TW201322355A - Light irradiation device - Google Patents
Light irradiation device Download PDFInfo
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- TW201322355A TW201322355A TW101131527A TW101131527A TW201322355A TW 201322355 A TW201322355 A TW 201322355A TW 101131527 A TW101131527 A TW 101131527A TW 101131527 A TW101131527 A TW 101131527A TW 201322355 A TW201322355 A TW 201322355A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
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- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Cleaning In General (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
本發明係關於對於沿著基板搬送路徑進行搬送的處理對象基板，照射光線的光照射裝置者。 The present invention relates to a light-irradiating device that irradiates light to a substrate to be processed that is transported along a substrate transport path.
例如於液晶顯示裝置等的製造工程中，為了對於玻璃基板等的基板形成高密接性的薄膜，藉由對基板的表面照射紫外線，對該玻璃基板進行洗淨處理。 For example, in a manufacturing process such as a liquid crystal display device, in order to form a film having high adhesion to a substrate such as a glass substrate, the glass substrate is subjected to a cleaning treatment by irradiating the surface of the substrate with ultraviolet rays.
於此種基板的洗淨處理所使用之光照射裝置中，要求可對於多數基板連續執行光照射裝置者，而作為此種光照射裝置，公知有對沿著基板搬送路徑進行搬送的基板照射光線者。 In the light irradiation device used for the cleaning process of such a substrate, it is required to continuously perform the light irradiation device for a plurality of substrates. As such a light irradiation device, it is known to irradiate the substrate that is transported along the substrate transfer path. By.
圖3係揭示對沿著基板搬送路徑進行搬送的基板照射光線之先前的光照射裝置之一例之構造的說明用剖面圖。於此光照射裝置中，具有於下面形成光射出用的開口，且外形為略直方體狀的燈室80，於此燈室80內，設置有將該燈室80內區分成上下，來形成燈管收容室R1及電裝部收容室R2的間隔壁81。於燈室80的燈管收容室R1內，分別放射例如波長200nm以下之紫外線的複數準分子燈85以水平並排之方式被收容配置，該等準分子燈85係分別電性連接於被收容於電裝部收容室R2之電裝部(省略圖示)。又，於燈室80的燈管收容室R1之間隔壁81的下面，配置有對身為處理對象的基板W與準分子燈85之 間供給惰性氣體的氣體供給手段86。 3 is a cross-sectional explanatory view for explaining a structure of an example of a conventional light irradiation device that irradiates light onto a substrate transported along a substrate transport path. In the light irradiation device, the lamp chamber 80 having an opening for light emission and having a shape of a substantially rectangular parallelepiped is formed in the lamp chamber 80, and the lamp chamber 80 is provided in the lamp chamber 80 so as to be vertically divided. The partition wall 81 of the lamp housing chamber R1 and the electrical component storage chamber R2. In the lamp tube accommodating chamber R1 of the lamp chamber 80, a plurality of excimer lamps 85 emitting ultraviolet rays having a wavelength of, for example, 200 nm or less are accommodated in a horizontal arrangement, and the excimer lamps 85 are electrically connected to each other. The electrical component (not shown) of the electrical component storage chamber R2. Further, on the lower surface of the partition wall 81 of the bulb storage chamber R1 of the lamp chamber 80, a substrate W and an excimer lamp 85 which are to be processed are disposed. A gas supply means 86 for supplying an inert gas.
於燈室80的下方，設置有沿著基板搬送路徑L來搬送基板W，且具有複數搬送滾筒91的基板搬送機構90，於此基板搬送機構90的下方，設置有對從氣體供給手段86供給之惰性氣體作排氣，且具有複數排氣口93的排氣機構92。 A substrate transport mechanism 90 that transports the substrate W along the substrate transport path L and has a plurality of transport rollers 91 is provided below the lamp chamber 80. The substrate transport mechanism 90 is provided below the substrate transport mechanism 90. The inert gas is exhausted and has an exhaust mechanism 92 of a plurality of exhaust ports 93.
於基板搬送路徑L之燈室80的上游側及下游側，藉由一方的壓力緩衝空間形成材82及另一方的壓力緩衝空間形成材83，鄰接於該燈室80，分別形成一方的壓力緩衝空間S1及另一方的壓力緩衝空間S2。於基板搬送路徑L之一方的壓力緩衝空間S1之上游側及另一方的壓力緩衝空間S2之下游側，分別設置有藉由對沿著基板搬送路徑L進行搬送的基板W之一面噴射空氣，從該基板W之一面去除塵埃的塵埃去除手段95、96，於設置於下游側的塵埃去除手段96，形成對被噴射之空氣作排氣的排氣口97。 One pressure buffer space forming material 82 and the other pressure buffer space forming material 83 are formed on the upstream side and the downstream side of the lamp chamber 80 of the substrate transport path L, and one pressure buffer is formed adjacent to the lamp chamber 80. The space S1 and the other pressure buffer space S2. On the upstream side of the pressure buffer space S1 on one of the substrate transport paths L and on the downstream side of the other pressure buffer space S2, air is ejected from one surface of the substrate W that is transported along the substrate transport path L, respectively. The dust removing means 95, 96 for removing dust on one side of the substrate W forms an exhaust port 97 for exhausting the injected air on the dust removing means 96 provided on the downstream side.
