TW201304081A - Substrate for mounting a plurality of light emitting elements - Google Patents
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Abstract
Description
本發明係關於一種用以安裝複數個發光元件之基板及一種製造此一基板之方法。本發明亦係關於一種包括此一基板之光輸出裝置及一種組裝此一光輸出裝置之方法。 The present invention relates to a substrate for mounting a plurality of light emitting elements and a method of fabricating the same. The invention also relates to a light output device comprising the substrate and a method of assembling the light output device.
現今，安裝在一基板上之發光元件(諸如安裝在一印刷電路板(PCB)上之發光二極體(LED))越來越多用在照明裝置中。為產生一期望光束形狀，基於LED之此一照明裝置通常可包括配置用於該等LED之各者之具有一光學元件(諸如一準直器)之一光學系統。作為該照明裝置之一實例，圖1中示意性繪示一已知照明裝置100，其中具有多個準直器102之一光學系統101係配置在安裝在一PCB 104上之複數個LED 103上方。 Nowadays, light-emitting elements mounted on a substrate, such as light-emitting diodes (LEDs) mounted on a printed circuit board (PCB), are increasingly used in lighting devices. To produce a desired beam shape, such an illumination device based on LEDs can generally include an optical system having an optical component (such as a collimator) configured for each of the LEDs. As an example of the illumination device, a known illumination device 100 is schematically illustrated in FIG. 1, wherein one optical system 101 having a plurality of collimators 102 is disposed above a plurality of LEDs 103 mounted on a PCB 104. .
為最佳化圖1中之光學系統之性能，LED之各者必須與其各自準直器對準。此可藉由調整準直器而完成，或者，若各LED係安裝在一單獨印刷電路板(PCB)上，則此可藉由調整其上配置該LED之該印刷電路板之位置而完成。然而，為促進LED之組裝及/或可交換性，通常較佳的是使用其上配置多個LED之一印刷電路板。因此，在LED已被安裝在印刷電路板上之後，LED具有相對於彼此之固定位置。此意謂使光學系統對準之唯一方式為調整準直器，此會是一非常不便且耗時之生產製程。 To optimize the performance of the optical system of Figure 1, each of the LEDs must be aligned with their respective collimators. This can be done by adjusting the collimator, or if each LED is mounted on a separate printed circuit board (PCB), this can be done by adjusting the position of the printed circuit board on which the LED is placed. However, to facilitate assembly and/or interchangeability of LEDs, it is generally preferred to use a printed circuit board on which one of the plurality of LEDs is disposed. Thus, after the LEDs have been mounted on a printed circuit board, the LEDs have a fixed position relative to each other. This means that the only way to align the optical system is to adjust the collimator, which can be a very inconvenient and time consuming production process.
因此，即使發光元件係安裝在相同基板上，亦需要促進 該等發光元件與其等之各自光學元件之對準。 Therefore, even if the light-emitting elements are mounted on the same substrate, it is necessary to promote The alignment of the illuminating elements with their respective optical elements.
本發明之一目的為克服此問題且促進發光元件與其等之各自光學元件之對準(即使該等發光元件係安裝在相同基板上)。 It is an object of the present invention to overcome this problem and to facilitate alignment of the light elements with their respective optical elements (even if the light elements are mounted on the same substrate).
根據本發明之一態樣，由一基板實現此及其他目的，該基板包括：一第一分段，其具有用於連接一第一發光元件之一第一接觸墊；及一第二分段，其具有用於連接一第二發光元件之一第二接觸墊，其中該基板具有自該基板之一邊緣延伸至該基板內之一點之至少一通孔使得可藉由將一機械力施加至該基板而在該基板之一平面中實現該基板之該第一分段與該基板之該第二分段之間之一相對移動。 According to one aspect of the present invention, the present invention and other objects are achieved by a substrate comprising: a first segment having a first contact pad for connecting a first light emitting element; and a second segment Having a second contact pad for connecting a second illuminating element, wherein the substrate has at least one through hole extending from an edge of the substrate to a point in the substrate such that a mechanical force can be applied thereto A substrate and a relative movement between the first segment of the substrate and the second segment of the substrate is implemented in a plane of the substrate.
