201213084 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是有關於一種均壓成型方法及其系統，特別是有 關於一種具有以液體做為壓力傳遞媒介之均壓成型方法 及其系統。 【先前技術】 [0002] 習知的熱壓成型係將壓印物放置於一壓印模具的模腔内 ’壓印模具包含一組上下模板’此上下模板各具一有壓 印花紋的壓印面，將壓印物置於上下模板具有壓印花紋 〇 的面之間後閉合此壓印模具，此時上下模板會形成一個 封閉模腔，而壓印物即存在此封閉模腔内。舉印模具閉 合後，壓印模具會加熱使壓印物軟化至可塑狀態，再由 壓印模具施壓於壓印物，使上下模板—的壓印花紋於壓印 物上成型，最後再加以冷卻壓印物，壓印模具打開後取 出成型品。 [0003] 習知的加壓裝置係以油壓、氣壓或其他驅動器作為輸出 Ο 壓力的來源，配合曲轴或軸直接連結壓印模具施壓於模 板。與傳遞壓力的軸相比，模板為大面積的平面，所以 轴所傳遞於模板的壓力可視作點施壓，故不易使模板達 到全面的受壓，因此透過模板受壓的壓印物，其受到的 Μ力亦不均勻，所以壓印成品的良率不容易提升，且壓 印成品的尺寸僅能成型小尺寸製品。後續另有多轴施壓 的加塵裝置出現以及使用矽膠板作缓衝材，其效果僅有 些許改善。 [0004]習知的加熱裝置係於上下模板或是壓印模具上鑽孔設置 099132261 表單編號Α0101 第5頁/共22頁 0992056461-0 201213084 水路，再通以熱液體或是冷液體加熱或冷卻壓印物；或 是熱管以及水路交叉配置，熱管用於加熱壓印物，再另 通以冷液體於水路冷卻壓印物。上述的習知加熱方式， 皆要先加熱壓印模具本體後，再經由熱傳導將熱能傳至 壓印物。此種方式熱能的傳遞容易因為壓印模具的大小 、加熱管或是水路埋設的位置以及壓印物的尺寸等原因 ，而形成傳遞不等速，進而出現壓印物軟化不平均的現 象，因此壓印成品的良率不容易提升。 【發明内容】 [0005] 有鑑於上述習知技藝之問題，本發明之目的就是在提供 一種均壓成型裝置，以解決壓印物受壓以及受熱不均， 良率無法提升的問題。 , [0006] 根據本發明之目的，提出一種均壓成型系統。均壓成型 系統包含一均壓成型裝置、一溫度控制裝置以及一壓力 裝置。其中，均壓成型裝置包含一第一腔體以及一第二 腔體。第一腔體以及第二腔體各包含一第一開口以及一 第二開口。第二腔體係設置於面對第一開口之位置，且 第二開口設置於第二腔體面對第一開口的一面上。第一 腔體以及第二腔體各別以一第一導熱膜片以及一第二導 熱膜片密封第一開口以及第二開口，並個別於第一腔體 以及第二腔體内形成一第一密閉壓力腔以及一第二密閉 壓力腔。一第一模板以及一第二模板係分別設置於第一 導熱膜片以及第二導熱膜片上，且一壓印物擺放於第一 模板上，介於第一模板與第二模板之間。當第一腔體以 及第二腔體閉合時，於第一模板與第二模板之間形成一 099132261 表單編號A0101 第6頁/共22頁 0992056461-0 201213084 容置空間，此容置空間内置有壓印物。壓力裝置包含一 第一驅動單元以及一第二驅動單元。第一驅動單元係透 過分別設置於第一密閉壓力腔以及第二密閉壓力腔周圍 的一第一液體出入口以及一第二液體出入口，連接第一 密閉壓力腔以及第二密閉壓力腔的内部，進而形成一密 封區，此密封區内充填有工作液體。加壓裝置加壓工作 液體，使工作液體產生一壓力。透過液體等線均壓的特 性，此壓力均勻地透過導熱膜片傳遞至壓印物上。溫度 控制裝置係設置於第一密閉壓力腔以及第二密閉壓力腔 周圍或内部，以調節工作液體的溫度。 [0007] 其中，本發明中之壓力裝置包含一第一驅動單元以及一 第二驅動單元。由第一驅動單元分別透過第一以及第二 液體出入口連結第一以及第二密閉壓力腔，且第二驅動 單元連接第一驅動單元，並驅動第一驅動單元。 [0008] 其中，本發明中之壓力裝置更包含一推力控制模組，此 推力控制模組電性連接第二驅動單元，於控制模組輸入 壓印壓印物所需之力的相對一推力，再由第二驅動單元 提供此推力予第一驅動單元，進而調節密封區容積。 [0009] 其中，本發明中之溫度控制裝置，其包含一溫度傳遞單 元、一冷液體槽、一熱液體槽以及一溫度控制模組。溫 度傳遞單元設置於密閉壓力腔内部或是其周圍，透過溫 度傳遞單元内部流動液體的溫度不同，進而改變密閉壓 力腔内部的工作液體溫度。溫度傳遞單元透過溫度控制 模組連接冷液體槽以及熱液體槽，容置於冷液體槽以及 熱液體槽内的冷、熱液體，經過溫度控制模組的再加溫 099132261 表單編號A0101 第7頁/共22頁 0992056461-0 201213084 或是再冷卻後，進入溫度傳遞單元内部。 [0010] 其中，本發明更包含一真空單元，係透過一真空管線連 接容置空間。此真空單元於均壓成型裝置閉合後抽取容 置空間内之空氣。 [0011] 根據本發明之目的，提出一種均壓成型方法，其適用於 一均壓成型系統，此均壓成型系統包含一均壓成型裝置 、一溫度控制裝置以及一壓力裝置。此均壓成型方法之 步驟為：連接一壓力裝置與一均壓成型裝置以形成一密封 區，再於密封區内充填一工作液體，接著放置一壓印物 於均壓成型裝置内，藉由溫度控制裝置調節工作液體溫 度，進而提升壓印物溫度，並軟化壓印物，透過壓力裝 置使工作液體產生一壓力，壓力透過導熱膜片施予壓印 物，使壓印物於均壓成型裝置内成型。 [0012] 其中，本發明之均壓成型方法，其所述之均壓成型裝置 包含一第一腔體以及一第二腔體。第一腔體以及第二腔 體各包含一第一開口以及一第二開口。第二腔體係設置 於面對第一開口之位置，且第二開口設置於第二腔體面 對第一開口的一面上。第一腔體以及第二腔體各別以一 第一導熱膜片以及一第二導熱膜片密封第一開口以及第 二開口，並個別於第一腔體以及第二腔體内形成一第一 密閉壓力腔以及一第二密閉壓力腔。一第一模板以及一 第二模板係分別設置於第一導熱膜片以及第二導熱膜片 上，且一壓印物擺放於第一模板上，介於第一模板與第 二模板之間。 099132261 表單編號A0101 第8頁/共22頁 0992056461-0 201213084 [0013] 其中，本發明之均壓成型方法，其所述之壓力裝置包含 一第一驅動單元以及一第二驅動單元。第一驅動單元係 連接第二驅動單元。且第一驅動單元透過第一液體出入 口以及第二液體出入口，連接第一密閉壓力腔以及第二 密閉壓力腔，進而形成密封區。 [0014] 其中，本發明之均壓成型方法，於第一腔體與第二腔體 閉合時，更包含一抽取容置空間空氣，使容置空間内真 空化之步驟。 0 [0015] 承上所述，依本發明之均壓成型方法及其系統，其可具 有一或多個下述優點： [0016] (1)此均壓成型裝置以及系統，因使用熱液體作為熱源 ，且作為介質的導熱膜片非常薄，故可均勻傳熱，使壓 印物均勻受熱。 [0017] (2)此均壓成型裝置以及系統，因使用高壓液體作為施 壓源，受液體分子等力分布的影響，可使壓印物均勻受 壓。 [0018] (3)此均壓成型裝置以及系統，因使用高壓液體作為施 壓源，受液體分子等力分布的影響，壓印物尺寸不受限 制。 【實施方式】 [0019] 請參閱第1圖，其係為本發明之均壓成型系統第一實施例 之示意圖。圖中，均壓成型系統1包含均壓成型裝置2、 溫度控制裝置3以及壓力裝置4。 099132261 均壓成型裝置2包含一第一腔體20、一第一模板22以及一 表單編號A0101 第9頁/共22頁 0992056461-0 [0020] 201213084 第二模板23。第一腔體20設置於一模具機台5的一側，第 一腔體20具有一第一開口 201。於第一腔體201内低於第 一開口 201之處，設置有一第一導熱膜片24，此第一導熱 膜片24封閉第一腔體20形成第一密閉壓力腔21。一第一 液體出入口 25被設置於第一密閉壓力腔21周圍之任一處 。第一模板22設置於第一導熱膜片24上，第二模板23設 置於模具機台5的另一侧。一壓印物7放置於第一模板22 上，當模具機台5關閉時，帶動均壓裝置2閉合，並於放 置壓印物7之處，由閉合的第一模板22以及第二模板23形 成一容置空間26。 [0021] 溫度控制裝置3用以提供均壓成型裝置2進行壓印製程時 所需的溫度。溫度控制裝置3包含一溫度傳遞單元31、一 溫度控制模組32、一冷液體槽33以及一熱液體槽34。溫 度傳遞單元31設置於靠近密閉壓力腔21之處，或是直接 設置於密閉壓力腔21内部，用以加熱、冷卻或是維持工 作液體211的溫度。工作液體211透過導熱膜片24以及第 一模板22傳遞熱量，使壓印物7軟化。於此，溫度傳遞單 元31的具體形式可為盤管、直管之任何形狀的管體，或 是直接於腔體2 0穿孔形成之水路或是另於密閉壓力腔21 外部連接具有水路之塊體等，任何可於工作液體211與溫 度傳遞單元31間之形成熱量傳遞的的具體形式。流動於 溫度傳遞單元31的液體溫度係由溫度控制模組32控制。 溫度控制模組32設置於溫度傳遞單元31以及冷液體槽33 與熱液體槽34之間。