereof. Further, a ball screw holder (not shown) is screwed to the center portion of the ball screw, and a shuttle holding plate 22 extending in the X direction is attached to the (+Y) side surface of the ball screw holder.
將版用梭23L可於鉛直方向Z升降地設置於該梭保持板22之(+X)側端部，另一方面，將基板用梭23R可於鉛直方向Z升降地設置於(-X)側端部。由於除了指針之旋轉機構，該等之梭23L、23R具有相同構成，故，此處，說明版用梭23L之構成，且針對基板用梭23R標註相同符號或相當之符號而省略構成說明。 The plate shuttle 23L is provided at the (+X) side end of the shuttle holding plate 22 in the vertical direction Z, and the substrate shuttle 23R is vertically movable in the vertical direction Z (-X). Side end. Since the shuttles 23L and 23R have the same configuration except for the rotation mechanism of the hands, the configuration of the magazine shuttle 23L will be described here, and the same reference numerals or the same reference numerals will be given to the substrate shuttle 23R, and the description of the configuration will be omitted.
梭23L具有在X方向與版PP之寬度尺寸(X方向尺寸)相同程度或略微較長地延伸之升降板231、與自升降板231之(+X)側端部及(-X)側端部分別延伸設置於前側即(+Y)側之2個版用指針232、232。升降板231介隔滾珠螺桿機構(圖示省略)可升降地安裝於梭保持板22之(+X)側端部。即，相對梭保持板22之(+X)側端部，將滾珠螺桿機構延伸設置於鉛直方向Z。於該滾珠螺桿機構之下端，版用梭升降馬達M22L(圖3)上連結有旋轉軸(圖示省略)。又，相對滾珠螺桿機構螺合滾珠螺桿支架(圖示省略)，且於該滾珠螺桿支架之(+Y)側面安裝有升降板231。因此，藉由根據來自控制部6之馬達控制部63之動作指令版用梭升降馬達M22L作動，將升降板231於鉛直方向Z升降驅動。 The shuttle 23L has a lift plate 231 that extends in the X direction to the same extent as the width dimension (X direction dimension) of the plate PP or slightly longer, and the (+X) side end portion and the (-X) side end of the self-lifting plate 231. The two extension fingers 232 and 232 are respectively disposed on the front side, that is, on the (+Y) side. The lift plate 231 is attached to the (+X) side end portion of the shuttle holding plate 22 so as to be movable up and down via a ball screw mechanism (not shown). That is, the ball screw mechanism is extended in the vertical direction Z with respect to the (+X) side end portion of the shuttle holding plate 22. At the lower end of the ball screw mechanism, a rotary shaft (not shown) is coupled to the plate lift motor M22L (Fig. 3). Further, the ball screw bracket (not shown) is screwed with respect to the ball screw mechanism, and the lift plate 231 is attached to the (+Y) side surface of the ball screw bracket. Therefore, the lift plate 231 is lifted and lowered in the vertical direction Z by the operation of the shuttle lift motor M22L in accordance with the operation of the motor control unit 63 from the control unit 6.
各指針232、232之前後尺寸(Y方向尺寸)長於版PP之長度尺寸(Y方向尺寸)，從而可在各指針232、232之前端側(+Y側)保持版PP。 The front and rear dimensions (Y-direction dimensions) of the hands 232 and 232 are longer than the length dimension (Y-direction dimension) of the plate PP, so that the plate PP can be held on the front end side (+Y side) of each of the hands 232 and 232.
又，為檢測如此以版用指針232、232保持版PP，自升降板231之中央部於(+Y)側介隔感測器支架安裝有版檢測用之感測器(圖示省略)。因此，若在兩指針232上載置版 PP，則感測器檢測版PP之後端部、即(-Y)側端部，且將檢測信號輸出至控制部6。 Further, in order to detect the holding of the plate PP by the plate fingers 232 and 232 as described above, a sensor for detecting the plate (not shown) is attached to the (+Y) side of the sensor holder from the center portion of the lift plate 231. Therefore, if the two pointers 232 are placed on the plate PP, the sensor detects the end portion of the PP after the PP, that is, the (-Y) side end portion, and outputs a detection signal to the control portion 6.
再者，各版用指針232、232介隔軸承(圖示省略)安裝於升降板231，且將於前後方向(Y方向)延伸之旋轉軸作為旋轉中心自由旋轉。又，在升降板231之X方向兩端，安裝有旋轉致動器RA2、RA2(圖3)。該等旋轉致動器RA2、RA2為將加壓氣體作為驅動源而動作者，且可根據介插於加壓氣體之供給路徑中之閥門(圖示省略)之開關，以180°單位旋轉。因此，藉由控制利用控制部6之閥門控制部64之上述閥門之開關，可在版用指針232、232之一主表面朝向上方而適合處理圖案化前之版PP之指針姿勢(以下稱為「未使用姿勢」)、與另一主表面朝向上方而適合處理圖案化後之版PP之指針姿勢(以下稱為「使用完姿勢」)之間切換指針姿勢。如此般具有指針姿勢之切換機構之點為版用梭23L與基板用梭23R唯一不同之點。 Further, the respective plates 232 and 232 are attached to the lift plate 231 via a bearing (not shown), and the rotating shaft extending in the front-rear direction (Y direction) is freely rotatable as a center of rotation. Further, rotary actuators RA2, RA2 (Fig. 3) are attached to both ends of the lift plate 231 in the X direction. The rotary actuators RA2 and RA2 are driven by a pressurized gas as a drive source, and are rotatable in units of 180° according to a switch inserted through a valve (not shown) in the supply path of the pressurized gas. Therefore, by controlling the switch of the valve by the valve control unit 64 of the control unit 6, the pointer posture of the plate PP before the patterning can be handled on the main surface of one of the plate pointers 232 and 232 (hereinafter referred to as The "unused posture" is switched between the pointer posture (hereinafter referred to as "use posture") in which the other main surface faces upward and is suitable for processing the patterned version PP. The point of the switching mechanism having the pointer posture as described above is the point that the plate shuttle 23L and the substrate shuttle 23R are uniquely different.
接著，就版用梭23L及基板用梭23R相對梭保持板22之安裝位置進行說明。在該實施形態中，如圖2所示，版用梭23L及基板用梭23R係在X方向以長於版PP或基板SB之寬度尺寸(另，在實施形態中，版PP與基板SB之寬度尺寸相同)之間隔分離而安裝於梭保持板22。且，若使梭水平驅動馬達M21之旋轉軸於特定方向旋轉，則兩梭23L、23R將在保持上述分離距離之狀態下於X方向移動。例如在圖2中，符號XP23表示上載台部3之正下方位置，梭23L、23R位於自位置XP23分別在(+X)方向及(-X)方向以等距離(將 該距離稱為「階段移動單位」)離開之位置XP22、XP24。另，在本實施形態中，將圖2所示之狀態稱為「中間位置狀態」。 Next, the mounting position of the plate shuttle 23L and the substrate shuttle 23R with respect to the shuttle holding plate 22 will be described. In this embodiment, as shown in FIG. 2, the plate shuttle 23L and the substrate shuttle 23R are longer than the width of the plate PP or the substrate SB in the X direction (in addition, in the embodiment, the width of the plate PP and the substrate SB) The same size is separated and attached to the shuttle holding plate 22. When the rotation axis of the shuttle horizontal drive motor M21 is rotated in a specific direction, the shuttles 23L and 23R are moved in the X direction while maintaining the separation distance. For example, in Fig. 2, the symbol XP23 indicates the position directly below the loading table portion 3, and the shuttles 23L, 23R are located equidistant from the position XP23 in the (+X) direction and the (-X) direction, respectively. This distance is called "phase moving unit") and the positions XP22 and XP24 are left. In the present embodiment, the state shown in Fig. 2 is referred to as "intermediate position state".
又，若自該中間位置狀態使梭水平驅動馬達M21之旋轉軸於特定方向旋轉而使梭保持板22以階段移動單位於(+X)方向移動，則基板用梭23R在(+X)方向移動且移動至上載台部3之正下方位置XP23而定位。此時，版用梭23L亦一體地在(+X)方向移動，且定位於與配置於印刷裝置100之(+X)方向側之版洗淨裝置(圖示省略)鄰近之位置XP21。 Further, when the rotation axis of the shuttle horizontal drive motor M21 is rotated in a specific direction from the intermediate position state and the shuttle holding plate 22 is moved in the (+X) direction by the phase shift unit, the substrate shuttle 23R is in the (+X) direction. It is moved and moved to the position XP23 directly below the uploading table unit 3 to be positioned. At this time, the plate shuttle 23L is also integrally moved in the (+X) direction, and is positioned at a position XP21 adjacent to the plate cleaning device (not shown) disposed on the (+X) direction side of the printing apparatus 100.
相反地，若使梭水平驅動馬達M21之旋轉軸於與特定方向相反之方向旋轉而使梭保持板22以階段移動單位於(-X)方向移動，則版用梭23L自中間位置狀態在(-X)方向移動且移動至上載台部3之正下方位置XP23而定位。此時，基板用梭23R亦一體地在(-X)方向移動，且定位於與配置於印刷裝置100之(-X)方向側之基板洗淨裝置(圖示省略)鄰近之位置XP25。如此般，在本說明書中，作為X方向之梭位置規定有5個位置XP21~XP25。即，版交接位置XP21為定位版用梭23L之3個位置XP21~XP23中最鄰近版洗淨裝置之位置，意為在與版洗淨裝置之間進行版PP之搬入搬出之X方向位置。基板交接位置XP25為定位基板用梭23R之3個位置XP23~XP25中最鄰近基板洗淨裝置之位置，意為在與基板洗淨裝置之間進行基板SB之搬入搬出之X方向位置。又，位置XP23意為上載台部3之吸附板34於鉛直方向Z移動而吸附保持版PP或基板SB之X方向位置。在本說明書 中，版用梭23L位於X方向位置XP23時，將該位置XP23稱為「版吸附位置XP23」，另一方面，基板用梭23R位於X方向位置XP23時，將該位置XP23稱為「基板吸附位置XP23」。又，將如此般利用梭23L、23R搬運版PP或基板SB之鉛直方向Z上之位置、即高度位置稱為「搬運位置」。 Conversely, if the rotation axis of the shuttle horizontal drive motor M21 is rotated in the opposite direction to the specific direction to move the shuttle holding plate 22 in the (-X) direction in the phase shifting unit, the plate shuttle 23L is in the intermediate position state ( The -X) direction is moved and moved to the position XP23 directly below the uploading table portion 3 to be positioned. At this time, the substrate shuttle 23R is also integrally moved in the (-X) direction, and is positioned at a position XP25 adjacent to the substrate cleaning device (not shown) disposed on the (-X) direction side of the printing apparatus 100. As described above, in the present specification, five positions XP21 to XP25 are defined as the shuttle position in the X direction. In other words, the plate transfer position XP21 is the position of the nearest position plate cleaning device among the three positions XP21 to XP23 of the positioning plate shuttle 23L, and means that the X direction position of the plate PP is carried in and out between the plate cleaning device and the plate cleaning device. The substrate transfer position XP25 is the position of the most adjacent substrate cleaning device among the three positions XP23 to XP25 of the positioning substrate shuttle 23R, and means that the X-direction position of the substrate SB is carried in and out with the substrate cleaning device. Further, the position XP23 means that the adsorption plate 34 of the loading stage 3 moves in the vertical direction Z to adsorb the position of the holding plate PP or the substrate SB in the X direction. In this manual When the plate shuttle 23L is located at the X-direction position XP23, the position XP23 is referred to as a "plate suction position XP23", and when the substrate shuttle 23R is located at the X-direction position XP23, the position XP23 is referred to as "substrate adsorption". Location XP23". In addition, the position at the vertical direction Z of the shuttle 23L, the 23R conveyance plate PP or the substrate SB, that is, the height position is referred to as a "transport position".
又，在本實施形態中，為正確控制版PP與橡皮布在圖案化時之間隙量、以及基板SB與橡皮布在轉印時之間隙量，必須計測版PP及基板SB之厚度。因此，設置有版厚度計測感測器SN22及基板厚度計測感測器SN23。另，在本實施形態中，作為兩感測器SN22、SN23，雖使用具有投光部與受光部之反射類型之光學感測器，但亦可使用其以外之感測器。 Further, in the present embodiment, in order to accurately control the amount of gap between the plate PP and the blanket during patterning and the amount of gap between the substrate SB and the blanket at the time of transfer, it is necessary to measure the thickness of the plate PP and the substrate SB. Therefore, the plate thickness measuring sensor SN22 and the substrate thickness measuring sensor SN23 are provided. Further, in the present embodiment, an optical sensor having a reflection type of the light projecting portion and the light receiving portion is used as the two sensors SN22 and SN23, but a sensor other than the sensor may be used.
面對位置XP23，配置有上載台部3。在該上載台部3中，固定有延伸設置於鉛直方向Z之滾珠螺桿機構31，且在該滾珠螺桿機構31之上端部，連結第1載台升降馬達M31之旋轉軸(圖示省略)。接著，相對滾珠螺桿機構31螺合有滾珠螺桿支架(圖示省略)。在該滾珠螺桿支架上，固定有支撐框架32，且可與滾珠螺桿支架一體地在鉛直方向Z升降。再者，在該支撐框架32之框架面上，支撐有其他滾珠螺桿機構(圖示省略)。在該滾珠螺桿機構中，設置有較上述滾珠螺桿機構31之滾珠螺桿更窄間距之滾珠螺桿，在其上端部，連結第2載台升降馬達M32(圖3)之旋轉軸(圖示省略)，且在中央部螺合有滾珠螺桿支架。 Facing the position XP23, the uploading station unit 3 is arranged. In the loading table portion 3, a ball screw mechanism 31 extending in the vertical direction Z is fixed, and a rotating shaft (not shown) of the first stage elevating motor M31 is coupled to an upper end portion of the ball screw mechanism 31. Next, a ball screw bracket (not shown) is screwed to the ball screw mechanism 31. A support frame 32 is fixed to the ball screw bracket, and can be lifted and lowered in the vertical direction Z integrally with the ball screw bracket. Further, on the frame surface of the support frame 32, other ball screw mechanisms (not shown) are supported. In the ball screw mechanism, a ball screw having a narrower pitch than the ball screw of the ball screw mechanism 31 is provided, and a rotation shaft (not shown) of the second stage elevating motor M32 (FIG. 3) is connected to the upper end portion thereof. And a ball screw bracket is screwed in the center portion.
在該滾珠螺桿支架上，安裝有載台固持器33。又，載台 固持器33之下表面上，安裝有例如鋁合金等之金屬製之吸附板34。因此，藉由根據來自控制部6之馬達控制部63之動作指令載台升降馬達M31、M32作動，吸附板34在鉛直方向Z升降移動。又，在本實施形態中，組合具有不同間距之滾珠螺桿機構，且藉由使第1載台升降馬達M31作動可使吸附板34以較寬之間距升降，即可使吸附板34高速移動。此外，藉由使第2載台升降馬達M32作動可使吸附板34以較窄之間距升降，即可精密地定位吸附板34。 A stage holder 33 is mounted on the ball screw bracket. Again, the stage On the lower surface of the holder 33, an adsorption plate 34 made of a metal such as an aluminum alloy is attached. Therefore, the suction plate 34 is moved up and down in the vertical direction Z by the operation of the stage lifting motors M31 and M32 in accordance with the operation of the motor control unit 63 from the control unit 6. Further, in the present embodiment, the ball screw mechanism having different pitches is combined, and by moving the first stage elevating motor M31, the suction plate 34 can be moved up and down at a wide distance, so that the suction plate 34 can be moved at a high speed. Further, by moving the second stage elevating motor M32, the suction plate 34 can be moved up and down by a narrow distance, so that the suction plate 34 can be precisely positioned.
於該吸附板34之下表面、即吸附保持版PP或基板SB之吸附面上設置有吸附機構，且經由負壓供給路徑連接於負壓供給源。且，藉由根據來自控制部6之閥門控制部64之開關指令對與吸附機構連接之吸附閥門V31(圖3)進行開關控制，可實現利用吸附機構之版PP或基板SB之吸附。另，在本實施形態中，上述吸附機構及如後述般吸附保持橡皮布之吸附機構雖使用工廠之用力作為負壓供給源，但亦可以使裝置100裝備真空泵等之負壓供給部，而自該負壓供給部對吸附機構供給負壓之方式構成。 An adsorption mechanism is provided on the lower surface of the adsorption plate 34, that is, the adsorption surface of the adsorption holding plate PP or the substrate SB, and is connected to the negative pressure supply source via a negative pressure supply path. Further, by performing the switching control of the adsorption valve V31 (FIG. 3) connected to the adsorption mechanism in accordance with the switching command from the valve control unit 64 of the control unit 6, the adsorption by the plate PP or the substrate SB of the adsorption mechanism can be realized. In the present embodiment, the suction mechanism and the suction mechanism that adsorbs and holds the blanket as described later use the force of the factory as the negative pressure supply source. However, the device 100 may be equipped with a vacuum supply unit such as a vacuum pump. The negative pressure supply unit is configured to supply a negative pressure to the adsorption mechanism.
在如此般構成之上載台部3中，利用搬運部2之版用梭23L將版自圖1之左手側經由搬運空間搬運至上載台部3之正下方之版吸附位置XP23後，上載台部3之吸附板34下降而吸附保持版PP。相反地，若在版用梭23L位於上載台部3之正下方位置之狀態下，吸附版PP之吸附板34解除吸附，則將版PP移載至搬運部2。藉此，在搬運部2與上載台部3之間進行版之交接。 In the loading table unit 3 configured as described above, the plate is transported by the plate shuttle 23L of the transport unit 2 from the left-hand side of FIG. 1 to the plate suction position XP23 immediately below the loading table unit 3 via the transport space, and then the table portion is loaded. The adsorption plate 34 of 3 is lowered to adsorb and retain the plate PP. On the other hand, when the plate shuttle 23L is positioned directly below the loading table unit 3, the suction plate 34 of the adsorption plate PP is desorbed, and the plate PP is transferred to the conveying unit 2. Thereby, the delivery of the plate is performed between the conveyance unit 2 and the loading stage unit 3.
又，關於基板SB亦與版PP同樣地保持於上載台部3。即，利用搬運部2之基板用梭23R將基板SB自圖1之右手側經由搬運空間搬運至上載台部3之正下方位置後，上載台部3之吸附板34下降而吸附保持基板SB。相反地，若在基板用梭23R位於上載台部3之正下方位置之狀態下吸附基板SB之上載台部3之吸附板34解除吸附，則將基板SB移載至搬運部2。藉此，在搬運部2與上載台部3之間進行基板SB之交接。 Further, the substrate SB is also held by the loading stage unit 3 in the same manner as the plate PP. In other words, the substrate SB is transported from the right hand side of the transport unit 2 to the position immediately below the uploading unit 3 via the substrate shuttle shuttle 23R, and then the suction plate 34 of the loading table unit 3 is lowered to suck and hold the substrate SB. On the other hand, when the adsorption plate 34 of the loading table portion 3 of the adsorption substrate SB is released from the state in which the substrate shuttle 23R is located immediately below the loading table portion 3, the substrate SB is transferred to the transport portion 2. Thereby, the transfer of the substrate SB is performed between the conveyance unit 2 and the loading stage unit 3.
