TW201312225A - Back-light unit and LCD using the same - Google Patents
Back-light unit and LCD using the same Download PDFInfo
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Abstract
Description
本發明係有關一種背光單元以及使用該背光單元之一液晶顯示器(liquid crystal display，LCD)；其係可藉由去除一導光板結構，使背光單元之結構輕薄的同時，亦能維繫其光效率。The present invention relates to a backlight unit and a liquid crystal display (LCD) using the same, which can reduce the structure of the backlight unit and lightly maintain the light efficiency thereof while removing the structure of the light guide plate. .
一種液晶顯示器(LCD)係一種能夠根據影像資訊個別地提供資料訊號(data signals)給排列於矩陣陣列(matrix form)中之畫素(pixels)，以控制畫素之透光率(optical transmittance)。然而，因為LCD本身並不發光，故一背光單元係被裝設於該LCD之一後表面，以顯示一影像。A liquid crystal display (LCD) is a type of pixels that can individually provide data signals according to image information to pixels arranged in a matrix form to control the optical transmittance of pixels. . However, since the LCD itself does not emit light, a backlight unit is mounted on the rear surface of one of the LCDs to display an image.
參閱圖1，一背光單元1係構成以包括一平面導光板30於一基板20之上，且複數個側發光式發光二極體10(side view LED)(圖中僅繪示一LED)係以一陣列型被排列於導光板30之一側。Referring to FIG. 1 , a backlight unit 1 is configured to include a planar light guide plate 30 on a substrate 20 , and a plurality of side view LEDs (only one LED is shown). They are arranged on one side of the light guide plate 30 in an array type.
自LED 10入射於導光板30之光線L係由一微反射結構(fine reflection pattern)或設置於導光板30之一底面上之一反射板40向上反射，然後自導光板30發出。然後，背光係被提供給一LCD面板50覆蓋在導光板30之上。The light L incident on the light guide plate 30 from the LED 10 is reflected upward by a fine reflection pattern or a reflection plate 40 disposed on one of the bottom surfaces of the light guide plate 30, and then emitted from the light guide plate 30. Then, the backlight is supplied to an LCD panel 50 over the light guide plate 30.
如圖2所示，該背光單元可形成為具有一結構，其係進一步將複數個光學片如一擴散片31(diffusion sheet)；稜鏡片32、33(prism sheets)；以及一保護片34等等設置於導光板30與LCD面板50之間。As shown in FIG. 2, the backlight unit can be formed to have a structure, which further includes a plurality of optical sheets such as a diffusion sheet 31; prism sheets 32, 33 (prism sheets); and a protective sheet 34, etc. It is disposed between the light guide plate 30 and the LCD panel 50.
該背光單元係用以從該LCD之背面均勻地照明該LCD(該LCD無法自行發光)來顯示一影像。另，該導光板係為可均勻地將光自一光源(LED)傳送至該LCD之一整體表面的一種塑膠模製鏡片，並係具有提供均勻照明於該背光單元之功能。因此，基本上，該導光板係作為背光單元之一必要組成部件。結果是，因為導光板之厚度的關係，其產品之整體厚度受到限制。又，當背光單元為大面積時，影像品質可能會下降。The backlight unit is configured to uniformly illuminate the LCD from the back side of the LCD (the LCD cannot emit light by itself) to display an image. In addition, the light guide plate is a plastic molded lens that can uniformly transmit light from a light source (LED) to an integral surface of the LCD, and has a function of providing uniform illumination to the backlight unit. Therefore, basically, the light guide plate is an essential component of one of the backlight units. As a result, the overall thickness of the product is limited because of the thickness of the light guide plate. Also, when the backlight unit has a large area, the image quality may be degraded.
另外，在習知技術中用以擴散光至背光單元的一擴散板或一擴散片31係具有一遮光微結構(light shielding pattern)，以避免光的匯聚。該遮光微結構係使用Ag來實施一遮光效果(light shielding effect)。然而，使用Ag並實施遮光效果之遮光微結構，因一微結構部分完全屏蔽光線，使其很難達到整體的光均勻度：進而因黃光自LED光源本身生成，而降低發出白光背光單元之可靠度。In addition, a diffusion plate or a diffusion sheet 31 for diffusing light to the backlight unit in the prior art has a light shielding pattern to avoid convergence of light. The light-shielding microstructure uses Ag to implement a light shielding effect. However, the use of Ag and the shading effect of the shading microstructure, because a microstructure part completely shields the light, making it difficult to achieve the overall light uniformity: in turn, due to the yellow light generated from the LED light source itself, the white light backlight unit is reduced. Reliability.
本發明之一方面係關於一種背光單元以及使用該背光單元之一LCD，其係可去除在習知背光單元中為必要元件的一導光板，並形成使用以寡聚物為主要組成物之樹脂來導光之一結構，藉此減少光源的數目，使背光單元之整體厚度縮小，並提升產品設計之自由度，確保其張力強度(tensile strength)、恆溫及恆濕之可靠度、及耐熱可靠度。One aspect of the present invention relates to a backlight unit and an LCD using the same, which can remove a light guide plate which is an essential component in a conventional backlight unit, and form a resin using an oligomer as a main component. To guide one of the light structures, thereby reducing the number of light sources, reducing the overall thickness of the backlight unit, and increasing the freedom of product design, ensuring its tensile strength, constant temperature and constant humidity reliability, and heat resistance reliability. degree.
另外，本發明之另一方面係關於一種背光單元，其係可藉由施用能實施光學微結構之遮光墨水以遮光或擴散光至背光單元之一擴散片之一表面來得到光品質之可靠度，並確保光均勻度、經由一擴散微結構與一金屬微結構之結合而實施一屏蔽黃光之效果。In addition, another aspect of the present invention relates to a backlight unit which can obtain light quality reliability by applying a light-shielding ink capable of implementing an optical microstructure to shield or diffuse light to one surface of one of the diffusion sheets of the backlight unit. And to ensure the uniformity of light, through the combination of a diffusion microstructure and a metal microstructure to achieve a shielding yellow light effect.
根據本發明一實施例，提供一種結構，其係藉由去除習知背光單元中一導光板、形成使用寡聚物為主要組成物之樹脂、以及一高分子型樹脂如聚丙烯(poly acryl)According to an embodiment of the present invention, a structure is provided by removing a light guide plate in a conventional backlight unit, forming a resin using an oligomer as a main composition, and a polymer type resin such as polyacryl.
根據本發明另一實施例，提供一種背光單元，其進一步包含有：複數個LED光源設置於一印刷電路板之上，藉此由形成包括一光學微結構的一擴散片之光屏蔽及擴散，來增加光效率；一樹脂層堆疊於一結構，其中該LED光源係嵌入於該結構，以將光擴散並導引向前；以及一擴散片，其係形成於該樹脂層之頂面上，且其上印刷有光學微結構，可屏蔽或反射光。According to another embodiment of the present invention, a backlight unit is provided, further comprising: a plurality of LED light sources disposed on a printed circuit board, thereby shielding and diffusing light formed by a diffusion sheet including an optical microstructure; To increase light efficiency; a resin layer is stacked on a structure in which the LED light source is embedded in the structure to diffuse and guide the light forward; and a diffusion sheet is formed on the top surface of the resin layer. And an optical microstructure is printed thereon to shield or reflect light.
