TW201301962A - Wiring body and method for making wiring body - Google Patents
Wiring body and method for making wiring body Download PDFInfo
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- TW201301962A TW201301962A TW101118688A TW101118688A TW201301962A TW 201301962 A TW201301962 A TW 201301962A TW 101118688 A TW101118688 A TW 101118688A TW 101118688 A TW101118688 A TW 101118688A TW 201301962 A TW201301962 A TW 201301962A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本申請發明係關於一種配線體及配線體之製造方法。詳細而言係關於一種搭載有發熱量較大之電子零件之配線體及其製造方法。 The invention of the present application relates to a wiring body and a method of manufacturing the wiring body. More specifically, it relates to a wiring body on which an electronic component having a large amount of heat is mounted and a method of manufacturing the same.
例如，用作液晶顯示器之背光之照明裝置係具備複數個LED發光元件而構成。上述LED發光元件由於發熱量較大，故而多數情況下係具備散熱性較高之金屬基板等而構成。 For example, an illumination device used as a backlight of a liquid crystal display is configured by a plurality of LED light-emitting elements. Since the LED light-emitting element has a large amount of heat generation, it is often configured to have a metal substrate having a high heat dissipation property.
於使用上述LED發光元件來構成照明裝置之情形時，並不限定於使上述發光元件排列於平坦面。於此種情形時，上述發光元件被搭載於具有曲面或撓曲面之金屬基板等。 When the illumination device is configured using the above-described LED light-emitting element, the light-emitting element is not limited to being arranged on a flat surface. In this case, the light-emitting element is mounted on a metal substrate having a curved surface or a curved surface.
[專利文獻1]日本特開2002-184209號 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-184209
為了高效率地將上述發光元件搭載於金屬基板上，較為理想的是採用焊料回焊(solder reflow)處理。然而，為了提昇散熱性，上述金屬基板等之熱容量變大，從而難以藉由焊料回焊處理來將上述發熱元件搭載於金屬基板上。因此，先前多採用以人工操作將各發光元件連接於金屬基板上之方法，故而存在製造效率較低之問題。 In order to efficiently mount the above-described light-emitting element on a metal substrate, it is preferable to use a solder reflow process. However, in order to improve heat dissipation, the heat capacity of the metal substrate or the like is increased, and it is difficult to mount the heat generating element on the metal substrate by solder reflow processing. Therefore, in the prior art, a method of manually connecting the respective light-emitting elements to the metal substrate has been used, and thus there is a problem that manufacturing efficiency is low.
為了避免上述不良情況，可考慮將預先藉由焊料回焊處理而搭載有發光元件之可撓性印刷配線板積層於散熱座 (heat sink)等散熱性較高之金屬構造體這一方法。 In order to avoid the above-mentioned problem, it is conceivable to laminate a flexible printed wiring board on which a light-emitting element is mounted by solder reflow processing in advance on a heat sink. A method of a metal structure having a high heat dissipation property such as a heat sink.
然而，於將搭載有發光元件之可撓性印刷配線板積層接著於金屬構造體等時，由於無法使較大之擠壓力作用於上述發光元件，故而無法使較大之擠壓力作用於搭載有上述發光元件之區域之背面與上述金屬構造體表面之間。因此，氣泡容易進入至設置有上述發光元件之區域正下方之區域，從而容易產生散熱性能降低之問題。 However, when a flexible printed wiring board on which a light-emitting element is mounted is laminated on a metal structure or the like, a large pressing force cannot be applied to the light-emitting element, so that a large pressing force cannot be applied to The back surface of the region in which the light-emitting element is mounted is placed between the back surface of the metal structure. Therefore, the bubble easily enters the region directly under the region where the above-described light-emitting element is provided, and the problem of a decrease in heat dissipation performance is likely to occur.
又，於構成照明裝置之情形時，存在必須使發光元件沿曲面或撓曲面排列之情形。於此種情形時，由於金屬構造體之可撓性印刷配線板積層面形成為曲面形狀或撓曲形狀，故而難以均一地擠壓可撓性印刷配線板之整個區域進行積層接著。 Further, in the case of constituting the illumination device, there is a case where the light-emitting elements must be arranged along a curved surface or a curved surface. In such a case, since the flexible printed wiring board layer of the metal structure is formed into a curved shape or a curved shape, it is difficult to uniformly press the entire region of the flexible printed wiring board to form a laminate.
又，於沿上述曲面或撓曲面積層有可撓性印刷配線板之情形時，可撓性印刷配線板容易產生應變，由於該應變，而使得氣泡容易進入至接著劑層。因此，金屬基板之散熱性受到阻礙，從而容易產生發光元件之溫度上升之問題。 Further, in the case where the flexible printed wiring board is formed along the curved surface or the flexural area layer, the flexible printed wiring board is likely to be strained, and the strain easily causes the air bubbles to enter the adhesive layer. Therefore, the heat dissipation property of the metal substrate is hindered, and the problem of an increase in the temperature of the light-emitting element is likely to occur.
為了解決上述先前之問題，本申請發明之課題在於提供一種將藉由焊料回焊處理而搭載有電子零件之可撓性印刷配線板不阻礙散熱性地積層接著於金屬構造體的配線體及配線體之製造方法。 In order to solve the above problems, an object of the present invention is to provide a flexible printed wiring board in which an electronic component is mounted by a solder reflow process, and a wiring body and a wiring which are laminated on the metal structure without hindering heat dissipation. The manufacturing method of the body.
本申請案之請求項1之發明係一種配線體，其係將搭載有電子零件之可撓性印刷配線板積層於具有散熱性之金屬構造體而構成者，該配線體具備：加強銅箔層：其設置於上述可撓性印刷配線板之搭載有上述電子零件之區域的 背面側，並且具有35μm以上之厚度；及接著劑層：其將上述可撓性印刷配線板接著於上述金屬構造體；上述加強銅箔層與上述金屬構造體之間之接著劑層中的氣泡率較其他區域之接著劑層的氣泡率設定得小。 The invention of claim 1 is a wiring body in which a flexible printed wiring board on which electronic components are mounted is laminated on a metal structure having heat dissipation properties, and the wiring body includes a reinforced copper foil layer The device is disposed in an area of the flexible printed wiring board on which the electronic component is mounted. a back surface side having a thickness of 35 μm or more; and an adhesive layer: the flexible printed wiring board is attached to the metal structure; and the air bubbles in the adhesive layer between the reinforcing copper foil layer and the metal structure The bubble rate of the adhesive layer is set smaller than that of the other regions.
