201246635 六、發明說明： 【發明所屬之技術領域】 本發明係關於具光致發光波長轉換之低成本以固態為基 礎之發光裝置及其之製造方法。更特定言之（但不獨佔式 地）’本發明之實施例係關於利用磷光體材料以藉由光致 發光程序執行波長轉換之以LED(發光二極體）為基礎之裝 置。本發明進一步係關於一種製造光致發光波長轉換組件 之方法。 本申請案主張以下申請案之優先權益：Yuan等人在2011 年12月13日申請之名為「具光致發光波長轉換之低成本固 態發光裝置及其之製造方法（Low-Cost Solid-State Light Emitting Devices with Photoluminescent Wavelength Conversion and Their Method of Manufacture)」的美國專 利申請案第13/324,309號’及Yuan等人在2010年12月17曰 申請之名為「具磷光體波長轉換之低成本以發光二極體 (LED)為基礎之發光裝置及其之製造方法（L〇w_c〇st LEd_ Based Light Emitting Devices with Phosphor Wavelength Conversion and their Method of Manufacture)」的美國臨時 專利申請案第61/424,589號，該等申請案之說明書及圖式 之全文係以引用的方式併入本文中。 【先前技術】 白色發光LED(「白色LED」）為吾人所知，且為相對新 近的創新。直至已開發在電磁光譜之藍色/紫外線部分中 發射之LED才使基於LED而開發白色光源變得實務。如（例 160926.doc 201246635 如）US 5,998,925中所教示’白色LED包括吸收藉由LED發 射之輻射之部分且再發射不同色彩（波長）之光的一或多種 磷光體材料（其為光致發光材料通常，LED晶片或晶粒 產生藍色光，且磷光體吸收藍色光之百分率且再發射黃色 光，或綠色光與紅色光、綠色光與黃色光、綠色光與橙色 光或黃色光與紅色光之組合。與藉由磷光體發射之光組合 的未被磷光體材料吸收之藉由LED產生之藍色光之部分提 供對於眼睛看來像是幾乎白色之光。 歸因於高亮度白色LED之長操作預期壽命（>5〇,〇〇〇小時） 及高發光效率（70流明/瓦特及更高），高亮度白色lED正曰 益用以替換習知螢光光源、緻密螢光光源及白熾光源。 圖1中展示典型白色LED 10之實例，且典型白色LED 1〇 包含收容於封裝14内之數個藍色發光GaN(氮化鎵）led晶 片U。可（例如）包含低溫共燒陶瓷（1〇w fired ceramic, LTCC)或高溫聚合物之封裝14包含上部本體 部件16及下部本體部件18。上部本體部件“界定經組態以 收納一或多個LED晶片12之數個凹座2〇(常常為圓形形 狀）。封裝14進一步包含亦在凹座2〇之底板上界定對應電 極接觸焊塾26、28之電連接器22、2[在使用黏接劑或焊 接的情況下，LED晶片12安裝至凹座2〇之底板。咖晶片 之電極焊墊係使用接合導線3〇、32而在封裝之底板上電連 接至對應電極接觸焊墊26、28，且凹座2〇中每一者經完全 地填充有透明聚合物材料34(通常為聚石夕氧），透明聚人物 材料Μ經裝載有粉末狀磷光體材料，使得led晶片η之曝 160926.doc 201246635 露表面係藉由磷光體/聚合物材料混合物覆蓋。為了增強 裝置之發射亮度’凹座之壁傾斜且具有反光表面。 雖然此等裝置提供良好效能’但該等裝置之成本使其對 於諸如一般照明之許多應用太昂貴^需要相比於先前技術 解決方案製造起來較不昂貴的具磷光體波長轉換之以LED 為基礎之發光裝置。 【發明内容】 本發明之實施例係關於以固態之基礎之發光裝置，該發 光裝置包含安裝於一基板（諸如，一印刷電路板）上之複數 個固態光發射器（通常為L E D)。該等光發射器經組態為一 已知陣列，諸如，一線性陣列、一矩形陣列、一正方形陣 列、一種六邊形陣列或一圓形陣列。該等裝置進一步包含 一分離光致發光波長轉換組件，該分離光致發光波長轉換 組件定位於該基板上且可操作以藉由將藉由該等固態發射 器發射之光之至少一比例轉換成一不同波長（色彩）之光而 提供一所要發射色彩。該波長轉換組件包含一透光載體， 該透光载體具有經定位以致上覆該等光發射器中之一各別 光發射器的光致發光材料之一各別區域。 根據本發明，藉由將光致發光材料區域之圖案印刷（較 佳地，篩網印刷）至該透光載體之一表面上來製造該波長 轉換組件。當篩網印刷該光致發光材料時，該透光載體通 常包含一實質平面透光材料薄片。本發明之實施例在該光 致發光材料包含一磷光體材料的情況下得到特定應用。然 而’本發明適用於其他類型之光致發光材料，諸如，量子 160926.doc 201246635 點。一量子點為激子在所有三個空間維度上受到限制之物 質（例如，半導體）之一部分，該物質可藉由輻射能量激發 以發射一特定波長或波長範圍之光。光致發光產生光之波 長係藉由該量子點之實體大小判定。 在該光致發光材料包含一磷光體材料的情況下，此磷光 體材料通常呈粉末形式且可與一透光液體黏合劑混合以形 成一漿料（「碗光體墨水（phosphor ink)」），該漿料接著作 為一圖案而被印刷至該透光載體上。本發明之一特定優點 為節省光致發光材料，此係因為僅在對應於一光發射器之 區域處提供光致發光材料。 在一配置中’該裝置包含具有一通孔陣列之一板，在該 等通孔中’每一孔與該等光發射器中之一者對應。該等孔 經組態成使得當該板安裝至該基板時，結合該基板之每一 孔界定收容該光發射器之一淺空腔。對於此等裝置，該波 長轉換組件可定位於該板上，使得每一光致發光材料區域 上覆且覆蓋一各別空腔開口。 在其他配置中，該波長轉換組件可包含一中空特徵（諸 如’圓頂狀殼層）陣列’該等中空特徵經組態成使得當該 波長轉換組件安裝至該基板時，每一中空特徵圍封且收容 該等光發射器中之一各別光發射器。在此等配置中，磷光 體區域提供於對應於一各別中空特徵之部位的部位處，通 常覆蓋内部凹形表面。此配置之一益處為：該光致發光材 料區域係與其關聯光發射器成間隔關係，該間隔關係為該 光致發光材料在該光發射器「遠端」。在遠端提供該光致 160926.doc 201246635 2材料可減少至該光致發光材料之熱轉移及該光致發光 材料之熱降解。根據本發明，可使用一熱塑性透光材料來 製造此波長組件。可將該光致發光材料區域陣列印刷至該 薄片之面上，且可接著加熱且真空模塑該薄片以形成該中 空特徵陣列。為了減少成本，較佳的是在單一材料薄片上 製作大數目個波長轉換組件，且接著將該薄片劃分成個別 波長轉換組件。 根據本發明之一態樣，一種製造一發光裝置之方法包 含：提供一基板及複數個固態光發射器；以一已知組態將 该等光發射器安裝且電連接於該基板上；提供一透光載 體；將至少一光致發光材料之一圖案篩網印刷至該載體之 一表面上，使得存在對應於該等光發射器中之一各別光發 射器的光致發光材料之一各別區域；將該載體定位於該基 板上，使得每一光致發光材料區域上覆該等光發射器中之 一各別光發射器。該基板可包含一金屬核心印刷電路板、 一阻燃劑印刷電路板或一陶瓷電路板。有利地，該等光發 射器經組態為一線性陣列、一正方形陣列、一矩形陣列、 一種六邊形陣列或一圓形陣列。 在本發明之一實施例中，該方法進一步包含：提供具有 一通孔陣列之一板，且其中該通孔陣列對應於已知光發射 器陣列；將該板定位於該基板上，使得每一光發射器收容 於一各別通孔内；及將該載體定位於該板上，使得每一光 致發光材料區域上覆該等通孔中之一各別通孔。該板較佳 地包含用以防止光自該裝置逸出之一不透明材料，且可包 I60926.doc 201246635 s印刷電路板、一玻璃纖維加強型板、一陶瓷板、一金 屬板或一塑膠材料。該透光載體可包含透光聚合物，諸 如，聚碳酸酯、丙烯酸類樹脂或聚對苯二甲酸伸乙酯或玻 璃。 在另外實施例中，该透光載體包含一可熱成型材料 (諸如’聚碳酸酯、丙烯酸類樹脂或聚對苯二曱酸伸乙 s曰），且該方法進一步包含：加熱且模塑該載體以致形成 一中空特徵陣列，該等中空特徵經組態成使得一各別特徵 對應於一各別光發射器且能夠收容一各別光發射器；及將 該載體安裝至該基板，使得每一光發射器收容於一中空特 徵内。模塑該等中空特徵會消除針對該板之需要且可減少 成本。較佳地，將該至少一光致發光材料之該等各別區域 印刷成使得當模塑該等特徵時，該光致發光材料實質上覆 蓋該特徵之内部表面。該等中空特徵可為圓頂狀、半球形 殼層狀、抛物面殼層狀或圓柱形殼層狀。 本發明之該方法可進一步包含使每一中空特徵填充有諸 如液體聚矽氧、丙烯酸類樹脂或環氧樹脂材料之一透光材 料。此材料提供該等光發射器之保護且辅助使來自該光發 射器之光耦合至該波長轉換組件中。可在將該波長轉換組 件安裝至該基板之前使該等中空特徵填充有透光黏接劑， 或在將該波長轉換組件安裝至該基板之後使該等中空特徵 填充有該透光黏接劑。為了輔助填充該等中空特徵及/或 實現過量材料之逸出’可將一或多個通道模塑至該組件 中。 160926.doc 201246635 據本發明之另一態樣，一種製造用於包含以一已知組 :安裝於基板上之複數個固態光發射器之一類型之一發 光裝置的一波長轉換組件的方法包含：提供一透光載體； 及將至）—光致發储料之—圖案篩網印刷至該載體之- 。“使彳于存在對應於該等光發射器中之一各別光發射 ° 光致發光材料之—各別區域。該透光載體可包含透光 聚。物諸如，聚碳酸酯、丙烯酸類樹脂或聚對苯二甲酸 伸乙酯或玻璃。 在該透光載體包含一可熱成型材料（諸如，聚碳酸酯、 丙稀酸類樹月曰或聚對苯二曱酸伸乙酯）的情況下，該方法 可進一步包含：加熱且真空模塑該載體以致形成一中空特 徵陣列’料中空特徵經組態成使得存在對應於—各別光 發射器之一各別特徵且每一特徵能夠收容一各別光發射 器。在一方法中，將該至少一光致發光材料之該等各別區 域印刷成使得當真空模塑該等特徵時，該光致發光材料實 質上覆蓋該特徵之内部表面。該等中空特徵可為圓頂狀、 半球形殼層狀'拋物面殼層狀或圓柱形殼層狀。 為了進一步減少製造成本’該方法有利地包含在一薄片 上製造複數個波長轉換組件且將該薄片劃分成分離組件。 經印刷光致發光材料區域之該圖案對應於該已知組態， 且可為一線性陣列、一正方形陣列、一矩形陣列、一種六 邊形陣列或一圓形陣列。 根據本發明之一另外態樣，一種發光裝置包含：一基 板；複麩個固態光發射器，其係以一已知組態安裝於該基 160926.doc •10- 201246635 板上且電連接至該基板；及一波長轉換組件，其包含至少 一光致發光材料，且可操作以吸收藉由該等光發射器發射 之光之一部分且發射一不同波長之光，其中該裝置之發射 產物包含藉由該等光發射器及該至少一光致發光材料產生 之光之一組合，且其中該波長轉換組件包含一透光載體， 該透光載體在該載體之一表面上具有該至少一光致發光材 料之一圖案且經組態成使得存在對應於該等光發射器中之 一各別光發射器的光致發光材料之一各別區域。該透光載 體可包含透光聚合物，諸如，聚碳酸酯、丙烯酸類樹脂或 聚對苯二甲酸伸乙醋或玻璃。 在一配置中，該裝置進一步包含具有一通孔陣列之一 板，該等通孔經組態為已知陣列且能夠收容一各別光發射 器，且其中該波長轉換組件安裝至該板，使得每一光致發 光材料區域上覆該等通孔中之一各別通孔。 或者，該波長轉換組件包含模塑於該載體中之一中空特 徵陣列，該等中空特徵經組態成使得一各別特徵對應於一 各別光發射器且能夠收容一各別光發射器。較佳地，在此 等組件中，該至少一光致發光材料之每一區域實質上覆蓋 一各別特徵之内部表面。該等中空特徵可為圓頂狀、半球 形殼層狀、拋物面殼層狀或圓柱形殼層狀。 該等固態光發射器可經組態為一線性陣列、一正方形陣 列、一矩形陣列、一種六邊形陣列或一圓形陣列。 取決於光發射器幾何形狀，該等光發射器可藉由導線接 合而電連接至該基板。或者，該等光發射器可使用覆晶接 160926.doc -I!- 201246635 合而安裝於該基板上且電連接至該基板。 該基板可包含一金屬核心印刷電路板、一阻燃劑印刷電 路板或一陶莞電路板。 【實施方式】 為了較好地理解本發明，現在將參看隨附圖式而僅藉由 實例來描述根據本發明之實施例的以固態為基礎之發光裝 置及其之製造方法。 貫穿本專利說明書，類似參考數字係用以表示類似部 件。 現在參看圖2、圖3及圖4來描述根據本發明之一實施例 的低成本以固態為基礎之發光裝置1〇〇，圖2、圖3及圖4分 別展示該裝置之部件的示意性平面圖、分解剖視圖及放大 剖視示意圖。裝置100可經組態以產生具有2700Κ之相關色 溫（correlated color temperature, CCT)之白色光。 如在圖3中最好地所見，裝置100包含由固態光引擎1〇2 及光致發光波長轉換組件104構成之總成》光引擎丨〇2包含 複數個以藍色（亦即，峰值波長=400 nm至480 nm)表面發 射InGaN/GaN(氮化銦鎵/氮化鎵）為基礎之LED晶片1 〇6， LED晶片106係以已知組態安裝於基板〗〇8(諸如，金屬核心 印刷電路板（MCPCB)-所謂機載晶片（chip 〇n board, COB) 配置）上。在其他配置中，預見到，基板包含諸如FR· 4(阻燃劑4)印刷電路板或陶瓷電路板之印刷電路板。如吾 人所知，MCPCB通常用於安裝產生大量熱且包含層化結 構之電組件，層化結構包含導熱基座〖1〇(通常為諸如鋁 160926.doc •12- 201246635 (A1)之金屬）’及非導電/導熱介電材料U2與導電軌跡 114(通常係由銅（Cu)製成）之交替層。介電層112極薄，使 得其可將熱自安裝於電軌跡上之組件傳導至基座11()。導 電轨跡114經組態以界定用於將電力電連接且提供至led 晶片106之陣列之電路。導電軌跡114可進一步界定導熱安 裝焊墊11 6 ’ LED晶片可使用導熱黏接劑或焊接而安裝於 導熱安裝焊墊116上。LED晶片106中每一者係藉由一對接 合導線118而電連接至導電軌跡^取決於Led晶片架構， LED晶片106可或者為接合至MCPCB 108之覆晶。 在圖2及圖3之例示性實施例中，LED晶片1 06經組態為 六個LED晶片106之線性陣列，且導電軌跡114經組態成使 得六個LED晶片106串聯地連接為一串。應瞭解，本發明 之裝置可包含其他LED晶片組態，諸如，正方形陣列、矩 形陣列、六邊形陣列或圓形陣列。 光致發光波長轉換組件104包含透光載體126，且可由諸 如聚碳酸酯、丙烯酸-聚（曱基丙烯酸曱酯χρΜΜΑ)或 PET(聚對苯二甲酸伸乙酯）之透光可熱成型塑膠（熱塑性）材 料製作。在圖2中，波長轉換組件1 〇4之右側部分經切掉以 顯露LED晶片1〇6及導電執跡114。如藉由圖2中之虛線所 指示’波長轉換組件1〇4具有對應於且實質上覆蓋基板108 之佔據面積。波長轉換組件104包含圓頂（大體上半球形）狀 殼層120之線性陣列，殼層12〇經組態成使得當該組件安裝 至基板108時’每一圓頂ι2〇上覆且圍封LED晶片106中之 一各別LED晶片。包含一或多個藍色光可激發光致發光材 160926.doc 201246635 料之光致發光波長轉換層丨22提供於每一圓頂12〇之内部凹 形表面之上。在操作中，光致發光波長轉換層122吸收藉 由其關聯LED晶片產生之藍色光之部分，且經由光致發光 程序而發射不同色彩（波長）（通常為黃綠色）之光。裝置之 發射產物包含藉由LED晶片產生之藍色光與藉由光致發光 轉換層122產生之光致發光之光的組合。通常，光致發光 材料經選擇成使得裝置之發射產物呈現白色。 光致發光材料可包含磷光體材料或量子點，量子點為激 子在所有三個空間維度上受到限制之物質（例如，半導體） 之部分，該物質可藉由輻射能量激發以發射特定波長或波 長範圍之光’該特定波長或波長範圍係藉由該量子點之實 體大小判定。因而，本發明不限於以磷光體為基礎之波長 轉換組件（除非如此主張）。 當光致發光材料包含磷光體時，其可包含無機或有機磷 光體，諸如，一般組合物心以⑴”心或^以⑴以彳之以矽 酸鹽為基礎之構光體’其中Si為石夕，〇為氧，a包含鎖 (Sr)、鋇（Ba)、鎂（Mg)或鈣（Ca)，且 D 包含氣（C1)、氟（F)、 氮（N)或硫（S)。以下專利中揭示以矽酸鹽為基礎之磷光體 之實例：美國專利US 7,575,697 B2「以矽酸鹽為基礎之綠 色填光體（Silicate-based green phosphors)」（已讓渡給 Intematix公司）、美國專利us 7,601，276 B2「二相以矽酸 鹽為基礎之黃色墙光體（Tw〇 phase silicate-based yellow phosphors)」（已讓渡給inteniatix公司）、美國專利us 7,655，156 B2「以矽酸鹽為基礎之橙色磷光體（siHcate_ 160926.doc •14- 201246635 based orange phosphors)」（已讓渡給Intematix公司），及美 國專利US 7,311，858 B2「以矽酸鹽為基礎之黃綠色磷光體 (Silicate-based yellow-green phosphors)」（已讓渡給 Intematix公司）。