如上所述，本發明之實施例係提供一種可去除在習知背光單元中為必要元件的一導光板，並形成使用以寡聚物為主要組成物之樹脂來導光之一結構，藉此減少光源的數目，使背光單元之整體厚度縮小，並提升產品設計之自由度，確保其張力強度、恆溫及恆濕之可靠度、及耐熱可靠度。As described above, the embodiment of the present invention provides a light guide plate which can remove necessary elements in a conventional backlight unit, and forms a structure for guiding light using a resin having an oligomer as a main component, whereby The number of light sources is reduced, the overall thickness of the backlight unit is reduced, and the degree of freedom in product design is improved, and the tensile strength, the reliability of constant temperature and constant humidity, and the heat resistance reliability are ensured.
尤其，本發明之實施例係可組成使用寡聚型與高分子型混合之樹脂層，以改善生產力與寡聚型之可靠度，並改善高分子型之黏著性質，進而達到產品之高品質。In particular, the embodiment of the present invention can form a resin layer mixed with an oligomeric type and a polymer type to improve the reliability of the productivity and the oligomeric type, and to improve the adhesive property of the polymer type, thereby achieving high quality of the product.
另，本發明之實施例係可以直下式(direct type)裝設側發光式LED，以確保其光學性質，同時顯著地減少光源的數目，並去除導光板以能夠適用於彈性的顯示器，且係包括設置於樹脂層之上，具有反射微結構之反射膜、以及包含遮光微結構之擴散片，進而確保穩定的發光性質。In addition, embodiments of the present invention are capable of directly mounting a side-emitting LED to ensure its optical properties while significantly reducing the number of light sources, and removing the light guide plate to be suitable for an elastic display. The invention comprises a reflective film disposed on the resin layer, having a reflective microstructure, and a diffusion sheet comprising a light-shielding microstructure, thereby ensuring stable luminescent properties.
另，本發明之實施例係可藉由施用可實施光學微結構將光屏蔽或擴散至背光單元之擴散片表面的遮光墨水，以及確保光均勻度並由擴散微結構與金屬微結構實施黃光遮蔽的效果，以達到可靠的光品質。In addition, embodiments of the present invention can shield or diffuse light to the surface of the diffusion sheet of the backlight unit by applying an optical microstructure, and ensure light uniformity and yellow light by the diffusion microstructure and the metal microstructure. The effect of masking to achieve reliable light quality.
上述及其他本發明實施例之方面、功效、與優點將配合所附圖示說明之。The aspects, functions, and advantages of the above and other embodiments of the invention will be described in conjunction with the accompanying drawings.
在以下參考所附圖示，將詳細說明本發明之實施例。相同參考的數字將會指定到圖示解說中的相同元件，重複解說的部分將予省略。應理解的是，「第一」、「第二」以及類似的用詞在此是用來描述不同的元件；這些元件並不限制於此些用詞。這些用詞係用以區分各項元件者。Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals will be assigned to the same elements in the illustrated explanation, and the repeated explanation will be omitted. It should be understood that the terms "first," "second," and the like are used herein to describe various elements; these elements are not limited to such terms. These terms are used to distinguish between components.
圖3係根據本發明一實施例，繪示有一背光單元之主要部件。FIG. 3 illustrates the main components of a backlight unit in accordance with an embodiment of the invention.
參閱圖3，背光單元係可包括：複數個LED光源111設置於一印刷電路板110之上；以及一樹脂層140堆疊於LED光源111之上，以將光擴散並導引向前在此結構中，一反射膜120可被堆疊於該印刷電路板之一頂面上，一擴散片150可被設置於樹脂層140之一頂部之上，且一稜鏡片160、一保護片170等等可進一步地被設置於擴散片150之一頂部之上。Referring to FIG. 3, the backlight unit may include: a plurality of LED light sources 111 disposed on a printed circuit board 110; and a resin layer 140 stacked on the LED light source 111 to diffuse and guide the light forward in the structure A reflective film 120 may be stacked on one of the top surfaces of the printed circuit board, and a diffusion sheet 150 may be disposed on top of one of the resin layers 140, and a die 160, a protective sheet 170, etc. Further disposed on top of one of the diffusion sheets 150.
至少一LED光源111係被設置於印刷電路板110之上，以發出光。在此情況下，根據本發明實施例，可使用一側發光式LED。也就是說，係可使用一光源，其中自LED光源111所發出之光並非直接地向上方行進，而是以一側向發出。另，該側發光式LED係以一直下式方式來設置，其可顯著地縮小背光單元的整體厚度，同時能夠使用實施擴散與反射功能的樹脂層來減少光源之總數量。At least one LED light source 111 is disposed on the printed circuit board 110 to emit light. In this case, a one-side illuminated LED can be used in accordance with an embodiment of the present invention. That is to say, a light source can be used in which the light emitted from the LED light source 111 does not directly travel upward but is emitted laterally. In addition, the side-emitting LED is disposed in a straight-down manner, which can significantly reduce the overall thickness of the backlight unit, and can reduce the total number of light sources by using a resin layer that performs diffusion and reflection functions.
樹脂層140係被堆疊於環繞LED光源111周圍之一結構中，用以將自光源發出之光以一側向散佈。也就是說，樹脂層140可具有習知技藝中一導光板之功能。該樹脂層可使用任何具有基本光擴散功能之樹脂。在此情況下，圖4係為圖3中一結構之局部放大圖，其中樹脂層140可包括一珠粒141，以增強光擴散與光反射。The resin layer 140 is stacked in a structure surrounding the LED light source 111 for spreading light emitted from the light source sideways. That is, the resin layer 140 may have the function of a light guide plate in the prior art. Any resin having a basic light diffusing function can be used for the resin layer. In this case, FIG. 4 is a partial enlarged view of a structure in FIG. 3, in which the resin layer 140 may include a bead 141 to enhance light diffusion and light reflection.
圖5係根據本發明實施例，繪示有上述結構中形成該樹脂層之組成之一例的圖表。Fig. 5 is a view showing an example of a composition for forming the resin layer in the above structure, according to an embodiment of the present invention.
根據本發明實施例，該樹脂層之主要材料之一例可包含有使用丙烯酸胺基甲酸酯寡聚物(urethane acrylate oligomer)作為主要原料之一樹脂(寡聚型(oligomer type))。舉例而言，可使用作為合成寡聚物之丙烯酸胺基甲酸酯寡聚物與高分子型(polymer type)聚丙烯(polyacryl)之混合。另外，在一單體中，一低沸點之稀釋反應性單體(low-boiling diluted reactive monomer)，亦即丙烯酸異冰片酯(isobornyl acrylate，IBOA)和丙烯酸羥基丙酯(hydroxylpropyl acrylate，HPA)、丙烯酸2-羥基乙酯(2-hydroxyethyl acrylate，2-HEA)等等，係被混合，而該單體可進一步地被包含於該混合物中。至於添加劑(additives)，一光起始劑(photo initiator)如1-羥基環己基苯基酮(1-Hydroxycyclohexyl Phenyl-Ketone)等等、一抗氧化劑(antioxidant)等等可被混合於其中。According to an embodiment of the present invention, one of the main materials of the resin layer may include a resin (oligomer type) using urethane acrylate oligomer as a main raw material. For example, a mixture of an urethane urethane oligomer as a synthetic oligomer and a polymer type polypropylene (polyacryl) can be used. In addition, in a monomer, a low-boiling diluted reactive monomer, ie, isobornyl acrylate (IBOA) and hydroxypropyl acrylate (HPA), 2-hydroxyethyl acrylate (2-HEA) or the like is mixed, and the monomer may be further contained in the mixture. As for the additives, a photo initiator such as 1-Hydroxycyclohexyl Phenyl-Ketone or the like, an antioxidant, or the like may be mixed therein.