於本申請發明之配線體中，在藉由焊料回焊處理將電子零件搭載於可撓性印刷配線板之後，將上述可撓性印刷配線板積層接著於具有散熱性之金屬構造體。 In the wiring body of the invention of the present invention, after the electronic component is mounted on the flexible printed wiring board by the solder reflow process, the flexible printed wiring board is laminated to the metal structure having heat dissipation properties.
於本申請發明中，於上述可撓性印刷配線板之至少搭載有上述電子零件之區域的背面側設置有具有35μm以上之厚度之加強銅箔層。藉由設置上述加強銅箔層，使上述電子零件搭載區域之剛性提昇。又，具備電子零件搭載區域正下方之區域對應於上述銅箔之厚度而呈台階狀地***的形態。 In the invention of the present invention, a reinforced copper foil layer having a thickness of 35 μm or more is provided on the back side of the region in which at least the electronic component is mounted on the flexible printed wiring board. By providing the reinforcing copper foil layer described above, the rigidity of the electronic component mounting region is improved. Moreover, the area immediately below the electronic component mounting area is formed so as to be raised in a stepped manner in accordance with the thickness of the copper foil.
根據上述構成，於直接擠壓電子零件之情形時，可使擠壓力集中於上述加強銅箔層形成部分，且可以將存在於上述加強銅箔層與上述金屬構造體表面之間的氣泡與接著劑層一併擠出至周圍之方式進行積層接著，且可使上述電子零件搭載區域正下方之氣泡率小於其他區域。 According to the above configuration, in the case of directly pressing the electronic component, the pressing force can be concentrated on the reinforcing copper foil layer forming portion, and the air bubbles existing between the reinforcing copper foil layer and the surface of the metal structural body can be Then, the layer of the layer is then extruded to the periphery to be laminated, and the bubble rate immediately below the electronic component mounting region can be made smaller than the other regions.
又，由於藉由上述加強銅箔層而使上述電子零件搭載區域之剛性提昇，故而於擠壓上述電子零件搭載區域之周圍之情形時，亦可使較大之擠壓力作用於上述電子零件搭載區域。藉此，於積層接著可撓性印刷配線板之步驟中，可將上述電子零件搭載區域中之氣泡與接著劑一併擠出至周圍。因此，可使上述電子零件搭載區域中之散熱性高於 其他區域。 Further, since the rigidity of the electronic component mounting region is improved by the reinforcing copper foil layer, when the periphery of the electronic component mounting region is pressed, a large pressing force can be applied to the electronic component. Mounting area. Thereby, in the step of laminating the flexible printed wiring board, the air bubbles in the electronic component mounting region and the adhesive can be collectively extruded to the surroundings. Therefore, the heat dissipation in the mounting area of the electronic component can be made higher than Other areas.
另一方面，雖然電子零件搭載區域以外之區域中之氣泡率變大，但由於上述銅箔之導熱率較高，而且可確保上述電子零件搭載區域正下方之區域之散熱性，故而電子零件之溫度不會上升。 On the other hand, although the bubble ratio in the region other than the electronic component mounting region is increased, the thermal conductivity of the copper foil is high, and the heat dissipation property of the region directly under the electronic component mounting region can be ensured, so that the electronic component is The temperature will not rise.
為了確保散熱性，如請求項2之發明般，較佳為，設定為上述加強銅箔層與上述金屬構造體之間之接著劑層中之氣泡率成為20%以下。為了成為上述氣泡率，設定發揮作用之擠壓力、擠壓時間等，而進行上述可撓性印刷配線板與上述金屬構造體之積層步驟。藉由設為上述氣泡率，可不阻礙散熱性地積層印刷配線板。再者，於本申請發明中，由於存在朝厚度方向之熱傳導受到氣泡阻礙之問題，故而接著劑層中之每單位體積之氣泡率不太重要，而將接著劑層中之氣泡投影至接著面之面積比率較為重要。因此，於本申請發明中，以將接著劑層中之氣泡投影至接著面之面積比率求出氣泡率。 In order to ensure heat dissipation, as in the invention of claim 2, it is preferable that the bubble ratio in the adhesive layer between the reinforcing copper foil layer and the metal structure is 20% or less. In order to achieve the above-described bubble ratio, a step of laminating the flexible printed wiring board and the metal structure is performed by setting a pressing force, a pressing time, and the like. By setting the bubble ratio as described above, the printed wiring board can be laminated without hindering heat dissipation. Further, in the invention of the present application, since there is a problem that heat conduction in the thickness direction is hindered by the bubble, the bubble rate per unit volume in the adhesive layer is less important, and the bubble in the adhesive layer is projected to the subsequent surface. The area ratio is more important. Therefore, in the invention of the present application, the bubble ratio is obtained by projecting the area ratio of the bubble in the adhesive layer to the adhesion surface.
上述銅箔可藉由如下方式而設置：將於絕緣性基材之兩側設置有銅箔之雙面可撓性印刷配線板之一面之銅箔設定得較厚，且以蝕刻等方法來除去上述電子零件搭載區域以外之部分。 The copper foil may be provided by setting a copper foil on one side of a double-sided flexible printed wiring board provided with copper foil on both sides of an insulating substrate to be thick, and removing it by etching or the like. The part other than the above-mentioned electronic component mounting area.
如請求項3之發明般，為了高效率地使積層步驟中之擠壓力發揮作用，較佳為，將上述加強銅箔層至少設置於連接上述電子零件之連接電極的區域的背面側。又，由於上述連接電極亦為熱之傳導路徑，故而可高效率地將於電 子零件中產生之熱傳導至金屬構造體而進行散熱。再者，上述連接電極亦包括例如為了進行散熱而設置之未通電之電極。 In order to efficiently exert the pressing force in the laminating step as in the invention of claim 3, it is preferable that the reinforcing copper foil layer be provided at least on the back side of the region where the connection electrode of the electronic component is connected. Moreover, since the connection electrode is also a heat conduction path, it can be efficiently charged. The heat generated in the sub-parts is transferred to the metal structure for heat dissipation. Furthermore, the connection electrode also includes an electrode that is not energized, for example, for heat dissipation.