本發明係基於以下認識：可藉由提供自基板之一邊緣延伸至基板內之一點之至少一通孔而增強一剛性基板之撓性，使得基板之不同分段可在基板之平面中相對於彼此而移動。發明者已進一步認識到：此等通孔之適當配置回應於施加至基板之一機械力而允許在基板之平面中進行用於連接一第一發光元件之一第一接觸墊與用於連接一第二發光元件之一第二接觸墊之間之一相對移動。藉此，可改變第一與第二發光元件(其等係固定安裝至該等第一及第二接觸墊)之間之一相對位置以允許該等第一及第二發光元件之各者與一各自光學元件對準。此使一多腔光學系統之非常精確對準可行且無需調整光學器件，藉此實現一更便利且更具時間效率之生產製程。此外，因為發光元件係配 置在一單一基板上，所以仍允許其組裝及/或可交換性易於發光元件係配置在單獨基板上之一設計。 The present invention is based on the recognition that the flexibility of a rigid substrate can be enhanced by providing at least one via extending from one edge of the substrate to a point in the substrate such that different segments of the substrate can be relative to each other in the plane of the substrate And move. The inventors have further recognized that the proper configuration of such vias allows one of the first contact pads for connecting a first light emitting element to be connected in a plane of the substrate in response to a mechanical force applied to the substrate. One of the second light-emitting elements is moved relative to one of the second contact pads. Thereby, a relative position between the first and second light-emitting elements (which are fixedly mounted to the first and second contact pads) can be changed to allow each of the first and second light-emitting elements to A respective optical component is aligned. This enables very precise alignment of a multi-cavity optical system and eliminates the need to adjust the optics, thereby enabling a more convenient and time efficient production process. In addition, because the light-emitting components are equipped It is placed on a single substrate so that its assembly and/or exchangeability is still allowed to be easily designed in one of the individual substrates.
如熟習此項技術者所認識，通孔之形狀及大小可變動。然而，通孔可較佳具有一細長形狀，諸如穿過基板之平面之一實質上筆直細長凹槽、通道或狹縫。 As will be appreciated by those skilled in the art, the shape and size of the through holes can vary. However, the through holes may preferably have an elongated shape, such as substantially straight elongated grooves, channels or slits through one of the planes of the substrate.
基板可具有複數個通孔，該等通孔之各者自基板之一邊緣延伸至基板內之一點。可藉由增加通孔之數目而實現撓性增強。亦藉由增加通孔之長度而增強撓性。 The substrate can have a plurality of vias, each of which extends from one edge of the substrate to a point within the substrate. Flexibility enhancement can be achieved by increasing the number of vias. Flexibility is also enhanced by increasing the length of the through holes.
根據一實施例，(若干)通孔可呈L形。一L形通孔允許其相對側上之分段沿基板之平面之兩個維度移動。此使沿基板之平面中之任何期望方向調整發光元件之位置更容易且藉此促進對準。 According to an embodiment, the (s) vias may be L-shaped. An L-shaped through hole allows the segments on the opposite sides to move in two dimensions along the plane of the substrate. This makes it easier to adjust the position of the light-emitting elements along any desired direction in the plane of the substrate and thereby facilitate alignment.
複數個通孔之一子集可自基板之一第一邊緣延伸，而通孔之剩餘者可自與該第一邊緣相對之基板之一第二邊緣延伸。 A subset of the plurality of vias may extend from a first edge of the substrate, and the remainder of the via may extend from a second edge of the substrate opposite the first edge.
位於在基板內之通孔之一端部可較佳具有一圓形形狀。一圓形形狀之一優點在於：在撓曲期間，應力係分佈在基板之一更大區域上，藉此減小基板破裂之風險。 One end of the through hole located in the substrate may preferably have a circular shape. One advantage of a circular shape is that during deflection, the stress is distributed over a larger area of the substrate, thereby reducing the risk of substrate rupture.
基板可為具有將電連接提供至接觸墊之(若干)電軌道之一(剛性)非導電基板，諸如一印刷電路板(PCB)。電軌道及接觸墊可(例如)蝕刻在一印刷電路板上或為可藉由(例如)一黏著劑而附接之離散元件。一優點在於：一習知基板(諸如一印刷電路板)至一撓性基板之轉換實現具成本效益之一解決方案。 The substrate can be a (rigid) non-conductive substrate, such as a printed circuit board (PCB), having one or more electrical tracks that provide electrical connections to the contact pads. The electrical tracks and contact pads can be etched, for example, on a printed circuit board or as discrete components that can be attached by, for example, an adhesive. One advantage is that the conversion of a conventional substrate (such as a printed circuit board) to a flexible substrate enables a cost effective solution.
此外，根據本發明之基板可被有利包含在一光輸出裝置中，該光輸出裝置進一步包括連接至第一接觸墊之一第一發光元件及連接至第二接觸墊之一第二發光元件。 Furthermore, the substrate according to the present invention may advantageously be included in a light output device further comprising a first light emitting element coupled to one of the first contact pads and a second light emitting element coupled to one of the second contact pads.
光輸出裝置可進一步包括一光學系統，其具有意欲接收來自第一發光元件之光之一第一光學元件及意欲接收來自第二發光元件之光之一第二光學元件，其中第一及第二發光元件之各者可藉由將一機械力施加至基板而與其各自光學元件對準。 The light output device may further include an optical system having a first optical element intended to receive light from the first light emitting element and a second optical element intended to receive light from the second light emitting element, wherein the first and second Each of the light emitting elements can be aligned with their respective optical elements by applying a mechanical force to the substrate.
