TW201335961A - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitor Download PDFInfo
- Publication number
- TW201335961A TW201335961A TW101128143A TW101128143A TW201335961A TW 201335961 A TW201335961 A TW 201335961A TW 101128143 A TW101128143 A TW 101128143A TW 101128143 A TW101128143 A TW 101128143A TW 201335961 A TW201335961 A TW 201335961A
- Authority
- TW
- Taiwan
- Prior art keywords
- lead terminal
- anode
- cathode
- foil
- electrolytic capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 72
- 239000007787 solid Substances 0.000 title claims abstract description 66
- 239000011888 foil Substances 0.000 claims abstract description 118
- 239000007784 solid electrolyte Substances 0.000 claims abstract description 14
- 238000004804 winding Methods 0.000 claims description 47
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000003068 static effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 239000010410 layer Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000003466 welding Methods 0.000 description 10
- 239000000835 fiber Substances 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007800 oxidant agent Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- FLDCSPABIQBYKP-UHFFFAOYSA-N 5-chloro-1,2-dimethylbenzimidazole Chemical compound ClC1=CC=C2N(C)C(C)=NC2=C1 FLDCSPABIQBYKP-UHFFFAOYSA-N 0.000 description 2
- 239000001741 Ammonium adipate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 235000019293 ammonium adipate Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- WHRAZOIDGKIQEA-UHFFFAOYSA-L iron(2+);4-methylbenzenesulfonate Chemical compound [Fe+2].CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 WHRAZOIDGKIQEA-UHFFFAOYSA-L 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- -1 organic acid salt Chemical class 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/151—Solid electrolytic capacitors with wound foil electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
本發明係關於一種固體電解電容器。 The present invention relates to a solid electrolytic capacitor.
近年來，隨著電子機器之高性能化際小型化，顧及零件之安裝密度之模塑芯片(Molded Chip)零件成為主流。鋁電解電容器亦不例外，表面安裝(Surfaced Mounting Technology，SMT)之鋁電解電容器亦得到廣泛應用。 In recent years, with the miniaturization of high-performance electronic devices, Molded Chip parts that take into account the mounting density of parts have become mainstream. Aluminum electrolytic capacitors are no exception, and surface mount technology (SMT) aluminum electrolytic capacitors are also widely used.
表面安裝技術係新一代的電子組裝技術，將傳統的電子零件壓縮成原有體積的幾十分之一，實現了電子零件安裝之高密度、高可靠性、小型化、低成本及生產之自動化。然而，就鋁電解電容器而言，一般的表面安裝品係縱型(通稱為V型)，應用在要求薄型之電子機器中時受到限制。 Surface Mount Technology is a new generation of electronic assembly technology that compresses traditional electronic components into one-tenth of the original volume, enabling high-density, high-reliability, miniaturization, low-cost, and automated production of electronic components. . However, in the case of an aluminum electrolytic capacitor, a general surface mount product is a vertical type (generally referred to as a V type), and is limited in applications requiring a thin electronic machine.
作為克服該缺陷之技術，提出將聚苯胺用在固體電解質層中之捲繞型模塑芯片。然而，因對圓柱形之捲繞元件進行模塑，故捲繞元件之徑長受到制約，封裝後，厚度依然會佔據較大的空間，從而存在難以滿足更薄的要求這一問題。而且，第二個問題係，雖然存在具有能夠較薄地形成元件之積層構造的模塑芯片型固體電解電容器，但當形成作為固體電解質層之聚吡咯時，於在第一層上形成化學聚合膜、使第二層電解聚合之方法中，電解聚合需要花費較長時間，且該電解聚合必需為單層處理而且必需按照積層片數進行焊接，故存在需要花費工時這一問題。 As a technique for overcoming this drawback, a wound type molded chip in which polyaniline is used in a solid electrolyte layer has been proposed. However, since the cylindrical winding member is molded, the diameter of the wound member is restricted, and the thickness still occupies a large space after the package, so that it is difficult to satisfy the thinner requirement. Further, the second problem is that although there is a molded chip type solid electrolytic capacitor having a laminated structure capable of forming a thinner element, when a polypyrrole as a solid electrolyte layer is formed, a chemical polymerization film is formed on the first layer. In the method of electrolytically polymerizing the second layer, electrolytic polymerization takes a long time, and the electrolytic polymerization must be a single layer treatment and it is necessary to perform welding in accordance with the number of laminated sheets, so that there is a problem that labor is required.
鑒於該等問題，提出如下之固體電解電容器，其包括：長方體之元件，其使陽極箔、陰極箔及隔在陽極箔與陰極箔之間的間隔件捲繞，進而使其變得扁平而成為長方體，利用化學聚合而形成固體電解質；電極引出端子，其連接於元件；及封裝體，對該長方體之元件進行封裝(例如，參照專利文獻1)。 In view of such problems, there is proposed a solid electrolytic capacitor comprising: a rectangular parallelepiped member which winds an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil to further flatten The rectangular parallelepiped forms a solid electrolyte by chemical polymerization; an electrode lead terminal is connected to the element; and a package body is used to encapsulate the rectangular parallelepiped element (for example, refer to Patent Document 1).
圖12係示意性地表示先前之固體電解電容器的縱剖面圖。 Fig. 12 is a longitudinal sectional view schematically showing a conventional solid electrolytic capacitor.
固體電解電容器101包括：長方體之元件110，其使陽極箔、陰極箔及隔在陽極箔與陰極箔之間的間隔件捲繞，進而使其變得扁平而成為長方體，並形成固體電解質；陽極引出端子121及陰極引出端子122，其連接於元件110；及，封裝體130，其對該長方體之元件110進行封裝。陽極引出端子121自元件110之一個端面110a露出，且連接於引線框架140。陰極引出端子122自元件110之另一個端面110b露出，且連接於引線框架140。 The solid electrolytic capacitor 101 includes a rectangular parallelepiped member 110 which winds an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil, thereby flattening it into a rectangular parallelepiped, and forming a solid electrolyte; The lead terminal 121 and the cathode lead terminal 122 are connected to the element 110; and the package body 130 encapsulates the rectangular parallelepiped element 110. The anode lead terminal 121 is exposed from one end surface 110a of the element 110 and is connected to the lead frame 140. The cathode lead terminal 122 is exposed from the other end surface 110b of the element 110 and is connected to the lead frame 140.
根據專利文獻1中揭示之固體電解電容器，能滿足更薄之要求，且能抑制工時之增加。而且，與先前之鉭電容器相比，無需使用銀或鉭等貴金屬，因此能實現低成本化。 According to the solid electrolytic capacitor disclosed in Patent Document 1, the thinner requirements can be satisfied, and the increase in man-hours can be suppressed. Moreover, compared with the conventional tantalum capacitor, it is not necessary to use a noble metal such as silver or tantalum, so that cost reduction can be achieved.
[專利文獻1]中華人民共和國專利申請公開第101527203號說明書 [Patent Document 1] Patent Application Publication No. 101527203 of the People's Republic of China
然而，於專利文獻1所揭示之固體電解電容器中，如圖12所示，連接於陽極箔之陽極引出端子121及連接於陰極箔之陰極引出端子122係以卷芯(一點鏈線)為中心而配置於兩側(對稱)，因此，在元件110之厚度方向上，陽極引出端子121之位置(高度)與陰極引出端子122之位置(高度)存在較大差異。但是，於固體電解電容器101中，通常，在利用樹脂對元件110進行密封而形成封裝體130時，必需使自封裝體130露出之引線框架140之高度一致。因此，在專利文獻1所揭示之固體電解電容器中，因對引線框架140進行彎曲加工而設置階差140a，故必需調整引線框架140與陰極引出端子122之連接位置上之引線框架140的高度，從而存在製造步驟繁瑣化這一問題。 However, in the solid electrolytic capacitor disclosed in Patent Document 1, as shown in FIG. 12, the anode lead terminal 121 connected to the anode foil and the cathode lead terminal 122 connected to the cathode foil are centered on the winding core (single chain line) On the other hand, it is disposed on both sides (symmetric), and therefore, in the thickness direction of the element 110, the position (height) of the anode lead terminal 121 and the position (height) of the cathode lead terminal 122 are largely different. However, in the solid electrolytic capacitor 101, when the package body 130 is formed by sealing the element 110 with a resin, it is necessary to make the height of the lead frame 140 exposed from the package 130 uniform. Therefore, in the solid electrolytic capacitor disclosed in Patent Document 1, since the step 140a is provided by bending the lead frame 140, it is necessary to adjust the height of the lead frame 140 at the connection position between the lead frame 140 and the cathode lead terminal 122. Therefore, there is a problem that the manufacturing steps are complicated.
而且，若在引線框架140上設置階差140a，則必需對該階差部分亦利用樹脂進行密封，因此必然會使電極箔(例如，陽極箔)縮短。因此，存在電容器之靜電電容受到限制這一問題。 Further, if the step 140a is provided on the lead frame 140, it is necessary to seal the step portion with a resin, so that the electrode foil (for example, the anode foil) is inevitably shortened. Therefore, there is a problem that the electrostatic capacitance of the capacitor is limited.
