201221892 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤其係用於電子元器件散熱 之散熱裝置。 【先前技術】 [0002] 隨著電子技術迅速發展，電子元器件之高頻、高速以及 集體電路之密集及微型化，使得單位容積電子元器件發 熱量劇增。因此，需要於電子元器件上貼附一散熱裝置 ，將電子元器件工作時所產生之熱量傳導至空氣中，以 ^ 確保電子元器件能穩定運轉。 [0003] 習知之散熱裝置通常包括平行間隔排列之斷面呈直線性 之散熱鰭片，以藉由散熱鰭片將電子元器件所產生之熱 量散發到環境空氣中。 [0004] 惟，習知之散熱鰭片之斷面均呈直線性，故其可提供散 熱之表面積非常有限，以致於習知之散熱鰭片無法適用 於發熱量劇增之電子元器件。 ❹ 【發明内容】 [0005] 有鑒於此，有必要提供一種具有較好散熱效果之散熱裝 置。 [0006] 一種散熱裝置，其包括導熱底座及複數散熱鰭片。該導 熱底座具有第一表面。每一散熱鰭片包括一本體。每一 本體均垂直設置於該第一表面。每一散熱鰭片還包括一 與該本體相連之延伸部，該延伸部由該本體之遠離該導 熱底座之端部沿著垂直於該本體之方向延伸形成。 099140704 表單編號A0101 第3頁/共11頁 0992070845-0 201221892 _7]肖I知技術相比，每一散熱縛片均具有一延伸部，使得 有”玄複數政熱縛片之散熱裝置於體積未增加之同時， 每一散熱縮片之散熱面積增大，從而提高了每一散熱鰭 片之利用率及散熱效能，進而提高了該散熱裝置之散熱 效率。 【實施方式】 [0008] 4參閱圖卜本發明第—實施例所提供之散熱裝置⑽包 括一導熱底座10及複數散熱鰭片2〇。 [0009] 導熱底座10具有相對之第一表面101及第二表面1〇3。第 一表面101與複數散熱鰭片2〇相連。第二表面1〇3貼合於 發熱電子兀*器件（圖未示）上。本實施例中，導熱底座1〇 由銅製成。當然，導熱底座10亦可由銅合金、鋁或鋁合 金等材料製成。 [0010] 複數散熱鰭片20係一組平行間隔設置之由銅製成之平板 。每一散熱鰭片20包括一本體201及-與本體2 0 1相連之 延伸部203。當然，每一散熱鰭片2〇亦可由銅合金、鋁或 鋁合金等材料製成。 [0011] 每一本體201均位於第一表面101及與其直接相連之延伸 部203之間，且垂直於第一表面1〇ι。本實施例中，本體 201為方形板’且與第一表面1〇1 一體成型。 [0012] 延伸部203由本體201遠離第一表面1〇1之端部沿著垂直 於本體201之方向延伸形成。本實施例中，延伸部2〇3為 垂直於第一表面1〇1之方形平板，且與本體2〇i_體成型 〇 099140704 表單編號A0101 第4頁/共11頁 0992070845-0 201221892 [_使用時，上述散熱裝置100之導熱底座10之第二表面103 貼合於電子元器件上，吸收電子元器件產生之熱量，從 而將熱量傳遞給散熱鰭片20，以藉由複數散熱鰭片20將 熱量散發至外界環境中。 [_肖習知技術相比，每-散熱雜片20均具有一延伸部2〇3， 使得散熱裝置1〇〇於體積未增加之同時，每一散熱鰭片2〇 之散熱面積增大，從而提高了每一散熱鰭片20之利用率 及散熱效能，進而提高了散熱裝置100之散熱效率。 Ο201221892 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of electronic components. [Prior Art] [0002] With the rapid development of electronic technology, the high frequency, high speed of electronic components, and the intensive and miniaturization of collective circuits have led to a sharp increase in the heat generation per unit volume of electronic components. Therefore, it is necessary to attach a heat dissipating device to the electronic component to conduct the heat generated by the operation of the electronic component to the air to ensure that the electronic component can operate stably. [0003] Conventional heat sinks typically include heat-dissipating fins that are linearly spaced in parallel to dissipate the heat generated by the electronic components into the ambient air by the heat sink fins. [0004] However, the conventional heat sink fins are linear in cross section, so that the surface area for providing heat dissipation is very limited, so that the conventional heat sink fins cannot be applied to electronic components with a sudden increase in heat generation. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a heat dissipating device having a better heat dissipation effect. [0006] A heat sink device includes a heat conductive base and a plurality of heat sink fins. The heat transfer base has a first surface. Each heat sink fin includes a body. Each body is vertically disposed on the first surface. Each of the heat dissipation fins further includes an extension connected to the body, the extension being formed by an end of the body remote from the heat conduction base extending in a direction perpendicular to the body. 099140704 Form No. A0101 Page 3 / Total 11 Page 0992070845-0 201221892 _7] Compared with the technology of Xiao I, each heat-dissipating piece has an extension, which makes the heat dissipation device of the Xuan complex number thermal block not in the volume. At the same time, the