TW201320301A - Multichip package structure and light bulb using the same - Google Patents
Multichip package structure and light bulb using the same Download PDFInfo
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- TW201320301A TW201320301A TW100140328A TW100140328A TW201320301A TW 201320301 A TW201320301 A TW 201320301A TW 100140328 A TW100140328 A TW 100140328A TW 100140328 A TW100140328 A TW 100140328A TW 201320301 A TW201320301 A TW 201320301A
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本發明係有關於一種混光式多晶封裝結構及使用混光式多晶封裝結構的燈泡，尤指一種用於有效提升混光效果的混光式多晶封裝結構及使用混光式多晶封裝結構的燈泡。The invention relates to a light-mixing polycrystalline package structure and a light bulb using the mixed light polycrystalline package structure, in particular to a light-mixing polycrystalline package structure for effectively enhancing the light mixing effect and using the mixed light polycrystal. The bulb of the package structure.
發光二極體(LED)與傳統光源比較，發光二極體係具有體積小、省電、發光效率佳、壽命長、操作反應速度快、且無熱輻射與水銀等有毒物質的污染等優點，因此近幾年來，發光二極體的應用面已極為廣泛。過去由於發光二極體之亮度還無法取代傳統之照明光源，但隨著技術領域之不斷提升，目前已研發出高照明輝度之高功率發光二極體，其足以取代傳統之照明光源。然而，傳統使用發光二極體的LED燈具仍然無法有效提升整體的混光效果。故，如何藉由結構設計的改良，來提升LED燈具整體的混光效果，已成為該項事業人事之重要課題。Compared with the traditional light source, the light-emitting diode (LED) has the advantages of small volume, power saving, good luminous efficiency, long life, fast reaction speed, and no pollution of toxic substances such as heat radiation and mercury. In recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source. However, LED lamps that traditionally use LEDs still cannot effectively enhance the overall light mixing effect. Therefore, how to improve the overall light mixing effect of LED lamps by improving the structural design has become an important issue for this business.
本發明實施例在於提供一種混光式多晶封裝結構，其可用於提升混光效果並可隨著不同的使用需求來改變相對色溫。Embodiments of the present invention provide a mixed-light polycrystalline package structure that can be used to enhance a light mixing effect and can change a relative color temperature according to different usage requirements.
本發明實施例在於提供一種使用混光式多晶封裝結構的燈泡，其可用於提升混光效果並可隨著不同的使用需求來改變相對色溫。Embodiments of the present invention provide a light bulb using a light-mixing polycrystalline package structure, which can be used to enhance a light mixing effect and can change a relative color temperature with different use requirements.
本發明其中一實施例所提供的一種混光式多晶封裝結構，其包括：一基板本體、多個混光式發光群組、及一封裝膠體。其中，上述多個混光式發光群組設置於該基板本體上且電性連接於該基板本體，其中每一個混光式發光群組包括多個彼此相鄰且用於產生第一種顏色光源的第一發光元件及多個彼此相鄰且用於產生第二種顏色光源的第二發光元件。該封裝膠體成形於該基板本體上且覆蓋上述多個混光式發光群組。A light-mixing polycrystalline package structure according to one embodiment of the present invention includes: a substrate body, a plurality of light-mixing light-emitting groups, and an encapsulant. The plurality of light-mixing light-emitting groups are disposed on the substrate body and electrically connected to the substrate body, wherein each of the light-mixing light-emitting groups includes a plurality of adjacent light sources for generating a first color light source. a first illuminating element and a plurality of second illuminating elements adjacent to each other for generating a second color source. The encapsulant is formed on the substrate body and covers the plurality of mixed light-emitting groups.
本發明另外一實施例所提供的一種使用混光式多晶封裝結構的燈泡，其包括：一基座單元、一電連接單元、一發光單元、及一燈罩單元。其中，該基座單元包括一基座本體。該電連接單元的頂端連接於該基座本體的底端，且該電連接單元的底部包括至少一電連接元件。該發光單元包括一設置於該基座本體的頂端上的基板本體、多個設置於該基板本體上且電性連接於該基板本體的混光式發光群組、及一成形於該基板本體上且覆蓋上述多個混光式發光群組的封裝膠體，其中每一個混光式發光群組包括多個彼此相鄰且用於產生第一種顏色光源的第一發光元件及多個彼此相鄰且用於產生第二種顏色光源的第二發光元件。該燈罩單元包括一設置於該基座本體的頂端上且用於遮罩該發光單元的透光燈罩。Another embodiment of the present invention provides a light bulb using a light mixing polycrystalline package structure, comprising: a base unit, an electrical connection unit, a light emitting unit, and a light cover unit. Wherein, the base unit comprises a base body. The top end of the electrical connection unit is connected to the bottom end of the base body, and the bottom of the electrical connection unit includes at least one electrical connection element. The light-emitting unit includes a substrate body disposed on a top end of the base body, a plurality of light-mixing light-emitting groups disposed on the substrate body and electrically connected to the substrate body, and a light-emitting group formed on the substrate body And covering the encapsulant of the plurality of light-mixing light-emitting groups, wherein each of the light-mixing light-emitting groups comprises a plurality of first light-emitting elements adjacent to each other for generating a first color light source and a plurality of adjacent ones of each other And a second illuminating element for generating a second color source. The lampshade unit includes a light-transmitting lamp cover disposed on a top end of the base body for shielding the light-emitting unit.