基板及光學系統可包含經調適以在對準期間配對之參考元件之對應組，以便可實現一更精確對準。 The substrate and optical system can include corresponding sets of reference elements that are adapted to be paired during alignment so that a more precise alignment can be achieved.
基板上之參考元件組可為一組參考孔，且光學系統上之參考元件組可為經調適以與該(等)參考孔配對之一組對應突起。此解決方案比其中基板具有該等突起且光學元件具有該等參考孔之一解決方案容易生產。該(等)突起可呈錐形或具有一斜切邊緣，使得當光學系統之該(等)突起係引入至該(等)參考孔中時該突起將基板之不同分段推入至正確位置中。 The set of reference elements on the substrate can be a set of reference holes, and the set of reference elements on the optical system can be adapted to correspond to one of the pair of reference holes. This solution is easier to produce than a solution in which the substrate has such protrusions and the optical element has one of the reference holes. The protrusions may be tapered or have a beveled edge such that when the (or the) protrusions of the optical system are introduced into the (or) reference holes, the protrusions push different segments of the substrate into the correct position. in.
根據本發明之另一態樣，提供一種製造一撓性基板之方法，其包括以下步驟：提供一基板，該基板包括具有用於連接一第一發光元件之一第一接觸墊之一第一分段及具有用於連接一第二發光元件之一第二接觸墊之一第二分段；形成自該基板之一邊緣延伸至該基板內之一點之至少一通孔，使得可藉由將一機械力施加至該基板而在該基板之 一平面中實現該基板之該第一分段與該基板之該第二分段之間之一相對移動。 According to another aspect of the present invention, a method of manufacturing a flexible substrate is provided, comprising the steps of: providing a substrate comprising: a first contact pad having a first contact pad for connecting a first light emitting element Segmenting and having a second segment of a second contact pad for connecting a second light-emitting element; forming at least one via extending from an edge of the substrate to a point in the substrate such that Mechanical force is applied to the substrate while on the substrate A relative movement between the first segment of the substrate and the second segment of the substrate is achieved in a plane.
此態樣提供與參考前述態樣而論述之優點類似之優點。 This aspect provides advantages similar to those discussed with reference to the foregoing aspects.
基板中之(若干)通孔之形成可包含在基板中產生一(圓形)通孔及產生自該通孔至基板之邊緣之一切口。以此方式，可形成在一通孔之內端處更寬之該通孔，使得在撓曲期間應力係分佈在基板之一更大區域上，藉此減小基板破裂之風險。然而，亦可以其他方式產生該通孔，例如，(若干)通孔可經沖鑽或銑削以實現一期望形狀。 The formation of the via(s) in the substrate can include creating a (circular) via in the substrate and a slit from the via to the edge of the substrate. In this way, the through hole can be formed wider at the inner end of a through hole such that the stress is distributed over a larger area of the substrate during flexing, thereby reducing the risk of substrate rupture. However, the through holes can also be created in other ways, for example, the through holes can be drilled or milled to achieve a desired shape.
方法可包含提供基板中之一組參考元件之步驟。該(等)參考元件促進發光元件與其等之各自光學元件之對準。 The method can include the step of providing a set of reference elements in the substrate. The (equal) reference element facilitates alignment of the illuminating element with its respective optical element.
此外，根據本發明之製造一基板之方法可被有利包含在組裝一光輸出裝置之一方法中，該組裝方法進一步包括將一第一發光元件安裝至基板上之第一接觸墊及將一第二發光元件安裝至基板上之第二接觸墊之步驟。 Furthermore, the method of fabricating a substrate according to the present invention can be advantageously included in a method of assembling a light output device, the method further comprising mounting a first light emitting element to the first contact pad on the substrate and The step of mounting the second light emitting element to the second contact pad on the substrate.
方法可進一步包括以下步驟：提供具有意欲接收來自第一發光元件之光之一第一光學元件及意欲接收來自第二發光元件之光之一第二光學元件之一光學系統；將該光學系統配置在發光元件上方；及藉由將一機械力施加至基板而使第一及第二發光元件之各者與其各自光學元件對準。在對準期間，該光學系統上之一組參考元件可與基板上之一組對應參考元件配對。 The method may further comprise the steps of: providing an optical system having one of the first optical element intended to receive light from the first illuminating element and one of the second optical element intended to receive light from the second illuminating element; configuring the optical system Above the light emitting element; and aligning each of the first and second light emitting elements with their respective optical elements by applying a mechanical force to the substrate. During alignment, a set of reference elements on the optical system can be paired with a corresponding set of reference elements on the substrate.
應注意本發明係關於技術方案中所列舉特徵之全部可能組合。 It should be noted that the present invention pertains to all possible combinations of the features recited in the technical solutions.
