201235281 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種梭車及具有該梭車之檢測機台，尤其是—種振動歸 位梭車及具有該振崎位梭車辭導航件檢測機台。 【先前技術】 】半導體7〇件的方法’主要可以分為虛擬測試與實境測試，其 中虛擬測_針對各IC的不_、根據預定的電路設計撰_定的 測试軟體’藉以確認例如職間是否非職地短路麵路、以及是否符合 預定的邏輯·:魏職贱藉由已經具有完整功效·板，僅將待測 〜置留白，將每個待測1(：輪流補入該空白位置，測試此時公板是否能正 I運作’從而確認此待測IC的功能正常，並依測試結果作為分類的依據。 當要測試㈣IC時’僅㈣換獨公板及戦的軟體即可。 為提昇效率，目前測試機台輸送及量測待測半導體元件過程均已採自 動化Ί式，如圖i所不，在入料區疊放有多組入料厘4，每一入料匿4中放 置有多顆待測半導體元件5卜開始測試時，先將最下方的人舰4向圖式 下方移出約-行的間距’並由一個人料臂31將此人碰4第一行内的制 半導體树51移載至橫向移_人料梭車33上，人料梭車％隨即右移至 測试臂組件Ml可没取的位置，再由測試臂組件加將待測半導體元件Μ 載於測4座21進行測試’測試完成後，測試臂組件22ι將已測半導體元 ^牛义运至圖式上方的出料梭車％上’出料梭車％隨即右移至出料臂％ 可沒取的位置，並由出料臂32依測試的數據資料做為已測半導體元件52 的分類依據’分卿載式右下方諸纽㈣g巾的對應分類籠中。 201235281 、、考圖2及圖3所不’然而，當入料臂31將待測半導體元件51 移載至橫向移動的入料梭車33上，以及測試臂組件切將已測的半導體元 件52送至㈣梭車34场，若铸體元件未鮮整《，造成如圖2所 不的歪斜，半導體疋件擺放超出梭車上預設的承载座位置，此時沒有即時 修正，則在測試臂組件221或出節2下驗取時，極可能造成如圖3所201235281 VI. Description of the invention: [Technical field of the invention] The present invention relates to a shuttle car and a detection machine having the shuttle, in particular, a vibrating home shuttle and having the navigation Parts inspection machine. [Prior Art] The method of semiconductor 7-components can be mainly divided into virtual test and real-world test, in which virtual test_for each IC does not, according to a predetermined circuit design, the test software is used to confirm, for example, Whether the job is short-circuited in the non-job position, and whether it meets the predetermined logic.: We have already completed the board with only the function, and only leave the test to be left, and each test 1 (: take turns to fill in The blank position, test whether the public board can operate positively at this time to confirm the function of the IC to be tested is normal, and according to the test results as the basis for classification. When testing (4) IC, 'only (four) for the single board and the software of the 戦In order to improve the efficiency, the current testing machine transports and measures the semiconductor components to be tested has been automated, as shown in Figure i, there are multiple sets of feeds in the loading area 4, each into In the storage 4, a plurality of semiconductor components to be tested are placed. When the test is started, the lowermost manned ship 4 is first removed from the lower side of the drawing and the distance between the rows and the rows is shifted by a human arm 31. The semiconductor tree 51 in the row is transferred to the lateral shift _ human shuttle On the 33, the shuttle shuttle % is then moved right to the position where the test arm assembly M1 can not be taken, and then the test arm assembly is loaded with the semiconductor component to be tested on the test 4 seat 21 for testing. After the test is completed, the test arm is tested. The component 22ι transports the measured semiconductor element to the discharge shuttle above the figure, and the output shuttle shuttle % is then moved right to the position where the discharge arm % can be taken, and is tested by the discharge arm 32. The data data is used as the classification of the tested semiconductor components 52 according to the corresponding classification cage of the lower right button (4) g towel. The 201235281, the test chart 2 and the figure 3 do not 'however, when the input arm 31 will The semiconductor component 51 to be tested is transferred to the laterally moving input shuttle 33, and the test arm assembly cuts the measured semiconductor component 52 to the (four) shuttle 34 field, if the casting component is not fresh, resulting in the figure 2 is not skewed, the semiconductor component is placed beyond the preset position of the carrier on the shuttle, and there is no immediate correction. When the test arm assembly 221 or the exit 2 is tested, it is likely to be caused by Figure 3.
