201219890 六、發明說明： 【發明所屬之技術領域】 〆+、w 性顯 對片 〜呢不窃的糸統和製造柔 不盗的方法。更特別地，本發gg t 1 "" +赞明有關卷對卷式或者卷 式製造柔性液晶顯示器的方法和系統。 【先前技術】 柔性顯示器是使用可·彎曲基板比如塑膠基板形成的平 面顯示設備’並且可彎曲、折疊或變形為輥形，同時保持 極好的顯示特徵。因此，目前柔性顯示器作為下一代技術， 正在引起全世界的注目。 柔性顯示設備由薄的柔性基板製成，該基板可像紙— 樣彎曲或卷成幾個釐米，而不喪失現有顯示設備的特徵。 不像由現有的玻璃基板製成的硬顯示器，柔性顯示器輕、 溥、尚度抗撞擊並可自由彎曲。根據其用途和功能，這種 柔性顯不Is可分為加固顯示器、彎曲顯示器和捲曲式顯示 器。質輕、堅固並可彎曲的顯示器可應用於數位多媒體廣 播（DMB)、無線寬帶（wiBro)、個人數位助理（PDA)等 高品質移動設備的顯示器，並將發展成捲曲式顯示器。 圖1是用於製造液晶顯示器的傳統方法的流程圖。 參照圖1 ’當使用玻璃基板製造液晶顯示器時，通常 通過劃分成薄膜電晶體（TFT)基板的工序和彩色濾光片基 板的工序來進行液晶盒加工。具體地，在步驟S2 0中，在 薄膜電晶體基板上形成薄膜電晶體陣列，以形成薄膜電晶 201219890 體該薄膜電曰曰體是液晶顯示器的開關或驅動元件。然後， 薄膜電晶體基板依次經# S21的取向膜的塗覆和摩擦步 驟、S 2 2的清洗步驟，以曰 及S23的液晶分配步驟。另^一方 面’在步驟S1 〇中，必由、疮μ r I色濾先片在玻璃基板上形成，隨後 經過S11的取向胺>薛 门膜的塗覆和摩擦步驟，S12的清洗步驟， S13 的密封分 配步驟，S14的短路分配（sh〇rt dispensation) '驟，”/ n 。厂 - " 及SI 5的隔墊物（Spacer )分配 步驟。然後，在步翻t ςςη + # 也少驟S30中裝配兩個基板（上基板和下基 板）’隨後，在+ c <3 ]上^ 、- 步驟S31中進行密封劑固化，在步驟S32 中進行液晶盒劃線和斷裂 |衣μ獲付早個液晶盒，並且在步驟 S33中進行偏振器板的最終檢查和安裝。 使用玻璃基板時，诵禍y料μ „ 逋k片對片式方法製造液晶顯示 益另方面，用柔性基板代替e綠彳f妨—+ # 双代管毛種傳統玻璃基板的大多 數嘗試都集中在片 ^ …… 月對片式方法。即，在片對片式方法中， 將一個形成有薄膜電晶體陣 ^ , 平幻的茱性溥片裝配到另一個形 成有知色濾光片的柔性壤 、/寻片上’因而明顯地降低了生產 率，並對柔性材料的利用帶來了困難。 L 了生產 【發明内容】 為了改善該技術和解決上 本發明的m + 上面概逑的—個或多個需求， 本發明的I方面在於提供—種 和製造柔性顯以的m i性液晶⑼器的系統 法並可顯著提高生產率。、 肖卷式或卷對片式方 根據本發明的-個方面’製造柔性液晶顯示器的系統 6 201219890 包括：第一拆卷機，連續供給第— 系性基板，第二拆卷機， 連續供給第二柔性基板；裝配單元，裝配在上述第一柔性 基板上形成的上基板和在上述第二柔性基板上形成的下基 板，第一取向膜形成單元，當 矛w甘上 田上通第一柔性基板從上述第 一拆卷機移動到上述裝配單元 在上述第一柔性基板的 一個表面塗敷取向H取向膜形成上述p 柔性基板從上述第二拆卷機移動到真空裝配單元時，在上 述第二柔性基板的上表面塗敷取向膜；密封分配器；隔塾 物形成皁兀；以及切割器，正 灯任上迷第一柔性基板和上 述第二柔性基板傳送到上述裝配單元之前、當上述第一柔 性基板和上述第二柔性基板在上述裝配單元内時、或者正 好在上述第-柔性基板和上述第二柔性基板傳送出上述裝 配單元之後，切割上述第一芽 ^本性基板和上述第二柔性基板 中的至少一個。 在一個實施例中，上述裒配單元可為真空襄配單元。 、在-個實施例中，上述裝配單元可包括靜電卡盤 (SC ) _L述靜電卡盤支擇和傳送由上述切割器切割的上 述第一柔性基板或上述第二柔性基板。 在-個實施例中’上述系統還可包括至 測器，上述測力感測器在上述第„柔性基板和上述^ = 性基板傳送到上述裝配單元時，維持上述第一柔性基板和 上述第一'柔性基板的張力。 纟—個實施例中，上述系統還可包括至少-個網狀導 向器，上述網狀導向器在上述第一柔性基板和上述第二柔 7 201219890 定位上述第一柔性基板和 性基板傳送到上述裝配單元時 上述第二柔性基板。 ^ …^ ,叮心丄処弟一系性暴板 和上述第二柔性基板的輥子 ^ _ ，、上迷第—柔性基板和上述 第二柔性基板的邊緣相接觸。 在一個實施例中，用於^ μ 、上述上基板的對準標記之間的 距離D1與用於上述下基搞的 丞板的對準標記之間的距離D2不相 同0 在一個實施例中’上述對準標記之間的距離D1可以大 於上述對準標記之間的距離D2。 根據本發明的另一個方面，製造柔性顯示器的方法包 括：在第-拆卷機連續供給的第一柔性基板的一個表面上 形成第-取向Μ，以形成上基板；在第二拆卷機連續供給 的第二柔性基板的上表面上形成第二取向膜，·纟第二柔性 基板的上表面進行密封分配或短路分配（sh〇n dispensation)，在第二柔性基板的上表面上形成空間， 以形成下基板；正好在第一柔性基板和第二柔性基板傳送 到裝配單元之前’ f第一柔性基板和第二柔性基板在裝配 單元内時，或者正好在第一柔性基板和第二柔性基板傳送 出裝配單it之後’㈣第—柔性基板和第二柔性基板中的 >、個，以及，將用於上基板的第一對準標記與用於下 基板的第二對準標記對準，以裝配上基板和下基板。 根據本發明進一步的方面，製造柔性顯示器的方法包 括：傳送第-網狀柔性基板，上述第一網狀柔性基板具有 201219890 多個上基板和各上基板上的對準標記，相鄰上基板的對準 標記之間的距離為D1;傳送第二網狀柔性基板上述第二 網狀柔性基板具有多個下基板和各下基板上的對準標 相鄰下基板的對準標記之間的距離為D2(Dl^D2);以及， 將上基板的對準標記與下基板的對準標記對準，以將上基 板和下基板彼此裝配起來。 在-個實施例中，相鄰上基板的對準標記之間的距離 D1可等於相鄰下基板的對準標記之間的距離⑽。 在-個實施例中，上述方法可進一步包括：在上述第 -柔性基板的-個表面上形成上述取向膜之前，在上述第 一柔性基板的一個表面上形成彩色濾光片。 在-個實施例中，上述方法可進一步包括：在上述第 二柔性基板的上表面上形成上述第二取向膜之前，在上述 第二柔性基板的上表面上形成薄骐電晶體陣列。 矛在-個實施例中，上述方法可進一步包括：在上述第 二柔性基板的上表面上形成上述薄膜電晶體陣列之前，在 上述第二柔性基板的上表面上形成彩色濾光片。 在一個實施例中’用於傳送上述第-柔性基板和上述 第二柔性基板的輕子可與上述第—柔性基板和上述第 性基板的邊緣相接觸’上述第一柔性基板和上述第二柔性 基板的邊緣分別位於上述第一柔性基板的上基板加工區域 和上述第二柔性基板的下基板加工區域之外。 在一個實施例中，上述第一柔性基板和上述第二柔性 基板在其邊緣處可以开$点 成有通孔，上述通孔用於分別定位 201219890 上述第一柔性基板和上述第二柔性基板。 在個實施例中，上述上基板和上述下基板的裝配可 以在真空下進行。 在一個實施例中，上述距離D1可大於上述距離D2。 在-個實施例中，上述方法可進一步包括在裝配上述 上基板和上述下基板之前或之後切割上述第一柔性基板。 …在-個實施例中，上述方法可進一步包括：在裝配上 述上基板和上述下基板之前，當傳送第二柔性基板時，在 第二柔性基板的上表面上形成第^取向冑；在形成有第二 取向膜的第二柔性基板的上表面上進行密封分配和液晶分 配’以及’在上述第：柔性基板的上表面上形成隔塾物。 在結合附圖與給出的下述實施例的描述中，本發明的 上述其他方面、特徵和優點將很明顯。 【實施方式】 現在參照附圖詳細描述本發明的實施例。 圖2為根據本發明的一個實施例的製造柔性液晶顯示 器的系統的框圖；圖3為根據本發明的一個實施例的製造 柔性液晶顯示器的方法的流程圖。 參考圖2和圖3，第一拆卷機102連續供給卷成輥形 的第一柔性基板100。第一柔性基板1〇〇可由聚對苯二甲 酸乙二醇酯（PET )、聚萘二甲酸乙二醇酯（pEN )、聚鍵 碾（PES)、聚丙烯酸酯（par )、聚碳酸酯（pC )、環締 煙共聚物（COC)或聚酰亞胺形成，但不限於上述材料。有 10 201219890 必要維持第一柔性基板1 00的張力在恒定的範圍之内以有 效地進行傳送和隨後的步驟。至少一個測力感測器i 〇 4可 a又置在第一柔性基板1 〇 〇的傳送方向，以測量和調整第一 柔性基板1 00的張力。由於第一柔性基板1〇〇在移動（傳 送）的過耘中可變形為蛇形蜷曲的形狀，至少一個網狀導 向器106可設置在第一柔性基板1〇〇的傳送方向，以調整 第一柔性基板1 0 〇位於恒定的位置。 首先，在步驟s100中在第一柔性基板1〇〇上形成彩色 濾光片108。然而，當預先形成帶有彩色遽光片1〇8的第 -柔性基才反100時，可省略形成彩色濾光片1〇8的步驟。 可通過形成彩色濾光片的典型方法來形成彩色濾光片 108此外，在第一柔性基板1〇〇上也可進—步形成普通的 電極（未示出）和黑色矩陣。 接下來，在步驟S102中通過第一取向膜形成單元（未 示出）在第-柔性基板100上形成第一取向膜11〇。第一 取向膜110可為有機取向膜、無機取向膜或金屬取向膜。 通過旋轉塗布、印刷塗布等形成有機聚合物層，然後固化 該有機聚合物層，可形成有機取向膜。該有機聚合㈣可 進-步經過摩擦。該有機取向膜的—個實例包括㈣亞胺 取向膜。通過諸如-氧切、二氧切等氧化物的斜射蒸 鑛’可形成無機取向膜。金屬取向膜可由諸如l(Au)、 始（Pt)等金屬材料形成。 可在第 彩色濾光片 一柔性基板1 〇 〇的上表面采 衣甶和下表面之一上形成 108和第一取向膜no。 201219890 第二拆卷機202連續供給卷成輥形的第二柔性基板 200。如上所述，至少一個用於調整第二柔性基板2〇〇的張 力的測力感測！ 204 #至少—個用於定位第二柔性基板 200的網狀導向H 206¾置在第二柔性基板2〇〇的傳送方 向。第一柔性基板200可由聚對笨二甲酸乙二醇酯（pET)、 聚蔡二甲酸乙二醇醋（PEN)、聚喊砜（pES)、聚丙稀酸 醋（PAR)、聚碳酸醋（PC)、環烯烴共聚物（c〇c)或聚 酰亞胺形成，但不限於上述材料1二柔性基板_的材 料與第一柔性基板1 00的材料可相同或不同。 首先，在步驟S200中通過形成薄膜電晶體陣列的典型 方法’可在第二柔性基板20G的上表面上形成薄膜電晶體 (TFT)陣列208。然而’當預先形成帶有薄膜電晶體陣列 的第二柔性基2〇。時，可省略形成薄膜電晶體陣列的步 驟。進-步地’對於無源矩陣液晶顯示器，而非有源矩陣 液晶顯示器，可形成透明電極圖形，而非薄膜電晶體陣列。 接下來，在步驟S202中，通過第二取向膜形成單元（未 示出）形成第二取向膜21。。第二取向膜21〇的種類和形 成方法和第-取向m 110的種類和形成方法相同，並且第 二取向膜形成單元可用#第-取向膜形成單元。 然後，分別通過密封分配器（未示出）、短路分配器 (short dispenser)’未示出）以及液晶分配器（未示出）， 可在具有第二取向膜21〇的第二柔性基板的上表面進行密 封刀配步驟S204、短路分配步驟S2〇6以及液晶分配步驟 S208此文中，短路分配步驟可省略。此外，密封分配步 201219890 驟S204、短路分配步驟S2〇6以及液晶分配步驟S2〇8的順 序可改變。進一步地，雖然本實施例說明了在裝配上基板 和下基板之前進行液晶分配步驟S2〇8，但是在真空裝配後 可進行注入液晶的步驟，而不需要進行液晶分配步驟s2〇8。 裝配第柔性基板和第二柔性基板2〇〇時，密封 刀配步驟S204是形成密封劑212的步驟，該密封劑21 2提 供用於接收液晶的框架。密封劑可為無機密封劑或有機密 封劑。有機密封劑可由環氧樹脂、酚醛樹脂、丙烯酸樹脂 或者異氰酸醋樹脂形成，並可為單組分型或雙組分型。進 ^也有機也封劑可為熱固化密封劑、紫外線固化密封 齊J或者熱固化與紫外線固化密封劑的組合。使用典型的分 器可進行在封分配步驟$ 2 〇 4。此文中，應理解的是，通 過絲網印刷等方法可形成密封劑212，不限於密封分配。 短路分配步驟S206在TFT基板（下基板）的公共電極 電壓應用端和彩色遽光片基板（上基板）@公共電極之間 形成電'接觸’以允許電壓通過TFT基板施加到彩色濾光片 基板的公共電極上。通過短路分配器，在密封模的外表面 可形成點狀的短路（sh〇rts) 214。短路214可由包括銀 (Ag)、銘（A1)等的導電膏形成，並且短路214可包括 除了岔封劑外相同或不同的固化劑。使用典型的分配器可 進行短路分配步驟S2〇6。 ° 通過液晶滴入制程（0DF，One-Drop-F i 11 i ng )方法了 進订液晶分配步驟S208。對於液晶滴入制程方法，在密 圖形中形成密封劑212。此文中，當通過液晶注入方法而 13 201219890 卜BB滴入制程方法進行液晶分配步驟時，在包括注入口 的圖开/中’而非密封圖形中形成密封齊丨212。當通過液晶 制程方法進行液晶分配步驟時，密封劑212可為紫外 線固化型、或熱固和紫外線固化結合型。 接下來，在步驟S210中，隔墊物形成單元（未示出） 用方、形成隔墊& 21 6。由於液晶層的厚度與液晶顯示器的 顯示特徵比如反應率、冑比度、視角、顏色等密切相關， 所以有必要對液晶層的厚度提供精確統—的控制。隔塾物 216用來維持上基板和下基板之間的恒定距離，即液晶層 的厚度。隔墊物216不僅可為通過分散玻璃隔墊物或塑： 隔塾物形成的隔墊物’也可為通過塗布光敏樹脂複合物， 然後曝光、顯影和烘乾形成的光感式隔墊物。 上基板和 封劑，在 後安裝偏 盒的步驟 驟時，液 密封劑的 方法時， 基板和下 接下來，在步驟S300中，通過裝配單元3〇〇 第一柔性基板100和第二柔性基板2〇〇上形成的 下基板對準並且裝配，隨後在步驟3〇2中固化密 步驟304中將裝配好的基板分成單個液晶盒，然 振器板。明顯地，將裝配好的基板分成單個液晶 可在安裝偏振器板之後進行。進行注入液晶的步 晶在上基板和下基板裝配之後被注入，並且那時 注入口是密封的。另一方面，進行液晶滴入制程 裝配單元30 0是真空裝配單元，其在真空中將上 基板彼此裝配在一起。 該糸統可設有切割器（ 球切割器正好在第 一柔性基板100和第二柔性基板200傳送 _ 才 < 到裝配早7L 3 0 201219890 之刖、當第一柔性基板1 〇〇和第二柔性基板2〇〇在裝配單 兀300之内時、或者正好在第一柔性基板1〇〇和第二柔性 基板200傳送出裝配單元3〇〇之後，切割第一柔性基板1〇〇 和第一柔性基板2〇〇中的至少一個。