201211500 六、發明說明: 【發明所屬之技術領威】 [0001]本發明是有關於〆種玻璃基板之厚度測定和二維碼(以 下稱為“2D碼,,)檢測系統及其方法,特別是有關同時 自動進行玻璃基板之裝載(Loading)及卸載(Unload-ing)、清洗作業、厚度以及2D碼測定作業之玻璃基板之 厚度測定和2D码檢測系統及其方法。 [0002]以及,有關利用播射以非接觸方式自動測定玻璃基板之 厚度和2D碼(code)之玻璃基板之厚度測定和2j)碼檢測 系統及其方法。 ...:=.. .. 【先前技術】 [画]目前在液晶顯示器(LCD )、電漿顳示板(pdp )、有機 發光二極體(0LED)、數位相機、照相手機等之顯示器 行業中’各種玻璃以較薄之基板之形態廣泛地利用於製 造工藝中。其中,玻璃晶片作為用在最近正在發展著之 高溫多晶矽薄膜電晶體液晶顯示器(tft_lcd)、〇led 、數位相機、照相手機等之主要甩濾光基板以及光通信 用材料,廣泛應用於要求高品質之規格之領域中。 [0004] 以及,在與矽晶片之黏接(b〇nding)、微機電系統( 100130033 MEMS)、光纖裝置(fiber 〇ptics device)之微機電系統(MEMS)、生物製藥(Bic)_medical)領域、微鏡 (micr〇_mirr〇r)、偏振射束***器(polarized beam splitters)、雙色向濾光鏡(dichr〇ic 卜 ter)之基板、微型破璃塊(micro glass-block)及 透鏡、數位影碟光碟(MD)、持續資料保護(CDp)等 表單編號A0101 第3頁/共50頁 1002050922-0 201211500 之讀取頭(pick-up)棱鏡領域等領域中使用著各種材料 之玻璃晶片。 [0005] 這種玻璃晶片屬於當前急速發展之顯示器行業、光通信 以及精密光學元件領域等領域中廣泛使用之材料行業, 是未來可以期待持續高成長之領域。為了持續成長,要 求對玻璃晶片延續正確之品質管理和品質向上,為此, 要求對玻璃晶片之特性,即平坦度和厚度變化之正確之 評價及測定技術。 [0006] 現有之玻璃晶片之平坦度測定方法有:用三維形狀測定 儀掃描(scan)測定放置於平坦(flat)平板上之玻璃 晶片之上表面之形狀,由此測定平坦度之方法;以及利 用菲佐(fizeau)干涉儀使用平行光束來觀測相同或大 於玻璃晶片之參考平面(Reference Flat)與玻璃晶片 之上表面之干涉條紋,由此測定平坦度之方法。 [0007] 利用二維形狀測定儀僅能夠測定直線之形狀,為了獲得 二維形狀需要用三維形狀測定儀掃面整個區域。雖然有 很多種類之形狀測定儀,但大部分只能測定較小區域, 若要測定200mm以上之玻璃晶片,則需要大型測定儀。但 是,越是大型測定儀,測定精確度越低,且價格越高。 [0008] 第1圖為示出為了測定平板之平坦度而製造之現有之商用 菲佐干涉儀之產品照片。 [0009] 參閱第1圖,為了測定平板之平坦度,至少需要大小相同 之參考透鏡。因此,玻璃晶片之大小變得越大,裝置也 變得越大。但是,該測定裝置由於使用雷射光束,因此 100130033 表單編號A0101 第4頁/共50頁 1002050922-0 201211500 干涉距離長,所以在測定作為透明之薄膜之玻璃晶片時 ’坡瑪晶片之上下表面與基準表面之間發生之所有之干 涉條紋將重疊顯現。雖然適合矽晶片之測定,但對於玻 璃晶片之測定而言存在問題。這種問題是一般之商用菲 佐干涉儀中都存在之問題。 [0010]第2圖為示出翟柯(Zygo)公司之Verifire MST干涉儀 以及該干涉儀之工作原理之圖,第3圖為示出用Zygo公司 之Verifire MST干涉儀測定玻璃晶片之測定結果之圖。 0 [0011]參閱第2圖及第3圖,Zygo公司之Verifire MST干涉儀 為通過使用特殊之演算法來消除玻璃晶片之上下表面與 基準表面之間發生之所有干涉條紋重疊顯現之問題之干 涉儀。這種Zygo公司之Verifire MST千涉儀可以測定 一 晶片之上下表面之平面度(Flatness)、厚度變化、折 射率等諸多參數。但是,Zyg〇公司之Verifire MST干 涉儀目前可測定之大小(直徑lOOinm)小於玻璃晶片之大 小,而且玻璃晶片之厚度越薄,則越難以測定厚度(光 Q 學厚度最小為1. 2mm以上才可測定),以及價格高,因此 在產業體中難以使用。 [0012] 以及,測定樣品厚度之現有之厚度測定裝置具有代表性 之是測微儀,這種測微儀有通過喷出預定壓力之空氣並 以其流出量和壓力變化為媒介測定厚度之空氣測微儀, 或者利用塗膜或鍍覆金屬之部分與基材之間之電磁性質 之差異來測定厚度之電動測微儀。 [0013] 在現有技術中’主要利用測微儀來測定玻璃板之厚度。 100130033 表單編號A0101 1002050922-0 201211500 但是,該測微儀根據接觸方式測定玻璃板之厚度,因此 存在精密拋光(polishing)之玻璃表面因干涉而受傷 或被污染之問題。 [0014] 以及,利用該測微儀之玻璃板之厚度測定方法是基於測 定者手工之測定方式,因此不僅測定作業繁瑣,而且測 定值之可靠度低。 [0015] 以下,測定玻璃基板之形狀以及厚度之現有技術如下。 [0016] 韓國公開專利第2009-0031 852號(以下成為“現有技術 1”)有關可連續地迅速測定諸如用作製造薄膜電晶體顯 示器之基板之大面積盤之厚度之大面積玻璃基板之厚度 測定裝置及方法。 [0017] 該現有技術1如第4圖所示,作為包括具備兩個交換( cross-over)單元之一個交換裝置和兩個以上之探針以 及一個控制裝置和評價裝置之、用於測定透明且平坦之 基板之厚度之裝置,公開了構成為如下之用於測定基板 之厚度之裝置。即,該交換單元固定有測頭,該交換單 元在基板上能夠以橫穿玻璃盤之移送方向之方向移動, 該交換單元可相互獨立地移動,並由該控制裝置控制交 換單元之動作,由此交換單元在工作過程甲以相位位移 之狀態,以橫穿基板移送方向之方向從一側邊緣位置移 動到相反側之邊緣位置,該評價裝置參照探針之資料撰 寫厚度特徵資訊(Profile)。 [0018] 韓國公開專利第2007-0 1 0061 8號(以下稱為“現有技術 2”)有關搬送根據化學研磨處理等而被薄型化之玻璃基 100130033 表單編號A0101 第6頁/共50頁 1002050922-0 201211500 [0019] Ο [0020]201211500 VI. Description of the Invention: [Technical Leadership of Invention] [0001] The present invention relates to a thickness measurement of a glass substrate and a two-dimensional code (hereinafter referred to as "2D code,") detection system and method thereof, particularly It relates to a glass substrate thickness measurement and a 2D code detection system and method thereof for automatically performing loading and unloading of a glass substrate, cleaning operation, thickness, and 2D code measurement operation. [0002] A method for measuring the thickness of a glass substrate and a thickness of a glass substrate of a 2D code by means of a broadcast, and a method for detecting a color of a 2D code and a method thereof. ...:=.. .. [Prior Art] [Drawing At present, in the display industry of liquid crystal display (LCD), plasma display (pdp), organic light-emitting diode (0LED), digital camera, camera phone, etc., various glasses are widely used in the form of thinner substrates. In the manufacturing process, among them, glass wafers are mainly used as high-temperature polycrystalline germanium thin film transistor liquid crystal displays (tft_lcd), 〇led, digital cameras, camera phones, etc., which are being developed recently. Optical substrates and materials for optical communication are widely used in fields requiring high quality specifications. [0004] As well as bonding to germanium wafers, microelectromechanical systems (100130033 MEMS), fiber optic devices (fibers) 〇ptics device) microelectromechanical system (MEMS), biopharmaceutical (Bic)_medical) field, micromirror (micr〇_mirr〇r), polarized beam splitters, dichroic filter (dichr 〇ic 卜) substrate, micro glass-block and lens, digital compact disc (MD), continuous data protection (CDp), etc. Form No. A0101 Page 3 / Total 50 pages 1002050922-0 201211500 Glass wafers using various materials in the field of pickup-up prisms, etc. [0005] Such glass wafers are widely used in the fields of the rapidly developing display industry, optical communication, and precision optical components. The industry is an area that can be expected to continue to grow in the future. In order to continue to grow, it is required to continue the correct quality management and quality of the glass wafer. For this reason, it is required to specialize in the glass wafer. The correct evaluation and measurement technique for flatness and thickness variation. [0006] The method for determining the flatness of a glass wafer is to measure a glass wafer placed on a flat plate by a three-dimensional shape measuring instrument. The shape of the upper surface, thereby determining the flatness; and the use of a parallel beam to observe interference fringes of the same or larger than the reference plane of the glass wafer and the upper surface of the glass wafer using a fizeau interferometer, The method of measuring the flatness thereby. [0007] Only the shape of a straight line can be measured by a two-dimensional shape measuring