TW201331800A - Wiring structure of touch panel and its manufacturing method - Google Patents
Wiring structure of touch panel and its manufacturing method Download PDFInfo
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本發明是關於一種觸控面板的配線構造，是在玻璃基板的平面上，配置了可將感應器電極引出到外部連接部的金屬配線圖案，更詳細地說，是關於一種觸控面板的配線構造，這種觸控面板的配線構造，在連結用圖案的其中一側是與感應器電極相連接，在連結用圖案的另一側則是經由形成在絕緣覆層內的連通孔來與金屬配線圖案相連接。 The present invention relates to a wiring structure of a touch panel in which a metal wiring pattern capable of guiding an inductor electrode to an external connection portion is disposed on a plane of the glass substrate, and more particularly, relates to a wiring of a touch panel. In the wiring structure of the touch panel, one side of the connection pattern is connected to the sensor electrode, and the other side of the connection pattern is connected to the metal via a communication hole formed in the insulating coating. The wiring patterns are connected.
觸控面板是一種輸入裝置，可偵測出：接近於輸入操作領域，或者與輸入操作領域接觸的輸入操作體的操作位置，並且輸出到上位處理裝置。依觸控面板所運用的偵測原理的不同，可以將其區分成：電阻膜方式、電容方式、電磁感應方式等的各種方式。在這些方式中，電阻膜方式和電容方式的觸控面板，是在作為輸入操作領域的絕緣基板上，形成了一個或複數個感應器電極，用來偵測出：輸入操作體的接近或接觸。各感應器電極是利用被配線在輸入操作領域的周圍的配線圖案，使得感應器電極被引出到外部連接部，因為輸入操作而產生於感應器電極的電氣訊號將會經由配線圖案與外部連接部，而被輸出到用來偵知輸入操作位置的外部偵測電路。 The touch panel is an input device that detects an operation position of an input operation body that is close to an input operation field or that is in contact with an input operation area, and is output to a higher-level processing device. According to the detection principle applied by the touch panel, it can be divided into various methods such as a resistive film method, a capacitive method, and an electromagnetic induction method. In these modes, the resistive film mode and the capacitive touch panel form one or a plurality of sensor electrodes on the insulating substrate as an input operation field for detecting the proximity or contact of the input operating body. . Each of the inductor electrodes is a wiring pattern that is wired around the input operation area, so that the sensor electrodes are led out to the external connection portion, and the electrical signals generated at the sensor electrodes due to the input operation will pass through the wiring pattern and the external connection portion. And is output to an external detection circuit for detecting the input operation position.
這種觸控面板，通常是與配置在該觸控面板內方側的液晶面板等的顯示裝置一起被使用，可以一邊觀看顯示裝 置的顯示內容，一邊對於觸控面板的輸入操作領域進行輸入操作，因此絕緣基板是以透明的玻璃基板來形成的，感應器電極則是採用透明導電性材料，也就是ITO(氧化銦錫)的披覆膜等。另一方面，因為輸入操作而產生於感應器電極且流經過配線圖案的電氣訊號是很微弱，所以配線圖案是採用：MAM(疊積了Mo(鉬)/Al(鋁)/Mo(鉬)的三層結構的金屬)之類的導電性金屬材料，這種金屬材料的每單位長度的電阻值是比透明的感應器電極的電阻值更低。 Such a touch panel is generally used together with a display device such as a liquid crystal panel disposed on the inner side of the touch panel, and can be viewed while viewing the display device. The display content is input to the input operation area of the touch panel, so the insulating substrate is formed by a transparent glass substrate, and the sensor electrode is made of a transparent conductive material, that is, ITO (Indium Tin Oxide). The draping film and so on. On the other hand, since the electrical signal generated by the input operation on the inductor electrode and flowing through the wiring pattern is very weak, the wiring pattern is: MAM (deposited Mo (molybdenum) / Al (aluminum) / Mo (molybdenum)) A conductive metal material such as a three-layered metal having a resistance value per unit length lower than that of a transparent inductor electrode.
此外，已知有一種觸控面板，因為流經過配線圖案的電氣訊號很微弱，為了減少周圍的靜電容量的變化、以及因雜訊所造成的影響，因而將其周圍以接地線圖案圍繞起來(請參考專利文獻1)。 In addition, a touch panel is known because the electrical signal flowing through the wiring pattern is weak, and in order to reduce the variation of the surrounding electrostatic capacity and the influence caused by noise, the surrounding area is surrounded by a ground line pattern ( Please refer to Patent Document 1).
因此，如第6圖、第7圖所示般地，當有接地線圖案103被形成在配線圖案101與感應器電極102之間的情況下，是必須利用隔著絕緣覆層104且跨越過接地線圖案103的導電性連結用圖案105，來將感應器電極102與配線圖案101之間做電性連接。 Therefore, as shown in FIGS. 6 and 7, when the ground line pattern 103 is formed between the wiring pattern 101 and the inductor electrode 102, it is necessary to use the insulating coating 104 and cross over. The conductive connection pattern 105 of the ground line pattern 103 electrically connects the inductor electrode 102 and the wiring pattern 101.
這種傳統的觸控面板的配線構造100，起初是在玻璃基板106上的整體表面藉由濺鍍來形成ITO的薄膜，運用光微影技術對於ITO的薄膜進行蝕刻，保留著玻璃基板106上的被形成感應器電極102、配線圖案101以及接地用圖案103的領域，來製作出電路圖案。 The wiring structure 100 of the conventional touch panel is initially formed by sputtering on the entire surface of the glass substrate 106 to form a thin film of ITO, and the ITO film is etched by photolithography to remain on the glass substrate 106. A circuit pattern is created in the field in which the inductor electrode 102, the wiring pattern 101, and the ground pattern 103 are formed.
利用同樣的工序，對於MAM的薄膜以及絕緣合成樹脂的薄膜，進行製作電路圖案，如第7圖所示般地，感應 器電極102、配線圖案101及接地用圖案103是覆蓋著由絕緣合成樹脂構成的絕緣覆層104，在絕緣覆層104中的位於感應器電極102與配線圖案105的上方的一部分的絕緣覆層104是被蝕刻而除去，而形成一對連通孔TH1、TH2。此處，在配線圖案101與接地線圖案103的形成領域中，雖然是在同一個MAM的薄膜上形成電路圖案，但是將配線抵達外部連接部110為止的配線圖案部分當作配線圖案101，而將一部分接地的配線圖案當作接地線圖案103。 By using the same process, a film of MAM film and a film of an insulating synthetic resin is produced, as shown in Fig. 7, induction The electrode 102, the wiring pattern 101, and the ground pattern 103 are covered with an insulating coating 104 made of an insulating synthetic resin, and an insulating coating on the portion of the insulating coating 104 above the inductor electrode 102 and the wiring pattern 105. 104 is removed by etching to form a pair of communication holes TH1, TH2. Here, in the field of formation of the wiring pattern 101 and the ground line pattern 103, although the circuit pattern is formed on the film of the same MAM, the wiring pattern portion until the wiring reaches the external connection portion 110 is regarded as the wiring pattern 101. A part of the grounded wiring pattern is taken as the ground line pattern 103.