進而，為了防止氣泡進入，如請求項4之發明般，較佳為，具備設定於較搭載有上述電子零件之區域更外側的擠壓區域而構成上述加強銅箔層。藉由設置上述擠壓區域，可使作用於上述電子零件搭載區域之擠壓力進一步提昇。 Further, in order to prevent the entry of the air bubbles, as in the invention of claim 4, it is preferable to form the reinforcing copper foil layer by providing a pressing region set to be outside the region in which the electronic component is mounted. By providing the above-described pressing region, the pressing force acting on the above-described electronic component mounting region can be further improved.
再者，較為理想的是上述擠壓區域對稱地設置於包挾上述電子零件搭載區域之兩側。藉此，可使擠壓力無偏差地作用於上述電子零件搭載區域之整個區域。 Further, it is preferable that the pressing regions are symmetrically provided on both sides of the electronic component mounting region. Thereby, the pressing force can be applied to the entire area of the electronic component mounting region without any deviation.
為了防止氣泡進入並且確保散熱性，如請求項5之發明般，較佳為，將上述銅箔設置為搭載有上述電子零件之區域的80%以上。例如可應用於利用上述加強銅箔層而將可撓性印刷配線板用作雙面基板之情形等。 In order to prevent the entry of air bubbles and to ensure heat dissipation, as in the invention of claim 5, it is preferable that the copper foil is provided in an amount of 80% or more of a region in which the electronic component is mounted. For example, it can be applied to a case where the flexible printed wiring board is used as a double-sided board by the above-mentioned reinforced copper foil layer.
進而，為了提昇氣泡之排除效果，如請求項7之發明般，較佳為，將上述加強銅箔層設定為70μm以上之厚度。 Further, in order to enhance the effect of eliminating the bubbles, as in the invention of claim 7, it is preferable to set the reinforcing copper foil layer to a thickness of 70 μm or more.
上述可撓性印刷配線板之構成及種類並無特別限定。不僅可採用於一面設置有搭載有電子零件之電路面的單面可撓性印刷配線板，亦可採用雙面印刷配線板。 The configuration and type of the above flexible printed wiring board are not particularly limited. It is possible to use not only a single-sided flexible printed wiring board on which a circuit surface on which electronic components are mounted but also a double-sided printed wiring board.
上述金屬構造體之材料亦無特別限定。例如可採用鋁製之金屬構造體。又，金屬構造體之形態亦無特別限定。例如可採用平坦板狀之金屬構造體。又，如請求項6之發明般，可採用上述金屬構造體之可撓性印刷配線板積層面 為曲面或撓曲面者。 The material of the above metal structure is also not particularly limited. For example, a metal structure made of aluminum can be used. Further, the form of the metal structure is also not particularly limited. For example, a flat plate-shaped metal structure can be used. Further, as in the invention of claim 6, the flexible printed wiring board layer of the above metal structure can be used. For curved or curved surfaces.
於該情形時，上述可撓性印刷配線板係於彎曲狀態或撓曲狀態下得以積層接著。於本申請發明中，由於設置有上述銅箔，故而上述電子零件搭載區域之剛性提昇。藉此，於上述電子零件搭載區域中不易產生應變，且可抑制氣泡進入至接著劑層。又，由於使擠壓力作用於電子零件搭載區域或擠壓區域，故而於曲面狀之積層面亦可容易地進行積層。 In this case, the flexible printed wiring board is laminated in a bent state or a flexed state. In the invention of the present application, since the copper foil is provided, the rigidity of the electronic component mounting region is improved. Thereby, strain is less likely to occur in the above-described electronic component mounting region, and it is possible to suppress entry of bubbles into the adhesive layer. Further, since the pressing force acts on the electronic component mounting region or the pressing region, the laminated layer can be easily laminated.
又，作為上述金屬構造體，如請求項8之發明般，可採用具備散熱片等散熱手段之散熱座。 Further, as the metal structure, as in the invention of claim 8, a heat sink having a heat dissipating means such as a heat sink may be employed.
本申請發明之配線體可應用於各種電子裝置。例如，如請求項9之發明般，可採用發光元件作為上述電子零件而構成照明裝置。 The wiring body of the invention of the present application can be applied to various electronic devices. For example, as in the invention of claim 9, a light-emitting element can be used as the electronic component to constitute an illumination device.
請求項10之發明係一種配線體之製造方法，其係用以製造搭載有發熱之電子零件的配線體，該配線體之製造方法包括：可撓性印刷配線板製造步驟：製造至少於搭載有上述電子零件之區域之背面側具備具有35μm以上之厚度之加強銅箔層的可撓性印刷配線板；電子零件搭載步驟：藉由焊料回焊處理將上述電子零件搭載於上述可撓性印刷配線板；及積層步驟：隔著接著劑層而將上述可撓性印刷配線板積層於金屬構造體；於上述積層步驟中，以將上述銅箔與上述金屬構造體表面之間之氣泡連同接著劑層一併擠出之方式，擠壓積層上述電子零件及/或上述可撓性印刷配線板。 The invention of claim 10 is a method of manufacturing a wiring body for manufacturing a wiring body on which electronic components for heating are mounted, and a method of manufacturing the wiring body includes a step of manufacturing a flexible printed wiring board: manufacturing at least a flexible printed wiring board having a reinforced copper foil layer having a thickness of 35 μm or more in a region on the back side of the electronic component; and an electronic component mounting step of mounting the electronic component on the flexible printed wiring by solder reflow processing a step of laminating the flexible printed wiring board to the metal structure via the adhesive layer; and forming a bubble between the copper foil and the surface of the metal structure together with the adhesive in the laminating step The layer is extruded together to laminate the electronic component and/or the flexible printed wiring board.
