TW201313085A - Circuit board with embedded conductive elements and usage thereof - Google Patents
Circuit board with embedded conductive elements and usage thereof Download PDFInfo
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- TW201313085A TW201313085A TW100132055A TW100132055A TW201313085A TW 201313085 A TW201313085 A TW 201313085A TW 100132055 A TW100132055 A TW 100132055A TW 100132055 A TW100132055 A TW 100132055A TW 201313085 A TW201313085 A TW 201313085A
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Abstract
Description
本發明係有關於電路板嵌入式元件，尤指一種可應用於傳輸大電流之具有嵌入式導電元件之電路板。The present invention relates to circuit board embedded components, and more particularly to a circuit board having embedded conductive components that can be used to transmit large currents.
現有技術之電路板嵌入式元件係作為導熱之用途，如台灣公開編號第200948258號「電路板嵌入式導熱元件製程方法」專利申請案，其係於一電路板上貫穿形成有一安裝孔，並在該安裝孔的內電鍍有一第一電鍍層，係將一導熱元件迫緊嵌入於安裝孔內，且導熱元件周緣向外突伸形成有複數迫緊塊，該等迫緊塊緊密頂抵於安裝孔之第一電鍍層，最後，在安裝孔內電鍍有一覆蓋於第一電鍍層的第二電鍍層，該第二電鍍層附著於導熱元件之迫緊塊上而與迫緊塊緊密連接。The prior art circuit board embedded component is used for heat conduction, such as the patent application of Taiwan Patent Publication No. 200948258, "Processing Method of Embedded Thermal Conductive Component of Circuit Board", which is formed by inserting a mounting hole in a circuit board, and A first plating layer is plated in the mounting hole, and a heat conducting component is tightly embedded in the mounting hole, and a peripheral edge of the heat conducting component protrudes outward to form a plurality of pressing blocks, and the pressing blocks are tightly mounted against the mounting. The first plating layer of the hole is finally plated with a second plating layer covering the first plating layer in the mounting hole, and the second plating layer is attached to the pressing block of the heat conducting member to be tightly connected to the pressing block.
上述電路板嵌入式導熱元件提供負載於電路板上的半導體晶片接觸於導熱元件一側的表面，而導熱元件的另一側表面接觸有散熱元件(如：散熱塊)，藉此，半導體晶片在運轉工作時所產生的熱能可傳導至導熱元件，再透過導熱元件傳導至散熱元件進而達成熱交換及散熱作業，以避免半導體晶片因工作溫度過熱而影響工作效率；然而，上述電路板嵌入式導熱元件僅提供熱能傳導之用途而無其他應用，故有待加以開發。The embedded heat conducting component of the circuit board provides a surface of the semiconductor chip supported on the circuit board contacting a surface of the heat conducting component, and the other side surface of the heat conducting component contacts a heat dissipating component (eg, a heat sink), whereby the semiconductor wafer is The heat generated during the operation can be conducted to the heat-conducting component, and then transmitted to the heat-dissipating component through the heat-conducting component to achieve heat exchange and heat dissipation operations, so as to prevent the semiconductor wafer from affecting the working efficiency due to overheating of the working temperature; however, the above-mentioned circuit board is embedded with heat conduction. The components are only used for thermal conduction and have no other application, so they need to be developed.
有鑑於前述現有技術之缺點，本發明之目的係在於提供一種具有嵌入式導電元件之電路板及其用途，藉由電路板上嵌入式有導電元件可應用於傳輸大電流，因而增廣電路板嵌入式元件的應用層面及範圍。In view of the foregoing shortcomings of the prior art, the object of the present invention is to provide a circuit board having an embedded conductive component and a use thereof, wherein a conductive element embedded in the circuit board can be applied to transmit a large current, thereby augmenting the circuit board. The application level and scope of embedded components.