在連通孔TH1與TH2的內底面，是讓形成了感應器電極102的ITO薄膜與形成了配線圖案101的MAM薄膜分別臨靠在該內底面，藉由在連通孔TH1、TH2的內底面與位在其間的絕緣覆層104上連續地形成的導電性連結用圖案105，跨越過接地用圖案103而將感應器電極102與配線圖案101利用連結用圖案105來做電性連接。然後，將整體表面利用絕緣性的頂部披覆層107予以覆蓋，而製造成觸控面板。 On the inner bottom surface of the communication holes TH1 and TH2, the ITO film on which the inductor electrode 102 is formed and the MAM film on which the wiring pattern 101 is formed are respectively placed on the inner bottom surface by the inner bottom surface of the communication holes TH1 and TH2. The conductive connection pattern 105 continuously formed on the insulating coating 104 is electrically connected to the wiring pattern 101 and the wiring pattern 101 by the connection pattern 105 across the ground pattern 103. Then, the entire surface is covered with an insulating top cladding layer 107 to be manufactured as a touch panel.
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2004-355545號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-355545
在上述的觸控面板的配線構造100中，雖然是對於絕 緣覆層104的薄膜進行蝕刻來形成連通孔TH1、TH2，但是因為必須在寬度很細的配線圖案101上形成連通孔TH2，所以必須進行細微加工。在塗布光阻劑後，利用光微影技術來進行製作電路圖案，然後，利用濕式蝕刻來形成TH1、TH2，並且基於除掉蝕刻工序的殘渣的目的，進行乾式蝕刻方式的洗淨作業，最後就形成了TH1、TH2。 In the above-described wiring structure 100 of the touch panel, although it is absolutely The film of the edge cladding layer 104 is etched to form the communication holes TH1, TH2. However, since the communication hole TH2 must be formed on the wiring pattern 101 having a small width, fine processing must be performed. After applying the photoresist, the circuit pattern is formed by photolithography, and then TH1 and TH2 are formed by wet etching, and the dry etching method is performed for the purpose of removing the residue in the etching process. Finally, TH1 and TH2 are formed.
連通孔TH2的內底面，在被連結用圖案105所覆蓋之前，構成配線圖案101的MAM的薄膜是直接露出來，所以在加工工序中，很容易受到化學性的攻擊。此外，臨靠在連通孔TH2的內底面的MAM的薄膜，在連通孔TH2的形成過程中會因為進行乾式蝕刻而使得MAM的薄膜受到氧化，因而導致MAM的薄膜與後來形成在連通孔TH2的內底面的連結用圖案101之間的密合性變差，而會有造成連接不良的原因的虞慮。 Before the inner bottom surface of the communication hole TH2 is covered by the connection pattern 105, the film of the MAM constituting the wiring pattern 101 is directly exposed, so that it is easily attacked chemically in the processing step. Further, the film of the MAM immediately adjacent to the inner bottom surface of the communication hole TH2 causes the film of the MAM to be oxidized by the dry etching during the formation of the communication hole TH2, thereby causing the film of the MAM to be formed later in the communication hole TH2. The adhesion between the connection patterns 101 on the inner bottom surface is deteriorated, which may cause a cause of connection failure.
本發明是考慮到這種先前技術的問題點而開發完成的，本發明的目的是提供：一種觸控面板的配線構造，即使對於配線圖案上的絕緣覆層進行蝕刻來形成連通孔，配線圖案與連結用圖案還是可確實地做電性連接。 The present invention has been developed in view of the problems of the prior art, and an object of the present invention is to provide a wiring structure of a touch panel, which is formed by etching an insulating coating on a wiring pattern to form a via hole, and a wiring pattern. It is still possible to make an electrical connection with the connection pattern.
為了達成上述目的，本案的請求項1的觸控面板的配線構造的特徵為，是具備：被配線在絕緣基板的平面上，且與形成在前述平面上的感應器電極和外部連接部做電性連接的配線圖案、橫越過感應器電極與配線圖案之間的導 電圖案、覆蓋著導電圖案與配線圖案的絕緣覆層、以及連結用圖案，該連結用圖案是隔著絕緣覆層且跨過導電圖案，該連結用圖案的其中一側是連接到感應器電極，該連結用圖案的另一側是利用形成在配線圖案上的絕緣覆層的連通孔來與配線圖案做電性連接；配線圖案是藉由在金屬配線圖案的至少一部分上具有氧化金屬薄膜層而形成的，在連通孔內，前述連結用圖案是連接到前述氧化金屬薄膜層。 In order to achieve the above object, the wiring structure of the touch panel of claim 1 of the present invention is characterized in that it is provided on the plane of the insulating substrate and is electrically connected to the inductor electrode and the external connection portion formed on the plane Wiring pattern of the connection, crossing the guide between the sensor electrode and the wiring pattern An electrical pattern, an insulating coating covering the conductive pattern and the wiring pattern, and a connecting pattern, the insulating pattern is across the conductive pattern, one side of the connecting pattern is connected to the inductor electrode The other side of the connection pattern is electrically connected to the wiring pattern by using a via hole of an insulating coating formed on the wiring pattern; the wiring pattern is formed by having an oxidized metal film layer on at least a portion of the metal wiring pattern Further, in the communication hole, the connection pattern is connected to the oxidized metal thin film layer.
本發明的配線構造，在配線圖案上的連通孔的內底面，是以較金屬薄膜更不容易受到加工工序時的化學性攻擊所造成的傷害的氧化金屬薄膜層臨靠在該內底面的狀態，來與連結用圖案連接在一起，所以與連結用圖案之間的密合性不會受到損壞。配線圖案是藉由在金屬配線圖案的至少一部分具有氧化金屬薄膜層而形成的，經由連結用圖案與臨靠在連通孔的氧化金屬薄膜層來與感應器電極做電性連接。 In the wiring structure of the present invention, the inner bottom surface of the communication hole in the wiring pattern is in a state in which the oxidized metal thin film layer is less likely to be damaged by the chemical attack during the processing step than the metal thin film. Since it is connected to the connection pattern, the adhesion to the connection pattern is not damaged. The wiring pattern is formed by having an oxidized metal thin film layer on at least a part of the metal wiring pattern, and is electrically connected to the inductor electrode via the connection pattern and the oxidized metal thin film layer that is adjacent to the communication hole.
本案的請求項2的觸控面板的配線構造的特徵為，氧化金屬薄膜層與感應器電極，是由：一個覆膜藉由採用光微影技術的同一個製作電路圖案工序所形成的，配線圖案，是藉由在氧化金屬薄膜層上的形成有連通孔以外的部位，疊積金屬配線圖案而形成的。 The wiring structure of the touch panel of claim 2 of the present invention is characterized in that the oxidized metal thin film layer and the inductor electrode are formed by: one film formed by the same circuit pattern process using photolithography; The pattern is formed by laminating a metal wiring pattern on a portion other than the communication hole formed in the oxidized metal thin film layer.