本發明係鑒於上述課題而研製，其目的在於提供一種能避免製造步驟之繁瑣化、且能增加靜電電容之固體電解電容器。 The present invention has been made in view of the above problems, and an object thereof is to provide a solid electrolytic capacitor which can avoid cumbersome manufacturing steps and can increase electrostatic capacitance.
本發明之固體電解電容器包括：長方體之元件，其使由陽極箔、陰極箔、及隔在陽極箔與陰極箔之間的間隔件捲繞而成之捲繞元件變得扁平而成為長方體，並形成固體電 解質；陽極引出端子，其連接於上述陽極箔，且自上述元件的一端露出；陰極引出端子，其連接於上述陰極箔，且自上述元件的另一端露出；及封裝體，其對上述元件進行封裝；且，上述陽極引出端子及上述陰極引出端子該兩者相對於上述元件之卷芯而配置於單側。 The solid electrolytic capacitor of the present invention comprises: a rectangular parallelepiped member which flattens a coiled member formed by winding an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil into a rectangular parallelepiped, and Solid electricity Decomposition; an anode lead terminal connected to the anode foil and exposed from one end of the element; a cathode lead terminal connected to the cathode foil and exposed from the other end of the element; and a package facing the above element The package is provided; and the anode lead terminal and the cathode lead terminal are disposed on one side with respect to the core of the element.
先前之方法中，陽極引出端子及陰極引出端子係以卷芯為中心而配置於兩側，且需要對引線框架進行彎曲加工，從而電極箔之寬度受到限制。然而，本發明中，藉由將陽極引出端子及陰極引出端子配置於卷芯之單側，從而能減小陽極引出端子及陰極引出端子之階差，無需對引線框架進行彎曲加工，因此能避免製造步驟之繁瑣化。而且，因無需設置引線框架之彎曲階差，故能擴大電極箔之寬度(面積)。因此能增加電容器之靜電電容值。根據本發明之固體電解電容器，與同尺寸的先前之固體電解電容器(參照專利文獻1)相比，能夠將靜電電容值增加至例如約1.2~1.5倍。 In the prior method, the anode lead terminal and the cathode lead terminal are disposed on both sides centering on the winding core, and the lead frame needs to be bent, so that the width of the electrode foil is limited. However, in the present invention, since the anode lead terminal and the cathode lead terminal are disposed on one side of the winding core, the step difference between the anode lead terminal and the cathode lead terminal can be reduced, and the lead frame does not need to be bent, thereby avoiding The manufacturing steps are cumbersome. Further, since it is not necessary to provide a bending step of the lead frame, the width (area) of the electrode foil can be increased. Therefore, the electrostatic capacitance value of the capacitor can be increased. According to the solid electrolytic capacitor of the present invention, the electrostatic capacitance value can be increased to, for example, about 1.2 to 1.5 times as compared with the conventional solid electrolytic capacitor of the same size (see Patent Document 1).
為了更容易地理解本發明的上述目的、特徵及優點，以下，參照附圖對本發明的具體實施形態進行詳細說明。為了便於理解本發明，在以下說明中雖記載詳細的內容，但本發明亦可在以下實施形態以外之範圍內實施，而並不限於以下實施形態。而且，附圖並非按照實際之尺寸製成，僅為概略圖或者示意圖，因此本發明並不受附圖的限制。 而且，附圖中，為了強調本發明之特徵部分，有時會省略一部分構成來進行表示。 In the following, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. In order to facilitate the understanding of the present invention, the details are described in the following description, but the present invention may be practiced in other than the following embodiments, and is not limited to the following embodiments. Further, the drawings are not to be considered as to Further, in the drawings, in order to emphasize the characteristic portions of the present invention, a part of the configuration may be omitted.
圖1係示意性地表示本申請發明之一實施形態中之固體電解電容器之概略縱剖面圖。圖2係示意性地表示本申請發明之一實施形態中之固體電解電容器之固體電解質形成前的分解構造之概略立體圖。 Fig. 1 is a schematic longitudinal cross-sectional view showing a solid electrolytic capacitor in an embodiment of the present invention. FIG. 2 is a schematic perspective view showing an exploded structure before formation of a solid electrolyte of a solid electrolytic capacitor according to an embodiment of the present invention.
如圖2所示，固體電解電容器1包括：長方體之元件10，其使由陽極箔11、陰極箔12、及配置於陽極箔11與陰極箔12之間的間隔件13捲繞而成之捲繞元件變得扁平而成為長方體，並形成固體電解質；陽極引出端子21，其連接於陽極箔11；陰極引出端子22，其連接於陰極箔12；及封裝體30，其對元件10進行樹脂模塑而進行封裝(參照圖1)。 As shown in FIG. 2, the solid electrolytic capacitor 1 includes a rectangular parallelepiped member 10 which is wound up from an anode foil 11, a cathode foil 12, and a spacer 13 disposed between the anode foil 11 and the cathode foil 12. The winding element becomes flat and becomes a rectangular parallelepiped, and forms a solid electrolyte; an anode lead terminal 21 connected to the anode foil 11; a cathode lead terminal 22 connected to the cathode foil 12; and a package body 30 which performs a resin mold on the element 10. The package is molded by plastic (refer to Fig. 1).
圖2中，捲繞固定帶14之端部係自由的，但實際上捲繞固定帶14之端部貼附於元件10之側面。而且，亦有不使用捲繞固定帶而是使用接著劑進行貼附之方法。如圖2所示，陽極箔11及陰極箔12整體為帶狀。於陽極箔11與陰極箔12之間設有間隔件13。作為由陽極箔及陰極箔各自之表面及間隔件13保持之固體電解質，可使用導電性高分子。作為導電性高分子，可列舉例如聚-3,4-乙二氧基噻吩等。 In Fig. 2, the end portion of the winding fixing belt 14 is free, but actually the end portion of the winding fixing belt 14 is attached to the side of the element 10. Further, there is also a method of attaching using an adhesive without using a winding fixing tape. As shown in FIG. 2, the anode foil 11 and the cathode foil 12 have a strip shape as a whole. A spacer 13 is provided between the anode foil 11 and the cathode foil 12. As the solid electrolyte held by the surface of each of the anode foil and the cathode foil and the separator 13, a conductive polymer can be used. Examples of the conductive polymer include poly-3,4-ethylenedioxythiophene.
陽極箔11包含第一閥金屬層(未圖示)、及形成於第一閥金屬層表面上之介電氧化皮膜(未圖示)。作為此處之閥金屬，可列舉鋁、鉭、鈮、鈦等金屬。本實施形態中使用鋁。上述介電氧化皮膜係經過蝕刻處理及化成處理後形成於上述第一閥金屬層之表面。本實施形態中，介電氧化皮 膜係氧化鋁。 The anode foil 11 includes a first valve metal layer (not shown) and a dielectric oxide film (not shown) formed on the surface of the first valve metal layer. Examples of the valve metal herein include metals such as aluminum, ruthenium, iridium, and titanium. Aluminum is used in the present embodiment. The dielectric oxide film is formed on the surface of the first valve metal layer after being subjected to an etching treatment and a chemical conversion treatment. In this embodiment, the dielectric scale Membrane alumina.
陰極箔12包含第二閥金屬層(未圖示)、及附著於第二閥金屬層表面上之碳化物粒子層(未圖示)。作為此處之閥金屬，可列舉鋁、鉭、鈮、鈦等金屬。本實施形態中使用鋁。 The cathode foil 12 includes a second valve metal layer (not shown) and a carbide particle layer (not shown) attached to the surface of the second valve metal layer. Examples of the valve metal herein include metals such as aluminum, ruthenium, iridium, and titanium. Aluminum is used in the present embodiment.
如圖1所示，固體電解電容器1包括陽極引出端子21及陰極引出端子22。陽極引出端子21連接於陽極箔(參照圖2)。陰極引出端子22連接於陰極箔(參照圖2)。 As shown in FIG. 1, the solid electrolytic capacitor 1 includes an anode lead terminal 21 and a cathode lead terminal 22. The anode lead terminal 21 is connected to the anode foil (refer to FIG. 2). The cathode lead terminal 22 is connected to the cathode foil (see Fig. 2).
如圖1所示，陽極引出端子21自元件10之一個端面10a露出。陰極引出端子22自元件10之另一個端面10b露出。端面10a、10b係元件10之與陽極箔11及陰極箔12之捲繞之軸線垂直的面。換而言之，係與陽極箔11及陰極箔12之寬度方向垂直的面。而且，元件10之與陽極箔11及陰極箔12之捲繞之軸線平行之面為元件10之側面。 As shown in FIG. 1, the anode lead terminal 21 is exposed from one end face 10a of the element 10. The cathode lead terminal 22 is exposed from the other end face 10b of the element 10. The end faces 10a, 10b are faces perpendicular to the axis of winding of the anode foil 11 and the cathode foil 12 of the component 10. In other words, it is a surface perpendicular to the width direction of the anode foil 11 and the cathode foil 12. Further, the surface of the element 10 which is parallel to the winding axis of the anode foil 11 and the cathode foil 12 is the side surface of the element 10.