:破壞該半⑽不&縣。如此，獨如卩停機而以人力排除 又壓知壞的廢’因而無謂延緩自動化的產出效能甚至可能更進一步影 響機械臂的定位精度’導致整個機台必須飾校準或甚至維修。 為避免上述It;兄發生，冑請人原本賴的安全_是_旦發現半導體 元件置放斜整，就會直接停機衫，讓㈣人狀力齡科整元件， 再重新啟動機台進行檢測；但是，對於機台的產出效率無疑仍有延宏。 因此·提供-觀轉倾車，—旦察覺有轉體元件未被穩妥 地放在承触巾’即可透過沿水平方向的軸，使該元㈣觸而些許位 移2到其被導正歸位，機台才進行後續動作。如此，提高半導體元件被 確實安放的機率’也大崎低機台非翻轉機與娜的舰，達到提高 半導體元件產出效率與良率，且降低機台停機排除廢品、以及被迫維修保 養之發生機會，達到有效降低成本的目的。 【發明内容】 本發明之-目的在提供—種具有娜單元、並提供梭車之承载座沿置 放平面方向振動的振動歸位梭車。 本發明之另-目的在提供—種可自祕餅擺放至梭車承載座的半導 體元件利用振動使其歸位的振動歸位梭車。 201235281 本發θ之再—目的在提供-種可自動化導正被歪斜放置於承載座之半 導體70件的具有振動歸位梭車之半導體元件檢測機台。 I月之X目的在提供一種意外停機的機率可被大幅降低，使產出 效率提昇的具有振動歸位梭車之半導體元件檢測機台。 ，依照本剌揭露的-辭導體耕之振靖錄車，储承載複數待 測或已測半導體元件，其中該振動歸位梭車包含：一個形成有至少一個供 —個前述半導體元件沿—個平面置人之承軸的本體；及-個使該至 J-個承_沿該置放平面方向振動的振動單元該振鮮元包括至少一 個振靈子。 而且’依照本發明揭露的一種具有振動歸位梭車之半導體元件檢測機 台’供檢測複數半導體元件，該檢測機台包含：一個基座；一個形成於該 基座、供置放至少—細彡成有供承倾數制半導體元件之人料盤的入料 品個t/成於5亥基座、供置放複數形成有供承載複數完測半導體元件之 籲㈣盤的出料區；-組具有至少一個測試座、並設置於該基座上的檢測裝 JLv個對勤述至少—細懷座、並供攜帶前述待辭導體元件至 該檢測裝置及攜妹自該檢職置之完測半導體元件的振觸位梭車，包 括一個形成有至少-個供-個前辭導體元件沿—個置放平面置入之承 载座的本體；及—個使該至少—個_座沿該置放平面方向振動的振動單 疋，该振動單元包括至少-個振|子；且該檢測機台還包含：—組在該入 料區、前述至少__個振動歸位梭車、及該出料區間搬移前述半導體元件的 移載裒置，及—個供驅動該振動單元振動的控制裝置。 由於本案所揭露具有鶴歸位梭車之半賴元件檢測機台，在對應振 201235281 動推板車處u水平檢峨置，無論是待測或完測的半導體元件，若 是被歪繼娜料，觸w 紙物的置放平面: Destroy the half (10) not & counties. In this way, the elimination of the labor and the suppression of the waste by the manpower alone, and thus the delay in the automation of the output efficiency may even further affect the positioning accuracy of the robot arm, resulting in the entire machine must be calibrated or even repaired. In order to avoid the above-mentioned It; brothers, please ask people to rely on the safety _ is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ However, there is no doubt that Yan Mao is still responsible for the output efficiency of the machine. Therefore, the supply-viewing tilting, if it is detected that the rotating element is not placed securely on the contact towel, can pass through the axis in the horizontal direction, so that the element (4) touches a slight displacement 2 until it is guided. The machine is only followed by the machine. In this way, the probability of the semiconductor component being reliably placed is improved. 'The Osaki low-machine non-inverting machine and the Na's ship are used to improve the output efficiency and yield of the semiconductor component, and reduce the machine to stop the waste and the forced maintenance. Opportunity to achieve effective cost reduction. SUMMARY OF THE INVENTION It is an object of the present invention to provide a vibrating home shuttle that has a nacelle unit and provides vibration of the carriage of the shuttle in the plane of the placement. Another object of the present invention is to provide a vibrating home shuttle that provides a self-sealing of a semi-conductor element that can be placed from the crust to the shuttle carrier. 201235281 The repetitive purpose of the present invention is to provide a semiconductor component detecting machine having a vibrating home shuttle which can automatically guide a 70-piece semi-conductor placed on the carrier. The purpose of the X month is to provide a semiconductor component inspection machine with a vibrating home shuttle that can significantly reduce the probability of unplanned downtime. According to the disclosure of the present disclosure, the conductor is plucked into a vehicle, and the load carries a plurality of semiconductor components to be tested or tested. The vibration homing shuttle comprises: one at least one for forming the aforementioned semiconductor components. a body that is placed on the plane of the bearing; and a vibration unit that causes the vibration to vibrate in the direction of the placement plane. The vibrating element includes at least one vibrator. Moreover, in accordance with the present invention, a semiconductor component detecting machine having a vibrating home shuttle is provided for detecting a plurality of semiconductor components, the testing machine comprising: a base; one formed on the base and placed at least fine The input material of the human tray having the semiconductor component for the tilting number is formed in a 5 hoist base, and the discharge area for placing the plurality of semiconductor components is completed. - a set of JLv pairs having at least one test stand and disposed on the base, at least one of the pairs, and