綜上所述，本發明實施例所提供的混光式多晶封裝結構及使用混光式多晶封裝結構的燈泡，其可透過“將多個混光式發光群組電性連接於基板本體，其中每一個混光式發光群組包括多個彼此相鄰且用於產生第一種顏色光源的第一發光元件及多個彼此相鄰且用於產生第二種顏色光源的第二發光元件”的設計，以使得本發明能夠有效提升混光效果，並可隨著不同的使用需求來改變相對色溫。In summary, the light-mixing polycrystalline package structure and the light bulb using the mixed-light polycrystalline package structure according to the embodiments of the present invention can be electrically connected to the substrate body through a plurality of light-mixing light-emitting groups. Each of the light-mixing light-emitting groups includes a plurality of first light-emitting elements adjacent to each other for generating a first color light source and a plurality of second light-emitting elements adjacent to each other for generating a second color light source The design is such that the present invention can effectively enhance the light mixing effect and can change the relative color temperature with different use requirements.
為使能更進一步瞭解本發明之特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
請參閱圖1A至圖1C所示，本發明第一實施例提供一種混光式多晶封裝結構C，其包括：一基板本體30、多個混光式發光群組31、及一封裝膠體32。Referring to FIG. 1A to FIG. 1C , a first embodiment of the present invention provides a light-mixing polycrystalline package structure C, comprising: a substrate body 30 , a plurality of mixed light-emitting groups 31 , and an encapsulant 32 . .
首先，如圖1所示，基板本體30包括至少一第一焊墊群組30A及至少一第二焊墊群組30B。第一焊墊群組30A包括一第一正電極焊墊301A及一對應於第一正電極焊墊301A的第一負電極焊墊302A，且第二焊墊群組30B包括一第二正電極焊墊301B及一對應於第二正電極焊墊301B的第二負電極焊墊302B。舉例來說，基板本體30可為一電路基板，其上表面具有多個導電線路(圖未示)，其可電性連接於第一焊墊群組30A(及第二焊墊群組30B)與每一個相對應的混光式發光群組31之間。First, as shown in FIG. 1 , the substrate body 30 includes at least one first pad group 30A and at least one second pad group 30B. The first pad group 30A includes a first positive electrode pad 301A and a first negative electrode pad 302A corresponding to the first positive electrode pad 301A, and the second pad group 30B includes a second positive electrode. The pad 301B and a second negative electrode pad 302B corresponding to the second positive electrode pad 301B. For example, the substrate body 30 can be a circuit substrate having a plurality of conductive lines (not shown) on the upper surface thereof, which can be electrically connected to the first pad group 30A (and the second pad group 30B). Between each corresponding mixed light-emitting group 31.
再者，配合圖1A與圖1C所示，上述多個混光式發光群組31(如圖1A中，以英文字S作為每一個混光式發光群組31的代表)設置於基板本體30上且電性連接於基板本體30，其中每一個混光式發光群組31包括多個彼此相鄰且用於產生第一種顏色光源的第一發光元件31A(如圖1C中，以英文字B作為每一個第一發光元件31A的代表)及多個彼此相鄰且用於產生第二種顏色光源的第二發光元件31B(如圖1C中，以英文字R作為每一個第二發光元件31B的代表)。Furthermore, as shown in FIG. 1A and FIG. 1C, the plurality of mixed light-emitting groups 31 (in FIG. 1A, the English word S is representative of each of the mixed-light groups 31) are disposed on the substrate body 30. And electrically connected to the substrate body 30, wherein each of the mixed light-emitting groups 31 includes a plurality of first light-emitting elements 31A adjacent to each other for generating a first color light source (as shown in FIG. 1C, in English words) B is a representative of each of the first light-emitting elements 31A) and a plurality of second light-emitting elements 31B adjacent to each other for generating a second color light source (as in FIG. 1C, the English word R is used as each of the second light-emitting elements). Representative of 31B).