於此種光照射裝置中，對於藉由基板搬送機構90沿著基板搬送路徑L進行搬送的基板W，首先，在該基板W通過塵埃去除手段95之去除處理區域T1時，藉由從該塵埃去除手段95噴射空氣來進行塵埃的去除處理，接下來，在該基板W通過位於準分子燈85正下方的光照射處理區域T2時，從氣體供給手段86對基板W與準分子燈85之間供給惰性氣體，並且從準分子燈85對基板W之一面，照射例如波長200nm以下的紫外線，藉此，進行光洗淨 處理，進而，在該基板W通過塵埃去除手段96之去除處理區域T3時，藉由從該塵埃去除手段96噴射空氣來進行塵埃的去除處理。 In the light irradiation device, the substrate W transported along the substrate transport path L by the substrate transport mechanism 90 first passes through the dust when the substrate W passes through the dust removal means 95 to remove the processing region T1. The removing means 95 ejects air to perform the dust removing process. Next, when the substrate W is irradiated to the processing region T2 by the light directly under the excimer lamp 85, the gas supply means 86 is used between the substrate W and the excimer lamp 85. An inert gas is supplied, and the surface of the substrate W is irradiated with ultraviolet rays having a wavelength of, for example, 200 nm or less from the excimer lamp 85, thereby performing light washing. Further, when the substrate W passes through the removal processing region T3 of the dust removing means 96, the dust is removed by ejecting air from the dust removing means 96.
然而，於前述之構造的光照射裝置中，有因為從塵埃去除手段95噴射的空氣係在流過位於準分子燈85正下方的光照射處理區域T2之後，從塵埃去除手段96之排氣口97被排氣，故因為流入至光照射處理區域T2的空氣而吸收來自準分子燈85的紫外線之結果，無法對於基板W以高效率照射紫外線之問題。 However, in the light irradiation device of the above-described configuration, since the air ejected from the dust removing means 95 flows through the light irradiation treatment region T2 located directly below the excimer lamp 85, the exhaust port from the dust removing means 96 Since 97 is exhausted, the ultraviolet light from the excimer lamp 85 is absorbed by the air flowing into the light irradiation treatment region T2, and the problem that the substrate W cannot be irradiated with ultraviolet rays with high efficiency cannot be obtained.
然後，為了抑制空氣流入位於準分子燈正下方的光照射處理區域，提案有於光照射處理區域之下方設置區隔板的光照射裝置(參照專利文獻1)。 Then, in order to suppress the flow of air into the light irradiation treatment region located directly below the excimer lamp, a light irradiation device in which a partition plate is provided below the light irradiation treatment region has been proposed (see Patent Document 1).
然而，於此種光照射裝置中，雖然可抑制流通於基板搬送路徑下方之空氣流入至光照射處理區域之狀況，但是，並未考量流通於基板搬送路徑上方的空氣，亦即沿著基板之被光線照射之一面流通的空氣流入至光照射處理區域，結果，因空氣流入準分子燈與基板之間，難以對於基板以高效率照射紫外線。 However, in such a light irradiation device, it is possible to prevent the air flowing under the substrate transfer path from flowing into the light irradiation treatment region. However, the air flowing over the substrate transfer path is not considered, that is, along the substrate. The air that has flowed on one side of the light beam flows into the light irradiation treatment region, and as a result, air flows between the excimer lamp and the substrate, and it is difficult to irradiate the ultraviolet rays with high efficiency to the substrate.
[專利文獻1]日本特開2010-75888號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-75888
本發明係有鑒於以上情況所發明者，其目的係提供抑制空氣流入至處理對象基板與燈管之間，所以，可對於處理對象基板以高效率來照射光線的光照射裝置。 The present invention has been made in view of the above circumstances, and an object of the invention is to provide a light-irradiating device that can irradiate light to a substrate to be processed with high efficiency, while suppressing the flow of air between the substrate to be processed and the tube.
本發明的光照射裝置，係具備內藏有朝向沿著基板搬送路徑進行搬送的處理對象基板之一面照射光線之準分子燈的燈室，與對前述處理對象基板與前述準分子燈之間供給惰性氣體的氣體供給手段，並於前述基板搬送路徑之前述燈室的上游側，鄰接於該燈室而形成壓力緩衝空間的光照射裝置，其特徵為： 於基板搬送路徑之壓力緩衝空間的上游側，設置有：空氣排出手段，係排出沿著處理對象基板之被光線照射之一面流通的空氣。 The light irradiation device of the present invention includes a lamp chamber in which an excimer lamp that irradiates light onto one surface of the substrate to be processed that is transported along the substrate transport path is provided, and is supplied between the substrate to be processed and the excimer lamp. A gas supply means for an inert gas, and a light irradiation device that forms a pressure buffer space adjacent to the lamp chamber on the upstream side of the lamp chamber of the substrate transfer path, and is characterized in that: On the upstream side of the pressure buffer space of the substrate transfer path, an air discharge means is provided to discharge air flowing along one side of the substrate to be processed which is irradiated with light.