在連結用圖案的其中一側的用來與感應器電極做電性連接的連通孔以及在另一側的用來與氧化金屬薄膜層做電性連接的連通孔，是形成同一深度，只要進行一次蝕刻工 序，即可分別形成各個連通孔。 The communication hole for electrically connecting the sensor electrode on one side of the connection pattern and the communication hole for electrically connecting the metal oxide film layer on the other side are formed at the same depth as long as One etcher In sequence, each of the communication holes can be formed separately.
本案的請求項3的觸控面板的配線構造的特徵為，氧化金屬薄膜層是疊積在金屬配線圖案上而形成的，氧化金屬薄膜層與金屬配線圖案，是藉由採用光微影技術之同一個製作電路圖案工序所形成的。 The wiring structure of the touch panel of claim 3 of the present invention is characterized in that the oxidized metal thin film layer is formed by being stacked on the metal wiring pattern, and the oxidized metal thin film layer and the metal wiring pattern are formed by using the photolithography technique. Formed by the same circuit pattern process.
在形成金屬配線圖案的金屬覆膜上，先形成供形成氧化金屬薄膜層的氧化金屬披覆膜，藉由採用光微影技術的同一個製作電路圖案工序，將配線圖案的周圍同時進行蝕刻，只要一次的製作電路圖案工序就可形成：在金屬配線圖案上疊積了氧化金屬薄膜層的配線圖案。 On the metal film forming the metal wiring pattern, an oxidized metal coating film for forming an oxidized metal thin film layer is formed first, and the wiring pattern is simultaneously etched by the same circuit patterning process using photolithography. As long as the circuit pattern process is performed once, a wiring pattern in which an oxidized metal thin film layer is laminated on the metal wiring pattern can be formed.
本案的請求項4的觸控面板的配線構造的特徵為，金屬配線圖案是以含有：鉬與鋁的導電材料所形成的。 The wiring structure of the touch panel of claim 4 of the present invention is characterized in that the metal wiring pattern is formed of a conductive material containing molybdenum and aluminum.
鉬與鋁是作為濺鍍的標靶材料，可很容易形成薄膜，對於氧化銦錫披覆膜等的氧化金屬薄膜層，具有優異的電氣接觸特性。此外，含有鉬與鋁的導電材料，亦可使用由：Mo或Mo合金/Al或Al合金/Mo或Mo合金所構成的3層構造來形成金屬配線圖案。 Molybdenum and aluminum are used as sputtering target materials, and can be easily formed into a thin film, and have excellent electrical contact properties for an oxidized metal thin film layer such as an indium tin oxide coating film. Further, as the conductive material containing molybdenum and aluminum, a metal wiring pattern may be formed using a three-layer structure composed of Mo or a Mo alloy/Al or an Al alloy/Mo or a Mo alloy.
本案的請求項5的觸控面板的配線構造的特徵為，前述氧化金屬薄膜層及前述感應器電極是ITO(Indium Tin Oxide)、IGO(Indium Gallium Oxide)、IZO(Indium Zinc Oxide)之中的一種。 In the wiring structure of the touch panel of claim 5, the oxidized metal thin film layer and the inductor electrode are among ITO (Indium Tin Oxide), IGO (Indium Gallium Oxide), and IZO (Indium Zinc Oxide). One.
這些氧化金屬，基於光學特性、電氣特性、耐久性等的各種觀點考量，很適合本發明的用途，此外，就蝕刻特性的這一方面而言，也很適合只要同一個製作電路圖案工 序就可形成：氧化金屬薄膜層與金屬配線圖案。 These oxidized metals are suitable for the use of the present invention based on various viewpoints such as optical characteristics, electrical characteristics, durability, etc. Further, in terms of etching characteristics, it is also suitable as long as the same circuit pattern is produced. The order can be formed: an oxidized metal film layer and a metal wiring pattern.
本案的請求項6的觸控面板配線構造的製造方法，其特徵為，包含：在絕緣基板的平面上形成氧化金屬薄膜的工序、藉由對於該氧化金屬薄膜進行蝕刻，而形成感應器電極與導電圖案與配線圖案的工序、在前述導電圖案、前述配線圖案的至少一部分上疊積金屬配線圖案的工序、形成包覆前述感應器電極與前述導電圖案與前述配線圖案的絕緣覆層的工序、利用乾式蝕刻將前述絕緣覆層的一部分予以除去，藉以形成可讓構成前述配線圖案的氧化金屬薄膜露出來的連通孔的工序、形成連結用圖案的工序，該連結用圖案是隔著前述絕緣覆層且跨過前述導電圖案，該連結用圖案的其中一側是連接於前述感應器電極，另一側是經由前述連通孔與前述配線圖案做電性連接。 A method of manufacturing a touch panel wiring structure according to claim 6 of the present invention, comprising the step of forming an oxidized metal thin film on a plane of the insulating substrate, and etching the oxidized metal thin film to form an inductor electrode and a step of forming a conductive pattern and a wiring pattern, a step of laminating a metal wiring pattern on at least a part of the conductive pattern and the wiring pattern, and a step of forming an insulating coating covering the inductor electrode and the conductive pattern and the wiring pattern, A part of the insulating coating is removed by dry etching to form a communication hole through which a metal oxide film constituting the wiring pattern is exposed, and a step of forming a connection pattern in which the insulating pattern is formed The layer crosses the conductive pattern, and one side of the connection pattern is connected to the inductor electrode, and the other side is electrically connected to the wiring pattern via the communication hole.
配線圖案是經由連結用圖案與臨靠在連通孔的氧化金屬薄膜層來與感應器電極做電性連接。 The wiring pattern is electrically connected to the inductor electrode via the connection pattern and the oxidized metal thin film layer that is adjacent to the communication hole.
本案的請求項7的觸控面板配線構造的製造方法，其特徵為，包含：在絕緣基板的平面上形成金屬薄膜的工序、在前述平面的整體上，形成氧化金屬薄膜的工序、藉由對於前述金屬薄膜與前述氧化金屬薄膜進行蝕刻，以形成由前述氧化金屬薄膜單獨構成的感應器電極、以及至少一部分是由前述金屬薄膜和前述氧化金屬薄膜疊積而成的導電圖案與配線圖案的工序、形成包覆前述感應器電極與前述導電圖案與前述配線圖案的絕緣覆層的工序、利用乾式蝕刻將前述絕緣覆層的一部分予以除去，藉以形成可讓構 成前述配線圖案的氧化金屬薄膜露出來的連通孔的工序、形成連結用圖案的工序，該連結用圖案是隔著前述絕緣覆層且跨過前述導電圖案，該連結用圖案的其中一側是連接於前述感應器電極，另一側是經由前述連通孔與前述配線圖案做電性連接。 A method of manufacturing a touch panel wiring structure according to claim 7 of the present invention, comprising the steps of: forming a metal thin film on a plane of the insulating substrate; forming a oxidized metal thin film on the entire surface; The metal thin film and the oxidized metal thin film are etched to form an inductor electrode composed of the oxidized metal thin film alone, and at least a part of a conductive pattern and a wiring pattern formed by laminating the metal thin film and the oxidized metal thin film Forming an insulating coating covering the inductor electrode and the conductive pattern and the wiring pattern, and removing a part of the insulating coating by dry etching, thereby forming an allowable structure a step of forming a communication hole in which the oxidized metal film of the wiring pattern is exposed, and a step of forming a connection pattern, wherein the connection pattern is across the conductive pattern via the insulating coating, and one side of the connection pattern is The sensor electrode is connected to the inductor electrode, and the other side is electrically connected to the wiring pattern via the communication hole.
