TW201300967A - Filter box, filter device, and exposure device - Google Patents

Filter box, filter device, and exposure device Download PDF

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Publication number
TW201300967A
TW201300967A TW101116829A TW101116829A TW201300967A TW 201300967 A TW201300967 A TW 201300967A TW 101116829 A TW101116829 A TW 101116829A TW 101116829 A TW101116829 A TW 101116829A TW 201300967 A TW201300967 A TW 201300967A
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filter
frame
filter case
case
exposure
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TW101116829A
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Chinese (zh)
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桂公一
松山和久
久保田將幸
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尼康股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/81—Solid phase processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407—Constructional details of adsorbing systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/40—Further details for adsorption processes and devices
    • B01D2259/41—Further details for adsorption processes and devices using plural beds of the same adsorbent in series
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/45—Gas separation or purification devices adapted for specific applications
    • B01D2259/455—Gas separation or purification devices adapted for specific applications for transportable use

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Biomedical Technology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

This filter box has: a frame that holds a chemical filter; and a first groove formed in the lateral surface of the frame. In the lateral surface of the frame, the first groove includes an edge section that extends from one lateral surface that is of two lateral surfaces that are separated from each other of the lateral surfaces of the frame and is on the side towards one end surface of the two end surfaces that are separated from each other, to the other lateral surface of the two lateral surfaces on the side towards the other end surface of the two end surfaces. It is possible to install the frame in a manner so that positioning can be easy.

Description

過濾器箱、過濾器裝置、及曝光裝置 Filter box, filter device, and exposure device

本發明係關於保持用以除去例如氣體中之不純物等之過濾器之過濾器箱、收納此過濾器箱之過濾器裝置、具備此過濾器裝置之曝光裝置、以及用以使用此曝光裝置製造例如半導體元件、液晶顯示元件、或攝影元件等之元件製造方法。 The present invention relates to a filter case for holding a filter for removing impurities such as impurities in a gas, a filter device for accommodating the filter case, an exposure device provided with the filter device, and a manufacturing device for manufacturing the same using the exposure device, for example A method of manufacturing a component such as a semiconductor element, a liquid crystal display element, or a photographic element.

在用以製造例如半導體元件等電子元件(微型元件)之微影製程中使用之曝光裝置中，為了得到高曝光精度(解像度及定位精度等)，需將照明光學系統之照明特性及投影光學系統之成像特性維持於既定之狀態且將設置標線片(或光罩等)、投影光學系統、以及晶圓(或玻璃板等)之空間維持於既定之環境。因此，以往包含曝光裝置之照明光學系統之一部分、標線片載台、投影光學系統、以及晶圓載台等之曝光本體部設置於箱型腔室內，於此腔室內具備空調裝置，該空調裝置係將控制成既定溫度且通過濾塵器之清淨氣體(例如空氣)以降流方式及側流方式供給。 In an exposure apparatus used for manufacturing a lithography process of an electronic component (micro component) such as a semiconductor element, in order to obtain high exposure accuracy (resolution, positioning accuracy, etc.), illumination characteristics of the illumination optical system and projection optical system are required. The imaging characteristics are maintained in a predetermined state and the space for setting the reticle (or mask, etc.), the projection optical system, and the wafer (or glass plate, etc.) is maintained in an established environment. Therefore, in the past, an exposure main body portion including an illumination optical system including an exposure device, a reticle stage, a projection optical system, and a wafer stage is provided in a box chamber, and an air conditioner is provided in the chamber. It is controlled to a predetermined temperature and is supplied by a clean gas (for example, air) of the dust filter in a downflow manner and a side flow manner.

又，曝光裝置中，為了對應近年之電路圖案之顯著微細化要求，曝光用光之波長不斷變短，最近係使用KrF準分子雷射光(波長248nm)及進一步大致為真空紫外區之ArF準分子雷射光(波長193nm)作為曝光用光。在使用此種短波長之曝光用光時，當於曝光用光所通過之空間(例如鏡筒之 內部空間)內存在微量之有機物之氣體(有機系氣體)時，曝光用光之透射率即會降低，且有因曝光用光與有機系氣體之反應而於透鏡元件等光學元件之表面產生霧物質之虞。再者，最好係從供應至腔室內之氣體亦除去與塗布於晶圓之光阻(感光材料)反應之鹼性物質之氣體(鹼系氣體)等。 Further, in the exposure apparatus, in order to cope with the refinement requirement of the circuit pattern in recent years, the wavelength of the exposure light is shortened, and recently, KrF excimer laser light (wavelength 248 nm) and ArF excimer which is further substantially in the vacuum ultraviolet region are used. Laser light (wavelength 193 nm) is used as exposure light. When such short-wavelength exposure light is used, the space through which the exposure light passes (for example, the lens barrel) In the internal space, when a trace amount of organic matter gas (organic gas) is present, the transmittance of the exposure light is lowered, and fogging occurs on the surface of the optical element such as the lens element due to the reaction between the exposure light and the organic gas. The shackles of matter. Further, it is preferable to remove a gas (alkaline gas) or the like which is an alkaline substance which reacts with a photoresist (photosensitive material) applied to the wafer from the gas supplied into the chamber.

因此，以往係於曝光裝置之空調裝置之氣體之擷取部，設有用以從供給至腔室內之氣體除去有機系氣體及/或鹼系氣體等之複數個化學過濾器(參照例如專利文獻1)。 Therefore, the gas extraction unit of the air conditioner of the exposure apparatus is provided with a plurality of chemical filters for removing the organic gas and/or the alkali gas from the gas supplied into the chamber (see, for example, Patent Document 1) ).

[專利文獻] [Patent Literature]

[專利文獻1]國際公開第2004/108252號小冊子 [Patent Document 1] International Publication No. 2004/108252

以往之曝光裝置中，在將化學過濾器設置於盒體內時，例如將收納化學過濾器之平板狀框架以橫置(過濾器面成為鉛直方向之面向)搬入至抵接於盒體內之側壁後，作業者係將該框架沿該側壁相對過濾器面於法線方向移動至設置位置為止。此情形下，若於框架之端面與形成有該盒體之通氣用開口之分隔構件之面之間有間隙，即有包含不純物之氣體不通過化學過濾器而經由間隙被供給至曝光本體部之虞。因此，用以將該框架正確地定位於其設置位置之時間變長、進而使用完畢之化學過濾器之更換時間亦變長。 In the conventional exposure apparatus, when the chemical filter is placed in the casing, for example, the flat frame in which the chemical filter is housed is placed horizontally (the filter surface is oriented in the vertical direction) and is brought into contact with the side wall of the casing. The operator moves the frame along the side wall relative to the filter surface in the normal direction to the set position. In this case, if there is a gap between the end surface of the frame and the surface of the partition member in which the ventilation opening of the casing is formed, the gas containing the impurity is supplied to the exposed body portion via the gap without passing through the chemical filter. Hey. Therefore, the time for properly positioning the frame at the set position thereof becomes longer, and the replacement time of the used chemical filter becomes longer.

再者，曝光裝置中，由於對應被要求之曝光精度之更加提升而增加所設置之化學過濾器之數目，因此需正確且有效率地進行化學過濾器之更換。 Further, in the exposure apparatus, since the number of chemical filters to be provided is increased corresponding to the required exposure accuracy, the chemical filter replacement needs to be performed accurately and efficiently.

本發明有鑑於上述情事，其目的在於能將過濾器之設置以容易定位之方式進行。 The present invention has been made in view of the above circumstances, and an object thereof is to enable the installation of a filter to be easily positioned.

根據本發明之第1態樣，提供一種過濾器箱，係保持過濾器。此過濾器箱具有：框架，保持該過濾器；以及第1形狀變化部，形成於前述框架之側面之至少一部分；該第1形狀變化部包含第1邊緣部，該第1邊緣部從該框架之側面中彼此分離之兩個第一端部中之一方第一端部側且從該框架之側面中彼此分離之兩個第二端部中之一方第二端部側，延伸至前述兩個第一端部中之另一方第一端部側且延伸至該兩個第二端部中之另一方第二端部側。 According to a first aspect of the present invention, a filter case is provided which holds a filter. The filter case has a frame that holds the filter, and a first shape changing portion formed on at least a part of a side surface of the frame, wherein the first shape changing portion includes a first edge portion from the frame One of the two first end portions separated from each other in the side faces and one of the second end portions of the two second end portions separated from each other from the side of the frame extends to the aforementioned two The other of the first ends is on the first end side and extends to the other of the two second ends.

又，根據本發明之第2態樣，提供一種過濾器裝置，收納保持過濾器之過濾器箱。此過濾器裝置具備：本發明之過濾器箱；盒體，以該框架中形成有該第1形狀變化部之側面為下面之方式收納該過濾器箱；以及第1導引部，設於該盒體之下部，具有能接觸於該過濾器箱之該第1形狀變化部之該第1邊緣部之第3邊緣部。 Moreover, according to a second aspect of the present invention, a filter device for accommodating a filter case holding a filter is provided. The filter device includes: a filter case according to the present invention; the case body houses the filter case such that a side surface of the frame in which the first shape change portion is formed is a lower surface; and a first guide portion provided in the filter case The lower portion of the casing has a third edge portion that can contact the first edge portion of the first shape changing portion of the filter case.

又，根據本發明之第3態樣，提供一種曝光裝置，係以曝光用光經由圖案使基板曝光。此曝光裝置具備：腔室，收納使該基板曝光之曝光本體部；本發明之過濾器裝置；以及空調裝置，將從該腔室之外部擷取之氣體經由該過濾器裝置送至該腔室內。 Moreover, according to a third aspect of the present invention, an exposure apparatus is provided which exposes a substrate via exposure using light for exposure. The exposure apparatus includes a chamber that houses an exposure body portion that exposes the substrate, a filter device of the present invention, and an air conditioning device that sends gas extracted from the outside of the chamber to the chamber through the filter device .

又，根據第4態樣，提供一種元件製造方法，其包含：使用本發明之曝光裝置使感光性基板曝光之動作；以及處理該曝光後之感光性基板之動作。 Moreover, according to the fourth aspect, there is provided a method of manufacturing a device comprising: an operation of exposing a photosensitive substrate using the exposure apparatus of the present invention; and an operation of treating the photosensitive substrate after the exposure.

根據本發明，藉由使用設於框架之第1形狀變化部，而能將過濾器之設置以容易定位之方式進行。 According to the present invention, by using the first shape changing portion provided in the frame, the installation of the filter can be performed easily.

以下，參照圖1~圖6說明本發明之實施形態一例。 Hereinafter, an example of an embodiment of the present invention will be described with reference to Figs. 1 to 6 .

圖1，係顯示本實施形態之曝光裝置EX。曝光裝置EX，作為一例係由掃描步進機構成之掃描曝光型曝光裝置(投影曝光裝置)。圖1中，曝光裝置EX具備：產生曝光用光(曝光用照明光)EL之光源部2、以曝光用光EL照明標線片R(光罩)之照明光學系統ILS、保持標線片R並移動之標線片載台RST、以及將標線片R之圖案之像投影至塗布有光阻(感光材料)之晶圓W(基板)表面之投影光學系統PL。再者，曝光裝置EX具備保持晶圓W並移動之晶圓載台WST、其他驅動機構及感測器類等、保管複數片標線片之標線片庫9、保管複數片未曝光及/或曝光完畢之晶圓之晶圓匣7、以及統籌控制曝光裝置EX之動作之主控制裝置(未圖示)。此等之從光源部2至主控制裝置(未圖示)之構件，設置於例如半導體元件製造工廠之潔淨室內之第1地FL1之上面。 Fig. 1 shows an exposure apparatus EX of this embodiment. The exposure apparatus EX is, for example, a scanning exposure type exposure apparatus (projection exposure apparatus) which is constituted by a scanning stepper. In FIG. 1, the exposure apparatus EX includes a light source unit 2 that generates exposure light (exposure illumination light) EL, an illumination optical system ILS that illuminates the reticle R (mask) with exposure light EL, and a holding reticle R. The moving reticle stage RST and the image of the pattern of the reticle R are projected onto the projection optical system PL on the surface of the wafer W (substrate) coated with the photoresist (photosensitive material). Further, the exposure apparatus EX includes a wafer stage WST for holding the wafer W and moving, other driving mechanisms, sensors, and the like, and a plurality of reticle banks 9 for storing a plurality of reticle sheets, and storing a plurality of sheets without exposure and/or The wafer 匣 7 of the exposed wafer and the main control device (not shown) that collectively controls the operation of the exposure device EX. The members from the light source unit 2 to the main control unit (not shown) are provided, for example, on the upper surface of the first ground FL1 in the clean room of the semiconductor element manufacturing factory.

又，曝光裝置EX具備設置於地FL1上之箱狀之高氣密性腔室10，腔室10內部，例如被具有兩個開口(以擋門24R及24W開閉)之分隔構件10d區劃成曝光室10a與裝載室10b。又，於曝光室10a內設置有包含照明光學系統ILS、標線片載台RST、投影光學系統PL、以及晶圓載台WST之曝光本體部4，於裝載室10b內設置有分別包含標線片庫9 及晶圓匣7之標線片裝載系統及晶圓裝載系統。 Further, the exposure apparatus EX includes a box-shaped high airtight chamber 10 provided on the ground FL1, and the inside of the chamber 10 is, for example, divided into sections by a partition member 10d having two openings (opening and closing with the shutters 24R and 24W). Room 10a and loading chamber 10b. Further, an exposure main body portion 4 including an illumination optical system ILS, a reticle stage RST, a projection optical system PL, and a wafer stage WST is provided in the exposure chamber 10a, and reticle sheets are respectively provided in the load chamber 10b. Library 9 And wafer 匣7 reticle loading system and wafer loading system.

又，曝光裝置EX具備用以進行腔室10內部整體之空調之整體空調系統。此整體空調系統，具備：設置於第1地FL1之地下之機械室之第2地FL2上面且具有串聯配置之複數個化學過濾器之過濾器裝置26、具有設置於地FL2上面之空調本體部31之空調裝置30、設置於曝光室10a上部之大型吹出口18、配置於收納照明光學系統ILS之副腔室22之底面之小型吹出口19R、以及配置於投影光學系統PL附近之小型吹出口19W。過濾器裝置26係從經由配管25供給之空調用氣體即空氣AR除去既定之不純物，將已除去不純物之空氣如以箭頭A1所示經由第1管32供給至空調本體部31(詳細後述)。 Further, the exposure apparatus EX includes an overall air conditioning system for performing air conditioning as a whole inside the chamber 10. The overall air conditioning system includes a filter device 26 having a plurality of chemical filters disposed in series on the second ground FL2 of the machine room underground of the first ground FL1, and an air conditioning main body portion disposed on the ground FL2. The air conditioner 30 of 31, the large air outlet 18 provided in the upper portion of the exposure chamber 10a, the small air outlet 19R disposed on the bottom surface of the sub chamber 22 accommodating the illumination optical system ILS, and the small air outlet disposed near the projection optical system PL 19W. The filter device 26 removes the predetermined impurity from the air AR which is the air-conditioning gas supplied through the pipe 25, and supplies the air from which the impurity has been removed to the air-conditioning main unit 31 via the first pipe 32 as indicated by an arrow A1 (details will be described later).