carrying the aforementioned conductor elements to the detecting device and carrying the self-inspection Completing the vibrating position shuttle of the semiconductor component, comprising: a body formed with at least one pre-conductor conductor element placed along a mounting plane; and - the at least one _ seat The vibrating unit vibrating in a plane direction, the vibrating unit includes at least one vibrating unit; and the detecting machine further comprises: a group in the feeding area, the at least one __ vibrating home shuttle, and The discharge section moves the movement of the aforementioned semiconductor component a load carrying device, and a control device for driving the vibration of the vibration unit. As the case disclosed in this case has a semi-reliable component inspection machine with a crane homing shuttle, the u-level inspection is performed at the corresponding vibration of the 201235281 push-pull vehicle, whether it is the semiconductor component to be tested or completed, if it is 歪继娜, touch w paper plane placement plane
振動，使得蝴蝴咖車小嶋，直物嘛餅卜因此， 無論是在人騎測触或㈣賴輕，人辦或測辦在狀時略有偏 差’機台仍可咖靖糊彻峨正，目嶋可以順暢地 進仃自動化_ ’無_懈機：戦f或崎餘後輪財，更不致 輕碰及職_铸航件，料狀_職爾；產出 效率與良率因而提昇，並達成所有上述目的。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在以下配合參考圖 式之較佳實施例的詳細說明中，將可清楚的呈現。 請-併參考圖4、圖5及圖6所示，為本案具有振動歸位梭車之半導體 元件檢測機台的第-較佳實施例，包括基座丨，、人料區2,、出料區3,、檢 測裝置4’、振動歸位梭車8，、移載裝置6，、控制裝置7,及水平檢職置9,。 基座Γ上形成有供擺放繼的人舰2,及出觀3,，其中人料區2,處的料 ®内，預絲載放置有複數個待辭導體元件51，，而出料㊣3，則是分別供 置放複數婦E，每崎E分麟應承載具有某特定性f、且被測試 分類完畢的半導體元件’紐於說明，在此定紐於人料區2，的料匿為入 料盤21’ ’且在本例中，入料盤21’是以堆疊方式置放於入料區2，，而位於 出料區3’的多個料匣為分類料盤31，。 一併參考圖5所示，設置在基座1’上的檢測裝置4，在本例中包括一個 處理分類裝置43,、四個測試座41，及一個附有吸嘴42〇，及溫度調節件422, 201235281 的測試臂42’ ’藉㈣，施加負壓吸_放負壓方式_釋放待測半 導體元件5Γ ’溫度調節件似，則可依照需求進行溫度調節，尤其在進行半 導體元件獅f，_測铸體元件Μ，處於—個默溫度，明試出半 導體元在模擬出的高溫環境或是低溫環境狀財是否魏正常運作。測試 臂料將吸嘴復所錄的半導體元件移入測試㈣，或反向移出，而測The vibration makes the butterfly and the car small, and the straight thing is the cake. Therefore, whether it is in the person riding the touch or (4) Lai light, the person or the measurement is slightly biased when the machine is still in the machine. , you can smoothly enter the automation _ 'No _ lazy machine: 戦 f or after the raffle, not to touch and _ casting parts, material _ er; output efficiency and yield thus improved And achieve all of the above purposes. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Please refer to FIG. 4, FIG. 5 and FIG. 6, which are the first preferred embodiment of the semiconductor component detecting machine with the vibrating home shuttle, including the base raft, the human material zone 2, and the The material zone 3, the detecting device 4', the vibration homening shuttle 8, the transfer device 6, the control device 7, and the horizontal inspection position 9, are. The pedestal raft is formed with a manned ship 2 for arranging, and a view 3, wherein in the material area 2, where the material is placed, the pre-wire carries a plurality of conductor elements 51 to be circulated, and the discharge is performed. Positive 3, respectively, is for the placement of a plurality of women E, each E-segment should carry a specific component f, and the semiconductor component that has been tested and classified, is described in the description of the human component area 2 The material is concealed as the feed tray 21'' and in this example, the feed tray 21' is placed in the feeding zone 2 in a stacked manner, and the plurality of magazines located in the discharge zone 3' are the sorting trays 31. ,. Referring to FIG. 5 together, the detecting device 4 disposed on the base 1', in this example includes a processing sorting device 43, four test sockets 41, and one with a suction nozzle 42 and temperature adjustment. The test arm 42'' of the 422, 201235281 borrows (4), applies the negative pressure suction _ discharge negative pressure mode _ release the semiconductor component to be tested 5 Γ 'temperature adjustment device, then can adjust the temperature according to demand, especially in the semiconductor component lion f _ Measure the casting component Μ, at a silent temperature, and test whether the semiconductor element is in the simulated high temperature environment or the low temperature environment. The test arm material moves the semiconductor component recorded by the nozzle into the test (4), or moves it in the reverse direction.