現將參考展示本發明之(若干)實施例之附圖而更詳細描述本發明之此及其他態樣。 This and other aspects of the present invention will now be described in more detail with reference to the accompanying drawings.
圖2示意性繪示根據本發明之一實施例之一基板1。基板1可為一(剛性)非導電基板，其包括具有用於連接一第一發光元件之一第一接觸墊22a之一第一分段5a及具有用於連接一第二發光元件之一第二接觸墊22b之一第二分段5b。基板可視情況包含額外接觸墊使得更多發光元件可連接至基板。例如，在圖2之所繪示實例中，存在用於將一第三發光元件連接至基板之一第三分段5c之一第三接觸墊22c。基板亦可包含(若干)導電路徑3，其等在基板內及/或製作在基板上以連接任何期望組態中之接觸墊。例如，此可(例如)藉由使用一習知印刷電路板(PCB)(諸如(例如)一IMS板(MCPCB)或一FR-4板)而實現。 Figure 2 is a schematic illustration of a substrate 1 in accordance with an embodiment of the present invention. The substrate 1 can be a (rigid) non-conductive substrate comprising a first segment 5a having a first contact pad 22a for connecting a first light-emitting element and having a second light-emitting component for connecting The second contact pad 22b is in a second segment 5b. The substrate may optionally include additional contact pads such that more of the light emitting elements can be attached to the substrate. For example, in the illustrated example of FIG. 2, there is a third contact pad 22c for connecting a third light emitting element to one of the third segments 5c of the substrate. The substrate may also include (s) conductive paths 3 that are etc. within the substrate and/or fabricated on the substrate to connect the contact pads in any desired configuration. For example, this can be accomplished, for example, by using a conventional printed circuit board (PCB) such as, for example, an IMS board (MCPCB) or an FR-4 board.
基板1具有一第一組通孔6a至6c，其等以使得可在基板之平面中實現基板之第一分段5a與基板之第二分段5b之間之一相對移動之一方式自基板之一邊緣8、9延伸至基板內之一點20。因此，該配置使得位於各通孔之內端20處之基板之一部分將充當一撓性鉸鏈，該撓性鉸鏈回應於施加至分段5a至5b之一機械力而允許在基板之平面中進行相鄰分段5a至5b之間之相對移動。 The substrate 1 has a first set of through holes 6a to 6c, such as to enable relative movement between one of the first segment 5a of the substrate and the second segment 5b of the substrate in the plane of the substrate. One of the edges 8, 9 extends to a point 20 within the substrate. Thus, this configuration allows a portion of the substrate at the inner end 20 of each via to act as a flexible hinge that allows for movement in the plane of the substrate in response to a mechanical force applied to one of the segments 5a to 5b Relative movement between adjacent segments 5a to 5b.
雖然一單一通孔6a至6c可滿足需要，但通常較佳的是提供額外通孔以增加撓性。例如，在圖2所繪示之實例中，存在配置在第一接觸墊22a與第二接觸墊22b之間之三個通 孔6a至6c。此處，各通孔具有一筆直細長形狀，諸如穿過基板之一凹槽、通道或狹縫。為減小基板被撓曲時之破裂風險，通孔可較佳具有在通孔之內端20處之一圓形形狀。 While a single through hole 6a to 6c may suffice, it is generally preferred to provide an additional through hole to increase flexibility. For example, in the example illustrated in FIG. 2, there are three passes disposed between the first contact pad 22a and the second contact pad 22b. Holes 6a to 6c. Here, each of the through holes has a straight elongated shape such as a groove, a passage or a slit through one of the substrates. To reduce the risk of cracking when the substrate is deflected, the through hole may preferably have a circular shape at the inner end 20 of the through hole.
再者，相鄰通孔較佳自基板之相對邊緣延伸。例如，在圖2所繪示之實例中，第一組通孔6a至6c具有自一第一邊緣8延伸之兩個通孔6a、6c及自與第一邊緣相對之基板之一第二邊緣9延伸之位於另外兩個通孔之間之第三通孔6b。 Furthermore, adjacent vias preferably extend from opposite edges of the substrate. For example, in the example illustrated in FIG. 2, the first set of through holes 6a to 6c have two through holes 6a, 6c extending from a first edge 8 and a second edge of the substrate opposite to the first edge. 9 extends the third through hole 6b between the other two through holes.
如熟習此項技術者所認識，若存在可相對於其他接觸墊而移動之額外接觸墊，則可在基板中形成(若干)額外通孔組。例如，在圖2之所繪示實例中，存在自基板之一邊緣8、9延伸至基板內之一點之一第二組通孔7a至7c，使得第三接觸墊22c可相對於第二接觸墊22b而移動。此允許在基板之平面中進行基板上之全部接觸墊22a至22c之間之相對移動。 As will be appreciated by those skilled in the art, if there are additional contact pads that can be moved relative to other contact pads, an additional set of vias (several) can be formed in the substrate. For example, in the illustrated example of FIG. 2, there is a second set of through holes 7a to 7c extending from one of the edges 8, 9 of the substrate to a point in the substrate such that the third contact pad 22c is rotatable relative to the second contact The pad 22b moves. This allows relative movement between all of the contact pads 22a to 22c on the substrate to be made in the plane of the substrate.
