TW201251132A

TW201251132A - Light emitting diode (LED) packages, systems, devices and related methods

Info

Publication number: TW201251132A
Application number: TW101115615A
Authority: TW
Inventors: Christopher P Hussell; Sung-Chul Joo
Original assignee: Cree Inc
Priority date: 2011-05-03
Filing date: 2012-05-02
Publication date: 2012-12-16
Also published as: KR20140018979A; WO2012151270A1; CN103534821A; CN103534821B

Abstract

Packages, systems, and devices for light emitting diodes (LEDs) and related methods are provided. The packages can include a lead frame with an electrically conductive chip carrier comprising an upper surface. An LED can be placed on the upper surface of the electrically conductive chip carrier. A casing can be disposed on the lead frame covering at least a portion of the lead frame. A reflector cavity can be in the casing surrounding the LED. The reflector cavity can have angled side wall portions and angled end wall portions with an angle at which the side wall portions are angled that is different from an angle at which the end wall portions are angled.

Description

201251132 六、發明說明：相關申請案之交又引用本申請案主張申請於2011年5月3曰之美國臨時專利申請案序號第61/482,088號之優先權，將該臨時專利申請案之揭示内容以全文引用之方式併入本文。【發明所屬之技術領域】本文揭示之申請標的大致上有關於發光二極體（Led) 封裝’且更特定而言，有關於具有反射體空腔的Led封裝，該反射體空腔具有傾斜的壁部份用於容置led裝置且反射來自該等LED裝置的光。【先前技術】與個人用途之照明產品，包含例如，室内與室外照明應用及用於監視器與電視之背光顯示器。白熾燈泡與管及螢光燈泡與管長久以來為照明產業中之標準規範。白熾燈泡與管及螢光燈泡與管可能能量使用效率不高，可能壽命短，及/或可能導致棄置問題。舉例而言，雖然緊湊型螢光燈（compact fluorescent lamps;咖）的壽命較白熾燈來得長，但緊湊型螢光燈的壽命仍相當短。由於哼等燈的内部所使用的化學物，例如汞，於使用後無法：正常的垃圾棄置途徑來棄置該等分咕哥敬對於大型設施棄置 b等CFL燈需要花費且由於需 wa而罟遷循流程而費時。相較於市場上的習知照明產π 屋0口 LED可用於緊湊型、 201251132 薄型、節能產品的設計中， ^ σ ^ 具有較長壽命。使用[ED的產"口兩要較少功率即達到針對仏 , 耵、〇疋照明應用之亮度規格，藉此顯著地減小能量消耗 .^ ^ 牦及對於主動冷卻系統之需求。封裝咖的目㈣勢為使用較薄輯模封裝，用以適配於薄型、可能平坦的平面顯示系統。舉例而言，較薄封裝可具有增加的空腔角戶心用度以協助超越或維持亮度規格。隨著空㈣度增加，封裝材料可能繞著封裝組件不完整地鑄模。舉例而言’封裝材料可能繞著引線架之部份不完整地鑄模。此可導致仏中土」等致給疋封裝内的組件之間的間隙、孔隙、不完整樹脂填充，及低附著性。近幾年來，發光二極體（LED)技術已有顯著的改善，使得亮度及色彩逼真度增加的LED已被提出。㈣效率設定為超越營光燈管之效率，而LED可輕易達到調光 (dimming)及可控制的演色性（c〇1〇r rendering)。多晶粒 LED燈可被安裝且使用於螢光燈具中，而由驅動電子電路來取代安定器。以相同或較低功率輸入，於螢光燈具中自LED燈輸出的光之空間分佈、強度及光譜可比得上由營光燈管所產生的光之空間分佈、強度及光譜。然而，製造於該等螢光燈具中的led燈可能相當昂貴。該等應用需要較小的LED。此外，LED亦可能產生熱階（heat level) ’若熱階變得過度及/或熱並未適當逸散，則可能導致LED及/或電路系統失效。此外’由於這些改善的LED及改善的影像處理技術，已可取得大型、全彩LED視訊螢幕且現已普遍使用。大 201251132 型LED顯示器通常包括個別LED面板之組合所提供的影像解析度取決於相鄰晝素之間的距離或「晝素間距」0 室外顯不器，預期用於自較遠的距離觀看，具有相當大的晝素間距且通常包括㈣LED陣列。於離散二陣列中’驅動-群各自安裝的紅、綠及藍led以形成由觀看者看來疋全衫晝素。另一方面，要求較短畫素間距例如3 mm或更小之室内螢幕，通常包括裝載紅、綠及藍LED安裝於罩— 士電子封裝（例如表面安裝裝置（SMD) :裝)之面板。各SMD通常界定畫素。相當小的SMD附著至驅卩刷f路板（PCB) ’驅動印刷電路板控制各 SMD之輸出。雖然室内顯示器及室外顯示器兩者於離#角度之大範圍各處為可觀看的，但隨著視角增加而度：可感知的損失。此外一封裝的材料二以:裝LED中的各者的材料可具有反射特性，該反射特杜藉由產生不想要的光反射及/或眩光（glare)可能進一步減小色彩逼真度。201251132 VI. STATEMENT OF RELATED APPLICATIONS: RELATED APPLICATIONS RELATED APPLICATIONS STATEMENT OF RELATED APPLICATIONS RELATED APPLICATIONS Incorporated herein by reference in its entirety. TECHNICAL FIELD OF THE INVENTION The subject matter disclosed herein relates generally to a light emitting diode (Led) package and, more particularly, to a LED package having a reflector cavity having a tilted The wall portion is for receiving the LED device and reflecting light from the LED devices. [Prior Art] Lighting products for personal use include, for example, indoor and outdoor lighting applications and backlit displays for monitors and televisions. Incandescent bulbs and tubes and fluorescent bulbs and tubes have long been standard specifications in the lighting industry. Incandescent bulbs and tubes and fluorescent bulbs and tubes may be inefficiently used, may have a short life span, and/or may cause disposal problems. For example, although compact fluorescent lamps have a longer life than incandescent lamps, the life of compact fluorescent lamps is still relatively short. Because the chemicals used in the interior of the lamps, such as mercury, cannot be used after use: The normal garbage disposal route to dispose of the branches. The goddess of the CFL lamps for large facilities is required to be disposed of. It takes time and time to follow the process. Compared with the conventional lighting on the market, π 屋 0 LED can be used in the design of compact, 201251132 thin, energy-saving products, ^ σ ^ has a longer life. Use [ED's production " port two less power to achieve brightness specifications for 仏, 耵, 〇疋 lighting applications, thereby significantly reducing energy consumption. ^ ^ 牦 and the need for active cooling systems. The purpose of the packaged coffee is to use a thinner package to fit a thin, possibly flat, flat display system. For example, a thinner package may have an increased cavity angle to help exceed or maintain brightness specifications. As the degree of space (four) increases, the encapsulating material may be incompletely molded around the package assembly. For example, the encapsulating material may be incompletely molded around portions of the lead frame. This can result in gaps, voids, incomplete resin filling, and low adhesion between components in the package. In recent years, LED technology has been significantly improved, and LEDs with increased brightness and color fidelity have been proposed. (4) Efficiency Set to exceed the efficiency of the camping light tube, and the LED can easily achieve dimming and controllable color rendering (c〇1〇r rendering). Multi-die LED lamps can be mounted and used in fluorescent fixtures, with the drive electronics replacing the stabilizer. With the same or lower power input, the spatial distribution, intensity and spectrum of light output from the LED lamp in a fluorescent fixture can be comparable to the spatial distribution, intensity and spectrum of light produced by the camping tube. However, LED lamps fabricated in such fluorescent fixtures can be quite expensive. These applications require smaller LEDs. In addition, the LED may also generate a heat level. If the thermal order becomes excessive and/or heat is not properly dissipated, the LED and/or circuitry may be disabled. In addition, due to these improved LEDs and improved image processing technology, large-scale, full-color LED video screens have been available and are now in common use. The large 201251132 LED display usually includes a combination of individual LED panels to provide image resolution depending on the distance between adjacent pixels or the "pixel spacing" 0 outdoor display, expected to be used for viewing from a longer distance. There are considerable pixel spacings and typically include (four) LED arrays. The red, green, and blue LEDs that are each mounted in the 'driver' group in the discrete two arrays are formed to be sturdy by the viewer. On the other hand, indoor screens requiring shorter pixel spacing, such as 3 mm or less, typically include panels loaded with red, green, and blue LEDs mounted on a hood-electronic package (such as a surface mount device (SMD): package). Each SMD usually defines a pixel. A fairly small SMD is attached to the drive board (PCB) to drive the printed circuit board to control the output of each SMD. While both the indoor display and the outdoor display are viewable from a wide range of angles, the degree of viewing angle increases: a perceptible loss. In addition, the material of a package is such that the material of each of the LEDs can have reflective properties that can further reduce color fidelity by creating unwanted light reflections and/or glares.

S A所白知SMD及許多其他類型的電子封裝，無論令積體電路或離散組件例如二極體或功率電晶體，逸散以要求熱管理的熱。此外，過度熱可導致LED失效。此’對於料LED系統之其卜料量為纽熱管理於電子封裝設計中有效熱管理之其中一個目的為維之知作溫度及其他主動電路組件於適當低階以避 6 201251132 過早的級件失效。各種冷卻策略包含傳導熱傳遞’相當中用。貫施傳導熱傳遞用以逸散電子封裝中的熱之一種習知方式為允許熱沿著裝置之引線傳導離開。然而，引線經有足夠的質量或曝露的表面面積以提供有效熱逸散。舉例而言’主要在電磁波頻譜之可見部份發射光的而強度LED藉由使用該等習知技術可能產生難以逸散的顯者熱量。增加視角、維持相當低的操作溫度及減小LED封裝的尺寸之》又计目的在某種程度而言彼此競爭。因此，需要 ’X展解决所有這些設計目的而具較低成本之led封裝。【發明内容】根據本揭示案，提供LED封裝、系統、裝置及方法。因此’本揭示案在此之目的為提供新穎l e d封裝、系統及方法’例如以下更詳細之描述。如可從在此揭示内容顯而易見的’藉由本文描述之申請標的來至少整體或部份達到此些及其他目的。【實施方式】現在將詳細參照本文申請標的月知的之可行的態樣或實施例，態樣或實施例之-或更多範例圖示於圖式中。提供各範例以解釋f請標的且並非作為限制。事實上，作為一個實施例之部份所圖示或描述的特徵可用於另一實施例中以產生又一實施例預期本文所揭不及設想的申請標的涵蓋此等修改與變異。 7 201251132 如在各種圖式中所圖示，為了部份之尺寸相對於其他結構或部^ 結構或供以圖示本揭示申請標的之一般性結構。再二因=，提成於其他結構、部份或兩者上的 > 照形示申請標的之各種能様 3 °卩份來描述本揭合裡怎樣。如本領域中到’參照-結構形成於另 -者將察覺方」涵蓋了額外的結構、部份或:::二或「上其間。參照-結構或-部份形成於另：:二者可介於上」而沒有介於其間的結構或部份，本：或…之接地」形成在該結構或部份「之二。本文可描述為「直备一個元件稱作為「連接」、「附著十「、了解到’ 個7C件時’該元件可為直接連耗σ」至另- 元件，戋可能存有人寸著或耦合至另一個次了此存有"於其間的元件。介於其間的元件時，一個元，虽不存有接附著」或「直接耦合」〜直接連接」、「直另—個元件。此外’本文使用相對用語例如「在.· ·. 「上部」、「頂部」、「下部」、或「」上方」、所圖示的一個結構或…Μ M描述如圖式中係。將了解到相對用語例如「在.·...·之：構“份之關部」、「頂部」、「下部」、或「」上方」、「上繪的方位以外還包”置之不二J期除了圖式中所描S A knows SMD and many other types of electronic packages, whether integrated circuits or discrete components such as diodes or power transistors, are dissipated to require thermal management of heat. In addition, excessive heat can cause LED failure. The purpose of this 'for the LED system is to effectively manage the heat management in the electronic package design. One of the purposes is to know the temperature and other active circuit components at the appropriate low level to avoid the premature level of 201251132. The piece is invalid. Various cooling strategies include conductive heat transfer 'is quite useful. One of the conventional ways of transmitting conductive heat transfer to dissipate heat in an electronic package is to allow heat to be conducted away along the leads of the device. However, the leads are of sufficient quality or exposed surface area to provide effective heat dissipation. For example, light is emitted primarily in the visible portion of the electromagnetic spectrum and intensity LEDs may produce significant heat that is difficult to dissipate by using such conventional techniques. The purpose of increasing the viewing angle, maintaining a relatively low operating temperature, and reducing the size of the LED package is somewhat competing with each other. Therefore, it is necessary to solve all of these design purposes and have a lower cost LED package. SUMMARY OF THE INVENTION In accordance with the present disclosure, LED packages, systems, devices, and methods are provided. Accordingly, the present disclosure is intended to provide a novel package, system, and method, such as described in greater detail below. These and other objects are achieved, at least in whole or in part, as may be apparent from the disclosure herein. [Embodiment] Reference will now be made in detail to the preferred embodiments of the embodiments herein, Each example is provided to explain the requirements and not as a limitation. In fact, the features illustrated or described as part of one embodiment can be used in another embodiment to produce a further embodiment that is intended to cover such modifications and variations. 7 201251132 As shown in the various figures, the size of the portion is relative to other structures or structures or to the general structure of the subject matter of the present disclosure. Secondly, = is derived from other structures, parts, or both. It is used to describe the various types of applications that can be used to describe what is in this disclosure. As in the art, the 'reference-structure is formed on the other side will cover the additional structure, part or::: two or "in the middle. Reference-structure or - part is formed in another:: both "Structure" or "partial" or "grounding" may be formed in the structure or part "2. This article may be described as "directing a component called "connection", " Attached to the ten ", when the '7C parts are known', the component can be directly connected to the sigma" to another component, and may be indented or coupled to another component that has the " When there is a component in between, one element does not have any attachment or "direct coupling" ~ direct connection", "straight another component. In addition, this article uses relative terms such as "in.. ·." , "top", "lower", or "above", a structure shown or ... Μ M is described in the figure. You will learn about relative terms such as "in the case of .....": "the part of the "parts", "top", "lower", or "above", "outside the direction of the painting" The second J period is described in the figure