容置於冷液體槽33以及熱液體槽34 内之冷、熱液體在進入溫度傳遞單元31前，需先由溫度 099132261 表單編號A0101 第10頁/共22頁 0992056461-0 201213084 控制模組32進行加熱或冷卻，直至當下均壓成型裝置2執 行壓印工作時所需之溫度。 [0022] Ο201213084 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a pressure forming method and system thereof, and more particularly to a pressure forming method having a liquid as a pressure transmitting medium and system. [Prior Art] [0002] Conventional hot press molding places an imprint in a cavity of an imprint mold. The imprint mold includes a set of upper and lower templates. The upper and lower templates each have a pressure of an imprint pattern. In the printing surface, the embossing material is placed between the upper and lower stencils having the embossed enamel surface, and then the embossing dies are closed. At this time, the upper and lower stencils form a closed cavity, and the embossed material is present in the closed cavity. After the printing mold is closed, the embossing mold is heated to soften the embossed material to a plastic state, and then the embossing mold presses the embossing material, so that the embossing pattern of the upper and lower stencils is formed on the embossed material, and finally, The embossed material is cooled, and the molded product is taken out after the embossing mold is opened. [0003] Conventional pressurizing devices use hydraulic pressure, air pressure or other actuators as a source of output Ο pressure, and are coupled to the stencil by means of a crankshaft or shaft directly coupled to the embossing die. Compared with the shaft that transmits pressure, the template is a large-area plane, so the pressure transmitted by the shaft to the template can be regarded as a point of pressure, so that it is difficult to make the template fully pressurized, so the embossed material pressed through the template is The strength of the embossed product is not uniform, so the yield of the embossed product is not easy to increase, and the size of the embossed product can only form a small-sized product. Subsequent addition of a multi-axis pressurized dusting device and the use of a silicone sheet as a cushioning material have only slightly improved. [0004] The conventional heating device is set on the upper and lower template or the imprinting mold. 099132261 Form No. Α0101 Page 5 / Total 22 0992056461-0 201213084 Waterway, then heated or cooled by hot liquid or cold liquid The embossed material; or the heat pipe and the water path cross-distribution, the heat pipe is used to heat the embossed material, and the embossed material is cooled by the cold liquid in the water path. In the above conventional heating method, heat is applied to the body of the stamping body, and heat energy is transferred to the stamping material via heat conduction. In this way, the transfer of thermal energy is likely to be caused by the size of the imprinting mold, the position of the heating pipe or the waterway embedding, and the size of the imprinted material, etc., so that the transfer is not uniform, and the embossing is softened unevenly. The yield of the imprinted product is not easy to increase. SUMMARY OF THE INVENTION [0005] In view of the above-described problems of the prior art, it is an object of the present invention to provide a pressure equalizing device for solving the problem that the embossing material is subjected to pressure and uneven heating, and the yield cannot be improved. According to an object of the present invention, a pressure equalization molding system is proposed. The pressure forming system includes a pressure equalizing device, a temperature control device, and a pressure device. Wherein, the pressure equalizing device comprises a first cavity and a second cavity. The first cavity and the second cavity each include a first opening and a second opening. The second cavity system is disposed at a