進一步地，該系統可 具有多個在第一柔性基板1〇〇和第二柔性基板2〇〇傳送方 向的輥子 R100、Rl〇2、r1〇4、Rl〇6、R1〇8、RU〇、RU2、 R200、R202、R204、R206、R208、R210、1^212 ’ 並且這些 親子中的些可以是由馬達驅動的驅動輥子。 如上面所述，在卷對卷式方法中，上基板或第一柔性 基板100可僅經過形成第一取向膜11〇的步驟，並且下基 板可、、二過升^/成剩餘液晶盒步驟。由於在重力方向進行分配 步驟（就如在玻璃基板的分配步驟一樣），因此必須在上 基板的上表面進行分配步驟之後、裝配上基板之前翻轉基 板平面，由此使製造系統複雜化並很難在液晶盒製造線安 裝系統。換言之，液晶盒製造線的第一層必須設置用於下 基板加工的裝備’並且第二層必須設置用於上基板加工的 裝備。進一步地’由於系統必須由兩層裝備組成，所以製 造設施的室内淨高增加’並且系統維修_。然而，在卷 對片式方法中，在第一柔性基板的上表面進行分配步驟以 形成上基，在裝配上基板和下基板之前切割第_柔性基 板和第二柔性基板之一，然後第一柔性基板的上表面裝配 =下基板。m夠在第—柔性基板的上表面進行比如 密封分配、短路分配、液晶分配等步驟。 圖4為根據本發明一個實施例的傳送柔性基板的步驟 15 201219890 的方案視圖。為了便於描述，參照第二柔性基板描述該步 驟，並且應理解的是，該步驟也可應用於第—柔性基板。 另一方面，下面描述的用於柔性基板的傳送步驟和裝配步 驟不僅可應用於柔性液晶gg + $ M , 条r生及曰曰顯不益、雙板型有機電致發光顯 示器等，還可應用於任何使用該柔性基板的方法、設備或 裝置。此文中’為了便於描述’主要參照液晶顯示器描述 這些步驟。 參照圖4 ’第二拆卷機_供給的第二柔性基板_ 的上表面具有下基板加工區域2〇〇2，薄膜電晶體陣列（或 用於無源矩陣的電極圖形）將在該區域上形成。此文中， 術語“下基板加工區域，，的意思是薄膜電晶體陣列、取向 膜' 密封劑、液晶、隔塾物等存在的區域。由於下基板加 工區域經歷上述的各種步驟’輥子R1、R2、们、Μ、以、 R6中的每個均可為啞鈴形狀’由直徑較小的中心部分和直 徑較大的邊緣部分構成，以防止在這些步驟中的污染並保 護先前形成的圖形或處理層，如密封劑、取向膜等… 在下基板加工區域2002所存在的第二柔性基板2〇〇的中心 部分A處，輥子R1等僅接觸到第二柔性基板2〇〇的邊緣b， 而非接觸整個第二柔性基板2〇〇。£優選地，上述輥子與 第二柔性基板200的一部分相接觸，上述該部分置於第二 柔性基板200對準標記2004的外邊。為在切割第二柔性基 板2 0 0後維持第二柔性基板2 〇 〇的張力和定位第二柔性基 板200’可通過通孔2〇〇6形成第二柔性基板2〇〇的邊緣b。 另方面，第二柔性基板200的下表面不具有在該區 16 201219890 域上形成薄膜電晶體陣列（或用於無源矩陣的電極圖形） 等的下基板加工區域2002。代替具有啞鈐形狀的輥子，具 有恒定直徑的圓筒形輥子可有利於支撐和傳送第二牟性美 板200。換言之，輥子R3、R4和R6可為啞鈐型輥=，: 報子Rl、R2、R5和R7可為圓筒形輥子。 圖5為以卷對卷式或者卷對片式製造柔性基板時例示 柔性基板位置控制的方案視圖。由於第一矛 矛 木性基板的位置 控制與第一柔性基板的位置控制以相同的方式進行為了 方便起見’參照第二柔性基板進行描述。 ‘' 第二柔性基板200不需要設置用於邊緣位置控制的追 蹤器270。當第二柔性基板2〇〇設置有追縱器27〇時位 置檢測感測器280可參照線路追蹤器27〇檢測第二柔性基 板200的位置。另一方面，第二柔性基板2〇〇不設置線^ 追縱器270時，能夠參照第二柔性基板的邊緣平面隱進 仃位置測量和調整。位置檢測感測器28〇可為超聲波感測 器或紫外線感測ϋ。上述的通孔簡（圖4)可作為線路 追蹤态或者可在第二柔性基板上形成單獨的線路追蹤器。 進步地’第二柔性基& 2。。的位置通過位置檢測感測器 檢測並且網狀導向Γ 等门器2〇6 (見圖2 )基於檢測結果進行 第二柔性基板200的位置控制。 圖6為以卷對卷式製造柔性基板時例示對準標記位置 的方案視圖。 參照圖6,通過上述的製造過程’在第一柔性基板⑽ 、 表面（下表面）上依次形成具有彩色濾光片等的上 17 201219890 基板150、152,並且在第二柔性基板2〇〇的上表面上依次 形成下基板250、252。然後，兩個或更多的用於對準上基 板150、152與下基板250、252的對準標記160、162、260、 262在每個上基板（在上基板加工區域）和下基板（在下 基板加工區域）的邊緣上形成。優選地，在每個上基板和 下基板的邊緣上形成四個對準標記。此文中，術語“上基 板的意思是包括上基板加工區域並在裝配中安裝到基 板上…，術語“下基板，，的意思是包括下基板加工： 域並在裝配中安裝到上基板上的薄片。 根據該實施例’在連續供給第一柔性基板1〇〇和第二 柔性基板200的卷對卷式方法中，當相鄰上基板的對準標 。己之間的距離D1 #於相鄰下基板的對準標記之間的距離 D2時’裝配工序中出現的對準誤差對後面所有的面板即後 面的上基板和下基板’有不利影響，造成加工成本明顯增 加。進-步地’在正常對準的情況下，在裝配彼此對準的 ^ 一上基们5〇和第-下基板㈣後，由於為了後面的上 ^板152與後面的下基板252對準，距離Μ等於距錢， 开上基板的對準標記162由於第一柔性基板⑽變 =ΓΓ於向右偏’產生在視覺對準方式中需要斜對 準而非垂直對準的問題。 固〖馬根據本發 哪列例示卷對卷式 柔性顯示器裝配步驟的方案視圖 參照圖7，通過上述的製诘 的-個表…“、 在第-柔性基板1〇° J幻表面（下表面）上依 依-人形成具有彩色濾光片等的上 18 201219890 基板150、152，並且在第二柔性基板2〇〇的上表面上依次 形成下基板250、252。然後，在每個上基板和下基板的邊 緣上形成兩個或更多的用於對準上基板15〇、152與下基板 250、252的對準標記160、162、260、262。優選地，在每 個上基板和下基板的邊緣上形成四個對準標記。 在根據本發明的實施例的製造柔性液晶顯示器的卷對 卷式方法中，相鄰上基板15〇、152的對準標記之間的距離 D1與相鄰下基板250、252的對準標記之間的距離D2不同。 優選地，D1大於D2。或者，D2可以大於M。 田D1大於D2，第一柔性基板1〇〇在已裝配的面板和 未裝配的面板之間的邊界處形成有階梯式部分C，由此在 對準第-上基板152與第二下基板252時，提供了消除傾 斜對準的優點。進—步地，當在第—上純⑽和第一下 基板25。對準中出現對準誤差時，後面所有的面板，即第 基板和第一下基板，都要受到該對準誤差的影響。由 於m大於d2,通過調整第二上基板152的位置，即使在 第 上基板150和第一下其4ε; ΟΕΛ 乐下基板250對準中出現對準誤差 時’也有可能對準第二卜A 4 —上基板152和第二下基板252。 、圖8為根據本發明的另-個實施例闡明例示卷對卷 方法中木1·生顯示器裝配步驟的方案視圖。 圖8顯示了一種格、、 lco . 種隋况，在該情況中，相鄰上基板15 152，152、154的對準桿紀 知。己之間的距離大於相鄰下基 〇 2 5 2 ’ 2 5 2、2 5 4 的對準 p 々夕 J 3丁 δ己之間的距離。此文中， 木性基板1 0 0的一個本；γ . 個表面（下表面）上依次形成有上 19 201219890 板 150、152、154、156，該上基板15〇、152、154156 上形成有彩色濾光片、取向膜等，並且該第一柔性基板1〇〇 被傳送到裝配單元300，以及第二柔性基板2〇〇的上表面 上依次形成有下基板250、252、254、256，並且該第二柔 性基板200被傳送到裝配單元3〇〇。裝配單元3〇〇可為真 空裝配單元。 裝配第一上基板150和第一下基板250後，當彼此裝 配第二上基板152和下基板252時，由於對準標記之間的 距離差異，第一柔性基板1〇〇的第一上基板和第二上基板 之間的邊界平面變形。雖，然第-柔性基板1〇〇的變形部分 允許保留下來，但是使用切割器35〇，第一柔性基板ι〇〇 以防止後面步驟中出現問題。 元300裏面或者裝配單元3〇〇 可被單獨切割（見圖8 ( A)) 起被切割（見圖8 ( B))，以 切割器3 5 0可放置在裝配單元 或者與第二柔性基板200 — 步的實施例例示卷對卷式方法 圖9為根據本發明進一步的實 的—個表面（下表面） 上依次201219890 VI. Description of the invention: [Technical field to which the invention belongs] 〆+, w sexual display 〜 呢 呢 呢 不 不 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和 和More specifically, the present invention relates to a method and system for manufacturing a flexible liquid crystal display in a roll-to-roll or roll-to-roll manner. [Prior Art] A flexible display is a flat display device formed using a bendable substrate such as a plastic substrate and can be bent, folded or deformed into a roll shape while maintaining excellent display characteristics. Therefore, flexible displays are currently attracting worldwide attention as next-generation technologies. The flexible display device is made of a thin flexible substrate that can be bent or rolled into a few centimeters like paper without losing the features of existing display devices. Unlike hard displays made from existing glass substrates, flexible displays are light, sturdy, resistant to impact and free to bend. Depending on its use and function, this flexible display can be divided into a reinforced display, a curved display, and a curled display. The lightweight, rugged and flexible display can be used in displays for high-quality mobile devices such as digital multimedia broadcasting (DMB), wireless broadband (wiBro), personal digital assistants (PDAs), and will be developed into a curled display. 1 is a flow chart of a conventional method for manufacturing a liquid crystal display. Referring to Fig. 1 'When a liquid crystal display is manufactured using a glass substrate, the liquid crystal cell processing is usually performed by a process of dividing into a thin film transistor (TFT) substrate and a process of a color filter substrate. Specifically, in step S20, a thin film transistor array is formed on the thin film transistor substrate to form a thin film transistor. The thin film transistor is a switch or driving element of the liquid crystal display. Then, the thin film transistor substrate is sequentially subjected to the coating and rubbing step of the alignment film of #S21, the cleaning step of S 2 2, and the liquid crystal dispensing step of 曰 and S23. On the other hand, in step S1, the must-have, the first color filter is formed on the glass substrate, and then the S11 oriented amine > Xuemen film coating and rubbing step, S12 cleaning step, S13 seal distribution step, S14 short circuit assignment (sh〇rt dispensation) 'jump,' / n. Factory - " and SI 5 spacer (Spacer) allocation step. Then, in step t ςςη + # also Two substrates (upper substrate