圖2及圖3a中所繪示之通孔主要實現沿與通孔之延伸部實質上垂直之一第一方向(圖3a中繪示為x方向)之分段之間之(一維)相對移動。如熟習此項技術者所認識，其他形狀之通孔亦可實現期望效應。圖3b至圖3c中繪示實現分段之間之一維相對移動之替代形狀通孔之兩個實例。 The through-holes illustrated in Figures 2 and 3a are primarily (one-dimensional) relative to each other in a first direction (shown as the x-direction in Figure 3a) substantially perpendicular to the extension of the through-hole. mobile. Other shapes of through holes can also achieve the desired effect, as will be appreciated by those skilled in the art. Two examples of alternative shape vias that achieve one dimensional relative movement between segments are illustrated in Figures 3b-3c.
亦可設計(若干)通孔使得(若干)通孔之相對側上之基板之分段可沿基板之平面之兩個維度(圖4中繪示為x方向及y方向)而相對於彼此移動。此可藉由使用一或多個L形通孔(6a至6b)而實現，如圖4中所繪示。 The vias may also be designed such that the segments of the substrate on opposite sides of the via(s) are movable relative to each other along two dimensions of the plane of the substrate (shown as x and y directions in FIG. 4) . This can be achieved by using one or more L-shaped vias (6a to 6b), as depicted in FIG.
圖5示意性繪示根據本發明之一實施例之一光輸出裝置。 Figure 5 is a schematic illustration of a light output device in accordance with an embodiment of the present invention.
此處，光輸出裝置包括以上參考圖2而描述之基板1。一第一發光元件2a係電及熱連接至基板1上之第一接觸墊22a，且一第二發光元件2b係電及熱連接至基板上之第二接觸墊22b。在圖5之所繪示實例中，亦存在連接至基板上之第三接觸墊22c之一第三發光元件2c。各發光元件可為一發光二極體(LED)，諸如直接安裝在接觸墊上之一晶片或晶粒。光輸出裝置亦可包括驅動及控制發光元件之所需組件。 Here, the light output device includes the substrate 1 described above with reference to FIG. 2. A first light-emitting element 2a is electrically and thermally connected to the first contact pad 22a on the substrate 1, and a second light-emitting element 2b is electrically and thermally connected to the second contact pad 22b on the substrate. In the example illustrated in FIG. 5, there is also a third light-emitting element 2c connected to the third contact pad 22c on the substrate. Each of the light emitting elements can be a light emitting diode (LED) such as a wafer or die mounted directly on the contact pad. The light output device can also include the required components to drive and control the light emitting elements.
光輸出裝置可進一步包括配置在發光元件上方之一光學系統10。該光學系統包括意欲接收來自第一發光元件2a之光之一第一光學元件11a及意欲接收來自第二發光元件2b之光之一第二光學元件11b。該光學系統可視情況包含意欲接收來自額外發光元件之光之額外光學元件。例如，在圖5之所繪示實例中，存在意欲接收來自第三發光元件2c之光之一第三光學元件11c。 The light output device can further include an optical system 10 disposed above the light emitting element. The optical system includes a first optical element 11a intended to receive light from the first illuminating element 2a and a second optical element 11b intended to receive light from the second illuminating element 2b. The optical system may optionally include additional optical elements intended to receive light from additional illuminating elements. For example, in the illustrated example of FIG. 5, there is a third optical element 11c intended to receive light from the third light-emitting element 2c.
此處，光學元件係準直反射器。各準直反射器可使用一反射表面(例如作為具有一反射表面之一腔)或基於如此項技術中所熟知之全內反射(TIR)(例如藉由使用由聚碳酸酯或PMMA製成之一本體部分)。 Here, the optical element is a collimating reflector. Each collimating reflector can use a reflective surface (e.g., as a cavity having a reflective surface) or based on total internal reflection (TIR) as is well known in the art (e.g., by using polycarbonate or PMMA). a body part).
較佳地，基板1及光學系統10具有對應參考元件組12、13以確保光學元件11a至11c與基板上之發光元件2a至2c適當對準。例如，光學系統可包含與基板中之一或多個對應 參考孔12配對之一或多個突起13(例如銷)，或反之亦然。參考元件係較佳配置在發光元件附近以確保足夠精確度。 Preferably, the substrate 1 and the optical system 10 have corresponding reference element groups 12, 13 to ensure proper alignment of the optical elements 11a to 11c with the light-emitting elements 2a to 2c on the substrate. For example, the optical system can include one or more corresponding to the substrate The reference hole 12 is paired with one or more protrusions 13 (eg, pins), or vice versa. The reference component is preferably disposed adjacent to the illuminating component to ensure sufficient accuracy.