式結果會傳至處理分歸置奴作為分_依據。輔在本例帽使用吸嘴 以祕/釋放貞壓方式録料體元件，但熟悉本技術者亦可使用例如爽持 等方式進行移載，皆無礙於本案之實施。The result will be passed to the processing of the slaves as a sub-base. In this example, the nozzle is used to capture the body element by the nozzle/release pressure method, but those skilled in the art can also use the method such as cool holding to carry out the transfer, which does not hinder the implementation of the case.
移載裝置6,在本例中包括一個設於結i，之入料區2，位置的入料臂 ス及個0又於基座1，之出料區3,位置的出料臂32,，其中，人料臂π 及出料们2,分別·為具有-組《丨/釋放半導體元件的吸嘴22〇，、320，， 並於基座1’的人料區2’及出料區3,之間設置—個貫穿的振動歸位梭車8,， 且振動歸位梭車8’所經過之處正好能交會到測試臂似,從振動歸位梭車& 沒取、或觀半導航件物纽置，使猶_梭車8，·交換位置時 可對應到測試座41，。因此，本例中的振動歸位梭車8,在機台上的移動途徑 係貫穿上述人料區、交換位置、及出料區並往返移動。 參閱圖7及圖8所示，本狀振崎減車8，包括—個本體8〖，，本體 81’中形成有四個凹陷的承載座8〇,，為便於說明，在此定義承載座底部大 致水平的方向為置放平面’以供轉體元件置人，而本體81，則是由一個上 半部件811’及一個下半部件812,所組成，並且在上半部件S11，及下半部件 812’間形成有-個容室8U，，容室S13，_設有—個振動單元⑵，本例中， 振動單7L 82’包括對應於每一承載座8〇,位置分別設置的一個振盤子奶，。 7 201235281 本例之振盡子821，包括-個偏心輪8211，及一個轉轴82l2,，偏心輪 8211中形成有-個偏離重心位置的樞接孔821〇,，並由轉車由奶穿過，而 轉轴82U’的兩端分別設於上半部件811，及下半部件812，，且每一娜好 奶，分別對應-個承載座8〇,的承載部财，使得偏心輪82ιι，會以承載部 814為樞減轉，故當任—紐子821，被驅動時，均會偏喊轉而使得對 應的承載座⑽/α著置放平面方向振動，並且，由於檢測*同的半導體元件 時’會因為不同的半導體元件會有不同的大小及重量，因此，振動單元们， 的振動巾胃度也1彡有所區別，睛-併參相9 ’係控制振動單元U，振動幅 度的控制電路’透過可調式雜聰〜遍調整輸出的功率，即可使得振動 單元82’振動幅度受到調整。 併 > 考圖4 '圖5及圖1〇所示，本例之水平檢測裝置9,係設置於基 座Γ之測試臂42’從振動歸位梭車8,沒取、或釋放半導體元件的交換位置 上’而水平檢測裝置9’包括有_光學收發單元91，，分卿應前振動歸位 梭車8’的承載座80,，且本例之光學收發單㈣，包括發光二極體9ΐι，、光 纖912’及光學接收器9D，，先由光纖912，將發光二極魏，所發的絲大 致垂直朝向對縣龜8G，狀平面方向㈣丨，使賊向承載座所承載的半 導體元件，再將反射光由光纖912，反向傳輸並導引至對應的光學接收器 913’ ’並由水平檢測裝置9,將檢測訊息傳至控制裝置7,。 在進仃移載測試作料，—併參考圖6及圖u至Η所示首先由入 料臂22,從人料盤21’中透過吸嘴戰取待測半導航㈣,，移載並放置 到位於入料區2，之振動歸位梭車8,的承載座8〇，上，隨後如圖^所示，當 振動歸位鮮8，受,轉右移，使承做⑽，對應觀交触置，此時水平檢 201235281 測裝置9,會檢嚼測铸體元件5丨，衫有歸，如果制或已辭導體元 件51’、52’有歪斜情況發生時，騎出的林會被反射_來的出光位置， 光干接收Θ 913 α有接收到足夠的反射光，即可由控制裝置7,判定待測或 已測半導體元件51，、52,放置時產生餅，航鶴鶴單元振動歸位梭 車8，並帶動魏座⑽沿著置放平面方向振動，使得歪斜的待測半導體 70件51’回歸到承載座80’正確的放置位置。The transfer device 6, in this example, includes a feed arm 设 disposed at the junction i, the feed zone 2, and a discharge arm 32 at the position of the discharge zone 3 of the susceptor 1, Wherein, the human arm π and the discharge material 2, respectively, are the nozzles 22〇, 320 having the group “丨/release semiconductor element, and the human material area 2′ of the susceptor 1 ′ and the discharge Zone 3, between the set--a vibrating homing shuttle 8, and the vibration homing shuttle 8' passes where it can meet the test arm, from the vibration homing shuttle & The half-navigation object is placed so that the shuttle bus 8 can exchange the position to the test seat 41. Therefore, the vibration in this example is homing to the shuttle 8, and the movement path on the machine is transmitted through the above-mentioned human material area, exchange position, and discharge area and moves back and forth. Referring to FIG. 7 and FIG. 8 , the present invention is composed of a body 8 , and a body 8 凹陷 is formed in the body 81 ′. For convenience of explanation, the bottom of the carrier is defined herein. The substantially horizontal direction is the placement plane 'for the turning element to be placed, and the body 81 is composed of an upper half 811' and a lower half 812, and in the upper half S11, and the lower half A chamber 812' is formed with a chamber 8U, and the chamber S13, _ is provided with a vibration unit (2). In this example, the vibration unit 7L 82' includes a corresponding position corresponding to each of the carriers 8〇. Vibrating plate milk,. 