於本發明的光照射裝置中，理想為於前述基板搬送路徑之前述空氣排出手段的上游側，設置有：塵埃去除手段，係藉由對前述處理對象基板之一面噴射空氣，從該處理對象基板之一面去除塵埃。 In the light irradiation device of the present invention, it is preferable that a dust removing means is provided on the upstream side of the air discharge means of the substrate transfer path, and air is ejected from one surface of the processing target substrate from the processing target substrate. Remove dust from one side.
又，理想為設置有：空氣流入限制板，係限制空氣從前述基板搬送路徑之前述壓力緩衝空間的上游流入至該壓力緩衝空間。 Further, it is preferable that an air inflow restriction plate is provided to restrict air from flowing into the pressure buffer space from upstream of the pressure buffer space of the substrate conveyance path.
依據本發明的光照射裝置，因為於基板搬送路徑之壓 力緩衝空間的上游側中，藉由空氣排出手段，排出沿著處理對象基板之被光照射之一面流通的空氣，可確實抑制空氣流入至處理對象基板與準分子燈之間，所以，可對於處理對象基板以高效率照射光線。 According to the light irradiation device of the present invention, the pressure is applied to the substrate transport path In the upstream side of the force buffer space, the air that flows along one side of the light to be irradiated on the substrate to be processed is discharged by the air discharge means, and the air can be surely prevented from flowing between the substrate to be processed and the excimer lamp. The target substrate is irradiated with light with high efficiency.
又，藉由設置限制空氣從基板搬送路徑之壓力緩衝空間的上游流入至該壓力緩衝空間的空氣流入限制板，可更確實抑制空氣流入至基板與準分子燈之間。 Further, by providing the air inflow restricting plate that restricts the flow of air from the upstream of the pressure buffer space of the substrate transfer path to the pressure buffer space, it is possible to more reliably prevent the air from flowing between the substrate and the excimer lamp.
以下，針對本發明之光照射裝置的實施形態進行說明。 Hereinafter, an embodiment of the light irradiation device of the present invention will be described.
圖1係揭示本發明之光照射裝置的一例之構造的說明用剖面圖。此光照射裝置係對於沿著延伸於水平方向(於圖1中為左右方向)的基板搬送路徑L進行搬送的基板W之一面(於圖1中為上面)，照射例如波長200nm以下的紫外線者，具有於下面形成光射出用的開口，且外形為略直方體狀的燈室10。於此燈室10內，設置有將該燈室10內區分成上下的間隔壁11，藉此，於間隔壁11的下方形成燈管收容室R1，並且於間隔壁11的上方，形成電裝部收容室R2。 Fig. 1 is a cross-sectional view for explaining the structure of an example of the light irradiation device of the present invention. In the light irradiation device, one of the substrates W (the upper surface in FIG. 1) that is transported along the substrate transport path L extending in the horizontal direction (the horizontal direction in FIG. 1) is irradiated with ultraviolet rays having a wavelength of, for example, 200 nm or less. The lamp chamber 10 having an opening for light emission and having a shape of a substantially rectangular parallelepiped is formed. In the lamp chamber 10, a partition wall 11 for dividing the inside of the lamp chamber 10 into upper and lower portions is provided, whereby the lamp tube accommodating chamber R1 is formed below the partition wall 11, and the electric device is formed above the partition wall 11. Part containment room R2.
於燈室10的燈管收容室R1內，分別放射紫外線的複數準分子燈20以水平並排之方式被收容配置，該等準分子燈20係分別電性連接於被收容於電裝部收容室R2之電裝部(省略圖示)。 In the lamp tube accommodating chamber R1 of the lamp chamber 10, a plurality of excimer lamps 20 that emit ultraviolet rays are arranged side by side, and the excimer lamps 20 are electrically connected to the accommodating portion accommodating chamber. Electric part of R2 (not shown).
準分子燈20係以具有充填有放電用氣體的放電空間 ，在用以激發此放電用氣體放電之兩個電極中至少一方的電極與放電空間之間中介存在有介電質材料之方式構成者，通常，形成放電空間的放電容器由介電質材料所成，於該放電容器的外表面配置至少一方的電極所構成。 The excimer lamp 20 is provided with a discharge space filled with a discharge gas A dielectric material is interposed between the electrode for exciting at least one of the two electrodes for discharging the discharge gas and the discharge space. Usually, the discharge vessel forming the discharge space is made of a dielectric material. At least one electrode is disposed on the outer surface of the discharge vessel.
作為封入至放電空間內的放電用氣體，使用可產生放射例如波長200nm以下之紫外線的準分子者，作為其具體例，可使用氙、氬、氪等之稀有氣體，或混合該等稀有氣體與溴、氯、碘、氟等之鹵素氣體的混合氣體等。將放電用氣體的具體例，與被放射之紫外線的波長一起揭示的話，在氬氣中為124nm，在氪氣中為153nm，在氙氣中為172nm，在氬與碘的混合氣體中為191nm，在氬與氟的混合氣體中為193nm。 As the discharge gas enclosed in the discharge space, an excimer capable of emitting ultraviolet rays having a wavelength of, for example, 200 nm or less is used. As a specific example, a rare gas such as helium, argon or neon may be used, or a rare gas may be mixed and a mixed gas of a halogen gas such as bromine, chlorine, iodine or fluorine. A specific example of the gas for discharge is 124 nm in argon gas, 153 nm in helium gas, 172 nm in helium gas, and 191 nm in a mixed gas of argon and iodine, together with the wavelength of the ultraviolet light to be emitted. It is 193 nm in a mixed gas of argon and fluorine.