填光體亦可包含諸如在吾人共同申請之 專利申請案US 2006/0158090 A1「新穎以鋁酸鹽為基礎之 綠色麟光體（Novel aluminate-based green phosphors)」及 專利US 7,390,437 B2「以鋁酸鹽為基礎之藍色磷光體 (Aluminate-based blue phosphors)」（已讓渡給Intematix公 司）中所教示的以鋁酸鹽為基礎之材料、如在共同申請之 申請案US 2008/0111472 A1「以矽酸鋁為基礎之橙紅色鱗 光體（Aluminum-silicate orange-red phosphor)」中所教示 的矽酸鋁橙紅色磷光體’或諸如在吾人共同申請之美國專 利申請案US 2009/0283721 A1「以氮化物為基礎之紅色磷 光體（Nitride-based red phosphors)」及國際專利申請案w〇 2010/074963 A1「以氮化物為基礎之以RGB(紅色_綠色_藍 色）發紅色照明系統（Nitride-based red-emitting in RGB (red-green-blue) lighting systems)」中所教示的以氮化物 為基礎之紅色破光體材料。應瞭解，麟光體材料不限於所 描述實例’且可包含包括氮化物及/或硫酸鹽磷光體材 料、氮氧化物及硫酸氧碟光體或石榴石材料（YAG)之任何 嶙光體材料。 光致發光波長轉換組件104可使用透光黏接劑124(通常 為諸如丙烯酸類樹脂、聚矽氧或環氧樹脂之聚合物）而接 合至基板108。如圖4所指示且為了提供LED晶片1〇6及接 160926.doc 201246635 合導線118之保護，每一圓頂120可視情況經完全地填充有 諸如透光黏接劑124之透光材料。有利地，透光材料經選 擇成使得其折射率接近LED晶片106之折射率（在可實行 時）。舉例而言’ InGaN/GaN LED晶片之折射率為心2.4至 2.5 ’而高折射率聚矽氧具有折射率»因此，實 務上，聚合物材料124具有折射率^1.2。高折射率聚合物 之使用可藉由提供折射率匹配度來增加自LED晶片1 〇6之 光發射。 圖5展示根據本發明之一實施例之以lEd為基礎之發光 裝置的示意性平面圖及剖視圖。在此實施例中，三十六個 LED晶片106在MCPCB 108上經組態為正方形陣列（六列乘 六行）。根據本發明，光致發光波長轉換組件丨〇4包含圓頂 120之匹配陣列，圓頂120在其内部表面上包括光致發光材 料層。 根據本發明之發光裝置之製造 現在參看圖5a至圖5n來描述製造圖2、圖3及圖4之發光 裝置之方法。如上文所描述，本發明之發光裝置包含固態 光引擎102及光致發光波長轉換組件1〇4之總成，現在描述 其中每一者之製造方法。 固態光引擎之製造（圓5a及圖5c) 藉由（例如）焊接將LED晶片106安裝於基板1〇8上以作為 已知陣列（圖5a及圖LED晶片1〇6中每一者係藉由（例 如）導線接合118而電連接至基板1〇8。或者，LED晶片1〇6 可藉由覆晶接合而接合且電連接至基板。 160926.doc • 16 201246635 光致發光波長轉換組件之製造（囷5d至囷5k) 現在參看圖5d至圖5k來描述光致發光波長轉換組件1〇4 之製造方法。波長轉換組件104係作為呈諸如聚碳酸酯、 丙烯酸-聚（甲基丙烯酸甲酯）(PMMA)或PET(聚對苯二甲酸 伸乙酯）之透光可熱成型聚合物材料之薄片126之形式的透 光載體而開始其使用期限。合適材料之實例為General201246635 VI. Description of the Invention: [Technical Field] The present invention relates to a low-cost solid-state light-emitting device having photoluminescence wavelength conversion and a method of manufacturing the same. More specifically (but not exclusively), embodiments of the present invention relate to an LED (Light Emitting Diode) based device that utilizes a phosphor material to perform wavelength conversion by a photoluminescence process. The invention further relates to a method of fabricating a photoluminescent wavelength conversion component. The present application claims the priority of the following application: a low-cost solid-state light-emitting device with photoluminescence wavelength conversion and its manufacturing method (Low-Cost Solid-State), which was applied by December et al. on December 13, 2011. Light Emitting Devices with Photoluminescent Wavelength Conversion and Their Method of Manufacture), US Patent Application No. 13/324,309, and Yuan et al., December 17, 2010, entitled "Low Cost of Phosphor Wavelength Conversion" U.S. Provisional Patent Application No. 61/424,589, the disclosure of which is incorporated herein by reference. The entire description of the application and the drawings are incorporated herein by reference. [Prior Art] White light-emitting LEDs ("white LEDs") are known to us and are relatively recent innovations. Until the LEDs that have been developed in the blue/ultraviolet portion of the electromagnetic spectrum have been developed, it has become practical to develop white light sources based on LEDs. The white LED includes one or more phosphor materials (which are photoluminescence) that absorb light from a portion of the radiation emitted by the LED and re-emit light of different colors (wavelengths) as taught in US Pat. No. 5,998,925. Materials Typically, LED chips or dies produce blue light, and the phosphor absorbs blue light and re-emits yellow light, or green and red, green and yellow, green and orange, or yellow and red. The combination of the blue light produced by the LED that is absorbed by the phosphor in combination with the light emitted by the phosphor provides light that appears to the eye to be almost white. Due to the length of the high brightness white LED Operating life expectancy (>5〇, 〇〇〇 hours) and high luminous efficiency (70 lumens/watt and higher), high-brightness white lED is used to replace conventional fluorescent sources, dense fluorescent sources and incandescent Light source. An example of a typical white LED 10 is shown in FIG. 1, and a typical white LED 1A includes a plurality of blue light-emitting GaN (gallium nitride) led wafers U housed within a package 14. This can, for example, include low temperatures. The fired ceramic (LTCC) or high temperature polymer package 14 includes an upper body component 16 and a lower body component 18. The upper body component "defines a plurality of recesses configured to receive one or more LED wafers 12 The housing is 2 turns (often circular). The package 14 further includes electrical connectors 22, 2 that also define corresponding electrode contact pads 26, 28 on the bottom plate of the recess 2 [in the case of adhesives or soldering) Next, the LED chip 12 is mounted to the bottom plate of the recess 2. The electrode pads of the coffee chip are electrically connected to the corresponding electrode contact pads 26, 28 on the bottom plate of the package using the bonding wires 3, 32, and the recess 2 Each of the crucibles is completely filled with a transparent polymer material 34 (usually poly-stone), and the transparent poly-material material is loaded with a powdered phosphor material to expose the exposed surface of the LED wafer 160926.doc 201246635 Covered by a phosphor/polymer material mixture. To enhance the emission brightness of the device, the wall of the recess is tilted and has a reflective surface. Although these devices provide good performance, the cost of such devices makes them suitable for general purposes such as Many of the applications are too expensive to require an LED-based illuminating device with phosphor wavelength conversion that is less expensive to manufacture than prior art solutions. SUMMARY OF THE INVENTION [0001] Embodiments of the present invention are based on solid state A light emitting device comprising a plurality of solid state light emitters (typically LEDs) mounted on a substrate, such as a printed circuit board. The light emitters are configured as a known array, such as a line Or a rectangular array, a square array, a hexagonal array or a circular array. The devices further comprise a separate photoluminescence wavelength conversion component, the separate photoluminescent wavelength conversion component being positioned on the substrate The operation is operable to provide a desired color to be emitted by converting at least a ratio of light emitted by the solid state emitters to light of a different wavelength (color). The wavelength conversion component includes a light transmissive carrier having respective regions of photoluminescent material positioned to overlie a respective one of the light emitters. According to the invention, the wavelength conversion component is fabricated by printing (preferably, screen printing) a pattern of photoluminescent material regions onto one of the surfaces of the light transmissive carrier. When the photoluminescent material is screen printed, the light transmissive carrier typically comprises a substantially planar sheet of light transmissive material. Embodiments of the invention find particular application where the photoluminescent material comprises a phosphor material. However, the present invention is applicable to other types of photoluminescent