TW201212807A - Air jet active heat sink apparatus - Google Patents

Abstract

An apparatus comprising a heat sink and a plenum. The heat sink includes a base and a plurality of heat exchange elements, connected to and raised above, a surface of the base. The plenum is located above the heat exchange elements. The plenum includes a housing configured to hold a positive air-pressure therein, and openings in a surface of the housing. The opening are positioned such that air exiting the plenum through the openings is directed to the heat sink.

Description

201212807 六、發明說明： 【發明所屬之技術領域】 本發明大體而言係針對主動式熱耗散裝置及其製造方 法。201212807 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to an active heat dissipation device and a method of manufacturing the same.

本申請案與Salamon之名為「A HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS」（「Salamon」） 並與本申請案共同讓渡且其全部内容以引用的方式併入本 文中的美國專利申請案第12/835,405號（檔案號第807929 號）有關。 【先前技術】 此章節引入可有助於促進對本發明之更好理解的態樣。 因此’此章節之陳述應以此角度來閱讀。此章節之陳述不 應理解為關於何在先前技術中或何不在先前技術中之承 認。 散熱片通常用以增大電子器件之熱傳遞面積來減小器件 與冷卻介質（例如，空氣）之間的熱阻。然而，存在增長之 趨勢’即電子器件耗散如此多之功率以使得傳統散熱片設 計不足以充分冷卻器件。來自電子器件之改良之熱傳遞效 率將有助於延長此等器件的壽命。 【發明内容】 一實施例係一種包含一散熱片及一充氣部之裝置。該散 熱片包括一基座及連接至該基座之一表面且在該表面上方 升起的複數個熱交換元件。該充氣部定位於該等熱交換元 件上方°該充氣部包括經組態以將一正氣壓保持於其中之 157124.doc 201212807 一外殼及在該外殼之一表面中的開口。該等開口經定位以 使得通過該等開口退出該充氣部之空氣導向至該散熱片。 另一實施例係一種系統，其包含上文所描述之裝置及經 組態以產生熱之一結構，其中該散熱片熱耦接至該結構。 另-實施例係-種製造―裝置之方法1方法包含提供 上文所描述之散熱片及充氣部。該方法亦包含將該充氣部 定位於該等熱交換it件上方，以使得通過該等開σ退出該 充氣部之空氣導向至該散熱片。 【實施方式】 當與隨附圖式一起閱讀時，自卩下實施方式最好地理解 本發明之實施例。為了^更利起見，在提及諸圖中之一些特 徵時’彼等特徵可描述為「垂直的」或「水平的」。此等 描述不限制此等特徵相對於自然水平線或重力之定向。各 種特徵可能未按比麟製，且為了論述清晰起見可任意增 大或減小大小。現參考結合隨附圖式所進行之以下描述。曰 描述及圖式僅說明本發明之原理β因此將瞭解，熟習此 項技術者將能夠設計各種配置，該等配置儘管未在本文中 明確描述或展示，但體現本發明之原理且包括於本發明之 範脅内。此外，本文中所敍述之所有實例主要意欲明白地 僅出於教育目的以幫助讀者理解本發明之原理及由（多個） 發明者所促成的概念來促㈣技術，且應解料不限於此 等特定敍述之實例及條件。此外，敍述本發明之原理、態 樣及實施例’以及本發明之特定實例的在本文中之所有陳 述意欲包含本發明的等效物。另夕卜，如本文中所使用之術 157124.doc 201212807 語「或」指代非排他的或，除非另外指定。又，本文中所 描述之各種實施例不必為相互排斥的，此係因為一些實施 例可與-或多個其他實施例組合以形成新的實施例。 本發明之實施例受益於邊界層沿散熱片之表面展開的辨 識。因此’可阻止自散熱片至周圍空氣之有效熱傳遞，此 係因為自纟該表面處之邊界層中流動的慢空氣與距該表面 較遠之空間中的較快移動冷空氣之熱傳遞之主要手段為熱 擴散。 μ 本文中所描述之實施例藉由增大定位於在散熱片之熱交 換70件之間的通道中之空氣的擾動（或混合）來改良熱傳遞 效率。舉例而言，增大之空氣擾動有助於混合接近熱交換 元件的較熱空氣與在通道之中間的較冷空氣，且藉此改良 熱傳遞。與類似的但無空氣之喷射的散熱片設計相比，藉 由如本文中所描述迫使空氣喷射至散熱片中所達成之空氣 擾動（或混合）的增大咸信為一些狀況能夠改良散熱片之冷 卻因子高達三倍。 本發明之一實施例係裝置。圖1呈現本發明之裝置之實 例實施例的透視圖。圖2Α呈現沿圖1中所展示之視線2-2之 裝置的半透明平面圖《圖2Β至圖2D呈現類似於圖2 Α中所 呈現之視圖的本發明之裝置之替代實施例的平面圖。圖3 A 呈現沿圖1中所展示之視線3-3之裝置的剖視圖。圖38至圖 3C呈現類似於圖3A中所呈現之視圖的本發明之裝置之替 代實施例的剖視圖》 轉至圖1，裝置1〇〇包含散熱片102。散熱片102包括基座 157124.doc • 6 · 201212807 105及連接至基座105之表面120且在表面120上方升起之複 數個熱交換元件110。裝置1〇〇包含定位於熱交換元件 上方之充氣部125。充氣部125包括外殼13〇，外殼130經組 態以將正氣壓保持於其中》開口 135係在外殼13〇之表面 140中》開口 135經定位，以使得通過開口丨3 5而退出充氣 部125之空氣被導向至散熱片1 〇2。在各種實施例中，舉例 而言，流動通過開口 135之空氣可導向至元件11〇或至定位 於元件110之間的通道13 7。 如本文中所使用之術語充氣部指代能夠將空氣（例如， 任何氣體）遞送至該等開口之任何氣體遞送系統。該充氣 «Ρ可包括將空既供應至散熱片之腔室、軟管及管，或可存 在（例如）組態為軟管及管之多個充氣部。 如本文中所使用之術語正氣壓意謂，當裝置1〇〇處於操U.S. Patent Application Serial No. 12, the entire disclosure of which is hereby incorporated by reference in its entirety in its entirety in its entirety in the the the the the the the the the the the the the the the the the the /835,405 (File No. 807929) related. [Prior Art] This section introduces aspects that may help to promote a better understanding of the present invention. Therefore, the statements in this section should be read from this perspective. The statements in this section should not be construed as an admission as to what is in the prior art or what is not in the prior art. The heat sink is typically used to increase the heat transfer area of the electronic device to reduce the thermal resistance between the device and the cooling medium (e.g., air). However, there is a growing trend that electronic devices dissipate so much power that conventional heat sink designs are not sufficient to adequately cool the device. Improved heat transfer efficiency from electronic devices will help extend the life of such devices. SUMMARY OF THE INVENTION An embodiment is an apparatus including a heat sink and an inflator. The heat sink includes a base and a plurality of heat exchange elements attached to a surface of the base and raised above the surface. The plenum is positioned above the heat exchange elements. The plenum includes a housing 157124.doc 201212807 configured to hold a positive air pressure therein and an opening in one of the surfaces of the housing. The openings are positioned such that air exiting the plenum through the openings is directed to the fin. Another embodiment is a system comprising the apparatus described above and a structure configured to generate heat, wherein the heat sink is thermally coupled to the structure. Another embodiment is a method of manufacturing a device comprising providing a heat sink and an