TW201325793A - Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium - Google Patents
Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium Download PDFInfo
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- TW201325793A TW201325793A TW101143432A TW101143432A TW201325793A TW 201325793 A TW201325793 A TW 201325793A TW 101143432 A TW101143432 A TW 101143432A TW 101143432 A TW101143432 A TW 101143432A TW 201325793 A TW201325793 A TW 201325793A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 476
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000005520 cutting process Methods 0.000 claims abstract description 98
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 10
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 99
- 239000010408 film Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 20
- 230000032258 transport Effects 0.000 description 17
- 239000012788 optical film Substances 0.000 description 16
- 230000001681 protective effect Effects 0.000 description 11
- 238000007689 inspection Methods 0.000 description 10
- 238000004064 recycling Methods 0.000 description 8
- 238000011084 recovery Methods 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Liquid Crystal (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Polarising Elements (AREA)
Abstract
Description
本發明係關於一種將光學組件貼合至光學顯示部件的光學組件貼合體之製造系統、製造方法及記錄媒體。 The present invention relates to a manufacturing system, a manufacturing method, and a recording medium of an optical component bonding body in which an optical component is bonded to an optical display component.
傳統上，已知液晶顯示器等光學顯示設備的生產系統。該生產系統係將貼合至液晶面板(光學顯示部件)的偏光板等光學組件，從長條薄膜切割出符合液晶面板之顯示區域尺寸的層片。然後，將光學組件貼合至液晶面板(例如，參考專利文獻1)。 Conventionally, a production system of an optical display device such as a liquid crystal display is known. This production system is an optical component such as a polarizing plate that is bonded to a liquid crystal panel (optical display member), and cuts a laminate that conforms to the size of the display region of the liquid crystal panel from the long film. Then, the optical component is attached to the liquid crystal panel (for example, refer to Patent Document 1).
【專利文獻1】日本專利特開第2003-255132號公報。 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-255132.
但是，上述習知結構中，考慮到液晶面板及層片的各尺寸偏差，以及相對於液晶面板的層片之貼合偏差(位置偏差)，會切割出較顯示區域稍大的層片。因此，顯示區域之周邊部形成有多餘區域(邊框部)，而有阻礙機器小型化的問題。 However, in the above-described conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) with respect to the ply of the liquid crystal panel, a ply which is slightly larger than the display region is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, and there is a problem that the size of the device is prevented from being reduced.
本發明有鑑於上述事項，係提供一種可縮小顯示區域周邊之邊 框部，以達成顯示區域之擴大及機器之小型化目的之光學組件貼合體的製造系統、製造方法及記錄媒體。 The present invention has been made in view of the above matters, and provides a side that can narrow the periphery of a display area. The frame portion is a manufacturing system, a manufacturing method, and a recording medium for an optical component bonding body for the purpose of expanding the display area and miniaturizing the device.
本發明之第一態樣為一種光學組件貼合體之製造系統，係具備：第一貼合裝置，係將較該光學顯示部件之顯示區域更大的第一光學組件層貼合至光學顯示部件之一側之面；以及切斷裝置，將該第一貼合裝置貼合好之第一光學組件層區域中對向該光學顯示部件之顯示區域的第一區域、與該第一光學組件層之第一區域外側區域的第二區域切斷。 A first aspect of the present invention is a manufacturing system of an optical component bonding body, comprising: a first bonding device that bonds a first optical component layer larger than a display area of the optical display component to an optical display component a side surface; and a cutting device, the first bonding device is attached to the first region of the first optical component layer region facing the display region of the optical display component, and the first optical component layer The second region of the outer region of the first region is severed.
不過，上述結構中的「第一區域(與顯示區域的對向部分)」係指較顯示區域大且較光學顯示部件外形小之區域，且為避開了電子部件安裝部等功能部分的區域。即，上述結構係包含沿光學顯示部件外周緣以雷射切斷剩餘部分的情況。 However, the "first region (opposing portion with the display region)" in the above-described configuration means an area which is larger than the display area and which is smaller than the outer shape of the optical display member, and is an area which avoids a functional portion such as an electronic component mounting portion. . That is, the above structure includes a case where the remaining portion is cut by laser along the outer periphery of the optical display member.
於本發明之第一態樣中，該切斷裝置係可以雷射切斷該第一光學組件層。 In a first aspect of the invention, the cutting device is capable of laser cutting the first optical component layer.
於本發明之第一態樣中，該切斷裝置係可使用二氧化碳(CO2)雷射切割機以雷射切斷該第一光學組件層。 In a first aspect of the invention, the cutting device is capable of laser cutting the first optical component layer using a carbon dioxide (CO 2 ) laser cutter.
於本發明之第一態樣中，該切斷裝置係可從該第一光學組件層切割出對應於該顯示區域大小的第一光學組件層，藉以切割出包含該光學顯示部件及該第一光學組件層的光學組件貼合體。 In a first aspect of the present invention, the cutting device can cut a first optical component layer corresponding to the size of the display area from the first optical component layer, thereby cutting the optical display component and the first The optical component of the optical component layer is bonded to the body.
於本發明之第一態樣中，該第一貼合裝置係可以較該顯示區域大且較該光學顯示部件外形小的區域來作為該第一區域。 In a first aspect of the invention, the first bonding device can be the first region that is larger than the display area and smaller than the outer shape of the optical display member.
於本發明之第一態樣中，該第一貼合裝置係可將該第一光學組件層之下側面與該光學顯示部件之上側面接合。 In a first aspect of the invention, the first bonding device can engage the lower side of the first optical component layer with the upper side of the optical display component.
於本發明之第一態樣中，其可更具備攝影裝置，係拍攝該光學顯示部件，以檢測出該光學顯示部件之顯示區域外周緣。 In a first aspect of the invention, the imaging device may be further provided to capture the optical display member to detect the outer periphery of the display area of the optical display member.
於本發明之第一態樣中，該切斷裝置係可沿著該攝影裝置所檢測出之光學顯示部件的顯示區域外周緣將該第一光學組件層切斷。 In a first aspect of the invention, the cutting device is capable of cutting the first optical component layer along an outer circumference of a display region of the optical display member detected by the imaging device.
於本發明之第一態樣中，其可更具備第一輸送裝置，係將該光學顯示部件以該第一貼合裝置及該切斷裝置之順序輸送。 In a first aspect of the present invention, the first transport device may be further provided, and the optical display member is transported in the order of the first bonding device and the cutting device.
於本發明之第一態樣中，其可更具備第二輸送裝置，係將該第一光學組件層輸送至該第一貼合裝置。 In a first aspect of the invention, it may further comprise a second delivery device for transporting the first optical component layer to the first bonding device.
於本發明之第一態樣中，該第二輸送裝置係可具備回收部，係將該切斷裝置所切斷之第一光學組件層之第二區域回收。 In a first aspect of the present invention, the second transport device may include a recovery unit for recovering the second region of the first optical component layer cut by the cutting device.
於本發明之第一態樣中，其可更具備第二貼合裝置，係將較該光學顯示部件之顯示區域更大的第二光學組件層貼合至光學顯示部件之另一側面。 In a first aspect of the invention, the second bonding device can be further provided with a second optical component layer that is larger than the display area of the optical display component to the other side of the optical display component.
於本發明之第一態樣中，該切斷裝置係可於切斷該第一區域與該第二區域的同時，將該第二貼合裝置貼合好之第二光學組件層區域中對向該光學顯示部件之顯示區域的第三區域、與該第二光學組件層之第三區域外側區域的第四區域切斷。 In a first aspect of the present invention, the cutting device can be used to cut the first region and the second region, and the second bonding device is attached to the second optical component layer region. The third region of the display region of the optical display member and the fourth region of the outer region of the third region of the second optical component layer are cut.
本發明之第二態樣為一種光學組件貼合體之製造方法，係將較該光學顯示部件之顯示區域更大的第一光學組件層貼合至光學顯示部件之一側之面；且將貼合好之第一光學組件層區域中對向該光學顯示部件之顯示區域的第一區域、與該第一光學組件層之第一區域外側區域的第二區域切斷。 A second aspect of the present invention is a method of manufacturing an optical component bonding body, wherein a first optical component layer larger than a display area of the optical display component is attached to a side of one side of the optical display component; A first region of the first optical component layer region that is aligned with the first region of the first region of the first optical component layer is cut off from the first optical component layer region.
本發明之第三態樣為一種電腦可讀式記錄媒體，係儲存有執行 下述動作的程式：將較該光學顯示部件之顯示區域更大的第一光學組件層貼合至光學顯示部件之一側之面；且將貼合好之第一光學組件層區域中對向該光學顯示部件之顯示區域的第一區域、與該第一光學組件層之第一區域外側區域的第二區域切斷。 The third aspect of the present invention is a computer readable recording medium, which is stored and executed. a program for attaching a first optical component layer larger than a display area of the optical display component to a side of one side of the optical display component; and facing the first optical component layer region to be bonded A first region of the display region of the optical display member is disconnected from a second region of the outer region of the first region of the first optical component layer.
上述光學組件貼合體之製造裝置中，該切斷裝置較佳地以雷射切斷該光學組件層。 In the above apparatus for manufacturing an optical component bonding body, the cutting device preferably cuts the optical component layer by laser.
又，本發明為一種將光學組件貼合至光學顯示部件的光學組件貼合體之製造方法，係包含：將較該光學顯示部件之顯示區域更大的光學組件層貼合至該光學顯示部件作為貼合層之步驟；將該光學組件層之對向該顯示區域的部分，與其外側之剩餘部分切斷，從該光學組件層切割出對應於該顯示區域大小的光學組件，藉以從該貼合層切割出包含單一個該光學顯示部件及與其重疊之光學組件的光學組件貼合體之步驟。 Moreover, the present invention provides a method of manufacturing an optical component bonding body in which an optical component is bonded to an optical display component, comprising: bonding an optical component layer larger than a display area of the optical display component to the optical display component as a step of bonding the layer; the portion of the optical component layer facing the display region is cut off from the remaining portion of the display region, and an optical component corresponding to the size of the display region is cut out from the optical component layer, thereby bonding from the optical component layer The layer cuts the step of splicing the optical component comprising a single optical component and the optical component overlapping the optical component.
根據本發明，將較顯示區域更大的光學組件層貼合至光學顯示部件之後，將光學組件層之剩餘部分切斷。因此，可在光學顯示部的表面上形成對應於顯示區域尺寸的光學組件。藉此，可讓光學組件之顯示區域提供更佳的精度，可使得顯示區域外側邊框部變窄，以達成顯示區域之擴大及機器之小型化之目的。 According to the present invention, after the optical component layer larger than the display area is attached to the optical display member, the remaining portion of the optical component layer is cut. Therefore, an optical component corresponding to the size of the display area can be formed on the surface of the optical display portion. Thereby, the display area of the optical component can be provided with better precision, and the outer frame portion of the display area can be narrowed to achieve the purpose of expanding the display area and miniaturizing the machine.
又，將光學顯示部件貼合至較顯示區域更大之光學組件層，即使是其光軸方向因光學組件層之位置而改變的情況，可依據該光軸方向校準光學顯示部件並進行貼合。藉此，可提升相對於光學顯示部件的光學組件之光軸方向的精度，可改善光學顯示設備的色彩度及對比度。 Further, the optical display member is attached to the optical component layer which is larger than the display area, and even if the optical axis direction is changed by the position of the optical component layer, the optical display component can be aligned and bonded according to the optical axis direction. . Thereby, the accuracy with respect to the optical axis direction of the optical component of the optical display member can be improved, and the color and contrast of the optical display device can be improved.