materials, such as Quantum 160926.doc 201246635. A quantum dot is a portion of a substance (e.g., a semiconductor) in which excitons are constrained in all three spatial dimensions, and the substance can be excited by radiant energy to emit light of a particular wavelength or range of wavelengths. The wavelength of light generated by photoluminescence is determined by the physical size of the quantum dot. Where the photoluminescent material comprises a phosphor material, the phosphor material is typically in powder form and can be mixed with a light transmissive liquid binder to form a slurry ("phosphor ink") The paste is printed as a pattern onto the light-transmissive carrier. A particular advantage of one of the present inventions is the savings in photoluminescent materials because the photoluminescent material is provided only at the regions corresponding to a light emitter. In one configuration, the device includes a plate having an array of vias in which each hole corresponds to one of the light emitters. The apertures are configured such that when the panel is mounted to the substrate, each aperture in conjunction with the substrate defines a shallow cavity that houses one of the light emitters. For such devices, the wavelength conversion component can be positioned on the panel such that each photoluminescent material region overlies and covers a respective cavity opening. In other configurations, the wavelength conversion component can include a hollow feature (such as a 'dome-shaped shell' array) that is configured such that when the wavelength conversion component is mounted to the substrate, each hollow feature Sealing and housing one of the light emitters. In such configurations, the phosphor regions are provided at locations corresponding to portions of a respective hollow feature, typically covering the inner concave surface. One benefit of this configuration is that the photoluminescent material region is in spaced relationship with its associated light emitter in a "distal" location of the photoluminescent material. Providing the photoreceptor at the distal end 160926.doc 201246635 2 material reduces thermal transfer to the photoluminescent material and thermal degradation of the photoluminescent material. In accordance with the present invention, a thermoplastic light transmissive material can be used to make the wavelength component. The photoluminescent material region can be printed onto the face of the sheet and the sheet can then be heated and vacuum molded to form the array of hollow features. To reduce cost, it is preferred to make a large number of wavelength conversion components on a single sheet of material and then divide the sheet into individual wavelength conversion components. According to one aspect of the invention, a method of fabricating a light emitting device includes: providing a substrate and a plurality of solid state light emitters; mounting and electrically connecting the light emitters to the substrate in a known configuration; a light transmissive carrier; screen printing one of the at least one photoluminescent material onto one surface of the carrier such that one of the photoluminescent materials corresponding to each of the light emitters Individual regions; the carrier is positioned on the substrate such that each photoluminescent material region overlies a respective one of the light emitters. The substrate may comprise a metal core printed circuit board, a flame retardant printed circuit board or a ceramic circuit board. Advantageously, the light emitters are configured as a linear array, a square array, a rectangular array, a hexagonal array or a circular array. In an embodiment of the invention, the method further comprises: providing a plate having an array of vias, and wherein the array of vias corresponds to a known array of light emitters; positioning the plate on the substrate such that each The light emitters are received in a respective through hole; and the carrier is positioned on the plate such that each of the photoluminescent material regions covers one of the through holes. The panel preferably includes an opaque material for preventing light from escaping from the device, and may comprise a printed circuit board, a fiberglass reinforced panel, a ceramic panel, a metal panel or a plastic material. . The light transmissive support may comprise a light transmissive polymer such as polycarbonate, acrylic or polyethylene terephthalate or glass. In another embodiment, the light transmissive support comprises a thermoformable material (such as 'polycarbonate, acrylic or poly(terephthalic acid)), and the method further comprises: heating and molding the The carrier is such that an array of hollow features is formed, the hollow features being configured such that a respective feature corresponds to a respective light emitter and is capable of housing a respective light emitter; and mounting the carrier to the substrate such that each A light emitter is housed within a hollow feature. Molding such hollow features eliminates the need for the board and reduces cost. Preferably, the respective regions of the at least one photoluminescent material are printed such that when the features are molded, the photoluminescent material substantially covers the interior surface of the feature. The hollow features may be dome-shaped, hemispherical shell-like, parabolic shell-like or cylindrical shell-like. The method of the present invention may further comprise filling each hollow feature with a light transmissive material such as a liquid polyoxyn, acrylic or epoxy material. This material provides protection for the light emitters and assists in coupling light from the light emitters into the wavelength conversion component. The hollow features may be filled with a light transmissive adhesive prior to mounting the wavelength conversion component to the substrate, or the hollow features may be filled with the light transmissive adhesive after the wavelength conversion component is mounted to the substrate . One or more channels may be molded into the assembly to assist in filling the hollow features and/or to achieve escape of excess material. 160926.doc 201246635 According to another aspect of the invention, a method of fabricating a wavelength conversion component for a light emitting device comprising one of a plurality of solid state light emitters mounted on a substrate comprises: Providing a light-transmissive carrier; and printing a pattern onto the carrier. "providing there is a separate region corresponding to one of the light emitters of the respective light emitters. The light transmissive carrier may comprise a light transmissive polymer such as polycarbonate or acrylic resin. Or polyethylene terephthalate ethyl or glass. In the case where the light transmissive support comprises a thermoformable material such as polycarbonate, acrylic acid, or polyethylene terephthalate The method may further comprise: heating and vacuum molding the carrier such that a hollow feature array 'material hollow feature is configured such that there is a respective feature corresponding to each of the individual light emitters and each feature is capable of receiving one Individual light emitters. In one method, the respective regions of the at least one photoluminescent material are printed such that when the features are vacuum molded, the photoluminescent material substantially covers the interior surface of the feature The hollow features may be dome-shaped, hemispherical shell-like 'parabolic shell layers or cylindrical shell layers. To further reduce manufacturing costs' the method advantageously comprises fabricating a plurality of wavelengths on a sheet Replacing the assembly and dividing the sheet into separate components. The pattern of printed photoluminescent material regions corresponds to the known configuration and may be a linear array, a square array, a rectangular array, a hexagonal array or A circular array. According to another aspect of the invention, a light emitting device comprises: a substrate; a complex bran solid state light emitter mounted to the substrate in a known configuration. 