Hlh 3衮置之不同的方位。舉例而一 4 圖式中的裝置翻轉，而5 ，右方H 射田述為位於其他結構或部份「卜」的結構或部份現將定向A 上方」。相同的，若圖式中的二:Γ結構或部份「下、置/σ者軸旋轉，則描述為位 201251132 於其他結構或部份「上方」的結構或部份，現將定向為 • 位於其他結構或部份的「隔壁」或「偏離」。全文各處相同的數字參照相同的元件。根據本文描述的實施例之發光裝置可包括製造於生長基板（舉例而言’碳化石夕基板）上的三五族基於氮的.（例如氣化鎵）發光二極體（LED)或雷射，該等裝置例如由北卡羅來納州達勒姆的Cree公司所製造且販售的裝置。舉例而言，本文論述的碳化矽（Sic)基板/層可為4h 多型（polytype)碳化矽基板/層。然而，可使用其他碳化矽候選多型，例如3C多型、6H多型及15R多型。可自北卡羅來納州達勒姆的Cree公司（本申請標的之受讓人）購得適當的碳化矽基板，且用以製造該等基板的方法記载於科學文獻以及數件共同受讓的美國專利，包含但不限於’美國專利再領證案第3 4，8 6 1號，美國專利案第 4,946,547號’及美國專利案第5,200,022號，該等揭示内容以全文引用之方式併入本文。如本文所使用的，「第三族氮化物」用語指那些形成於氮與週期表之第三族中一或更多元素之間的半導體化合物，該一或更多元素通常為紹（A1)、鎵（Ga)及銦（in)。該 * 用語亦指二元化合物、三元化合物及四元化合物例如 . GaN、AlGaN及AlInGaN。第三族元素可與氣結合以形成二元化合物（例如，GaN)、三元化合物（例如，AlGaN) 及四元化合物（例如，AlInGaN)。此些化合物可具有經驗公式，其中一莫耳的氮與整體一莫耳的第三族元素結； 9 201251132 合。因此，經常使用公式例如AixGal-xN其中1>x>0來描述這些化合物。用於第三族氮化物之磊晶生長的技術已相當發達且發表於適當的科學文獻中，且在共同受讓的美國專彳丨案第5,210，〇51冑、美國專利案第5,993 號及美國專利案第5,523,589號中，該等揭示内容以全文引用之方式藉此併入本文。雖然本文揭示的LED之各種實施例包括生長基板，本領域習知技藝者將了解到，可移除結晶產晶生長基板（該、、’0日日磊日日生長基板上生長有包括的磊晶層），且獨立式的蟲晶層T安裝於㈣載體基板或次安裝S，該替代載體基板或次安裝座相較於原基板可具有較佳的熱特性、電性特性、結構的特性及/或光學特性。本文描述的申β钛的並不限於具有結晶磊晶生長基板的結構且可與結構有關來使用’該等結構其中蟲晶層已自以層的原生長基板移除且接合至替代載體基板。根據本申請標的之某些實施例的基於第三族氮化物的 LED’舉例而t，可製造於生長基板(例如碳化矽基板）上以提供水平褒置（於咖之相同側上具有電性接點兩者）或垂裝置（於LED之相反側上具有電性接點）。再者於氡k或移除（例如，藉由钱刻、研磨、抛光等）之後生長基板可維持於led上。舉例而言，可移除生長所產生LED之厚度及/或減小通過垂直LED 的順向電壓。舉例而言，水平裝置（具有或不具有生長基板）可經覆晶接合（例如，使用焊料）至載體基板或印刷電s 10 201251132 路板（PCB)，或經打線接合。垂直裝置（具有或不具有生長基板）可具有第一終端及第二終端，第一終端焊料接合至載體基板、安裝墊或PCB，第二終端打線接合至載體基板、電性元件或PCB。垂直LED晶片結構及水平LED 晶片結構之範例藉由舉例論述於Bergnianri等人之美國么開案第2008/0258130號及Edmond等人之美國公開案第2006/0186418號中，該等揭示内容以該等案之全文引用之方式藉此併入本文。固態發光LED可獨立地使用或以組合方式使用，任選地連同—或更多發光材料（例如，螢光粉、閃爍體、螢光墨）及/或濾片，以產生所需感知色彩之光（包含可感知為白色的色彩之組合）。於LED裝置中引入發光（亦稱作螢光）材料可藉由將該等材料加至封裝材料、將該等材料加至透鏡或藉由直接塗佈至LED上來達成。其他材料，例如分散劑及/或折射率匹配材料可設置於該等封裝材料中。可以一或更多螢光粉至少部份地塗佈LED，該一或更多螢光粉吸收LED光之至少一部份且發射不同的光波長’使得該LED發射來自該LED及該螢光粉的組合光。在一個實施例中’ LED發射LED及螢光粉光的白光組合。可使用許多不同的方法塗佈及製造LED，而一個適當的方法描述於美國專利申請案序號第1 1/656,759號及第 11/899,790 號’兩者標題為「Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing 5 201251132Hlh 3 sets different orientations. For example, the device in the figure is flipped, and 5, the right H field is described as being located in other structures or parts of the structure or part of the "B" will now be directed above A. Similarly, if the second structure in the figure: the structure or part of the "lower, lower/σ axis rotation, the structure or part described as bit 201251132 in other structures or parts "above" will now be oriented to "Extraordinary" or "deviation" in other structures or parts. The same reference numerals throughout the text refer to the same elements. A light emitting device according to embodiments described herein can include a three-five family of nitrogen-based (eg, gallium hydride) light-emitting diodes (LEDs) or lasers fabricated on a growth substrate, such as a 'carbonized stone substrate. Such devices are for example manufactured and sold by Cree, Inc. of Durham, North Carolina. For example, the tantalum carbide (Sic) substrate/layer discussed herein can be a 4h polytype tantalum carbide substrate/layer. However, other types of carbide defects can be used, such as 3C polytype, 6H polytype, and 15R polytype. Appropriate tantalum carbide substrates are commercially available from Cree, Inc. of Durham, North Carolina (the assignee of this application), and methods for making such substrates are described in the scientific literature and in several commonly assigned US The patents include, but are not limited to, 'U.S. Patent Re-issuance No. 3,8, 161, U.S. Patent No. 4,946, 547, and U.S. Patent No. 5,200, 022, the disclosures of As used herein, the term "Group III nitride" refers to those semiconductor compounds formed between nitrogen and one or more elements of the third group of the periodic table, typically one or more elements (A1) , gallium (Ga) and indium (in). The term * also refers to binary compounds, ternary compounds, and quaternary compounds such as GaN, AlGaN, and AlInGaN. The Group III element can be combined with gas to form a binary compound (e.g., GaN), a ternary compound (e.g., AlGaN), and a quaternary compound (e.g., AlInGaN). These compounds may have an empirical formula in which one mole of nitrogen is combined with an overall one-mole third element; 9 201251132. Therefore, these compounds are often described using a formula such as AixGal-xN where 1 > x > 0. Techniques for epitaxial growth of Group III nitrides are well developed and published in the appropriate scientific literature, and are commonly assigned US Patent Nos. 5,210, 〇 51, US Patent No. 5,993 and In U.S. Patent No. 5,523,589, the disclosures of which are hereby incorporated by reference in its entirety herein. While various embodiments of the LEDs disclosed herein include a growth substrate, those skilled in the art will appreciate that the crystallized crystal growth substrate can be removed (this, '0 day and day growth growth substrate has a included Lei a crystalline layer), and the free-formed worm layer T is mounted on the (four) carrier substrate or the sub-mount S, which may have better thermal, electrical, and structural characteristics than the original substrate. And / or optical properties. The beta titanium described herein is not limited to structures having a crystalline epitaxial growth substrate and may be structurally related to the use of the structures in which the insecticidal layer has been removed from the original growth substrate of the layer and bonded to the replacement carrier substrate. A Group III nitride-based LED' according to certain embodiments of the present application can be fabricated on a growth substrate (eg, a tantalum carbide substrate) to provide a horizontal placement (electrical on the same side of the coffee) Contact either) or vertical device (with electrical contacts on the opposite side of the LED). The growth substrate can then be maintained on the led after 氡k or removal (e.g., by engraving, grinding, polishing, etc.). For example, the thickness of the LED produced by the growth can be removed and/or the forward voltage through the vertical LED can be reduced. For example, a horizontal device (with or without a growth substrate) can be flip chip bonded (e.g., using solder) to a carrier substrate or printed electrical s 10 201251132 circuit board (PCB), or wire bonded. The vertical device (with or without a growth substrate) can have a first terminal and a second terminal, the first terminal solder bonded to the carrier substrate, the mounting pad or the PCB, and the second terminal wire bonded to the carrier substrate, the electrical component or the PCB. Examples of vertical LED die structures and horizontal LED die structures are illustrated by way of example in U.S. Patent No. 2008/0258130 to Bergnian, et al., and U.S. Patent Publication No. 2006/0186418 to Edmond et al. The manner in which the full text is cited is hereby incorporated by reference. Solid state light emitting LEDs can be used independently or in combination, optionally together with - or more luminescent materials (eg, phosphor, scintillator, fluorescent ink) and/or filters to produce the desired perceived color. Light (including a combination of colors that can be perceived as white). The introduction of luminescent (also known as fluorescent) materials into the LED device can be accomplished by applying the materials to the encapsulating material, applying the materials to the lens, or by directly coating the LED. Other materials, such as dispersants and/or index matching materials, may be disposed in the encapsulating materials. The LED may be at least partially coated with one or more phosphors, the one or more phosphors absorbing at least a portion of the LED light and emitting a different wavelength of light 'such that the LED emits light from the LED and the fluorescent light The combined light of the powder. In one embodiment, the 'LED' emits a combination of LED and fluorescent white light. LEDs can be coated and fabricated using a number of different methods, and a suitable method is described in U.S. Patent Application Serial Nos. 1 1/656,759 and 11/899,790, both entitled "Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing 5 201251132

Me — d」，且該等案兩者以引用之方式併入本文。替代地，可使用其他方法塗佈LED例如電泳沉積（EpD)，而適當的EPD方法描述於美國專利申請案序號第 11/473,089 ^ r ci〇se Loop ElectrophoreticMe — d”, and both of these are incorporated herein by reference. Alternatively, LEDs such as electrophoretic deposition (EpD) can be coated using other methods, and suitable EPD methods are described in U.S. Patent Application Serial No. 11/473,089, r ci〇se Loop Electrophoretic