instrument, and in order to obtain a two-dimensional shape, it is necessary to scan the entire area with a three-dimensional shape measuring instrument. Although there are many types of shape measuring instruments, most of them can only measure small areas. To measure glass chips of 200 mm or more, a large measuring instrument is required. However, the larger the analyzer, the lower the accuracy of the measurement and the higher the price. [0008] Fig. 1 is a photograph showing a product of a conventional commercial Fizeau interferometer manufactured to measure the flatness of a flat plate. [0009] Referring to Fig. 1, in order to determine the flatness of the flat plate, at least a reference lens of the same size is required. Therefore, the larger the size of the glass wafer becomes, the larger the device becomes. However, since the measuring device uses a laser beam, 100130033 Form No. A0101 Page 4/50 pages 1002050922-0 201211500 The interference distance is long, so when measuring the glass wafer as a transparent film, the upper surface of the Slope wafer is All interference fringes that occur between the reference surfaces will appear overlapping. Although suitable for the measurement of tantalum wafers, there are problems with the measurement of glass wafers. This problem is a problem in the general commercial Philippine interferometer. [0010] Fig. 2 is a view showing a Verifire MST interferometer of Zygo Corporation and a working principle of the interferometer, and Fig. 3 is a view showing measurement results of measuring a glass wafer by a Verifire MST interferometer of Zygo Corporation. Picture. [0011] Referring to Figures 2 and 3, Zygo's Verifire MST interferometer is an interference that eliminates the problem of overlapping all interference fringes that occur between the lower surface of the glass wafer and the reference surface by using a special algorithm. instrument. The Zygo Verifire MST meter can measure the flatness, thickness variation, and refractive index of the lower surface of a wafer. However, the measurable size (100 Å in diameter) of the Zyg〇 company's Verifire MST interferometer is smaller than the size of the glass wafer, and the thinner the thickness of the glass wafer, the more difficult it is to measure the thickness (the optical Q thickness is at least 1. 2 mm or more). It is measurable, and it is expensive, so it is difficult to use in the industrial sector. [0012] And, the conventional thickness measuring device for measuring the thickness of the sample is typically a micrometer having air for measuring the thickness by ejecting air of a predetermined pressure and using the outflow amount and the pressure change as a medium. A micrometer, or an electric micrometer that measures the thickness using a difference in electromagnetic properties between a coated film or a portion of a plated metal and a substrate. [0013] In the prior art, a micrometer is mainly used to measure the thickness of a glass plate. 100130033 Form No. A0101 1002050922-0 201211500 However, the micrometer measures the thickness of the glass plate according to the contact method, so there is a problem that the polished glass surface is injured or contaminated by interference. [0014] Further, the method for measuring the thickness of the glass plate using the micrometer is based on the measurement method manually by the measurer, so that the measurement operation is cumbersome and the reliability of the measurement value is low. [0015] Hereinafter, the prior art for measuring the shape and thickness of a glass substrate is as follows. [0016] Korean Laid-Open Patent Publication No. 2009-0031 852 (hereinafter referred to as "Prior Art 1") relates to a thickness of a large-area glass substrate which can continuously and rapidly measure the thickness of a large-area disk such as a substrate used for manufacturing a thin film transistor display. Measuring device and method. [0017] This prior art 1 is shown in FIG. 4 as a measuring device including a switching device having two cross-over units and two or more probes, and a control device and evaluation device for measuring transparency. As a device for the thickness of a flat substrate, an apparatus for measuring the thickness of a substrate is disclosed as follows. That is, the exchange unit is fixed with a probe that can move in a direction across the transfer direction of the glass disk on the substrate, the exchange unit can move independently of each other, and the control device controls the action of the exchange unit, The switching unit moves from the one edge position to the edge position on the opposite side in the direction of the substrate transfer direction in the phase of the phase shift, and the evaluation device writes the thickness profile information with reference to the probe data. [0018] Korean Patent Publication No. 2007-0 1 0061 8 (hereinafter referred to as "Prior Art 2") relates to glass substrate 100130033 which is thinned by chemical polishing treatment or the like. Form No. A0101 Page 6 of 50 page 1002050922 -0 201211500 [0019] Ο [0020]