陽極引出端子21之露出部21a及陰極引出端子22的露出部22a包含非閥金屬。陽極引出端子之連接部21b及陰極引出端子之連接部22b包含閥金屬。另外，陽極引出端子21的露出部21a及陰極引出端子22的露出部22a亦可包含閥金屬。陽極引出端子21及陰極引出端子22兩者相對於元件10之卷芯10c而配置於單側。藉此，能夠減小元件10外的陽極引出端子21與陰極引出端子22的高度差。 The exposed portion 21a of the anode lead terminal 21 and the exposed portion 22a of the cathode lead terminal 22 include a non-valve metal. The connection portion 21b of the anode lead terminal and the connection portion 22b of the cathode lead terminal include a valve metal. Further, the exposed portion 21a of the anode lead terminal 21 and the exposed portion 22a of the cathode lead terminal 22 may include a valve metal. Both the anode lead terminal 21 and the cathode lead terminal 22 are disposed on one side with respect to the winding core 10c of the element 10. Thereby, the height difference between the anode lead terminal 21 and the cathode lead terminal 22 outside the element 10 can be reduced.
而且，於元件10內，與陽極引出端子21相比，陰極引出端子22更靠近卷芯10c(參照圖3(a))。陽極箔11上形成與額定電壓成正比例的較厚的介電氧化皮膜，相對於此，陰極 箔12上未形成此種氧化皮膜。因此，陰極箔12比陽極箔11薄且柔軟。本實施形態中，將陽極引出端子21連接於陽極箔11，且將陰極引出端子22連接於陰極箔12，在此狀態下對捲繞元件16(參照圖6)進行加壓處理，使其變形為長方體之元件10。因此，越位於元件10之內側，越產生會引起變形之力。本實施形態中，連接於比較薄且柔軟的陰極箔12之陰極引出端子22比連接於陽極箔11之陽極引出端子21更位於內側。因此，能夠防止對陽極箔11施加過度的機械負載而損傷介電氧化皮膜從而流通較大之洩漏電流。 Further, in the element 10, the cathode lead terminal 22 is closer to the winding core 10c than the anode lead terminal 21 (see Fig. 3(a)). A thick dielectric oxide film is formed on the anode foil 11 in proportion to the rated voltage. In contrast, the cathode Such an oxide film is not formed on the foil 12. Therefore, the cathode foil 12 is thinner and softer than the anode foil 11. In the present embodiment, the anode lead terminal 21 is connected to the anode foil 11, and the cathode lead terminal 22 is connected to the cathode foil 12. In this state, the wound element 16 (see Fig. 6) is subjected to pressure treatment to be deformed. It is a component 10 of a rectangular parallelepiped. Therefore, the more the inner side of the element 10, the more the force that causes deformation. In the present embodiment, the cathode lead terminal 22 connected to the relatively thin and flexible cathode foil 12 is located further inside than the anode lead terminal 21 connected to the anode foil 11. Therefore, it is possible to prevent an excessive mechanical load from being applied to the anode foil 11 and damage the dielectric oxide film to circulate a large leakage current.
另外，於元件10外部，陽極引出端子21之厚度大於陰極引出端子22之厚度。亦即，陽極引出端子21及陰極引出端子22相對於卷芯10c而位於單側，於元件10內位於遠離卷芯10c之位置的引出端子的元件10外之厚度較大。因此，能以更高的精度使元件10外的陽極引出端子21及陰極引出端子22之高度一致。 Further, outside the element 10, the thickness of the anode lead terminal 21 is larger than the thickness of the cathode lead terminal 22. That is, the anode lead terminal 21 and the cathode lead terminal 22 are located on one side with respect to the winding core 10c, and the thickness outside the element 10 of the lead terminal located at a position away from the winding core 10c in the element 10 is large. Therefore, the heights of the anode lead terminal 21 and the cathode lead terminal 22 outside the element 10 can be made uniform with higher precision.
如圖1所示，於元件10之外部設有引線框架40。引線框架40嵌入於封裝體30內。而且，各引線框架40上連接有陽極引出端子21或者陰極引出端子22。在此構成下，當製造固體電解電容器1時，在一個引線框架40上連接有多個元件10(參照圖9、圖11)。 As shown in FIG. 1, a lead frame 40 is provided outside the element 10. The lead frame 40 is embedded in the package 30. Further, an anode lead terminal 21 or a cathode lead terminal 22 is connected to each lead frame 40. Under this configuration, when the solid electrolytic capacitor 1 is manufactured, a plurality of elements 10 are connected to one lead frame 40 (see FIGS. 9 and 11).
自封裝體30內露出的引線框架40沿著封裝體30的表面向圖1中的下側彎曲。而且，與卷芯10c相比，陽極引出端子21及陰極引出端子22更位於圖1的下側。亦即，陽極引出端子21及陰極引出端子22相對於卷芯10c而位於單側，且 引線框架40亦向同一側彎曲。 The lead frame 40 exposed from the package body 30 is bent toward the lower side in FIG. 1 along the surface of the package body 30. Further, the anode lead terminal 21 and the cathode lead terminal 22 are located on the lower side of FIG. 1 as compared with the winding core 10c. That is, the anode lead terminal 21 and the cathode lead terminal 22 are located on one side with respect to the winding core 10c, and The lead frame 40 is also bent toward the same side.
本實施形態下，陽極引出端子21及陰極引出端子22自元件10露出的所有部分均呈扁平狀。與該部分呈圓柱狀的情況相比，使陽極引出端子21及陰極引出端子22與元件10外部的導線(例如引線框架40)連接時成為面接觸，因此可獲得更大的接觸面積，從而可確保電性連接。本發明中，陽極引出端子21及陰極引出端子22的露出部分的形狀並不限定為該例，例如亦可為平板狀。 In the present embodiment, all portions of the anode lead terminal 21 and the cathode lead terminal 22 exposed from the element 10 are flat. When the anode lead terminal 21 and the cathode lead terminal 22 are connected to a lead wire outside the element 10 (for example, the lead frame 40) as compared with the case where the portion is cylindrical, a surface contact is obtained, so that a larger contact area can be obtained. Make sure the electrical connection. In the present invention, the shape of the exposed portion of the anode lead terminal 21 and the cathode lead terminal 22 is not limited to this example, and may be, for example, a flat plate shape.
如圖1所示，利用封裝體30，對元件10及連接於元件10的引線框架40進行封裝(密封)，以此確保與外部絕緣。作為封裝體30，可列舉例如環氧樹脂或液晶聚合物等。而且，於形成封裝體30時，可使用普通的模塑成型之工藝。於封裝體30內，引線框架40具有平板狀，且與陽極引出端子21及陰極引出端子22各自面接觸。於封裝體30內，引線框架40未經過彎曲加工。具體而言，於元件10之端面10a、10b和封裝體30之與端面10a、10b相向的表面之間，引線框架40未經過彎曲加工，引線框架40平行於卷芯10c之軸線(圖1中之一點鏈線)方向而延伸。因此，能縮短元件10之端面10a、10b與封裝體30之與端面10a、10b相對的表面之間的距離。結果，能擴大陽極箔11之寬度，從而能增加靜電電容。 As shown in FIG. 1, the package 10 and the lead frame 40 connected to the element 10 are sealed (sealed) by the package 30, thereby ensuring insulation from the outside. Examples of the package 30 include an epoxy resin, a liquid crystal polymer, and the like. Moreover, in the case of forming the package 30, a general molding process can be used. In the package 30, the lead frame 40 has a flat shape and is in surface contact with the anode lead terminal 21 and the cathode lead terminal 22. In the package 30, the lead frame 40 is not subjected to bending processing. Specifically, between the end faces 10a, 10b of the component 10 and the surface of the package body 30 facing the end faces 10a, 10b, the lead frame 40 is not bent, and the lead frame 40 is parallel to the axis of the core 10c (in FIG. 1 One point of the chain line) extends in the direction. Therefore, the distance between the end faces 10a, 10b of the component 10 and the surface of the package body 30 opposite to the end faces 10a, 10b can be shortened. As a result, the width of the anode foil 11 can be enlarged, so that the electrostatic capacitance can be increased.