5‧‧‧滾筒輸送機 5‧‧‧Roller conveyor
11‧‧‧第一校準裝置 11‧‧‧First calibration device
12,12’‧‧‧第一貼合裝置 12,12’‧‧‧First bonding device
12a,12a’‧‧‧輸送裝置 12a, 12a’‧‧‧ delivery device
12b‧‧‧夾壓滾筒 12b‧‧‧ pinch roller
12c‧‧‧滾筒保持部 12c‧‧‧Roller Keeping Department
12d‧‧‧保護薄膜回收部 12d‧‧‧Protective film recycling department
12e‧‧‧第一回收部 12e‧‧‧First Recycling Department
13,13’‧‧‧第一切斷裝置 13,13'‧‧‧First cut-off device
14‧‧‧第二校準裝置 14‧‧‧Second calibration device
15‧‧‧第二貼合裝置 15‧‧‧Second laminating device
15a‧‧‧輸送裝置 15a‧‧‧Conveyor
15b‧‧‧夾壓滾筒 15b‧‧‧ pinch roller
15c‧‧‧滾筒保持部 15c‧‧‧Roller Keeping Department
15d‧‧‧第二回收部 15d‧‧‧Second Recycling Department
16‧‧‧第二切斷裝置 16‧‧‧Second cutting device
C,16a,19a‧‧‧攝影機 C, 16a, 19a‧‧‧ camera
17,17’‧‧‧第三校準裝置 17,17'‧‧‧ third calibration device
18,18’‧‧‧第三貼合裝置 18,18’‧‧‧ Third bonding device
18a‧‧‧輸送裝置 18a‧‧‧Transportation device
18b‧‧‧夾壓滾筒 18b‧‧‧ pinch roller
18c‧‧‧滾筒保持部 18c‧‧‧Roller Keeping Department
18d‧‧‧第三回收部 18d‧‧‧ Third Recycling Department
19‧‧‧第三切斷裝置 19‧‧‧ Third cutting device
20‧‧‧控制裝置 20‧‧‧Control device
F1‧‧‧第一光學組件層 F1‧‧‧First optical component layer
F1S‧‧‧層片 F1S‧‧‧ layer
F11‧‧‧第一光學組件 F11‧‧‧First optical component
F12‧‧‧第二光學組件 F12‧‧‧Second optical component
F13‧‧‧第三光學組件 F13‧‧‧ Third optical component
F2‧‧‧第二光學組件層 F2‧‧‧Second optical component layer
F3‧‧‧第三光學組件層 F3‧‧‧ third optical component layer
F21‧‧‧第一貼合層 F21‧‧‧ first bonding layer
F22‧‧‧第二貼合層 F22‧‧‧Second bonding layer
F23‧‧‧第三貼合層 F23‧‧‧ third bonding layer
FX‧‧‧光學組件層 FX‧‧‧ optical component layer
G‧‧‧邊框部 G‧‧‧Border Department
R1‧‧‧第一料捲滾筒 R1‧‧‧First roll drum
R2‧‧‧第二料捲滾筒 R2‧‧‧second roll drum
R3‧‧‧第三料捲滾筒 R3‧‧‧ third roll
t‧‧‧切斷端 T‧‧‧ cut end
P‧‧‧液晶面板 P‧‧‧ LCD panel
P1‧‧‧第一基板 P1‧‧‧ first substrate
P2‧‧‧第二基板 P2‧‧‧second substrate
P3‧‧‧液晶層 P3‧‧‧ liquid crystal layer
P4‧‧‧顯示區域 P4‧‧‧ display area
P5‧‧‧電子部件安裝部 P5‧‧‧Electronic Component Installation Department
P11‧‧‧第一單面貼合面板 P11‧‧‧First single-sided fitting panel
P12‧‧‧第二單面貼合面板 P12‧‧‧Second single-sided fitting panel
P13‧‧‧雙面貼合面板 P13‧‧‧ double-sided fitting panel
pf‧‧‧保護薄膜 Pf‧‧‧protective film
pt1‧‧‧起點 Starting point of pt1‧‧
pt2‧‧‧終點 End point of pt2‧‧
PX‧‧‧光學顯示組件 PX‧‧‧Optical display components
第1圖係本發明之實施形態中光學顯示設備之薄膜貼合系統的示意結構圖。 Fig. 1 is a schematic configuration diagram of a film bonding system of an optical display device in an embodiment of the present invention.
第2圖係上述薄膜貼合系統之第二貼合裝置周邊的立體圖。 Fig. 2 is a perspective view showing the periphery of a second bonding apparatus of the above film bonding system.
第3圖係顯示上述薄膜貼合系統之光學組件層的光軸方向與其貼合之光學顯示部件的立體圖。 Fig. 3 is a perspective view showing an optical display member in which the optical axis direction of the optical component layer of the film bonding system is bonded thereto.
第4圖係上述薄膜貼合系統中第一貼合層的剖面圖。 Figure 4 is a cross-sectional view of the first bonding layer in the above film bonding system.
第5圖係上述薄膜貼合系統之第二切斷裝置中第二貼合層的剖面圖。 Fig. 5 is a cross-sectional view showing a second bonding layer in the second cutting device of the film bonding system.
第6圖係上述薄膜貼合系統之第三切斷裝置中第三貼合層的平面圖。 Fig. 6 is a plan view showing a third bonding layer in the third cutting device of the above film bonding system.
第7圖係第6圖之A-A線的剖面圖。 Figure 7 is a cross-sectional view taken along line A-A of Figure 6.
第8圖係通過上述薄膜貼合系統之雙面貼合面板的剖面圖。 Figure 8 is a cross-sectional view of the double-sided bonding panel through the above film bonding system.
第9圖係顯示已貼合至液晶面板的光學組件層之雷射切斷端的剖面圖。 Fig. 9 is a cross-sectional view showing the laser cut end of the optical component layer which has been bonded to the liquid crystal panel.
第10圖係顯示光學組件層單體之雷射切斷端的剖面圖。 Figure 10 is a cross-sectional view showing the laser cut end of the optical component layer unit.
第11圖係顯示上述薄膜貼合系統之第一貼合裝置周邊變形例的示意結構圖。 Fig. 11 is a schematic structural view showing a modification of the periphery of the first bonding apparatus of the above film bonding system.
第12圖係顯示上述薄膜貼合系統之第三貼合裝置周邊變形例的示意結構圖。 Fig. 12 is a schematic structural view showing a modification of the periphery of the third bonding apparatus of the above film bonding system.
以下，參考圖面說明本發明之實施形態。本實施形態中，係說明包含光學組件貼合體之製造裝置的薄膜貼合系統。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system including a manufacturing apparatus of an optical component bonding body will be described.
第1圖係顯示本實施形態之薄膜貼合系統1的示意結構。薄膜貼合系統1係將偏光薄膜或相位差薄膜、輝度增加薄膜等薄膜狀光學組件貼合至例如液晶面板或有機EL面板等面板狀光學顯示部件。薄膜貼合系統係製造包含有該光學顯示部件及光學組件的光學組件貼合體。薄膜貼合系統1中，使用液晶面板P作為該光學顯示部件。薄膜貼合系統1之各部位係透過作為電子控 制裝置的控制裝置20進行整體控制。 Fig. 1 is a view showing a schematic configuration of a film bonding system 1 of the present embodiment. In the film bonding system 1 , a film-shaped optical component such as a polarizing film, a retardation film, or a brightness increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic EL panel. The film bonding system manufactures an optical component bonding body including the optical display member and the optical component. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. Each part of the film bonding system 1 is transmitted as an electronic control The control device 20 of the device performs overall control.
薄膜貼合系統1係從貼合步驟之起始位置到最終位置為止，使用例如驅動式之滾筒輸送機5輸送液晶面板P，同時對液晶面板P依序施以特定處理。液晶面板P係以其正/反面呈水平狀態下於滾筒輸送機5上進行輸送。 The film bonding system 1 transports the liquid crystal panel P from the start position to the final position of the bonding step, for example, using a driving type roller conveyor 5, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is conveyed on the roller conveyor 5 with its front/reverse surface in a horizontal state.
不過，第1圖之紙面左側係顯示液晶面板P的輸送方向上游側(以下稱作面板輸送上游側)。第1圖之紙面右側係顯示液晶面板P的輸送方向下游側(以下稱作面板輸送下游側)。 However, the left side of the paper surface of the first drawing shows the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the upstream side of the panel transport). The right side of the paper surface of Fig. 1 shows the downstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the downstream side of the panel transport).
一併參考第6圖至第8圖進行說明。不過，第7圖以及第8圖中，液晶面板P之紙面上方側係為顯示側，紙面下方側則為背光側。液晶面板P之平面視圖為長方形(參考第6圖)。從液晶面板P外周緣距特定寬度之內側處，形成具有沿該外周緣形狀的顯示區域P4(參考第6圖)。於後述第二校準裝置14的面板輸送上游側時，使得顯示區域P4之短邊約略沿著輸送方向之座向來輸送液晶面板P。於該第二校準裝置14的面板輸送下游側時，則使得顯示區域P4之長邊約略沿著輸送方向之座向來輸送液晶面板P。 The description will be made with reference to Figs. 6 to 8. However, in the seventh and eighth figures, the upper side of the paper surface of the liquid crystal panel P is the display side, and the lower side of the paper surface is the backlight side. The plan view of the liquid crystal panel P is rectangular (refer to Fig. 6). A display region P4 having a shape along the outer periphery is formed from the inner periphery of the liquid crystal panel P at a certain width from the outer periphery (refer to FIG. 6). When the panel of the second calibration device 14 is transported to the upstream side as will be described later, the short side of the display region P4 is caused to convey the liquid crystal panel P approximately in the direction of the transport direction. When the panel of the second calibration device 14 conveys the downstream side, the long side of the display region P4 is caused to convey the liquid crystal panel P approximately in the direction of the conveyance direction.
針對該液晶面板P之正/反面，長條形之第一光學組件層F1、第二光學組件層F2及第三光學組件層F3所切割出的第一光學組件F11、第二光學組件F12及第三光學組件F13適當地貼合至液晶面板P(參考第8圖)。本實施形態中，液晶面板P之背光側及顯示側的雙面係各自貼合有作為偏光薄膜的第一光學組件F11及第三光學組件F13(參考第8圖)。液晶面板P之背光側一面進一步貼合有重疊於第一光學組件F11之作為輝度增加薄膜之第二光學組件F12(參考第8圖)。 The first optical component F11 and the second optical component F12 cut by the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3, which are formed on the front/back side of the liquid crystal panel P, The third optical component F13 is appropriately attached to the liquid crystal panel P (refer to FIG. 8). In the present embodiment, the first optical unit F11 and the third optical unit F13 which are polarizing films are bonded to each other on the backlight side and the display side of the liquid crystal panel P (refer to FIG. 8). On the side of the backlight side of the liquid crystal panel P, a second optical component F12 as a luminance increasing film which is overlapped with the first optical component F11 is further bonded (refer to FIG. 8).
如第1圖所示，薄膜貼合系統1係具備第一校準裝置11、第一 貼合裝置12、第一切斷裝置13及第二校準裝置14。 As shown in FIG. 1, the film bonding system 1 includes a first calibration device 11 and a first The bonding device 12, the first cutting device 13, and the second calibration device 14.
第一校準裝置11係將液晶面板P從上游步驟輸送至滾筒輸送機5之面板輸送上游側上，同時進行液晶面板P的校準。第一貼合裝置12係設置於第一校準裝置11的面板輸送下游側。第一切斷裝置13係設置於接近第一貼合裝置12處。第二校準裝置14係設置於第一貼合裝置12及第一切斷裝置13的面板輸送下游側。 The first calibration device 11 transports the liquid crystal panel P from the upstream step to the upstream side of the panel conveyance of the roller conveyor 5 while performing calibration of the liquid crystal panel P. The first bonding device 12 is disposed on the downstream side of the panel conveyance of the first calibration device 11. The first cutting device 13 is disposed adjacent to the first bonding device 12. The second calibration device 14 is disposed on the downstream side of the panel transport of the first bonding device 12 and the first cutting device 13.
