TW201307374A - 助焊劑 - Google Patents
助焊劑 Download PDFInfo
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- TW201307374A TW201307374A TW101120069A TW101120069A TW201307374A TW 201307374 A TW201307374 A TW 201307374A TW 101120069 A TW101120069 A TW 101120069A TW 101120069 A TW101120069 A TW 101120069A TW 201307374 A TW201307374 A TW 201307374A
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- Prior art keywords
- flux
- phosphonate
- migration
- solder
- flux residue
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- 230000004907 flux Effects 0.000 title claims abstract description 80
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000005476 soldering Methods 0.000 claims abstract description 15
- -1 phosphonate ester Chemical class 0.000 claims abstract description 13
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 9
- AIPRAPZUGUTQKX-UHFFFAOYSA-N diethoxyphosphorylmethylbenzene Chemical compound CCOP(=O)(OCC)CC1=CC=CC=C1 AIPRAPZUGUTQKX-UHFFFAOYSA-N 0.000 claims abstract description 6
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims description 37
- YPJHXRAHMUKXAE-UHFFFAOYSA-N 3-diethoxyphosphorylprop-1-ene Chemical compound CCOP(=O)(CC=C)OCC YPJHXRAHMUKXAE-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 3
- JJJOZVFVARQUJV-UHFFFAOYSA-N 2-ethylhexylphosphonic acid Chemical compound CCCCC(CC)CP(O)(O)=O JJJOZVFVARQUJV-UHFFFAOYSA-N 0.000 claims 1
- 230000005012 migration Effects 0.000 abstract description 33
- 238000013508 migration Methods 0.000 abstract description 33
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- QKGBKPZAXXBLJE-UHFFFAOYSA-N diethyl 4-methylbenzylphosphonate Chemical compound CCOP(=O)(OCC)CC1=CC=C(C)C=C1 QKGBKPZAXXBLJE-UHFFFAOYSA-N 0.000 abstract description 3
- XBEDEUGIOGUZSN-UHFFFAOYSA-N CCCCC(CC)COP(O)=O Chemical compound CCCCC(CC)COP(O)=O XBEDEUGIOGUZSN-UHFFFAOYSA-N 0.000 abstract 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- 239000002184 metal Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000009413 insulation Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- NLNXYXXHVONUCN-UHFFFAOYSA-N 2-ethylhexylphosphane Chemical compound CCCCC(CC)CP NLNXYXXHVONUCN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009791 