and lower substrate) are assembled in a small step S30. Subsequently, the sealant is cured in +c <3], and in step S31, and the liquid crystal cell is scribed and broken in step S32. μ is paid for the early liquid crystal cell, and the final inspection and mounting of the polarizer plate is performed in step S33. When the glass substrate is used, the y material is produced by the method of manufacturing the liquid crystal display. Substrate instead of e green 彳 妨 + —+ # 代 代 管 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 That is, in the chip-to-chip method, a thin film transistor formed with a thin film transistor array is assembled onto another flexible soil formed on the color filter, or on the finder sheet, thus significantly reducing Productivity and difficulties in the use of flexible materials. L. Production [Invention] In order to improve the technology and solve one or more of the above requirements of the present invention, the first aspect of the present invention provides a mi liquid liquid crystal (9) device that provides flexibility and flexibility. Systematic approach and can significantly increase productivity. A system for manufacturing a flexible liquid crystal display according to the aspect of the invention. 6 201219890 comprising: a first unwinder, a continuous supply of a first substrate, a second unwinder, and a continuous supply a second flexible substrate; an assembly unit, an upper substrate formed on the first flexible substrate; and a lower substrate formed on the second flexible substrate, the first alignment film forming unit, when the spear is on the field, the first flexible Moving the substrate from the first unwinder to the mounting unit to apply an oriented H alignment film on one surface of the first flexible substrate to form the p flexible substrate from the second unwinder to the vacuum assembly unit, The upper surface of the second flexible substrate is coated with an alignment film; the sealing dispenser; the spacer forms a sapon; and the cutter, the positive lamp before the first flexible substrate and the second flexible substrate are transferred to the assembly unit, when The first flexible substrate and the second flexible substrate are transferred in the assembly unit or just above the first flexible substrate and the second flexible substrate After said assembled unit, the first cut shoots and the second substrate ^ nature of at least one flexible substrate. In one embodiment, the above-described mating unit may be a vacuum mating unit. In one embodiment, the assembly unit may include an electrostatic chuck (SC) _L to describe the electrostatic chuck and transfer the first flexible substrate or the second flexible substrate cut by the cutter. In one embodiment, the above system may further include a detector that maintains the first flexible substrate and the first portion when the first flexible substrate and the above-mentioned ^= substrate are transferred to the assembly unit A tension of the flexible substrate. In one embodiment, the system may further include at least one mesh guide, the mesh guide positioning the first flexibility on the first flexible substrate and the second flexible 7 201219890 The second flexible substrate is transferred to the assembly unit when the substrate and the substrate are transferred to the above-mentioned assembly unit. ^^^, the core of the violent board and the roller of the second flexible substrate, the upper flexible substrate and the above The edges of the second flexible substrate are in contact. In one embodiment, the distance between the distance D1 between the alignment marks of the upper substrate and the alignment mark of the raft for the lower substrate is used. D2 is not the same 0 In one embodiment, the distance D1 between the above alignment marks may be greater than the distance D2 between the above alignment marks. According to another aspect of the invention, a method of manufacturing a flexible display includes Forming a first orientation yoke on one surface of the first flexible substrate continuously supplied by the first unwinder to form an upper substrate; forming a second orientation on an upper surface of the second flexible substrate continuously supplied by the second unwinder a film, a top surface of the second flexible substrate is subjected to sealing distribution or short-circuit dispensing, and a space is formed on the upper surface of the second flexible substrate to form a lower substrate; just in the first flexible substrate and the second Before the flexible substrate is transferred to the assembly unit, 'f the first flexible substrate and the second flexible substrate are in the assembly unit, or just after the first flexible substrate and the second flexible substrate are transferred out of the assembly sheet it' (4) - the flexible substrate and the first And a second alignment mark for the upper substrate is aligned with the second alignment mark for the lower substrate to assemble the upper substrate and the lower substrate. Further according to the present invention In one aspect, a method of manufacturing a flexible display includes: transmitting a first-mesh flexible substrate having the alignment marks on a plurality of upper substrates and respective upper substrates of 201219890, The distance between the alignment marks of the adjacent substrates is D1; the second mesh flexible substrate is transferred, and the second mesh flexible substrate has the alignment marks of the plurality of lower substrates and the adjacent lower substrates on the lower substrates The distance between them is D2 (Dl^D2); and, the alignment mark of the upper substrate is aligned with the alignment mark of the lower substrate to assemble the upper substrate and the lower substrate to each other. In one embodiment, the phase The distance D1 between the alignment marks of the adjacent substrates may be equal to the distance (10) between the alignment marks of the adjacent lower substrates. In an embodiment, the above method may further include: - a plurality of the first flexible substrates Before forming the alignment film on the surface, a color filter is formed on one surface