又，薄膜貼合系統1係具備第二貼合裝置15、第二切斷裝置16、第三校準裝置17、第三貼合裝置18及第三切斷裝置19。 Further, the film bonding system 1 includes a second bonding device 15, a second cutting device 16, a third calibration device 17, a third bonding device 18, and a third cutting device 19.
第二貼合裝置15係設置於第二校準裝置14的面板輸送下游側。第二切斷裝置16係設置於接近第二貼合裝置15處。第三校準裝置17係設置於第二貼合裝置15及第二切斷裝置16的面板輸送下游側。第三貼合裝置18係設置於第三校準裝置17的面板輸送下游側。第三切斷裝置19係設置於接近第三貼合裝置18處。 The second bonding device 15 is disposed on the downstream side of the panel conveyance of the second calibration device 14. The second cutting device 16 is disposed adjacent to the second bonding device 15. The third calibration device 17 is provided on the downstream side of the panel transport of the second bonding device 15 and the second cutting device 16. The third bonding device 18 is disposed on the downstream side of the panel conveyance of the third calibration device 17. The third cutting device 19 is disposed adjacent to the third bonding device 18.
第一校準裝置11係可保持液晶面板P並自由地朝垂直方向及水平方向進行輸送。又，第一校準裝置11具有拍攝液晶面板P之面板輸送上游側及下游側之端部的一對攝影機C(參考第3圖)。攝影機C的攝影資料係傳送至控制裝置20。 The first calibration device 11 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. Further, the first calibration device 11 has a pair of cameras C that capture the end portions of the upstream and downstream sides of the panel transport of the liquid crystal panel P (refer to FIG. 3). The photographic data of the camera C is transmitted to the control device 20.
控制裝置20係根據該攝影資料與預先儲存之光軸方向的檢查資料，以啟動第一校準裝置11。不過，後述第二校準裝置14及第三校準裝置17亦同樣地具有攝影機C，並將該攝影機C之攝影資料用以進行校準。 The control device 20 activates the first calibration device 11 based on the photographic data and the inspection data in the optical axis direction stored in advance. However, the second calibration device 14 and the third calibration device 17 described later also have the camera C, and the photographic data of the camera C is used for calibration.
第一校準裝置11係受控制裝置20之控制，相對第一貼合裝置12進行液晶面板P的校準。此時，決定液晶面板P於垂直輸送方向之水平方向 (以下稱作部件寬度方向)上的位置，及繞垂直軸之迴轉方向(以下稱作迴轉方向)上的位置。在該狀態下，將液晶面板P引導至第一貼合裝置12之貼合位置。 The first calibration device 11 is controlled by the control device 20 to calibrate the liquid crystal panel P with respect to the first bonding device 12. At this time, the horizontal direction of the liquid crystal panel P in the vertical conveying direction is determined. The position on the rotation direction of the vertical axis (hereinafter referred to as the rotation direction) (hereinafter referred to as the member width direction). In this state, the liquid crystal panel P is guided to the bonding position of the first bonding apparatus 12.
第一貼合裝置12係針對被引導至貼合位置之長條狀第一光學組件層F1的上側面，將沿其上方輸送之液晶面板P的下側面(背光側)進行貼合。第一貼合裝置12係具備輸送裝置12a及夾壓滾筒12b。 The first bonding apparatus 12 is attached to the lower side surface (backlight side) of the liquid crystal panel P that is transported along the upper side of the long first optical component layer F1 that is guided to the bonding position. The first bonding apparatus 12 is provided with a conveying device 12a and a nip roller 12b.
輸送裝置12a係從捲繞有第一光學組件層F1之第一料捲滾筒R1將第一光學組件層F1捲出，並沿其長邊方向輸送第一光學組件層F1。夾壓滾筒12b係將滾筒輸送機5所輸送之液晶面板P的下側面貼合至輸送裝置12a所輸送之第一光學組件層F1的上側面。 The conveying device 12a winds up the first optical component layer F1 from the first roll drum R1 around which the first optical component layer F1 is wound, and conveys the first optical component layer F1 in the longitudinal direction thereof. The nip roller 12b bonds the lower side surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the upper side surface of the first optical component layer F1 conveyed by the conveyance device 12a.
輸送裝置12a係具備滾筒保持部12c及保護薄膜回收部12d。滾筒保持部12c係支撐著捲繞有第一光學組件層F1之第一料捲滾筒R1，並沿其長邊方向捲出第一光學組件層F1。保護薄膜回收部12d係將重疊於第一光學組件層F1下側面而與第一光學組件層F1一併捲出的保護薄膜pf，在第一貼合裝置12之面板輸送下游側進行回收。 The conveying device 12a includes a drum holding portion 12c and a protective film collecting portion 12d. The roller holding portion 12c supports the first roll drum R1 around which the first optical component layer F1 is wound, and winds up the first optical component layer F1 in the longitudinal direction thereof. The protective film collecting portion 12d collects the protective film pf which is superposed on the lower side surface of the first optical component layer F1 and is unwound with the first optical component layer F1, and is collected on the downstream side of the panel transport of the first bonding apparatus 12.
夾壓滾筒12b具有於軸線方向相互平行配置的一對貼合滾筒。一對貼合滾筒之間形成有指定間隙，該間隙內即為第一貼合裝置12的貼合位置。將液晶面板P及第一光學組件層F1重合導入該間隙內。該等液晶面板P及第一光學組件層F1係於該貼合滾筒之間受夾壓，並送往面板輸送下游側。藉此，便可形成將複數個液晶面板P相距特定間隔而連續貼合至長條狀第一光學組件層F1上側面的第一貼合層F21。 The nip roller 12b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the first bonding device 12. The liquid crystal panel P and the first optical component layer F1 are superposed into the gap. The liquid crystal panel P and the first optical component layer F1 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the first bonding layer F21 in which a plurality of liquid crystal panels P are continuously bonded to the upper surface of the elongated first optical component layer F1 at a predetermined interval can be formed.
一併參考第4圖以及第5圖進行說明。不過，第4圖以及第5 圖中，液晶面板P之紙面上方側係背光側，紙面下方側係顯示側。第一切斷裝置13係位於保護薄膜回收部12d的面板輸送下游側。第一切斷裝置13係於第一光學組件層F1之指定部位(沿輸送方向上並列的液晶面板P之間)處，沿該部件寬度方向將整個寬度切斷。藉此，第一切斷裝置13係切斷第一貼合層F21之第一光學組件層F1，而形成較顯示區域P4更大(本實施形態中較液晶面板P更大)的層片F1S。不過，第一切斷裝置13可使用切割刀片，亦可使用雷射切割機。透過該切斷步驟，形成於液晶面板P下側面貼合有較顯示區域P4更大之層片F1S的第一單面貼合面板P11。 The description will be made with reference to Fig. 4 and Fig. 5 together. However, Figure 4 and Figure 5 In the figure, the upper side of the paper surface of the liquid crystal panel P is the backlight side, and the lower side of the paper surface is the display side. The first cutting device 13 is located on the downstream side of the panel conveyance of the protective film collecting portion 12d. The first cutting device 13 is cut at a designated portion of the first optical component layer F1 (between the liquid crystal panels P juxtaposed in the transport direction), and the entire width is cut along the width direction of the member. Thereby, the first cutting device 13 cuts the first optical component layer F1 of the first bonding layer F21 to form a layer F1S larger than the display region P4 (more in the present embodiment than the liquid crystal panel P). . However, the first cutting device 13 may use a cutting blade or a laser cutting machine. Through the cutting step, the first single-sided bonding panel P11 having the layer F1S larger than the display region P4 is bonded to the lower surface of the liquid crystal panel P.
參考第1圖進行說明。第二校準裝置14係例如可夾持滾筒輸送機5上的第一單面貼合面板P11並繞垂直軸迴轉90°。藉此，與顯示區域P4之短邊略呈平行所輸送的第一單面貼合面板P11係轉換方向為與顯示區域P4之長邊略呈平行進行輸送。不過，前述迴轉步驟係當貼合至液晶面板P的其它光學組件層之光軸方向相對第一光學組件層F1之光軸方向配置呈直角的情況。 This will be described with reference to Fig. 1. The second calibration device 14 is, for example, capable of gripping the first single-sided conforming panel P11 on the roller conveyor 5 and rotating 90° about the vertical axis. Thereby, the first single-sided bonding panel P11 conveyed in a direction slightly parallel to the short side of the display region P4 is conveyed in a direction slightly parallel to the long side of the display region P4. However, the above-described turning step is a case where the optical axis direction of the other optical component layers bonded to the liquid crystal panel P is disposed at a right angle with respect to the optical axis direction of the first optical component layer F1.
第二校準裝置14係進行與該第一校準裝置11相同的校準。即，第二校準裝置14係根據儲存於控制裝置20之光軸方向檢查資料及該攝影機C的攝影資料，以決定相對第二貼合裝置15的第一單面貼合面板P11之部件寬度方向及迴轉方向的位置。在該狀態中，第一單面貼合面板P11被引導至第二貼合裝置15之貼合位置。 The second calibration device 14 performs the same calibration as the first calibration device 11. That is, the second calibration device 14 determines the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15 based on the inspection data stored in the optical axis direction of the control device 20 and the imaging data of the camera C. And the position of the direction of rotation. In this state, the first single-sided bonding panel P11 is guided to the bonding position of the second bonding apparatus 15.
第二貼合裝置15係針對被引導至貼合位置的長條狀之第二光學組件層F2上側面，將沿其上方輸送之第一單面貼合面板P11下側面(液晶面板P之背光側)進行貼合。第二貼合裝置15係具備輸送裝置15a及夾壓滾筒15b。 The second bonding device 15 is directed to the upper side of the elongated second optical component layer F2 that is guided to the bonding position, and the first single-sided bonding panel P11 is transported along the upper side thereof (the backlight of the liquid crystal panel P) Side) for fitting. The second bonding apparatus 15 is provided with a conveying device 15a and a nip roller 15b.
輸送裝置15a係從捲繞有第二光學組件層F2之第二料捲滾筒R2將第二光 學組件層F2捲出，並沿其長邊方向輸送第二光學組件層F2。夾壓滾筒15b係將滾筒輸送機5所輸送之第一單面貼合面板P11的下側面貼合至輸送裝置15a所輸送之第二光學組件層F2的上側面。 The conveying device 15a is to take the second light from the second roll drum R2 around which the second optical component layer F2 is wound. The component layer F2 is rolled out and transports the second optical component layer F2 along its longitudinal direction. The nip roller 15b bonds the lower side surface of the first single-sided bonding panel P11 conveyed by the roller conveyor 5 to the upper side surface of the second optical component layer F2 conveyed by the conveying device 15a.
輸送裝置15a係具備滾筒保持部15c及第二回收部15d。滾筒保持部15c係支撐著捲繞有第二光學組件層F2之第二料捲滾筒R2，並沿其長邊方向捲出第二光學組件層F2。第二回收部15d係將通過位於夾壓滾筒15b的面板輸送下游側之第二切斷裝置16後的第二光學組件層F2之剩餘部分回收。 The conveying device 15a includes a drum holding portion 15c and a second collecting portion 15d. The roller holding portion 15c supports the second roll drum R2 around which the second optical component layer F2 is wound, and winds up the second optical component layer F2 in the longitudinal direction thereof. The second recovery portion 15d collects the remaining portion of the second optical module layer F2 after passing through the second cutting device 16 on the downstream side of the panel of the nip roller 15b.