[0021] 板之同時準確地測定板厚度之玻璃基板之板厚度測定裝 置。 該現有技術2如第5圖所示,作為容納經薄型化處理之玻 璃基板而對其玻璃基板測定多個點之板厚度之板厚度測 定裝置,公開了具有如下特徵之平面顯示器(Flat Panel Display)用玻璃基板之板厚度測定裝置。即, 該裝置之特徵在於包括:垂直相交於搬送該玻璃基板之 搬送路而設置於該玻璃基板之表面側和背面侧之多組感 測器;基於從該感測器之輸出信號計算各感測器與該玻 璃基板之表面之間之間隔距離之第一機構;基於該第一 機構之計算值和預先設定之一對感測器之間隔距離而計 算搬送中之該玻璃基板之板厚度之第二機構。 韓國公開專利第0074514號(以下稱為“現有技術3”) 有關利用根據鐘射之非接觸式方法而不僅能夠以高精破 度測定亂反射物體之表面,而且還能夠對諸如玻璃之鏡 面反射物體之表面將準確之反射角考慮進去,從而以玻 璃等鏡面物體為物件,能夠同時踯定鏡面物體之形狀和 厚度之根據鐳射之非接觸方式之鏡面物體之形狀以及厚 度測定系統。 該現有技術3如第6圖所示公開了如下之非接觸方式之鏡 面物趙之形狀以及厚度測定系統。即,根據鐳射振盪器 而振盪出之鐳射通過透鏡而聚光,且根據鏡面表面而反 射之光再次通過物鏡反射到分束器之後輸入到光檢測器 °在該光檢測器通過檢測輸入光來計算出具有物體形狀 之資訊’即粗糙度或高度資訊之光強度分佈。以及,如 100130033 表單編號A0101 第7頁/共50頁 1002050922-0 201211500 果精禮地移送相當於驅動部之平移台(translatl〇n 5响6),則通過物鏡*具有預定反射角之鐳射聚光到破 璃鏡面之背面1反射射面之光再次通過玻璃鏡面之 後經過物鏡和分束器,並返回到光檢測器,由此被實施 Μ通過刀析由沒種方式檢測到之兩個信號來同時測 定待測物之相同軸上之形狀和厚度。 、 [0022] [0023] [0024] 韓國授權專利第086⑽號(以下稱為“現有技術4”) 有關光學測定塗布有多層薄膜(Thin Fum)之平板型 玻璃之厚度之?層《布玻叙厚度敎裝置。 該現有技術4如第7圖所示,公開了多層塗布玻璃之厚度 測定衣置’該裝置包括:具有傾斜面之—對支樓台該 傾斜面朝前方滑動地支撑玻璃左右侧之下端;由賢直: 裝之一對支持台構成之固定手段,以用於在該支標台之 前面支持該玻璃左右側之邊緣位置;當該玻璃位於焦點 時輸出焦’誤錢之全息光學系統;使該全息光學系 統相對於該玻璃形成直角坐標移動之直角坐標移動機構 ,通過程式來處理從該全息光學系統接收之焦點錯誤資 訊,以計算出該玻璃之厚度之電腦。 韓國授權專利第0908639號(以下稱為“現有技術5”) 有關利用光以非接觸方式測定玻璃晶片之形狀之方法及 裝置。 該現有技術5如第8圖所示,公開了玻璃晶片形狀測定方 法’其中包含:將從光源發出之光照射到玻璃晶片之光 照射步驟;用於使從該破璃晶片之下表面反射之第一光 100130033 表單編號A0101 第8頁/共50頁 1002050922-0 [0025] 201211500 ^ 以及透過該玻璃晶片之下表面而從基準面上發射之第一 光重疊而產生干涉條紋之干涉條紋生成步驟;用米檢测 部檢測該生成之干涉條紋之檢測步驟;基於該檢測之干 涉條紋計算出該玻璃晶片之下表面之平坦度之計算步驟 〇 [0026]但是,現有技術雖然公開了根據詐接觸方式測定諸如玻 璃板之待測物之厚度之方法,但是,為了測定待測物之 厚度,需要在測定設備上全部用手工設置待測物’因此 存在需要花費較多之作業時間,且不方便之問題° 〇 [〇〇27]以及,在現有技術中從來沒有提及和公開同時自動地處 理待測物之裝載及卸載、清诜作業、厚度以為二維碼(2D - 碼)測定作業之系統及方法。 【發明内容】 [0028] 有鑑於上述習知技藝之問題,本發明其中一目的就是在 提供一種同時自動地進行玻璃基板之裝載及卸載、清洗 作業、厚度及二維碼(以下稱為“2D碼”)測定作業之 Ο 玻璃基板之厚度測定和2D碼檢測系統及其方法。 [0029] 本發明之另一目的,提出一種利用鐳射(Laser)以非接 觸方式自動測定玻璃基板之厚度之玻璃基板之厚度測定 和2D碼檢測系統及其方法。 [0030] 本發明之再一目的,提出一種利用二維矩陣(Matrix) 之觸發信號(Trigger Signal)來測定厚度之同時能夠 讀取矩陣之玻璃基板之厚度測定和2D碼檢測系統及其方 法。 100130033 表單編號A0101 第9頁/共50頁 1002050922-0 201211500 [0031] 本發明之又一目的在於提供一種即使玻璃基板薄型化也 能夠正確地測定板厚度之玻璃基板之厚度測定和2D碼檢 測系統及其方法。 [0032] 本發明所要解決之技術問題並不限定於上述之情況對 於沒有提及之其他所要解決之技術問題,技術人員可從 下面之記載中明確地理解。 [0033] 作為為了解決上述技術問題之手段,本發明所提供之玻 璃基板之厚度測定和2D碼檢測系統包括:裝載及卸載玻 璃基板之裝載及卸載部;清洗該玻璃基板2〇之清洗部2〇〇 ;檢測該玻璃基板20之2D碼並測量厚度之測定部3〇〇 ;根 據设置於中央之旋轉轴30而旋轉之三個安置台;以用 於順序向該裝載及卸載部100和該清洗部200以及該測定 部300同時移送該玻璃基板20 ;以及測定終端機4〇〇,自 動控制該裝載及卸載部100、該清洗部2〇〇、該測定部 300以及該女置台40之動作,並對該測定部3〇〇之第一影 像感測器321所拍攝之影像和2D碼進行影像處理,以計算 該玻璃基板20之厚度和檢測該2D碼。 [0034] 以及,該測定部包括:具有第一鐳射振盪器和第一影像 感測器之上部測定儀,該第一鐳射振盪器朝該玻璃基板 之上表面照射入射光,該第一影像感測器將從該玻璃基 板之上表面反射之反射光或者雷射光束在該玻璃基板之 上表面之第一反射點和第二反射點拍攝為影像;具有第 二鐳射振盡器和第二影像感測器之下部測定儀,該第二 鐳射振盪器朝該玻璃基板之下表面照射入射光,該第二 影像感測器將從該玻璃基板之下表面反射之反射光或者 100130033[0021] A plate thickness measuring device for a glass substrate in which a plate thickness is accurately measured at the same time. As shown in FIG. 5, the prior art 2 discloses a flat panel display having the following features as a panel thickness measuring device for accommodating a glass substrate having a thinned glass substrate and measuring a plurality of dots on the glass substrate (Flat Panel Display) A plate thickness measuring device using a glass substrate. That is, the apparatus includes: a plurality of sets of sensors disposed perpendicularly to the transport path for transporting the glass substrate and disposed on the front side and the back side of the glass substrate; and calculating the sense based on an output signal from the sensor a first mechanism for separating the distance between the detector and the surface of the glass substrate; calculating the thickness of the glass substrate in the transport based on the calculated value of the first mechanism and a predetermined distance between the sensors Second institution. Korean Laid-Open Patent No. 0075514 (hereinafter referred to as "Prior Art 3") relates to the use of a non-contact method according to a clock shot to measure not only the surface of a reflexible object with high precision, but also a specular reflection such as glass. The surface of the object takes the accurate reflection angle into consideration, so that the mirror object such as glass is used as an object, and the shape and thickness of the specular object can be simultaneously determined according to the shape and thickness of the non-contact type of the mirror object. The prior art 3 discloses a non-contact type mirror surface shape and a thickness measuring system as shown in Fig. 6 as follows. That is, the laser oscillated according to the laser oscillator is condensed by the lens, and the light reflected according to the mirror surface is again reflected by the objective lens to the beam splitter and then input to the photodetector. The photodetector passes the detection input light. Calculate the light intensity distribution with the information of the shape of the object's roughness or height information. And, for example, 100130033 Form No. A0101 Page 7 / Total 50 Page 1002050922-0 201211500 The essence is transferred to the translation stage of the drive unit (translatl〇n 5 ring 6), then through the objective lens * laser with a predetermined reflection angle Light to the back of the glass mirror 1 The light reflecting the surface passes through the glass mirror and passes through the objective lens and the beam splitter, and returns to the photodetector, thereby being implemented by the knife to analyze the two signals detected by the different methods. The shape and thickness on the same axis of the test object are simultaneously measured. [0024] [0024] Korean Patent No. 086(10) (hereinafter referred to as "Prior Art 4") relates to the optical measurement of the thickness of a flat glass coated with a multilayer film (Thin Fum). Layer "Bou Sui Xu thickness device. The prior art 4, as shown in FIG. 7, discloses a thickness measuring garment for a multi-layer coated glass. The apparatus includes: having an inclined surface-supporting the lower end of the left and right sides of the glass sliding toward the front of the inclined platform; : mounting a fixed means for the support table for supporting the edge position of the left and right sides of the glass in front of the support table; outputting a holographic optical system of the wrong amount when the glass is at the focus; making the hologram The computer system forms a rectangular coordinate moving mechanism for moving the rectangular coordinate with respect to the glass, and programs the computer to process the focus error information received from the