又，準分子用氣體的封壓係例如10~100kPa。 Further, the sealing of the excimer gas is, for example, 10 to 100 kPa.
作為構成形成放電空間之放電容器的介電質材料，使用可良好透射放電空間內產生之準分子光，具體來說為波長200nm以下的紫外線者，作為其具體例，可舉出合成石英玻璃等的矽玻璃、藍寶石玻璃等。 As the dielectric material constituting the discharge vessel forming the discharge space, excimer light which is generated in the discharge space is used, specifically, ultraviolet light having a wavelength of 200 nm or less. Specific examples thereof include synthetic quartz glass and the like. Glass, sapphire glass, etc.
於燈室10的燈管收容室R1內之間隔壁11的下面，配置有對身為處理對象的基板W與準分子燈20之間供給惰性氣體的氣體供給手段30。 A gas supply means 30 for supplying an inert gas between the substrate W to be processed and the excimer lamp 20 is disposed on the lower surface of the partition wall 11 in the bulb storage chamber R1 of the lamp chamber 10.
作為從此氣體供給手段30供給之惰性氣體，可使用氮氣、氦氣等的稀有氣體等。 As the inert gas supplied from the gas supply means 30, a rare gas such as nitrogen or helium or the like can be used.
於燈室10的下方，設置有以複數搬送滾筒36沿著基板搬送路徑L並排於水平方向之方式配置所成的基板搬送 機構35，於此基板搬送機構35的下方，設置有對從氣體供給手段30供給之惰性氣體作排氣，且具有複數排氣口38的排氣機構37。 A substrate conveyance in which the plurality of transport rollers 36 are arranged in the horizontal direction along the substrate transport path L is provided below the lamp chamber 10 The mechanism 35 is provided below the substrate transfer mechanism 35 with an exhaust mechanism 37 that exhausts the inert gas supplied from the gas supply means 30 and has a plurality of exhaust ports 38.
於基板搬送路徑L之燈室10的上游側(於圖1中為左側)，藉由設置於燈室10的側壁之外面的一方的壓力緩衝空間形成材12，鄰接於該燈室10而形成一方的壓力緩衝空間S1，於基板搬送路徑L之燈室10的下游側(於圖1中為右側)，藉由設置於燈室10的側壁之外面的另一方的壓力緩衝空間形成材13，鄰接於該燈室10而形成另一方的壓力緩衝空間S2。 On the upstream side (left side in FIG. 1) of the lamp chamber 10 of the substrate transfer path L, a pressure buffer space forming material 12 provided on the outer surface of the side wall of the lamp chamber 10 is formed adjacent to the lamp chamber 10 One of the pressure buffer spaces S1 is formed on the downstream side (the right side in FIG. 1) of the lamp chamber 10 of the substrate transport path L by the other pressure buffer space provided on the outer surface of the side wall of the lamp chamber 10, The other pressure buffer space S2 is formed adjacent to the lamp chamber 10.
一方的壓力緩衝空間S1，係藉由空氣流入限制板15，與基板搬送路徑L之該一方的壓力緩衝空間S1之上游側的空間區隔，藉此，限制空氣從一方的壓力緩衝空間S1之上游流入至該一方的壓力緩衝空間S1之狀況。 The one pressure buffer space S1 is partitioned from the space on the upstream side of the pressure buffer space S1 of the substrate transport path L by the air inflow restriction plate 15, thereby restricting the air from the one pressure buffer space S1. The state in which the upstream flows into the pressure buffer space S1 of the one side.
又，另一方的壓力緩衝空間S2，係藉由空氣流入限制板16，與基板搬送路徑L之該另一方的壓力緩衝空間S2之下游側的空間區隔，藉此，限制空氣從另一方的壓力緩衝空間S2之下游流入至該另一方的壓力緩衝空間S2之狀況。 Further, the other pressure buffer space S2 is partitioned from the space on the downstream side of the other pressure buffer space S2 of the substrate transport path L by the air inflow restriction plate 16, thereby restricting the air from the other side. The condition downstream of the pressure buffer space S2 flows into the pressure buffer space S2 of the other side.
於基板搬送路徑L之一方的壓力緩衝空間S1之上游側，設置有排出沿著基板W之被光線照射之一面流通的空氣的空氣排出手段40。此範例的空氣排出手段40，係藉由空氣流通構件41與設置於此空氣流通構件41的吸引機構(省略圖示)所構成。空氣排出手段40之空氣流通構件 41以空氣流入口42位於基板搬送路徑L之一方的壓力緩衝空間S1之上游側，而空氣流出口43位於基板搬送路徑L之另一方的壓力緩衝空間S2之下游側之狀態配置。 On the upstream side of the pressure buffer space S1 on one of the substrate transport paths L, an air discharge means 40 that discharges air flowing along one side of the substrate W by the light is provided. The air discharge means 40 of this example is constituted by an air flow member 41 and a suction mechanism (not shown) provided in the air flow member 41. Air circulation member of air discharge means 40 The air inflow port 42 is located on the upstream side of the pressure buffer space S1 of one of the substrate transport paths L, and the air outflow port 43 is placed on the downstream side of the pressure buffer space S2 of the other substrate transport path L.