7 201235281 The vibrating element 821 of this example includes an eccentric wheel 8211 and a rotating shaft 8212. The eccentric wheel 8211 is formed with a pivot hole 821〇 deviated from the center of gravity position, and is passed by the transfer by the milk. The two ends of the rotating shaft 82U' are respectively disposed on the upper half member 811 and the lower half member 812, and each of the two good milks respectively correspond to the carrying portion of the carrying portion 8〇, so that the eccentric wheel 82 ι, The bearing portion 814 will be pivoted, so when the NU---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- In the case of semiconductor components, 'different semiconductor components will have different sizes and weights. Therefore, the vibration of the vibrating unit is also different. The eye-and-phase 9' control the vibration unit U, vibration The amplitude control circuit 'adjusts the power of the output through the adjustable miscellaneous-by-pass adjustment, so that the vibration amplitude of the vibration unit 82' is adjusted. And, as shown in FIG. 5 and FIG. 1A, the level detecting device 9 of the present example is mounted on the test arm 42' of the base 从 to locate the shuttle 8 from the vibration, and does not take or release the semiconductor component. In the exchange position, the horizontal detecting device 9' includes an optical transceiver unit 91, and the optical transmission unit (4) of the shuttle bus 8', and the optical transceiver (4) of the present embodiment, including the light-emitting diode The body 9ΐι, the optical fiber 912' and the optical receiver 9D, firstly by the optical fiber 912, will emit the dipole Wei, and the emitted hair is oriented substantially perpendicularly to the county turtle 8G, in the direction of the plane (four), so that the thief carries to the carrier The semiconductor component then transmits the reflected light back from the optical fiber 912 to the corresponding optical receiver 913'' and is transmitted by the level detecting means 9 to the control device 7. In the loading and unloading test material, and referring to FIG. 6 and FIG. u to 首先, the feeding arm 22 is firstly taken from the human tray 21' through the nozzle to take the half navigation (4) to be tested, and the loading and placing are performed. To the loading zone 2, the vibrating homing shuttle 8, the carrier 8 〇, on, and then as shown in Figure ^, when the vibration is returned to the fresh 8, subject, turn right, so that (10), corresponding view Cross-contact, at this time level check 201235281 measuring device 9, will chew the casting component 5 丨, the shirt has a return, if the system or the resigned conductor elements 51 ', 52 'has a skewed situation, the riding forest will The reflected light position of the reflected light, the light-drying receiving 913 913 α receives sufficient reflected light, and the control device 7 determines the semiconductor component 51, 52 to be tested or measured, and generates a cake when placed, and the crane crane unit The vibration locates the shuttle 8 and drives the Wei seat (10) to vibrate along the placement plane, so that the skewed semiconductor 70 piece 51' returns to the correct placement position of the carrier 80'.