夾壓滾筒15b具有沿軸線方向相互平行配置的一對貼合滾筒。一對貼合滾筒之間形成有指定間隙，該間隙內即為第二貼合裝置15的貼合位置。將第一單面貼合面板P11及第二光學組件層F2重合導入該間隙內。該等第一單面貼合面板P11及第二光學組件層F2係於該貼合滾筒之間受夾壓，並送往面板輸送下游側。藉此，便可形成將複數個第一單面貼合面板P11相距特定間隔而連續貼合至長條狀第二光學組件層F2上側面的第二貼合層F22。 The nip roller 15b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the second bonding device 15. The first single-sided bonding panel P11 and the second optical component layer F2 are superposed and introduced into the gap. The first single-sided bonding panel P11 and the second optical component layer F2 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the second bonding layer F22 in which the plurality of first single-sided bonding panels P11 are continuously bonded to the upper surface of the long second optical component layer F2 at a predetermined interval can be formed.
一併參考第2圖以及第5圖進行說明。第二切斷裝置16係位於夾壓滾筒15b的面板輸送下游側。第二切斷裝置16係同時切斷第二光學組件層F2與貼合於其上側面的第一單面貼合面板P11之第一光學組件層F1之層片F1S。第二切斷裝置16例如為二氧化碳(CO2)雷射切割機。第二切斷裝置16係沿顯示區域P4之外周緣(本實施形態中沿液晶面板P之外周緣)不間斷地切斷第二光學組件層F2與第一光學組件層F1之層片F1S。將各光學組件層(第一光學組件層F1及第二光學組件層F2)貼合至液晶面板P後再一同進行切割，可提高各光學組件層(第一光學組件層F1及第二光學組件層F2)的光軸方向之精度。 又，可消除各光學組件層(第一光學組件層F1及第二光學組件層F2)間的光軸方向之偏差。而且，可簡化第一切斷裝置13中的切斷步驟。 The description will be made with reference to Fig. 2 and Fig. 5 together. The second cutting device 16 is located on the downstream side of the panel conveyance of the nip roller 15b. The second cutting device 16 simultaneously cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 of the first single-sided bonding panel P11 attached to the upper side thereof. The second cutting device 16 is, for example, a carbon dioxide (CO 2 ) laser cutting machine. The second cutting device 16 cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 without interruption along the outer periphery of the display region P4 (in the present embodiment, along the outer periphery of the liquid crystal panel P). After bonding each optical component layer (the first optical component layer F1 and the second optical component layer F2) to the liquid crystal panel P and then cutting together, the optical component layers (the first optical component layer F1 and the second optical component) can be improved. The accuracy of the optical axis direction of layer F2). Moreover, the deviation of the optical axis direction between each optical component layer (the first optical component layer F1 and the second optical component layer F2) can be eliminated. Moreover, the cutting step in the first cutting device 13 can be simplified.
透過第二切斷裝置16的切斷步驟，形成於液晶面板P之下側面重疊貼合有第一光學組件F11及第二光學組件F12的第二單面貼合面板P12(參考第7圖)。此時，使第二單面貼合面板P12能與切除顯示區域P4之對向部分(第一光學組件F11及第二光學組件F12)後殘餘呈框狀的各光學組件層(第一光學組件層F1及第二光學組件層F2)之剩餘部分相互分離。第二光學組件層F2之剩餘部分會成為複數相連的梯子狀。該剩餘部分係與第一光學組件層F1之剩餘部分共同捲取至第二回收部15d。 The second single-sided bonding panel P12 in which the first optical component F11 and the second optical component F12 are bonded to the lower surface of the liquid crystal panel P is formed by the cutting step of the second cutting device 16 (refer to FIG. 7). . At this time, each of the optical component layers (the first optical component) in which the second single-sided bonding panel P12 can be removed from the opposite portions (the first optical component F11 and the second optical component F12) of the display region P4 The remaining portions of the layer F1 and the second optical component layer F2) are separated from each other. The remaining portion of the second optical component layer F2 may be in the form of a plurality of ladders connected. The remaining portion is taken up to the second recovery portion 15d together with the remaining portion of the first optical component layer F1.
此處，該「與顯示區域P4之對向部分」係指，較顯示區域P4大並較液晶面板P外形小之區域，且為避開了電子部件安裝部等功能部分的區域。本實施形態中，於平面視圖為矩狀外形之液晶面板P中除了該功能部分之外的三個側邊處，沿液晶面板P之外周緣以雷射切斷剩餘部分，而相當於該功能部分的一側邊，則從液晶面板P之外周緣朝顯示區域P4側適當深入的位置處以雷射切斷剩餘部分。 Here, the "opposing portion with the display region P4" refers to a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as an electronic component mounting portion. In the present embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides except the functional portion, which is equivalent to the function. On one side of the portion, the remaining portion is cut by laser from a position outside the outer periphery of the liquid crystal panel P toward the display region P4 side.
參考第1圖進行說明。第三校準裝置17將液晶面板P顯示側朝向上側面的第二單面貼合面板P12進行正/反面反轉，使得液晶面板P之背光側朝向上側面。第三校準裝置17係進行該第一校準裝置11及第二校準裝置14相同的校準。即，第三校準裝置17係根據儲存於控制裝置20之光軸方向檢查資料及該攝影機C的攝影資料，決定相對於第三貼合裝置18的第二單面貼合面板P12之部件寬度方向及迴轉方向上的位置。在該狀態中，第二單面貼合面板P12被引導至第三貼合裝置18之貼合位置。 This will be described with reference to Fig. 1. The third calibration device 17 reverses the front/reverse side of the second single-sided bonding panel P12 on the display side of the liquid crystal panel P toward the upper side such that the backlight side of the liquid crystal panel P faces the upper side. The third calibration device 17 performs the same calibration of the first calibration device 11 and the second calibration device 14. That is, the third calibration device 17 determines the component width direction of the second single-sided bonding panel P12 with respect to the third bonding device 18 based on the optical axis direction inspection data stored in the control device 20 and the imaging data of the camera C. And the position in the direction of rotation. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18.
第三貼合裝置18係針對被引導至貼合位置的長條狀之第三光學組件層F3上側面，將沿其上方被輸送之第二單面貼合面板P12下側面(液晶面板P之顯示側)進行貼合。第三貼合裝置18係具備輸送裝置18a及夾壓滾筒18b。 The third bonding device 18 is for the upper side of the elongated third optical component layer F3 that is guided to the bonding position, and the second single-sided bonding panel P12 that is transported along the upper side thereof is attached to the lower side of the panel P12 (the liquid crystal panel P Display side) for bonding. The third bonding apparatus 18 is provided with a conveying device 18a and a nip roller 18b.
輸送裝置18a係從捲繞有第三光學組件層F3之第三料捲滾筒R3將第三光學組件層F3捲出，並沿其長邊方向輸送第三光學組件層F3。夾壓滾筒18b係將滾筒輸送機5所輸送之第二單面貼合面板P12的下側面貼合至輸送裝置18a所輸送之第三光學組件層F3的上側面。 The conveying device 18a winds up the third optical component layer F3 from the third roll drum R3 around which the third optical component layer F3 is wound, and conveys the third optical component layer F3 in the longitudinal direction thereof. The nip roller 18b bonds the lower side surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5 to the upper side surface of the third optical component layer F3 conveyed by the conveying device 18a.
輸送裝置18a係具備滾筒保持部18c及第三回收部18d。滾筒保持部18c係支撐著捲繞有第三光學組件層F3之第三料捲滾筒R3，並沿其長邊方向捲出第三光學組件層F3。第三回收部18d係將通過位於夾壓滾筒18b之面板輸送下游側之第三切斷裝置19後的第三光學組件層F3之剩餘部分回收。 The conveying device 18a includes a drum holding portion 18c and a third collecting portion 18d. The roller holding portion 18c supports the third roll drum R3 around which the third optical component layer F3 is wound, and winds up the third optical component layer F3 in the longitudinal direction thereof. The third recovery portion 18d collects the remaining portion of the third optical module layer F3 after passing through the third cutting device 19 on the downstream side of the panel conveyance roller 18b.
夾壓滾筒18b具有沿軸線方向相互平行配置的一對貼合滾筒。一對貼合滾筒之間形成有指定間隙，該間隙內即為第三貼合裝置18的貼合位置。將第二單面貼合面板P12及第三光學組件層F3重合導入該間隙內。該等第二單面貼合面板P12及第三光學組件層F3係於該貼合滾筒之間受夾壓，並送往面板輸送下游側。藉此，便可形成將複數個第二單面貼合面板P12相距特定間隔而連續貼合至長條狀第三光學組件層F3上側面的第三貼合層F23。 The nip roller 18b has a pair of bonding rollers arranged parallel to each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. The second single-sided bonding panel P12 and the third optical component layer F3 are superposed into the gap. The second single-sided bonding panel P12 and the third optical component layer F3 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the third bonding layer F23 in which the plurality of second single-sided bonding panels P12 are continuously bonded to the upper surface of the elongated third optical component layer F3 at a predetermined interval can be formed.
第三切斷裝置19係位於夾壓滾筒18b之面板輸送下游側，用以切斷第三光學組件層F3。第三切斷裝置19具有與第二切斷裝置16相同的雷射加工機，沿顯示區域P4之外周緣(例如，沿液晶面板P之外周緣)不間斷地切斷第三光學組件層F3。 The third cutting device 19 is located on the downstream side of the panel conveyance of the nip roller 18b for cutting the third optical component layer F3. The third cutting device 19 has the same laser processing machine as the second cutting device 16, and cuts the third optical component layer F3 continuously along the outer periphery of the display region P4 (for example, along the outer periphery of the liquid crystal panel P). .
藉由第三切斷裝置19的切斷步驟，形成於第二單面貼合面板P12之下側面貼合有第三光學組件F13的雙面貼合面板P13(參考第8圖)。此時，使雙面貼合面板P13能與切除顯示區域P4之對向部分(第三光學組件F13)後殘餘呈框狀的第三光學組件層F3之剩餘部分相互分離。與第二光學組件層F2之剩餘部分相同，第三光學組件層F3之剩餘部分會成為複數相連的梯子狀(參考第2圖)。該剩餘部分係捲取至第三回收部18d。 The double-sided bonding panel P13 in which the third optical component F13 is bonded to the lower surface of the second single-sided bonding panel P12 is formed by the cutting step of the third cutting device 19 (refer to FIG. 8). At this time, the double-sided bonding panel P13 can be separated from the remaining portion of the third optical component layer F3 which remains in a frame shape after the opposite portion (third optical component F13) of the cut-off display region P4. Like the rest of the second optical component layer F2, the remaining portion of the third optical component layer F3 may be in the form of a plurality of ladders (refer to Fig. 2). This remaining portion is taken up to the third recovery portion 18d.
雙面貼合面板P13通過圖中未顯示之缺陷檢查裝置，以檢查是否有缺陷(貼合不良等)後，輸送至下游步驟進行其它處理。 The double-sided bonding panel P13 passes through the defect inspection device not shown in the drawing to check whether there is a defect (poor bonding or the like), and then conveys it to the downstream step for other processing.
此處，一般長條狀光學薄膜(相當於第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)係將經二色性染料進行染色之樹脂薄膜朝一軸延伸般所製造，光學薄膜之光軸方向與樹脂薄膜之延伸方向概略一致。但是，關於光學薄膜之光軸，光學薄膜全體並非相同，於光學薄膜之寬度方向上略有差異。 Here, the general elongated optical film (corresponding to the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is a resin film which is dyed by a dichroic dye and which is extended toward one axis. In the manufacturing, the optical axis direction of the optical film is substantially the same as the extending direction of the resin film. However, regarding the optical axis of the optical film, the entire optical film is not the same, and there is a slight difference in the width direction of the optical film.
因此，欲沿其寬度方向將複數個光學顯示部件貼合至光學薄膜的情況中，較佳地應依據光學薄膜之光軸方向進行光學顯示部件的校準。 Therefore, in the case where a plurality of optical display members are to be bonded to the optical film in the width direction thereof, the alignment of the optical display member should preferably be performed in accordance with the optical axis direction of the optical film.