Deposition of Semiconduct〇r ，該案以引用之方式亦併入本文。了解到根據本揭示申請標的之LED裝置及方法可亦具有多個色彩不同的LED，該等LED中之一或更多可為發射白光的。第1圖至第8C圖描繪發光二極體（LED)封裝，一般指疋為10 ’該發光二極體封裝舉例而言可為表面安裝裝置 (SMD)，且該發光二極體封裝之部件根據使用於顯示器（例如室内LED螢幕及/或室外LED螢幕）中的特定、不範性實施例。LED封裝1〇可包括外殼12，外殼 12形成用以裝載引線架14的主體13,引線架14之實施例於以下有更詳細的描述，且一或更多LED 4〇可電性連接至引線架14。舉例而言，一或更多LED 4〇藉由電性連接例如導線40A、40B(參見例如第2圖）可電性連接至引線架14。如本領域當中所習知，亦可使用其他適當電性連接以將一或更多LED 40電性連接至引線架14。外殼12可為至少大致上矩形，分別包含相對的第—主表面16及第二主表面18(或上部表面及丁部表面 Μ) ’相對的各自側表面2〇及22，及端表面24及26。外殼12及引線架14可協助界定LED封裝之外部尺寸。在—個實施例中，外殼12(或主體12)之上部表面16 12 201251132 與引線架14之下部表面9〇、92間的距離T(如第把圖中所見）’或封裝分佈高度或厚度可小於約（或近似）2 〇匪。舉例而言，上部表面16與引線架14之下部表面 92間的距離τ可Α折介/ 1 J馮近似1.70 mm至近似1.95 mm »舉例而言，上部主表面16與下部主表面18間的距離τ可為近似1.90 mm。側表面2〇與22間的距離w可小於近似 3.0 mm。舉例而言，側表面2〇與22間的距離w可近似 2.7 mm至近似3.〇 _。舉例而言側表面2〇與η間的距離w可近似2.8 _。端表面24與26間的距離L 可小於近似3.5mm。舉例而言’端表面“與“間的距離L的範圍為自近似3.lmm至近似3 5_。舉例而言，端表面24與26間的距離L可近似3.2 mme 外殼12可由電性絕緣的且導熱的兩者材料來製心在某些實施例中，外殼可為熱塑性聚縮合物 (p〇lyc〇ndensate)。舉例而言，在一個態樣中，可使用的熱塑性聚縮合物為聚鄰苯二甲醯胺㈣沖制⑽心； PPA)。在某些實施例中，外殼12可由黑他或白pm 所形成。本文已發現於影像產生咖封裝令使用黑材料例如封裝利用在視訊顯示器中，改善了對比度。可使用的其他外殼材料可包括陶瓷、樹脂、環氧化物及玻璃。在某些實施例中，外殼12可包括白塑谬材料，更明確而言’鑄模白塑谬材料。在一個態樣令，外殼Η可包括任何適當的鑄模H在另—個態，外殼12可包括盖 13 201251132 具有對於固態裝置封裝應用經最佳化之定量性質且定性性質的塑膠材料。在-個態樣中，舉例而言，該塑膠材料可包括任何適當的有機聚合物，例如，舉例而言，耐熱樹脂’例如聚醯胺樹脂。該塑膠材料可填充有玻璃或礦物材料用於強度及某些物類似二氧化鈦用於反射性。由於硬度可取決於溫度’針對外殼12利用例如本文所述的塑夥材料可允許外殼12於操作溫度下有有利的柔軟度。此柔軟度可允許外殼12具有改善的可靠度及可用壽命。在-個態樣中’塑膠材料可為液晶聚合物(Lcp)。據此經最佳化的塑膠材料可包括玻璃轉換溫度(、)，舉例而言，該玻璃轉換溫度（Tg)可大於近似攝& ιι〇度 (°c)。舉例而言，玻螭轉換溫度（Tg)可大於近似ii5t或大於近似12〇t;。在一個態樣中，玻璃轉換溫度（Tg)可大於近似123°C。據此經最佳化的塑膠材料亦可包括㈣溫度（Tm)，可小於近似315t。舉例而言，熔點溫度可小於近似31(rc ^舉例而言，熔點溫度（Tm)可小於近似3〇〇°C。在一個態樣中’溶點溫度（Tm)可近似3orc。相較於許多習知所使用的塑膠，八近似123。〇之塑膠材料溫度較高，且該塑膠材料可允許封裝於溫度上升時具有增加的穩定度。具有近似307t的較低、塑膠材料^ 允許較佳流動性’因為熔點溫度低於習知所使用的塑膠之熔點溫度且塑膠主體易於鑄模。針對外殼12所選擇的塑膠亦可包括經最佳化的定性性質。舉例而言，可選擇展現較佳&射率保留值的白塑膠制，白塑膠材料同時 201251132 展現當承受熱及/或光曝露時較不會變色、劣化及/或苦化的傾向。在一個態樣中，塑膠材料之反射率可大於例如9 0 /。，且於時間、熱、濕氣及藍光曝露下可維持該反射率準位或另一較高反射率準位。用於外殼12的塑膠材料之其他特性或特徵可包括近似1.4%或更大的伸長值（機械性質），或16%或更大的伸長值。在一個態樣中，伸長值可近似1·5%或更大。此外作為機械性質，藉由ASTM D790標準所測量的外殼12 之塑膠材料之撓曲強度可近似150 Mpa或較低、近似13〇 MPa或較低’或近似120 MPa或較低。在一個態樣中，藉由ASTM D790標準所測量的外殼12之塑耀L材料之撓曲強度可近似140 Mpa或較低。此外作為機械性質，外殼12之塑膠材料之撓曲模數可近似6.9 GPa或較低，或近似6.5 GPa或較低。在一個態樣中，外殼12之塑膠材料之撓曲模數可近似6.0 GPa或較低。作為又一機械性質’藉由ASTM D638標準所測量的外殼之塑膠材料之抗拉強度可近似1 〇〇 MPa或較低，近似90 MPa或較低’或近似80 MPa或較低。在一個態樣中，藉由ASTM D638標準所測量的外殼12之塑膠材料之抗拉強度可小於近似75 MPa。外殼12可進一步界定反射體凹口或空腔28，反射體凹口或空腔28可設置於至少部份位於外殼12内。在一個態樣中，空腔28可從上部表面16延伸進入外殼12 之主體。可藉由朝向外殼之内部向内削斜反射體空腔28 15 201251132 來增強反射體空腔28之反射率的效力。因此，反射體空腔28可具有傾斜壁部份3〇、32、34、％，傾斜壁部份 30、32、34、36可形成至少大致上矩形形狀。舉例而言，傾斜側土 σ卩伤30、32彼此近似平行延伸，而傾斜端壁部份34、36彼此近似平行延伸，傾斜側壁部份3〇、32近似垂直於傾斜端壁部份34、36。傾斜側壁部份3〇、Μ 所傾斜的角度不同於傾斜端壁部份34、36所傾斜的角度如以下進一步的描述。過渡壁部份39Α、39Β、39C、 39D可坐落於傾斜側壁部份3〇、32與傾斜端壁部份以、 36之間，過渡壁部份39Α、39Β、39(：、39d提供各自壁伤30、32、34、36之各自角度的過渡部份。如第i 圖至第3B圖中所圖示，傾斜側壁部份3〇、32可比傾斜端壁部份34、36 |。因此’根據本揭示案之一個態樣，工腔的尺寸相較於例如環形空腔而增加。空腔底之面積除以主表面之面積的比率可為至少35%。在某些實施例中’該比率大於4G%。在又—些其他實施例中，該比率大於50%。反射體空腔28可任選地塗佈有反射物質及/或填充有所需準位的封裂材料E(例如，如第^中的虛線所示）。在第1圖中，虛線圖示在反射體空腔28内封裝材料£ Z填充至第一準位。亦即，封裝材料E可填充至實質上與上部主表面16齊平的準位，或替代地封裝材料E在反射體空腔28内可填充至任何適當的準位且可包括凹或凸面且甚至超越或延伸於上部主表面16的上方。封 16 201251132 裝材料E可保護且位置上穩定引線架14及藉此所裝載的該—或更多LED 40。在—些情況下，封裝材料£可覆蓋該一或更多LED 4〇、引線架14透過反射體空腔Μ 所曝露的部份及LED之電性連接。可選擇封裝材料Ε 以具有預定光學性質，以便增強自LED的投射光。封裝材料E可包括本領域所習知的任何適當的材料。舉例而言，封裝材料E可由樹脂、環氧化物、熱塑性聚縮合物、玻璃及/或其他適當的材料或材料之組合所形成。在某些 Λ知例中’可增加材料至封裝材料E以增強光發射、吸收，/或色散S LED及/或自LED的光發射、吸收及/或色散。舉例而言，封裝材料E可任選地包括螢光粉或螢光體以與由一咨争容TPFk /ΙΛ A更^ LED 40所發射的光相互作用且相應地發射不同波長頻譜之光。在某些實施例中’可沿著反射體空腔28之傾斜壁部份3〇、& 34、％之至少— 部份…固定反射式***物或環。此外，該反射式插入物或¥可與外殼12整合且可由與外殼Η相同的材料所製成。如關於根據本文的申請標的之咖封裝的可能的尺寸及空腔壁禹户：;隹_ ^ ^ 進一步描述，空腔28内的整體體積可大於其他類似LED封穿，私丨Λ | y , TFn ^ ^ 裝例如舉例而言，其他類似封裝其巾空腔或凹口為環形的。如第3A圖及第3B圖中不，傾斜側壁部份3〇、32 的長度可為Was且傾斜 w 响立邛伤34、36的長度可為 WAE。傾斜端壁部份34、％壁部份30'32的長度w。驻度〜可大於傾斜側 AE藉由使得傾斜端壁部份34、Deposition of Semiconduct〇r, which is incorporated herein by reference. It is understood that LED devices and methods in accordance with the teachings of the present disclosure may also have a plurality of LEDs of different colors, one or more of which may be white light emitting. 1 to 8C depict a light emitting diode (LED) package, generally referred to as 10'. The light emitting diode package may be, for example, a surface mount device (SMD), and the components of the light emitting diode package Depending on the particular, non-standard embodiment used in displays such as indoor LED screens and/or outdoor LED screens. The LED package 1A can include a housing 12 that forms a body 13 for loading the lead frame 14. An embodiment of the lead frame 14 is described in more detail below, and one or more LEDs 4 can be electrically connected to the leads Shelf 14. For example, one or more of the LEDs 4 can be electrically connected to the lead frame 14 by electrical connections such as wires 40A, 40B (see, for example, Figure 2). Other suitable electrical connections may also be used to electrically connect one or more of the LEDs 40 to the leadframe 14 as is known in the art. The outer casing 12 can be at least substantially rectangular, including opposing first major surface 16 and second major surface 18 (or upper surface and butyl surface Μ) respectively, opposite respective side surfaces 2 and 22, and end surface 24 and 26. The outer casing 12 and lead frame 14 assist in defining the outer dimensions of the LED package. In one embodiment, the outer surface of the outer casing 12 (or body 12) 16 12 201251132 is at a distance T from the lower surface 9 〇, 92 of the lead frame 14 (as seen in the drawings) or the package distribution height or thickness. Can be less than about (or approximately) 2 〇匪. For example, the distance τ between the upper surface 16 and the lower surface 92 of the lead frame 14 can be reduced to approximately 1.90 mm to approximately 1.95 mm. For example, between the upper major surface 16 and the lower major surface 18 The distance τ can be approximately 1.90 mm. The distance w between the side surfaces 2〇 and 22 may be less than approximately 3.0 mm. For example, the distance w between the side surfaces 2〇 and 22 can be approximately 2.7 mm to approximately 3. 〇 _. For example, the distance w between the side surfaces 2〇 and η can be approximately 2.8 _. The distance L between the end surfaces 24 and 26 can be less than approximately 3.5 mm. For example, the distance between the end surfaces "and" is in the range of from approximately 3.1 mm to approximately 3 5 mm. For example, the distance L between the end surfaces 24 and 26 can be approximately 3.2 mme. The outer casing 12 can be cored by both electrically insulating and thermally conductive materials. In certain embodiments, the outer casing can be a thermoplastic polycondensate (p〇 Lyc〇ndensate). For example, in one aspect, the thermoplastic polycondensate that can be used is polyphthalamide (iv) (10) core; PPA). In some embodiments, the outer casing 12 can be formed from black or white pm. It has been found in the image-generating coffee package that the use of black materials such as packages for use in video displays improves contrast. Other housing materials that may be used may include ceramics, resins, epoxies, and glass. In certain embodiments, the outer casing 12 can comprise a white plastic enamel material, more specifically a 'molded white plastic enamel material. In one aspect, the outer casing can include any suitable mold H. In another state, the outer casing 12 can include a cover 13 201251132 having a plastic material that is optimized for the solid state device packaging application with quantitative properties and qualitative properties. In one aspect, for example, the plastic material can comprise any suitable organic polymer, such as, for example, a heat resistant resin such as a polyamide resin. The plastic material can be filled with glass or mineral materials for strength and certain materials like titanium dioxide for reflectivity. Since the hardness may depend on the temperature' for the outer casing 12, for example, the plastic material, as described herein, may allow the outer casing 12 to have a favorable softness at the operating temperature. This softness allows the outer casing 12 to have improved reliability and useful life. In one aspect, the plastic material may be a liquid crystal polymer (Lcp). Accordingly, the optimized plastic material may include a glass transition temperature (,), which may be, for example, greater than the approximate & amp (°c). For example, the glass transition temperature (Tg) can be greater than approximately ii5t or greater than approximately 12 〇t; In one aspect, the glass transition temperature (Tg) can be greater than approximately 123 °C. Accordingly, the optimized plastic material may also include (iv) temperature (Tm), which may be less than approximately 315 tons. For example, the melting point temperature can be less than approximately 31 (rc ^ for example, the melting point temperature (Tm) can be less than approximately 3 ° C. In one aspect the 'melting point temperature (Tm) can be approximately 3 orc. Many of the plastics used in the prior art are similar to 123. The plastic material has a high temperature, and the plastic material can allow the package to have an increased stability when the temperature rises. The lower the plastic material, which is approximately 307t, allows for better plasticity. Fluidity 'Because the melting point temperature is lower than the melting temperature of the plastic used in the prior art and the plastic body is easy to mold. The plastic selected for the outer casing 12 may also include optimized qualitative properties. For example, it may be preferred to exhibit better. & white plastic with a retention rate, white plastic material at the same time 201251132 shows a tendency to discolor, deteriorate and/or bitter when subjected to heat and/or light exposure. In one aspect, the reflection of plastic material The rate can be greater than, for example, 90%, and the reflectance level or another higher reflectance level can be maintained over time, heat, moisture, and blue light exposure. Other characteristics or characteristics of the plastic material used for the outer casing 12. An elongation value (mechanical property) of approximately 1.4% or more, or an elongation value of 16% or more is included. In one aspect, the elongation value may be approximately 1.5% or more. Further, as a mechanical property, The flexural strength of the plastic material of the outer casing 12 as measured by the ASTM D790 standard may be approximately 150 Mpa or less, approximately 13 MPa or lower 'or approximately 120 MPa or lower. In one aspect, by ASTM D790 standard The measured flexural strength of the plastic L material of the outer casing 12 may be approximately 140 Mpa or less. Further, as a mechanical property, the flexural modulus of the plastic material of the outer casing 12 may be approximately 6.9 GPa or less, or approximately 6.5 GPa or In one aspect, the flexural modulus of the plastic material of the outer casing 12 can be approximately 6.0 GPa or less. As a further mechanical property, the tensile strength of the plastic material of the outer casing measured by the ASTM D638 standard can be Approx. 1 〇〇 MPa or lower, approximately 90 MPa or lower 'or approximately 80 MPa or lower. In one aspect, the tensile strength of the plastic material of the outer casing 12 as measured by the ASTM D638 standard may be less than approximately 75 MPa. The outer casing 12 can further define the reflection A recess or cavity 28, a reflector recess or cavity 28 can be disposed at least partially within the outer casing 12. In one aspect, the cavity 28 can extend from the upper surface 16 into the body of the outer casing 12. The reflector cavity 28 15201251132 is angled inwardly toward the interior of the housing to enhance the effectiveness of the reflectivity of the reflector cavity 28. Thus, the reflector cavity 28 can have inclined wall portions 3, 32, 34, %, The inclined wall portions 30, 32, 34, 36 may form at least a substantially rectangular shape. For example, the inclined side soils σ bruises 30, 32 extend approximately parallel to each other, and the inclined end wall portions 34, 36 extend approximately parallel to each other. The inclined side wall portions 3, 32 are approximately perpendicular to the inclined end wall portions 34, 36. The angle at which the inclined side wall portions 3, Μ are inclined is different from the angle at which the inclined end wall portions 34, 36 are inclined as described further below. The transition wall portions 39Α, 39Β, 39C, 39D may be located between the inclined side wall portions 3〇, 32 and the inclined end wall portions, 36, and the transition wall portions 39Α, 39Β, 39 (:, 39d provide respective walls The transition portions of the respective angles of 30, 32, 34, 36 are injured. As illustrated in Figures i to 3B, the inclined side wall portions 3, 32 are comparable to the inclined end wall portions 34, 36 | According to one aspect of the present disclosure, the size of the working chamber is increased compared to, for example, an annular cavity. The ratio of the area of the bottom of the cavity divided by the area of the major surface can be at least 35%. In some embodiments, The ratio is greater than 4 G%. In still other embodiments, the ratio is greater than 50%. The reflector cavity 28 can optionally be coated with a reflective material and/or a sealing material E filled with a desired level (eg, As shown by the dashed line in Fig. 2, in Fig. 1, the dashed line shows that the encapsulation material £Z is filled to the first level in the reflector cavity 28. That is, the encapsulation material E can be filled to substantially The upper major surface 16 is flush with the level, or alternatively the encapsulating material E can be filled to any suitable level within the reflector cavity 28 and Included concave or convex and even beyond or extending above the upper major surface 16. The seal 16 201251132 contains material E that protects and positions the lead frame 14 and the LEDs 40 that are loaded thereby. The encapsulating material can cover the one or more LEDs 4, the exposed portion of the lead frame 14 through the reflector cavity, and the electrical connection of the LEDs. The encapsulating material 可选择 can be selected to have predetermined optical properties to enhance Projecting light from the LED. The encapsulating material E may comprise any suitable material known in the art. For example, the encapsulating material E may be made of a resin, an epoxide, a thermoplastic polycondensate, glass, and/or other suitable materials or A combination of materials is formed. In some instances, the material may be added to the encapsulation material E to enhance light emission, absorption, and/or dispersion S LED and/or light emission, absorption, and/or dispersion from the LED. In other words, the encapsulating material E can optionally include a phosphor or phosphor to interact with light emitted by a collimating TPFk / A A LED 40 and correspondingly emit light of a different wavelength spectrum. In some embodiments, The inclined wall portion 3〇, & 34, % of at least a portion of the reflector cavity 28 is fixed to the reflective insert or ring. Further, the reflective insert or ¥ can be integrated with the outer casing 12 and can be The outer casing is made of the same material. As with the possible dimensions of the coffee package and the cavity wall according to the application herein; 隹_ ^ ^ further described, the overall volume within the cavity 28 can be larger than other similar LEDs封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封封The length of 32 can be Was and the length of the tilting w. The length of the 34, 36 can be WAE. The length w of the inclined end wall portion 34, the % wall portion 30'32. The standing degree ~ can be greater than the inclined side AE by causing the inclined end wall portion 34,