為達到前述之發明目的，本發明所設計之具有嵌入式導電元件之電路板，其具有一電路板本體，該電路板本體上以嵌入方法設有至少一導電元件，每一導電元件與設置在電路板本體上的兩電子元件相互連接，以提供兩電子元件間的電流傳送。In order to achieve the foregoing object, a circuit board having an embedded conductive component designed by the present invention has a circuit board body, and the circuit board body is provided with at least one conductive component by an embedding method, and each conductive component is disposed at The two electronic components on the body of the board are interconnected to provide current transfer between the two electronic components.
所述之具有嵌入式導電元件之電路板，其中該導電元件係以銅材製成。The circuit board having the embedded conductive component, wherein the conductive component is made of copper.
所述之具有嵌入式導電元件之電路板，其中該兩電子元件分別為晶片與電連接器。The circuit board has embedded conductive elements, wherein the two electronic components are respectively a wafer and an electrical connector.
所述之具有嵌入式導電元件之電路板，其中該電路板本體上設有IC訊號精密傳輸電路。The circuit board has an embedded conductive component, wherein the circuit board body is provided with an IC signal precision transmission circuit.
所述之具有嵌入式導電元件之電路板，其中該電路板本體上貫穿形成有一安裝孔，該安裝孔內電鍍有一電鍍層，將該導電元件迫緊嵌入於安裝孔內，且導電元件周緣突伸有複數迫緊塊，該迫緊塊緊抵於安裝孔之電鍍層。The circuit board has an embedded conductive component, wherein a mounting hole is formed in the circuit board body, and a plating layer is plated in the mounting hole, and the conductive component is tightly embedded in the mounting hole, and the conductive component protrudes from the periphery Extending a plurality of pressing blocks that abut against the plating of the mounting holes.
所述之具有嵌入式導電元件之電路板中，該電路板本體上貫穿形成有一安裝孔，該安裝孔內電鍍有一電鍍層，該導電元件迫緊嵌入於安裝孔內，且導電元件之周緣緊抵於安裝孔之電鍍層。In the circuit board having the embedded conductive component, a mounting hole is formed in the circuit board body, and the plating hole is plated with a plating layer, the conductive component is tightly embedded in the mounting hole, and the circumference of the conductive component is tight Corresponding to the plating layer of the mounting hole.
一種所述之電路板之用途，其用來提供電路板本體上所設的兩電子元件可透過導電元件彼此傳輸電流。The use of the circuit board described above for providing two electronic components disposed on a circuit board body to transmit current to each other through the conductive elements.
一種所述之電路板之用途，其用來提供電路板本體上所設的電子元件透過導電元件與該電路板本體的線路傳輸電流。The use of the circuit board for providing an electronic component disposed on a circuit board body to transmit current through a conductive element and a line of the circuit board body.
本發明所提供之具有嵌入式導電元件之電路板，可以獲得的優點及功效增進至少包括：兩電子元件可透過導電元件達到傳輸大電流之效果，以配合不同電子設備之運作需求。The circuit board with embedded conductive elements provided by the present invention can achieve advantages and enhancements including at least two electronic components that can transmit large current through the conductive elements to meet the operational requirements of different electronic devices.
請參閱圖1及2所示，本發明之具有嵌入式導電元件之電路板，其具有一電路板本體10及至少一導電元件20，該電路板本體10上以嵌入方法設有該導電元件20，較佳的具體實施例為，該導電元件20係以具高導電特性的銅材製成，於電路板本體10的線路上且相鄰於每一導電元件20之間間隔連接有兩電子元件，藉此提供該兩電子元件可透過該導電元件20達到彼此傳輸大電流之效果，以配合不同電子設備之運作需求。Referring to FIGS. 1 and 2, a circuit board having an embedded conductive component of the present invention has a circuit board body 10 and at least one conductive component 20, and the conductive component 20 is disposed on the circuit board body 10 by an embedded method. In a preferred embodiment, the conductive element 20 is made of a copper material having high electrical conductivity, and two electronic components are spaced apart from each other on the line of the circuit board body 10 and adjacent to each of the conductive elements 20. Thereby, the two electronic components can be transmitted through the conductive component 20 to achieve a large current transmission effect to meet the operational requirements of different electronic devices.