更詳細來說，該樹脂層可由包括寡聚物與高分子型樹脂之一混合物的合成樹脂來構成。特別是，該樹脂層可使用下述之組成：20-42%的寡聚物與高分子型樹脂之混合物；30-63%的單體；以及1.5-6%的添加劑。In more detail, the resin layer may be composed of a synthetic resin including a mixture of an oligomer and a polymer resin. In particular, the resin layer may use a composition of 20 to 42% of a mixture of an oligomer and a polymer resin; 30 to 63% of a monomer; and 1.5 to 6% of an additive.
在此情況下，寡聚物與高分子樹脂之組成可為包含10-21 wt %的丙烯酸氨基甲酸酯寡聚物以及10-21 wt %的聚丙烯(對應於該樹脂層之整體重量)之一混合物。另外，該單體，亦即低沸點反應性稀釋單體，可由10-21 wt %的IBOA、10-21 wt %的HPA、以及10-21 wt %的2-HEA來形成。該添加劑之組成可為包含1-5 wt %的光起始劑以起始光反應，以及0.5-1 wt%的抗氧化劑，以改善一黃化現象(yellowing phenomenon)。In this case, the composition of the oligomer and the polymer resin may be 10-21 wt% of acrylic urethane oligomer and 10-21 wt% of polypropylene (corresponding to the overall weight of the resin layer) One of the mixtures. Additionally, the monomer, that is, the low boiling reactive diluent monomer, can be formed from 10-21 wt% IBOA, 10-21 wt% HPA, and 10-21 wt% 2-HEA. The additive may be composed of 1-5 wt% of a photoinitiator to initiate a photoreaction and 0.5 to 1 wt% of an antioxidant to improve a yellowing phenomenon.
藉由使用上述之組成來形成例如紫外線樹脂等等之樹脂層，可取代習知導光板之功能，並使用上述組成補足寡聚型之缺陷如表面黏著力降低，同時控制折射率與厚度，解決因高分子型之長期硬化所致之生產速率降低的問題，以滿足黏著特性、可靠度、以及生產速率。By using the above composition to form a resin layer such as an ultraviolet resin or the like, the function of the conventional light guide plate can be replaced, and the above-mentioned composition can be used to complement the defects of the oligomeric type such as surface adhesion reduction, while controlling the refractive index and thickness, and solving The problem of reduced production rate due to long-term hardening of the polymer type meets adhesion characteristics, reliability, and production rate.
尤其，根據本發明實施例之樹脂層可由一特定方式形成。In particular, the resin layer according to an embodiment of the present invention may be formed in a specific manner.
亦即，根據本發明實施例之該樹脂層係使用丙烯酸氨基甲酸酯寡聚物作為主要材料。該樹脂層主要地係在紫外線硬化波長為300-350 μm之下進行主要反應，將丙烯酸氨基甲酸酯寡聚物與高分子型聚丙烯相混合，並使用水銀燈(mercury lamp)或金屬(鎵(gallium))燈，在硬化高分子型於波長400 μm時輸入N2，以控制與一一般寡聚型的硬化平衡(curing balance)，以使該樹脂層可具有絕佳的彈性及黏著力，並維持可克服一熱塑性樹脂(polymethylmethacrylate，PMMA)導光板之一折射率，進而克服導光板所受之限制。That is, the resin layer according to an embodiment of the present invention uses an acryl urethane oligomer as a main material. The resin layer is mainly subjected to a main reaction at a UV hardening wavelength of 300-350 μm, mixing an acryl urethane oligomer with a polymer polypropylene, and using a mercury lamp or a metal (gallium). (gallium) lamp, which is input with N 2 at a wavelength of 400 μm in a hardened polymer type to control a curing balance with a general oligomeric type, so that the resin layer can have excellent elasticity and adhesion. And maintaining the refractive index of one of the light guide plates of a thermoplastic resin (PMMA), thereby overcoming the limitations of the light guide plate.
尤其，當寡聚物與高分子型混合時，若不輸入N2，則因內部硬化與表面硬化平衡之故，可能造成一表面皺痕及裂縫現象。本發明之特徵係輸入N2，故就算在一般的金屬鹵化物等等之中，仍能夠實施快速硬化。In particular, when the oligomer is mixed with the polymer type, if N 2 is not supplied, a surface wrinkle and crack may occur due to the balance between internal hardening and surface hardening. The feature of the present invention is that N 2 is input, so that even in a general metal halide or the like, rapid hardening can be performed.
在下文中，如圖5所示，將說明一僅由高分子型所製成之樹脂層(類型1)、一僅由寡聚型所製成之樹脂層(類型2)、以及根據本發明實施例，一由寡聚型與高分子型之混合物所製成之樹脂層(類型3)，其實驗對照結果。Hereinafter, as shown in FIG. 5, a resin layer (type 1) made only of a polymer type, a resin layer (type 2) made only of an oligomer type, and a method according to the present invention will be described. For example, a resin layer (type 3) made of a mixture of an oligomeric type and a polymer type, the experimental comparison result.
本測試係使用薄膜拉力測試機(thin film tension tester-Instron Co.(USA))，來測量張力強度。將具有一塗覆厚度為1300 μm及一面積為長x寬為50 mm×100 mm之樹脂層，各自提供於儀器之上部與下部夾具(grips)。下列係顯示桿型單元(rod cell)於上夾具向上移動時被施加負載之比較與觀察(其測試條件(test condition)為每分鐘0.1m)。This test uses a thin film tension tester (Instron Co. (USA)) to measure the tensile strength. There will be a resin layer having a coating thickness of 1300 μm and an area of length x width of 50 mm × 100 mm, each provided on the upper and lower grips of the instrument. The following series shows the comparison and observation of the applied load when the rod cell is moved upward (the test condition is 0.1 m per minute).
從上述試驗結果，可以得知，一單一寡聚型表現出低張力強度，而根據本發明實施例之類型3表現出與類型1之高分子型相等之張力強度。From the above test results, it is understood that a single oligomeric type exhibits a low tensile strength, and Type 3 according to an embodiment of the present invention exhibits a tensile strength equal to that of the type 1 polymeric form.
本測試係藉由使用一恆溫及恆濕腔室(temperature humidity bias(THB)，THB SH-641/ESPEC Co.(Japan))，將恆溫及恆濕施加於一腔室，以比較恆溫及恆濕特性。在溫度為60℃且濕度為95%之測試條件維持240小時以後，進行其特性之比較(如圖2所示，該具有反射膜設置於印刷電路板之上以及樹脂層設置於其上之結構係為實驗對象)。This test uses a constant temperature and constant humidity chamber (THB, THB SH-641/ESPEC Co. (Japan)) to apply constant temperature and constant humidity to a chamber to compare constant temperature and constant temperature. Wet characteristics. After the test conditions of a temperature of 60 ° C and a humidity of 95% were maintained for 240 hours, a comparison of their characteristics was carried out (as shown in FIG. 2, the structure having the reflective film disposed on the printed circuit board and the resin layer disposed thereon) Is the experimental object).
該樹脂層係具有一塗覆厚度為1300 μm及一面積為長x寬為115 mm×175 mm，且係被設置於上述之反射膜之上；其外觀與發光測試係於上述測試條件下進行比較。The resin layer has a coating thickness of 1300 μm and an area of length x width of 115 mm×175 mm, and is disposed on the reflective film; the appearance and luminescence test are performed under the above test conditions. Comparison.