這對於抑制光學顯示設備單元之光軸偏差，改善色彩度及對比度是有效的。 This is effective for suppressing the optical axis deviation of the optical display device unit, improving the color and contrast.
作為偏光薄膜之光學薄膜為了遮斷沿一方向上振動之光線以外的光線，係以例如碘或二色性染料等進行染色。不過，光學薄膜處亦可進一步層積有剝離薄膜或保護薄膜。 The optical film as a polarizing film is dyed with, for example, iodine or a dichroic dye in order to block light other than the light that vibrates in one direction. However, a peeling film or a protective film may be further laminated on the optical film.
檢查光學薄膜之光軸方向的檢查裝置係具備光源及分析儀。光源係配置於光學薄膜之正/反面的一側。分析儀則配置於光學薄膜之正/反面的另一側。分析儀接收自光源照射並透射光學薄膜的光線，檢測出該光線 強度，藉以檢測出光學薄膜之光軸。分析儀例如可於光學薄膜之寬度方向上移動，可在光學薄膜之寬度方向的任意部位上檢查光軸。 The inspection device for inspecting the optical axis direction of the optical film is provided with a light source and an analyzer. The light source is disposed on one side of the front/back side of the optical film. The analyzer is placed on the other side of the front/back of the optical film. The analyzer receives the light that is irradiated from the light source and transmitted through the optical film to detect the light. The intensity by which the optical axis of the optical film is detected. The analyzer can be moved, for example, in the width direction of the optical film, and the optical axis can be inspected at any position in the width direction of the optical film.
本實施形態的情況中，該檢查裝置所獲得之各光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)之光軸方向檢查資料係與各光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)之長邊方向位置及寬度方向位置資料連結地儲存於控制裝置20之記憶體。該檢查之後，各自捲取各光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)，以形成各料捲滾筒(第一料捲滾筒R1、第二料捲滾筒R2及第三料捲滾筒R3)。以下，各光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)可統稱為光學組件層FX，貼合至各光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)的液晶面板P、第一單面貼合面板P11及第二單面貼合面板P12可統稱為光學顯示組件PX。 In the case of the present embodiment, the optical axis direction inspection data system and each optical component of each optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) obtained by the inspection apparatus The positions in the longitudinal direction and the width direction of the layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) are stored in the memory of the control device 20 in a data-separated manner. After the inspection, each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is taken up to form each of the roll rolls (the first roll roll R1, the second roll) Roller drum R2 and third roll drum R3). Hereinafter, each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) may be collectively referred to as an optical component layer FX, and is bonded to each optical component layer (first optical component layer F1) The liquid crystal panel P, the first single-sided bonding panel P11, and the second single-sided bonding panel P12 of the second optical component layer F2 and the third optical component layer F3) may be collectively referred to as an optical display component PX.
此處，構成光學組件層FX之偏光薄膜係例如經二色性染料進行染色之PVA薄膜，並朝一軸延伸所形成。由於偏光薄膜於延伸時會有PVA薄膜厚度之不均勻或二色性染料染色不均勻等問題，亦造成光學組件層FX之寬度方向內側與寬度方向外側之光軸方向相異的問題。 Here, the polarizing film constituting the optical component layer FX is formed, for example, by a PVA film dyed with a dichroic dye and extended toward one axis. The problem that the thickness of the PVA film is uneven or the dyeing of the dichroic dye is uneven during the stretching of the polarizing film causes a problem that the optical axis direction of the optical component layer FX in the width direction and the width direction are different.
該處，本實施形態中，根據預先儲存於控制裝置20之光學組件層FX各部位中的光軸面內分布檢查資料，進行貼合至該處的光學顯示部件PX之校準。接著，將光學顯示部件PX貼合至光學組件層FX。 In this embodiment, the inspection data is distributed in accordance with the optical axis plane stored in each of the optical component layers FX of the control device 20, and the optical display member PX bonded thereto is calibrated. Next, the optical display member PX is bonded to the optical component layer FX.
具體而言，於光學組件層FX中貼合光學顯示部件PX的部位之面內，例如找出相對於指定之基準軸(長邊方向軸等)，角度最大之光軸與最小之光軸。接著，將該各光軸所產生的角度兩等分後的軸作為該部位之平均光軸 以該軸為基準進行光學顯示部件PX的校準。 Specifically, in the plane of the portion where the optical display member PX is bonded to the optical component layer FX, for example, the optical axis having the largest angle and the smallest optical axis with respect to the designated reference axis (longitudinal axis, etc.) are found. Then, the axis obtained by halving the angle generated by each optical axis is taken as the average optical axis of the portion The alignment of the optical display unit PX is performed based on the axis.
藉此，即使是在光學組件層FX之寬度方向上相異位置處貼合光學顯示部件PX的情況，可抑制相對光學顯示部件PX基準位置的光學組件層FX之光軸方向偏差。又，光軸公差幾乎為0°(容許公差為±0.25°)。 Thereby, even when the optical display member PX is bonded to the position different from the width direction of the optical component layer FX, the optical axis direction deviation of the optical component layer FX with respect to the reference position of the optical display component PX can be suppressed. Also, the optical axis tolerance is almost 0° (allowable tolerance is ±0.25°).
不過，亦可於捲出光學組件層FX的同時檢測光軸方向，再根據該檢測資料進行光學顯示部件PX的校準。又，前述各種校準方式不限於光學組件層FX之光軸方向為0°及90°的情況，亦可適用於任意角度的情況。 However, the optical axis direction can also be detected while the optical component layer FX is being unwound, and the optical display component PX can be calibrated based on the detected data. Further, the above various calibration methods are not limited to the case where the optical axis direction of the optical component layer FX is 0° and 90°, and may be applied to any angle.
第3圖係顯示於相對較寬的光學組件層FX之寬度方向上並列貼合有三個光學顯示部件PX的範例。但是，並不限於此，亦可於光學組件層FX之寬度方向上並列貼合有二個以下或四個以上的光學顯示部件PX。又，亦可於寬度方向上排列複數個相對較窄的光學組件層FX，並各自貼合光學顯示部件PX。 Fig. 3 is a view showing an example in which three optical display members PX are juxtaposed in the width direction of the relatively wide optical component layer FX. However, the present invention is not limited thereto, and two or less or four or more optical display members PX may be laminated in parallel in the width direction of the optical module layer FX. Further, a plurality of relatively narrow optical component layers FX may be arranged in the width direction, and each of the optical display members PX may be attached.
參考第4圖進行說明。液晶面板P係具備第一基板P1、第二基板P2及液晶層P3。 This will be explained with reference to Fig. 4. The liquid crystal panel P includes a first substrate P1, a second substrate P2, and a liquid crystal layer P3.
第一基板P1係例如TFT基板所構成的長方形基板。第二基板P2係對向第一基板P1配置的長方形基板。液晶層P3係封入於第一基板P1與第二基板P2之間。不過，為了圖示方便起見，省略剖面圖中的各層剖面線。 The first substrate P1 is a rectangular substrate made of, for example, a TFT substrate. The second substrate P2 is a rectangular substrate that is disposed on the first substrate P1. The liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. However, for convenience of illustration, the cross-sectional lines of the respective layers in the cross-sectional view are omitted.
參考第6圖以及第7圖進行說明。第一基板P1外周緣之三側邊係沿著第二基板P2相對應之三側邊配置，外周緣剩餘之一側邊則延伸至第二基板P2相對應之一側邊的外側。藉此，於第一基板P1之一側邊處設置有延伸至第二基板P2外側的電子部件安裝部P5。 Description will be made with reference to Fig. 6 and Fig. 7. The three sides of the outer periphery of the first substrate P1 are disposed along three sides corresponding to the second substrate P2, and one of the remaining sides of the outer periphery extends to the outer side of one side of the second substrate P2. Thereby, an electronic component mounting portion P5 that extends to the outside of the second substrate P2 is provided at one side of the first substrate P1.
參考第5圖以及第7圖進行說明。第二切斷裝置16以攝影機16a 等檢測工具來檢測顯示區域P4之外周緣，並沿顯示區域P4之外周緣等切斷第一光學組件層F1及第二光學組件層F2。又，第三切斷裝置19以攝影機19a等檢測工具來檢測顯示區域P4之外周緣，並沿顯示區域P4之外周緣等切斷第三光學組件層F3。顯示區域P4之外側處係設置有將第一基板P1及第二基板P2接合之密封劑等設置用特定寬度之邊框部G。於該邊框部G之寬度內以第二切斷裝置16及第三切斷裝置19進行雷射切割。 Description will be made with reference to Fig. 5 and Fig. 7. The second cutting device 16 is a camera 16a The detecting means detects the outer periphery of the display region P4, and cuts the first optical component layer F1 and the second optical component layer F2 along the outer periphery of the display region P4 or the like. Further, the third cutting device 19 detects the outer periphery of the display region P4 by a detecting tool such as the camera 19a, and cuts the third optical component layer F3 along the outer periphery of the display region P4 or the like. A frame portion G having a specific width for providing a sealant or the like for joining the first substrate P1 and the second substrate P2 is provided on the outer side of the display region P4. The laser cutting is performed by the second cutting device 16 and the third cutting device 19 within the width of the frame portion G.
如第10圖所示，單獨對樹脂製的光學組件層FX進行雷射切割時，其切斷端t可能因熱變形而膨脹或呈波浪形。因此，將雷射切割後之光學組件層FX貼合至光學顯示部件PX的情況，光學組件層FX處易產生空氣混入或變形等貼合不良問題。 As shown in Fig. 10, when the optical component layer FX made of resin is subjected to laser cutting alone, the cut end t may be expanded or wavy due to thermal deformation. Therefore, in the case where the laser-cut optical component layer FX is bonded to the optical display member PX, the optical component layer FX is liable to cause a problem of poor adhesion such as air incorporation or deformation.
另一方面，本實施形態中，如第9圖所示，於液晶面板P貼合好光學組件層FX之後，以雷射切斷光學組件層FX。本實施形態中，光學組件層FX之切斷端t會受到液晶面板P之玻璃表面支撐。因此，光學組件層FX之切斷端t不會產生膨脹或波浪形，且於液晶面板P之貼合後進行故不會有前述貼合不良。 On the other hand, in the present embodiment, as shown in FIG. 9, after the optical component layer FX is bonded to the liquid crystal panel P, the optical component layer FX is cut by laser. In the present embodiment, the cut end t of the optical component layer FX is supported by the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical component layer FX does not swell or wavy, and after the liquid crystal panel P is bonded, the bonding failure does not occur.
雷射加工機之切割線的振動幅度(公差)係較切割刀片之公差更小。因此本實施形態中，與使用切割刀片切斷光學組件層FX的情況相比，可使得該邊框部G的寬度更窄。又，可達到液晶面板P之小型化及(或)顯示區域P4之大型化。這可應用於近年來之智慧型手機或平板電腦終端等，需要在機殼尺寸之限制下將顯示畫面放大的高機能行動裝置。 The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in the present embodiment, the width of the frame portion G can be made narrower than in the case where the optical module layer FX is cut by the dicing blade. Moreover, the miniaturization of the liquid crystal panel P and/or the enlargement of the display area P4 can be achieved. This can be applied to a high-performance mobile device that needs to enlarge a display screen under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.
又，對將光學組件層FX整合於液晶面板P之顯示區域P4的層片進行切割之後，貼合至液晶面板P的情況中，該層片及液晶面板P各自的尺 寸公差，以及該等之相對貼合位置的尺寸公差會疊加。因此，難以縮小液晶面板P之邊框部G的寬度。換言之，難以使得顯示區域擴大。 Further, in the case where the optical component layer FX is integrated into the display region P4 of the liquid crystal panel P and then cut into the liquid crystal panel P, the respective layers of the laminate and the liquid crystal panel P are used. Inch tolerances, as well as dimensional tolerances for these relative fit positions, are superimposed. Therefore, it is difficult to reduce the width of the frame portion G of the liquid crystal panel P. In other words, it is difficult to enlarge the display area.
