TW201230164A - Chip unloading and arranging machine - Google Patents

Abstract

The present invention provides a chip unloading and arranging machine, which comprises an unloading machine, a chip arranging and screening machine, and a washing machine. The chip unloading machine conveys a grinding disk to each liquid tank for washing, so as to dissolve the wax between the grinding disk and a chip. The chip arranging and screening machine has a robot arm and a visual inspection device. The robot arm can clip a chip from the unloading machine, and check if there is any damage in association with the visual inspection device. If the chip is intact, it will be moved again to a chip carrier on the other side. The chip carrier can be conveyed into the washing machine, and the wax remained on the chip can be washed out through several solvent tanks and a pure water tank. Finally, the chip is dried with nitrogen and then discharged. The present invention can improve the current technique for chip processing, which needs to be carried out manually and easily results in damaged chips, so as to integrate each process, establish the automated processing, and improve the production yield.

Description

201230164 六、發明說明： 【發明所屬之技術領域】 本發明為一種工具機，尤指一種整合有取下晶片功 能、篩選排列晶片功能、洗淨晶片及研磨盤功能之晶片下 片排片機。 【先前技術】 其中有一道手續為研磨 現有技術的LED晶片製程中201230164 VI. Description of the Invention: [Technical Field] The present invention relates to a machine tool, and more particularly to a wafer lowering machine integrated with the functions of removing a wafer, screening a wafer, cleaning a wafer, and grinding a disk. [Prior Art] One of the procedures is to grind the prior art LED wafer process.

晶片’ S A將複S晶片_L冑並黏置於—陶冑或鐵製之研磨 盤上，再以該研磨盤設置於相對應的研磨機中進行晶片研 磨的減薄作業’各晶片於研磨完畢後即可將研磨盤由機器 中取出，標準的製程為以有機溶劑將蠟溶解再將晶片由研 磨盤上取下，此道手續須以人工運用晶片鑷子或安全到刀 將晶片由研磨盤上取下，再以人工筛選破損之晶片以及使 用溶劑清洗晶片，然、而現有技術之下晶片手續具有下述之 缺點； 首先，於製程中使用之溶劑通常具有致癌成分，明顯 對操作人員的健康有害’再者’以人工方式將晶片取下， :但，產速度慢’而且常因為人員操作的疏失造成晶片破 損提升了生產的不良率，故現有技術之晶片製程實有待 進一步改良。 【發明内容】 有鑑於現有技術晶片的減薄製程具有人工操作使得產 生破片的機率增加並且會因接觸溶劑有影響身體健康的風 險，因此本發明的發明目的在於提供一種工具機，其可整 [S] 3 201230164 合製程並提高生產良率。 本發明為一種晶片下片排片機，其包括有一下片機、 一排片篩片機與一洗淨機； 該下片機的機架上設有-進料輸送裝置、複數個溶劑 槽、至少'純水槽…升降裝置、_橫移裝置以及一出料 輸送裝置； 該進料輪送裝置係設置於機架的—端處· 、、該溶劑槽内設有溶劑，各溶劑槽係依：設置於機架上 並以其一端相鄰於該進料輸送裝置； 該純水槽内設有純水，該純水槽係設置於溶劑槽 一端之機架上； 該升降裝置包括有複數升降臂， ^ _ 平是各升降臂係分別設置 於各槽體的上方處，該升降臂可降 十用JI▼下位於槽體内或 於槽體上方； 粕遐升起位 該橫移裝置係設置於各槽體的一側 複數個推桿，於各槽體的一 置〃有 別a又有一推桿，該施士日-T 朝向於機架之一端推動或收回； 推扣可 該出料輸送裝置係設置於機體的另一端處； 該排片筛片機包括有一機械手臂與 洛 該機械手臂係相鄰於Ύ ΰ _ 、視覺檢測裴置； Μ相鄰於该下片機之出料輪送裝 測裝置的位置係相對於該機械手臂； /視覺檢 該洗淨機的機架上設有—進料輸 槽、複數個純水槽、至少一、、、至少—溶劑 w , η 虱軋烘乾裝置、—升降F w 秩移裝置以及-出料輸送裝置； 裝置、 該進料輸送裝置係設置 機架之一端並相鄰於該機械 201230164 手臂； s合劑槽内設有溶劑，該溶劑槽係設置在機架上並相 鄰於進料輸送裝置處； 、、該純水槽内設有純水，各純水槽係依序設置於機架上 並以一端相鄰於該溶劑槽； 乂氮氣烘乾裝置係設置於機架上並相鄰於該純水槽的 另一端； 該升降裝置包括有複數升降臂，各升降臂係分別設置 於各槽體的上方處，該升降臂可降下位於槽體内或升起位 於槽體上方； 該橫移裝置係設置於各槽體的一側，該橫移裝置具有 複數個推桿，於各槽體的一側分別設有一推桿，該推桿可 朝向於機架之一端推動或收回； 該出料輸送裝置係設置於機架的另一端，並相鄰於該 氮氣烘乾裝置。 ~ 所述之晶片下片排片機，其中該下片機之各溶劑槽内 設有電熱器以及超音波裝置，該電熱器可對溶劑進行加熱； 該下片機之純水槽内設有電熱器以及超音波裝置，, 電熱器可對純水進行加熱。 所述之晶片下片排片機，其令該洗淨機之各溶劑槽内 設有電熱器以及超音波裝置，該電熱器可對溶劑進行加^ ; 該洗淨機之純水槽内設有電熱器以及超音波裝置，1 電熱器可對純水進行加熱。 所述之晶片下片排片機，其進一步於下片機的機架上 設置一吸取裝置’該吸取裝置包括有一升降機構、—橫移 201230164 機構與：盤部，該吸盤部係位於 置的上方，該吸盤部#機之出枓輸送裝 降與橫移。 #降_與㈣機構帶動進行升 1 :㉜於片下片排片機，其進-步於下片機的機_上 设置一盤體輸送裝置，盆 π』獨木上 帶；該輸送帶設置 軌、一升降台與一輪送 下方，該滑軌係連接犬伸於機架的進料輸送裝置 輸送帶，該升降台二：出料輪送裝置的下方處與該 Γ滑軌升起位於出料輸送裝置之表面，也可沿該 軌下降位於該輪送帶表面。 戶二之晶片下片排片機，其中該下片機之橫移裝置包 y Κ移推臂，該橫移推臂位於各液體槽之—側面各 推桿係與該橫移推臂垂直連接並位於㈣槽之-側。 所述之曰曰片下片排片機，其中該洗淨機之橫移裝置包 括有一橫移推臂’該橫移推臂位於各液體槽之-側面，各 推桿係與該橫移推臂垂直連接並位於液體槽之一側。 所述之晶片下片排片機，其中該機械手臂係-種六軸式 之機械手臂。 藉上述的技術手段’以下片機對研磨盤進行取下晶片 的作業，並可將研磨盤清洗並回收，以排片篩片機排除破 知的晶片，並將良好的晶片置入一晶片載座中，該洗淨機 可對晶片載座内的晶片進行清洗，再將清洗完的晶片以氮 氣供乾’本發明將取下晶片、清洗研磨盤、篩選破片、排 列晶片以及清洗晶片五項生產製程整合，並可藉由連接控 制系統達到標準化、自動化的生產，可有效增加產能，並 201230164 排除因人為疏失造忐a u 成3曰片破損的不良率，有效降低人事成 本’也可進一步避备 光彳呆作人員接觸溶劑產生影響身體健廉 的風險，以符合各國的設廢規範。 【實施方式】 本發明之晶片下片排片機，如圖1所示，其包括有—下 片機1〇、-排片筛片機20與一洗淨機3〇; 。該下片機1〇,請參閱圖2及圖3所示，其包括有一機 進料輸送裝置12、複數個液體槽13、一升降裝置 14橫移裝置15、-出料輸送裝置16、—盤體輸送裝置 1 7與一溶劑循環槽18 ; 該機架11為一架體，其具有一外端111與一内端112, 並於機架11上設有複數個軌道11 3，各軌道11 3間係以一 間隔設置； β亥進料輸送裝置12係設置於機架11之外端111處， C括有相互連接的一橫移氣缸121與一升降氣缸122,該 ^移虹121可朝向機架11之外端111方向將該升降汽缸 122推出或收回’該升降汽紅122具有-可頂升或下降的伸 縮才干1221，該升縮桿1221於頂端設有一可承載物件的平 °亥進料輸送裝置12可將平台上的物件以橫移汽缸121 朝向機架11的外端川推移再以升降氣紅122頂升而位於 機架1 1内； 5玄液體槽13為一中空槽體，各液體槽内設有液體、電 熱裔138與超音波設備139，各液體槽13包括有五個内設 有溶劑之溶劑槽131、132、133、134、135與兩個内設有 純水的純水槽1 36、1 37，該電熱器1 38可對液體槽，3内 [S3 7 201230164 之液體進行加熱，該超音波設備139為現有技術，其可於 液體内產生真空氣泡，溶劑槽131、132、133、134、135 與純水槽1 36、1 37係沿外端111至内端彳彳2的方向依序 設置於該機架11上，並且各溶劑槽13頂端的兩側與該軌 道1 1 3相連接； 該升降裝置14係設置於機架彳彳上，其包括有一 开降 汽缸141、複數個升降滑執142、複數個升降座143以及複 數個升降臂144，該升降滑軌142係直立設置於機架n 上，該升降座143係與該升降滑軌142為可滑動的互相结 合，該升降氣虹141可驅動該升降座143於升降滑執142 上進行上升或下降的位移’該升降臂144之頂端與該升降 連接，該升降臂144的底端設有—可於頂面承載物 件的叉架心該升降臂144於升降座143上升時可位於 各:體槽13之上方處，該升降臂144之又架145於升降座 3下降時可位於各液體槽13内部； 氣二移裝置15係設置於機架111，其包括有-橫移 移推臂⑽置=:广複數個推桿152,該橫 151之臂體上突伸有複數心5=兩處; 間設置一推桿15? 