160926.doc • 10 - 201246635 And electrically coupled to the substrate; and a wavelength conversion component comprising at least one photoluminescent material and operable to absorb a portion of the light emitted by the light emitters and emit a different wavelength of light, wherein The emission product of the device comprises a combination of light generated by the light emitter and the at least one photoluminescent material, and wherein the wavelength conversion component comprises a light transmissive carrier on a surface of the carrier Having a pattern of one of the at least one photoluminescent material and configured such that there is a respective region of one of the photoluminescent materials corresponding to one of the respective light emitters The light transmissive support may comprise a light transmissive polymer such as polycarbonate, acrylic or polyethylene terephthalate or glass. In one configuration, the device further comprises a plate having an array of through holes, The vias are configured as a known array and are capable of housing a respective light emitter, and wherein the wavelength conversion component is mounted to the board such that each photoluminescent material region overlies one of the vias Alternatively, the wavelength conversion component includes an array of hollow features molded into the carrier, the hollow features being configured such that a respective feature corresponds to a respective light emitter and can accommodate a respective Preferably, in such an assembly, each of the at least one photoluminescent material substantially covers an inner surface of a respective feature. The hollow features may be dome-shaped, hemispherical shells The solid-state light emitters can be configured as a linear array, a square array, a rectangular array, a hexagonal array, or a circular array. Depending on the light emitter geometry, the light emitters can be electrically connected to the substrate by wire bonding. Alternatively, the light emitters can be mounted on the substrate and electrically connected to the substrate using flip chip bonding 160926.doc -I!- 201246635. The substrate may comprise a metal core printed circuit board, a flame retardant printed circuit board or a ceramic circuit board. [Embodiment] For a better understanding of the present invention, a solid-state light-emitting device and a method of manufacturing the same according to embodiments of the present invention will now be described by way of example only with reference to the accompanying drawings. Throughout the specification, like reference numerals are used to refer to the like. Referring now to Figures 2, 3 and 4, a low cost solid state based illumination device 1 is illustrated in accordance with an embodiment of the present invention. Figures 2, 3 and 4 show schematic representations of the components of the device, respectively. Plan view, sub-anatomy view and enlarged cross-sectional view. Device 100 can be configured to produce white light having a correlated color temperature (CCT) of 2700 Å. As best seen in FIG. 3, apparatus 100 includes an assembly of solid state light engine 1〇2 and photoluminescent wavelength conversion component 104. Light engine 丨〇2 includes a plurality of colors (ie, peak wavelengths). =400 nm to 480 nm) surface-emitting InGaN/GaN (Indium Gallium Nitride/GaN)-based LED wafer 1 〇6, LED wafer 106 is mounted on a substrate in a known configuration 〇8 (such as metal Core Printed Circuit Board (MCPCB) - the so-called chip 〇n board (COB) configuration. In other configurations, it is envisioned that the substrate comprises a printed circuit board such as a FR 4 (Flame Retardant 4) printed circuit board or ceramic circuit board. As we know, MCPCBs are commonly used to mount electrical components that generate a large amount of heat and contain a stratified structure that contains a thermally conductive pedestal [usually a metal such as aluminum 160926.doc •12- 201246635 (A1)) And alternating layers of non-conductive/thermally conductive dielectric material U2 and conductive traces 114 (typically made of copper (Cu)). Dielectric layer 112 is extremely thin so that it conducts heat from the components mounted on the electrical track to pedestal 11(). The conductive traces 114 are configured to define circuitry for electrically connecting and providing power to an array of led wafers 106. The conductive traces 114 can further define thermally conductive mounting pads. The LED wafer can be mounted to the thermally conductive mounting pads 116 using a thermally conductive adhesive or solder. Each of the LED wafers 106 is electrically connected to the conductive traces by a pair of bond wires 118. The LED wafers 106 may be either flip chip bonded to the MCPCB 108. In the exemplary embodiment of FIGS. 2 and 3, LED wafer 106 is configured as a linear array of six LED wafers 106, and conductive traces 114 are configured such that six LED wafers 106 are connected in series as a string . It will be appreciated that the apparatus of the present invention may include other LED wafer configurations, such as a square array, a rectangular array, a hexagonal array, or a circular array. The photoluminescence wavelength conversion component 104 comprises a light transmissive carrier 126 and may be made of a light transmissive thermoformable plastic such as polycarbonate, acrylic-poly(m-decyl acrylate) or PET (polyethylene terephthalate). (Thermoplastic) material is produced. In Fig. 2, the right portion of the wavelength conversion element 1 〇4 is cut away to reveal the LED chip 1〇6 and the conductive trace 114. As indicated by the dashed line in Fig. 2, the wavelength converting component 1?4 has an area corresponding to and substantially covering the substrate 108. The wavelength conversion component 104 includes a linear array of dome (substantially hemispherical) shell layers 120 that are configured such that when the component is mounted to the substrate 108, each dome is overlaid and encloses the LED One of the individual LED chips in the wafer 106. A photoluminescence wavelength converting layer 22 comprising one or more blue light-excitable photoluminescent materials is provided over the inner concave surface of each of the domes 12 。. In operation, photoluminescent wavelength conversion