本實施形態中，元件10為長方體，藉由將長方體之元件10設定為適當之厚度(例如，1.8 mm)，當進行樹脂模塑時，元件徑長不受制約，從而可實現能滿足更薄的要求之 芯片式固體電解電容器。因此，根據本實施形態中之固體電解電容器1，厚度所占之空間少，能以更高之水平來滿足電子設備之薄型化的要求。 In the present embodiment, the element 10 is a rectangular parallelepiped, and by setting the rectangular parallelepiped element 10 to an appropriate thickness (for example, 1.8 mm), when the resin molding is performed, the element diameter is not restricted, so that it can be made thinner. Demand Chip type solid electrolytic capacitor. Therefore, according to the solid electrolytic capacitor 1 of the present embodiment, the space occupied by the thickness is small, and the demand for thinning of the electronic device can be satisfied at a higher level.
接著，利用圖3，對於本實施形態中之固體電解電容器1所包含之元件10、與先前之固體電解電容器101所包含之元件110進行對比。圖3(a)係表示本發明之一實施形態中之元件10的示意圖，圖3(b)係表示先前之元件110的示意圖。 Next, with reference to Fig. 3, the component 10 included in the solid electrolytic capacitor 1 of the present embodiment is compared with the component 110 included in the conventional solid electrolytic capacitor 101. Fig. 3(a) is a schematic view showing the component 10 in an embodiment of the present invention, and Fig. 3(b) is a schematic view showing the prior component 110.
如圖3(a)所示，元件10中，陽極引出端子21及陰極引出端子22相對於卷芯10c而配置於單側。卷芯10c包含位於最內周之間隔件13(參照圖4)。卷芯10c如圖3(a)所示，藉由對元件10進行加壓加工，而使得自卷芯10c之軸線方向觀察時，其沿端面10b之長度方向延伸。於元件10之厚度方向(圖3之上下方向)上，陽極引出端子21及陰極引出端子22與卷芯10c重疊。自卷芯10c之軸線方向觀察時，沿端面10b(或者端面10a)之長度方向上之卷芯10c之長度比陽極引出端子21及陰極引出端子22之寬度長。陽極引出端子21及陰極引出端子22中之位於元件10內之所有部分與卷芯10c在元件10之厚度方向上重疊。換而言之，於端面10b(或者端面10a)之長度方向上，陽極引出端子21及陰極引出端子22之寬度比卷芯10c之寬度窄。藉此，能減少加壓時施加在連接於陽極引出端子21之陽極箔11、及連接於陰極引出端子22之陰極箔12上的力。而且，於元件10內，陽極引出端子21與陰極引出端子22在元件10之厚度方向上重疊。本發明中，陽極引出端子21及陰極引出端子22之至少一部分 重疊即可，其程度並無特別限定，例如較佳為於元件10內陽極引出端子21及陰極引出端子22至少有一半重疊，更較佳為有2/3以上重疊。另外，本實施形態中，兩端子具有相同之寬度，但當兩端子之寬度不同時，兩端子之重疊程度可以寬度較短的端子為基準而算出。 As shown in FIG. 3(a), in the element 10, the anode lead terminal 21 and the cathode lead terminal 22 are disposed on one side with respect to the winding core 10c. The core 10c includes a spacer 13 located at the innermost circumference (refer to FIG. 4). As shown in Fig. 3(a), the core 10c is subjected to press working of the element 10 so as to extend in the longitudinal direction of the end surface 10b when viewed from the axial direction of the winding core 10c. In the thickness direction of the element 10 (the upper and lower directions in FIG. 3), the anode lead terminal 21 and the cathode lead terminal 22 overlap with the winding core 10c. When viewed from the axial direction of the winding core 10c, the length of the winding core 10c in the longitudinal direction of the end surface 10b (or the end surface 10a) is longer than the width of the anode lead terminal 21 and the cathode lead terminal 22. All of the anode lead terminal 21 and the cathode lead terminal 22 located in the element 10 overlap with the winding core 10c in the thickness direction of the element 10. In other words, in the longitudinal direction of the end surface 10b (or the end surface 10a), the widths of the anode lead terminal 21 and the cathode lead terminal 22 are narrower than the width of the winding core 10c. Thereby, the force applied to the anode foil 11 connected to the anode lead terminal 21 and the cathode foil 12 connected to the cathode lead terminal 22 at the time of pressurization can be reduced. Further, in the element 10, the anode lead terminal 21 and the cathode lead terminal 22 overlap in the thickness direction of the element 10. In the present invention, at least a portion of the anode lead terminal 21 and the cathode lead terminal 22 The degree of overlap is not particularly limited. For example, it is preferable that at least half of the anode lead terminal 21 and the cathode lead terminal 22 overlap in the element 10, and it is more preferable to have 2/3 or more overlap. Further, in the present embodiment, the two terminals have the same width. However, when the widths of the two terminals are different, the degree of overlap between the two terminals can be calculated based on the terminal having a short width.
另一方面，於圖3(b)所示之先前之元件110中，卷芯110c位於陽極引出端子121與陰極引出端子122之間。如圖3(a)、(b)所示，元件10內之陽極引出端子21與陰極引出端子22的距離比元件110內之陽極引出端子121與陰極引出端子122的距離短。因此，於本實施形態之元件10中，能減小元件10之厚度方向上之陽極引出端子21與陰極引出端子22的高度差。 On the other hand, in the previous element 110 shown in FIG. 3(b), the core 110c is located between the anode lead terminal 121 and the cathode lead terminal 122. As shown in FIGS. 3(a) and 3(b), the distance between the anode lead terminal 21 and the cathode lead terminal 22 in the element 10 is shorter than the distance between the anode lead terminal 121 and the cathode lead terminal 122 in the element 110. Therefore, in the element 10 of the present embodiment, the difference in height between the anode lead terminal 21 and the cathode lead terminal 22 in the thickness direction of the element 10 can be reduced.
圖4(a)係示意性地表示本發明之一實施形態中之固體電解電容器成形前的狀態之橫剖面圖，圖4(b)係示意性地表示本發明之一實施形態中之固體電解電容器成形後的狀態之橫剖面圖。圖4中，對於與圖1~圖3相同之構成標註與圖1~圖3中相同之符號。 Fig. 4 (a) is a cross-sectional view schematically showing a state before solid electrolytic capacitors in an embodiment of the present invention, and Fig. 4 (b) is a view schematically showing solid electrolysis in an embodiment of the present invention. A cross-sectional view of the state after the capacitor is formed. In FIG. 4, the same components as those in FIGS. 1 to 3 are denoted by the same reference numerals as those in FIGS. 1 to 3.
如圖4(a)所示，捲繞元件16(加壓成型前之元件)包含比較寬且較大之卷芯10c。圖4(a)所示之捲繞元件16經過加壓加工後，成為圖4(b)所示之長方體之元件10。陽極箔11比陰極箔12厚。本實施形態中，如圖4(b)所示，於元件10之卷芯10c之單側，陽極引出端子21連接於陽極箔11外側之面，陰極引出端子22連接於陰極箔12外側之面。另外，本發明並不限於該例，例如，亦可使陽極引出端子21連接於 陽極箔11內側之面，使陰極引出端子22連接於陰極箔12內側之面。亦即，既可使陽極引出端子21及陰極引出端子22兩者均連接於電極箔(陽極箔11或者陰極箔12)之外側，亦可使其等連接於電極箔之內側。而且，又可使陽極引出端子21及陰極引出端子22中之一個連接於電極箔之外側，而使另一個連接於電極箔之內側。 As shown in Fig. 4(a), the winding member 16 (the member before press molding) contains a relatively wide and large core 10c. The winding element 16 shown in Fig. 4(a) is subjected to press working to form the rectangular parallelepiped element 10 shown in Fig. 4(b). The anode foil 11 is thicker than the cathode foil 12. In the present embodiment, as shown in Fig. 4(b), on one side of the winding core 10c of the element 10, the anode lead terminal 21 is connected to the outer surface of the anode foil 11, and the cathode lead terminal 22 is connected to the outer surface of the cathode foil 12. . In addition, the present invention is not limited to this example, and for example, the anode lead terminal 21 may be connected to The surface on the inner side of the anode foil 11 is such that the cathode lead terminal 22 is connected to the inner side of the cathode foil 12. In other words, both the anode lead terminal 21 and the cathode lead terminal 22 may be connected to the outside of the electrode foil (anode foil 11 or cathode foil 12), or may be connected to the inner side of the electrode foil. Further, one of the anode lead terminal 21 and the cathode lead terminal 22 may be connected to the outer side of the electrode foil, and the other may be connected to the inner side of the electrode foil.
而且，如圖4(b)所示，於陽極引出端子21與陰極引出端子22之間，配置有僅有的1片陽極箔11及間隔件13。亦即，配置於陽極引出端子21與陰極引出端子22之間的電極箔係1片。因此，能夠縮短元件10之厚度方向上之陽極引出端子21與陰極引出端子22的距離，藉此，能夠省去引線框架40之彎曲加工。另外，本發明中，配置於陽極引出端子21與陰極引出端子22之間的電極箔並不限於該例。 Further, as shown in FIG. 4(b), a single anode foil 11 and a separator 13 are disposed between the anode lead terminal 21 and the cathode lead terminal 22. That is, the electrode foil disposed between the anode lead terminal 21 and the cathode lead terminal 22 is one piece. Therefore, the distance between the anode lead terminal 21 and the cathode lead terminal 22 in the thickness direction of the element 10 can be shortened, whereby the bending process of the lead frame 40 can be omitted. Further, in the present invention, the electrode foil disposed between the anode lead terminal 21 and the cathode lead terminal 22 is not limited to this example.
