TW201227208A - Constant-current device, chip package and lamp thereof - Google Patents

Constant-current device, chip package and lamp thereof Download PDF

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Publication number
TW201227208A
TW201227208A TW99144177A TW99144177A TW201227208A TW 201227208 A TW201227208 A TW 201227208A TW 99144177 A TW99144177 A TW 99144177A TW 99144177 A TW99144177 A TW 99144177A TW 201227208 A TW201227208 A TW 201227208A
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Taiwan
Prior art keywords
constant current
circuit
current
constant
voltage
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TW99144177A
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Chinese (zh)
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Ying-Chia Chen
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Ying-Chia Chen
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Priority to TW99144177A priority Critical patent/TW201227208A/en
Priority to CN2011100605301A priority patent/CN102548116A/en
Publication of TW201227208A publication Critical patent/TW201227208A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Devices (AREA)

Abstract

A constant-current device includes a first constant-current circuit and a second constant-current circuit. The first constant-current circuit includes a first constant-current element and a zener diode configured anti-parallel with the first constant-current element. The second constant-current circuit includes a second constant-current element in the same direction as and connected to the downstream side of the first constant-current element. When an input voltage is greater than the breakdown voltage of the zener diode, the zener diode may dissipate a larger portion of power, and the current-limiting function of second constant-current circuit is brought into play, thereby allowing the aforementioned constant-current device to sustain a higher voltage. A chip package and a lamp including the above constant-current device are also disclosed.

Description

201227208 、發明說明: 【發明所屬之技術領域】 本發明是有關-種定電流裝置、晶片封裝件及其燈具,特別是一 種能夠承受較高電璧之定電流裝置、晶片封裝件及其燈具。 疋 【先前技術】 發光二極體(light-emitting diode,LED)具有體積小、使用壽命長以 及省電等優點,因此發光二極體已廣泛應用於多種照明以及裝飾等用 途。請參照圖1 ’ 一種習知之以直流電驅動之發光二極體架構是將交流 電源AC1、AC2經過一整流電路11將交流電轉換為直流電後施加於發 光一極體13。為了避免發光一極體13隨著交流電之電壓變化而間歇發 光的問題,可於整流電路11之輸出端跨接一穩壓電容c以及一放電電 阻R,以穩定整流電路11之輸出電壓。由於電流的大小會隨著電壓的 變化而改變,因此,可再設置一定電流電路12與發光二極體13串接, 以限制電流的最大值進而避免發光二極體13燒毀。 然而’在定電流的情況下,發光二極體丨3以及定電流電路12所 消耗的功率與跨接於元件兩端之電壓成正比。換言之,發光二極體13 所消耗之功率較少時,較大比例之消耗功率則落在定電流電路丨2上。 由於半導體元件以及封裝晶片有其最大之耐受電壓(maximum operation voltage)’因此’定電流電路12可能因電壓變化超過其耐受電壓而燒毀。 綜上所述,如何使定電流電路以及相關應用能夠承受較高之電歷 便是目前極需努力的目標。 【發明内容】 本發明提供一種定電流裝置、晶片封裝件及其燈具,其是串接多 個定電流電路,且設置一齊納二極體與最上游之定電流電路並聯連 接,以使跨接電壓超過齊納二極體之崩潰電壓時,電流可經由齊納二r 201227208 極體流向下游之定電流電路而限制電流之最大值。藉由齊納二極體分 • 擔較大比例之消耗功率’使得本發明之定電流裝置、晶片封裝件以及 . 其燈具能夠承受較高之電壓’進而提升產品的安全性以及可靠性。 本發明一實施例之定電流裝置包含一第一定電流電路以及—第二 定電流電路。第一定電流電路包含一第一定電流元件以及一齊納二極 體,其中,第一定電流元件用以限制通過一負載之一電流之最大值; 齊納二極體與第一定電流元件反向並聯。第二定電流電路包含一第二 定電流元件,其同向連接於第一定電流元件之下游側,用以限制通過 負載之電流之最大值。 ® 本發明另一實施例之晶片封裝件包含一承座、至少一定電流晶 粒、一發光二極體晶粒以及一封裝體。承座包含多個内導電接點以及 多個外導電接點。定電流晶粒设置於承座,並與内導電接點電性連接。 定電流晶粒包含一第一定電流電路以及一第二定電流電路。第—定電 流電路包含用以限制一電流之最大值之一第一定電流元件以及—齊納 二極體,其與第一定電流元件反向並聯。第二定電流電路包含—第二 定電流兀件,其同向連接於第一定電流元件之下游側,用以限制電流 之最大值。發光二極體晶粒與第一定電流電路以及第二定電流電路串 接。封裝體包覆定電流晶粒、發光二極體晶粒以及内導電接點。 本發明又一實施例之燈具包含一發光元件、一驅動裝置以及一燈 座。驅動裝置用以驅動發光元件,並包含一定電流裝置。定電流裝置 包含-第-定電流電路以及-第二定電流電路。第—定電流電路包含 —第一定電流元件以及一齊納二極體,其中,第一定電流元件與發光 元件串接’用膽制通過發光元件之_電流之最大值;#納二極體與 第-定電流元件反向並聯。第二定電流電路包含—第二定電流元件,' 其同向連接於第-定電流元件之下游側,用以限制通過發光元件之電 "IL之最大值。燈座與驅動裝置電性連接,用以與一電源電性連接。 以下藉由類實關配合所_圖式詳加·,#更容純解本 發明之目的、技術内容、特點及其所達成之功效。 「 201227208 【實施方式】 請參照圖2a ’本發明之一實施例之定電流裝置2包含一第一定電 流電路21以及一第二定電流電路22〇第一定電流電路21包含一第一 定電流元件211以及一齊納二極體(zener出〇如)212。第一定電流元件 211用以限制通過一負載30之一電流之最大值。舉例而言,負載3〇可 為多個_接之發光二極體《齊納二極體212則與第一定電流元件211 反向並聯。第二定電流電路22包含-第二定電流元件,其同向連接於 第-定電流元件211之下游側。第二定電流元件亦可限制通過負載3〇 之電流之最大值。 於貫施例中A納—極體212之崩潰電壓(breakdown voltage)小 於第疋電/;IL元件211之最大耐受電壓(maximum 〇perati〇n v〇itage)。依 據圖2a所示之架構,當跨接於節點V1以及節點V2之電壓略大於第一 定電流電路21之定電流元件21卜第二定電流電路22之定電流元件以 及負載30的啟動電壓總和時,電流是從節點V1流經第一定電流元件 21卜第二定電流電路22以及負載3〇之後流至節點V2。藉由第一定電 流元件211的限流作用’使得通過電流之最大值被限制在一設定值,因 此,通過整個迴路的電流可得到控制,負載3〇之發光二極體因而得到 保護。當跨接於節.點VI以及節點V2之電壓持續增加,此時超過啟動 電壓總和的電壓部分主要跨在第一定電流元件211上。 當跨接於第一定電流元件211之電壓大於齊納二極體212之崩潰電 壓時,電流主要路徑則是從節點V1流經齊納二極體212、第二定電流 電路22以及負載3〇之後流至卽點V2。此時,藉由第二定電流電路22 的限"IL作用,使知通過電流之最大值仍被限制在一設定值,因此,通 過整個迴路的電流仍可得到控制,負載3〇之發光二極體因而得到保 護。簡言之,在較高電壓時,齊納二極體212分擔了較大比例之消耗 功率,保護住第一定電流元件211不會超過其最大耐受電壓。此外,由 於齊納二極體212分擔了較大的跨壓,超出的電壓比例才會施加於第 6 [\ 1 201227208 定電流電路22,因此整體電路的對電壓變化的承受能力可大幅增 ::J而提升整體產品的安全性以及可靠性。於—實施例中於第二 =電路21之上游側串接-或多個同向第-定電流電路21可大幅 徒尚本發明之定電流裝置2之最大耐受電壓。 