此外，再次配合圖1A與圖1C所示，由於第一焊墊群組30A可電性連接於上述多個第一發光元件31A，所以第一正電極焊墊301A及第一負電極焊墊302A可分別作為上述多個第一發光元件31A的正極電源輸入端及負極電源輸入端。由於第二焊墊群組30B可電性連接於上述多個第二發光元件31B，所以第二正電極焊墊301B及第二負電極焊墊302B可分別作為上述多個第二發光元件31B的正極電源輸入端及負極電源輸入端。換言之，當電流導入第一正電極焊墊301A及第一負電極焊墊302A時，上述多個第一發光元件31A即可同時被點亮；當電流導入第二正電極焊墊301B及第二負電極焊墊302B時，上述多個第二發光元件31B即可同時被點亮。In addition, as shown in FIG. 1A and FIG. 1C, the first positive electrode pad 301A and the first negative electrode pad 302A are electrically connected to the plurality of first light emitting elements 31A. The positive power supply input terminal and the negative power supply input end of the plurality of first light emitting elements 31A can be respectively used. Since the second pad group 30B is electrically connected to the plurality of second light emitting elements 31B, the second positive electrode pad 301B and the second negative electrode pad 302B can respectively serve as the plurality of second light emitting elements 31B. Positive power input and negative power input. In other words, when current is introduced into the first positive electrode pad 301A and the first negative electrode pad 302A, the plurality of first light emitting elements 31A can be simultaneously illuminated; when current is introduced into the second positive electrode pad 301B and the second In the case of the negative electrode pad 302B, the plurality of second light-emitting elements 31B can be simultaneously illuminated.
另外，配合圖1A、圖1B、及圖1C所示，每一個混光式發光群組31內的兩相鄰的第一發光元件31A與第二發光元件31B彼此分離一第一預定距離D1(如圖1C所示)，且每兩個相鄰混光式發光群組31彼此分離一第二預定距離D2(如圖1A所示)。由於第二預定距離D2遠大於第一預定距離D1，所以上述多個第一發光元件31A所產生的第一種顏色光源與上述多個第二發光元件31B所產生的第二種顏色光源可以先相互混光以產生一第一混合光源L1(如圖1B所示)，然後上述多個混光式發光群組31所產生的多個第一混合光源L可相互混光以產生一第二混合光源L2。In addition, as shown in FIG. 1A, FIG. 1B, and FIG. 1C, the two adjacent first light-emitting elements 31A and the second light-emitting elements 31B in each of the light-mixing light-emitting groups 31 are separated from each other by a first predetermined distance D1 ( As shown in FIG. 1C, and each two adjacent mixed light-emitting groups 31 are separated from each other by a second predetermined distance D2 (as shown in FIG. 1A). Since the second predetermined distance D2 is much larger than the first predetermined distance D1, the first color light source generated by the plurality of first light emitting elements 31A and the second color light source generated by the plurality of second light emitting elements 31B may be first Mixing light to each other to generate a first mixed light source L1 (as shown in FIG. 1B), and then the plurality of first mixed light sources L generated by the plurality of mixed light-emitting groups 31 can be mixed with each other to generate a second mixture. Light source L2.
舉例來說，上述多個第一發光元件31A與上述多個第二發光元件31B以彼此交錯的方式排列(如圖1C中，以英文字B、R、B、R、…所表示的排列方式)，以有效增加兩個彼此相鄰的第一發光元件31A與第二發光元件31B的混光效果。再者，每一個第一發光元件31A可為一用於產生藍色光源的藍色發光二極體裸晶片，其可透過打線或覆晶的方式以電性連接於基板本體30，且每一個第二發光元件31B可為一用於產生紅色光源的紅色發光二極體裸晶片，其可透過打線或覆晶的方式以電性連接於基板本體30。因此，多個藍色發光二極體裸晶片(多個第一發光元件31A)所產生的藍色光源(第一種顏色光源)與多個紅色發光二極體裸晶片(多個第二發光元件31B)所產生的紅色光源(第二種顏色光源)可以先相互混光以產生第一混合光源L1(如圖1B所示)，然後上述多個混光式發光群組31所產生的多個第一混合光源L可相互混光以產生第二混合光源L2。然而，上述所使用的第一發光元件31A與第二發光元件31B並非用以限定本發明，舉凡兩種以上可發出不同種類顏色光源的發光元件，皆可應用於本發明。For example, the plurality of first light-emitting elements 31A and the plurality of second light-emitting elements 31B are arranged in a staggered manner with each other (as shown in FIG. 1C, the arrangement represented by the English words B, R, B, R, . ) to effectively increase the light mixing effect of the two first light-emitting elements 31A and the second light-emitting elements 31B adjacent to each other. Furthermore, each of the first light-emitting elements 31A can be a blue light-emitting diode bare wafer for generating a blue light source, which can be electrically connected to the substrate body 30 through wire bonding or flip chip, and each of them The second light-emitting element 31B can be a red light-emitting diode bare wafer for generating a red light source, which can be electrically connected to the substrate body 30 through wire bonding or flip chip. Therefore, the blue light source (the first color light source) generated by the plurality of blue light emitting diode bare wafers (the plurality of first light emitting elements 31A) and the plurality of red light emitting diode bare wafers (the plurality of second light emitting lights) The red light source (the second color light source) generated by the element 31B) may be first mixed with each other to generate the first mixed light source L1 (as shown in FIG. 1B), and then the plurality of mixed light-emitting groups 31 are generated. The first mixed light sources L may be mixed with each other to generate a second mixed light source L2. However, the first light-emitting element 31A and the second light-emitting element 31B used in the above are not intended to limit the present invention, and two or more light-emitting elements capable of emitting light sources of different kinds of colors can be applied to the present invention.