空調裝置30，具備第1管32、空調本體部31、通過設於地FL1之開口連結空調本體部31與腔室10之內部之第2管35、以及配置於例如第2管35之途中且從於內部流動之空氣除去微小粒子(微粒)之ULPA過濾器(Ultra Low Penetration Air-filter)等濾塵器36。管32,35及配管25，係使用例如不鏽鋼或氟樹脂等污染物質之產生量少之材料形成。 The air conditioner 30 includes a first pipe 32, an air-conditioning main body portion 31, a second pipe 35 that connects the air-conditioning main body portion 31 and the inside of the chamber 10 through an opening provided in the ground FL1, and is disposed in the middle of the second pipe 35, for example. A dust filter 36 such as an ULPA filter (Ultra Low Penetration Air-filter) that removes fine particles (fine particles) from the air flowing inside. The tubes 32 and 35 and the piping 25 are formed of a material having a small amount of pollutants such as stainless steel or fluororesin.

空調本體部31具備：控制經由第1管32供給之空氣之溫度之溫度控制部33A、控制該空氣之濕度之濕度控制部33B、以及將該空氣送至第2管35側之風扇馬達34。該空氣被控制於溫度為20℃~30℃之範圍內之例如23℃，經由第2管35及吹出口18以降流方式供給至曝光室10a內部。 腔室10內部藉由此空氣之供給被設定成正壓狀態。又，第2管35內之空氣經由分歧管35a及35b與對應之吹出口19W及吹出口19R供給至曝光室10a內。曝光室10a內之空氣一部分亦流入裝載室10b。 The air-conditioning main unit 31 includes a temperature control unit 33A that controls the temperature of the air supplied through the first pipe 32, a humidity control unit 33B that controls the humidity of the air, and a fan motor 34 that sends the air to the second tube 35 side. The air is controlled to be, for example, 23 ° C in a temperature range of 20 ° C to 30 ° C, and is supplied to the inside of the exposure chamber 10 a in a downflow manner via the second tube 35 and the air outlet 18 . The inside of the chamber 10 is set to a positive pressure state by the supply of the air. Further, the air in the second tube 35 is supplied into the exposure chamber 10a via the branch pipes 35a and 35b and the corresponding air outlet 19W and the air outlet 19R. A part of the air in the exposure chamber 10a also flows into the load chamber 10b.

作為一例，流動於腔室10內部(曝光室10a)之空氣，通過設於腔室10底面之多數個開口45a及設於地FL1之多數個開口45b流至地下之排氣管44內，排氣管44內之空氣經由未圖示之過濾器排出。此外，亦能使流至排氣管44之空氣之全部或一部分返回至配管25側而再利用。 As an example, the air flowing inside the chamber 10 (exposure chamber 10a) flows through a plurality of openings 45a provided in the bottom surface of the chamber 10 and a plurality of openings 45b provided in the ground FL1 to the underground exhaust pipe 44. The air in the air tube 44 is discharged through a filter (not shown). Further, all or part of the air flowing to the exhaust pipe 44 can be returned to the side of the pipe 25 for reuse.

以下，圖1中，係與投影光學系統PL之光軸AX平行地取Z軸，在與Z軸垂直之平面(在本實施形態中為大致水平面)內與圖1之紙面垂直地取X軸，與圖1之紙面平行地取Y軸來說明。本實施形態中，掃描曝光時之標線片R及晶圓W之掃描方向係Y方向。又，將繞與X軸、Y軸、Z軸平行之軸之旋轉方向亦稱為θ x、θ y、θ z方向。 Hereinafter, in Fig. 1, the Z axis is taken in parallel with the optical axis AX of the projection optical system PL, and the X axis is taken perpendicular to the plane of the paper of Fig. 1 in a plane perpendicular to the Z axis (in the present embodiment, a substantially horizontal plane). The Y axis is taken in parallel with the paper surface of Fig. 1 to illustrate. In the present embodiment, the scanning direction of the reticle R and the wafer W at the time of scanning exposure is the Y direction. Further, the directions of rotation about the axes parallel to the X-axis, the Y-axis, and the Z-axis are also referred to as θ x , θ y , and θ z directions.

首先，設置於腔室10外側之地FL1上之光源部2，具備產生ArF準分子雷射光(波長193nm)作為曝光用光EL之曝光光源、以及將該曝光用光EL導至照明光學系統ILS之光束送光光學系統。光源部2之曝光用光EL之射出端，係通過腔室10之+Y方向側面上部之開口配置於曝光室10a內。此外，亦能使用KrF準分子雷射光源(波長248nm)等紫外脈衝雷射光源、YAG雷射之諧波產生光源、固態雷射(半導體雷射等)之諧波產生裝置、或水銀燈(i線等)等作為曝光光源。 First, the light source unit 2 provided on the ground FL1 outside the chamber 10 includes an exposure light source that generates ArF excimer laser light (wavelength: 193 nm) as the exposure light EL, and leads the exposure light EL to the illumination optical system ILS. The beam is sent to the optical system. The emission end of the exposure light EL of the light source unit 2 is disposed in the exposure chamber 10a through the opening of the upper surface of the chamber 10 in the +Y direction. In addition, it is also possible to use an ultraviolet pulse laser light source such as a KrF excimer laser light source (wavelength 248 nm), a harmonic generation light source of a YAG laser, a harmonic generation device of a solid state laser (semiconductor laser, etc.), or a mercury lamp (i Lines, etc.) are used as exposure light sources.

又，配置於腔室10內上部之照明光學系統ILS，如例如美國發明專利申請公開第2003/0025890號說明書等所揭示，具備包含光學積分器等之照度均一化光學系統、標線片遮簾、以及聚光光學系統等。照明光學系統ILS係藉由曝光用光EL以大致均一照度照明以標線片遮簾規定之標線片R之圖案面之於X方向細長之狹縫狀照明區域。 Further, the illumination optical system ILS disposed in the upper portion of the chamber 10, as disclosed in, for example, the specification of the US Patent Application Publication No. 2003/0025890, includes an illuminance uniformization optical system including an optical integrator, and a reticle blind. , as well as concentrating optical systems. The illumination optical system ILS illuminates the slit-shaped illumination region which is elongated in the X direction by the pattern surface of the reticle R defined by the exposure light EL by the exposure light EL.

形成於標線片R之圖案區域中照明區域內之圖案像，係經由兩側遠心且投影倍率β為縮小倍率(例如1/4)之投影光學系統PL成像投影至晶圓W之表面。 The pattern image formed in the illumination region in the pattern region of the reticle R is image-projected onto the surface of the wafer W via the projection optical system PL which is telecentric on both sides and whose projection magnification β is a reduction magnification (for example, 1/4).

又，於腔室10之曝光室10a內之地FL1上，透過複數個台座11設置有下部框架12，於下部框架12之中央部固定有平板狀之底座構件13，於底座構件13上透過例如三處之防振台14支承有平板狀之晶圓底座WB，於晶圓底座WB之與XY平面平行之上面透過空氣軸承將晶圓載台WST載置成可移動於X方向、Y方向且可旋轉於θ z方向。又，於下部框架12之上端，透過配置成包圍晶圓底座WB之例如三處之防振台15支承有光學系統框架16。於光學系統框架16中央部之開口配置有投影光學系統PL，於光學系統框架16上將上部框架17固定成包圍投影光學系統PL。 Further, in the floor FL1 in the exposure chamber 10a of the chamber 10, a plurality of pedestals 11 are provided with a lower frame 12, and a flat base member 13 is fixed to a central portion of the lower frame 12, for example, through the base member 13 The anti-vibration table 14 of the three places supports a flat wafer base WB, and the wafer stage WST is placed in the X direction and the Y direction through the air bearing on the upper side of the wafer base WB parallel to the XY plane. Rotate in the θ z direction. Further, at the upper end of the lower frame 12, the optical system frame 16 is supported by the vibration isolating table 15 disposed, for example, at three places surrounding the wafer base WB. A projection optical system PL is disposed in an opening in a central portion of the optical system frame 16, and the upper frame 17 is fixed to surround the projection optical system PL on the optical system frame 16.

又，於光學系統框架16底面之+Y方向端部固定有Y軸之雷射干涉儀21WY，於其底面之+X方向端部固定有X軸之雷射干涉儀(未圖示)。由此等干涉儀構成之晶圓干涉儀，分別對晶圓載台WST之側面之反射面(或移動鏡)照射複數軸之測量用光束，以例如投影光學系統PL之側面之參 照鏡(未圖示)為基準，測量晶圓載台WST之X方向、Y方向之位置、以及θ x、θ y、θ z方向之旋轉角，將測量值供給至主控制裝置(未圖示)。 Further, a Y-axis laser interferometer 21WY is fixed to the +Y-direction end of the bottom surface of the optical system frame 16, and an X-axis laser interferometer (not shown) is fixed to the bottom surface of the bottom surface in the +X direction. The wafer interferometer formed by the interferometer irradiates the reflection surface (or the moving mirror) on the side of the wafer stage WST with the measurement beam of the plurality of axes, for example, the side of the projection optical system PL. The position of the wafer stage WST in the X direction and the Y direction, and the rotation angles in the θ x, θ y, and θ z directions are measured by a mirror (not shown), and the measured value is supplied to the main control device (not shown). ).

主控制裝置(未圖示)內之載台控制系統，係根據上述晶圓干涉儀之測量值及自動聚焦感測器(未圖示)之測量值等透過包含線性馬達等之驅動機構(未圖示)控制晶圓載台WST之X方向、Y方向之位置及速度與θ z方向之旋轉角，且將晶圓載台WST內之Z載台(未圖示)控制成晶圓W之表面對焦於投影光學系統PL之像面。又，亦設有用以進行標線片R及晶圓W之對準之對準系統ALG等。 The stage control system in the main control unit (not shown) transmits a drive mechanism including a linear motor or the like based on the measured value of the wafer interferometer and the measured value of an autofocus sensor (not shown). The figure shows the position and speed of the wafer stage WST in the X direction and the Y direction and the rotation angle in the θ z direction, and controls the Z stage (not shown) in the wafer stage WST to be the surface focus of the wafer W. In the image plane of the projection optical system PL. Further, an alignment system ALG or the like for performing alignment of the reticle R and the wafer W is also provided.

另一方面，於上部框架17之+Y方向上部固定有收納照明光學系統ILS之副腔室22。再者，於上部框架17之與XY平面平行之上面透過空氣軸承將標線片載台RST載置成可定速移動於Y方向且能往X方向移動及往θ z方向旋轉。 On the other hand, a sub-chamber 22 that houses the illumination optical system ILS is fixed to the upper portion of the upper frame 17 in the +Y direction. Further, the reticle stage RST is placed on the upper surface of the upper frame 17 parallel to the XY plane through the air bearing so as to be movable at a constant speed in the Y direction and movable in the X direction and in the θ z direction.

又，於上部框架17上面之+Y方向端部固定有Y軸之雷射干涉儀21RY，於其上面之+X方向端部固定有X軸之雷射干涉儀(未圖示)。由此等干涉儀構成之標線片干涉儀，分別對設於標線片載台RST之移動鏡21MY等照射複數軸之測量用光束，以例如投影光學系統PL之側面之參照鏡(未圖示)為基準，測量標線片載台WST之X方向、Y方向之位置、以及θ x、θ y、θ z方向之旋轉角，將測量值供給至主控制裝置(未圖示)。 Further, a Y-axis laser interferometer 21RY is fixed to the upper portion of the upper frame 17 at the +Y direction, and an X-axis laser interferometer (not shown) is fixed to the upper +X direction end portion. The reticle interferometer formed by the interferometer, respectively, irradiates the measuring beam of the plurality of axes on the moving mirror 21MY or the like provided on the reticle stage RST, for example, a reference mirror on the side of the projection optical system PL (not shown) Based on the reference, the X-direction and the Y-direction position of the reticle stage WST and the rotation angles in the θ x, θ y, and θ z directions are measured, and the measured values are supplied to a main control device (not shown).

主控制裝置(未圖示)內之載台控制系統，係根據該標線 片干涉儀之測量值等透過包含線性馬達等之驅動機構(未圖示)控制標線片載台RST之Y方向之速度及位置、X方向之位置、以及θ z方向之旋轉角等。 The stage control system in the main control unit (not shown) is based on the marking The measured value of the interferometer or the like is controlled by a driving mechanism (not shown) including a linear motor or the like to control the speed and position in the Y direction of the reticle stage RST, the position in the X direction, and the rotation angle in the θ z direction.

又，本實施形態之曝光裝置EX為液浸型時，係從配置於投影光學系統PL下端之光學構件之下面之包含例如環狀嘴頭之局部液浸機構(未圖示)，對投影光學系統PL前端之光學構件與晶圓W之間之局部液浸區域供給既定之液體(純水等)。作為該局部液浸機構，可使用例如於美國發明專利申請公開第2007/242247號說明書等所揭示之液浸機構。此外，曝光裝置EX為乾燥型時，無需具備該液浸機構。 Further, when the exposure apparatus EX of the present embodiment is a liquid immersion type, it is a partial liquid immersion mechanism (not shown) including, for example, an annular nozzle disposed on the lower surface of the optical member at the lower end of the projection optical system PL. A predetermined liquid (pure water, etc.) is supplied to a partial liquid immersion area between the optical member of the front end of the system PL and the wafer W. As the partial liquid immersion mechanism, a liquid immersion mechanism disclosed in, for example, the specification of the US Patent Application Publication No. 2007/242247 can be used. Further, when the exposure apparatus EX is of a dry type, it is not necessary to provide the liquid immersion mechanism.

