TW201241412A - Device and method for measuring height of protrusions - Google Patents
Device and method for measuring height of protrusions Download PDFInfo
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- TW201241412A TW201241412A TW101107596A TW101107596A TW201241412A TW 201241412 A TW201241412 A TW 201241412A TW 101107596 A TW101107596 A TW 101107596A TW 101107596 A TW101107596 A TW 101107596A TW 201241412 A TW201241412 A TW 201241412A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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201241412 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是關於測定分布複數個於基板（substrate) 平面上的突出部之由前述平面突出的高度，特別是測定 形成於具備BGA(Ball Grid Array:球栅陣列）的半導體 裝置上的凸塊（bump)尚度等之突出部高度測定裝置及方 法0 【先前技術】 0 [_ 近年來的電子機器，特別是攜帶用電子機器等伴隨 著小型化與高性能化，搭载於内部的電子零件越來越被 以咼岔度女裝。其中IC的封裝（package)也小型化起來 . ，如 BGA(Ba11 Grid Array:球栅陣列）或 CSP(Chip201241412 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to measuring the height of a projection protruding from a plurality of projections on a substrate plane, and in particular measuring the formation of a BGA (including a BGA) Ball Grid Array: a projection height measuring device and method for a bump on a semiconductor device of a ball grid array. [Prior Art] 0 [_ Recent electronic devices, particularly portable electronic devices, etc. With the miniaturization and high performance, electronic components mounted inside are increasingly being worn by women. The package of the IC is also miniaturized. For example, BGA (Ba11 Grid Array) or CSP (Chip)
Size Package:晶片尺寸封裝）般凸塊接合（bump bonding)型的封裝急速普及。進而如c〇c(chip 〇n aSize Package: Wafer size package) The bump bonding type of package is rapidly spreading. Further as c〇c(chip 〇n a
Chip:晶片堆疊）般上下堆疊並安裝搭載凸塊的晶片 (chip)的手法也登場^ 〇 &種凸塊接合型的封K情形，藉由在封裝背面的 端子上承栽銲球（s〇lder bau)形成凸塊使封裝背面 對接於女袭對象基板，藉由回流等將凸塊（球 狀的銲料（s〇lder))加熱，對安裝對象基板上的配線銲 墊aP(wiring land part)進行焊接（如敝 而進行安襞。 、_〇數個於封裝上’惟凸塊形成時的聚程 餘松（P ocess margin)小，很難形成均等的高度的凸 塊:因此’有高度不同的凸塊各自被形成的情形。在這 1013155733-0 為單編號下☆藉由對-部分的凸塊抽樣測定高度，估計 1011075#單編號Α_ 帛5頁/共4〇頁 201241412 其他的凸塊的南度，則會產生不適當的事例。為了解決 這種不適當，被要求測定全凸塊的高度。而且，因凸塊 的密集化使得每一晶片及晶圓（wafer)的凸塊數增加，施 於晶圓之凸塊測定用的處理時間被要求盡可能短時間。 因此，被要求以更短時間測定全凸塊的高度。 而且’全凸塊各個的頭頂部的相對的高度的平坦度 (flatness)(共面性：COpianarity)很重要，不僅如此 而已，也被要求距封裝的基面（base surface)的高度的 測疋。此乃因在使用小徑且密集的凸塊的晶片的安農中 ’對安裝時的晶片與基板的間隙量（gap am〇unt)，相對 於凸塊尚度的個別差異（individual difference)的容 許範圍（allowable range)小。 在即使全凸塊各個的頭頂部的相對的高度一致，凸 塊高度也不均等的情形（亦即以全凸塊的頭頂部形成的面 與封裝的基面不平行的情形），或在雖然平行但與所需的 距離不同的情形下’容易產生安裝不良。此乃因銲球的 大小與預先規定的A小不同，故大的凸塊的情形，由於 凸塊過度壓壞而擴展於旁邊使得相鄰的凸塊彼此容易短 路’小的凸塊的情形，銲料無法遍及想接合的凸塊與電 極之間而容易成為接合不良，產生無法得到所需的導通 之現象。該等[凸塊高度低的不良凸塊的情形，想接合的 凸塊與電極之間成為接合不良而無法得到導通]及[凸塊 而度尚的不良凸塊的情形，接近的壓壞的凸塊彼此接觸 而變成短路]現象在凸塊高度的平坦度（共面性）的測定中 無法發現。 因此’需在使用小徑且密集的凸塊的晶片的安裝前 075#單編號删1 第6頁/共40頁 1013155733-0 201241412 管理距基面的凸塊的高度，相反地若測定距基面的高度 ，則可在安裝前判定能否以製程上規定的間隙量（g a p amount)安裝，可在安裝前丟棄具有高度不良的凸塊的晶 片，或進行重做（rework)等的對策。而且為了測定分布 複數個於基板平面上的突出部的高度，習知的技術揭示 有自動對焦法（autofocus method) '立體攝影機法 (stereo camera method)、光切法（iight_secti〇Jl method)等的技術。 β 1)、自動對焦法 〇 自動對焦法是藉由透過自動對焦的原理對焦於凸塊 ，計測凸塊的高度。調焦及凸塊高度計測是對凸塊的一 . 個一個依次進行。亦即每一凸塊重複執行如下之一連串 的動作：將具有測定對象的凸塊之晶片或晶圓搭載於义¥平 台（XY table)，使XY平台移動微小量並使封裝上的一個 凸塊位於光學系的光軸的正下方，進行調焦，計測凸塊 高度（例如專利文獻1)。 〇 但是在該方法中’隨著凸塊數增加計測時間也增加 。例如CSP封裝的一種之WLP(Wafer Uvel Package: 晶圓級封裝）的ic凸塊有在直徑300n]m的晶圓上具有2〇〇 萬個以上的情形，而在該測定中假設對^^平台的一次的 移動花0.2秒，對一次的調焦花丨秒，則對一片晶圓上的 全凸塊的測定就會花462小時以上。該測定時間在實際的 生產現場中是不切實際的。 2)、立體攝影機法 在立體攝影機法中，對凸塊照射光，以複數台攝影 機拍攝來自凸塊頭頂部的反射光並各自抽出其位置，由 10110759^單編號A0101 第7頁/共40頁 1013155733-0 201241412 該等座標位置的差求凸塊頭頂部的座標。在該立體攝影 機法中，若使用CCD(Charge Coupled Device:電荷搞 合元件）或CMOS(Complementary Metal Oxide Semiconductor:互補金氧半導體）等的二維攝影機（攝 影部），則可同時拍攝存在於規定範圍的複數個凸塊，並 求各個高度（例如專利文獻2〜5)。 另一方面，在測定解析度與測定範圍之間有取捨 (trade-off)的關係，若想提高測定解析度，則測定範 圍變窄。因此，將凸塊頭頂部放進測定範圍内，即使各 個凸塊的頭頂部的高度的個別差異可測定，基板平面上 到凸塊頭頂部的高度也不知道。而且，當測定對象的凸 塊有許多，無法一次拍攝時，需分割成複數個區域而進 行測定，而在立體攝影機法中只能求攝影區域内的該凸 塊的相對的高度的差，無法進行與先拍攝的凸塊高度的 對比。當無論如何也想進行對比時，需使先拍攝的凸塊 包含於接著拍攝的視野之内而進行拍攝。 但這需重複拍攝，無法在短時間完成拍攝。再者， 因會接收先前的資訊而求高度，故根據以先前的測定得 到的高度資訊，當作下一個高度計測的資訊，一旦包含 誤差的話，則會產生誤差的連鎖，最終也有無法得到精 度南的結果之虞。 3)、光切法 光切法是以對測定對象斜斜（例如以測定對象的垂直 方向為0°時為45° )的角度且透過雷射狹縫光投影裝置 投射雷射狹縫光，透過CCD攝影機等的攝影部拍攝在被檢 驗部產生的雷射狹縫光所造成的反射光的方法（專利文獻 而·#單編號纖01 第8頁/共40頁 1013155733-0 201241412 6)。在測定對象上產生的光切線具有位置依照測定對象 的高度而位移於水平方向的特性。因此，可根據拍攝影 像内的光切線的位移算出測定對象之投射了雷射狹缝光 的線的高度分布，可藉由一邊一點一點地移動測定對象 ，一邊重複測定線的高度分布，得到測定對象的面内的 高度分布。Chip: wafer stacking) The method of stacking and mounting chips with bumps is also available. ^ 〇 & bump type K-type case, by soldering solder balls on the terminals on the back of the package (s 〇lder bau) forming a bump so that the back surface of the package is butted against the substrate of the female object, and the bump (ball solder) is heated by reflow or the like, and the wiring pad aP on the mounting target substrate (wiring land) Part) welding (such as 敝 进行 襞 、 、 〇 封装 封装 ' ' ' ' ' ' ' ' ' 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 惟 凸 凸 凸 凸 凸 凸 凸 凸 凸The case where different bumps are each formed. Under this 1013155733-0 is a single number ☆ Measure the height by bump-part bump sampling, estimate 1011075# single number Α _ 帛 5 pages / total 4 pages 201241412 other convex The south degree of the block will produce an inappropriate case. In order to solve this kind of inappropriateness, it is required to determine the height of the full bump. Moreover, the bump of each wafer and wafer is made due to the densification of the bump. Increase in number, applied to the bump measurement of the wafer Time is required to be as short as possible. Therefore, it is required to measure the height of the full bump in a shorter time. Moreover, the flatness (coplanarity: COpianarity) of the relative height of the top of each of the full bumps is very high. Importantly, not only that, but also the height of the base surface of the package is required. This is due to the wafer and substrate during installation in the Anon using wafers with small diameters and dense bumps. The gap amount (gap am〇unt) is small relative to the allowable range of the individual difference of the bumps. The height of the bumps is uniform even if the relative heights of the tops of the entire bumps are uniform. In the case of unequalness (that is, the case where the face formed by the top of the full bump is not parallel to the base of the package), or in the case of being parallel but different from the required distance, it is easy to cause mounting failure. However, since the size of the solder ball is different from the pre-specified A, the case of a large bump is extended to the side due to excessive crushing of the bump so that adjacent bumps are easily short-circuited with each other. The solder cannot easily pass between the bump and the electrode to be joined, and the bonding defect is likely to occur, and the desired conduction cannot be obtained. In the case of the defective bump having a low bump height, the bump and the electrode to be joined are required. In the case where the bonding is poor and the conduction cannot be obtained] and [the bumps are not good, the bumps that are close to each other are in contact with each other and become short-circuited]. The phenomenon is flatness (coplanarity) at the height of the bumps. It cannot be found in the measurement. Therefore, 'there is a need to use a small-diameter and dense bump wafer before the installation of the 075# single number deletion 1 page 6 / a total of 40 pages 1013155733-0 201241412 manage the height of the bump from the base surface, on the contrary If the ground is measured at a height from the base surface, it can be determined whether it can be installed with the gap amount specified in the process before installation. The wafer with poor bumps can be discarded before installation or reworked (rework) ) Countermeasures such as. Further, in order to measure the height of a plurality of projections distributed on the plane of the substrate, the conventional technique discloses an autofocus method 'stereo camera method, a light cut method (iight_secti〇 Jl method), or the like. technology. β 1), autofocus method 〇 Autofocus method measures the height of the bump by focusing on the bump by the principle of autofocus. The focus and bump height measurement is performed one by one for the bumps. That is, each bump repeatedly performs a series of operations: loading a wafer or wafer having bumps to be measured on an XY table, moving the XY stage by a small amount and making a bump on the package. The focus is directly under the optical axis of the optical system, and the height of the bump is measured (for example, Patent Document 1). 〇 However, in this method, the measurement time increases as the number of bumps increases. For example, a WLP (Wafer Uvel Package) ic bump of a CSP package has more than 20 million cases on a wafer having a diameter of 300 n]m, and it is assumed in the measurement that ^^ The movement of the platform takes 0.2 seconds, and for one focus, the measurement of the full bump on a wafer takes more than 462 hours. This measurement time is impractical in the actual production site. 2) Stereo camera method In the stereo camera method, the bump is irradiated with light, and the reflected light from the top of the bump head is taken by a plurality of cameras and their positions are extracted, respectively, by 10110759^single number A0101, page 7 / total 40 pages 1013155733 -0 201241412 The difference between these coordinate positions is the coordinate at the top of the bump head. In the stereo camera method, when a two-dimensional camera (photographing unit) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) is used, it is possible to simultaneously capture the presence of the camera. A plurality of bumps in the range are obtained, and each height is obtained (for example, Patent Documents 2 to 5). On the other hand, there is a trade-off relationship between the measurement resolution and the measurement range, and if the measurement resolution is to be improved, the measurement range is narrowed. Therefore, the top of the bump is placed in the measurement range, and even if the individual difference in the height of the top of each bump can be determined, the height of the top of the bump to the top of the bump is not known. Further, when there are many bumps to be measured, and it is impossible to take a single shot, it is necessary to divide into a plurality of regions and perform measurement. In the stereo camera method, only the difference in the relative height of the bumps in the photographing region can be obtained. Compare the height of the bump with the first shot. When you want to compare anyway, you need to make the first shot to be included in the field of view that is shot next. However, this requires repeated shooting and it is not possible to complete the shooting in a short time. Furthermore, since the height is received by receiving the previous information, the height information obtained by the previous measurement is used as the information of the next height measurement. If the error is included, the error is chained, and finally the accuracy is not obtained. The result of the South. 3) The light-cutting method is to project the laser slit light through the laser slit projection device at an angle which is oblique to the measurement object (for example, 45° when the vertical direction of the measurement object is 0°). A method of capturing reflected light caused by laser slit light generated by a portion to be inspected by a photographing unit such as a CCD camera (Patent Document No. #单编号纤01第8页/共40页1013155733-0 201241412 6). The light tangent generated on the measurement target has a characteristic that the position is displaced in the horizontal direction in accordance with the height of the measurement target. Therefore, the height distribution of the line on which the laser slit light is projected can be calculated from the displacement of the light tangent in the captured image, and the height distribution of the line can be repeatedly measured while moving the measurement target little by little. The in-plane height distribution of the measurement target is obtained.