此外，配合圖1A與圖1B所示，封裝膠體32成形於基板本體30上且覆蓋上述多個混光式發光群組31。依據不同的設計需求，封裝膠體32可為一由矽膠或環氧樹脂所形成的透明膠體。舉例來說，可先透過點膠或壓模的方式將液態矽膠或液態環氧樹脂成形於基板本體30上且覆蓋上述多個混光式發光群組31，然後再透過烘烤的方式來固化液態矽膠或液態環氧樹脂，最後即可完成上述由矽膠或環氧樹脂所形成的封裝膠體32。當然，依據不同的設計需求，封裝膠體32內亦可加入多個螢光顆粒(圖未示)以形成一螢光膠體，或者封裝膠體32內亦可加入多個光擴散顆粒(圖未示)以增加發光的均勻性。In addition, as shown in FIG. 1A and FIG. 1B, the encapsulant 32 is formed on the substrate body 30 and covers the plurality of mixed light-emitting groups 31. According to different design requirements, the encapsulant 32 can be a transparent colloid formed of silicone or epoxy. For example, the liquid silicone resin or the liquid epoxy resin may be formed on the substrate body 30 by means of dispensing or compression molding, and the plurality of light-mixing light-emitting groups 31 may be covered, and then cured by baking. The liquid silicone or liquid epoxy resin can finally complete the above-mentioned encapsulant 32 formed of silicone or epoxy resin. Of course, depending on different design requirements, a plurality of phosphor particles (not shown) may be added to the encapsulant 32 to form a phosphor colloid, or a plurality of light diffusing particles may be added to the encapsulant 32 (not shown). To increase the uniformity of luminescence.
再者，配合圖1A與圖1B所示，本發明混光式多晶封裝結構可以更進一步包括：一圍繞狀反射框體33，其設置於基板本體30上且圍繞上述多個混光式發光群組31與封裝膠體32，且封裝膠體32可接觸圍繞狀反射框體33的內表面。換言之，當圍繞狀反射框體33先被設置於基板本體30上以形成一填膠區域時，封裝膠體32就只能被容置於圍繞狀反射框體33所圍成的填膠區域內，以達到定位封裝膠體32的功能。In addition, as shown in FIG. 1A and FIG. 1B, the light-mixing polycrystalline package structure of the present invention may further include: a surrounding reflective frame 33 disposed on the substrate body 30 and surrounding the plurality of mixed light-emitting lights. The group 31 and the encapsulant 32, and the encapsulant 32 can contact the inner surface of the surrounding reflective frame 33. In other words, when the surrounding reflective frame 33 is first disposed on the substrate body 30 to form a glue filling area, the encapsulant 32 can only be accommodated in the filling area surrounded by the surrounding reflective frame 33. In order to achieve the function of positioning the encapsulant 32.
請參閱圖2所示，本發明第二實施例提供一種混光式多晶封裝結構。由圖2與圖1C的比較可知，第二實施例與第一實施例最大的差別在於：在第二實施例中，上述多個第一發光元件31A與上述多個第二發光元件31B皆以多排的方式呈現，多排的第一發光元件31A與多排的第二發光元件31B以彼此交錯的方式排列(如圖1C中，以英文字6個B、6個R、6個B、6個R、…由上到下所表示的排列方式)，其亦可有效增加兩個彼此相鄰的第一發光元件31A與第二發光元件31B的混光效果。Referring to FIG. 2, a second embodiment of the present invention provides a light mixing polycrystalline package structure. 2 and FIG. 1C, the greatest difference between the second embodiment and the first embodiment is that, in the second embodiment, the plurality of first light-emitting elements 31A and the plurality of second light-emitting elements 31B are In a multi-row manner, the plurality of rows of first light-emitting elements 31A and the plurality of rows of second light-emitting elements 31B are arranged in a staggered manner (as shown in FIG. 1C, in English words, 6 B, 6 R, 6 B, The arrangement of the six R, ... from top to bottom) can also effectively increase the light mixing effect of the two first light-emitting elements 31A and the second light-emitting elements 31B adjacent to each other.