of the first flexible substrate. In one embodiment, the method may further include: forming the first surface on the upper surface of the second flexible substrate Before the two alignment films, a thin tantalum transistor array is formed on the upper surface of the second flexible substrate. In one embodiment, the above method may further include forming a color filter on the upper surface of the second flexible substrate before forming the thin film transistor array on the upper surface of the second flexible substrate. In one embodiment, a 'leather for transporting the first flexible substrate and the second flexible substrate may be in contact with an edge of the first flexible substrate and the first substrate,' the first flexible substrate and the second flexible The edges of the substrate are respectively located outside the upper substrate processing region of the first flexible substrate and the lower substrate processing region of the second flexible substrate. In one embodiment, the first flexible substrate and the second flexible substrate may be opened at their edges by a through hole for respectively positioning the first flexible substrate and the second flexible substrate of 201219890. In one embodiment, the assembly of the upper substrate and the lower substrate described above may be performed under vacuum. In one embodiment, the distance D1 may be greater than the distance D2. In one embodiment, the above method may further include cutting the first flexible substrate before or after assembling the upper substrate and the lower substrate. In one embodiment, the above method may further include: forming a second orientation on the upper surface of the second flexible substrate when the second flexible substrate is transferred before assembling the upper substrate and the lower substrate; A seal distribution and a liquid crystal distribution are performed on the upper surface of the second flexible substrate having the second alignment film, and a spacer is formed on the upper surface of the first flexible substrate. The above-described other aspects, features, and advantages of the present invention will be apparent from the description of the accompanying drawings. [Embodiment] Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. 2 is a block diagram of a system for fabricating a flexible liquid crystal display in accordance with one embodiment of the present invention; and FIG. 3 is a flow chart of a method of fabricating a flexible liquid crystal display in accordance with one embodiment of the present invention. Referring to Figures 2 and 3, the first unwinder 102 continuously feeds the first flexible substrate 100 wound into a roll shape. The first flexible substrate 1 can be made of polyethylene terephthalate (PET), polyethylene naphthalate (pEN), poly bond (PES), polyacrylate (par), polycarbonate. (pC), cyclazone copolymer (COC) or polyimide is formed, but is not limited to the above materials. There are 10 201219890 It is necessary to maintain the tension of the first flexible substrate 100 within a constant range for efficient transfer and subsequent steps. At least one load cell i 〇 4 can be placed in the transfer direction of the first flexible substrate 1 〇 to measure and adjust the tension of the first flexible substrate 100. Since the first flexible substrate 1 is deformable into a serpentine shape in the moving (transporting), at least one mesh guide 106 may be disposed in the conveying direction of the first flexible substrate 1 to adjust the A flexible substrate 10 〇 is at a constant position. First, a color filter 108 is formed on the first flexible substrate 1A in step s100. However, when the first-flexible group having the color light-receiving sheet 1〇8 is formed in advance, the step of forming the color filter 1〇8 can be omitted. The color filter 108 can be formed by a typical method of forming a color filter. Further, a common electrode (not shown) and a black matrix can be further formed on the first flexible substrate 1A. Next, the first alignment film 11A is formed on the first flexible substrate 100 by a first alignment film forming unit (not shown) in step S102. The first alignment film 110 may be an organic alignment film, an inorganic alignment film or a metal alignment film. An organic alignment layer can be formed by forming an organic polymer layer by spin coating, printing coating, or the like, and then curing the organic polymer layer. The organic polymerization (4) can be further subjected to friction. An example of the organic alignment film includes a (iv) imine oriented film. The inorganic alignment film can be formed by oblique evaporation of an oxide such as an oxygen cut or a dioxane. The metal alignment film may be formed of a metal material such as 1 (Au), or (Pt). 108 and a first alignment film no may be formed on one of the upper surface of the first color filter-flexible substrate 1 采 and the lower surface. 201219890 The second unwinder 202 continuously supplies the second flexible substrate 200 wound into a roll shape. As described above, at least one force sensing for adjusting the tension of the second flexible substrate 2〇〇! 204 #At least one mesh guide H 2063⁄4 for positioning the second flexible substrate 200 is placed in the transport direction of the second flexible substrate 2''. The first flexible substrate 200 may be composed of polyethylene terephthalate (pET), polycaene glycol vinegar (PEN), polysulfone (pES), polyacrylic acid vinegar (PAR), polycarbonate ( The material formed of PC), cycloolefin copolymer (c〇c) or polyimide, but not limited to the above-mentioned material 1 and 2 flexible substrates may be the same as or different from the material of the first flexible substrate 100. First, a thin film transistor (TFT) array 208 can be formed on the upper surface of the second flexible substrate 20G by a typical method of forming a thin film transistor array in step S200. However, when a second flexible substrate 2 having a thin film transistor array is formed in advance. At the time, the step of forming the thin film transistor array can be omitted. Step-by-step For a passive matrix liquid crystal