參閱上述圖表，根據本發明實施例之類型3與僅由寡聚型形成樹脂之類型2係形成藍光，且其黏合度不變；然而僅由高分子型形成樹脂之類型1造成了黃化現象於其前端部份且導致白化現象，且亦發生黏著性質之弱化。Referring to the above graph, type 3 according to an embodiment of the present invention forms blue light only with the type 2 of the oligomer-forming resin, and the degree of adhesion is constant; however, the type 1 of the polymer-forming resin causes yellowing. It causes whitening at the front end portion and also weakens the adhesive property.
本測試係藉由在一預設時間內使用一預設的熱於一烘箱(oven)(HT330/ETAC Co.(Japan))，來比較及評估產品之耐熱度。其樹脂層之耐熱及黏合特性係在240小時、80℃之測試條件下來做比較。在一測試方法中，該樹脂層係具有一塗覆厚度為1300 μm及一面積為長x寬為115 mm×175 mm，且係被設置於上述圖2中所示之反射膜之上；其外觀與發光測試係於上述測試條件下進行比較。The test compares and evaluates the heat resistance of the product by using a predetermined heat (HT30/ETAC Co. (Japan)) for a predetermined period of time. The heat resistance and adhesion characteristics of the resin layer were compared under the test conditions of 240 hours and 80 °C. In a test method, the resin layer has a coating thickness of 1300 μm and an area of length x width of 115 mm × 175 mm, and is disposed on the reflective film shown in FIG. 2 above; The appearance and luminescence tests were compared under the above test conditions.
在本測試中，根據本發明實施例之類型3與僅由寡聚型形成樹脂之類型2係形成藍光，且其黏合度不變；然而僅由高分子型形成樹脂之類型1造成了黃化現象於其前端部份。In this test, the type 3 according to the embodiment of the present invention forms a blue light with the type 2 which forms the resin only by the oligomeric type, and the degree of adhesion is constant; however, the type 1 of the polymer-forming resin causes yellowing. The phenomenon is at the front end.
比較上述三種特性測試，可以得知，具有寡聚型與高分子型混合之樹脂層，相較於單一樹脂層，在如張力強度、恆溫及恆濕特性、及耐熱性、可靠度、黏著性質等等之各方面係為較有效者。Comparing the above three characteristics tests, it can be known that the resin layer having an oligomeric type and a polymer type is compared with a single resin layer such as tensile strength, constant temperature and constant humidity characteristics, and heat resistance, reliability, and adhesive properties. All aspects of etc. are more effective.
參閱本發明圖3、4中所示之結構，將在下文中配合上述樹脂層來說明根據本發明實施例之特殊背光單元之結構與運作。Referring to the structure shown in Figs. 3 and 4 of the present invention, the structure and operation of the special backlight unit according to the embodiment of the present invention will be described below in conjunction with the above resin layer.
在根據本發明實施例之背光單元中，樹脂層140可進一步地包含有珠粒141(bead)，以增進光的擴散與反射。珠粒141可以對應於該樹脂層之整體厚度之0.01至0.3%來提供。也就是說，自LED側向發出之光係經樹脂層140與珠粒141而被擴散、反射，並向上行進。另外，當提供反射膜120與反射微結構121(將在下文中詳述)時，其反射特性可被進一步地提升。藉由以該樹脂層來取代習知技術中的導光板，可顯著地將該導光板所佔據之厚度縮小，進而實施產品的輕薄度。又，產品可由彈性材料製成，故係具有亦能夠適用於彈性顯示器之普遍性。In the backlight unit according to an embodiment of the present invention, the resin layer 140 may further include beads 141 to enhance diffusion and reflection of light. The beads 141 may be provided corresponding to 0.01 to 0.3% of the entire thickness of the resin layer. That is, light emitted from the side of the LED is diffused, reflected, and traveled upward through the resin layer 140 and the beads 141. In addition, when the reflective film 120 and the reflective microstructure 121 (which will be described in detail later) are provided, the reflection characteristics thereof can be further improved. By replacing the light guide plate in the prior art with the resin layer, the thickness occupied by the light guide plate can be remarkably reduced, and the product can be made light and thin. Moreover, the product can be made of an elastic material, so that it has a universality that can also be applied to an elastic display.
另外，反射膜120可由黑白印刷(white printing)來包含反射微結構121以促進光的散佈，同時係由一反射材料所製成，以散佈來自光源的光。該反射微結構可使用包含TiO2及Al2O3其中任一者之反射墨水來印刷。In addition, the reflective film 120 may include a reflective microstructure 121 by white printing to promote dispersion of light while being made of a reflective material to spread light from the light source. The reflective microstructure can be printed using a reflective ink comprising either of TiO 2 and Al 2 O 3 .
又，擴散片150係藉由樹脂層140用以擴散光。特別是，為避免光學性質的弱化或黃光因極強的光強度而被黃化，光學微結構151之一預設部分可形成以實施遮光效果(light shielding effect)。也就是說，可使用遮光墨水來印刷遮光微結構，以防止光匯聚。Further, the diffusion sheet 150 is used to diffuse light by the resin layer 140. In particular, in order to avoid weakening of optical properties or yellowing being yellowed due to extremely strong light intensity, a predetermined portion of the optical microstructure 151 may be formed to implement a light shielding effect. That is to say, the light-shielding ink can be used to print the light-shielding microstructure to prevent light from converge.
在下文中，將詳細說明一擴散片與光學微結構被進一步地包含於上述之第一實施例之一背光單元的一結構。Hereinafter, a structure in which a diffusion sheet and an optical microstructure are further included in the backlight unit of one of the above-described first embodiments will be described in detail.
在圖3、4中，上述擴散片150之一表面可具有光學微結構151，其係可藉由阻礙光的匯聚，來解決光學性質弱化的問題。In FIGS. 3 and 4, one surface of the above-mentioned diffusion sheet 150 may have an optical microstructure 151 which solves the problem of weakening of optical properties by hindering the convergence of light.
光學微結構151大致可以印刷於擴散片150之頂面或底面上來實施。尤其，較佳地，該光學微結構可以一方向(前方)設置，其中光係自設置於擴散片之底部之LED光源111之位置發出。也就是說，該光學微結構可被設置於擴散片上對應於LED光源之一垂直頂面或一發光方向表面之位置。The optical microstructures 151 can be implemented by printing on the top or bottom surface of the diffusion sheet 150. In particular, preferably, the optical microstructure can be disposed in one direction (front), wherein the light system is emitted from a position of the LED light source 111 disposed at the bottom of the diffusion sheet. That is, the optical microstructure can be disposed on the diffusion sheet at a position corresponding to one of the vertical top surface or the light emitting direction surface of the LED light source.
為求能局部地屏蔽及擴散光，而非完全地遮光，該光學微結構可被實施以使用一單一光學微結構來控制遮光程度或光擴散程度。較佳地，根據本發明實施例之光學微結構可以一複合微結構之交疊印刷結構來實施。該交疊印刷結構係指由形成一單一微結構並印刷另一微結構形狀於該單一微結構之上來實施之一結構。In order to be able to partially shield and diffuse light, rather than completely shading, the optical microstructure can be implemented to control the degree of shading or the degree of light diffusion using a single optical microstructure. Preferably, the optical microstructures in accordance with embodiments of the present invention can be implemented in an overlapping printed structure of composite microstructures. The overlap printed structure refers to a structure implemented by forming a single microstructure and printing another microstructure on top of the single microstructure.