請參閱圖3所示，本發明第三實施例提供一種混光式多晶封裝結構。由圖3與圖1C的比較可知，第三實施例與第一實施例最大的差別在於：在第三實施例中，每一個混光式發光群組31更進一步包括多個彼此相鄰且用於產生第三種顏色光源的第三發光元件31C(如圖3中，以英文字G作為每一個第三發光元件31C的代表)。因此，上述多個第一發光元件31A所產生的第一種顏色光源、上述多個第二發光元件31B所產生的第二種顏色光源、及上述多個第三發光元件31C所產生的第三種顏色光源可以先相互混光以產生一第一混合光源(圖未示)，然後上述多個混光式發光群組31所產生的多個第一混合光源(圖未示)可相互混光以產生一第二混合光源(圖未示)。Referring to FIG. 3, a third embodiment of the present invention provides a light mixing polycrystalline package structure. It can be seen from the comparison between FIG. 3 and FIG. 1C that the biggest difference between the third embodiment and the first embodiment is that in the third embodiment, each of the mixed light-emitting groups 31 further includes a plurality of adjacent and adjacent to each other. The third light-emitting element 31C that generates the third color light source (as in Fig. 3, the English word G is used as a representative of each of the third light-emitting elements 31C). Therefore, the first color light source generated by the plurality of first light-emitting elements 31A, the second color light source generated by the plurality of second light-emitting elements 31B, and the third color generated by the plurality of third light-emitting elements 31C The color light sources may first be mixed with each other to generate a first mixed light source (not shown), and then the plurality of first mixed light sources (not shown) generated by the plurality of mixed light-emitting groups 31 may be mixed with each other. To produce a second hybrid light source (not shown).
舉例來說，上述多個第一發光元件31A、上述多個第二發光元件31B、及上述多個第三發光元件31C以彼此交錯的方式排列(如圖3中，以英文字R、G、B、R、G、B、…所表示的排列方式)，以有效增加三個彼此相鄰的第一發光元件31A、第二發光元件31B、及第三發光元件31C的混光效果。再者，每一個第一發光元件31A可為一用於產生藍色光源的藍色發光二極體裸晶片，其可透過打線或覆晶的方式以電性連接於基板本體30，每一個第二發光元件31B可為一用於產生紅色光源的紅色發光二極體裸晶片，其可透過打線或覆晶的方式以電性連接於基板本體30，且每一個第三發光元件31C可為一用於產生綠色光源的綠色發光二極體裸晶片，其可透過打線或覆晶的方式以電性連接於基板本體30。For example, the plurality of first light-emitting elements 31A, the plurality of second light-emitting elements 31B, and the plurality of third light-emitting elements 31C are arranged in a staggered manner (as shown in FIG. 3, in English words R, G, The arrangement shown by B, R, G, B, ...) effectively increases the light mixing effect of the three first light-emitting elements 31A, the second light-emitting elements 31B, and the third light-emitting elements 31C which are adjacent to each other. Furthermore, each of the first light-emitting elements 31A can be a blue light-emitting diode bare wafer for generating a blue light source, which can be electrically connected to the substrate body 30 through wire bonding or flip chip bonding, each of which is The second light-emitting element 31B can be a red light-emitting diode bare chip for generating a red light source, which can be electrically connected to the substrate body 30 through wire bonding or flip chip, and each of the third light-emitting elements 31C can be one. The green light emitting diode bare chip for generating a green light source is electrically connected to the substrate body 30 by wire bonding or flip chip bonding.