另一方面，將光學組件層FX貼合至液晶面板P之後，依據顯示區域P4進行切割的情況中，只需考慮切割線的振動公差。因此，可降低邊框部G之寬度的公差(±0.1mm以下)。此特點亦可使得液晶面板P之邊框部G的寬度變窄(可使得顯示區域擴大)。 On the other hand, in the case where the optical component layer FX is bonded to the liquid crystal panel P and the cutting is performed in accordance with the display region P4, only the vibration tolerance of the cutting line is considered. Therefore, the tolerance (±0.1 mm or less) of the width of the frame portion G can be reduced. This feature also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).
再者，以非利刃的雷射來切斷光學組件層FX，切斷時不會有作用力施加至液晶面板P，因此液晶面板P之基板端緣部不易產生裂痕或破裂，提升對於熱循環等的耐久性。同樣地，由於不接觸液晶面板P，對於電子部件安裝部P5的損傷亦較少。 In addition, the optical component layer FX is cut by a non-profit laser, and no force is applied to the liquid crystal panel P during the cutting, so that the edge of the substrate of the liquid crystal panel P is less likely to be cracked or broken, and the thermal cycle is improved. Durability. Similarly, since the liquid crystal panel P is not touched, damage to the electronic component mounting portion P5 is also small.
不過，以雷射切斷光學組件層FX的情況，雷射照射之每單位長度的能量較佳地需考慮液晶面板P或光學組件層FX的厚度結構來決定。 However, in the case where the optical component layer FX is cut by laser, the energy per unit length of the laser irradiation is preferably determined in consideration of the thickness structure of the liquid crystal panel P or the optical component layer FX.
本實施形態中，以雷射切斷光學組件層FX的情況，每單位長度的能量較佳地在0.01~0.11(J/mm)的範圍內進行雷射照射。於雷射照射中，每單位長度的能量過大時，以雷射切斷光學組件層FX的情況，光學組件層FX將有受到損傷之虞。但是，因為每單位長度的能量在0.01~0.11(J/mm)的範圍內進行雷射照射，可防止光學組件層FX受到損傷。 In the present embodiment, in the case where the optical component layer FX is cut by laser, the energy per unit length is preferably laser-irradiated in the range of 0.01 to 0.11 (J/mm). In the case of laser irradiation, when the energy per unit length is excessively large, the optical component layer FX is damaged by the laser, and the optical component layer FX is damaged. However, since the energy per unit length is laser-irradiated in the range of 0.01 to 0.11 (J/mm), the optical component layer FX can be prevented from being damaged.
如第6圖所示，以雷射切斷光學組件層FX(第6圖中之第三光學組件層F3)的情況，例如將顯示區域P4之一長邊的延長上設定為雷射切割的起點pt1。接著，從該起點pt1先開始進行該一長邊的切斷動作。雷射切割之終點pt2係設計於雷射環繞顯示區域P4一圈後，到達顯示區域P4之起點側短邊的延長上之位置。起點pt1及終點pt2係設計使得光學組件層FX之剩餘部分仍會 剩餘特定接續部分，而能承受捲取光學組件層FX時的張力。 As shown in FIG. 6, when the optical component layer FX (the third optical component layer F3 in FIG. 6) is cut by laser, for example, the extension of one of the long sides of the display region P4 is set to laser cutting. Starting point pt1. Next, the cutting operation of the long side is started from the starting point pt1. The end point pt2 of the laser cutting is designed to reach the position on the extension of the short side of the starting side of the display area P4 after the laser surrounds the display area P4 one turn. The starting point pt1 and the end point pt2 are designed so that the rest of the optical component layer FX will still The remaining joint portion remains, and can withstand the tension when the optical component layer FX is taken up.
如以上說明，上述實施形態中光學組件貼合體之製造系統，於將光學組件(第一光學組件F11及第二光學組件F12)貼合至液晶面板P的第二單面貼合面板P12之製造系統中，係具備：貼合裝置(第一貼合裝置12及第二貼合裝置15)，係將較該液晶面板P之顯示區域P4更大的光學組件層(第一光學組件層F1及第二光學組件層F2)貼合至液晶面板P(光學顯示部件)之一側之面；以及第二切斷裝置16，係將貼合裝置(第一貼合裝置12及第二貼合裝置15)貼合好之光學組件層(第一光學組件層F1及第二光學組件層F2)區域中對向該液晶面板P之顯示區域P4的第一區域、與該光學組件層(第一光學組件層F1及第二光學組件層F2)之第一區域外側區域的第二區域切斷。 As described above, in the manufacturing system of the optical component bonding body in the above embodiment, the manufacturing of the second single-sided bonding panel P12 in which the optical component (the first optical component F11 and the second optical component F12) is bonded to the liquid crystal panel P is manufactured. The system includes: a bonding device (the first bonding device 12 and the second bonding device 15), which is an optical component layer (the first optical component layer F1 and the display region P4 of the liquid crystal panel P) The second optical component layer F2) is bonded to the surface of one side of the liquid crystal panel P (optical display member); and the second cutting device 16 is a bonding device (the first bonding device 12 and the second bonding device) 15) a first region facing the display region P4 of the liquid crystal panel P in the region of the bonded optical component layer (the first optical component layer F1 and the second optical component layer F2), and the optical component layer (first optical The second region of the outer region of the first region of the component layer F1 and the second optical component layer F2) is cut.
同樣地，上述實施形態中光學組件貼合體之製造系統，於將第三光學組件F13貼合至第二單面貼合面板P12的雙面貼合面板P13之製造系統中，係具備：第三貼合裝置18，係將較該液晶面板P之顯示區域P4更大的第三光學組件層F3貼合至該第二單面貼合面板P12之光學組件(第一光學組件F11及第二光學組件F12)的相反側之面，來作為第三貼合層F23；及第三切斷裝置19，係將該第三光學組件層F3之顯示區域P4的對向部分，與其外側之剩餘部分切斷，從該第三光學組件層F3切割出對應於該顯示區域P4大小的第三光學組件F13，藉以從該第三貼合層F23切割出包含單一個該液晶面板P及與其重疊之光學組件F13的雙面貼合面板P13。 Similarly, in the manufacturing system of the optical component bonding body in the above-described embodiment, in the manufacturing system of the double-sided bonding panel P13 in which the third optical component F13 is bonded to the second single-sided bonding panel P12, the third manufacturing system includes: The bonding device 18 is configured to attach a third optical component layer F3 larger than the display area P4 of the liquid crystal panel P to the optical component of the second single-sided bonding panel P12 (the first optical component F11 and the second optical component) The opposite side of the module F12) is referred to as a third bonding layer F23; and the third cutting device 19 is formed by cutting the opposite portion of the display region P4 of the third optical component layer F3 with the remaining portion thereof Breaking, the third optical component F13 corresponding to the size of the display area P4 is cut out from the third optical component layer F3, thereby cutting out a single optical component panel P and overlapping optical components thereof from the third bonding layer F23. F13 double-sided fitting panel P13.
本實施形態中，如上所述，該第三切斷裝置19可以雷射切斷該光學組件層(第一光學組件層F1及第二光學組件層F2)。 In the present embodiment, as described above, the third cutting device 19 can laser-cut the optical component layer (the first optical component layer F1 and the second optical component layer F2).
又，本實施形態中，如上所述，該第三切斷裝置19可使用二氧化碳(CO2) 雷射切割機以雷射切斷該第一光學組件層。 Further, in the present embodiment, as described above, the third cutting device 19 may use carbon dioxide (CO 2) laser cutting machine to cut off the laser of the first optical component layer.
又，本實施形態中，如上所述，該第三切斷裝置19可從該光學組件層(第一光學組件層F1及第二光學組件層F2)切割出對應於該顯示區域P4大小的光學組件層(第一光學組件層F1及第二光學組件層F2)，藉以切割出包含該液晶面板P及該光學組件層(第一光學組件層F1及第二光學組件層F2)的第二貼合層F22(光學組件貼合體)。 Further, in the present embodiment, as described above, the third cutting device 19 can cut the optical size corresponding to the display region P4 from the optical component layer (the first optical component layer F1 and the second optical component layer F2). a component layer (a first optical component layer F1 and a second optical component layer F2) for cutting a second sticker including the liquid crystal panel P and the optical component layer (the first optical component layer F1 and the second optical component layer F2) Laminated layer F22 (optical component bonding body).
又，本實施形態中，如上所述，該貼合裝置(第一貼合裝置12及第二貼合裝置15)可以較該顯示區域大且較該液晶面板P外形小的區域來作為該第一區域。 Further, in the present embodiment, as described above, the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) may be larger than the display area and smaller than the outer shape of the liquid crystal panel P. An area.
又，本實施形態中，如上所述，該貼合裝置(第一貼合裝置12及第二貼合裝置15)可將該光學組件層(第一光學組件層F1及第二光學組件層F2)之下側面與該液晶面板P之上側面接合。 Further, in the present embodiment, as described above, the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) can apply the optical component layer (the first optical component layer F1 and the second optical component layer F2) The lower side is joined to the upper side of the liquid crystal panel P.
又，本實施形態中，如上所述，可更具備拍攝該液晶面板P，以檢測出該液晶面板P之顯示區域P4外周緣的攝影機C(攝影裝置)。 Further, in the present embodiment, as described above, the camera C (photographing device) that images the liquid crystal panel P to detect the outer periphery of the display region P4 of the liquid crystal panel P can be further provided.
又，本實施形態中，如上所述，該第三切斷裝置19可沿著該攝影機C所檢測出之液晶面板P的顯示區域P4外周緣將該光學組件層(第一光學組件層F1及第二光學組件層F2)切斷。 Further, in the present embodiment, as described above, the third cutting device 19 can separate the optical component layer (the first optical component layer F1 and the outer peripheral edge of the display region P4 of the liquid crystal panel P detected by the camera C. The second optical component layer F2) is cut.
又，本實施形態中，如上所述，可更具備將該液晶面板P以該貼合裝置(第一貼合裝置12及第二貼合裝置15)及該第三切斷裝置19之順序輸送的滾筒輸送機5(第一輸送裝置)。 Further, in the present embodiment, as described above, the liquid crystal panel P may be further conveyed in the order of the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) and the third cutting apparatus 19. Roller conveyor 5 (first conveyor).
又，本實施形態中，如上所述，可更具備將該光學組件層(第一光學組件層F1及第二光學組件層F2)輸送至該貼合裝置(第一貼合裝置12及第二貼合裝置15)的輸送裝置12a(第二輸送裝置)。 Further, in the present embodiment, as described above, the optical component layer (the first optical component layer F1 and the second optical component layer F2) may be further transported to the bonding apparatus (the first bonding apparatus 12 and the second The conveying device 12a (second conveying device) of the bonding device 15).
又，本實施形態中，如上所述，該輸送裝置12a可具備將該第三切斷裝置19所切斷之光學組件層(第一光學組件層F1及第二光學組件層F2)之第二區域回收的第二回收部15d(回收部)。 Further, in the present embodiment, as described above, the transport device 12a may include the second optical component layer (the first optical component layer F1 and the second optical component layer F2) that is cut by the third cutting device 19. The second recovery unit 15d (recycling unit) that is recovered in the area.
又，本實施形態中，如上所述，可更具備將較該液晶面板P之顯示區域更大的光學組件層(第三光學組件層F3)貼合至液晶面板P之另一側面的貼合裝置(第二貼合裝置18)。 Further, in the present embodiment, as described above, it is possible to further provide bonding of the optical component layer (third optical component layer F3) larger than the display region of the liquid crystal panel P to the other side surface of the liquid crystal panel P. Device (second bonding device 18).