layer 122 absorbs portions of the blue light produced by its associated LED wafer and emits different colors (wavelengths) (typically yellow-green) light via a photoluminescent process. The emission product of the device comprises a combination of blue light generated by the LED wafer and photoluminescent light generated by the photoluminescence conversion layer 122. Typically, the photoluminescent material is selected such that the emission product of the device appears white. The photoluminescent material may comprise a phosphor material or a quantum dot, which is part of a substance (eg, a semiconductor) whose exciton is constrained in all three spatial dimensions, which may be excited by radiant energy to emit a specific wavelength or The wavelength range of light 'this particular wavelength or range of wavelengths is determined by the physical size of the quantum dot. Thus, the invention is not limited to phosphor-based wavelength conversion components (unless so claimed). When the photoluminescent material comprises a phosphor, it may comprise an inorganic or organic phosphor, such as a general composition of the core of (1)" or (1) a silicate based on bismuth silicate. In the evening, 〇 is oxygen, a contains lock (Sr), barium (Ba), magnesium (Mg) or calcium (Ca), and D contains gas (C1), fluorine (F), nitrogen (N) or sulfur (S) An example of a citrate-based phosphor is disclosed in the following patent: US Patent 7,575,697 B2 "Silicate-based green phosphors" (already assigned to Intematix) US Patent us 7,601,276 B2 "Tw〇phase silicate-based yellow phosphors" (already transferred to inteniamix), US patent us 7,655,156 B2" Phosphate-based orange phosphors (siHcate_ 160926.doc •14-201246635 based orange phosphors)" (already assigned to Intematix), and US patent US 7,311,858 B2 "yttrium-based yellow Silicate-based yellow-green phosphors Transfer to Intematix). The illuminating body can also include, for example, the patent application US 2006/0158090 A1, "Novel aluminate-based green phosphors" and the patent US 7,390,437 B2 "Aluminium Aluminate-based materials taught in Aluminate-based blue phosphors (already assigned to Intematix), as in the co-pending application US 2008/0111472 A1 "Aluminum sulphate orange-red phosphors as taught in "Aluminum-silicate orange-red phosphors", or US Patent Application No. US 2009/0283721, which is incorporated herein by reference. A1 "Nitride-based red phosphors" and international patent application w〇2010/074963 A1 "Nitride-based RGB (red_green_blue) red illumination A nitride-based red light-breaking material as taught in the system (Nitride-based red-emitting in RGB (red-green-blue) lighting systems). It should be understood that the lithitic material is not limited to the described examples' and may include any phosphor material including a nitride and/or sulfate phosphor material, an oxynitride, and an oxysulfide or garnet material (YAG). . Photoluminescent wavelength conversion component 104 can be bonded to substrate 108 using a light transmissive bond 124, typically a polymer such as an acrylic, polyoxygen or epoxy. As illustrated in Figure 4 and to provide protection for LED wafers 1 and 6 and 16926.doc 201246635 conductors 118, each dome 120 can be completely filled with a light transmissive material such as light transmissive adhesive 124, as appropriate. Advantageously, the light transmissive material is selected such that its refractive index is close to the index of refraction of the LED wafer 106 (when practicable). For example, an InGaN/GaN LED wafer has a refractive index of 2.4 to 2.5 Å and a high refractive index polyfluorene has a refractive index. Therefore, the polymer material 124 has a refractive index of 1.2. The use of a high refractive index polymer can increase the light emission from the LED wafer 1 〇 6 by providing a degree of index matching. Figure 5 shows a schematic plan view and a cross-sectional view of a light emitting device based on lEd according to an embodiment of the present invention. In this embodiment, thirty-six LED wafers 106 are configured as a square array (six columns by six rows) on MCPCB 108. In accordance with the present invention, photoluminescent wavelength conversion component 丨〇4 includes a matching array of domes 120 that include a layer of photoluminescent material on its interior surface. Fabrication of Light Emitting Device According to the Invention A method of fabricating the light emitting device of Figs. 2, 3 and 4 will now be described with reference to Figs. 5a through 5n. As described above, the light-emitting device of the present invention comprises an assembly of a solid-state light engine 102 and a photoluminescence wavelength conversion component 1-4, and a method of manufacturing each of them will now be described. Fabrication of a solid state light engine (circles 5a and 5c) LED chips 106 are mounted on substrate 1-8 by, for example, soldering as a known array (Fig. 5a and each of LED chips 1〇6) It is electrically connected to the substrate 1 8 by, for example, a wire bond 118. Alternatively, the LED chip 1 6 can be bonded and electrically connected to the substrate by flip chip bonding. 160926.doc • 16 201246635 Photoluminescence wavelength conversion component Manufacture (囷5d to k5k) A method of manufacturing the photoluminescence wavelength conversion module 1〇4 will now be described with reference to Figures 5d to 5k. The wavelength conversion component 104 is used as, for example, polycarbonate, acrylic-poly(methacrylic acid) The use of a light transmissive carrier in the form of a sheet 126 of a light transmissive thermoformable polymeric material of the ester (PMMA) or PET (polyethylene terephthalate) begins with its useful life. An example of a suitable material is General.
Electric Plastics’ Lexan® 8010(U.V_穩定）聚碳酸酯膜（0.020 吋厚）。因為本發明係關於低成本裝置之製造，所以波長 轉換組件通常係由單一薄片大量生產。舉例而言，大約三 百個波長組件（100 mm乘15 mm)可由單一薄片126(1000 mm乘500 mm)製作。出於理解簡易性起見，諸圖中僅說明 單一組件之製作。 光致發光波長轉換層之印刷： 可使用光致發光組合物13 2將光致發光波長轉換層12 2篩 網印刷於載體薄片126上，光致發光組合物132包含粉末狀 光致發光材料及透光液體黏合劑材料之漿料。因為光致發 光組合物係可印刷的’所以其在本說明書中且出於簡潔起 見而將被稱作「磷光體墨水」《黏合劑材料可包含可固化 液體聚合物，諸如，聚合物樹脂、單體樹脂、丙烯酸類樹 脂、環氧樹脂（聚環氧化物）、聚矽氧、氟化聚合物，或澄 清可篩網印刷墨水。重要的是，黏合劑材料在其固化狀態 下能透射藉由光致發光（磷光體）材料及LED晶片1〇6產生之 光之所有波長，且遍及可見光譜（38〇 ^„至8〇〇 nm)較佳地 具有至少0.9之透射率。黏合劑材料較佳地為可υν·固化 160926.doc 201246635 的，但其可為可熱固化的'以溶劑為基礎，或其組合。可 υ_ν·固化或可熱固化黏合劑可為較佳的，此係因為·不同 於以溶劑為基礎之材料，可U.V.固化或可熱固化黏合劑在 聚a期間不會「除氣（Gutgas)」。當溶劑蒸發時，組合物之 體積及黏度將改變，從而引起光致發光材料之較高濃度， 此情形將影響裝置之發射產物色彩。在可uv固化聚合物 的情丨兄下，黏度及固體比率在沈積程序期間較穩定，其中 在沈積完成之後使用U.V.固化以使層聚合且凝固。此外， 因為在磷光體墨水之篩網印刷的狀況下可能需要多遍次印 刷以達成所需層厚度，所以可υ.ν·固化黏合劑之使用係較 佳的’此係因為每一層可在印刷之後於下一層之印刷之前 立即實際地固化。 如圖6d所示，將印刷篩網128定位於薄片126之上。篩網 128包含開口 13〇之圖案，開口 13〇經組態以印刷對應於每 一 LED晶片1 〇6的光致發光材料之各別區域。在此實例 中，印刷篩網128具有界定七個圓形區域之線性陣列之孔 隙130。藉由使用可撓性刀片（刮刀）134將磷光體墨水132拖 曳於印刷篩網128之上而將磷光體墨水132印刷於薄片126 上（圖6e)。自薄片126移除印刷篩網128(圖5f)，且藉由將 薄片126曝露至U.V.光而使經印刷磷光體墨水132固化（圖 5g)。通常，藉由將薄片置放於傳遞通過U.V.固化站之輸送 機上而使磷光體墨水固化。 藉由裝置產生之發射產物之色彩將取決於波長轉換層 122中每單位面積的光致發光材料之數量。應瞭解，每單 160926.doc -18· 201246635 位面積的光致發光材料之數量取決於波長轉換層122之厚 度及磷光體墨水中光致發光材料至黏合劑之重量負載β在 發射產物為白色的應用中，或在發射產物具有高飽和色彩 (亦即，發射產物包含實質上所有光致發光產生光）的應用 中’波長轉換層122中每單位面積的光致發光材料之數量 將通常介於10 mg.cm·2與4〇 mg.cm·2之間。為了實現以最 小數目個印刷遍次來印刷波長轉換層丨22，鱗光體墨水132 較佳地具有磷光體（光致發光）材料至黏合劑材料之儘可能 高的固體負載，且較佳地具有磷光體材料至黏合劑之儘可 能高的重量負載，且較佳地係在4〇〇/。