接著，參照圖5~圖11，對於本實施形態中之固體電解電容器之製造方法進行說明。 Next, a method of manufacturing the solid electrolytic capacitor in the present embodiment will be described with reference to Figs. 5 to 11 .
<步驟S1> <Step S1>
如圖5所示，準備剪裁成規定寬度的陽極箔11及陰極箔12。具體而言，陽極箔11及陰極箔12均呈帶狀。陽極箔11及陰極箔12與上文所述相同，因此，此處省略說明。 As shown in Fig. 5, the anode foil 11 and the cathode foil 12 which are cut into a predetermined width are prepared. Specifically, both the anode foil 11 and the cathode foil 12 have a strip shape. The anode foil 11 and the cathode foil 12 are the same as described above, and thus the description thereof is omitted here.
<步驟S2> <Step S2>
如圖5所示，使電極引出端子21、22與陽極箔11及陰極箔12接合。具體而言，使陽極引出端子21與陽極箔11接合，使陰極引出端子22與陰極箔12接合。陽極引出端子21包含圓柱形之露出部21a及平板狀之連接部21b。陰極引出 端子22包含圓柱形之露出部22a及平板狀之連接部22b。陽極引出端子21之連接部21b與陽極箔11接合。本實施形態中，連接部21b、22b呈平板狀。陰極引出端子22之連接部22b與陰極箔12接合。本實施形態中，陰極引出端子22之連接部22b比陰極箔12之寬度長。另外，陽極引出端子21之連接部21b亦可比陽極箔11之寬度長。各電極引出端子21、22與電極箔11、12之接合係藉由鉚接或超聲波焊接等實現。陽極引出端子21上，連接部21b之長度與陽極箔11之寬度相同，露出部21a自陽極箔11沿著陽極箔11之寬度方向向外側之一方突出。陰極引出端子22上，連接部22b之長度比陰極箔12之寬度長，連接部22b自陰極箔12沿著陰極箔12之寬度方向向外側之另一方突出。露出部22a自陰極箔12沿著陰極箔12之寬度方向向外側之一方突出。 As shown in FIG. 5, the electrode lead terminals 21 and 22 are joined to the anode foil 11 and the cathode foil 12. Specifically, the anode lead terminal 21 is joined to the anode foil 11 to bond the cathode lead terminal 22 to the cathode foil 12. The anode lead terminal 21 includes a cylindrical exposed portion 21a and a flat connecting portion 21b. Cathode extraction The terminal 22 includes a cylindrical exposed portion 22a and a flat connecting portion 22b. The connection portion 21b of the anode lead terminal 21 is joined to the anode foil 11. In the present embodiment, the connecting portions 21b and 22b have a flat plate shape. The connection portion 22b of the cathode lead terminal 22 is joined to the cathode foil 12. In the present embodiment, the connection portion 22b of the cathode lead terminal 22 is longer than the width of the cathode foil 12. Further, the connection portion 21b of the anode lead terminal 21 may be longer than the width of the anode foil 11. The joining of the electrode lead terminals 21, 22 and the electrode foils 11, 12 is achieved by riveting, ultrasonic welding or the like. In the anode lead terminal 21, the length of the connecting portion 21b is the same as the width of the anode foil 11, and the exposed portion 21a protrudes outward from the anode foil 11 in the width direction of the anode foil 11. In the cathode lead terminal 22, the length of the connecting portion 22b is longer than the width of the cathode foil 12, and the connecting portion 22b protrudes from the cathode foil 12 to the other side in the width direction of the cathode foil 12. The exposed portion 22a protrudes from the cathode foil 12 toward the outside in the width direction of the cathode foil 12.
<步驟S3> <Step S3>
如圖6所示，使陽極箔11、陰極箔12、及配置於陽極箔11與陰極箔12之間的間隔件13捲繞且以規定之長度進行切割，從而形成圓柱體，利用捲繞固定帶14將其端部固定在圓柱體之側面。而且，亦有不使用捲繞固定帶而是利用接著劑貼附的方法。以此形成捲繞元件16。此時，陽極引出端子21之連接部21b及陰極引出端子22之連接部22b位於捲繞元件16之內部。而且，陽極引出端子21之露出部21a及陰極引出端子22之露出部22a自捲繞元件16之一端露出。而且，陰極引出端子22之連接部22b的一部分自捲繞元件16之另一端露出。間隔件13例如包含天然纖維(纖維素)或 者化學纖維。作為可用作間隔件13之天然纖維或化學纖維，並無特別限制。作為化學纖維，可使用聚醯胺纖維、丙烯系纖維(acrylic fiber)、維尼綸纖維(vinylon fiber)、聚醯亞胺纖維、尼龍纖維等合成纖維。 As shown in Fig. 6, the anode foil 11, the cathode foil 12, and the separator 13 disposed between the anode foil 11 and the cathode foil 12 are wound and cut to a predetermined length to form a cylinder, which is fixed by winding. The belt 14 has its ends fixed to the sides of the cylinder. Further, there is also a method of attaching with an adhesive without using a winding fixing tape. The winding element 16 is thus formed. At this time, the connection portion 21b of the anode lead terminal 21 and the connection portion 22b of the cathode lead terminal 22 are located inside the wound element 16. Further, the exposed portion 21a of the anode lead terminal 21 and the exposed portion 22a of the cathode lead terminal 22 are exposed from one end of the winding element 16. Further, a part of the connecting portion 22b of the cathode lead terminal 22 is exposed from the other end of the winding member 16. The spacer 13 comprises, for example, natural fibers (cellulose) or Chemical fiber. The natural fiber or chemical fiber which can be used as the spacer 13 is not particularly limited. As the chemical fiber, a synthetic fiber such as polyamide fiber, acrylic fiber, vinylon fiber, polyimine fiber, or nylon fiber can be used.
<步驟S4> <Step S4>
如圖7所示，使捲繞元件16變形為長方體之元件10(參照圖4(a)、(b))。具體而言，將捲繞元件16固定於規定的夾具上(未圖示)，施加負荷使其變形，從而形成規定尺寸之長方體之元件10。接著，將長方體之元件10固定於棒體上。而且，本實施形態中，當陽極引出端子21或陰極引出端子22自元件10露出之部分為圓柱狀時，包含以下所述之內容。使捲繞元件16變形為長方體之元件10之後，如圖7所示，除去陰極引出端子22的露出部22a，對陽極引出端子21的圓柱狀的露出部21a進行加壓，使其成形為扁平狀(或者平板狀)。另外，本實施形態中，元件10之厚度方向上之陽極引出端子21與陰極引出端子22的距離較短，且陽極引出端子21之露出部21a比連接部21b厚，因此為了防止陽極引出端子21與陰極引出端子22之短路，而小心地除去陰極引出端子22之露出部22a。因此，如圖1所示，於元件10中，陰極引出端子22雖然自元件10之端面10b突出，但幾乎不自元件10之端面10a突出。本發明中，較佳為，陰極引出端子22不自元件10之端面10a突出。但是，自防止短路之觀點出發，允許有少許量(例如，製造時不可避免之誤差)之突出。 As shown in Fig. 7, the winding element 16 is deformed into a rectangular parallelepiped element 10 (see Figs. 4(a) and 4(b)). Specifically, the winding element 16 is fixed to a predetermined jig (not shown), and a load is applied to deform the element 10 to form a rectangular parallelepiped element 10 having a predetermined size. Next, the rectangular parallelepiped element 10 is fixed to the rod. Further, in the present embodiment, when the portion where the anode lead terminal 21 or the cathode lead terminal 22 is exposed from the element 10 is a columnar shape, the following contents are included. After the winding element 16 is deformed into the rectangular parallelepiped element 10, as shown in FIG. 7, the exposed portion 22a of the cathode lead terminal 22 is removed, and the cylindrical exposed portion 21a of the anode lead terminal 21 is pressurized to be flattened. Shape (or flat). Further, in the present embodiment, since the distance between the anode lead terminal 21 and the cathode lead terminal 22 in the thickness direction of the element 10 is short, and the exposed portion 21a of the anode lead terminal 21 is thicker than the connecting portion 21b, the anode lead terminal 21 is prevented. Short-circuiting with the cathode lead-out terminal 22, and carefully removing the exposed portion 22a of the cathode lead-out terminal 22. Therefore, as shown in FIG. 1, in the element 10, the cathode lead terminal 22 protrudes from the end surface 10b of the element 10, but hardly protrudes from the end surface 10a of the element 10. In the present invention, it is preferable that the cathode lead terminal 22 does not protrude from the end surface 10a of the element 10. However, from the viewpoint of preventing short circuit, a slight amount (for example, an inevitable error in manufacturing) is allowed to stand out.