又，本實施形態中，如上所述，該第三切斷裝置19可於切斷該第一區域與該第二區域的同時，將第二貼合裝置18貼合好之第三光學組件層F3區域中對向該液晶面板P之顯示區域P4的第三區域、與該第三光學組件層F3之第三區域外側區域的第四區域切斷。 Further, in the present embodiment, as described above, the third cutting device 19 can bond the second bonding device 18 to the third optical component layer while cutting the first region and the second region. In the F3 region, the third region facing the display region P4 of the liquid crystal panel P and the fourth region of the third region outside the third optical component layer F3 are cut off.
於該結構中，將較顯示區域P4更大的光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)貼合至液晶面板P之後，將光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)之剩餘部分切斷。藉此，可在液晶面板P的表面上形成對應於顯示區域P4尺寸的光學部件(第一光學組件F11、第二光學組件F12及第三光學組件F13)。藉此，可讓光學組件(第一光學組件F11、第二光學組件F12及第三光學組件F13)在顯示區域P4時提供較佳的精度，可使得顯示區域P4外側邊框部G變窄，以達成顯示區域之擴大及機器之小型化的目的。 In this configuration, after the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) larger than the display region P4 are attached to the liquid crystal panel P, the optical component layer is bonded. The remaining portions (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) are cut. Thereby, optical members (the first optical component F11, the second optical component F12, and the third optical component F13) corresponding to the size of the display region P4 can be formed on the surface of the liquid crystal panel P. Thereby, the optical components (the first optical component F11, the second optical component F12, and the third optical component F13) can be provided with better precision in the display area P4, and the outer frame portion G of the display region P4 can be narrowed to Achieve the expansion of the display area and the miniaturization of the machine.
又，將液晶面板P貼合至較顯示區域P4更大的光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)。因此，即使是對應光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)之位置改變之光軸方向的情況，可依據該光軸方向校準液晶面板P並進行貼合。藉此，可提 升相對於液晶面板P的光學組件(第一光學組件F11、第二光學組件F12及第三光學組件F13)之光軸方向的精度，可改善光學顯示設備的色彩度及對比度。 Further, the liquid crystal panel P is bonded to the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) which is larger than the display region P4. Therefore, even in the case of the optical axis direction corresponding to the position change of the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3), the liquid crystal panel P can be calibrated according to the optical axis direction. And fit it together. With this, you can mention The accuracy of the optical axis direction of the optical components (the first optical component F11, the second optical component F12, and the third optical component F13) of the liquid crystal panel P can be improved to improve the color and contrast of the optical display device.
又，上述光學組件貼合體之製造裝置係使用該第二切斷裝置16及該第三切斷裝置19以雷射切斷該光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)。因此，與使用利刃切斷光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)的情況相比，不施加作用力至液晶面板P，不易產生裂痕或破裂，可使得液晶面板P獲得穩定的耐久性。又，與單獨以雷射切斷貼合前之光學組件層(第一光學組件層F1、第二光學組件層F2及第三光學組件層F3)的情況相比，可防止貼合不佳的情況發生。 Further, the optical component bonding body manufacturing apparatus uses the second cutting device 16 and the third cutting device 19 to cut the optical component layer by laser (first optical component layer F1, second optical component layer F2) And a third optical component layer F3). Therefore, compared with the case where the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is cut by the sharp edge, no force is applied to the liquid crystal panel P, and cracks or cracks are less likely to occur. The cracking allows the liquid crystal panel P to obtain stable durability. Moreover, compared with the case where the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) before the bonding is separately cut by the laser, the poor bonding can be prevented. The situation happened.
此處，上述實施形態中光學組件貼合體之製造方法，係將較該液晶面板P之顯示區域P4更大的光學組件層(第一光學組件層F1及第二光學組件層F2)貼合至該液晶面板P(光學顯示部件)之一側之面，將貼合好之光學組件層(第一光學組件層F1及第二光學組件層F2)區域中對向該液晶面板P之顯示區域P4的第一區域、與該光學組件層(第一光學組件層F1及第二光學組件層F2)之第一區域外側區域的第二區域切斷。 Here, in the manufacturing method of the optical component bonding body in the above embodiment, the optical component layer (the first optical component layer F1 and the second optical component layer F2) which is larger than the display region P4 of the liquid crystal panel P is bonded to One side of the liquid crystal panel P (optical display member) faces the display region P4 of the liquid crystal panel P in the region of the bonded optical component layer (the first optical component layer F1 and the second optical component layer F2) The first region is cut off from the second region of the outer region of the first region of the optical component layer (the first optical component layer F1 and the second optical component layer F2).
同樣地，上述實施形態中光學組件貼合體之製造方法，係包含：將較該第二單面貼合面板P12之顯示區域P4更大的第三光學組件層F3貼合至該第二單面貼合面板P12之光學組件(第一光學組件F11及第二光學組件F12)的相反側之面，來作為第三貼合層F23之步驟；將該第三光學組件層F3之顯示區域P4的對向部分，與其外側之剩餘部分切斷，從該第三光學組件層F3切割對應於該顯示區域P4大小的第三光學組件F13，藉以從該第三貼合層F23切割出包含單一個該液晶面板P及與其重疊之第三光學組件F13的雙面貼合面板P13。 Similarly, in the manufacturing method of the optical component bonding body of the above embodiment, the third optical component layer F3 larger than the display region P4 of the second single-sided bonding panel P12 is bonded to the second single-sided surface. a step of bonding the opposite side of the optical component (the first optical component F11 and the second optical component F12) of the panel P12 as a third bonding layer F23; and displaying the display area P4 of the third optical component layer F3 The opposing portion is cut off from the remaining portion of the outer portion thereof, and the third optical component F13 corresponding to the size of the display region P4 is cut from the third optical component layer F3, thereby cutting out the single bonding layer F23 to include a single one. The liquid crystal panel P and the double-sided bonding panel P13 of the third optical component F13 overlapping therewith.
不過，第11圖係顯示薄膜貼合系統1的變形例。這相較於第1圖的結構，具備有以第一貼合裝置12’代替該第一貼合裝置12，和以第一切斷裝置13’代替該第一切斷裝置13的相異點。其它部分，與前述實施形態相同結構者則賦予相同元件符號並省略詳細說明。 However, Fig. 11 shows a modification of the film bonding system 1. Compared with the structure of FIG. 1, this is different from the first bonding device 12', and the first cutting device 13' is replaced by the first cutting device 13'. . In the other portions, the same components as those in the above-described embodiments are denoted by the same reference numerals, and their detailed description is omitted.
第一貼合裝置12’係具備代替該輸送裝置12a的輸送裝置12a’。輸送裝置12a’與該輸送裝置12a相比，除了滾筒保持部12c及保護薄膜回收部12d之外，更具有第一回收部12e。第一回收部12e係捲取通過第一切斷裝置13’而被切割殘餘呈梯子狀的第一光學組件層F1之剩餘部分。 The first bonding device 12' is provided with a conveying device 12a' in place of the conveying device 12a. The conveying device 12a' has a first collecting portion 12e in addition to the roller holding portion 12c and the protective film collecting portion 12d as compared with the conveying device 12a. The first collecting portion 12e winds up the remaining portion of the first optical component layer F1 which is cut by the first cutting device 13' and which is cut into a ladder shape.
第一切斷裝置13’係位於保護薄膜回收部12d之面板輸送下游側，和第一回收部12e之面板輸送上游側。第一切斷裝置13’應從第一光學組件層F1切割出較顯示區域P4更大的層片，以切斷第一光學組件層F1。第一切斷裝置13’具有與該第二切斷裝置16及第三切斷裝置19相同的雷射加工機。第一切斷裝置13’係沿顯示區域P4外側之指定邊線不間斷地切斷第一光學組件層F1。 The first cutting device 13' is located on the downstream side of the panel conveyance of the protective film collecting portion 12d, and on the upstream side of the panel conveying of the first collecting portion 12e. The first cutting device 13' should cut a larger layer from the first optical component layer F1 than the display region P4 to cut the first optical component layer F1. The first cutting device 13' has the same laser processing machine as the second cutting device 16 and the third cutting device 19. The first cutting device 13' cuts the first optical component layer F1 uninterrupted along a predetermined side line outside the display region P4.
透過第一切斷裝置13’的切斷步驟，形成於液晶面板P之下側面將較顯示區域P4更大的第一光學組件層F1之層片貼合好的第一單面貼合面板P11’。此時，第一單面貼合面板P11’與切割後殘餘呈梯子狀的第一光學組件層F1之剩餘部分分離，第一光學組件層F1之剩餘部分被捲取至第一回收部12e。 The first single-sided bonding panel P11 of the first optical component layer F1 which is formed on the lower side of the liquid crystal panel P and which is larger than the display region P4 is formed by the cutting step of the first cutting device 13'. '. At this time, the first single-sided bonding panel P11' is separated from the remaining portion of the first optical component layer F1 which is left in a ladder shape after cutting, and the remaining portion of the first optical component layer F1 is taken up to the first recovery portion 12e.
第12圖係顯示薄膜貼合系統1的其它變形例。這相較於第1圖的結構，具備有以第三校準裝置17’及第三貼合裝置18’代替該第三校準裝置17及第三貼合裝置18的相異點。其它部分，與前述實施形態相同結構者則賦予相同元件符號並省略詳細說明。 Fig. 12 shows another modification of the film bonding system 1. This is in contrast to the configuration of Fig. 1 in that the third calibration device 17' and the third bonding device 18' are provided instead of the third calibration device 17 and the third bonding device 18. In the other portions, the same components as those in the above-described embodiments are denoted by the same reference numerals, and their detailed description is omitted.
第三校準裝置17’與該第三校準裝置17相比，為較簡單的結構，沒有面板正/反面反轉功能，僅具有與該第一校準裝置11及第二校準裝置14相同的校準功能。即，第三校準裝置17’係根據儲存於控制裝置20的光軸方向檢查資料及該攝影機C之攝影資料，決定相對於第三貼合裝置18’的第二單面貼合面板P12之部件寬度方向及迴轉方向上的位置。於此狀態中，將第二單面貼合面板P12引導至第三貼合裝置18’之貼合位置。 Compared with the third calibration device 17, the third calibration device 17' has a simpler structure, has no panel forward/reverse inversion function, and has only the same calibration function as the first calibration device 11 and the second calibration device 14. . That is, the third calibration device 17' determines the components of the second single-sided bonding panel P12 with respect to the third bonding device 18' based on the optical axis direction inspection data stored in the control device 20 and the photographic data of the camera C. Position in the width direction and the direction of rotation. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18'.
第三貼合裝置18’與該第三貼合裝置18相比，係針對被引導至貼合位置的長條狀第三光學組件層F3下側面，將沿其下方輸送之第二單面貼合面板P12上側面(液晶面板P之顯示側)進行貼合。第三貼合裝置18’係具有將該輸送裝置18a及夾壓滾筒18b上下顛倒的結構。藉此，第三光學組件層F3之貼合面變成朝下貼合，可抑制對該貼合面的刮痕或灰塵等異物之附著。 Compared with the third bonding device 18, the third bonding device 18' is a second single-sided sticker that is conveyed along the lower side of the elongated third optical component layer F3 that is guided to the bonding position. The upper side of the panel P12 (the display side of the liquid crystal panel P) is bonded. The third bonding device 18' has a structure in which the conveying device 18a and the nip roller 18b are turned upside down. Thereby, the bonding surface of the third optical component layer F3 is bonded downward, and adhesion of foreign matter such as scratches or dust on the bonding surface can be suppressed.
不過，本發明不限於上述實施形態及變形例，例如與該第三貼合裝置18’相同般，第一貼合裝置12及第二貼合裝置15亦可上下顛倒。又，亦可將該等上下顛倒之各貼合裝置與該第一貼合裝置12’及第一切斷裝置13’進行適當組合。 However, the present invention is not limited to the above-described embodiments and modifications. For example, like the third bonding device 18', the first bonding device 12 and the second bonding device 15 may be turned upside down. Further, each of the above-described bonding devices that are upside down may be appropriately combined with the first bonding device 12' and the first cutting device 13'.