inflator as described above. The method also includes positioning the plenum above the heat exchange members such that air exiting the plenum through the σ opens to the heat sink. [Embodiment] The embodiments of the present invention are best understood from the following description when read with the accompanying drawings. For the sake of brevity, when referring to some of the features in the figures, the features may be described as "vertical" or "horizontal". These descriptions do not limit the orientation of such features relative to natural horizontal lines or gravity. The various features may not be comparable and may be arbitrarily increased or decreased for clarity of discussion. Reference is now made to the following description in conjunction with the drawings. The description and drawings are merely illustrative of the principles of the present invention. It will be appreciated that those skilled in the art will be able to devise various configurations which, although not explicitly described or shown herein, Within the scope of the invention. In addition, all of the examples described herein are intended to be illustrative only to facilitate the reader's understanding of the principles of the present invention and the concepts that the inventor(s) have facilitated, and the solution is not limited thereto. Examples and conditions of specific narratives. Furthermore, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples of the invention, are intended to include the equivalents of the invention. In addition, as used herein, 157124.doc 201212807 "or" refers to a non-exclusive or unless otherwise specified. Further, the various embodiments described herein are not necessarily mutually exclusive, as some embodiments may be combined with any other embodiments to form new embodiments. Embodiments of the present invention benefit from the recognition of the boundary layer spreading along the surface of the heat sink. Therefore, 'effective heat transfer from the heat sink to the surrounding air can be prevented because of the heat transfer from the slow moving air flowing in the boundary layer at the surface and the faster moving cold air in the space farther from the surface. The main means is thermal diffusion. μ The embodiments described herein improve heat transfer efficiency by increasing the perturbation (or mixing) of air positioned in the passage between the heat exchange 70 pieces of the heat sink. For example, increased air disturbances help to mix hotter air near the heat exchange element with cooler air in the middle of the passage, and thereby improve heat transfer. The increased air disturbance (or mixing) achieved by forcing air into the heat sink as described herein can improve the heat sink for some conditions compared to a similar but airless jet heat sink design. The cooling factor is up to three times. An embodiment of the invention is an apparatus. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing an embodiment of an apparatus of the present invention. Figure 2A shows a translucent plan view of the apparatus along line of sight 2-2 shown in Figure 1. Figure 2A through Figure 2D show a plan view of an alternative embodiment of the apparatus of the present invention similar to that shown in Figure 2. Figure 3A shows a cross-sectional view of the device along line 3-3 of Figure 1 . 38 through 3C present a cross-sectional view of an alternative embodiment of the apparatus of the present invention similar to the view presented in Fig. 3A. Turning to Fig. 1, apparatus 1 includes a heat sink 102. The heat sink 102 includes a base 157124.doc • 6 · 201212807 105 and a plurality of heat exchange elements 110 coupled to the surface 120 of the base 105 and raised above the surface 120. Apparatus 1A includes an inflator 125 positioned above the heat exchange element. The inflator 125 includes a housing 13 that is configured to retain positive air pressure therein. The opening 135 is in the surface 140 of the housing 13". The opening 135 is positioned such that the inflator 125 exits through the opening 丨 35. The air is directed to the heat sink 1 〇2. In various embodiments, for example, air flowing through opening 135 can be directed to element 11 or to channel 13 7 positioned between elements 110. The term plenum as used herein refers to any gas delivery system capable of delivering air (eg, any gas) to the openings. The charge «Ρ can include chambers, hoses, and tubes that are supplied to the heat sink, or can have, for example, multiple plenums configured as hoses and tubes. The term positive air pressure as used herein means when the device is in operation

性壓力模式。Sexual stress mode.