display, rather than an active matrix liquid crystal display, a transparent electrode pattern can be formed instead of a thin film transistor array. Next, in step S202, the second alignment film 21 is formed by a second alignment film forming unit (not shown). . The kind and formation method of the second alignment film 21A are the same as those of the first orientation m 110, and the second alignment film formation unit can form a unit by the #-oriented film. Then, through a sealed dispenser (not shown), a short dispenser 'not shown', and a liquid crystal dispenser (not shown), respectively, in the second flexible substrate having the second alignment film 21A The upper surface is subjected to a sealing knife fitting step S204, a short-circuit distributing step S2〇6, and a liquid crystal dispensing step S208. Here, the short-circuit distributing step can be omitted. Further, the order of the seal distribution step 201219890 step S204, the short-circuit distribution step S2〇6, and the liquid crystal distribution step S2〇8 can be changed. Further, although the present embodiment has explained that the liquid crystal dispensing step S2 〇 8 is performed before the upper substrate and the lower substrate are assembled, the step of injecting the liquid crystal can be performed after the vacuum assembly, without performing the liquid crystal dispensing step s2 〇 8. When the first flexible substrate and the second flexible substrate 2 are assembled, the sealing step S204 is a step of forming a sealant 212 which provides a frame for receiving the liquid crystal. The sealant can be an inorganic sealant or an organic sealant. The organic sealant may be formed of an epoxy resin, a phenol resin, an acrylic resin or an isocyanate resin, and may be a one-component type or a two-component type. The organic also sealant can be a combination of a heat curing sealant, an ultraviolet curing seal, or a heat curing and UV curing sealant. A typical splitter can be used in the seal assignment step $2 〇 4. In this context, it should be understood that the encapsulant 212 can be formed by screen printing or the like, and is not limited to the seal dispensing. The short-circuit distribution step S206 forms an electrical 'contact' between the common electrode voltage application end of the TFT substrate (lower substrate) and the color slab substrate (upper substrate) @ common electrode to allow voltage to be applied to the color filter substrate through the TFT substrate. On the common electrode. By shorting the distributor, a dot-like short circuit 214 can be formed on the outer surface of the sealing mold. The short circuit 214 may be formed of a conductive paste including silver (Ag), Ming (A1), or the like, and the short circuit 214 may include the same or different curing agents other than the sealant. The short circuit distribution step S2〇6 can be performed using a typical dispenser. ° The liquid crystal dispensing step S208 is ordered by the liquid crystal dropping process (0DF, One-Drop-F i 11 i ng ) method. For the liquid crystal dropping process, the sealant 212 is formed in the dense pattern. Here, when the liquid crystal dispensing step is carried out by the liquid crystal injection method, the sealing aligning 212 is formed in the drawing opening/middle including the injection port instead of the sealing pattern. When the liquid crystal dispensing step is carried out by the liquid crystal process method, the encapsulant 212 may be of an ultraviolet curing type or a combination of a thermosetting and ultraviolet curing. Next, in step S210, a spacer forming unit (not shown) is used to form a spacer & Since the thickness of the liquid crystal layer is closely related to the display characteristics of the liquid crystal display such as the reaction rate, the contrast ratio, the viewing angle, the color, etc., it is necessary to provide precise control of the thickness of the liquid crystal layer. The spacer 216 is used to maintain a constant distance between the upper substrate and the lower substrate, that is, the thickness of the liquid crystal layer. The spacer 216 may be not only a spacer formed by dispersing a glass spacer or a plastic: barrier but also a photosensitive spacer formed by coating a photosensitive resin composite, followed by exposure, development, and drying. . The upper substrate and the sealing agent, in the step of mounting the offset box later, the method of the liquid sealing agent, the substrate and the next, in step S300, the first flexible substrate 100 and the second flexible substrate are passed through the assembly unit 3 The lower substrate formed on the second substrate is aligned and assembled, and then the assembled substrate is divided into a single liquid crystal cell and a vibrator plate in the curing step 304 in step 3. Obviously, dividing the assembled substrate into individual liquid crystals can be performed after the polarizer plate is mounted. The step of injecting the liquid crystal is injected after the upper substrate and the lower substrate are assembled, and then the injection port is sealed. On the other hand, the liquid crystal dropping process assembly unit 30 0 is a vacuum assembling unit which assembles the upper substrates to each other in a vacuum. The system may be provided with a cutter (the ball cutter is just transferred between the first flexible substrate 100 and the second flexible substrate 200) until after assembly 7L 3 0 201219890, when the first flexible substrate 1 and the first flexible substrate Cutting the first flexible substrate 1 and the second flexible substrate 2 〇〇 within the assembly unit 300 or just after the first flexible substrate 1 〇〇 and the second flexible substrate 200 are transferred out of the assembly unit 3 〇〇 At least one of the flexible substrates 2 . Further, the system may have a plurality of rollers R100, R1 〇 2, r1 〇 4 in the transport direction of the first flexible substrate 1 and the second flexible substrate 2, Rl〇6, R1〇8, RU〇, RU2, R200, R202, R204, R206, R208, R210, 1^212' and some of these parents may be driven rollers driven by a motor. As described above, In the roll-to-roll method, the upper substrate or