舉例而言，參閱圖6，光學微結構151可由使用包括選自由TiO2、CaCo3、BaSO4、Al2O3、及矽其中任一者之遮光墨水在擴散片之底面上於發光方向所形成之擴散微結構151a，以及使用包含Al或Al與TiO2之混合物之遮光墨水所形成之遮光微結構151b之交疊印刷結構來實施。也就是說，擴散微結構151a係由黑白印刷形成於擴散片之表面上，然後遮光微結構151b再形成於其上；然而，亦可以一相反順序形成一雙重結構。又，可以得知的是，此處微結構之形成排列設計可依據光效率、光強度、以及遮光率而有所變動。For example, referring to FIG. 6, the optical microstructure 151 can be used in a light-emitting direction on the bottom surface of the diffusion sheet by using a light-shielding ink selected from the group consisting of TiO 2 , CaCo 3 , BaSO 4 , Al 2 O 3 , and 矽. The formed diffusion microstructure 151a is formed by an overlap printing structure using a light-shielding microstructure 151b formed of a light-shielding ink containing Al or a mixture of Al and TiO 2 . That is, the diffusion microstructures 151a are formed on the surface of the diffusion sheet by black and white printing, and then the light shielding microstructures 151b are formed thereon; however, a double structure may be formed in the reverse order. Further, it can be known that the arrangement design of the microstructures herein can be varied depending on the light efficiency, the light intensity, and the light blocking rate.
或者，該光學微結構可形成為一三重結構，其係實施一金屬微結構，也就是設置於一中間層之遮光微結構151b以及各自設置於頂部及底部之擴散微結構151a，於依序堆疊結構中。在該三重結構內，光學微結構可由選自上述之材料來實施。舉例而言，該三重結構可確保光效率與光均勻度；其中，一擴散微結構係使用具有極佳折射率(refractive index)之TiO2來實施，另一擴散微結構可使用具有極佳光穩定度(light stability)與色彩感測(color sense)之CaCO3以及TiO2來實施，而遮光微結構係使用具有極佳遮蔽特性(masking property)之Al來實施。特別是，CaCO3係經由其減少黃光曝光之功能，作為最終實施白光者，進而得以更穩定地實施光效率。除了CaCO3外，BaSO4、Al2O3、及矽珠粒等可為大粒徑，且可使用具有相似結構之無機材料。Alternatively, the optical microstructure can be formed into a triple structure, which is implemented by a metal microstructure, that is, a light-shielding microstructure 151b disposed in an intermediate layer and diffusion micro-structures 151a respectively disposed at the top and bottom, in order In the stack structure. Within the triple structure, the optical microstructures can be implemented from a material selected from the foregoing. For example, the triple structure ensures light efficiency and light uniformity; wherein one diffusion microstructure is implemented using TiO 2 having a refractive index, and the other diffusion microstructure can be used with excellent light. The light stability is performed with CaCO 3 and TiO 2 of color sense, and the light-shielding microstructure is implemented using Al having excellent masking properties. In particular, CaCO 3 is a function of reducing yellow light exposure, and as a person who finally performs white light, the light efficiency can be more stably performed. In addition to CaCO 3 , BaSO 4 , Al 2 O 3 , and ruthenium beads may have a large particle size, and an inorganic material having a similar structure may be used.
另外，較佳地，可由控制微結構密度來形成光學微結構，以在光學微結構遠離LED光源之發光方向時降低微結構密度，而增進光效率。In addition, preferably, the optical microstructure can be formed by controlling the microstructure density to reduce the microstructure density while the optical microstructure is away from the illumination direction of the LED light source, thereby improving light efficiency.
另外，根據本發明實施例之背光單元結構，尤其是圖3、4中所示之結構，其進一步地包含有：一表面處理層152(surface treatment layer)，其係可消除在樹脂層140與設置在擴散片之表面上的光學微結構151之間的光學微結構之微結構不均勻度、使其平坦，且其係可被實施為一平坦化層(planarized layer)，具有一結構可包覆光學微結構151之所有階差，以去除一陰影區(dark portion)以及一亮區(bright portion)之間，因在接合擴散片150之光學微結構151與設置於其下之樹脂層140時產生之段差所導致之一空氣層而產生的差距。另外，主要地，該表面處理層係使用與樹脂層140相同之材料，來改善黏著性。In addition, the backlight unit structure according to the embodiment of the present invention, particularly the structure shown in FIGS. 3 and 4, further includes: a surface treatment layer 152 which can be eliminated in the resin layer 140 The microstructure of the optical microstructure between the optical microstructures 151 disposed on the surface of the diffusion sheet is uneven, making it flat, and the system can be implemented as a planarized layer having a structure All the steps of the optical microstructure 151 are covered to remove between a dark portion and a bright portion due to the optical microstructure 151 joining the diffusion sheet 150 and the resin layer 140 disposed thereunder. The resulting gap creates a gap in one of the air layers. Further, mainly, the surface treatment layer uses the same material as the resin layer 140 to improve the adhesion.
圖7係繪示有光學微結構之形成過程；圖8係繪示有構成上述光學微結構與反射微結構之遮光墨水與反射墨水之組成之一例。在表中所示之1-degree、2-degree、3-degree遮光墨水中，係顯示1-degree與2-degree各自實施擴散微結構且2-degree實施遮光微結構之一組成例。上述遮光墨水之結構可根據光學微結構之結構而變動。FIG. 7 is a view showing a process of forming an optical microstructure; and FIG. 8 is a view showing an example of a composition of a light-shielding ink and a reflective ink constituting the optical microstructure and the reflective microstructure. In the 1-degree, 2-degree, and 3-degree light-shielding inks shown in the table, one of the composition examples in which the 1-degree and the 2-degree are each subjected to a diffusion microstructure and the 2-degree is performed as a light-shielding microstructure is shown. The structure of the above-described light-shielding ink may vary depending on the structure of the optical microstructure.
參閱圖7、8，根據本發明實施例之光學微結構可形成於一結構中，其中光學微結構係被印刷於擴散片150之頂面或底面上。圖7A係繪示有實施1-degree印刷之一結構，以使光學微結構形成為單一微結構層(第一微結構：151a)；圖7B係繪示有具有第二微結構151b交疊印刷於該第一微結構之上的一結構；或圖7C係繪示有一三重結構，其中該第一及第二微結構係被印刷，然後一第三微結構交疊印刷於其上。該交疊印刷結構係指由形成一單一微結構並將另一微結構印刷於其上來實施之一結構。Referring to Figures 7 and 8, an optical microstructure in accordance with an embodiment of the present invention can be formed in a structure in which an optical microstructure is printed on a top or bottom surface of a diffuser 150. 7A illustrates a structure in which 1-degree printing is performed to form an optical microstructure into a single microstructure layer (first microstructure: 151a); and FIG. 7B shows an overlap printing with a second microstructure 151b. A structure above the first microstructure; or FIG. 7C is a triple structure in which the first and second microstructures are printed, and then a third microstructure is overprinted thereon. The overlap printed structure refers to a structure that is implemented by forming a single microstructure and printing another microstructure thereon.
如圖7A所示，當經由印刷於擴散片150之表面上來實施光學微結構時，該光學微結構可形成於包括單一擴散微結構之一結構。As shown in FIG. 7A, when the optical microstructure is implemented via printing on the surface of the diffusion sheet 150, the optical microstructure can be formed in a structure including a single diffusion microstructure.
