TW201230238A - Film formation apparatus - Google Patents

Film formation apparatus Download PDF

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Publication number
TW201230238A
TW201230238A TW100141691A TW100141691A TW201230238A TW 201230238 A TW201230238 A TW 201230238A TW 100141691 A TW100141691 A TW 100141691A TW 100141691 A TW100141691 A TW 100141691A TW 201230238 A TW201230238 A TW 201230238A
Authority
TW
Taiwan
Prior art keywords
film forming
chamber
stage
moving mechanism
substrate
Prior art date
Application number
TW100141691A
Other languages
Chinese (zh)
Other versions
TWI575642B (en
Inventor
Tomohiro Hayasaka
Koji Takahashi
Masashi Kubo
Masahiro Nagashima
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201230238A publication Critical patent/TW201230238A/en
Application granted granted Critical
Publication of TWI575642B publication Critical patent/TWI575642B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A film formation apparatus includes: a film formation chamber in which a film is formed on a substrate; a carrier vertically holding the substrate so that a surface of the substrate is located along a vertical direction; a loading-ejecting chamber disposed so as to be communicated with the film formation chamber with an openable-closable section interposed therebetween; and a transfer mechanism transferring the carrier between a transfer position and a safety position, the transfer mechanism upwardly and downwardly moving the carrier in a diagonal direction, the diagonal direction forming a predetermined angle with respect to each of a vertical direction and a horizontal direction, the predetermined angle being greater than 0 DEG and less than 90 DEG with respect to each of a vertical direction and a horizontal direction, the transfer mechanism being capable of attaching and removing the carrier between the film formation chamber and the transfer mechanism at the transfer position, and the safety position being adjacent to the transfer position.

Description

201230238 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種成膜裝置,詳細而言係關於一種構成 成膜裝置之裝入、取出室之結構。 【先前技術】 例如,作為將功能膜成膜於半導體基板等上之成膜裝 置’可舉出 PVD(Physical Vapor Deposition:物理氣相沉 積)裝置或 CVD(Chemical Vapor Deposition:化學氣相沉 積)裝置等。 以此種PVD裝置或CVD裝置等為代表的成膜裝置至少包 含:成膜室’其對基板進行成膜;及裝入、取出室(負 載、卸載腔室),其係經由具有氣密性之閘閥(開關部)而連 通成膜室。 裝入、取出室係例如將基板從大氣氛圍之空間(一側面) 裝入至裝入、取出室的内部,待將腔室内減壓後,打開形 成於與處於減壓氛圍之成膜室連通之另一側面的閘閥,且 將裝入於腔至内之基板送入成膜室内。又裝入、取出室 係於減壓氛圍下’取出在成膜室内成膜有功能膜之基板, 且通過另一側面搬送至裝入、取出室内(腔室内),待腔室 内為大氣氛圍後’從—側面送出成膜完成之基板。 即,裝入、取出室係為了在内部為減壓氛圍之成膜室、 與處於大氣氛圍之成膜裝置之外部之間,以將成膜室之内 部保持為減壓氛圍的狀態,裝入取出基板所使用之交接腔 室。 160l02.doc 201230238 如此之裝入、取出室,先前為高效地裝入取出複數之基 板,例如具有搬送機構,其係沿水平方向搬送將基板之一 面以沿錯直方向直立之狀態予以保持的載台(縱型載台)(例 如’參照國際公開第屬/116721號公報及國際公開第 2008/129983 號公報)。 如此之先前之裝入、取出室係把將要進行成膜之基板 (成膜前基板)裝入至裝入、取出室,其後減㈣裝入、取 出室内部(腔室内),使基板朝水平方向之一方之位置移 動,使其由連通於成膜室之位置⑽送位置)退避。接著, 使成膜完成之基板從内部為減壓氛圍之成膜室朝裝入、取 出室移動,使成膜完成之基板移動至水平方向之另一方之 位置。又,其後使將要進行成膜之基板朝連通於成膜室之 搬送位置移動’將該基板導入成膜室 '繼而,使成膜完成 之基板再次朝搬送位置移動後,待作為裝入、取出室之腔 室内由減壓氛圍變回大线圍後,將該成膜完成之基板取 出至裝入、取出室外部。 然而,如上所述之具備沿水平方向使保持基板垂直之載 台在連通於成膜室之搬送位置與退避位置之間移動之裝 入'取出室的成膜裝置,存在沿裝入、取出室之水平方向 之寬度增大的問題。即’在裝入、取出室中,為不與位於 搬送位置之載台干涉’必須確保水平方向上有足夠寬度的 退避位置,故難以減小裝入、取出室之沿水平方向之寬 度。 且,由於難以減小裝入、取出室之沿水平方向之寬度, 160102.doc 201230238 故不得不增大裝入、取出室之内容積,致使裝入、取出室 内部由大氣氛_至真空氛圍之排氣時間變長。因此, 其結果存在在成膜室與成膜室外部之間取出裝入載台時所 需之更替時間即裝入、取出效率降低之問題。 又為使保持基板垂直之載台沿水平方向在連通於成膜 室之搬送位置與退避位置之間移動,除使載台朝水平方向 Γ之移㈣置以外,還_水平方向延伸之軌道或齒輪 專眾多構成零件,故存在成本增加之問題。 再者目伴隨該種朝水平方向延伸之軌道或齒輪等 械性運轉之零件所產生之微粒,污染裝人、取出室之内 部,從而亦有使基板通過裝入、取出室時基板之表面受污 染之虞。 【發明内容】 本發明係鑒於上述問題 θ ^ ^ 喊而凡成者,其目的在於提供一種 具有裝入、取出效率傷白 _ 憂良,谷易小型化,且構成簡單可以 取出室的成膜裝置。 為解決上述問題,本發 發月以夕種形態提供如下之成膜裝 罝0 即’本發明之成膜货番 被霜膜! 成膜室’其於基板上形成 被·覆膜,載台,其以蚀μ、+、 吏上述基板之一面沿著鉛直方向之方 式垂直保持上述基板;裝、— 連通之方式經由開關部而㈣ 其以與上述成臈室 配置,及移動機構,其設置於上 插:二:出室内,使上述載台在可在與上述成膜室之間 插抑上述載台之搬送位置、與鄰接於上述搬送位置之退避 I60I02.doc 201230238 位置之間移動,且使上述載台朝相對於鉛直方向及水平方 向分別成大於0。小於90。之特定角度的傾斜方向上下移 動。 較好的是’上述移動機構在上述搬送位置與相對於上述 搬送位置而位於斜上方的上述退避位置之間,使上述載台 沿上述傾斜方向直線性上下移動。 上述移動機構較好為包含:第一移動機構,其係使上述 載台在上述搬送位置與相對於上述搬送位置位於一方之斜 上方的第一退避位置之間移動;及第二移動機構,其係使 上述載台在上述搬送位置與相對於上述搬送位置位於另一 方之斜上方的第二退避位置之間移動。 較好的是,於上述第一移動機構與上述第二移動機構中 刀別具備支持上述载台並使其移動之伸縮構件,且上述第 y移動機構之伸縮構件與上述第二移動機構之伸縮構件係 以相互交又之方式配置。 較好的是,上述移動機構以相對於水平方向45。以上、 85。以下之角度使上述載台於傾斜方向上下移動。 本發明之成臈裝置較好為進而包含加熱部,其設置於上 述裝入、取出至之靠近上述退避位置之位置,用以加熱上 本發明之成膜裝置’較好的是,上述移動機構進而包含 第二移動機構’其係使上述載台沿鉛直方向移動。 [發明之效果] 根據本發明之成膜奘署 取膜裝置’在裝入、取出室中,使載台朝 '60102.doc 201230238 相對於水平方向成特定角度之傾斜方向(即、鉛直方向及 夂平方向)移動。例如,在相對於搬送位置位於斜上方的 退避位置與搬送位置之間,使載台沿傾斜方向直線性上下 移動藉由進行如此動作,與先前使載台沿水平方向朝與 7送位置並排地退避之情形相比較,可實現成膜裝置之小 型化。特別,由於係以在鉛直方向及水平方向上移位之方 式使载台退避’故可減少載台在鉛直方向上移位程度、及 載〇在水平方向上之移動距離。進而,可以鄰接之複數個 載口之邊緣於錯方向重合之狀態,將複數個載台收納於 2入、取出室。因此,可省略水平方向上複數個載台之重 合’其結果可縮小裝人、取出室沿水平方向之寬度實現 成膜裝置之小型化。 又,在構成先前之成膜裝置之裝入、取出 台僅沿水平方向移動’需要沿水平方向敷設之執道 扣合之滾輪等° m前之成膜裝置存在裝置複雜化且 成本較高之問題。另-方面,在構成本發明之成膜裝置的 裝入、取出室中,由於設置將載台朝與鉛直方向及水平方 向分別成大於0°小於90。之角度,即傾斜方向升高之移動 機構’例如,一對油壓缸或氣壓缸等即可,故可降低成膜 聚置之製造成本。 再者,本發明中,在構成成膜裝置之裝入、取出室中, 使載台朝特定位置退避時’係將其朝向對鉛直方向及水平 方向分別成大於0。小於90。之角度、即傾斜方向升高。因 此’可減少如先前般沿水平方向敷設之軌道或與其扣合之 160102.doc 201230238 滾輪等之機械性摩擦、接觸所產生的振動。因成匕,可抑制 在裝入、取$室中產生微粒,從而可維持基板表面或裝 入、取出室内部之清潔狀態。 【實施方式】 以下,參照圖面’對本發明之成膜裝置之一實施形態加 以說明1 ’本實施形㈣為使發明之要旨更好理解而具 體加以說明者’只要無特別指定,並非意欲限定本發明。 又’以下說明中所用之圖面係採用可於圖面上辨識各構成 要件程度之大小’故各構成要件之尺寸及比例與實際情況 有適當不同。、 圖1係顯示本發明之成膜裝置之一實施形態之連續型 PVD裝置(以下簡單稱為成膜裝置)整體的概要圖。 在本實施形態之成膜裝置10中,串聯設置有成膜室(成 膜腔至)11、裝入、取出室(負冑、卸載腔室)12、及堆疊器 (移載裝置)13。成膜室11及裝人、取出室12係藉由使下文 所述之閘閥開口而連通。又,裝入、取出室12及堆疊器13 係同樣藉由使閘閥開口而連通。χ,載置有基板w之載台 μ可在成膜室u、裝入、取出室12、及堆疊器13之間相互 移動。 於成膜室11與裝入、取出室12之間,形成有將成膜室u 及裝入、取出室12之空間内氣密保持的閘閥16。又,於裝 入、取出室12與堆疊器13之間,亦形成有將裝入、取出室 12與堆疊器13之空間内氣密保持的閘閥17。該等閘閥16、 17係於載移動時開放’在載台14不移動時關閉。 160102.doc 201230238 成膜室(成膜腔室)ιι具有可氣密保持内部之腔室本體 21。且,於該腔室本體21内設置有加熱器22'及陰極單元 23 〇 於腔室本體21之一面(一側面)形成有可使搭載有基板W 之載台14通過的開口 24,且於該側面經由閘閥1 6可連通地 連接有裝入、取出室12。此種腔室本體21之内部,可利用 真空泵(省略圖示)予以減壓。 陰極單元23係以面對導入至腔室本體21之基板W之一面 (一方之基板面)的方式形成,藉由濺鍍靶材,於基板貿之 一面上使功能膜成膜。 加熱器22係將導入至腔室本體21之基板W加熱至最適於 成膜的溫度◊作為該種加熱器22,例如使用護套加熱器、 紅外線加熱器。 堆疊器1 3係以例如可收納複數個載台14之方式形成,且 經由閘閥(開關部)17可連通地連接於裝入、取出室12。於 此種堆疊器13中,暫時載置成膜前之基板,且在將成膜後 之基板向進行其他步驟之裝置送出時,中繼基板。堆疊器 13之内部只要維持大氣氛圍即可。 圖2係俯視構成成膜裝置之裝入、取出室的剖面圖。圖3 係從堆叠器觀察之裝入、取出室之剖面圖。 裝入、取出室(負載、卸載腔室)12具備可維持内部空間 為氣密狀態之腔室本體31。於腔室本體31之正面側(正面 位置)形成有連通成膜室(成膜腔室)u與腔室本體31之開口 32。在該正面位置令,經由閘閥16連接有成膜室^與㈣ 160 丨 O2.doc •10· 201230238 本體31。又,於腔室本體31之背面側(背面位置)形成有連 通堆疊器(移載裝置)13與腔室本體31之開口 33。在該背面 位置中,經由閘閥17連接有堆疊器π與腔室本體31。 於腔室本體31之一側面31a(第1側面),形成有加熱器(加 熱部)34。該加熱器(加熱部)34係下文所述用以加熱位於退 避位置之基板W的裝置。作為該加熱器係例如使用護套加 熱器或紅外線加熱器。 又,於腔室本體31之另一側面31 b(與第1側面相反之第2 側面)設置有真空泵35。