於基板搬送路徑L之空氣排出手段40的上游側，具體來說空氣流通構件41之空氣流入口42的上游側，設置有藉由對沿著基板搬送路徑L進行搬送之基板W的一面噴射空氣，從該基板W的一面去除塵埃的塵埃去除手段50。 On the upstream side of the air discharge means 40 of the substrate transport path L, specifically, on the upstream side of the air inflow port 42 of the air flow member 41, air is sprayed on one side of the substrate W that is transported along the substrate transport path L. A dust removing means 50 for removing dust from one surface of the substrate W.
又，於基板搬送路徑L之空氣流通構件41的空氣流出口43之下游側，設置有藉由對沿著基板搬送路徑L進行搬送之基板W的一面噴射空氣，從該基板W的一面去除塵埃的塵埃去除手段55，於此塵埃去除手段55，形成有對被噴射之空氣作排氣的排氣口56。 Further, on the downstream side of the air outflow port 43 of the air flow member 41 of the substrate transport path L, air is ejected from one surface of the substrate W transported along the substrate transport path L, and dust is removed from one surface of the substrate W. The dust removing means 55, the dust removing means 55, is formed with an exhaust port 56 for exhausting the injected air.
於前述的光照射裝置中，藉由基板搬送機構35，身為處理對象的基板W沿著基板搬送路徑L，從其上游側被搬送至下游側。然後，在基板W通過塵埃去除手段50之去除處理區域T1時，藉由該塵埃去除手段50對基板W的一面噴射空氣，對於該基板W的一面進行塵埃的去除處理，之後，在基板W通過位於準分子燈20正下方的光照射處理區域T2時，藉由氣體供給手段30對基板W與準分子燈20之間供給惰性氣體，並且藉由準分子燈20對基板W之一面，照射例如波長200nm以下的紫外線，藉此，對於該基板W的一面進行光洗淨處理。 In the above-described light irradiation device, the substrate W to be processed is transported from the upstream side to the downstream side along the substrate transport path L by the substrate transport mechanism 35. Then, when the substrate W passes through the removal processing region T1 of the dust removing means 50, air is ejected to one surface of the substrate W by the dust removing means 50, dust is removed from one surface of the substrate W, and then the substrate W is passed through. When the light is irradiated to the processing region T2 directly under the excimer lamp 20, an inert gas is supplied between the substrate W and the excimer lamp 20 by the gas supply means 30, and one side of the substrate W is irradiated by the excimer lamp 20, for example. Ultraviolet rays having a wavelength of 200 nm or less are subjected to a light washing treatment on one surface of the substrate W.
此時，藉由塵埃去除手段50噴射至基板W的一面之 空氣，係該一部分沿著基板W的一面朝向基板搬送路徑L之塵埃去除手段50的下游側流通，但是，沿著該基板W的一面流通之空氣，係藉由空氣排出手段40之吸引機構(省略圖示)，從空氣流入口42流入至空氣流通構件41內，流入至此空氣流通構件41內的空氣在從空氣流出口43流出後，被塵埃去除手段55的排氣口56排氣。 At this time, it is ejected to one side of the substrate W by the dust removing means 50. The air flows along the downstream side of the dust removing means 50 of the substrate transport path L along one surface of the substrate W. However, the air flowing along one side of the substrate W is a suction mechanism by the air discharge means 40 ( The airflow inflow member 42 flows into the air flow member 41, and the air that has flowed into the air flow member 41 flows out of the air flow outlet 43 and is exhausted by the exhaust port 56 of the dust removing means 55.
然後，進行光洗淨處理的基板W係在通過塵埃去除手段55之去除處理區域T3時，藉由例用該塵埃去除手段55對基板W的一面噴射空氣，對於該基板W的一面進行塵埃的去除處理。 Then, when the substrate W subjected to the photo-cleaning treatment is removed from the processing region T3 by the dust removing means 55, air is ejected to one surface of the substrate W by the dust removing means 55, and dust is applied to one surface of the substrate W. Removal processing.
以上說明中，藉由塵埃去除手段50噴射之空氣的流量例如為5~30m3/min，藉由塵埃去除手段55噴射之空氣的流量例如為1~5m3/min。 In the above description, the flow rate of the air ejected by the dust removing means 50 is, for example, 5 to 30 m 3 /min, and the flow rate of the air ejected by the dust removing means 55 is, for example, 1 to 5 m 3 /min.
又，藉由氣體供給手段30供給之惰性氣體的流量例如為0.4~0.8m3/min。 Moreover, the flow rate of the inert gas supplied by the gas supply means 30 is, for example, 0.4 to 0.8 m 3 /min.
又，藉由空氣排出手段40排出之空氣的流量例如為3~15m3/min。 Further, the flow rate of the air discharged by the air discharge means 40 is, for example, 3 to 15 m 3 /min.
依據前述的光照射裝置，因為於基板搬送路徑L之壓力緩衝空間S1的上游側中，藉由空氣排出手段40，排出沿著基板W之被光照射之一面流通的空氣，可確實抑制空氣流入至基板W與準分子燈20之間，所以，可對於基板W以高效率照射光線。 According to the above-described light irradiation device, in the upstream side of the pressure buffer space S1 of the substrate transport path L, the air discharged through one side of the substrate W by the air discharge means 40 is discharged, and the air inflow can be surely suppressed. Since the substrate W is interposed between the substrate W and the excimer lamp 20, the substrate W can be irradiated with light with high efficiency.