position facing the first opening, and the second opening is disposed on a side of the second cavity facing the first opening. The first cavity and the second cavity respectively seal the first opening and the second opening with a first heat conductive film and a second heat conductive film, and form a first part in the first cavity and the second cavity a closed pressure chamber and a second closed pressure chamber. A first template and a second template are respectively disposed on the first heat conductive film and the second heat conductive film, and an embossed object is placed on the first template between the first template and the second template . When the first cavity and the second cavity are closed, a 099132261 form number A0101 page 6 / 22 pages 0992056461-0 201213084 is formed between the first template and the second template, and the housing space is built in Imprinted. The pressure device includes a first drive unit and a second drive unit. The first driving unit is connected to the first sealed pressure chamber and the second sealed pressure chamber through a first liquid inlet and outlet and a second liquid inlet and outlet respectively disposed around the first sealed pressure chamber and the second sealed pressure chamber, and further A sealing zone is formed which is filled with working fluid. The pressurizing device pressurizes the working liquid to generate a pressure to the working fluid. Through the uniformity of the liquid equalizing line, the pressure is uniformly transmitted to the embossed material through the thermal conductive film. The temperature control device is disposed around or inside the first closed pressure chamber and the second closed pressure chamber to adjust the temperature of the working fluid. [0007] wherein the pressure device of the present invention comprises a first driving unit and a second driving unit. The first driving unit is coupled to the first and second sealed pressure chambers through the first and second liquid inlets and outlets, respectively, and the second driving unit is coupled to the first driving unit and drives the first driving unit. [0008] wherein the pressure device of the present invention further includes a thrust control module, the thrust control module is electrically connected to the second driving unit, and the relative force of the force required to input the stamping impression on the control module is Then, the second driving unit provides the thrust to the first driving unit, thereby adjusting the sealing area volume. [0009] wherein the temperature control device of the present invention comprises a temperature transfer unit, a cold liquid tank, a hot liquid tank and a temperature control module. The temperature transfer unit is disposed inside or around the closed pressure chamber, and the temperature of the flowing liquid inside the temperature transfer unit is different, thereby changing the temperature of the working liquid inside the sealed pressure chamber. The temperature transfer unit is connected to the cold liquid tank and the hot liquid tank through the temperature control module, and the cold and hot liquid accommodated in the cold liquid tank and the hot liquid tank is reheated by the temperature control module. 099132261 Form No. A0101 Page 7 / Total 22 pages 0992056461-0 201213084 Or after cooling, enter the inside of the temperature transfer unit. [0010] Wherein, the present invention further comprises a vacuum unit connected to the accommodating space through a vacuum line. The vacuum unit extracts air in the accommodating space after the pressure equalizing device is closed. [0011] In accordance with the purpose of the present invention, a pressure equalization molding method is proposed which is suitable for use in a pressure equalization molding system comprising a pressure