electrochemical migration reaction Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- GJWAEWLHSDGBGG-UHFFFAOYSA-N hexylphosphonic acid Chemical class CCCCCCP(O)(O)=O GJWAEWLHSDGBGG-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3611—Phosphates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本發明係在提供可於形成助焊劑殘渣之焊接部,確實地抑制發生遷移之助焊劑。於與焊錫粉末混合生成錫膏之助焊劑,包含於焊接時附著於焊接部的表面,形成具有疏水性的披膜的量的膦酸酯。膦酸酯的添加量,以1質量%以上~30質量%以下為佳。此外,膦酸酯,以二乙基苄基膦酸酯、二乙基烯丙基膦酸酯、二乙基(對甲基苄基)膦酸酯或2-乙基己基,2-乙基己基膦酸酯之任一為佳。
Description
本發明係關於與焊錫粉末混合之助焊劑,特別是關於具有防止焊接後發生遷移的效果的助焊劑。
於構裝電子零件之印刷電路板等的電路板,配合電子零件的引線等的端子形成電極。電子零件與電路板的固定及電性連接,主要係以焊接進行。於如此之電路板,在電子零件的端子與電路板的電極的焊接部分,由於施加直流電壓的電極間附著水滴等的原因,有發生離子遷移(電化學遷移)的可能性。
離子遷移(以下,稱為遷移),係於施加直流電壓的電極間,由陽極溶出的金屬離子在陰極接受電子,在陰極還原的金屬成長,因伸長到陽極的還原金屬,使兩極短路的現象。如此地,發生遷移,則會在電極之間發生短路,而失去作為電路板的功能。
然而,一般使用於焊接的助焊劑,係於焊錫會熔解的溫度,化學去除存在於焊錫及焊接對象之金屬表面之金屬氧化物,具有在兩者的境界可使金屬元素移動的功能,藉由使用助焊劑,於焊錫與焊接對象的金屬表面之間形成金屬間化合物,可得堅固的接合。
錫膏係混合焊錫粉末與助焊劑而得之複合材料。錫膏,係於印刷電路板等的電路板的電極或端子等的焊接部分,以印刷法或射出法塗佈。將零件搭載於塗佈有錫膏的焊接部上,以稱為回焊爐之加熱爐將基板加熱使焊錫熔融,而進行焊接。
於助焊劑,亦包含並不會因焊接的加熱而分解、蒸發的成分,於焊接之後殘留於焊接部的周邊成為助焊劑殘渣。在發生上述遷移的原因之一,可舉水滴對電極間的附著。含於助焊劑的主成分的松香(松脂),具有潑水性,故以松香為主成分的助焊劑殘渣形成於焊接部,則即使水滴附著在助焊劑殘渣上,因松香的潑水效果,並不會立即發生遷移。
但是,於助焊劑殘渣產發破裂,則水分由助焊劑殘渣破裂的部分浸入助焊劑殘渣中,而該水分將成為誘發遷移的主要原因。
因此,因水滴等發生遷移的對策,由先前即採取使電路板的構造係水滴不會附著焊錫面的構造而進行。此外,於焊接面施行防濕塗層而進行。
另一方面,藉由助焊劑殘渣抑制發生遷移的技術,有
於助焊劑中添加脂肪酸酯的技術之提案(參照,例如專利文獻1)。
[專利文獻1]日本特開平11-077376號公報
於助焊劑中添加甘油的脂肪酸酯,則可使助焊劑殘渣具有延展性,於焊接後使焊接部暴露於惡劣的環境,可抑制助焊劑殘渣發生破裂。
但是,只是使助焊劑殘渣具有延展性,並不能抑制水分因殘渣破裂而浸入以外的原因所發生的遷移。即,發生遷移之其他的原因,可舉在於高溫、高濕的狀況下,因助焊劑殘渣的吸濕而殘渣的絕緣電阻下降,或吸濕的水分附著在電極間。
即使,藉由使助焊劑殘渣具有延展性,防止水分因助焊劑殘渣的破裂而浸入,無法抑制因助焊劑殘渣在如此之高溫、高濕的狀況下的吸濕而絕緣電阻下降,或因助焊劑殘渣的吸濕而水分附著於電極等而發生遷移。因此,即使助焊劑殘渣形成於焊接部而披覆焊接部,無法確實地抑制發生遷移。
此外,作為抑制發生遷移的對策,將電路板的構造作成防止水滴附著的構造或施以防濕塗層,將成提高組裝電路板的成本的原因。
本發明係為解決如此之課題而完成者,在於形成助焊劑殘渣的焊接部,不僅藉由助焊劑殘渣覆蓋焊接部,提供可確實地抑制發生遷移之助焊劑為目標。
本發明者們,著眼於膦酸酯對金屬的吸附性,發現藉由在與焊錫粉末混合生成錫膏之助焊劑添加膦酸酯,膦酸酯在焊接時吸附於焊錫等的金屬的表面,形成具有疏水性的披膜。
本發明係在於與焊錫粉末混合生成錫膏之助焊劑,係包含於焊接時助焊劑殘渣吸附於焊接部的表面,形成具有疏水性的披膜的量的膦酸酯的助焊劑。
膦酸酯的添加量,以1%以上~30%以下為佳。再者,%若無特別指定,係指質量%。此外,膦酸酯以二乙基苄基膦-酸酯、二乙基烯丙基膦酸酯、二乙基(對甲基苄基)膦酸酯、或2-乙基己基,2-乙基己基膦酸酯之任一為佳。
本發明的助焊劑,藉由添加具有對金屬的吸附性的膦酸酯,將本發明之助焊劑與焊錫粉末混合生成錫膏,使用該錫膏進行焊接,形成助焊劑殘渣,則膦酸酯吸附於形成助焊劑殘渣的焊接部的金屬表面,形成疏水性的披膜。
藉此,吸附於焊接部的疏水性膦酸酯的披膜,抑制水滴等附著於形成助焊劑殘渣之焊接部,即使焊接部暴露於惡劣的環境而發生助焊劑殘渣破裂之情形,亦可抑制水滴等附著於焊接部,而可抑制因水滴等的附著而發生遷移。