the first flexible substrate 100 may pass only the step of forming the first alignment film 11〇, and the lower substrate may be, and may be over-formed into the remaining liquid crystal cell step. Dispensing step (as in the dispensing step of the glass substrate) Therefore, it is necessary to flip the substrate plane after the dispensing step on the upper surface of the upper substrate and before the upper substrate is assembled, thereby complicating the manufacturing system and making it difficult to mount the system in the liquid crystal cell manufacturing line. In other words, the first of the liquid crystal cell manufacturing line The layer must be equipped with equipment for lower substrate processing' and the second layer must be equipped with equipment for upper substrate processing. Further 'because the system must consist of two layers of equipment, the indoor height of the manufacturing facility increases' and the system repairs _ However, in the roll-to-roll method, a dispensing step is performed on the upper surface of the first flexible substrate to form an upper substrate, and one of the first flexible substrate and the second flexible substrate is cut before the upper substrate and the lower substrate are assembled, and then The upper surface of a flexible substrate is assembled = the lower substrate. m is sufficient for the steps of sealing distribution, short circuit distribution, liquid crystal distribution, etc. on the upper surface of the first flexible substrate. Fig. 4 is a step 15 of transferring a flexible substrate according to an embodiment of the present invention. Plan view of 201219890. For ease of description, this step is described with reference to the second flexible substrate, and should be understood Yes, this step can also be applied to the first flexible substrate. On the other hand, the transfer step and the assembly step for the flexible substrate described below can be applied not only to the flexible liquid crystal gg + $ M , but also to the raw and unfavorable A double-plate type organic electroluminescence display or the like can also be applied to any method, apparatus or device using the flexible substrate. In the present description, these steps are mainly described with reference to a liquid crystal display for convenience of description. The upper surface of the supplied second flexible substrate _ has a lower substrate processing region 2〇〇2 on which a thin film transistor array (or an electrode pattern for a passive matrix) will be formed. In this context, the term “下下” The substrate processing region means a region in which a thin film transistor array, an alignment film 'sealant, a liquid crystal, a barrier, and the like are present. Since the lower substrate processing region undergoes the various steps described above, 'each of the rollers R1, R2, Μ, 以, R6 can be a dumbbell shape' consisting of a smaller diameter central portion and a larger diameter edge portion, Preventing contamination in these steps and protecting previously formed patterns or processing layers such as sealants, alignment films, etc. At the central portion A of the second flexible substrate 2A present in the lower substrate processing region 2002, the roller R1, etc. only It contacts the edge b of the second flexible substrate 2〇〇 instead of contacting the entire second flexible substrate 2〇〇. Preferably, the roller is in contact with a portion of the second flexible substrate 200, and the portion is disposed outside the alignment mark 2004 of the second flexible substrate 200. To maintain the tension of the second flexible substrate 2 和 after cutting the second flexible substrate 200 and to position the second flexible substrate 200', the edge b of the second flexible substrate 2A can be formed through the through holes 2〇〇6. On the other hand, the lower surface of the second flexible substrate 200 does not have the lower substrate processing region 2002 in which a thin film transistor array (or an electrode pattern for a passive matrix) or the like is formed on the region 16 201219890. Instead of a roller having a dull shape, a cylindrical roller having a constant diameter can facilitate the support and conveyance of the second inert sheet 200. In other words, the rollers R3, R4 and R6 may be dumb type rollers =,: the newspapers R1, R2, R5 and R7 may be cylindrical rollers. Fig. 5 is a view showing a scheme of exemplifying flexible substrate position control when a flexible substrate is manufactured in a roll-to-roll or roll-to-roll manner. Since the position control of the first spear-wood substrate is performed in the same manner as the position control of the first flexible substrate, the description will be made with reference to the second flexible substrate for the sake of convenience. The second flexible substrate 200 does not need to be provided with a tracer 270 for edge position control. The position detecting sensor 280 can detect the position of the second flexible substrate 200 with reference to the line tracker 27 when the second flexible substrate 2 is provided with the tracer 27A. On the other hand, when the second flexible substrate 2 is not provided with the line tracer 270, the position measurement and adjustment of the edge plane of the second flexible substrate can be referred to. The position detecting sensor 28 can be an ultrasonic sensor or a UV sensor. The above-described through hole (Fig. 4) can be used as a line tracking state or a separate line tracker can be formed on the second flexible substrate. Progressively 'second flexible base & 2. . The position is detected by the position detecting sensor and the mesh guide Γ isolators 2〇6 (see Fig. 2) perform position control of the second flexible substrate 200 based on the detection result. Fig. 6 is a plan view showing the position of an alignment mark when a flexible substrate is manufactured in a roll-to-roll type. Referring to FIG. 6, the upper 17 201219890 substrate 150, 152 having a color filter or the like is sequentially formed on the first flexible substrate (10), the surface (lower surface) by the above-described manufacturing process, and is on the second flexible substrate 2 