又，除了將光學顯示部件貼合至從料捲滾筒捲出之光學組件層的結構之外，亦可為將複數個光學顯示部件適當地貼合至大尺寸光學組件層的結構。 Further, in addition to the structure in which the optical display member is bonded to the optical component layer which is wound out from the take-up reel, a structure in which a plurality of optical display members are appropriately bonded to the large-sized optical component layer may be employed.
接著，上述實施形態及變形例中之結構僅為本發明之一例，於不偏離該發明之要旨的範圍內各種變化皆為可能。 The configurations of the above-described embodiments and modifications are merely examples of the invention, and various changes are possible without departing from the scope of the invention.
上述控制裝置20係於內部具有電腦系統。接著，上述各裝置之動作係以程式的形式儲存於電腦可讀取的記錄媒體，以電腦執行讀出的程式，以進行上述處理。此處，電腦可讀取的記錄媒體係指磁碟、磁光碟、CD-ROM DVD-ROM、半導體記憶體等。又，亦可藉由通訊線路將該電腦程式傳送至電腦，由接受到該傳送資料的電腦執行該程式。 The control device 20 described above has a computer system inside. Next, the operation of each of the above devices is stored in a computer-readable recording medium in the form of a program, and the read program is executed by the computer to perform the above processing. Here, the computer readable recording medium refers to a magnetic disk, a magneto-optical disk, a CD-ROM. DVD-ROM, semiconductor memory, etc. Alternatively, the computer program can be transmitted to the computer via the communication line, and the program can be executed by the computer that receives the data.
又，上述程式，亦可為用以實現前述一部分功能者。 Moreover, the above program may be used to implement some of the aforementioned functions.
再者，亦可藉由將儲存於電腦系統中的程式進行組合以達成前述功能，即所謂的差別檔案(difference file；差別程式)。 Furthermore, the aforementioned functions can be achieved by combining programs stored in a computer system, a so-called difference file (difference file).
本發明係可適用於，一種可縮小顯示區域周邊之邊框部，以達成顯示區域之擴大及機器之小型化目的之光學組件貼合體的製造系統、製造方法及記錄媒體。 The present invention is applicable to a manufacturing system, a manufacturing method, and a recording medium of an optical component bonding body which can reduce the frame portion around the display area and achieve the purpose of expanding the display area and miniaturizing the device.
5‧‧‧滾筒輸送機 5‧‧‧Roller conveyor
11‧‧‧第一校準裝置 11‧‧‧First calibration device
12‧‧‧第一貼合裝置 12‧‧‧First bonding device
12a‧‧‧輸送裝置 12a‧‧‧Transporting device
12b‧‧‧夾壓滾筒 12b‧‧‧ pinch roller
12c‧‧‧滾筒保持部 12c‧‧‧Roller Keeping Department
12d‧‧‧保護薄膜回收部 12d‧‧‧Protective film recycling department
13‧‧‧第一切斷裝置 13‧‧‧First cutting device
14‧‧‧第二校準裝置 14‧‧‧Second calibration device
15‧‧‧第二貼合裝置 15‧‧‧Second laminating device
15a‧‧‧輸送裝置 15a‧‧‧Conveyor
15b‧‧‧夾壓滾筒 15b‧‧‧ pinch roller
15c‧‧‧滾筒保持部 15c‧‧‧Roller Keeping Department
15d‧‧‧第二回收部 15d‧‧‧Second Recycling Department
16‧‧‧第二切斷裝置 16‧‧‧Second cutting device
17‧‧‧第三校準裝置 17‧‧‧ Third calibration device
18‧‧‧第三貼合裝置 18‧‧‧ Third bonding device
18a‧‧‧輸送裝置 18a‧‧‧Transportation device
18b‧‧‧夾壓滾筒 18b‧‧‧ pinch roller
18c‧‧‧滾筒保持部 18c‧‧‧Roller Keeping Department
18d‧‧‧第三回收部 18d‧‧‧ Third Recycling Department
19‧‧‧第三切斷裝置 19‧‧‧ Third cutting device
20‧‧‧控制裝置 20‧‧‧Control device
F1‧‧‧第一光學組件層 F1‧‧‧First optical component layer
F2‧‧‧第二光學組件層 F2‧‧‧Second optical component layer
F3‧‧‧第三光學組件層 F3‧‧‧ third optical component layer
F21‧‧‧第一貼合層 F21‧‧‧ first bonding layer
F22‧‧‧第二貼合層 F22‧‧‧Second bonding layer
F23‧‧‧第三貼合層 F23‧‧‧ third bonding layer
R1‧‧‧第一料捲滾筒 R1‧‧‧First roll drum
R2‧‧‧第二料捲滾筒 R2‧‧‧second roll drum
R3‧‧‧第三料捲滾筒 R3‧‧‧ third roll
P‧‧‧液晶面板 P‧‧‧ LCD panel
P11‧‧‧第一單面貼合面板 P11‧‧‧First single-sided fitting panel
P12‧‧‧第二單面貼合面板 P12‧‧‧Second single-sided fitting panel
P13‧‧‧雙面貼合面板 P13‧‧‧ double-sided fitting panel
pf‧‧‧保護薄膜 Pf‧‧‧protective film
Claims (15)
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| JP2011253887 | 2011-11-21 |
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| TW201325793A true TW201325793A (en) | 2013-07-01 |
| TWI441703B TWI441703B (en) | 2014-06-21 |
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| TW101143432A TWI441703B (en) | 2011-11-21 | 2012-11-21 | Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium |
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| JP (2) | JP5279058B2 (en) |
| KR (1) | KR101477453B1 (en) |
| CN (1) | CN103562984B (en) |
| TW (1) | TWI441703B (en) |
| WO (1) | WO2013077353A1 (en) |
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| CN105992967A (en) * | 2013-12-03 | 2016-10-05 | 住友化学株式会社 | Device for manufacturing laminated optical member |
| CN105992968A (en) * | 2013-12-03 | 2016-10-05 | 住友化学株式会社 | Device for manufacturing laminated optical member |
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| JP5618283B2 (en) * | 2012-02-29 | 2014-11-05 | 住友化学株式会社 | Optical display device production system and optical display device production method |
| KR102044588B1 (en) * | 2012-09-07 | 2019-11-13 | 스미또모 가가꾸 가부시키가이샤 | Device for producing optical member pasted body |
| JP6037564B2 (en) * | 2013-06-24 | 2016-12-07 | 住友化学株式会社 | Optical display device production system |
| JP5943354B2 (en) * | 2013-07-23 | 2016-07-05 | 住友化学株式会社 | Optical display device production system |
| JP6526940B2 (en) * | 2013-08-20 | 2019-06-05 | 住友化学株式会社 | Apparatus and method for manufacturing optical member bonding body |
| JP2015049115A (en) * | 2013-08-30 | 2015-03-16 | 住友化学株式会社 | Method for manufacturing optical member laminate |
| KR102301536B1 (en) | 2015-03-10 | 2021-09-14 | 삼성전자주식회사 | Grain Analyzing Method and System using HRTEM Image |
| CN113568198A (en) * | 2021-07-08 | 2021-10-29 | 业成科技（成都）有限公司 | Laminating method of polaroid and display thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3616866B2 (en) * | 1997-09-19 | 2005-02-02 | 住友化学株式会社 | Manufacturing method of optical film bonded substrate |
| JP2003107452A (en) * | 2001-09-17 | 2003-04-09 | Internatl Business Mach Corp <Ibm> | Method of manufacturing liquid crystal display panel, method of manufacturing liquid crystal display device, and device for manufacturing the liquid crystal display device |
| KR20040002796A (en) * | 2002-06-28 | 2004-01-07 | 후지 샤신 필름 가부시기가이샤 | Method and apparatus for bonding polarizing plate |
| JP4376558B2 (en) * | 2002-07-04 | 2009-12-02 | 富士フイルム株式会社 | Polarizing plate bonding method and apparatus |
| JP4342851B2 (en) * | 2002-07-04 | 2009-10-14 | 富士フイルム株式会社 | Polarizing plate bonding method and apparatus |
| JP4371709B2 (en) * | 2003-06-05 | 2009-11-25 | 富士フイルム株式会社 | Optical film sticking apparatus and method |
| JP2007212690A (en) * | 2006-02-08 | 2007-08-23 | Toshiba Matsushita Display Technology Co Ltd | Inspection apparatus for liquid crystal panel and its inspection method |
| JP4808106B2 (en) * | 2006-08-23 | 2011-11-02 | 日東電工株式会社 | Cutting method of optical film |
| JP2008073742A (en) * | 2006-09-22 | 2008-04-03 | Nitto Denko Corp | Cutting method of optical film, and optical film |
| JP5015824B2 (en) * | 2008-02-29 | 2012-08-29 | 日東電工株式会社 | Adhesive film position detector and adhesive film sticking device |
| JP4855493B2 (en) * | 2008-04-14 | 2012-01-18 | 日東電工株式会社 | Optical display device manufacturing system and optical display device manufacturing method |
| KR100848854B1 (en) * | 2008-04-21 | 2008-07-30 | 주식회사 탑 엔지니어링 | Scribing apparatus of fragile substrate and method thereof |
| KR101004775B1 (en) * | 2009-03-12 | 2011-01-04 | 한동희 | Automatic attaching apparatus of protect film and attaching method thereof |
| JP4673414B2 (en) * | 2009-03-18 | 2011-04-20 | 日東電工株式会社 | Manufacturing method of liquid crystal display element |
| WO2011016572A1 (en) * | 2009-08-06 | 2011-02-10 | 住友化学株式会社 | Method for manufacturing polarizing plate |
| JP4774123B1 (en) * | 2010-03-18 | 2011-09-14 | 住友化学株式会社 | Method for inspecting bonding accuracy of polarizing plate and apparatus for inspecting bonding accuracy |
| JP2011232625A (en) * | 2010-04-28 | 2011-11-17 | Nitto Denko Corp | Production method for material roll and liquid crystal panel |
| CN102369098B (en) * | 2010-06-10 | 2014-05-07 | 日东电工株式会社 | Method for position adjustment of film sheet and rectangular panel in display panel production device |
| JP4878070B2 (en) * | 2010-10-29 | 2012-02-15 | 日東電工株式会社 | Manufacturing method of liquid crystal display element |
-
2012
- 2012-11-21 CN CN201280025657.2A patent/CN103562984B/en active Active
- 2012-11-21 JP JP2012255498A patent/JP5279058B2/en not_active Expired - Fee Related
- 2012-11-21 TW TW101143432A patent/TWI441703B/en not_active IP Right Cessation
- 2012-11-21 WO PCT/JP2012/080157 patent/WO2013077353A1/en active Application Filing
- 2012-11-21 KR KR1020137030660A patent/KR101477453B1/en active IP Right Grant
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992967A (en) * | 2013-12-03 | 2016-10-05 | 住友化学株式会社 | Device for manufacturing laminated optical member |
| CN105992968A (en) * | 2013-12-03 | 2016-10-05 | 住友化学株式会社 | Device for manufacturing laminated optical member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013214077A (en) | 2013-10-17 |
| KR20130133910A (en) | 2013-12-09 |
| WO2013077353A1 (en) | 2013-05-30 |
| TWI441703B (en) | 2014-06-21 |
| JP5360946B2 (en) | 2013-12-04 |
| CN103562984A (en) | 2014-02-05 |
| JP5279058B2 (en) | 2013-09-04 |
| CN103562984B (en) | 2016-04-27 |
| JP2013130867A (en) | 2013-07-04 |
| KR101477453B1 (en) | 2014-12-29 |
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