<步驟S5> <Step S5>
對元件10進行化成處理及熱處理。具體而言，將長方體之元件10浸漬於化成液容器中之化成液中，將化成容器作為陰極，將陽極引出端子21作為陽極，對陽極箔11進行化成處理。化成液所使用的溶質係具有羧酸基之有機酸鹽類、磷酸鹽等無機酸鹽等溶質。本實施形態中，作為化成液使用的是己二酸銨。該化成處理中，使用以濃度0.5 wt%~3 wt%之己二酸銨為主體之化成液，且以接近介電氧化皮膜之耐受電壓的電壓進行處理。接著，自化成液中取出長方體之元件10，進行熱處理。熱處理係於200℃~300℃之溫度範圍內進行幾分鐘~十幾分鐘之程度。反覆進行化成及熱處理之動作。藉由該等處理，於露出在陽極箔11之剖面上之閥金屬、或因端子連接所致之損傷等而形成之金屬露出面上，形成氧化皮膜。藉此，能形成具有更佳的耐熱性之介電氧化皮膜。 The element 10 is subjected to a chemical conversion treatment and a heat treatment. Specifically, the rectangular parallelepiped element 10 is immersed in a chemical conversion liquid in a chemical conversion container, and the chemical conversion container is used as a cathode, and the anode lead terminal 21 is used as an anode, and the anode foil 11 is chemically treated. The solute used in the chemical conversion solution is a solute such as an organic acid salt of a carboxylic acid group or an inorganic acid salt such as a phosphate. In the present embodiment, ammonium adipate is used as the chemical conversion liquid. In the chemical conversion treatment, a chemical conversion solution mainly composed of ammonium adipate having a concentration of 0.5 wt% to 3 wt% is used, and the treatment is carried out at a voltage close to the withstand voltage of the dielectric oxide film. Next, the rectangular parallelepiped element 10 is taken out from the chemical conversion liquid, and heat treatment is performed. The heat treatment is carried out at a temperature ranging from 200 ° C to 300 ° C for a few minutes to ten minutes. The process of chemical conversion and heat treatment is repeated. By these processes, an oxide film is formed on the metal exposed surface formed by exposing the valve metal on the cross section of the anode foil 11 or the damage due to the connection of the terminals. Thereby, a dielectric oxide film having better heat resistance can be formed.
<步驟S6> <Step S6>
於上述元件之陽極箔11與陰極箔12之間形成固體電解質層13。本實施形態中，固體電解質係導電性高分子，且係由作為單體之3,4-乙二氧基噻吩及作為氧化劑之對甲苯磺酸鐵鹽的化學聚合而形成。具體而言，首先，對於單體溶液例如利用乙醇進行稀釋，使其濃度成為25 wt%。將長方體之元件10浸漬於單體溶液中，然後，利用加熱乾燥除去作為溶劑之乙醇，僅保留單體。加熱乾燥之溫度較佳為40℃~60℃，可設為例如50℃。在超過60℃之溫度下，因接 近乙醇之沸點，故會導致急遽蒸發，單體不會均勻地保留在元件10內部。而且，在40℃以下時，蒸發需要花費時間。乾燥時間與長方體之元件10的體積有關，但就長方體之元件10而言，較佳為10分鐘~20分鐘之程度。然後，使殘留有單體的長方體之元件10中含浸氧化劑，從而形成3,4-乙二氧基噻吩。上述氧化劑之含浸係利用減壓含浸法而含浸於長方體之元件10中。作為氧化劑，使用對甲苯磺酸鐵鹽之55 wt%的丁醇溶液，使長方體之元件10浸漬於氧化劑中，進行減壓含浸。接著，使長方體之元件10階段性地自30℃升溫至180℃，利用化學聚合反應可形成導電性高分子即聚-3,4-乙二氧基噻吩。另外，元件中形成之導電性高分子不僅可採用在元件內利用化學聚合而形成之方法，亦可預先合成導電性高分子、使元件浸漬於分散於溶劑中的溶液中且使其乾燥後形成，亦可代替聚-3,4-乙二氧基噻吩，而使用單獨的或多種聚苯胺、聚吡咯、聚噻吩等公知之導電性高分子。 A solid electrolyte layer 13 is formed between the anode foil 11 and the cathode foil 12 of the above elements. In the present embodiment, the solid electrolyte-based conductive polymer is formed by chemical polymerization of 3,4-ethylenedioxythiophene as a monomer and iron p-toluenesulfonate as an oxidizing agent. Specifically, first, the monomer solution is diluted with, for example, ethanol to have a concentration of 25 wt%. The rectangular parallelepiped element 10 was immersed in a monomer solution, and then ethanol as a solvent was removed by heat drying to retain only the monomer. The temperature for heating and drying is preferably from 40 ° C to 60 ° C, and may be, for example, 50 ° C. At temperatures above 60 ° C, due to Near the boiling point of ethanol, it causes rapid evaporation, and the monomer does not remain uniformly inside the element 10. Moreover, it takes time to evaporate at temperatures below 40 °C. The drying time is related to the volume of the cuboid element 10, but it is preferably from 10 minutes to 20 minutes in terms of the cuboid element 10. Then, the element 10 of the rectangular parallelepiped in which the monomer remains is impregnated with an oxidizing agent to form 3,4-ethylenedioxythiophene. The impregnation system of the above oxidizing agent is impregnated into the rectangular parallelepiped element 10 by a vacuum impregnation method. As a oxidizing agent, a butanol solution of 55 wt% of p-toluenesulfonic acid iron salt was used, and the rectangular parallelepiped element 10 was immersed in an oxidizing agent, and subjected to reduced pressure impregnation. Next, the element 10 of the rectangular parallelepiped is heated from 30 ° C to 180 ° C in a stepwise manner, and poly-3,4-ethylenedioxythiophene which is a conductive polymer can be formed by chemical polymerization. Further, the conductive polymer formed in the element may be formed not only by chemical polymerization in the element, but also by synthesizing the conductive polymer in advance, immersing the element in a solution dispersed in a solvent, and drying it. Instead of poly-3,4-ethylenedioxythiophene, a known conductive polymer such as polyaniline, polypyrrole or polythiophene may be used alone or in combination.
<步驟S7> <Step S7>
如圖9所示，使長方體之元件10之電極引出端子21、22連接於引線框架40。具體而言，將陽極引出端子21及陰極引出端子22之多餘的部分切去，而使其連接於引線框架40。引線框架40成為外部引出端子。作為連接方法，可使用例如利用激光焊接(laser welding)或電阻焊接(resistance welding)等進行連接之方法、或利用銀漿等接著連接之方法。若考慮到製造成本及連接電阻，較佳為採用激光焊接 或電阻焊接等利用金屬間結合之連接方法。先前之積層型固體電場電容器中，通常係在陽極箔上形成固體電解質層之後，使用塗覆用銀漿，進而在使經塗覆之元件與引線框架接合時使用銀漿，從而成為成本上升之一個原因，但本發明中，可採用激光焊接或電阻焊接等利用金屬間接合而實現之連接，因此無需銀等貴金屬，從而能抑制成本。 As shown in FIG. 9, the electrode lead terminals 21 and 22 of the rectangular parallelepiped element 10 are connected to the lead frame 40. Specifically, the excess portions of the anode lead terminal 21 and the cathode lead terminal 22 are cut away to be connected to the lead frame 40. The lead frame 40 becomes an external lead terminal. As the connection method, for example, a method of joining by laser welding or resistance welding, or a method of joining by silver paste or the like can be used. If the manufacturing cost and the connection resistance are taken into consideration, it is preferred to use laser welding. Or a connection method using a combination of metals such as resistance welding. In the conventional laminated solid-state electric field capacitor, after the solid electrolyte layer is formed on the anode foil, silver paste for coating is used, and silver paste is used for bonding the coated member to the lead frame, thereby increasing the cost. One reason, however, in the present invention, the connection by the inter-metal bonding such as laser welding or electric resistance welding can be employed, so that a noble metal such as silver is not required, and the cost can be suppressed.
另外，使用圖10對於具體的連接方法進行說明。 In addition, a specific connection method will be described using FIG.
如圖10(a)所示，使頂端呈錐形狀之針(未圖示)貫通於引線框架40，從而於引線框架40上形成突起部40a。突起部40a沿著針貫通時之針之周緣而形成。突起部40a係以與陽極引出端子21及陰極引出端子22連接時朝向陽極引出端子21及陰極引出端子22的方式而形成。突起部40a之數量並無特別限定。 As shown in FIG. 10(a), a needle (not shown) having a tapered tip end is inserted through the lead frame 40 to form a projection 40a on the lead frame 40. The protrusion 40a is formed along the circumference of the needle when the needle penetrates. The protruding portion 40a is formed to face the anode lead terminal 21 and the cathode lead terminal 22 when connected to the anode lead terminal 21 and the cathode lead terminal 22. The number of the protrusions 40a is not particularly limited.