Lower substrates 250, 252 are sequentially formed on the upper surface. Then, two or more alignment marks 160, 162, 260, 262 for aligning the upper substrate 150, 152 and the lower substrate 250, 252 are on each of the upper substrate (in the upper substrate processing region) and the lower substrate ( Formed on the edge of the lower substrate processing region). Preferably, four alignment marks are formed on the edges of each of the upper and lower substrates. As used herein, the term "upper substrate" is meant to include the upper substrate processing region and is mounted to the substrate during assembly. The term "lower substrate" means including the lower substrate processing: the domain and is mounted to the upper substrate during assembly. Sheet. According to this embodiment, in the roll-to-roll method of continuously supplying the first flexible substrate 1 and the second flexible substrate 200, the alignment of adjacent upper substrates is marked. When the distance D1 between the distances D1 is at the distance D2 between the alignment marks of the adjacent lower substrates, the alignment error occurring in the assembly process adversely affects all the subsequent panels, that is, the rear upper substrate and the lower substrate, resulting in Processing costs have increased significantly. In the case of normal alignment, after assembling the substrates 5 and the lower substrate (4) which are aligned with each other, the rear plate 152 and the lower substrate 252 are aligned for the rear. The distance Μ is equal to the distance from the money, and the alignment mark 162 of the open substrate is changed from the first flexible substrate (10) to the right, resulting in the problem of requiring oblique alignment rather than vertical alignment in the visual alignment mode.固马 According to the column of the present invention, a plan view of the assembly process of the roll-to-roll flexible display is described with reference to FIG. 7, through the above-mentioned --...", on the first flexible substrate 1 〇 J phantom surface (lower surface The upper Yiyi-man forms an upper 18 201219890 substrate 150, 152 having a color filter or the like, and sequentially forms lower substrates 250, 252 on the upper surface of the second flexible substrate 2A. Then, on each of the upper substrate and Two or more alignment marks 160, 162, 260, 262 for aligning the upper substrate 15A, 152 and the lower substrate 250, 252 are formed on the edge of the lower substrate. Preferably, on each of the upper substrate and the lower Four alignment marks are formed on the edge of the substrate. In the roll-to-roll method of manufacturing a flexible liquid crystal display according to an embodiment of the present invention, the distance D1 between the alignment marks of adjacent upper substrates 15 〇, 152 and the phase The distance D2 between the alignment marks of the adjacent lower substrates 250, 252 is different. Preferably, D1 is greater than D2. Alternatively, D2 may be greater than M. Field D1 is greater than D2, the first flexible substrate 1 is mounted on the panel and not a ladder is formed at the boundary between the assembled panels The portion C, thereby providing the advantage of eliminating the oblique alignment when aligning the first-up substrate 152 and the second lower substrate 252. Further, when in the first-thin (10) and the first lower substrate 25. When an alignment error occurs in the quasi-middle, all the subsequent panels, that is, the first substrate and the first lower substrate, are affected by the alignment error. Since m is larger than d2, by adjusting the position of the second upper substrate 152, even in the first When the alignment error occurs in the alignment of the upper substrate 150 and the first lower substrate 250, it is also possible to align the second substrate A 4 with the upper substrate 152 and the second lower substrate 252. FIG. 8 is based on Another embodiment of the invention clarifies a schematic view of a step of assembling a wooden display in a roll-to-roll method. Figure 8 shows a case, lco. In this case, adjacent upper substrate 15 152 , 152, 154 alignment rod knows. The distance between the two is greater than the distance between the adjacent lower base 〇 2 5 2 ' 2 5 2, 2 5 4 alignment p 々 J J 3 δ δ 己. In this paper, a wooden substrate of 100 is a book; γ. The surface (lower surface) is formed with the upper 19 201219890 Plates 150, 152, 154, 156, a color filter, an alignment film, and the like are formed on the upper substrate 15A, 152, 154156, and the first flexible substrate 1 is transferred to the assembly unit 300, and the second flexible The lower substrate 250, 252, 254, 256 is sequentially formed on the upper surface of the substrate 2, and the second flexible substrate 200 is transferred to the assembly unit 3. The assembly unit 3 can be a vacuum assembly unit. After the upper substrate 150 and the first lower substrate 250, when the second upper substrate 152 and the lower substrate 252 are assembled to each other, the first upper substrate and the first flexible substrate 1 〇〇 are different due to the difference in distance between the alignment marks The boundary plane between the two upper substrates is deformed. Although the deformed portion of the first flexible substrate 1 允许 is allowed to remain, the cutter 35 〇, the first flexible substrate 使用 is used to prevent problems in the subsequent steps. The inside of the element 300 or the assembly unit 3 can be cut by separate cutting (see Fig. 8 (A)) (see Fig. 8 (B)), so that the cutter 350 can be placed in the assembly unit or with the second flexible substrate. 200-step embodiment exemplified roll-to-roll method FIG. 9 is a further actual surface (lower surface) according to the present invention