heat dissipation area of each heat sinking fin is increased, thereby improving the utilization efficiency and heat dissipation performance of each heat sink fin, thereby improving the heat dissipation efficiency of the heat sink device. [Embodiment] [0008] 4 The heat dissipating device (10) provided by the first embodiment includes a heat conducting base 10 and a plurality of heat dissipating fins 2. The heat conducting base 10 has a first surface 101 and a second surface 1〇3 opposite to each other. The first surface 1〇3 is attached to the heat generating electronic device* (not shown). In this embodiment, the heat conducting base 1 is made of copper. Of course, the heat conducting base 10 is also It can be made of a material such as copper alloy, aluminum or aluminum alloy. [0010] The plurality of heat dissipation fins 20 are a set of plates made of copper arranged in parallel, each of the heat dissipation fins 20 includes a body 201 and a body 20 1 connected extension 203. Of course, each of the heat dissipation fins 2 can also be made of a material such as copper alloy, aluminum or aluminum alloy. [0011] Each body 201 is located between the first surface 101 and the extension portion 203 directly connected thereto, and is perpendicular to The first surface is 1 〇. In this embodiment, the body 201 is a square plate 'and is integrally formed with the first surface 1 。 1 . [0012] The extension portion 203 is separated from the end of the body 201 away from the first surface 1 〇 1 The extension portion 2〇3 is a square flat plate perpendicular to the first surface 〇1, and is formed with the body 2〇i_ body 〇099140704 Form No. A0101 Page 4/ 11 pages 0992070845-0 201221892 [In use, the second surface 103 of the heat-conducting base 10 of the heat sink 100 is attached to the electronic component to absorb heat generated by the electronic component, thereby transferring heat to the heat sink fin 20 To dissipate heat to the external environment by the plurality of heat dissipating fins 20. [_ xiao Xiaozhi technology, each of the heat dissipating chips 20 has an extension portion 2〇3, so that the heat dissipating device 1 does not increase in volume. At the same time, the heat dissipation surface of each heat sink fin 2 The product is increased, thereby improving the utilization and heat dissipation performance of each of the heat dissipation fins 20, thereby improving the heat dissipation efficiency of the heat dissipation device 100.
[0015] 请參閱圖2，本發明第二實施例提供之散熱裝置2〇〇包括 導熱底座30及複數散熱“片40。 [0016] 導熱底座30與導熱底座1〇大體上相同，不同之處在於： 導熱底座30之第二表面303還設有一粗糙度小於8奈米之 導熱金屬層305，以降低第二表面303之表面粗糙度，從 而增加導熱底座30與電子元器件之接觸面積，提高散熱 效率。 [0017] 複數散熱籍片40與'_複:熬散熱趙片20大體上相同，不同之 處在於：每一散熱鰭片40之延伸部403上設置有複數間隔 分布之通孔4031，以增加散熱鰭片40與空氣之接觸面積 ，從而進一步提高散熱鰭片40之散熱效率。 [0018] 請參閱圖3，本發明第三實施例提供之散熱裝置3〇〇包括 導熱底座50及複數散熱鰭片60。 [0019] 導熱底座50與導熱底座10大體上相同，不同之處在於： 導熱底座50之内部還具有一密封中空腔501及填充於中空 腔501内之工作流體503，以使電子元器件所散發出來之 099140704 表單煸號 Α0101 第 5 頁/共 11 頁 0992070845-0 201221892 熱量被工作流體503吸收。吸收熱量之工作流體503受熱 蒸發，吸收相變潜熱成為氣體，氣體到達散熱鰭片60被 冷卻，冷凝成液體並釋放出熱量。散熱鰭片60將熱量傳 遞給外界。 [0020] 複數散熱鰭片60與複數散熱鰭片20大體上相同，不同之 處在於：每一散熱鰭片60呈T字型。 [0021] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0022] 圖1係本發明第一實施例提供之散熱裝置之示意圖。 [0023] 圖2係本發明第二實施例提供之散熱裝置之示意圖。 [0024] 圖3係本發明第三實施例提供之散熱裝置之示意圖。 