動凡後S人由水平檢測裝置9,進行檢測，直到待測半導體元件51, 已正確無誤地回歸到承載座8〇,，才交由對應於交換位置的測試臂42,將承 載座8〇,上所承載的待測半導體元件51，由吸嘴復沒取，再如圖12所示， 當待測半導體元件51’被移載至測試座41，之測試錄後，測試臂纪將下 降’使得被吸嘴420,汲取的待測半導體元件51，被_在測試座Μ，上進行 2，並同時摸擬特定環境，由溫度調節件似，調整施加預定溫度至待測 半¥體兀件51 ’並將測試結果傳輸至處禮分類裝置奴，接著再由測試臂 42,將已游導航件52’移虹交換位置並職，使已游導體元件52，落 在承載座8G ’並且再由水平檢測裝置9,進行檢測已解導體元件52,是否 有擺放歪斜。 最後如圖13所示，振動歸位梭車8’受驅動右移至出料區3, ’並提供至 出料臂32,已經依照處理分類裝置43，的指令，將駭取的已測半導體元件 釋放至對應的分類料匣31，中。 當然，如祕此技術領域者職輕練解，軸在本财係使用發光 二極體做為光源，但熟悉本技術者亦可使用例如雷射二極體做為光源，皆 …、礙於本案之貫施。另方面為提升整體產出效率更可本案第二較佳實施 201235281 例，-併參考如圖μ及圖15所示，以兩組振動歸位梭車η”進行半 導體元件的測試作麵移载，當人料臂22,，將剌之半導體元件51”移載至 振動歸位梭車8|，，之_座8GI，，時，已承載制之铸體元件51，，之振動歸 位梭車82”則已經先出發並鶴至_職座41，，的錢位置，由測試臂 42”進行移載測試後，再將已測半導體元件％，，移载回振動歸位梭車&，，之 承載座8〇2”。 ,並如圖15所示，振動歸位梭車82，，移動至出料區由出料臂Μ”沒取已 測半導體元件52”時’振_位梭車81”_動至__ —的交換位 置同樣由測試臂42”進行移載測試，此種設計讓貫穿輸送梭車一舉統人入料 與出料的同步協調運作，使人、出料動作可以被高度同步化，移載作業盘 測試作業效率㈣提昇，勤之辭力與市場接受度觀提高，達成本發 明所有上述目的。 只After the S-person is detected by the level detecting device 9, until the semiconductor component 51 to be tested has returned to the carrier 8〇 correctly, it is handed over to the test arm 42 corresponding to the exchange position, and the carrier 8 is placed. The semiconductor component 51 to be tested carried by the capacitor is removed from the nozzle, and as shown in FIG. 12, when the semiconductor component 51' to be tested is transferred to the test socket 41, the test arm will be lowered. 'The semiconductor element 51 to be tested, which is sucked by the suction nozzle 420, is carried out 2 on the test stand, and simultaneously simulates a specific environment, and is adjusted by the temperature adjustment member to apply a predetermined temperature to the half body to be tested. The piece 51' transmits the test result to the ritual sorting device slave, and then by the test arm 42, moves the traversed navigation member 52' to the rainbow exchange position, so that the traveled conductor element 52 falls on the carrier 8G' and Further, by the level detecting means 9, the detected conductor element 52 is detected to be tilted. Finally, as shown in Fig. 13, the vibration homing shuttle 8' is driven to the right to the discharge zone 3, 'and supplied to the discharge arm 32, which has been taken in accordance with the instructions of the processing sorting device 43, The component is released into the corresponding sorting magazine 31. Of course, if the technical field is a lighter solution, the axis uses a light-emitting diode as a light source in this financial system, but those skilled in the art can also use, for example, a laser diode as a light source. The application of this case. On the other hand, in order to improve the overall output efficiency, the second best implementation of this case is 201235281, and with reference to Figure 5 and Figure 15, the test of semiconductor components is carried out with two sets of vibration-homed shuttles η" When the arm 22 of the human body is transferred to the vibration homing shuttle 8|, the slab 8GI, the cast body member 51 has been loaded, and the vibration homing shuttle The car 82" has already started and the crane position to the seat 41, the money position, after the transfer test by the test arm 42", then the measured semiconductor component %, transferred back to the vibration home shuttle & , the carrier 8 〇 2". , and as shown in Figure 15, vibrating the shuttle 82, moving to the discharge area by the discharge arm Μ "when the measured semiconductor component 52 is not taken" The exchange position of the shuttle 81"_moving to __" is also transferred by the test arm 42". This design allows the conveyor shuttle to coordinate the operation of the feeding and discharging. The action can be highly synchronized, the efficiency of the transfer workbench test operation (4) is improved, the diligence of the work and the acceptance of the market are improved, and the achievement is achieved. All of the above objects of the invention.