真空泵35係在閘閥16、17為閉鎖 之狀態下排出腔室本體31内之氣體’並減壓腔室本體, 藉此使腔室本體3 1内成為真空狀態。 對此種裝入、取出室12裝入取出之載台14係以使基板w 之一面Wa沿鉛直方向G之方式垂直地保持基板冒之所謂的 縱型載台。載台14例如係保持矽晶圓等之基板臀之邊緣部 分,且以直立於大致鉛直方向之狀態保持基板w。 於靠近腔室本體31之底面31c的位置,形成有移動機構 40及搬送軌道36〇又,移動機構4〇係以貫通構成底面3卜 之壁部的方式,設置於腔室本體3丨(裝入、取出室12)之下 部。搬送軌道36係以在與腔室本體31之成膜室11相連的開 口 32及與堆疊器13相連的開口 33之間延伸之方式形成。保 持基板W之載台14係在搬送軌道36上移動。另,於該種搬 送軌道36中途,適當配置有以使載台14移動之搬送輥軸等 構成的旋轉機構(省略圖示)。 移動機構40包含第一移動機構41、第二移動機構42、及 160102.doc 201230238 第三移動機構43而構成。該等第一移動機構41、第二移動 機構42、及第二移動機構43分別由具有可伸縮之伸縮構件 41a、42a、43a之例如油壓缸或氣壓缸構成。 第一移動機構41係以沿著伸縮構件4U之延長方向相對 於鉛直方向G及水平方向f分別成大於〇。小於9〇。之特定角 度的傾斜方向(即,鉛直方向及水平方向)延伸之方式配 置。例如’使第一移動機構41之伸縮構件41a相對於水平 方向F成45。以上85。以下之角度、在本實施形態中例如成 6〇°之方式配置第一移動機構41。 第二移動機構42係以沿著伸縮構件42&之延長方向相對 於垂直方向G及水平方向F分別成大於0。小於90。之特定角 度的傾斜方向延伸之方式配置。又,第二移動機構42係以 使伸縮構件42a與第一移動機構41之伸縮構件4la相互交叉 之方式配置。例如,係以第二移動機構42之伸縮構件42a 相對於水平方向F與第一移動機構4丨之伸縮構件4丨a在反方 向上成45。以上85。以下之角度,本實施形態中例如成6〇。 之方式配置第二移動機構42。 另’以相互交又之方式配置之第一移動機構41之伸縮構 件413與第二移動機構42之伸縮構件42&,可在腔室本體31 之深度方向(搬送轨道36之延長方向),相互錯開位置地配 置。 於此種第一移動機構41之伸縮構件41a之前端部分、及 第二移動機構42之伸縮構件42a之前端部分,分別形成有 支持載台14之支持部41b、42b。 16〇102.doc 201230238 支持部4〗b、42b,例如係採用可於 - 4分被切除之部分(凹部 道6之 台14 送軌道36之延長部的構件。支持:置栽台"之構成搬 之兩端部分。 支持㈣b,係支持載 第二移動機構43係以使伸縮構^ ^ ^ 方向G延伸之方式配置。該種第向㈣直 第一移動機構43係使載台! 4 自搬送執道36脫離,使載台14停止移動。 關於具有如上構成之裝入、取出室之作用,參照圖2、 圖4A〜圖6〇加以說明。圖4A〜圖奶係階段性顯示構成本發 明之成膜裝置之裝入、取出室之動作的剖面圖。 另’以下㈣中,將說明由載台14取出成膜前之基板而 送入成膜室η,且自成膜室u取出成膜完成之基板並送入 載台14之一連串動作。 首先’在閉鎖設置於成膜室u與裝入、取出室12間之閘 閥16的狀態下’開放閑閥17,使裝入、取出室⑽堆疊器 13連通。此時,裝入、取出室12之内部之氛圍係與堆疊器 13之内部相同’為大氣氛圍。接著,將支持有成膜前之基 板W1之載σ 14A搭載於搬送軌道36,且由堆疊器13將载台 14Α導入裝入、取出室12内(參照圖4Α)。 載台14Α到達裝入、取出室12内之特定位置,即搬送位 置Ρ〇後,使第三移動機構43動作,伸縮構件43&沿鉛直方 向G朝上方向延伸。藉由該動作,載台14八自搬送執道% 脫離(離開),載台14Α之移動停止(參照圖4Β)。 其次,使第二移動機構42動作,令伸縮構件42a以相對 160102.doc •13· 201230238 於鉛直方向G及水平方向F分別成大於〇。小於9〇。之特定的 角度朝斜上方延伸。藉由該動作’使位於搬送位置之載 台14A載至形成於伸縮構件42a之前端部分之支持部4^。 其後,載台!4A係沿傾斜方向(即,錯直方向及㈣方向) 直線移動。藉此,載台14A由搬送位置p〇,向位於朝向一 斜上方之方向(第!移動方向)上的第_退避位置扪移罐 照圖4C)。該第一退避位置?1係腔室本體31(裝入、取出室 12)之内部中靠近加熱器34之位置。 其次’在閉鎖閘閥17後,使真空泵35動作,減壓裝入、 取出室12之内部,使其變成與成膜室u之内部相同程度之 真空狀態。接著,開放閘閥16,使裝入、取出室12連^成 膜室11後’將載置有配置於成膜室u内之成膜完成之基板 W2的載台14B載至搬送軌道36上,並將載台i4B導入裝 入、取出室12内(參照圖4D)。 載台14B到達裝人、取出室12内特^位置,即搬送位置 P0後,使第三移動機構43動作,伸縮構件43a沿鉛直方向G 朝上方向延伸。藉由該動作,載台14β自搬送軌道%脫離 (離開),載台14B停止移動(參照圖5A)。 此時,關於載台14A、14B之高度(鉛直方向g中之面31e 至載台14A、14B的距離),其争位於第一退避位置”之載 台14A之咼度係不同於位於搬送位置P0之載台14B之高 度。又,在水平方向!7中,載台14A之位置與载台14B之位 置不同。藉由如此改變載台14A及載台14B之高度及位 置,鉛直方向G中即使是位於搬送位置p〇之載台MB之邊 160102.doc 201230238 緣部分與載台14A之邊緣部分有部分重合的位置,仍不會 使載台14A、14B相互干涉(接觸)。 又,載置於位於第一退避位fpi夕被人u 圯避位罝P1之載台14A上的基板W1 車乂好為藉由加熱器(加哉部)34,力道λ <,,、’在導入成膜室丨】前,預先 使其升溫至特定之成滕、、Β痒。益 驭犋m度藉此,在基板W1被導入成 膜室U後’可節約使其升溫至特定成膜溫度之時間,進而 可更有效地在短時間内進行成膜。 其次’使第-移動機構41動作,將伸縮構件41a相對於 紹直方向G及水平方向F,即與伸縮構件42a以相對於錯直 軸線對稱之方向的特定角度,向斜上方延伸。藉由該動 作,使位於搬送位置P0之載台14B載至形成於伸縮構件“a 之前端部分之支持部杨上。接著,載台⑽沿傾斜方向直 線移動。藉此’載台14B從搬送位置p〇朝位於朝向另一斜 上方之方向(第2移動方向)的第二退避位置P2移動(參照圖 5B)。該第二退避位置^在腔室本體31(裝入、取出室工^) 之内邛中,係自加熱器34離開之位置,且係與第一退避位 置P1相反之位置。 其後,再次使第二移動機構42動作,將伸縮構件42a相 對於釔直方向G及水平方向ρ以特定角度收縮至斜下方。藉 由該動作,使位於第一退避位置P1之載台14A沿傾斜方向 直線移動,返回至搬送位置p〇(參照圖5 c)。此時,由於第 三移動機構43之伸縮構件43a係處於沿鉛直方向G朝上方向 延伸的狀態,故載台14A係保持自搬送軌道36離開之狀 態0 160102.doc •15- 201230238 載台14A到達搬送位置P0後,使第三移動機構43動作, 將伸縮構件43a沿鉛直方向G收縮至下方向,藉此將載台 14A載置於搬送軌道36(參照圖5d)。接著,沿搬送軌道耗 將載台14A送入成膜室11(參照圖6A)。將預先以加熱器34 升溫至特定成膜溫度的基板W1導入成膜室11後,迅速進 行成膜處理。 另一方面’待載台14A被送入成膜室11後,將閘閥16閉 鎖’使裝入、取出室12恢復大氣氛圍。繼而,開放閉鎖之 閘閥17,使其與大氣氛圍下之堆疊器13連通。 其後,再次使第一移動機構41動作,將伸縮構件4U相 對於鉛直方向G及水平方向F以特定角度收縮至斜下方。藉 由該動作,使位於第二退避位置p2之載台14B沿傾斜方向 直線移動,返回至搬送位置p〇(參照圖6B)。㈣由於第 三移動機構43之伸縮構件43a係處於沿鉛直方向G朝上方向 延伸的狀‘態,故載台14B係保持自搬送執道36離開之 態。201230238 VI. Description of the Invention: [Technical Field] The present invention relates to a film forming apparatus, and more particularly to a structure of a loading and unloading chamber constituting a film forming apparatus. [Prior Art] For example, a film forming apparatus that forms a functional film on a semiconductor substrate or the like can be a PVD (Physical Vapor Deposition) device or a CVD (Chemical Vapor Deposition) device. Wait. A film forming apparatus typified by such a PVD device or a CVD device or the like includes at least a film forming chamber which forms a film on a substrate, and a loading and unloading chamber (load, unloading chamber) which is airtight. The gate valve (switch portion) communicates with the film forming chamber. The loading and unloading chamber is, for example, loading the substrate from the space (one side) of the atmosphere to the inside of the loading and unloading chamber, and after decompressing the chamber, opening and connecting with the film forming chamber in a decompressing atmosphere On the other side of the gate valve, the substrate loaded into the cavity is fed into the film forming chamber. Further, the loading and unloading chamber is under a reduced pressure atmosphere. 'The substrate having the functional film formed in the film forming chamber is taken out, and is transported to the inside and outside (in the chamber) through the other side surface, and the chamber is in an atmosphere. 'From the side - the substrate is formed into a film. In other words, the loading and unloading chamber is installed in a state in which the inside of the film forming chamber is maintained in a reduced pressure atmosphere between the film forming chamber in which the inside is a reduced pressure atmosphere and the outside of the film forming apparatus in the air atmosphere. The transfer chamber used for the substrate is taken out. 160l02.doc 201230238 In the above-described loading and unloading chamber, a substrate that has been efficiently loaded and unloaded, for example, has a transport mechanism that transports one surface of the substrate in a horizontal direction and is held in a state of being staggered in the horizontal direction. A table (a vertical stage) (for example, 'refer to International Publication No. 116716 and International Publication No. 2008/129983). In the previous loading and unloading chamber, the substrate (the substrate before film formation) to be film-formed is loaded into the loading and unloading chamber, and then the interior (chamber) is loaded and removed (4), and the substrate is placed toward The position in one of the horizontal directions is moved so as to be retracted by the position (10) that is connected to the film forming chamber. Then, the substrate on which the film formation is completed is moved from the film forming chamber