中柔性顯示器裝配步驟的方案視圖。 雖然第一柔性基板1 〇 〇的—桐j 20 201219890 _柔性基板1〇〇之前或之 的第一柔性基板100的一 切割第一柔性基板1 〇 〇。切割第 後’在上基板加工區域1〇〇2所在 側，可用機械卡盤或真空卡# 36。來支樓或固定上基板 150,並且在較上基板150的同時，使用靜電卡盤37〇移 動與下基板裝配的上純15。來維持真空下上基板的吸附 狀態。換言之，通過上基板加工區域1()(32所不在的平面， 靜電卡盤370憑藉靜電吸引力固定上基板15〇，移動上基 板150使上基板加工區域1〇〇2面對下基板25〇的上表面， 隨後上基板和下基板彼此對準和裝配。此文中下基板 也可由機械卡盤或真空卡盤38〇來支撐和固定。土 切割器350可安放在裝配單元3〇〇的裏面或者安放在 裝配單S綱的外面（在左側）以在第—柔性基板ι〇〇進 入裝配單A 300之前進行切割。在卷對片式方法中，由於 在裝配前切割包括上基板（或者下基板）@第—柔性基板 (或者第二柔性基板）’因此’在相鄰上基板的對準標記 之間的距離等於相鄰下基板250、252的對準標記之間的距 離的情況下’沒有大的問題。所以，上基板的對準標記之 間的距離可等於或不同於下基板的對準標記之間的距離。 靜電卡盤370固定和移動上基板15〇到下基板25〇的 上表面之上，對準並安裝上基板15〇到下基板25〇上，然 後從上基板150脫離。機械卡盤、真空卡盤或者靜電卡盤 380可放置在第二柔性基板200的下表面，以支撐或固定 第二柔性基板200或下基板250。 21 201219890 同樣地’根據本發明實施例的系統和方法採用卷對卷 式或卷對片式方法製造柔性液晶顯示器，由此顯著提高製 造率。 進一步地’根據本發明實施例的系統和方法，通過引 入對準標記之間距離的調整和切割器，可顯著提高裝配效 率0 雖然在本發明中描述了一些實施例，本領域技術人員 應理：的&，僅僅通過例示的方式給出這些實施例，並且 在不違背本發明的精神和範圍的前提下，可進行各種修 改^:化和變更。本發明的保護範圍僅僅限於所附 利範圍和其等同物。 L圃式簡單說明】 圖1為製造液晶顯示器的傳統方法的流程圖； 圖2為根據本發明的—個實施例的 态的系統的框圖； 狀日日4不 圖3為根據本發明的—個實施例 器的方法的流程圖； w柔性液日日顯示 圖4為根據本發明的— 的方案視圖； &列的傳送柔性基板步驟 圖5(A)、（B)為以卷對 板時例示柔性基板位置控:或者卷對片式製造柔性基 徑制的方案視圖； 的方案視圖； 圖6為以卷對卷式製造 圖； 基板時例示對準標記位置 22 201219890 圖7為根據本發明的一個實施例例示卷對卷式方法 柔性顯示器裝配步驟的方案視圖； 、 圖8(A)、（B)為根據本發明的另一個實施例例示卷對 卷式方法中柔性顯示器裝配步驟的方案視圖；及 圖9為根據本發明的一個實施例例示卷對卷式方法中 柔性顯示器裝配步驟的方案視圖。 【主要元件符號說明】 10 0〜第一柔性基板； 102~第一拆卷機； 10 4〜測力感測器； 106〜網狀導向器； 1〇8~彩色濾光片； 110〜第一取向膜； R100、R102、Rl〇4、R106、R108、R110、R112、R2 00、 R202、R204、R206、R208、R210、R212-輥子； 200〜第二柔性基板； 202〜第二拆卷機； 2 0 4〜測力感測器； 206〜網狀導向器； 2 〇 8〜陣列； 210〜第二取向膜； 1002〜上基板加工區域； 2002〜下基板加工區域； 23 201219890 R1、R2、R3、R4、R5、R6~輥子； 2004〜對準標記； 2006~通孔； 270〜追蹤器； 2 8 0 ~位置檢測感測器； 20 0a〜邊緣平面； 150、152、154、156〜上基板； 250、252、254、256~下基板； 160、162、260、262〜對準標記； 300〜裝配單元； 350~切割器； 360、380~真空卡盤； 370~靜電卡盤。 24A plan view of the assembly steps of the flexible display. Although the first flexible substrate 1 is 切割 桐 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 After the cutting is performed on the side of the upper substrate processing area 1〇〇2, a mechanical chuck or vacuum card #36 can be used. The upper substrate 150 is fixed or fixed, and the upper pure 15 assembled with the lower substrate is moved using the electrostatic chuck 37 while the upper substrate 150 is being attached. To maintain the adsorption state of the upper substrate under vacuum. In other words, by the upper substrate processing region 1 (), the electrostatic chuck 370 fixes the upper substrate 15 by the electrostatic chuck, and moves the upper substrate 150 so that the upper substrate processing region 1〇〇2 faces the lower substrate 25〇. The upper surface, then the upper substrate and the lower substrate are aligned and assembled with each other. The lower substrate can also be supported and fixed by a mechanical chuck or vacuum chuck 38. The soil cutter 350 can be placed inside the assembly unit 3〇〇. Or placed on the outside of the assembly sheet S (on the left side) to cut before the first flexible substrate ι enters the assembly sheet A 300. In the roll-to-sheet method, since the cutting includes the upper substrate (or under the assembly) Substrate) @第一- flexible substrate (or second flexible substrate) 'so 'in the case where the distance between the alignment marks of adjacent upper substrates is equal to the distance between the alignment marks of adjacent lower substrates 250, 252' There is no major problem. Therefore, the distance between the alignment marks of the upper substrate may be equal to or different from the distance between the alignment marks of the lower substrate. The electrostatic chuck 370 fixes and moves the upper substrate 15 to the lower substrate 25Above the upper surface, the upper substrate 15 is aligned and mounted onto the lower substrate 25, and then detached from the upper substrate 150. A mechanical chuck, a vacuum chuck or an electrostatic chuck 380 may be placed on the lower surface of the second flexible substrate 200. To support or secure the second flexible substrate 200 or the lower substrate 250. 21 201219890 Similarly, the system and method according to embodiments of the present invention manufactures a flexible liquid crystal display using a roll-to-roll or roll-to-roll method, thereby significantly improving manufacturing. Further, 'systems and methods in accordance with embodiments of the present invention can significantly improve assembly efficiency by introducing adjustments of the distance between alignment marks and cutters. Although some embodiments are described in the present invention, those skilled in the art will recognize The present invention is given by way of example only, and various modifications and changes can be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The present invention is a flowchart of a conventional method for manufacturing a liquid crystal display. FIG. 2 is a diagram of a conventional method for manufacturing a liquid crystal display. A block diagram of a system of an embodiment; a day 4 is not a flowchart of a method of an embodiment according to the present invention; w a flexible liquid day display 4 is a plan view according to the present invention FIG. 5(A), (B) is a plan view showing a flexible substrate position control when rolling-to-plate: or a roll-to-sheet manufacturing flexible base diameter; FIG. 6 FIG. 7 is a plan view illustrating a step of assembling a flexible display of a roll-to-roll method according to an embodiment of the present invention; FIG. 8(A), (FIG. 7 is a view showing an alignment mark position on a substrate; B) is a plan view illustrating a flexible display assembly step in a roll-to-roll method according to another embodiment of the present invention; and FIG. 9 is a diagram illustrating a flexible display assembly step in a roll-to-roll method according to an embodiment of the present invention. view. [Main component symbol description] 10 0~first flexible substrate; 102~first unwinder; 10 4~force sensor; 106~mesh guide; 1〇8~color filter; 110~ An oriented film; R100, R102, R10, R106, R108, R110, R112, R2 00, R202, R204, R206, R208, R210, R212-roller; 200~ second flexible substrate; 202~ second unwinding 2 0 4 ~ force sensor; 206 ~ mesh guide; 2 〇 8 ~ array; 210 ~ second orientation film; 1002 ~ upper substrate processing area; 2002 ~ lower substrate processing area; 23 201219890 R1 R2, R3, R4, R5, R6~roller; 2004~ alignment mark; 2006~through hole; 270~ tracker; 2 8 0 ~ position detection sensor; 20 0a~ edge plane; 150, 152, 154, 156~ upper substrate; 250, 252, 254, 256~ lower substrate; 160, 162, 260, 262~ alignment mark; 300~ assembly unit; 350~ cutter; 360, 380~ vacuum chuck; 370~ electrostatic card plate. twenty four