本案具有半導體元件之振動歸位梭車及具有該梭車之檢測機台之第較 佳實施例，如圖16、圖Π及圖1S所示，在本例中，振動歸位梭車8”，传— 個具有單-承触⑽”，並於振動歸讀車8”,之容㈣3”，之壁面向内形 2内齒輪财” ’並於容室813，，，内中心位置設有—個可轉_太陽齒輪 ，且本例之振盈子821，”是-個具有相當重量的行星齒輪8213”，，科 由同時接觸太陽齒輪815”,及内齒輪814，,,，當太陽齒輪815”，受驅動_ 日、’仃星純咖”繼繼，觀物歸細”，崎制而繞著 太陽齒輪815”，_ 自轉，行讎瞭就此影塑整個 心車，使得振動單元『，被驅動而振動時，承載座『同樣會沿著置放平 面方向振動。 201235281 而本例之水平檢測裝置9”，之光學收發單元91，”則係例示為雷射二極 體911”，及光學接收器912，”所組成，並設於振動歸位梭車8”，的移動路徑位 於入料區2”，與交換位置、以及交換位出料區3”，之間，由雷射二極體 9Π’”發射-個可平行承載座，，置放平_光，並由設於相_面的光學 接收器912”，接收雷射二極體911 ”，所發的光束，使得振動歸位梭車8”,移動 經過光學收發單元91’，，時，若半導體元件擺缝斜時，雷射二極體911”， 所發的光束便會受到了阻絕，光學接收㈣2”，無法接㈣絲，即可判定 • 半導體元件擺放已歪斜，需進行歸位程序。 經由上述結構設計’在進行半導體元件的移載及檢測作業時，不僅可 以水平檢測裝置檢測擺放至振動歸位梭車之承載座是否有歪斜，即使有歪 斜情況發生，亦可透過振動單元產生_個沿承載座置放平面方向的振動， 使得下驗取半導體元件時，衫辨導體元件造賴迫娜，因此亦不 而經爷性地暫停作業處理被破壞的半導體元件以及維修因此造成損壞的機 σ 7自動化仏測抓私無礙，而且若能透過兩組梭車完整肩負入料與出料 使ρ也使彳t各工作肖位畴件具有^度協雛，可有效率侧步進行半 導體元件移載、測试、與分類，提昇檢測效率與產出效率之目的。 、斤述者僅本發明之較佳實施例而已，當不能以此限定本發明 實施之域’即大凡依本發明巾料利範圍及發魏明内容所作簡單的等 效變化與修飾，皆仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是$知半導體元件檢測機台的示意圖； 圖2疋圖丨半導體元件未擺放正確的立體示意圖； 201235281 圖3疋圖1半導體元件未槪正確而進概取料致破)ί的立體示意 圖； 圖4疋本案帛較佳貫施例具有半導體元件之振動歸位梭車之檢測機 台的俯視圖； 圖5是圖4檢測機台的側視圖； 圖6是圖4檢測機台之裒置操控的方塊示意圖； 圖7是圖4振動歸位梭車的立體圖； 鲁 圖8是圖7振動歸位梭車的立體分解圖； 圖9是圖7振動歸位梭車的控制電路圖； 圖是圖5檢測機台之水平檢測裝置之立體示意圖； 圖11至Η I3疋本例具有半導體元件之振崎位梭車之檢測機台之梭 車、入料臂、出料臂及職臂之操作步上視圖； 圖14至圖15是本案第二較佳實施例具有半導體元件之振動歸位梭車 之_機台，躺敝梭纽兩_辦高度同步化進行耗作業之操作 胃步上視圖； 圖16是本案第三較佳實施例具有半導體元件之振動歸位梭車之檢測機 台； 圖Π是圖丨6之振動歸位梭車、且梭車具有單—承載座的立體圖； 圖U是圖16之振動歸位梭車内部的剖視圖，是說明振動單元以齒輪 組件示意。 【主要元件符號說明】 1 基座 12 201235281The present invention has a vibration homing shuttle of a semiconductor component and a preferred embodiment of the testing machine having the shuttle, as shown in FIG. 16, FIG. 1 and FIG. 1S. In this example, the vibration homing shuttle 8" , pass - has a single-bearing (10)", and in the vibration of the car 8", the capacity (four) 3", the wall facing the inner shape 2 internal gear "" and in the chamber 813,,, the inner center position a convertible _ sun gear, and the vibrating sub-821 of this example, "is a planet gear 8213 with considerable weight," by the simultaneous contact with the sun gear 815", and the internal gear 814,,,, when the sun Gear 815", driven by _ day, 'Yu Xing pure coffee' continued, the view of the object is fine, "saki and around the sun gear 815", _ rotation, smashed the shadow of the entire car, so that the vibration unit "When driven and vibrated, the carrier " will also vibrate along the placement plane. 201235281 The optical transceiving unit 91 of the horizontal detecting device 9" of this example is exemplified as a laser diode 911" and an optical receiver 912, and is composed of a vibration homing shuttle 8" , the moving path is located in the feeding zone 2", and the exchange position, and the exchange bit discharge zone 3", is emitted by the laser diode 9Π'" - a parallel carrier, and the flat light is placed And receiving, by the optical receiver 912" disposed on the phase surface, the laser diode 911", the generated light beam, causing the vibration to return to the shuttle 8", moving through the optical transceiver unit 91', when When the semiconductor component is tilted, the laser diode 911", the emitted light beam will be blocked, the optical receiving (4) 2", can not be connected to the (four) wire, can be judged • The semiconductor component is placed skewed and needs to be homing Through the above-mentioned structural design, when performing the transfer and inspection of the semiconductor element, it is possible to detect not only whether the horizontal detecting device detects the skew of the carrier placed on the vibrating home shuttle, but also transmits vibration even if a skew occurs. Unit generates _ along the carrier The vibration in the plane direction is placed so that when the semiconductor component is taken down, the conductor component of the shirt is ruined, so that the semiconductor component that is destroyed by the operation of the master is suspended, and the damage caused by the repair is caused.