0 於兩相鄰之液體槽 -推桿152,該橫於該進料輸送裝置12之上方設有 彳彳内端”、方向:出7收橫移推臂151朝向機架 推…向機架 該出料輸送裝置16’盆包°推出或收回； 取裝置162;該出料平台;6 ^出料平台161與一吸 之頂面可承載物件，且該出 201230164 料平台具有一入料端1611與一出料 山付鳊1612，該出料平台 161以入料端1611連接該純水 牙之軌道11 3 ;該吸 取裝置162包括有一升降氣缸1621、— ^ ' 橫移氣缸1622盥 一吸盤部1623,該吸盤部1623相對於該出料平台π〗的 上方處，該吸盤部1623可以底部將位於出料平台16彳上之 物件吸起或放下，並可受該升降氣缸则與心氣缸1622 帶動進行升降及橫向的位移； 言亥盤體輸送裝置17包括有一滑執The wafer 'SA 将 复 复 胄 胄 胄 胄 胄 胄 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA After the completion, the grinding disc can be taken out of the machine. The standard process is to dissolve the wax with an organic solvent and then remove the wafer from the grinding disc. This procedure must be carried out by manually applying the wafer tweezers or safely to the wafer. The upper part is removed, and the damaged wafer is manually screened and the wafer is cleaned by using a solvent. However, the prior art wafer processing has the following disadvantages: First, the solvent used in the process usually has a carcinogenic component, which is apparent to the operator. The health is harmful 'further' to manually remove the wafer, but: the production speed is slow' and the wafer damage is often caused by the loss of personnel operation, which increases the defective rate of production. Therefore, the wafer processing of the prior art needs to be further improved. SUMMARY OF THE INVENTION In view of the fact that the thinning process of the prior art wafer has a manual operation to increase the probability of generating fragments and may affect the health of the body due to contact with the solvent, the object of the present invention is to provide a machine tool which can be integrated. S] 3 201230164 Co-production process and increase production yield. The invention relates to a wafer lower sheet discharging machine, comprising a lower sheet machine, a row of sheet screening machine and a washing machine; the frame of the lowering machine is provided with a feeding conveying device, a plurality of solvent tanks, at least 'Pure sink... lifting device, _ traverse device and a discharge conveying device; the feeding wheeling device is arranged at the end of the frame, and the solvent tank is provided with a solvent, and each solvent tank is: Arranging on the frame and having one end adjacent to the feed conveying device; the pure water tank is provided with pure water, and the pure water tank is disposed on the frame at one end of the solvent tank; the lifting device includes a plurality of lifting arms, ^ _ flat is that each lifting arm is respectively disposed above each trough body, and the lifting arm can be lowered in the tank body or above the trough body by using JI ▼; the lifting device is disposed in the lifting device a plurality of push rods on one side of each tank body, and a push rod is arranged on one of the tank bodies, and the Shishiri-T is pushed or retracted toward one end of the rack; the push button can be used for the discharge conveyor Is disposed at the other end of the body; the row sieve machine includes a robot The arm and the Luo robot arm are adjacent to the Ύ ΰ _ and the visual inspection device; the position of the discharge device adjacent to the discharge machine of the lower machine is relative to the robot arm; / visual inspection of the cleaning The machine frame is provided with a feeding trough, a plurality of pure water tanks, at least one, at least, a solvent w, a η rolling drying device, a lifting F w rank shifting device, and a discharging conveying device; The feed conveying device is disposed at one end of the rack and adjacent to the arm of the machine 201230164; the solvent is disposed in the mixture tank, and the solvent tank is disposed on the frame and adjacent to the feeding conveying device; The pure water tank is provided with pure water, and the pure water tanks are sequentially disposed on the frame and adjacent to the solvent tank at one end; the nitrogen gas drying device is disposed on the frame and adjacent to the pure water tank. One end; the lifting device includes a plurality of lifting arms, each of which is disposed above each of the troughs, the lifting arm can be lowered in the trough body or raised above the trough; the traverse device is disposed at each One side of the trough, the traverse device has a plurality of pushes Each of the tanks is provided with a push rod on one side thereof, and the push rod can be pushed or retracted toward one end of the rack; the discharge conveying device is disposed at the other end of the rack and is adjacent to the nitrogen drying Device. The wafer lower sheet discharging machine, wherein each solvent tank of the lowering machine is provided with an electric heater and an ultrasonic device, wherein the electric heater can heat the solvent; the pure water tank of the lowering machine is provided with an electric heater As well as the ultrasonic device, the electric heater can heat the pure water. The wafer lower sheet discharging machine is provided with an electric heater and an ultrasonic device in each solvent tank of the washing machine, and the electric heater can add a solvent to the solvent; the electric washing machine has electric heating in the pure water tank And ultrasonic device, 1 electric heater can heat pure water. The wafer lower sheet discharging machine further comprises a suction device on the frame of the lowering machine. The suction device comprises a lifting mechanism, a traversing 201230164 