having the inside of the reduced pressure atmosphere to the loading and unloading chamber, and the substrate on which the film formation is completed is moved to the other position in the horizontal direction. In addition, the substrate to be film-formed is moved to the transfer position that communicates with the film formation chamber, and the substrate is introduced into the film formation chamber. Then, the substrate on which the film formation is completed is moved to the transfer position again, and then to be loaded, After the chamber in the take-out chamber is returned to the large line by the reduced pressure atmosphere, the substrate on which the film formation is completed is taken out to the outside of the loading and unloading chamber. However, as described above, the film forming apparatus incorporated in the 'extraction chamber' having the stage in which the holding substrate is perpendicular to the horizontal direction moves between the transfer position and the retracted position which communicate with the film forming chamber exists in the loading and unloading chamber. The problem that the width in the horizontal direction increases. In other words, in the loading and unloading chamber, it is necessary to ensure a sufficient retracting position in the horizontal direction so as not to interfere with the stage at the transport position. Therefore, it is difficult to reduce the width in the horizontal direction of the loading and unloading chamber. Moreover, since it is difficult to reduce the width in the horizontal direction of the loading and unloading chamber, 160102.doc 201230238, the internal volume of the loading and unloading chamber has to be increased, so that the inside and outside of the loading and unloading room are from a large atmosphere to a vacuum atmosphere. The exhaust time becomes longer. Therefore, as a result, there is a problem that the replacement time required for taking out the loading stage between the film forming chamber and the outside of the film forming chamber, that is, the loading and unloading efficiency is lowered. Further, in order to move the stage holding the substrate perpendicularly in the horizontal direction between the transport position and the retracted position that communicate with the film forming chamber, in addition to shifting the stage in the horizontal direction (four), the track extending in the horizontal direction or There are many components in the gears, so there is a problem of increased cost. Furthermore, the particles generated by the mechanically operated parts such as the rails or the gears extending in the horizontal direction contaminate the inside of the loading and unloading chamber, and the surface of the substrate is also subjected to the loading and unloading of the substrate. The blasphemy of pollution. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a film-forming film having a loading and unloading efficiency, a whiteness, a small size, and a simple configuration. Device. In order to solve the above problems, the present invention provides the following film forming apparatus in the form of a matte type, that is, the film forming product of the present invention is a frost film! a film forming chamber which forms a film on the substrate, and a stage which vertically holds the substrate in such a manner that one surface of the substrate is in a vertical direction; the device is connected to the device via the switch portion. (4) arranging with the above-mentioned chamber, and a moving mechanism provided in the upper insertion: two: in the outlet, the tray is inserted into the deposition chamber at a position that can be inserted between the film forming chamber and the adjacent chamber The position of the retraction I60I02.doc 201230238 is moved between the positions of the transfer position, and the stage is made larger than 0 in the vertical direction and the horizontal direction, respectively. Less than 90. The tilt direction of a specific angle moves up and down. Preferably, the moving mechanism linearly moves the stage up and down in the oblique direction between the transfer position and the retracted position located obliquely upward with respect to the transfer position. Preferably, the moving mechanism includes: a first moving mechanism that moves the stage between the transfer position and a first retracted position that is obliquely upward with respect to the transfer position; and a second moving mechanism The stage is moved between the transfer position and a second retracted position that is located obliquely upward with respect to the transfer position. Preferably, in the first moving mechanism and the second moving mechanism, a telescopic member that supports and moves the stage is provided, and the telescopic member of the yth moving mechanism and the second moving mechanism expand and contract The components are configured in a mutually overlapping manner. Preferably, the moving mechanism is in a horizontal direction 45. Above, 85. The angle below causes the stage to move up and down in the oblique direction. Preferably, the enthalpy device of the present invention further includes a heating portion provided at a position close to the retracted position for loading and unloading the film forming device of the present invention. Preferably, the moving mechanism Further, the second moving mechanism is included to move the stage in the vertical direction. [Effects of the Invention] According to the film forming apparatus of the present invention, in the loading and unloading chamber, the stage is inclined at a certain angle with respect to the horizontal direction toward the horizontal direction of the '60102.doc 201230238 (that is, the vertical direction and Move in the direction of the flat). For example, the stage is linearly moved up and down in the oblique direction between the retracted position and the transport position which are located obliquely above the transport position, and the stage is arranged in the horizontal direction toward the 7-feed position in the horizontal direction. Compared with the case of retreating, the film forming apparatus can be miniaturized. In particular, since the stage is retracted by shifting in the vertical direction and the horizontal