S 17 201251132 36的長度Wae大於傾斜側壁部份3〇、32的長声w 傾斜側壁部份30、32的隹^ B ^ AE ’ 幻角度（且於傾斜側壁部份之間）可大於傾斜端壁邹份背34 36之⑴ 的角度（且於傾斜端壁 34、36之間）’如以下進一步描述。第6圖圖示LED封裝1〇哀10之頂視圖。LED封裝1〇中意圖示有一個LED 4〇丁丁 ED封裝1❶可有一或更多 LED 40。LED封裝10為通稱聃旳且在此包含以圖示可能的進-步尺寸。LED40可包括寬度ι及長度2,該寬度及該長度可為任何適當的尺寸。咖封裝iq圖示封= 本身之各種尺寸。舉例而言，业切〃型的尺寸例如長度、寬度、厚度及面積可如第6圖中所圖示且於以下表格" 所揭示的那些。表格近似測量（單位為參考符號尺寸描述 L1 整體封裝之長度，包含電性引線之部份 mm) L2 L3 封裝主體之長度於主體之上部表面處測量的反射體空腔之長度 201251132 L4 L5 設置於反射體空腔外側的主體之上部表面之長度空腔底之長度The length Wae of the S 17 201251132 36 is greater than the long sound of the inclined side wall portions 3〇, 32. The 隹^ B ^ AE ' magic angle of the inclined side wall portions 30, 32 (and between the inclined side wall portions) may be larger than the inclined end The angle of (1) (and between the inclined end walls 34, 36) of the wall back 34 36 is further described below. Figure 6 shows a top view of the LED package 1 哀 10 . The LED package 1 〇 has an LED 4 〇 ED package 1 ❶ can have one or more LEDs 40. The LED package 10 is generic and includes the possible step sizes as illustrated. LED 40 can include a width ι and a length 2, and the width and the length can be any suitable size. The coffee package iq icon seal = various sizes of its own. For example, the dimensions of the cut shape, such as length, width, thickness, and area, can be as illustrated in Figure 6 and are disclosed in the following table ". Table approximation measurement (unit is the reference symbol size description L1 overall package length, including part of the electrical lead mm) L2 L3 package body length measured at the upper surface of the body of the reflector cavity length 201251132 L4 L5 is set at The length of the upper surface of the body outside the cavity of the reflector is the length of the bottom of the cavity

L6 角落長度L6 corner length

整體封裝主體之寬度 --------- 於主體之上部表面處測量的反射體空腔之寬度 W3 空腔底之寬度氺τ 封裝之整體厚度 1.74 — .9 尺寸 *指明於第3Β圖中所圖示的厚度表格1說明（而非限制）針對咖封裝1〇度與寬度尺寸。在一個自t^ 』此的長在個L樣中，整體封裝面可近似 9.4mm2 2 、1XW1) 至近似l〇mm。任何形狀的LED晶片例如〜了及結構先前所述，h個/ 心咖封裝1G中。如 40可設置於LED封裝η 寸的LED 4。/\各種長度與寬度。可❹任何適當尺 _封農特:二=L6可為足夠大至足以產生唇二腔28内。因此，距離L5及L6可Width of the whole package body ---------- width of the reflector cavity measured at the upper surface of the body W3 width of the cavity bottom τ τ overall thickness of the package 1.74 - .9 size * specified in section 3 The thickness table 1 illustrated in the figure illustrates (but not limits) the width and width dimensions for the coffee package. In a long L-like sample, the overall package surface can be approximated by 9.4mm2 2 , 1XW1) to approximately l〇mm. Any shape of LED wafer, for example, and structure, previously described, h/heart coffee package 1G. For example, 40 can be set in the LED package η inch LED 4. /\ Various lengths and widths. Any suitable ruler can be used. _Fenunter: Two = L6 can be large enough to produce lip chamber 28. Therefore, the distances L5 and L6 can

S 19 201251132 ’同時產生較大傾斜壁部射體空腔28之反射表面經最小化以允許保持封裴材料份 30、32、34、36。藉此，反可經取大化且在上部表面24上的浪費空間可經最小化β亥配置可造成至少約！〇%的照明明亮輸出。再者本文;主思到，如第i圖中所示，於上部表面^ 處反射體空腔28之開π可為較大矩形形狀且於空腔底 7〇處反射體空腔28之開口（見第7A圖及第7B圖）可為杈小矩形形狀。於上部表面16處反射體空腔28之較大矩形/狀開口可正比於或並非正比於於空腔底處反射體空腔28之較小矩形形狀開口。舉例而言，在某些實施例t，於上部表面16處較大矩形形狀開口可藉由較長側壁部份及較短端壁部份來界定，而於空腔底7〇處較小矩形形狀開口可為正方形，而界定該開口的側壁部份及端壁部份之長度為實質上相同。第5圖圖示針對引線架14的一個可能的實施例，與第 1圖至第4圖中所圖示的引線架有稍微不同的方位。因此，使用相同的元件符號。引線架14可包括導電晶片載體（一般指定為50)及自該導電晶片載體分離的第一、第二及第三導電連接部’分別一般指定為52、54及56。導電晶片載體50及第一、第二及第三導電連接部S2、 54及56可形成引線60、Μ、64及66。導電晶片载體 50可具有上部表面80,上部表面80包含連接墊68 ^連接墊68可自外殼12曝露出。第一導電連接部52可由導電片載體50至少部份圍繞。第一、第一及苐三導電連 20 201251132 接部中之各者可具有上部表面、下部表面或終端及在上部表面之上的連接塾。舉例而言，於第m導電連接部52可具有上部表面82、下部表面％及在上部表面82之上的連接塾72。第二導電連接部54可具有上部表面84'下部表面94及在上部表面Μ之上的連接塾 74。第三導電連接部56可具有上部表面％、下部表面 %及在上部表面86之上的連接塾％。因此，第一、第二及第三導電連接部52、54及％可分別各具有連接墊 72、74及76。如連接墊68,連接墊72、”及％可具有至少-部份自外# 12曝露出’也圖示於第i圖及第2 圖中。第-導電連接部52之上部表面82之表面面積可小於第二導電連接部54之上部表面84之上部表面面積或第三導電連接部56之上部表面86之上部表面面積。連接墊68可具有相對側。該等相對侧的其中一側可接近連接墊74及76,該側可與如第！圖及第2圖中所示的反射體空腔28之端壁部份34、36至少一樣長。另一侧可接近連接墊72，該側長度大於反射體空腔28之鄰近端壁部份34之近似二分之一長度。一或更多led設置於導電晶片載體50之上部表面8〇之上。舉例而言，於第1圖及第2圖中，LED 40可設置於上部表面8〇之連接墊68之上。在一些實施例中，於端部份之底部之上包含有焊料墊，使得當自頂部觀看各個別LED封裝時看不見焊料。由於此助於避免眩光且改善對比度，此可為有優勢的，$ 21 201251132 特別是在曰照觀看期問。‘ ^ 百J間如於弟1圖及第2圖中最佳可見，反射體空腔28可延伸進入外殼内部至足夠深度以曝露出連接墊60及72、74、76。引線60、62、64及66之下部表面9〇 92 94及％自外殼之端表面32及34向内延伸之特定尺寸可取決於表面安裝LED縣之預㈣財式、待制的咖、外殼12之材料、LED封裝之尺寸及/或其他該等因素及, 或因素之組合。在一些實施例中，分別形成弓丨線MW、 64及66的導電晶片載體5〇及第一、第二及第三導電連接部52、54及56可藉由連接塾68及連接塾72、 %當中的間隙98分離’以彼此電性隔離連接部幻、“ 及56及自導電晶片載體5〇電性隔離。如於第^圖至第 3A圖中所示，在LED封裝1〇中，連接塾⑼與連接塾 72、74、76之間的間隙:98可填充有外殼材料以形成主體部份12A、12B，主體部份似、12B使連接墊的與連接塾72、74、76彼此隔離。參考第5圖，藉由使第一導電連接部“之上部表 82之表面面積最小化至僅具有《夠空間來維持連接2 72’可實現增強的熱逸散。上部表面82之表面面積可小於第二導電連接部54之上部表面84之表面面積或第三導電連接部56之上部表面86之表面面積。導電連接： 52、54及56可包括放大的電性連接墊72、74、％，八別設置於圍繞中心區域58(見第i圖及第2圖），鄰近= 載晶片載體50之上部表面8〇的組件但自該組件分離、 22 201251132 舉例而言，如上所述，間隙98可彼此分離連接部52、 S4及56且自導電晶片载體so分離。在表面安裝led 封裝10之一些實施例中，可彎折引線6〇、62、64及66 以延伸於外殼之外側且沿著引線60、62、64及66之各自的外殼之端表面24及26,然後再度彎折使得引線6〇、 62、64及66之下部表面90、92、94及96沿著外殼12 之下部表面26延伸。下部表面90、92、94及96亦可被稱為接腳墊片。引線60、62、64及66之下部表面9〇、 92、94及96之面朝外表面及導熱主體之底部表面可實質上齊平以促進連接至位於下方的基板。引線之下部表面90、92、94及96藉由數個習知連接技術之任一種來電性連接或接合至基板上的跡線或墊，習知技術包含焊接。S 19 201251132 'The reflective surface that simultaneously produces the larger inclined wall portion cavity 28 is minimized to allow retention of the sealing material portions 30, 32, 34, 36. Thereby, the waste that can be oversized and on the upper surface 24 can be at least approximately achieved by minimizing the beta configuration! 〇% of the lighting is brightly output. Furthermore, it is believed that, as shown in Figure i, the opening π of the reflector cavity 28 at the upper surface ^ can be a larger rectangular shape and the opening of the reflector cavity 28 at the bottom 7 of the cavity (See Figures 7A and 7B) It can be a small rectangular shape. The larger rectangular/shaped opening of the reflector cavity 28 at the upper surface 16 can be proportional to or not proportional to the smaller rectangular shaped opening of the reflector cavity 28 at the bottom of the cavity. For example, in some embodiments t, a larger rectangular shaped opening at the upper surface 16 can be defined by a longer sidewall portion and a shorter end wall portion, and a smaller rectangle at the bottom of the cavity 7 〇 The shape opening may be square, and the length of the side wall portion and the end wall portion defining the opening are substantially the same. Figure 5 illustrates one possible embodiment for leadframe 14 that has a slightly different orientation than the leadframe illustrated in Figures 1 through 4. Therefore, the same component symbol is used. Lead frame 14 can include a conductive wafer carrier (generally designated 50) and first, second, and third conductive connections separated from the conductive wafer carrier are generally designated 52, 54 and 56, respectively. Conductive wafer carrier 50 and first, second and third conductive connections S2, 54 and 56 may form leads 60, Μ, 64 and 66. The conductive wafer carrier 50 can have an upper surface 80 that includes a connection pad 68. The connection pads 68 can be exposed from the outer casing 12. The first conductive connection 52 can be at least partially surrounded by the conductive sheet carrier 50. Each of the first, first and third conductive links 20 201251132 may have an upper surface, a lower surface or a terminal and a port on the upper surface. For example, the mth conductive connection 52 can have an upper surface 82, a lower surface %, and a port 72 above the upper surface 82. The second electrically conductive connection 54 can have a lower surface 94 of the upper surface 84' and a port 74 above the upper surface. The third electrically conductive connection 56 can have an upper surface %, a lower surface %, and a connection % above the upper surface 86. Therefore, the first, second and third conductive connecting portions 52, 54 and % can each have connection pads 72, 74 and 76, respectively. For example, the connection pads 68, the connection pads 72, "and % can have at least - a portion exposed from the outer #12" are also illustrated in Figures i and 2. The surface of the upper surface 82 of the first conductive connection portion 52. The area may be smaller than the upper surface area of the upper surface 84 of the second conductive connection 54 or the upper surface area of the upper surface 86 of the third conductive connection 56. The connection pads 68 may have opposite sides. One side of the opposite sides may Adjacent to the connection pads 74 and 76, the side may be at least as long as the end wall portions 34, 36 of the reflector cavity 28 as shown in Figures! and 2, and the other side may be adjacent to the connection pad 72. The side length is greater than approximately one-half the length of the adjacent end wall portion 34 of the reflector cavity 28. One or more LEDs are disposed over the upper surface 8 of the conductive wafer carrier 50. For example, in Figure 1 And in Fig. 2, the LED 40 can be disposed on the upper surface 8 of the connection pad 68. In some embodiments, the solder pad is included over the bottom of the end portion such that when viewing the individual LED packages from the top I can't see the solder. Because it helps to avoid glare and improve the contrast, this can be Potential, $ 21 201251132 is especially during the viewing period. ' ^ Between the J and J, as best seen in Figure 1 and Figure 2, the reflector cavity 28 can extend into the interior of the enclosure to a depth sufficient to expose The pads 60 and 72, 74, 76. The lower surfaces of the leads 60, 62, 64 and 66 9 92 92 and % extend inwardly from the outer end surfaces 32 and 34 of the outer casing may depend on the surface mount LED prefecture (4) The financial formula, the coffee to be made, the material of the outer casing 12, the size of the LED package, and/or other such factors and/or combinations of factors. In some embodiments, the conductive lines of the bow wires MW, 64, and 66 are formed, respectively. The wafer carrier 5 and the first, second and third conductive connecting portions 52, 54 and 56 can be separated from each other by a gap 98 between the connecting port 68 and the connecting ports 72, % to electrically isolate the connecting portions, and 56 and electrically isolated from the conductive wafer carrier 5 . As shown in FIGS. 3 to 3A, in the LED package 1 间隙, the gap between the connection 塾 (9) and the connection ports 72, 74, 76: 98 may be filled with a casing material to form the body portions 12A, 12B. The body portion, 12B, isolates the connection pads from the ports 72, 74, 76 from each other. Referring to Figure 5, enhanced thermal dissipation can be achieved by minimizing the surface area of the first conductive connection "top table 82 to only have "sufficient space to maintain connection 2 72". The surface area of the upper surface 82 can be Less than the surface area of the upper surface 84 of the second conductive connection portion 54 or the surface area of the upper surface 86 of the third conductive connection portion 56. The conductive connections: 52, 54 and 56 may include enlarged electrical connection pads 72, 74, % Eight is disposed around the central region 58 (see Figures i and 2), adjacent to the component of the upper surface of the wafer carrier 50, but separated from the component, 22 201251132, for example, as described above, the gap 98 can separate the connections 52, S4, and 56 from each other and separate from the conductive wafer carrier so. In some embodiments of the surface mount LED package 10, the leads 6, 62, 64, and 66 can be bent to extend beyond the outer side of the housing. And along the end surfaces 24 and 26 of the respective outer casings of the leads 60, 62, 64 and 66, and then bent again such that the lower surfaces 90, 92, 94 and 96 of the leads 6, 62, 64 and 66 are along the outer casing 12. The lower surface 26 extends. The lower surfaces 90, 92, 94 and 96 are also The outer surface of the lower surfaces 9〇, 92, 94 and 96 of the leads 60, 62, 64 and 66 and the bottom surface of the thermally conductive body may be substantially flush to facilitate connection to the underside. Substrate. The lower surface 90, 92, 94, and 96 of the leads are electrically connected or bonded to traces or pads on the substrate by any of a number of conventional bonding techniques, including conventional soldering.