基板可視情況熱連接至一散熱元件18，諸如一散熱器。 The substrate may be thermally coupled to a heat dissipating component 18, such as a heat sink, as appropriate.
在操作光輸出裝置之後，電流係經由基板之導電跡線而供應至發光元件，藉此發光元件發出光。可由光學系統之光學組件定形所發出光之輻射圖樣。此處，所發出光係經準直。此外，可藉由直接熱接觸而將由發光元件產生之熱自基板轉移至散熱器以冷卻發光元件。 After operating the light output device, current is supplied to the light emitting elements via conductive traces of the substrate, whereby the light emitting elements emit light. The radiant pattern of the emitted light can be shaped by the optical components of the optical system. Here, the emitted light is collimated. In addition, heat generated by the light-emitting elements can be transferred from the substrate to the heat sink by direct thermal contact to cool the light-emitting elements.
現將進一步參考圖6中之流程圖而描述根據本發明之一實施例之一撓性基板之一製造方法。 A method of fabricating one of the flexible substrates according to an embodiment of the present invention will now be described with further reference to the flow chart of FIG.
在步驟S1中，提供一(剛性)非導電基板1。該基板包括具有用於連接一第一發光元件2a之一第一接觸墊22a之一第一分段5a及具有用於連接一第二發光元件2b之一第二接觸墊22b之一第二分段5b。該基板可包含(若干)導電路徑，其等在該基板內及/或製作在該基板上以連接期望組態中之板上各種組件。該基板通常可為一習知印刷電路板(PCB)，諸如(例如)一IMS板(MCPCB)或一FR-4板。 In step S1, a (rigid) non-conductive substrate 1 is provided. The substrate includes a first segment 5a having a first contact pad 22a for connecting a first light emitting element 2a and a second segment having a second contact pad 22b for connecting a second light emitting element 2b Section 5b. The substrate can include a conductive path(s) that are within the substrate and/or fabricated on the substrate to connect various components on a board in a desired configuration. The substrate can typically be a conventional printed circuit board (PCB) such as, for example, a IMS board (MCPCB) or an FR-4 board.
在步驟S2中，於基板中形成一組通孔6a至6c。通孔6a至6c自基板之一邊緣延伸至基板內之一點，且以使得可回應於施加至基板之一機械力而在基板之平面中實現基板之第一分段5a與基板之第二分段5b之間之相對移動之一方式配置。例如，可藉由在基板中產生一初始(圓形)通孔20且接著產生自初始通孔20至基板之邊緣之一切口(其穿過基板之平面)而形成各通孔。然而，通孔亦可以其他方式(諸如 藉由沖鑽或銑削)形成且可採取其他形狀。此外，應注意電佈局已經設計使得電軌道3沿形成於基板之邊緣8、9與通孔之內端20之間之基板之小橋接器運行。 In step S2, a set of through holes 6a to 6c are formed in the substrate. The through holes 6a to 6c extend from one edge of the substrate to a point in the substrate such that a second portion of the first segment 5a of the substrate and the substrate can be realized in the plane of the substrate in response to a mechanical force applied to the substrate One of the relative movements between segments 5b is configured. For example, each via may be formed by creating an initial (circular) via 20 in the substrate and then creating a slit from the initial via 20 to one of the edges of the substrate that passes through the plane of the substrate. However, the through hole can also be in other ways (such as It is formed by drilling or milling and can take other shapes. Furthermore, it should be noted that the electrical layout has been designed such that the electrical track 3 operates along a small bridge formed on the substrate between the edges 8, 9 of the substrate and the inner end 20 of the through hole.
較佳地，在步驟S3中，於基板中形成一組參考元件12。各參考元件可(例如)為基板中之一參考孔12，其經調適以接收光學系統中之一對應突起13。參考元件係較佳配置在發光元件附近。 Preferably, in step S3, a set of reference elements 12 are formed in the substrate. Each reference element can be, for example, a reference aperture 12 in the substrate that is adapted to receive a corresponding protrusion 13 in the optical system. The reference component is preferably disposed adjacent to the light emitting component.
現將參考圖6而描述根據本發明之一實施例之一光輸出裝置之一組裝方法。 An assembly method of a light output device according to an embodiment of the present invention will now be described with reference to FIG.