於本申請發明中，由於設置有上述加強銅箔層，故而於直接擠壓電子零件之情形時，可使上述擠壓力集中於設置有上述加強銅箔層之區域。因此，可以將上述加強銅箔層與上述金屬構造體表面之間之接著劑層與氣泡一併擠出之方式，積層上述可撓性印刷配線板。 In the invention of the present application, since the reinforcing copper foil layer is provided, when the electronic component is directly pressed, the pressing force can be concentrated on a region where the reinforcing copper foil layer is provided. Therefore, the flexible printed wiring board can be laminated so that the adhesive layer between the reinforcing copper foil layer and the surface of the metal structure is extruded together with the air bubbles.
又，於藉由上述加強銅箔層而使上述電子零件搭載區域之剛性提昇、且擠壓該區域之周圍之情形時，亦可使較大之擠壓力作用於上述加強銅箔層。其結果，於上述積層步驟中，可以將上述加強銅箔層與上述金屬構造體表面之間之接著劑層內之氣泡與上述接著劑層一併擠出之方式，擠壓上述電子零件及上述可撓性印刷配線板。 Further, when the rigidity of the electronic component mounting region is raised by the reinforcing copper foil layer and the periphery of the region is pressed, a large pressing force acts on the reinforcing copper foil layer. As a result, in the stacking step, the electronic component and the above-described electronic component may be extruded by extruding the bubble in the adhesive layer between the reinforcing copper foil layer and the surface of the metal structure together with the adhesive layer. Flexible printed wiring board.
上述積層步驟中之擠壓部位並無特別限定。如請求項11之發明般，可以包括使擠壓力作用於搭載後之電子零件的電子零件擠壓步驟之方式進行上述擠壓步驟。再者，上述電子零件擠壓步驟可藉由作用有不會使電子零件破壞、或產生故障之程度之力而進行。 The pressing portion in the above laminating step is not particularly limited. As in the invention of claim 11, the pressing step may be performed in such a manner that the pressing force acts on the electronic component pressing step of the mounted electronic component. Furthermore, the above-described electronic component pressing step can be performed by a force acting to prevent the electronic component from being broken or causing a malfunction.
請求項12之發明中，上述擠壓步驟係包括銅箔擠壓步驟而進行，該銅箔擠壓步驟係對設定於較搭載有上述電子零件之區域更外側的上述銅箔之擠壓區域進行擠壓。 In the invention of claim 12, the pressing step is performed by a copper foil pressing step of performing a pressing region of the copper foil set to be outside the region in which the electronic component is mounted. extrusion.
藉由擠壓上述擠壓區域，而於擠壓電子零件搭載區域之周圍之情形時，亦可使較大之擠壓力作用於電子零件搭載區域而擠出氣泡。 When the extrusion region is pressed to press around the electronic component mounting region, a large pressing force acts on the electronic component mounting region to extrude the air bubbles.
可獲得一種藉由擠出電子零件搭載區域之背面側之氣泡而使導熱性提昇、從而可高效率地散發出由電子零件產 生之熱的配線體。 It is possible to increase the thermal conductivity by ejecting the air bubbles on the back side of the mounting area of the electronic component, thereby efficiently emitting the electronic components. The heat wiring body.
以下，基於圖對本申請發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described based on the drawings.
圖1至圖3表示本申請發明之第1實施形態。圖1係第1實施形態中使用之可撓性印刷配線板1之主要部分剖面圖。可撓性印刷配線板1構成為具備由聚醯亞胺等絕緣性樹脂形成之基材膜2、積層於該基材膜2之上表面且由銅箔形成之電路圖案3、於該電路圖案3之特定部位露出之電子零件連接電極4、隔著焊料11而與該電子零件連接電極4連接之電子零件5、以及覆蓋上述電子零件連接電極4以外之區域之覆蓋層6及接著劑層7。採用LED發光元件作為上述電子零件5，且隔著焊料11而將設置於上述電子零件5之下表面之電極10與上述電子零件連接電極4連接。 Fig. 1 to Fig. 3 show a first embodiment of the invention of the present application. Fig. 1 is a cross-sectional view showing a main portion of a flexible printed wiring board 1 used in the first embodiment. The flexible printed wiring board 1 is configured to include a base film 2 made of an insulating resin such as polyimide, a circuit pattern 3 laminated on the upper surface of the base film 2 and formed of a copper foil, and the circuit pattern. The electronic component connection electrode 4 in which the specific portion is exposed, the electronic component 5 connected to the electronic component connection electrode 4 via the solder 11, and the cover layer 6 and the adhesive layer 7 covering the region other than the electronic component connection electrode 4 . An LED light-emitting element is used as the electronic component 5, and the electrode 10 provided on the lower surface of the electronic component 5 is connected to the electronic component connection electrode 4 via the solder 11.
於本實施形態中，採用雙面可撓性印刷配線板作為上述可撓性印刷配線板1，於背面側亦積層有未圖示之形成電路圖案之銅箔。又，於背面側亦設置有保護藉由上述銅箔而形成之電路圖案的覆蓋層8及接著劑層9。 In the present embodiment, a double-sided flexible printed wiring board is used as the flexible printed wiring board 1, and a copper foil (not shown) forming a circuit pattern is laminated on the back side. Further, a cover layer 8 and an adhesive layer 9 for protecting a circuit pattern formed by the copper foil are also provided on the back side.
如圖1所示，於搭載有上述電子零件5之區域之背面側，設置有使形成背面側電路圖案之銅箔殘留而形成之加強銅箔層12。於本實施形態中，上述加強銅箔層12之厚度設定為35μm，且形成為與周圍之區域相比上述電子零件搭載區域之背面僅對應於上述厚度而呈凸狀突出之形態。上述可撓性印刷配線板1積層接著於具有散熱性之金屬構造體。 As shown in FIG. 1, a reinforcing copper foil layer 12 formed by leaving a copper foil forming a back side circuit pattern is provided on the back side of the region on which the electronic component 5 is mounted. In the present embodiment, the thickness of the reinforced copper foil layer 12 is set to 35 μm, and the back surface of the electronic component mounting region is formed to protrude convexly only in accordance with the thickness. The flexible printed wiring board 1 is laminated on the metal structure having heat dissipation properties.