仏 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 抓 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若The purpose of the invention is to improve the efficiency of the test and the efficiency of the output. The present invention is only a preferred embodiment of the present invention, and the scope of the invention may not be limited thereto. The simple equivalent changes and modifications made by Weiming are still within the scope of the present invention. [Simplified Schematic] FIG. 1 is a schematic diagram of a semiconductor device detecting machine; FIG. The correct three-dimensional diagram is not placed; 201235281 Figure 3 is a three-dimensional diagram of the semiconductor component that is not correct and the material is broken. Figure 4 is a preferred embodiment of the semiconductor element. Figure 5 is a side view of the detection machine of Figure 4; Figure 6 is a block diagram of the operation of the detection machine of Figure 4; Figure 7 is a schematic diagram of the vibration home of Figure 4 FIG. 9 is a perspective view of the control circuit of the vibrating home shuttle of FIG. 7; FIG. 9 is a perspective view of the horizontal detecting device of the detecting machine of FIG. 5; 11 to Η I3 上 This is an example of the operation steps of the shuttle, the input arm, the discharge arm and the arm of the detection machine of the Zhenshen shuttle of the semiconductor component; Figure 14 to Figure 15 is the second comparison of the case. A preferred embodiment has a vibration-homing shuttle of a semiconductor component, and a high-synchronization operation operation step of the operation step; FIG. 16 is a third preferred embodiment of the present invention having a semiconductor component. The vibration is returned to the detection machine of the shuttle car; Figure Π is the vibration of the shuttle car of Figure 6 and the shuttle has a single-bearing seat; Figure U is a cross-sectional view of the interior of the vibration-homed shuttle of Figure 16 It is stated that the vibration unit is illustrated by a gear assembly. [Main component symbol description] 1 pedestal 12 201235281
2， 、 2”， 料區 21， 入料盤 22’、22” 入料臂 221 測試臂組件 3， 、 3”， 出料區 31 入料臂 3Γ 分類料盤 34 出料梭車 32、32,、32” 出料臂 33 入料梭車 4 入料匣 4， 檢測裝置 2 卜 41，、41” 測試座 42,、42” 測試臂 220,、320,、420， 吸嘴 422， 溫度調節件 43, 處理分類裝置 5 卜 51’、51” 待測半導體元件 52、52,、52” 已測半導體元件 6， 移載裝置 7， 控制裝置 8,、8Γ，、82”、8”， 振動歸位梭車 13 2012352812, 2", material zone 21, feed tray 22', 22" feed arm 221 test arm assembly 3, 3", discharge zone 31 feed arm 3 Γ sorting tray 34 discharge shuttle 32, 32 , 32" discharge arm 33 feed shuttle 4 feed 匣 4, detection device 2 卜 41, 41" test socket 42, 42, 42" test arm 220, 320, 420, nozzle 422, temperature adjustment Item 43, processing classification device 5 51', 51" semiconductor component to be tested 52, 52, 52" measured semiconductor component 6, transfer device 7, control device 8, 8, Γ, 82", 8", vibration Homing shuttle 13 201235281
8Γ 80’、80Γ’、8〇2”、 811， 812’ 813, 、 813”， 814， 814，” 815”， 82， 、 82”’ 821，、821”， 821Γ 8212’ 8213”， 8210’ 9,、9，，， 91，、9Γ” 911， 911”， 912’ 913,、912”， 本體 80”’承載座 上半部件 下半部件 容室 承載部 内齒輪 太陽齒輪 振動單元 振盪子 偏心輪 轉軸 行星齒輪 柩接孔 水平檢測裝置 光學收發單元 發光二極體 雷射二極體 光纖 光學接收器 148Γ 80', 80Γ', 8〇2”, 811, 812' 813, 813”, 814, 814, “815”, 82, 82” '821, 821”, 821Γ 8212' 8213”, 8210' 9, 9, 9, 91, 911" 911, 911", 912' 913, 912", body 80"' carrier upper half lower part compartment bearing inner gear sun gear vibration unit oscillator eccentric rotation Axis Planetary Gear Clamping Hole Level Detection Device Optical Transceiver Unit Light Emitting Diode Laser Diode Fiber Optic Receiver 14