也就是說，較佳地，藉由使用基本上包括TiO2之遮光墨水來進行印刷，以實施擴散效果並同時有效地實施遮光效果。在此情況下，該遮光墨水可被實施為一結構，其中無機顏料如TiO2等等係被添加於，例如一樹脂(亦即例如壓克力聚多元醇(acryl polyol)等樹脂)以及一烴基(hydrocarbon-based)與酯基(ester-based)溶劑。尤其，該遮光墨水可藉由進一步地額外包括添加劑如含矽濕潤分散劑(wetting dispersant)或發泡劑(foaming agent)/均染劑(leveling agent)等。另外，可使用TiO2，或選擇CaCO3、BaSO4、Al2O3、及矽其中至少一者加上TiO2，來作為無機顏料。3-degree遮光墨水中，可使用對應於遮光墨水整體重量之20-25%的壓克力聚多元醇樹脂、20-29%的溶劑(5-10%的烴基與15-19%的酯基)、50-55%的TiO2作為無機顏料、以及1-2%的添加劑(0.5-1%的矽基潤濕分散劑與0.5-1%的含矽發泡劑/均染劑)之混合物。在此情況下，該無機顏料可使用500-550 nm之粒徑。That is, preferably, printing is performed by using a light-shielding ink substantially including TiO 2 to effect a diffusion effect while effectively performing a light-shielding effect. In this case, the light-shielding ink may be embodied as a structure in which an inorganic pigment such as TiO 2 or the like is added, for example, a resin (that is, a resin such as an acrylic acryl polyol) and a Hydrocarbon-based and ester-based solvents. In particular, the light-shielding ink may further include an additive such as a wetting dispersant or a foaming agent/leveling agent or the like. Further, use may be TiO 2, or select CaCO 3, BaSO 4, Al 2 O 3, and wherein at least one silicon plus TiO 2, as the inorganic pigment. In the 3-degree light-shielding ink, an acrylic polyhydric alcohol resin corresponding to 20-25% of the total weight of the light-shielding ink, 20-29% of a solvent (5-10% of a hydrocarbon group and 15-19% of an ester group) can be used. ), 50-55% of TiO 2 as an inorganic pigment, and 1-2% of an additive (0.5-1% of a cerium-based wetting dispersing agent and 0.5-1% of a cerium-containing blowing agent/leveling agent) . In this case, the inorganic pigment may use a particle diameter of 500 to 550 nm.
或者，該單層之擴散微結構可使用圖1中的遮光墨水。Alternatively, the single layer diffusion microstructure can use the shading ink of FIG.
也就是說，在3-degree遮光墨水中，可使用對應於遮光墨水整體重量之20-25%的壓克力聚多元醇樹脂、20-29%的溶劑(5-10%的烴基與15-19%的酯基)、15-20%的TiO2作為無機顏料、30-35%的CaCO3、以及1-2%的添加劑(0.5-1%的矽基潤濕分散劑與0.5-1%的矽型發泡劑/整平劑)之混合物。在此情況下，該無機顏料可使用500-550 nm之粒徑。特別是，CaCO3係經由其減少黃光曝光之功能，作為最終實施白光者，進而得以更穩定地實施光效率；而除了CaCO3以外，BaSO4、Al2O3、及矽珠粒等可為大粒徑，且如上所述可使用具有相似結構之無機材料。在此情況下，可使用粒徑為1-2 μm之CaCO3。That is, in the 3-degree light-shielding ink, 20-25% of the total weight of the light-shielding ink can be used, and 20-29% of the solvent (5-10% of the hydrocarbon group and 15-) can be used. 19% ester base), 15-20% TiO 2 as inorganic pigment, 30-35% CaCO 3 , and 1-2% additive (0.5-1% sulfhydryl wetting and dispersing agent and 0.5-1%) A mixture of 矽 type blowing agent / leveling agent). In this case, the inorganic pigment may use a particle diameter of 500 to 550 nm. In particular, CaCO 3 is used to reduce the yellow light exposure function, and as a final white light, the light efficiency can be more stably performed. In addition to CaCO 3 , BaSO 4 , Al 2 O 3 , and ruthenium beads can be used. It is a large particle size, and an inorganic material having a similar structure can be used as described above. In this case, CaCO 3 having a particle diameter of 1-2 μm can be used.
圖4係根據本發明實施例，繪示有反射膜與反射微結構之結構之平面圖。4 is a plan view showing the structure of a reflective film and a reflective microstructure in accordance with an embodiment of the present invention.
也就是說，根據本發明實施例之反射膜120係被堆疊於印刷電路板之上，且LED光源111係經由該反射膜上所形成之孔而向外突伸。當該LED光源係被實施為一側發光式LED結構，光源之數量可顯著地減少。為了降低減少比例(reduction rate)，反射微結構130係被實施，以顯著地改善光反射率。That is, the reflective film 120 according to the embodiment of the present invention is stacked on the printed circuit board, and the LED light source 111 protrudes outward through the hole formed in the reflective film. When the LED light source is implemented as a one-sided LED structure, the number of light sources can be significantly reduced. In order to reduce the reduction rate, reflective microstructures 130 are implemented to significantly improve light reflectance.
如顯示例中所示該反射微結構可形成於該LED光源之發光方向。特別是，當該反射微結構為遠離該LED光源之發光方向時，該反射微結構可被設置以提高微結構密度。也就是說，遠離該LED光源之發光方向的第二區域132之微結構密度，相較於鄰近該LED光源之發光方向的第一區域131之微結構密度，越提高時，越能夠提升反射率。另外，其微結構結構可根據設計目的而以不同之形狀來實施。又，反射微結構之形成可經使用包含TiO2、Al2O3其中任一者反射墨水印刷來實施。The reflective microstructure can be formed in the direction of illumination of the LED light source as shown in the display example. In particular, when the reflective microstructure is away from the direction of illumination of the LED source, the reflective microstructure can be configured to increase the microstructure density. That is, the microstructure density of the second region 132 away from the light emitting direction of the LED light source is higher than that of the first region 131 adjacent to the light emitting direction of the LED light source. . In addition, the microstructure may be implemented in different shapes depending on the design purpose. Further, the formation of the reflective microstructure can be carried out by printing using a reflective ink comprising either TiO 2 or Al 2 O 3 .
如圖7B所示，具有交疊印刷結構之光學微結構可被實施。As shown in Figure 7B, an optical microstructure having an overlapping printed structure can be implemented.
也就是說，根據本發明實施例之其他光學微結構可形成以實施一雙重結構，其中實施光擴散或遮光效果之擴散微結構(第一微結構)以及實施遮光效果之遮光微結構(第二微結構)交疊印刷。也就是說，光學微結構可被實施為一結構，其中上述圖7A中之第一微結構係被印刷，然後經由使用一金屬材料之遮光墨水來印刷之第二微結構係被印刷於該第一微結構之上。該第二微結構係使用包含有Al或Al及TiO2之混合材料之遮光墨水來印刷。另外，該光學微結構亦可由改變第一及第二微結構之堆疊順序來形成。That is, other optical microstructures according to embodiments of the present invention may be formed to implement a dual structure in which a diffusion microstructure (first microstructure) that implements light diffusion or light blocking effects and a light-shielding microstructure that performs a light-shielding effect (second Microstructure) overlap printing. That is, the optical microstructure can be implemented as a structure in which the first microstructure in FIG. 7A described above is printed, and then the second microstructure printed via the shading ink using a metal material is printed on the first Above a microstructure. The second microstructure is printed using a light-shielding ink comprising a mixed material of Al or Al and TiO 2 . Additionally, the optical microstructure can be formed by changing the stacking order of the first and second microstructures.