又，在裝載室10b內部，於上方之支承台67上面設置有標線片庫9及水平多關節型機器手即標線片裝載器8。標線片裝載器8，係通過以分隔構件10d之擋門24R開閉之開口，在標線片庫9與標線片載台RST之間進行標線片R之更換。 Further, inside the loading chamber 10b, a reticle library 9 and a horizontal multi-joint type robot, that is, a reticle loader 8, are provided on the upper support table 67. The reticle loader 8 replaces the reticle R between the reticle library 9 and the reticle stage RST through an opening that is opened and closed by the shutter 24R of the partition member 10d.

又，在裝載室10b內部，於下方之支承台68上面設置有晶圓匣7與在與晶圓匣7之間進行晶圓之取出或置入之水平多關節型機器手6a。於水平多關節型機器手6a上方，設置有與水平多關節型機器手6a一起構成晶圓裝載器6之晶圓搬送裝置6b。晶圓搬送裝置6b，係通過以分隔構件10d之擋門24W開閉之開口在水平多關節型機器手6a與晶圓載台WST之間搬送晶圓W。 Further, inside the loading chamber 10b, a wafer cassette 7 and a horizontal articulated robot hand 6a for taking out or inserting the wafer between the wafer cassette 7 are provided on the lower support table 68. Above the horizontal articulated robot hand 6a, a wafer transfer device 6b that constitutes the wafer loader 6 together with the horizontal articulated robot hand 6a is provided. The wafer transfer device 6b transfers the wafer W between the horizontal articulated robot 6a and the wafer stage WST through an opening that is opened and closed by the shutter 24W of the partition member 10d.

接著，在曝光裝置EX之曝光時，首先進行標線片R及晶圓W之對準。其後，開始對標線片R照射曝光用光EL， 藉由一邊經由投影光學系統PL將標線片R之圖案之一部分像投影至晶圓W表面之一個照射區域，一邊以投影光學系統PL之投影倍率β為速度比將標線片載台RST與晶圓載台WST同步移動(同步掃描)於Y方向之掃描曝光動作，於該照射區域轉印標線片R之圖案像。其後，反覆進行透過晶圓載台WST將晶圓W步進移動於X方向、Y方向之動作與上述掃描曝光動作，以步進掃描方式於晶圓W之全部照射區域轉印標線片R之圖案像。 Next, at the time of exposure of the exposure apparatus EX, alignment of the reticle R and the wafer W is first performed. Thereafter, the exposure light EL is irradiated to the reticle R, By projecting a partial image of the pattern of the reticle R onto one of the irradiation areas of the wafer W via the projection optical system PL, the reticle stage RST is compared with the projection magnification β of the projection optical system PL as a speed ratio. The wafer stage WST synchronously moves (synchronously scans) the scanning exposure operation in the Y direction, and the pattern image of the reticle R is transferred in the irradiation area. Thereafter, the wafer W is stepwise moved through the wafer stage WST in the X direction and the Y direction, and the scanning exposure operation is performed, and the reticle R is transferred to all the irradiation areas of the wafer W by the step scanning method. The pattern image.

其次，本實施形態之曝光裝置EX，為了將照明光學系統ILS之照明特性(照度均一性等)及投影光學系統之成像特性(解像度等)維持於既定狀態，且將設置標線片R、投影光學系統PL、以及晶圓W之環境氣氛(空間)維持於既定之環境，以高曝光精度(解像度、定位精度等)進行曝光，係如上述具備整體空調系統，該整體空調系統包含將經溫度控制之清淨空氣以降流方式供給至腔室10內部之空調裝置30。 Next, in the exposure apparatus EX of the present embodiment, in order to maintain the illumination characteristics (illuminance uniformity, etc.) of the illumination optical system ILS and the imaging characteristics (resolution, etc.) of the projection optical system in a predetermined state, the reticle R and the projection are set. The optical system PL and the ambient atmosphere (space) of the wafer W are maintained in a predetermined environment, and are exposed with high exposure accuracy (resolution, positioning accuracy, etc.), as described above, with an overall air conditioning system including the temperature to be passed through The controlled clean air is supplied to the air conditioning unit 30 inside the chamber 10 in a downflow manner.

又，該整體空調系統具備局部空調部。亦即，從第2管35之分歧管35b及35a分別對副腔室22底面之吹出部19R及光學系統框架16底面之吹出部19W供給經溫度控制之清淨空氣。此情形下，吹出部19R及19W，分別配置於標線片載台RST用之Y軸之雷射干涉儀21RY及晶圓載台WST用之Y軸之雷射干涉儀21WY之測量用光束之光路上。吹出部19R,19W，係分別將經溫度控制之空氣以大致均一之風速分布以降流方式(或亦可係側流方式)對測量用 光束之光路上吹出。同樣地，亦對X軸之雷射干涉儀之測量用光束之光路局部地供給經溫度控制之空氣。藉此，能藉由標線片干涉儀21R及晶圓干涉儀21W等高精度地測量標線片載台RST及晶圓載台WST之位置。 Moreover, the integral air conditioning system includes a partial air conditioning unit. That is, the temperature-controlled clean air is supplied from the branch pipes 35b and 35a of the second pipe 35 to the blow-out portion 19R on the bottom surface of the sub-chamber 22 and the blow-out portion 19W on the bottom surface of the optical system frame 16, respectively. In this case, the blowing portions 19R and 19W are respectively disposed on the Y-axis laser interferometer 21RY for the reticle stage RST and the Y-axis laser interferometer 21WY for the measurement beam light for the Y-axis for the wafer stage WST. On the road. The blowing portions 19R, 19W respectively distribute the temperature-controlled air at a substantially uniform wind speed in a downflow manner (or a lateral flow method) for measurement. The light beam is blown out on the road. Similarly, the temperature-controlled air is locally supplied to the optical path of the measuring beam of the X-axis laser interferometer. Thereby, the positions of the reticle stage RST and the wafer stage WST can be measured with high precision by the reticle interferometer 21R and the wafer interferometer 21W.

又，於裝載室10b內設置有局部空調裝置60。局部空調裝置60具備配置於支承台68底面之小型風扇馬達61、將以風扇馬達61送出之空氣供給至上部之管62、以及配置於標線片庫9及晶圓匣7之上方之吹出口65及66。管62之前端部分離至分別對吹出口65及66供給空氣之分歧管62R及62W。又，於吹出口65及66之空氣流入口附近分別設置有ULPA過濾器等濾塵器，於風扇馬達61附近之管62內，設置有收納化學過濾器(用以除去既定不純物)之過濾器箱63,64。作為一例，過濾器箱63之化學過濾器係除去有機系氣體(有機物之氣體)，過濾器箱64之化學過濾器係除去鹼系氣體(鹼性物質之氣體)及酸性氣體(酸性物質之氣體)。 Further, a local air conditioner 60 is provided in the load compartment 10b. The local air conditioner 60 includes a small fan motor 61 disposed on the bottom surface of the support base 68, a tube 62 for supplying air sent from the fan motor 61 to the upper portion, and a blow port disposed above the reticle library 9 and the wafer cassette 7. 65 and 66. The front end of the tube 62 is separated into branch pipes 62R and 62W which supply air to the air outlets 65 and 66, respectively. Further, a dust filter such as a ULPA filter is provided in the vicinity of the air inlets of the air outlets 65 and 66, and a filter box for accommodating a chemical filter (for removing a predetermined impurity) is provided in the tube 62 near the fan motor 61. 63,64. As an example, the chemical filter of the filter case 63 removes an organic gas (a gas of an organic substance), and the chemical filter of the filter case 64 removes an alkali gas (a gas of an alkaline substance) and an acid gas (a gas of an acidic substance). ).

在裝載室10b內使局部空調裝置60動作後，從風扇馬達61送出之空氣，經由過濾器箱63,64及管62從吹出口65及66分別以降流方式被供給至配置有標線片庫9及晶圓匣7之空間。接著，流動於標線片庫9周圍之空氣，經由支承台67周圍、支承台67下方之晶圓匣7周圍、以及支承台68周圍返回至風扇馬達61。又，從吹出口66供給至晶圓匣7周圍之空氣，經由支承台68周圍返回至風扇馬達61。接著，返回至風扇馬達61之空氣，再次經由過濾器箱 63,64及濾塵器從吹出口65,66供給至裝載室10b內。如此，藉由局部空調裝置60，裝載室10b內之空氣保持於清淨之狀態。 After the local air conditioner 60 is operated in the loading chamber 10b, the air sent from the fan motor 61 is supplied to the reticle library from the air outlets 65 and 66 via the filter boxes 63, 64 and 62, respectively, in a downflow manner. 9 and the space of the wafer 匣7. Then, the air flowing around the reticle 9 is returned to the fan motor 61 via the periphery of the support table 67, around the wafer cassette 7 below the support table 67, and around the support table 68. Further, the air supplied from the air outlet 66 to the periphery of the wafer cassette 7 is returned to the fan motor 61 via the periphery of the support base 68. Then, return to the air of the fan motor 61, again through the filter box 63, 64 and the dust filter are supplied from the air outlets 65, 66 into the load chamber 10b. Thus, the air in the load chamber 10b is kept in a clean state by the local air conditioner 60.

其次，說明本實施形態之整體空調系統中，連結於空調裝置30之過濾器裝置26之構成及作用。過濾器裝置26具有於Y方向細長之經氣密化之箱狀盒體28、將盒體28內之空間在大致水平面內於Y方向分成兩個空間之與XZ平面平行之分隔板42、於分隔板42各自之一面(圖1中為+Y方向之面)透過後述之罩構件(未圖示)緊貼而設置之第1種類之過濾器箱38、第2種類之過濾器箱40、以及第1種類之過濾器箱38。過濾器裝置26具有兩種類且三個(三段)串聯配置之過濾器箱38,40。以下，將第1種類之過濾器箱38亦稱為第1過濾器箱38，將第2種類之過濾器箱40亦稱為第1過濾器箱40。此外，本實施形態中，過濾器箱之過濾器面設置於與水平方向交叉之方向、例如過濾器箱之過濾器面設置於XZ面內。此外，將此過濾器箱之設置狀態設為橫置，以下說明之。 Next, the configuration and operation of the filter device 26 connected to the air conditioner 30 in the overall air conditioning system of the present embodiment will be described. The filter device 26 has a box-shaped box 28 that is elongated in the Y direction, and a partition plate 42 that is parallel to the XZ plane in which the space in the casing 28 is divided into two spaces in the Y direction in a substantially horizontal plane. The first type of filter case 38 and the second type of filter case are provided on one surface of each of the partition plates 42 (the surface in the +Y direction in FIG. 1) through a cover member (not shown) to be described later. 40. A filter box 38 of the first type. The filter device 26 has two types and three (three-stage) filter boxes 38, 40 arranged in series. Hereinafter, the first type of filter case 38 is also referred to as a first filter case 38, and the second type of filter case 40 is also referred to as a first filter case 40. Further, in the present embodiment, the filter surface of the filter case is disposed in a direction crossing the horizontal direction, for example, the filter surface of the filter case is disposed in the XZ plane. In addition, the setting state of this filter case is set to be horizontal, which will be described below.

進而，過濾器裝置26，具有在過濾器箱38,40之***時或更換時，為了開啟用以取出或置入過濾器箱38,40之窗部28b(參照圖2)，而於盒體28在複數處透過鉸鏈機構29h(參照圖4)可開閉地安裝之門29。於盒體28之+Y方向側壁形成有開口28a，於此側壁固定有通過開口28a擷取空調用空氣AR之配管25。於盒體28之-Y方向側壁形成有開口28g，於此側壁連結有通過開口28g排出經清淨化之空氣 之第1管32。 Further, the filter device 26 has a window portion 28b (refer to FIG. 2) for taking out or inserting the filter case 38, 40 at the time of insertion or replacement of the filter boxes 38, 40, and in the case The door 29 is opened and closed by a hinge mechanism 29h (refer to Fig. 4) at a plurality of places. An opening 28a is formed in the +Y direction side wall of the casing 28, and a pipe 25 for drawing the air-conditioning air AR through the opening 28a is fixed to the side wall. An opening 28g is formed in the side wall of the casing 28 in the Y direction, and the side wall is connected with the purified air discharged through the opening 28g. The first tube 32.

圖2係顯示已將圖1中之盒體28之門29開啟之狀態之過濾器裝置26。圖3係顯示已從圖2之盒體28取出過濾器箱38,40後之狀態。此外，圖2及圖3中，為了說明方便，盒體28係以兩點鍊線表示。圖2中，於門29固定有用以在以門29關閉盒體28之窗部28b時密閉窗部28b之周邊及分隔板42之端部與門29之間之墊片46。墊片46能由耐蝕性優異且脫氣較少之材料、例如鐵氟龍(杜邦公司之註冊商標)之片體、或矽橡膠之片等形成。 Fig. 2 is a view showing a filter device 26 in a state in which the door 29 of the casing 28 of Fig. 1 has been opened. Fig. 3 shows the state after the filter boxes 38, 40 have been taken out from the casing 28 of Fig. 2. In addition, in FIGS. 2 and 3, for convenience of explanation, the casing 28 is indicated by a two-dot chain line. In Fig. 2, the door 29 is fixed with a spacer 46 for sealing the periphery of the window portion 28b and the end portion of the partitioning plate 42 and the door 29 when the window portion 28b of the casing 28 is closed by the door 29. The gasket 46 can be formed of a material excellent in corrosion resistance and less degassing, for example, a sheet of Teflon (registered trademark of DuPont), a sheet of ruthenium rubber, or the like.

又，於盒體28內，設置有將盒體28內之空間分割成+Y方向之較大第1空間28c及-Y方向之較小第2空間28f之分隔板42。通過圖1之配管25及開口28a從外部供應空氣AR至空間28c內，空間28f內之空氣通過開口28g及圖1之第1管32供應至空調本體部31。 Further, in the casing 28, a partition plate 42 that divides the space in the casing 28 into a large first space 28c in the +Y direction and a small second space 28f in the -Y direction is provided. The air AR is supplied from the outside to the space 28c through the pipe 25 and the opening 28a of Fig. 1, and the air in the space 28f is supplied to the air conditioning main body portion 31 through the opening 28g and the first pipe 32 of Fig. 1.

如圖3所示，於分隔板42形成有用以使經清淨化之空氣通過之大致正方形或矩形之開口42a，於分隔板42之對向於過濾器箱38之面，透過接著等固定有易滑動且於中央部形成有使氣體通過之開口之平板狀罩構件TF3。罩構件TF3例如由合成樹脂形成，具體而言例如由鐵氟龍(杜邦公司之註冊商標)形成。 As shown in FIG. 3, a substantially square or rectangular opening 42a for allowing the purified air to pass through is formed in the partitioning plate 42 on the surface of the partitioning plate 42 opposite to the filter case 38, and then fixed. There is a flat cover member TF3 which is slidable and has an opening through which a gas passes through the center portion. The cover member TF3 is formed, for example, of a synthetic resin, specifically, for example, Teflon (registered trademark of DuPont).