equalization molding apparatus, a temperature control apparatus, and a pressure apparatus. The step of the pressure equalization molding method is: connecting a pressure device and a pressure equalization device to form a sealing zone, filling a sealing liquid in the sealing zone, and then placing an embossing material in the pressure equalizing device; The temperature control device adjusts the temperature of the working liquid, thereby increasing the temperature of the embossing material, and softening the embossed material, and generating a pressure through the pressure device to apply pressure to the working liquid, and the pressure is applied to the embossing material through the thermal conductive film to make the embossed material in the pressure forming manner. Forming inside the device. [0012] wherein, in the pressure equalization molding method of the present invention, the pressure equalization molding apparatus comprises a first cavity and a second cavity. The first cavity and the second cavity each include a first opening and a second opening. The second cavity system is disposed at a position facing the first opening, and the second opening is disposed on a side of the second cavity facing the first opening. The first cavity and the second cavity respectively seal the first opening and the second opening with a first heat conductive film and a second heat conductive film, and form a first part in the first cavity and the second cavity a closed pressure chamber and a second closed pressure chamber. A first template and a second template are respectively disposed on the first heat conductive film and the second heat conductive film, and an embossed object is placed on the first template between the first template and the second template . 099132261 Form No. A0101 Page 8 of 22 0992056461-0 201213084 [0013] wherein the pressure equalizing method of the present invention comprises a first driving unit and a second driving unit. The first drive unit is coupled to the second drive unit. And the first driving unit is connected to the first sealed pressure chamber and the second sealed pressure chamber through the first liquid inlet and outlet and the second liquid inlet and outlet to form a sealing region. [0014] Wherein, the pressure equalization molding method of the present invention further comprises the step of extracting the accommodating space air to make the accommodating space be vacuumized when the first cavity and the second cavity are closed. [0015] As described above, the pressure forming method and system thereof according to the present invention may have one or more of the following advantages: [0016] (1) The pressure equalizing device and system, due to the use of hot liquid As a heat source, and the heat conductive film as a medium is very thin, uniform heat transfer can be performed to uniformly heat the embossed material. [0017] (2) The pressure equalizing apparatus and system use a high-pressure liquid as a pressure source, and are uniformly pressed by the force distribution of liquid molecules. [0018] (3) The pressure equalizing device and system are not limited by the use of a high-pressure liquid as a pressure source due to the force distribution of liquid molecules or the like. [Embodiment] [0019] Referring to Figure 1, there is shown a schematic view of a first embodiment of a pressure equalization system of the present invention. In the figure, the pressure equalization molding system 1 includes a pressure equalizing device 2, a temperature control device 3, and a pressure device 4. 