【主要元件符號說明】 [0025] 散熱裝置：100、200、300 [0026] 導熱底座：10、30、50 [0027] 散熱鰭片：20、40、60 [0028] 第一表面：1 0 1 [0029] 第二表面：103、303 [0030] 本體：201 099140704 表單編號A0101 第6頁/共11頁 0992070845-0 201221892 [0031] 延伸部：203、403 [0032] 導熱金屬層：305 [0033] 通孔：40 3 1 [0034] 中空腔：5 01 [0035] 工作流體：503 ❹ 0992070845-0 099140704 表單編號A0101 第7頁/共11頁Referring to FIG. 2, a heat dissipating device 2 provided by a second embodiment of the present invention includes a heat conducting base 30 and a plurality of heat dissipating “slices 40. [0016] The heat conducting base 30 and the heat conducting base 1 are substantially the same, and the difference is different. The second surface 303 of the thermal conductive base 30 is further provided with a thermal conductive metal layer 305 having a roughness of less than 8 nm to reduce the surface roughness of the second surface 303, thereby increasing the contact area between the thermally conductive base 30 and the electronic component, thereby improving [0017] The plurality of heat-dissipating heat-dissipating films 40 are substantially the same as the heat-dissipating heat-dissipating film 20, except that the extending portion 403 of each heat-dissipating fin 40 is provided with a plurality of spaced-apart through holes 4031 In order to increase the heat dissipation efficiency of the heat dissipation fins 40, the heat dissipation device 3 of the third embodiment of the present invention includes a heat conduction base 50 and The heat-dissipating fins 50 are substantially the same as the heat-conducting base 10, except that: the heat-conducting base 50 further has a sealed hollow cavity 501 and a workflow filled in the hollow cavity 501. 503, so that the electronic components are emitted 099140704 Form No. 1010101 Page 5 of 11 0992070845-0 201221892 The heat is absorbed by the working fluid 503. The heat-absorbing working fluid 503 is evaporated by heat, absorbing latent heat of phase change into a gas, The gas reaches the heat sink fins 60 to be cooled, condenses into a liquid and releases heat. The heat sink fins 60 transfer heat to the outside. [0020] The plurality of heat sink fins 60 are substantially identical to the plurality of heat sink fins 20, with the following differences: Each of the heat dissipation fins 60 has a T-shape. [0021] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention. The scope of the patent application in this case is not limited by this. Any equivalent modifications or changes made by those skilled in the art to the spirit of the present invention should be included in the scope of the following patent application. [Simplified illustration] [0022 1 is a schematic view of a heat dissipating device according to a first embodiment of the present invention. [0023] FIG. 2 is a schematic view of a heat dissipating device according to a second embodiment of the present invention. 3 is a schematic diagram of a heat dissipating device according to a third embodiment of the present invention. [Main component symbol description] [0025] Heat dissipating device: 100, 200, 300 [0026] Thermally conductive base: 10, 30, 50 [0027] Fins: 20, 40, 60 [0028] First surface: 1 0 1 [0029] Second surface: 103, 303 [0030] Body: 201 099140704 Form number A0101 Page 6 / Total 11 pages 0992070845-0 201221892 [ 0031] Extension: 203, 403 [0032] Thermally conductive metal layer: 305 [0033] Through hole: 40 3 1 [0034] Cavity: 5 01 [0035] Working fluid: 503 ❹ 0992070845-0 099140704 Form number A0101 No. 7 Page / Total 11 pages