因此，多個藍色發光二極體裸晶片(多個第一發光元件31A)所產生的藍色光源(第一種顏色光源)、多個紅色發光二極體裸晶片(多個第二發光元件31B)所產生的紅色光源(第二種顏色光源)、及多個綠色發光二極體裸晶片(多個第三發光元件31C)所產生的綠色光源(第三種顏色光源)可以先相互混光以產生第一混合光源(圖未示)，然後上述多個混光式發光群組31所產生的多個第一混合光源(圖未示)可相互混光以產生第二混合光源(圖未示)，其即為白色光源。然而，上述所使用的第一發光元件31A、第二發光元件31B、及第三發光元件31C並非用以限定本發明，舉凡兩種以上可發出不同種類顏色光源的發光元件，皆可應用於本發明。Therefore, the blue light source (the first color light source) generated by the plurality of blue light emitting diode bare wafers (the plurality of first light emitting elements 31A) and the plurality of red light emitting diode bare wafers (the plurality of second light emitting lights) The red light source (the second color light source) generated by the element 31B) and the green light source (the third color light source) generated by the plurality of green light emitting diode bare chips (the plurality of third light emitting elements 31C) may first Mixing light to generate a first mixed light source (not shown), and then a plurality of first mixed light sources (not shown) generated by the plurality of mixed light-emitting groups 31 can be mixed with each other to generate a second mixed light source ( The figure is not shown), which is a white light source. However, the first light-emitting element 31A, the second light-emitting element 31B, and the third light-emitting element 31C used in the above are not intended to limit the present invention, and two or more light-emitting elements that can emit light sources of different kinds of colors can be applied to the present invention. invention.
請參閱圖4A及圖4B所示，本發明第四實施例提供一種使用混光式多晶封裝結構C的燈泡Z，其包括：一基座單元1、一電連接單元2、一發光單元3、及一燈罩單元4。Referring to FIG. 4A and FIG. 4B , a fourth embodiment of the present invention provides a bulb Z using a light-mixing polycrystalline package structure C, comprising: a base unit 1 , an electrical connection unit 2 , and an illumination unit 3 . And a lampshade unit 4.
首先，基座單元1包括一基座本體10。舉例來說，基座本體10可由一散熱本體101及多個圍繞散熱本體101且設置在散熱本體101外周圍上的散熱鰭片102所組成，且上述多個散熱鰭片102可透過一體成型的方式設置於散熱本體101的外周圍上。然而，上述有關基座本體10的界定只是用來舉例而已，其並非用以限定本發明。First, the base unit 1 includes a base body 10. For example, the base body 10 can be composed of a heat dissipation body 101 and a plurality of heat dissipation fins 102 surrounding the heat dissipation body 101 and disposed on the outer periphery of the heat dissipation body 101, and the plurality of heat dissipation fins 102 can be integrally formed. The method is disposed on the outer circumference of the heat dissipation body 101. However, the above definition of the base body 10 is for illustrative purposes only and is not intended to limit the invention.
再者，電連接單元2的頂端連接於基座本體10的底端，且電連接單元2的底部包括至少一電連接元件20。舉例來說，電連接元件20可為一表面具有鎖固螺紋200的電連接器(但不以此為限)，因此本發明可透過上述具有鎖固螺紋200之電連接元件20的使用，將燈泡Z以旋轉的方式鎖固於一供電插槽(圖未示)上，以使得電連接元件20可取得供電插槽(圖未示)的電源供應。再者，電連接單元2還包括至少一設置於基座本體10內的驅動積體電路模組21。驅動積體電路模組21電性連接於電連接元件20與發光單元3之間，以用於電性控制發光單元3。例如：驅動積體電路模組21可用於將交流電(AC)轉換成直流電(DC)，以提供給發光單元3使用。由於交流電可直接轉換成直流電來供應給發光單元3使用，所以本發明可以明顯降低電路的複雜性和功率的損失。Furthermore, the top end of the electrical connection unit 2 is connected to the bottom end of the base body 10, and the bottom of the electrical connection unit 2 includes at least one electrical connection element 20. For example, the electrical connection component 20 can be an electrical connector having a locking thread 200 on the surface (but not limited thereto). Therefore, the present invention can be used through the use of the electrical connection component 20 having the locking thread 200 described above. The bulb Z is rotatably locked to a power supply slot (not shown) such that the electrical connection component 20 can obtain a power supply to a power supply slot (not shown). Furthermore, the electrical connection unit 2 further includes at least one driving integrated circuit module 21 disposed in the base body 10. The driving integrated circuit module 21 is electrically connected between the electrical connecting component 20 and the light emitting unit 3 for electrically controlling the light emitting unit 3. For example, the driving integrated circuit module 21 can be used to convert alternating current (AC) into direct current (DC) for use by the light emitting unit 3. Since the alternating current can be directly converted into direct current to be supplied to the light emitting unit 3, the present invention can significantly reduce the complexity of the circuit and the loss of power.