在形成金屬配線圖案的金屬覆膜上，又形成了供形成氧化金屬薄膜層的氧化金屬披覆膜。 On the metal film forming the metal wiring pattern, an oxidized metal coating film for forming an oxide metal thin film layer is formed.
根據本案的請求項1的發明，連結用圖案是連接在氧化金屬薄膜層臨靠著的連通孔，所以在形成連通孔的過程中，連通孔的內底面不會受到化學性攻擊，或者不會因受到氧化而產生劣化，在連通孔處的配線圖案的氧化金屬薄膜層與連結用圖案之間不會發生電性連接不良的情事。 According to the invention of claim 1, the connection pattern is connected to the communication hole adjacent to the oxidized metal film layer, so that the inner bottom surface of the communication hole is not chemically attacked or formed during the formation of the communication hole. Deterioration due to oxidation causes no electrical connection failure between the oxidized metal thin film layer of the wiring pattern at the communication hole and the connection pattern.
根據本案的請求項2的發明，只要利用同一個乾式蝕刻工序，即可形成連結用圖案的兩側的連通孔。 According to the invention of claim 2 of the present invention, the communication holes on both sides of the connection pattern can be formed by the same dry etching process.
根據本案的請求項3的發明，只要一次的製作電路圖案工序，即可形成在金屬配線圖案上疊積了氧化金屬薄膜層的配線圖案。 According to the invention of claim 3 of the present invention, the wiring pattern in which the metal oxide thin film layer is laminated on the metal wiring pattern can be formed by forming the circuit pattern process once.
根據本案的請求項4的發明，可將金屬配線圖案高精度地配線，而與氧化金屬薄膜層做穩定的電性連接。 According to the invention of claim 4 of the present invention, the metal wiring pattern can be wired with high precision, and the metal oxide film layer can be stably electrically connected.
根據本案的請求項5的發明，可獲得良好的光學特性、電氣特性、耐久性。 According to the invention of claim 5 of the present invention, good optical characteristics, electrical characteristics, and durability can be obtained.
根據本案的請求項6的發明，乾式蝕刻時所露出來的 金屬配線圖案不會受到損傷，與連結用圖案之間的密合性不會變差。 According to the invention of claim 6 of the present invention, exposed during dry etching The metal wiring pattern is not damaged, and the adhesion to the connection pattern does not deteriorate.
根據本案的請求項7的發明，只要一次的製作電路圖案工序，即可形成在金屬配線圖案上疊積了氧化金屬薄膜層的配線圖案。 According to the invention of claim 7 of the present invention, the wiring pattern in which the metal oxide thin film layer is laminated on the metal wiring pattern can be formed by forming the circuit pattern process once.
茲佐以第1圖至第3圖來說明本發明的第1實施方式的觸控面板的配線構造1如下。在本實施方式中，是舉出靜電容量方式(電容式)的觸控面板10的例子來做說明，這種觸控面板10是被安裝成作為可攜式行動電話機等的電子機器的輸入裝置，可以從沿著玻璃基板2的平面而形成的透明感應器電極3的靜電容量的變化，來偵知接近該感應器電極3的輸入操作體的輸入操作位置。 The wiring structure 1 of the touch panel according to the first embodiment of the present invention is described below with reference to FIGS. 1 to 3 . In the present embodiment, an example of a touch panel 10 of a capacitance type (capacitive type) which is an input device of an electronic device mounted as a portable mobile phone or the like is described. The input operation position of the input operating body close to the sensor electrode 3 can be detected from the change in the electrostatic capacitance of the transparent sensor electrode 3 formed along the plane of the glass substrate 2.
在觸控面板10的玻璃基板2的平面上，是沿著由許多感應器電極3互相正交的XV方向，將許多感應器電極3互相絕緣地形成矩陣狀，各感應器電極3是利用與各感應器電極3分別做電性連接的配線圖案5而被引出到在玻璃基板2的平面的一部分上的外部連接部4。 On the plane of the glass substrate 2 of the touch panel 10, a plurality of inductor electrodes 3 are formed in a matrix shape in an XV direction orthogonal to each other by a plurality of sensor electrodes 3, and each of the inductor electrodes 3 is utilized. Each of the inductor electrodes 3 is electrically connected to the wiring pattern 5 and is led out to the external connection portion 4 on a part of the plane of the glass substrate 2.
所有的配線圖案5是在外部連接部4，被排列整齊地進行配線，利用異方向性導電接著劑等，而連接到可撓性配線基板的相對應的電極，各感應器電極3是經由外部連接部4而連接到用來偵知輸入操作的偵測電路(未圖示)。一旦輸入操作體接近到感應器電極3的話，就會產生一個 表示與該感應器電極3的靜電容量的變化相關的電氣訊號，偵測電路將會從產生了該電氣訊號的感應器電極3的配置位置來偵知輸入操作位置。 All the wiring patterns 5 are arranged in a line in the external connection portion 4, and are connected to the corresponding electrodes of the flexible wiring substrate by an anisotropic conductive adhesive or the like, and each of the inductor electrodes 3 is externally connected. The connection unit 4 is connected to a detection circuit (not shown) for detecting an input operation. Once the input operating body approaches the sensor electrode 3, a Indicates an electrical signal associated with a change in the electrostatic capacitance of the sensor electrode 3, and the detecting circuit will detect the input operating position from the position of the sensor electrode 3 from which the electrical signal is generated.
為了使得流經配線圖案5的電氣訊號不受到周圍的浮游電磁容量的變化、電磁雜訊的影響，乃以第1圖所示的方式，沿著配線圖案5的兩側隔著預定的間隔，形成了接地線圖案6。因此，有時候特定的配線圖案5，在與其對應做電性連接的感應器電極3之間會形成有接地線圖案6，為了與這個接地線圖案6絕緣，並且又將配線圖案5與感應器電極3之間做電性連接，乃以第2圖所示的方式，利用連結用圖案8隔著絕緣覆層7且跨過接地線圖案6，來將配線圖案5與感應器電極3做電性連接。 In order to prevent the electrical signal flowing through the wiring pattern 5 from being affected by the change in the surrounding floating electromagnetic capacity and the electromagnetic noise, a predetermined interval is formed along both sides of the wiring pattern 5 in the manner shown in FIG. A ground line pattern 6 is formed. Therefore, sometimes a specific wiring pattern 5 is formed with a ground line pattern 6 between the sensor electrodes 3 electrically connected thereto, in order to be insulated from the ground line pattern 6, and the wiring pattern 5 and the inductor are again The electrodes 3 are electrically connected to each other, and the wiring pattern 5 and the inductor electrode 3 are electrically connected by the connection pattern 8 and across the ground line pattern 6 by the connection pattern 8 as shown in FIG. Sexual connection.