099132261 The pressure forming device 2 comprises a first cavity 20, a first template 22 and a form number A0101. Page 9 of 22 0992056461-0 [0020] 201213084 Second template 23. The first cavity 20 is disposed on one side of a mold machine 5, and the first cavity 20 has a first opening 201. A first thermally conductive diaphragm 24 is disposed in the first cavity 201 below the first opening 201. The first thermally conductive diaphragm 24 encloses the first cavity 20 to form a first sealed pressure chamber 21. A first liquid inlet and outlet 25 is provided at any point around the first closed pressure chamber 21. The first template 22 is disposed on the first thermally conductive diaphragm 24, and the second template 23 is disposed on the other side of the molding machine 5. An embossed material 7 is placed on the first template 22, and when the mold machine 5 is closed, the pressure equalizing device 2 is driven to close, and where the embossed material 7 is placed, the closed first template 22 and the second template 23 are closed. An accommodation space 26 is formed. [0021] The temperature control device 3 is used to provide the temperature required for the pressure forming device 2 to perform an imprint process. The temperature control device 3 includes a temperature transfer unit 31, a temperature control module 32, a cold liquid tank 33, and a hot liquid tank 34. The temperature transfer unit 31 is disposed near the closed pressure chamber 21 or directly inside the closed pressure chamber 21 for heating, cooling or maintaining the temperature of the working fluid 211. The working liquid 211 transfers heat through the heat conductive film 24 and the first template 22 to soften the embossed material 7. Here, the specific form of the temperature transfer unit 31 may be a tube of any shape of a coil or a straight tube, or a water path formed directly by the perforation of the cavity 20 or a block connected to the outside of the closed pressure chamber 21 with a water path. Body, any specific form of heat transfer between the working fluid 211 and the temperature transfer unit 31. The temperature of the liquid flowing through the temperature transfer unit 31 is controlled by the temperature control module 32. The temperature control module 32 is disposed between the temperature transfer unit 31 and the cold liquid tank 33 and the hot liquid tank 34. The cold and hot liquid contained in the cold liquid tank 33 and the hot liquid tank 34 before entering the temperature transfer unit 31 must first be controlled by the temperature module 099132261 Form No. A0101 Page 10 / Total 22 Page 0992056461-0 201213084 Heating or cooling until the temperature required for the embossing operation is performed by the current pressure forming device 2. [0022] Ο
G 壓力裝置4包含一第一驅動單元41以及一第二驅動單元42 。第一驅動單元41透過第一液體出入口 25連接第一密閉 壓力腔21，形成一密封區43，此密封區43之容積將依據 第一驅動單元41的往復運轉而有所改變。當第一驅動單 元41運作而使密封區43之容積壓縮變小，進而使工作液 體211具有液壓時，即為均壓成型系統1的充壓狀態。在 充壓狀態下，第一導熱膜片24受壓被推擠而彈性變形， 進而施壓於壓印物7。當第一驅動單元41運作而使密封區 43之容積回復或拉伸變大，直至工作液體211不具液壓時 ，即為均壓成型系統1之洩壓狀態。在洩壓狀態下，第一 導熱膜片24回復原來外型，並卸載施加於壓印物7之壓力 。當第一驅動單元41運作至定點，且使密封區43之容積 壓縮變小，並使工作液體211具有穩定的液壓時，即為均 壓成型系統1的保壓狀態。在保壓狀態下，第一導熱膜片 24受工作液體211之壓力維持彈性變形，並透過第一模板 22施均勻定壓於壓印物7。工作液體211的使用量，最佳 為填滿第一驅動單元41處於機械原點狀態時所形成的密 封區43，藉由密封區43容積的改變，工作液體211隨之具 有相對當下密封區43容積的液壓。 [0023] 壓力裝置4更包含一推力控制單元44，推力控制單元44電 性連接第二驅動單元42，用以輸入壓印壓印物7所需壓力 之相對的推力，並由第二驅動單元42輸出此推力。於本 實施例中，第一驅動單元41為可變容積之液壓缸，第二 099132261 表單編號A0101 第11頁/共22頁 0992056461-0 201213084 驅動單元42為大直徑之氣壓缸，利用氣壓的比例控制技 術，作為第二驅動單元42之氣壓缸可提供任意的推力予 作為第一驅動單元41之液壓缸，此推力用以改變液壓缸 之容積，進而改變密封區43之容積，使工作液體211具有 相對當下密封區43容積的液壓。於此所述之分段式的加 壓工作液體之方式僅為較佳實施例，實際施行時不限於 此，使工作液體31具有加壓裝置另可使用加壓幫浦或是 以其他加壓系統取代之。 [0024] 因工作液體211僅設置於密封區43間，故當工作液體211 加溫後，其溫度不會對第二驅動單元42產生影響，使第 二驅動單元42能穩定提供推力以作為壓印壓印物7的壓力 來源。此壓力裝置4值得再提的是，當進入洩壓狀態時， 密封區43實際呈現一種負壓狀態，在此狀態下可維持導 熱膜片24不被重力拉扯而垂落。 [0025] 本發明之均壓成型系統進一步可包含一真空單元6。真空 單元6藉由一真空管線61連結容置空間26，真空單元6於 模具機台5閉合後，抽取容置空間26内之空氣，使容置空 間26内呈現真空狀態。 [0026] 請參閱第2圖，其係為本發明之均壓成型系統第二實施例 之示意圖。此第二實施例與第一實施例不同之處在於均 壓成型裝置2的結構。其不同點在於，均壓成型裝置2更 可包含一第二腔體80，第二腔體80設置於模具機台5，面 對第一開口 201之另一側。第二腔體80上，面對第一開口 201之一面上，具有一第二開口 81。在第二腔體内，低於 第二開口 81之位置，設置有一第二導熱膜片82。