導電晶片載體50及導電連接部52、54及56可由導電金屬或金屬合金所製成，例如銅、銅合金、其他適當的低電阻率、耐腐蝕材料或該等材料之組合。因為全部D 晶片設置於導電晶片載體5〇之上，較大的上部表面8〇之表面面積可幫助熱逸散。參考第1圖、第2圖、第3A圖及第3B圖，反射體空腔28可藉由底7〇(包含連接墊68、72、74、％之部份及外威或主體部❾12A、12B)自T方為界且沿著傾斜側壁部份3G、32、傾斜端壁部份34、36及過渡壁部份39A 至39D之邊緣為界。過渡壁部份39A至39D設置於各分別的傾斜側壁部份3〇、32與傾斜端壁部份34、％之間。 23 201251132Conductive wafer carrier 50 and conductive connections 52, 54 and 56 may be formed from a conductive metal or metal alloy such as copper, copper alloy, other suitable low resistivity, corrosion resistant materials or combinations of such materials. Since all of the D wafers are disposed over the conductive wafer carrier 5A, the surface area of the larger upper surface 8〇 can help the heat to escape. Referring to Figures 1, 2, 3A and 3B, the reflector cavity 28 can be formed by the bottom 7 (including the connecting pads 68, 72, 74, % of the parts and the external or main body ❾ 12A, 12B) is bounded from the T side and bounded along the edges of the inclined side wall portions 3G, 32, the inclined end wall portions 34, 36, and the transition wall portions 39A to 39D. The transition wall portions 39A to 39D are disposed between the respective inclined side wall portions 3, 32 and the inclined end wall portions 34, %. 23 201251132