在步驟S4中，將發光元件(諸如發光二極體(LED))安裝至根據步驟S1至S3而製造之基板之接觸墊。因此，第一發光元件2a係連接至基板上之第一接觸墊，且第二發光元件2b係連接至第二接觸墊。此可藉由將基板配置在一焊接夾具(圖中未展示)中且利用焊接來將發光元件連接至接觸墊而實現。應注意發光元件係安裝在相對於參考元件之一預定位置處。因此，為提高精確度且確保各發光元件係安裝在基板上之其所欲位置處(相對於基板中之參考元件12)處，該焊接夾具較佳具有與基板上之參考元件12及由光學系統使用之參考元件對應之一組參考元件(例如突起或銷)。 In step S4, a light-emitting element such as a light-emitting diode (LED) is mounted to the contact pads of the substrate manufactured according to steps S1 to S3. Therefore, the first light emitting element 2a is connected to the first contact pad on the substrate, and the second light emitting element 2b is connected to the second contact pad. This can be achieved by arranging the substrate in a soldering fixture (not shown) and soldering the light emitting elements to the contact pads. It should be noted that the light emitting element is mounted at a predetermined position relative to one of the reference elements. Therefore, in order to improve the accuracy and ensure that each of the light-emitting elements is mounted at a desired position on the substrate (relative to the reference element 12 in the substrate), the soldering fixture preferably has a reference element 12 on the substrate and is optically The reference element used by the system corresponds to a set of reference elements (such as protrusions or pins).
在步驟S5中，提供具有複數個光學元件11a至11b之一光學系統10。此處，該光學系統包括意欲接收來自第一發光元件2a之光之一第一光學元件11a及意欲接收來自第二發光元件2b之光之一第二光學元件11b。 In step S5, an optical system 10 having a plurality of optical elements 11a to 11b is provided. Here, the optical system includes a first optical element 11a intended to receive light from the first light-emitting element 2a and a second optical element 11b intended to receive light from the second light-emitting element 2b.
在步驟S6中，光學系統10係配置在發光元件2a至2b上方。 In step S6, the optical system 10 is disposed above the light-emitting elements 2a to 2b.
在步驟S7中，藉由通過將一力施加至基板之分段5a至5b來個別調整各發光元件在基板之平面中之位置而使各發光元件與其對應光學元件對準。如圖7a至圖7b中所繪示，此可藉由使用光學系統上之錐形突起13而實現，當光學系統之突起13係引入至基板之參考孔12中時突起13導致基板之不同分段移動至其等之適當位置中(即，使發光元件與其對應光學元件對準之位置)。如圖7c中所繪示，光學系統亦可具有含一斜切邊緣之一突起，當光學系統係配置在發光元件上方時該突起壓在基板之邊緣上。 In step S7, each of the light-emitting elements is aligned with its corresponding optical element by individually adjusting the position of each of the light-emitting elements in the plane of the substrate by applying a force to the segments 5a to 5b of the substrate. As shown in Figures 7a to 7b, this can be achieved by using tapered protrusions 13 on the optical system, the protrusions 13 causing different divisions of the substrate when the protrusions 13 of the optical system are introduced into the reference holes 12 of the substrate. The segment is moved into its proper position (i.e., the location at which the illuminating element is aligned with its corresponding optical element). As illustrated in Figure 7c, the optical system can also have a protrusion having a beveled edge that presses against the edge of the substrate when the optical system is disposed over the light emitting element.
可在對準期間進行之發光元件之位移可變動且取決於通孔之長度及數目。通常，可使兩個相鄰發光元件之間之距離改變達約±0.5毫米或更大。 The displacement of the light-emitting elements that can be performed during alignment can vary and depends on the length and number of vias. Generally, the distance between two adjacent light-emitting elements can be varied by about ± 0.5 mm or more.
熟習此項技術者應認識到本發明絕不受限於上述較佳實施例。相反，可在隨附申請專利範圍之範疇內進行諸多修改及變動。例如，本發明不受限於具有準直反射器之一光學系統，但上述發明可有益地用在將發光元件用在一基板上之全部應用中，其中可期望發光元件與(若干)光學組件(諸如透鏡、TIR光學器件或光導)個別對準。光輸出裝置可用在各種應用(諸如(例如)汽車頭燈/尾燈及聚光燈)中。 Those skilled in the art will recognize that the present invention is in no way limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims. For example, the invention is not limited to an optical system having a collimating reflector, but the above described invention may be beneficially used in all applications in which a light emitting element is used on a substrate, wherein the light emitting element and the optical component(s) may be desired Individual alignments (such as lenses, TIR optics, or light guides). Light output devices can be used in a variety of applications such as, for example, automotive headlights/taillights and spotlights.