另外，發光單元3包括一設置於基座本體10的頂端上的基板本體30、多個設置於基板本體30上且電性連接於基板本體30的混光式發光群組31、及一成形於基板本體30上且覆蓋上述多個混光式發光群組31的封裝膠體32。每一個混光式發光群組31包括多個彼此相鄰且用於產生第一種顏色光源的第一發光元件31A(如圖1C所示)及多個彼此相鄰且用於產生第二種顏色光源的第二發光元件31B(如圖1C所示)，且基板本體30包括至少一電性連接於上述多個第一發光元件31A的第一焊墊群組30A及至少一電性連接於上述多個第二發光元件31B的第二焊墊群組30B，其中第一焊墊群組30A包括一第一正電極焊墊301A及一對應於第一正電極焊墊301A的第一負電極焊墊302A，且第二焊墊群組30B包括一第二正電極焊墊301B及一對應於第二正電極焊墊301B的第二負電極焊墊302B。In addition, the light-emitting unit 3 includes a substrate body 30 disposed on the top end of the base body 10, a plurality of light-mixing light-emitting groups 31 disposed on the substrate body 30 and electrically connected to the substrate body 30, and a formed The encapsulant 32 of the plurality of light-mixing light-emitting groups 31 is covered on the substrate body 30. Each of the mixed light-emitting groups 31 includes a plurality of first light-emitting elements 31A (shown in FIG. 1C) adjacent to each other for generating a first color light source and a plurality of adjacent to each other and for generating a second type a second light-emitting element 31B of the color light source (as shown in FIG. 1C ), and the substrate body 30 includes at least one first pad group 30A electrically connected to the plurality of first light-emitting elements 31A and at least one electrically connected to The second pad group 30B of the plurality of second light-emitting elements 31B, wherein the first pad group 30A includes a first positive electrode pad 301A and a first negative electrode corresponding to the first positive electrode pad 301A The pad 302A, and the second pad group 30B includes a second positive electrode pad 301B and a second negative electrode pad 302B corresponding to the second positive electrode pad 301B.
再者，發光單元3可更進一步包括一圍繞狀反射框體33，其可設置於基板本體30上且圍繞上述多個混光式發光群組31與封裝膠體32，且封裝膠體32可接觸圍繞狀反射框體33的內表面。換言之，當圍繞狀反射框體33先被設置於基板本體30上以形成一填膠區域時，封裝膠體32就只能被容置於圍繞狀反射框體33所圍成的填膠區域內，以達到定位封裝膠體32的功能。In addition, the light-emitting unit 3 can further include a surrounding reflective frame 33, which can be disposed on the substrate body 30 and surrounds the plurality of light-mixing light-emitting groups 31 and the encapsulant 32, and the encapsulant 32 can be contacted around. The inner surface of the frame 33 is reflected. In other words, when the surrounding reflective frame 33 is first disposed on the substrate body 30 to form a glue filling area, the encapsulant 32 can only be accommodated in the filling area surrounded by the surrounding reflective frame 33. In order to achieve the function of positioning the encapsulant 32.
此外，燈罩單元4包括一設置於基座本體10的頂端上且用於遮罩發光單元3的透光燈罩40。舉例來說，透光燈罩40的底部可與基座本體10的頂端相互配合，以使得透光燈罩40被固定在基座本體10上。此外，透光燈罩40內可以混有具有均光效果的擴散粉，以增加本發明燈泡Z投光時的均勻性。In addition, the lamp cover unit 4 includes a light-transmitting lamp cover 40 that is disposed on the top end of the base body 10 and that covers the light-emitting unit 3. For example, the bottom of the light-transmitting lamp cover 40 can cooperate with the top end of the base body 10 such that the light-transmitting lamp cover 40 is fixed on the base body 10. In addition, a diffusing powder having a uniform light effect may be mixed in the light-transmitting lamp cover 40 to increase the uniformity of the bulb Z of the present invention when it is projected.
綜上所述，本發明實施例所提供的混光式多晶封裝結構及使用混光式多晶封裝結構的燈泡，其可透過“將多個混光式發光群組電性連接於基板本體，其中每一個混光式發光群組包括多個彼此相鄰且用於產生第一種顏色光源的第一發光元件及多個彼此相鄰且用於產生第二種顏色光源的第二發光元件”的設計，以使得本發明能夠有效提升混光效果，並可隨著不同的使用需求來改變相對色溫。In summary, the light-mixing polycrystalline package structure and the light bulb using the mixed-light polycrystalline package structure according to the embodiments of the present invention can be electrically connected to the substrate body through a plurality of light-mixing light-emitting groups. Each of the light-mixing light-emitting groups includes a plurality of first light-emitting elements adjacent to each other for generating a first color light source and a plurality of second light-emitting elements adjacent to each other for generating a second color light source The design is such that the present invention can effectively enhance the light mixing effect and can change the relative color temperature with different use requirements.
以上所述僅為本發明之較佳可行實施例，非因此侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之等效技術變化，均包含於本發明之範圍內。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.