但是，在光切法中為了 一邊一點一點地移動測定對 象，一邊重複測定線的高度分布，有花費測定時間的問 題。而且，近年來雖然凸塊進行小徑化，但若想測定像 小徑凸塊的平坦面上的小徑突起物，則因凸塊頭頂部與 平坦面的反射光大不同，故光切線的拍攝亮度大不同， 其結果有無法正確地檢測凸塊頭頂部與平坦面的至少任 一光切線的位置，無法正確地測定凸塊高度的問題。However, in the photo-cutting method, in order to move the measurement object little by little, the measurement of the height distribution of the line is repeated, and the measurement time is required. Further, in recent years, although the bump is reduced in diameter, if the small-diameter projection on the flat surface of the small-diameter bump is to be measured, the reflected light of the top of the bump and the flat surface are greatly different, so the brightness of the light tangent is measured. As a result, there is a problem that the position of at least one of the light tangent lines of the top of the bump and the flat surface cannot be accurately detected, and the problem of the height of the bump cannot be accurately measured.
[專利文獻2] [專利文獻3] [專利文獻4] [專利文獻5] [專利文獻6] [專利文獻1]日本國特開平5-21318號公報 日本國特開平9-304030號公報 日本國特開平1 0-239025號公報 曰本國特開平1 1-287628號公報 日本國特開2002-267415號公報 日本國特開平1 1-287628號公報 【發明内容】 [0003] 如上述，習知的技術各有利弊，針對分布複數個於 基板平面上的突出部，不僅很難以短時間且高精度地測 定頭頂部的相對的高度的個別差異，也很難以短時間且 高精度地測定自基板平面突出的各個頭頂部的高度。 因此，本發明的目的為提供一種針對分布複數個於 基板平面上的突出部，不僅能以短時間且高精度地測定 1〇11〇759#單編號肅〇1 1013155733-0 第9頁/共40頁 201241412 頭頂部的相對的高度的個別差異，也能以短時間且高精 度地測定自基板平面突出的各個頭頂部的高度之裝置及 方法。 為了解決以上的課題，記載於申請專利範圍第1項之 發明為一種突出部高度測定裝置，測定分布複數個於基 板平面上的突出部之由前述基板平面突出的高度，其特 徵包含： 朝包含成為測定對象的前述突出部的前述基板平面 由第一方向照射照明光之第一照明部； 拍攝由前述第一照明部照射且在前述突出部的頭頂 部反射的第一反射光之第一攝影部； 朝包含成為測定對象的前述突出部的前述基板平面 由第二方向照射照明光之第二照明部； 拍攝由前述第二照明部照射且在前述突出部的頭頂 部反射的第二反射光之第二攝影部； 根據藉由前述第一攝影部拍攝的來自前述突出部的 頭頂部的反射光的位置資訊，與藉由前述第二攝影部拍 攝的來自前述突出部的頭頂部的反射光的位置資訊，算 出前述突出部的頭頂部彼此的相對高度之相對高度運算 部； 由第三方向朝前述基板平面照射比前述突出部的直 徑長的線狀的照明光之第三照明部； 拍攝由前述第三照明部照射且在前述基板平面上反 射的第三反射光之第三攝影部；以及 根據藉由前述第三攝影部拍攝的來自前述基板平面 上的反射光的位置資訊，與藉由前述相對高度運算部算 1011075#單編號應01 第10頁/共40頁 1013155733-0 201241412 出的結果，算出分布複數個於前述基板平面上的各個突 出部之由前述基板平面突出的高度之突出部高度運算部 為了解決以上的課題，記載於申請專利範圍第5項之 發明為一種突出部高度測定方法，測定分布複數個於基 板平面上的突出部之由前述基板平面突出的高度，其特 徵包含： 朝前述基板平面由第一方向照射照明光之第一照明 照射程序； 拍攝在前述第一照明照射程序被照射的光在前述突 出部的頭頂部反射的第一反射光之第一攝影程序； 朝前述基板平面由第二方向照射照明光之第二照明 照射程序； 拍攝在前述第二照明照射程序被照射的光在前述突 出部的頭頂部反射的第二反射光之第二攝影程序； 根據在前述第一攝影程序拍攝的來自前述突出部的 頭頂部的反射光的位置資訊，與在前述第二攝影程序拍 攝的來自前述突出部的頭頂部的反射光的位置資訊，算 出前述突出部的頭頂部彼此的相對高度之相對高度運算 程序； 由第三方向朝前述基板平面照射比前述突出部的直 徑長的線狀的照明光之第三照明照射程序； 拍攝在前述第三照明照射程序被照射的光在前述基 板平面上反射的第三反射光之第三攝影程序；以及 根據在前述第三攝影程序拍攝的來自前述基板平面 上的反射光的位置資訊，與在前述相對高度運算程序算 1013155733-0 101HT759#單編號A〇1〇l 第11頁/共40頁 201241412 出的結果，算出分布複數個於前述基板平面上的各個突 出部之由前述基板平面突出的高度之突出部高度運算程 序。 因使用上述的突出部高度測定裝置及方法，針對規 定的攝影區域，僅藉由稍微錯開拍攝時序而大致同時進 行攝影，針對分布複數個於基板平面上的突出部，可高 精度地算出由基板平面突出的各個頭頂部的高度。而且 ，即使是將測定對象分割成複數個攝影區域的情形，每 一分割的攝影區域也能各自大致同時進行攝影。 記載於申請專利範圍第2項之發明為記載於申請專利 範圍第1項之突出部高度測定裝置，其中由前述第一照明 部照射的光的照射，與由前述第二照明部照射的光的照 射是錯開時間而被進行。 記載於申請專利範圍第6項之發明為記載於申請專利 範圍第5項之突出部高度測定方法，其中前述第一照明照 射程序與前述第二照明照射程序是錯開時間而進行。 若使用上述的突出部高度測定裝置及方法，即使使 用於第一及第二攝影部的照明的主波長（dominant wavelength)相同，也能僅藉由錯開照射的時序而拍攝 各自的影像，不會拍攝由他方的照明照射的主波長成分 ，不會影響測定精度。 記載於申請專利範圍第3項之發明為記載於申請專利 範圍第1項之突出部高度測定裝置，其中由前述第一照明 部照射的光的主波長與由前述第二照明部照射的光的主 波長不同，前述第一攝影部與前述第二攝影部同時進行 攝影。 10110759产單編號 A〇101 第12頁/共40頁 1013155733-0 201241412 記載於申請專利範圍第7項之發明為記載於申請專利 範圍第5項之突出部高度測定方法，其中在前述第一照明 照射程序被照射的光的主波長與在前述第二照明照射程 序被照射的光的主波長不同，同時進行前述第一攝影程 序與前述第二攝影程序。 若使用上述的突出部高度測定裝置及方法，即使不 錯開第一及第二照明光的照射時序而同時照射，在藉由 各自的攝影部觀察的影像之中，在其他的攝影部使用的 波長的光也不被拍攝。因此，可縮短為了以第一及第二 攝影部拍攝突出部所需的時間，不影響測定精度。 記載於申請專利範圍第4項之發明為記載於申請專利 範圍第1項至第3項中任一項之突出部高度測定裝置，其 中由前述第三照明部照射的光的主波長與由前述第一照 明部及/或前述第二照明部照射的光的主波長不同，同時 進行前述第三攝影部的攝影，和拍攝與前述第三攝影部 不同的主波長的光的前述第一攝影部及/或前述第二攝影 部的攝影。 記載於申請專利範圍第8項之發明為記載於申請專利 範圍第5項至第7項中任一項之突出部高度測定方法，其 中在前述第三照明照射程序被照射的光的主波長與由前 述第一照明照射程序及/或前述第二照明照射程序被照射 的光的主波長不同5 同時進行前述第三攝影程序的攝影，和拍攝與前述 第三攝影程序不同的主波長的光的前述第一攝影程序及/ 或前述第二攝影程序的攝影。 若使用上述的突出部高度測定裝置及方法，可各自 10110759严編號 A_ 第13頁/共40頁 1013155733-0 201241412 同時照射第一至第三照明並進行攝影，即使在藉由第一 及第二攝影部觀察的區域内照射第三照明，在藉由各自 的攝影部觀察的影像之中，在其他的攝影部使用的波長 的光也不被拍攝。因此，因無須錯開照明光的照射時序 ，故可充分縮短用以進行前述突起物的高度測定的時間 。而且，因可測定藉由第一及第二攝影部拍攝的部分的 平面部的高度，故即使是基板周邊部，也能防止第三照 明光由基板表面露出。 [0004] [0005] 【發明的功效】 針對分布複數個於基板平面上的突出部，不僅能以 短時間且高精度地測定頭頂部的相對的高度的個別差異 ，也能以短時間且高精度地測定由基板平面突出的各個 頭頂部的高度。因此，若將本發明適用於銲料凸塊 (solder bump)的測定，則可防止銲料不良（接鄰電極彼 此的短路或導通不良）的發生於未然。 【實施方式】 針對用以實施本發明的形態，一邊使用圖一邊進行 說明。 圖1是顯示體現本發明的形態的一例之斜視圖。在各 圖中設正交座標糸的3轴為X、Y、Z，設XY平面為水平面 ，設Z方向為鉛直方向。特別是Z方向是以箭頭的方向為 上，以其反方向表現為下。體現本發明的突出部高度測 定裝置1包含基板移動部2、第一觀察部3、第二觀察部4 、第三觀察部5而構成。 [基板移動部] 10110759^^'^^ A0101 第14頁/共40頁 1013155733-0 201241412[Patent Document 2] [Patent Document 3] [Patent Document 4] [Patent Document 5] [Patent Document 6] [Patent Document 1] Japanese Patent Laid-Open No. Hei 5-21318, Japanese Patent Publication No. 9-304030 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Each of the advantages and disadvantages of the technique is that it is difficult to measure the individual differences of the relative heights of the tops of the heads in a short time and with high precision for the distribution of the plurality of protrusions on the plane of the substrate, and it is difficult to measure the self-substrate plane in a short time and with high precision. The height of the top of each head is highlighted. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a projection for distributing a plurality of planes on a substrate surface, which can be measured not only in a short time but also with high precision. 1〇11〇759#单单〇1 1013155733-0 Page 9 / Total 40 pages 201241412 The individual differences in the relative heights of the top of the head can also be used to measure the height of each of the heads protruding from the plane of the substrate in a short time and with high precision. In order to solve the above problems, the invention of the first aspect of the invention is a projection height measuring device that measures a height of a protruding portion of a plurality of projections on a plane of the substrate protruding from the plane of the substrate, and the feature includes: a first illumination portion that illuminates the illumination light by the first direction of the substrate plane of the protruding portion to be measured; and photographing the first illumination of the first reflected light that is irradiated by the first illumination portion and reflected at the top of the protruding portion a second illumination portion that illuminates the illumination light in the second direction toward the substrate plane including the protrusion portion to be measured; and photographs the second reflection light that is irradiated by the second illumination portion and is reflected on the top of the protrusion portion a second imaging unit; the positional information of the reflected light from the top of the protruding portion captured by the first imaging unit, and the reflected light from the top of the protruding portion captured by the second imaging unit Position information, a relative height calculation unit for calculating the relative heights of the head portions of the protruding portions; a third illumination portion that irradiates the substrate plane with linear illumination light longer than the diameter of the protruding portion; and a third imaging portion that captures the third reflected light that is irradiated by the third illumination portion and is reflected on the substrate plane And according to the position information of the reflected light from the plane of the substrate taken by the third photographing unit, and by the relative height calculation unit, 1011075# single number should be 01, 10th page, total 40 pages, 1013155733-0 201241412 As a result of the above, the projection height calculating unit that calculates the height of each of the protruding portions on the substrate plane that protrudes from the substrate plane is used to solve the above problems, and the invention described in the fifth aspect of the patent application is a prominent a height measuring method for measuring a height of a protruding portion of the plurality of projections on a plane of the substrate protruding from the plane of the substrate, the feature comprising: a first illumination illumination program for illuminating the illumination light from the first direction toward the substrate plane; The first illumination illumination program is irradiated with the first reflected light reflected at the top of the protrusion a second illumination illumination program for illuminating the illumination