圖2中，於盒體28之第1空間28c內，以緊貼固定於分隔板42之罩構件TF3之方式設置有第1過濾器箱38，以緊貼此過濾器箱38之方式設置有第2過濾器箱40，以緊貼此過濾器箱40之方式設置有第1過濾器箱38。第1過濾器 箱38之基本構造係於框架50之開口50f(參照圖4)保持有用以除去有機系氣體(有機物之氣體)之化學過濾器51者。 In FIG. 2, the first filter case 38 is provided in the first space 28c of the casing 28 so as to be in close contact with the cover member TF3 fixed to the partition plate 42, and is placed in close contact with the filter case 38. There is a second filter case 40, and the first filter case 38 is provided in close contact with the filter case 40. 1st filter The basic structure of the tank 38 is one in which the opening 50f of the frame 50 (refer to Fig. 4) holds the chemical filter 51 which is useful for removing the organic gas (the gas of the organic matter).

又，第2過濾器箱40之基本構造係於框架55之開口55f(參照圖4)保持有除去氨或胺等鹼性系氣體(鹼性物質之氣體)及酸性氣體(酸性物質之氣體)之化學過濾器56者。各過濾器箱38,40之Y方向(空氣流動之方向)寬度為例如200~400mm，各過濾器箱38,40之重量為例如10~20kg左右。 Further, the basic structure of the second filter case 40 is such that an alkali-based gas (a gas of an alkaline substance) such as ammonia or an amine and an acid gas (a gas of an acidic substance) are held in the opening 55f (see FIG. 4) of the frame 55. Chemical filter 56. The width of each of the filter boxes 38, 40 in the Y direction (direction of air flow) is, for example, 200 to 400 mm, and the weight of each of the filter boxes 38, 40 is, for example, about 10 to 20 kg.

作為有機系氣體除去用之化學過濾器51，可使用例如活性碳型過濾器或陶瓷型過濾器等。又，作為鹼系氣體及酸性氣體除去用之化學過濾器56，能使用添加劑活性碳型過濾器、離子交換樹脂型過濾器、離子交換纖維型過濾器、或添加劑陶瓷型過濾器等。又，框架50,55、分隔板42、盒體28、以及門29，分別由具有耐蝕性且脫氣等較少之材料、例如於表面形成有氧化皮膜(氧化鋁等)之鋁(經氧化處理之鋁)或不鏽鋼等形成。此外，框架50,55等亦能以包含具有耐蝕性且脫氣較少之材料(以聚乙烯覆蓋之層板或氟系樹脂等)等形成。 As the chemical filter 51 for removing organic gases, for example, an activated carbon filter or a ceramic filter can be used. Further, as the chemical filter 56 for removing the alkali gas and the acid gas, an additive activated carbon filter, an ion exchange resin filter, an ion exchange fiber filter, or an additive ceramic filter can be used. Further, the frames 50, 55, the partitioning plate 42, the casing 28, and the door 29 are each made of a material having less corrosion resistance and degassing, for example, an aluminum film (alumina or the like) formed on the surface thereof. Oxidized aluminum) or stainless steel or the like. Further, the frames 50, 55 and the like can also be formed of a material (such as a laminate covered with polyethylene or a fluorine-based resin) having corrosion resistance and less degassing.

此外，藉由除去有機系氣體，使腔室10之曝光室10a內曝光用光EL之透射率提升，且藉由有機系氣體與曝光用光EL之相互作用抑制形成於光學元件表面之霧物質之產生。又，藉由除去鹼系氣體及酸性氣體，抑制晶圓W之光阻特性之變化等。特別是，當光阻為化學放大型光阻時，若於空氣中有氨或胺等鹼系氣體，即有產生之酸反應而於光阻表面形成難溶化層之虞。因此，特別是除去氨或胺等 鹼系氣體為有效。 Further, by removing the organic gas, the transmittance of the exposure light EL in the exposure chamber 10a of the chamber 10 is increased, and the mist substance formed on the surface of the optical element is suppressed by the interaction of the organic gas and the exposure light EL. Produced. Further, by removing the alkali gas and the acid gas, the change in the photoresist characteristics of the wafer W and the like are suppressed. In particular, when the photoresist is a chemically amplified photoresist, if an alkali-based gas such as ammonia or an amine is present in the air, the generated acid reacts to form an insoluble layer on the surface of the photoresist. Therefore, in particular, removal of ammonia or amines, etc. The alkali gas is effective.

此外，圖1之裝載室10b內之過濾器箱63,64內之化學過濾器之構成，與化學過濾器51,56之構成相同。不過，過濾器箱63,64較過濾器箱38,40小型亦可。 Further, the chemical filter in the filter boxes 63, 64 in the loading chamber 10b of Fig. 1 has the same configuration as the chemical filters 51, 56. However, the filter boxes 63, 64 may be smaller than the filter boxes 38, 40.

此處，參照圖5(A)~(D)說明過濾器箱38及40之構成。圖5(C)係顯示圖5(A)之過濾器箱38之俯視圖，圖5(D)係顯示圖5(B)之過濾器箱40之俯視圖。 Here, the configuration of the filter boxes 38 and 40 will be described with reference to Figs. 5(A) to (D). Fig. 5(C) is a plan view showing the filter case 38 of Fig. 5(A), and Fig. 5(D) is a plan view showing the filter case 40 of Fig. 5(B).

如圖5(A)所示，第1過濾器箱38具有於中央部設有大致正方形開口50f(參照圖4)之大致環狀框架50、保持於開口50f內之化學過濾器51、以及於載置於框架50之盒體28之底板28h(參照圖2)上面之作為第1側面之下面(底面或載置面)50b形成為相對框架50之氣体流出側之第1端面50a以傾斜角α(參照圖5(C))傾斜之第1槽部52A。作為一例，傾斜角α為數度~20°，例如3°~10°程度。 As shown in Fig. 5(A), the first filter case 38 has a substantially annular frame 50 having a substantially square opening 50f (see Fig. 4) at the center, a chemical filter 51 held in the opening 50f, and The lower surface (bottom surface or mounting surface) 50b as the first side surface of the bottom plate 28h (see FIG. 2) of the casing 28 of the frame 50 is formed at an inclination angle with respect to the first end surface 50a of the gas outflow side of the frame 50. α (see Fig. 5(C)) is the first groove portion 52A that is inclined. As an example, the inclination angle α is several degrees to 20 degrees, for example, about 3 to 10 degrees.

進而，本實施形態中，過濾器箱38具有：隔著化學過濾器51於框架50之與下面50b為相反側之作為第2側面之上面50c平行形成為與第1槽部52A相同形狀之第2槽部52B、於框架50之第1端面50a藉接著等固定成包圍開口50f之大致正方形環狀墊片54A、固定於框架50之與端面50a相鄰之第4側面50c之把手部70A、藉接著等固定於框架50之氣体流入側之第2端面50g之框狀罩構件TF1。罩構件TF1之材料例如與罩構件TF3之材料相同。又，把手部70A之形狀為任意。 Further, in the present embodiment, the filter case 38 has the same shape as the first groove portion 52A in parallel with the upper surface 50c which is the second side surface opposite to the lower surface 50b of the frame 50 via the chemical filter 51. The second groove portion 52B is fixed to a substantially square annular gasket 54A surrounding the opening 50f, and a handle portion 70A fixed to the fourth side surface 50c of the frame 50 adjacent to the end surface 50a, and the first end surface 50a of the frame 50. Then, the frame-like cover member TF1 fixed to the second end surface 50g of the gas inflow side of the frame 50 is waited for. The material of the cover member TF1 is, for example, the same as that of the cover member TF3. Further, the shape of the handle portion 70A is arbitrary.

框架50之槽部52A及52B，分別具有深度d1且從端 面50a往端面50g之方向以寬度a1平行配置之邊緣部52Aa,52Ab及52Ba,52Bb。槽部52A,52B，平均地傾斜成在框架50之第4側面50e中接近第2端面50g、在第3側面50d中接近第1端面50a之位置。又，於第2槽部52B(及第1槽部52A)之兩端形成有用以使與後述之盒體28側之上部導板48A,48C之卡合容易之去角部52Bc,52Bd(參照圖5(c))。 The groove portions 52A and 52B of the frame 50 have depths d1 and slave ends, respectively. The surface 50a is disposed in the direction of the end surface 50g in the direction of the edge portion 52Aa, 52Ab and 52Ba, 52Bb which are arranged in parallel with the width a1. The groove portions 52A and 52B are evenly inclined so as to approach the second end surface 50g in the fourth side surface 50e of the frame 50 and to approach the first end surface 50a in the third side surface 50d. Further, at both ends of the second groove portion 52B (and the first groove portion 52A), the corner portions 52Bc and 52Bd for facilitating the engagement with the upper guide plates 48A and 48C on the casing 28 side to be described later are formed (refer to Figure 5 (c)).

又，如圖5(B)所示，第2過濾器箱40具有於中央部設有大致正方形開口55f(參照圖4)之大致環狀框架55、保持於開口55f內之化學過濾器56、以及於載置於框架55之盒體28之底板28h(參照圖2)上面之作為第1側面之下面(底面或載置面)55B形成為相對框架55之氣体流出側之第1端面55a以與第1槽部52A相同傾斜角α(參照圖5(D))傾斜之第1槽部57A。 Further, as shown in FIG. 5(B), the second filter case 40 has a substantially annular frame 55 having a substantially square opening 55f (see FIG. 4) at the center, and a chemical filter 56 held in the opening 55f. And a lower surface (bottom surface or mounting surface) 55B as a first side surface of the bottom plate 28h (see FIG. 2) of the casing 28 of the frame 55 is formed so as to be opposite to the first end surface 55a of the gas outflow side of the frame 55. The first groove portion 57A which is inclined at the same inclination angle α (see FIG. 5(D)) as the first groove portion 52A.

本實施形態中，過濾器箱40具有：隔著化學過濾器56於框架55之與下面55b為相反側之上面55c(第2側面)平行形成為與第1槽部57A相同形狀之第2槽部57B。過濾器箱40之槽部57A,57B之深度d2較過濾器箱38之槽部52A,52B之深度d1深，且槽部57A及57B之兩個邊緣部57Aa,57Ab及57Ba,57Bb之寬度a2設定為較槽部52A,52B之寬度a1窄。過濾器箱40之構成除了化學過濾器56之種類與化學過濾器51相異及槽部57A,57B之形狀與槽部52A,52B相異以外，其餘則與過濾器箱38相同。 In the present embodiment, the filter case 40 has a second groove formed in the same shape as the first groove portion 57A in parallel with the upper surface 55c (second side surface) of the frame 55 opposite to the lower surface 55b via the chemical filter 56. Part 57B. The depth d2 of the groove portions 57A, 57B of the filter case 40 is deeper than the depth d1 of the groove portions 52A, 52B of the filter case 38, and the widths a2 of the two edge portions 57Aa, 57Ab and 57Ba, 57Bb of the groove portions 57A and 57B It is set to be narrower than the width a1 of the groove portions 52A, 52B. The configuration of the filter case 40 is the same as that of the filter case 38 except that the type of the chemical filter 56 is different from that of the chemical filter 51 and the shapes of the groove portions 57A, 57B are different from those of the groove portions 52A, 52B.

亦即，過濾器箱40亦具有：於框架55之第1端面55a藉接著等固定成包圍開口55f之大致正方形環狀墊片54B、 固定於框架55之第4側面55c之把手部70B、藉接著等固定於框架55之氣体流入側之第2端面55g之框狀罩構件TF2。又，設於框架55之槽部57A,57B，亦平均地傾斜成在框架55之第4側面55e中接近第2端面55g、在第3側面55d中接近第1端面55a之位置。又，於第2槽部57B(及第1槽部57A)之兩端形成有用以使與後述之盒體28側之上部導板48B之卡合容易之去角部57Bc,57Bd(參照圖5(D))。 That is, the filter case 40 also has a substantially square annular spacer 54B that is fixed to the opening 55f by the first end surface 55a of the frame 55, The handle portion 70B fixed to the fourth side surface 55c of the frame 55 is fixed to the frame-shaped cover member TF2 of the second end surface 55g on the gas inflow side of the frame 55. Moreover, the groove portions 57A and 57B provided in the frame 55 are also inclined evenly so as to approach the second end surface 55g in the fourth side surface 55e of the frame 55 and to approach the first end surface 55a in the third side surface 55d. Further, at both ends of the second groove portion 57B (and the first groove portion 57A), corner portions 57Bc and 57Bd for facilitating the engagement with the upper portion guide 48B on the casing 28 side to be described later are formed (see FIG. 5). (D)).

本實施形態中，第1過濾器箱38及第2過濾器箱40由於槽部52A,52B及57A,57B之形狀彼此相異，因此能從外形識別化學過濾器51,56之種類相異。 In the present embodiment, since the shapes of the groove portions 52A, 52B and 57A, 57B differ from each other in the first filter case 38 and the second filter case 40, the types of the chemical filters 51, 56 can be different from each other.

又，藉由於圖2之分隔板42設置罩構件TF3，於過濾器箱38,40設置罩構件TF1,TF2，而在過濾器箱38,40之更換時從盒體28內搬出過濾器箱38,40時，能容易地從分隔板42(罩構件TF3)及過濾器箱38(罩構件TF1)分別容易地使過濾器箱38及40之墊片54A及54B分離。同樣地，能容易地從過濾器箱40(罩構件TF2)容易地使過濾器箱38之墊片54A分離。 Further, since the cover member TF3 is provided in the partition plate 42 of Fig. 2, the cover members TF1, TF2 are provided in the filter boxes 38, 40, and the filter case is carried out from the case 28 when the filter boxes 38, 40 are replaced. At 38 and 40, the spacers 54A and 54B of the filter boxes 38 and 40 can be easily separated from the partition plate 42 (cover member TF3) and the filter case 38 (cover member TF1). Similarly, the gasket 54A of the filter box 38 can be easily separated from the filter case 40 (cover member TF2).