部（例如，經由一 一或多個管道15〇) 或多個氣流器件145耦接至充氣 道150)以便向外殼130提供正氣 157124.doc 201212807 氣流器件145之一些實施例可為淨正質量通量氣流器 件。亦即，當氣流器件145在操作時，存在淨正質量通量 之空氣自充氣部之外殼130溢出》 此等淨正質量通量器件145之非限制實例實施例可包括 空氣驅動器機構，諸如加壓氣缸、機械壓縮機、隔膜空氣 泵（例如，偏心的、振動的、線性的、旋轉的）、活塞空氣 果或輪葉空氣泵。舉例而言’在一些狀況下，氣流器件 145可包括一或多個空氣壓縮機流泵或壓縮氣缸。 舉例而言，如圖2A中所說明，氣流器件145可包括致動 氣缸220中之薄膜215的活塞210。當器件145***作時，可 (例如）藉由器件之空氣驅動器機構（未圖示）以電磁或機械 方式致動活塞210。 氣流器件145之其他實施例可為淨零質量通量氣流器 件。亦即，當氣流器件145在操作時’存在淨零質量通量 之空氣自充氣部之外殼130溢出。 此等淨零質量通量器件145之非限制實例實施例可包括 耦接至驅動器之壓電元件及耦接至該驅動器之薄膜，以使 得在振盪薄膜時，空氣傳遞至外殼130中。然而，在其他 實施例中，壓電元件可用於正質量通量氣流器件145中。 氣流器件145之一些實施例可經組態以將振盪氣流遞送 至充氣部125 » 舉例而言，在一些狀況下，（諸如）圖2A中所描繪之氣流 器件145可重複地斷開及接通以將振盪氣流遞送至充氣部 125之外殼130。 157124.docPortions (e.g., via one or more conduits 15A) or a plurality of airflow devices 145 coupled to the inflation passages 150) to provide positive air to the outer casing 130 157124.doc 201212807 Some embodiments of the airflow device 145 may be net positive mass passages Air flow device. That is, when the airflow device 145 is in operation, there is a net positive mass flux of air that overflows from the outer casing 130 of the plenum. Non-limiting example embodiments of such net positive mass flux devices 145 may include an air drive mechanism, such as Press cylinders, mechanical compressors, diaphragm air pumps (eg, eccentric, vibrating, linear, rotating), piston air fruit or vane air pumps. For example, in some cases, airflow device 145 can include one or more air compressor flow pumps or compression cylinders. For example, as illustrated in Figure 2A, airflow device 145 can include a piston 210 that actuates film 215 in cylinder 220. When device 145 is operated, piston 210 can be actuated electromagnetically or mechanically, for example, by an air drive mechanism (not shown) of the device. Other embodiments of the airflow device 145 can be a net zero mass flux airflow device. That is, when the airflow device 145 is in operation, the air having a net zero mass flux overflows from the outer casing 130 of the plenum. Non-limiting example embodiments of such net zero mass flux devices 145 can include a piezoelectric element coupled to the driver and a film coupled to the driver such that air is transferred into the housing 130 when the film is oscillated. However, in other embodiments, piezoelectric elements can be used in the positive mass flux gas flow device 145. Some embodiments of the airflow device 145 can be configured to deliver an oscillating airflow to the plenum 125. For example, in some cases, the airflow device 145, such as depicted in Figure 2A, can be repeatedly turned off and on. The oscillating airflow is delivered to the outer casing 130 of the plenum 125. 157124.doc

S 201212807 舉例而言’在一些狀況下，（諸如）圖2B中所描繪之氣流 器件145 ’充氣部125進一步包括位於開口 135中之一或多 者之上的—或多個流閥225。舉例而言，在一些應用中， (諸如）當散熱片102用以冷卻微電子器件時，流閥225可為 MEMS器件。圖2B中所描繪之實施例描繪用於開口 135中 之母一者的個別閥225。然而，在其他實施例中，閥可經 組態及定位以覆蓋或露出開口 13 5來調變來自一個以上開 口 135(例如’一列或一行開口 135)的氣流。 閥225可經組態以在致動時覆蓋或露出開口 135，以便提 供自開口 135溢出之所選擇氣流。在一些狀況下，所選擇 氣流可為自開口 135溢出之振盪氣流❶在其他狀況下，所 選擇流可為在通過散熱片1〇2之所選擇方向（例如，與圖i 中所描繪之元件110之長尺寸155平行的方向）上驅動氣流 之閥225的順序操作》在此等狀況下，在閥225被重複地致 動為打開及閉合之同時’氣流器件145可簡單地將恆定氣 流遞送至該外殼以維持外殼13〇中之正氣壓。在其他狀況 下’所選擇流可為在通過散熱片1〇2之所選擇方向（例如， 與圖1中所描繪之元件11〇之長尺寸155平行的方向）上之閥 220的順序操作以確保空氣之有效及澈底混合，該空氣係 藉助於外部來源（諸如，風扇或鼓風機）橫過散熱片。然 而’在再其他狀況下’在閥225經致動（例如）以產生通過開 口 135之氣流之更複雜型樣的同時，氣流器件145亦可接通 及斷開》 在如圖2C中所說明之一些實施例中，為了促進空氣通過 157124.doc -9- 201212807 所選擇開口 135之傳遞’外殼130可分割為兩個或兩個以上 腔室 230、232、234 ° 如圖2C中進一步說明，裝置1〇〇可包括氣流器件145，氣 流器件145個別地耦接至腔室中之每一者（例如，腔室 230、232或234中之一者），以便向腔室230、232、23 4選 擇性地提供正氣壓。另外，可存在管道15〇，其將氣流自 氣'/瓜器件145中之一者導向至外殼130之腔室230、232、 234中的一者，或在一些實施例中分離被視為經個別地容 納的腔室（例如，軟管或管）。 §腔至230中之一者具備正氣壓時，空氣經選擇性地導 向通過開口 135中在一腔室230内的一或多者。在一些例子 中，藉由按順序（例如，腔室23〇、腔室232及接著腔室234) 向腔至提供正氣壓，可在通過散熱片1〇2之所選擇方向上 驅動通過開口 135的氣流《在一些例子中，藉由按順序（例 如，腔室230、腔室232及接著腔室234)向腔室提供正氣 壓，可驅動通過開口 135之氣流以便確保空氣之有效及澈 底混合，該空氣係與外部空氣循環來源（例如，風扇或鼓 風機作而橫過散熱片。在一些狀況下，可振盪（例如， 藉由接通及斷開氣流器件145)至個別腔室 之氣流，以向腔室230、232、234中之一或多者提供振盪 氣流且使其通過開口 13 5。 在些實施例中，&了促進空氣通過外殼130之所選擇 開口 135之傳遞’可使用耗接至複數個管道15G之流閥控制 通過多腔至外喊! 3 〇的氣流。舉例而言，如圖2D中所說 157124.doc 201212807 月肌閥240(例如，螺線管閱）可搞接至管道例如，自 中央&道245所饋入)中之_或多者該等管道】％各自耦 接至腔室230、232、234中之一者。閥24〇可經組態以開放 及閉合管道15〇,以便向腔室23〇、232、234中之一或多者 提供所選擇氣流》類似於在圖2B及圖2(：之情形中所論述 的閥’可重複地打開及閉合閥⑽以產生通過開口⑴之振 盪氣流，或順序地導向空氣以特定次序通過在腔室23〇、 232 234中之開口，以促進導向氣流在特定方向上通過散 熱片102。 裝置1〇〇之實施例可進一步包括：控制單元16〇(圖丨）， 其經組態以控制耦接至充氣部丨25之該一或多個氣流器件 145，致動閥225，其位於開口 135之上（圖2B);或致動閥 240,其耦接至管道15〇(圖2D)，以遞送所要型樣的空氣通 過開口 135。 在一些狀況下，充氣部125可擱置於熱交換元件11〇之頂 4 165的正上方。然而，在（諸如）圖3八中所說明之其他狀 况下’充氣部125可藉由間隙3 10與元件11 〇之頂部165分 離。舉例而言，在一些實施例中’在外殼13〇與頂部165之 間的間隙310多達約3 mm。需要最小化間隙3 1 〇以將開口 135置放為靠近需要空氣擾動之散熱片ι〇2區域。舉例而 5 ’若開口 13 5定位距元件11 〇過遠，則空氣之動量將在其 到達散熱片102之前耗散或擴散。另外，大的間隙31〇可能 不合需要地增大裝置100之垂直輪廓。又，大的間隙31〇亦 可允許空氣繞過熱交換元件110’藉此減小熱傳遞之效 157124.doc 201212807 率。 