light from the second direction toward the substrate plane; capturing a second illumination of the second reflected light reflected by the second illumination illumination program at the top of the protrusion a program; calculating the position information of the reflected light from the top of the head portion of the protruding portion captured by the first imaging program and the position information of the reflected light from the top of the protruding portion of the protruding portion captured by the second imaging program a relative height calculation program of the relative heights of the tops of the protrusions; a third illumination illumination program for illuminating the substrate plane by a third direction longer than the diameter of the protrusions; and photographing the third illumination a third photographing program of the third reflected light reflected by the illumination program on the plane of the substrate; and positional information of the reflected light from the plane of the substrate photographed in the third photographing program, and the relative height at the foregoing The calculation program counts 1013155733-0 101HT759#单号A〇1〇l Page 11 of 40 201241412 As a result, a projection height calculation procedure for distributing the height of each of the projections on the plane of the substrate to the height of the substrate plane is calculated. By using the above-described protrusion height measuring apparatus and method, it is possible to accurately perform imaging with respect to a predetermined imaging area by simply shifting the imaging sequence slightly, and to accurately calculate the substrate by distributing a plurality of protruding portions on the substrate plane. The height of the top of each head that protrudes in a plane. Further, even in the case where the measurement target is divided into a plurality of imaging regions, each of the divided imaging regions can be photographed substantially simultaneously. The invention of claim 2, wherein the projection height measuring device according to the first aspect of the invention is characterized in that the illumination by the first illumination unit and the illumination by the second illumination unit Irradiation is performed by staggering the time. The invention of claim 6 is the method for measuring the height of the protruding portion according to the fifth aspect of the patent application, wherein the first illumination irradiation program and the second illumination irradiation program are shifted in time. According to the above-described protrusion height measuring device and method, even if the dominant wavelengths of the illuminations used in the first and second imaging units are the same, it is possible to capture the respective images only by shifting the timing of the irradiation. Shooting the dominant wavelength component illuminated by the other illumination does not affect the measurement accuracy. The invention of claim 3, wherein the main beam of the light irradiated by the first illumination unit and the light irradiated by the second illumination unit are the protrusion height measuring device according to the first aspect of the invention. The first imaging unit and the second imaging unit simultaneously perform imaging at different principal wavelengths. 10110759Product No. A〇101 Page 12/Total 40 Page 1013155733-0 201241412 The invention described in claim 7 is the method for measuring the height of the protrusion according to item 5 of the patent application, wherein the first illumination is The main wavelength of the light to be irradiated by the irradiation program is different from the main wavelength of the light to be irradiated by the second illumination irradiation program, and the first imaging program and the second imaging program are simultaneously performed. According to the above-described protrusion height measuring device and method, even if the irradiation timings of the first and second illumination lights are turned on at the same time, the wavelengths used in the other imaging units among the images observed by the respective imaging units are used. The light is not taken. Therefore, the time required for photographing the projections by the first and second photographing sections can be shortened without affecting the measurement accuracy. The invention of claim 4, wherein the main beam of the light irradiated by the third illumination unit has a dominant wavelength of the light emitted from the third illumination unit. The first illuminating unit and/or the second illuminating unit emits light of the main imaging wavelength, and simultaneously captures the third imaging unit and the first imaging unit that captures light of a dominant wavelength different from the third imaging unit. And/or photography of the aforementioned second photographing unit. The invention of claim 8 is the method for measuring the height of the protrusion according to any one of the items 5 to 7, wherein the main wavelength of the light irradiated by the third illumination illumination program is The main wavelength of the light irradiated by the first illumination illumination program and/or the second illumination illumination program is different by 5, and the third imaging program is simultaneously photographed, and the main wavelength of light different from the third imaging program is captured. Photography of the aforementioned first imaging program and/or the aforementioned second imaging program. If the above-described protrusion height measuring device and method are used, each of the 10110759 can be numbered A_13/40 pages 1013155733-0 201241412 while the first to third illuminations are simultaneously illuminated and photographed, even by the first and second The third illumination is irradiated in the area observed by the photographing unit, and among the images observed by the respective photographing units, the light of the wavelength used in the other photographing unit is not photographed. Therefore, since it is not necessary to shift the irradiation timing of the illumination light, the time for measuring the height of the projections can be sufficiently shortened. Further, since the height of the flat portion of the portion photographed by the first and second photographing portions can be measured, even the peripheral portion of the substrate can prevent the third illumination light from being exposed from the surface of the substrate. [0004] [Effect of the Invention] For the distribution of a plurality of protrusions on the plane of the substrate, it is possible to measure not only individual differences in the relative heights of the tops of the heads in a short time but also with high precision, and also in a short time and high The height of each of the heads protruding from the plane of the substrate is accurately measured. Therefore, if the present invention is applied to the measurement of solder bumps, it is possible to prevent the occurrence of solder failure (short-circuit or poor conduction between adjacent electrodes). [Embodiment] The embodiment for carrying out the invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of a mode embodying the present invention. In each of the figures, the three axes of the orthogonal coordinates are X, Y, and Z, and the XY plane is the horizontal plane, and the Z direction is the vertical direction. In particular, the Z direction is in the direction of the arrow and in the opposite direction. The protruding portion height measuring device 1 embodying the present invention includes a substrate moving portion 2, a first observation portion 3, a second observation portion 4, and a third observation portion 5. [Substrate moving part] 10110759^^'^^ A0101 Page 14 of 40 1013155733-0 201241412