接著，如圖10(b)所示，以陽極引出端子21及陰極引出端子22與引線框架40之突起部40a接觸的方式，將元件10配置於引線框架40上。 Next, as shown in FIG. 10(b), the element 10 is placed on the lead frame 40 such that the anode lead terminal 21 and the cathode lead terminal 22 are in contact with the protruding portion 40a of the lead frame 40.
接著，如圖10(c)所示，利用電阻焊接等方法，將陽極引出端子21及陰極引出端子22與引線框架40接合。例如，陽極引出端子21及陰極引出端子22包含鋁，當引線框架40包含銅時，在焊接時陽極引出端子21及陰極引出端子22會熔化。當元件10外的陽極引出端子21與陰極引出端子22之厚度差較大時，陽極引出端子21與陰極引出端子22之熔化程度之差變大，從而難以高精度地進行模塑。因此，較佳為，使元件10外之陽極引出端子21與陰極引出端子22之厚 度差儘量小。具體而言，當陽極引出端子21及陰極引出端子22位於元件10之卷芯10c之單側、且與卷芯10c的距離較遠的電極引出端子(陽極引出端子21或者陰極引出端子22)之厚度較大時，較佳為，於元件10之厚度方向上，自卷芯10c至該電極引出端子之外側之面的距離在自卷芯10c至元件10的外表面的距離以下。本實施形態中，自卷芯10c至陽極引出端子21的外側之面的距離在自卷芯10c至元件10的外表面的距離以下。本實施形態中，藉由將陽極引出端子21及陰極引出端子22配置於卷芯10c之單側，能夠調整陽極引出端子21及陰極引出端子22的高度(位置)，因此，無需根據陽極引出端子21與陰極引出端子22之厚度差而調整高度。因此，能抑制陽極引出端子21之厚度，且能確保封裝體30之厚度而不會增大固體電解電容器1。 Next, as shown in FIG. 10(c), the anode lead terminal 21 and the cathode lead terminal 22 are joined to the lead frame 40 by a method such as electric resistance welding. For example, the anode lead terminal 21 and the cathode lead terminal 22 contain aluminum. When the lead frame 40 contains copper, the anode lead terminal 21 and the cathode lead terminal 22 are melted during soldering. When the difference in thickness between the anode lead terminal 21 and the cathode lead terminal 22 outside the element 10 is large, the difference in the degree of melting between the anode lead terminal 21 and the cathode lead terminal 22 becomes large, so that it is difficult to perform molding with high precision. Therefore, it is preferable to make the anode lead terminal 21 and the cathode lead terminal 22 outside the component 10 thick. The difference is as small as possible. Specifically, when the anode lead terminal 21 and the cathode lead terminal 22 are located on one side of the winding core 10c of the element 10 and the distance from the winding core 10c is far from the electrode lead terminal (anode lead terminal 21 or cathode lead terminal 22) When the thickness is large, it is preferable that the distance from the core 10c to the outer surface of the electrode lead terminal in the thickness direction of the element 10 is equal to or less than the distance from the winding core 10c to the outer surface of the element 10. In the present embodiment, the distance from the core 10c to the outer surface of the anode lead terminal 21 is equal to or less than the distance from the winding core 10c to the outer surface of the element 10. In the present embodiment, since the anode lead terminal 21 and the cathode lead terminal 22 are disposed on one side of the winding core 10c, the height (position) of the anode lead terminal 21 and the cathode lead terminal 22 can be adjusted. Therefore, it is not necessary to use the anode lead terminal. 21 is adjusted in height by the difference in thickness from the cathode lead terminal 22. Therefore, the thickness of the anode lead terminal 21 can be suppressed, and the thickness of the package 30 can be ensured without increasing the solid electrolytic capacitor 1.
<步驟S8> <Step S8>
如圖11及圖1所示，對於連接於該引線框架40之長方體之元件10進行模塑封裝，藉此形成封裝體30，接著，形成引線框架40之端子，從而製成芯片型固體電解電容器10。 As shown in FIG. 11 and FIG. 1, the element 10 connected to the rectangular parallelepiped of the lead frame 40 is molded and packaged, thereby forming the package 30, and then the terminals of the lead frame 40 are formed, thereby forming a chip type solid electrolytic capacitor. 10.
上述實施形態係本發明之較佳實施形態，但對本發明並無限制。本發明之業者可在本發明之範圍內，使用上述方法及技術內容來對本發明進行各種變更，或者改變為等同的實施形態。因此，只要不脫離本發明之內容，那麼，基於本發明而對實施形態所作之所有改變、及向等價物之置換及修飾均屬於本發明的範圍內。 The above embodiments are preferred embodiments of the present invention, but the present invention is not limited thereto. The invention may be variously modified or changed to equivalent embodiments using the above-described methods and technical contents within the scope of the invention. Therefore, all changes that come within the scope of the invention, and equivalents
<實施例> <Example>
作為實施例，製造上述本實施形態中所示之固體電解電容器1(6.3 V、100 μF)(圖1)。該固體電解電容器1之封裝盒之尺寸為7.3 mm×4.3 mm×2.8 mm。作為引線框架40，使用的是表面經過鍍鎳處理之厚度為100 μm的銅框架材料。另外，在製造時，當使引線框架40與陽極引出端子21(鋁製陽極板)及陰極引出端子22(鋁製陰極板)連接之前，使針貫通至引線框架40上之與陽極引出端子21及陰極引出端子22的連接位置，藉此在上述連接位置上形成突起部40a。作為針，使用的是頂端呈四角錐形狀之φ0.26 mm的針。使用逆變式電阻焊接機，將引線框架40與陽極引出端子21及陰極引出端子22連接。 As an example, the solid electrolytic capacitor 1 (6.3 V, 100 μF) shown in the above embodiment (Fig. 1) was produced. The package of the solid electrolytic capacitor 1 has a size of 7.3 mm × 4.3 mm × 2.8 mm. As the lead frame 40, a copper frame material having a surface treated with nickel plating and having a thickness of 100 μm was used. Further, at the time of manufacture, before the lead frame 40 is connected to the anode lead terminal 21 (aluminum anode plate) and the cathode lead terminal 22 (aluminum cathode plate), the needle is passed through the lead frame 40 and the anode lead terminal 21. And a connection position of the cathode lead terminal 22, whereby the protrusion 40a is formed at the above-mentioned connection position. As the needle, a needle having a quadrangular pyramid shape of φ 0.26 mm was used. The lead frame 40 is connected to the anode lead terminal 21 and the cathode lead terminal 22 by using an inverter type resistance welding machine.
<比較例> <Comparative example>
比較例中，代替實施例中之固體電解電容器1而製造先前之固體電解電容器101(6.3 V、100 μF)，除此以外均與實施例相同。該固體電解電容器101之封裝盒之尺寸與實施例相同，為7.3 mm×4.3 mm×2.8 mm。 In the comparative example, the conventional solid electrolytic capacitor 101 (6.3 V, 100 μF) was produced instead of the solid electrolytic capacitor 1 in the example, and was otherwise the same as the examples. The package of the solid electrolytic capacitor 101 has the same dimensions as the embodiment and is 7.3 mm × 4.3 mm × 2.8 mm.
對於實施例中之固體電解電容器1與比較例中之固體電解電容器101的性能進行比較。將其結果表示於表1中。另外，Tanδ表示損耗角之正切。LC表示洩漏電流。ESR表示等效串聯電阻(Equivalent Series Resistance)。 The performance of the solid electrolytic capacitor 1 in the embodiment and the solid electrolytic capacitor 101 in the comparative example was compared. The results are shown in Table 1. In addition, Tan δ represents the tangent of the loss angle. LC represents the leakage current. ESR stands for Equivalent Series Resistance.
如表1所示，與比較例之固體電解電容器101相比，於實 施例之固體電解電容器1中，靜電電容增加了約20%，可確認ESR之改善，明確體現了本發明之有效性。 As shown in Table 1, compared with the solid electrolytic capacitor 101 of the comparative example, In the solid electrolytic capacitor 1 of the embodiment, the electrostatic capacitance is increased by about 20%, and the improvement of the ESR can be confirmed, and the effectiveness of the present invention is clearly demonstrated.
1‧‧‧固體電解電容器 1‧‧‧Solid electrolytic capacitor
10‧‧‧元件 10‧‧‧ components
10a、10b‧‧‧端面 10a, 10b‧‧‧ end face
11‧‧‧陽極箔 11‧‧‧Anode foil
12‧‧‧陰極箔 12‧‧‧Cathode foil
13‧‧‧間隔件(固體電解質層) 13‧‧‧ Spacer (solid electrolyte layer)
14‧‧‧捲繞固定帶 14‧‧‧Winding strap
21‧‧‧陽極引出端子 21‧‧‧Anode lead terminal
22‧‧‧陰極引出端子 22‧‧‧Cathode lead terminals
30‧‧‧封裝體 30‧‧‧Package
40‧‧‧引線框架 40‧‧‧ lead frame
圖1係示意性地表示本申請發明之一實施形態中之固體電解電容器的概略縱剖面圖。 Fig. 1 is a schematic longitudinal cross-sectional view showing a solid electrolytic capacitor according to an embodiment of the present invention.