如圖3A中進一步說明，裝置100之一些實施例包括一或 多個氣流分流器以增大空氣擾動元件110的表面，以便增 大熱傳遞。在一些狀況下，分流器315可為在一或多個熱 交換疋件110之側面320上的結構。舉例而言，分流器315 之一些實施例可包括定位於開口 135中之一者之正下方的 垂直槽’（例如）來向自開口 135至元件11〇之空氣提供最小 阻抗並增強接近側面320之空氣擾動。在一些狀況下，分 流器325可為在外殼130之表面140上在開口 135中之一或多 者附近的結構《舉例而言，此等分流器325之一些實施例 可包括定位於開口 135周圍之喷嘴喷射結構，來（例如）將氣 流自開口 135導向至元件110的側面320且藉此增大空氣混 合°在再其他實施例中，分流器3 15、325可經組態以將空 氣導向遠離侧面32〇且至在元件u〇之間的通道137之中央 中’（例如）來經由較長距離熱混合機構增大空氣混合。分 流器亦可用以驅動空氣橫向通過散熱片102。合適之氣流 分流器設計的額外實例呈現於上文所併入之專利申請案第 12/165,193 中。 可以合作方式調整開口 135之位置及大小來促進增大之 空亂擾動。舉例而言，在一些實施例中，開口 n5之大小 33〇(例如’圓形開口之直徑）可自熱交換元件110之厚度335 的十分之一變化至元件110之間的通道137之寬度340的一 半。 開口 U5相對於元件110之位置可取決於元件之厚度 157124.docS 201212807 By way of example, 'in some cases, the gas flow device 145' plenum 125, such as depicted in Figure 2B, further includes one or more flow valves 225 located in one or more of the openings 135. For example, in some applications, such as when the heat sink 102 is used to cool a microelectronic device, the flow valve 225 can be a MEMS device. The embodiment depicted in Figure 2B depicts an individual valve 225 for the parent of the opening 135. However, in other embodiments, the valve can be configured and positioned to cover or expose the opening 13 5 to modulate airflow from more than one opening 135 (e.g., 'a row or row of openings 135'). Valve 225 can be configured to cover or expose opening 135 upon actuation to provide a selected flow of air that overflows from opening 135. In some cases, the selected airflow may be an oscillating airflow that overflows from the opening 135. In other conditions, the selected flow may be in a selected direction through the heat sink 1〇2 (eg, with the components depicted in FIG. The sequential operation of the valve 225 that drives the airflow over the direction of the long dimension 155 of 110. Under these conditions, the airflow device 145 can simply deliver a constant airflow while the valve 225 is repeatedly actuated to open and close. To the outer casing to maintain the positive air pressure in the outer casing 13〇. In other cases, the selected stream may be a sequential operation of the valve 220 on a selected direction through the fins 1 〇 2 (eg, a direction parallel to the long dimension 155 of the element 11 图 depicted in FIG. 1). Ensure that the air is effectively and thoroughly mixed, the air being traversed through the heat sink by means of an external source such as a fan or blower. However, 'under other conditions', while valve 225 is actuated, for example, to create a more complex pattern of airflow through opening 135, airflow device 145 can also be turned "on" and "off", as illustrated in Figure 2C. In some embodiments, the outer casing 130 can be divided into two or more chambers 230, 232, 234° to facilitate the passage of air through the openings 135 selected by 157124.doc -9-201212807, as further illustrated in Figure 2C, The device 1A can include a gas flow device 145 that is individually coupled to each of the chambers (eg, one of the chambers 230, 232, or 234) to the chambers 230, 232, 23 4 selectively provides positive air pressure. Additionally, there may be a conduit 15 that directs airflow from one of the gas'/melon devices 145 to one of the chambers 230, 232, 234 of the outer casing 130, or in some embodiments the separation is considered Individually housed chambers (eg, hoses or tubes). § When one of the chambers 230 has positive air pressure, the air is selectively directed through one or more of the openings 135 in a chamber 230. In some examples, the through opening 135 can be driven in a selected direction through the heat sink 1〇2 by providing positive air pressure to the chamber in sequence (e.g., chamber 23, chamber 232, and then chamber 234). Airflow "In some instances, by providing positive air pressure to the chamber in sequence (e.g., chamber 230, chamber 232, and subsequent chamber 234), the airflow through opening 135 can be driven to ensure efficient and thorough mixing of the air. The air system is circulated across the heat sink with a source of external air circulation (eg, a fan or blower. In some cases, the airflow can be oscillated (eg, by turning the airflow device 145 on and off) to individual chambers, An oscillating airflow is provided to one or more of the chambers 230, 232, 234 and passed through the opening 13 5. In some embodiments, & facilitating the transfer of air through the selected opening 135 of the outer casing 130 'is available The flow valve that is connected to a plurality of pipes 15G controls the flow through the multi-chamber to the outside! 