其次，如圖3所示，過濾器裝置26具備：於盒體28之底板28h上面平行固定成相對分隔板42表面以傾斜角α傾斜之3條軌道狀之下部導板47A,47B,47C、以及於盒體28之上板28j底面平行固定成相對分隔板42表面以傾斜角α傾斜之3條軌道狀之上部導板48A,48B,48C。本實施形態中，所謂下部係在使用時之狀態下為-Z方向(垂直下方)之部分(底部)，所謂上部為+Z方向之部分。 Next, as shown in Fig. 3, the filter device 26 is provided with three rail-shaped lower guides 47A, 47B, 47C which are fixed in parallel on the bottom plate 28h of the casing 28 so as to be inclined at an inclination angle α with respect to the surface of the partition plate 42. And three rail-shaped upper guide plates 48A, 48B, 48C which are parallelly fixed to the bottom surface of the upper plate 28j of the casing 28 so as to be inclined at an inclination angle α with respect to the surface of the partition plate 42. In the present embodiment, the lower portion is a portion (bottom portion) in the -Z direction (vertical lower direction) in the state of use, and the upper portion is a portion in the +Z direction.

下部導板47A~47C與上部導板48A~48C互為平行。導板47A~47C,48A~48C之傾斜角α與設於過濾器箱38,40之框架50,55之槽部52A,52B及57A,57B之傾斜角α(參照圖5(C)、(D))相同。導板47A~47C,48A~48C例如與框架50,55相同為金屬製。此外，亦可將導板47A~47C,48A~48C與罩構件TF3同樣地由易滑動之合成樹脂形成。 The lower guide plates 47A to 47C and the upper guide plates 48A to 48C are parallel to each other. The inclination angle α of the guide plates 47A to 47C, 48A to 48C and the inclination angle α of the groove portions 52A, 52B and 57A, 57B provided in the frames 50, 55 of the filter boxes 38, 40 (refer to Fig. 5(C), D)) Same. The guide plates 47A to 47C, 48A to 48C are made of metal, for example, similarly to the frames 50 and 55. Further, the guide plates 47A to 47C, 48A to 48C may be formed of a synthetic resin that is easy to slide, similarly to the cover member TF3.

過濾器箱38用之下部導板47A,47C之形狀互為相同。下部導板47A係具有Y方向之寬度b1之平行邊緣部47Aa,47Ab之平板狀構件。下部導板47A之寬度b1設定為略小於過濾器箱38之第1槽部52A之寬度a1，且較過濾器箱40之第1槽部57A之寬度a2寬。下部導板47A之厚度h1設定為略小於過濾器箱38之第1槽部52A之深度d1小。因此，在於底板28h上載置有過濾器箱38,40之下面50b,55b之狀態下，下部導板47A收納於第1槽部52A內，且下部導板47A係卡在第1槽部57A而無法進入。下部導板47A之長度L1設定為較第1槽部52A長。 The shape of the lower guide plates 47A, 47C of the filter case 38 are identical to each other. The lower guide 47A is a flat member having parallel edge portions 47Aa, 47Ab of the width b1 in the Y direction. The width b1 of the lower guide 47A is set to be slightly smaller than the width a1 of the first groove portion 52A of the filter case 38, and is wider than the width a2 of the first groove portion 57A of the filter case 40. The thickness h1 of the lower guide 47A is set to be slightly smaller than the depth d1 of the first groove portion 52A of the filter case 38. Therefore, in a state in which the bottom plate 28h is placed on the lower surfaces 50b and 55b of the filter boxes 38 and 40, the lower guide 47A is housed in the first groove portion 52A, and the lower guide 47A is caught in the first groove portion 57A. Inaccessible. The length L1 of the lower guide 47A is set to be longer than the first groove portion 52A.

又，過濾器箱40用之下部導板47B係具有於Y方向較寬度b1窄之寬度b2枝邊緣部47Ba,47Bb、厚度較h1厚之h2且長度L1之平板狀構件。寬度b2設定為略小於過濾器箱40之第1槽部57A之寬度a2，下部導板47B之厚度h2設定為大於過濾器箱38之第1槽部52A之深度d1且設定為略小於第1槽部57A之深度d2。因此，在於底板28h上載置有過濾器箱38,40之狀態下，下部導板47B收納於第1槽部57A內，且下部導板47B係卡在第1槽部52A而無 法進入。 Further, the lower guide vane 47B of the filter case 40 has a width-shaped b2 branch edge portions 47Ba, 47Bb narrower than the width b1 in the Y direction, and a flat member having a thickness h2 thicker than h1 and having a length L1. The width b2 is set to be slightly smaller than the width a2 of the first groove portion 57A of the filter case 40, and the thickness h2 of the lower guide 47B is set to be larger than the depth d1 of the first groove portion 52A of the filter case 38 and set to be slightly smaller than the first one. The depth of the groove portion 57A is d2. Therefore, in a state in which the filter case 38, 40 is placed on the bottom plate 28h, the lower guide 47B is housed in the first groove portion 57A, and the lower guide 47B is caught in the first groove portion 52A without Law enters.

藉由此構成，由於無法將第2過濾器箱40之第1槽部57A卡合於下部導板47A,47C，且無法將第1過濾器箱38之第1槽部52A卡合於下部導板47B，因此能防止將過濾器箱38,40設置於錯誤位置。又，能在分別使過濾器箱38,40,38之第1槽部52A,57A,52A卡合於下部導板47A,47B,47C之狀態下，使過濾器箱38,40在底板28h上順暢地移動至側壁28i側，相對分隔板42將過濾器箱38,40容易且正確地定位。又，於下部導板47A,47B之窗部28b側前端部形成有去角部47Ac,47Bc。因此，能使過濾器箱38,40之第1槽部52A,57A容易地卡合於下部導板47A,47B。 With this configuration, the first groove portion 57A of the second filter case 40 cannot be engaged with the lower guide plates 47A and 47C, and the first groove portion 52A of the first filter case 38 cannot be engaged with the lower guide. The plate 47B can thus prevent the filter boxes 38, 40 from being placed at the wrong position. Further, the filter cases 38, 40 can be placed on the bottom plate 28h while the first groove portions 52A, 57A, 52A of the filter boxes 38, 40, 38 are engaged with the lower guide plates 47A, 47B, 47C, respectively. Smoothly moving to the side of the side wall 28i, the filter boxes 38, 40 are easily and correctly positioned relative to the partitioning plate 42. Further, chamfered portions 47Ac, 47Bc are formed at the front end portion of the lower portion guide plates 47A, 47B on the side of the window portion 28b. Therefore, the first groove portions 52A, 57A of the filter boxes 38, 40 can be easily engaged with the lower guide plates 47A, 47B.

又，過濾器箱38用之上部導板48A,48C之形狀互為相同。上部導板48A係具有Y方向寬度與下部導板47A之寬度b1相同之邊緣部48Aa,48Ab之長度L2之平板狀構件。上部導板48A之厚度h3設定為當於底板28h上載置有過濾器箱38時上部導板48A收納於過濾器箱38之框架50之第2槽部52B內。上部導板48A之長度L2設定為較第2槽部52B之長度短。 Further, the shape of the upper guide plates 48A, 48C of the filter case 38 are identical to each other. The upper guide 48A is a flat member having a length L2 of the edge portions 48Aa and 48Ab having the same width in the Y direction as the width b1 of the lower guide 47A. The thickness h3 of the upper guide 48A is set such that the upper guide 48A is housed in the second groove portion 52B of the frame 50 of the filter case 38 when the filter case 38 is placed on the bottom plate 28h. The length L2 of the upper guide 48A is set to be shorter than the length of the second groove portion 52B.

又，過濾器箱40用之上部導板48B係具有Y方向寬度與下部導板47B之寬度b2相同之邊緣部48Ba,48Bb、厚度為較h3厚之厚度h4且長度L2之平板狀構件。厚度h4設定為當於底板28h上載置有過濾器箱38,40時上部導板48B會卡在過濾器箱38之第2槽部52B而無法收納，且上部導板48B會收納於過濾器箱40之框架55之第2槽部57B內。 又，於過濾器箱38,40之上面與盒體28之上板28j之間確保有一定程度之間隙。 Further, the upper case 48B of the filter case 40 has the edge portions 48Ba, 48Bb having the same width in the Y direction as the width b2 of the lower guide 47B, and a flat member having a thickness h4 thicker than h3 and having a length L2. The thickness h4 is set such that when the filter case 38, 40 is placed on the bottom plate 28h, the upper guide 48B is caught in the second groove portion 52B of the filter case 38 and cannot be stored, and the upper guide 48B is housed in the filter case. In the second groove portion 57B of the frame 55 of 40. Further, a certain degree of clearance is ensured between the upper surface of the filter boxes 38, 40 and the upper plate 28j of the casing 28.

藉由此構成，能在盒體28內分別使過濾器箱38,40,38之第1槽部52A,57A,52A卡合於下部導板47A,47B,47C後，進而分別使過濾器箱38,40,38之第2槽部52B,57B,52B卡合於上部導板48A,48B,48C。此狀態下，於上部導板48A,48B之窗部28b側之前端部形成有去角部48Ac,48Bc。因此，能容易地使過濾器箱38,40之第2槽部52B,57B容易地卡合於上部導板48A,48B。 With this configuration, the first groove portions 52A, 57A, and 52A of the filter boxes 38, 40, and 38 can be engaged with the lower guide plates 47A, 47B, and 47C in the casing 28, and then the filter boxes can be respectively made. The second groove portions 52B, 57B, 52B of 38, 40, 38 are engaged with the upper guide plates 48A, 48B, 48C. In this state, the corner portions 48Ac, 48Bc are formed at the front end portions on the side of the window portion 28b of the upper guide plates 48A, 48B. Therefore, the second groove portions 52B, 57B of the filter boxes 38, 40 can be easily engaged with the upper guide plates 48A, 48B.

圖4係從上面觀看已將圖2之盒體28之門29關閉之狀態之過濾器裝置26之剖面圖。圖4中，橫置於盒體28之底板28h上面之過濾器箱38,40,38之第1槽部52A,57A,52A分別卡合於下部導板47A,47B,47C。進而，過濾器箱38,40,38之第2槽部52B,57B,52B分別卡合於上部導板48A,48B,48C(參照圖2)。在此狀態下，卡合於下部導板47A之過濾器箱38之墊片54A緊貼於固定在分隔板42之罩構件TF3，卡合於下部導板47B之過濾器箱40之墊片54B緊貼於固定在此過濾器箱38之罩構件TF1，卡合於下部導板47C之過濾器箱38之墊片54A緊貼於固定在此過濾器箱40之罩構件TF2。 4 is a cross-sectional view of the filter device 26 in a state in which the door 29 of the casing 28 of FIG. 2 has been closed as viewed from above. In Fig. 4, the first groove portions 52A, 57A, 52A of the filter boxes 38, 40, 38 which are placed on the bottom plate 28h of the casing 28 are respectively engaged with the lower guide plates 47A, 47B, 47C. Further, the second groove portions 52B, 57B, and 52B of the filter boxes 38, 40, and 38 are respectively engaged with the upper guide plates 48A, 48B, and 48C (see Fig. 2). In this state, the gasket 54A of the filter case 38 that is engaged with the lower guide 47A is in close contact with the cover member TF3 fixed to the partitioning plate 42, and the gasket of the filter case 40 that is engaged with the lower guide 47B. 54B is in close contact with the cover member TF1 fixed to the filter case 38, and the spacer 54A of the filter case 38 engaged with the lower guide 47C is in close contact with the cover member TF2 fixed to the filter case 40.

又，盒體28內之以分隔板42分割之空間28c,28f，藉由具有墊片46之門29被氣密化。又，用以將過濾器箱38,40從門29側往盒體28之側壁28i彈壓之彼此相同構成之彈壓機構58A,58B,58C與下部導板47A~47C對應地設於 門29。彈壓機構58C例如具有固定於門29之支點部58C3、安裝成能旋轉於支點部58C3之桿構件58C2、將桿構件58C2從門29往盒體28側彈壓之壓縮線圈彈簧58C1、以及將桿構件58C2之旋轉角抑制於既定值以下之阻尼器(未圖示)。 Further, the spaces 28c, 28f partitioned by the partition plate 42 in the casing 28 are hermetically sealed by the door 29 having the spacer 46. Further, the biasing mechanisms 58A, 58B, 58C for urging the filter boxes 38, 40 from the side of the door 29 toward the side wall 28i of the casing 28 are provided correspondingly to the lower guides 47A to 47C. Door 29. The biasing mechanism 58C has, for example, a fulcrum portion 58C3 fixed to the door 29, a lever member 58C2 that is rotatably attached to the fulcrum portion 58C3, a compression coil spring 58C1 that presses the lever member 58C2 from the door 29 toward the casing 28 side, and a lever member. The rotation angle of 58C2 is suppressed by a damper (not shown) below a predetermined value.

由於下部導板47A~47C(及上部導板48A~48C)與第1槽部52A,57A(及第2槽部52B,57B)相對分隔板42表面以傾斜角α(參照圖3)傾斜，因此藉由以彈壓機構58A~58C將過濾器箱38,40往側壁28i側彈壓，過濾器箱38,40即被往分隔板42側彈壓。因此，分隔板42(罩構件TF3)與過濾器箱38,40間之氣密性可高度維持。 The lower guide plates 47A to 47C (and the upper guide plates 48A to 48C) and the first groove portions 52A and 57A (and the second groove portions 52B and 57B) are inclined at an inclination angle α (refer to FIG. 3) with respect to the surface of the partition plate 42. Therefore, the filter boxes 38, 40 are biased toward the side wall 28i by the biasing mechanisms 58A to 58C, and the filter boxes 38, 40 are biased toward the partition plate 42 side. Therefore, the airtightness between the partition plate 42 (the cover member TF3) and the filter boxes 38, 40 can be highly maintained.

接著，盒體28內之第1空間28c內之空氣AR必定通過卡合於下部導板47C之過濾器箱38內之化學過濾器51、卡合於下部導板47B之過濾器箱40內之化學過濾器56、卡合於下部導板47A之過濾器箱38內之化學過濾器51、以及分隔板42之開口42a而流入第2空間28f。空間28i內之空氣通過側壁之開口28g流入圖1之第1管32。因此，從盒體28之開口28a流入之空氣AR，必定通過兩段之有機系氣體除去用之過濾器箱38及一段之鹼系氣體及酸性氣體除去用之過濾器箱40而供給至圖1之空調裝置30，因此腔室10內被供給已高度除去不純物之空氣。 Then, the air AR in the first space 28c in the casing 28 is necessarily passed through the chemical filter 51 engaged in the filter box 38 of the lower guide 47C, and the filter box 40 engaged with the lower guide 47B. The chemical filter 56 is engaged with the chemical filter 51 in the filter case 38 of the lower guide 47A and the opening 42a of the partition plate 42 to flow into the second space 28f. The air in the space 28i flows into the first pipe 32 of Fig. 1 through the opening 28g of the side wall. Therefore, the air AR flowing in from the opening 28a of the casing 28 is supplied to the filter tank 38 for removing the organic gas in two stages and the filter tank 40 for removing the alkali gas and acid gas. In the air conditioner (30), air in the chamber 10 is highly supplied with impurities.