f參,圖2b,於-實施例中,賊3G串接於第-^電流電路21 =〜-定電流電路22之間亦可獲得相同效果。舉例而言,當跨接於 第二定電流電路21之電壓小於齊納二極體212之崩潰電壓時,第一定 2元件2U發揮限流作用’使得通過整個迴路的電流可得到控制。而 ^接於第-疋電流電路21之電壓大於齊納二極體212之崩潰電壓 日丹敏:於負載30下游側之第二^電流電路22發揮限流作用,使得通 過查個迴路的電流仍可得到控制。 ;實_中’本發明之定電流裝置2可包含-整流電路(如圖1 二,肋將交流電轉換為直流電,以提供單—方向之電流。舉例 =j流電路可為-橋式整流電路。較佳者,本發明之定電流裝置2 士匕3 -滅魏,其用域定整流f路讀出紐, 光發光的問題。舉例而言,·電 一放電電阻。 产ΐΤΓΓ笛於一實施例中,第一定電流元件211以及第二定電 二1二定電流元件可包含一金氧半場效電晶體 eGnduetwFidd•驗tTransistGr,M0S_M 以及- 其中控制電路CL控制金氧半場效電晶體Μ導通或斷 體M 謂^ M H極11 D並猶接於金氧半場效電晶 體Μ之源極以及沒極。依據此結構,當節點从之電壓大於節點w 時’控制電路CL控制金氧半場效電晶體Μ導通,而寄生二極 3 =處概向纏,其可視鱗路,因此電流触金氧半場效電晶體 最大值即可受到限制。 t曰曰體Μ之兀件特性’通過電流之 當節點VB之賴大於節點从之電屋時,寄生二極體d處於順向⑸ 7 201227208 偏壓,電流可大量通過,因此電流可經由寄生二極體D流向節點VA。 此特性可應用於以交流電驅動之發光二極體模組。舉例而言,請參照 圖3a,多個反向並聯之發光二極體30a、30b所組成之負載,其兩側分 別串接一反向之定電流裝置2a以及2b。當交流電之第一連接端AC1 處於正極性時,電流從交流電之第一連接端AC1流經定電流裝置2a 之第一定電流元件211以及第二定電流電路22之第二定電流元件、發 光二極體30a、定電流裝置2b之第二定電流元件之寄生二極體以及第 —定電流元件211之寄生二極體或齊納二極體2Π至交流電之第二連接 端AC2,以驅動同向之發光二極體30a發光。此時,定電流裝置2a之 第一定電流元件211以及第二定電流電路22之第二定電流元件發揮限 流作用。 相反的,當交流電之第一連接端AC1處於負極性時,電流從交流 電之第二連接端AC2流經定電流裝置2b之第一定電流元件211以及第 二定電流電路22之第二定電流元件、發光二極體30b、定電流裝置2a 之第二定電流元件之寄生二極體以及第一定電流元件211之寄生二極 體或齊納二極體212至交流電之第一連接端AC1,以驅動同向之發光 二極體30b發光。此時’定電流裝置2b之第一定電流元件211以及第 二定電流電路22之第二定電流元件發揮限流作用。依據圖3&所示之架 構,發光二極體30a、30b可直接以交流電源加以驅動。 請參照圖4 ’本發明一實施例之晶片封裝件4包含一承座41、至 少一定電流晶粒42、一發光二極體晶粒43以及一封裝體44。承座41 具有多個内導電接點411以及多個外導電接點412。舉例而言,承座41 可為一導線架、封裝基板或陶瓷基座等。定電流晶粒42設置於承座41, 並與承座41之内導電接點411電性連接,使定電流晶粒42可經由相對 應之外導電接點412與外部電性連接。定電流晶粒42可包含前述之定 電流裝置’以限制通過負載之電流的最大值。需注意者,定電流裝置 中之元件,例如第一定電流電路、第二定電流電路以及齊納二極體, 可製作於單一晶粒或多個晶粒。發光二極體晶粒43與第—定電流電路 201227208 21以及第二定電流電路22串接。封裝體44則包覆定電流晶粒42、發 光一極體晶粒43以及承座41之内導電接點411。201227208, invention: [Technical Field] The present invention relates to a constant current device, a chip package and a lamp thereof, and more particularly to a constant current device, a chip package and a lamp thereof capable of withstanding higher power.疋 【Prior Art】 Light-emitting diodes (LEDs) have the advantages of small size, long life and power saving. Therefore, LEDs have been widely used in a variety of lighting and decoration applications. Referring to FIG. 1 ', a conventional DC-driven LED structure is applied to the light-emitting diode 13 after the AC power source AC1, AC2 is converted into DC power by a rectifier circuit 11. In order to avoid the problem that the light-emitting body 13 intermittently emits light according to the voltage change of the alternating current, a voltage stabilizing capacitor c and a discharge resistor R may be connected across the output end of the rectifier circuit 11 to stabilize the output voltage of the rectifier circuit 11. Since the magnitude of the current changes with the change of the voltage, the constant current circuit 12 can be further connected in series with the light-emitting diode 13 to limit the maximum value of the current and thereby prevent the light-emitting diode 13 from being burnt. However, in the case of a constant current, the power consumed by the LEDs 3 and the constant current circuit 12 is proportional to the voltage across the terminals. In other words, when the power consumed by the light-emitting diode 13 is small, a large proportion of the power consumption falls on the constant current circuit 丨2. Since the semiconductor element and the packaged wafer have their maximum operation voltage, the constant current circuit 12 may be burnt due to a voltage change exceeding its withstand voltage. In summary, how to make the current circuit and related applications can withstand higher electrical calendars is the goal that is currently in great demand. SUMMARY OF THE INVENTION The present invention provides a constant current device, a chip package, and a lamp thereof, which are connected in series with a plurality of constant current circuits, and a Zener diode is connected in parallel with the most upstream constant current circuit to make a jumper When the voltage exceeds the breakdown voltage of the Zener diode, the current can be limited to the maximum value of the current through the Zener II 201227208 polar body to the downstream constant current circuit. By consuming a large proportion of the power consumption of the Zener diodes, the constant current device, the chip package and the lamp of the present invention can withstand higher voltages, thereby improving the safety and reliability of the product. A constant current device according to an embodiment of the invention comprises a first constant current circuit and a second constant current circuit. The first constant current circuit includes a first constant current component and a Zener