3 〇 of the air flow. For example, as shown in Figure 2D 157124.doc 201212807 month muscle valve 240 (for example, solenoid read) Getting connected to the pipeline, for example, from Central & feed channel 245) in the _]% or more of such pipes each coupled to one of those chambers 230, 232. Valve 24A can be configured to open and close conduit 15A to provide selected airflow to one or more of chambers 23, 232, 234, similar to in the case of Figures 2B and 2 (: The valve of the discussion 'repeatedly opens and closes the valve (10) to create an oscillating air flow through the opening (1), or sequentially directs air through the openings in the chambers 23, 232, 234 in a particular order to facilitate directing the airflow in a particular direction. The heat sink 102. The embodiment of the apparatus 1 further includes: a control unit 16 (FIG.) configured to control the one or more airflow devices 145 coupled to the inflator 25, actuated Valve 225, which is located above opening 135 (Fig. 2B); or actuates valve 240, which is coupled to conduit 15 (Fig. 2D) to deliver the desired pattern of air through opening 135. In some cases, the plenum 125 may rest directly above the top 4 165 of the heat exchange element 11 。. However, in other situations such as illustrated in Figure 3, the plenum 125 may be by the gap 3 10 and the top of the element 11 165 separation. For example, in some embodiments 'in the outer casing 13 The gap 310 between the portions 165 is up to about 3 mm. It is necessary to minimize the gap 3 1 〇 to place the opening 135 close to the area of the heat sink ι 2 that requires air disturbance. For example, 5 ' if the opening 13 5 is positioned at a distance from the element 11 〇 too far, the momentum of the air will dissipate or spread before it reaches the heat sink 102. In addition, the large gap 31〇 may undesirably increase the vertical profile of the device 100. In addition, the large gap 31〇 may also Allowing air to bypass the heat exchange element 110' thereby thereby reducing the efficiency of heat transfer 157124.doc 201212807. As further illustrated in FIG. 3A, some embodiments of the apparatus 100 include one or more airflow splitters to increase the air disturbance element 110. The surface is to increase heat transfer. In some cases, the flow splitter 315 can be a structure on the side 320 of one or more heat exchange elements 110. For example, some embodiments of the flow splitter 315 can include positioning A vertical slot ' directly below one of the openings 135', for example, provides minimal impedance to the air from the opening 135 to the element 11 and enhances air disturbance near the side 320. In some cases, the shunt 32 5 may be a structure on one or more of the openings 135 on the surface 140 of the outer casing 130. For example, some embodiments of such shunts 325 may include a nozzle spray structure positioned about the opening 135 to For example, directing airflow from opening 135 to side 320 of element 110 and thereby increasing air mixing. In still other embodiments, shunts 3 15, 325 can be configured to direct air away from side 32 and to In the center of the channel 137 between the elements u〇 'for example, to increase air mixing via a longer distance thermal mixing mechanism. The shunt can also be used to drive air laterally through the heat sink 102. A suitable example of a suitable airflow splitter design is presented in the above-incorporated patent application Serial No. 12/165,193. The position and size of the opening 135 can be adjusted in a cooperative manner to promote increased spatial disturbances. For example, in some embodiments, the size 33 of the opening n5 (eg, the diameter of the circular opening) may vary from one tenth of the thickness 335 of the heat exchange element 110 to the width of the channel 137 between the elements 110. Half of the 340. The position of the opening U5 relative to the element 110 may depend on the thickness of the element 157124.doc

S •12- 201212807 3 3 5、開口的大小3 3 0及通過開口 13 5之氣流之力。 舉例而言，如圖3Α中所說明，當元件no之厚度3 35與開 口 13 5之大小3 3 0相比相對大時，使開口 13 5實質上與熱交 換元件110中之一者的一側面320對準可為有利的。在一些 狀況下’開口 13 5可將空氣導向至熱交換元件u 〇之側面 32〇或沿側面32〇導向空氣。舉例而言，開口丄3 5可置放於 熱父換元件110中之一者的一侧面320之正上方，或開口 135可自熱交換元件11〇偏移，但具有實質上定向之形狀 (例如，成角度的），以便將空氣導向至熱交換元件11〇的該 側面。此對準開口 135可有助於增大接近元件之側面32〇中 之一者的空氣擾動。 舉例而言，如圖3B中所說明，（諸如）當元件11〇之厚度 335與開口 135之大小330相比相對小時，使開口 135定中心 於熱交換元件110中之一者的正上方可為有利的。此定中 心開口 135可最大化接近元件之側面32〇兩者的空氣擾動。 舉例而言，如圖3C中所說明，當存在通過開口 135之氣 机的強力時，將開口 135實質上定位於通道137之中央之上 可為有利的。舉例而言，一旦來自開口 135之空氣碰撞基 座1〇5之表面120，則該空氣可橫向展佈開，且接著撞擊元 件110之側面32〇，藉此增大接近侧面32〇的空氣擾動。 ▲對於本文中所呈現之實例實施例中之許多實例實施例 (諸如在圖1至圖3C中），熱交換元件11〇描繪為矩形平面翼 片。在—些實施例甲，此熱交換元件11〇設計可為合乎需 要的’（例如）此係因為此等結構之製造可為相對簡輕便 157124.doc •13· 201212807 宜的。然而，在其他實施例中，使熱交換元件110具有其 他形狀可為有利的。其他熱交換元件設計之實例呈現於專 利申清案第12/165,063號；第12/165，193號；及第 12/165’225號中’所有此等專利中請案之全部内容以引用 的方式併入本文中。非限制實例設計包括：彎的或彎曲之 翼片、包括流分流器之翼片、單體結構複雜設計，或主動 式散熱片設計。 熟1此項技術者將熟悉待用於特定冷卻應用之基座1〇5 及元件110之適當大小與在元件u〇之間的間距之寬度 340(圖3 A)。