圖中所示的其中一種實施例，在電路板本體10上所設的該兩電子元件可分別為晶片30與電連接器30A，又電路板本體10上設有IC訊號精密傳輸電路(圖中未示)，提供晶片30可透過該傳輸電路達到傳輸IC訊號之效果，其中該晶片30與電連接器30A的一端分別與電路板本體10的線路連接，又該晶片30與電連接器30A的另一端連接在導電元件20上；上述導電元件20嵌入在電路板本體10的結合固定方法為現有技術，即於該電路板本體10上貫穿形成有一安裝孔11，該安裝孔11內電鍍有一電鍍層，該導電元件20係迫緊嵌入結合於安裝孔11內，且導電元件20周緣可突伸有複數迫緊塊，該等迫緊塊緊抵於安裝孔11之電鍍層，使兩者之間的結合更為穩固。此外，該導電元件20亦可設計為未成型有該等迫緊塊，俾使該導電元件20之周緣直接緊抵於安裝孔11之電鍍層，以增加該導電元件20與該安裝孔11之電鍍層的接觸面積，進而達到傳輸大電流之效果。In one embodiment shown in the figure, the two electronic components disposed on the circuit board body 10 can be a chip 30 and an electrical connector 30A, respectively, and the circuit board body 10 is provided with an IC signal precision transmission circuit (in the figure). The chip 30 can provide the effect of transmitting the IC signal through the transmission circuit, wherein one end of the chip 30 and the electrical connector 30A are respectively connected to the circuit of the circuit board body 10, and the wafer 30 and the electrical connector 30A are connected. The other end is connected to the conductive member 20; the method for bonding and fixing the conductive member 20 to the circuit board body 10 is a prior art, that is, a mounting hole 11 is formed in the circuit board body 10, and a plating hole is plated in the mounting hole 11. The conductive element 20 is tightly embedded in the mounting hole 11 , and a plurality of pressing blocks protrude from the periphery of the conductive element 20 , and the pressing blocks abut against the plating layer of the mounting hole 11 to make the two The combination between the two is more stable. In addition, the conductive element 20 can also be designed such that the pressing blocks are not formed, so that the periphery of the conductive element 20 directly abuts the plating layer of the mounting hole 11 to increase the conductive element 20 and the mounting hole 11 The contact area of the plating layer, in turn, achieves the effect of transmitting a large current.
本發明在電路板本體10上嵌合固定有導電元件20係運用在電路板本體10上所設置的電子元件間，並可提供電子元件以大電流相互傳輸之用。In the present invention, the conductive member 20 is fitted and fixed on the circuit board body 10 to be used between the electronic components provided on the circuit board body 10, and the electronic components can be transmitted to each other with a large current.
10．．．電路板本體10. . . Board body
11．．．安裝孔11. . . Mounting holes
20．．．導電元件20. . . Conductive component
30．．．晶片30. . . Wafer
30A．．．電連接器30A. . . Electrical connector
圖1係本發明之俯視示意圖。Figure 1 is a top plan view of the present invention.
圖2係本發明之剖面示意圖。Figure 2 is a schematic cross-sectional view of the present invention.
10．．．電路板本體10. . . Board body
20．．．導電元件20. . . Conductive component
30．．．晶片30. . . Wafer
30A．．．電連接器30A. . . Electrical connector
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100132055A TW201313085A (en) | 2011-09-06 | 2011-09-06 | Circuit board with embedded conductive elements and usage thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100132055A TW201313085A (en) | 2011-09-06 | 2011-09-06 | Circuit board with embedded conductive elements and usage thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201313085A true TW201313085A (en) | 2013-03-16 |
Family
ID=48482743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100132055A TW201313085A (en) | 2011-09-06 | 2011-09-06 | Circuit board with embedded conductive elements and usage thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201313085A (en) |
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2011
- 2011-09-06 TW TW100132055A patent/TW201313085A/en unknown
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