diode, wherein the first constant current component is configured to limit a maximum value of a current passing through a load; the Zener diode and the first constant current component Reverse parallel. The second constant current circuit includes a second constant current element connected in the same direction to the downstream side of the first constant current element for limiting the maximum value of the current passing through the load. The chip package of another embodiment of the present invention comprises a socket, at least a certain current crystal grain, a light emitting diode die, and a package. The socket includes a plurality of inner conductive contacts and a plurality of outer conductive contacts. The constant current die is disposed on the socket and electrically connected to the inner conductive contact. The constant current die includes a first constant current circuit and a second constant current circuit. The first constant current circuit includes a first constant current element for limiting a maximum value of a current and a Zener diode connected in anti-parallel with the first constant current element. The second constant current circuit includes a second constant current element connected in the same direction to the downstream side of the first constant current element for limiting the maximum value of the current. The light emitting diode die is connected in series with the first constant current circuit and the second constant current circuit. The package is coated with a constant current die, a light emitting diode die, and an inner conductive contact. A lamp according to still another embodiment of the present invention includes a light emitting element, a driving device, and a lamp holder. The driving device is used to drive the light emitting element and includes a certain current device. The constant current device includes a -first constant current circuit and a second constant current circuit. The first constant current circuit includes a first constant current element and a Zener diode, wherein the first constant current element and the light emitting element are connected in series to a maximum value of a current passing through the light emitting element; In parallel with the first constant current element. The second constant current circuit includes a second constant current element, which is coupled in the same direction to the downstream side of the first constant current element for limiting the maximum value of the electric current through the light emitting element. The lamp holder is electrically connected to the driving device for electrically connecting to a power source. The following is the purpose, technical content, characteristics and effects achieved by the invention. Referring to FIG. 2a, a constant current device 2 according to an embodiment of the present invention includes a first constant current circuit 21 and a second constant current circuit 22. The first constant current circuit 21 includes a first predetermined The current component 211 and a Zener diode (such as zener) 212. The first constant current component 211 is used to limit the maximum current through a load 30. For example, the load 3 〇 can be multiple _ The light-emitting diode "Zener diode 212 is connected in anti-parallel with the first constant current element 211. The second constant current circuit 22 includes a second constant current element connected in the same direction to the first constant current element 211. On the downstream side, the second constant current element can also limit the maximum value of the current through the load 3. In the embodiment, the breakdown voltage of the A nano-pole 212 is less than the third power / the maximum of the IL element 211 Withstand voltage (maximum 〇perati〇nv〇itage). According to the structure shown in Fig. 2a, when the voltage across the node V1 and the node V2 is slightly larger than the constant current element 21 of the first constant current circuit 21, the second constant current The constant current component of circuit 22 and the start of load 30 When the dynamic voltage is summed, the current flows from the node V1 through the first constant current element 21, the second constant current circuit 22, and the load 3〇 to the node V2. The current limiting action of the first constant current element 211 is passed through. The maximum value of the current is limited to a set value, so that the current through the entire loop can be controlled, and the LED of the load of 3 因而 is thus protected. When the voltage