此等大小及間距之實例呈現於上文所併入之 Salamon申請案中。 充氣部125之一些實施例包括低輪廓外殼13〇，以便不增 大裝置100之垂直輪廓。舉例而言，在一些實施例中，外 殼130具有小於散熱片102之高度355之百分之十的高度 3 50(圖3A)。舉例而言，對於一些微電子應用，厚度35〇高 達約5 mm。在一些實施例中’外殼13〇之橫向尺寸實質上 與散熱片102之橫向尺寸相同。 如圖3 A中進一步說明’本發明之另一實施例係系統 3 60。系統360包含裝置1〇〇，諸如在圖1至圖3C之情形中所 論述之裝置100之實施例中的任一者。舉例而言，裝置1 〇〇 包含散熱片102、充氣部125，及在一些狀況下，耦接至充 氣部125以便向外殼130提供正氣壓的氣流器件145 '系統 360亦包含經組態以產生熱之結構370。裝置100之散熱片 102耦接至結構370。熟習此項技術者將熟悉將散熱片耦接 I57124.docS •12- 201212807 3 3 5. The size of the opening 3 3 0 and the force of the air flow through the opening 13 5 . For example, as illustrated in FIG. 3A, when the thickness 3 35 of the element no is relatively large compared to the size 3 3 0 of the opening 13 5 , the opening 13 5 is substantially one of the heat exchange elements 110 Alignment of the sides 320 can be advantageous. In some cases, the opening 13 5 directs air to the side 32 of the heat exchange element u 〇 or directs air along the side 32 〇. For example, the opening 丄 35 can be placed directly above one side 320 of one of the hot parent elements 110, or the opening 135 can be offset from the heat exchange element 11 , but have a substantially oriented shape ( For example, angled) to direct air to the side of the heat exchange element 11''. This alignment opening 135 can help to increase the air disturbance of one of the sides 32 of the access element. For example, as illustrated in FIG. 3B, such as when the thickness 335 of the element 11 is relatively small compared to the size 330 of the opening 135, centering the opening 135 directly above one of the heat exchange elements 110 can be It is beneficial. This centering opening 135 maximizes air disturbances near both sides 32 of the component. For example, as illustrated in Figure 3C, it may be advantageous to position the opening 135 substantially above the center of the channel 137 when there is a strong force of the air passing through the opening 135. For example, once the air from the opening 135 strikes the surface 120 of the pedestal 1 〇 5, the air can spread laterally and then impact the side 32 〇 of the element 110, thereby increasing the air disturbance near the side 32 〇 . ▲ For many of the example embodiments (such as in Figures 1-3C) of the example embodiments presented herein, the heat exchange element 11A is depicted as a rectangular planar fin. In some embodiments A, the heat exchange element 11 can be designed to be desirable (for example) because the manufacture of such structures can be relatively simple and light 157124.doc • 13· 201212807. However, in other embodiments, it may be advantageous to have the heat exchange element 110 have other shapes. Examples of other heat exchange element designs are presented in the patent application No. 12/165,063; No. 12/165,193; and No. 12/165 '225, the entire contents of The manner is incorporated herein. Non-limiting example designs include curved or curved fins, fins including flow splitters, complex single-body designs, or active heat sink designs. Those skilled in the art will be familiar with the appropriate size of the pedestal 1 〇 5 and component 110 to be used for a particular cooling application and the width 340 of the spacing between the components u (Fig. 3A). Examples of such sizes and spacings are presented in the Salamon application incorporated above. Some embodiments of the plenum 125 include a low profile outer casing 13〇 so as not to increase the vertical profile of the device 100. For example, in some embodiments, the outer casing 130 has a height 3 50 that is less than ten percent of the height 355 of the fins 102 (Fig. 3A). For example, for some microelectronic applications, the thickness is 35 〇 up to about 5 mm. In some embodiments, the lateral dimension of the outer casing 13 is substantially the same as the lateral dimension of the heat sink 102. Another embodiment of the present invention is a system 3 60 as further illustrated in Figure 3A. System 360 includes any of the devices 100, such as the embodiments of device 100 discussed in the context of Figures 1 through 3C. For example, device 1 includes heat sink 102, plenum 125, and in some cases, airflow device 145 coupled to plenum 125 to provide positive air pressure to housing 130. System 360 also includes configuration to generate The structure of heat 370. The heat sink 102 of the device 100 is coupled to the structure 370. Those skilled in the art will be familiar with coupling the heat sink to I57124.doc