mechanism and a disk portion, and the suction cup portion is located above the set. The suction cup part of the suction cup is transported and loaded and lowered. #降_与(4) The mechanism drives the lifting of 1:32 in the under-chip sorting machine, and the step-by-step setting of a disc body conveying device on the machine of the lowering machine, the basin π"single belt; the conveyor belt setting The rail, the lifting platform and the lowering of the wheel are connected to the feeding conveyor conveyor belt of the dog extending to the frame, and the lifting platform 2: the lower side of the discharging wheeling device is raised with the sliding rail The surface of the feed conveyor can also be lowered along the rail at the surface of the transfer belt. a second wafer lowering machine, wherein the lowering device of the lowering machine y moves the push arm, and the traverse push arm is located at each of the liquid grooves - the side pusher is vertically connected with the traverse push arm and Located on the side of the (four) slot. The cymbal lower sheet arranging machine, wherein the traversing device of the washing machine comprises a traverse push arm 'the traverse push arm is located at a side of each liquid tank, and each push rod system and the traverse push arm Connect vertically and on one side of the liquid tank. The wafer lower sheet discharging machine, wherein the mechanical arm is a six-axis type mechanical arm. By the above-mentioned technical means, the following machine is used to remove the wafer from the grinding disc, and the grinding disc can be cleaned and recovered, the chip is removed by the sheet sieving machine, and a good wafer is placed in a wafer carrier. The cleaning machine can clean the wafer in the wafer carrier and then dry the cleaned wafer with nitrogen. The present invention will remove the wafer, clean the grinding disk, screen the fragments, arrange the wafers, and clean the wafer. Process integration, and can achieve standardized and automated production through the connection control system, which can effectively increase the production capacity, and 201230164 eliminates the non-performing rate caused by human error, and effectively reduces the personnel cost. The exposure of the light-storing personnel to the solvent has a risk of affecting the health of the body in order to comply with the national waste regulations. [Embodiment] The wafer lower sheet discharging machine of the present invention, as shown in Fig. 1, comprises a lower-sheet machine 1 -, a platter screen machine 20 and a washing machine 3 〇; 1 and 3, which includes a machine feed conveying device 12, a plurality of liquid tanks 13, a lifting device 14 traverse device 15, and a discharge conveying device 16, The tray conveying device 17 and a solvent circulation tank 18; the frame 11 is a frame body having an outer end 111 and an inner end 112, and a plurality of rails 11 3 are disposed on the frame 11 11 is arranged at an interval; the β-Hui feed conveyor 12 is disposed at the outer end 111 of the frame 11, and C includes a traversing cylinder 121 and a lifting cylinder 122 connected to each other. The lifting cylinder 122 can be pushed out or retracted toward the outer end 111 of the frame 11. The lifting steam red 122 has a telescopic function 1221 that can be lifted or lowered. The lifting rod 1221 is provided with a flat bearing member at the top end. The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ a hollow tank body, each liquid tank is provided with a liquid, an electric 138 and an ultrasonic device 139, and each liquid tank 13 includes five built-in a solvent solvent tank 131, 132, 133, 134, 135 and two pure water tanks 1 36 and 137 which are provided with pure water, and the electric heater 138 can carry out liquid in the liquid tank, 3 [S3 7 201230164] Heating, the ultrasonic device 139 is a prior art, which can generate vacuum bubbles in the liquid, and the solvent tanks 131, 132, 133, 134, 135 and the pure water tanks 1 36, 1 37 are along the outer end 111 to the inner end 彳彳 2 The direction is sequentially disposed on the frame 11, and the two sides of the top end of each solvent tank 13 are connected to the rail 1 13; the lifting device 14 is disposed on the frame raft, and includes an opening and lowering cylinder 141. a plurality of lifting slides 142, a plurality of lifting seats 143, and a plurality of lifting arms 144, the lifting rails 142 are erected on the frame n, and the lifting blocks 143 and the lifting rails 142 are slidable with each other. In combination, the lifting gas rainbow 141 can drive the lifting seat 143 to move up or down on the lifting slide 142. The top end of the lifting arm 144 is connected with the lifting, and the bottom end of the lifting arm 144 is provided with a top The fork arm of the surface bearing member is located when the lifting arm 143 is raised. Each of the upper portions of the body groove 13 may be located inside each of the liquid tanks 13 when the lifting base 3 is lowered; the gas two-shifting device 15 is disposed on the frame 111, and includes a traverse shift The push arm (10) is set to: a plurality of push rods 152, and the plurality of push rods 152 are protruded from the arm body of the horizontal 151; a push rod 15? 