各側壁：份30、32及各端壁部份34、％可包括實質上直的上部邊緣，且各過渡壁部份39A至39D可包括彎或W又的上部邊緣，該彎曲或分段的上部邊緣自侧壁部份3〇、32之上部邊緣過渡至端壁部份34、36之j· H 接„ 工邊第7A圖及第7B圖圖示LED封裝（例如led封裴w 及本文描述的其他封裝）可具有的空腔角度之示意圖式。第7A圖及第78圖中的點？可包括一或更多空腔、或傾斜壁部份3〇、32、34及/或36延伸朝向且交錯空腔底70的交錯區域。在一個態樣中，一或更多空腔可包括於反射體空腔28之壁之間所測量的空腔角度。在一個態樣中，本文描述的封裝之空腔角度可包括9〇。或更大。在另一態樣中，本文描述的封裝之空腔角度可包括9〇。或更小。 +例而言，第7A圖圖示設置於外部側端壁24及％之間的空腔底70之一部份。亦即，第7A圖圖示空腔底之較長的測量L4。舉例而言，在一個態樣中，反射體空腔28之空腔端壁部份34、36之間的空腔角度以⑽ 72、在一個態樣中，反射體空腔28之空腔端壁部份3心 36之間的空腔角度点（於端壁部份之間所測量）可至少近似70。或更大，取決於LED封裝之厚度τ(見第36圖）。較薄、具有較薄尺寸的最佳化封裝可包括較大空腔角度’較大空腔角度可允許封裝内的反射準位維持或超越反射光量。舉例而言該反射光可維持或超越相似封裝^ 24 201251132 之現有亮度標準。隨著空腔角度增加，由空腔壁與空腔底所形成的點下方的面積可變得如此的小而使得黏性材料無法於該面積中鑄模、形成孔隙。藉由於點(空腔辟與空腔底會合處）下方提供較大面積及/或將電㈣線^該點或空腔底之邊緣移位至少―距離，本文描述的封襄可減小及/或消除孔隙。第7B圖圖示設置於外部側邊側壁2〇及22之間的空腔底70之—部份。亦即，帛圖圖示空腔底7〇之^ 短的寬度測量W3。在一個態樣中，反射體空腔28之空腔或傾斜側壁部份30 份之間所測量）可近似、32之間的空腔角度α (於側壁部 5 0或更大’舉例而言，近似$ 1。。在一個態樣中，反射體空腔28之空腔側壁部份3〇、Μ 之間的空腔角度α可至少近似45。或更大，取決於LEd 封裝之厚度T(見第3B圖）。再次，較薄、具有較薄尺寸的最佳化封裝可包括較大空腔角度，較大空腔角度可允許封裝内的反射準位維持或超越反射光量，使得反射光可維持或超越現有亮度標準。相k於各側壁部份30、32及各端壁部份34、36，各過渡壁部份39A至39D可以較大平均角度相對於垂直於反射體空腔之底之平面而傾斜。舉例而言，第8A圖提供主體部份之簡化示意橫截面視圖，第圖圖示相對於垂直於主體空腔之底之平面，主體部份之側壁部份之角度0，而第8B圖提供主體部份之簡化示意橫截面視圖，第8B圖圖示相對於垂直於主體空腔之底之平面， 25 201251132 主體部份之端壁部份之角度φ。相似地，帛^圖提供主體部份之簡化示意橫截面視圖，第8C圖圖示相對於垂直於主體空腔之底之平面，過渡壁部份之角度在一些實施財，各側壁部份可以角度0 Γ少近似2 5 。或更大而傾斜。在進一步實施例中，角度0可至少近似 30。或至少近似35。。在-些實施例中，各側壁部份可以角度Φ至少近似30。而傾斜。在進—步實施例中，角度 Φ可至少近似35»或至少近似4〇、在一些實施例中，2 過渡壁部份可以角度Ρ至少近似35。而傾斜H步實施例中，角度Ρ可至少近似4G。或至少近似45。。㈣部份M、32、端壁部份34、36及過渡壁部份39A至抓之該等角度大於固態發射器|置中通常所採用的角度。雖然側壁/端壁部份及過渡壁部份於第8a圖至第沾圖中圖示為自空腔底至封裝之上部邊緣為呈角度的，在替代實施例t ’該等壁部份中之任一或更多(或全部)可具有分段的及/或彎曲的橫截面之特徵’亦即’從底部延伸至封裝之上部邊緣的壁沿著壁之至少一部份為非線性的。若該等壁為彎曲的或分段的，則上述傾斜角度可對應至彎曲或分段的壁之平均角度，或該壁之端點之間的角度。使用交替角度之側壁部份3()、32/端壁部份 Μ及過渡壁部份似至39D促使反射體空腔μ之前額積相對於成型的上部表面16而經最大化，同時特別當多個發射器（例如多個LED)設置於空腔28中時，提供戶: 需的擴散輸出光束特徵。 26 201251132 在第9圖之圖不的實施例中，提供LED封裝封裝110可包括裝載可如上述的引線架1]U的外殼ιΐ2。因此，相Π的元件付號指示相同或相似的元件^ led封裝110可進一步包括一或更多LED。於第9圖中所示的實施例中，舉例而言，led封裝110可包括三個lED44、 46、48 ’ LED 44、46、48可分別發射紅色、綠色及藍色色彩，使得當經適當地啟動時該等LED產生實質上全色彩範圍組合。LED晶片可具有類似正方形尺寸或矩形尺寸。舉例而言，類似正方形的LED晶片可具有高度分佈’該尚度分佈小於約o.ll mm，或在近似009爪爪至近似0.11 mm的範圍内’或小於近似mm，或在近似〇.〇8 mm至近似〇.1〇 mm的範圍内。類似正方形的lED 晶片可具有寬度分佈’該寬度分佈小於近似0.32 mm，或在0.265 mm至0·315 mm的範圍内。類似正方形的led 晶片可具有寬度分佈’該寬度分佈小於近似038 mm，或在近似0.33 mm至近似0.38 mm的範圍内。矩形的LED 曰曰片可具有兩度分佈，該向度分佈小於近似0.13 mm，或在近似〇. 1 〇 mm至近似〇. 13 mm的範圍内。矩形的LED 晶片可具有寬度分佈，該寬度分佈小於近似0.28 mm j 或在近似0.20mm至近似〇.28mm的範圍内。矩形的LED 曰曰片可具有寬度分佈’該寬度分佈小於近似0.36 mm，或在近似0.28 mm至近似0.36 mm的範圍内。如上，弓丨線架114可包括導電晶片載體50及導電連接部52、54及56，導電連接部52、54及56提供連接墊 27 201251132 72 74及76。導電晶片載體50及導電連接部52、54 及56形成引線6〇、62、64及66。導電晶片载體5〇可具有上部表面80,上部表面80包括連接墊68。連接墊 68可自外设112曝露出。連接墊68具有相對側。該等相對侧中之一側接近連接墊74及76，該側可至少如空腔128之側一樣長。連接墊68之另—側接近連接墊”，該側長度可大於空腔128之鄰近側之近似二分之一長度。複數個LED可設置於導電晶片载體5〇之上部表面 80之上。舉例而言，在第9圖中，三個led 44、妬及 48設置於上部表面8〇之連接墊的之上。該三個led 通吊發射不同色彩的光。舉例而言，LED 44可發射紅光、LED 46可發射綠光且LED 48可發射藍光。該等Led 中之兩個或兩個以上LED可發射相同的色彩，包含白色。舉例而言，LED 44及LED 46可兩者皆發射紅光。各LED具有第一電性終端及第二電性終端。第一電性終端可稱作陽極。舉例而言，第一 LED 44可具有陽極，該陽極電性耦合至導電連接部54之連接墊74。第二led 46可具有陽極，該陽極電性耦合至導電連接部56之連接墊76。相似地，第三LED 48可具有陽極，該陽極電 ϋ耦合至導電連接部52之連接墊72。如上，晶片載體 50亦作為散熱座以自該複數個LED逸散熱。藍色及綠色LED之尺寸可為：寬度近似2〇5微米至近似275微米’且長度近似285微米至近似355微米。在個貫施例中，藍色及綠色LEd可具有近似240微米的 28 201251132 寬度且近似3 20微米的長度。藍色及綠色LED之厚度可從近似1 00微米變化至近似1 30微米，舉例而言，近似 115微米。紅色LED可具有各種尺寸。在某些實施例中，紅色 LED可具有近似355微米的寬度及長度，但寬度及長度尺寸可從近似330微米變化至近似380微米。紅色LED 之厚度在該等實施例中可為近似70微米至近似125微米’舉例而言，近似1 〇〇微米。在該等實施例中，紅色 LED具有尺寸範圍從近似90微米至近似110微米的接合墊，舉例而言，近似100微米。 ° 在某些實施例中，紅色LED可具有近似290微米的寬度及長度，但寬度及長度可從近似256微米變化至近似 3 15微米。紅色LED之厚度在該等實施例中可為近似1〇〇微米，但厚度範圍可從近似85微米變化至近似11 5微米。在該等實施例中’紅色LED可具有尺寸範圍從近似 80微米至近似1〇〇微求的接合塾，舉例而言，近似9〇微米。第10圖示意圖示LED顯示螢幕之一部份，該led顯示螢幕一般指定為200。舉例而言，LED顯示螢幕200 可為室内或室外螢幕，包括（以一般性用語）驅動器印刷電路板（PCB)202 ’驅動器印刷電路板（PCB)2〇2裝載大量的以列及行排列的LED封裝204，各LED封褒附著至或整合於該等其他LED封裝204，以形成單—螢幕。[ED 封裝204可電性連接至PCB 2〇2上的跡線或墊。在某些 29 201251132 實施例中’ PCB 202可連接至適當的電性訊號處理及驅動器電路系統。舉例而s，LED封裝204可包括如上述的LED封裝 10、110。各LED封裝204可包括引線架，而外殼設置於該5丨線架之至少一部份之上。外殼可具有反射體空腔於該外殼中，該反射體空腔圍繞該引線架之上的一或更多LED 206形成矩形形狀開口，而該反射體空腔具有圍繞該一或更多LED的傾斜端壁部份及傾斜側壁部份。如上以LED封裝1〇、no所述，反射體空腔之各端壁部份之角度可與各側壁部份之角度不同。如於第丨〇圖中所不，各LED封裝204可具有多個LED 206於該各LED 封裝204中。舉例而言，如上所述，[ED封裝204中之各者可裝載垂直定向的紅色、綠色及藍色LED 2〇6之線性陣列。該LED線性方位可改善於廣視角範圍下的色彩逼真度。替代地，如以來自第i圖至第5圖的封裝1〇 , 於各LED封裝中可提供單一 LED。各LED封裝204可界定晝素210。顯示器之各畫素21〇可具有近似3.0 mm或更小乘以近似3 5 mm或更小的尺寸LED封裝204可包括例如那些描述於上且圖示於第 1圖至第9圖中的裝置。如上所述，LED封裝204可電性連接至PCB 2G2上的跡線或塾，該等跡線或墊互相連接以提供適當的電性訊號處理電路系統及驅動器電路系統（未圖示）。亦可提供有貫穿孔208以允許更佳且較短的用於將塑膠外殼主體接至pcB的接點。貫穿孔2〇8亦 30 201251132 可允許改善的熱逸散。使用於背光或其他面板顯示系統中的㈣可包括红色、綠色及藍色LED裝置之平面陣列配置，該等裝置經配置以發射於操作中看起來為白光晝素的光。可選擇紅色、綠色及藍色LED之尺寸以符合所需亮度及/或強度平衡準位。可使用任何的紅色、綠色及藍&咖之配置。利帛如本文所述的金屬對金屬晶粒附著方法的㈣封裝及/或LED可使用於背光系統及任何適當的顯示面板系統200 +。舉例但非限制，使用於背光及顯示面板系統中的LED封裝及/或LED可於300 mA於冷白（cw) 下提供多達I22流明的光輸出，且於3〇〇 mA於暖白色彩點下提供多達1 〇〇流明的光輸出。舉例而言，本文揭示的LED封裝及/或LED可使用於照明燈具中，該等照明燈具包括使用於顯示面板系統中的燈具，提供針對 CW色彩點之CRI最小值為65 CRI。本文揭示的LED封裝及/或LED可使用於照明燈具中’該等照明燈具包括使用於顯示面板系統中的燈具，提供針對c w色彩.點之 CRI最小值為75 CRI(對應至5,000 κ至8,300 κ的CCT 範圍）。使用於顯示面板系統中的本文揭示的LED封裝及/或LED亦可提供’舉例而言，針對Cw色彩點之CRI 最小值為80 CRI(對應至2,600 K至3,700 K的CCT範圍）。該等LED封裝及/或LED可使用於標準及高電麗配置兩者。再者’本文描述的LED封裝可使用於其他一般性照明 31 201251132 領域中，例如管照明裝置或條帶照明裝置。舉例而言，如於第11圖t所示，照明裝置300可包括管3〇2及㈣封穿 LED封裝310相似於參照第！圖至第4圖上狀LED封裝1G、11()，LED封裝可放置或附著於單一列中。LED封裝3iG可彼此整合或可分離地附著至基板如第11圖中所示，LED封裝31〇可適當地附著至驅動器PCB 3G6epcB 3G6可連接至適當的電性訊號處理及驅動11電路系統例如電性連接器3G8。管302可為大致上透光的或半透光的。在—些實施例中，管302 之-部份（LED封裝31G所面向），可為大致上透光的或半透光的，而| 3G2之—部份（PCB 3G4所面向）可為不透光的。列或條帶LED封裝310可***至管3〇2，管3〇2 可為較大、較小或相當於螢光照明燈管或CFL燈之尺寸，在此LED封裂以本領域中習知的方式可取代營光管照明。 LED封裝陣列亦可使用於照明裝置中。背光裝置可以在側（一列，沒有行）之上的條帶或陣列來作出。LED封裝陣列可使^背光裝置及其他照明裝置中，舉例而言而非限制，如第12圖中所示。特別是，帛12圖圖示照明裝置330之前側330A之部份及背側33〇b之部份。該照明裝置330可使用於習知使用CFL燈或營光管的照明燈具$。因此’舉例而言’照明裝置330可取代CFL燈來使用。Each side wall: portions 30, 32 and each end wall portion 34, % may comprise a substantially straight upper edge, and each transition wall portion 39A to 39D may comprise a curved or W-upper upper edge, the curved or segmented The upper edge transitions from the upper edge of the side wall portions 3〇, 32 to the end wall portion 34, 36 j· H connects the working edge 7A and 7B to illustrate the LED package (eg led seal w and this article) The other packages described can have a schematic view of the cavity angle. The points in Figures 7A and 78 can include one or more cavities, or inclined wall portions 3, 32, 34, and/or 36. The staggered regions extending toward and interlacing the cavity bottom 70. In one aspect, one or more cavities can be included in the cavity angle measured between the walls of the reflector cavity 28. In one aspect, this article The cavity angle of the package described may include 9 Å or more. In another aspect, the cavity angle of the package described herein may comprise 9 〇 or less. + For example, Figure 7A illustrates A portion of the cavity bottom 70 disposed between the outer side end walls 24 and %. That is, Figure 7A illustrates a longer measurement L4 of the cavity bottom. For example, in one aspect, the cavity angle between the cavity end wall portions 34, 36 of the reflector cavity 28 is (10) 72, in one aspect, the cavity end of the reflector cavity 28 The angle of the cavity between the wall portions 3 and the angle of the cavity (measured between the end wall portions) may be at least approximately 70. or greater depending on the thickness τ of the LED package (see Figure 36). An optimized package with a thinner size may include a larger cavity angle. A larger cavity angle may allow the reflection level within the package to maintain or exceed the amount of reflected light. For example, the reflected light may maintain or exceed a similar package ^ 24 201251132 Existing brightness standards. As the cavity angle increases, the area under the point formed by the cavity wall and the cavity bottom can become so small that the viscous material cannot mold and form voids in the area. The larger area is provided below the cavity and the bottom of the cavity, and/or the edge of the point or the bottom of the cavity is displaced by at least a distance. The seal described herein can be reduced and/or eliminated. Pore. Figure 7B illustrates the space disposed between the outer side walls 2 and 22 The portion of the cavity bottom 70. That is, the figure shows the short width measurement W3 of the bottom 7 of the cavity. In one aspect, the cavity or inclined side wall portion of the reflector cavity 28 is 30 parts. Between the measurements) approximating, the cavity angle α between 32 (in the side wall portion 50 or greater', for example, approximately $1. In one aspect, the cavity side wall of the reflector cavity 28 The cavity angle α between the 3 〇 and Μ can be at least approximately 45. or greater, depending on the thickness T of the LEd package (see Figure 3B). Again, the thinner, thinner size optimized package can be used. Including a larger cavity angle, a larger cavity angle may allow the reflection level within the package to maintain or exceed the amount of reflected light such that the reflected light can maintain or exceed existing brightness standards. The transition wall portions 39A to 39D can be inclined at a relatively large average angle with respect to a plane perpendicular to the bottom of the reflector cavity. For example, Figure 8A provides a simplified schematic cross-sectional view of the body portion, the figure illustrating the angle 0 of the sidewall portion of the body portion relative to a plane perpendicular to the bottom of the body cavity, and Figure 8B provides A simplified schematic cross-sectional view of the body portion, and Figure 8B illustrates the angle φ of the end wall portion of the body portion of the 25 201251132 with respect to a plane perpendicular to the bottom of the body cavity. Similarly, the figure provides a simplified schematic cross-sectional view of the body portion, and FIG. 8C illustrates the angle of the transition wall portion relative to the plane perpendicular to the bottom of the body cavity. The angle 0 is less than approximately 2 5 . Or larger and inclined. In a further embodiment, the angle 0 can be at least approximately 30. Or at least approximately 35. . In some embodiments, each sidewall portion may have an angle Φ of at least approximately 30. And tilted. In a further embodiment, the angle Φ can be at least approximately 35» or at least approximately 4 〇. In some embodiments, the 2 transition wall portions can have an angle Ρ of at least approximately 35. In the tilted H step embodiment, the angle Ρ can be at least approximately 4G. Or at least approximately 45. . (d) The partial M, 32, end wall portions 34, 36 and transition wall portion 39A are at an angle greater than the angle normally employed by the solid state emitter. Although the side wall/end wall portion and the transition wall portion are illustrated as being angled from the bottom of the cavity to the upper edge of the package in Fig. 8a to the top view, in an alternative embodiment t' Any or more (or all) of the features of the segmented and/or curved cross section may be characterized as 'the wall extending from the bottom to the upper edge of the package is non-linear along at least a portion of the wall . If the walls are curved or segmented, the angle of inclination may correspond to the average angle of the curved or segmented wall, or the angle between the ends of the wall. Using alternating side wall portions 3(), 32/end wall portions, and transition wall portions to 39D maximizes the front volume of the reflector cavity μ relative to the formed upper surface 16, while When multiple emitters (e.g., multiple LEDs) are disposed in the cavity 28, they provide the desired diffused output beam characteristics. 26 201251132 In an embodiment of Figure 9, the LED package package 110 can include a housing ι 2 that can be loaded with a lead frame 1] U as described above. Thus, opposing component numbers indicate the same or similar components. The led package 110 can further include one or more LEDs. In the embodiment shown in FIG. 9, for example, the LED package 110 can include three lEDs 44, 46, 48' LEDs 44, 46, 48 that can emit red, green, and blue colors, respectively, such that when appropriate These LEDs produce a substantially full color range combination when grounded. The LED wafer can have a square or rectangular size. For example, a square-like LED wafer can have a height distribution 'this degree distribution is less than about o.ll mm, or in the range of approximately 009 pawl to approximately 0.11 mm' or less than approximately mm, or approximately 〇.〇 8 mm to approximately 〇.1〇mm. A square-like lED wafer may have a width distribution 'this width distribution is less than approximately 0.32 mm, or in the range of 0.265 mm to 0.315 mm. A square-like led wafer may have a width distribution 'this width distribution is less than approximately 038 mm, or in the range of approximately 0.33 mm to approximately 0.38 mm. A rectangular LED cymbal may have a two degree distribution that is less than approximately 0.13 mm, or approximately in the range of approximately 1 1 〇 mm to approximately 〇 13 mm. The rectangular LED wafer can have a width distribution that is less than approximately 0.28 mm j or in the range of approximately 0.20 mm to approximately 〇.28 mm. The rectangular LED haptics may have a width distribution 'this width distribution is less than approximately 0.36 mm, or in the range of approximately 0.28 mm to approximately 0.36 mm. As above, the bow tray 114 can include a conductive wafer carrier 50 and conductive connections 52, 54 and 56, and the conductive connections 52, 54 and 56 provide connection pads 27 201251132 72 74 and 76. Conductive wafer carrier 50 and conductive connections 52, 54 and 56 form leads 6A, 62, 64 and 66. The conductive wafer carrier 5A can have an upper surface 80 that includes a connection pad 68. Connection pads 68 can be exposed from peripherals 112. The connection pads 68 have opposite sides. One of the opposite sides is adjacent to the connection pads 74 and 76, which may be at least as long as the side of the cavity 128. The other side of the connection pad 68 is adjacent to the connection pad. The side length can be greater than approximately one-half the length of the adjacent side of the cavity 128. A plurality of LEDs can be disposed over the upper surface 80 of the conductive wafer carrier 5 . For example, in Figure 9, three leds 44, 妒 and 48 are disposed on the connection pads of the upper surface 8 。. The three LEDs are hoisted to emit different colors of light. For example, the LED 44 can Red light is emitted, LED 46 can emit green light, and LED 48 can emit blue light. Two or more of the LEDs can emit the same color, including white. For example, LED 44 and LED 46 can be both Each of the LEDs has a first electrical terminal and a second electrical terminal. The first electrical terminal can be referred to as an anode. For example, the first LED 44 can have an anode electrically coupled to the conductive connection The connection pad 74 of the portion 54. The second led 46 may have an anode electrically coupled to the connection pad 76 of the conductive connection portion 56. Similarly, the third LED 48 may have an anode electrically coupled to the conductive connection portion 52 connection pad 72. As above, the wafer carrier 50 also serves as a heat sink The heat dissipation from the plurality of LEDs can be as follows: the width is approximately 2〇5 microns to approximately 275 microns' and the length is approximately 285 microns to approximately 355 microns. In a uniform example, blue and green The LEd can have a width of approximately 28 microns of 201251132 and a length of approximately 3 20 microns. The thickness of the blue and green LEDs can vary from approximately 100 microns to approximately 1 30 microns, for example, approximately 115 microns. Red LEDs can have Various sizes. In some embodiments, the red LED can have a width and length of approximately 355 microns, but the width and length dimensions can vary from approximately 330 microns to approximately 380 microns. The thickness of the red LED can be in these embodiments. Approximately 70 microns to approximately 125 microns 'is, for example, approximately 1 〇〇 microns. In these embodiments, the red LED has bond pads ranging in size from approximately 90 microns to approximately 110 microns, for example, approximately 100 microns. ° In some embodiments, the red LED can have a width and length of approximately 290 microns, but the width and length can vary from approximately 256 microns to approximately 3 15 microns. The embodiments may be approximately 1 〇〇 micron, but the thickness may range from approximately 85 microns to approximately 11 5 microns. In these embodiments 'red LEDs may have sizes ranging from approximately 80 microns to approximately 1 〇〇. The micro-finished joint 塾, for example, is approximately 9 μm. Figure 10 is a schematic diagram showing one portion of the LED display screen, the LED display screen is generally designated as 200. For example, the LED display screen 200 can be indoors. Or an outdoor screen, including (in general terms) a driver printed circuit board (PCB) 202 'driver printed circuit board (PCB) 2〇2 loaded with a large number of LED packages 204 arranged in columns and rows, each LED package attached to or Integrated with the other LED packages 204 to form a single-screen. [ED package 204 can be electrically connected to traces or pads on PCB 2〇2. In some 29 201251132 embodiments, the PCB 202 can be connected to appropriate electrical signal processing and driver circuitry. By way of example, LED package 204 can include LED packages 10, 110 as described above. Each of the LED packages 204 can include a lead frame, and the outer casing is disposed over at least a portion of the 5 turns of the wire frame. The outer casing may have a reflector cavity in the outer casing, the reflector cavity forming a rectangular shaped opening around one or more of the LEDs 206 on the lead frame, and the reflector cavity having a circumference around the one or more LEDs The inclined end wall portion and the inclined side wall portion. As described above in the LED package 1〇, no, the angle of each end wall portion of the reflector cavity may be different from the angle of each side wall portion. As shown in the figures, each LED package 204 can have a plurality of LEDs 206 in each of the LED packages 204. For example, as described above, [Either each of the ED packages 204 can be loaded with a linear array of vertically oriented red, green, and blue LEDs 2〇6. The linear orientation of the LED improves color fidelity over a wide viewing angle range. Alternatively, a single LED can be provided in each LED package, as in package 1 from Figures i through 5. Each LED package 204 can define a halogen 210. The individual pixels 21' of the display may have a size of approximately 3.0 mm or less by approximately 35 mm or less. The LED package 204 may include, for example, those described above and illustrated in Figures 1 through 9. As noted above, LED package 204 can be electrically connected to traces or turns on PCB 2G2 that are interconnected to provide suitable electrical signal processing circuitry and driver circuitry (not shown). A through hole 208 may also be provided to allow for a better and shorter joint for attaching the plastic housing body to the pcB. The through hole 2〇8 is also 30 201251132 to allow for improved thermal runaway. (4) used in backlights or other panel display systems may include planar array configurations of red, green, and blue LED devices that are configured to emit light that appears to be white light in operation. The red, green, and blue LEDs can be sized to match the desired brightness and/or intensity balance. Any configuration of red, green and blue & coffee can be used. The (iv) package and/or LED of the metal-to-metal die attach method as described herein can be used in backlight systems and any suitable display panel system 200+. By way of example and not limitation, LED packages and/or LEDs used in backlight and display panel systems can provide up to I22 lumens of light output at 300 mA in cool white (cw) and warm white at 3 mA Provides up to 1 lumen of light output at the point. For example, the LED packages and/or LEDs disclosed herein can be used in lighting fixtures that include luminaires for use in display panel systems that provide a CRI minimum of 65 CRI for CW color points. The LED packages and/or LEDs disclosed herein can be used in lighting fixtures. These lighting fixtures include fixtures for use in display panel systems that provide cw color. The CRI minimum for points is 75 CRI (corresponding to 5,000 κ to 8,300). The CCT range of κ). The LED packages and/or LEDs disclosed herein for use in a display panel system may also provide 'for example, a CRI minimum for a Cw color point of 80 CRI (corresponding to a CCT range of 2,600 K to 3,700 K). These LED packages and/or LEDs can be used for both standard and high battery configurations. Furthermore, the LED packages described herein can be used in other general illuminations 31 201251132, such as tube lighting or strip lighting. For example, as shown in FIG. 11 t, the illumination device 300 can include the tube 3〇2 and (4) the encapsulation LED package 310 is similar to the reference! Figure 4 to Figure 4 above the LED package 1G, 11 (), LED package can be placed or attached to a single column. The LED packages 3iG can be integrated or detachably attached to the substrate as shown in Fig. 11, and the LED packages 31 can be properly attached to the driver PCB 3G6epcB 3G6 can be connected to appropriate electrical signal processing and drive 11 circuitry such as electricity Connector 3G8. Tube 302 can be substantially light transmissive or translucent. In some embodiments, a portion of the tube 302 (facing the LED package 31G) may be substantially transparent or semi-transmissive, and a portion of the 3G2 (facing the PCB 3G4) may be transparent. The column or strip LED package 310 can be inserted into the tube 3〇2, which can be larger, smaller or equivalent to the size of a fluorescent lighting tube or CFL lamp, where the LED is sealed in the art. The way of knowing can replace the lighting of the camp light. LED package arrays can also be used in lighting devices. The backlight can be made in strips or arrays on the side (one column, no rows). The LED package array can be used, for example and without limitation, in backlights and other illumination devices, as shown in Figure 12. In particular, Figure 12 illustrates a portion of the front side 330A and a portion of the back side 33〇b of the illumination device 330. The illumination device 330 can be used for conventional lighting fixtures that use CFL lamps or camp tubes. Thus, for example, the illumination device 330 can be used in place of a CFL lamp.