1‧‧‧基板 1‧‧‧Substrate
2a‧‧‧第一發光元件 2a‧‧‧First light-emitting element
2b‧‧‧第二發光元件 2b‧‧‧second illuminating element
2c‧‧‧第三發光元件 2c‧‧‧3rd light-emitting element
3‧‧‧導電路徑/電軌道 3‧‧‧Electrical path/electrical track
5a‧‧‧第一分段 5a‧‧‧ first paragraph
5b‧‧‧第二分段 5b‧‧‧Second segment
5c‧‧‧第三分段 5c‧‧‧ third subsection
6a‧‧‧通孔 6a‧‧‧through hole
6b‧‧‧通孔 6b‧‧‧through hole
6c‧‧‧通孔 6c‧‧‧through hole
7a‧‧‧通孔 7a‧‧‧through hole
7b‧‧‧通孔 7b‧‧‧through hole
7c‧‧‧通孔 7c‧‧‧through hole
8‧‧‧第一邊緣 8‧‧‧ first edge
9‧‧‧第二邊緣 9‧‧‧ second edge
10‧‧‧光學系統 10‧‧‧Optical system
11a‧‧‧第一光學元件 11a‧‧‧First optical component
11b‧‧‧第二光學元件 11b‧‧‧Second optical component
11c‧‧‧第三光學元件 11c‧‧‧ Third optical component
12‧‧‧參考元件/參考孔 12‧‧‧Reference component/reference hole
13‧‧‧參考元件/突起 13‧‧‧Reference elements/protrusions
18‧‧‧散熱元件 18‧‧‧Heat components
20‧‧‧點/內端 20‧‧‧ points/end
22a‧‧‧第一接觸墊 22a‧‧‧First contact pad
22b‧‧‧第二接觸墊 22b‧‧‧second contact pad
22c‧‧‧第三接觸墊 22c‧‧‧ third contact pad
100‧‧‧照明裝置 100‧‧‧Lighting device
101‧‧‧光學系統 101‧‧‧Optical system
102‧‧‧準直器 102‧‧‧ collimator
103‧‧‧發光二極體/LED 103‧‧‧Lighting diode/LED
104‧‧‧印刷電路板/PCB 104‧‧‧Printed circuit board/PCB
圖1示意性繪示根據先前技術之具有含多個準直器之一光學系統之基於LED之一照明裝置； 圖2示意性繪示根據本發明之一實施例之一基板；圖3a至圖3c示意性繪示實現一維撓性之通孔之各種組態；圖4示意性繪示實現二維撓性之通孔之一組態；圖5示意性繪示根據本發明之一實施例之一光輸出裝置；圖6係展示根據本發明之一實施例之一光輸出裝置之產生步驟之一流程圖；及圖7a至圖7c示意性繪示發光元件與其等之各自光學元件之間之對準。 1 schematically illustrates an LED-based illumination device having an optical system including a plurality of collimators according to the prior art; 2 is a schematic view of a substrate according to an embodiment of the present invention; FIGS. 3a to 3c schematically illustrate various configurations for implementing one-dimensional flexible through-holes; and FIG. 4 is a schematic diagram showing two-dimensional flexibility. One of the through holes is configured; FIG. 5 schematically illustrates a light output device according to an embodiment of the present invention; and FIG. 6 is a flow chart showing a step of generating a light output device according to an embodiment of the present invention. And Figures 7a to 7c schematically illustrate the alignment between the light-emitting elements and their respective optical elements.
1‧‧‧基板 1‧‧‧Substrate
3‧‧‧導電路徑/電軌道 3‧‧‧Electrical path/electrical track
5a‧‧‧第一分段 5a‧‧‧ first paragraph
5b‧‧‧第二分段 5b‧‧‧Second segment
5c‧‧‧第三分段 5c‧‧‧ third subsection
6a‧‧‧通孔 6a‧‧‧through hole
6b‧‧‧通孔 6b‧‧‧through hole
6c‧‧‧通孔 6c‧‧‧through hole
7a‧‧‧通孔 7a‧‧‧through hole
7b‧‧‧通孔 7b‧‧‧through hole
7c‧‧‧通孔 7c‧‧‧through hole
8‧‧‧第一邊緣 8‧‧‧ first edge
9‧‧‧第二邊緣 9‧‧‧ second edge
12‧‧‧參考元件/參考孔 12‧‧‧Reference component/reference hole
20‧‧‧點/內端 20‧‧‧ points/end
22a‧‧‧第一接觸墊 22a‧‧‧First contact pad
22b‧‧‧第二接觸墊 22b‧‧‧second contact pad
22c‧‧‧第三接觸墊 22c‧‧‧ third contact pad
Claims (15)
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| EP11015913 | 2011-03-22 |
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| TW101109740A TW201304081A (en) | 2011-03-22 | 2012-03-21 | Substrate for mounting a plurality of light emitting elements |
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| TWI759388B (en) * | 2016-12-21 | 2022-04-01 | 美商亮銳公司 | An illumination device and method for addressing misalignment of leds on a printed circuit board |
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| TWI759388B (en) * | 2016-12-21 | 2022-04-01 | 美商亮銳公司 | An illumination device and method for addressing misalignment of leds on a printed circuit board |
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