該第二微結構係可包括一金屬基顏料。將組成第二微結構之遮光墨水作為一例來說明，其係可使用一樹脂如壓克力聚多元醇(acryl polyol)等、一烴基或酯基溶劑、一金屬基顏料、以及一潤濕分散劑或添加劑如一發泡劑/均染劑等之一混合材料。作為組成之一例，該遮光墨水可由36-40%的壓克力聚多元醇樹脂、33-40%的溶劑、20-25%的無機顏料、以及1-2%的添加劑來製成。另外，33-40%的溶劑可由10-15%的低沸點的烴基溶劑與23-25%的酯基溶劑之混合物製成。該第二微結構係為金屬微結構，且係可基本地實施遮光效果。在此情況下，可使用粒徑為5-15 μm之Al作為無機顏料。The second microstructure can comprise a metal based pigment. The light-shielding ink constituting the second microstructure will be described as an example, and a resin such as an acryl polyol or the like, a hydrocarbon-based or ester-based solvent, a metal-based pigment, and a wetting-dispersion may be used. A mixture of additives or additives such as a blowing agent/leveling agent. As an example of the composition, the light-shielding ink may be made of 36-40% of an acrylic polyhydric alcohol resin, 33-40% of a solvent, 20-25% of an inorganic pigment, and 1-2% of an additive. Further, 33-40% of the solvent may be prepared from a mixture of 10-15% of a low boiling hydrocarbon-based solvent and 23-25% of an ester-based solvent. The second microstructure is a metal microstructure, and the shading effect can be substantially implemented. In this case, Al having a particle diameter of 5 to 15 μm can be used as the inorganic pigment.
如本發明實施例所述，當擴散微結構與遮光微結構其兩微結構結構之堆疊結構形成時，可選擇、應用能夠實施上述擴散微結構之1-degree與3-degree遮光墨水其中任一者。As described in the embodiment of the present invention, when the diffusion microstructure and the light-shielding microstructure and the stacked structure of the two microstructures are formed, any one of the 1-degree and 3-degree light-shielding inks capable of implementing the diffusion microstructure can be selected and applied. By.
如圖7C所示，根據本發明實施例之光學微結構可形成於三層結構之交疊印刷結構。As shown in FIG. 7C, an optical microstructure according to an embodiment of the present invention may be formed in an overlap printed structure of a three-layer structure.
也就是說，該光學微結構，其中光學微結構之中間層係以構成一金屬微結構之一遮光微結構來實施，而擴散微結構係被實施為光學微結構之頂部及底部。That is, the optical microstructure, wherein the intermediate layer of the optical microstructure is implemented to form a light-shielding microstructure of a metal microstructure, and the diffusion microstructure is implemented as the top and bottom of the optical microstructure.
作為金屬微結構之該遮光微結構(第二微結構)係使用如上所述包含有Al或Al及TiO2之混合材料之2-degree遮光墨水印刷，且其頂部及底部可實施使用圖7A與7B所述之1-degree及3-degree遮光墨水所形成之擴散微結構之一結構。又，該擴散微結構係堆疊於該遮光微結構支頂部或底部，且其係可以變動的堆疊順序形成。The light-shielding microstructure (second microstructure) as a metal microstructure is printed using a 2-degree light-shielding ink containing a mixed material of Al or Al and TiO 2 as described above, and the top and bottom portions thereof can be implemented using FIG. 7A and One of the diffusion microstructures formed by the 1-degree and 3-degree shading inks described in 7B. Moreover, the diffusion microstructures are stacked on top or bottom of the light-shielding microstructure support and are formed in a variable stacking sequence.
無論如何，構成上述光學微結構之該擴散與遮光微結構可各自具有一厚度為4-10 μm。In any event, the diffusion and light-shielding microstructures constituting the optical microstructure described above may each have a thickness of 4 to 10 μm.
圖9係根據本發明實施例，繪示有反射膜與反射微結構結構之平面圖。Figure 9 is a plan view showing a reflective film and a reflective microstructure in accordance with an embodiment of the present invention.
也就是說，根據本發明實施例之反射膜120係被堆疊於印刷電路板之上，且LED光源111係經由該反射膜上所形成之孔而向外突伸。當該LED光源係被實施為一側發光式LED結構，光源之數量可顯著地減少。為了降低減少比例，反射微結構130係被實施，以顯著地改善光反射率。That is, the reflective film 120 according to the embodiment of the present invention is stacked on the printed circuit board, and the LED light source 111 protrudes outward through the hole formed in the reflective film. When the LED light source is implemented as a one-sided LED structure, the number of light sources can be significantly reduced. In order to reduce the reduction ratio, the reflective microstructures 130 are implemented to significantly improve the light reflectance.
如顯示例中所示該反射微結構可形成於該LED光源之發光方向。特別是，當該反射微結構為遠離該LED光源之發光方向時，該反射微結構可被設置以提高微結構密度。也就是說，遠離該LED光源之發光方向的第二區域132之微結構密度，相較於鄰近該LED光源之發光方向的第一區域131之微結構密度，越提高時，越能夠提升反射率。另外，其微結構結構可根據設計目的而以不同之形狀來實施。又，反射微結構之形成可經使用包含TiO2、Al2O3其中任一者反射墨水印刷來實施。The reflective microstructure can be formed in the direction of illumination of the LED light source as shown in the display example. In particular, when the reflective microstructure is away from the direction of illumination of the LED source, the reflective microstructure can be configured to increase the microstructure density. That is, the microstructure density of the second region 132 away from the light emitting direction of the LED light source is higher than that of the first region 131 adjacent to the light emitting direction of the LED light source. . In addition, the microstructure may be implemented in different shapes depending on the design purpose. Further, the formation of the reflective microstructure can be carried out by printing using a reflective ink comprising either TiO 2 or Al 2 O 3 .
將圖8中組成反射微結構之反射墨水之組成作為一例來說明。該反射墨水中，可使用對應於反射墨水整體重量之20-25%的壓克力聚多元醇樹脂、20-29%的溶劑(5-10%的烴基與15-19%的酯基)、50-55%的TiO2作為無機顏料、以及1-2%的添加劑(0.5-1%的矽基潤濕分散劑與0.5-1%的含矽發泡劑/均染劑)之混合物。The composition of the reflective ink constituting the reflective microstructure in Fig. 8 will be described as an example. In the reflective ink, an acrylic polyhydric alcohol resin corresponding to 20-25% of the total weight of the reflective ink, 20-29% of a solvent (5-10% of a hydrocarbon group and 15-19% of an ester group), 50-55% of TiO 2 is used as an inorganic pigment, and a mixture of 1-2% of an additive (0.5-1% of a cerium-based wetting dispersing agent and 0.5-1% of a cerium-containing blowing agent/leveling agent).
圖10係根據本發明實施例，繪示有背光單元之一運作狀態圖。FIG. 10 is a diagram showing an operational state of a backlight unit according to an embodiment of the invention.