0 is disposed between the two adjacent liquid tanks-push rods 152, The inner end of the feed conveyor 12 is disposed transversely to the feed conveyor 12, and the direction: 7 is traversed and the push arm 151 is pushed toward the frame to push out or retract the rack discharge device 16' The discharging device 162; the discharging platform; 6 ^ discharging platform 161 and a suction top surface can carry the article, and the 201230164 material platform has a feeding end 1611 and a discharging mountain 鳊 1612, the discharging The platform 161 is connected to the pure water tooth track 11 3 by the feeding end 1611; the suction device 162 includes a lifting cylinder 1621, - ^ ' traverse cylinder 1622 吸 a suction cup portion 1623, the suction cup portion 1623 is opposite to the discharging platform Above the π〗, the suction cup portion 1623 can suck or lower the object located on the discharge platform 16彳 at the bottom, and can be subjected to the lifting cylinder. Heart cylinder 1622 moved up and down and driven transverse displacement; Yan Hai tray conveying means 17 comprises a slide enforcement

171、一升降台172 以及-輸送帶173,該輸送帶173係設置於機架”;部並 可由一馬達（圖中未示）驅動位移，該輸送帶彳73可將物件由 機架11之内端112輸送至外端，該滑軌171係垂直設 置於該出料平台161的入料端1611與該輸送帶173間，該 升降台172係設置於該滑執171上並具有一升降氣缸 1721，該升降台172可以升降氣缸1721驅動以沿該滑軌 181進行上升或下降的位移，該升降台172的頂面於上升 後位於出料輸送裝置16的入料端1611表面，於下降後位 於輸送帶173的表面； β亥溶劑循環槽1 8係位於機架11上，其内部設有溶劑 並與各溶劑槽131、1 32、133、134、135相互連通，該溶 劑循環槽18可對各溶劑槽131、132、133、134、135内 的溶劑進行循環更新； δ玄排片篩片機20，請配合參閱圖4及圖5所示，其包 括有一機架21、一機械手臂22與一視覺檢測裝置23 ; S玄機架21係一架體，該架體設置於該下片部1 0之内 端1 1 2的—側； 201230164 該機械手臂22係設置於該機架21上，其為一六轴式 之機械手臂22,可進行多方向的轉動，該機械手臂22可以 前端夾取物件或放下； 該視覺檢測裝置23為一現有技術，其係設置於該下片 機10之機架11上並朝向於該機械手臂22,該視覺檢測裝 置23可與機械手臂22配合運作； 該洗淨機30,請參閱圖6及圖7所示，其包括有—機 木31、一進料輸送裝置32、複數個液體槽33、至少—氮 氣烘乾裝置34、-升降裝f 35、一橫移裝置36與一出料 輸送裝置37 ; 該機架31為一架體，其具有—内端311與外端312， 該機架31之内端311係位於機械手臂22之一側，並於機 架3彳上設有複數個軌道313，各軌道313間係以一間隔設 置；171, a lifting platform 172 and a conveyor belt 173, the conveyor belt 173 is disposed on the frame; the portion can be driven and displaced by a motor (not shown), and the conveyor belt 73 can be used for the object by the frame 11. The inner end 112 is transported to the outer end. The slide rail 171 is vertically disposed between the feeding end 1611 of the discharging platform 161 and the conveying belt 173. The lifting platform 172 is disposed on the sliding 171 and has a lifting cylinder. 1721, the lifting platform 172 can be driven by the lifting cylinder 1721 to perform a rising or falling displacement along the sliding rail 181. The top surface of the lifting platform 172 is located on the surface of the feeding end 1611 of the discharge conveying device 16 after being raised. Located on the surface of the conveyor belt 173; the β-coal solvent circulation tank 18 is located on the frame 11, and is internally provided with a solvent and communicates with each of the solvent tanks 131, 1 32, 133, 134, 135, and the solvent circulation tank 18 can be The solvent in each of the solvent tanks 131, 132, 133, 134, and 135 is cyclically updated; the δ Xuanjie sheet sieving machine 20, as shown in FIG. 4 and FIG. 5, includes a frame 21 and a robot arm 22 And a visual detecting device 23; the S-frame 21 is a body, the frame is set The robot arm 22 is disposed on the frame 21, which is a six-axis robot arm 22, which can perform multi-directional rotation, which is disposed on the side of the inner end 1 1 2 of the lower portion 10; The robot arm 22 can grip the object or drop it at the front end; the visual detecting device 23 is a prior art, which is disposed on the frame 11 of the lower film machine 10 and faces the robot arm 22, and the visual detecting device 23 can The robot arm 22 cooperates; the cleaning machine 30, as shown in FIG. 6 and FIG. 7, includes a machine 31, a feed conveying device 32, a plurality of liquid tanks 33, and at least a nitrogen drying device 34. - a lifting device f 35, a traverse device 36 and a discharge conveying device 37; the frame 31 is a frame having an inner end 311 and an outer end 312, and the inner end 311 of the frame 31 is located One side of the robot arm 22, and a plurality of rails 313 are disposed on the rack 3, and the rails 313 are disposed at an interval;