direction, the degree of displacement of the stage in the vertical direction and the moving distance of the carrier in the horizontal direction can be reduced. Further, a plurality of stages can be accommodated in the two inlet and take-out chambers in a state in which the edges of the plurality of adjacent carrier ports are overlapped in the wrong direction. Therefore, the overlap of the plurality of stages in the horizontal direction can be omitted. As a result, the size of the film loading device can be reduced by reducing the width of the loading and unloading chambers in the horizontal direction. Further, in the film forming apparatus in which the loading and unloading stages constituting the previous film forming apparatus are moved only in the horizontal direction, and the roller which is required to be attached in the horizontal direction, the film forming apparatus is complicated and costly. problem. On the other hand, in the loading and unloading chamber constituting the film forming apparatus of the present invention, the stage is set to be larger than 0° and smaller than 90 in the vertical direction and the horizontal direction, respectively. The angle, that is, the moving mechanism in which the inclination direction is increased, for example, a pair of hydraulic cylinders or pneumatic cylinders, can reduce the manufacturing cost of film formation. Further, in the present invention, when the stage is retracted to a specific position in the loading and unloading chamber constituting the film forming apparatus, the orientation is greater than zero in the vertical direction and the horizontal direction, respectively. Less than 90. The angle, that is, the tilt direction increases. Therefore, it is possible to reduce the vibration generated by the mechanical friction and contact of the rails laid in the horizontal direction as before or the 160102.doc 201230238 rollers. Since it is formed into a crucible, it is possible to suppress the generation of fine particles in the loading and unloading chambers, thereby maintaining the clean state of the surface of the substrate or the inside of the substrate. [Embodiment] Hereinafter, an embodiment of a film forming apparatus of the present invention will be described with reference to the drawings ''. This embodiment (4) is specifically described for better understanding of the gist of the invention, unless otherwise specified, and is not intended to be limited this invention. Further, the drawings used in the following description are based on the extent to which the respective constituent elements can be identified on the drawing. Therefore, the sizes and proportions of the respective constituent elements are appropriately different from the actual conditions. Fig. 1 is a schematic view showing the entirety of a continuous type PVD apparatus (hereinafter simply referred to as a film forming apparatus) according to an embodiment of the film forming apparatus of the present invention. In the film forming apparatus 10 of the present embodiment, a film forming chamber (film forming chamber) 11, a loading and unloading chamber (negative weir, unloading chamber) 12, and a stacker (transfer device) 13 are provided in series. The film forming chamber 11 and the loading and unloading chamber 12 are communicated by opening the gate valve described below. Further, the loading and unloading chamber 12 and the stacker 13 are also connected by opening the gate valve. Then, the stage μ on which the substrate w is placed can move between the film forming chamber u, the loading and unloading chamber 12, and the stacker 13. A gate valve 16 that hermetically holds the film forming chamber u and the space in which the film forming chamber u and the loading and unloading chamber 12 are airtight is formed between the film forming chamber 11 and the loading and unloading chamber 12. Further, between the loading and unloading chamber 12 and the stacker 13, a gate valve 17 for airtightly holding the space in which the loading and unloading chamber 12 and the stacker 13 are held is formed. The gate valves 16, 17 are open when the carrier moves, and are closed when the stage 14 does not move. 160102.doc 201230238 Film forming chamber (film forming chamber) ιι has a chamber body 21 which can be airtightly held inside. A heater 22' and a cathode unit 23 are disposed in the chamber body 21, and an opening 24 through which the stage 14 on which the substrate W is mounted is formed on one surface (one side surface) of the chamber body 21, and The side surface is communicably connected to the loading and unloading chamber 12 via a gate valve 16. The inside of the chamber body 21 can be decompressed by a vacuum pump (not shown). The cathode unit 23 is formed to face one surface (one substrate surface) of the substrate W introduced into the chamber body 21, and the functional film is formed on one side of the substrate by sputtering the target. The heater 22 heats the substrate W introduced into the chamber body 21 to a temperature optimum for film formation. As the heater 22, for example, a sheath heater or an infrared heater is used. The stacker 13 is formed, for example, so as to accommodate a plurality of stages 14, and is communicably connected to the loading and unloading chamber 12 via a gate valve (switch portion) 17. In such a stacker 13, the substrate before film formation is temporarily placed, and when the substrate after film formation is sent to a device that performs another step, the substrate is relayed. The inside of the stacker 13 is only required to maintain the atmosphere. Fig. 2 is a cross-sectional view showing the loading and unloading chamber constituting the film forming apparatus in plan view. Figure 3 is a cross-sectional view of the loading and unloading chamber as viewed from the stacker. The loading and unloading chamber (load, unloading chamber) 12 is provided with a chamber body 31 that can maintain the internal space in an airtight state. An opening 32 that communicates with the film forming chamber (film forming chamber) u and the chamber body 31 is formed on the front side (front side) of the chamber body 31. In the front position, the film forming chamber and the (four) 160 丨 O2.doc •10· 201230238 body 31 are connected