基板移動部2包含有如下的構件而構成：承載於突出 部高度測定裝置1的裝置底座（未圖示）上之Y轴平台21 ; 安裝於Y軸平台21上之X軸平台22 ;安裝於X軸平台22上 之台子（table)23。Y軸平台21能以規定的速度使安裝於 其上的X軸平台22移動於Y方向，使其定位移動、靜止於 規定的位置，X軸平台22能以規定的速度使安裝於其上的 台子23移動於X方向，使其定位移動於規定的位置，台子 23在其表面形成有溝或孔，前述溝或孔透過開關控制用 闊連接於真空源。在台子23上可承載成為測定對象的基 板1 0。 基板移動部2因成如上述的構成，故能以規定的速度 使承載於台子23上的基板10移動於XY方向，使其定位移 動、靜止於規定的位置。 [基板觀察部]The substrate moving unit 2 includes a Y-axis stage 21 carried on a device base (not shown) of the protrusion height measuring device 1 and an X-axis platform 22 mounted on the Y-axis stage 21; A table 23 on the X-axis platform 22. The Y-axis stage 21 can move the X-axis stage 22 mounted thereon in the Y direction at a predetermined speed, and can be positioned and moved to be at a predetermined position, and the X-axis stage 22 can be mounted thereon at a predetermined speed. The table 23 is moved in the X direction to be positioned and moved to a predetermined position, and the table 23 is formed with a groove or a hole on the surface thereof, and the groove or hole is connected to the vacuum source through the switch control. The substrate 10 to be measured can be carried on the table 23. Since the substrate moving portion 2 has the above configuration, the substrate 10 placed on the table 23 can be moved in the XY direction at a predetermined speed, and positioned and moved to a predetermined position. [Substrate observation unit]
第一觀察部3包含有當作第一照明部的同軸落射照明 (coaxialepi-illumination)31、當作第一攝影部的 鏡筒34與攝影機35而構成。同軸落射照明31可朝基板10 照射由第一方向照射的第一照明光32。由同軸落射照明 31照射，透過基板10的平面及基板10上的突出部的頭頂 部反射的第一反射光33通過鏡筒34被攝影機35的攝影部 接收。鏡筒34組裝有透鏡等的光學元件，將基板10上的 突出部的頭頂部放進焦點深度（depth of focus)内並 使其成像於攝影機35的攝影部而構成。 第二觀察部4包含有當作第二照明部的照明41、當作 第二攝影部的鏡筒44與攝影機45而構成。照明41可朝基 板10照射由第二方向照射的第二照明光42。由照明41照 10110759戶單編號A_ 第15頁/共40頁 1013155733-0 201241412 射，透過基板10的平面及基板10上的突出部的頭頂部反 射的第二反射光43通過鏡筒44被攝影機45的攝影部接收 。鏡筒44組裝有透鏡等的光學元件，將基板10上的突出 部的頭頂部放進焦點深度内並使其成像於攝影機4 5的攝 影部而構成。 第三觀察部5包含有當作第三照明部的線照明51、當 作第三攝影部的鏡筒54與攝影機55而構成。線照明51可 朝基板1 0由第三方向以規定的長度照射線狀的第三照明 光52。當作線照明51被照射，在基板10的平面及基板10 上的突出部的頭頂部反射的第三反射光53通過鏡筒54被 攝影機55的攝影部接收。鏡筒54組裝有透鏡等的光學元 件，將基板10的平面放進焦點深度内並使其成像於攝影 機55的攝影部而構成。 攝影機35與照明41與攝影機45與線照明51與攝影機 5 5被安裝於如下：被安裝於突出部高度測定裝置1的前述 裝置底座的框架（frame)(未圖示）。 上述的同軸落射照明31被安裝於鏡筒34而使用，可 舉例說明光被照射於如下的範圍的形態：包含透過鏡筒内 部的半鏡（ha 1 f mirror)反射的光藉由攝影機35拍攝的 範圍。 上述的照明41可舉例說明組合點光源、線發光或面 發光的光源與鏡子（mirror)或透鏡的形態者，若為光被 照射於包含透過攝影機45拍攝的範圍之範圍的話即可。 上述的線照明51可舉例說明使用線發光、點光源或 面發光的光源，將被照射的光成形成線狀者，或使由雷 射或雷射二極體（laser diode)發出的光束通過柱面透 10110759#單職崖01 第16頁/共40頁 1013155733-0 201241412 鏡（cylindrical lens)，或透過柱面透鏡使其反射， 延伸於一方向，成形成線狀者。 上述攝影機35、45、55可舉例說明被稱為影像區域 感測器（image area sensor)之CCD或CMOS所代表的攝 影元件被二維地排列的形態者，可將依照拍攝的影像的 亮度的影像信號輸出到外部。 圖2是顯示體現本發明的形態的一例之系統構成圖。 如圖2所示，體現本發明的突出部高度測定裝置1為上述 的基板移動部2、第一觀察部3、第二觀察部4及第三觀察 部5的各機器與控制部9的各機器連接。 在控制部9連接包含有：控制用電腦90、資訊輸入部 91、資訊輸出部92、發出警告部93、資訊記錄部94、機 器控制單元95、影像處理單元96。 控制用電腦90可舉例說明微電腦、個人電腦、工作 站（work station)等的搭載有數值運算單元者。資訊輸 入部91可舉例說明鍵盤或滑鼠或開關等。資訊輸出部92 可舉例說明影像顯示顯示器或燈等。 發出警告部93可舉例說明蜂鳴器（buzzer)或揚聲器 (speaker)、燈等可提醒作業者者。 資訊記錄部94可舉例說明記憶卡（memory card)或 資料碟（data disk)等的半導體記錄媒體或磁記錄媒體 或光磁記錄媒體等。 機器控制單元95可舉例說明可程式控制器 (programmable control ler)或被稱為運動控制器 (motion controller)的機器等。 由攝影機35、45、55輸出的影像信號經由影像處理 單編號崖〇1 第17頁/共40頁 1013155733-0 201241412 單元96被輸入到控制用電腦90。影像處理單元96—般搭 載有被稱為框接收器（frame grabber)等之將影像信號 數位化（digitize)的裝置（device)，取入由攝影機35 、4 5、5 5輸出的影像信號，根據以各個攝影機拍攝的視 野内的亮度資訊，以超過預先設定的參考值（reference value)的亮度的觀察點當作亮點（bright spot)掌握， 可檢測突出部的頭頂部。再者，若校準（calibrate)相 當於觀察視野的實際的觀察面的尺寸，則也可對前述亮 點位於視野内的哪一位置進行運算處理，可將基板上的 亮點的位置換算成實際尺寸而算出。 影像處理單元96可舉例說明設置於控制用電腦90的 外部的形態者、連接於控制用電腦90的框體内的形態者 、利用控制用電腦90的影像處理部的形態者等。 再者，如在後述詳細說明的，影像處理單元96或控 制用電腦90以超過預先設定的參考值的亮度的觀察點當 作亮點掌握，可測定分布複數個於基板平面上的突出部 之由前述基板平面突出的高度，構成算出突出部的頭頂 部彼此的相對高度之相對高度運算部。 在機器控制單元95連接有Y軸平台21、X軸平台22。 對基板10上的任意的區域，使台子23移動、靜止，以便 能以攝影機35、45取得影像而取得影像。或者一邊以規 定的速度移動台子23，同時照明使用氣燈（xenon 1 amp) 或鹵素燈（halogen lamp)並瞬間地發出大光量的光，或 使用具有高速快門功能的照相機，以取得被當作靜止的 影像也可以。 而且，在機器控制單元95連接有分別個別地用以調 H)蘭5#單編號A0101 第18頁/共40頁 1013155733-0 201241412 節同軸落射照明31、照明41及線照明51的光量之光量調 節單元30、40、50。光量調節單元3〇、40、50中的照明 的光量調節的方式可舉例說明調節施加的電壓或電流， 或調節電壓或電流的施加時間的方式。 機器控制單元95與其他的控制機器（未圖示）連接， 可藉由對該等其他的控制機器給予控制用信號，使各機 器動作或使其靜止。 [立體觀察] Ο 突出部1〇b的頭頂部的各個高度的個別差異的測定是 使用兩台攝影機35、45，根據被稱為立體觀察法的手法 進行。圖3是顯示體現本發明的形態的一例之部分放大斜 視圖’將圖1部分故大而顯示。由第一方向照射的第一照 明光32與由第二方向照射的第二照明光42朝攝影機35及 攝影機45互相共通觀察之基板1〇的觀察區域被照射。 在圖3中’為了使說明簡單化起見，顯示在觀察區域 10f内包含有9個突出部l〇b的樣子。著眼於其中3個突出 〇 部WbWObS ’針對前述照明光32、42之中，被照射到 突出部10匕1~10匕3的各個頭頂部的一點1〇"(：1〜1〇^：3且反 射的光33al〜33a3及43al~43a3進行說明》 第一照明光32a卜32a3與第二照明光42a卜42a3各 自朝突出部10b卜10b3的各個頭頂部的一點i〇ti~i〇t3 被照射。進而在突出部l〇bl〜l〇b3的各個頭頂部的一點 10U〜10t3反射的光各自以第一反射光333卜33&3與第 二反射光43al〜43a3藉由攝影機35、45拍攝。 此時’第一照明光32al〜32a3與第一反射光 1013155733-0 33al~33a3由於是在突出部的頭頂部反射的光，故有正 1〇11〇759#單編號A0101 第19頁/共40頁 201241412 反射的關係。同樣地，第二照明光42a卜42a3與第二反 射光43al~43a3也有正反射的關係。 圖4是體現本發明的形態的一例之藉由第一觀察部拍 攝的舉例說明影像’顯示藉由第一攝影部的攝影機35觀 察到的影像的例子。前述影像是表示由正交於基板1〇的 方向（Y方向）以攝影機35觀察到觀察區域1〇f的X方向及γ 方向之影像。 在以第一攝影部觀察到的影像中，突出部 1 Ob 1〜1 0b3的頭頂部的一點1 〇 11〜1 〇 13以亮點被拍攝， 因突出部成略球狀，故頭頂部以外的部分1〇rl〜1〇r3以 暗部被拍攝。而且，因第一照明光3231~3233與第一反 射光33al〜33a3都對基板表面成垂直的角度’故在顯示 突出部的暗部影像的中央就會被觀察到顯示突出部的頭 頂部的亮點。此時，將在攝影機35的攝影區域内被觀察 到的距前述點l〇t卜10t3的基準點（reference point)10t0的距離分別定義為。 圖5是體現本發明的形態的一例之藉由第二觀察部拍 顯示藉由第二攝影部的攝影機45觀 將與圖3中的第二反射光43a、43b正 方向，表示以第二攝影部觀察到觀察 攝的舉例說明影像， 察到的影像的例子。 交的方向定義為Y， 區域l〇f的X方向及γ，方向之影像。 點被拍攝，惟因由斜方向觀察，起 以外的部分1〇!>的暗部成延伸於γ， 在前述影像中，突出部1〇b的頭頂部的一點m以亮 ’故顯示突出部的頭頂部The first observation unit 3 includes a coaxial epi-illumination 31 as a first illumination unit, a lens barrel 34 as a first imaging unit, and a camera 35. The coaxial epi-illumination illumination 31 can illuminate the substrate 10 with the first illumination light 32 illuminated by the first direction. The first reflected light 33 reflected by the coaxial epi-illumination illumination 31 and transmitted through the plane of the substrate 10 and the top portion of the projection on the substrate 10 is received by the imaging unit of the camera 35 through the lens barrel 34. An optical element such as a lens is incorporated in the lens barrel 34, and the head top of the protruding portion on the substrate 10 is placed in a depth of focus and formed on the imaging portion of the camera 35. The second observation unit 4 includes an illumination 41 as a second illumination unit, a lens barrel 44 as a second imaging unit, and a camera 45. The illumination 41 can illuminate the substrate 10 with the second illumination light 42 illuminated by the second direction. The second reflected light 43 reflected by the plane of the substrate 10 and the top of the protrusion on the substrate 10 is passed through the lens barrel 44 by the illumination 41, according to the illumination of the camera 110, 10110759, unit number A_, page 15 of 40, 1013155733-0, 201241412. The photography department of 45 receives. The lens barrel 44 is assembled with an optical element such as a lens, and the head top of the protruding portion on the substrate 10 is placed in the depth of focus and imaged on the imaging portion of the camera 45. The third observation unit 5 includes a line illumination 51 as a third illumination unit, a lens barrel 54 as a third imaging unit, and a camera 55. The line illumination 51 can illuminate the linear third illumination light 52 with a predetermined length from the third direction toward the substrate 10. As the line illumination 51 is irradiated, the third reflected light 53 reflected on the plane of the substrate 10 and the top of the protruding portion on the substrate 10 is received by the imaging unit of the camera 55 through the lens barrel 54. The lens barrel 54 is assembled with an optical element such as a lens, and the plane of the substrate 10 is placed in the depth of focus and formed on the imaging unit of the camera 55. The camera 35, the illumination 41, the camera 45, the line illumination 51, and the camera 55 are attached to a frame (not shown) of the device base attached to the protrusion height measuring device 1. The above-described coaxial epi-illumination illumination 31 is used by being attached to the lens barrel 34, and can exemplify a form in which light is irradiated in a range in which light reflected by a half mirror (ha 1 f mirror) that passes through the inside of the lens barrel is photographed by the camera 35. The scope. The above-described illumination 41 can exemplify a combination of a point light source, a line light source or a surface light source, a mirror or a lens, and the light can be irradiated to a range including a range photographed by the camera 45. The above-described line illumination 51 can exemplify a light source that uses line illumination, point light source, or surface illumination to form a line that is illuminated, or to pass a beam of light emitted by a laser or a laser diode. Cylindrical surface 10110759# Single job cliff 01 Page 16 / Total 40 pages 1013155733-0 201241412 Mirror (cylindrical