其次，參照圖6(A)、(B)說明過濾器箱38,40對盒體28之設置動作及更換動作。圖6(A)、(B)，分別係以剖面表示盒體28之俯視圖。 Next, the installation operation and the replacement operation of the filter case 38, 40 with respect to the casing 28 will be described with reference to Figs. 6(A) and (B). 6(A) and 6(B) are plan views showing the casing 28 in a cross section.

首先，於盒體28最初設置兩個過濾器箱38及一個過 濾器箱40時，準備圖5(A)之填充有未使用之化學過濾器51之兩個過濾器箱38、以及圖5(B)之填充有未使用之化學過濾器56之一個過濾器箱40。其次，在解除盒體28之鎖固(未圖示)而開啟門29後，圖6(A)中作業者抓持第一個過濾器箱38之把手部70A，使過濾器箱38(框架50)之下面50b之第1槽部52A卡合於盒體28之底板28h上之下部導板47A之前端部。 First, two filter boxes 38 and one are initially provided in the casing 28. In the case of the filter case 40, two filter boxes 38 filled with the unused chemical filter 51 of Fig. 5(A) and one filter case filled with the unused chemical filter 56 of Fig. 5(B) are prepared. 40. Next, after unlocking the lock of the casing 28 (not shown) and opening the door 29, the operator in FIG. 6(A) grips the handle portion 70A of the first filter case 38, so that the filter case 38 (frame 50) The first groove portion 52A of the lower surface 50b is engaged with the front end portion of the lower portion guide plate 47A on the bottom plate 28h of the casing 28.

其後，將過濾器箱38往側壁28i側壓入後，過濾器箱38沿下部導板47A傾斜移動，過濾器箱38(框架50)之第2槽部52B卡合於盒體28之上部導板48A。在此狀態下進一步將過濾器箱38往側壁28i側壓入後，即如圖6(B)所示，過濾器箱38在墊片54A接觸於分隔板42表面之罩構件TF3之位置(設置位置)停止。此情形下，在過濾器箱38之槽部52A,52B之端面50a側(圖6(B)中為分隔板42側)之邊緣部52Aa,52Ba由於被以盒體28內之下部導板47A及上部導板48A之分隔板42側之邊緣部47Aa,48Aa往分隔板42側彈壓，因此墊片54A緊貼於罩構件TF3。 Thereafter, after the filter case 38 is pressed into the side wall 28i side, the filter case 38 is tilted and moved along the lower guide 47A, and the second groove portion 52B of the filter case 38 (frame 50) is engaged with the upper portion of the case 28. Guide plate 48A. After the filter case 38 is further pushed into the side wall 28i side in this state, as shown in Fig. 6(B), the filter case 38 is in contact with the cover member TF3 of the surface of the partitioning plate 42 at the position of the spacer 54A ( Set the location) to stop. In this case, the edge portions 52Aa, 52Ba on the side of the end face 50a of the groove portions 52A, 52B of the filter case 38 (the side of the partition plate 42 in Fig. 6(B)) are guided by the lower portion of the inside of the casing 28. The edge portions 47Aa, 48Aa on the partition plate 42 side of the 47A and the upper guide 48A are biased toward the partition plate 42 side, so that the gasket 54A is in close contact with the cover member TF3.

其次，作業者抓持第一個過濾器箱40之把手部70B，使過濾器箱40(框架55)之下面55b之第1槽部57A卡合於盒體28之底板28h上之下部導板47B之前端部。其後，將過濾器箱40往側壁28i側壓入後，過濾器箱40沿下部導板47B傾斜移動，過濾器箱40之第2槽部57B卡合於盒體28之上部導板48B。在此狀態下進一步將過濾器箱40往側壁28i側壓入後，過濾器箱40在墊片54B接觸於第一個過濾 器箱38之罩構件TF1之位置(設置位置)停止。此情形下，在過濾器箱40之槽部57A,57B之端面55a側(圖6(B)中為分隔板42側)之邊緣部57Aa,57Ba由於被以盒體28內之下部導板47B及上部導板48B之分隔板42側之邊緣部47Ba,48Ba往分隔板42側彈壓，因此墊片54B緊貼於罩構件TF1。 Next, the operator grips the handle portion 70B of the first filter case 40, so that the first groove portion 57A of the lower surface 55b of the filter case 40 (frame 55) is engaged with the lower portion of the bottom plate 28h of the case 28 The front end of 47B. Thereafter, after the filter case 40 is pushed into the side wall 28i side, the filter case 40 is tilted and moved along the lower guide 47B, and the second groove portion 57B of the filter case 40 is engaged with the upper guide 48B of the case 28. After the filter box 40 is further pushed into the side wall 28i side in this state, the filter box 40 is in contact with the first filter at the spacer 54B. The position (set position) of the cover member TF1 of the box 38 is stopped. In this case, the edge portions 57Aa, 57Ba on the side of the end surface 55a of the groove portions 57A, 57B of the filter case 40 (the side of the partitioning plate 42 in Fig. 6(B)) are guided by the lower portion of the inside of the casing 28. The edge portions 47Ba, 48Ba on the partition plate 42 side of the 47B and the upper guide 48B are biased toward the partition plate 42 side, so that the gasket 54B is in close contact with the cover member TF1.

其後，作業者與第一個過濾器箱38同樣地，使第二個過濾器箱38(框架50)之下面50b之第1槽部52A卡合於底板28h上之下部導板47C之前端部，將此過濾器箱38往側壁28i側壓入。其後，過濾器箱38之第2槽部52B卡合於盒體28之上部導板48C後，進一步將過濾器箱38往側壁28i側壓入後，即如圖4所示，過濾器箱38在墊片54A接觸於過濾器箱40之罩構件TF2之位置(設置位置)停止。其後，藉由關閉門29，成為過濾器裝置26能使用之狀態。 Thereafter, in the same manner as the first filter case 38, the operator engages the first groove portion 52A of the lower surface 50b of the second filter case 38 (frame 50) with the front end of the lower plate guide 47C on the bottom plate 28h. The filter box 38 is pressed into the side wall 28i side. Thereafter, after the second groove portion 52B of the filter case 38 is engaged with the upper guide 48C of the casing 28, the filter case 38 is further pressed into the side wall 28i side, that is, as shown in FIG. 38 is stopped at a position (setting position) where the spacer 54A comes into contact with the cover member TF2 of the filter case 40. Thereafter, by closing the door 29, the filter device 26 can be used.

又，在更換過濾器箱38,40時，係在開啟門29後，作業者抓持第二個過濾器箱38之把手部70B，將過濾器箱38沿導板47C,48C拉出至盒體28外。其次，抓持過濾器箱40之把手部70B，將過濾器箱40沿導板47B,48B拉出至盒體28外，並將第一個過濾器箱38沿導板47A,48A拉出至盒體28外。其後，以參照圖6(A)、(B)所說明之順序將新的過濾器箱38,40設置於盒體28內，過濾器箱38,40之更換即結束。 Further, when the filter boxes 38, 40 are replaced, after the door 29 is opened, the operator grips the handle portion 70B of the second filter case 38, and pulls the filter case 38 along the guide plates 47C, 48C to the case. Outside the body 28. Next, the handle portion 70B of the filter case 40 is grasped, the filter case 40 is pulled out along the guide plates 47B, 48B to the outside of the case 28, and the first filter case 38 is pulled out along the guide plates 47A, 48A to Outside the casing 28. Thereafter, the new filter boxes 38, 40 are placed in the casing 28 in the order described with reference to Figs. 6(A) and (B), and the replacement of the filter boxes 38, 40 is completed.

此時，由於於過濾器箱38,40設有槽部52A,52B及57A,57B，於盒體28內設有下部導板47A~47C及上部導板48A~48C，因此能將過濾器箱38,40容易且迅速地設置於設置 位置。再者，由於能將過濾器箱38,40容易地從盒體28內取出，因此能容易且迅速地進行過濾器箱38,40之更換。 At this time, since the filter boxes 38, 40 are provided with the groove portions 52A, 52B and 57A, 57B, the lower guide plates 47A to 47C and the upper guide plates 48A to 48C are provided in the casing 28, so that the filter case can be provided. 38, 40 is easy and quick to set in settings position. Further, since the filter boxes 38, 40 can be easily taken out from the casing 28, the filter boxes 38, 40 can be easily and quickly replaced.

本實施形態之效果等如下所述。 The effects and the like of the embodiment are as follows.

(1)本實施形態之曝光裝置EX具備包含過濾器裝置26及空調裝置30之整體空調系統，過濾器裝置26係具備兩個第1過濾器箱38及一個第2過濾器箱40。 (1) The exposure apparatus EX of the present embodiment includes an entire air conditioning system including the filter device 26 and the air conditioner 30. The filter device 26 includes two first filter cases 38 and one second filter case 40.

接著，保持化學過濾器51之第1過濾器箱38，具有保持化學過濾器51之框架50；形成於框架50之下面50b(第1側面)之第1槽部52A(第1形狀變化部)。第1槽部52A包含邊緣部52Aa，該邊緣部52Aa從框架50之側面中彼此分離之兩個端面(第一端面)50a,50g中之一方端面50g側且從框架50之側面中彼此分離之兩個側面(第二端面)50d,50e中之一方側面50e側，延伸至兩個端面50a,50g中之另一方側面50a側且延伸至兩個側面50d,50e中之另一方側面50d。 Next, the first filter case 38 of the chemical filter 51 is held, and has a frame 50 for holding the chemical filter 51, and a first groove portion 52A (first shape change portion) formed on the lower surface 50b (first side surface) of the frame 50. . The first groove portion 52A includes an edge portion 52Aa which is separated from each other from the side surface 50g side of the two end faces (first end faces) 50a, 50g which are separated from each other in the side surface of the frame 50. One of the two side faces (second end faces) 50d, 50e side extends to the other of the two end faces 50a, 50g and extends to the other of the two side faces 50d, 50e.

又，過濾器裝置26具備：過濾器箱38；盒體28，以過濾器箱38之框架50中形成有第1槽部52A之側面為下面50b之方式收納過濾器箱38；以及下部導板47A(第1導引部)，設於盒體28之底板28h表面(下部)，具有能接觸於過濾器箱38之第1槽部52A之邊緣部52Aa之邊緣部47Aa。 Further, the filter device 26 includes a filter case 38, and a case 28 in which the filter case 38 is housed such that the side surface of the frame 50 of the filter case 38 in which the first groove portion 52A is formed is the lower surface 50b; and the lower guide plate The 47A (first guide portion) is provided on the surface (lower portion) of the bottom plate 28h of the casing 28, and has an edge portion 47Aa that can contact the edge portion 52Aa of the first groove portion 52A of the filter case 38.

根據本實施形態，藉由以過濾器箱38之第1槽部52A之邊緣部52Aa沿盒體28之下部導板47A之邊緣部47Aa之方式彈壓(移動)框架50，即能以有效率及容易定位之方式進行過濾器箱38(化學過濾器51)對盒體28內之目標位置 之設置。換言之，過濾器箱38之下部導板47A能發揮移動及定位之兩個功能。 According to the present embodiment, by elastically moving (moving) the frame 50 so that the edge portion 52Aa of the first groove portion 52A of the filter case 38 is along the edge portion 47Aa of the lower portion of the lower portion 47A of the casing 28, it is possible to efficiently The filter box 38 (chemical filter 51) is positioned to the target position in the casing 28 in an easy positioning manner. The setting. In other words, the lower guide 47A of the filter box 38 can perform two functions of movement and positioning.

(2)又，第1過濾器箱38具有第2槽部52B(第2形狀變化部)，其形成於框架50之隔著化學過濾器51與下面50b為相反側之上面50c(第2側面)、包含與邊緣部52Aa平行之邊緣部52Ba。進而，過濾器裝置26具備上部導板48A(第2導引部)，其設於盒體28之上板28j之底面(上部)，具有能接觸於過濾器箱38之第2槽部52B之邊緣部52Ba之邊緣部48Aa。 (2) Further, the first filter case 38 has a second groove portion 52B (second shape changing portion) formed on the upper surface 50c of the frame 50 opposite to the lower surface 50b via the chemical filter 51 (the second side surface) ), including an edge portion 52Ba parallel to the edge portion 52Aa. Further, the filter device 26 includes an upper guide 48A (second guide portion) provided on the bottom surface (upper portion) of the upper plate 28j of the casing 28, and has a second groove portion 52B that can contact the filter case 38. The edge portion 48Aa of the edge portion 52Ba.

因此，在將過濾器箱38壓入盒體28內時，由於過濾器箱38之上部沿上部導板48A移動，因此能更穩定且有效率地將過濾器箱38設置於目標位置。 Therefore, when the filter case 38 is pressed into the casing 28, since the upper portion of the filter case 38 moves along the upper guide 48A, the filter case 38 can be set to the target position more stably and efficiently.

(3)又，設於第2過濾器箱40之框架55之第1槽部57A及第2槽部57B之形狀與第1過濾器箱38之槽部52A,52B之形狀相異，盒體28內之下部導板47A及47B分別為卡合於第1槽部52A及57A之形狀，上部導板48A及48B分別為卡合於第2槽部52B及57B之形狀。因此，能防止誤將第2過濾器箱40(化學過濾器56)設置於應設置第1過濾器箱38(化學過濾器51)之位置，反之亦能防止誤將第1過濾器箱38設置於應設置第2過濾器箱40之位置。 (3) Further, the shape of the first groove portion 57A and the second groove portion 57B of the frame 55 provided in the second filter case 40 is different from the shape of the groove portions 52A and 52B of the first filter case 38, and the case body The inner lower guide plates 47A and 47B are respectively engaged with the first groove portions 52A and 57A, and the upper guide plates 48A and 48B are respectively engaged with the second groove portions 52B and 57B. Therefore, it is possible to prevent the second filter case 40 (chemical filter 56) from being erroneously placed at the position where the first filter case 38 (chemical filter 51) is to be provided, and conversely, the first filter case 38 can be prevented from being set by mistake. The position of the second filter case 40 should be set.