圖2係表示將上述可撓性印刷配線板1積層接著於金屬構造體15之前之狀態的剖面圖。如該圖所示，上述可撓性印刷配線板1係隔著接著劑層16而積層接著於上述金屬構造體15。上述接著劑層16中含有多個氣泡17，於此狀態下，接著劑層16之導熱率變低，從而無法確保所需之散熱性能。 FIG. 2 is a cross-sectional view showing a state in which the flexible printed wiring board 1 is laminated in the state before the metal structure 15 is laminated. As shown in the figure, the flexible printed wiring board 1 is laminated on the metal structure 15 via the adhesive layer 16. The plurality of cells 17 are contained in the adhesive layer 16, and in this state, the thermal conductivity of the adhesive layer 16 is lowered, so that the required heat dissipation performance cannot be ensured.
自圖2所示之狀態，進行如下之積層步驟：利用壓模(press die)20使特定之壓力作用於上述電子零件5之周圍之區域，藉此將可撓性印刷配線板1積層接著於金屬構造體15。於本實施形態中，因於上述電子零件搭載區域之背面側設置有厚度為35μm之加強銅箔層12，故而係以「由藉由上述加強銅箔層12而形成之凸狀部來推開以特定厚度存在於上述金屬構造體15之表面的接著劑層16」之方式進行擠壓。藉此，介於上述加強銅箔層12與上述金屬構造體15之表面之間的接著劑層16之一部分，係以自設置有上述加強銅箔層12之區域被擠出之方式變形，並且上述氣泡17自上述電子零件搭載區域被擠出。 From the state shown in Fig. 2, a lamination step is performed in which a specific pressure is applied to a region around the electronic component 5 by a press die 20, whereby the flexible printed wiring board 1 is laminated. Metal structure 15. In the present embodiment, since the reinforcing copper foil layer 12 having a thickness of 35 μm is provided on the back side of the electronic component mounting region, "the convex portion formed by the reinforcing copper foil layer 12 is pushed away. The pressing is performed in such a manner that the adhesive layer 16'' exists on the surface of the above-mentioned metal structure 15 with a specific thickness. Thereby, a portion of the adhesive layer 16 interposed between the reinforcing copper foil layer 12 and the surface of the metal structural body 15 is deformed in such a manner that the region from which the reinforcing copper foil layer 12 is provided is extruded, and The bubble 17 is extruded from the electronic component mounting region.
如圖3所示，上述積層步驟已結束之配線體100中，上述加強銅箔層12與上述金屬構造體15之間之接著劑層16中的氣泡率小於周圍之區域的氣泡率。藉此，可防止上述電子零件搭載區域正下方之區域中之導熱性能因接著劑層16中所含之上述氣泡17而降低，從而可高效率地使由電子零件5產生之熱傳導至上述金屬構造體15而散熱。 As shown in FIG. 3, in the wiring body 100 in which the stacking step is completed, the bubble ratio in the adhesive layer 16 between the reinforcing copper foil layer 12 and the metal structure 15 is smaller than the bubble ratio in the surrounding region. Thereby, it is possible to prevent the heat conduction performance in the region directly under the electronic component mounting region from being lowered by the air bubbles 17 contained in the adhesive layer 16, and to efficiently transfer the heat generated by the electronic component 5 to the metal structure. The body 15 is cooled.
由於上述電子零件5可藉由焊料回焊處理而與上述可 撓性印刷配線板1連接，故而與先前之利用人工操作的電子零件連接步驟相比，作業效率明顯地提昇。 Since the above electronic component 5 can be processed by solder reflow, Since the flexible printed wiring board 1 is connected, the work efficiency is remarkably improved as compared with the previous electronic component connection step using manual operation.
又，藉由設置上述加強銅箔層12，而使上述電子零件搭載區域之剛性變大。藉此，即便擠壓上述電子零件搭載區域之周圍，亦可使較大之擠壓力作用於上述電子零件搭載區域之內側。又，即便於直接擠壓電子零件之情形時，亦可使擠壓力集中於設置有上述加強銅箔層12之部分。因此，可高效率地將上述氣泡17與接著劑層16之一部分一併排除至周圍之區域。再者，本實施形態中係將電子零件設為LED發光元件，但並不特別限定於此，只要為發熱之電子零件，便可期待相同之效果。 Further, by providing the reinforcing copper foil layer 12 described above, the rigidity of the electronic component mounting region is increased. Thereby, even if the periphery of the electronic component mounting region is pressed, a large pressing force acts on the inner side of the electronic component mounting region. Further, even in the case of directly pressing the electronic component, the pressing force can be concentrated on the portion where the reinforcing copper foil layer 12 is provided. Therefore, the bubble 17 and one portion of the adhesive layer 16 can be efficiently removed to the surrounding area. In the present embodiment, the electronic component is an LED light-emitting device. However, the present invention is not particularly limited thereto, and the same effect can be expected as long as it is an electronic component that generates heat.
圖4表示本申請發明之第2實施形態。本實施形態係將本申請發明之可撓性印刷配線板201積層接著於具有撓曲部250之金屬構造體215。 Fig. 4 shows a second embodiment of the invention of the present application. In the present embodiment, the flexible printed wiring board 201 of the present invention is laminated on the metal structure 215 having the flexure portion 250.
如圖4所示，本實施形態中係採用於一面形成有電路圖案203之單面可撓性印刷配線板201。因此，無需如第1實施形態般於背面側設置用於電路保護之覆蓋層等。 As shown in FIG. 4, in the present embodiment, a single-sided flexible printed wiring board 201 in which a circuit pattern 203 is formed on one surface is used. Therefore, it is not necessary to provide a cover layer for circuit protection or the like on the back side as in the first embodiment.
於本申請發明中，由於僅於上述電子零件搭載區域之背面設置有加強銅箔層212，故而可撓性印刷配線板201之設置有上述加強銅箔層212之區域以外之區域的撓曲性較高。因此，可沿上述金屬構造體215之撓曲面積層接著上述可撓性印刷配線板201。 In the invention of the present invention, since the reinforcing copper foil layer 212 is provided only on the back surface of the electronic component mounting region, the flexible printed wiring board 201 is provided with the flexibility of the region other than the region of the reinforcing copper foil layer 212. Higher. Therefore, the flexible printed wiring board 201 can be adhered along the flexural area layer of the metal structure 215 described above.