為了將連結用圖案8的兩側與感應器電極3和配線圖案5做電性連接，於連結用圖案8的兩側，在覆蓋於感應器電極3與配線圖案5上的絕緣覆層7中，分別形成了連通孔TH1、TH2。在由氧化金屬披覆膜所形成的氧化金屬薄膜層51上，疊積著由金屬覆膜所形成的金屬配線圖案52(連通孔TH2的部位除外)而形成配線圖案5，如第2圖所示，在連通孔TH2的內底面，只有氧化金屬薄膜層51露出來。 In order to electrically connect both sides of the connection pattern 8 to the inductor electrode 3 and the wiring pattern 5, on both sides of the connection pattern 8, in the insulating coating 7 covering the inductor electrode 3 and the wiring pattern 5. , the communication holes TH1, TH2 are formed, respectively. On the oxidized metal thin film layer 51 formed of the oxidized metal coating film, the metal wiring pattern 52 (excluding the portion of the communication hole TH2) formed of the metal film is laminated to form the wiring pattern 5, as shown in FIG. It is shown that only the oxidized metal thin film layer 51 is exposed on the inner bottom surface of the communication hole TH2.
因此，連結用圖案8的其中一側是連接於露出在連通孔TH1內的感應器電極3，另一側則是連接於露出在連通孔TH2內的氧化金屬薄膜層51，感應器電極3是經由連結用圖案8和氧化金屬薄膜層51來與金屬配線圖案52做 電性連接。 Therefore, one side of the connection pattern 8 is connected to the inductor electrode 3 exposed in the communication hole TH1, and the other side is connected to the oxidized metal thin film layer 51 exposed in the communication hole TH2, and the inductor electrode 3 is The metal wiring pattern 52 is made via the connection pattern 8 and the oxidized metal thin film layer 51. Electrical connection.
形成了感應器電極3、連結用圖案8及配線圖案5的玻璃基板2的平面側整體，是如第2圖所示般地，覆蓋著由透明的絕緣樹脂構成的頂部披覆層9，使得感應器電極3和配線圖案5受到保護。 The entire planar side of the glass substrate 2 on which the inductor electrode 3, the connection pattern 8 and the wiring pattern 5 are formed is covered with a top cladding layer 9 made of a transparent insulating resin as shown in Fig. 2, so that The inductor electrode 3 and the wiring pattern 5 are protected.
以下將說明關於這種觸控面板的配線構造1的製造工序。在本實施方式的靜電容量方式的觸控面板10中，為了提高檢測位置的檢測分解能，必須在玻璃基板2的平面上，配置許多感應器電極3，並且是以很小的間距配置成互相保持絕緣，而且與各感應器電極3做電性連接的配線圖案5也是必須在感應器電極3的周圍的受限的配線領域內，將與感應器電極3的數目相當的數目的配線圖案5配線成互相保持絕緣，所以這些在玻璃基板2上疊積而形成的各部分，是將以μm單位來形成的覆膜，反覆地進行以光微影技術來製作電路圖案而形成的細微加工所形成的。 The manufacturing process of the wiring structure 1 of such a touch panel will be described below. In the capacitive touch panel 10 of the present embodiment, in order to improve the detection and resolution of the detection position, it is necessary to arrange a plurality of sensor electrodes 3 on the plane of the glass substrate 2, and to arrange them at a small pitch to maintain each other. The wiring pattern 5 which is insulated and electrically connected to the respective inductor electrodes 3 is also required to be wired in the limited wiring area around the inductor electrode 3, and the number of wiring patterns 5 corresponding to the number of the inductor electrodes 3 is wired. Each of the portions formed by laminating on the glass substrate 2 is a film formed in units of μm, and is formed by fine processing which is formed by photolithography to form a circuit pattern. of.
一開始是在經過化學強化後的玻璃基板2的平面上，利用濺鍍方式來形成作為：感應器電極3、接地線圖案6及氧化金屬薄膜層51的ITO(氧化銦錫)的覆膜。感應器電極3，基於考慮到能夠以目視來觀看被配置在該感應器電極3的內方側的顯示裝置的表示內容，以及基於可從薄膜來進行製作圖案而可容易形成在玻璃基板2上的考量，乃採用ITO來當作透明導電材料，而且連結用圖案8也是同樣採用ITO，所以氧化金屬薄膜層51也是從同一個ITO來形成的，如此一來，只要利用感應器電極3的形成工序 ，就可以一起形成氧化金屬薄膜層51。 Initially, a film of ITO (indium tin oxide) as the inductor electrode 3, the ground line pattern 6, and the oxidized metal thin film layer 51 is formed on the plane of the chemically strengthened glass substrate 2 by sputtering. The sensor electrode 3 can be easily formed on the glass substrate 2 based on the fact that it is possible to visually view the display content of the display device disposed on the inner side of the sensor electrode 3, and based on the pattern that can be formed from the film. The consideration is to use ITO as a transparent conductive material, and the connection pattern 8 also uses ITO, so the oxidized metal film layer 51 is also formed from the same ITO, so that the formation of the inductor electrode 3 is utilized. Process Then, the oxidized metal thin film layer 51 can be formed together.
接下來，利用光阻劑將整個ITO的覆膜予以覆蓋起來，利用光罩來僅針對於形成感應器電極3、接地線圖案6及配線圖案5的領域進行曝光，對於其他的部分則進行蝕刻，以對於由ITO所構成的感應器電極3、接地線圖案6的基層及氧化金屬薄膜層51進行製作電路圖案。 Next, the entire ITO film is covered with a photoresist, and the mask is used to expose only the areas where the inductor electrode 3, the ground line pattern 6 and the wiring pattern 5 are formed, and the other portions are etched. A circuit pattern is formed on the inductor electrode 3 composed of ITO, the base layer of the ground line pattern 6, and the oxidized metal thin film layer 51.
然後，利用濺鍍方式將MAM的覆膜形成在整體表面上，以光微影技術來製作電路圖案，在由ITO所構成的接地線圖案6的基層與氧化金屬薄膜層51的上層，形成由MAM所構成的接地線圖案6與金屬配線圖案52。MAM是疊積了Mo(鉬)/Al(鋁)/Mo的三層構造的金屬覆膜，與被疊積在下層的ITO都是物理性、化學性、電氣接觸特性優異，且電阻率很低，因此可將接地線圖案6和配線圖案5的單位長度的電阻值保持成很低。此處，金屬配線圖案52是在接地線圖案6的近傍，被配線在氧化金屬薄膜層51上(後述的形成有連通孔TH2的部位除外)，因此，氧化金屬薄膜層51是露出在形成有連通孔TH2的部位。 Then, a film of the MAM is formed on the entire surface by sputtering, and a circuit pattern is formed by photolithography, and the base layer of the ground line pattern 6 made of ITO and the upper layer of the oxidized metal film layer 51 are formed. The ground line pattern 6 and the metal wiring pattern 52 formed by the MAM. MAM is a three-layer metal film in which Mo (molybdenum) / Al (aluminum) / Mo is laminated, and is excellent in physical, chemical, and electrical contact characteristics with ITO stacked on the lower layer, and has a high electrical resistivity. It is low, so the resistance value per unit length of the ground line pattern 6 and the wiring pattern 5 can be kept low. Here, the metal wiring pattern 52 is formed in the vicinity of the ground line pattern 6 and is wired on the oxidized metal thin film layer 51 (excluding a portion where the communication hole TH2 is formed later). Therefore, the oxidized metal thin film layer 51 is exposed and formed. The portion of the communication hole TH2.