又，藉由設置限制空氣從基板搬送路徑L之壓力緩衝空間S1的上游流入至該壓力緩衝空間S1的空氣流入限制 板15，可更確實抑制空氣流入至基板W與準分子燈20之間。 Further, an air inflow restriction that restricts the flow of air from the upstream of the pressure buffer space S1 of the substrate transport path L to the pressure buffer space S1 is provided. The plate 15 can more reliably suppress the inflow of air between the substrate W and the excimer lamp 20.
圖2係揭示本發明之光照射裝置的其他例之構造的說明用剖面圖。於此光照射裝置中，空氣排出手段40，係藉由以空氣流入口42位於基板搬送路徑L之一方的壓力緩衝空間S1之上游側，而空氣流出口43位於基板搬送路徑L之另一方的壓力緩衝空間S2之下游側之狀態配置的空氣流通構件41，與設置於此空氣流通構件41的空氣流入口42之下方的空氣刀45所構成，空氣刀45係以空氣的噴射方向對於水平方向以0~90°的角度往下方傾斜之方式配置。其他構造係與圖1所示之光照射裝置的構造相同。 Fig. 2 is a cross-sectional view for explaining the structure of another example of the light irradiation device of the present invention. In the light irradiation device, the air discharge means 40 is located on the upstream side of the pressure buffer space S1 of one of the substrate transport paths L by the air inflow port 42, and the air outflow port 43 is located on the other side of the substrate transport path L. The air flow member 41 disposed on the downstream side of the pressure buffer space S2 is configured by an air knife 45 disposed below the air inflow port 42 of the air flow member 41, and the air knife 45 is oriented in the horizontal direction with respect to the air jet direction. It is configured to tilt downward at an angle of 0 to 90°. The other structure is the same as that of the light irradiation device shown in Fig. 1.
於前述的光照射裝置中，藉由基板搬送機構35，身為處理對象的基板W沿著基板搬送路徑L，從其上游側被搬送至下游側。然後，在基板W通過塵埃去除手段50之去除處理區域T1時，藉由該塵埃去除手段50對基板W的一面噴射空氣，對於該基板W的一面進行塵埃的去除處理，之後，在基板W通過位於準分子燈20正下方的光照射處理區域T2時，藉由氣體供給手段30對基板W與準分子燈20之間供給惰性氣體，並且藉由準分子燈20對基板W之一面，照射例如波長200nm以下的紫外線，藉此，對於該基板W的一面進行光洗淨處理。 In the above-described light irradiation device, the substrate W to be processed is transported from the upstream side to the downstream side along the substrate transport path L by the substrate transport mechanism 35. Then, when the substrate W passes through the removal processing region T1 of the dust removing means 50, air is ejected to one surface of the substrate W by the dust removing means 50, dust is removed from one surface of the substrate W, and then the substrate W is passed through. When the light is irradiated to the processing region T2 directly under the excimer lamp 20, an inert gas is supplied between the substrate W and the excimer lamp 20 by the gas supply means 30, and one side of the substrate W is irradiated by the excimer lamp 20, for example. Ultraviolet rays having a wavelength of 200 nm or less are subjected to a light washing treatment on one surface of the substrate W.
此時，藉由塵埃去除手段50噴射至基板W的一面之空氣，係該一部分沿著基板W的一面朝向基板搬送路徑L之塵埃去除手段50的下游側流通，但是，沿著該基板W 的一面流通之空氣，係藉由從空氣排出手段40之空氣刀45噴射的空氣，朝向空氣流通構件41的空氣流入口42流通，從空氣流入口42流入至空氣流通構件41內的空氣在從空氣流出口43流出後，被塵埃去除手段55的排氣口56排氣。 At this time, the air which is ejected to one side of the substrate W by the dust removing means 50 flows along the downstream side of the dust removing means 50 of the substrate transport path L along one surface of the substrate W, but along the substrate W The air that flows through the air is circulated toward the air inflow port 42 of the air flow member 41 by the air ejected from the air knife 45 of the air discharge means 40, and the air flowing into the air flow member 41 from the air inflow port 42 is in the air. After the air outflow port 43 flows out, it is exhausted by the exhaust port 56 of the dust removing means 55.
然後，進行光洗淨處理的基板W係在通過塵埃去除手段55之去除處理區域T3時，藉由例用該塵埃去除手段55對基板W的一面噴射空氣，對於該基板W的一面進行塵埃的去除處理。 Then, when the substrate W subjected to the photo-cleaning treatment is removed from the processing region T3 by the dust removing means 55, air is ejected to one surface of the substrate W by the dust removing means 55, and dust is applied to one surface of the substrate W. Removal processing.
於以上說明中，藉由塵埃去除手段50噴射之空氣的流量及藉由氣體供給手段30供給之惰性氣體的流量，係與圖1所示之光照射裝置相同。 In the above description, the flow rate of the air injected by the dust removing means 50 and the flow rate of the inert gas supplied by the gas supply means 30 are the same as those of the light irradiation means shown in FIG.