再者,於高溫.高濕的狀況下助焊劑殘渣吸濕,而助焊劑殘渣的絕緣電阻下降等的情形,或因助焊劑殘渣的吸濕而水分附著在電極等的情形,藉由吸附於焊接部之疏水性膦酸酯之披膜,可抑制發生遷移。因此,使用混合本發明之助焊劑的錫膏進行焊接的電路板,及構裝該電路板的電子機器可實現很高的可靠度。
此外,由於可藉由對助焊劑添加膦酸酯得到防止發生遷移的效果,故無需先前的電路板所需之水滴附著防止構造及防濕塗層,可減低組裝所需的成本。
本實施形態之助焊劑,係與焊錫粉末混合生成錫膏。本實施形態的助焊劑,包含於焊接時會吸附於焊錫等的金屬表面的膦酸酯。膦酸酯,以二乙基苄基膦酸酯、二乙基烯丙基膦酸酯、二乙基(對甲基苄基)膦酸酯或2-乙基己基,2-乙基己基膦酸酯之任一為佳。
於助焊劑,包含不會因焊接的加熱而分解、蒸發的成分,而於焊接後覆蓋焊接部地形成助焊劑殘渣。再者,於助焊劑添加既定量的膦酸酯的本實施形態的錫膏,膦酸酯在焊接時的加熱溫度並不會蒸發,而吸附於焊錫及以焊錫接合之電極等的金屬表面,於焊接部的表面形成疏水性的披膜。
藉由該披膜阻礙水滴與金屬的接觸,可抑制發生遷移。以於焊接部有助焊劑殘渣的狀態,於溫度變化大的環
境、反覆溫度變化的環境、受到衝擊的環境等,焊接部暴露於惡劣的環境時,即使助焊劑殘渣破裂而水分浸入,由於焊接部分的表面以疏水性的披膜覆蓋,可防止水分直接與焊接部的金屬部分接觸。
此外,於高溫.高濕的狀況下,助焊劑殘渣吸濕,而助焊劑殘渣的絕緣電阻下降等的情形,或者,因助焊劑殘渣的吸濕而水分附著於電極等的情形時,由於焊接部的表以疏水性的披膜覆蓋,可防止水分直接與焊接部的金屬部分接觸。藉此,可抑制發生遷移。
在此,藉由添加膦酸酯的量,使助焊劑殘渣的性狀變化,增加膦酸酯的添加量,則助焊劑殘渣會液狀化。因此,考慮焊接後的助焊劑殘渣的性狀,膦酸酯的添加量,以質量%,以1%以上~30%以下為佳。
以如下所示組成調合實施例與比較例之助焊劑,使用實施例及比較例之助焊劑調合錫膏,比較有無添加膦酸酯對防止發生遷移的效果。此外,比較添加膦酸酯的量與助焊劑殘渣的性狀的關係。
(1)助焊劑的組成
以如下表1所示組成調合實施例與比較例之助焊劑,焊錫粉末(組成:Sn-3Ag-0.5Cu粒度:25~36μm),使質量%成89%地調合錫膏。再者,在於表1之組成率係質量%。
於表1中,二乙基苄基膦酸酯、二乙基烯丙基膦酸酯、二乙基(對甲基苄基)膦酸酯、2-乙基己基,2-乙基己基膦酸酯係膦酸酯之一例,選擇性地於各實施例添加。再者,比較例1,係為比較膦酸酯的添加量與助焊劑殘渣的性狀的關係,添加二乙基苄基膦酸酯作為膦酸酯之一例。比較例2,係未添加膦酸酯。
構成各實施例及比較例的助焊劑的成分,松香係主要具有去除金屬表面的氧化物的作用,二甘醇單己基醚,係具有使松香及其他的的添加劑溶解的作用。助焊劑的殘留成分,添加硬化蓖麻油作為黏度調整劑,添加二乙胺臭氫酸鹽作為活性劑。
(2)試驗方法
將表1所示實施例與比較例之錫膏,於電路板以間距0.5mm形成的電極提供印刷,之後,將具有與電極相同間距的引線的零件搭載於電路板上,以回焊爐進行焊接。然後,為進行加速惡化試驗,對焊接之電極間滴下去離子水,對引線之間施加8V的電壓,以實體顯微鏡邊觀察,邊測量發生遷移的時間。
(3)結果
將發生遷移的時間示於如下表2。
如上述之表2之實施例5所示,將膦酸酯以質量%添加1%,則與比較例2所示的膦酸酯與未添加時相比,發生遷移的時間變長,可知藉由添加膦酸酯可發揮防止發生遷移的效果。如實施例1~實施例4所示,使膦酸酯的添加量為10%左右,則可使發生遷移的時間變得充分長,可知可更加提升防止發生遷移的效果。
因此,膦酸酯的添加量,只要以質量%在1%以上即可,為提升防止發生遷移的效果,可知使膦酸酯的添加量以10%左右為佳。
另一方面,如比較例1所示,將膦酸酯的添加量以質量%定為30%時,雖然在形成助焊劑殘渣之焊接部會形成具有疏水性的披膜,但助焊劑殘渣的性狀會液狀化。即使,助焊劑殘渣液狀化,可維持防止發生遷移的效果。但是,在焊接後,垃圾附著在形成液狀化的助焊劑殘渣的焊接部等,而有引起電極間的絕緣電阻下降,損及電路的電性可靠度等之於。
因此,考慮防止發生遷移的效果,則膦酸酯的添加量以質量%亦可超過30%的程度,惟考慮助焊劑殘渣的性狀,則可知膦酸酯的添加量以30%以下為佳。
由以上的結果,了解到藉由對助焊劑添加膦酸酯,可
發揮防止發生遷移的效果,並且為在形成助焊劑殘渣的焊接部以膦酸酯形成具有疏水性的披膜,將膦酸酯以質量%添加1%以上~30%以下為佳。再者,亦瞭解到藉由對助焊劑添加膦酸酯,則即減少添加作為活性劑的鹵化物,亦可提升沾濕性。
本發明的助焊劑,亦可使用在搭載於汽車之電子機器等,有可能受到水及灰塵的影響的環境中使用的電子機器。
Claims (3)
- 一種助焊劑,與焊錫粉末混合生成錫膏,其特徵在於:包含於焊接時助焊劑殘渣吸附於焊接部的表面,形成具有疏水性的披膜的量的膦酸酯。
- 申請專利範圍第1項所述的助焊劑,其中上述膦酸酯的添加量包含1%以上~30%以下。
- 申請專利範圍第1或2項所述的助焊劑,其中上述膦酸酯係二乙基苄基膦酸酯、二乙基烯丙基膦酸酯、二乙基(對甲基苄基)膦酸酯、或2-乙基己基,2-乙基己基膦酸酯之任一。
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