via the gate valve 16. Further, an opening 33 for connecting the stacker (transfer device) 13 and the chamber body 31 is formed on the back side (back position) of the chamber body 31. In this rear position, the stacker π and the chamber body 31 are connected via the gate valve 17. A heater (heating portion) 34 is formed on one side surface 31a (first side surface) of the chamber body 31. The heater (heating portion) 34 is a device for heating the substrate W located at the retracted position as described below. As the heater, for example, a sheath heater or an infrared heater is used. Further, a vacuum pump 35 is provided on the other side surface 31b of the chamber body 31 (the second side surface opposite to the first side surface). The vacuum pump 35 discharges the gas in the chamber body 31 while the gate valves 16 and 17 are closed, and decompresses the chamber body, thereby bringing the inside of the chamber body 31 into a vacuum state. The loading and unloading chamber 12 is loaded into the loading stage 14 so that the one surface of the substrate w is vertically held in the vertical direction G so that the substrate is held by the so-called vertical stage. For example, the stage 14 holds the edge portion of the substrate buttocks such as a silicon wafer, and holds the substrate w in a state of standing upright in a substantially vertical direction. A moving mechanism 40 and a transfer rail 36 are formed at a position close to the bottom surface 31c of the chamber body 31. The moving mechanism 4 is disposed in the chamber body 3A so as to penetrate the wall portion constituting the bottom surface 3. Enter and remove the lower part of the chamber 12). The transfer rail 36 is formed to extend between the opening 32 connected to the film forming chamber 11 of the chamber body 31 and the opening 33 connected to the stacker 13. The stage 14 holding the substrate W moves on the transfer rail 36. In the middle of the transport rail 36, a rotation mechanism (not shown) including a transport roller shaft for moving the stage 14 is disposed. The moving mechanism 40 includes a first moving mechanism 41, a second moving mechanism 42, and a 160102.doc 201230238 third moving mechanism 43. The first moving mechanism 41, the second moving mechanism 42, and the second moving mechanism 43 are each constituted by, for example, a hydraulic cylinder or a pneumatic cylinder having telescopic elastic members 41a, 42a, and 43a. The first moving mechanism 41 is larger than 〇 in the vertical direction G and the horizontal direction f along the extending direction of the elastic member 4U. Less than 9 inches. The inclination of the specific angle (i.e., the vertical direction and the horizontal direction) is configured to extend. For example, the telescopic member 41a of the first moving mechanism 41 is made 45 with respect to the horizontal direction F. Above 85. In the following manner, in the present embodiment, the first moving mechanism 41 is disposed, for example, at 6 〇. The second moving mechanism 42 is formed to be larger than 0 with respect to the vertical direction G and the horizontal direction F along the extending direction of the elastic member 42 & Less than 90. The specific angle is extended in the oblique direction. Further, the second moving mechanism 42 is disposed such that the elastic member 42a and the elastic member 41la of the first moving mechanism 41 intersect each other. For example, the telescopic member 42a of the second moving mechanism 42 is formed at 45 in the opposite direction with respect to the horizontal direction F and the telescopic member 4A of the first moving mechanism 4''. Above 85. In the following embodiment, for example, it is 6 inches. The second moving mechanism 42 is configured in a manner. Further, the telescopic member 413 of the first moving mechanism 41 and the telescopic member 42 of the second moving mechanism 42 disposed in a mutually overlapping manner may be in the depth direction of the chamber body 31 (the extending direction of the conveying rail 36) Disposed positionally. Support portions 41b and 42b for supporting the stage 14 are respectively formed at the front end portion of the telescopic member 41a of the first moving mechanism 41 and the front end portion of the telescopic member 42a of the second moving mechanism 42. 16〇102.doc 201230238 Supporting part 4 b, 42b, for example, a part that can be cut off at -4 points (a member of the stage 14 of the concave path 6 to the extension of the track 36. Support: the station " The four ends of the moving support mechanism 43 are arranged to extend the telescopic structure ^^ direction G. The first (four) straight first moving mechanism 43 is a stage! The movement of the transfer path 36 is released, and the stage 14 is stopped. The operation of the loading and unloading chamber having the above configuration will be described with reference to Figs. 2 and 4A to 6B. Fig. 4A to Fig. 4A shows the composition of the milk stage. A cross-sectional view of the operation of the film forming apparatus of the present invention in the loading and unloading chamber. In the following (4), the substrate before the film formation is taken out by the stage 14 and fed into the film forming chamber η, and the film forming chamber The substrate on which the film formation is completed is taken out and sent to the stage 14 in a series of operations. First, the valve 17 is opened in a state where the gate valve 16 provided between the film forming chamber u and the loading and unloading chamber 12 is closed, and the valve 17 is opened. The take-out chamber (10) stacker 13 is in communication. At this time, the atmosphere inside the chamber 12 is loaded and unloaded. The inside of the stacker 13 is the same as the atmosphere. Next, the carrier σ 14A supporting the substrate W1 before the film formation is mounted on the transfer rail 36, and the stacker 13 is introduced into the loading and unloading chamber 12 by the stacker 13 ( Referring to Fig. 4A), the stage 14 is moved to a specific position in the loading and unloading chamber 12, that is, after the transport position Ρ〇, the third moving mechanism 43 is operated, and the telescopic members 43 & extend in the vertical direction G upward. In this