S 如第12圖中，照明裝置33〇可包括管332，管幻2具 32 201251132 有前側332A及背側332B。照明裝置330亦可包括設置於管332内的PCB 334及位於管332之任一側的電性連接器336。照明裝置330可進一步包括LED封裝340， LED封裝340相似於參照第1圖至第4圖如上述LED封裝10、110，LED封裝340可電性地且操作上附著至陣列342中的驅動器PCB 334。如第12圖中所示，陣列 342可呈棋盤狀圖案。該棋盤狀圖案陣列342可促進由照明裝置330產生均勻照明。如第12圖中所示，可附著LED封裝340之陣列342 使得該等LED封裝340面向管332之前側332 A。前側 332A可准許由LED封裝340之陣列342所產生的光照耀通過前側332A。舉例而言，前側332A可大致上為透光的或半透光的。當照明裝置330放置於照明燈具中，例如舉例而言習知容置CFL燈的照明燈具，管332之背側332A可面向照明燈具而管332之前側332A面朝外，使得由LED封裝340之陣列342所產生的光照耀朝外進入待照明的區域。在例如這些實施例中，管332之背側 332B可為不透光的。管332可為單式管使得管332之前側332A及背側332B為單一整合件。在該等實施例中，管332之背側332B可以大致上不透光材料來塗抹或塗佈。替代地，在某些實施例中，管332之前側332A及管332之背側332A可包括兩種不同的組件，該等組件可適配以形成管332。在某些實施例中，管332之背側332A可為大致上透s 33 201251132 光的或半透光的。在該等實施例中，具有咖 LED封裝障列之笛—可裝例如 :裝陣歹!之第一 PCB可設置於管中’使得 LL"32之背側’使得由—所產生的先’、、、耀通過背側332A。該等實施例可用於照明燈具中， ::希望光以相對的方向照耀，使得來自單—照明裝置，可以更廣範圍區域來照耀。舉例而言，該等昭明裝置可產生涵蓋於照明裝置之任一側上大的半徑及周邊部々的先輸出。以此方式，可產生大致上全光半徑。圖示於圖式中及上述的本揭示案之實施例為可於所附申凊專利範圍之範疇内所為的眾多實施例之示例。本文預期led封裝、系統之配置及相时法所明確揭k外的^配置。除了本文【圖式簡單說明】，申請標的之完整且可實施的揭示内容包含對於本領. 域热知技藝者而言之本申請標的之最佳實施模式，該揭不内容更特定地記載於說明書之其餘部份，包含參照所附圖式，其中：第1圖為圖示根據本文揭示的申請標的之發光二極體 (led)封裝之實施例的頂透視視圖；第2圖為圖示根據第i圖的該LED封裝之實施例的頂平面視圖；第3A圖為圖示該LED封裝之實施例沿著第2圖的 3A 3A線的橫截面視圖；S As in Fig. 12, the illumination device 33A may include a tube 332 having a front side 332A and a back side 332B. Illumination device 330 can also include a PCB 334 disposed within tube 332 and an electrical connector 336 located on either side of tube 332. The illumination device 330 can further include an LED package 340 that is similar to the LED packages 10, 110 described above with reference to Figures 1 through 4, which can be electrically and operatively attached to the driver PCB 334 in the array 342. . As shown in Fig. 12, the array 342 may have a checkerboard pattern. The checkerboard pattern array 342 can facilitate uniform illumination produced by the illumination device 330. As shown in FIG. 12, the array 342 of LED packages 340 can be attached such that the LED packages 340 face the front side 332A of the tube 332. The front side 332A may permit illumination from the array 342 of LED packages 340 to pass through the front side 332A. For example, front side 332A can be substantially translucent or semi-transmissive. When the illumination device 330 is placed in a lighting fixture, such as, for example, a lighting fixture that accommodates a CFL lamp, the back side 332A of the tube 332 can face the lighting fixture and the front side 332A of the tube 332 face outwardly such that the array 342 of the LED package 340 The resulting light flares outward into the area to be illuminated. In such embodiments, for example, the back side 332B of the tube 332 can be opaque. Tube 332 can be a single tube such that front side 332A and back side 332B of tube 332 are a single integrated piece. In such embodiments, the back side 332B of the tube 332 can be applied or coated with a substantially opaque material. Alternatively, in some embodiments, the front side 332A of the tube 332 and the back side 332A of the tube 332 can comprise two different components that can be adapted to form the tube 332. In some embodiments, the back side 332A of the tube 332 can be substantially s 33 201251132 light or semi-transmissive. In these embodiments, a flute having a coffee LED package barrier can be mounted, for example, with a front panel! The first PCB can be placed in the tube 'so that the back side of the LL" 32 is caused by the first , , , and Yao pass through the back side 332A. These embodiments can be used in lighting fixtures. :: It is desirable that the light shines in opposite directions so that it can be illuminated from a single-illumination device over a wider range of areas. For example, such illumination devices can produce a prior output that includes a large radius and peripheral ridges on either side of the illumination device. In this way, a substantially full light radius can be produced. The embodiments illustrated in the drawings and described above are examples of numerous embodiments that are within the scope of the appended claims. This article expects that the LED package, the configuration of the system, and the phase-time method clearly reveal the configuration of the ^. Except for the following description of the drawings, the complete and implementable disclosure of the subject matter of the application includes the best mode of implementation of the subject matter of the subject of the prior art, which is more specifically described in the specification. The rest of the drawings, including referenced drawings, wherein: FIG. 1 is a top perspective view illustrating an embodiment of a light emitting diode package according to the application of the present disclosure; a top plan view of the embodiment of the LED package of Fig. i; Fig. 3A is a cross-sectional view showing the embodiment of the LED package taken along line 3A 3A of Fig. 2;

S 34 201251132 第3B圖為圖示該LED封裝之實施例沿著第2圖的 3B-3B線的橫截面視圖；第4圖為圖示根據第！圖的該LED封裝之實施例的底透視圖；第5圖為圖示根據一個實施例之引線架的透視圖，該引線架可使用於根據本文申請標的之LED封裝中；第6圖為圖示根據本文揭示的申請標的之led封裝之另一實施例的頂平面視圖；第7A圖及第7B圖為圖示根據本文揭示的申請標的之 LED封裝之貫施例之一部份的橫截面側視圖；第8A圖至第8C圖為圖示根據本文揭示的申請標的之 LED封裝之貫施例之部份的橫截面示意側視圖；第9圖為圖示根據本文申請標的之LED封裝之進一牛實施例的頂平面視圖；第1 0圖為圖示使用根據本文申請標的之LED封裝之實施例的顯示螢幕之實施例的頂平面視圖；第π圖為圖示使用根據本文申請標的之led封事之實施例的照明裝置之實施例的部份橫截面側視圖；第12圖為圖示使用根據本文申請標的之[ED封事之實施例的照明裝置之另一實施例的頂透視視圖。、【主要元件符號說明】 1 寬度 2 長度 10 發光二極體封裝 12 外殼 201251132 12A 主體部份 12B 13 主體 14 16 第主表面/上部表18 面/上部主表面 20 側表面/外部側邊壁倒22 24 端表面/外部側端壁 26 28 反射體凹口 /反射體3〇空腔 32 傾斜側壁部份 34 36 傾斜端壁部份 39A 39B 過渡壁部份 39C 39D 過渡壁部份 40 40A 導線 40B 44 LED 46 48 LED 50 52 第一導電連接部 54 56 第三導電連接部 58 60 引線 62 64 引線 66 68 連接墊 70 72 連接墊 74 76 連接墊 80 上部表面 82 84S 34 201251132 FIG. 3B is a cross-sectional view showing the embodiment of the LED package taken along line 3B-3B of FIG. 2; FIG. 4 is a diagram according to the first! A bottom perspective view of an embodiment of the LED package of the figure; FIG. 5 is a perspective view illustrating a lead frame according to an embodiment, which may be used in an LED package according to the subject matter of the application; FIG. A top plan view of another embodiment of a led package in accordance with the subject matter disclosed herein; FIGS. 7A and 7B are cross-sectional views illustrating a portion of a portion of a LED package in accordance with the disclosed subject matter. 8A through 8C are cross-sectional schematic side views illustrating portions of an embodiment of an LED package in accordance with the subject matter disclosed herein; FIG. 9 is a diagram illustrating an LED package in accordance with the subject matter herein A top plan view of an embodiment of a cow; FIG. 10 is a top plan view illustrating an embodiment of a display screen using an embodiment of an LED package in accordance with the subject matter of the present application; A partial cross-sectional side view of an embodiment of a lighting device of an embodiment of the LED package; FIG. 12 is a top perspective view illustrating another embodiment of a lighting device using an embodiment of the ED package according to the application herein Fig. [Main component symbol description] 1 Width 2 Length 10 LED package 12 Housing 201251132 12A Main body part 12B 13 Main body 14 16 Main surface/Upper surface 18 Surface/Upper main surface 20 Side surface/External side wall 22 24 end surface / outer side end wall 26 28 reflector notch / reflector 3 〇 cavity 32 sloping side wall portion 34 36 slanted end wall portion 39A 39B transition wall portion 39C 39D transition wall portion 40 40A wire 40B 44 LED 46 48 LED 50 52 First Conductive Connection 54 56 Third Conductive Connection 58 60 Lead 62 64 Lead 66 68 Connection Pad 70 72 Connection Pad 74 76 Connection Pad 80 Upper Surface 82 84

S 主體部份 Μ線架第-主表面/下部表面/下部主表面侧表面/外部侧邊側壁端表面/外部側端壁傾斜侧壁部份S Main part Crimping frame First-main surface/lower surface/lower main surface Side surface/external side side Wall End surface/External side end wall Slanted side wall part

傾斜端壁部份過渡壁部份過渡壁部份 LED 導線 LED 導電晶片載體第二導電連接部中心區域引線引線空腔底連接墊上部表面上部表面 36 201251132 86 上部表面 90 下部表面 92 下部表面 94 下部表面 96 下部表面 98 間隙 110 LED封裝 112 外殼 114 引線架 128 空腔 200 LED顯示螢幕/顯示 202 驅動器印刷電路板面板系統 (PCB) 204 LED封裝 206 LED 208 貫穿孔 210 畫素 300 照明裝置 302 管 306 驅動器PCB 308 電性連接器 310 LED封裝 330 照明裝置 330A 前側 330B 背側 332 管 332A 前側 332B 背側 334 PCB 336 電性連接器 340 LED封裝 342 陣列 E 封裝材料 L 長度 L1 整體封裝之長度 L2 封裝主體之長度 L3 於主體之上部表面處測量的反射體空腔之長度 L4 空腔底之長度 L5 設置於反射體空腔Inclined end wall part transition wall part transition wall part LED wire LED conductive wafer carrier second conductive connection center area lead wire cavity bottom connection pad upper surface upper surface 36 201251132 86 upper surface 90 lower surface 92 lower surface 94 lower part Surface 96 Lower Surface 98 Gap 110 LED Package 112 Housing 114 Lead Frame 128 Cavity 200 LED Display Screen / Display 202 Driver Printed Circuit Board Panel System (PCB) 204 LED Package 206 LED 208 Through Hole 210 Pixel 300 Lighting Device 302 Tube 306 Driver PCB 308 Electrical Connector 310 LED Package 330 Lighting Device 330A Front Side 330B Back Side 332 Tube 332A Front Side 332B Back Side 334 PCB 336 Electrical Connector 340 LED Package 342 Array E Package Material L Length L1 Overall Package Length L2 Package Body The length L3 is the length of the reflector cavity measured at the upper surface of the body L4 The length L5 of the cavity bottom is set in the reflector cavity

S 外側的主體之上部表面之長度 37 201251132 L6 角落長度 Ρ 點 T 封裝之整體厚度 W 寬度 W1 整體封裝主體之寬度 W2 於主體之處測量的腔之寬度 W3 空腔底之寬度 Wae 傾斜端壁度 Was 傾斜側壁部份的長度 a 空腔角度 β 空腔角度 θ 主體部份份之角度 Ρ 過渡壁部份之角度 Ψ 主體部份份之角度上部表面反射體空部份的長之側壁部之端壁部 38S The length of the upper surface of the outer body of the outer body 37 201251132 L6 Corner length Ρ Point T The overall thickness of the package W Width W1 The width of the overall package body W2 The width of the cavity measured at the body W3 The width of the cavity bottom Wae The slant end wall Was the length of the inclined side wall portion a cavity angle β cavity angle θ the angle of the main body part Ψ the angle of the transition wall portion 角度 the angle of the main body portion the end of the long side wall portion of the upper surface reflector body Wall 38