across the node VI and the node V2 continues to increase, At this time, the voltage portion exceeding the sum of the starting voltages mainly straddles the first constant current element 211. When the voltage across the first constant current element 211 is greater than the breakdown voltage of the Zener diode 212, the main current path is The node V1 flows through the Zener diode 212, the second constant current circuit 22, and the load 3〇, and then flows to the defect V2. At this time, the current is passed through the limit of the second constant current circuit 22 The maximum value is still limited to a set value, so that the current through the entire loop can still be controlled, and the light-emitting diode of the load is protected. In short, at a higher voltage, the Zener diode 212 share A large proportion of the power consumption protects the first constant current element 211 from exceeding its maximum withstand voltage. In addition, since the Zener diode 212 shares a large cross-over voltage, the excess voltage ratio is applied to the first 6 [\ 1 201227208 constant current circuit 22, so the overall circuit's ability to withstand voltage changes can be greatly increased::J to improve the safety and reliability of the overall product. In the embodiment, upstream of the second = circuit 21 The side series- or the plurality of the same direction constant current circuit 21 can greatly increase the maximum withstand voltage of the constant current device 2 of the present invention. f, FIG. 2b, in the embodiment, the thief 3G is connected in series -^ Current circuit 21 = ~ - The same effect can be obtained between the constant current circuits 22. For example, when the voltage across the second constant current circuit 21 is less than the breakdown voltage of the Zener diode 212, the first fixed 2 element 2U acts as a current limiting action so that the current through the entire loop can be controlled. And the voltage connected to the first-thick current circuit 21 is greater than the breakdown voltage of the Zener diode 212. The third current circuit 22 on the downstream side of the load 30 acts as a current limiting function, so that the current through the loop is checked. Still get control. The steady current device 2 of the present invention may comprise a rectifying circuit (as shown in FIG. 1 , the rib converts the alternating current into direct current to provide a single-direction current. For example, the j-flow circuit may be a bridge rectifier circuit Preferably, the constant current device of the present invention is a gyroscope 3 - extinguished Wei, which uses a domain to determine the f-channel readout, and the problem of light illumination. For example, an electric discharge resistor. In an embodiment, the first constant current element 211 and the second constant current two-two constant current element may include a gold-oxygen half field effect transistor eGnduetwFidd • tTransistGr, M0S_M and - wherein the control circuit CL controls the gold-oxygen half-field effect transistor Turning on or off body M means ^ MH pole 11 D and is still connected to the source of the gold-oxygen half-field effect transistor and the immersion. According to this structure, when the voltage from the node is greater than the node w, the control circuit CL controls the gold-oxygen half field. The effect transistor is turned on, and the parasitic diode 3 = is wrapped around, which can be seen as a scale path, so the maximum value of the current contact gold oxide half field effect transistor can be limited. When the node VB depends on the node When the parasitic diode d is in the forward direction (5) 7 201227208 bias, the current can pass in a large amount, so the current can flow to the node VA via the parasitic diode D. This characteristic can be applied to the LED module driven by alternating current. For example, referring to FIG. 3a, a load composed of a plurality of anti-parallel LEDs 30a, 30b is connected in series with a reverse constant current device 2a and 2b on both sides. When the first connection of the alternating current When the terminal AC1 is in the positive polarity, the current flows from the first connection terminal AC1 of the alternating current to the first constant current element 211 of the constant current device 2a and the second constant current element of the second constant current circuit 22, the light emitting diode 30a, The parasitic diode of the second constant current component of the current device 2b and the parasitic diode or the Zener diode 