此第二 099132261 表單編號A0101 第i2頁/共22頁 0992056461-0 201213084 導熱膜片82密封腔體80形成1二密閉壓力腔83。—第 二液體出人口84被設置於密閉髮力腔83周圍之任_處， 第二模板23由模具機台5的另1更改為設置於第Γ導執 膜片82上。且一第二溫度傳遞單元35設置於第二密閉壓 力腔83的内部或其關。第-叫單元4ι透過第—液體 出入口 25連接第一密閉壓力腔2i，鬥吐 ，冋時亦透過第二液體 出入口84連接第二密閉壓力腔82， 乙’形成密封區43，同時 密封區43内充填有工作液體2li。、μ 其餘部分皆與第一實施 例相同，於此不再贅述。The G pressure device 4 includes a first drive unit 41 and a second drive unit 42. The first driving unit 41 is connected to the first sealed pressure chamber 21 through the first liquid inlet and outlet port 25 to form a sealing portion 43. The volume of the sealing portion 43 will be changed according to the reciprocating operation of the first driving unit 41. When the first driving unit 41 operates to reduce the volume compression of the sealing portion 43, and the working fluid 211 has hydraulic pressure, it is the state of pressure of the pressure equalizing molding system 1. In the pressurized state, the first heat-conductive diaphragm 24 is pressed and elastically deformed by pressing, and is then pressed against the embossed material 7. When the first driving unit 41 operates to increase or decrease the volume of the sealing portion 43 until the working fluid 211 does not have hydraulic pressure, it is the pressure relief state of the pressure forming system 1. In the pressure relief state, the first thermally conductive diaphragm 24 returns to its original shape and unloads the pressure applied to the imprint 7. When the first driving unit 41 is operated to a fixed point and the volume compression of the sealing portion 43 is made small, and the working fluid 211 has a stable hydraulic pressure, it is the pressure holding state of the pressure forming system 1. In the pressure holding state, the first heat conductive film 24 is elastically deformed by the pressure of the working liquid 211, and is uniformly pressed against the embossed material 7 through the first die plate 22. The working fluid 211 is preferably used to fill the sealing zone 43 formed when the first driving unit 41 is in the mechanical origin state. By changing the volume of the sealing zone 43, the working fluid 211 has a relatively lower sealing zone 43 accordingly. Volumetric hydraulic pressure. [0023] The pressure device 4 further includes a thrust control unit 44. The thrust control unit 44 is electrically connected to the second driving unit 42 for inputting the relative thrust of the pressure required to imprint the stamp 7, and is driven by the second driving unit. 42 outputs this thrust. In the embodiment, the first driving unit 41 is a variable-volume hydraulic cylinder, and the second 099132261 is a form number A0101. Page 11/22 pages 0992056461-0 201213084 The driving unit 42 is a large-diameter pneumatic cylinder, and the ratio of the air pressure is utilized. The control technology, as the pneumatic cylinder of the second driving unit 42, can provide any thrust to the hydraulic cylinder as the first driving unit 41, the thrust is used to change the volume of the hydraulic cylinder, thereby changing the volume of the sealing zone 43, so that the working fluid 211 There is a hydraulic pressure relative to the volume of the current sealing zone 43. The manner of the segmented pressurized working fluid described herein is only a preferred embodiment, and the actual application is not limited thereto, so that the working fluid 31 has a pressurizing device, and a pressurized pump or other pressurizing may be used. The system replaces it. [0024] Since the working liquid 211 is only disposed between the sealing regions 43, when the working liquid 211 is warmed, its temperature does not affect the second driving unit 42, so that the second driving unit 42 can stably provide the thrust as a pressure. The source of pressure for the imprint 7 . It is worth mentioning that the pressure device 