operation, the stage 14 is lifted (away) from the transport path, and the movement of the stage 14 is stopped (see Fig. 4A). Next, the second moving mechanism 42 is operated to make the telescopic member 42a relatively 160102.doc • 13 · 201230238 is greater than 〇 in the vertical direction G and the horizontal direction F. The specific angle is less than 9 〇. The specific angle extends obliquely upward. By this action, the stage 14A at the transfer position is carried to the front end formed on the telescopic member 42a. Part of the support portion 4^. Thereafter, the stage !4A moves linearly in the oblique direction (that is, in the direction of the misalignment and the direction of (4). Thereby, the stage 14A is moved from the transport position p〇 toward the obliquely upward direction. Direction (the !! moving direction) _ A first retracted position shift can be palpable to Fig 4C). The first retreat position? The inside of the 1-chamber chamber body 31 (the loading and unloading chamber 12) is located close to the heater 34. Then, after the gate valve 17 is closed, the vacuum pump 35 is operated, and the inside of the chamber 12 is introduced into and taken out under reduced pressure to be in a vacuum state similar to the inside of the film forming chamber u. Then, the gate valve 16 is opened, and the loading and unloading chamber 12 is connected to the film forming chamber 11, and the stage 14B on which the substrate W2 which has been deposited in the film forming chamber u is placed is placed on the transfer rail 36. The stage i4B is introduced into the loading and unloading chamber 12 (see Fig. 4D). When the stage 14B reaches the position in the loading and unloading chamber 12, that is, the transport position P0, the third moving mechanism 43 is operated, and the telescopic member 43a extends upward in the vertical direction G. By this operation, the stage 14β is released (away) from the conveyance rail %, and the stage 14B stops moving (see Fig. 5A). At this time, regarding the heights of the stages 14A and 14B (the distance from the surface 31e in the vertical direction g to the stages 14A and 14B), the stage 14A of the first retracted position is different from the position at the transfer position. The height of the stage 14B of P0. Further, in the horizontal direction! 7, the position of the stage 14A is different from the position of the stage 14B. By changing the height and position of the stage 14A and the stage 14B in this manner, the vertical direction G is Even if the edge portion of the stage MB102 of the transfer position p〇160102.doc 201230238 partially overlaps the edge portion of the stage 14A, the stages 14A and 14B are not interfered (contacted) with each other. The substrate W1 placed on the stage 14A which is placed on the first retreat position fpi is removed by the heater (twisting portion) 34, and the force λ <,, 'in the introduction Before the film forming chamber, the temperature is raised to a specific level and itching in advance. Therefore, after the substrate W1 is introduced into the film forming chamber U, the temperature can be increased to a specific film forming temperature. The time can be more effectively formed into a film in a short time. Next, the first moving mechanism 41 is made In the operation, the telescopic member 41a extends obliquely upward with respect to the straight direction G and the horizontal direction F, that is, at a specific angle with respect to the direction in which the telescopic member 42a is symmetrical with respect to the straight axis. By this action, the transport position P0 is located. The stage 14B is carried to the support portion Yang formed on the front end portion of the telescopic member "a". Next, the stage (10) moves linearly in the oblique direction. Thereby, the stage 14B moves from the transport position p〇 toward the second retracted position P2 located in the direction (second moving direction) which is obliquely upward (see Fig. 5B). The second retracted position is at a position away from the heater 34 in the inner bore of the chamber body 31 (loading and unloading chamber), and is at a position opposite to the first retracted position P1. Thereafter, the second moving mechanism 42 is again operated to contract the telescopic member 42a at a predetermined angle with respect to the straight direction G and the horizontal direction ρ to obliquely downward. By this operation, the stage 14A located at the first retracted position P1 is linearly moved in the oblique direction, and is returned to the transport position p (see Fig. 5c). At this time, since the telescopic member 43a of the third moving mechanism 43 is in a state of extending upward in the vertical direction G, the stage 14A is kept in a state of being separated from the conveyance rail 36. 0160102.doc •15- 201230238 Stage 14A After reaching the transport position P0, the third moving mechanism 43 is operated to contract the telescopic element 43a in the vertical direction G to the lower direction, whereby the stage 14A is placed on the transport rail 36 (see FIG. 5d). Next, the stage 14A is fed into the film forming chamber 11 along the transport rail (see Fig. 6A). The substrate W1 which has been previously heated by the heater 34 to a specific film formation temperature is introduced into the film forming chamber 11, and then the film forming process is rapidly performed. On the other hand, after the to-be-loaded stage 14A is fed into the film forming chamber 11, the gate valve 16 is closed, and the loading and unloading chamber 12 is returned to the atmosphere. Then, the latching gate valve 17 is opened to communicate with the stacker 13 in the atmosphere. Thereafter, the first moving mechanism 41 is operated again, and the telescopic member 4U is contracted obliquely downward at a specific angle with respect to the vertical direction G and the horizontal direction F. By this operation, the stage 14B located at the second retracted position p2 is linearly moved in the oblique direction, and is returned to the transport position p (see Fig. 6B). (4) Since the telescopic member 43a of the third moving mechanism 43 is in a state of extending upward in the vertical direction G, the stage 14B is kept away from the conveyance path 36.