(4)又，過濾器箱38之化學過濾器51(濾材)係除去通過其中之氣體中之有機系氣體(有機物)，過濾器箱40之化學過濾器56(濾材)係除去通過其中之氣體中之鹼性氣體及酸性氣體，因此能將已高度除去不純物之空氣供給至收納曝 光本體部4之腔室10內。 (4) Further, the chemical filter 51 (filter material) of the filter tank 38 removes the organic gas (organic matter) in the gas passing therethrough, and the chemical filter 56 (filter material) of the filter tank 40 removes the gas passing therethrough. Alkaline gas and acid gas, so that the air with high impurity removal can be supplied to the storage exposure Inside the chamber 10 of the light body portion 4.

此外，過濾器箱40內之過濾器亦可係例如除去通過其中之氣體中之鹼性物質及酸性物質之至少一方。又，化學過濾器除去之不純物亦可係任意，例如藉由一個化學過濾器吸收有機系氣體與鹼性氣體及酸性氣體。 Further, the filter in the filter tank 40 may be, for example, at least one of an alkaline substance and an acidic substance in the gas passing therethrough. Further, the impurities removed by the chemical filter may be arbitrary, for example, by absorbing an organic gas, an alkaline gas, and an acid gas by a chemical filter.

再者，過濾器箱38,40內之過濾器能使用化學過濾器以外之任意過濾器(濾材)。例如，作為過濾器箱38,40之過濾器，亦能使用如HEPA過濾器或ULPA過濾器之用以除去微小粒子(微粒)之濾塵器。 Further, the filter in the filter boxes 38, 40 can use any filter (filter material) other than the chemical filter. For example, as the filter of the filter boxes 38, 40, a dust filter such as a HEPA filter or a ULPA filter for removing minute particles (fine particles) can also be used.

(5)再者，於本實施形態之過濾器裝置26由於設置有兩個過濾器箱38及一個過濾器箱40。因此能使空氣高度清淨。此外，過濾器裝置26所具備之過濾器箱38,40之數目係任意。又，於過濾器裝置26亦可僅設置一個或複數個過濾器箱38、或一個或複數個過濾器箱40。 (5) Further, in the filter device 26 of the present embodiment, two filter boxes 38 and one filter case 40 are provided. Therefore, the air can be highly cleaned. Further, the number of the filter boxes 38, 40 provided in the filter device 26 is arbitrary. Also, only one or a plurality of filter boxes 38, or one or more filter boxes 40 may be provided in the filter unit 26.

再者，亦可將盒體28內於Z方向分離成複數個空間，於各空間分別設置一個或複數個過濾器箱38,40。 Further, the inside of the casing 28 may be separated into a plurality of spaces in the Z direction, and one or a plurality of filter boxes 38, 40 may be provided in each space.

(6)又，過濾器裝置26之盒體28由於被以分隔板42分隔成兩個空間，因此過濾器箱38,40之設置係容易。此外，亦能不以分隔板42分隔盒體28內而單將過濾器箱38及40例如交互堆疊。 (6) Further, since the casing 28 of the filter device 26 is partitioned into two spaces by the partition plate 42, the filter boxes 38, 40 are easily installed. Further, it is also possible to simply stack the filter boxes 38 and 40, for example, without separating the inside of the casing 28 by the partitioning plate 42.

(7)又，本實施形態之曝光裝置EX，係以曝光用光EL經由標線片R之圖案及投影光學系統PL使晶圓W(基板)曝光，其具備：腔室10，收納使晶圓W曝光之曝光本體部4；具備本實施形態之過濾器箱38,40之過濾器裝置26；以及 空調裝置30，將從腔室10之外部擷取之空氣經由過濾器裝置26送至腔室10內。 (7) In the exposure apparatus EX of the present embodiment, the exposure light EL is exposed to the wafer W (substrate) via the pattern of the reticle R and the projection optical system PL, and the chamber 10 is provided with a crystal. a exposure body portion 4 exposed by a circle W; a filter device 26 including the filter boxes 38, 40 of the present embodiment; The air conditioner 30 sends air extracted from the outside of the chamber 10 to the chamber 10 via the filter device 26.

根據本實施形態，由於能有效率地進行過濾器箱38,40之更換，能高精度地進行過濾器箱38,40間之定位，因此能有效率地進行曝光裝置之維護，且能高精度地除去腔室10內之空氣之不純物。 According to the present embodiment, since the filter boxes 38 and 40 can be efficiently exchanged, the positioning between the filter boxes 38 and 40 can be performed with high precision, so that the maintenance of the exposure apparatus can be performed efficiently and with high precision. The impurities of the air in the chamber 10 are removed.

此外，本實施形態中，作為裝載室10b內之局部空調裝置60之過濾器箱63,64之框架，亦可使用與過濾器箱38,40之框架50,55相同之形成有槽部之框架，將過濾器箱63,64收納於形成有與下部導板47A,47B及上部導板48A,48B相似形狀之盒體。 Further, in the present embodiment, as the frame of the filter boxes 63, 64 of the partial air conditioner 60 in the loading chamber 10b, the same frame as the frames 50, 55 of the filter boxes 38, 40 may be used. The filter boxes 63, 64 are housed in a case body having a shape similar to that of the lower guide plates 47A, 47B and the upper guide plates 48A, 48B.

此外，上述實施形態亦可如下變形。以下變形例中，係對與圖2對應之部分賦予相同符號，省略其詳細說明。 Further, the above embodiment may be modified as follows. In the following modifications, the same reference numerals will be given to the parts corresponding to those in FIG. 2, and the detailed description thereof will be omitted.

圖7係顯示上述實施形態之變形例之過濾器裝置26A。圖7中，過濾器裝置26A具有兩個過濾器箱38A、一個過濾器箱40A、收納過濾器箱38A,40A之盒體28。又，過濾器箱38A於此框架之底面形成有第1槽部52A，於該框架之上面未形成有槽部。同樣地，過濾器箱40A於此框架之底面形成有第1槽部57A，於該框架之上面未形成有槽部。過濾器箱38A,40A以外之構成與過濾器箱38,40相同。 Fig. 7 shows a filter device 26A according to a modification of the above embodiment. In Fig. 7, the filter device 26A has two filter boxes 38A, one filter box 40A, and a case 28 that houses the filter boxes 38A, 40A. Further, the filter case 38A is formed with a first groove portion 52A on the bottom surface of the frame, and a groove portion is not formed on the upper surface of the frame. Similarly, the filter case 40A is formed with a first groove portion 57A on the bottom surface of the frame, and a groove portion is not formed on the upper surface of the frame. The configuration other than the filter boxes 38A, 40A is the same as that of the filter boxes 38, 40.

此外，上述實施形態中，雖說明了框架50之槽部52A及52B具有平行配置之邊緣部52Aa,52Ab及52Ba,52Bb之構成，但邊緣部不限定於平行配置之構成。例如，亦可係在框架50之槽部52A及52B中從彼此分離之兩個側面中 之側面50d側往側面50e側寬度漸廣之槽部。框架55之槽部57A及槽部57B亦相同。 Further, in the above-described embodiment, the groove portions 52A and 52B of the frame 50 have the configuration in which the edge portions 52Aa, 52Ab and 52Ba, 52Bb are arranged in parallel, but the edge portions are not limited to the configuration in which they are arranged in parallel. For example, it may be in the two sides separated from each other in the groove portions 52A and 52B of the frame 50. The side surface 50d side has a groove portion having a wider width toward the side surface 50e side. The groove portion 57A and the groove portion 57B of the frame 55 are also the same.

此情形下，只要設置適於此槽部之形狀之上部導板及下部導板即可。 In this case, it is only necessary to provide a shape upper guide plate and a lower guide plate suitable for the groove portion.

又，雖於過濾器裝置26A之盒體28之底板28h設有下部導板47A~47C，但於上板28j未設有導板。除此以外之構成則與過濾器裝置26相同。藉由此過濾器裝置26A過濾器箱38A,40A對盒體28內之設置，可藉由使過濾器箱38A及40A之第1槽部52A及57A分別卡合於下部導板47A(47C)及47B而較容易地進行。 Further, although the lower guide plates 47A to 47C are provided on the bottom plate 28h of the casing 28 of the filter device 26A, the guide plates are not provided on the upper plate 28j. The other configuration is the same as that of the filter device 26. By the filter device 26A, the filter boxes 38A, 40A are disposed in the casing 28, and the first groove portions 52A and 57A of the filter boxes 38A and 40A are respectively engaged with the lower guide 47A (47C). And 47B is easier to carry out.

又，上述實施形態中，過濾器箱38,40等之把手部70A,70B雖為凸部，但亦可將設於框架50,55側面之凹部作為把守部。 Further, in the above-described embodiment, the handle portions 70A, 70B of the filter cases 38, 40 and the like are convex portions, but the concave portions provided on the side faces of the frames 50, 55 may be used as the guard portions.

又，亦可將易滑動之合成樹脂之板例如藉由接著劑固定於上述實施形態之過濾器箱38,40等之框架50,55之槽部52A,52B,57A,57B。藉此，能更順暢地進行過濾器箱38,40等之出入。 Further, the slideable synthetic resin sheet may be fixed to the groove portions 52A, 52B, 57A, 57B of the frames 50, 55 of the filter cases 38, 40 and the like of the above-described embodiment, for example, by an adhesive. Thereby, the entrance and exit of the filter boxes 38, 40, etc. can be performed more smoothly.

又，亦可取代上述實施形態之過濾器箱38,40等之框架50,55之槽部52A,52B,57A,57B，而先形成具有邊緣部52Aa,52Ba,57Aa,57Ba之段差部。 Further, instead of the groove portions 52A, 52B, 57A, and 57B of the frames 50 and 55 of the filter cases 38 and 40 of the above-described embodiment, the step portions 52A, 52Ba, 57Aa, and 57Ba may be formed first.

再者，過濾器箱38,40之墊片54A,54B亦能省略。此情形下，亦可將墊片54A,54B設於第1端面50a所緊貼之對象側(例如分隔板或其他過濾器箱)。 Further, the spacers 54A, 54B of the filter boxes 38, 40 can also be omitted. In this case, the spacers 54A, 54B may be provided on the object side to which the first end surface 50a abuts (for example, a partition plate or another filter case).

再者，亦能取代罩構件TF1~TF3，貼附例如易滑動之 樹脂製黏附帶。 Furthermore, it is also possible to replace the cover members TF1 to TF3 and attach them to, for example, easy sliding. Resin made with resin.

又，上述實施形態及變形例中，過濾器箱38,38A,40,40A之框架50,55之外形係大致正方形(大致正方形之環狀(框狀))。然而，框架50,55之外形亦可係例如長方形等大致矩形(大致矩形之環狀(框狀))或大致正方形或矩形且於角部施有去角等。 Further, in the above-described embodiments and modifications, the frames 50, 55 of the filter boxes 38, 38A, 40, and 40A have a substantially square shape (a substantially square ring shape (frame shape)). However, the outer shape of the frames 50, 55 may be, for example, a substantially rectangular shape such as a rectangular shape (a substantially rectangular ring shape (frame shape)) or a substantially square or rectangular shape, and a chamfer may be applied to the corner portion.

此外，本實施形態中，過濾器箱雖過濾器面設置於相對水平方向為交叉之方向，例如過濾器箱之過濾器面設置於XZ面內，但過濾器箱之過濾器面亦可相對XZ面傾斜設置。此情形下，係於過濾器箱之框架之設置面形成錐狀，或於盒體28之底板28h設置錐狀構件。 Further, in the present embodiment, the filter case is disposed in a direction in which the filter faces are intersected with respect to the horizontal direction. For example, the filter face of the filter case is disposed in the XZ plane, but the filter face of the filter case may also be opposite to the XZ. Face tilt setting. In this case, the installation surface of the frame of the filter case is tapered, or the tapered member is provided on the bottom plate 28h of the casing 28.

又，上述實施形態之曝光裝置EX，能將由複數個透鏡構成之照明光學系統、投影光學系統組入曝光裝置本體並進行光學調整，將多數個機械零件所構成之標線片載台或晶圓載台安裝於曝光裝置本體並連接配線或配管，進而進行綜合調整(電氣調整、動作確認等)來製造。此外，該製造裝置之製造最好係在溫度及潔淨度等均被管理之潔淨室進行。 Further, in the exposure apparatus EX of the above-described embodiment, the illumination optical system and the projection optical system including a plurality of lenses can be incorporated into the exposure apparatus main body and optically adjusted, and the reticle stage or wafer composed of a plurality of mechanical parts can be carried. The stage is attached to the main body of the exposure apparatus, and is connected to a wiring or a pipe, and is manufactured by comprehensive adjustment (electrical adjustment, operation confirmation, etc.). Further, the manufacturing apparatus is preferably manufactured in a clean room in which temperature and cleanliness are managed.

又，在使用上述實施形態之曝光裝置EX製造半導體元件等電子元件(或微型元件)時，電子元件如圖8所示，係經進行電子元件之功能、性能設計之步驟221，根據此設計步驟製作光罩(標線片)之步驟222，製造元件基材即基板(晶圓)並塗布光阻之步驟223，包含藉由前述實施形態之曝光裝置將光罩之圖案曝光於基板(感應基板)之步驟、使已曝光之基 板顯影之步驟、已顯影基板之加熱(CURE)以及顯影步驟之基板処理步驟224，元件組裝步驟(包含切割步驟、接合步驟、封裝步驟等加工製程)225，以及檢査步驟226等而製造。 Further, when an electronic component (or a micro component) such as a semiconductor element is manufactured by using the exposure apparatus EX of the above-described embodiment, the electronic component is subjected to a step 221 of performing the function and performance design of the electronic component as shown in FIG. Step 222 of fabricating a mask (reticle), manufacturing a substrate (wafer) as a component substrate, and applying a photoresist step 223, comprising exposing the pattern of the mask to the substrate by the exposure apparatus of the above embodiment (inductive substrate) Steps to make the exposed base The step of developing the plate, the heating of the developed substrate (CURE), and the substrate processing step 224 of the developing step, the component assembling step (including the cutting process, the bonding step, the packaging step, and the like) 225, and the inspection step 226 and the like are manufactured.

是以，此元件製造方法，包含使用上述實施形態之曝光裝置於基板上形成感光層之圖案之動作與處理形成有該圖案之基板之動作(步驟224)。藉由該曝光裝置，由於能減低維護成本，提升曝光精度，因此能廉價且高精度地製造電子元件。 Therefore, the device manufacturing method includes an operation of forming a pattern of a photosensitive layer on a substrate by using the exposure apparatus of the above embodiment, and an operation of processing a substrate on which the pattern is formed (step 224). According to this exposure apparatus, since the maintenance cost can be reduced and the exposure accuracy can be improved, the electronic component can be manufactured inexpensively and with high precision.