holographic optical system to calculate the thickness of the glass. Korean Patent No. 0908639 (hereinafter referred to as "Prior Art 5") relates to a method and apparatus for measuring the shape of a glass wafer by light in a non-contact manner. The prior art 5, as shown in FIG. 8, discloses a method for measuring a shape of a glass wafer, which comprises: a step of irradiating light from a light source to a glass wafer; and for reflecting from a lower surface of the glass wafer First light 100130033 Form No. A0101 Page 8 / Total 50 pages 1002050922-0 [0025] 201211500 ^ and interference fringe generation step of generating interference fringes by overlapping the first light emitted from the reference surface through the lower surface of the glass wafer a step of detecting the generated interference fringes by the meter detecting portion; calculating a flatness of the flat surface of the glass wafer based on the detected interference fringes [0026] However, the prior art discloses The method of measuring the thickness of the object to be tested such as a glass plate, but in order to determine the thickness of the object to be tested, it is necessary to manually set the object to be tested on the measuring device. Therefore, there is a need to spend a lot of work time, and it is inconvenient. The problem of °[〇〇27] and, in the prior art, never mentioned and disclosed simultaneously and automatically handles the loading and unloading of the object to be tested. Shen cleaning operations, two-dimensional code (2D - Code) that a thickness measurement system and method of operation. SUMMARY OF THE INVENTION [0028] In view of the above problems of the prior art, one of the objects of the present invention is to provide a simultaneous automatic loading and unloading, cleaning operation, thickness and two-dimensional code of a glass substrate (hereinafter referred to as "2D" Code") Measurement of the thickness of the glass substrate and the 2D code detection system and method thereof. Another object of the present invention is to provide a thickness measurement and 2D code detecting system and method for a glass substrate which automatically measures the thickness of a glass substrate by means of a laser in a non-contact manner. A further object of the present invention is to provide a thickness measurement and 2D code detection system and method for a glass substrate capable of reading a matrix while using a Trigger Signal of a two-dimensional matrix (Trigger Signal). 100130033 Form No. A0101 Page 9 / Total 50 Page 1002050922-0 201211500 [0031] Another object of the present invention is to provide a thickness measurement and 2D code detection system for a glass substrate capable of accurately measuring the thickness of a plate even if the thickness of the glass substrate is reduced. And its method. The technical problems to be solved by the present invention are not limited to the above-described cases, and other technical problems to be solved which are not mentioned will be clearly understood by those skilled in the art from the following description. [0033] As a means for solving the above technical problems, the thickness measurement and 2D code detection system of the glass substrate provided by the present invention includes: loading and unloading portion for loading and unloading a glass substrate; and cleaning portion 2 for cleaning the glass substrate 2 a measuring unit 3 that detects a 2D code of the glass substrate 20 and measures the thickness; three mounting stages that are rotated according to the central rotating shaft 30; for sequentially loading the loading and unloading unit 100 and the The cleaning unit 200 and the measurement unit 300 simultaneously transfer the glass substrate 20 and the measurement terminal unit 4, and automatically control the loading and unloading unit 100, the cleaning unit 2, the measuring unit 300, and the female unit 40. And performing image processing on the image and the 2D code captured by the first image sensor 321 of the measuring unit 3 to calculate the thickness of the glass substrate 20 and detecting the 2D code. [0034] The measuring unit includes: a first laser oscillator and a first image sensor upper measuring instrument, the first laser oscillator illuminating the upper surface of the glass substrate with incident light, the first image sense The detector reflects the reflected light or the laser beam reflected from the upper surface of the glass substrate as an image on the first reflection point and the second reflection point on the upper surface of the glass substrate; and has a second laser vibrator and a second image a sensor under the sensor, the second laser oscillator illuminates the incident light toward the lower surface of the glass substrate, and the second image sensor reflects the reflected light from the lower surface of the glass substrate or 100130033