感應器電極3和接地線圖案6和配線圖案5的表面，是利用濺鍍方式覆蓋著由氧化矽(SiO2)等的覆膜所構成的絕緣覆層7，如第3圖所示般地，在接地線圖案6的兩側，形成有連通孔TH1與連通孔TH2的部位的絕緣覆層7，是利用光微影技術的蝕刻而被除去的。想要形成連通孔TH1、TH2，必須要求細微加工精度及穩定的電性連接，因此為了除去蝕刻後的絕緣覆層7的殘渣，乃噴吹反應性 氣體以執行可令絕緣覆層7氣化的乾式蝕刻來進行洗淨。利用乾式蝕刻，感應器電極3和氧化金屬薄膜層51雖然會露出於連通孔TH1、TH2的內底面，但是兩者都是ITO，所以不會發生因被氧化而劣化的情事。 The surface of the inductor electrode 3, the ground line pattern 6, and the wiring pattern 5 is covered with an insulating coating 7 made of a film of yttrium oxide (SiO 2 ) or the like by sputtering, as shown in FIG. The insulating coating 7 on the both sides of the ground line pattern 6 where the communication hole TH1 and the communication hole TH2 are formed is removed by etching by photolithography. In order to form the communication holes TH1 and TH2, it is necessary to require fine processing precision and stable electrical connection. Therefore, in order to remove the residue of the insulating coating 7 after etching, a reactive gas is blown to perform vaporization of the insulating coating 7 . Dry etching is used for cleaning. The dry etching causes the inductor electrode 3 and the oxidized metal thin film layer 51 to be exposed on the inner bottom surfaces of the communication holes TH1 and TH2. However, both of them are ITO, so that deterioration by oxidation is not caused.
又，根據本實施方式，對於絕緣覆層7進行蝕刻而形成的連通孔TH1、TH2的深度相同，因此只以同一個蝕刻條件就可形成連通孔TH1、TH2。 Moreover, according to the present embodiment, since the depths of the communication holes TH1 and TH2 formed by etching the insulating coating 7 are the same, the communication holes TH1 and TH2 can be formed only by the same etching condition.
接下來，再度利用濺鍍來形成ITO的披覆膜，以光微影技術將構成連結用圖案8的部分製作成電路圖案保留下來，利用跨越著接地線圖案6的連結用圖案8隔著絕緣覆層7，讓連通孔TH1內的感應器電極3與連通孔TH2內的氧化金屬薄膜層51做電性連接。連通孔TH2以外的部分，則因為在氧化金屬薄膜層51上有金屬配線圖案52疊積著，所以感應器電極3是利用低電阻的金屬配線圖案52而被引出到外部連接部4。 Next, a coating film of ITO is again formed by sputtering, and a portion constituting the connection pattern 8 is formed into a circuit pattern by photolithography, and the connection pattern 8 spanning the ground line pattern 6 is insulated. The cladding layer 7 electrically connects the inductor electrode 3 in the communication hole TH1 with the oxidized metal thin film layer 51 in the communication hole TH2. In the portion other than the communication hole TH2, since the metal wiring pattern 52 is laminated on the oxidized metal thin film layer 51, the inductor electrode 3 is led out to the external connection portion 4 by the metal wiring pattern 52 having a low resistance.
此外，第2圖所示的感應器電極3是沿著XY方向的其中一個方向配線的其中一方的感應器電極3 x，與這個感應器電極3 x呈正交配線的另一方的感應器電極3 y是在覆蓋於感應器電極3 x的絕緣覆層7上，利用同一個製作電路圖案工序，從ITO的覆膜被形成的，而且是與上述連結用圖案8一起被形成的。因此，只要利用互相保持絕緣地在正交方向上配線的感應器電極3的製造工序，不必增加其他的工序，就可形成覆蓋接地線圖案6的絕緣覆層7與連結用圖案8。 Further, the inductor electrode 3 shown in Fig. 2 is one of the inductor electrodes 3 x wired in one of the directions in the XY direction, and the other inductor electrode orthogonally wired to the inductor electrode 3 x 3 y is formed on the insulating coating 7 covering the inductor electrode 3 x by the same circuit pattern forming process, and is formed from the ITO film and together with the connecting pattern 8 described above. Therefore, the insulating coating layer 7 covering the ground line pattern 6 and the connection pattern 8 can be formed by using the manufacturing process of the inductor electrode 3 which is insulated from each other in the orthogonal direction, without adding another process.
將可撓性配線基板的與各配線圖案5相對應的電極連接到外部連接部4的各配線圖案5，並且將位在配線圖案5的兩側隔著預定間隔而形成的接地線圖案6予以接地，除了外部連接部4以外，將整個表面使用例如：滾子型覆膜機等機器進行覆蓋一層由透明的絕緣材料所構成的頂部披覆層9，即可完成觸控面板10的製造。 The electrodes corresponding to the respective wiring patterns 5 of the flexible wiring substrate are connected to the respective wiring patterns 5 of the external connection portion 4, and the ground line patterns 6 formed at predetermined intervals on both sides of the wiring pattern 5 are given. In addition to the external connection portion 4, the entire surface is covered with a top cladding layer 9 made of a transparent insulating material using a device such as a roller type laminator to complete the manufacture of the touch panel 10.
其次，佐以第4圖與第5圖來說明本發明的第2實施方式的觸控面板的配線構造20。這種觸控面板的配線構造20，僅僅在金屬配線圖案211上疊積氧化金屬薄膜層212來製作配線圖案21的這個結構是與觸控面板的配線構造1有所不同，因此針對於與觸控面板的配線構造1共通的結構，都標示同一個元件符號並且省略其說明。 Next, the wiring structure 20 of the touch panel according to the second embodiment of the present invention will be described with reference to FIGS. 4 and 5 . In the wiring structure 20 of the touch panel, the structure in which the metal oxide film layer 212 is laminated only on the metal wiring pattern 211 to form the wiring pattern 21 is different from the wiring structure 1 of the touch panel, and therefore The common structure of the wiring structure 1 of the control panel is denoted by the same reference numeral and the description thereof is omitted.
觸控面板的配線構造20，一開始是在形成感應器電極3的輸入操作領域的周圍的玻璃基板2上，利用濺鍍方式來預先形成MAM的覆膜。 The wiring structure 20 of the touch panel is initially formed on the glass substrate 2 around the input operation area where the inductor electrode 3 is formed, and a film of the MAM is formed in advance by sputtering.