圖2係示意性地表示本申請發明之一實施形態中之固體電解電容器的固體電解質形成前之分解構造之概略立體圖。 FIG. 2 is a schematic perspective view showing an exploded structure before solid electrolyte formation of the solid electrolytic capacitor according to the embodiment of the present invention.
圖3(a)係表示本發明之一實施形態中之固體電解電容器的示意圖，圖3(b)係表示先前之固體電解電容器的示意圖。 Fig. 3 (a) is a schematic view showing a solid electrolytic capacitor in an embodiment of the present invention, and Fig. 3 (b) is a schematic view showing a conventional solid electrolytic capacitor.
圖4(a)係示意性地表示本發明之一實施形態中之固體電解電容器成形前的狀態之橫剖面圖，圖4(b)係示意性地表示本發明之一實施形態中之固體電解電容器成形後的狀態之橫剖面圖。 Fig. 4 (a) is a cross-sectional view schematically showing a state before solid electrolytic capacitors in an embodiment of the present invention, and Fig. 4 (b) is a view schematically showing solid electrolysis in an embodiment of the present invention. A cross-sectional view of the state after the capacitor is formed.
圖5係示意性地表示本發明之一實施形態中之固體電解電容器之製造步驟的圖。 Fig. 5 is a view schematically showing a manufacturing procedure of a solid electrolytic capacitor in an embodiment of the present invention.
圖6係示意性地表示本發明之一實施形態中之固體電解電容器之製造步驟的圖。 Fig. 6 is a view schematically showing a manufacturing procedure of a solid electrolytic capacitor in an embodiment of the present invention.
圖7係示意性地表示本發明之一實施形態中之固體電解電容器之製造步驟的圖。 Fig. 7 is a view schematically showing a manufacturing procedure of a solid electrolytic capacitor in an embodiment of the present invention.
圖8係示意性地表示本發明之一實施形態中之固體電解電容器之製造步驟的圖。 Fig. 8 is a view schematically showing a manufacturing procedure of a solid electrolytic capacitor in an embodiment of the present invention.
圖9係示意性地表示本發明之一實施形態中之固體電解 電容器之製造步驟的圖。 Figure 9 is a view schematically showing solid electrolysis in an embodiment of the present invention Diagram of the manufacturing steps of the capacitor.
圖10(a)~(c)係示意性地表示本發明之一實施形態中之固體電解電容器之製造步驟的圖。 10(a) to 10(c) are diagrams schematically showing a manufacturing procedure of a solid electrolytic capacitor according to an embodiment of the present invention.
圖11係示意性地表示本發明之一實施形態中之固體電解電容器之製造步驟的圖。 Fig. 11 is a view schematically showing a manufacturing procedure of a solid electrolytic capacitor in an embodiment of the present invention.
圖12係示意性地表示先前之固體電解電容器的縱剖面圖。 Fig. 12 is a longitudinal sectional view schematically showing a conventional solid electrolytic capacitor.
1‧‧‧固體電解電容器 1‧‧‧Solid electrolytic capacitor
10‧‧‧元件 10‧‧‧ components
10a、10b‧‧‧端面 10a, 10b‧‧‧ end face
10c‧‧‧卷芯 10c‧‧‧core
21‧‧‧陽極引出端子 21‧‧‧Anode lead terminal
22‧‧‧陰極引出端子 22‧‧‧Cathode lead terminals
30‧‧‧封裝體 30‧‧‧Package
40‧‧‧引線框架 40‧‧‧ lead frame
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210049734.XA CN103295785B (en) | 2012-02-22 | 2012-02-22 | Solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201335961A true TW201335961A (en) | 2013-09-01 |
| TWI492252B TWI492252B (en) | 2015-07-11 |
Family
ID=49096498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101128143A TWI492252B (en) | 2012-02-22 | 2012-08-03 | Solid electrolytic capacitors |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5775040B2 (en) |
| KR (1) | KR101404532B1 (en) |
| CN (1) | CN103295785B (en) |
| TW (1) | TWI492252B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI674600B (en) * | 2016-03-31 | 2019-10-11 | 日商日本貴彌功股份有限公司 | Electrode foil, wound capacitor, method of manufacturing electrode foil, and method of manufacturing wound capacitor |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104658758A (en) * | 2015-02-05 | 2015-05-27 | 深圳江浩电子有限公司 | Flat aluminum electrolytic capacitor and manufacturing method thereof |
| CN111909362A (en) * | 2019-05-09 | 2020-11-10 | 深圳新宙邦科技股份有限公司 | Conductive polymer, capacitor and preparation method thereof |
| CN112979927B (en) * | 2019-12-17 | 2021-12-14 | 深圳新宙邦科技股份有限公司 | Composition, polymer for capacitor and capacitor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3233972B2 (en) * | 1992-03-31 | 2001-12-04 | 新日本製鐵株式会社 | Chip type solid electrolytic capacitor |
| JP2007180432A (en) * | 2005-12-28 | 2007-07-12 | Nichicon Corp | Electrolytic capacitor |
| JP2008300502A (en) * | 2007-05-30 | 2008-12-11 | Daikin Ind Ltd | Film capacitor and arrangement structure therefor |
| CN101527203A (en) * | 2009-02-19 | 2009-09-09 | 富士通多媒体部品（苏州）有限公司 | Solid electrolytic capacitor and manufacture method thereof |
| JP2010251436A (en) * | 2009-04-14 | 2010-11-04 | Elna Co Ltd | Solid-state electrolytic capacitor and method of manufacturing the same |
| TWI395244B (en) * | 2009-07-10 | 2013-05-01 | Lamellar stacked solid electrolytic condenser | |
| CN201966071U (en) * | 2010-11-23 | 2011-09-07 | 尼吉康株式会社 | Pin frame, manufacturing device thereof, solid electrolytic capacitor |
| CN202695147U (en) * | 2012-02-22 | 2013-01-23 | 尼吉康株式会社 | Solid electrolytic condenser |
-
2012
- 2012-02-22 CN CN201210049734.XA patent/CN103295785B/en not_active Expired - Fee Related
- 2012-08-03 TW TW101128143A patent/TWI492252B/en active
- 2012-08-13 KR KR1020120088350A patent/KR101404532B1/en active IP Right Grant
- 2012-09-06 JP JP2012196177A patent/JP5775040B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI674600B (en) * | 2016-03-31 | 2019-10-11 | 日商日本貴彌功股份有限公司 | Electrode foil, wound capacitor, method of manufacturing electrode foil, and method of manufacturing wound capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013172146A (en) | 2013-09-02 |
| KR101404532B1 (en) | 2014-06-09 |
| KR20130096621A (en) | 2013-08-30 |
| CN103295785A (en) | 2013-09-11 |
| CN103295785B (en) | 2016-05-18 |
| TWI492252B (en) | 2015-07-11 |
| JP5775040B2 (en) | 2015-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5679275B2 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| CN101527203A (en) | Solid electrolytic capacitor and manufacture method thereof | |
| US6791822B2 (en) | Solid electrolytic capacitor | |
| TWI492252B (en) | Solid electrolytic capacitors | |
| TWI486984B (en) | Solid electrolytic capacitors | |
| US8218293B2 (en) | Winding-type electrolytic capacitor and method of manufacturing the same | |
| US9576741B2 (en) | Solid electrolytic capacitor and production method thereof | |
| JP6774745B2 (en) | Solid electrolytic capacitors and their manufacturing methods | |
| CN202905476U (en) | Solid electrolytic condenser | |
| CN202695147U (en) | Solid electrolytic condenser | |
| JP2010074083A (en) | Electrolytic capacitor, and method of manufacturing the same | |
| CN203013534U (en) | Solid electrolytic capacitor | |
| KR101475367B1 (en) | Solid electrolytic capacitor | |
| JP4624017B2 (en) | Manufacturing method of solid electrolytic capacitor | |
| JP5698450B2 (en) | Manufacturing method of solid electrolytic capacitor | |
| JP2011003699A (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| JP5903611B2 (en) | Solid electrolytic capacitor | |
| JP5898927B2 (en) | Chip type solid electrolytic capacitor | |
| JP2010251435A (en) | Solid-state electrolytic capacitor and manufacturing method therefor | |
| JP2004200417A (en) | Chip type electrolytic capacitor and manufacturing method thereof | |
| JP2010098230A (en) | Winding type electrolytic capacitor and method of manufacturing the same | |
| JP2011003700A (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| JPWO2012086407A1 (en) | Solid electrolytic capacitor and manufacturing method thereof |