S 201212807 至結構以便達成有效熱傳遞之手段。 舉例而言，在一些實施例中，該裝置係電器件，且熱產 生結構370包括積體電路或在其他狀況下該電器件之㈣ 供應器。在一些實施例中，系統36〇係熱交換器且熱產生 結構370係將加熱之流體攜載於其中（例如，水、空氣、致 冷劑）之管’例而t ’複數個散熱片1G2可熱㈣至熱管 結構370，熱管結構37〇經組態以使流體自產生熱之另一器 件（例如，馬達或電源供應器（未圖示））循環。然而，在其 他實施例中，熱管可併入於基座1〇5内。儘管基座1〇5及結 構370描繪為具有平面界面375，但在其他狀況下，界面 375可為非平面的（例如，諸如在結構37〇為圓柱形管之壁 時）。 本發明之另一實施例係製造裝置之方法。圖4呈現製造 本發明之裝置100(諸如，在圖i至圖3C之情形中所論述的 實施例中之任一者）的實例方法4〇〇中之所選擇步驟的流程 圖。 藉由繼續參看遍及圖1至圖3C，方法400包含提供散熱片 102之步驟410。該散熱片包括基座1〇5及連接至基座 105之 表面120且在表面120上方升起的複數個熱交換元件11〇。 該散熱片可為可購得之散熱器或在上文所併入之專利申請 案中之任一者中所揭示的散熱片設計中之任一者。 方法400亦包含提供充氣部125之步驟420，充氣部125包 括經組態以將正氣壓保持於其中之外殼13〇及在外殼13〇之 表面140中的開口 135。在步驟420中提供充氣部125在一些 157124.doc 15 201212807 狀況下可包括在第一金屬薄片中形成開口 135(例如，經由 衝壓或鑽孔）之步驟430及形成外殼130之步驟435，外殼 130係藉由將壁耦接至該薄片且接著將第二薄片耦接至壁 以在外殼130中形成封閉空腔而形成。 該方法亦包含將充氣部125定位於熱交換元件110上方， 以使得通過開口 135退出充氣部125之空氣導向至散熱片 102的步驟440。 該方法之一些實施例進一步包括將氣流器件145耦接至 充氣部125以便向外殼130提供正氣壓的步驟450。舉例而 言，管道150可自氣流器件145之輸出端附接至外殼13〇。 儘管已詳細描述實施例，但一般熟習此項技術者應理 解，其可在不脫離本發明之範鳴的情況下在本文中進行各 種改變、取代及更改。 【圖式簡單說明】 圖1呈現本發明之裝置之實例實施例的透視圖； 圖2A呈現沿圖1中所展示之視線2-2之裝置的半透明平面 圖； 圖2B至圖2D呈現類似於圖2 A中所呈現之視圖的本發明 之裝置之替代實施例的平面圖； 圖3A呈現沿圖1中所展示之視線3-3之裝置的剖視圖；及 圖3B至圖3C呈現類似於圖3 A中所呈現之視圖的本發明 之裝置之替代實施例的剖視圖。 圖4呈現製造本發明之裝置（例如，諸如呈現於圖1至圖 3C中）的實例方法中之所選擇步驟的流程圖。 157124.docS 201212807 to the structure in order to achieve effective heat transfer means. For example, in some embodiments, the device is an electrical device and the heat generating structure 370 includes an integrated circuit or, in other conditions, a (four) supply of the electrical device. In some embodiments, the system 36 is a heat exchanger and the heat generating structure 370 is a tube in which a heated fluid is carried (eg, water, air, refrigerant), and a plurality of fins 1G2 The heat pipe structure 370 can be configured to circulate the fluid from another device that generates heat (e.g., a motor or power supply (not shown). However, in other embodiments, the heat pipe can be incorporated into the base 1〇5. Although the pedestal 1 〇 5 and the structure 370 are depicted as having a planar interface 375, in other cases, the interface 375 can be non-planar (e.g., such as when the structure 37 is a wall of a cylindrical tube). Another embodiment of the invention is a method of making a device. Figure 4 presents a flow diagram of selected steps in an example method 4 of fabricating a device 100 of the present invention, such as any of the embodiments discussed in the context of Figures i through 3C. The method 400 includes the step 410 of providing a heat sink 102 by continuing reference throughout FIGS. 1 through 3C. The heat sink includes a base 1〇5 and a plurality of heat exchange elements 11〇 connected to the surface 120 of the base 105 and raised above the surface 120. The heat sink can be either a commercially available heat sink or any of the heat sink designs disclosed in any of the above-incorporated patent applications. The method 400 also includes the step 420 of providing an inflator 125 that includes an outer casing 13 that is configured to retain positive air pressure therein and an opening 135 in the surface 140 of the outer casing 13A. Providing the plenum 125 in step 420 may include a step 430 of forming an opening 135 in the first foil (eg, via stamping or drilling) and a step 435 of forming the outer casing 130, in some cases 157124.doc 15 201212807, the outer casing 130 It is formed by coupling a wall to the sheet and then coupling the second sheet to the wall to form a closed cavity in the outer casing 130. The method also includes the step 440 of positioning the plenum 125 above the heat exchange element 110 to direct air exiting the plenum 125 through the opening 135 to the heat sink 102. Some embodiments of the method further include the step 450 of coupling the airflow device 145 to the plenum 125 to provide positive air pressure to the outer casing 130. For example, conduit 150 can be attached to housing 13 from the output of airflow device 145. Although the embodiments have been described in detail, it is to be understood by those skilled in the art that various changes, substitutions and changes may be made herein without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 presents a perspective view of an example embodiment of a device of the present invention; Figure 2A shows a translucent plan view of the device along line of sight 2-2 shown in Figure 1; Figures 2B through 2D are similar 2A is a plan view of an alternative embodiment of the apparatus of the present invention in the view presented in FIG. 2A; FIG. 3A is a cross-sectional view of the apparatus along line 3-3 of FIG. 1; and FIGS. 3B-3C are similar to FIG. A cross-sectional view of an alternative embodiment of the apparatus of the present invention in the view presented in A. Figure 4 presents a flow diagram of selected steps in an example method of fabricating a device of the present invention (e.g., such as presented in Figures 1-3C). 157124.doc