在上載台部3之鉛直方向之下方(以下稱為「鉛直下方」或「-Z」方向)，石材板1之上表面上配置有對準部4。在該對準部4中，支撐板41係如圖1所示般，以跨越石材板1之凹部之方式，以水平姿勢配置，且固定於石材板1之上表面。又，該支撐板41之上表面上固定有對準載台42。且，對準部4之對準載台42上載置有下載台部5且下載台部5之上表面與上載台部3之吸附板34對向。該下載台部5之上表面可吸附保持橡皮布BL，且藉由控制部6控制對準載台42可高精度地定位下載台部5上之橡皮布BL。 The alignment portion 4 is disposed on the upper surface of the stone board 1 below the vertical direction of the loading table portion 3 (hereinafter referred to as "vertical downward" or "-Z" direction). In the alignment portion 4, as shown in FIG. 1, the support plate 41 is disposed in a horizontal posture so as to straddle the concave portion of the stone board 1, and is fixed to the upper surface of the stone board 1. Further, an alignment stage 42 is fixed to the upper surface of the support plate 41. Further, the registration stage unit 5 is placed on the alignment stage 42 of the alignment unit 4, and the upper surface of the download stage unit 5 faces the adsorption plate 34 of the loading stage unit 3. The upper surface of the downloading table portion 5 can adsorb and hold the blanket BL, and the control unit 6 controls the alignment stage 42 to accurately position the blanket BL on the downloading table portion 5.
對準載台42具有固定於支撐板41上之載台基底421、與配置於載台基底421之鉛直上方且支撐下載台部5之載台頂部422。該等載台基底421及載台頂部422任一者均具有中央部具有開口之框架形狀。又，於該等載台基底421及載台頂部422之間，將具有以鉛直方向Z上延伸之旋轉軸為旋轉中心之旋轉方向、X方向及Y方向之3自由度之例如交叉滾子軸承等之支撐機構423配置於載台頂部422之各角部附 近。又，相對各支撐機構423設置滾珠螺桿機構(圖示省略)，且各滾珠螺桿機構中安裝有載台驅動馬達M41(圖3)。且，藉由使各載台驅動馬達M41根據來自控制部6之馬達控制部63之動作指令作動，一面在對準載台42之中央部設置較大之空間，一面使載台頂部422在水平面內移動。又，使鉛直軸作為旋轉中心旋轉，而可定位下載台部5之吸附板51。另，本實施形態中使用具有空心空間之對準載台42之理由之一係為了利用拍攝部43拍攝形成於保持於下載台部5之上表面之橡皮布BL及保持於上載台部3之下表面之基板SB上之對準標記。 The alignment stage 42 has a stage base 421 fixed to the support plate 41, and a stage top 422 disposed vertically above the stage base 421 and supporting the download stage 5. Each of the stage base 421 and the stage top 422 has a frame shape having an opening at the center. Further, between the stage base 421 and the stage top 422, for example, a cross roller bearing having three degrees of freedom in the rotation direction, the X direction, and the Y direction of the rotation axis extending in the vertical direction Z is used. The supporting mechanism 423 is disposed at each corner of the stage top 422. near. Further, a ball screw mechanism (not shown) is provided to each of the support mechanisms 423, and a stage drive motor M41 (FIG. 3) is attached to each of the ball screw mechanisms. Further, by causing each stage drive motor M41 to operate in accordance with an operation command from the motor control unit 63 of the control unit 6, a large space is provided in the central portion of the alignment stage 42, and the stage top 422 is at the horizontal plane. Move inside. Further, the vertical axis is rotated as a center of rotation, and the suction plate 51 of the downloading table portion 5 can be positioned. Further, in the present embodiment, one of the reasons for using the alignment stage 42 having a hollow space is to capture the blanket BL formed on the upper surface of the downloading table portion 5 and the holding table portion 3 by the imaging unit 43. Alignment marks on the substrate SB of the lower surface.
下載台部5具有吸附板51、柱構件52、載台基底53、及頂升銷部54。載台基底53上，於前後方向Y並列設置有3個左右方向X上延伸之長孔形狀之開口。且，以使該等長孔開口、與對準載台42之中央開口自上方俯視重疊之方式，將載台基底53固定於對準載台42上。又，於上述長孔開口中，游插有拍攝部43之一部分。又，自載台基底53之上表面角部於(+Z)直立設置柱構件52，且各頂部支撐吸附板51。 The download stage 5 has an adsorption plate 51, a column member 52, a stage base 53, and a jacking pin portion 54. On the stage base 53, an opening having a long hole shape extending in three left-right directions X is arranged in parallel in the front-rear direction Y. Further, the stage base 53 is fixed to the alignment stage 42 such that the long hole openings and the central opening of the alignment stage 42 overlap each other in a plan view from above. Further, a part of the imaging unit 43 is inserted into the long hole opening. Further, the column members 52 are erected at the upper surface corner of the stage base 53 at (+Z), and each of the top supports the adsorption plate 51.
該吸附板51係以例如鋁合金等之金屬板構成。吸附板51之上表面上設置有吸附機構(圖示省略)。對吸附機構連接正壓供給配管(圖示省略)之一端，且將另一端連接於加壓用歧管。再者，於各正壓供給配管之中間部介插有加壓閥門V51(圖3)。對該加壓用歧管常時供給有藉由以調節器將自工廠之用電供給之加壓氣體進行調壓而得之一定壓力之 氣體。因此，當根據來自控制部6之閥門控制部64之動作指令而選擇性地打開所需之加壓閥門V51時，對與該選擇之加壓閥門V51連接之吸附機構供給經調壓之加壓氣體。 The adsorption plate 51 is made of a metal plate such as an aluminum alloy. An adsorption mechanism (not shown) is provided on the upper surface of the adsorption plate 51. One end of the positive pressure supply pipe (not shown) is connected to the adsorption mechanism, and the other end is connected to the pressure manifold. Further, a pressurizing valve V51 (Fig. 3) is inserted into the intermediate portion of each positive pressure supply pipe. The pressure manifold is constantly supplied with a certain pressure obtained by regulating the pressurized gas supplied from the factory with a regulator. gas. Therefore, when the required pressurizing valve V51 is selectively opened in accordance with the operation command from the valve control unit 64 of the control unit 6, the pressurizing mechanism connected to the selected pressurizing valve V51 is supplied with the pressure-regulating pressurization. gas.
又，相對吸附機構之一部分不僅選擇供給加壓氣體，亦可進行選擇性之負壓供給。即，對特定之吸附機構之各者連接負壓供給配管(圖示省略)之一端，且將另一端連接於負壓用歧管。再者，於各負壓供給配管之中間部中介插有吸附閥門V52(圖3)。該負壓用歧管中，經由調節器連接有負壓供給源，常時供給有特定值之負壓。因此，當根據來自控制部6之閥門控制部64之動作指令而選擇性地打開所需之吸附閥門V52時，對與該選擇之吸附閥門V52連接之吸附機構供給經調壓之負壓。 Further, a part of the adsorption mechanism is not only selected to supply the pressurized gas, but also a selective negative pressure supply. That is, one end of the negative pressure supply pipe (not shown) is connected to each of the specific adsorption mechanisms, and the other end is connected to the negative pressure manifold. Further, an adsorption valve V52 (FIG. 3) is interposed in the intermediate portion of each of the negative pressure supply pipes. In the manifold for negative pressure, a negative pressure supply source is connected via a regulator, and a negative pressure having a specific value is always supplied. Therefore, when the required adsorption valve V52 is selectively opened in accordance with the operation command from the valve control unit 64 of the control unit 6, the pressure-adjusting negative pressure is supplied to the adsorption mechanism connected to the selected adsorption valve V52.
如此般在本實施形態中，可藉由閥門V51、V52之開關控制使橡皮布BL局部或全面地吸附於吸附板51上，或在吸附板51與橡皮布BL之間局部供給氣體使橡皮布BL局部膨脹而按壓於保持於上載台部3之版PP或基板SB。 In this embodiment, the blanket BL can be partially or completely adsorbed on the adsorption plate 51 by the switch control of the valves V51 and V52, or the gas can be locally supplied between the adsorption plate 51 and the blanket BL. The BL is partially inflated and pressed against the plate PP or the substrate SB held by the loading table portion 3.
在頂升銷部54中，於吸附板51與載台基底53之間升降自由地設置有升降板541。該升降板541上，於複數個部位形成有缺口部從而防止與拍攝部43之干擾。又，自升降板541之上表面於鉛直上方直立設置有複數個頂升銷542。另一方面，於升降板541之下表面，連接有銷升降缸CL51(圖3)。且，藉由控制部6之閥門控制部64切換連接於銷升降缸CL51之閥門之開關，使銷升降缸CL51作動從而使升降板541升降。其結果，所有的頂升銷542相對於吸附板51之 上表面即吸附面進退移動。例如，藉由使頂升銷542自吸附板51之上表面向(+Z)方向突出，可利用未圖示之橡皮布搬運機械裝置將橡皮布BL載置於頂升銷542之頂部。且，繼橡皮布BL之載置之後，使頂升銷542自吸附板51之上表面於(-Z)方向後退，藉此將橡皮布BL移載至吸附板51之上表面。其後，如後所述般，在適當之時機，利用配置於吸附板51之附近之橡皮布厚度計測感測器SN51(圖3)計測該橡皮布BL之厚度。 In the jacking pin portion 54, a lifting plate 541 is provided between the suction plate 51 and the stage base 53 so as to be lifted and lowered. A cutout portion is formed in the plurality of portions of the lift plate 541 to prevent interference with the imaging portion 43. Further, a plurality of jacking pins 542 are erected from the upper surface of the lift plate 541 vertically upward. On the other hand, a pin lifting cylinder CL51 (Fig. 3) is attached to the lower surface of the lifting plate 541. Further, the valve control unit 64 of the control unit 6 switches the switch connected to the valve of the pin lifting cylinder CL51, and the pin lifting cylinder CL51 is actuated to raise and lower the lifting plate 541. As a result, all of the jacking pins 542 are opposed to the suction plate 51. The upper surface, that is, the adsorption surface moves forward and backward. For example, by causing the jacking pin 542 to protrude from the upper surface of the suction plate 51 in the (+Z) direction, the blanket BL can be placed on top of the jacking pin 542 by a blanket conveying mechanism (not shown). Then, after the blanket BL is placed, the jacking pin 542 is retracted from the upper surface of the suction plate 51 in the (-Z) direction, whereby the blanket BL is transferred to the upper surface of the suction plate 51. Thereafter, as will be described later, the thickness of the blanket BL is measured by a blanket thickness measuring sensor SN51 (Fig. 3) disposed in the vicinity of the adsorption plate 51 at an appropriate timing.
如上所述，在本實施形態中，上載台部3與下載台部5係在鉛直方向Z上相互對向配置。且，於該等之間，分別配置有自上方推壓載置於下載台部5上之橡皮布BL之推壓部7、與進行版PP、基板SB及橡皮布BL之預對準之預對準部8。 As described above, in the present embodiment, the loading stage unit 3 and the download stage unit 5 are arranged to face each other in the vertical direction Z. Further, between these, the pressing portion 7 of the blanket BL placed on the downloading table portion 5 from above is preliminarily arranged with the pre-alignment of the plate PP, the substrate SB, and the blanket BL. Aligning portion 8.
推壓部7可藉由利用切換機構(圖示省略)於鉛直方向Z升降設置於吸附板51之鉛直上方側之推壓構件71而切換為2個狀態。即，若切換機構使推壓構件71下降，則成為由推壓部7推壓吸附板51上之橡皮布BL之狀態(橡皮布推壓狀態)。另一方面，若切換機構使推壓構件71上升，則成為推壓部7自橡皮布BL離開而解除橡皮布BL之推壓之狀態(橡皮布推壓解除狀態)。 The pressing portion 7 can be switched to two states by raising and lowering the pressing member 71 provided on the vertical upper side of the suction plate 51 in the vertical direction Z by a switching mechanism (not shown). In other words, when the switching mechanism lowers the pressing member 71, the pressing portion 7 presses the blanket BL on the suction plate 51 (the blanket pressing state). On the other hand, when the switching mechanism raises the pressing member 71, the pressing portion 7 is separated from the blanket BL, and the pressing of the blanket BL is released (the blanket pressing release state).
在預對準部8中，在鉛直方向Z上以2段積層配置有預對準上部81及預對準下部82。該等之中，預對準上部81配置於較預對準下部82更靠向鉛直上方側，且與橡皮布BL之密著前，在位置XP23上對準利用版用梭23L保持之版PP及利 用基板用梭23R保持之基板SB。另一方面，預對準下部82在與版PP或基板SB之密著前，對準載置於下載台部5之吸附板51之橡皮布BL。另，預對準上部81、與預對準下部82基本具有相同之構成。因此，以下，就預對準上部81之構成進行說明，對於預對準下部82，標註相同或相當之符號而省略構成說明。 In the pre-alignment portion 8, a pre-aligned upper portion 81 and a pre-aligned lower portion 82 are laminated in two stages in the vertical direction Z. Among these, the pre-alignment upper portion 81 is disposed on the upper side of the pre-alignment lower portion 82, and is aligned with the blanket BL, and is aligned with the version PP held by the plate shuttle 23L at the position XP23. Benefit The substrate SB held by the substrate shuttle 23R. On the other hand, the pre-alignment lower portion 82 is aligned with the blanket BL placed on the adsorption plate 51 of the download table portion 5 before being adhered to the plate PP or the substrate SB. Further, the pre-aligned upper portion 81 has substantially the same configuration as the pre-aligned lower portion 82. Therefore, the configuration of the pre-alignment upper portion 81 will be described below, and the same or corresponding reference numerals will be given to the pre-alignment lower portion 82, and the description of the configuration will be omitted.
在預對準上部81中，相對框架狀之框架構造體811移動自由地設置有4個上導向器812。即，框架構造體811為組合相互於左右方向X分離且延伸設置於前後方向Y之2個水平框架、與相互於前後方向Y分離且延伸設置於左右方向X之2個水平框架者。且，如圖2所示，相對延伸設置於前後方向Y之2個水平板中之左側水平板，在其中央部利用省略圖示之滾珠螺桿機構於左右方向X移動自由地設置有上導向器812。且，藉由連結於該滾珠螺桿機構之驅動馬達M81(圖3)根據來自控制部6之馬達控制部63之動作指令作動，上導向器812在左右方向X移動。又，相對右側水平板，亦與上述相同，以使上導向器812利用驅動馬達M81在左右方向X移動之方式構成。再者，相對延伸設置於前後方向Y之2個水平板之各者，亦與上述相同，以使上導向器812利用驅動馬達M81在左右方向X移動之方式構成。如此，4個上導向器812在位置XP23之鉛直下方位置包圍版PP或基板SB，且各上導向器812獨立並可相對版PP等鄰近或遠離。因此，藉由控制各上導向器812之移動量可使版PP及基板SB在梭之指針上水平移動或旋轉而對準。 In the pre-alignment upper portion 81, four upper guides 812 are movably provided with respect to the frame-shaped frame structure 811. In other words, the frame structure 811 is a combination of two horizontal frames that are separated from each other in the left-right direction X and extended in the front-rear direction Y, and two horizontal frames that are separated from each other in the front-rear direction Y and extend in the left-right direction X. Further, as shown in FIG. 2, the left horizontal plate is extended to the left horizontal plate provided in the front-rear direction Y, and the upper guide is movably provided in the center portion by the ball screw mechanism (not shown) in the left-right direction X. 812. Further, the drive motor M81 (FIG. 3) connected to the ball screw mechanism is actuated by the operation command from the motor control unit 63 of the control unit 6, and the upper guide 812 is moved in the left-right direction X. Further, similarly to the above, the upper guide 812 is configured to move the upper guide 812 in the right and left direction X by the drive motor M81. Further, in the same manner as described above, each of the two horizontal plates extending in the front-rear direction Y is configured such that the upper guide 812 is moved in the left-right direction X by the drive motor M81. Thus, the four upper guides 812 surround the plate PP or the substrate SB at a position directly below the position XP23, and the upper guides 812 are independent and can be adjacent or distant from the plate PP or the like. Therefore, by controlling the amount of movement of each of the upper guides 812, the plate PP and the substrate SB can be aligned by horizontally moving or rotating on the pointer of the shuttle.
又，在本實施形態中，如後說明般，將橡皮布BL上之圖案層轉印於基板SB後，將橡皮布BL自基板SB剝離，在該剝離階段會產生靜電。又，利用版PP將橡皮布BL上之塗佈層圖案化後，在將橡皮布BL自版PP剝離時，亦會產生靜電。因此，在本實施形態中，為除去靜電，設置有除電部9。該除電部9具有自(+X)側向以上載台部3與下載台部5包夾之空間照射離子之電離器91。 Further, in the present embodiment, as will be described later, after the pattern layer on the blanket BL is transferred onto the substrate SB, the blanket BL is peeled off from the substrate SB, and static electricity is generated in the peeling stage. Further, after the coating layer on the blanket BL is patterned by the plate PP, static electricity is generated also when the blanket BL is peeled off from the plate PP. Therefore, in the present embodiment, the static eliminating portion 9 is provided to remove static electricity. The neutralization unit 9 has an ionizer 91 that irradiates ions from the (+X) side to the space surrounded by the loading stage 3 and the download stage unit 5.
控制部6具有CPU(Central Processing Unit：中央處理單元)61、記憶體62、馬達控制部63、閥門控制部64、圖像處理部65及顯示/操作部66，CPU61根據預先記憶於記憶體62之程式控制裝置各部，如圖4所示般執行圖案化處理及轉印處理。 The control unit 6 includes a CPU (Central Processing Unit) 61, a memory 62, a motor control unit 63, a valve control unit 64, an image processing unit 65, and a display/operation unit 66. The CPU 61 is previously stored in the memory 62. Each part of the program control device performs patterning processing and transfer processing as shown in FIG.
圖4係顯示圖1之印刷裝置之整體動作之流程圖。在該印刷裝置100之初始狀態下，版用梭23L及基板用梭23R分別定位於中間位置XP22、XP24。且，與利用版洗淨裝置之版搬運機械裝置(圖示省略)之版PP之搬運動作同步執行版PP之投入工序(步驟S1)，以及與基板洗淨裝置之基板搬運機械裝置(圖示省略)之基板SB之搬運動作同步執行基板SB之投入工序(步驟S2)。另，由於採用版用梭23L及基板用梭23R一體地在左右方向X移動之搬運構造，故雖在進行版PP之搬入(步驟S1)後，進行基板SB之搬入(步驟S2)，但亦可替換兩者之順序。 4 is a flow chart showing the overall operation of the printing apparatus of FIG. 1. In the initial state of the printing apparatus 100, the plate shuttle 23L and the substrate shuttle 23R are respectively positioned at the intermediate positions XP22 and XP24. In addition, the input process of the PP is performed in synchronization with the transfer operation of the plate PP of the plate transporting device (not shown) by the plate cleaning device (step S1), and the substrate transfer mechanism with the substrate cleaning device (illustration The transfer operation of the substrate SB (omitted) is performed in synchronization with the input process of the substrate SB (step S2). In addition, since the plate shuttle 23L and the substrate shuttle 23R are integrally moved in the left-right direction X, the substrate SB is carried in after the plate PP is carried in (step S1) (step S2). The order of the two can be replaced.