此外，上述實施形態中，雖使用空氣作為空調用之氣體，但亦可取代其而使用氮氣或稀有氣體(氦、氖等)、或此等氣體之混合氣體等。 Further, in the above embodiment, air is used as the gas for air conditioning, but nitrogen gas or a rare gas (such as helium or neon) or a mixed gas of such gases may be used instead.

又，本發明不僅可適用於使用掃描曝光型之投影曝光裝置進行曝光之情形，亦能適用於使用一次曝光型(步進機型)之投影曝光裝置進行曝光之情形。 Further, the present invention can be applied not only to the case of exposure using a scanning exposure type projection exposure apparatus but also to exposure using a single exposure type (stepper type) projection exposure apparatus.

又，本發明亦能適用於以不使用投影光學系統之近接方式或接觸方式之曝光裝置等進行曝光時。 Further, the present invention is also applicable to exposure when an exposure apparatus such as a proximity method or a contact method that does not use a projection optical system is used.

又，本發明並不限定適用於半導體元件之製程，亦能廣泛適用於例如形成於角型玻璃板之液晶顯示元件、或電漿顯示器等顯示器裝置之製程、或攝影元件(CCD等)、微型機械、MMS(Microelectromechanical Systems：微小電氣機械系統)、薄膜磁頭及DNA晶片等各種元件之製程。進而，本發明亦能適用於使用微影製程製造形成有各種元件之遮罩圖案之遮罩(光罩、標線片等)時之製造步驟。 Further, the present invention is not limited to the process applicable to a semiconductor element, and can be widely applied to, for example, a process of forming a liquid crystal display element of a prismatic glass plate or a display device such as a plasma display, or a photographic element (CCD, etc.) or a micro Processes for various components such as machinery, MMS (Microelectromechanical Systems), thin film magnetic heads, and DNA wafers. Further, the present invention is also applicable to a manufacturing process in the case of manufacturing a mask (a mask, a reticle, etc.) in which a mask pattern of various elements is formed by using a lithography process.

如上述，本發明並不限定於上述實施形態，當然可在 不脫離本發明要旨之範圍內採取各種構成。 As described above, the present invention is not limited to the above embodiment, and of course Various configurations are made without departing from the gist of the present invention.

又，援用本案所記載之上述公報、各國際公開小冊子、美國發明專利、或美國發明專利申請公開說明書中之揭示作為本說明書記載之一部分。又，包含說明書、申請專利範圍、圖式、以及摘要之2011年5月11日提出之日本專利申請第2011-105904號之所有揭示內容，均直接引用而加入本案中。 Further, the disclosures of the above-mentioned publications, the respective international publication pamphlets, the U.S. invention patents, or the U.S. invention patent application publications cited in the present application are incorporated herein by reference. In addition, all the disclosures of Japanese Patent Application No. 2011-105904, filed on Jan. 11, 2011, which is incorporated herein by reference in its entirety, in

EX‧‧‧曝光裝置 EX‧‧‧Exposure device

R‧‧‧標線片 R‧‧‧ reticle

PL‧‧‧投影光學系統 PL‧‧‧Projection Optical System

W‧‧‧晶圓 W‧‧‧ wafer

4‧‧‧曝光本體部 4‧‧‧Exposure body

10‧‧‧腔室 10‧‧‧ chamber

26‧‧‧過濾器裝置 26‧‧‧Filter device

28‧‧‧盒體 28‧‧‧Box

30‧‧‧空調裝置 30‧‧‧Air conditioning unit

38,40‧‧‧過濾器箱 38,40‧‧‧Filter box

42A‧‧‧分隔板 42A‧‧‧ divider

47A~47C‧‧‧下部導板 47A~47C‧‧‧lower guide

48A~48C‧‧‧上部導板 48A~48C‧‧‧ upper guide

50,55‧‧‧框架 50, 55‧‧‧ framework

52A,57A‧‧‧第1槽部 52A, 57A‧‧‧1st groove

52B,57B‧‧‧第2槽部 52B, 57B‧‧‧2nd groove

51,56‧‧‧化學過濾器 51,56‧‧‧Chemical filter

60‧‧‧局部空調裝置 60‧‧‧Local air conditioning unit

70A,70B‧‧‧把手部 70A, 70B‧‧‧Hands

圖1係顯示實施形態一例之曝光裝置之構成之一部分已切除之圖。 Fig. 1 is a view showing a part of the configuration of an exposure apparatus showing an example of the embodiment.

圖2係顯示圖1之過濾器裝置26之立體圖。 2 is a perspective view showing the filter device 26 of FIG. 1.

圖3係顯示圖2中之盒體28之立體圖。 Figure 3 is a perspective view showing the casing 28 of Figure 2 .

圖4顯示圖2之過濾器裝置26之剖面圖。 Figure 4 shows a cross-sectional view of the filter device 26 of Figure 2.

圖5(A)係顯示圖4中之過濾器箱38之立體圖，(B)係顯示圖4中之過濾器箱40之立體圖，(C)係顯示過濾器箱38之俯視圖，(D)係顯示過濾器箱40之俯視圖。 Fig. 5(A) is a perspective view showing the filter case 38 of Fig. 4, (B) is a perspective view showing the filter case 40 of Fig. 4, and (C) is a plan view showing the filter case 38, (D) A top view of the filter box 40 is shown.

圖6(A)係顯示於盒體28收納過濾器箱38之狀態之一部分剖面之俯視圖，圖6(B)係顯示於盒體28收納過濾器箱40之狀態之一部分剖面之俯視圖。 6(A) is a plan view showing a partial cross-sectional view of the casing 28 in which the filter case 38 is housed, and FIG. 6(B) is a plan view showing a partial cross-sectional view of the case 28 in which the filter case 40 is housed.

圖7係顯示變形例之過濾器裝置之立體圖。 Fig. 7 is a perspective view showing a filter device of a modification.

圖8係顯示電子元件之製程一例之流程圖。 Fig. 8 is a flow chart showing an example of the process of electronic components.

38,40‧‧‧過濾器箱 38,40‧‧‧Filter box

50,55‧‧‧框架 50, 55‧‧‧ framework

50a,55a‧‧‧第1端面 50a, 55a‧‧‧ first end

50b,55b‧‧‧下面 50b, 55b‧‧‧ below

50c,55c‧‧‧上面 50c, 55c‧‧‧ above

50d,50e,55d,55e‧‧‧側面 50d, 50e, 55d, 55e‧‧‧ side

50f,55f‧‧‧開口 50f, 55f‧‧‧ openings

50g,55g‧‧‧第2端面 50g, 55g‧‧‧2nd end face

51,56‧‧‧化學過濾器 51,56‧‧‧Chemical filter

52A,52B,57A,57B‧‧‧槽部 52A, 52B, 57A, 57B‧‧‧ slot

52Aa,52Ab,57Aa,57Ab‧‧‧邊緣部 52Aa, 52Ab, 57Aa, 57Ab‧‧‧ edge

52Ba,52Bb,57Ba,57Bb‧‧‧邊緣部 52Ba, 52Bb, 57Ba, 57Bb‧‧‧ edge

52Bc,52Bd,57Bc,57Bd‧‧‧去角部 52Bc, 52Bd, 57Bc, 57Bd‧‧‧ corner

54A,54B‧‧‧墊片 54A, 54B‧‧‧shims

70A,70B‧‧‧把手部 70A, 70B‧‧‧Hands

TF1,TF2‧‧‧罩構件 TF1, TF2‧‧‧ cover member

Claims (17)

一種過濾器箱，係保持過濾器，其特徵在於，具有：框架，保持前述過濾器；以及第1形狀變化部，形成於前述框架之側面之至少一部分；前述第1形狀變化部包含第1邊緣部，該第1邊緣部從前述框架之側面中彼此分離之兩個第一端部中之一方第一端部側且從前述框架之側面中彼此分離之兩個第二端部中之一方第二端部側，延伸至前述兩個第一端部中之另一方第一端部側且延伸至前述兩個第二端部中之另一方第二端部側。 A filter case, comprising: a frame holding the filter; and a first shape changing portion formed on at least a part of a side surface of the frame; wherein the first shape changing portion includes a first edge a first one of the first end portions of the two first end portions separated from each other from the side surface of the frame and one of the two second end portions separated from each other from the side surface of the frame The two end sides extend to the other one of the two first end portions and extend to the other of the two second end portions. 如申請專利範圍第1項之過濾器箱，其中，前述框架具備複數個側面；前述第1形狀變化部形成於前述複數個側面中之第1側面。 The filter case according to claim 1, wherein the frame has a plurality of side faces, and the first shape changing portion is formed on the first side faces of the plurality of side faces. 如申請專利範圍第2項之過濾器箱，其中，前述第1形狀變化部係形成於前述第1側面之槽部。 The filter case according to claim 2, wherein the first shape changing portion is formed in a groove portion of the first side surface. 如申請專利範圍第2或3項之過濾器箱，其具有第2形狀變化部，形成於前述複數個側面中前述框架之隔著前述過濾器與前述第1側面為相反側之第2側面、包含與前述第1邊緣部平行之第2邊緣部。 The filter case according to the second or third aspect of the invention, comprising: a second shape changing portion, wherein the second side surface of the frame opposite to the first side surface of the frame is formed on the plurality of side surfaces, The second edge portion is parallel to the first edge portion. 如申請專利範圍第4項之過濾器箱，其中，前述第2形狀變化部係形成於前述第2側面之槽部。 The filter case according to claim 4, wherein the second shape changing portion is formed in a groove portion of the second side surface. 如申請專利範圍第3項之過濾器箱，其具備複數個前 述過濾器箱；前述複數個過濾器箱，形成於前述框架之前述第1側面之前述槽部之寬度及深度之至少一方彼此相異。 Such as the filter box of claim 3, which has a plurality of fronts The filter case; wherein the plurality of filter cases are different from each other in at least one of a width and a depth of the groove portion formed on the first side surface of the frame. 如申請專利範圍第1至6項中任一項之過濾器箱，其具有設於前述框架之形成於前述另一方第一端部側之端面之密封構件。 The filter case according to any one of claims 1 to 6, further comprising a sealing member provided on an end surface of the frame formed on the other first end side. 如申請專利範圍第1至7項中任一項之過濾器箱，其具備設於前述框架之把手部。 The filter case according to any one of claims 1 to 7, comprising a handle portion provided in the frame. 如申請專利範圍第8項之過濾器箱，其中，前述框架具備複數個側面；前述把手部設於前述複數個側面中之與設有前述第1形狀變化部之側面相鄰之側面。 The filter case according to claim 8, wherein the frame has a plurality of side faces, and the handle portion is provided on a side surface of the plurality of side faces adjacent to a side surface on which the first shape change portion is provided. 如申請專利範圍第1至9項中任一項之過濾器箱，其中，前述過濾器係除去通過前述過濾器之氣體中之有機物。 The filter case according to any one of claims 1 to 9, wherein the filter removes organic matter in the gas passing through the filter. 如申請專利範圍第1至10項中任一項之過濾器箱，其中，前述過濾器係除去通過前述過濾器之氣體中之鹼性物質及酸性物質之至少一方。 The filter case according to any one of claims 1 to 10, wherein the filter removes at least one of an alkaline substance and an acidic substance in a gas passing through the filter. 一種過濾器裝置，收納保持過濾器之過濾器箱，其特徵在於，具備：申請專利範圍第1至10項中任一項之過濾器箱；盒體，以前述框架中形成有前述第1形狀變化部之側面為下面之方式收納前述過濾器箱；以及第1導引部，設於前述盒體之下部，具有能接觸於前 述過濾器箱之前述第1形狀變化部之前述第1邊緣部之第3邊緣部。 A filter device, comprising: a filter case according to any one of claims 1 to 10; a case body having the first shape formed in the frame The side of the changing portion houses the filter case in a manner as follows; and the first guiding portion is provided at a lower portion of the case body to have a front contact The third edge portion of the first edge portion of the first shape changing portion of the filter case is described. 如申請專利範圍第12項之過濾器裝置，其中，前述過濾器箱之前述第1形狀變化部係槽部；設於前述盒體之前述第1導引部係能收納於前述槽部之軌道狀構件。 The filter device according to claim 12, wherein the first shape changing portion groove portion of the filter case is provided, and the first guiding portion provided in the case body is slidable in the groove portion Shaped member. 如申請專利範圍第12或13項之過濾器裝置，其中，前述過濾器箱之前述框架具備複數個側面；前述過濾器箱具有第2形狀變化部，該第2形狀變化部形成於前述複數個側面中前述框架之隔著前述過濾器與前述第1側面為相反側之第2側面、包含與前述第1邊緣部平行之第2邊緣部；且具備第2導引部，其設於前述盒體之上部，具有能接觸於前述過濾器箱之前述第2形狀變化部之前述第2邊緣部之第4邊緣部。 The filter device of claim 12, wherein the frame of the filter case has a plurality of side faces, and the filter case has a second shape changing portion, and the second shape changing portion is formed in the plurality of a second side surface of the frame opposite to the first side surface via the filter, and a second edge portion parallel to the first edge portion; and a second guiding portion provided in the case The upper portion of the body has a fourth edge portion that can contact the second edge portion of the second shape changing portion of the filter case. 如申請專利範圍第14項之過濾器裝置，其中，前述過濾器箱之前述第2形狀變化部係槽部；設於前述盒體之前述第2導引部係能收納於前述槽部之軌道狀構件。 The filter device according to claim 14, wherein the second shape changing portion of the filter case is a groove portion; and the second guiding portion provided in the casing is slidable in the groove portion Shaped member. 一種曝光裝置，係以曝光用光經由圖案使基板曝光，其特徵在於，具備：腔室，收納使前述基板曝光之曝光本體部；申請專利範圍第12至15項中任一項之過濾器裝置；以及 空調裝置，將從前述腔室之外部擷取之氣體經由前述過濾器裝置送至前述腔室內。 An exposure apparatus for exposing a substrate by exposure light through a pattern, comprising: a chamber for accommodating the exposed body portion for exposing the substrate; and the filter device according to any one of claims 12 to 15. ;as well as In the air conditioning apparatus, the gas extracted from the outside of the chamber is sent to the chamber through the filter device. 一種元件製造方法，其特徵在於，包含：使用申請專利範圍第16項之曝光裝置使感光性基板曝光之動作；以及處理前述曝光後之感光性基板之動作。 A method of manufacturing a device, comprising: an operation of exposing a photosensitive substrate using an exposure apparatus of claim 16; and an operation of processing the photosensitive substrate after the exposure.
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