至75%之範圍内。已 發現，在高於約75%重量負載的情況下，可難以確保強内 聚力、黏接力及維持碌光體墨水之可印刷性。對於低於約 40%之重量負載，已發現，五個或五個以上印刷遍次可為 達成每單位面積的所需磷光體材料所必要。應注意，在本 發明之磷光體墨水132中’磷光體材料至黏合劑材料之重 量負載比習知篩網印刷墨水中之顏料之重量負載高得多。 磷光體材料包含具有10 μιη至2〇 且通常大約15 pm之平 均粒子大小之粒子。 碌光體墨水13 2之黏度主要地係藉由黏合劑材料之黏度 及磷光體/反光材料之重量負載判定。黏合劑材料較佳地 具有在1 Pa.s至2.5 Pa.S(1000 cps至2500 cps)之範圍内的黏 度。可在磷光體墨水之初始調配期間使用稀化添加劑以達 成所需黏度且在印刷期間使磷光體墨水「稀化」。然而， 當稀化時必須要小心以維持固體負載，此係因為正是磷光 160926.doc 19 201246635 體材料含量（負載）及層厚度而非黏度判定藉由磷光體墨水 產生之光之色彩。 除了黏度以外，黏合劑材料之表面張力亦可影響磷光體 墨水132之效能。舉例而言，若磷光體墨水之表面張力太 南，則可在印刷期間形成氣泡，從而引起不良層形成。在 低表面張力的情況下亦可在磷光體墨水中形成氣泡且較 佳的是另外將消泡劑添加至磷光體墨水。 圓頂狀特徵之形成： 接著藉由熱真空形成程序而在波長轉換組件上形成圓頂 狀特徵120。 將包括經印刷磷光體墨水之圖案之載體薄片126小心地 定位於成型器136之上，成型器136包含複數個圓頂狀（大 體上半球形）成型器138(圖6h)。如圖6h所示，將載體薄片 126較佳地置放於真空成型器中，其中經印刷構光體之圖 案面對成型器138，以確保波長轉換層122將在成品波長轉 換組件中處於圓頂狀特徵12〇之内部凹形表面上。使載體 薄片126在成型器之上對準’使得磷光體區域中每一者上 覆一對應成型器138。接著藉由使用（例如）輻射加熱器來加 熱載體薄片126而使該薄片軟化。一旦載體薄片126軟化， 隨即抽空在薄片126與成型器136之間的空氣，藉此造成該 薄片符合成型器136。接著冷卻載體薄片126以使該薄片再 硬化（圖6ι) ’且自真空模塑器移除經模塑薄片（圖***面圖、剖 視圖及端視圖。在此實例中，填充埠140包含延行波長轉 換組件104之長度且連接圓頂狀特徵丨2〇中每一者之通道。 在波長轉換組件104定位於光引擎102上的情況下，可使用 通道140而使圓頂狀特徵中每一者填充有透光黏接劑^或 者，可將波長轉換組件104接合至光引擎1〇2(如參看圖51至 圖5n所描述）’在此狀況下，通道14〇幫助過量黏接劑之逸 出。 根據本發明之另外實施例之發光裝置 160926.doc •21 . 201246635 現在參看圖8、圖9及圖10來描述根據本發明之一實施例 的低成本以LED為基礎之發光裝置100，圖8、圖9及圖10 分別展示該裝置之示意性部分剖示平面圖、通過A-A之剖 視圖及分解剖視圖。與較早實施例一樣，裝置100包含由 光引擎102及光致發光波長轉換組件104構成之總成。光引 擎1 02可包含COB配置，COB配置包含以已知組態安裝於 平面基板1〇8(諸如，MCPCB)上之複數個以發藍色 InGaN/GaN(氮化銦鎵/氮化鎵）為基礎之LED晶片106。在此 實施例中，光引擎進一步包含具有通孔144之陣列之板 142，在通孔144中，每一孔144與LED晶片中之一者對 應。該板可包含用以防止光自裝置逸出之任何不透明材 料’諸如，印刷電路板、玻璃纖維加強型板、陶瓷板、金 屬板或塑膠材料。孔144經組態成使得當板142安裝至基板 108時，結合基板1〇8之每一孔144界定環繞各別LED晶片 106之淺空腔。板142之厚度經選擇成使得當該板安裝至基 板時，該板之上部表面齊平或高於LED晶片/接合導線之最 上部表面。因為板142提供波長轉換組件之間隔，所以此 情形消除針對模塑圓頂狀特徵122之需要。因此，對於此 等裝置’波長轉換組件104可包含具有經篩網印刷磷光體 區域陣列之實質上平面透光基板126，且可使用圖^至圖 6g之方法予以製造。因為不需要模塑基板126，所以其可 包含諸如透光聚合物或玻璃之任何透光材料。如在圖_ 最好地所見，波長轉換組件1〇4可安裝至板142，使得每— 鱗光體區域124上霜且涛_ a， a, aa 復覆蓋一各別開口 144。此等裝置之特 160926.doc •22· 201246635 定益處為磷光體波長組件之低成本生產。 圖11及圖12展示根據本發明之實施例的以固態為基礎之 發光裝置。在此等實施例中，光致發光波長轉換組件進— 步包含白色漫射光材料146之層。可出於美學考慮而使用 漫射光材料，且漫射光材料可用以改良裝置在「斷開狀 態」下之視覺外觀，亦即，其斷開狀態白色外觀。利用光 致發光波長轉換之發光裝置之一個問題為該裝置在其斷開 狀態下之非白色外觀。在裝置之接通狀態期間，led晶片 產生藍色光，且磷光體吸收藍色光之百分率且再發射黃色 光’或綠色光與紅色光、綠色光與黃色光、綠色光與橙色 光或黃色光與紅色光之組合。與藉由磷光體發射之光組合 的未被磷光體吸收之藉由LED產生之藍色光之部分提供對 於人眼看來像是幾乎白色之光。然而，對於處於斷開狀態 之裝置，不存在原本將會藉由處於接通狀態之led產生之 藍色光會造成裝置（尤其是波長轉換組件）具有微黃色、黃 橙色或橙色外觀。此非白色外觀對潛在購買者可為令人不 愉快的或不合需要的，且因此造成對目標客戶之銷售損 失。在當前實施例中且為了改良斷開狀態，光致發光波長 轉換層122(如自裝置之外部所檢視）係藉由白色漫射光材料 146之層遮蔽。 漫射光材料層可包含透光黏合劑與漫射光材料之粒子之 混合物’諸如’二氧化欽（Ti〇2)。可以類似方式將漫射光 材料沈積於載體上以作為光致發光材料，且較佳地將筛網 印刷漫射光材料。漫射光材料亦可為其他材料，諸如，硫 160926.doc •23· 201246635 酸鋇（BaS04)、氧化鎂（MgO)、二氧化矽（Si02)或氧化銘 (AhO3)。通常，漫射光材料為白色。以此方式，在斷開狀 態下，波長轉換組件内之磷光體材料將呈現為白色，而非 通常為黃綠色、黃色或橙色之磷光體材料色彩。在替代f 施例中，漫射光材料可提供於載體之整個表面之上，或 者’併入於載體内，使得漫射光材料貫穿基板之體積而均 勻地分佈。 應瞭解，本發明不限於所描述之例示性實施例，且可在 本發明之範疇内進行變化《舉例而言，雖然本發明係關於 以LED為基礎之發光裝置而出現，但其他實施例可基於其 他固態（半導體）光發射器，諸如，電致發光發射器（包括 (但不限於）雷射二極體及雷射）。 【圖式簡單說明】 圖1為如先前所描述之已知以LED為基礎之發光裝置的 示意性剖視圖； 圖2為根據本發明之一實施例之以LED為基礎之發光裝 置的示意性平面圖； 圖3為通過a-A之圖2之發光裝置的分解剖視圖； 圖4為展示圖3之裝置之部件的放大剖視圖； 圖5展示根據本發明之一實施例之以LED為基礎之發光 裝置的示意性平面圖及剖視圖； 圖6a至圖6n為說明用於製造圖2至圖5之發光裝置之步驟 的示意性表示； 圖7展示根據本發明之一實施例之光致發光波長轉換組 160926.doc -24· 201246635 件的示意性平面圖、剖視圖及端視圖； 圖8為根據本發明之一實施例之以LED為基礎之發光裝 置的示意性部分刳視平面圖； 圖9為通過A-A之圖8之發光裝置的剖視圖； . 圖1 〇為通過A-A之圖8之發光裝置的分解剖視圖； -圖11為根據本發明之一實施例之發光裝置的剖視圖；及 圖12為展示根據本發明之一實施例之裝置之部件的放大 剖視圖。 【主要元件符號說明】 10 12 16 18 20 22 24 26 28 30 32 34 100 102 160926.doc 白色發光二極體 藍色發光GaN(氮化鎵）發光二極體晶片 上部本體部件 下部本體部件 凹座 電連接器 電連接器 電極接觸焊墊 電極接觸焊墊 接合導線 接合導線 透明聚合物材料 以固態為基礎之發光裝置/以發光二極體為 基礎之發光裝置 固態光引擎 -25- 201246635 104 光致發光波長轉換組件 106 以藍色表面發射InGaN/GaN(氮化銦鎵/氮化 鎵）為基礎之發光二極體晶片 108 基板/金屬核心印刷電路板 110 導熱基座 112 非導電/導熱介電材料/介電層 114 導電軌跡 116 導熱安裝焊墊 118 接合導線/導線接合 120 圓頂（大體上半球形）狀殼層/圓頂/圓頂狀特徵 122 光致發光波長轉換層 124 透光黏接劑/聚合物材料/碟光體區域 126 透光載體/載體薄片/實質上平面透光基板 128 印刷篩網 130 開口 /孔隙 132 光致發光組合物/磷光體墨水 134 可撓性刀片（刮刀） 136 成型器 138 圓頂狀(大體上半球形)成型器 140 填充槔/通道 142 板 144 通孔/開口 146 白色漫射光材料 160926.doc • 26 -Electric Plastics' Lexan® 8010 (U.V_stable) polycarbonate film (0.020 吋 thick). Since the present invention relates to the manufacture of low cost devices, the wavelength conversion components are typically produced in large quantities from a single sheet. For example, approximately three hundred wavelength components (100 mm by 15 mm) can be fabricated from a single sheet 126 (1000 mm by 500 mm). For the sake of simplicity of understanding, only the production of a single component is illustrated in the figures. Printing of the photoluminescence wavelength converting layer: The photoluminescent wavelength converting layer 12 2 can be screen printed on the carrier sheet 126 using a photoluminescent composition 13 2, the photoluminescent composition 132 comprising a powdered photoluminescent material and A slurry of a light transmissive liquid binder material. Since the photoluminescent composition is printable, it will be referred to as "phosphor ink" in this specification and for the sake of brevity. "The binder material may comprise a curable liquid polymer, such as a polymer resin. , monomer resin, acrylic resin, epoxy resin (polyepoxide), polyfluorene oxide, fluorinated polymer, or clarified screen printing ink. Importantly, the binder material can transmit all wavelengths of light generated by the photoluminescence (phosphor) material and the LED wafer 1〇6 in its cured state, and throughout the visible spectrum (38〇^„ to 8〇〇) The nm) preferably has a transmittance of at least 0.9. The binder material is preferably υν·cured 160926.doc 201246635, but it may be heat curable 'solvent based, or a combination thereof. υ υ ν·· Curing or heat curable adhesives may be preferred because, unlike solvent based materials, UV curable or heat curable adhesives do not "Gutgas" during poly a. As the solvent evaporates, the volume and viscosity of the composition will change, causing a higher concentration of the photoluminescent material, which will affect the color of the emission product of the device. In the case of uv-curable polymers, the viscosity and solids ratios were relatively stable during the deposition procedure, where U.V. cure was used after the deposition was completed to polymerize and solidify the layers. In addition, because multiple passes may be required to achieve the desired layer thickness in the case of screen printing of phosphor inks, the use of ν.