其後,載台MB到達搬送位置pG後,使第三移動機構43 動作’將伸縮構件43&沿錯直方向⑽縮至下方向藉此使 載台UB載置於搬送執道36(參照_)。接著,將載台i4B =搬送軌道36送出至堆疊器13(參照圖6d)。藉此將成膜 元成之基板W 2取出至堆最哭1 〇 隹疊器13,將成膜前之基板W1與成 膜後之基板W2經由裝入 '取+ 取出至12有效地替換之1次步驟 r2r* 二、 / 70成0 另,在上述實施形態中,作為使載台朝傾斜方向移動之 I60102.doc -16 - 201230238 移動機構’雖以具備第一移動機構與第二移動機構之結構 加以說明,但亦可採用具備任一移動機構之結構。 又’在上述實施形態中,雖以具備使載台朝鉛直方向移 動之第二移動機構的結構加以說明,但亦可藉由設置使載 σ停止的裝置來作為與上述移動機構不同之裝置,而不特 - 別具備第三移動機構。 如上所述’在本發明之成膜裝置中,係使載台14相對於 斜直方向及水平方向分別成大於〇。小於9〇。之特定角度的 傾斜方向移動。例如’在相對於搬送位置Ρ0位於斜上方之 退避位置PI、Ρ2與搬送位置Ρ0之間,使載台14沿傾斜方向 直線性上下移動。藉由進行如此之動作,與先前使載台沿 水平方向F與搬送位置並排退避的情形相比較,可實現成 膜裝置10之小型化。尤其是,藉由以船直方向G上偏移之 方式使載台14退避’可以在使鄰接之複數個載台之邊緣於 錯直方向G重合之狀態下,將複數個載台收納於裝入、取 出室12内。因此’可省略水平方向中複數個載台之重合, 其結果可縮小裝入、取出室12沿水平方向f之寬度,實現 成臈裝置10之小型化。 作為一例’先前可將三個載台並排於水平方向之裝入、 取出室的寬度為565 mm。另一方面’如本發明所述,將三 個載台中之兩個載台於鉛直方向及水平方向以特定角度傾 斜、即可使載台沿斜上方向退避之裝入、取出室的寬度為 3 05 mm。即’本發明之成膜裝置由於可省略水平方向中載 台之重合’故可使裝入、取出室之寬度減為約先前之一半 160102.doc 17- 201230238 左右。 又’構成先前之成膜裝置之裝人、取出室 π 水平方向F移動,須有沿水平 吏載〜。 之潢銓笙m 丁力门敷°又之軌道或與其扣合 =門:另先前之成膜裝置中存在裝置複雜化且成 入問H方面,構成本發明之成膜裝置的裝 、取出室,由於僅需設置將載台朝錯直方向 向::朝傾斜方向升高之移動機構,例如設置一 或氣屋紅等即可,故可降低成膜裝置之製造成本。Thereafter, after the stage MB reaches the transport position pG, the third moving mechanism 43 is operated to "retract the telescopic member 43 & in the wrong direction (10) to the lower direction, thereby placing the stage UB on the transport lane 36 (see _ ). Next, the stage i4B = transport track 36 is sent to the stacker 13 (refer to Fig. 6d). Thereby, the substrate W 2 formed by the film formation element is taken out to the stack crying 1 stacker 13, and the substrate W1 before film formation and the substrate W2 after film formation are effectively replaced by loading 'taken + taken out to 12 In the above-described embodiment, the I60102.doc -16 - 201230238 moving mechanism that moves the stage in the tilt direction has the first moving mechanism and the second moving mechanism. The structure is explained, but a structure having any moving mechanism can also be employed. Further, in the above-described embodiment, the second moving mechanism that moves the stage in the vertical direction is described. However, a device that stops the load σ may be provided as a device different from the moving mechanism. Not special - don't have a third mobile agency. As described above, in the film forming apparatus of the present invention, the stage 14 is made larger than 〇 in the oblique direction and the horizontal direction, respectively. Less than 9 inches. The tilting direction of the specific angle moves. For example, the stage 14 is linearly moved up and down in the oblique direction between the retracted positions PI and Ρ2 and the transport position Ρ0 which are obliquely above the transport position Ρ0. By performing such an operation, the size of the film forming apparatus 10 can be reduced as compared with the case where the stage is previously retracted in the horizontal direction F and the transport position. In particular, the stage 14 is retracted by offsetting in the ship straight direction G. It is possible to store a plurality of stages in a state in which the edges of the adjacent plurality of stages overlap in the misalignment direction G. The chamber 12 is taken in and taken out. Therefore, the overlapping of the plurality of stages in the horizontal direction can be omitted, and as a result, the width of the loading and unloading chamber 12 in the horizontal direction f can be reduced, and the size of the crucible device 10 can be reduced. As an example, the width of the loading and unloading chamber in which the three stages can be arranged side by side in the horizontal direction is 565 mm. On the other hand, as described in the present invention, when two of the three stages are tilted at a specific angle in the vertical direction and the horizontal direction, the width of the loading and unloading chamber in which the stage is retracted in the obliquely upward direction is 3 05 mm. That is, the film forming apparatus of the present invention can reduce the width of the loading and unloading chamber to about one of the previous ones, 160102.doc 17-201230238, since the overlap of the stages in the horizontal direction can be omitted. Further, the loading and unloading chambers constituting the previous film forming apparatus are moved in the horizontal direction F, and must be horizontally loaded. The 铨笙 铨笙 丁 丁 丁 丁 敷 丁 丁 又 又 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = Since it is only necessary to provide a moving mechanism that raises the stage in the wrong direction: toward the oblique direction, for example, one or a gas house red is provided, so that the manufacturing cost of the film forming apparatus can be reduced.

位’本發明中,在裝入、取出”使載台退避至特定 時’係將其㈣直方向及水平方向即傾斜方向升古 因此’可減少如先前般沿水平方向敷設之軌道或與^ 之滾輪等之機械性摩擦'接觸所產生的振動。故 D 取出室中產生微粒,從而維持基板表面或裝入: 取出室之内部之清潔狀態。 [產業上之可利用性] 取出室之成膜裝置 本發明可適用於具備裝入、 【圖示簡單說明】 圖1係顯示本發明之成膜裝置之概要圖。 取出室之剖 圖2係俯視構成本發明之成膜裝置之裝入 面圖。 圖3係從堆疊器觀察之裝入、取出室之剖面圖。 圖4A係顯示構成本發明之成膜裝置之裝入、 作之剖面圖。 至 < 動 圖4B係顯示構成本發明之成膜裝置之裝入、取出a 之動 160102.doc 201230238 作之剖面圖。In the present invention, when the loading/unloading is performed to retract the carrier to a specific state, the (four) straight direction and the horizontal direction, that is, the oblique direction are raised, so that the track which is laid in the horizontal direction as before can be reduced or The mechanical friction of the roller or the like 'contacts the vibration generated. Therefore, D is generated in the extraction chamber to maintain the surface of the substrate or into the clean state of the inside of the extraction chamber. [Industrial Applicability] The present invention is applicable to a package, and the following is a schematic view of the film forming apparatus of the present invention. Fig. 2 is a plan view showing a mounting surface of the film forming apparatus of the present invention. Figure 3 is a cross-sectional view of the loading and unloading chamber as viewed from the stacker. Figure 4A is a cross-sectional view showing the loading and constituting of the film forming apparatus of the present invention. A cross-sectional view of the film forming apparatus for loading and unloading a motion 160102.doc 201230238.

