TW201327281A - Optical navigation sensor module of optical mouse and method for manufacturing the same - Google Patents
Optical navigation sensor module of optical mouse and method for manufacturing the same Download PDFInfo
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- TW201327281A TW201327281A TW100148257A TW100148257A TW201327281A TW 201327281 A TW201327281 A TW 201327281A TW 100148257 A TW100148257 A TW 100148257A TW 100148257 A TW100148257 A TW 100148257A TW 201327281 A TW201327281 A TW 201327281A
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Abstract
Description
本發明係有關一種光學滑鼠，特別是一種光學滑鼠感測器模組及其製作方法。The invention relates to an optical mouse, in particular to an optical mouse sensor module and a manufacturing method thereof.
光學滑鼠以其內部之影像感測器擷取光學滑鼠所放置之表面的影像，藉由滑鼠移動造成擷取影像的變動情形，而使顯示幕上之游標(cursor)做一相關之移動。The optical mouse captures the image of the surface placed by the optical mouse with its internal image sensor, and the movement of the captured image is caused by the movement of the mouse, so that the cursor on the display screen is related. mobile.
傳統一種光學滑鼠之光學感測模組係使發光晶片進行晶體管外型(TO)封裝或燈型(lamp)封裝，其中晶體管外型(TO)封裝價格高，而燈型封裝雖然價格便宜，但是良率及精確度不佳，且封裝體積大，如圖1所示為習知一種以燈型封裝之LED作為光源之光學感測模組30，其中LED 32係設置於一電路板34上，而影像感測元件36係設置於一固定座38內側，LED 32與影像感測元件36之間並設置一透鏡構件40，藉以將LED 32所產生之光束42經由透鏡構件40之匯聚而投射至桌面44，又桌面44反射之光束42經由透鏡構件40之匯聚而成像於影像感測元件36，在此種設計中，由於LED 32之封裝體積大，使得LED 32所產生之光束42需經長距離之光程到達桌面44再反射至影像感測元件36，容易造成整個光程上的光損失。A conventional optical mouse optical sensing module enables a light-emitting chip to be packaged in a transistor (TO) package or a lamp package, in which a transistor package (TO) package is expensive, and a lamp package is inexpensive. However, the yield and the accuracy are not good, and the package is bulky. As shown in FIG. 1 , an optical sensing module 30 using a lamp-type LED as a light source is provided. The LED 32 is disposed on a circuit board 34 . The image sensing component 36 is disposed inside a fixing base 38, and a lens member 40 is disposed between the LED 32 and the image sensing component 36, thereby projecting the light beam 42 generated by the LED 32 through the lens member 40. The light beam 42 reflected from the lens member 40 to the table top 44 is imaged by the lens member 40 and imaged on the image sensing element 36. In this design, since the package size of the LED 32 is large, the light beam 42 generated by the LED 32 is required to pass through. The long-range optical path reaches the table top 44 and is reflected to the image sensing element 36, which tends to cause light loss over the entire optical path.
傳統另一種光學滑鼠之光學感測模組係將發光晶片、影像感測元件及透鏡等光構，封裝在同一顆IC元件中，使一顆IC元件即具有光學滑鼠感測模組的功能，然而此種設計之封裝成本高，且一旦IC元件中之發光晶片、影像感測元件或透鏡不良時，無法僅更換其中之一個不良構件，而需更換所有元件再進行重新封裝，因此造成元件浪費而無法降低製作成本。Another optical optical sensing module of the optical mouse is to package the optical structure of the light-emitting chip, the image sensing component and the lens in the same IC component, so that one IC component has the optical mouse sensing module. Function, however, the packaging cost of this design is high, and once the light-emitting chip, the image sensing element or the lens in the IC component is defective, it is impossible to replace only one of the defective components, and all the components need to be replaced and then repackaged, thereby causing The component is wasted and the production cost cannot be reduced.
為了解決上述問題，本發明目的之一係提供一種光學滑鼠感測器模組及其製作方法，其係使用表面黏著元件(SMD)封裝型之發光晶片封裝體，且發光晶片封裝體與影像感測元件設置於同一基板上，使整個光學滑鼠感測器模組之元件尺寸縮小，可有效縮小光學滑鼠感測器模組至外界表面的距離，降低光束在整個光程上的光損失，進而增加光學滑鼠的靈敏度，且增加生產良率。In order to solve the above problems, an object of the present invention is to provide an optical mouse sensor module and a manufacturing method thereof, which use a surface mount component (SMD) package type light emitting chip package, and a light emitting chip package and image The sensing components are disposed on the same substrate, so that the components of the entire optical mouse sensor module are reduced in size, which can effectively reduce the distance of the optical mouse sensor module to the external surface and reduce the light of the light beam over the entire optical path. Loss, which in turn increases the sensitivity of the optical mouse and increases production yield.