該進料輸送裝置32係設置於機架31之内端311處， 八已括有可艾馬達（圖中未示）驅動旋轉的輸送帶321與 一升降氣缸322,該輸送帶321可輸送物件至升降氣缸322 處°玄升降氣缸322可將物件頂升進入機架31之内端311 處， 该液體槽33為—内設有液體之中空槽體，其包括有一 個内叹有溶劑的溶劑槽331以及三個内設有純水的純水槽 332、333、334，访 〜洛劑槽331、純水槽332、純水槽333 與純水槽334係外免^ ^ 口 ’、。内碥311至外端312的方向依序設置於 该機架31上，各液體槽33的頂端兩侧分別與該執道31 3 連接’各槽體内設有I Λ S] 巧冤熱裔335，戎電熱器335可對液體 10 201230164 槽33内的液體進行加熱，並分別於溶劑槽33彳與純水槽 332、333内設有超音波設備336 ’該超音波設備336為現 有技術’其可於上述溶劑槽331與純水槽332、333内產生 真空之氣泡； 該氮氣烘乾裝置34係設置於機架31之相鄰於純水槽 334處，該氮氣烘乾裝置34頂端兩側分別與該㈣313相 連接，且其一側的執道313與該純水槽334相連接，該氮 氣烘乾裝置34可對内部之物件進行烘乾；The feeding conveyor 32 is disposed at the inner end 311 of the frame 31, and includes a conveyor belt 321 that is driven to rotate by a motor (not shown) and a lifting cylinder 322, and the conveyor belt 321 can transport the object. Up to the lifting cylinder 322, the vertical lifting cylinder 322 can lift the object into the inner end 311 of the frame 31. The liquid tank 33 is a hollow tank with a liquid therein, and includes a solvent with a solvent inside. The tank 331 and the three pure water tanks 332, 333, and 334 having pure water therein are provided, and the access tank 331, the pure water tank 332, the pure water tank 333, and the pure water tank 334 are exempted from the mouth. The direction of the inner rim 311 to the outer end 312 is sequentially disposed on the frame 31, and the top ends of the liquid tanks 33 are respectively connected with the obstruction 31 3 'I Λ S in each tank body] 335, the crucible heater 335 can heat the liquid in the liquid 10 201230164 tank 33, and is provided with an ultrasonic device 336 in the solvent tank 33 and the pure water tanks 332, 333 respectively. The ultrasonic device 336 is a prior art A vacuum bubble may be generated in the solvent tank 331 and the pure water tanks 332, 333; the nitrogen drying device 34 is disposed adjacent to the pure water tank 334 of the frame 31, and the nitrogen drying device 34 is respectively on both sides of the top end The (four) 313 is connected, and one side of the road 313 is connected to the pure water tank 334, and the nitrogen drying device 34 can dry the inner object;

該升降裝置35係設置於機架31上，其包括有一升降 汽缸351、複數個升降滑軌352、複數個升降座353以及複 數個升降臂354,該升降滑軌352係直立設置於機架31 上’該升降座353係與該升降滑執352為可滑動的互相結 合’該升降氣缸351可驅動該升降座353於升降滑軌说 上進行上升或下降的位移’該升降f 354之頂端與該升降 =53連接，該升降臂354的底端設有—可於頂面承㈣ •又架355’該升降f 354於升降座如上升時可位於 各;夜體槽33之上方處’各升降臂354之又架355於升降座 下降時可位於各液體槽33及氮氣供乾裝置34内部； 氣缸(Ht裝^ 36係設置於機架31上’其包括有-橫移 1㈤中未不）、—橫移推臂361與複數個推桿362，奸 多推臂361係設置於各液㈣33 < ^ 如之臂體上突伸有複數個推桿362 ==移推臂 33間設置一推0 於兩相鄰之液體槽 -置料362,且於該進料輪送裝置 -推桿362,該橫移氣缸可推移該橫 上方故有 31外端312 66 * Α 山# 361朝向機架 向推出或收回，該橫移推臂361可帶動各 201230164 推桿：朝向機架31外端312的方向推出或收回丨 其包：有：輪送裝置37係設置於機架31之外端312處， -井降々可受馬達（圖中未示）驅動旋轉的輸送♦ 371與 處之物Π372,該升降氣缸372可將機架31之外端312 牛降下，並連接該輸送帶371 架3!方向輸送； 以將遠物件遠離該機 =明於使用時係、配合-研磨盤承載台Μ與一The lifting device 35 is disposed on the frame 31 and includes a lifting cylinder 351, a plurality of lifting rails 352, a plurality of lifting seats 353, and a plurality of lifting arms 354. The lifting rails 352 are erected on the frame 31. The upper lifting seat 353 is slidably coupled to the lifting slide 352. The lifting cylinder 351 can drive the lifting seat 353 to move up or down on the lifting rail. The top end of the lifting f 354 is The lifting/lowering 53 is connected to the bottom end of the lifting arm 354. The bottom end of the lifting arm 354 is provided with a top surface (4). The lifting frame 355' is located at the top of the night body slot 33. The frame 355 of the lifting arm 354 can be located inside each liquid tank 33 and the nitrogen supply device 34 when the lifting seat is lowered; the cylinder (the Ht assembly 36 is disposed on the frame 31) which includes - traverse 1 (5) ), the traverse push arm 361 and the plurality of push rods 362, the stalk push arm 361 is set in each liquid (four) 33 < ^ as the arm body protrudes with a plurality of push rods 362 == shifting arm 33 setting Pushing 0 to two adjacent liquid tank-placement 362, and at the feed transfer device-push rod 362, the traverse The cylinder can be moved over the upper side so that there are 31 outer ends 312 66 * Α Mountain # 361 is pushed out or retracted toward the frame, and the traverse push arm 361 can drive each 201230164 push rod: toward the outer end 312 of the frame 31 or The bag is retracted: there are: the wheeling device 37 is disposed at the outer end 312 of the frame 31, and the well hoist can be driven by the motor (not shown) to rotate ♦ 371 and the object 372, the lifting The air cylinder 372 can lower the outer end 312 of the frame 31 and connect the conveyor belt 371 to the frame 3! direction to convey the far object away from the machine=the use-time, the matching-grinding disk bearing platform and the

:一载座42使用，請參閱圖8及圖9所示，該研磨盤4〇 Μ IU讀體’其—端面以蠛黏有複數晶片的，該承載台 41為一塊體，塊體側面相對於研磨盤4〇具有晶片5〇的側 面形成一結合面411，並於該砝人品〜 。。® 411内對應於各晶片 〇的位置凹設有複數個容置槽412 ’並於各容置槽川表 面穿設有-流道413,以提供研磨盤4〇與承載台41全士入 ^液體可透過該流道413流人或流出該容置槽412 = 晶片載座42為一塊體，其可承載複數片晶片5〇 ; 人 [S] 本發明於實際使用時，係將該研磨盤4〇與承載台Μ 互相結合’以將黏置於研磨盤4〇上之各晶片5〇位二載 台的之各容置槽412内’將該結合後的研磨盤4〇與承載 台41以下片機1G處的進料輸送裝置12運送進人機架I) 的外端川處，以該橫移裝置15的推桿152相對於該研磨 盤切與承載台41的側面並沿該軌道113推移，使該研磨 盤4〇與承載台41位於該溶_ 131之上方的升降臂⑷ 之又架145上，以該升降裝置14的升㈣144將該研磨盤 〇與承載台41下降至溶劑槽131處進行清洗，溶劑可沿 承栽台41底面的流道413流入容置槽412内部對晶片 12 201230164 與研磨盤40間的蠟質進行溶解，再將該升降臂彳44升起帶 動該研磨盤40與承載台41位於溶劑槽131之上方處，該 容置槽412内的溶劑可沿流道413流出，該橫移裝置15可 由推桿152推動該研磨盤40與承載台41至下一升降臂144 處，並依此步驟依序以溶劑槽132、133、134、135以及 純水槽136、137對研磨盤4〇與晶片間的蠟質進行溶解與 清洗，再以推桿】52推動該研磨盤4〇與承載台41進入出 料平台161之入料端161彳，以吸取裝置162之吸盤部1623 * 將研磨盤40與承載台41共同吸附升起並朝向出料平台161 的出料端1612移動，該吸盤部1623將吸起之承載台41 降下並位於該出料端1612處’該吸盤部1623再將該研磨 盤40移至出料平台161之入料端彳61彳並降下，使該研磨 盤4〇位於升降台172之上方，該升降台】72可將研磨盤 4〇降下至輸送帶173處並向機架川之外端1n輪送；該 出料平台161上的承載台41内的晶片5〇此時可被機械手 淥22失取並以視覺檢測裝置23檢查是否有破損情形，如 無破損情形該機械手臂22將夾取該晶片5〇至洗淨部3〇之 ，輸送裝置32上的晶片載座42内，該晶片載座42可由 進料輸送裝置32帶動進入洗淨機30的機架31内端311 下方並由该升降氣缸322頂升，以該橫移裝置36的推桿 362相對於該晶片載座42的側面並沿該軌道31 3推移，使 