表單編號A0101 第1〇頁/共50頁 l〇〇S 201211500 雷射光束在該玻璃基板之下表面之第一反射點和第二反 射點拍攝為影像;以及具有2D碼影像感測器和照明裝置 之2D碼檢測器,該2D碼影像感測器用於拍攝該玻璃基板 之2D碼,該照明裝置用於在該21)碼影像感測器工作時朝 該玻璃基板之2D碼部位提供照明β [0035] 以及,本發明所提供之玻璃基板之厚度測定和2D碼檢測 系統,當該第一鐳射振盪器和該第二鐳射振盪器之鐳射 為擴散鐳射時,在該上部及下部測定儀之内部還具備將 Ο [0036] 該擴散鐳射轉換為准直鐳射或點狀鐳射之第一透鏡和第 二透鏡。 Ο 以及,該測定終端機包括:輸入部,該輸入部具有用於 輸入該厚度測定和2 D碼檢測系統之動作命令之鍵盤和滑 鼠以及通過調節該測定部之χ軸和γ軸來搜尋該2D碼之操 縱桿;具有監視H和通料之輸出部,該監視器在畫面 上輸出該玻璃基板之厚度測定和2D碼檢測程式畫面和該 第-影像所拍攝之影像和2])碼,該通信埠用於通 過通信網收發該測定終端機所測定之資料資訊;以及控 制部’該控制部儲存並驅動該厚度測定和2d碼檢測程式 ’並根據通過該輸入部所輸人之命令而自動控制該裝載 及卸載部、該清洗部、該狀部以及該安置台之動作, 且影像處理由該第―影像感測器所拍攝之影像和2〇碼, 以計算該玻璃基板之厚度和檢測該21)碼。 [0037] 100130033 以及,該厚度測定和2_檢測系統由該測定終端機對在 該玻璃基板之上部以及下部分別拍攝之影像進行影像處 ^以根據下述關係式1計算作為測定樣品之該玻璃基板 第11頁/共50頁 理 表單編號A0101 1002050922-0 201211500 [0038] [0039] [0040] [0041] [0042] [0043] 100130033 第12頁/共50頁 之反射光之位置變化量, 【關係式1】 ^ δ x^os θ ^ δ d2= δ x2cos θ 2 在此,該<5 \及<5 \為與基準玻璃基板G之厚度d進行比 較時該玻璃基板之厚度變化量,該^及^為從該第一錯 射振蘆器和該第二_振1器朝該玻璃基板人射之入射 光之角度。 【關係式2】Form No. A0101 Page 1 of 50 l〇〇S 201211500 Laser beam is imaged as the first reflection point and the second reflection point on the lower surface of the glass substrate; and has 2D code image sensor and illumination a 2D code detector for capturing a 2D code of the glass substrate, wherein the illumination device is configured to provide illumination to the 2D code portion of the glass substrate when the 21) code image sensor operates [0035] Moreover, the thickness measurement and 2D code detection system of the glass substrate provided by the present invention, when the laser of the first laser oscillator and the second laser oscillator is a diffusion laser, in the upper and lower analyzers The interior also has a first lens and a second lens that convert the diffusion laser into a collimated laser or a spot laser. And the measurement terminal includes: an input unit having a keyboard and a mouse for inputting the operation command of the thickness measurement and the 2D code detection system, and searching by adjusting the axis and the γ axis of the measurement unit a 2D code joystick; an output unit for monitoring H and a material, the monitor outputs a thickness measurement of the glass substrate and a 2D code detection program screen and an image captured by the first image and 2] code on the screen The communication port is configured to transmit and receive data information measured by the measurement terminal device through the communication network; and the control unit 'the control unit stores and drives the thickness measurement and 2d code detection program' and according to the command of the person input through the input unit Automatically controlling the loading and unloading portion, the cleaning portion, the portion, and the mounting table, and image processing the image captured by the first image sensor and 2 weights to calculate the thickness of the glass substrate And detecting the 21) code. [0037] 100130033 and the thickness measurement and 2_detection system perform image recording on the image captured on the upper portion and the lower portion of the glass substrate by the measurement terminal device, and calculate the sample as the measurement sample according to the following relational expression 1 Glass substrate page 11/total 50 page form number A0101 1002050922-0 201211500 [0038] [0040] [0043] 100130033 Page 12 of 50 The positional change of reflected light [Relationship 1] ^ δ x^os θ ^ δ d2 = δ x2cos θ 2 Here, the thickness of the glass substrate when <5 \ and <5 \ is compared with the thickness d of the reference glass substrate G The amount of change, which is the angle of incident light from the first misfirer and the second transducer to the glass substrate. [Relationship 2]
"t 一 f'OC/Q I 1 2 UT 0 x^os did X〇c〇s Θ 1 2 2 在此,該d為基準玻璃基板之厚度^。 以及,根據該關係式1計算該%及以2之後,如上述關 係式2求出該破璃基板2〇之厚度t。 以及,作為為了解決上述技_題之手段,本發明所提 供之玻璃基板之厚度測定和2D碼檢測方法包括:⑷提 供厚度測定吨碼制系狀㈣,料度測定和⑼瑪 檢測系統具備安置有玻璃基㈣而同時旋轉迴圈於裝載 =載部、清洗部、測定部之三個安置台;(b)將該玻 /板女置到該裝載及卸載部之步驟;(㈠㈣旋轉該 女置台’以將該玻璃基板移送到清洗部之步驟;⑷在 該清洗部清洗璃基板之步驟;(e)同賴轉該安置 台’以將該破縣板料龍敎化步驟;⑴在該 ^定部對準並真空加壓該玻縣板之後,測定該玻璃基 表=並同時檢測2D碼之步驟;⑴同時旋轉該安 1002051 201211500 置台,以將該玻璃基板移送到該裝載及卸載部之步驟; (h)在該裝載及卸載部進行該玻璃基板之卸載和外觀檢 查之步驟。 [0044] 以及,在該(f )步驟中測定該玻璃基板之厚度之方法為 ,由關係式1計算朝該玻璃基板之上表面和下表面照射雷 射光束而從該玻璃基板反射之反射光之位置變化量, [0045] 【關係式1】 5 <5 XjCos Θ j δ ά2= δ x2cos θ 2 [0046] 在此,該6'及5d2為與基準玻璃基板之厚度d進行比較 時該玻璃基板之厚度變化量,該^^及^!為從該第一鐳射"t a f'OC/Q I 1 2 UT 0 x^os did X〇c〇s Θ 1 2 2 Here, d is the thickness of the reference glass substrate ^. Then, after calculating % and 2 based on the relational expression 1, the thickness t of the glass substrate 2 is obtained by the above-described relationship 2. And, as a means for solving the above problems, the thickness measurement and 2D code detection method of the glass substrate provided by the present invention include: (4) providing a thickness measurement tonne system (4), measuring the degree of material and (9) detecting system with placement a glass base (4) while rotating the loop back to the loading station, the cleaning section, and the three placement stages of the measuring section; (b) the step of placing the glass/plate female to the loading and unloading section; ((1) (4) rotating the female a step of "putting the glass substrate to the cleaning portion; (4) a step of cleaning the glass substrate in the cleaning portion; (e) a step of turning the mounting table to turn the broken plate into a step; (1) After the fixed portion is aligned and vacuum pressed the glass plate, the step of measuring the glass base table and simultaneously detecting the 2D code is determined; (1) simultaneously rotating the security 1002051 201211500 to transfer the glass substrate to the loading and unloading portion Step (h) performing the steps of unloading and visually inspecting the glass substrate at the loading and unloading portion. [0044] And, the method for measuring the thickness of the glass substrate in the step (f) is Calculate towards the glass The positional change amount of the reflected light reflected from the glass substrate by the upper surface and the lower surface of the substrate, [0045] [Relationship 1] 5 < 5 XjCos Θ j δ ά 2 = δ x2cos θ 2 [0046] Here, the 6' and 5d2 are thickness variations of the glass substrate when compared with the thickness d of the reference glass substrate, and the ^^ and ^! are from the first laser