lens), or through the cylindrical lens to reflect, extending in one direction, forming a line. The cameras 35, 45, and 55 can exemplify a form in which a photographic element represented by a CCD or a CMOS called an image area sensor is two-dimensionally arranged, and can follow the brightness of the captured image. The image signal is output to the outside. Fig. 2 is a system configuration diagram showing an example of a mode embodying the present invention. As shown in FIG. 2, the protrusion height measuring apparatus 1 embodying the present invention is each of the above-described substrate moving unit 2, the first observation unit 3, the second observation unit 4, and the third observation unit 5, and each of the control unit 9. Machine connection. The control unit 9 is connected to include a control computer 90, an information input unit 91, an information output unit 92, a warning unit 93, an information recording unit 94, a machine control unit 95, and an image processing unit 96. The control computer 90 can be exemplified by a numerical calculation unit equipped with a microcomputer, a personal computer, a work station, or the like. The information input unit 91 can exemplify a keyboard or a mouse or a switch. The information output unit 92 can exemplify an image display display, a lamp, or the like. The issuing warning unit 93 can exemplify a buzzer or a speaker, a lamp, or the like to alert the operator. The information recording unit 94 can exemplify a semiconductor recording medium such as a memory card or a data disk, a magnetic recording medium, a magneto-optical recording medium, or the like. The machine control unit 95 can exemplify a programmable controller or a machine called a motion controller. The video signals output by the cameras 35, 45, and 55 are processed by the image processing. Single-numbered cliffs 1 Page 17 of 40 1013155733-0 201241412 The unit 96 is input to the control computer 90. The image processing unit 96 is generally equipped with a device for digitizing a video signal, such as a frame grabber, and takes in image signals output by the cameras 35, 45, and 5 5 . Based on the brightness information in the field of view taken by each camera, the observation point of the brightness exceeding the preset reference value is grasped as a bright spot, and the top of the protrusion can be detected. Further, if the calibration corresponds to the size of the actual observation surface of the observation field of view, it is also possible to calculate which position of the bright point is in the field of view, and to convert the position of the bright spot on the substrate into the actual size. Calculated. The image processing unit 96 can exemplify a form of the outside of the control computer 90, a form of the image processing unit connected to the control computer 90, and a form of the image processing unit using the control computer 90. Further, as will be described later in detail, the image processing unit 96 or the control computer 90 grasps the observation point of the brightness exceeding the preset reference value as a bright spot, and can measure the number of the projections distributed on the substrate plane. The height at which the substrate plane protrudes constitutes a relative height calculation unit that calculates the relative heights of the head portions of the protruding portions. A Y-axis stage 21 and an X-axis stage 22 are connected to the machine control unit 95. The table 23 is moved and stopped in an arbitrary area on the substrate 10 so that the images can be acquired by the cameras 35 and 45 to obtain an image. Or, while moving the table 23 at a predetermined speed, and simultaneously illuminating a light lamp (xenon 1 amp) or a halogen lamp and instantaneously emitting a large amount of light, or using a camera having a high-speed shutter function to obtain a Still images are also available. Moreover, the amount of light of the amount of light of the coaxial epi-illumination 31, the illumination 41, and the line illumination 51 is separately connected to the machine control unit 95 for individually adjusting the H) blue 5# single number A0101 page 18 / total 40 page 1013155733-0 201241412 section. Adjustment unit 30, 40, 50. The manner in which the amount of illumination of the illumination in the light amount adjusting units 3, 40, 50 is adjusted may exemplify a method of adjusting the applied voltage or current, or adjusting the application time of the voltage or current. The machine control unit 95 is connected to another control device (not shown), and each of the control devices can be given a control signal to operate or stop each of the machines. [Stereoscopic observation] 个别 The measurement of the individual differences in the heights of the tops of the projections 1b is performed using two cameras 35 and 45 according to a method called stereoscopic observation. Fig. 3 is a partial enlarged perspective view showing an embodiment of the present invention. The observation area of the substrate 1A which is observed by the first illumination light 32 irradiated in the first direction and the second illumination light 42 irradiated in the second direction toward the camera 35 and the camera 45 is irradiated. In Fig. 3, for the sake of simplification of the description, it is shown that nine projections 10b are included in the observation region 10f. Focusing on one of the three protruding ridges WbWObS' for the aforementioned illumination lights 32, 42, one point of the top of each of the protrusions 10匕1 to 10匕3 is 〇"(:1~1〇^: 3 and the reflected light 33a1 to 33a3 and 43al to 43a3 will be described. The first illumination light 32a 32a and the second illumination light 42a 42a3 each point toward the top of each of the protrusions 10b and 10b3. i〇ti~i〇t3 Further, the light reflected at a point 10U to 10t3 at the top of each of the protrusions l〇b1 to lb3 is respectively the first reflected light 333, 33 & 3 and the second reflected light 43al to 43a3 by the camera 35, 45. At this time, the first illumination light 32al~32a3 and the first reflected light 1013155733-0 33al~33a3 are light reflected at the top of the protrusion, so there is a positive 1〇11〇759# single number A0101 19th Pages/Total 40 pages 201241412 Relationship of reflections Similarly, the second illumination light 42a 42a3 and the second reflected light 43al~43a3 also have a regular reflection relationship. Fig. 4 is a first observation of an embodiment embodying the present invention. An example of the shooting of the image shows that the image viewed by the camera 35 of the first photographing unit is displayed. In the example, the image is an image in which the X direction and the γ direction of the observation area 1〇f are observed by the camera 35 in a direction orthogonal to the substrate 1 (Y direction). In the image observed by the first imaging unit, The point 1 at the top of the head of the protrusion 1 Ob 1 to 1 0b3 is 1 〇 11 to 1 〇 13 is photographed at a bright spot, and since the protruding portion is slightly spherical, the portion other than the top of the head 1 〇 rl 1 1 〇 r3 is photographed in a dark portion. Further, since the first illumination light 3231 to 3233 and the first reflected light 33al to 33a3 are both perpendicular to the surface of the substrate, the top of the display portion of the projection is observed at the center of the dark portion of the display portion. In this case, the distance from the reference point 10t0 of the point l〇tb 10t3 observed in the imaging area of the camera 35 is defined as Fig. 5 is an example of a form embodying the present invention. The second observation unit captures and displays the positive direction of the second reflected light 43a, 43b in FIG. 3 by the camera 45 of the second imaging unit, and indicates an example image observed by the second imaging unit. An example of the image that is sent. The image is defined as Y, the X direction of the region l〇f, and the image of the γ direction. The point is captured, but the dark portion of the other part 1 〇!> extends from γ in the above image. The point m at the top of the head of the protrusion 1〇b is bright, so the top of the protrusion is displayed.