如此，在本實施形態中，在執行圖案化處理前，不僅版PP，亦準備基板SB，且如後詳述般，連續執行圖案化處 理及轉印處理。藉此，可縮短直至將在敷層橡皮布BL上圖案化之塗佈層轉印於基板SB為止之時間間隔，從而執行穩定之處理。 As described above, in the present embodiment, before the patterning process is performed, not only the plate PP but also the substrate SB is prepared, and the patterning portion is continuously executed as will be described in detail later. Management and transfer processing. Thereby, the time interval until the coating layer patterned on the blanket blanket BL is transferred to the substrate SB can be shortened, thereby performing stable processing.
在此後之步驟S3中，梭水平驅動馬達M21使旋轉軸旋轉，且使梭保持板22在(-X)方向移動。藉此，版用梭23L移動至版吸附位置XP23而定位。且，版用梭升降馬達M22L使旋轉軸旋轉，且使升降板231在下方向(-Z)移動。藉此，在保持被版用梭23L支撐之狀態下版PP移動至較搬運位置更低之預對準位置而定位。 In the subsequent step S3, the shuttle horizontal drive motor M21 rotates the rotary shaft and moves the shuttle holding plate 22 in the (-X) direction. Thereby, the plate shuttle 23L is moved to the plate suction position XP23 to be positioned. Further, the plate lift motor M22L rotates the rotary shaft and moves the lift plate 231 in the downward direction (-Z). Thereby, the plate PP is moved to a pre-alignment position lower than the conveyance position while being held by the plate shuttle 23L.
接著，上導向器驅動馬達M81作動而上導向器812移動，各上導向器812與支撐於版用梭23L之版PP之端面抵接而在預先設定之水平位置上定位版PP。其後，各上導向器驅動馬達M81於反方向作動，從而各上導向器812自版PP分離。如此，版PP之預對準處理完成後，載台升降馬達M31使旋轉軸在特定方向旋轉，並使吸附板34在下方向(-Z)下降而與版PP之上表面抵接。此後，閥門V31打開，藉此，利用上載台用之吸附機構將版PP吸附於吸附板34。 Next, the upper guide driving motor M81 is actuated and the upper guide 812 is moved, and each of the upper guides 812 abuts against the end surface of the plate PP supported by the plate shuttle 23L to position the plate PP at a predetermined horizontal position. Thereafter, each of the upper guide drive motors M81 is actuated in the reverse direction, whereby the upper guides 812 are separated from the plate PP. Thus, after the pre-alignment processing of the plate PP is completed, the stage lifting motor M31 rotates the rotating shaft in a specific direction, and the suction plate 34 is lowered in the downward direction (-Z) to abut against the upper surface of the plate PP. Thereafter, the valve V31 is opened, whereby the plate PP is adsorbed to the adsorption plate 34 by the adsorption mechanism for the loading table.
如此版PP之吸附完成後，載台升降馬達M31於反方向旋轉，吸附板34在吸附保持版PP之狀態下，使版PP在鉛直上方上升並移動至版吸附位置XP23之鉛直上方位置。且，版用梭升降馬達M22L使旋轉軸旋轉，使升降板231在鉛直上方移動，從而將版用梭23L自預對準位置移動至搬運位置、即版吸附位置XP23而定位。其後，梭水平驅動馬達M21使旋轉軸旋轉而使梭保持板22在(+X)方向移動，且將 已為空之版用梭23L定位於中間位置XP22。 After the adsorption of the PP of this version is completed, the stage lifting motor M31 is rotated in the reverse direction, and the adsorption plate 34 is raised in the vertical direction in the state in which the holding plate PP is adsorbed and moved to the position directly above the plate adsorption position XP23. Further, the plate lift motor M22L rotates the rotary shaft to move the lift plate 231 vertically upward, thereby moving the plate shuttle 23L from the pre-alignment position to the conveyance position, that is, the plate suction position XP23. Thereafter, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (+X) direction, and The empty version of the shuttle 23L is positioned at the intermediate position XP22.
在此後之步驟S4中，載台驅動馬達M41作動而使對準載台42移動至初始位置。藉此，每次開始為相同位置。此後，銷升降缸CL51動作而使升降板541上升，並使頂升銷542自吸附板51之上表面向鉛直上方突出。如此，若橡皮布BL之投入準備完成，則省略圖示之橡皮布搬運機械裝置，出入裝置100而將橡皮布BL載置於頂升銷542之頂部後，自裝置100撤離。接著，銷升降缸CL51動作而使升降板541下降。藉此，頂升銷542在支撐橡皮布BL之狀態下下降而將橡皮布BL載置於吸附板51。於是，下導向器驅動馬達M82作動，從而下導向器822移動，且各下導向器822與支撐於吸附板51之橡皮布BL之端面抵接而將橡皮布BL定位於預先設定之水平位置。 In the next step S4, the stage drive motor M41 is actuated to move the alignment stage 42 to the initial position. Thereby, each time starts at the same position. Thereafter, the pin lifting cylinder CL51 operates to raise the lift plate 541, and the jacking pin 542 protrudes vertically upward from the upper surface of the suction plate 51. As described above, when the preparation of the blanket BL is completed, the blanket conveyance mechanism shown in the drawing is omitted, and the entry and exit device 100 is placed on the top of the jacking pin 542, and then the device 100 is evacuated. Next, the pin lifting cylinder CL51 operates to lower the lifting plate 541. Thereby, the jacking pin 542 is lowered while supporting the blanket BL, and the blanket BL is placed on the suction plate 51. Then, the lower guide driving motor M82 is actuated, whereby the lower guide 822 is moved, and each of the lower guides 822 abuts against the end surface of the blanket BL supported by the suction plate 51 to position the blanket BL at a predetermined horizontal position.
如此橡皮布BL之預對準處理完成後，吸附閥門V52打開，藉此相對下載台用之吸附機構供給經調壓之負壓而將橡皮布BL吸附於吸附板51。再者，各下導向器驅動馬達M82使旋轉軸於反方向旋轉，而使各下導向器822自橡皮布BL分離。藉此，圖案化處理之準備完成。 After the pre-alignment processing of the blanket BL is completed, the adsorption valve V52 is opened, whereby the pressure-adjusting negative pressure is supplied to the adsorption mechanism for the downloading station to adsorb the blanket BL to the adsorption plate 51. Further, each of the lower guide driving motors M82 rotates the rotating shaft in the reverse direction to separate the respective lower guides 822 from the blanket BL. Thereby, the preparation of the patterning process is completed.
在此後之步驟S5中，感測器水平驅動缸CL52(圖3)動作而將橡皮布厚度計測感測器SN51定位於橡皮布BL之右端部之正上方位置。且，橡皮布厚度計測感測器SN51將與橡皮布BL之厚度關連之資訊輸出至控制部6，藉此計測橡皮布BL之厚度。其後，上述感測器水平驅動缸CL52於反方向動作而使橡皮布厚度計測感測器SN51自吸附板51撤離。 In the subsequent step S5, the sensor horizontal drive cylinder CL52 (Fig. 3) operates to position the blanket thickness measuring sensor SN51 directly above the right end of the blanket BL. Further, the blanket thickness measuring sensor SN51 outputs information relating to the thickness of the blanket BL to the control unit 6, thereby measuring the thickness of the blanket BL. Thereafter, the sensor horizontal drive cylinder CL52 is operated in the reverse direction to evacuate the blanket thickness measuring sensor SN51 from the adsorption plate 51.
接著，第1載台升降馬達M31使旋轉軸在特定方向旋轉，使吸附板34在下方向(-Z)下降而使版PP移動至橡皮布BL之附近。再者，第2載台升降馬達M32使旋轉軸旋轉，使吸附板34以較窄之間距升降而正確地調整版PP與橡皮布BL在鉛直方向Z之間隔、即間隙量。另，該間隙量係基於版PP及橡皮布BL之厚度計測結果由控制部6決定。 Next, the first stage elevating motor M31 rotates the rotating shaft in a specific direction, and the suction plate 34 is lowered in the downward direction (-Z) to move the plate PP to the vicinity of the blanket BL. Further, the second stage elevating motor M32 rotates the rotating shaft, and the suction plate 34 is lifted and lowered at a narrow distance to accurately adjust the interval between the plate PP and the blanket BL in the vertical direction Z, that is, the amount of the gap. Further, the amount of the gap is determined by the control unit 6 based on the measurement result of the thickness of the plate PP and the blanket BL.
接著，使推壓部7之推壓構件71下降而跨全周以推壓構件71推壓橡皮布BL之周緣部。此後，閥門V51、V52動作，在吸附板51與橡皮布BL之間局部供給氣體而使橡皮布BL局部膨脹。將該浮起部分按壓於保持於上載台部3之版PP。其結果，橡皮布BL之中央部密著於版PP而預先形成於版PP之下表面之圖案(圖示省略)與預先塗佈於橡皮布BL之上表面之塗佈層抵接並將該塗佈層圖案化而形成圖案層。 Then, the pressing member 71 of the pressing portion 7 is lowered, and the peripheral portion of the blanket BL is pressed by the pressing member 71 across the entire circumference. Thereafter, the valves V51 and V52 operate to locally supply gas between the suction plate 51 and the blanket BL to partially expand the blanket BL. The floating portion is pressed against the plate PP held by the loading table portion 3. As a result, the central portion of the blanket BL is adhered to the plate PP, and a pattern (not shown) formed in advance on the lower surface of the plate PP is brought into contact with the coating layer previously applied to the upper surface of the blanket BL. The coating layer is patterned to form a pattern layer.
在此後之步驟S6中，第2載台升降馬達M32使旋轉軸旋轉，從而吸附板34上升而使版PP自橡皮布BL剝離。又，與為進行剝離處理使版PP上升並行，適時切換閥門V51、V52之開關狀態，對橡皮布BL賦與負壓而牽引至吸附板51側。其後，第1載台升降馬達M31使旋轉軸旋轉，使吸附板34上升而將版PP定位於與電離器91大致相同高度之除電位置。又，使推壓部7之推壓構件71上升而解除橡皮布BL之推壓。此後，電離器91作動而除去上述版剝離處理時產生之靜電。該除電處理完成後，第1載台升降馬達M31使旋轉軸旋轉，在吸附保持版PP之狀態下，吸附板34上升至 初始位置(較版吸附位置XP23更高之位置)。 In the next step S6, the second stage elevating motor M32 rotates the rotating shaft, and the suction plate 34 rises to peel the plate PP from the blanket BL. Further, in parallel with the rise of the plate PP in order to perform the peeling process, the switching states of the valves V51 and V52 are switched in time, and the negative pressure is applied to the blanket BL to be pulled to the suction plate 51 side. Thereafter, the first stage elevating motor M31 rotates the rotating shaft, raises the suction plate 34, and positions the plate PP at a neutralization position substantially the same height as the ionizer 91. Further, the pressing member 71 of the pressing portion 7 is raised to release the pressing of the blanket BL. Thereafter, the ionizer 91 is actuated to remove static electricity generated during the above-described plate peeling treatment. After the completion of the static elimination process, the first stage elevating motor M31 rotates the rotating shaft, and the adsorption plate 34 rises to the state in which the holding plate PP is adsorbed. The initial position (higher than the plate adsorption position XP23).
在此後之步驟S7中，旋轉致動器RA2、RA2動作，使版用指針232、232旋轉180°而自原點位置定位於反轉位置。藉此，指針姿勢自未使用姿勢切換為使用完姿勢，從而使用完之版PP之接收準備完成。且，梭水平驅動馬達M21使旋轉軸旋轉，而使梭保持板22在(-X)方向移動。藉此，版用梭23L移動至版吸附位置XP23而定位。 In the subsequent step S7, the rotary actuators RA2, RA2 operate to rotate the plate pointers 232, 232 by 180 and are positioned at the reverse position from the origin position. Thereby, the pointer posture is switched from the unused posture to the used posture, and the reception preparation of the used version PP is completed. Further, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (-X) direction. Thereby, the plate shuttle 23L is moved to the plate suction position XP23 to be positioned.
另一方面，第1載台升降馬達M31使旋轉軸旋轉，在吸附保持版PP之狀態下，吸附板34向版用梭23L之指針232、232下降而使版PP位於指針232、232上之後，閥門V31、V32關閉，藉此，解除利用吸附板34之吸附機構之版PP之吸附而搬運位置上之版PP之交接完成。且，第1載台升降馬達M31使旋轉軸逆旋轉，而使吸附板34上升至初始位置。其後，梭水平驅動馬達M21使旋轉軸旋轉，而使梭保持板22在(+X)方向移動。藉此，版用梭23L在保持使用完之版PP之狀態下移動至中間位置XP22而定位。 On the other hand, the first stage elevating motor M31 rotates the rotating shaft, and in the state in which the holding plate PP is sucked, the suction plate 34 is lowered toward the hands 232 and 232 of the plate shuttle 23L, and the plate PP is placed on the hands 232 and 232. When the valves V31 and V32 are closed, the transfer of the plate PP at the transport position by the adsorption of the plate PP of the adsorption mechanism of the adsorption plate 34 is released. Further, the first stage elevating motor M31 reversely rotates the rotating shaft to raise the suction plate 34 to the initial position. Thereafter, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (+X) direction. Thereby, the plate shuttle 23L is moved to the intermediate position XP22 while being held in the state of using the used plate PP.
在此後之步驟S8中，梭水平驅動馬達M21使旋轉軸旋轉，而使梭保持板22在(+X)方向移動。藉此，保持處理前之基板SB之基板用梭23R移動至基板吸附位置XP23而定位。且，與版PP之預對準處理及利用吸附板34之版PP之吸附處理同樣地執行基板SB之預對準處理及基板SB之吸附處理。其後，若檢測出基板SB之吸附，則載台升降馬達M31使旋轉軸旋轉，在吸附保持基板SB之狀態下使吸附板34在鉛直上方上升且使基板SB移動至較基板吸附位置 XP23更高之位置。且，基板用梭升降馬達M22R使旋轉軸旋轉，使基板用梭23R自預對準位置移動至搬運位置而定位。其後，梭水平驅動馬達M21使旋轉軸旋轉而使梭保持板22在(-X)方向移動，從而將已為空之基板用梭23R定位於中間位置XP24。 In the subsequent step S8, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (+X) direction. Thereby, the substrate shuttle 23R holding the substrate SB before the process is moved to the substrate suction position XP23 and positioned. Further, the pre-alignment process of the substrate SB and the adsorption process of the substrate SB are performed in the same manner as the pre-alignment process of the plate PP and the adsorption process of the plate PP of the adsorption plate 34. When the adsorption of the substrate SB is detected, the stage elevating motor M31 rotates the rotating shaft, and the adsorption plate 34 is raised vertically upward while the substrate SB is adsorbed and held, and the substrate SB is moved to the substrate adsorption position. XP23 is higher. Further, the substrate lifter motor M22R rotates the rotary shaft to move the substrate shuttle 23R from the pre-aligned position to the transport position. Thereafter, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (-X) direction, thereby positioning the already empty substrate shuttle 23R at the intermediate position XP24.
在此後之步驟S9中，計測橡皮布厚度，進而執行精密對準後，執行轉印處理。即，與圖案化處理中之厚度計測同樣地計測橡皮布BL之厚度。另，如此般不僅即將圖案化前，在即將轉印前亦計測橡皮布BL之厚度之主要理由係因為由於橡皮布BL之一部分膨脹而橡皮布BL之厚度經時變化，且藉由計測在即將轉印前之橡皮布厚度可進行高精度之轉印處理。 In the subsequent step S9, the thickness of the blanket is measured, and after the precise alignment is performed, the transfer process is performed. That is, the thickness of the blanket BL is measured in the same manner as the thickness measurement in the patterning process. In addition, the main reason for measuring the thickness of the blanket BL immediately before the transfer is not so much because the thickness of the blanket BL changes over time due to the expansion of one portion of the blanket BL, and the measurement is about to be performed soon. The thickness of the blanket before transfer can be processed with high precision.
接著，第1載台升降馬達M31使旋轉軸在特定方向旋轉，使吸附板34在下方向(-Z)下降而使基板SB移動至橡皮布BL之附近。再者，第2載台升降馬達M32使旋轉軸旋轉，使吸附板34以較窄之間距升降而正確地調整基板SB與橡皮布BL在鉛直方向Z之間隔、即間隙量。關於該間隙量，係基於基板SB及橡皮布BL之厚度計測結果由控制部6決定。且，與圖案化(步驟S5)同樣地進行利用推壓構件71之橡皮布BL之周緣部之推壓。 Next, the first stage elevating motor M31 rotates the rotating shaft in a specific direction, and the suction plate 34 is lowered in the downward direction (-Z) to move the substrate SB to the vicinity of the blanket BL. In addition, the second stage elevating motor M32 rotates the rotating shaft, and the suction plate 34 is vertically moved up and down to accurately adjust the interval between the substrate SB and the blanket BL in the vertical direction Z, that is, the amount of the gap. The amount of the gap is determined by the control unit 6 based on the measurement result of the thickness of the substrate SB and the blanket BL. In the same manner as the patterning (step S5), the pressing of the peripheral edge portion of the blanket BL by the pressing member 71 is performed.
如此，基板SB與橡皮布BL任一者均預對準，且以適合轉印處理之間隔離開而定位，為將形成於橡皮布BL上之圖案層正確地轉印於基板SB，必須將兩者精密地位置對準。因此，在本實施形態中，拍攝部43拍攝於橡皮布BL上圖案 化之對準標記以及形成於基板SB上之對準標記，且將該等之圖像輸出至控制部6之圖像處理部65。且，基於該等之圖像，控制部6求出用以相對基板SB將橡皮布BL位置對準之控制量，進而製作對準部4之載台驅動馬達M41之動作指令。且，載台驅動馬達M41根據上述控制指令作動而使吸附板51在水平方向移動且繞著於鉛直方向Z延伸之虛擬旋轉軸旋轉從而將橡皮布BL與基板SB精密地位置對準(對準處理)。 Thus, the substrate SB and the blanket BL are both pre-aligned and positioned to be separated from each other by the suitable transfer process, and in order to correctly transfer the pattern layer formed on the blanket BL to the substrate SB, two must be The position is precisely aligned. Therefore, in the present embodiment, the imaging unit 43 captures the pattern on the blanket BL. The alignment marks and the alignment marks formed on the substrate SB are output to the image processing unit 65 of the control unit 6. Then, based on the images, the control unit 6 obtains a control amount for aligning the blanket BL with respect to the substrate SB, and further creates an operation command of the stage drive motor M41 of the alignment unit 4. Further, the stage driving motor M41 is moved in the horizontal direction according to the above-described control command, and rotates around the virtual rotating shaft extending in the vertical direction Z to precisely position the blanket BL and the substrate SB (aligned) deal with).
且，閥門V51、V52動作，在吸附板51與橡皮布BL之間局部供給氣體而使橡皮布BL局部膨脹。將該浮起部分按壓於保持於上載台部3之基板SB。其結果，橡皮布BL密著於基板SB。藉此，橡皮布BL側之圖案層一方面與基板SB之下表面之圖案精密地位置對準，並轉印於基板SB。 Further, the valves V51 and V52 operate to locally supply gas between the suction plate 51 and the blanket BL to partially expand the blanket BL. The floating portion is pressed against the substrate SB held by the loading table portion 3. As a result, the blanket BL is adhered to the substrate SB. Thereby, the pattern layer on the side of the blanket BL is precisely aligned with the pattern of the lower surface of the substrate SB on the one hand, and is transferred onto the substrate SB.