Z．．．燈泡Z. . . light bulb
C．．．混光式多晶封裝結構C. . . Mixed light polycrystalline package structure
1．．．基座單元1. . . Base unit
10．．．基座本體10. . . Base body
101．．．散熱本體101. . . Heat sink body
102．．．散熱鰭片102. . . Heat sink fin
2．．．電連接單元2. . . Electrical connection unit
20．．．電連接元件20. . . Electrical connection element
200．．．鎖固螺紋200. . . Locking thread
21．．．驅動積體電路模組twenty one. . . Driving integrated circuit module
3．．．發光單元3. . . Light unit
30．．．基板本體30. . . Substrate body
30A．．．第一焊墊群組30A. . . First pad group
301A．．．第一正電極焊墊301A. . . First positive electrode pad
302A．．．第一負電極焊墊302A. . . First negative electrode pad
30B．．．第二焊墊群組30B. . . Second pad group
301B．．．第二正電極焊墊301B. . . Second positive electrode pad
302B．．．第二負電極焊墊302B. . . Second negative electrode pad
31．．．混光式發光群組31. . . Mixed light group
31A．．．第一發光元件31A. . . First illuminating element
31B．．．第二發光元件31B. . . Second illuminating element
32．．．封裝膠體32. . . Encapsulant
33．．．圍繞狀反射框體33. . . Revolving frame
4．．．燈罩單元4. . . Shade unit
40．．．透光燈罩40. . . Light-transmitting lampshade
圖1A為本發明第一實施例的混光式多晶封裝結構的上視示意圖。1A is a top plan view of a light-mixing polycrystalline package structure according to a first embodiment of the present invention.
圖1B為圖1A的1B-1B割面線的剖面示意圖。1B is a schematic cross-sectional view of the cut line of 1B-1B of FIG. 1A.
圖1C為本發明第一實施例的混光式多晶封裝結構的混光式發光群組的上視示意圖。1C is a top plan view of a light mixing type light emitting group of a light mixing type polycrystalline package structure according to a first embodiment of the present invention.
圖2為本發明第二實施例的混光式多晶封裝結構的混光式發光群組的上視示意圖。2 is a top plan view of a light-mixing light-emitting group of a light-mixing polycrystalline package structure according to a second embodiment of the present invention.
圖3為本發明第三實施例的混光式多晶封裝結構的混光式發光群組的上視示意圖。3 is a top plan view of a light mixing type light emitting group of a light mixing type polycrystalline package structure according to a third embodiment of the present invention.
圖4A為本發明第四實施例的混光式多晶封裝結構使用於燈泡的部分立體分解示意圖。4A is a partially exploded perspective view showing a light-mixing polycrystalline package structure used in a bulb according to a fourth embodiment of the present invention.
圖4B為本發明第四實施例的混光式多晶封裝結構使用於燈泡的立體組合示意圖。4B is a perspective view of a three-dimensional combination of a light-mixing polycrystalline package structure used in a bulb according to a fourth embodiment of the present invention.
Z．．．燈泡Z. . . light bulb
C．．．混光式多晶封裝結構C. . . Mixed light polycrystalline package structure
1．．．基座單元1. . . Base unit
10．．．基座本體10. . . Base body
101．．．散熱本體101. . . Heat sink body
102．．．散熱鰭片102. . . Heat sink fin
2．．．電連接單元2. . . Electrical connection unit
20．．．電連接元件20. . . Electrical connection element
200．．．鎖固螺紋200. . . Locking thread
21．．．驅動積體電路模組twenty one. . . Driving integrated circuit module
3．．．發光單元3. . . Light unit
30．．．基板本體30. . . Substrate body
30A．．．第一焊墊群組30A. . . First pad group
301A．．．第一正電極焊墊301A. . . First positive electrode pad
302A．．．第一負電極焊墊302A. . . First negative electrode pad
30B．．．第二焊墊群組30B. . . Second pad group
301B．．．第二正電極焊墊301B. . . Second positive electrode pad
302B．．．第二負電極焊墊302B. . . Second negative electrode pad
31．．．混光式發光群組31. . . Mixed light group
32．．．封裝膠體32. . . Encapsulant
33．．．圍繞狀反射框體33. . . Revolving frame
4．．．燈罩單元4. . . Shade unit
40．．．透光燈罩40. . . Light-transmitting lampshade
Claims (10)
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| Publication Number | Publication Date |
|---|---|
| TW201320301A true TW201320301A (en) | 2013-05-16 |
Family
ID=48872633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100140328A TW201320301A (en) | 2011-11-04 | 2011-11-04 | Multichip package structure and light bulb using the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201320301A (en) |
-
2011
- 2011-11-04 TW TW100140328A patent/TW201320301A/en unknown
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