1 L 振盪器和該第二鐳射振盪器朝該玻璃基板入射之入射光 之角度。 [0047] 【關係式2】 .... ...... t=d+ δ άχ+ δ d =d+ δ x cos Θ + 5 x9cos Θ [0048] 在此’該d為基準玻璃基板G之厚度d。 [0049] 以及’利用該關係式2求出該玻璃基板之厚度t。 [0050] 以及’在該(f )步驟中檢測2D碼之方法為,通過對拍攝 該玻璃基板之2 D碼之影像進行影像處理來檢測該2 D碼。 [0051] 承上所述’本發明之同時自動進行玻璃基板之裝載及卸 載、清洗作業、厚度及2D碼測定作業,此可具有可大幅 減小作業時間,提高作業效率之優點。 [0052] 其中’由於利用設置於玻璃基板20之上部之第一鐳射振 100130033 表單編號 A0101 第 13 頁/共 50 頁 1002050922-0 201211500 [0053] [0054] [0055] [0056] 自動剩定玻璃基板 號來測定厚度之同 [0057] [0058] [0059] 100130033 羞益322和第-影像感測器犯 定破璁其柘夕®Γ u非接觸方式測 土板之厚度之方式,因此 之署.由地剛定玻璃基板 之所有位置,並不限制於特定位置。 明從抛光之玻璃表面受到 或被污染之問題,而且具右处热 "又才貝 ㈤而且具有一使厚度㈤定作業變成自 動化,厚度測定作業之精確度大幅提高之致果了 其中,具有可利用鐳射以非接觸方式 之厚度,且可利用二維矩陣之觸發信 時讀取矩陣之效果。 本發明之效果並不限定於以上所述之情況,對於沒有提 及之其他效果,技術人員可從下面之記載明確地理解。 【實施方式】 以下,參照附圖詳細說明本發明之實施例,以使本發明 所屬技術領域之具有通常知識之技術人員容易實施。但 是,本發明能夠以各種不同之形態實現,並不限定於在 此所說明之實施例。並且,為了明確地說明本發明,附 圖中省略了與說明無關之部分,在整個說明書中對於相 似之部分將賦予相似之符號進行說明。 以下,參照附圖詳細說明本發明所要實施之具體之技術 内容。 <玻璃基板之厚度測定和二維碼檢測系統> 請參閱第9圖和第10圖,其分別係為本發明之最佳實施例 之玻璃基板之厚度測定以及二維碼檢測系統之構成圖和 設計圖。 表單編號A0101 第14頁/共50頁 1〇〇 201211500 LU_」 如第9圖以及第10圖所示,根據本發明之玻璃基板之厚度 測定和二維碼(以下稱為“2D碼,,)檢測系統包括:用於 裝載及卸載玻璃基板20之裝載及卸載部1〇〇 :清洗該玻璃 基板20之清洗部200 ;測定該玻璃基板2〇之厚度和2])碼 之測定部300 ;根據設置於中央之旋轉轴3〇而旋轉之三個 安置台40,以用於順序向該裝載及卸載部1〇〇和該清洗部 200以及該測定部300同時移送該玻璃基板2〇 ;測定終端 機400,自動控制該裝載及卸載部1〇〇、該清洗部2〇〇、 Ο 該測定部300以及該安置台4〇之動作,並對該測定部3〇〇 之第一'衫像感測器3 21 (參照第15圖之第一影像感測器 321 )所拍攝之影像和2D碼進行影像處理,以計算該玻璃 基板20之厚度和檢測該2D碼、 [0061]The angle of the incident light incident by the 1 L oscillator and the second laser oscillator toward the glass substrate. [Relationship 2] .......... t=d+ δ άχ+ δ d =d+ δ x cos Θ + 5 x9cos Θ [0048] Here, 'this d is the reference glass substrate G Thickness d. And the thickness t of the glass substrate is determined by the relational expression 2. And the method of detecting the 2D code in the step (f) is to detect the 2D code by performing image processing on the image of the 2D code of the glass substrate. According to the above description, the mounting and unloading of the glass substrate, the cleaning operation, the thickness and the 2D code measurement operation are automatically performed at the same time as the present invention, which can greatly reduce the working time and improve the work efficiency. [0052] [Because of the use of the first laser oscillator 100130033 disposed on the upper portion of the glass substrate 20 Form No. A0101 Page 13 of 50 1002050922-0 201211500 [0054] [0055] [0056] Automatically set glass The substrate number is used to determine the thickness [0057] [0059] 100130033 The yummy 322 and the first-image sensor are determined to break the thickness of the non-contact type soil measuring board, so The location of all the glass substrates is not limited to a specific location. The problem of being exposed or contaminated from the polished glass surface, and having the heat on the right side, and having a thickness (five) to make the operation become automated, and the accuracy of the thickness measurement operation is greatly improved. The thickness of the laser can be utilized in a non-contact manner, and the effect of reading the matrix can be obtained by using the trigger signal of the two-dimensional matrix. The effects of the present invention are not limited to the above, and those skilled in the art can clearly understand the other effects that are not mentioned. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention can be embodied in various different forms and is not limited to the embodiments described herein. Further, in order to clearly explain the present invention, the parts that are not related to the description are omitted in the drawings, and the same reference numerals will be given to the like parts throughout the specification. Hereinafter, specific technical contents to be implemented by the present invention will be described in detail with reference to the accompanying drawings. <Measurement of thickness of glass substrate and two-dimensional code detecting system> Referring to Fig. 9 and Fig. 10, respectively, the thickness measurement of the glass substrate and the composition of the two-dimensional code detecting system of the preferred embodiment of the present invention are respectively Diagram and design drawings. Form No. A0101 Page 14/Total 50 Page 1〇〇201211500 LU_" As shown in Figs. 9 and 10, the thickness measurement and the two-dimensional code of the glass substrate according to the present invention (hereinafter referred to as "2D code,") The detecting system includes: a loading and unloading unit for loading and unloading the glass substrate 20; a cleaning unit 200 for cleaning the glass substrate 20; and a measuring unit 300 for measuring the thickness of the glass substrate 2 and the 2] code; The three mounting stages 40 are disposed on the central rotating shaft 3〇 and are rotated for sequentially transferring the glass substrate 2 to the loading and unloading unit 1 and the cleaning unit 200 and the measuring unit 300; The machine 400 automatically controls the loading and unloading unit 1〇〇, the cleaning unit 2〇〇, the measuring unit 300, and the setting unit 4〇, and the first 'shirt image feeling of the measuring unit 3 The image taken by the detector 3 21 (refer to the first image sensor 321 of FIG. 15) and the 2D code are subjected to image processing to calculate the thickness of the glass substrate 20 and detect the 2D code, [0061]