該阳片載座42位於該溶劑槽331之上方的升降臂354之叉 架 355 μ ’、 以該升降裝置35的升降臂354將該晶片載座 降至'合劑槽331處進行清洗再上升，並依此步驟依序 將°玄阳片載座42下降位於各液體槽33進行清洗再上升， 13 201230164 m移裝置36帶動前進至下-個液體槽33處，該晶片 載座42於純水槽334、主、β 僧34 h洗完畢後將由升降臂354帶動而谁 入氮氣烘乾裝置34蔣a U Μ 將日日片50上之水分烘乾，再經由機 31外端312的出料輸送裝置37輸ι “: A carrier 42 is used, as shown in FIG. 8 and FIG. 9 , the grinding disc 4 IU readable body's end surface is affixed with a plurality of wafers, and the carrying platform 41 is a single body, and the side of the block is opposite. A bonding surface 411 is formed on the side of the polishing disk 4 having the wafer 5 turns, and is disposed on the body. . In the 411, a plurality of accommodating grooves 412' are recessed in the positions corresponding to the respective cymbals, and a flow path 413 is formed in the surface of each accommodating groove to provide the grinding plate 4 and the loading table 41. The liquid can flow through the flow channel 413 or flow out of the accommodating groove 412. The wafer carrier 42 is a body that can carry a plurality of wafers 5 〇; human [S] The present invention is used in actual use. 4 〇 and the carrier 互相 are combined with each other to adhere the respective wafers 5 stuck on the grinding disc 4 to each of the accommodating grooves 412 of the two stages. The combined grinding disc 4 〇 and the carrying table 41 The feed conveyor 12 at the lower machine 1G is transported into the outer end of the rack I), and the push rod 152 of the traverse device 15 is cut with respect to the grinding disc and along the side of the carrying table 41. 113 shifting, the grinding disc 4〇 and the loading table 41 are located on the shelf 145 of the lifting arm (4) above the solution 131, and the lifting tray and the loading table 41 are lowered to the solvent by the rising (four) 144 of the lifting device 14. The tank 131 is cleaned, and the solvent can flow into the accommodating tank 412 along the flow path 413 of the bottom surface of the loading table 41 to the wafer 12 201230164 and the grinding disc. 40 pieces of wax are dissolved, and the lifting arm 彳 44 is raised to drive the grinding disc 40 and the loading table 41 above the solvent tank 131. The solvent in the accommodating groove 412 can flow out along the flow path 413. The traverse device 15 can push the grinding disc 40 and the loading table 41 to the next lifting arm 144 by the push rod 152, and sequentially grind the disc with the solvent tanks 132, 133, 134, 135 and the pure water tanks 136, 137. 4. The wax between the wafer and the wafer is dissolved and cleaned, and then the polishing disc 4 is pushed by the push rod 52 and the loading table 41 enters the feeding end 161 of the discharging platform 161 to suck the suction portion 1623 of the device 162 * The grinding disc 40 is lifted together with the loading table 41 and moved toward the discharge end 1612 of the discharge platform 161. The suction cup portion 1623 lowers the suctioned loading platform 41 and is located at the discharge end 1612 'the suction cup portion 1623 Then, the grinding disc 40 is moved to the feeding end 彳61彳 of the discharging platform 161 and lowered, so that the grinding disc 4 is located above the lifting platform 172, and the lifting table 72 can lower the grinding disc 4〇 to the conveyor belt. At 173, it is rotated to the outer end 1n of the rack; the loading platform 161 is on the loading platform 41. The sheet 5 can be lost by the robot 22 at this time and checked by the visual inspection device 23 for damage. If there is no damage, the robot arm 22 will grip the wafer 5 to the cleaning portion 3, the conveying device In the wafer carrier 42 on the 32, the wafer carrier 42 can be driven by the feed conveyor 32 into the lower end 311 of the frame 31 of the washer 30 and lifted by the lift cylinder 322 to the traverse device 36. The push rod 362 is moved relative to the side surface of the wafer carrier 42 along the track 31 3 such that the male carrier 42 is located at the fork 355 μ′ of the lifting arm 354 above the solvent groove 331 by the lifting device 35. The lifting arm 354 lowers the wafer carrier to the 'mixing tank 331 for washing and rising, and according to this step, the Xuanyang sheet carrier 42 is lowered in each liquid tank 33 for cleaning and rising, 13 201230164 m shift The device 36 is driven to proceed to the lower liquid tank 33. After the pure water tank 334, the main, β 僧 34 h is washed, the wafer carrier 42 will be driven by the lifting arm 354 and the nitrogen drying device 34 will be used. The moisture on the day piece 50 is dried, and then the discharge conveying device 3 via the outer end 312 of the machine 31 7 loses “