4, when entering the pressure relief state, actually exhibits a negative pressure state in which the heat transfer film 24 can be kept from being pulled by gravity. [0025] The pressure equalization system of the present invention may further comprise a vacuum unit 6. The vacuum unit 6 is connected to the accommodating space 26 by a vacuum line 61. After the vacuum unit 6 is closed, the air in the accommodating space 26 is extracted, so that the accommodating space 26 is in a vacuum state. Please refer to Fig. 2, which is a schematic view of a second embodiment of a pressure equalization system of the present invention. This second embodiment differs from the first embodiment in the structure of the pressure forming device 2. The difference is that the pressure equalizing device 2 further includes a second cavity 80 disposed on the mold table 5 facing the other side of the first opening 201. The second cavity 80 has a second opening 81 facing one side of the first opening 201. A second thermally conductive diaphragm 82 is disposed in the second chamber below the second opening 81. This second 099132261 Form No. A0101 Page i2 / Total 22 pages 0992056461-0 201213084 The thermally conductive diaphragm 82 seals the cavity 80 to form a two closed pressure chamber 83. The second liquid out-of-population 84 is disposed at any position around the sealed force chamber 83, and the second template 23 is changed from the other one of the mold stages 5 to the second guide film 82. And a second temperature transfer unit 35 is disposed inside or closed of the second sealed pressure chamber 83. The first calling unit 4 is connected to the first closed pressure chamber 2i through the first liquid inlet and outlet 25, and is connected to the second closed pressure chamber 82 through the second liquid inlet and outlet 84, and forms a sealing portion 43 while the sealing portion 43 is formed. The inside is filled with working liquid 2li. The rest of μ is the same as that of the first embodiment, and will not be described again.
[0027] Ο [0028] [0029] [0030] [0031] [0032] 099132261 壓印的製程係由置入壓印物7、閉 闲合均壓成型裝置2、系 統進入充壓狀態、軟化壓印物7、么" 系統進入保壓狀態、冷 卻壓印物7、系統進入洩壓狀態， 最後打開均壓成型裝置 2取出完成壓印之壓印物7，等鞀皮> — 寸《序依序完成。本發明之 均壓成型系統的均壓成型裝置2、溫度控制裝置3以及壓 力裝置4，係以上述制的連結_^設置，並於各個程 序中發揮其功用，藉由嶄新的巧田 一一克服了各個製程 的程序中可能造成工件成品缺憾的問題。 請參閱第3圖，其係為本發明之均壓成型方法之流程圖。 均壓成型方法係包含以下步驟： S100:連接壓力裝置與均壓成型裝置形成密封區； S101:透過溫度控制裝置調節工作液體溫度，進而提升 壓印物溫度，並軟化壓印物； S102:驅動壓力裝置使工作液體產生愿力； ’使壓印物於均壓成 0992056461-0 S103:壓力透過導熱膜片施予壓印物 表單煸號A0101 第13頁/共22頁 201213084 型裝置内成型。 [0033] 本發明藉由工作液體來作為壓力傳遞的媒介，透過液體 等線均壓均溫的特性，平均施壓於導熱膜片，進而達到 壓印物均壓均溫，提升壓印物成品品質之效果。 [0034] 於上述均壓成型方法中，亦能進一步包含一取該容置空 間内空氣，使該容置空間真空化之步驟。在閉合均壓裝 置後，於第一模板以及第二模板間會出現一容置空間， 此容置空間用以容置壓印物。 [0035] 藉由容置空間真空化之步驟的實施，可有效排除滯留於 容置空間内的空氣所造成的壓印物品質缺陷，並能使模 板更能貼合壓印物，完美壓印模板上的花紋於壓印物上 〇 [0036] 以上所述僅為舉例性，而非為限制性者。任何未脫離本 發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 [0037] 第1圖係為本發明之均壓成型系統第一實施例之示意圖； 第2圖係為本發明之均壓成型系統第二實施例之示意圖； 以及 第3圖係為本發明之均壓成型方法之流程圖。 【主要元件符號說明】 [0038] 1 :均壓成型系統； 2 :均壓成型裝置； 20 :第一腔體； 099132261 表單編號A0101 第14頁/共22頁 0992056461-0 201213084 201 :第一開口； 21 :第一密閉壓力腔； 211 :工作液體； 22 :第一模板； 23 :第二模板； 24 :第一導熱膜片； 25 :第一液體出入口； 2 6 :容置空間； 3:溫度控制裝置； 〇 31 :溫度傳遞單元； 32 :溫度控制模組； 33 :冷液體槽； 34 :熱液體槽； 35 :第二溫度傳遞單元； 4:壓力裝置； 41 :第一驅動單元； 42 :第二驅動單元； 〇 43 :密封區； 44 :推力控制單元； 5:模具機台； 6 :真空單元； 61 :真空管線； 7:壓印物； 80 :第二腔體； 81 :第二開口； 82 :第二導熱膜片； 099132261 表單編號 A0101 第 15 頁/共 22 頁 0992056461-0 201213084 83 :第二密閉壓力腔； 84:第二液體出入口；以及 S100~ S103:步驟。 