而且，於本實施形態中，藉由擠壓上述電子零件搭載區域及其周圍之部分，而使上述電子零件搭載區域正下方 之接著劑層216變形而擠出氣泡，從而可確保散熱性。又，由於上述可撓性印刷配線板201之電子零件搭載區域之剛性較高，故而不易變形。因此，可撓性印刷配線板201中之電子零件搭載區域不易產生應變等，從而亦可抑制氣泡之產生。再者，撓曲角度並無限定，可沿剖面為L字狀之金屬構造體215之撓曲面積層接著。 Further, in the present embodiment, the electronic component mounting region and the surrounding portion thereof are pressed to directly below the electronic component mounting region. The adhesive layer 216 is deformed to extrude bubbles, thereby ensuring heat dissipation. Moreover, since the electronic component mounting region of the flexible printed wiring board 201 has high rigidity, it is not easily deformed. Therefore, in the electronic component mounting region of the flexible printed wiring board 201, strain or the like is less likely to occur, and generation of bubbles can be suppressed. Further, the deflection angle is not limited, and the deflection area layer of the metal structure 215 having an L-shaped cross section may be followed.
圖5表示本申請發明之第3實施形態。於對金屬構造體315積層接著可撓性印刷配線板301時，若可撓性印刷配線板301於橫方向偏移，則無法較佳地擠出氣泡。因此，較為理想的是於上述積層步驟中以可一面對可撓性印刷配線板301進行定位一面進行擠壓之方式構成。 Fig. 5 shows a third embodiment of the invention of the present application. When the metal structure 315 is laminated on the flexible printed wiring board 301, if the flexible printed wiring board 301 is displaced in the lateral direction, air bubbles cannot be preferably extruded. Therefore, it is preferable that the laminate step is performed so as to be pressed while facing the flexible printed wiring board 301.
於圖5所示之第3實施形態中，利用能將可撓性印刷配線板301與金屬構造體315於積層方向上加以可相對移動地卡合之定位銷330來進行積層步驟。於上述可撓性印刷配線板301及上述金屬構造體315形成有定位孔，並且連通地***有上述定位銷330。因此，可不使上述可撓性印刷配線板301與上述金屬構造體315於橫方向偏移地作用擠壓力而進行積層接著。 In the third embodiment shown in FIG. 5, the step of laminating the flexible printed wiring board 301 and the metal structure 315 in a laminating direction is performed by a positioning pin 330 that is relatively movable. A positioning hole is formed in the flexible printed wiring board 301 and the metal structure 315, and the positioning pin 330 is inserted in communication. Therefore, the flexible printed wiring board 301 and the metal structure 315 can be laminated without being biased in the lateral direction.
圖6~圖8表示本申請發明之第4實施形態。利用該實施形態來確認本申請發明之作用效果。本實施形態中搭載有LED發光元件405作為電子零件。 6 to 8 show a fourth embodiment of the invention of the present application. The effects of the invention of the present application were confirmed by this embodiment. In the present embodiment, the LED light-emitting element 405 is mounted as an electronic component.
於第4實施形態中，沿矩形板狀之金屬構造體415之一邊而積層接著有搭載有複數個LED發光元件405之可撓性印刷配線板401。由於上述可撓性印刷配線板401之構成 與上述實施形態相同，故而省略其說明。 In the fourth embodiment, a flexible printed wiring board 401 on which a plurality of LED light-emitting elements 405 are mounted is laminated along one side of a rectangular plate-shaped metal structure 415. Due to the composition of the above flexible printed wiring board 401 The same as the above embodiment, the description thereof will be omitted.
利用該實施形態，驗證接著劑層之氣泡率及散熱特性根據設置加強銅箔層之區域及銅箔之厚度會如何變化。 According to this embodiment, it is verified how the bubble ratio and the heat dissipation characteristics of the adhesive layer change depending on the region where the copper foil layer is reinforced and the thickness of the copper foil.
如圖7所示，作為本實施形態之電子零件的發光元件405具備8 mm×5 mm之搭載面積。相對於上述LED發光元件405之搭載面積而變更設置於可撓性印刷配線板401之背面之加強銅箔層之面積、加強銅箔之厚度，測定發光元件405之溫度上升、連接電極間之焊料溫度、及設置有上述加強銅箔層之區域中之接著劑層之氣泡率。再者，上述氣泡率係利用超音波探傷裝置自金屬構造體側觀察金屬構造體表面與可撓性印刷配線板間之接著劑層，且根據氣泡之投影面積之比率而算出。 As shown in Fig. 7, the light-emitting element 405 as an electronic component of the present embodiment has a mounting area of 8 mm × 5 mm. The area of the reinforced copper foil layer provided on the back surface of the flexible printed wiring board 401 is changed with respect to the mounting area of the LED light-emitting element 405, and the thickness of the copper foil is reinforced. The temperature rise of the light-emitting element 405 and the solder between the electrodes are measured. The temperature, and the bubble ratio of the adhesive layer in the region where the above-mentioned reinforcing copper foil layer is provided. In addition, the bubble ratio is obtained by observing the adhesive layer between the surface of the metal structure and the flexible printed wiring board from the side of the metal structure by the ultrasonic flaw detector, and calculating the ratio based on the projected area of the bubble.
於圖8中，比較例1係於藉由熱壓而將可撓性印刷配線板(FPC，Flexible Print Circuit)積層接著於上述金屬構造體415之後連接LED發光元件405而構成者。又，比較例2係於將LED發光元件405與於背面不具有加強銅箔層之可撓性印刷配線板(FPC)連接後積層接著於金屬構造體415而構成者。 In FIG. 8, Comparative Example 1 is constructed by laminating a flexible printed wiring board (FPC) by thermal pressing and then connecting the LED light-emitting elements 405 to the metal structure 415. Further, in Comparative Example 2, the LED light-emitting element 405 is connected to a flexible printed wiring board (FPC) having no reinforcing copper foil layer on its back surface, and is laminated on the metal structure 415.