在此後之步驟S10中，與版剝離(步驟S6)同樣地執行基板SB自橡皮布BL之剝離、基板SB向除電位置之定位、利用推壓構件71之橡皮布BL之推壓解除、及除電。其後，第1載台升降馬達M31使旋轉軸旋轉，在吸附保持基板SB之狀態下，吸附板34上升至初始位置(較搬運位置更高之位置)。 In the subsequent step S10, the peeling of the substrate SB from the blanket BL, the positioning of the substrate SB to the static eliminating position, the pressing of the blanket BL by the pressing member 71, and the neutralization are performed in the same manner as the plate peeling (step S6). . Thereafter, the first stage elevating motor M31 rotates the rotating shaft, and in a state where the holding substrate SB is sucked and held, the suction plate 34 is raised to the initial position (a position higher than the carrying position).
在此後之步驟S11中，梭水平驅動馬達M21使旋轉軸旋轉，而使梭保持板22在(+X)方向移動。藉此，基板用梭23R移動至基板吸附位置XP23而定位。另一方面，第1載台升降馬達M31使旋轉軸旋轉，在吸附保持基板SB之狀態下使吸附板34向基板用梭23R之指針232、232下降。其 後，閥門V31關閉，藉此解除利用吸附機構之基板SB之吸附。且，第1載台升降馬達M31使旋轉軸旋轉，而使吸附板34上升至初始位置。其後，梭水平驅動馬達M21使旋轉軸旋轉，使梭保持板22在(-X)方向移動且在保持該基板SB之狀態下使基板用梭23R移動至中間位置XP24而定位。 In the subsequent step S11, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (+X) direction. Thereby, the substrate shuttle 23R is moved to the substrate suction position XP23 to be positioned. On the other hand, the first stage elevating motor M31 rotates the rotating shaft, and the suction plate 34 is lowered toward the hands 232 and 232 of the substrate shuttle 23R while the holding substrate SB is being sucked. its Thereafter, the valve V31 is closed, thereby releasing the adsorption of the substrate SB by the adsorption mechanism. Further, the first stage elevating motor M31 rotates the rotating shaft to raise the suction plate 34 to the initial position. Thereafter, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (-X) direction and moves the substrate shuttle 23R to the intermediate position XP24 while positioning the substrate SB.
在此後之步驟S12中，閥門V51、V52動作而解除利用吸附板51之橡皮布BL之吸附。且，銷升降缸CL51動作而使升降板541上升，而將使用完之橡皮布BL自吸附板51頂升至鉛直上方。且，橡皮布搬運機械裝置出入裝置100而自頂升銷542之頂部接收使用完之橡皮布BL，且自裝置100撤離。此後，銷升降缸CL51動作而使升降板541下降，且使頂升銷542較吸附板51在下方向(-Z)下降。 In the next step S12, the valves V51 and V52 operate to release the suction of the blanket BL by the suction plate 51. Further, the pin lifting cylinder CL51 operates to raise the lifting plate 541, and the used blanket BL is lifted from the suction plate 51 to the vertical upper side. Moreover, the blanket handling mechanism enters and exits the apparatus 100 and receives the used blanket BL from the top of the jacking pin 542 and is evacuated from the apparatus 100. Thereafter, the pin lifting cylinder CL51 operates to lower the lifting plate 541, and the jacking pin 542 is lowered in the lower direction (-Z) from the suction plate 51.
在此後之步驟S13中，梭水平驅動馬達M21使旋轉軸旋轉，而使梭保持板22在(+X)方向移動。藉此，版用梭23L移動至版交接位置XP21而定位。此後，版洗淨裝置之版搬運機械裝置自印刷裝置100取出使用完之版PP。如此版PP之搬出完成後，梭水平驅動馬達M21使旋轉軸旋轉而使梭保持板22在(-X)方向移動，且將版用梭23L定位於中間位置XP22。 In the subsequent step S13, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (+X) direction. Thereby, the plate shuttle 23L is moved to the plate transfer position XP21 to be positioned. Thereafter, the plate transport mechanism of the plate cleaning device takes out the used version of the PP from the printing device 100. After the loading of the PP is completed, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (-X) direction, and positions the plate shuttle 23L at the intermediate position XP22.
在此後之步驟S14中，梭水平驅動馬達M21使旋轉軸旋轉，而使梭保持板22在(-X)方向移動。藉此，基板用梭23R移動至基板交接位置XP25而定位。此後，基板洗淨裝置之基板搬運機械裝置自印刷裝置100取出已接受轉印處理之基板SB。如此基板SB之搬出完成後，梭水平驅動馬 達M21使旋轉軸旋轉而使梭保持板22在(+X)方向移動，且將基板用梭23R定位於中間位置XP23。藉此，印刷裝置100回到初始狀態。 In the subsequent step S14, the shuttle horizontal drive motor M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (-X) direction. Thereby, the substrate shuttle 23R is moved to the substrate transfer position XP25 to be positioned. Thereafter, the substrate transfer mechanism of the substrate cleaning apparatus takes out the substrate SB that has undergone the transfer process from the printing apparatus 100. After the substrate SB is removed, the shuttle horizontally drives the horse. The M21 rotates the rotary shaft to move the shuttle holding plate 22 in the (+X) direction, and positions the substrate shuttle 23R at the intermediate position XP23. Thereby, the printing apparatus 100 returns to the initial state.
接著，就如上所述般構成之印刷裝置100之精密對準動作進一步詳細說明。如先前說明般，在本實施形態中，進行保持於下載台部5之上表面之橡皮布BL與保持於上載台部3之下表面之基板SB之精密對準。在該精密對準中，係藉由利用拍攝部43拍攝預先形成於橡皮布BL及基板SB之各者上之對準標記，且基於其拍攝結果使對準載台42動作而進行。此處，假定之基板SB之平面尺寸為350 mm×300 mm左右。另一方面，設為目標之基板SB與橡皮布BL之水平方向之位置對準精度為例如±3 μm左右。 Next, the precise alignment operation of the printing apparatus 100 configured as described above will be described in further detail. As described above, in the present embodiment, the splicing of the blanket BL held on the upper surface of the downloading table portion 5 and the substrate SB held on the lower surface of the loading table portion 3 are precisely aligned. In the precise alignment, the alignment marks previously formed on each of the blanket BL and the substrate SB are imaged by the imaging unit 43, and the alignment stage 42 is operated based on the imaging result. Here, it is assumed that the plane size of the substrate SB is about 350 mm × 300 mm. On the other hand, the positional alignment accuracy of the target substrate SB and the blanket BL in the horizontal direction is, for example, about ±3 μm.
圖5係顯示對準載台之詳細構造之圖。如上所述，對準載台42具備載台基底421及載台頂部422，於該等之間設置有支撐機構423，且利用載台驅動馬達M41驅動支撐機構423，藉此實現載台頂部422相對載台基底421之移動。在圖5中，利用符號423a、423b、423c及423d對分別設置於載台基底421之四角之支撐機構423之各者進行區分。又，對於與該等之各者結合之載台驅動馬達M41，分別標註符號M41a、M41b、M41c及M41d。 Fig. 5 is a view showing a detailed configuration of the alignment stage. As described above, the alignment stage 42 includes the stage base 421 and the stage top 422, and the support mechanism 423 is provided between them, and the support mechanism 423 is driven by the stage drive motor M41, thereby realizing the stage top 422. Movement relative to the stage base 421. In FIG. 5, each of the support mechanisms 423 provided at the four corners of the stage base 421 is distinguished by the symbols 423a, 423b, 423c, and 423d. Moreover, the stage drive motor M41 combined with each of these is denoted by the symbols M41a, M41b, M41c, and M41d, respectively.
藉由載台驅動馬達M41a驅動支撐機構423a，在支撐機構423a之附近，如虛線箭頭所示，支撐機構423a可於Y方向在特定之範圍中移動。又，在各者之附近，如虛線箭頭所示，分別在特定之範圍中，載台驅動馬達M41b可將支 撐機構423b在X方向移動，載台驅動馬達M41c可將支撐機構423c在Y方向移動，載台驅動馬達M41d可將支撐機構423d在X方向移動。 The support mechanism 423a is driven by the stage drive motor M41a. In the vicinity of the support mechanism 423a, the support mechanism 423a is movable in a specific range in the Y direction as indicated by a broken line arrow. Further, in the vicinity of each of them, as indicated by a broken line arrow, the stage driving motor M41b can be supported in a specific range. The support mechanism 423b moves in the X direction, the stage drive motor M41c can move the support mechanism 423c in the Y direction, and the stage drive motor M41d can move the support mechanism 423d in the X direction.
藉由支撐機構423a及423c互相在同方向移動，載台頂部422相對載台基底421在(+Y)方向或(-Y)方向移動。又，藉由支撐機構423b及423d互相在同方向移動，載台頂部422相對載台基底421在(+X)方向或(-X)方向移動。另一方面，藉由該等互相在反方向移動，載台頂部422相對載台基底421繞著鉛直軸旋轉。藉此，實現相對載台基底421之載台頂部422之水平面(XY平面)內之移動與繞著Z軸之旋轉運動。 The support tops 422 are moved in the (+Y) direction or the (-Y) direction with respect to the stage base 421 by the support mechanisms 423a and 423c moving in the same direction. Further, the support mechanisms 423b and 423d move in the same direction with each other, and the stage top 422 moves in the (+X) direction or the (-X) direction with respect to the stage base 421. On the other hand, by moving in the opposite directions, the stage top 422 is rotated about the vertical axis with respect to the stage base 421. Thereby, the movement in the horizontal plane (XY plane) of the stage top 422 of the stage base 421 and the rotational movement about the Z axis are achieved.
圖6係顯示拍攝部之詳細構造之圖。如圖2所示，拍攝部43其上端部延伸至下載台部5之吸附板51之正下方，其前端部中安裝有圖6所示之CCD相機430。另，拍攝部43對應利用吸附板51吸附保持之橡皮布BL之四角而設置有4個部位，該等之拍攝部43之構造任一者均相同。 Fig. 6 is a view showing a detailed configuration of an imaging unit. As shown in Fig. 2, the imaging unit 43 has an upper end portion extending directly below the suction plate 51 of the download table portion 5, and a CCD camera 430 shown in Fig. 6 is attached to the distal end portion thereof. Further, the imaging unit 43 is provided with four locations corresponding to the four corners of the blanket BL sucked and held by the suction plate 51, and any of the configurations of the imaging sections 43 are the same.
吸附板51中對應橡皮布BL之四角之位置上分別嵌入有透明之石英窗52a，經由該石英窗52a可自吸附板51之下方看清橡皮布BL。石英窗52a之下方，配置有CCD相機430。具體而言，石英窗52a之正下方位置上，物鏡435、半鏡面437及CCD拍攝元件之受光面438係以該順序配置。物鏡435之光軸大致與鉛直方向一致，該光軸上分別配置有石英窗52a及受光面438。半鏡面437中，來自光源436之光自側方入射，該光在半鏡面437中反射而向石英窗52a出射， 且經由石英窗52a入射至橡皮布BL。 A transparent quartz window 52a is embedded in each of the four corners of the suction plate 51 corresponding to the blanket BL, and the blanket BL can be seen from below the suction plate 51 via the quartz window 52a. Below the quartz window 52a, a CCD camera 430 is disposed. Specifically, the objective lens 435, the half mirror surface 437, and the light receiving surface 438 of the CCD imaging element are disposed in this order directly below the quartz window 52a. The optical axis of the objective lens 435 substantially coincides with the vertical direction, and the quartz window 52a and the light receiving surface 438 are disposed on the optical axis. In the half mirror 437, light from the light source 436 is incident from the side, and the light is reflected in the half mirror 437 to be emitted toward the quartz window 52a. And it is incident on the blanket BL via the quartz window 52a.
保持於上載台部3之吸附板34之下表面上之基板SB之下表面中面對石英窗52a之位置上，預先形成有特定之第1對準標記AM1。另一方面，保持於下載台部5之吸附板51之上表面上之橡皮布BL之上表面中面對石英窗52a之位置上，預先形成有特定之第2對準標記AM2。即，基板SB與橡皮布BL係以使各自之對準標記形成面互相相對之方式對向配置。藉此，可縮小鉛直方向(Z方向)之兩對準標記間之距離。關於間隙調整後之基板SB與橡皮布BL之間之間隔Gsb，期望使其儘可能地縮小。然而，若考慮裝置各部之尺寸精度或基板SB及橡皮布BL之彎曲等，則為防止基板SB與橡皮布BL之未預定之接觸，不得不以某種程度分離。此處例如將間隔Gsb設為300 μm。 A specific first alignment mark AM1 is formed in advance at a position on the lower surface of the substrate SB held on the lower surface of the adsorption plate 34 of the loading stage 3 facing the quartz window 52a. On the other hand, a specific second alignment mark AM2 is formed in advance at a position on the upper surface of the blanket BL held on the upper surface of the suction plate 51 of the downloading table portion 5 facing the quartz window 52a. That is, the substrate SB and the blanket BL are disposed to face each other such that the alignment mark forming faces thereof face each other. Thereby, the distance between the two alignment marks in the vertical direction (Z direction) can be reduced. Regarding the gap Gsb between the substrate SB and the blanket BL after the gap adjustment, it is desirable to make it as small as possible. However, in consideration of the dimensional accuracy of each part of the apparatus or the bending of the substrate SB and the blanket BL, it is necessary to prevent the substrate SB from being unintended contact with the blanket BL, and it is necessary to separate to some extent. Here, for example, the interval Gsb is set to 300 μm.
橡皮布BL為玻璃板或透明樹脂板之表面上形成有利用例如矽橡膠之較薄之彈性層者，且具有透光性。因此，成為自下載台部5之下方經由石英窗52a及橡皮布BL可同時看清第1對準標記AM1及第2對準標記AM2之狀態。CCD受光面438在同一視野內統一拍攝面對石英窗52a而配置之第1對準標記AM1及第2對準標記AM2。 The blanket BL is formed of a thin elastic layer using, for example, a ruthenium rubber on the surface of a glass plate or a transparent resin plate, and has light transmissivity. Therefore, the state in which the first alignment mark AM1 and the second alignment mark AM2 are simultaneously visible from the lower side of the download stage 5 via the quartz window 52a and the blanket BL can be seen. The CCD light receiving surface 438 uniformly captures the first alignment mark AM1 and the second alignment mark AM2 disposed facing the quartz window 52a in the same field of view.
物鏡435、半鏡面437、受光面438及光源436可一體地利用XY平台431在沿著XY平面之方向、或利用精密升降平台432在鉛直方向(Z方向)移動。物鏡435之前側焦點係利用精密升降平台432對準橡皮布BL之對準標記形成面。另一方面，後側焦點係預先對準CCD拍攝元件之受光面438。 因此，在CCD受光面438上，焦點對準之(焦點內之)光學像成像於形成於橡皮布BL上之第2對準標記AM2，且利用CCD相機430拍攝該光學像。 The objective lens 435, the half mirror surface 437, the light receiving surface 438, and the light source 436 can be integrally moved in the vertical direction (Z direction) by the XY stage 431 in the direction along the XY plane or by the precision lifting platform 432. The front side focus of the objective lens 435 is aligned with the alignment mark forming surface of the blanket BL by the precision lifting platform 432. On the other hand, the rear focus is pre-aligned with the light receiving surface 438 of the CCD imaging element. Therefore, on the CCD light receiving surface 438, the in-focus (inside focus) optical image is imaged on the second alignment mark AM2 formed on the blanket BL, and the optical image is captured by the CCD camera 430.
另，第2對準標記AM2係利用與應轉印於基板上之圖案相同之材料，與圖案形成同時形成於橡皮布BL上之彈性層之表面。即，於版PP上與應轉印於基板SB上之圖案一起預先形成有對應對準標記AM2之圖案，且使版PP密著於橡皮布BL上之塗佈層而進行圖案化時，亦同時形成對準標記AM2。如上所述，橡皮布BL之主表面中，形成有彈性層之側之一主表面成為圖案及對準標記之形成面。 Further, the second alignment mark AM2 is formed on the surface of the elastic layer on the blanket BL at the same time as the pattern formation by using the same material as the pattern to be transferred onto the substrate. That is, when the pattern of the corresponding alignment mark AM2 is formed in advance on the plate PP and the pattern to be transferred onto the substrate SB, and the plate PP is adhered to the coating layer on the blanket BL, the pattern is also formed. At the same time, the alignment mark AM2 is formed. As described above, in the main surface of the blanket BL, one of the main surfaces on the side on which the elastic layer is formed serves as a pattern and a formation surface of the alignment mark.
圖7A至圖7C係顯示對準標記之圖案之例之圖。更詳細而言，圖7A顯示該實施形態中形成於基板上之第1對準標記，圖7B顯示該實施形態中形成於橡皮布上之第2對準標記。 7A to 7C are views showing an example of a pattern of alignment marks. More specifically, Fig. 7A shows the first alignment mark formed on the substrate in the embodiment, and Fig. 7B shows the second alignment mark formed on the blanket in the embodiment.
如圖7A所示，形成於基板SB上之第1對準標記AM1包含互相隔離配置之複數個(在該例中為4個)第1對準圖案AP1(AP11~AP14)。各對準圖案AP1為即使在焦點未對準之狀態下圖形仍不會消失之程度之尺寸、例如1邊為50 μm左右之矩形(在該例中為正方形)，且四邊所包圍之內部同樣地塗滿之實心之圖形。如此之第1對準圖案AP1為4個分別配置於作為正方形之頂點之位置而構成第1對準標記AM1。各對準圖案AP1間之間隙為750 μm。 As shown in FIG. 7A, the first alignment mark AM1 formed on the substrate SB includes a plurality of (four in this example) first alignment patterns AP1 (AP11 to AP14) which are disposed apart from each other. Each of the alignment patterns AP1 is a size that does not disappear even when the focus is not aligned, for example, a rectangle having a side of about 50 μm (in this example, a square), and the inside surrounded by the four sides is the same The solid figure is painted on the ground. The first alignment pattern AP1 is configured such that four of the first alignment patterns AP1 are disposed at positions apexes of squares to constitute the first alignment mark AM1. The gap between the alignment patterns AP1 is 750 μm.
另一方面，如圖7B所示，形成於橡皮布BL上之第2對準標記AM2包含單一之第2對準圖案AP2。第2對準圖案AP2 為例如1邊為120 μm左右之矩形且內部被挖空而成為空白之環狀之空心之圖形。形成正方形之各邊之線寬為例如10 μm，因此，內部之正方形之1邊為100 μm左右。 On the other hand, as shown in FIG. 7B, the second alignment mark AM2 formed on the blanket BL includes a single second alignment pattern AP2. Second alignment pattern AP2 For example, a rectangular shape having a rectangular shape of about 120 μm on one side and being hollowed out to become a blank is formed. The line width of each side forming the square is, for example, 10 μm, and therefore, one side of the inner square is about 100 μm.