第20頁/共4〇頁 如腿#單編號則01 1013155733-0 201241412 下被觀察到。此時，將在攝影機45的攝影區域内被觀察 到的距前述點I〇tl~l〇t3的基準點10t0的距離分別定義 為d，卜d，3。 圖6是顯示體現本發明的形態的一例之前視圖，顯示 由側面（亦即X方向的箭頭方向）看圖3的樣子。顯示以攝 影機35拍攝的突出部1〇1)1~1〇]33的頭頂部的亮點的位置 之dl〜d3即使突出部i〇bl〜1〇b3的高度有個別差異也不變 化。另一方面，顯示以攝影機45拍攝的突出部 10bl〜10b3的頭頂部的亮點的位置之d，卜d，3若突出部 10bl~10b3的高度有個別差異，則會與高度的個別差異 成比例而變化。此處，設突出部1 Q b.i〜1 〇 b3的各個高度 為H1~H3，設該等突出部i〇bl~l〇b3的高度的個別差異為 △ h〗〜Ah3, 一般式是定義第η個突出部的高度為η ，定 η 義該等突出部的高度的個別差異為而表示。 η 在圖6中，對突出部i〇bl~l〇b3的高度H^H^h，突 出部10b3,的高度成為H3，=h-Ah3的狀態被圖示。亦 即突出部10b3如以虛線表示的突出部b3’般，當高度 僅低△、時，透過突出部10b3，的頭頂部反射的光43a3 與前述反射光43a3比較，會在γ，方向僅移位。 3 基板表面與第一反射光所成的角度01為9〇度，若設 基板表面與第二反射光所成的角度02與前述角度01的 角度差為β，則在第η個突出部中的高度的個別差異 ，與根據觀察其頭頂部的影像而算出的移位量Ad之間 η [公式1] 10110759#單編號 Α0101 第21頁/共40頁 1013155733-0 201241412 A dn=A hn、s ί η 0 [0006] 的關係成立，可根據 [公式2] △ d η in Θ Δ h π= 一 s 剛的_式算出气（在圖6中圖示n=3的情形當適 發明時，將細0的突出部10b適宜區分成規定的攝 圍’每-已區分的攝影範圍透過兩個觀察部同時/ 然後可由包含於所拍攝的影像的各亮點資訊，算出各個 突出部的頭頂部的高度的個別差異。 [線光三角測量法] 在依照上述的立體觀察法的測定方法中，雖然可求 各突出部的頭頂部彼此的高度的個別差異，但無法求突 出部〗Ob之距基板10的表面的高度h。乃因被由基板平 1 反射的光的光量與來自前述頭頂部的反射光比較，過強 或過弱’很難特定基板平面部的規定的場所。而且，即 使被由基板平面反射的光的光量適切，當排列同樣的配 線圖案時，或完全無配線圖案時，無法特定以兩台攝影 機拍攝的同一點。因此，朝基板丨〇的表面由第三方向照 射線狀的第三照明光52，以第三攝影部拍攝其反射光， 使用三角測量的原理測定突出部1 Ob之在基板1 〇的正確的 位置’如後述，組合上述的立體觀察法與下述的光切法 ’算出突出部之距基板平面的高度的分布。 1013155733-0 第22頁/共40頁 201241412 圖疋體見本發明的形態的一例之藉由第三觀察部拍 攝的舉例說明影像，翱_ _丄雄_μ 員不猎由第二攝景> 部的攝影機5 5觀 察到的〜像的例子。將與第三反射光53正交的方向定義 為Υ方向’顯不拍攝了圖i中的第三反射光Μ的樣子。 在‘述如像中被由第三照明部照射的線照明Η以比突 出部的直徑還長的線狀的照明光被照射，在突出部10b的 頭頂^反射的光53a以點狀的光，在基板10的平面部反射 的光53b以線狀的光被拍攝。此時，設在攝影機π的攝影 丨 區域内觀察到的透過_部反射的光53a之距基準點l〇g 的Y方向的距離為Li’將在基板1〇的平面部反射的光 53b之距基準點l〇g的距離定義為基準點到基面的r方向 的距離L2 °在本方式中，因若突出部的大小小的話，在 頭頂部反射的光53a的光量比在基板10的平面部反射的光 53b還微弱’故前述距離L1不測定，根據基準點到基面的 Y”方向的距離L2進行測定，使其適用本發明。 圖8是顯示體現本發明的形態的一例之前視圖，顯示 I 由侧面（亦即X方向的箭頭方向）看圖1的樣子。第三照明 光52朝基板10由第三方向與基板10的表面成規定的角度 03而被照射，在突出部的頭頂部反射的光53a與由基板 10的表面反射的光53b所成的角度’和與基板的表面所 成的規定的角度Θ3相等。 此時設基準點為RP，將由該部分以角度03反射的光 53z藉由攝影機55觀察的位置定義為Lz。在基準點RP之 距基板10表面的高度h0，與藉由攝影機55觀察到的透過 基準點RP反射的光53z與在基板1〇表面反射的光53b的距 離L2之間， 10U0759#單編號 A〇1〇l 第 23 頁 / 共 40 頁 1013155733-0 201241412 若定義基準點Rp到基板10的表面的距離為L’ ，則 如下的關係成立： L2 = L’ . sin2 0 3 h〇=L’ . sin03 由根據所觀察到的影像算出的移位量[2，可根據 [公式3] h〇=：L2 sin 2 θ 3Page 20 of 4 Pages If the leg #单号 is 01 1013155733-0 201241412 is observed. At this time, the distances from the reference points 10t0 of the aforementioned points I 〇 t1 to l 〇 t3 observed in the imaging area of the camera 45 are defined as d, d, and d, respectively. Fig. 6 is a front view showing an example of a mode embodying the present invention, showing a state in which Fig. 3 is viewed from the side (i.e., the direction of the arrow in the X direction). The positions of the bright spots at the top of the heads of the projections 1〇1) 1 to 1〇] 33 taken by the camera 35 are displayed. dl to d3 are not changed even if the heights of the projections i 〇 b1 to 1 〇 b3 are different. On the other hand, the position d of the bright spot at the top of the head portion of the protruding portions 10b1 to 10b3 photographed by the camera 45 is displayed, and if the heights of the protruding portions 10b1 to 10b3 are individually different, they are proportional to the individual differences in height. And change. Here, it is assumed that the heights of the protrusions 1 Q bi 〜 1 〇 b3 are H1 to H3, and the individual differences of the heights of the protrusions i 〇 b1 to l 〇 b3 are Δ h 〗 〖Ah3, and the general formula is defined. The height of the n protrusions is η, and the individual differences of the heights of the protrusions are defined as η. η In Fig. 6, the height H^H^h of the protruding portion i〇bl~l〇b3, the height of the protruding portion 10b3 is H3, and the state of =h-Ah3 is shown. That is, the protruding portion 10b3 is like the protruding portion b3' indicated by a broken line. When the height is only low Δ, the light 43a3 reflected from the top of the protruding portion 10b3 is compared with the reflected light 43a3, and is shifted in the γ direction. Bit. 3 The angle 01 between the surface of the substrate and the first reflected light is 9 degrees. If the angle difference between the angle 02 formed by the surface of the substrate and the second reflected light and the angle 01 is β, then in the nth protrusion The individual difference in height is determined by the amount of shift Ad calculated from the image at the top of the head. [Formula 1] 10110759#单号Α0101 Page 21/Total 40 Page 1013155733-0 201241412 A dn=A hn, The relationship of s ί η 0 [0006] is established, and the gas can be calculated according to [Formula 2] Δ d η in Θ Δ h π = s _ just (the case where n = 3 is illustrated in Fig. 6 when it is suitable for invention) The protruding portion 10b of the thin 0 is appropriately divided into a predetermined shooting range. Each of the divided shooting ranges is simultaneously transmitted through the two viewing portions. Then, the highlights of the respective captured portions can be calculated from the respective highlight information included in the captured image. [Line light triangulation method] In the measurement method according to the stereoscopic method described above, although the individual differences in the heights of the head portions of the respective protruding portions can be obtained, the distance between the protrusions and the Ob can not be obtained. The height h of the surface of the substrate 10 is reflected by the substrate 1 The amount of light is too strong or too weak to be compared with the reflected light from the top of the head. It is difficult to specify a predetermined place on the plane of the substrate. Moreover, even when the amount of light reflected by the plane of the substrate is appropriate, when the same wiring pattern is arranged When the wiring pattern is completely absent, the same point that is captured by the two cameras cannot be specified. Therefore, the surface of the substrate 照射 is irradiated with the linear third illumination light 52 in the third direction, and the reflected light is taken by the third imaging unit. Using the principle of triangulation, the position of the protrusion 1 Ob at the correct position of the substrate 1 is measured. As will be described later, the above-described stereoscopic method and the following photo-cutting method are combined to calculate the distribution of the height of the protruding portion from the substrate plane. 1013155733-0 Page 22 of 40201241412 The figure shows an example of an image taken by the third observation unit as an example of the aspect of the present invention, 翱__丄雄_μ member is not hunting by the second scene> The example of the image that is observed by the camera 5 5 is defined as the direction orthogonal to the third reflected light 53 as the Υ direction 'the state of the third reflected pupil in the image i is not taken. in The line illumination illuminating by the third illumination unit is irradiated with linear illumination light longer than the diameter of the protruding portion, and the light 53a reflected at the top of the protruding portion 10b is spot-shaped light on the plane portion of the substrate 10. The reflected light 53b is imaged by linear light. At this time, the distance of the light-reflected portion 53a observed in the imaging pupil region of the camera π from the reference point l〇g in the Y direction is Li'. The distance from the reference point l〇g of the light 53b reflected on the plane portion of the substrate 1〇 is defined as the distance L2 from the reference point to the r-direction of the base surface. In the present embodiment, if the size of the protruding portion is small, the head is The amount of light of the light 53a reflected at the top is weaker than the light 53b reflected on the plane portion of the substrate 10. Therefore, the distance L1 is not measured, and the distance L2 from the reference point to the Y direction of the base surface is measured, and the present invention is applied. Fig. 8 is a front view showing an example of a mode embodying the present invention, and shows a state in which Fig. 1 is viewed from the side (i.e., the direction of the arrow in the X direction). The third illumination light 52 is irradiated toward the substrate 10 at a predetermined angle 03 from the surface of the substrate 10 in the third direction, and the angle of the light 53a reflected at the top of the protrusion and the light 53b reflected by the surface of the substrate 10 is formed. 'It is equal to a predetermined angle Θ3 formed by the surface of the substrate. At this time, the reference point is RP, and the position of the light 53z reflected by the portion at the angle 03 by the camera 55 is defined as Lz. The height h0 from the surface of the substrate 10 at the reference point RP, and the distance L2 between the light 53z reflected by the transmission reference point RP observed by the camera 55 and the light 53b reflected on the surface of the substrate 1 is 10U0759# single number A 〇1〇l Page 23 of 40 1013155733-0 201241412 If the distance from the reference point Rp to the surface of the substrate 10 is defined as L', the following relationship holds: L2 = L' . sin2 0 3 h〇=L' Sin03 is the amount of shift calculated from the observed image [2, according to [Formula 3] h〇=:L2 sin 2 θ 3
[0008]的關係式算出h〇e 實際的各頭頂部的高度\若以Z方向、γ，方向、γ” 方向的箭頭的方向當作正成分表示，則由公式1 ' 2的△ hn及公式3齡0 ’第η個突出部的頭頂部之距基板1〇表面 的高度Ηη可藉由下式算出。 [公式4] [0009][0008] The relational expression calculates the height of the top of each head of h〇e. If the direction of the arrow in the Z direction, γ, direction, and γ" direction is expressed as a positive component, the Δ hn of the formula 1 ' 2 and The height Ηη of the top surface of the n-th protrusion from the surface of the substrate 1 is calculated by the following equation: [Formula 4] [0009]
Hn = h 0+Δ hHn = h 0+Δ h
—Adn s * n 203 ~7Τ7Γθ [基準點與突出部的頭頂部高度的偏位調整（〇ffset adjustment)] 藉由上述的立體觀察法算出的高度的_差異Μ ’與藉由上述的線光三角測量法算出的基準點Rp之距基n 板10表面的高細是如下述崎運算，並進行偏位調整（ 參照圖6、圖8)。 首先’準備形成有格子狀__attern)的校準 工具（calibration to〇l)i〇c， 10Π 0759#單編號A01〇l 第24頁/共4〇頁 以攝影機35、45拍攝 1013155733-0 201241412 該等圖案的圖樣。此時，鉻膜1 Op為厚度已知且均勻的金 屬膜，表面反射的光使用攝影機35、45而被立體觀察。 再者，校準工具l〇c的石英面（亦即格子狀的圖案的底部） 使用線狀的第三照明光52與攝影機55，觀察來自石英面 的反射光。—Adn s * n 203 ~7Τ7Γθ [Offset adjustment of the height of the top of the reference point and the protruding portion] _ difference Μ ' of the height calculated by the stereoscopic method described above and the line light by the above The height of the reference point Rp calculated by the triangulation method from the surface of the base n-plate 10 is adjusted as follows, and the offset adjustment is performed (see Figs. 6 and 8). First, 'calibration to 〇 〇 ) , , , , , , , 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 759 The pattern of the pattern. At this time, the chromium film 1 Op is a metal film having a known thickness and uniformity, and the light reflected from the surface is stereoscopically observed using the cameras 35 and 45. Further, the quartz surface of the calibration tool 100 (i.e., the bottom of the lattice pattern) uses the linear third illumination light 52 and the camera 55 to observe the reflected light from the quartz surface.