如圖10所示，根據本發明實施例之背光單元係自側發光式LED 111以側向發光。在此情況下，發出之光藉由取代習知導光板之樹脂層140來反射、漫射；其中，特別是由反射膜120與反射微結構130來提高反射率，進而將光導引向前。通過樹脂層140之光係容易受到藉由形成於擴散片150上之光學微結構151擴散或遮光過程影響。光束L係經該過程而通過如一稜鏡片160(prism sheet)等之光學片，而以白光之形式入射於LCD面板之上。As shown in FIG. 10, the backlight unit according to an embodiment of the present invention emits light laterally from the side-illuminated LED 111. In this case, the emitted light is reflected and diffused by replacing the resin layer 140 of the conventional light guide plate; wherein, in particular, the reflective film 120 and the reflective microstructure 130 improve the reflectance, thereby guiding the light forward. . The light system passing through the resin layer 140 is easily affected by the diffusion or shading process of the optical microstructure 151 formed on the diffusion sheet 150. The light beam L is incident on the LCD panel in the form of white light through an optical sheet such as a prism sheet or the like.
如上所述，根據本發明實施例之背光單元係可藉由去除導光板結構來實施輕薄度，並減少光源數量；其係可將側發光式LED實施為提供光源者，且係可藉由以樹脂層的光擴散和光反射來導光；其亦可以光學微結構如反射微結構、遮光微結構、擴散微結構等，來補償因光源數量減少所導致之光亮度與均勻度之弱化，進而實施光均勻度與影像品質。As described above, the backlight unit according to the embodiment of the present invention can implement the lightness and thinness and reduce the number of light sources by removing the structure of the light guide plate; and the side light-emitting LED can be implemented as a light source, and The light diffusion and light reflection of the resin layer guide light; and the optical microstructures such as the reflective microstructure, the light-shielding microstructure, and the diffusion microstructure can also compensate for the weakening of the brightness and uniformity caused by the decrease in the number of light sources, and then implement Light uniformity and image quality.
另外，為求避免光學微結構在樹脂層140與擴散片150接合時產生的段差，所可能造成之黏著性弱化，以及去除因空氣層形成所導致陰影區的產生，可進一步地提供表面處理層152，以實施可靠的背光單元，並得以被應用於包括該背光單元之液晶顯示器。In addition, in order to avoid the step difference caused when the optical microstructure is bonded to the diffusion sheet 150 by the resin layer 140, the adhesion may be weakened, and the generation of the shadow region due to the formation of the air layer may be removed, and the surface treatment layer may be further provided. 152, to implement a reliable backlight unit, and can be applied to a liquid crystal display including the backlight unit.
雖然參考實施例之許多說明性實施例來描述實施例，但應理解，熟習此項技術者可想出將落入本發明之原理的精神及範疇內的眾多其他修改及實施例。因此，本發明之範疇應由所附之專利範圍之範疇，而非本參考書之說明內文，來定義，且所有落入本發明範疇之修改均應被理解為被包括於本發明申請範疇之內。While the embodiments have been described with reference to the embodiments of the embodiments the embodiments Therefore, the scope of the present invention should be construed as being included in the scope of the appended claims, and all modifications within the scope of the present invention should be construed as being included in the scope of the present invention. within.
1．．．背光單元1. . . Backlight unit
10．．．發光二極體10. . . Light-emitting diode
20．．．基板20. . . Substrate
30．．．導光板30. . . Light guide
40．．．反射板40. . . Reflective plate
50．．．LCD面板50. . . LCD panel
L．．．光線L. . . Light
31、150．．．擴散片31, 150. . . Diffusion sheet
32、33、160．．．稜鏡片32, 33, 160. . . Bract
34、170．．．保護片34, 170. . . Protective sheet
110．．．印刷電路板110. . . A printed circuit board
120．．．反射膜120. . . Reflective film
130．．．反射微結構130. . . Reflective microstructure
140．．．樹脂層140. . . Resin layer
111．．．光源111. . . light source
151．．．光學微結構151. . . Optical microstructure
152．．．表面處理層152. . . Surface treatment layer
141．．．珠粒141. . . Bead
151a．．．擴散微結構151a. . . Diffusion microstructure
151b．．．遮光微結構151b. . . Shading microstructure
131、132、133、134．．．區域131, 132, 133, 134. . . region
圖1、2係根據習知技藝，繪示有一背光單元之結構圖；1 and 2 are structural diagrams of a backlight unit according to the prior art;
圖3係根據本發明一實施例，繪示有一背光單元結構中之主要部件；3 is a diagram showing main components in a backlight unit structure according to an embodiment of the invention;
圖4係根據本發明實施例，繪示有背光單元中一樹脂層與一珠粒之功能其運作狀態圖；4 is a diagram showing the operation state of a resin layer and a bead in a backlight unit according to an embodiment of the invention;
圖5係根據本發明實施例，繪示有形成該樹脂層之組成之一例的圖表；Figure 5 is a diagram showing an example of a composition for forming the resin layer according to an embodiment of the present invention;
圖6係根據本發明實施例，繪示有光學微結構之一例；Figure 6 is a diagram showing an example of an optical microstructure according to an embodiment of the present invention;
圖7係根據本發明實施例，繪示有實施光學微結構之製造過程；Figure 7 is a diagram showing a manufacturing process for implementing an optical microstructure in accordance with an embodiment of the present invention;
圖8係根據本發明實施例，繪示有構成光學微結構與反射微結構之墨水之組成例之表；8 is a table showing a composition example of an ink constituting an optical microstructure and a reflective microstructure according to an embodiment of the present invention;
圖9係根據本發明實施例，繪示有反射微結構之一例；以及Figure 9 is a diagram showing an example of a reflective microstructure in accordance with an embodiment of the present invention;
圖10係根據本發明實施例，繪示有背光單元之一運作狀態圖。FIG. 10 is a diagram showing an operational state of a backlight unit according to an embodiment of the invention.
110．．．印刷電路板110. . . A printed circuit board
120．．．反射膜120. . . Reflective film
130．．．反射微結構130. . . Reflective microstructure
140．．．樹脂層140. . . Resin layer
111．．．光源111. . . light source
150．．．擴散片150. . . Diffusion sheet
151．．．光學微結構151. . . Optical microstructure
152．．．表面處理層152. . . Surface treatment layer
160．．．稜鏡片160. . . Bract
170．．．保護片170. . . Protective sheet
Claims (22)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100133029A TWI483043B (en) | 2011-09-14 | 2011-09-14 | Lighting unit and lcd using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100133029A TWI483043B (en) | 2011-09-14 | 2011-09-14 | Lighting unit and lcd using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201312225A true TW201312225A (en) | 2013-03-16 |
| TWI483043B TWI483043B (en) | 2015-05-01 |
Family
ID=48482496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100133029A TWI483043B (en) | 2011-09-14 | 2011-09-14 | Lighting unit and lcd using the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI483043B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111989522A (en) * | 2018-02-19 | 2020-11-24 | 康宁公司 | LCD backlight unit including solvent-free microreplicated resin |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100703856B1 (en) * | 2005-10-10 | 2007-04-06 | 에스에스씨피 주식회사 | High solid uv curable coating composition |
| US7845826B2 (en) * | 2008-01-15 | 2010-12-07 | Skc Haas Display Films Co., Ltd. | Multilayered integrated backlight illumination assembly |
| KR101302877B1 (en) * | 2009-11-05 | 2013-09-05 | 엘지전자 주식회사 | Backlight unit |
-
2011
- 2011-09-14 TW TW100133029A patent/TWI483043B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111989522A (en) * | 2018-02-19 | 2020-11-24 | 康宁公司 | LCD backlight unit including solvent-free microreplicated resin |
| CN111989522B (en) * | 2018-02-19 | 2022-11-22 | 康宁公司 | LCD backlight unit including solvent-free microreplicated resin |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI483043B (en) | 2015-05-01 |
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