又，圖7C顯示該等之對準圖案之空間頻率頻譜。若比較該等圖案所具有之空間頻率成分，則實心圖形之第1對準圖案AP1含有較空心圖形之第2對準圖案AP2更多之低頻率成分。即，第1對準圖案AP1其空間頻率之頻譜偏向低頻率側。在後述之精密對準動作中，利用該特徵進行各對準圖案之位置檢測。 Again, Figure 7C shows the spatial frequency spectrum of the alignment patterns. When the spatial frequency components of the patterns are compared, the first alignment pattern AP1 of the solid pattern contains more low frequency components than the second alignment pattern AP2 of the hollow pattern. That is, the spectrum of the spatial frequency of the first alignment pattern AP1 is biased toward the low frequency side. In the precise alignment operation described later, the position detection of each alignment pattern is performed using this feature.
圖8係顯示用於精密對準動作之對準標記之配置之圖。基板SB及橡皮布BL為具有大致相同之平面尺寸之板狀體，於重合兩者時互相對應之位置分別形成對準標記。即，在板狀之基板SB之中央部，設定形成電路圖案等之特定圖案且最終作為器件發揮功能之有效圖案區域PR。與其對應之橡皮布BL之表面區域為橡皮布BL之有效圖案區域PR，利用版PP在該區域PR中將所應轉印於基板SB上之圖案圖案化。圖8之例中雖將矩形基板SB之中央部之矩形區域作為有效圖案區域PR，但該等之形狀並非限定於矩形而為任意。 Figure 8 is a diagram showing the configuration of alignment marks for precision alignment operations. The substrate SB and the blanket BL are plate-like bodies having substantially the same planar size, and alignment marks are formed at positions corresponding to each other when the two are superposed. In other words, in the central portion of the plate-shaped substrate SB, an effective pattern region PR that forms a specific pattern such as a circuit pattern and finally functions as a device is set. The surface area of the blanket BL corresponding thereto is the effective pattern area PR of the blanket BL, and the pattern to be transferred onto the substrate SB is patterned in the area PR by the plate PP. In the example of FIG. 8, the rectangular region of the central portion of the rectangular substrate SB is defined as the effective pattern region PR, but the shape is not limited to a rectangular shape and is arbitrary.
且，將有效圖案區域PR之四角之外側、鄰近基板SB之角部之區域作為對準標記形成區域AR。另，設置於下載台部5之吸附板51上之石英窗52a分別設置於與上述4部位之對準標記形成區域AR對應之位置。 Further, a region other than the four corners of the effective pattern region PR and adjacent to the corner portion of the substrate SB is used as the alignment mark forming region AR. Further, the quartz windows 52a provided on the adsorption plate 51 of the downloading table portion 5 are respectively provided at positions corresponding to the alignment mark forming regions AR of the above-described four portions.
在基板SB上，例如利用光微影技術預先於4處之對準標 記形成區域AR之各者中形成第1對準標記AM1。另一方面，形成於橡皮布BL之各對準標記形成區域AR中之第2對準標記AM2與形成於有效圖案區域PR中之圖案一起使用版PP而藉由圖案形成材料予以圖案化。因此，不論圖案化時之版PP與橡皮布BL之位置關係如何，於橡皮布BL上形成於有效圖案區域PR中之圖案與形成於對準標記形成區域AR中之對準標記之位置關係皆不變。藉此，藉由使用對準標記之位置對準，基板SB與橡皮布BL上之圖案之位置關係保持一定。因此，不一定需要版PP與橡皮布BL之間之精密對準。 On the substrate SB, for example, using an optical lithography technique to pre-align the coordinates at 4 places The first alignment mark AM1 is formed in each of the formation areas AR. On the other hand, the second alignment mark AM2 formed in each of the alignment mark formation areas AR of the blanket BL is patterned by the pattern forming material using the pattern PP together with the pattern formed in the effective pattern area PR. Therefore, regardless of the positional relationship between the plate PP and the blanket BL at the time of patterning, the positional relationship between the pattern formed in the effective pattern region PR on the blanket BL and the alignment mark formed in the alignment mark forming region AR is constant. Thereby, the positional relationship between the substrate SB and the pattern on the blanket BL is kept constant by using the alignment of the alignment marks. Therefore, precise alignment between the plate PP and the blanket BL is not necessarily required.
在該實施形態中，利用對準部4之拍攝部43拍攝如上所述般構成之對準圖案。自所拍攝之圖像檢測對準圖案從而把握基板SB與橡皮布BL(嚴密而言為橡皮布BL上之圖案)之位置關係，且根據需要進行用以對準該等之位置之調整動作。 In this embodiment, the alignment pattern configured as described above is imaged by the imaging unit 43 of the alignment unit 4. The alignment pattern is detected from the captured image to grasp the positional relationship between the substrate SB and the blanket BL (strictly, the pattern on the blanket BL), and the adjustment operation for aligning the positions is performed as needed.
本實施形態之第1對準標記及第2對準標記分別為將上述對準圖案作為構成要件且包含1個或複數個對準圖案者。然而，本實施形態之精密對準動作自身即使利用僅包含單一之對準圖案之對準標記亦成立。對此，此處使用將包含單一之第1對準圖案AP1之第1對準標記形成於基板SB上，且將包含單一之第2對準圖案AP2之第2對準標記形成於橡皮布BL上之例說明對準動作之原理。 Each of the first alignment mark and the second alignment mark in the embodiment is one in which the alignment pattern is used as a component and includes one or a plurality of alignment patterns. However, the precision alignment operation of the present embodiment is established by using an alignment mark including only a single alignment pattern. In this case, the first alignment mark including the single first alignment pattern AP1 is formed on the substrate SB, and the second alignment mark including the single second alignment pattern AP2 is formed on the blanket BL. The above example illustrates the principle of alignment.
圖9A至圖9C係顯示以CCD相機所拍攝之圖像之一例之圖。在所拍攝之圖像IM中，如圖9A所示，包含有在焦點 對準之狀態下以較高之圖像對比度所拍攝之第2對準圖案AP2。因此，較容易自所拍攝之圖像檢測第2對準圖案AP2之重心位置G2m。將第2對準圖案AP2設為環狀矩形之空心圖形之情形時，例如可如下般求得重心位置。如圖9B所示，可藉由以特定之臨限值將圖像內之各個位置之亮度二元化，擷取第2對準圖案AP2之邊緣部分，然後推定第2對準圖案AP2之輪廓而求出其重心G2m之位置。尤其，由於預先已知圖案之外形尺寸或線寬等之特徵，故圖像處理部65可應用以該等特徵經特殊化之圖像處理。 9A to 9C are views showing an example of an image taken by a CCD camera. In the captured image IM, as shown in FIG. 9A, included in the focus The second alignment pattern AP2 captured at a higher image contrast in the aligned state. Therefore, it is easier to detect the gravity center position G2m of the second alignment pattern AP2 from the captured image. When the second alignment pattern AP2 is a hollow pattern of a circular rectangle, the center of gravity position can be obtained, for example, as follows. As shown in FIG. 9B, the edge of the second alignment pattern AP2 can be extracted by binarizing the brightness of each position in the image with a specific threshold, and then the outline of the second alignment pattern AP2 is estimated. And find the position of its center of gravity G2m. In particular, since the features such as the shape size or the line width of the pattern are known in advance, the image processing unit 65 can apply image processing that is specialized by the features.
另一方面，對於形成於基板側之第1對準圖案AP1並不一定能夠對焦。若第1對準圖案AP1與第2對準圖案AP2在光軸方向上之間隔為物鏡435之景深以下，則可拍攝焦點對準第1對準圖案AP1與第2對準圖案AP2之兩者之圖像。然而，對準圖案間之間隔大於物鏡435之景深時，若將焦點對準第2對準圖案AP2，則第1對準圖案AP1為景深外而失焦，從而被拍攝為輪廓模糊之圖像。 On the other hand, it is not always possible to focus on the first alignment pattern AP1 formed on the substrate side. When the interval between the first alignment pattern AP1 and the second alignment pattern AP2 in the optical axis direction is equal to or less than the depth of field of the objective lens 435, the focus can be focused on both the first alignment pattern AP1 and the second alignment pattern AP2. The image. However, when the interval between the alignment patterns is larger than the depth of field of the objective lens 435, if the focus is on the second alignment pattern AP2, the first alignment pattern AP1 is out of focus and out of focus, thereby being imaged as a blurred outline. .
本實施形態中使用具有5倍左右之倍率之物鏡435，其景深為±30 μm(聚焦範圍為60 μm)左右。另一方面，裝設於裝置100之基板SB與橡皮布BL之間隔Gsb在間隙調整後為300 μm左右。在如此之條件下，無法將焦點同時對準兩個對準圖案。即，若將焦點對準第2對準圖案AP2，則對於第1對準圖案AP1必然失焦。本實施形態之精密對準方法為即使在如此之情形下亦可應對而可實現高精度之位置對準者。 In the present embodiment, an objective lens 435 having a magnification of about 5 times is used, and the depth of field is about 30 μm (focus range is 60 μm). On the other hand, the interval Gsb between the substrate SB and the blanket BL attached to the apparatus 100 is about 300 μm after the gap adjustment. Under such conditions, the focus cannot be simultaneously aligned to the two alignment patterns. That is, when the focus is on the second alignment pattern AP2, the first alignment pattern AP1 is inevitably out of focus. The precise alignment method of the present embodiment is a positional alignment that can achieve high precision even in such a case.
焦點未對準第1對準圖案AP1時，如圖9A所示，第1對準圖案AP1大於虛線所示之本來之外形，且在輪廓模糊之狀態下被拍攝。因此，失去原本之第1對準圖案AP1之形狀所具有之空間頻率成分中較高之頻率成分。因此，可認為難以應用如第2對準圖案AP2之情形般擷取邊緣之方法，且檢測誤差亦較大。對此，如圖9C所示，以亮度位準之峰值位置求出第1對準圖案AP1之重心位置。 When the focus is not aligned with the first alignment pattern AP1, as shown in FIG. 9A, the first alignment pattern AP1 is larger than the original shape shown by the broken line, and is captured in a state where the outline is blurred. Therefore, the higher frequency component among the spatial frequency components of the shape of the original first alignment pattern AP1 is lost. Therefore, it can be considered that it is difficult to apply the method of extracting the edge as in the case of the second alignment pattern AP2, and the detection error is also large. On the other hand, as shown in FIG. 9C, the position of the center of gravity of the first alignment pattern AP1 is obtained from the peak position of the luminance level.
此時，如圖7C所示，藉由預先將第1對準圖案AP1之形狀設為包含多數低空間頻率成分者，可抑制圖像資訊之損失，從而可抑制重心位置之檢測精度之降低。尤其進行伴隨陰影修正之圖像處理之情形時，由於亦會因而失去低頻率成分，故使用空間頻率之分布偏向低頻率側之形狀之圖案較有效。 At this time, as shown in FIG. 7C, by setting the shape of the first alignment pattern AP1 to include a plurality of low spatial frequency components in advance, it is possible to suppress loss of image information, and it is possible to suppress a decrease in detection accuracy of the position of the center of gravity. In particular, in the case of image processing with shadow correction, since the low frequency component is also lost, it is effective to use a pattern in which the spatial frequency distribution is shifted toward the shape on the low frequency side.
又，由於預先已知會失去原本之形狀中所含之高頻率成分，故在重心位置之檢測中高頻率成分為不具有有用性，反倒作為雜訊起作用者。對此，期望進行自圖像除去高頻率成分之低頻過濾處理，且自除去後之圖像檢測重心位置。藉此，檢測焦點未對準之第1對準圖案AP1之重心G1m之位置。 Further, since it is known in advance that the high frequency component contained in the original shape is lost, the high frequency component is not useful in detecting the position of the center of gravity, and it acts as a noise. In this regard, it is desirable to perform low-frequency filtering processing for removing high-frequency components from the image, and to detect the position of the center of gravity from the image after the removal. Thereby, the position of the center of gravity G1m of the first alignment pattern AP1 whose focus is not aligned is detected.
如圖9A所示，例如將第1對準圖案AP1之重心位置G1m作為基準時，即原本基板SB與橡皮布BL之位置關係適當時，利用符號G2t表示第2對準圖案AP2應當所在之重心之位置。然而，實測之重心G2m之位置未必與其一致，為使該等一致，需要精密對準動作。即在精密對準動作中，如 圖9A中箭頭所示，以使所要檢測之第2對準圖案AP2之重心位置G2m與其適當位置G2t一致之方式，調整基板SB與橡皮布BL之相對位置。在該實施形態中，藉由基於拍攝結果算出對準載台42之載台頂部422之必要移動量並使其移動，使支撐於載台頂部422之下載台部5及載置於其上之橡皮布BL移動，從而進行相對於基板SB之位置對準。 As shown in FIG. 9A, for example, when the position of the center of gravity G1m of the first alignment pattern AP1 is used as a reference, that is, when the positional relationship between the original substrate SB and the blanket BL is appropriate, the center of gravity of the second alignment pattern AP2 should be indicated by the symbol G2t. The location. However, the position of the measured center of gravity G2m does not necessarily coincide with it, and in order to achieve the same, a precise alignment action is required. That is, in a precise alignment action, such as As shown by the arrow in Fig. 9A, the relative position of the substrate SB and the blanket BL is adjusted so that the gravity center position G2m of the second alignment pattern AP2 to be detected coincides with the appropriate position G2t. In this embodiment, by calculating and moving the necessary amount of movement of the stage top 422 of the alignment stage 42 based on the imaging result, the download stage 5 supported on the stage top 422 and the carrier portion 5 are placed thereon. The blanket BL is moved to perform alignment with respect to the substrate SB.
圖10係顯示精密對準動作之處理流程之流程圖。另，該處理係作為圖4之步驟S9之處理之一部分進行者。首先，利用精密升降平台432，將設置於拍攝部43之CCD相機430之焦點對準橡皮布BL之對準標記形成面(上表面)(步驟S901)。另，由於橡皮布BL因膨脹而其厚度變動，故需要每次執行轉印處理均進行聚焦。 Fig. 10 is a flow chart showing the processing flow of the precise alignment action. In addition, the processing is performed as part of the processing of step S9 of FIG. First, the focus of the CCD camera 430 provided in the imaging unit 43 is aligned with the alignment mark forming surface (upper surface) of the blanket BL by the precision lifting platform 432 (step S901). Further, since the thickness of the blanket BL varies due to expansion, it is necessary to perform focusing every time the transfer processing is performed.
具體而言，例如根據如下之自動聚焦(AF)調整動作，可進行聚焦。即，一面藉由利用精密升降平台432將CCD相機430在上下方向(Z方向)移動而在Z方向以一定間距變更設定焦點位置，且每當該變更設定時進行利用CCD相機430之拍攝。且，根據拍攝之對準圖案AP2之圖像，算出圖像對比度成為最大之位置，且將物鏡435之焦點位置對準該位置。另，4個CCD相機430之聚焦雖係分別單個進行，但其處理內容相同。 Specifically, focusing can be performed, for example, according to the following auto focus (AF) adjustment operation. In other words, the CCD camera 430 is moved in the vertical direction (Z direction) by the precision lifting platform 432, and the set focus position is changed at a constant pitch in the Z direction, and the CCD camera 430 is photographed every time the setting is changed. Then, based on the image of the photographing alignment pattern AP2, the position at which the image contrast is maximized is calculated, and the focus position of the objective lens 435 is aligned with the position. In addition, although the focus of the four CCD cameras 430 is performed individually, the processing contents are the same.
圖11係顯示聚焦動作之流程圖。最初，利用精密升降平台432，將CCD相機430之高度、即Z方向位置設定為特定之初始值(步驟S911)。且，一面利用精密升降平台432多階段地變更設定CCD相機430之高度，且每當該變更設定時 進行利用CCD相機430之第2對準圖案AP2之拍攝(步驟S912)。反復上一個步驟，直至CCD相機430到達特定之最終高度(步驟S913)。在該實施形態中，在距預先所設定之標準高度±100 μm之範圍中，使CCD相機430以20 μm梯級移動，且在各位置進行拍攝。 Figure 11 is a flow chart showing the focusing action. First, the height of the CCD camera 430, that is, the Z-direction position is set to a specific initial value by the precision lifting platform 432 (step S911). Further, the height of the CCD camera 430 is set to be changed in multiple stages by the precision lifting platform 432, and each time the setting is changed The imaging by the second alignment pattern AP2 of the CCD camera 430 is performed (step S912). The previous step is repeated until the CCD camera 430 reaches a certain final height (step S913). In this embodiment, the CCD camera 430 is moved in steps of 20 μm in a range of ±100 μm from the standard height set in advance, and imaging is performed at each position.
如此以各高度所拍攝之原圖像中，第2對準圖案AP2為最鮮明顯現者，係表示CCD相機430之焦點對準(或最鄰近其)第2對準圖案AP2之狀態。因此，藉由找出如此之圖像，並在與其對應之高度裝設CCD相機430，從而達成聚焦之目的。 In the original image taken at each height, the second alignment pattern AP2 is the most vivid one, and indicates the state in which the CCD camera 430 is in focus (or closest to) the second alignment pattern AP2. Therefore, by finding such an image and mounting the CCD camera 430 at a height corresponding thereto, the purpose of focusing is achieved.
然而，由於第2對準圖案AP2為以與應轉印於基板SB上之圖案相同之材料形成者，故未必能始終以良好之對比度進行拍攝。例如，以具有與橡皮布BL近似之光學特性(尤其是折射率、反射率等)之材料形成有第2對準圖案AP2之情形時，有時即使對拍攝條件進行微調整仍只可得到較低之圖像對比度。 However, since the second alignment pattern AP2 is formed of the same material as the pattern to be transferred onto the substrate SB, it is not always possible to perform imaging with good contrast. For example, when the second alignment pattern AP2 is formed of a material having optical characteristics (especially refractive index, reflectance, etc.) similar to the blanket BL, even if the imaging conditions are finely adjusted, only a comparison can be obtained. Low image contrast.
又，在將基板SB與橡皮布BL極其鄰近而配置之狀態下，藉由來自光源463之照明光因基板SB反射而可獲得較明亮之圖像。與此相對，由於例如如基板SB與橡皮布BL之間隙調整未完成之狀態般基板SB與橡皮布BL之距離較大時，自CCD相機430側觀察位於橡皮布BL之背後之基板SB較遠，故有無法獲得充足之反射光量，而成為較暗且對比度較低之圖像之情形。基板SB自身之反射率較低之情形亦相同。 Further, in a state where the substrate SB and the blanket BL are disposed in close proximity to each other, the illumination light from the light source 463 is reflected by the substrate SB to obtain a brighter image. On the other hand, when the distance between the substrate SB and the blanket BL is large, for example, if the gap between the substrate SB and the blanket BL is not completed, the substrate SB located behind the blanket BL is far from the CCD camera 430 side. Therefore, there is a case where a sufficient amount of reflected light cannot be obtained, and it becomes a darker and lower contrast image. The case where the reflectance of the substrate SB itself is low is also the same.
如此，有無法期待在良好之環境下進行焦點尚未對準之狀態下之第2對準圖案AP2之拍攝之情形，且有難以自圖像檢測第2對準圖案AP2之情形。然而，即使在如此之環境下仍需要確實地進行聚焦。為實現此點，在該實施形態中係如下般進行。 As described above, there is a case where it is impossible to expect the second alignment pattern AP2 to be photographed in a state where the focus has not been aligned in a good environment, and it is difficult to detect the second alignment pattern AP2 from the image. However, even in such an environment, it is necessary to perform focusing in a sure manner. In order to achieve this, in this embodiment, the following is performed.