又，藉由空氣排出手段40的空氣刀45噴射之空氣的流量例如為6~10m3/min。 Further, the flow rate of the air ejected by the air knife 45 of the air discharge means 40 is, for example, 6 to 10 m 3 /min.
依據前述的光照射裝置，因為於基板搬送路徑L之壓力緩衝空間S1的上游側中，藉由空氣排出手段40，排出沿著基板W之被光照射之一面流通的空氣，可確實抑制空氣流入至基板W與準分子燈20之間，所以，可對於基板W以高效率照射光線。 According to the above-described light irradiation device, in the upstream side of the pressure buffer space S1 of the substrate transport path L, the air discharged through one side of the substrate W by the air discharge means 40 is discharged, and the air inflow can be surely suppressed. Since the substrate W is interposed between the substrate W and the excimer lamp 20, the substrate W can be irradiated with light with high efficiency.
又，藉由設置限制空氣從基板搬送路徑L之壓力緩衝空間S1的上游流入至該壓力緩衝空間S1的空氣流入限制板15，可更確實抑制空氣流入至基板W與準分子燈20之間。 In addition, by providing the air inflow restricting plate 15 that restricts the flow of air from the upstream of the pressure buffer space S1 of the substrate transport path L to the pressure buffer space S1, it is possible to more reliably prevent the air from flowing between the substrate W and the excimer lamp 20.
10‧‧‧燈室 10‧‧‧ lamp room
11‧‧‧間隔壁 11‧‧‧ partition wall
12‧‧‧一方的壓力緩衝空間形成材 12 ‧ ‧ one side of the pressure buffer space forming material
13‧‧‧另一方的壓力緩衝空間形成材 13‧‧‧The other side of the pressure buffer space forming material
15，16‧‧‧空氣流入限制板 15,16‧‧‧Air inflow limit plate
20‧‧‧準分子燈 20‧‧‧Excimer lamp
30‧‧‧氣體供給手段 30‧‧‧ gas supply means
35‧‧‧基板搬送機構 35‧‧‧Substrate transport mechanism
36‧‧‧搬送滾筒 36‧‧‧Transport roller
37‧‧‧排氣機構 37‧‧‧Exhaust mechanism
38‧‧‧排氣口 38‧‧‧Exhaust port
40‧‧‧空氣排出手段 40‧‧‧Air removal means
41‧‧‧空氣流通構件 41‧‧‧Air circulation components
42‧‧‧空氣流入口 42‧‧‧Air inlet
43‧‧‧空氣流出口 43‧‧‧Air outlet
45‧‧‧空氣刀 45‧‧ Air knife
50，55‧‧‧塵埃去除手段 50, 55‧‧‧ dust removal means
56‧‧‧排氣口 56‧‧‧Exhaust port
80‧‧‧燈室 80‧‧‧light room
81‧‧‧間隔壁 81‧‧‧ partition wall
82‧‧‧一方的壓力緩衝空間形成材 82‧‧‧ one side of the pressure buffer space forming material
83‧‧‧另一方的壓力緩衝空間形成材 83‧‧‧The other side of the pressure buffer space forming material
85‧‧‧準分子燈 85‧‧‧Excimer lights
86‧‧‧氣體供給手段 86‧‧‧ gas supply means
91‧‧‧搬送滾筒 91‧‧‧Transport roller
90‧‧‧基板搬送機構 90‧‧‧Substrate transport mechanism
92‧‧‧排氣機構 92‧‧‧Exhaust mechanism
93‧‧‧排氣口 93‧‧‧Exhaust port
95，96‧‧‧塵埃去除手段 95,96‧‧‧Dust removal means
97‧‧‧排氣口 97‧‧‧Exhaust port
L‧‧‧基板搬送路徑 L‧‧‧Substrate transport path
R1‧‧‧燈管收容室 R1‧‧‧ lamp tube storage room
R2‧‧‧電裝部收容室 R2‧‧‧Electric equipment department
S1‧‧‧一方的壓力緩衝空間 Pressure buffer space on the S1‧‧‧ side
S2‧‧‧另一方的壓力緩衝空間 S2‧‧‧The other side of the pressure buffer space
T1‧‧‧去除處理區域 T1‧‧‧Removal treatment area
T2‧‧‧光照射處理區域 T2‧‧‧Light irradiation treatment area
T3‧‧‧去除處理區域 T3‧‧‧Removal treatment area
W‧‧‧基板 W‧‧‧Substrate
[圖1]揭示本發明之光照射裝置的一例之構造的說明用剖面圖。 Fig. 1 is a cross-sectional view for explaining the structure of an example of the light irradiation device of the present invention.
[圖2]揭示本發明之光照射裝置的其他例之構造的說明用剖面圖。 Fig. 2 is a cross-sectional view for explaining the structure of another example of the light irradiation device of the present invention.
[圖3]揭示對沿著基板搬送路徑進行搬送的基板照射光線之先前的光照射裝置之一例之構造的說明用剖面圖。 3 is a cross-sectional view for explaining an example of an example of a conventional light irradiation device that irradiates light onto a substrate that is transported along a substrate transport path.