本發明目的之一係提供一種光學滑鼠感測器模組，具有省電、節能及保障眼睛安全之功效。One of the objects of the present invention is to provide an optical mouse sensor module that has the functions of saving electricity, saving energy, and ensuring eye safety.
本發明目的之一係提供一種光學滑鼠感測器模組，其表面黏著元件(SMD)封裝型之發光晶片封裝體具有更換容易且使光學滑鼠感測器模組之良率佳及精確度高的優點。One of the objects of the present invention is to provide an optical mouse sensor module having a surface mount component (SMD) package type of light emitting chip package with easy replacement and excellent yield and precision of the optical mouse sensor module. The advantage of high degree.
為了達到上述目的，本發明一實施例之光學滑鼠感測器模組包含：一基板具有一下表面；一影像感測元件設置於基板之下表面；以及一表面黏著元件(SMD)封裝型之發光晶片封裝體，電性連接於基板之下表面，發光晶片封裝體產生一光束投射至一外界表面，外界表面將光束反射至影像感測元件。In order to achieve the above object, an optical mouse sensor module according to an embodiment of the invention includes: a substrate having a lower surface; an image sensing component disposed on a lower surface of the substrate; and a surface mount component (SMD) package type The light emitting chip package is electrically connected to the lower surface of the substrate, and the light emitting chip package generates a light beam projected onto an external surface, and the external surface reflects the light beam to the image sensing element.
本發明一實施例光學滑鼠感測器模組之製作方法包含：以一表面黏著技術封裝一發光晶片為一發光晶片封裝體；以及電性連接發光晶片封裝體與一影像感測元件至一基板之一下表面。The method for fabricating an optical mouse sensor module according to an embodiment of the present invention comprises: packaging a light emitting chip into a light emitting chip package by a surface adhesion technology; and electrically connecting the light emitting chip package and an image sensing element to the first One of the lower surfaces of the substrate.
圖2所示為本發明一實施例光學滑鼠感測器模組之結構示意圖。於本實施例中，如圖所示，一光學滑鼠感測器模組10包含一基板12，於一實施例中基板係為一電路板，其係具有一下表面121；一影像感測元件14，設置於基板12之下表面121，影像感測元件14例如是一電荷耦合元件或是一互補金氧半導體影像感測元件；以及一發光晶片封裝體16，電性連接於基板12之下表面121，其中發光晶片封裝體16係為一表面黏著元件(SMD)封裝體，且以焊接方式將封裝體之複數個焊點161設置於基板12的下表面121。於一實施例中，發光晶片封裝體16係為一垂直共振腔面射型雷射(VCSEL)晶片進行SMD封裝所構成。2 is a schematic structural view of an optical mouse sensor module according to an embodiment of the present invention. In the present embodiment, as shown, an optical mouse sensor module 10 includes a substrate 12. In one embodiment, the substrate is a circuit board having a lower surface 121; an image sensing component 14 , disposed on the lower surface 121 of the substrate 12 , the image sensing component 14 is, for example, a charge coupled component or a complementary MOS image sensing component; and a light emitting chip package 16 electrically connected to the substrate 12 The surface 121, wherein the light emitting chip package 16 is a surface mount component (SMD) package, and a plurality of solder joints 161 of the package are disposed on the lower surface 121 of the substrate 12 by soldering. In one embodiment, the light emitting chip package 16 is formed by a vertical cavity surface area laser (VCSEL) wafer for SMD packaging.
接續上述說明，如圖3所示，應用本發明光學滑鼠感測器模組10之光學滑鼠(圖中未示)係放置於一外界表面18(如桌面)上，發光晶片封裝體16產生一光束20投射至外界表面18，外界表面18將光束20反射至影像感測元14件，以便藉由影像感測元件14擷取外界表面18之影像，如此當使用者移動光學滑鼠時，影像感測元件14所擷取之影像便會隨之變化。Following the above description, as shown in FIG. 3, an optical mouse (not shown) to which the optical mouse sensor module 10 of the present invention is applied is placed on an external surface 18 (such as a desktop), and the light emitting chip package 16 is mounted. A light beam 20 is generated to be projected onto the outer surface 18, and the outer surface 18 reflects the light beam 20 to the image sensing element 14 to capture an image of the outer surface 18 by the image sensing element 14, such that when the user moves the optical mouse The image captured by the image sensing component 14 changes accordingly.