S 201212807 【主要元件符號說明】 100 裝置 102 散熱片 105 基座 110 熱交換元件/空氣擾動元件 120 表面 125 充氣部 130 外殼 135 開口 137 通道 140 表面 145 氣流器件/淨正質量通量器件 150 管道 155 長尺寸 160 控制單元 165 頂部 210 活塞 215 薄膜 220 氣缸 225 流閥/致動閥 230 腔室 232 腔室 234 腔室 240 流閥/致動閥 157124.doc -17· 201212807 245 中央管道 310 間隙 315 分流β 320 側面 325 分流益 330 大小 335 厚度 340 寬度 350 高度/厚度 355 南度 360 系統 370 熱產生結構/熱管結構 375 界面 157124.doc -18 · sS 201212807 [Main component symbol description] 100 Device 102 Heat sink 105 Base 110 Heat exchange element / Air disturbance element 120 Surface 125 Inflator 130 Housing 135 Opening 137 Channel 140 Surface 145 Airflow device / Net positive mass flux device 150 Pipe 155 Long dimension 160 Control unit 165 Top 210 Piston 215 Membrane 220 Cylinder 225 Flow valve / Actuated valve 230 Chamber 232 Chamber 234 Chamber 240 Flow valve / Actuated valve 157124.doc -17· 201212807 245 Central pipe 310 Clearance 315 Split β 320 Side 325 Split Flow 330 Size 335 Thickness 340 Width 350 Height/Thickness 355 South 360 System 370 Heat Generation Structure / Heat Pipe Structure 375 Interface 157124.doc -18 · s

Claims (1)

201212807 七、申請專利範圍： 1. 一種裝置，其包含： 一散熱片，其包括： 一基座，及 複數個熱交換元件，其連接至該基座之—表面且在 該表面上方升起；及 一充氣部，其定位於該等熱交換元件上方，其中該充 氣部包括： ' ~ 一外殼，其經組態以將一正氣壓保持於其中，及 在該外殼之-表面中的開口，該開口經定位以使得 通過該等開口退出該充氣部之空氣導向至該散熱片。 2. 如請求項1之裝置，其進一步包括耦接至該充氣部以便 向該外殼提供該正氣壓之一或多個氣流器件。 3. 如請求項2之裝置，其中該氣流器件係一淨正質量通量 氣流器件。 4. 如咕求項2之裝置，其中該氣流器件係—淨零質量通量 氣流器件。 5. 如請求項4之裝置’其中該淨零質量通量氣流器件包括 耦接至—驅動器之-壓電元件及—薄膜，以使得在該薄 膜振遭時’空氣被傳遞至該外殼中。 —，項1之裝置，其中該外殼分割為兩個或兩個以上 产、以使得在該等腔室中之一者具備該正氣壓時，空 氣被選擇性地導向通過該等開口中在該一腔室一或 多者。 157124.doc 201212807 7. 8. 9. 10. 如請求項6之裝置，其進一步包括個別地耦接至該等腔 室中之每一者以便向該等腔室選擇性地提供該正氣壓的 氣流器件。 一種系統，其包含： 一裝置，其包括： 一散熱片，其包括： 一基座，及 複數個熱交換元件，其連接至該基座之一表面且 在該表面上方升起；及 一充氣部，其定位於該等熱交換元件上方，其中該 充氣部包括： 一外殼，其經組態以將一正氣壓保持於其中，及 在該外殼之一表面中的開口，該開口經定位以使 得通過該等開口退出該充氣部之空氣導向至該散熱片；及 一結構，其經組態以產生熱，其中該散熱片熱耦接至 該結構。 如請求項8之系統，其進一步包括耦接至該充氣部以便 向該外殼提供該正氣壓之一氣流器件。 一種製造一裝置之方法，其包含： 提供一散熱片’該散熱片包括： 一基座，及 複數個熱交換元件，其連接至該基座之一表面且在 該表面上方升起；及 提供一充氣部，該充氣部包括： \51\2A.doc -2- 201212807 一外殼，其經組態以將一正氣壓保持於其中，及 在該外殼之一表面中的開口；及 將該充氣部定位於該等熱交換元件上方，以使得通過 該等開口退出該充氣部之空氣導向至該散熱片。 157124.doc201212807 VII. Patent application scope: 1. A device comprising: a heat sink comprising: a base, and a plurality of heat exchange elements connected to a surface of the base and raised above the surface; And an inflator positioned above the heat exchange elements, wherein the inflator comprises: '~ an outer casing configured to retain a positive air pressure therein, and an opening in a surface of the outer casing, The opening is positioned such that air exiting the plenum through the openings is directed to the heat sink. 2. The device of claim 1, further comprising a gas flow device coupled to the plenum for providing the positive pressure to the housing. 3. The device of claim 2, wherein the gas flow device is a net positive mass flux gas flow device. 4. The device of claim 2, wherein the gas flow device is a net zero mass flux gas flow device. 5. The device of claim 4, wherein the net zero mass flux gas flow device comprises a piezoelectric element and a film coupled to the driver such that air is transferred into the outer casing when the film is shaken. The device of item 1, wherein the outer casing is divided into two or more, such that when one of the chambers has the positive air pressure, air is selectively directed through the openings One or more chambers. 157124.doc 201212807 7. 8. 9. 10. The device of claim 6, further comprising individually coupling to each of the chambers to selectively provide the positive air pressure to the chambers Airflow device. A system comprising: a device comprising: a heat sink comprising: a base, and a plurality of heat exchange elements coupled to a surface of the base and raised above the surface; and an inflation a portion positioned above the heat exchange elements, wherein the plenum includes: a housing configured to retain a positive air pressure therein, and an opening in a surface of the housing, the opening being positioned Air that exits the plenum through the openings is directed to the heat sink; and a structure configured to generate heat, wherein the heat sink is thermally coupled to the structure. The system of claim 8 further comprising a gas flow device coupled to the plenum for providing the positive pressure to the outer casing. A method of fabricating a device, comprising: providing a heat sink comprising: a susceptor, and a plurality of heat exchange elements coupled to a surface of the pedestal and raised above the surface; and providing An inflating portion comprising: \51\2A.doc -2- 201212807 an outer casing configured to retain a positive air pressure therein, and an opening in a surface of the outer casing; and the inflating The portion is positioned above the heat exchange elements such that air exiting the plenum through the openings is directed to the heat sink. 157124.doc