2 of the first constant current component 211 are connected to the second connection terminal AC2 of the alternating current to drive the same direction of the light emitting diode The body 30a emits light. At this time, the first constant current element 211 of the constant current device 2a and the second constant current element of the second constant current circuit 22 exert a current limiting function. Conversely, when the first connection terminal AC1 of the alternating current is in a negative polarity Time, electricity Flowing from the second connection terminal AC2 of the alternating current to the first constant current element 211 of the constant current device 2b and the second constant current element of the second constant current circuit 22, the light emitting diode 30b, and the second constant current of the constant current device 2a The parasitic diode of the element and the parasitic diode or Zener diode 212 of the first constant current element 211 to the first connection terminal AC1 of the alternating current drive to drive the light-emitting diodes 30b in the same direction to emit light. The first constant current element 211 of the current device 2b and the second constant current element of the second constant current circuit 22 perform a current limiting function. According to the structure shown in FIG. 3 & the light emitting diodes 30a, 30b can be directly connected by an alternating current power source. drive. Referring to FIG. 4, a chip package 4 according to an embodiment of the present invention includes a socket 41, at least a certain current die 42, a light-emitting diode die 43, and a package 44. The socket 41 has a plurality of inner conductive contacts 411 and a plurality of outer conductive contacts 412. For example, the socket 41 can be a lead frame, a package substrate or a ceramic base or the like. The constant current die 42 is disposed on the socket 41 and electrically connected to the conductive contact 411 of the socket 41, so that the constant current die 42 can be electrically connected to the outside via the corresponding external conductive contact 412. The constant current die 42 can include the aforementioned constant current device ' to limit the maximum current through the load. It should be noted that components in the constant current device, such as the first constant current circuit, the second constant current circuit, and the Zener diode, can be fabricated in a single die or a plurality of die. The light-emitting diode die 43 is connected in series with the first constant current circuit 201227208 21 and the second constant current circuit 22. The package body 44 covers the constant current crystal grains 42, the light-emitting one-pole crystal grains 43, and the inner conductive contacts 411 of the socket 41.

於一實施例中’發光二極體晶粒43包含多個發光二極體30a〜30d, 其呈橋式連接,如圖3b所示,而可直接以交流電源驅動。舉例而言, 當交流電之第一連接端AC1處於正極性時,電流依序通過發光二極體 30a、第一定電流電路21、第二定電流電路22以及發光二極體3〇d至 交流電之第二連接端AC2,以驅動發光二極體30a、30cj發光,並由第 一定電流電路21或第二定電流電路22限制最大電流,以保護發光二 極體30a、30d。當交流電之第一連接端aci處於負極性時,電流依序 通過發光二極體30b、第一定電流電路21、第二定電流電路22以及發 光二極體30c,以驅動發光二極體3〇b、3〇c發光,此時,第一定電流 電路21或第二定電流電路22仍能發揮限流作用以保護發光二極體 30b、30c。較佳者,請參照圖3c ’於定電流裝置2之上游端以及下游 端至少其中-可再串接發光二極體3〇e,以提昇整體之發光效率。經由 適當的電路設計,發光二極體晶粒43可串接於第—定電流電路以及第 二定電流電路之間或第二定電流電路之下游側。詳細說明已如前所 述,在此不再贅述。需注意者’單—發光二極體晶粒中可包含一發光 二極體或多個串接或橋式連接之發光二極體。 X 請參照圖5,本發明之一實施例之燈具5〇包含一發光元件μ、一 驅動裝置52以及—麵53。發光元件51可為至少—發光二極體 個反向並聯或橋錢接之發光二減。驅崎置&用轉紐光元 Μ,並包含-定電流裝置。定電流裝置之翻說明已如前述所述 此不再贅述。 53與驅動裝置52 連接,肋與__ 接。需注意者,贿53之狀可紐具之_而加雙化。舉例H 燈座53可為-插!員、螺旋式接頭或針腳式接頭等。 口’ 於-實施例中,本發明之燈具50能夠以圖3a至圖乂所 例加以實現,而使燈具%中之發光二極體以交流電源直接驅動也 清參照圖6 ’购裝置52更包含魏棘u、親餘c以及 201227208 阻R等,將交流電源轉換為直流電源後驅動多個串接之發光二極體13。 综合上述,本發明之定電流裝置、晶片封裝件及其燈具中串接兩 個以上之定電流電路,且設置至少一齊納二極體與上游之定電流電路 並聯連接,以使電壓超過齊納二極體之崩潰電壓時,電流可經由齊納 二極體流向下游之定電流電路,以限制電流之最大值。藉由齊納二極 體分擔較大比例之消耗功率,使得本發明之定電流裝置、晶片封裝件 以及其燈具能夠承受較高之電壓,進而提升產品的安全性以及可靠性。 以上所述之實施例僅是為說明本發明之技術思想及特點,其目的In one embodiment, the light-emitting diode die 43 includes a plurality of light-emitting diodes 30a to 30d which are connected in a bridge, as shown in FIG. 3b, and can be directly driven by an alternating current power source. For example, when the first connection terminal AC1 of the alternating current is in a positive polarity, the current sequentially passes through the light emitting diode 30a, the first constant current circuit 21, the second constant current circuit 22, and the light emitting diode 3〇d to the alternating current. The second connection terminal AC2 drives the light-emitting diodes 30a, 30cj to emit light, and the maximum current is limited by the first constant current