099132261 表單編號A0101 第16頁/共22頁 0992056461-0[0027] [0029] [0032] [0032] 099132261 The process of imprinting is carried out by placing the imprinted material 7, closing the idle pressure equalizing device 2, entering the charging state, softening pressure Printed matter 7, "The system enters the pressure holding state, cools the embossed material 7, the system enters the pressure relief state, and finally opens the pressure equalizing device 2 to take out the embossed embossed material 7, and so on." The order is completed in order. The pressure equalizing device 2, the temperature control device 3, and the pressure device 4 of the pressure equalizing system of the present invention are provided in the above-described system, and are used in each program by the new Qiao Tianyi. It overcomes the problem that the defects of the workpieces may be caused in the process of each process. Please refer to FIG. 3, which is a flow chart of the pressure equalization molding method of the present invention. The pressure forming method comprises the following steps: S100: connecting the pressure device and the pressure equalizing device to form a sealing zone; S101: adjusting the temperature of the working liquid through the temperature control device, thereby increasing the temperature of the embossing material, and softening the embossed material; S102: driving The pressure device causes the working fluid to generate a force; 'The embossing material is uniformly pressed into 0992056461-0 S103: the pressure is transmitted through the thermal conductive film to the embossed form No. A0101, page 13 of 22, 201213084 type device. [0033] The present invention uses the working liquid as a medium for pressure transmission, and uniformly applies pressure to the heat conductive film through the uniformity of the liquid equalizing pressure, thereby achieving the pressure equalization temperature of the embossed material and improving the finished product of the embossed product. The effect of quality. [0034] In the above pressure equalization molding method, the step of taking the air in the accommodation space to vacuum the accommodation space may be further included. After the pressure equalizing device is closed, an accommodating space is formed between the first template and the second template, and the accommodating space is used for accommodating the embossed material. [0035] By the implementation of the step of accommodating the space vacuuming, the defects of the embossing quality caused by the air retained in the accommodating space can be effectively eliminated, and the stencil can be more conformed to the embossed material, and the embossing is perfect. The pattern on the stencil is on the embossing [0036] The above description is by way of example only and not as a limitation. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0037] FIG. 1 is a schematic view showing a first embodiment of a pressure equalization molding system of the present invention; FIG. 2 is a schematic view showing a second embodiment of a pressure equalization molding system of the present invention; The figure is a flow chart of the pressure equalization molding method of the present invention. [Description of main component symbols] [0038] 1 : Pressure forming system; 2: Pressure equalizing device; 20: First cavity; 099132261 Form number A0101 Page 14 of 22 0992056461-0 201213084 201 : First opening 21: first closed pressure chamber; 211: working liquid; 22: first template; 23: second template; 24: first thermal conductive diaphragm; 25: first liquid inlet and outlet; 2 6: accommodation space; Temperature control device; 〇31: temperature transfer unit; 32: temperature control module; 33: cold liquid tank; 34: hot liquid tank; 35: second temperature transfer unit; 4: pressure device; 41: first drive unit; 42: second drive unit; 〇43: sealing zone; 44: thrust control unit; 5: mold machine; 6: vacuum unit; 61: vacuum line; 7: embossed; 80: second cavity; Second opening; 82: second thermal conductive diaphragm; 099132261 Form No. A0101, page 15 of 22 0992056461-0 201213084 83: second closed pressure chamber; 84: second liquid inlet and outlet; and S100~S103: steps. 099132261 Form No. A0101 Page 16 of 22 0992056461-0