作之剖面圖。 圖4D係顯示構成本發明之成膜裝置之裝入 明之成膜裝置之裝入、取出室之動 取出室之動 作之剖面圖。 之成膜裝置之裝入、取出室之動 圖5八係顯示構成本發明之成膜裝置之裝入 作之刮面圖。 圖50係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 圖5C係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 圖係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 圖6A係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 圖6B係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 圖係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 圖6D係顯示構成本發明之成膜裝置之裝入、取出室之動 作之剖面圖。 【主要元件符號說明】 !〇 成膜裝置 成膜室(成膜腔室) 160102.doc •19· 201230238 12 裝入、取出室(負載、卸載腔室) 13 堆疊器(移載裝置) 14 載台 14A 載台 14B 載台 16 閘閥 17 閘閥 21 腔室本體 22 加熱器 23 陰極單元 24 開口 3 1 腔室本體 31a 一側面(第1側面) 31b 另一側面(第2側面) 3 1c 底面 32 開口 33 開口 34 加熱器 35 真空泵 36 搬送軌道 40 移動機構 41 第一移動機構 41a 伸縮構件 41b 支持部 160102.doc -20- 201230238 42 第二移動機構 42a 伸縮構件 42b 支持部 43 第三移動機構 43a 伸縮構件 F 水平方向 G 鉛直方向 P0 移動位置 PI 第一退避位置 P2 第二退避位置 W 基板 W1 基板 W2 基板 Wa 基板W之一面 160102.doc -21 -Make a sectional view. Fig. 4D is a cross-sectional view showing the operation of the ejector chamber of the loading and unloading chamber of the film forming apparatus of the present invention which constitutes the film forming apparatus of the present invention. The loading and unloading chamber of the film forming apparatus Fig. 5 shows a plan view of the film forming apparatus of the present invention. Figure 50 is a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. Fig. 5C is a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. The figure shows a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. Fig. 6A is a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. Fig. 6B is a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. The figure shows a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. Fig. 6D is a cross-sectional view showing the operation of the loading and unloading chamber constituting the film forming apparatus of the present invention. [Main component symbol description] !〇 Film forming device film forming chamber (film forming chamber) 160102.doc •19· 201230238 12 Loading and unloading chamber (load, unloading chamber) 13 Stacker (transfer device) 14 Table 14A Stage 14B Stage 16 Gate valve 17 Gate valve 21 Chamber body 22 Heater 23 Cathode unit 24 Opening 3 1 Chamber body 31a One side (1st side) 31b The other side (2nd side) 3 1c Bottom side 32 Opening 33 opening 34 heater 35 vacuum pump 36 conveying rail 40 moving mechanism 41 first moving mechanism 41a telescopic member 41b supporting portion 160102.doc -20- 201230238 42 second moving mechanism 42a telescopic member 42b supporting portion 43 third moving mechanism 43a telescopic member F Horizontal direction G Vertical direction P0 Movement position PI First retracted position P2 Second retracted position W Substrate W1 Substrate W2 Substrate Wa Substrate W One side 160102.doc -21 -

Claims (1)

201230238 七、申請專利範圍: L 一種成膜裝置,其特徵為包含: 成膜室’其於基板上形成被覆膜; 載台’其以使上述基板之一面沿著鉛直方向之方式垂 • 直保持上述基板; • $入、取出室,其以與上述成膜室連通之方式經由開 關部而配置;及 移動機構,其設置於上述裝入、取出室内,使上述載 台在可在與上述成膜室之間插卸上述載台之搬送位置、 與鄰接於上述搬送位置之退避位置之間移動,且使上述 載台朝相對於錯直方向及水平方向分別成大於〇。小於9〇〇 之特疋角度的傾斜方向上下移動。 2. 如請求们之成膜裝置’其中上述移動機構係在上述搬 送位置與相對於上述搬送位置而位於斜上方的上述退避 位置之間,使上述裁台沿上述傾斜方向直線性上下移 動。 3. 如請求項1之成膜裝置,其中上述移動機構包含: 第一移動機構,其使上述載台在上述搬送位置與相對 於上述搬送位置位於一方之斜上方的第一退避位置之間 移動;及 第二移動機構,其使上述載台在上述搬送位置與相對 ;上述搬送位置位於另一方之斜上方的第二退避位置之 間移動。 4.如請求項3之成膜裝置,其中 160102.doc 201230238 於上述第-移動機構與上述第二移動機❹ 支持上述載台並使其移動之伸縮構件4 移 機構之伸㈣❹I第移動 互交又之方式配置。#動機構之伸縮構件係以相 5. 6. 如請求項1至4中任-項之成膜裝置,其令 .上述移動機構係以相對於水平方向45。以上、85。以下 之角度使上述載台於傾斜方向上下移動。 如請求項1至4中任一馆夕士 項之成膜裝置,其中進而包含加熱 部’其設置於上述裝入、取屮〜 出至之靠近上述退避位置之 位置,用以加熱上述基板。 如請求項1至4中杯—话夕士 . 項成膜裝置’其中上述移動機構 進^ a第—移動機構,其使上述載台沿鉛直方向移 動0 160102.doc201230238 VII. Patent Application Range: L A film forming apparatus, comprising: a film forming chamber 'which forms a coating film on a substrate; a stage' which is arranged such that one surface of the substrate is perpendicular to the vertical direction Holding the substrate; • an in-and-out chamber that is disposed through the switch portion in communication with the film forming chamber; and a moving mechanism that is disposed in the loading and unloading chamber to allow the carrier to be The transfer position between the deposition chamber and the retracted position adjacent to the transfer position is moved between the film forming chambers, and the stage is made larger than 〇 in the direction of the straight line and the horizontal direction. The tilt direction of the special angle less than 9 上下 moves up and down. 2. The film forming apparatus of the requester, wherein the moving mechanism is linearly moved up and down in the oblique direction between the transport position and the retracted position located obliquely upward with respect to the transport position. 3. The film forming apparatus of claim 1, wherein the moving mechanism includes: a first moving mechanism that moves the stage between the transfer position and a first retracted position that is obliquely above one of the transfer positions And a second moving mechanism that moves the stage between the transport position and the second retracted position where the transport position is located obliquely above the other. 4. The film forming apparatus of claim 3, wherein 160102.doc 201230238 is in the above-mentioned first-moving mechanism and the second moving machine ❹ supporting the stage and moving the telescopic member 4 to move the mechanism (4) Another way to configure. The stretching mechanism of the moving mechanism is a phase forming device according to any one of claims 1 to 4, wherein the moving mechanism is in a horizontal direction 45. Above, 85. The following angle causes the stage to move up and down in the oblique direction. The film forming apparatus according to any one of claims 1 to 4, further comprising a heating unit ??? which is disposed at a position close to the retracted position by the loading and unloading to heat the substrate. For example, in the claims 1 to 4, the cup-and-seven-film forming device </ RTI> wherein the moving mechanism is moved to the first moving mechanism, which moves the above-mentioned stage in the vertical direction.
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