接下來，將包含輸入操作領域在內的玻璃基板2的整體平面上，利用濺鍍方式來形成ITO的覆膜，使用光微影技術來對於MAM與ITO的覆膜進行蝕刻，而留下感應器電極3、配線圖案21及接地線圖案22的部位。其結果，只利用一次的製作電路圖案工序，即可形成由ITO所構成的感應器電極3、在MAM的金屬配線圖案211上疊積ITO的氧化金屬薄膜層212的配線圖案21、被ITO所覆蓋的MAM的接地線圖案22。 Next, a film of ITO is formed on the entire surface of the glass substrate 2 including the input operation field by sputtering, and the film of MAM and ITO is etched by photolithography to leave an induction. The portion of the electrode 3, the wiring pattern 21, and the ground line pattern 22. As a result, the wiring pattern 21 of the oxidized metal thin film layer 212 in which the ITO is deposited on the metal wiring pattern 211 of the MAM can be formed by using the circuit pattern process once, and the ITO is formed by the ITO. The ground wire pattern 22 of the covered MAM.
然後，如第5圖所示般地，將利用與第1實施方式同 樣的工序所形成的絕緣覆層7的連通孔TH1、TH2的部位，以乾式蝕刻方式進行洗淨。即使在進行這個乾式蝕刻的工序時，在所形成的連通孔TH1、TH2的內底面，分別是有ITO的感應器電極3與氧化金屬薄膜層212露出來，所以不會發生MAM的金屬配線圖案211受到氧化因而劣化的情事。 Then, as shown in FIG. 5, the same as in the first embodiment will be used. The portions of the communication holes TH1 and TH2 of the insulating coating 7 formed in the same process are cleaned by dry etching. Even in the step of performing the dry etching, the inductor electrode 3 and the oxidized metal thin film layer 212 each having ITO are exposed on the inner bottom surfaces of the formed communication holes TH1 and TH2, so that the metal wiring pattern of the MAM does not occur. 211 is oxidized and deteriorates.
隔著絕緣覆層7且跨過接地線圖案22的連結用圖案8的兩側，在連通孔TH1內是連接於感應器電極3，在連通孔TH2內是連接於氧化金屬薄膜層212，所以感應器電極3是經由疊積在連結用圖案8、氧化金屬薄膜層212及氧化金屬薄膜層212的金屬配線圖案211，而被引出到外部連接部4。 Both sides of the connection pattern 8 that penetrates the ground line pattern 22 via the insulating coating 7 are connected to the inductor electrode 3 in the communication hole TH1, and are connected to the oxidized metal thin film layer 212 in the communication hole TH2. The sensor electrode 3 is led out to the external connection portion 4 via the metal wiring pattern 211 stacked on the connection pattern 8, the oxidized metal thin film layer 212, and the oxidized metal thin film layer 212.
在上述的各實施方式中，雖然是在感應器電極3的上方的絕緣覆層7中形成了連通孔TH1，但只要能夠將連結用圖案8連接到感應器電極3的話，也不一定要形成連通孔TH1。 In each of the above-described embodiments, the communication hole TH1 is formed in the insulating coating 7 above the inductor electrode 3. However, the connection pattern 8 may not be formed as long as the connection pattern 8 can be connected to the inductor electrode 3. Connect the hole TH1.
又，連結用圖案8雖然是舉出以絕緣方式跨過接地線圖案6的例子來做說明，但本發明亦可適用於：將與感應器電極3相對應的配線圖案5、22之間，利用以絕緣方式跨過其他的配線圖案5、22的連結用圖案8來進行連接。 Further, although the connection pattern 8 is described as an example in which the ground line pattern 6 is insulated, the present invention is also applicable to the case where the wiring patterns 5 and 22 corresponding to the inductor electrode 3 are provided. The connection pattern 8 that is insulated across the other wiring patterns 5 and 22 is connected by insulation.
又，在上述的實施方式中，雖然是將氧化金屬薄膜層舉出ITO薄膜的例子，將金屬薄膜也就是MAM舉出Mo/Al/Mo的3層構造的例子，但是，氧化金屬薄膜層亦可為ITO、IGO、IZO的任何一種，或者因應需求而將這 些疊積在一起的構造，而金屬披覆膜也就是MAM亦可置換成：Mo或Mo合金/Al或Al合金/Mo或Mo合金的3層構造，在玻璃基板上形成薄膜的成膜工序，不限於採用濺鍍方法，亦可採用真空蒸鍍法之類的其他方法來形成薄膜。 Further, in the above-described embodiment, the oxidized metal thin film layer is exemplified as the ITO thin film, and the metal thin film, that is, the MAM, is an example of a three-layer structure of Mo/Al/Mo. However, the oxidized metal thin film layer is also used. Can be any of ITO, IGO, IZO, or depending on the needs The laminated structure, and the metal coating film, that is, the MAM, may be replaced by a three-layer structure of Mo or Mo alloy/Al or Al alloy/Mo or Mo alloy, and a film forming process for forming a film on a glass substrate. It is not limited to the sputtering method, and other methods such as vacuum evaporation may be used to form the film.
此外，在上述的實施方式中，雖然是將臨靠在連通孔TH2的氧化金屬薄膜層51、212疊積在整個金屬配線圖案52、211上，但只要是能夠疊積在金屬配線圖案52、211上而可做電性連接的話，只疊積在金屬配線圖案52、211的一部上也是可以。 Further, in the above-described embodiment, the oxidized metal thin film layers 51 and 212 which are adjacent to the communication hole TH2 are stacked on the entire metal wiring patterns 52 and 211, but they may be stacked on the metal wiring pattern 52, If the 211 is electrically connected, it may be stacked on only one of the metal wiring patterns 52 and 211.
本發明的觸控面板的配線構造是適合於：將配線圖案跨過其他的導電圖案來與相對應的感應器電極做連接。 The wiring structure of the touch panel of the present invention is suitable for connecting a wiring pattern across other conductive patterns to correspond to corresponding sensor electrodes.
1、20‧‧‧觸控面板的配線構造 1, 20‧‧‧Wiring structure of touch panel
2‧‧‧玻璃基板 2‧‧‧ glass substrate
3‧‧‧感應器電極 3‧‧‧ sensor electrodes
5‧‧‧配線圖案 5‧‧‧Wiring pattern
6‧‧‧接地線圖案(導電圖案) 6‧‧‧ Grounding wire pattern (conductive pattern)
7‧‧‧絕緣覆層 7‧‧‧Insulation coating
8‧‧‧連結用圖案 8‧‧‧Link pattern
9‧‧‧頂部披覆層 9‧‧‧Top coating
10‧‧‧觸控面板 10‧‧‧Touch panel
21‧‧‧配線圖案 21‧‧‧Wiring pattern
51‧‧‧氧化金屬薄膜層 51‧‧‧Oxidized metal film layer
52‧‧‧金屬配線圖案 52‧‧‧Metal wiring pattern
211‧‧‧金屬配線圖案 211‧‧‧Metal wiring pattern
212‧‧‧氧化金屬薄膜層 212‧‧‧Oxidized metal film layer
TH1‧‧‧連通孔 TH1‧‧‧Connected Hole
TH2‧‧‧連通孔 TH2‧‧‧Connected Hole
第1圖是本發明的第1實施方式的觸控面板的配線構造1，省略了頂部披覆層15的圖示後的重要部位的俯視圖。 1 is a plan view of a wiring structure 1 of a touch panel according to the first embodiment of the present invention, and an important portion of the top cladding layer 15 is omitted.