ν·curing adhesives is preferred because this layer can be used in each layer. Immediately after printing, it is actually cured before printing on the next layer. As shown in Figure 6d, the printing screen 128 is positioned over the sheet 126. The screen 128 includes a pattern of openings 13 that are configured to print respective regions of the photoluminescent material corresponding to each of the LED wafers 1 to 6. In this example, the printing screen 128 has a slit 130 that defines a linear array of seven circular regions. Phosphor ink 132 is printed on sheet 126 by dragging phosphor ink 132 onto printing screen 128 using a flexible blade (blade) 134 (Fig. 6e). The printed screen 128 is removed from the sheet 126 (Fig. 5f) and the printed phosphor ink 132 is cured by exposing the sheet 126 to U.V. light (Fig. 5g). Typically, the phosphor ink is cured by placing the sheet on a conveyor that is passed through a U.V. curing station. The color of the emission product produced by the device will depend on the amount of photoluminescent material per unit area in the wavelength conversion layer 122. It should be understood that the number of photoluminescent materials per area of 160926.doc -18·201246635 depends on the thickness of the wavelength conversion layer 122 and the weight of the photoluminescent material in the phosphor ink to the binder loading β is white in the emission product. In applications, or where the emission product has a high saturation color (ie, the emission product comprises substantially all of the photoluminescence-generated light), the number of photoluminescent materials per unit area in the wavelength conversion layer 122 will generally be Between 10 mg.cm·2 and 4〇mg.cm·2. In order to achieve printing of the wavelength converting layer 22 with a minimum number of printing passes, the scale ink 132 preferably has the highest possible solid loading of the phosphor (photoluminescent) material to the binder material, and preferably It has the highest possible weight loading of the phosphor material to the binder, and is preferably at 4 Å/. Up to 75%. It has been found that at loads above about 75% by weight, it is difficult to ensure strong cohesion, adhesion and maintain printability of the bluish ink. For weight loads below about 40%, it has been found that five or more printing passes may be necessary to achieve the desired phosphor material per unit area. It should be noted that in the phosphor ink 132 of the present invention, the weight loading of the phosphor material to the binder material is much higher than the weight loading of the pigment in the conventional screen printing ink. The phosphor material comprises particles having an average particle size of from 10 μηη to 2 Å and typically about 15 pm. The viscosity of the phosphor ink 13 2 is mainly determined by the viscosity of the binder material and the weight load of the phosphor/reflective material. The binder material preferably has a viscosity in the range of 1 Pa.s to 2.5 Pa.S (1000 cps to 2500 cps). The thinning additive can be used during the initial formulation of the phosphor ink to achieve the desired viscosity and to "thinize" the phosphor ink during printing. However, care must be taken to maintain the solid load when thinning, because it is the color of the light produced by the phosphor ink because of the phosphorous content (load) and layer thickness rather than viscosity. In addition to viscosity, the surface tension of the binder material can also affect the efficacy of the phosphor ink 132. For example, if the surface tension of the phosphor ink is too south, bubbles may be formed during printing to cause formation of a defective layer. It is also possible to form bubbles in the phosphor ink at a low surface tension and it is preferable to additionally add an antifoaming agent to the phosphor ink. Formation of dome-shaped features: A dome-shaped feature 120 is then formed on the wavelength conversion component by a thermal vacuum forming process. A carrier sheet 126 comprising a pattern of printed phosphor ink is carefully placed over the former 136, which includes a plurality of dome-shaped (generally upper hemispherical) formers 138 (Fig. 6h). As shown in Figure 6h, the carrier sheet 126 is preferably placed in a vacuum former with the pattern of printed illuminators facing the former 138 to ensure that the wavelength conversion layer 122 will be in the finished wavelength conversion assembly. The top feature 12 is on the inner concave surface. The carrier sheets 126 are aligned over the former such that each of the phosphor regions is overlaid with a corresponding former 138. The sheet is then softened by heating the carrier sheet 126 using, for example, a radiant heater. Once the carrier sheet 126 has softened, the air between the sheet 126 and the former 136 is then evacuated, thereby causing the sheet to conform to the former 136. The carrier sheet 126 is then cooled to re-harden the sheet (Fig. 6) and the molded sheet is removed from the vacuum former. Finally 'dividing the sheet 126 into individual wavelength conversion components 1 〇 4 ^ assembly of the device (circle 5 到 to circle 5 n) 160926.doc -20 - 201246635 The final assembly of the device involves mounting the wavelength conversion component 1 〇 4 to the light engine 102 . An example of a method of mounting the wavelength conversion component 104 using the light-transmitting adhesive 124 is illustrated in Figures 51 and 5n. Where the wavelength conversion component is oriented such that its pedestal is at the uppermost portion, the dome is made by, for example, using a flexible blade (scraper) 132 to drag the light-transmitting adhesive 124 onto the pedestal Each of the 120 is filled with the adhesive. The light engine 102 (i.e., the substrate 108 filled with the LED wafers 1 - 6) is then brought into engagement with the wavelength conversion component such that each lEd wafer 1 6 is positioned within a respective dome 120 and any excess is removed. Adhesive 124. In other configurations, the wavelength conversion component 104 can be joined or otherwise attached to the light engine 102 without the dome-like features being filled with a light transmissive material. In still other embodiments, it is envisioned to fill the dome 120 using one or more channels or turns 14 that may be formed in the susceptor of the wavelength conversion component during vacuum formation. An example of such a channel is shown in Figure 7, which shows a schematic plan, cross-sectional and end views of a phosphor wavelength conversion component 1 〇4 in accordance with an embodiment of the present invention. In this example, the fill cassette 140 includes a channel that extends the length of the wavelength conversion component 104 and connects each of the dome-shaped features 丨2〇. Where the wavelength conversion component 104 is positioned on the light engine 102, the channel 140 can be used to fill each of the dome-shaped features with a light transmissive adhesive or the wavelength conversion component 104 can be bonded to the light engine 1 〇 2 (as described with reference to Figures 51 to 5n) 'In this case, the channel 14 〇 helps the excess adhesive to escape. Light-emitting device according to another embodiment of the present invention 160926.doc • 21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 and 10 respectively show a schematic partial cross-sectional plan view of the device, a cross-sectional view through AA, and an exploded cross-sectional view. As with earlier embodiments, device 100 includes an assembly of light engine 102 and photoluminescent wavelength conversion component 104. The light engine 102 may include a COB configuration including a plurality of blue-emitting InGaN/GaN (indium gallium nitride/gallium nitride) mounted on a planar substrate 1〇8 (such as an MCPCB) in a known configuration. Based on the LED chip 106. In this embodiment, the light engine further includes a plate 142 having an array of through holes 144, each of which corresponds to one of the LED dies. The panel may comprise any opaque material such as a printed circuit board, a fiberglass reinforced panel, a ceramic panel, a metal panel or a plastic material to prevent light from escaping from the device. The apertures 144 are