圖4所示為本發明一實施例光學滑鼠感測器模組之製作方法流程示意圖，如圖所示，光學滑鼠感測器模組之製作方法包含：以一表面黏著技術封裝一發光晶片，以構成一發光晶片封裝體，此為步驟S50，於一實施例中，發光晶片係為一垂直共振腔面射型雷射(VCSEL)晶片；之後，電性連接此晶片封裝體及一影像感測元件至一基板之一下表面，此為步驟S52，其中基板係為一電路板，且晶片封裝體係為焊接方式電性連接於基板之下表面。4 is a schematic flow chart of a method for manufacturing an optical mouse sensor module according to an embodiment of the present invention. As shown in the figure, a method for manufacturing an optical mouse sensor module includes: encapsulating a light with a surface adhesion technology. The wafer is configured to form a light-emitting chip package. In this embodiment, the light-emitting chip is a vertical cavity surface-emitting laser (VCSEL) wafer. Thereafter, the chip package is electrically connected to the chip package. The image sensing component is connected to a lower surface of a substrate. The step S52 is a circuit board, and the chip packaging system is electrically connected to the lower surface of the substrate.
在本發明中，光源係使用經SMD封裝所構成之發光晶片封裝體16，且發光晶片封裝體16與影像感測元件14設置於同一基板12之下表面121上，其中由於發光晶片封裝體16之微型化特點，使整個光學滑鼠感測器模組10之元件尺寸縮小，可縮小光學滑鼠感測器模組10至外界表面18的距離，降低光束20在整個光程上的光損失，進而增加光學滑鼠的靈敏度，以便於不同的外界表面(即不同桌面)皆可適用，其中更由於整個光程的縮小，對於發光晶片封裝體16與影像感測元件14在基板12上的安裝，精準需求度可降低，而增加生產良率，同時光程的縮小亦可省略傳統之如透鏡等光構元件的使用；此外，光損失的減少更可降低光源輸出功率，達到省電、節能之功效，又當發光晶片封裝體16乃為一垂直共振腔面射型雷射(VCSEL)進行SMD封裝所構成時，其低功率的使用更可保障使用者之眼睛安全且符合產品安規。In the present invention, the light source is a light-emitting chip package 16 formed by an SMD package, and the light-emitting chip package 16 and the image sensing element 14 are disposed on the lower surface 121 of the same substrate 12, wherein the light-emitting chip package 16 is used. The miniaturization feature reduces the component size of the entire optical mouse sensor module 10, and reduces the distance between the optical mouse sensor module 10 and the external surface 18, and reduces the light loss of the light beam 20 over the entire optical path. In addition, the sensitivity of the optical mouse is increased, so that different external surfaces (ie, different desktops) can be applied, wherein the light-emitting chip package 16 and the image sensing element 14 are on the substrate 12 due to the reduction of the entire optical path. Installation, precision demand can be reduced, and increase production yield, while the reduction of optical path can also omit the use of traditional light-emitting components such as lenses; in addition, the reduction of light loss can reduce the output power of the light source, to achieve power saving, The energy-saving effect, when the light-emitting chip package 16 is composed of a vertical cavity surface-emitting laser (VCSEL) for SMD packaging, its low power use can further protect the user. Eye safe and comply with product safety.