G 該測定終端機400包括:輸入部41〇,該輸入部41〇具有 用於輸入該厚度測定和2 D碼檢測系統之動作命令之鍵盤 411和滑鼠412以及通過調節該測定部3 〇 〇之X軸和γ軸來 搜尋該2D碼之操縱桿413 ;具有監視器431和通信埠432 之輸出部430 ’該監視器431辛畫面上輸出該玻璃基板20 之厚度測定和2D碼檢測程式畫面和該第一影像感測器321 所拍攝之影像和2D碼’該通信埠432用於通過通信網收發 該測定終端機400所測定之資料資訊;控制部420,該控 制部420儲存並驅動該厚度測定和2D碼檢測程式,並根據 通過該輸入部410所輸入之命令而自動控制該裝載及卸載 部10 0、該清洗部2 0 0、該測定部3 0 0以及該安置台4 0之 動作,且影像處理由該第一影像感測器321所拍攝之影像 和2D碼,以計算該玻璃基板2〇之厚度和檢測該2D碼。 100130033 表單編號A0101 第15頁/共50頁 1002050922-0 201211500 [0062] /裝載及卸載部1QQ是將作業貝所要測定厚度之破璃基 裝栽到邊女置台4〇,並對在該測定部3〇〇結束厚度及 2D馬之測疋之坡璃基板2〇進行卸載和檢查外觀之地方。 έ載及卸載100設有能夠在卸載該玻璃基板20之前檢查 異物等之材料(玻璃基板)掛桿和燈(light)。— 剛Μ裝缺卸,當由料業員1()將該柄基板別 女置到安置台40時(或者,通過該測定終端機400之輸入 部410輪入測定命令時),該安置台40自動旋轉,將該玻 璃土板20移送至该清洗部2q〇。此時’如第9圖所示,該 安置σ 40由二個構成,以分別位於該裝載及卸載部1〇〇和 該π洗。卩200以及該測定部3〇〇,而且三個安置台4〇根據 »又置於中央之紅轉轴3〇而同時旋轉,從而旋轉迴圈於該 裝載及卸載部1〇〇和該清洗部2〇〇以及該測定部。該 安置台40之—側與該旋轉軸30連接,該安置台40之另一 侧形成為安置部41以預定間隔形成之叉子狀。 剛纟該清洗部2GG進行對從該裝載及卸載剛移送過來之該 玻璃基板20進行清洗之作業。在完成清洗作業之後,根 據該安置台40之旋轉,該玻璃基板20從該清洗部2〇〇被移 送至該測定部3〇〇。 [0065]當從該清洗部200移送過來該玻璃基板2〇時,在該測定部 300首先根據該X軸和γ軸對準裝置31〇而對準該玻璃基板 20之X軸和Υ軸。以及’在該測定部3〇〇通過⑼碼檢測器 340搜尋2D碼。此時,若沒有發現該21)碼,則該作業員 10利用該操縱桿413將該2D碼檢測器34〇朝X軸以及γ軸移 1002050922- 動’以搜尋該2D碼。若該2D碼被發現’則該2D碼檢測器 100130033 表單編號A0101 第丨6頁/共50頁 201211500 3 4 0將該2 D瑪拍攝為影像,並由該控制部4 2 〇影像處理所 拍攝之2D碼之影像,以檢測出2D碼。此時,2D碼之檢測 方法為屬於已公知之技術,在此不對其原理進行詳細說 明。 [0066] 當該2D碼檢測器340拍攝到2D碼時,該測定部3〇〇利用上 部測定儀3 2 0和下部測定儀3 3 0自動測定該玻璃基板2 〇之 厚度。此時,對於測定該玻璃基板2〇之厚度之方法,將 在後述之第15圖至第20圖中詳細說明。 ❹ [0067] 當該測定部3 0 0完成該玻璃基板2 〇之厚度和2 D碼測定時, 該安置台40自動旋轉,以將該玻璃基板2〇移送至該裝載 及卸載部100 〇 ' [0068] 在該裝載及卸載部100,該作業員1〇用肉眼對從該測定部 300移送過來之該玻璃基板20進行外觀檢查(檢杳異物等 )之後卸載’然後將所要測定之新之玻璃基板2〇裝載到 該安置台40。 [0069] 如此’根據本發明之玻璃基板之厚度測定和2D碼檢測系 統由於同時自動地進行玻璃基板20之裝載及卸載、清洗 作業、厚度和2 D碼測定作業’因此具有能夠大幅縮短作 業時間和提高作業效率之優點。 [0070] <測定部300之構成例〉 [0071] 請參閱第11圖’其係為本發明之第9圖和第1〇圖所示之測 定部300之構成圖。 [0072] 如第11圖所示’該測定部300包括:具有第一鐳射振盪器 100130033 表單編號A0101 第17頁/共50頁 1002050922-0 201211500 322和第一影像感測器321之上部測定儀320,該第一鐳 射振盪器322朝該玻璃基板20之上表面G1照射入射光li ’該第一影像感測器321將從該玻璃基板20之上表面G1反 射之反射光L2或者雷射光束在該玻璃基板2〇之上表面gi 反射之點SI、S2拍攝為影像;具有第二鐳射振盪器332和 第二影像感測器331之下部測定儀330,該第二鐳射振i 器332朝該玻璃基板20之下表面G2照射入射光L1,該第 二影像感測器331將從該玻璃基板2〇之下表面(;2反射之反 射光L2或者雷射光束在該玻璃基板2〇之下表面G2反射之 點SI、S2拍攝為影像;具有2D碼影像感測器342和照明 裝置341之2D碼檢測器340,該2D碼影像感測器342用於 拍攝該玻璃基板20之2D碼,該照明裝置341用於在該2D 碼影像感測器342工作時朝該破璃基板2〇之2])碼部位提供 照明。 [0073] [0074] [0075] [0076] <測定位置及2D碼位置〉 請參閱第12圖,其係為本發明之示出玻璃基板2〇之測定 位置及2D碼位置之圖。 該玻璃基板20如第12圖所示,多個晶片21以矩陣之形態 佈置,在該晶片21之拐角外廓形成21)碼22。在此,B指該 上部測定儀320之厚度測定位置,c指該上部測定儀32〇之 密封(sealing)位置(測定間距)。 该2D碼22為資料朝兩個軸(X方向,γ方向)排列之平面 化之2D碼,該2D碼22如船舶運輸用包裝一樣將批號( lot number)、預購號、接收者、數量其他資訊等各種 100130033 表單編號A0101 第18頁/共50頁 1002050922-0 201211500 内容用條瑪來类― 不’並黏貼到物件或與物件一同伴隨, 從=貝料伴隨著物件物之移動一起移動時,能夠表示 祀多:料該2D碼22用二維標諸(symbol )表示,在其 他電腦系統中不敲擊鍵盤也能夠實現再輪入。 闺該2D碼22之優點在於:一個標註(symb^)可包含大容 量之資料’能夠在較窄之區域内高密度地表示較多之資 料;空間利用率非常高;即使標諸(symbol)被污染或 損毁導致資料損壞也能夠通過檢測錯誤而恢復之能力卓 ^ 著,以及黑白兀件(element)並不局限於邊緣部位,因 此易於印刷和讀取標誌(symbol),且可多方位地讀取 標达(symbol);可以表示包括韓語在内之所有外語以 及圖形資訊。該2D碼22根據%成資料之方法而大體分為 堆疊式條碼(Stacked Bar Code)和矩陣碼(MatrixG The measurement terminal 400 includes an input unit 41A having a keyboard 411 and a mouse 412 for inputting an operation command of the thickness measurement and 2D code detection system, and by adjusting the measurement unit 3 The X-axis and the γ-axis search for the 2D code joystick 413; the monitor 431 and the communication port 432 output portion 430'. The monitor 431 outputs the thickness of the glass substrate 20 and the 2D code detection program screen. And the image and 2D code captured by the first image sensor 321 are used to transmit and receive the information information measured by the measurement terminal 400 through the communication network; the control unit 420 stores and drives the information The thickness measurement and the 2D code detection program automatically control the loading and unloading unit 100, the cleaning unit 2000, the measuring unit 300, and the placement table 40 according to a command input through the input unit 410. The image is processed by the first image sensor 321 and the 2D code is used to calculate the thickness of the glass substrate 2 and detect the 2D code. 100130033 Form No. A0101 Page 15 / Total 50 pages 1002050922-0 201211500 [0062] / Loading and Unloading Unit 1QQ is to load the glass base of the thickness of the work to the side of the table, and to the measuring unit. 3〇〇The thickness and the 2D horse's sloping glass substrate 2〇 are unloaded and inspected for appearance. The load carrying and unloading 100 is provided with a material (glass substrate) hanging rod and a light which can check foreign matter or the like before unloading the glass substrate 20. — when the equipment is unloaded and unloaded, when the handle member 1 () places the handle substrate on the placement table 40 (or when the measurement command is entered by the input portion 410 of the measurement terminal 400), the placement table 40 automatically rotates, and the glass earth plate 20 is transferred to the cleaning unit 2q. At this time, as shown in Fig. 9, the arrangement σ 40 is composed of two to be respectively located at the loading and unloading portion 1 and the π washing.卩200 and the measuring unit 3〇〇, and the three mounting tables 4〇 are simultaneously rotated according to the red shaft 3〇 placed at the center, thereby rotating the loop around the loading and unloading unit 1〇〇 and the cleaning unit 2〇〇 and the measurement unit. The side of the mounting table 40 is connected to the rotating shaft 30, and the other side of the mounting table 40 is formed in a fork shape in which the seating portions 41 are formed at predetermined intervals. The cleaning unit 2GG performs an operation of cleaning the glass substrate 20 that has just been transferred from the loading and unloading. After the cleaning operation is completed, the glass substrate 20 is transferred from the cleaning unit 2 to the measuring unit 3 according to the rotation of the mounting table 40. When the glass substrate 2 is transferred from the cleaning unit 200, the measuring unit 300 first aligns the X-axis and the x-axis of the glass substrate 20 in accordance with the X-axis and γ-axis aligning means 31A. And in the measuring unit 3, the 2D code is searched by the (9) code detector 340. At this time, if the 21) code is not found, the operator 10 uses the joystick 413 to shift the 2D code detector 34 to the X-axis and the γ-axis by 1002050922- to search for the 2D code. If the 2D code is found, then the 2D code detector 100130033 Form No. A0101 Page 6 / Total 50 pages 201211500 3 4 0 The 2 D Ma is taken as an image and taken by the control