configured such that when the board 142 is mounted to the substrate 108, each aperture 144 of the bonding substrate 1A8 defines a shallow cavity that surrounds the respective LED wafer 106. The thickness of the plate 142 is selected such that when the plate is mounted to the substrate, the upper surface of the plate is flush or higher than the uppermost surface of the LED wafer/bonding wire. This eliminates the need for molded dome features 122 because the plates 142 provide spacing between the wavelength conversion components. Thus, for such devices, the wavelength conversion component 104 can comprise a substantially planar light transmissive substrate 126 having an array of screen printed phosphor regions, and can be fabricated using the methods of Figures 6 through 6g. Since the substrate 126 is not required to be molded, it may comprise any light transmissive material such as a light transmissive polymer or glass. As best seen in the Figure _, the wavelength conversion component 1〇4 can be mounted to the plate 142 such that each of the scale regions 124 is frosted and the waves _ a, a, aa cover a respective opening 144. The benefits of these devices are 160926.doc •22· 201246635 The benefit is the low cost production of phosphor wavelength components. 11 and 12 show a solid state based illumination device in accordance with an embodiment of the present invention. In such embodiments, the photoluminescent wavelength conversion component further comprises a layer of white diffused light material 146. A diffused light material can be used for aesthetic reasons, and a diffused light material can be used to improve the visual appearance of the device in the "disconnected state", that is, its off-state white appearance. One problem with illumination devices that utilize photoluminescence wavelength conversion is the non-white appearance of the device in its off state. During the on state of the device, the LED wafer produces blue light, and the phosphor absorbs the percentage of blue light and re-emits yellow light 'or green light and red light, green light and yellow light, green light and orange light or yellow light A combination of red light. The portion of the blue light produced by the LED that is absorbed by the phosphor in combination with the light emitted by the phosphor provides light that appears to the human eye to be almost white. However, for devices in the off state, there is no blue light that would otherwise be generated by the LED in the on state, causing the device (especially the wavelength conversion component) to have a yellowish, yellowish orange or orange appearance. This non-white appearance can be unpleasant or undesirable for potential purchasers and thus result in lost sales to the target customer. In the current embodiment and to improve the off state, the photoluminescent wavelength conversion layer 122 (as viewed from the outside of the device) is shielded by a layer of white diffused light material 146. The layer of diffused light material may comprise a mixture of particles of a light transmissive binder and a diffusing light material, such as 'dioxide. The diffused light material can be deposited onto the support in a similar manner to act as a photoluminescent material, and preferably the screen is printed with a diffused light material. The diffused light material may also be other materials such as sulfur 160926.doc •23· 201246635 Barium (BaS04), Magnesium Oxide (MgO), Cerium Oxide (Si02) or Oxide (AhO3). Typically, the diffused light material is white. In this manner, in the off state, the phosphor material within the wavelength conversion component will appear white instead of the phosphor material color, typically yellow-green, yellow or orange. In an alternative embodiment, the diffusing light material can be provided over the entire surface of the carrier, or ' incorporated into the carrier such that the diffusing light material is evenly distributed throughout the volume of the substrate. It is to be understood that the invention is not limited to the illustrative embodiments described and may be varied within the scope of the invention. For example, although the invention has been described with respect to LED-based lighting devices, other embodiments may Based on other solid state (semiconductor) light emitters, such as electroluminescent emitters (including but not limited to laser diodes and lasers). BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a known LED-based light-emitting device as previously described; FIG. 2 is a schematic plan view of an LED-based light-emitting device according to an embodiment of the present invention; Figure 3 is an exploded cross-sectional view of the illumination device of Figure 2 through aA; Figure 4 is an enlarged cross-sectional view showing the components of the device of Figure 3; Figure 5 is a schematic illustration of an LED-based illumination device in accordance with one embodiment of the present invention; Figure 6a to Figure 6n are schematic representations illustrating steps for fabricating the illumination device of Figures 2 through 5; Figure 7 shows a photoluminescence wavelength conversion group 160926.doc in accordance with an embodiment of the present invention. -24· 201246635 A schematic plan view, a cross-sectional view and an end view; FIG. 8 is a schematic partial plan view of an LED-based light-emitting device according to an embodiment of the present invention; FIG. 9 is a view through FIG. 1 is a cross-sectional view of a light-emitting device of FIG. 8 through AA; FIG. 11 is a cross-sectional view of a light-emitting device according to an embodiment of the present invention; and FIG. An enlarged sectional view of part of the apparatus of one embodiment of the present invention. [Main component symbol description] 10 12 16 18 20 22 24 26 28 30 32 34 100 102 160926.doc White light-emitting diode blue light-emitting GaN (gallium nitride) light-emitting diode wafer upper body part lower body part recess Electrical connector electrical connector electrode contact pad electrode contact pad bonding wire bonding wire transparent polymer material solid state based illuminating device / illuminating diode based illuminating device solid state light engine - 25 - 201246635 104 Photoinduced The light-emitting wavelength conversion component 106 emits InGaN/GaN (indium gallium nitride/gallium nitride)-based light-emitting diode wafer 108 on a blue surface. The substrate/metal core printed circuit board 110 thermally conductive pedestal 112 non-conductive/thermal conductive dielectric Material/dielectric layer 114 Conductive track 116 Thermally conductive mounting pad 118 Bonding wire/wire bond 120 Dome (substantially hemispherical) shell/dome/dome feature 122 Photoluminescent wavelength conversion layer 124 Light transmissive Adhesive/Polymer Material/Disc Body Area 126 Light Transmissive Carrier/Carrier Sheet/Substantially Planar Transmissive Substrate 128 Printing Screen 130 Opening/Pore 132 Photoluminescence Compound/Phosphor Ink 134 Flexible Blade (Scraper) 136 Former 138 Dome-shaped (substantially hemispherical) former 140 Filler/channel 142 Plate 144 Through hole/opening 146 White diffused light material 160926.doc • 26 -