circuit 21 or the second constant current circuit 22 to protect the light-emitting diodes 30a, 30d. When the first connection end aci of the alternating current is in a negative polarity, the current sequentially passes through the light emitting diode 30b, the first constant current circuit 21, the second constant current circuit 22, and the light emitting diode 30c to drive the light emitting diode 3 〇b, 3〇c emit light. At this time, the first constant current circuit 21 or the second constant current circuit 22 can still exert a current limiting function to protect the light emitting diodes 30b and 30c. Preferably, referring to FIG. 3c', at least the upstream end and the downstream end of the constant current device 2 can be connected in series with the LEDs 3〇e to improve the overall luminous efficiency. The LED body 43 can be connected in series between the first constant current circuit and the second constant current circuit or downstream of the second constant current circuit via a suitable circuit design. The detailed description has been described above and will not be described here. It should be noted that the single-light-emitting diode die may include a light-emitting diode or a plurality of LEDs connected in series or in a bridge. X Referring to Figure 5, a luminaire 5A according to an embodiment of the present invention includes a light-emitting element μ, a driving device 52, and a face 53. The light-emitting element 51 can be at least one of the two parallel-light-emitting diodes of the anti-parallel or the bridge. Susaki & uses the converter element Μ and contains a constant current device. The description of the constant current device has been omitted as described above. 53 is connected to the driving device 52, and the rib is connected to the __. Need to pay attention to, the bribe 53 can be added to the _ and plus double. For example, the H lamp holder 53 can be a plug-in, a screw connector or a pin connector. In the embodiment, the lamp 50 of the present invention can be realized by the example of FIG. 3a to FIG. 3, and the light-emitting diode of the lamp% is directly driven by the AC power source. Including Wei Xuan u, pro-c and 201227208 R, etc., the AC power is converted into a DC power source to drive a plurality of LEDs 13 connected in series. In summary, the constant current device, the chip package and the lamp thereof of the present invention are connected in series with two or more constant current circuits, and at least one Zener diode is connected in parallel with the upstream constant current circuit to make the voltage exceed Zener. When the diode collapses, current can flow to the downstream constant current circuit via the Zener diode to limit the maximum current. By sharing a large proportion of power consumption by the Zener diode, the constant current device, the chip package and the lamp of the present invention can withstand higher voltages, thereby improving product safety and reliability. The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof

在使熟習 以之限定 等變化或1 201227208 【圖式簡單說明】 圖1為—示意圖’顯示習知之以直流電驅動之發光二極體架構。 圖2a為—示意圖,顯示本發明一實施例之定電流裝置。 圖2b為—示意圖’顯示本發明另一實施例之定電流裝置。 圖2c為一示意圖,顯示本發明一實施例之定電流元件。 圖3a至圖3C為一示意圖,顯示本發明一實施例之定電流裝置以交 流電源驅動發光二極體之應用例。 圖4為一剖面圖’顯示本發明一實施例之晶片封裝件。 圖5為一示意圖,顯示本發明一實施例之燈具。 圖6為一示意圖,顯示本發明一實施例之燈具之電路。 【主要元件符號說明】 11 整流電路 12 定電流電路 13 發光二極體 2、2a、2b 定電流裝置 21 第一定電流電路 211 第一定電流元件 212 齊納二極體 22 第二定電流電路 30 負載 30a~30e 發光二極體 4 晶片封裝件 41 承座 11 201227208In order to limit the familiarity or the like, or 1 201227208 [Simplified description of the drawings] Fig. 1 is a schematic view showing a conventional LED-driven LED structure. Figure 2a is a schematic view showing a constant current device in accordance with an embodiment of the present invention. Fig. 2b is a schematic view showing a constant current device according to another embodiment of the present invention. Figure 2c is a schematic diagram showing a constant current element in accordance with an embodiment of the present invention. 3a to 3C are schematic views showing an application example of a constant current device for driving a light-emitting diode with an alternating current power supply according to an embodiment of the present invention. Figure 4 is a cross-sectional view showing a chip package in accordance with an embodiment of the present invention. Fig. 5 is a schematic view showing a lamp according to an embodiment of the present invention. Figure 6 is a schematic view showing the circuit of a luminaire according to an embodiment of the present invention. [Main component symbol description] 11 Rectifier circuit 12 Constant current circuit 13 Light-emitting diode 2, 2a, 2b Constant current device 21 Positive current circuit 211 Positive current element 212 Zener diode 22 Second constant current circuit 30 Load 30a~30e Light Emitting Diode 4 Chip Package 41 Seat 11 201227208