實施例1至實施例6均係於搭載有LED發光元件405之區域之背面側設置銅箔而構成者。實施例1至實施例3及實施例6係僅於設置有上述LED發光元件405之區域之正下方設置有加強銅箔層者。又，實施例4及實施例5係如圖7所示般於大於上述LED搭載區域之部分設置有加強銅箔層者。又，實施例1中之加強銅箔層之厚度為18μm， 實施例2及實施例4~實施例6中之加強銅箔層之厚度為35μm，實施例3係採用加強銅箔層之厚度為70μm者。 Each of the first to sixth embodiments is formed by providing a copper foil on the back side of the region in which the LED light-emitting element 405 is mounted. The first to third embodiments and the sixth embodiment are provided with a reinforcing copper foil layer directly under the region where the LED light-emitting element 405 is provided. Further, in the fourth embodiment and the fifth embodiment, as shown in Fig. 7, a reinforcing copper foil layer is provided in a portion larger than the LED mounting region. Further, the thickness of the reinforced copper foil layer in Example 1 is 18 μm. The thickness of the reinforced copper foil layer in Example 2 and Examples 4 to 6 was 35 μm, and in Example 3, the thickness of the reinforced copper foil layer was 70 μm.
採用LED發光元件405之溫度及電極連接部之焊料之溫度作為測量項目。上述LED發光元件405之溫度係測定LED通電時之電壓下降量且根據該值及溫度特性而導出者。上述焊料之溫度係藉由貼附於中央部之LED發光元件405之焊料之熱電偶而測定之值。 The temperature of the LED light-emitting element 405 and the temperature of the solder of the electrode connection portion are used as measurement items. The temperature of the LED light-emitting element 405 is a measure of the amount of voltage drop when the LED is energized, and is derived based on the value and the temperature characteristic. The temperature of the solder is measured by a thermocouple attached to the solder of the LED light-emitting element 405 at the center.
根據上述圖8可知，以與先前相同之方法積層接著有連接有LED發光元件405之可撓性印刷配線板之情形時(比較例2)的溫度上升，與積層接著可撓性印刷配線板後連接LED發光元件405之情形時(比較例1)相比，高出5℃以上。又，上述氣泡率之值亦與上述溫度上升對應。因此，於比較例2之方法中，判定出無法充分地散發出由LED發光元件405產生之熱。 As can be seen from the above-mentioned FIG. 8, when the flexible printed wiring board to which the LED light-emitting element 405 is connected is laminated in the same manner as before, the temperature rises (Comparative Example 2), and after the multilayer printed flexible wiring board is laminated. When the LED light-emitting element 405 was connected (Comparative Example 1), it was 5 ° C or more higher. Further, the value of the bubble rate also corresponds to the above temperature increase. Therefore, in the method of Comparative Example 2, it was determined that the heat generated by the LED light-emitting element 405 could not be sufficiently emitted.
另一方面，於在LED發光元件405之正下方設置有加強銅箔層之實施例中，於任一情形時，與上述比較例2相比，LED發光元件之溫度上升之值均較低。又，於在大於上述LED發光元件405之正下方之區域的區域內設置有銅箔之情形時(實施例4及實施例5)，判定出LED發光元件之溫度上升進一步變小。進而，於在小於LED發光元件405之正下方之區域之範圍內設定有銅箔之情形時(實施例6)，亦可期待特定之效果。 On the other hand, in the embodiment in which the reinforcing copper foil layer is provided directly under the LED light-emitting element 405, in either case, the temperature rise value of the LED light-emitting element is lower than that of Comparative Example 2. Further, when copper foil is provided in a region larger than the region directly under the LED light-emitting element 405 (Examples 4 and 5), it is determined that the temperature rise of the LED light-emitting device is further reduced. Further, when a copper foil is set in a range smaller than a region directly under the LED light-emitting element 405 (Example 6), a specific effect can be expected.
但，於加強銅箔層之厚度為18μm之構成(實施例1)中，無法降低LED發光元件之溫度上升。 However, in the configuration in which the thickness of the reinforced copper foil layer was 18 μm (Example 1), the temperature rise of the LED light-emitting element could not be lowered.
於加強銅箔層之厚度為35μm之情形時，於任一情形時LED溫度上升及焊料溫度均成為可使用之範圍。因此，判定出，加強銅箔層之厚度較佳為設定為35μm以上。進而，更佳為使其為70μm以上。 When the thickness of the copper foil layer is 35 μm, the LED temperature rises and the solder temperature becomes a usable range in either case. Therefore, it is determined that the thickness of the reinforced copper foil layer is preferably set to 35 μm or more. Further, it is more preferably 70 μm or more.
上述各實施例中之上述加強銅箔層與上述金屬構造體之間的接著劑層之氣泡率係與上述LED溫度上升大致對應。因此，藉由控制上述接著劑層之氣泡率，可降低配線體之溫度上升。 The bubble ratio of the adhesive layer between the reinforcing copper foil layer and the metal structure in each of the above embodiments substantially corresponds to the rise in the temperature of the LED. Therefore, by controlling the bubble ratio of the above-mentioned adhesive layer, the temperature rise of the wiring body can be reduced.
根據上述試驗結果可知，較佳為，以上述加強銅箔層與上述金屬構造體之間之接著劑層中之氣泡率成為20%以下之方式構成。再者，本實施形態中係將電子零件設為LED發光元件，但並不特別限定於此，只要為發熱之電子零件，便可期待相同之效果。 According to the above test results, it is preferable that the bubble ratio in the adhesive layer between the reinforcing copper foil layer and the metal structure is 20% or less. In the present embodiment, the electronic component is an LED light-emitting device. However, the present invention is not particularly limited thereto, and the same effect can be expected as long as it is an electronic component that generates heat.
本發明提供一種一面確保散熱性一面將搭載有電子零件之可撓性印刷配線板積層接著於金屬構造體而構成的配線體。 The present invention provides a wiring body in which a flexible printed wiring board on which an electronic component is mounted is laminated on a metal structure while ensuring heat dissipation.