此時，在鉻膜10p的表面有基準點RP，設基準點RP 與基板面的高度的差為hO。然後，以藉由上述的立體觀 察法（參照圖6)算出的第η個突出部的高度Η的個別差異 η △ h當作對於頭頂部的高度對基準點RP的高度hO的個別 D n 差異而算出。於是，可由根據藉由立體觀察法觀察到的 影像算出的移位量Ad ，與根據藉由線光三角測量法觀 η 察到的影像算出的移位量L2，算出實際的突出部的頭頂 部的高度Η 。 η [觀察、測定流程] 圖9是顯示體現本發明的形態的一例的動作流程之流 程圖，將在基板10上具有多數個的突出部10b區分成幾個 區域並重複逐次移動及觀察，算出各個突出部的高度之At this time, the reference point RP is present on the surface of the chrome film 10p, and the difference between the height of the reference point RP and the substrate surface is hO. Then, the individual difference η Δ h of the height Η of the n-th projection calculated by the stereoscopic method described above (refer to FIG. 6 ) is taken as the individual D n difference of the height hO of the height of the head to the reference point RP. And calculate. Then, the head portion of the actual protruding portion can be calculated from the shift amount Ad calculated from the image observed by the stereoscopic observation method and the shift amount L2 calculated from the image observed by the line light triangulation method η. The height of the Η. η [Observation and Measurement Flow] FIG. 9 is a flowchart showing an operation flow of an example of the embodiment of the present invention, in which a plurality of protruding portions 10b are formed on the substrate 10 into a plurality of regions, and the movement and observation are repeated one by one to calculate The height of each protrusion
tJ 一連串的流程是以每一步驟顯示。 首先，將基板10承載於突出部高度測定裝置1的台子 23(sl01)。接著，使台子23移動到觀察位置（sl02)， 朝觀察區域10f由第一方向照射第一照明光32(sll3)， 以前述第一攝影部觀察反射的光（sll4)。然後，朝觀察 區域10f由第二方向照射第二照明光42(sl23)，以前述 第二攝影部觀察反射的光（sl24)。然後，朝觀察區域 10f由第三方向照射線狀的第三照明光52(sl33)，以前 述第三攝影部觀察反射的光（sl34)。然後，算出觀察區 10110759#單編號麵1 帛 25 頁 / 共 40 頁 1013155733-0 201241412 域i〇f内的各個突出部10b之距基面的高度（si〇5)。 其次’判斷是否針對所㈣觀察對㈣域進行觀察 (sl〇6)，若有應接著觀察的觀察對象區域，則使台子Μ 移動到該場所，重複上述的步驟S102、sii3~s134、 。若被判斷為所有的觀察結束，則將在各觀察區域 2异出的結果合成’當作基板1〇内的所有的突出部⑽的 高度算出（sl〇7)。 若所有的突出部10b的高度的算出結束，則使台子 23朝基板遞送位置移動（sl〇8)，由台子㈡取出基板 I〇(sl〇9)。 在根據上述的立體觀察法的觀察中，第一照明光及 第二照明光若主波長相同，則不是使其同時發光，而是 频錯開發糾序較佳。此情形，若各自的發光時間為 紐a宁間，則可不那麼增加拍攝一個觀察區域的時間而進 行測定。再者，因可使第—照明光及第二照明光成相同 的主波長，故可使照明或攝影機、濾鏡（filter)等的零 件共通化，無須個別準備專用零件。因此，可達成可謀 求裝置或維修保養的成本降低之功效。 而且，若發光時間非常少，則因可藉由錯開發光時 間及拍攝時序而不檢測出由他方的照明造成的亮點，故 可適用本發明。 即使線狀的第三照明光52照射到觀察區域1〇f之外 也能適用本發明，惟照射於觀察區域1 Of内較佳。據此， 可防止第二照明光由基板表面露出。此時，若第三照明 光52為與第一及第二照明光32、33相同的主波長，則稍 微錯開發光時序即可’當第一〜第三照明光的發光時間及 1013155733-0 10110759产單編號麵 第26頁/共40頁 201241412 攝影時間以及到下一個發光為止的時間非常少時，可以 說上述的步驟sll2~sl34可大致同時進行。 [變異（var iat ion)] 另一方面，當想更縮短攝影時間時，第一照明光與 第二照明光以不同的主波長成分，以第—攝影部僅拍攝 第一照明光的主波長，第二攝影部僅拍攝第二照明光的 主波長的形態較佳。例如使用紅色照明當作第—照明光 ，在第一攝影部使用僅使紅色的波長區域透過的帶通濾 波器（bandpass filter )Fr，使用綠色照明當作第二照 明光，在第二攝影部使用僅使綠色的波長區域透過的帶 通濾波器Fg。據此，入射到第—攝影部的綠色的照明光 藉由前述濾波器Fr吸收，入射到第二攝影部的紅色的照 明光藉由前述濾波器Fg吸收。因此，即使使第一及第二 照明光同時發光，也不檢測出由他方的照明造成的亮點 。據此，即使同時照射第一照明光與第二照明光，以兩 個攝影部同時拍攝，也能防止誤檢測應觀察的亮點的位 置。因此，即使是有許多應觀察的場所，也達成可更縮 短攝影時間之功效。此時，以第一照明光與第二煦明光 i作不同的主波長成分的具體的例子，如前述般可舉出： 使用顏色不同的照明（例如紅、綠、藍色的LED照明等）， 改變照明光的主波長成分的情形，或雖使用共通的波長 特性的照明（例如白色照明等），但使用通過特定的波長 成分的帶通濾波器並改變各自可透過的主波長成分而使 用的情形等。 而且，線狀的第三照明光52也當作與第一及第二照 明光不同的主波長成分較佳。據此，即使同時將第一〜第 1013155733-0 10110759#單編號A〇101 第27頁/共40頁 201241412 一照明光32、42、52照射到觀察區域i〇f内，彼此的昭 明光的主波長也沒有給予在其他的觀察部的败影響。、 圖10是顯示體現本發_另—形態的_例的動作流 程之流程圖，將在基㈣上具有多數個的突出部m區分 成幾個區域並重複逐次移動錢察，Μ各個突出部的 高度之另-形態的-連串的流程是以每一步驟顯示。在 使用圖9說明的形態中雖然是以時間序列地依次進行步驟 sll3~sl34的流程，但取代該程序，在此處敘述的另一 形態中是以並列進行步驟sU3~sl34的流程。據此如上 述’可更縮短步驟si 13〜si34所需的時間。 [第一方向] 針對上述中的第-攝影機，顯示第一方向對基板1〇 的表面垂直地照射照明，觀察被垂直地反射的光的形態 。但是，該第一方向若與第二方向不同的話也可以，若 為以垂直以外的角度朝基板10的表面照射者也可以。此 時，由第一方向照射的照明光若使用與照明41同樣的形 態者也可以。 [第二攝影部的傾斜（tilt)補正] 在上述中第二攝影機變成來自斜方向的攝影。因此 ，在使用區域感測器時，當使用通常的光學系時，有依 照攝影條件’拍攝的影像之内僅視野中央對焦，在視野 私偏離景冰（depth of field)而模糊的情形。因模糊 的部分的資訊在之後的處理中無法使用，故成為浪費。 因此也能以如下的形態：使光學系成移位光學配置（shift optical conf iguration)或 Scheimpf lug光學配置 (Scheimpflug 1〇1l〇759#單編號 A0101 optical conf iguration)，大大地取 第28頁/共40頁 1013155733-0 201241412 焦點深度，以便以攝影影像全面對焦且每一單位攝影的 有效影像資料變大。 [第四線照明與觀察部] 也能以如下的形態：除了上述的第三觀察部5之外， 另外更具備第四觀察部6。第四觀察部6包含有當作第四 照明部的線照明61，與當作第四攝影部的鏡筒64與攝影 機65而構成。線照明61可朝基板10由第四方向以規定的 長度照射線狀的照明光62。 由線照明61照射，在基板10的平面及基板10上的突 出部的頭頂部反射的第四反射光63通過鏡筒64被攝影機 65的攝影部接收。鏡筒64組裝有透鏡等的光學元件，將 基板10的平面放進焦點深度内並使其成像於攝影機65的 攝影部而構成。 由第四照明部照射的光在基板10上，被照射到與由 第三照明部照射的光不同的部位且被反射。因此，僅藉 由第三線照明無法擷取之與第三照明的縱向正交的方向 的基板的傾斜可藉由追加測定第四線照明而正確地擷取 〇 【圖式簡單說明】 [0010] 圖1是顯示體現本發明的形態的一例之斜視圖。 圖2是顯示體現本發明的形態的一例之系統構成圖。 圖3是顯示體現本發明的形態的一例之部分放大斜視 圖。 圖4是體現本發明的形態的一例之藉由第一觀察部拍 攝的舉例說明影像。 圖5是體現本發明的形態的一例之藉由第二觀察部拍 ΐ()ΐΐ(Τ7^單編號 A0101 第29頁/共40頁 1013155733-0 201241412 攝的舉例說明影像。 圖6是顯示體現本發明的形態的一例之前視圖。 圖7是體現本發明的形態的一例之藉由第三觀察部拍 攝的舉例說明影像。 圖8是顯示體現本發明的形態的一例之前視圖。 圖9是顯示體現本發明的形態的一例的動作流程之流 程圖。 圖10是顯示體現本發明的另一形態的一例的動作流 程之流程圖。 【主要元件符號說明】 [0011] 1 :突出部高度測定裝置 2 :基板移動部 3:第一觀察部 4:第二觀察部 5:第三觀察部 6:第四觀察部 10 :基板 10b、10M 〜10b3:突出部 ' 10c·.校準工具 10f :觀察區域 l〇g:基準點 1 Op :鉻膜 1 010 :基準點 1 011 ~ 1013 :突出部的各個頭頂部的一點 21 : Y軸平台 22:X軸平台 075#單編號A_ 第30頁/共40頁 1013155733-0 201241412 23:台子 30、40、50、60:光量調節單元 31 :第一照明部 32、 32al〜32a3:第一照明光 33、 33al〜33a3:第一反射光 34、 44、54、64:鏡筒 35、 45 ' 55、65:攝影機 41 :第二照明部 42、 42al~42a3:第二照明光A series of processes in tJ is shown in each step. First, the substrate 10 is placed on the table 23 of the protruding height measuring device 1 (s101). Next, the stage 23 is moved to the observation position (s102), the first illumination light 32 is irradiated toward the observation area 10f by the first direction (sll3), and the reflected light is observed by the first imaging unit (s114). Then, the second illumination light 42 is irradiated toward the observation region 10f by the second direction (s23), and the reflected light is observed by the second imaging portion (s24). Then, the linear third illumination light 52 is irradiated toward the observation region 10f by the third direction (s33), and the reflected light is observed by the third imaging unit (s34). Then, the observation area 10110759# single-numbered surface 1 帛 25 pages / total 40 pages 1013155733-0 201241412 The height of each of the protruding portions 10b in the field i〇f from the base surface (si〇5). Next, it is judged whether or not the (four) field is observed for (4) observation (sl〇6), and if there is an observation target region to be observed next, the table is moved to the place, and the above-described steps S102 and sii3 to s134 are repeated. When it is judged that all the observations have been completed, the results of the different observations in the respective observation regions 2 are combined and calculated as the heights of all the projections (10) in the substrate 1 (s1 to 7). When the calculation of the height of all the projections 10b is completed, the table 23 is moved toward the substrate delivery position (s1 to 8), and the substrate (I) is taken out by the table (2). In the observation by the stereoscopic observation method described above, if the first illumination light and the second illumination light have the same dominant wavelength, the first illumination light and the second illumination light are not simultaneously emitted, but the frequency error development is better. In this case, if the respective illuminating times are between nucleus and neon, the measurement can be performed without increasing the time for taking an observation area. Further, since the first illumination light and the second illumination light can be made to have the same dominant wavelength, it is possible to make the illumination, the camera, the filter, and the like common to each other, and it is not necessary to separately prepare a dedicated component. Therefore, it is possible to achieve the effect of reducing the cost of the device or maintenance. Further, if the light-emitting time is extremely small, the present invention can be applied because the bright spots caused by the other illumination can be detected without being detected by the wrong development of the light time and the imaging timing. The present invention can be applied even if the linear third illumination light 52 is irradiated to the observation area 1〇f, but it is preferable to irradiate it in the observation area 1 Of. According to this, it is possible to prevent the second illumination light from being exposed from the surface of the substrate. At this time, if the third illumination light 52 has the same dominant wavelength as the first and second illumination lights 32 and 33, the light timing can be slightly wrong. 