在本實施形態之CCD相機430中，拍攝元件之1像素之尺寸約為0.7 μm。另一方面，如圖7B所示，第2對準圖案AP2之線寬為10 μm，此與拍攝元件之約14像素大小相當。因此，即使例如為低對比度之圖像，藉由增強相當於對應該線寬之14像素大小之空間頻率成分，仍可更容易地自圖像檢測第2對準圖案AP2。其理由為，第2對準圖案AP2之形狀及尺寸為已知，且該情形時，自所拍攝之圖像檢測第2對準圖案AP2，只要特定其邊緣位置即可。 In the CCD camera 430 of the present embodiment, the size of one pixel of the imaging element is about 0.7 μm. On the other hand, as shown in Fig. 7B, the line width of the second alignment pattern AP2 is 10 μm, which is equivalent to about 14 pixels of the imaging element. Therefore, even if it is, for example, a low-contrast image, the second alignment pattern AP2 can be more easily detected from the image by enhancing the spatial frequency component corresponding to the 14-pixel size corresponding to the line width. The reason for this is that the shape and size of the second alignment pattern AP2 are known, and in this case, the second alignment pattern AP2 is detected from the captured image, and the edge position may be specified.
例如，藉由除去與相較於線寬足夠細、例如線寬之一半以下之尺寸對應之空間頻率成分，可不會丟失與第2對準圖案AP2之邊緣相關之資訊而除去雜訊成分、尤其是高頻率之隨機雜訊成分。又，藉由除去與相較於線寬足夠大、例如線寬之2倍以上之尺寸對應之空間頻率成分，同樣地不會丟失與第2對準圖案AP2之邊緣相關之資訊，且可排除更大規模下之變動要因、例如陰影之影響。 For example, by removing the spatial frequency component corresponding to a dimension that is sufficiently thinner than the line width, for example, one-half or less of the line width, the information related to the edge of the second alignment pattern AP2 can be removed without removing the noise component, especially It is a high frequency random noise component. Further, by removing the spatial frequency component corresponding to the size larger than the line width, for example, twice or more the line width, the information related to the edge of the second alignment pattern AP2 is not lost, and can be excluded. The causes of changes on a larger scale, such as the effects of shadows.
具體而言，關於以各高度所拍攝之原圖像，圖像處理部65以基於第2對準圖案AP2之圖案形狀所設定之特定之像素單位、具體而言為對應線寬之像素數量之一半以下(例如4像素×4像素)，進行平均化壓縮(步驟S914)。此處將平均化 壓縮後之圖像資料稱為第1資料。藉由如此進行平均化壓縮，除去包含於原圖像中之高頻率成分，尤其有效地除去隨機雜訊成分。即，平均化壓縮處理實質上相當於低通濾波處理。又，亦有削減以後之運算中之資料量之效果。 Specifically, regarding the original image captured at each height, the image processing unit 65 sets the specific pixel unit set based on the pattern shape of the second alignment pattern AP2, specifically, the number of pixels corresponding to the line width. Half or less (for example, 4 pixels × 4 pixels), averaging compression is performed (step S914). Averaged here The compressed image data is called the first data. By performing averaging compression in this way, the high frequency components contained in the original image are removed, and the random noise component is particularly effectively removed. That is, the averaging compression process substantially corresponds to the low pass filtering process. Also, there is an effect of reducing the amount of data in the subsequent calculations.
接著，相對平均化壓縮後之第1資料，以特定之像素單位、例如7像素×7像素進行平均化壓縮(步驟S915)。另，此處所言之「像素」意為以4像素單位所壓縮之第1資料之像素，因此，此處之7像素相當於原圖像之28像素(即線寬之2倍)。藉此，擷取不取決於第2對準圖案AP2之低頻率成分、例如由陰影引起之變動部分。將此作為第2資料。 Next, the averaged compressed first data is averaged and compressed in a specific pixel unit, for example, 7 pixels × 7 pixels (step S915). In addition, "pixel" as used herein means a pixel of the first data compressed in units of 4 pixels, and therefore, 7 pixels here correspond to 28 pixels of the original image (that is, twice the line width). Thereby, the low frequency component that does not depend on the second alignment pattern AP2, for example, the fluctuation portion caused by the shading, is extracted. Use this as the second material.
接著，藉由獲取第1資料與第2資料之比，自第1資料排除陰影之影響。即，求該比之處理實質上相當於除去低頻率下之變動成分之高通濾波處理。其結果，僅擷取將對應第2對準圖案AP2之線寬之成分作為中心之頻帶之空間頻率成分。即，利用帶通濾波器擷取對應第2對準圖案AP2之線寬之空間頻率成分。藉由對如此所獲得之比值乘以大於1之特定之增強係數K，可獲得原圖像中對應第2對準圖案AP2之線寬之圖像要件之對比度增強之圖像(步驟S916)。 Then, by obtaining the ratio of the first data to the second data, the influence of the shadow is excluded from the first data. That is, the processing for determining the ratio substantially corresponds to the high-pass filter processing for removing the fluctuation component at a low frequency. As a result, only the spatial frequency component of the frequency band in which the component corresponding to the line width of the second alignment pattern AP2 is taken as the center is extracted. That is, the spatial frequency component corresponding to the line width of the second alignment pattern AP2 is extracted by the band pass filter. By multiplying the thus obtained ratio by a specific enhancement coefficient K greater than 1, an image of the contrast enhancement of the image element corresponding to the line width of the second alignment pattern AP2 in the original image can be obtained (step S916).
圖12係顯示對比度增強之圖像資料之例之圖。同圖顯示有拍攝第2對準圖案AP2之圖像中所劃之一根之線上之位置與像素值之關係。符號(A)表示原圖像之圖像資料，資料中包含有雜訊，原圖像中未獲得對找出第2對準圖案AP2之位置而言充分之對比度。符號(B)表示第1資料，雖藉由低通濾波處理大幅除去高頻率雜訊成分，但可見起因於陰影 之更緩慢之變動。符號(C)表示第2資料，幾乎僅顯現由陰影引起之低頻率之變動。 Fig. 12 is a view showing an example of image data of contrast enhancement. The same figure shows the relationship between the position on the line drawn in one of the images of the second alignment pattern AP2 and the pixel value. The symbol (A) indicates the image data of the original image, and the data contains noise, and the contrast in the original image that is sufficient for finding the position of the second alignment pattern AP2 is not obtained. The symbol (B) indicates the first data, although the high-frequency noise component is largely removed by the low-pass filtering process, but it can be seen from the shadow. A slower change. The symbol (C) indicates the second data, and almost only the low frequency variation caused by the shadow appears.
符號(D)表示對比度增強後之資料，藉由在除去由陰影引起之低頻率之變動之基礎上增強對比度，可清晰地辨識相當於第2對準圖案AP2之邊緣之位置之峰值。圖像中顯現之第2對準圖案AP2越鮮明，該峰值亦越鮮明地顯現。利用此點，可自圖像檢測第2對準圖案AP2。 The symbol (D) indicates the contrast-enhanced data, and the peak corresponding to the position of the edge of the second alignment pattern AP2 can be clearly recognized by enhancing the contrast based on the variation of the low frequency caused by the shadow. The sharper the second alignment pattern AP2 appearing in the image, the sharper the peak appears. With this, the second alignment pattern AP2 can be detected from the image.
例如不完全包含第2對準圖案AP2之圖像中，對比度增強後之資料(符號(D))中亦不會顯現顯著之峰值，圖像整體之像素值為鄰***均位準Vavg之均一值。另一方面，CCD相機430之焦點越鄰近橡皮布BL上表面，會顯現自平均位準Vavg背離越大之像素值。因此，求出圖像內之各個位置之像素值Vi與其平均值Vavg之差之絕對值，且根據在圖像內累計該值之總和：Σ | Vi-Vavg |………(式1)之值之大小，可評估CCD相機430之聚焦位置與橡皮布BL上表面位置之偏移量。CCD相機430之焦點越鄰近橡皮布BL上表面，與圖像所含之第2對準標記AM2對應之空間頻率成分越多，隨之上述(式1)所示之值越大。因此，此處將關於使CCD相機430之高度不同而拍攝之圖像之各者利用(式1)求得之值稱為「AF評估值」。可以說，拍攝該等之圖像中、AF評估值成為最大之、即最多地包含有對應第2對準標記AM2之空間頻率成分之圖像時之CCD相機430之高度為CCD相機430之焦點最鄰近橡皮布BL上表面之高度。 For example, in the image that does not completely include the second alignment pattern AP2, the contrast-enhanced data (symbol (D)) does not show a significant peak, and the pixel value of the entire image is a uniform value of the adjacent average level Vavg. . On the other hand, the closer the focus of the CCD camera 430 is to the upper surface of the blanket BL, the larger the pixel value from which the average level Vavg deviates. Therefore, the absolute value of the difference between the pixel value Vi of each position in the image and its average value Vavg is obtained, and the sum of the values is accumulated in the image according to: Σ | Vi-Vavg |... (Formula 1) The magnitude of the value can be used to evaluate the offset of the focus position of the CCD camera 430 from the position of the upper surface of the blanket BL. The closer the focus of the CCD camera 430 is to the upper surface of the blanket BL, the larger the spatial frequency component corresponding to the second alignment mark AM2 included in the image, and the larger the value shown in the above (Formula 1). Therefore, the value obtained by using (Formula 1) for each of the images captured by the height of the CCD camera 430 is referred to as "AF evaluation value". It can be said that the height of the CCD camera 430 when the AF evaluation value becomes the largest, that is, the image including the spatial frequency component corresponding to the second alignment mark AM2, is the focus of the CCD camera 430. The height of the upper surface of the blanket BL is closest to it.
關於增強係數K，雖可設為大於1之任意值，但當然地該值越大對比度越強地增強，從而增強對應第2對準圖案AP2之邊緣之峰值。該情形時，雖有甚至增強與對準圖案無關係之信號之虞，但根據發明者們之實驗，至少關於聚焦動作未產生會對其精度帶來影響之程度之障礙。可認為其理由係藉由進行以應檢測之對準圖案之形狀特殊化之信號處理，即擷取與對第2對準圖案AP2賦與特徵之空間頻率成分對應之頻帶之帶通濾波處理，與對準圖案無關係之信號充分減少。 The enhancement coefficient K may be set to an arbitrary value larger than 1, but of course, the larger the value is, the stronger the contrast is, so that the peak corresponding to the edge of the second alignment pattern AP2 is enhanced. In this case, although the signal which has nothing to do with the alignment pattern is enhanced, according to experiments by the inventors, at least the focus operation does not cause an obstacle to the degree of influence on the accuracy. The reason for this is considered to be a signal processing that is specialized in the shape of the alignment pattern to be detected, that is, a band pass filtering process that captures a frequency band corresponding to the spatial frequency component of the second alignment pattern AP2. The signal that has nothing to do with the alignment pattern is sufficiently reduced.
另一方面，原理上無法超過CCD相機430原本具有之動態範圍而增強對比度，在該點上定有增強係數K之適當值之上限。例如在相對最大輸出信號之隨機雜訊之平均振幅為N%之拍攝系統中，增強係數K之適當之最大值Kmax係以下式：Kmax=100/4N………(式2)給出。此係自難以於±N%之振幅之雜訊增強至(100/2N)倍時以雜訊成分達到100%、及實際應用上將S/N比不到2倍之信號自雜訊分離之實驗事實推導出者。例如在相對信號之隨機雜訊之比為1%之拍攝系統中，增強係數K之上限值為25。 On the other hand, in principle, the dynamic range that the CCD camera 430 originally has cannot be exceeded to enhance the contrast, and the upper limit of the appropriate value of the enhancement coefficient K is set at this point. For example, in a photographing system in which the average amplitude of the random noise of the maximum output signal is N%, the appropriate maximum value Kmax of the enhancement coefficient K is given by: Kmax=100/4N (...2). This is a self-noise separation from a noise that is difficult to achieve an amplitude of ±N% to (100/2N) times, a noise component of 100%, and a practical application of a S/N ratio of less than 2 times. Experimental facts are derived. For example, in a shooting system in which the ratio of the random noise of the relative signals is 1%, the upper limit of the enhancement coefficient K is 25.
回到圖11，根據利用步驟S916之前之處理增強對比度之各高度上之圖像資料，基於上述原理，分別算出(式1)所定義之AF評估值(步驟S917)。且，以對應該等之中AF評估值為最大之圖像之高度，設定CCD相機430之高度(步驟 S918)。藉此，將CCD相機430之聚焦位置大致對準橡皮布BL之上表面。 Returning to Fig. 11, based on the image data at each height of the enhanced contrast using the processing before step S916, the AF evaluation value defined by (Formula 1) is calculated based on the above principle (step S917). And, the height of the CCD camera 430 is set in accordance with the height of the image in which the AF evaluation value is the largest among the correspondences (steps) S918). Thereby, the focus position of the CCD camera 430 is substantially aligned with the upper surface of the blanket BL.
回到圖10繼續精密對準動作之說明。如此進行焦點調整之狀態下，為第1對準圖案AP1及與其對應之第2對準圖案AP2進入各CCD相機430之視野，且其中焦點對準第2對準圖案AP2之狀態。各CCD430分別拍攝該圖像，且將圖像資料向圖像處理部65發送(步驟S902)。圖像處理部65相對如此拍攝之圖像進行特定之圖像處理，且進行圖像內之第1及第2對準圖案AP1、AP2之位置檢測(步驟S903、S904)。具體而言係檢測該等之重心位置G1m、G2m。 Returning to Figure 10, the description of the precise alignment action continues. In the state in which the focus adjustment is performed in this manner, the first alignment pattern AP1 and the second alignment pattern AP2 corresponding thereto enter the field of view of each CCD camera 430, and the focus is aligned with the second alignment pattern AP2. Each of the CCDs 430 captures the image and transmits the image data to the image processing unit 65 (step S902). The image processing unit 65 performs specific image processing on the image thus captured, and detects the positions of the first and second alignment patterns AP1 and AP2 in the image (steps S903 and S904). Specifically, the center-of-gravity positions G1m, G2m are detected.
若如上所述般檢測出第1對準圖案AP1之重心G1m、及第2對準圖案AP2之重心G2m之位置，則接著算出該等之間之位置偏移量(步驟S905)。此處應算出的並非檢測出之2個對準圖案各者之重心G1m、G2m間之位置偏移量，而是自第1對準圖案AP1之重心位置G1m推導出之第2對準圖案AP2之適當之重心位置G2t、與藉由實測檢測出之第2對準圖案AP2之重心位置G2m之間之位置偏移量。另，第1及第2對準圖案係以使其重心位置為共通之方式配置(即將G2t與G1m相等地設定)之情形時，當然地2個對準圖案各者之重心G1m、G2m間之位置偏移量為應求出之量。 When the positions of the center of gravity G1m of the first alignment pattern AP1 and the center of gravity G2m of the second alignment pattern AP2 are detected as described above, the positional shift amount between the first alignment patterns AP1 is calculated (step S905). Here, the positional offset between the centers of gravity G1m and G2m of the two adjacent alignment patterns is not calculated, but the second alignment pattern AP2 derived from the gravity center position G1m of the first alignment pattern AP1. The positional offset between the appropriate center of gravity position G2t and the center of gravity position G2m of the second alignment pattern AP2 detected by the actual measurement. Further, when the first and second alignment patterns are arranged such that their positions of gravity are common (that is, G2t and G1m are set equally), of course, the center of gravity G1m and G2m of each of the two alignment patterns is The position offset is the amount that should be found.
另，作為XY平面內基板SB與橡皮布BL之間產生之位置偏移，不僅為向X方向及Y方向之偏移，亦有扭曲即繞著鉛直軸之旋轉角度互相不同之類型之偏移。以設置於基板SB及橡皮布BL之各者之1對對準圖案之重心位置之調整， 難以修正向繞著該鉛直軸之旋轉方向(以下，稱為「θ方向」)之偏移。尤其一方之對準圖案係在焦點未對準之狀態下拍攝時，難以根據模糊之圖像把握該圖案之旋轉角度。 Further, the positional deviation between the substrate SB and the blanket BL in the XY plane is not only the offset in the X direction and the Y direction, but also the type of offset in which the rotation angles around the vertical axis are different from each other. . The adjustment of the position of the center of gravity of the pair of alignment patterns provided on each of the substrate SB and the blanket BL, It is difficult to correct the shift in the direction of rotation about the vertical axis (hereinafter referred to as "theta direction"). In particular, when the alignment pattern of one of the images is photographed in a state in which the focus is not aligned, it is difficult to grasp the rotation angle of the pattern based on the blurred image.
在該實施形態中，於基板SB及橡皮布BL之4角分別設置各1對之對準標記(圖8)，且以4組拍攝部43拍攝該等。且，以平均地修正根據該等以4組之拍攝部43所拍攝之圖像之各者求得之X、Y及θ方向之位置偏移之方式，綜合決定載台頂部422之X、Y及θ方向之移動量。藉此，可實現基板SB與橡皮布BL之高精度之位置對準。 In this embodiment, each pair of alignment marks (FIG. 8) are provided at four corners of the substrate SB and the blanket BL, and the four groups of imaging units 43 capture the same. Further, the X, Y of the top 422 of the stage is collectively determined so as to uniformly correct the positional shifts in the X, Y, and θ directions obtained by each of the images captured by the imaging units 43 of the four groups. And the amount of movement in the θ direction. Thereby, the positional alignment of the substrate SB and the blanket BL with high precision can be achieved.
關於基板SB側及橡皮布BL側之各者，以各相機所拍攝之對準圖案之重心位置係藉由利用圖像處理部65之圖像處理求得(步驟S903、S904)。根據該等之算出結果，算出基板SB與橡皮布BL之位置偏移量(步驟S905)。此處之位置偏移量係針對X方向、Y方向及θ方向之各者而算出。若如此求出之位置偏移量在預先決定之允許範圍內(步驟S906)，則將基板SB與橡皮布BL之間之位置偏移作為可忽視者而結束精密對準動作。 The position of the center of gravity of the alignment pattern captured by each camera is determined by image processing by the image processing unit 65 (steps S903 and S904). Based on the calculated results, the positional shift amount between the substrate SB and the blanket BL is calculated (step S905). The positional shift amount here is calculated for each of the X direction, the Y direction, and the θ direction. When the positional shift amount obtained in this way is within a predetermined allowable range (step S906), the positional deviation between the substrate SB and the blanket BL is regarded as a negligible, and the precise alignment operation is ended.
位置偏移量超過允許範圍時，需要用以修正其之橡皮布BL之移動。接著，雖進行該目的之移動，但考慮亦有可能成為因某些裝置之異常而無法實現位置對準之狀態，而對用以位置對準之移動之重試次數設定上限。即，重試次數達到預先設定之特定次數時(步驟S907)，在執行特定之錯誤停止處理之基礎上(步驟S908)，結束處理。作為該錯誤 停止處理之內容，例如可考慮顯示特定之錯誤訊息而完全中止處理自身，及在將錯誤之內容通知使用者之基礎上關於以後之處理等待使用者之指示等。可根據使用者之指示重新開始處理。 When the positional deviation exceeds the allowable range, the movement of the blanket BL for correcting it is required. Next, although the movement of the object is performed, it is considered that the state of alignment cannot be achieved due to an abnormality of some devices, and the upper limit of the number of retries for the movement of the alignment is set. That is, when the number of retries reaches a predetermined number of times (step S907), the specific error stop processing is executed (step S908), and the processing ends. As the error The content of the processing is stopped, for example, the processing itself may be completely suspended by displaying a specific error message, and the user's instruction to wait for the user in the subsequent processing based on the content of the error is notified to the user. The process can be restarted according to the instructions of the user.