411 内導電接點 412 外導電接點 42 定電流晶粒 43 發光二極體晶粒 44 封裝體 50 燈具 51 發光元件 52 驅動裝置 53 燈座 AC1 ' AC2 交流電源 C 穩壓電容 CL 控制電路 D 寄生二極體 M 金氧半場效電晶體 R 放電電阻 VI ' V2 節點 VA ' VB 節點 12411 Inner Conductive Contact 412 External Conductive Contact 42 Constant Current Die 43 Light Emitting Diode Grain 44 Package 50 Lamp 51 Light Emitting Element 52 Drive Unit 53 Lamp Holder AC1 'AC2 AC Power Supply C Regulator Capacitor CL Control Circuit D Parasitic Diode M Gold Oxygen Half Field Effect Crystal R Discharge Resistor VI ' V2 Node VA ' VB Node 12

Claims (1)

201227208 七、申請專利範圍: 1. 一種定電流裝置,包含: 一第一定電流電路,包含: 一第一定電流元件,其用以限制通過一負載之一電流之最大 值;以及 一齊納二極體(zenerdiode),其與該第一定電流元件反向並聯; 以及 一第二定電流電路,其包含一第二定電流元件,其同向連接於該第 一定電流元件之下游側,用以限制通過該負載之該電流之最大值。201227208 VII. Patent application scope: 1. A constant current device comprising: a first constant current circuit comprising: a first constant current element for limiting a maximum current through a load; and a Zener a Zener diode, which is connected in anti-parallel with the first constant current element; and a second constant current circuit including a second constant current element connected in the same direction to the downstream side of the first constant current element, Used to limit the maximum value of the current through the load. 2. 如請求項1所述之定電流裝置’其中該齊納二極體之崩潰電壓小於該 第' —疋電流元件之最大财受電壓。 3_如請求項1所述之定電流裝置,其中該第一定電流元件包含—金氧半 場效電晶體以及-㈣電路,其巾該㈣控繼金氧半場效電晶體 導通或斷開。 二定電流元件包含一金氧半 路控制該金氧半場效電晶體 4.如請求項丨所述之定電流裝置,其中該第 場效電晶體以及一控制電路,其中該控制電 導通或斷開。 5.如請求項1所述之定電流裝置,更包含: 一整流電路,其用以提供該電流。 6.如請求項5所述之定電流裝置,更包含: 7. 路 一穩壓電路,其用以穩定該整流電路之_輪出電壓。 如請求項1所述之定電流裝置,包含多個同向串接之該第 一定電流電 定電流電路 8·如請求項1所述之定電流裝置,其中該負载串接於該第— 以及该第二定電流電路之間或該第二定電流電路之下游側。 9. 一種晶片封裝件,包含: -承座,其包含多_導電接點以及多個料電接點; 13 201227208 至少-定電流晶粒,其設置於該承座,並與該内導電接點電性連接, 該定電流晶粒包含; 一一第一定電流電路,其包含用以限制-電流之最大值之-第-定電流70件以及-齊納二極體,其與該第—定電流元件反向並聯;以及 一第二定電流電路,其包含—第二定電流締,其同向連接於 該第-定電流元件之下_ ’用以限_電流之最大值; -發光二極體晶粒,其無第—定f流電路以及該第二定電流電路 串接;以及 -封裝體’其包龍定電流締、該發光二極體晶細及該内導電2. The constant current device of claim 1 wherein the Zener diode has a breakdown voltage that is less than a maximum voltage of the first current component. 3) The constant current device of claim 1, wherein the first constant current element comprises a gold-oxygen half field effect transistor and a - (four) circuit, wherein the (four) control galvanic half-effect transistor is turned on or off. The second constant current element comprises a gold-oxygen half-channel control device. The constant current device according to claim ,, wherein the first field effect transistor and a control circuit, wherein the control device is electrically connected or disconnected . 5. The constant current device of claim 1, further comprising: a rectifier circuit for providing the current. 6. The constant current device of claim 5, further comprising: 7. a voltage stabilizing circuit for stabilizing the voltage of the rectifier circuit. The constant current device of claim 1, comprising a plurality of first constant current constant current circuits connected in the same direction. The constant current device according to claim 1, wherein the load is serially connected to the first And a downstream side of the second constant current circuit or the second constant current circuit. 9. A chip package comprising: - a socket comprising a plurality of conductive contacts and a plurality of electrical contacts; 13 201227208 at least a constant current die disposed on the socket and electrically connected to the inner conductor a point-to-point connection, the constant current die includes: a first constant current circuit including a -first constant current 70 for limiting the maximum value of the current and a Zener diode, and the first a constant current element in anti-parallel; and a second constant current circuit comprising - a second constant current, which is connected in the same direction below the first constant current element - for limiting the maximum value of the current; a light-emitting diode die having no first-ordered f-current circuit and the second constant current circuit connected in series; and a package body having a package current, a light-emitting diode crystal, and the inner conductive ιυ.如請衣項 、-丨4〜曰曰乃坷牧件,其中該齊納二極體之崩潰電壓小; S玄第一定電流元件之最大而才受電壓。 11.如請求項9所述之晶片封褒件,其 半場效電晶體以及一控制電路,1巾^ ^ /;'L 匕3 一 體導通或賴。 