Claims

201251132 七、申請專利範圍： 1. 一種用於一發光二極體（LED)之封裝，該封裝包括：一引線架，該引線架包括一導電晶片载體，該導電晶片載體包括一上部表面，該上部表面用於附著一或更多 LED ; 一外殼，該外殼覆蓋該引線架之至少—部份；以及一反射體空腔，該反射體空腔至少部份設置於該外殼内，該空腔具有傾斜側壁部份及傾斜端壁部份，該等傾斜側壁部份及傾斜端壁部份圍繞該晶片載體:該二部表面之至少—部份，該等側壁部份所延伸之一角度不同於該等端壁部份所延伸之一角度。 .如。月求項1所述之封襄，其中該引線架經彎折且包括 J於近似〇·5 mm的一厚度分佈。人月长項1所述之封裝，其中該引線架經彎折且包括 ;丨於近似0.42 mm至近似〇 48删的一厚度分佈。 1所述之封裝，其中該封裝之—下部表面與、之上部表面之間的一高度距離小於近似2.〇 4所述之封裝，其中該高度距離從近似1.7 39 201251132 mm至近似2.0 mm。 • 6。如凊求項1所述之封裝，其中該高度距離近似19 mm 〇 .如請求項i所述之封裴，其中該外殼形成外部側壁及外部端壁，而該等外部側壁近似垂直於該等外部端壁。 8·如睛求項7所述之封裝，其中於該封裝之外部側壁之間所測量的該封裝之—寬度距離小於近似3〇 _。 ’如明求$ 8所述之封裝’其中該寬度距離介於近似 2’7mm 至近似 3.0 mm。 1〇.如請求項8所述之封裝，其中該寬度距離近似28 mm ° 11.如請求項7所述之封裝端壁之間所測量的該LED 3·5 mm 〇 ’其中於該LED封裝之外部封裝之一長度距離小於近似〇，如請求項丨丨所述之封裝，装，、宁該長度距離介於近似 3·〇 mm 至近似 3 5 mm。 40 1 201251132 13·如明求項12所述之封裝，其中該長度距離近似 14. 如明求項丨所述之封裝，其中該反射體空腔之該等傾斜側壁部份及傾斜端壁部份具有設置於該等傾斜侧壁部份及傾斜端壁部份間的過渡壁部份。 15. 如請求項ι4所述之封裝，其中該等過渡壁部份係沿著至少一個角度來設置，該角度不同於該等側壁之該角度及該等端壁之該角度。 16·如請求項15所述之封裝，其中該等過渡壁部份之該角度大於該等側壁之該角度及該等端壁之該角度。 17.如請求項1所述之封裝，其中該反射體空腔之該等傾斜側壁部份係沿著近似50。或更大的一角度設置。 18·如請求項17所述之封裝，其中該反射體空腔之該等傾斜端壁部份係沿著近似7 0。或更大的一角度設置。 19.—種發光二極體（LED)封裝’包括： —引線架，該引線架包括一導電晶片載體，該導電晶片載體包括一上部表面；至少一個LED位於該導電晶片載體之該上部表面s 41 201251132 之上；一外殼，該外殼設置於該引線架之至少一部份之上且覆蓋該引線架之該至少一部份；一反射體空腔’該反射體空腔位於該外殼内，該空腔具有圍繞該LED的傾斜側壁部份及傾斜端壁部份，該反射體空腔之該等傾斜側壁部份係沿著近似50。或更大的一角度設置’且該反射體空腔之該等傾斜端壁部份係沿著近似7 0 °或更大的一角度設置；以及 s玄LED封裝具有於該LED封裝之外部側壁之間所測量的一寬度距離，該寬度距離小於近似3〇mm，且該 LED封裝具有於該LED封裝之外部端壁之間所測量的一長度距離，該長度距離小於近似3 5 mm。 20. -種提供—發光裝置之方法，該方法包括以下步驟：提供-引線架’該引線架包括一導電晶片载體，該導電晶片載體包括一上部表面；、固定-外殼’該外殼覆蓋該引線架之至少一部份；以及該外殼圍繞該上部有傾斜側壁部份及斜之一角度不同於形成—反射體空腔於該外殼内，表面之至少1份，該反射體空腔具傾斜端壁部f分’而該等側壁部份所傾該等端壁部份所傾斜之一角度。 21 請求項20所述之方法，進—步包括以下步驟設 S 42 201251132 置一 LED於該導電晶片载體之該上部表面上。 22. 如請求項20所述之方法，其中該引線架經彎折且包括小於近似〇。5 mm的一厚度分佈。 23. 如請求項2〇所述之方法，其中該led封裝之一下部表面與該LED封裝之一上部表面之間的—高度距離小於近似2 · 〇。 24. 如請求項20所述之方法’其中該外殼形成外部側壁及外部端壁，而該等外部側壁近似垂直於該等外部端壁。 25·如請求項24所述之方法，其中於該LED封裝之外部側壁之間所測量的該LED封裝之一寬度距離小於近似 3·〇 mm。 26.如請求項24所述之方法，其中於該LED封裝之外部端壁之間所測量的該LED封裝之一長度距離小於近似 3.5 mm。 27.如請求項20所述之方法’其中該反射體空腔之該等傾斜側壁部份及傾斜端壁部份具有設置於該等傾斜側壁部份及傾斜端壁部份間的過渡壁部份。 S 43 201251132 28. 如請求項27所述之方法9其中沿著一角度來設置該等過渡壁部份，該角度不同於該等側壁之該角度及該等端壁之該角度。 29. 如請求項28所述之方法，其中該等過渡壁部份之該角度大於該等側壁之該角度及該等端壁之該角度。 30·如請求項20所述之方法，其中該反射體空腔之該等傾斜侧壁部份係沿著一角度設置’該角度不同於該反射體空腔之該等端壁部份之一角度。 3 1.如請求項30所述之方法，其中該等端壁部份之該角度近似70°或更多。 32. 如請求項3〇所述之方法，其中該等側壁部份之該角度近似5 0 °或更多。 33. —種發光二極體（L]ED)顯示器，包括：一印刷電路板（PCB);以及一 LED封裝之陣列，該等LED封裝係以垂直行及水平列來排列且電性連接至該PCB，該等LED封裝中之各者包括：一弓丨線架，該引線架包括一導電晶片載體，該導電晶片載體包括一上部表面； 44 201251132 一 LED ’該LED位於該導電晶片載體之該上部表面之上；一外殼，該外殼設置於該引線架之上且覆蓋該引線架之至少一部份；以及一反射體空腔於該外殼内’該外殼具有圍繞兮 LED的傾斜側壁部份及傾斜端壁部份，該等側壁部份所延伸之一角度不同於該等端壁部份所延伸之一角度。 34. —種發光二極體（LED)背光裝置，包括：一印刷電路板（PCB);以及一 LED封裝之陣列，該等LED封裝係以垂直行及水平列來排列且電性連接至該PCB，該等LED封裝中之各者包括：一引線架，該引線架包括一導電晶片載體，該導電晶片載體包括一上部表面；一 LED ’該LED位於該導電晶片載體之該上部表面之上；一外殼’該外殼設置於該引線架之上且覆蓋該引線架之至少一部份；以及一反射體空腔於該外殼内，該外殼具有圍繞該 LED的傾斜側壁部份及傾斜端壁部份，該等側壁部份所延伸之一角度不同於該等端壁部份所延伸之一角度。 35. 如請求項34所述之LED背光裝置，其中該等垂直玉 45 201251132 行及水平列係呈一棋盤狀圖案β 36. —種發光二極體（led)照明裝置，包括·· 一印刷電路板（PCB);以及一 LED封裝之條帶，該等LED封裝係以一列來排列且電性連接至該PCB，該等LED封裝中之各者包括：一引線架，該引線架包括一導電晶片載體，該導電晶片載體包括一上部表面；一 LED ’該LED位於該導電晶片載體之該上部表面之上；一外殼’該外殼設置於該引線架之上且覆蓋該引線架之至少一部份；以及一反射體空腔於該外殼内，該外殼具有圍繞該 LED的傾斜側壁部份及傾斜端壁部份，該等側壁部份所延伸之一角度不同於該等端壁部份所延伸之一角度。 37.如請求項36或以上其他請求項中之任一請求項述之LED照明裝置’其中該等咖係排列於一管 rt? Λ 3 46201251132 VII. Patent Application Range: 1. A package for a light emitting diode (LED), the package comprising: a lead frame comprising a conductive wafer carrier, the conductive wafer carrier comprising an upper surface, The upper surface is for attaching one or more LEDs; an outer casing covering at least a portion of the lead frame; and a reflector cavity, the reflector cavity being at least partially disposed within the outer casing, the empty The cavity has a slanted sidewall portion and an inclined end wall portion, the slanted sidewall portion and the slanted end wall portion surrounding the wafer carrier: at least a portion of the two surfaces, an angle at which the sidewall portions extend Different from the angle at which the end wall portions extend. .Such as. The seal of claim 1, wherein the lead frame is bent and includes a thickness distribution of J of approximately 〇·5 mm. The package of claim 1, wherein the lead frame is bent and includes a thickness distribution of approximately 0.42 mm to approximately 删48. The package of claim 1, wherein a height distance between the lower surface and the upper surface of the package is less than a package of approximately 2. 〇 4, wherein the height distance is from approximately 1.7 39 201251132 mm to approximately 2.0 mm. • 6. The package of claim 1, wherein the height distance is approximately 19 mm. The package of claim i, wherein the outer casing forms an outer sidewall and an outer end wall, and the outer sidewalls are approximately perpendicular to the External end wall. 8. The package of claim 7, wherein the package-width distance measured between the outer sidewalls of the package is less than approximately 3 〇 _. 'As stated in the package of $8', wherein the width distance is between approximately 2'7 mm and approximately 3.0 mm. The package of claim 8, wherein the width distance is approximately 28 mm. 11. The LED is measured between the package end walls as recited in claim 7 and is included in the LED package. One of the outer packages has a length distance less than approximately 〇, as described in the claim 丨丨, the package, and the length distance is approximately 3·〇mm to approximately 3 5 mm. The package of claim 12, wherein the length distance is approximately 14. The package of the present invention, wherein the inclined side wall portion and the inclined end wall portion of the reflector cavity The partition has a transition wall portion disposed between the inclined side wall portions and the inclined end wall portions. 15. The package of claim 1-4, wherein the transition wall portions are disposed along at least one angle that is different from the angle of the sidewalls and the angle of the end walls. The package of claim 15 wherein the angle of the transition wall portions is greater than the angle of the sidewalls and the angle of the end walls. 17. The package of claim 1 wherein the sloped sidewall portions of the reflector cavity are along approximately 50. Or a larger angle setting. 18. The package of claim 17 wherein the inclined end wall portions of the reflector cavity are along approximately 70. Or a larger angle setting. 19. A light emitting diode (LED) package comprising: a lead frame comprising a conductive wafer carrier, the conductive wafer carrier comprising an upper surface; at least one LED being located on the upper surface of the conductive wafer carrier 41201251132; a casing disposed on at least a portion of the lead frame and covering the at least one portion of the lead frame; a reflector cavity in which the reflector cavity is located The cavity has an angled sidewall portion surrounding the LED and a sloped end wall portion, the sloped sidewall portions of the reflector cavity being approximately 50. Or a larger angle setting 'and the inclined end wall portions of the reflector cavity are disposed at an angle of approximately 70° or greater; and the s-shaped LED package has an outer sidewall of the LED package A width distance measured between the width distances of less than approximately 3 mm, and the LED package having a length distance measured between the outer end walls of the LED package, the length distance being less than approximately 35 mm. 20. A method of providing a light-emitting device, the method comprising the steps of: providing a lead frame comprising: a conductive wafer carrier, the conductive wafer carrier comprising an upper surface; and a mounting-shell At least a portion of the lead frame; and the outer casing has an inclined side wall portion at an angle different from the angle at which the reflector cavity is formed in the outer casing, at least one portion of the surface, the reflector cavity is inclined The end wall portion f is 'and the side wall portions are inclined at an angle to which the end wall portions are inclined. The method of claim 20, further comprising the step of: setting S 42 201251132 to place an LED on the upper surface of the conductive wafer carrier. 22. The method of claim 20, wherein the lead frame is bent and includes less than approximately 〇. A thickness distribution of 5 mm. 23. The method of claim 2, wherein a height distance between a lower surface of the LED package and an upper surface of the LED package is less than approximately 2 · 。. 24. The method of claim 20 wherein the outer casing forms an outer sidewall and an outer end wall, the outer sidewalls being approximately perpendicular to the outer end walls. The method of claim 24, wherein the width of one of the LED packages measured between the outer sidewalls of the LED package is less than approximately 3 mm. The method of claim 24, wherein a length of the LED package measured between the outer end walls of the LED package is less than approximately 3.5 mm. 27. The method of claim 20, wherein the inclined sidewall portions and the inclined end wall portions of the reflector cavity have transition walls disposed between the inclined sidewall portions and the inclined end wall portions Share. The method of claim 27, wherein the transition wall portions are disposed along an angle different from the angle of the sidewalls and the angle of the end walls. 29. The method of claim 28, wherein the angle of the transition wall portions is greater than the angle of the sidewalls and the angle of the end walls. The method of claim 20, wherein the inclined sidewall portions of the reflector cavity are disposed along an angle that is different from one of the end wall portions of the reflector cavity angle. 3. The method of claim 30, wherein the angle of the end wall portions is approximately 70° or more. 32. The method of claim 3, wherein the angle of the sidewall portions is approximately 50° or more. 33. A light-emitting diode (L]ED) display comprising: a printed circuit board (PCB); and an array of LED packages arranged in a vertical row and a horizontal column and electrically connected to The PCB, each of the LED packages comprises: a bow and wire frame, the lead frame comprising a conductive wafer carrier, the conductive wafer carrier comprising an upper surface; 44 201251132 an LED 'the LED is located on the conductive wafer carrier Above the upper surface; an outer casing disposed on the lead frame and covering at least a portion of the lead frame; and a reflector cavity in the outer casing. the outer casing has an inclined side wall portion surrounding the 兮LED And the inclined end wall portion, the one of the side wall portions extending at an angle different from the angle at which the end wall portions extend. 34. A light-emitting diode (LED) backlight device comprising: a printed circuit board (PCB); and an array of LED packages arranged in a vertical row and a horizontal column and electrically connected to the LED package a PCB, each of the LED packages comprising: a lead frame comprising a conductive wafer carrier, the conductive wafer carrier including an upper surface; an LED 'on the upper surface of the conductive wafer carrier An outer casing 'the outer casing is disposed on the lead frame and covering at least a portion of the lead frame; and a reflector cavity in the outer casing, the outer casing having an inclined side wall portion and an inclined end wall surrounding the LED In part, the one of the side wall portions extends at an angle different from an angle at which the end wall portions extend. The LED backlight device of claim 34, wherein the vertical jade 45 201251132 rows and horizontal columns are in a checkerboard pattern β 36. A light-emitting diode (LED) illumination device, including a printing a circuit board (PCB); and a strip of LED packages arranged in a row and electrically connected to the PCB, each of the LED packages comprising: a lead frame, the lead frame including a lead frame a conductive wafer carrier comprising an upper surface; an LED 'on the upper surface of the conductive wafer carrier; an outer casing' disposed on the lead frame and covering at least one of the lead frames a portion; and a reflector cavity in the outer casing, the outer casing having an inclined side wall portion and an inclined end wall portion surrounding the LED, the side wall portions extending at an angle different from the end wall portions One of the angles extended. 37. An LED lighting device as claimed in any of claims 36 or above, wherein the coffee machines are arranged in a tube rt? Λ 3 46