第2圖是沿著第1圖的A-A線的位置截斷後的觸控面板的配線構造1的縱剖視圖。 Fig. 2 is a vertical cross-sectional view of the wiring structure 1 of the touch panel taken along the line A-A of Fig. 1 .
第3圖是顯示形成觸控面板的配線構造1的連通孔TH的工序的縱剖視圖。 FIG. 3 is a vertical cross-sectional view showing a step of forming a communication hole TH of the wiring structure 1 of the touch panel.
第4圖是本發明的第2實施方式的觸控面板的配線構造20的重要部位的縱剖視圖。 Fig. 4 is a vertical cross-sectional view showing an important part of the wiring structure 20 of the touch panel according to the second embodiment of the present invention.
第5圖是顯示形成觸控面板的配線構造20的連通孔TH的工序的縱剖視圖。 Fig. 5 is a vertical cross-sectional view showing a step of forming a communication hole TH of the wiring structure 20 of the touch panel.
第6圖是傳統的觸控面板的配線構造100，省略了頂部披覆層107的圖示後的重要部位的俯視圖。 Fig. 6 is a view showing a wiring structure 100 of a conventional touch panel, and a plan view of an important portion after the illustration of the top cladding layer 107 is omitted.
第7圖是沿著第6圖的B-B線的位置截斷後的觸控面板的配線構造100的縱剖視圖。 Fig. 7 is a vertical cross-sectional view of the wiring structure 100 of the touch panel taken along the line B-B of Fig. 6.
1‧‧‧觸控面板的配線構造 1‧‧‧Wiring structure of touch panel
2‧‧‧玻璃基板 2‧‧‧ glass substrate
3‧‧‧感應器電極 3‧‧‧ sensor electrodes
5‧‧‧配線圖案 5‧‧‧Wiring pattern
6‧‧‧接地線圖案 6‧‧‧ Grounding wire pattern
7‧‧‧絕緣覆層 7‧‧‧Insulation coating
8‧‧‧連結用圖案 8‧‧‧Link pattern
9‧‧‧頂部披覆層 9‧‧‧Top coating
10‧‧‧觸控面板 10‧‧‧Touch panel
51‧‧‧氧化金屬薄膜層 51‧‧‧Oxidized metal film layer
52‧‧‧金屬配線圖案 52‧‧‧Metal wiring pattern
TH1‧‧‧連通孔 TH1‧‧‧Connected Hole
TH2‧‧‧連通孔 TH2‧‧‧Connected Hole
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012005913A JP5588466B2 (en) | 2012-01-16 | 2012-01-16 | Touch panel wiring structure |
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| TW201331800A true TW201331800A (en) | 2013-08-01 |
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| TW101129711A TW201331800A (en) | 2012-01-16 | 2012-08-16 | Wiring structure of touch panel and its manufacturing method |
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| JP (1) | JP5588466B2 (en) |
| CN (1) | CN103207699B (en) |
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| TWI512582B (en) * | 2013-08-30 | 2015-12-11 | Au Optronics Corp | Touch panel and touch display panel |
| US10203537B2 (en) | 2013-05-14 | 2019-02-12 | Japan Display Inc. | Electronic component and electronic device using the same |
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| JP5762507B2 (en) * | 2013-06-05 | 2015-08-12 | アルプス電気株式会社 | Input device |
| JP6242710B2 (en) * | 2014-02-19 | 2017-12-06 | アルプス電気株式会社 | Manufacturing method of input device |
| JP2016009419A (en) * | 2014-06-26 | 2016-01-18 | 三菱電機株式会社 | Touch panel structure and manufacturing method thereof, and display device and manufacturing method thereof |
| KR102248460B1 (en) | 2014-08-08 | 2021-05-07 | 삼성디스플레이 주식회사 | Touch screen panel and fabrication method of the same |
| JP6374816B2 (en) * | 2015-03-24 | 2018-08-15 | アルプス電気株式会社 | Input device |
| US9715304B2 (en) * | 2015-06-30 | 2017-07-25 | Synaptics Incorporated | Regular via pattern for sensor-based input device |
| CN107515503A (en) * | 2017-09-30 | 2017-12-26 | 广东欧珀移动通信有限公司 | Optical filter, camera lens module and imaging modules |
| JP6942602B2 (en) | 2017-10-19 | 2021-09-29 | 株式会社ジャパンディスプレイ | Display device manufacturing method |
| CN109947292B (en) * | 2019-03-14 | 2022-07-19 | 合肥鑫晟光电科技有限公司 | Preparation method of narrow-frame touch screen, narrow-frame touch screen and display device |
| WO2021005695A1 (en) * | 2019-07-08 | 2021-01-14 | 株式会社Ａｎｏｖａ | Touch panel structure and production method for touch panel structure |
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| JP2004355545A (en) * | 2003-05-30 | 2004-12-16 | Pentel Corp | Electrostatic capacity type digital touch panel device |
| JP2010160670A (en) * | 2009-01-08 | 2010-07-22 | Seiko Epson Corp | Method for manufacturing touch panel, touch panel, display and electronic apparatus |
| JP5278759B2 (en) * | 2009-05-28 | 2013-09-04 | 凸版印刷株式会社 | Capacitive input device |
| JP5503651B2 (en) * | 2009-06-23 | 2014-05-28 | ジオマテック株式会社 | Capacitance type input device and manufacturing method thereof |
| KR101107173B1 (en) * | 2010-02-11 | 2012-01-25 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display and method for manufacturing the same |
| US8780061B2 (en) * | 2010-02-11 | 2014-07-15 | Lg Display Co., Ltd. | Electrostatic capacity type touch screen panel and method of manufacturing the same |
| JP5531707B2 (en) * | 2010-03-26 | 2014-06-25 | 大日本印刷株式会社 | Manufacturing method of touch panel sensor integrated color filter |
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2012
- 2012-01-16 JP JP2012005913A patent/JP5588466B2/en not_active Expired - Fee Related
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10203537B2 (en) | 2013-05-14 | 2019-02-12 | Japan Display Inc. | Electronic component and electronic device using the same |
| TWI512582B (en) * | 2013-08-30 | 2015-12-11 | Au Optronics Corp | Touch panel and touch display panel |
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| Publication number | Publication date |
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| JP5588466B2 (en) | 2014-09-10 |
| CN103207699B (en) | 2016-04-27 |
| CN103207699A (en) | 2013-07-17 |
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