另一方面，若未達到特定之重試次數(步驟S907)，則算出位置對準所需之橡皮布BL之移動量(步驟S909)。基於所算出之移動量使對準載台42動作(步驟S910)，且使橡皮布BL之位置與載台頂部422一起移動。在該狀態下，再次進行各對準圖案之拍攝及重心位置之檢測，從而進行是否需要再移動橡皮布BL之判定(步驟S902~S906)。反復進行上述步驟S902~S906，直至達到特定之重試次數(步驟S907)。 On the other hand, if the specific number of retries has not been reached (step S907), the amount of movement of the blanket BL required for the alignment is calculated (step S909). The alignment stage 42 is operated based on the calculated movement amount (step S910), and the position of the blanket BL is moved together with the stage top 422. In this state, the photographing of each alignment pattern and the detection of the position of the center of gravity are performed again, thereby determining whether or not the blanket BL needs to be moved again (steps S902 to S906). The above steps S902 to S906 are repeated until the specific number of retries is reached (step S907).
藉此，在利用各CCD相機430拍攝之圖像之各者中，第1對準圖案AP1與第2對準圖案AP2之位置關係與預先設定之關係(例如，圖9A)一致，或根據該關係之位置偏移量在允許範圍內。如此完成基板SB與橡皮布BL之位置對準(精密對準)。 Thereby, in each of the images captured by the respective CCD cameras 430, the positional relationship between the first alignment pattern AP1 and the second alignment pattern AP2 is identical to a predetermined relationship (for example, FIG. 9A), or The positional offset of the relationship is within the allowable range. The alignment (precise alignment) of the substrate SB and the blanket BL is thus completed.
如此完成對準處理後，藉由在吸附板51與橡皮布BL之間送入氣體，橡皮布BL之中央部浮起而密著於基板SB，從而將承載於橡皮布BL之圖案轉印於基板SB。此時，以與圖案相同之材料形成於橡皮布BL表面上之第2對準標記AM2亦與圖案一起被轉印於基板SB。在精密對準結束時點，由於第2對準標記AM2位於與基板SB上之第1對準標記AM1大致對向之位置，故在該狀態下橡皮布BL抵接於基板 SB，藉此第2對準標記AM2被轉印於第1對準標記AM1之附近。 After the alignment process is completed in this way, by feeding the gas between the adsorption plate 51 and the blanket BL, the central portion of the blanket BL floats and adheres to the substrate SB, thereby transferring the pattern carried on the blanket BL to Substrate SB. At this time, the second alignment mark AM2 formed on the surface of the blanket BL with the same material as the pattern is also transferred onto the substrate SB together with the pattern. At the end of the precise alignment, since the second alignment mark AM2 is located substantially opposite to the first alignment mark AM1 on the substrate SB, the blanket BL abuts on the substrate in this state. SB, whereby the second alignment mark AM2 is transferred to the vicinity of the first alignment mark AM1.
向基板SB上之圖案之轉印係根據需要反復執行複數次。當然，每當其時皆需要上述之對準處理。因此，每次進行圖案轉印時，與該圖案一起形成之第2對準標記被轉印於基板SB。此時，先前所轉印之第2對準標記，可能有成為用於此後之轉印處理之對準動作之障礙之情況。本實施形態之對準標記之配置(圖7)為考慮到如此之問題者。 The transfer to the pattern on the substrate SB is repeatedly performed as many times as necessary. Of course, the alignment process described above is required whenever it is. Therefore, each time the pattern transfer is performed, the second alignment mark formed together with the pattern is transferred onto the substrate SB. At this time, the second alignment mark previously transferred may be an obstacle to the alignment operation for the subsequent transfer process. The arrangement of the alignment marks (Fig. 7) of this embodiment is considered in consideration of such a problem.
圖13A及圖13B係用以說明對準標記之配置之圖。如圖13A所示，基板SB上之對準標記AM1為以使各者成為正方形之頂點之方式配置有4個第1對準圖案AP11~AP14者。藉由最初之轉印處理自橡皮布BL轉印於基板SB上之第2對準標記AM21被該等4個第1對準圖案AP11~AP14包圍，且轉印於自各第1對準圖案AP11~AP14隔開特定之間隔之區域(對準標記轉印區域)TR之內側。 13A and 13B are views for explaining the arrangement of alignment marks. As shown in FIG. 13A, the alignment mark AM1 on the substrate SB is such that four first alignment patterns AP11 to AP14 are arranged such that each of them becomes a vertex of a square. The second alignment mark AM21 transferred from the blanket BL onto the substrate SB by the first transfer process is surrounded by the four first alignment patterns AP11 to AP14, and is transferred from each of the first alignment patterns AP11. The ~AP 14 is spaced apart from the inside of the TR of the specific interval (alignment mark transfer area) TR.
第2次之轉印處理前之對準處理中，亦如上所述般進行將焦點對準橡皮布BL之拍攝。此時，如圖13B所示，此時雖承載於橡皮布BL上之第2對準標記AM22之圖像較鮮明，但基板SB表面之第1對準圖案AP11~AP12、與先前轉印於基板SB表面之第2對準標記AM21因焦點未對準而不鮮明。 In the alignment process before the second transfer process, the focus of the blanket BL is also captured as described above. At this time, as shown in FIG. 13B, at this time, although the image of the second alignment mark AM22 carried on the blanket BL is sharp, the first alignment patterns AP11 to AP12 on the surface of the substrate SB are previously transferred to The second alignment mark AM21 on the surface of the substrate SB is not clear due to the misalignment of the focus.
此時，若不鮮明地顯現之第2對準標記AM21與第1對準圖案AP11~AP14及第2對準標記AM22之任一者重疊或位於極其鄰近之位置，則會對該等之重心位置之算出帶來影響，作為結果有使對準處理之位置對準精度下降之虞。尤 其，若在判斷精密對準動作是否結束之處理步驟(圖10之步驟S906)中包含如此之檢測誤差，則會導致在殘留有位置偏移之狀態下結束對準處理。 At this time, if the second alignment mark AM21 that is not clearly displayed and the first alignment patterns AP11 to AP14 and the second alignment mark AM22 overlap or are located in an extremely close position, the center of gravity position is The calculation has an influence, and as a result, the alignment accuracy of the alignment process is lowered. especially If such a detection error is included in the processing step (step S906 of FIG. 10) for determining whether or not the precise alignment operation is completed, the alignment processing is ended in a state where the positional shift remains.
為避免如此之問題，在該實施形態中，在如下之設計思想下，進行對準標記之設計。 In order to avoid such a problem, in this embodiment, the design of the alignment mark is performed under the following design concept.
(1)將橡皮布BL上之第2對準標記AM2轉印於自基板SB上之第1對準標記離開一定距離以上之位置。 (1) The second alignment mark AM2 on the blanket BL is transferred to a position at a predetermined distance or more from the first alignment mark on the substrate SB.
(2)將以複數次圖案轉印自橡皮布BL轉印於基板SB之第2對準標記AM2在互不相同之位置且互相隔開充分之距離而進行轉印。 (2) The second alignment marks AM2 transferred from the blanket BL to the substrate SB in a plurality of pattern transfers are transferred at a different distance from each other at a different distance from each other.
(3)為提高對準精度，在各次對準處理中，將基板SB側之第1對準圖案AP1與橡皮布BL側之第2對準標記AM2配置於儘可能近之位置。 (3) In order to improve the alignment accuracy, the first alignment pattern AP1 on the substrate SB side and the second alignment mark AM2 on the side of the blanket BL are placed as close as possible in each alignment process.
即，藉由將第2對準標記AM2之轉印位置限定於自第1對準圖案AP11~AP14離開之對準標記轉印區域TR內，而補充上述必要條件(1)。若考慮到有根據焦點未對準之狀態之拍攝，第1對準圖案AP11~AP14及轉印完之第2對準標記AM2之像之外觀之大小較實際擴大至2倍左右之實例，則第1對準圖案AP11~AP14之位置、與各次之轉印之第2對準標記AM2之轉印位置，需要至少較第1對準圖案AP1之外形尺寸(50 μm)與第2對準標記AM2之外形尺寸(120 μm)之和之一半(85 μm)更大地隔離。在該實施形態中，如圖13B所示，將該距離設為115 μm。 That is, the above-described requirement (1) is supplemented by limiting the transfer position of the second alignment mark AM2 to the alignment mark transfer area TR which is separated from the first alignment patterns AP11 to AP14. In consideration of the case where the focus is not aligned, the appearance of the image of the first alignment patterns AP11 to AP14 and the image of the second alignment mark AM2 after the transfer is actually increased by about 2 times. The position of the first alignment patterns AP11 to AP14 and the transfer position of the second alignment mark AM2 of each transfer need to be at least smaller than the first alignment pattern AP1 (50 μm) and the second alignment. One half (85 μm) of the outer dimensions (120 μm) of the mark AM2 is more isolated. In this embodiment, as shown in Fig. 13B, the distance is set to 115 μm.
又，為補充必要條件(2)，可使承載於橡皮布BL之第2對 準標記AM2之位置在各次之轉印中均不同，且，使該位置之變化量充分大。又，為補充必要條件(3)，可隔離配置複數個第1對準圖案AP1，且可將欲重新轉印之第2對準標記AM2鄰近該等之至少一個而配置。 Moreover, in order to supplement the necessary condition (2), the second pair carried on the blanket BL can be made. The position of the quasi-marker AM2 is different in each transfer, and the amount of change in the position is sufficiently large. Further, in order to supplement the necessary condition (3), a plurality of first alignment patterns AP1 may be disposed in isolation, and the second alignment mark AM2 to be re-transferred may be disposed adjacent to at least one of the first alignment marks AM2.
鑑於該等，在該實施形態中，以包圍轉印第2對準標記AM2之對準標記轉印區域TR之方式，設定有配置有4個第1對準圖案AP11~AP14之第1對準標記AM1。對準標記轉印區域TR中，確保有可轉印多達9個之第2對準標記AM2之空間。因此可實現最大9次之圖案轉印。又，以使欲重新轉印之第2對準標記AM22不與轉印完之第2對準標記AM21之像重疊之方式，將轉印區域TR內之第2對準標記間之轉印間距設為200 μm。圖7A所示之第1對準標記AM1為如此構成者。 In view of this, in the embodiment, the first alignment in which the four first alignment patterns AP11 to AP14 are arranged is set so as to surround the alignment mark transfer region TR of the second alignment mark AM2. Mark AM1. In the alignment mark transfer area TR, it is ensured that there is a space in which up to nine second alignment marks AM2 can be transferred. Therefore, pattern transfer of up to 9 times can be achieved. Further, the transfer pitch between the second alignment marks in the transfer region TR is such that the second alignment mark AM22 to be re-transferred does not overlap with the image of the transferred second alignment mark AM21. Set to 200 μm. The first alignment mark AM1 shown in Fig. 7A is configured as such.
藉此，在各次轉印處理中，在CCD相機430之同一視野內拍攝承載於橡皮布BL之第2對準標記AM2與形成於基板SB之第1對準圖案AP11~AP14中之至少1個，基於該圖像可高精度地進行位置對準。此時，可防止在先前之轉印處理中轉印於基板SB上之第2對準標記之像干擾橡皮布BL表面之第2對準標記AM2之像，且即使重複複數次轉印，仍可在各次所轉印之圖案間維持較高之位置精度。 Thereby, at least one of the second alignment mark AM2 carried on the blanket BL and the first alignment patterns AP11 to AP14 formed on the substrate SB is captured in the same field of view of the CCD camera 430 in each transfer process. Based on this image, positional alignment can be performed with high precision. At this time, it is possible to prevent the image of the second alignment mark transferred onto the substrate SB from being disturbed by the image of the second alignment mark AM2 on the surface of the blanket BL in the previous transfer process, and even if the multiple transfer is repeated, A high positional accuracy can be maintained between each of the transferred patterns.
如上所述，在該實施形態中，在將承載於橡皮布BL之圖案轉印於基板SB之前，拍攝形成於各者上之對準標記，且基於其拍攝結果而執行進行橡皮布BL與基板SB之位置對準之對準處理。此時，將進行拍攝之CCD相機430之焦 點對準橡皮布BL上表面之第2對準標記AM2。使第2對準標記AM2為主要包含較高之空間頻率成分之圖案，另一方面，針對設置於基板SB側之第1對準標記AM1設為大量包含較低之空間頻率成分之圖案，藉此即使在焦點未對準之狀態下仍可高精度地進行其位置檢測。 As described above, in this embodiment, before the pattern carried on the blanket BL is transferred to the substrate SB, the alignment marks formed on the respective ones are taken, and the blanket BL and the substrate are executed based on the result of the photographing. Alignment of the position of the SB. At this time, the focus of the CCD camera 430 that will be taken is The point is aligned with the second alignment mark AM2 on the upper surface of the blanket BL. The second alignment mark AM2 is a pattern mainly including a high spatial frequency component, and the first alignment mark AM1 provided on the substrate SB side is a pattern in which a large number of spatial frequency components are included. This makes it possible to perform position detection with high precision even in a state where the focus is not aligned.
為將CCD相機430之焦點對準橡皮布BL上之第2對準標記AM2，在該實施形態中，藉由相對所拍攝之圖像進行對比度增強，易化包含於圖像中之第2對準標記AM2之檢測。更詳細而言，利用第2對準標記AM2之形狀為已知此點，進行選擇性地擷取與第2對準標記AM2之空間頻率成分對應之頻帶之過濾處理，且對如此獲得之資料乘以大於1之增強係數K，藉此特別增強與第2對準標記AM2之邊緣對應之圖像成分。藉此，可將第2對準標記AM2自雜訊成分等分離而檢測。 In order to align the focus of the CCD camera 430 with the second alignment mark AM2 on the blanket BL, in this embodiment, the contrast is enhanced with respect to the captured image, thereby facilitating the second pair included in the image. Detection of the quasi-label AM2. More specifically, the shape of the second alignment mark AM2 is known, and the filtering process of the frequency band corresponding to the spatial frequency component of the second alignment mark AM2 is selectively extracted, and the data thus obtained is obtained. The enhancement factor K greater than 1 is multiplied, whereby the image component corresponding to the edge of the second alignment mark AM2 is particularly enhanced. Thereby, the second alignment mark AM2 can be separated from the noise component or the like and detected.
因此，即使在因例如第2對準標記AM2不具有相對光之充分之反射性等之理由而來自第2對準標記AM2之反射光量較少之情形下，仍可高精度地進行CCD相機430向第2對準標記AM2之聚焦。 Therefore, even when the second alignment mark AM2 does not have sufficient reflectivity with respect to light, for example, the amount of reflected light from the second alignment mark AM2 is small, the CCD camera 430 can be accurately performed. Focusing on the second alignment mark AM2.
藉由在如此將焦點對準第2對準標記AM2之狀態下進行對準處理，在該實施形態中，可高精度地進行基板SB、與承載於橡皮布BL之圖案之位置對準。且，在該狀態下基板SB與橡皮布BL抵接，藉此可高精度地將圖案轉印於基板SB之特定位置。 By performing alignment processing in a state where the focus is aligned on the second alignment mark AM2 as described above, in this embodiment, the substrate SB can be accurately aligned with the position of the pattern carried on the blanket BL. Further, in this state, the substrate SB is in contact with the blanket BL, whereby the pattern can be transferred to a specific position of the substrate SB with high precision.
如以上說明般，在該實施形態中，橡皮布BL相當於本 發明之「承載體」，第2對準標記AM2相當於本發明之「對準標記」。另一方面，形成於基板SB上之第1對準標記AM1相當於本發明之「基板側對準標記」。 As described above, in this embodiment, the blanket BL corresponds to the present. In the "carrier" of the invention, the second alignment mark AM2 corresponds to the "alignment mark" of the present invention. On the other hand, the first alignment mark AM1 formed on the substrate SB corresponds to the "substrate side alignment mark" of the present invention.
又，在上述實施形態中，上載台部3及下載台部5係一體作為本發明之「保持機構」發揮功能。又，拍攝部43作為本發明之「拍攝機構」發揮功能，其中精密升降平台432作為本發明之「聚焦調整機構」發揮功能。又，圖像處理部65作為本發明之「圖像處理機構」發揮功能，另一方面，對準部4、其中尤其對準載台42作為本發明之「對準機構」發揮功能。 Further, in the above embodiment, the loading table unit 3 and the downloading station unit 5 integrally function as the "holding mechanism" of the present invention. Further, the imaging unit 43 functions as the "imaging mechanism" of the present invention, and the precision lifting platform 432 functions as the "focus adjustment mechanism" of the present invention. Further, the image processing unit 65 functions as the "image processing means" of the present invention, and the alignment unit 4, in particular, the alignment stage 42 functions as the "alignment mechanism" of the present invention.
另，本發明並非限定於上述實施形態，在不脫離其宗旨之限度內，可於上述者以外進行各種變更。例如，上述實施形態所示之對準標記之形狀不過為一例，可於上述以外採用各種形狀。然而，由於如上所述般設想有焦點未對準之狀態下之拍攝，故為了在如此之狀態下仍可容易地檢測，期望特徵在於對準標記之圖像具有之空間頻率成分。 The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention. For example, the shape of the alignment mark shown in the above embodiment is merely an example, and various shapes can be employed in addition to the above. However, since photographing in a state in which the focus is misaligned is conceived as described above, in order to be easily detectable in such a state, it is desirable to have a spatial frequency component which the image of the alignment mark has.
即，關於形成於基板SB上之第1對準標記AM1，較好為以在焦點未對準之狀態下仍可高精度地檢測其重心位置之方式，大量包含較低之頻率成分，且相對重心關於若干旋轉角度點對稱之圖形。又，關於形成於橡皮布BL上之第2對準標記AM2，從提高相對雜訊之耐性來看，期望為大量包含較高之頻率成分，且具有可利用窄頻帶之帶通濾波處理而擷取之特徵部份者。 In other words, it is preferable that the first alignment mark AM1 formed on the substrate SB can detect the position of the center of gravity with high precision even when the focus is not aligned, and a large number of lower frequency components are included and relatively The center of gravity is a point symmetrical graph about several angles of rotation. Further, the second alignment mark AM2 formed on the blanket BL is expected to have a high frequency component in a large amount and a band pass filter process capable of using a narrow band in view of improving resistance to relative noise. Take the feature part.
又，在上述實施形態中，雖藉由將利用低通濾波器除去 隨機雜訊成分之圖像資料(第1資料)除以自該資料進一步除去高頻成分之資料(第2資料)而作為實質之帶通濾波處理，但亦可利用與自第1資料除去低頻成分之高通濾波器之組合而實現帶通濾波。又，在陰影等之低頻率成分之雜訊不會成為問題之拍攝系統中，可省去低頻成分之除去。 Further, in the above embodiment, the low pass filter is used to remove The image data (the first data) of the random noise component is divided into the data of the high-frequency component (the second data) from the data, and is used as the substantial bandpass filtering process. However, the low frequency can be removed from the first data. Bandpass filtering is achieved by a combination of high pass filters of components. Further, in an imaging system in which noise of a low frequency component such as a shadow is not a problem, the removal of low frequency components can be omitted.