'When the first to third illumination lights are illuminated, and 1013155733-0 10110759 When the time of the photographing and the time until the next lighting is very small, it can be said that the above steps sll2 to sl34 can be performed substantially simultaneously. [var iat ion] On the other hand, when it is desired to shorten the photographing time, the first illumination light and the second illumination light have different main wavelength components, and the first photographing unit only photographs the main wavelength of the first illumination light. It is preferable that the second imaging unit captures only the dominant wavelength of the second illumination light. For example, red illumination is used as the first illumination light, and a bandpass filter Fr that transmits only the red wavelength region is used in the first imaging unit, and green illumination is used as the second illumination light in the second imaging unit. A band pass filter Fg that transmits only the green wavelength region is used. As a result, the green illumination light incident on the first imaging unit is absorbed by the filter Fr, and the red illumination light incident on the second imaging unit is absorbed by the filter Fg. Therefore, even if the first and second illumination lights are simultaneously illuminated, bright spots caused by other illumination are not detected. According to this, even if the first illumination light and the second illumination light are simultaneously irradiated and the two imaging units are simultaneously photographed, it is possible to prevent erroneous detection of the position of the bright spot to be observed. Therefore, even if there are many places to be observed, the effect of shortening the shooting time can be achieved. In this case, a specific example of the main wavelength component different from the first illumination light and the second illumination light i may be as follows: illumination using different colors (for example, red, green, and blue LED illumination, etc.) When the main wavelength component of the illumination light is changed, or illumination with a common wavelength characteristic (for example, white illumination or the like) is used, but a band pass filter having a specific wavelength component is used and the respective permeable main wavelength components are changed and used. The situation, etc. Further, the linear third illumination light 52 is also preferably a main wavelength component different from the first and second illumination lights. According to this, even if the first to 1013155733-0 10110759# single number A 〇 101 page 27 / total 40 pages 201241412 illumination light 32, 42, 52 is irradiated into the observation area i 〇 f, each of the Zhaoming light The dominant wavelength is also not affected by the failure of other observations. FIG. 10 is a flow chart showing an operation flow of an example of the embodiment of the present invention. The plurality of protrusions m on the base (four) are divided into several areas and the movements are successively moved, and the respective protrusions are displayed. The height of the other-formal-series process is shown in each step. In the embodiment described with reference to Fig. 9, the flow of steps sll3 to sl34 is sequentially performed in time series. However, in place of the program, in another embodiment described herein, the flow of steps sU3 to sl34 is performed in parallel. According to this, the time required for the steps si 13 to si 34 can be further shortened. [First direction] With respect to the above-described first camera, the first direction is displayed to illuminate the surface of the substrate 1A vertically, and the form of the light reflected vertically is observed. However, the first direction may be different from the second direction, and may be irradiated to the surface of the substrate 10 at an angle other than the vertical. At this time, the illumination light irradiated in the first direction may be the same as the illumination 41. [Tilt Correction of Second Photographing Unit] In the above, the second camera becomes photographing from an oblique direction. Therefore, when the area sensor is used, when the normal optical system is used, only the center of the field of view is focused within the image taken in accordance with the shooting condition, and the field of view is blurred from the depth of field. Since the information of the blurred part cannot be used in the subsequent processing, it is wasteful. Therefore, it is also possible to adopt a form in which the optical system is a shift optical conf iguration or a Scheimpf lug optical configuration (Scheimpflug 1〇1l〇759#single number A0101 optical conf iguration), which is largely taken on page 28/ A total of 40 pages 1013155733-0 201241412 depth of focus, so that the photographic image is fully focused and the effective image data of each unit of photography becomes larger. [Fourth Line Illumination and Observation Unit] The fourth observation unit 6 may be further provided in addition to the third observation unit 5 described above. The fourth observation unit 6 includes a line illumination 61 as a fourth illumination unit, and a lens barrel 64 as a fourth imaging unit and a camera 65. The line illumination 61 can illuminate the linear illumination light 62 with a predetermined length from the fourth direction toward the substrate 10. The fourth reflected light 63 reflected by the line illumination 61 and reflected on the plane of the substrate 10 and the top of the projection on the substrate 10 is received by the imaging unit of the camera 65 through the lens barrel 64. An optical element such as a lens is incorporated in the lens barrel 64, and the plane of the substrate 10 is placed in the depth of focus and formed on the imaging portion of the camera 65. The light irradiated by the fourth illumination portion is irradiated onto the substrate 10 at a portion different from the light irradiated by the third illumination portion and reflected. Therefore, the tilt of the substrate which is only in the direction orthogonal to the longitudinal direction of the third illumination which cannot be extracted by the third line illumination can be correctly captured by additionally measuring the fourth line illumination. [Illustration of the Drawing] [0010] Fig. 1 is a perspective view showing an example of a mode embodying the present invention. Fig. 2 is a system configuration diagram showing an example of a mode embodying the present invention. Fig. 3 is a partially enlarged perspective view showing an example of a mode embodying the present invention. Fig. 4 is a view showing an exemplary image taken by the first observation unit in an example of the embodiment of the present invention. Fig. 5 is a view showing an example of an image taken by the second observation unit by means of the second observation unit (Τ7^单号 A0101 page 29/40 pages 1013155733-0 201241412.) Fig. 7 is an exemplary image taken by a third observation unit in an example of an embodiment of the present invention. Fig. 8 is a front view showing an example of a mode embodying the present invention. Fig. 10 is a flow chart showing an operation flow of an example of another embodiment of the present invention. [Description of main component symbols] [0011] 1 : Projection height measuring device 2: substrate moving portion 3: first observation portion 4: second observation portion 5: third observation portion 6: fourth observation portion 10: substrate 10b, 10M to 10b3: protruding portion '10c·. calibration tool 10f: observation area L〇g: reference point 1 Op: chrome film 1 010: reference point 1 011 ~ 1013: point at the top of each head of the protrusion 21: Y-axis platform 22: X-axis platform 075# single number A_ page 30/total 40 Page 1013155733-0 201241412 23: Table 30, 40, 50, 60: Light amount adjusting unit 31: first illumination unit 32, 32al to 32a3: first illumination light 33, 33al to 33a3: first reflected light 34, 44, 54, 64: lens barrel 35, 45' 55, 65: camera 41: Second illumination portion 42, 42al~42a3: second illumination light
D 43、 43al~43a3:第二反射光 51:第三照明部 52:第三照明光 53:第三反射光 5 3 a:在頭頂部反射的光 61:第四照明部 62:第四照明光 0 63:第四反射光 90:控制用電腦 91 :資訊輸入部 92:資訊輸出部 93:發出警告部 94:資訊記錄部 95:機器控制單元 96:影像處理單元 H1~H3:突出部的高度 RP:基準點 1013155733-0 1()11()759#單編號A0101 第31頁/共40頁 201241412 △ :突出部的高度的個別差異 1 〇 0 1 :角度 刪075#單編號删1 第32頁/共40頁 1013155733-0D 43, 43al~43a3: second reflected light 51: third illumination portion 52: third illumination light 53: third reflected light 5 3 a: light 61 reflected at the top of the head: fourth illumination portion 62: fourth illumination Light 0 63: Fourth reflected light 90: Control computer 91: Information input unit 92: Information output unit 93: Issue warning unit 94: Information recording unit 95: Machine control unit 96: Image processing unit H1 to H3: Projection unit Height RP: Reference point 1013155733-0 1()11()759# Single number A0101 Page 31/Total 40 page 201241412 △ : Individual difference in height of the protrusion 1 〇0 1 : Angle deletion 075#单编号 删除1 32 pages / total 40 pages 1013155733-0
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011077360 | 2011-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201241412A true TW201241412A (en) | 2012-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101107596A TW201241412A (en) | 2011-03-31 | 2012-03-07 | Device and method for measuring height of protrusions |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201241412A (en) |
| WO (1) | WO2012132865A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7271250B2 (en) * | 2019-03-22 | 2023-05-11 | ヤマハ発動機株式会社 | Measuring equipment and surface mounters |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09329422A (en) * | 1996-06-12 | 1997-12-22 | Fujitsu Ltd | Height measuring method and device |
| JP3722608B2 (en) * | 1996-12-25 | 2005-11-30 | 株式会社ルネサス東日本セミコンダクタ | Appearance inspection device |
| JP3767161B2 (en) * | 1998-04-02 | 2006-04-19 | オムロン株式会社 | Height measuring device, height measuring method and observation device |
| JP2002267415A (en) * | 2001-03-08 | 2002-09-18 | Nec Corp | Semiconductor measuring instrument |
| JP4566445B2 (en) * | 2001-05-09 | 2010-10-20 | イビデン株式会社 | Bump height inspection method and inspection apparatus |
| JP3638569B2 (en) * | 2002-05-15 | 2005-04-13 | 川崎重工業株式会社 | 3D measuring device |
| JP2007093412A (en) * | 2005-09-29 | 2007-04-12 | Fujinon Corp | Three-dimensional shape measuring device |
-
2012
- 2012-03-07 TW TW101107596A patent/TW201241412A/en unknown
- 2012-03-13 WO PCT/JP2012/056336 patent/WO2012132865A1/en active Application Filing
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| WO2012132865A1 (en) | 2012-10-04 |
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