3雜機雛繼錢半場效電, 12·如請求項9所述之晶片封裂件υ υ 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 , , , , , , , , , , , , , , , , , , , 11. The wafer package of claim 9, wherein the half field effect transistor and a control circuit are turned on or off. 3 Miscellaneous machine chicks follow the money half-field power, 12 · The wafer cracking parts as claimed in claim 9 半場效電晶體以及-㈣纽甘+ m電件包3一金j 體導通或_。 1 J雜㈣雜繼錄半場效電, 接之該第-定電流ΐ路Γ片封料,其_該定電流晶粒包含多個同向; Κ 一種燈具,包含: 一發光元件; 一驅動裝置,其用以驅動兮路也_ 置,其包含: 件,該驅動裝置包含-定電㈤ 一第一定電流電路,其包含一 體,其中,該第4電流轉與=光第4電流元件以及—齊納二才 元件之-電流之最大值;該齊^極二件串接,用以限制通過言输 納一極體與該第-定電流元件反向並聯 201227208 以及 一第二定電流電路,其包含一第二定電流元件,其同向連接於 該第一定電流元件之下游側,用以限制通過該發光元件之該電流之最大 值;以及 一燈座,其與該驅動裝置電性連接,用以與一電源電性連接。 15.如請求項14所述之燈具,其中該齊納二極體之崩潰電壓小於該第一 定電流元件之最大耐受電壓。 /Half-field effect transistor and - (four) Newan + m electric parts package 3 a gold j body conduction or _. 1 J (four) heterogeneous recording half-field power, followed by the first-fixed current Γ Γ 封 封 , , , , 该 该 该 该 该 该 定 定 定 定 Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ The device is configured to drive a circuit, and includes: a device, the driving device includes a constant current (5), a first constant current circuit, and an integral body, wherein the fourth current is rotated and the fourth current element is replaced And - the maximum value of the current of the Zener component; the two poles are connected in series to limit the reverse parallel connection of the first-pole body to the first constant current element 201227208 and a second constant current a circuit comprising a second constant current element coupled to the downstream side of the first constant current element for limiting a maximum value of the current passing through the light emitting element; and a lamp holder and the driving device Electrical connection for electrically connecting to a power source. 15. The luminaire of claim 14, wherein the Zener diode has a breakdown voltage that is less than a maximum withstand voltage of the first constant current element. / 16_如請求項14所述之燈具,其中該第一定電流元件包含一金氧半場效 電晶體以及一控制電路’其中該控制電路控制該金氧半場效電晶體^通 或斷開。 17·如請求項14所述之燈具,其中該第二定電流元件包含—金氧半揚效 電晶體以及一控制電路,其中該控制電路控制該金氧半場效電a體導通 或斷開。 BS 18.如請求項14所述之燈具,其中該驅動裝置更包含: 一整流電路,其用以提供該電流。 19. 如請求項18所述之燈具,其中該驅動裝置更包含: 一穩壓電路,其用以穩定該整流電路之一輸出電壓。 20. 如請求項14所述之燈具,其中該定電流裝置包含多個同向串接之該 第一定電流電路。 21. 如請求項14所述之燈具,其中該發光元件包含至少一發光二極體或 多個反向並聯或橋式連接之發光二極體。The luminaire of claim 14, wherein the first constant current element comprises a MOS field effect transistor and a control circuit wherein the control circuit controls the MOSFET to be turned on or off. The luminaire of claim 14, wherein the second constant current element comprises a MOSFET and a control circuit, wherein the control circuit controls the MOSFET to be turned on or off. The luminaire of claim 14, wherein the driving device further comprises: a rectifying circuit for supplying the current. 19. The luminaire of claim 18, wherein the driving device further comprises: a voltage stabilizing circuit for stabilizing an output voltage of the one of the rectifying circuits. 20. The luminaire of claim 14, wherein the constant current device comprises a plurality of the first constant current circuits connected in series. 21. The luminaire of claim 14, wherein the illuminating element comprises at least one light emitting diode or a plurality of anti-parallel or bridge connected light emitting diodes.
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TWI663893B (en) * 2015-03-02 2019-06-21 晶元光電股份有限公司 Led driver and illumination system related to the same
TWI678944B (en) * 2015-10-23 2019-12-01 晶元光電股份有限公司 Led driver and illumination system related to the same
TWI678946B (en) * 2015-03-26 2019-12-01 晶元光電股份有限公司 Led driver and illumination system related to the same
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CN201479422U (en) * 2009-08-07 2010-05-19 数能科技股份有限公司 Light emitting diode constant current driving element structure
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CN201657388U (en) * 2010-01-08 2010-11-24 陈盈佳 Constant-current chip packaging body and luminous diode lamp driven by alternating current

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Publication number Priority date Publication date Assignee Title
TWI663893B (en) * 2015-03-02 2019-06-21 晶元光電股份有限公司 Led driver and illumination system related to the same
USRE48798E1 (en) 2015-03-02 2021-10-26 Epistar Corporation LED driver and illumination system related to the same
TWI678946B (en) * 2015-03-26 2019-12-01 晶元光電股份有限公司 Led driver and illumination system related to the same
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