10‧‧‧燈室 10‧‧‧ lamp room
11‧‧‧間隔壁 11‧‧‧ partition wall
12‧‧‧一方的壓力緩衝空間形成材 12 ‧ ‧ one side of the pressure buffer space forming material
13‧‧‧另一方的壓力緩衝空間形成材 13‧‧‧The other side of the pressure buffer space forming material
15，16‧‧‧空氣流入限制板 15,16‧‧‧Air inflow limit plate
20‧‧‧準分子燈 20‧‧‧Excimer lamp
30‧‧‧氣體供給手段 30‧‧‧ gas supply means
35‧‧‧基板搬送機構 35‧‧‧Substrate transport mechanism
36‧‧‧搬送滾筒 36‧‧‧Transport roller
37‧‧‧排氣機構 37‧‧‧Exhaust mechanism
38‧‧‧排氣口 38‧‧‧Exhaust port
40‧‧‧空氣排出手段 40‧‧‧Air removal means
41‧‧‧空氣流通構件 41‧‧‧Air circulation components
42‧‧‧空氣流入口 42‧‧‧Air inlet
43‧‧‧空氣流出口 43‧‧‧Air outlet
50，55‧‧‧塵埃去除手段 50, 55‧‧‧ dust removal means
56‧‧‧排氣口 56‧‧‧Exhaust port
L‧‧‧基板搬送路徑 L‧‧‧Substrate transport path
R1‧‧‧燈管收容室 R1‧‧‧ lamp tube storage room
R2‧‧‧電裝部收容室 R2‧‧‧Electric equipment department
S1‧‧‧一方的壓力緩衝空間 Pressure buffer space on the S1‧‧‧ side
S2‧‧‧另一方的壓力緩衝空間 S2‧‧‧The other side of the pressure buffer space
T1‧‧‧去除處理區域 T1‧‧‧Removal treatment area
T2‧‧‧光照射處理區域 T2‧‧‧Light irradiation treatment area
T3‧‧‧去除處理區域 T3‧‧‧Removal treatment area
W‧‧‧基板 W‧‧‧Substrate
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011256934A JP5601312B2 (en) | 2011-11-25 | 2011-11-25 | Light irradiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201322355A true TW201322355A (en) | 2013-06-01 |
Family
ID=48488901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101131527A TW201322355A (en) | 2011-11-25 | 2012-08-30 | Light irradiation device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5601312B2 (en) |
| KR (1) | KR20130058602A (en) |
| CN (1) | CN103128080B (en) |
| TW (1) | TW201322355A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI588925B (en) * | 2015-04-16 | 2017-06-21 | Ushio Electric Inc | Light irradiation device |
| TWI774734B (en) * | 2017-04-06 | 2022-08-21 | 日商牛尾電機股份有限公司 | light irradiation device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6152010B2 (en) * | 2013-08-08 | 2017-06-21 | 株式会社Ｓｃｒｅｅｎホールディングス | Light irradiation apparatus and light irradiation method |
| CN103464424B (en) * | 2013-08-28 | 2015-12-02 | 西安耀北光电科技有限公司 | Ultra-violet radiation ozone light cleaning machine |
| JP6984206B2 (en) * | 2017-07-19 | 2021-12-17 | ウシオ電機株式会社 | Light irradiation device |
| CN109894432B (en) * | 2019-03-22 | 2020-01-14 | 浙江晶鲸科技有限公司 | Dry-type non-contact cleaning device |
| CN110751901B (en) * | 2019-11-19 | 2022-04-05 | 安徽赛迈特光电股份有限公司 | Display screen module convenient to it is clean |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11267597A (en) * | 1998-03-26 | 1999-10-05 | Matsushita Electric Works Ltd | Plate cleaning device |
| JP4014729B2 (en) * | 1998-06-05 | 2007-11-28 | クリーン・テクノロジー株式会社 | UV cleaning equipment |
| DE19828266C1 (en) * | 1998-06-25 | 2000-03-30 | Michael Bisges | Ultra-violet light drying system for paint, lacquer, adhesives and printing ink has air flow pattern preventing particle deposition on mirror reflectors |
| JP4218192B2 (en) * | 1999-08-05 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | Substrate processing apparatus and processing method |
| JP4682456B2 (en) * | 2001-06-18 | 2011-05-11 | 株式会社日立ハイテクノロジーズ | Substrate processing method and substrate processing apparatus |
| JP5077173B2 (en) * | 2008-09-27 | 2012-11-21 | 株式会社Ｇｓユアサ | UV irradiation treatment equipment |
-
2011
- 2011-11-25 JP JP2011256934A patent/JP5601312B2/en active Active
-
2012
- 2012-08-30 TW TW101131527A patent/TW201322355A/en unknown
- 2012-11-06 KR KR1020120124782A patent/KR20130058602A/en not_active Application Discontinuation
- 2012-11-23 CN CN201210482539.6A patent/CN103128080B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI588925B (en) * | 2015-04-16 | 2017-06-21 | Ushio Electric Inc | Light irradiation device |
| TWI774734B (en) * | 2017-04-06 | 2022-08-21 | 日商牛尾電機股份有限公司 | light irradiation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5601312B2 (en) | 2014-10-08 |
| CN103128080B (en) | 2016-06-15 |
| KR20130058602A (en) | 2013-06-04 |
| CN103128080A (en) | 2013-06-05 |
| JP2013111489A (en) | 2013-06-10 |
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