另一方面，由於每一發光晶片封裝體16於生產後皆已進行檢測與篩檢，發光晶片封裝體16之良率獲得保障，因此發光晶片封裝體16與影像感測元件14安裝於基板12上所構成光學滑鼠感測器模組10即獲得相當之良率保證。又一旦光學滑鼠感測器模組10中之發光晶片封裝體16需要更換時，僅需解銲基板12上之光晶片封裝體16的焊點161進行更換即可，不需同時更換無損壞之影像感測元件14。相對於傳統將發光晶片、影像感測元件及透鏡同時以封裝製程構成一封裝IC所造成之其中一元件不良卻需全部更換且重新封裝的設計而言，本案具有更換容易且光學滑鼠感測器模組之良率佳的優點。於本發明另一實施例之光學滑鼠感測器模組中，依據設計者需求仍可設置一透鏡於影像感測元件及發光晶片封裝體之下方，其中一旦發光晶片封裝體不良需要更換時，亦不致影響透鏡的拆卸與更換。On the other hand, since each of the light-emitting chip packages 16 has been inspected and screened after production, the yield of the light-emitting chip package 16 is secured, and thus the light-emitting chip package 16 and the image sensing element 14 are mounted on the substrate 12. The optical mouse sensor module 10 formed thereon achieves a considerable yield guarantee. Moreover, once the light emitting chip package 16 in the optical mouse sensor module 10 needs to be replaced, only the solder joint 161 of the optical chip package 16 on the substrate 12 needs to be soldered for replacement, and no replacement is required at the same time. Image sensing element 14. Compared with the conventional design that the light-emitting chip, the image sensing element and the lens are simultaneously formed by the package process, one of the components is defective, but needs to be completely replaced and re-packaged, the case has easy replacement and optical mouse sensing. The advantages of good yield of the module. In the optical mouse sensor module of another embodiment of the present invention, a lens may be disposed under the image sensing component and the light emitting chip package according to the designer's requirement, and the light emitting chip package may need to be replaced if it is defective. It also does not affect the disassembly and replacement of the lens.
綜合上述，本發明使用SMD封裝型之發光晶片封裝體作為光學滑鼠的光源，使光學滑鼠感測器模組具有微型化之優點；又發光晶片封裝體與影像感測元件設置同一電路板，可縮小光學滑鼠感測器模組至外界表面之距離，降低光束在整個光程上的光損失，進而增加光學滑鼠的靈敏度，且達到省電、節能及保障眼睛安全之功效。In summary, the present invention uses an SMD package type light-emitting chip package as a light source of an optical mouse, so that the optical mouse sensor module has the advantage of miniaturization; and the light-emitting chip package and the image sensing element are provided with the same circuit board. The optical mouse sensor module can be reduced to the distance from the external surface, the light loss of the light beam over the entire optical path is reduced, thereby increasing the sensitivity of the optical mouse, and achieving the effects of power saving, energy saving and eye safety.
以上所述之實施例僅係為說明本發明之技術思想及特點，其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施，當不能以之限定本發明之專利範圍，即大凡依本發明所揭示之精神所作之均等變化或修飾，仍應涵蓋在本發明之專利範圍內。The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.
10．．．光學滑鼠感測器模組10. . . Optical mouse sensor module
12．．．基板12. . . Substrate
121．．．下表面121. . . lower surface
14．．．影像感測元件14. . . Image sensing component
16．．．發光晶片封裝體16. . . Light-emitting chip package
161．．．焊點161. . . Solder joint
18．．．外界表面18. . . Exterior surface
20．．．光束20. . . beam
30．．．光學感測模組30. . . Optical sensing module
32．．．LED32. . . led
34．．．電路板34. . . Circuit board
36．．．影像感測元件36. . . Image sensing component
38．．．固定座38. . . Fixed seat
40．．．透鏡構件40. . . Lens member
42．．．光束42. . . beam
44．．．桌面44. . . desktop
S50、S52．．．步驟S50, S52. . . step
圖1所示為習知一種以燈型封裝之LED作為光源之光學感測模組。FIG. 1 shows an optical sensing module using a lamp-packaged LED as a light source.
圖2所示為本發明一實施例光學滑鼠感測器模組之結構示意圖。2 is a schematic structural view of an optical mouse sensor module according to an embodiment of the present invention.
圖3所示為本發明一實施例光學滑鼠感測器模組中之光程示意圖。FIG. 3 is a schematic diagram showing optical paths in an optical mouse sensor module according to an embodiment of the invention.
圖4所示為本發明一實施例光學滑鼠感測器模組之製作方法流程示意圖。FIG. 4 is a schematic flow chart of a method for fabricating an optical mouse sensor module according to an embodiment of the invention.
10．．．光學滑鼠感測器模組10. . . Optical mouse sensor module
12．．．基板12. . . Substrate
121．．．下表面121. . . lower surface
14．．．影像感測元件14. . . Image sensing component
16．．．發光晶片封裝體16. . . Light-emitting chip package
18．．．外界表面18. . . Exterior surface
20．．．光束20. . . beam
Claims (9)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI615741B (en) * | 2017-01-06 | 2018-02-21 | 致伸科技股份有限公司 | Mouse with air pressure sensing type switches |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI615741B (en) * | 2017-01-06 | 2018-02-21 | 致伸科技股份有限公司 | Mouse with air pressure sensing type switches |
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