述可头本發明藉此將晶片取下 '清洗研磨盤 選破片、排列晶片以及清洗晶片五項生產製程整合 藉由將下片機、排片筛片機與洗淨機連接控制系統達到標 準化自動化的生產，可有效增加產能，並排除因人為 失—損的不良率，有效降低人事成本，更避免操 作人貝接觸溶劑產生致癌風險，料_步符合各 麻 規範。 』°又墩 【圖式簡單說明】 圖1為本發明之上視圖。 圖2為本發明之下片機的上視圖。 圖3為本發明之下片機的側視圖。 圖4為本發明之排片篩片機的上視圖。 圖5為本發明之排片篩片機的側視圖。 圖6為本發明之洗淨機的上視圖。 圖7為本發明之洗淨機的側視圖。 圖8為本發明之研磨盤與承載台之立體外觀圖。 圖9為本發明之研磨盤與承載台之剖面示意圖。 【主要元件符號說明】 10下片機 11機架 111外端 112内端 [S] 14 201230164 113軌道 12進料輸送裝置 121橫移氣缸 122升降氣缸 1221伸縮桿 13液體槽 131、132、133、134、135 溶劑槽According to the invention, the wafer is removed, the cleaning of the grinding disc is selected, the wafer is arranged, and the wafer is cleaned. The five production processes are integrated, and the control system of the lowering machine, the screen sieving machine and the washing machine is standardized and automated. Production can effectively increase production capacity, and eliminate the non-performing rate due to human loss-loss, effectively reduce personnel costs, and avoid the risk of carcinogenicity caused by human exposure to solvents. 』°又墩 [A brief description of the drawings] Fig. 1 is a top view of the present invention. Figure 2 is a top plan view of the lower machine of the present invention. Figure 3 is a side elevational view of the lower tablet machine of the present invention. Figure 4 is a top plan view of the sheet sieving machine of the present invention. Figure 5 is a side elevational view of the sheet sieving machine of the present invention. Figure 6 is a top plan view of the washing machine of the present invention. Figure 7 is a side view of the washing machine of the present invention. Figure 8 is a perspective view of the grinding disc and the carrier of the present invention. Figure 9 is a schematic cross-sectional view of a grinding disc and a carrier of the present invention. [Main component symbol description] 10 lower machine 11 frame 111 outer end 112 inner end [S] 14 201230164 113 track 12 feed conveying device 121 traverse cylinder 122 lifting cylinder 1221 telescopic rod 13 liquid tank 131, 132, 133, 134, 135 solvent tank

136、137純水槽 139超音波設備 14升降裝置 142升降滑軌 144升降臂 1 5橫移裝置 151橫移推臂 1 6出料輸送裝置 1611入料端 162吸取裝置 1622橫移機構 17盤體輸送裝置 171滑軌 173輸送帶 20排片篩片機 22機械手臂 30洗淨機 31 1内端 313軌道 32進料輸送裝置 138電熱器 141升降氣缸 143升降座 145叉架 152推桿 161出料平台 1 61 2出料端 1621升降機構 1623吸盤部 172升降台 1 8溶劑循環槽 21機架 23視覺檢測裝置 31機架 31 2外端 321輸送帶 [S] 15 201230164 322升降氣缸 33液體槽 331溶劑槽 332、333、334 純水槽 335電熱器 336超音波設備 34氮氣烘乾裝置 35升降裝置 351升降氣缸 352升降滑軌 353升降座 354升降臂 355叉架 36橫移裝置 361橫移推臂 362推桿 37出料輸送裝置 371輸送帶 372升降氣缸 40研磨盤 41承載台 42晶片載座 50晶片 16136, 137 pure water tank 139 ultrasonic equipment 14 lifting device 142 lifting rail 144 lifting arm 1 5 traverse device 151 traverse push arm 16 discharge conveying device 1611 feeding end 162 suction device 1622 traverse mechanism 17 disk conveying Device 171 slide rail 173 conveyor belt 20 row sieve machine 22 robot arm 30 washing machine 31 1 inner end 313 rail 32 feed conveyor 138 electric heater 141 lifting cylinder 143 lifting seat 145 fork 152 push rod 161 discharging platform 1 61 2 discharge end 1621 lifting mechanism 1623 suction cup part 172 lifting table 1 8 solvent circulation tank 21 frame 23 visual inspection device 31 frame 31 2 outer end 321 conveyor belt [S] 15 201230164 322 lifting cylinder 33 liquid tank 331 solvent tank 332, 333, 334 pure water tank 335 electric heater 336 ultrasonic equipment 34 nitrogen drying device 35 lifting device 351 lifting cylinder 352 lifting rail 353 lifting seat 354 lifting arm 355 fork 36 traverse device 361 traverse push arm 362 putter 37 discharge conveying device 371 conveyor belt 372 lifting cylinder 40 grinding disc 41 carrying platform 42 wafer carrier 50 wafer 16

Claims (1)

201230164 七 、申請專利範圍·· 排片篩 > —- 1·一種晶片下片排片機，其包括有一下片機 片機與一洗淨機； 广：片機的機架上設有一進料輪送裝置、複數個溶劑 輸送裝置； 升降裝置、—橫移裝置以及-出料 該進料輪送裝置係設置於機架的一端處； :溶：槽内設有溶劑，各溶劑槽係依序設置於機架上 並以/、端相鄰於該進料輪送裝置； 該純水槽内設有純水，該 一端之機架上； ，槽係扠置於溶劑槽之另 該升降裝置包括有複數升降臂 於各槽體的上方處，該升降臂 升降《係刀別設置 於槽體上方； 位於槽體内或升起位 該橫移裝置将机$ & > μ γ罝係叹置於各槽體的_ 複數個推桿，於各槽體的—二“移裝置具有 朝向於機架之—端推動或收回；叹有㈣干’該推桿可 :出料輸送裝置係設置於機體的 該排片筛片機包括有一機械…“， 該機械手臂係相鄰於手#與-視覺檢測裝置； 測裝置的位置係相對J該機械二:料輪送裝置；該視覺檢 該洗淨機的機架& — 槽、複數個純水槽、、—進料輸送裝置、至少一溶剤 一橫移裝置以及少―氮氣烘乾裝置 '一升降裝置 及出料輸送裝置. 技置、 該進料輸& S] 架之一端並相鄰於該機械 17 201230164 手臂； 忒各劑槽内設有溶劑，該溶劑槽係設置在機架上並相 鄰於進料輸送裝置處； 、°亥純水槽内設有純水，各純水槽係依序設置於機架上 並以一端相鄰於該溶劑槽； 5亥氮氣烘乾裝置係設置於機架上並相鄰於該純水槽的 另一端； S升降裝置包括有複數升降臂，各升降臂係分別設置 於各槽體的上方處’該升降臂可降下位於槽體内或升起位 於槽體上方； 4褕移裝置係設置於各槽體的一侧，該橫移裝置具有 複數個推桿，於各槽體的—側分別設有—推桿該推桿可 朝向於機架之一端推動或收回； 产遠出料輸送I置係設置於機架的另—端，並相鄰於該 氮氣烘乾裝置。 Λ 2 •如申請專利範圍第1項所述之晶片下片排片機，其中 忒下片機之各溶劑槽内設有電熱器以及超音波裝置，該電 熱器可對溶劑進行加熱； '亥下片機之純水槽内設有電熱器以及超音波裝置該 電熱器可對純水進行加熱。 3,如申請專利範圍第2項所述之晶片下片排片機，其中 該洗淨機之各溶劑槽内設有電熱器以及超音波裝置，該電 熱器可對溶劑進行加埶. 該洗淨機之純水槽内設有電熱器以及超音波裝置，該 電熱器可對純水進行加熱。 18 201230164 4. 如申請專利範圍第ι $ ^ ^ 固弟1至3項任-項所述之晶片下片排 片機，其進一步於下片機的機 埤朱上1又置—吸取裝置，該明 取裝置包括有一升降機構、_ 杈移機構與一吸盤部，該 盤部係位於該下片機之出料輪 久 叶掏达裝置的上方，該吸盤部可 受升降機構與橫移機構帶動進行升降與橫移。 5. 如申請專利範圍第4項所β +曰u 乐項所述之晶片下片排片機，复谁 一步於下片機的機架上設置-盤體輸送裝L其具有」滑 軌 '-升降台與一輸送帶；該輸送帶設置於機架上並 於機架的進料輸送裝置下方，該滑執係連接設置於該出料 輸达裝置的下方處與該輸送帶，該升降台與該滑軌為可滑 動的結合’該升降台可沿該滑軌升起位於出料輸送裝置之 表面，也可沿該升降滑軌下降位於該輸送帶表面。 如申請專利範圍第5項所述之晶片下片排片機，其令 该下片機之橫移裝置包括有一橫移推臂，該橫移推臂位於 各液體槽之-側面，各推桿係與該橫移推臂垂直連接並位 於液體槽之一側。 7.如申請專利範圍第6項所述之晶片下片排片機，其中 該洗淨機之橫移裝置包括有-橫移推臂，該橫移推臂位於 各夜體槽之-側面’各推桿係與該橫移推臂垂直連接並位 於液體槽之一側。 + 8.如申請專利範圍第7項所述之晶片下片排片機，其中 5亥機械手臂係一種六軸式之機械手臂。 