1‧‧‧可撓性印刷配線板 1‧‧‧Flexible printed wiring board
2‧‧‧基材膜 2‧‧‧Base film
3‧‧‧電路圖案 3‧‧‧ circuit pattern
4‧‧‧電子零件連接電極 4‧‧‧Electronic parts connection electrode
5‧‧‧電子零件 5‧‧‧Electronic parts
6‧‧‧覆蓋層 6‧‧‧ Coverage
7‧‧‧接著劑層 7‧‧‧ adhesive layer
8‧‧‧覆蓋層 8‧‧‧ Coverage
9‧‧‧接著劑層 9‧‧‧ adhesive layer
10‧‧‧電極 10‧‧‧ electrodes
11‧‧‧焊料 11‧‧‧ solder
12‧‧‧加強銅箔層 12‧‧‧Strengthened copper foil layer
15‧‧‧金屬構造體 15‧‧‧Metal constructs
16‧‧‧接著劑層 16‧‧‧ adhesive layer
17‧‧‧氣泡 17‧‧‧ bubbles
20‧‧‧壓模 20‧‧‧Molding
100、200、300‧‧‧配線體 100, 200, 300‧‧‧ wiring body
201、301、401‧‧‧可撓性印刷配線板 201, 301, 401‧‧‧Flexible printed wiring boards
203、303‧‧‧電路圖案 203, 303‧‧‧ circuit pattern
212、312‧‧‧加強銅箔層 212, 312‧‧‧ Strengthened copper foil layer
215、315、415‧‧‧金屬構造體 215, 315, 415‧‧‧ metal structures
216、316‧‧‧接著劑層 216, 316‧‧‧ adhesive layer
250‧‧‧撓曲部 250‧‧‧Flexing Department
320‧‧‧壓模 320‧‧‧Molding
330‧‧‧定位銷 330‧‧‧Locating pin
405‧‧‧發光元件 405‧‧‧Lighting elements
(200系列、300系列、400系列之符號分別與第2實施形態、第3實施形態、第4實施形態對應，只要無特別規定，則後2位相同之編號者表示相同之要素。) (The symbols of the 200 series, the 300 series, and the 400 series correspond to the second embodiment, the third embodiment, and the fourth embodiment, respectively. Unless otherwise specified, the same two digits indicate the same elements.)
圖1係本申請發明之第1實施形態中之可撓性印刷配線板之主要部分剖面圖。 Fig. 1 is a cross-sectional view showing a main portion of a flexible printed wiring board according to a first embodiment of the present invention.
圖2係示意性地表示將圖1所示之可撓性印刷配線板積層接著於金屬構造體時含氣泡之接著劑層之流動的主要部分放大剖面圖。 Fig. 2 is a partially enlarged cross-sectional view schematically showing the flow of a bubble-containing adhesive layer when the flexible printed wiring board shown in Fig. 1 is laminated to a metal structure.
圖3係圖2所示之積層步驟結束後之配線體之主要部 分放大剖面圖。 Figure 3 is the main part of the wiring body after the lamination step shown in Figure 2 Divide the section view.
圖4係本申請發明之第2實施形態，且係將搭載有電子零件之可撓性印刷配線板積層於具有撓曲之積層面之金屬構造體而構成的配線體之剖面圖。 Fig. 4 is a cross-sectional view showing a wiring body in which a flexible printed wiring board on which electronic components are mounted is laminated on a metal structure having a layer of deflection, in a second embodiment of the present invention.
圖5係本申請發明之第3實施形態，且係表示使用定位銷而將可撓性印刷配線板積層於板狀之金屬構造體之狀態的剖面圖。 Fig. 5 is a cross-sectional view showing a state in which a flexible printed wiring board is laminated on a plate-shaped metal structure using a positioning pin according to a third embodiment of the present invention.
圖6係本申請發明之第4實施形態之配線體之俯視圖。 Fig. 6 is a plan view showing a wiring body according to a fourth embodiment of the present invention.
圖7係表示圖6所示之配線體中搭載之電子零件及設置銅箔之區域的放大俯視圖。 Fig. 7 is an enlarged plan view showing an electronic component mounted on the wiring body shown in Fig. 6 and a region in which a copper foil is provided.
圖8係表示於改變圖6及圖7之實施形態中的銅箔之厚度及設置銅箔之區域之情形時的散熱特性試驗結果之圖表。 Fig. 8 is a graph showing the results of heat dissipation test tests when the thickness of the copper foil in the embodiment of Figs. 6 and 7 is changed and the area of the copper foil is set.
300‧‧‧配線體 300‧‧‧ wiring body
301‧‧‧可撓性印刷配線板 301‧‧‧Flexible printed wiring board
302‧‧‧基材膜 302‧‧‧Substrate film
303‧‧‧電路圖案 303‧‧‧ circuit pattern
305‧‧‧電子零件 305‧‧‧Electronic parts
306‧‧‧覆蓋層 306‧‧‧ Coverage
307‧‧‧接著劑層 307‧‧‧ adhesive layer
312‧‧‧加強銅箔層 312‧‧‧Strengthened copper foil layer
315‧‧‧金屬構造體 315‧‧‧Metal structures
316‧‧‧接著劑層 316‧‧‧ adhesive layer
320‧‧‧壓模 320‧‧‧Molding
330‧‧‧定位銷 330‧‧‧Locating pin
Claims (12)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011135028A JP2013004775A (en) | 2011-06-17 | 2011-06-17 | Wiring body and manufacturing method therefor |
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| Publication Number | Publication Date |
|---|---|
| TW201301962A true TW201301962A (en) | 2013-01-01 |
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| JP (1) | JP2013004775A (en) |
| TW (1) | TW201301962A (en) |
| WO (1) | WO2012172937A1 (en) |
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| JP6388297B2 (en) * | 2013-04-15 | 2018-09-12 | Ｄｎライティング株式会社 | Lighting device |
| TWI611740B (en) | 2015-02-05 | 2018-01-11 | 頎邦科技股份有限公司 | Flexible substrate |
| CN107768415B (en) * | 2017-10-30 | 2024-03-08 | 京东方科技集团股份有限公司 | Flexible display device, display apparatus and manufacturing method |
| TWI777760B (en) * | 2021-08-09 | 2022-09-11 | 頎邦科技股份有限公司 | Flexible printed circuit board with heat-dissipation plate and heat-dissipation plate thereof |
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| JP3834888B2 (en) * | 1996-09-13 | 2006-10-18 | イビデン株式会社 | Manufacturing method of electronic component mounting board |
| JP2001127398A (en) * | 1999-10-27 | 2001-05-11 | Hitachi Chem Co Ltd | Method for manufacturing wiring board with metal plate |
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2011
- 2011-06-17 JP JP2011135028A patent/JP2013004775A/en active Pending
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2012
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