又，在上述實施形態中，雖藉由以精密升降載台432使CCD相機430整體上下而進行聚焦，但可取而代之，藉由設置包含複數個透鏡之成像光學系統調節該透鏡間之距離而進行聚焦。 Further, in the above-described embodiment, the CCD camera 430 is vertically moved up and down by the fine lifting stage 432. Alternatively, the distance between the lenses may be adjusted by providing an imaging optical system including a plurality of lenses. Focus.
又，上述實施形態中雖在基板SB及橡皮布BL之4個角部之附近形成有4組對準標記，但對準標記之形成個數並非限定於此而為任意。然而，為適當地修正繞著鉛直軸之位置偏移，較好為使用不同位置上所形成之複數組對準標記，且更期望該等位於儘可能地分離之位置。又，為抑制由各相機之位置偏移而引起之誤差，期望設置3組以上之對準標記。 Further, in the above-described embodiment, four sets of alignment marks are formed in the vicinity of the four corner portions of the substrate SB and the blanket BL, but the number of the alignment marks is not limited thereto. However, in order to properly correct the positional deviation around the vertical axis, it is preferable to use the complex array alignment marks formed at different positions, and it is more desirable that the positions are located as far as possible. Further, in order to suppress an error caused by the positional shift of each camera, it is desirable to provide three or more sets of alignment marks.
又，上述實施形態中雖利用與圖案形成材料相同之材料形成有橡皮布BL上之對準標記，但此點並非必須之必要條件，例如亦可將不轉印於基板之對準標記預先形成於橡皮布BL。該情形時，由於為以較高之位置精度進行向基板SB之圖案轉印而承載於橡皮布BL上之圖案之位置精度較重要，故進行利用版PP之對橡皮布BL之圖案化時，需要更精密地進行版PP與橡皮布BL之位置對準。 Further, in the above-described embodiment, the alignment mark on the blanket BL is formed of the same material as the pattern forming material. However, this is not a necessary condition. For example, the alignment mark not transferred to the substrate may be formed in advance. On the blanket BL. In this case, since the positional accuracy of the pattern carried on the blanket BL by the pattern transfer to the substrate SB with high positional accuracy is important, when patterning the blanket BL by the plate PP is performed, It is necessary to perform the positional alignment of the plate PP and the blanket BL more precisely.
又，在上述實施形態中，基板SB側之對準標記轉印區域 TR為無任何特別設置之空白區域。然而，例如由於事後會進行轉印於此處之第2對準標記AM2之位置確認，故可對應應轉印之第2對準標記之各者而預先設置不會對對準處理帶來影響之程度之較小之標記。 Further, in the above embodiment, the alignment mark transfer area on the substrate SB side TR is a blank area without any special settings. However, for example, since the position of the second alignment mark AM2 transferred here is confirmed afterwards, it is possible to set in advance for each of the second alignment marks to be transferred without affecting the alignment process. A lesser degree of marking.
又，上述實施形態中雖在基板SB上設置有最大可轉印9個第2對準標記AM2之對準標記轉印區域TR，但轉印於基板SB之第2對準標記AM2之個數、即向基板SB之圖案轉印之次數為任意。即使在例如向基板SB之圖案轉印為1次之情形下，上述聚焦動作仍為有效地發揮功能者。 Further, in the above embodiment, the number of the second alignment marks AM2 transferred to the substrate SB is set on the substrate SB with the alignment mark transfer region TR in which the nine second alignment marks AM2 can be transferred at the maximum. That is, the number of times of pattern transfer to the substrate SB is arbitrary. Even in the case where, for example, the pattern is transferred to the substrate SB once, the above-described focusing operation is effective.
又，在上述實施形態中，在本發明之轉印裝置之一實施態樣即印刷裝置之內部進行對橡皮布BL之圖案化。然而，本發明並非限定於此，為亦可適宜地應用於例如搬入在外部進行圖案化之橡皮布而進行向基板之圖案轉印之裝置者。 Further, in the above embodiment, the patterning of the blanket BL is performed inside the printing apparatus which is one embodiment of the transfer device of the present invention. However, the present invention is not limited thereto, and may be suitably applied to, for example, a device that carries a pattern that is patterned on the outside and that transfers the pattern to the substrate.
本發明可適宜地應用於要求以高精度進行承載圖案之承載體、與轉印該圖案之基板之位置對準之技術領域。 The present invention can be suitably applied to a technical field in which a carrier carrying a pattern with high precision and a position of a substrate on which the pattern is transferred are aligned.
1‧‧‧石材板 1‧‧‧ Stone board
2‧‧‧搬運部 2‧‧‧Transportation Department
3‧‧‧上載台部(保持機構) 3‧‧‧Uploading Department (Maintenance Agency)
4‧‧‧對準部 4‧‧‧Alignment Department
5‧‧‧下載台部(保持機構) 5‧‧‧Download station (maintaining agency)
6‧‧‧控制部 6‧‧‧Control Department
7‧‧‧推壓部 7‧‧‧Pushing Department
8‧‧‧預對準部 8‧‧‧Pre-alignment
9‧‧‧除電部 9‧‧‧Department of Electricity
21‧‧‧滾珠螺桿機構 21‧‧‧Rolling screw mechanism
22‧‧‧梭保持板 22‧‧‧ Shuttle retention plate
23L‧‧‧梭 23L‧‧‧ Shuttle
23R‧‧‧梭 23R‧‧‧ Shuttle
31‧‧‧滾珠螺桿機構 31‧‧‧Rolling screw mechanism
32‧‧‧支撐框架 32‧‧‧Support frame
33‧‧‧載台固持器 33‧‧‧stage holder
34‧‧‧吸附板 34‧‧‧Adsorption plate
41‧‧‧支撐板 41‧‧‧Support plate
42‧‧‧對準載台(對準機構) 42‧‧‧Aligning the stage (alignment mechanism)
43‧‧‧拍攝部(拍攝機構) 43‧‧‧Photography Department (photographing agency)
51‧‧‧吸附板 51‧‧‧Adsorption plate
52‧‧‧柱構件 52‧‧‧column components
52a‧‧‧石英窗 52a‧‧‧Quartz window
53‧‧‧載台基底 53‧‧‧Substrate base
54‧‧‧頂升銷部 54‧‧‧Top Sales Department
61‧‧‧CPU 61‧‧‧CPU
62‧‧‧記憶體 62‧‧‧ memory
63‧‧‧馬達控制部 63‧‧‧Motor Control Department
64‧‧‧閥門控制部 64‧‧‧ Valve Control Department
65‧‧‧圖像處理部(圖像處理機構) 65‧‧‧Image Processing Department (Image Processing Organization)
66‧‧‧顯示/操作部 66‧‧‧Display/Operation Department
71‧‧‧推壓構件 71‧‧‧ Pushing members
81‧‧‧預對準上部 81‧‧‧Pre-aligned upper part
82‧‧‧預對準下部 82‧‧‧Pre-aligned lower part
91‧‧‧電離器 91‧‧‧Ionizer
100‧‧‧印刷裝置(轉印裝置) 100‧‧‧Printing device (transfer device)
231‧‧‧升降板 231‧‧‧ lifting plate
232‧‧‧指針 232‧‧ pointer
421‧‧‧載台基底 421‧‧‧Substrate base
422‧‧‧載台頂部 422‧‧‧The top of the stage
423‧‧‧支撐機構 423‧‧‧Support institutions
423a‧‧‧支撐機構 423a‧‧‧Support institutions
423b‧‧‧支撐機構 423b‧‧‧Support institutions
423c‧‧‧支撐機構 423c‧‧‧Support institutions
423d‧‧‧支撐機構 423d‧‧‧Support institutions
430‧‧‧CCD相機 430‧‧‧CCD camera
431‧‧‧XY平台 431‧‧‧XY platform
432‧‧‧精密升降平台(聚焦調整機構) 432‧‧‧Precision lifting platform (focus adjustment mechanism)
435‧‧‧物鏡 435‧‧‧ objective lens
436‧‧‧光源 436‧‧‧Light source
437‧‧‧半鏡面 437‧‧‧Half mirror
438‧‧‧受光面 438‧‧‧Glossy surface
541‧‧‧升降板 541‧‧‧ lifting plate
542‧‧‧頂升銷 542‧‧‧ top sales
811‧‧‧框架構造體 811‧‧‧Frame structure
812‧‧‧上導向器 812‧‧‧Upper guide
822‧‧‧下導向器 822‧‧‧ lower guide
A‧‧‧所拍攝之圖像資料 Image data taken by A‧‧‧
AM1‧‧‧第1對準標記(基板側對準標記) AM1‧‧‧1st alignment mark (substrate side alignment mark)
AM2‧‧‧第2對準標記(對準標記) AM2‧‧‧2nd alignment mark (alignment mark)
AM21‧‧‧第2對準標記 AM21‧‧‧2nd alignment mark
AM22‧‧‧第2對準標記 AM22‧‧‧2nd alignment mark
AP1‧‧‧第1對準圖案 AP1‧‧‧1st alignment pattern
AP2‧‧‧第2對準圖案 AP2‧‧‧2nd alignment pattern
AP11‧‧‧第1對準圖案 AP11‧‧‧1st alignment pattern
AP12‧‧‧第1對準圖案 AP12‧‧‧1st alignment pattern
AP13‧‧‧第1對準圖案 AP13‧‧‧1st alignment pattern
AP14‧‧‧第1對準圖案 AP14‧‧‧1st alignment pattern
AR‧‧‧對準標記形成區域 AR‧‧‧ alignment mark forming area
B‧‧‧排除隨機雜訊之影響之資料 B‧‧‧Removal of the effects of random noise
BL‧‧‧橡皮布(承載體) BL‧‧‧ blanket (carrier)
C‧‧‧已擷取較低之空間頻率成分之資料 C‧‧‧ has taken information on lower spatial frequency components
CL51‧‧‧銷升降缸 CL51‧‧‧ pin lifting cylinder
CL52‧‧‧感測器水平驅動缸 CL52‧‧‧Sensor horizontal drive cylinder
CL71‧‧‧推壓構件升降缸 CL71‧‧‧Pushing member lifting cylinder
D‧‧‧增強邊緣部分之資料 D‧‧‧Enhanced information on the marginal part
G1m‧‧‧重心位置 G1m‧‧‧ center of gravity
G2m‧‧‧重心位置 G2m‧‧‧ center of gravity
G2t‧‧‧目標重心位置 G2t‧‧‧Target center of gravity
Gsb‧‧‧間隔 Gsb‧‧‧ interval
IM‧‧‧圖像 IM‧‧‧ image
M21‧‧‧梭水平驅動馬達 M21‧‧‧ shuttle horizontal drive motor
M22L‧‧‧版用梭升降馬達 M22L‧‧‧ version shuttle lift motor
M22R‧‧‧基板用梭升降馬達 M22R‧‧‧Single shuttle lift motor
M31‧‧‧第1載台升降馬達 M31‧‧‧1st stage lift motor
M32‧‧‧第2載台升降馬達 M32‧‧‧2nd stage hoist motor
M41‧‧‧載台驅動馬達 M41‧‧‧Motor drive motor
M41a‧‧‧載台驅動馬達 M41a‧‧‧Motor drive motor
M41b‧‧‧載台驅動馬達 M41b‧‧‧ stage drive motor
M41c‧‧‧載台驅動馬達 M41c‧‧‧Motor drive motor
M41d‧‧‧載台驅動馬達 M41d‧‧‧Motor drive motor
M81‧‧‧驅動馬達 M81‧‧‧ drive motor
M82‧‧‧下導向器驅動馬達 M82‧‧‧ lower guide drive motor
PP‧‧‧版 PP‧‧ version
PR‧‧‧有效圖案區域 PR‧‧‧effective pattern area
RA2‧‧‧旋轉致動器 RA2‧‧‧ Rotary Actuator
SB‧‧‧基板 SB‧‧‧ substrate
SN22‧‧‧版厚度計測感測器 SN22‧‧ version thickness measuring sensor
SN23‧‧‧基板厚度計測感測器 SN23‧‧‧ substrate thickness measurement sensor
SN51‧‧‧橡皮布厚度計測感測器 SN51‧‧‧ blanket thickness measuring sensor
SN52‧‧‧銷下降檢測感測器 SN52‧‧‧ pin drop detection sensor
TR‧‧‧對準標記轉印區域 TR‧‧‧Alignment mark transfer area
V31‧‧‧吸附閥門 V31‧‧‧Adsorption valve
V51‧‧‧加壓閥門 V51‧‧‧Pressure valve
V52‧‧‧吸附閥門 V52‧‧‧Adsorption valve
Vavg‧‧‧平均位準 Vavg‧‧‧ average level
XP21‧‧‧位置 XP21‧‧‧ position
XP22‧‧‧位置 XP22‧‧‧Location
XP23‧‧‧位置 XP23‧‧‧Location
XP24‧‧‧位置 XP24‧‧‧Location
XP25‧‧‧位置 XP25‧‧‧ position
圖1係顯示裝備本發明之轉印裝置之印刷裝置之立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing a printing apparatus equipped with a transfer device of the present invention.
圖2係模式性顯示圖1所示之印刷裝置之剖面之圖。 Fig. 2 is a view schematically showing a cross section of the printing apparatus shown in Fig. 1.
圖3係顯示圖1之裝置之電性構成之方塊圖。 Figure 3 is a block diagram showing the electrical configuration of the device of Figure 1.
圖4係顯示圖1之印刷裝置之整體動作之流程圖。 4 is a flow chart showing the overall operation of the printing apparatus of FIG. 1.
圖5係顯示對準載台之詳細構造之圖。 Fig. 5 is a view showing a detailed configuration of the alignment stage.
圖6係顯示拍攝部之詳細構造之圖。 Fig. 6 is a view showing a detailed configuration of an imaging unit.
圖7A至圖7C係顯示對準標記之圖案之例之圖。 7A to 7C are views showing an example of a pattern of alignment marks.
圖8係顯示用於精密對準動作之對準標記之配置之圖。 Figure 8 is a diagram showing the configuration of alignment marks for precision alignment operations.
圖9A至圖9C係顯示以CCD相機拍攝之圖像之一例之圖。 9A to 9C are views showing an example of an image taken with a CCD camera.
圖10係顯示精密對準動作之處理流程之流程圖。 Fig. 10 is a flow chart showing the processing flow of the precise alignment action.
圖11係顯示聚焦動作之流程圖。 Figure 11 is a flow chart showing the focusing action.
圖12係顯示對比度增強之圖像資料之例之圖。 Fig. 12 is a view showing an example of image data of contrast enhancement.
圖13A、圖13B係用以說明對準標記之配置之圖。 13A and 13B are views for explaining the arrangement of alignment marks.
A‧‧‧所拍攝之圖像資料 Image data taken by A‧‧‧
AP2‧‧‧對準圖案 AP2‧‧‧ alignment pattern
B‧‧‧排除隨機雜訊之影響之資料 B‧‧‧Removal of the effects of random noise
C‧‧‧已擷取較低之空間頻率成分之資料 C‧‧‧ has taken information on lower spatial frequency components
D‧‧‧增強邊緣部分之資料 D‧‧‧Enhanced information on the marginal part
Vavg‧‧‧平均位準 Vavg‧‧‧ average level
Claims (11)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012069934A JP5948102B2 (en) | 2012-03-26 | 2012-03-26 | Transfer apparatus and transfer method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201338997A true TW201338997A (en) | 2013-10-01 |
| TWI500520B TWI500520B (en) | 2015-09-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101139360A TWI500520B (en) | 2012-03-26 | 2012-10-24 | Transfer apparatus and transfer method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5948102B2 (en) |
| KR (1) | KR101453613B1 (en) |
| CN (1) | CN103358674B (en) |
| TW (1) | TWI500520B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI596018B (en) * | 2014-08-12 | 2017-08-21 | 斯克林集團公司 | Removing method, removing apparatus and printing system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017109379A (en) * | 2015-12-16 | 2017-06-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Transfer device |
| CN117516395B (en) * | 2024-01-05 | 2024-03-22 | 常州新区盛晖针纺织品有限公司 | Detection device and detection method for blanket production |
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| AU2001273491A1 (en) * | 2000-07-16 | 2002-02-05 | Board Of Regents, The University Of Texas System | High-resolution overlay alignment methods and systems for imprint lithography |
| JP2002036512A (en) * | 2000-07-26 | 2002-02-05 | Canon Inc | Apparatus and method for offset printing, and image forming apparatus using the same |
| KR20030040378A (en) * | 2000-08-01 | 2003-05-22 | 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 | Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography |
| JP2003141550A (en) * | 2001-11-05 | 2003-05-16 | Canon Inc | Position detection method |
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| JP2003282410A (en) * | 2002-03-25 | 2003-10-03 | Nikon Corp | Alignment equipment, aligner and method of exposure |
| JP2004151653A (en) * | 2002-11-01 | 2004-05-27 | Seiko Epson Corp | Electro-optic device, method and device for manufacturing electro-optic device and electronic equipment |
| JP2004356156A (en) * | 2003-05-27 | 2004-12-16 | Riipuru:Kk | Method and equipment for aligning mask and wafer |
| KR101212223B1 (en) * | 2005-07-18 | 2012-12-13 | 삼성디스플레이 주식회사 | Device taking a picture and method to generating the image with depth information |
| JP4767641B2 (en) * | 2005-09-27 | 2011-09-07 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate transfer method |
| JP4958614B2 (en) * | 2006-04-18 | 2012-06-20 | キヤノン株式会社 | Pattern transfer apparatus, imprint apparatus, pattern transfer method, and alignment apparatus |
| JP2008124142A (en) * | 2006-11-09 | 2008-05-29 | Dainippon Screen Mfg Co Ltd | Position detecting method and apparatus, pattern drawing apparatus, and object to be detected |
| JP2008254405A (en) * | 2007-04-09 | 2008-10-23 | Nec Lcd Technologies Ltd | Printing method, printer, and liquid-crystal display device manufactured by using the printing method |
| KR101150987B1 (en) * | 2007-07-16 | 2012-06-08 | 삼성전자주식회사 | Image processing apparatus and control method thereof |
| JP5219865B2 (en) * | 2008-02-13 | 2013-06-26 | キヤノン株式会社 | Imaging apparatus and focus control method |
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| KR101037607B1 (en) * | 2009-07-28 | 2011-05-27 | 주식회사 나래나노텍 | Intaglio Stamping-Type Off-Set Printing Apparatus and Printing System, and Intaglio Stamping-Type Off-Set Printing Method |
-
2012
- 2012-03-26 JP JP2012069934A patent/JP5948102B2/en not_active Expired - Fee Related
- 2012-10-24 TW TW101139360A patent/TWI500520B/en not_active IP Right Cessation
- 2012-10-30 KR KR1020120121003A patent/KR101453613B1/en active IP Right Grant
- 2012-12-10 CN CN201210528499.4A patent/CN103358674B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI596018B (en) * | 2014-08-12 | 2017-08-21 | 斯克林集團公司 | Removing method, removing apparatus and printing system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013200269A (en) | 2013-10-03 |
| KR20130108964A (en) | 2013-10-07 |
| CN103358674B (en) | 2015-10-14 |
| TWI500520B (en) | 2015-09-21 |
| CN103358674A (en) | 2013-10-23 |
| JP5948102B2 (en) | 2016-07-06 |
| KR101453613B1 (en) | 2014-10-21 |
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