、圖式：（如次頁） 19 1201230164 VII. Patent application scope · 排片筛> —- 1· A wafer lower film arranging machine including a lower film machine and a washing machine; 广: The machine frame is provided with a feeding wheel The sending device and the plurality of solvent conveying devices; the lifting device, the traverse device and the discharging device are arranged at one end of the frame; the solution: the solvent is provided in the tank, and the solvent tanks are sequentially arranged Arranging on the frame and adjacent to the feeding wheel transfer device by /, the pure water tank is provided with pure water, the one end of the frame; the groove fork is placed in the solvent tank, and the lifting device comprises There are a plurality of lifting arms above the respective troughs, and the lifting arms are lifted and lowered. "The knife is placed above the trough; in the trough or in the raised position, the traverse device will sigh with the machine &> μ γ 罝_ a plurality of push rods placed in each tank body, the two "shifting devices of each tank body have a pushing or retracting toward the end of the rack; the sigh (four) dry 'the push rod can be: the discharging conveying device system is set The sieving machine of the body includes a machine...", the robot The position is adjacent to the hand #and-visual inspection device; the position of the measuring device is relative to J. The mechanical two: material feeding device; the visual inspection of the washing machine frame & - slot, a plurality of pure water tanks, - Feed conveying device, at least one solvent-distributing device, and less-nitrogen drying device, a lifting device and a discharging conveying device. One end of the feeding, the feeding and the S] frame is adjacent to the machine 17 201230164 Arm; 溶剂 Each agent tank is provided with a solvent, the solvent tank is arranged on the frame and adjacent to the feed conveying device; and the pure water tank is provided with pure water, and the pure water tanks are sequentially arranged The rack is adjacent to the solvent tank at one end; the nitrogen gas drying device is disposed on the frame and adjacent to the other end of the pure water tank; the S lifting device includes a plurality of lifting arms, and each lifting arm is respectively Provided above the respective tanks, the lifting arm can be lowered in the tank body or raised above the tank body; 4 the shifting device is disposed on one side of each tank body, and the traverse device has a plurality of push rods. Each of the sides of the trough is provided with a push rod At one end of the rack rod toward the retracted or pushed; yield far out-feed conveyor is provided based on the I-rack further - ends, and a nitrogen adjacent to the drying apparatus. Λ 2 • The wafer lower sheet discharging machine according to claim 1, wherein each of the solvent tanks of the squatting machine is provided with an electric heater and an ultrasonic device, and the electric heater can heat the solvent; The pure water tank of the tablet machine is provided with an electric heater and an ultrasonic device which can heat the pure water. 3. The wafer lower sheet discharging machine according to claim 2, wherein each solvent tank of the washing machine is provided with an electric heater and an ultrasonic device, and the electric heater can twist the solvent. The pure water tank of the machine is provided with an electric heater and an ultrasonic device, which can heat the pure water. 18 201230164 4. If the wafer lowering machine described in the patent application range ι $ ^ ^ Gudi 1 to 3, is further placed on the machine of the lower machine, the suction device is The clearing device comprises a lifting mechanism, a squeezing mechanism and a suction cup portion, the disk portion is located above the discharge wheel of the lower machine, and the suction cup portion can be driven by the lifting mechanism and the traverse mechanism Lift and traverse. 5. If the wafer lower sheet discharging machine described in the β + 曰u music item in the fourth paragraph of the patent application is applied, which one step is set on the frame of the lowering machine - the disk body loading device L has a "slide track" - a lifting platform and a conveyor belt; the conveyor belt is disposed on the frame and below the feeding conveyor of the frame, the sliding system is disposed at a position below the discharging and conveying device and the conveyor belt, the lifting platform The slidable combination with the slide rail can be raised along the slide rail on the surface of the discharge conveyor, or can be lowered along the lift rail at the surface of the conveyor belt. The wafer lower sheet discharging machine according to claim 5, wherein the traversing device of the lowering machine comprises a traverse push arm, the traverse push arm is located at a side of each liquid tank, and each push rod system It is perpendicularly connected to the traverse push arm and located on one side of the liquid tank. 7. The wafer lower sheet discharging machine according to claim 6, wherein the traversing device of the washing machine comprises a traverse push arm, and the traverse push arm is located at each side of the night body groove The push rod is vertically connected to the traverse push arm and is located on one side of the liquid tank. + 8. The wafer lower sheet discharging machine according to claim 7, wherein the 5 liter mechanical arm is a six-axis type mechanical arm. , pattern: (such as the next page) 19 1