unit 4 2 〇 image processing The image of the 2D code to detect the 2D code. At this time, the detection method of the 2D code is a well-known technique, and the principle will not be described in detail herein. When the 2D code detector 340 captures the 2D code, the measuring unit 3 自动 automatically measures the thickness of the glass substrate 2 by the upper measuring instrument 3 20 and the lower measuring instrument 3 30 . In this case, a method of measuring the thickness of the glass substrate 2 will be described in detail in Figs. 15 to 20 which will be described later. [0067] When the measuring portion 300 completes the thickness of the glass substrate 2 and the 2D code measurement, the mounting table 40 automatically rotates to transfer the glass substrate 2 to the loading and unloading portion 100 〇 ' [0068] In the loading and unloading unit 100, the worker 1 visually inspects the glass substrate 20 transferred from the measuring unit 300 by visual inspection (unloading foreign matter, etc.) and then unloads 'the new one to be measured. The glass substrate 2 is loaded onto the mounting table 40. [0069] Thus, the thickness measurement of the glass substrate and the 2D code detection system according to the present invention can greatly shorten the operation time by simultaneously performing the loading and unloading of the glass substrate 20, the cleaning operation, the thickness, and the 2D code measurement operation. And the advantages of improving work efficiency. <Configuration Example of Measurement Unit 300> [0071] Referring to Fig. 11 is a configuration diagram of the measurement unit 300 shown in Fig. 9 and Fig. 1 of the present invention. [0072] As shown in FIG. 11, the measuring unit 300 includes: a first laser oscillator 100130033, a form number A0101, a 17th page, a total of 50 pages, 1002050922-0201211500 322, and a first image sensor 321 upper measuring instrument. 320. The first laser oscillator 322 illuminates the incident surface light G1 toward the upper surface G1 of the glass substrate 20. The first image sensor 321 reflects the reflected light L2 or the laser beam from the upper surface G1 of the glass substrate 20. The points SI, S2 reflected on the surface gi of the glass substrate 2 are taken as images; the second laser oscillator 332 and the second image sensor 331 are below the analyzer 330, and the second laser oscillator 332 faces The lower surface G2 of the glass substrate 20 illuminates the incident light L1, and the second image sensor 331 reflects the reflected light L2 or the laser beam reflected from the lower surface of the glass substrate 2 on the glass substrate 2 The points S1 and S2 reflected by the lower surface G2 are taken as images; the 2D code detector 340 having the 2D code image sensor 342 and the illumination device 341 is used to capture the 2D code of the glass substrate 20. The illumination device 341 is used in the 2D code image sensor 342 Broken glass toward the substrate when making the 2〇 2]) code portion to provide illumination. <Measurement Position and 2D Code Position> Referring to Fig. 12, it is a view showing the measurement position and the 2D code position of the glass substrate 2 of the present invention. In the glass substrate 20, as shown in Fig. 12, a plurality of wafers 21 are arranged in the form of a matrix, and 21) codes 22 are formed on the outer corner of the wafer 21. Here, B refers to the thickness measurement position of the upper analyzer 320, and c refers to the sealing position (measurement pitch) of the upper analyzer 32. The 2D code 22 is a planarized 2D code in which data is arranged in two axes (X direction, γ direction), and the 2D code 22 is a lot number, a pre-order number, a receiver, and the number of other packages such as a shipping package for ships. Information, etc. 100130033 Form No. A0101 Page 18/Total 50 Page 1002050922-0 201211500 Contents are used in the category of Malay - not attached to the object or accompanying the object, when the material moves along with the movement of the object It can be said that the 2D code 22 is represented by a two-dimensional symbol (symbol), and it can be re-entered without hitting the keyboard in other computer systems. The advantage of the 2D code 22 is that a label (symb^) can contain large-capacity data 'capable of representing more data in a narrower area in a narrower area; space utilization is very high; even if it is symbolized The ability to recover from damage caused by contamination or damage can also be recovered by detecting errors, and the black and white element is not limited to the edge, so it is easy to print and read the symbol, and can be multi-directionally Read the symbol; it can represent all foreign languages including Korean and graphic information. The 2D code 22 is roughly classified into a stacked barcode (Matrix) and a matrix code (Matrix) according to the method of % data.
Code)。 [0078] 在該玻璃基板之厚度測定和二維蹲檢測系統中測定之該 玻璃基板20之可以為最小600x406mm至最大699. 6x ❹ 440mm,但並不限定於此之。該厚度測定和二維碼檢測系 統可測定所有之透明以及半透明材質之玻璃基板2〇,而 且除了玻璃基板20之外,還可以測定其他材質之透明或 半透明材質之板之厚度。 [0079] <厚度測定儀之第一實施例> [0〇8〇] 清參閱第13圖和第14圖’其分別係為本發明之概略地示 出玻璃基板之厚度測定儀之第一實施例之立體圖和剖面 圖。此外’請參閱第15圖,其係為本發明之用於說明玻 100130033 表單編號A0101 第19頁/共50頁 1002050922-0 201211500 璃基板之厚度測定儀之内部構成和厚度測定方法之之說 明圖。 [0081] 該玻璃基板之厚度測定儀之第一實施例如第1 3圖至第1 5 圖所示’在該玻璃基板20之一侧上部及下部分別具有一 個或兩個以上之上部及下部測定儀32〇、330。該上部及 下部測定儀320、330在框架301構成為上下對稱且平行 。該上部及下部測定儀320、330與該玻璃基板20之間之 距離s最佳為2〇_左右。 [0082] 該上部及下部測定儀32〇、33〇如第15圖所示,其内部分 別具備朝該玻璃基板20之上表面G1或下表面G2照射入射 光L1之該第一鐳射振盪器322和該第二鐳射振盪器332和 將從該玻璃基板20之上表面G1或下表面G2反射之反射光 L2或者雷射光束在該玻璃基板2〇之上表面G1或下表面G2 反射之點SI、S2拍攝為影像之第一影像感測器321和第二 影像感測器3 31。以及,該上部及下部測定儀3 2 0、3 3 0 在其内部還具備當該第一鐳射振盪器322和該第二鐳射振 盡器332之鐳射為擴散鐳射時將該擴散鐳射轉換為准直鐳 射或點狀鐳射之透過透鏡323、333。 [0083] 該上部及下部測定儀320、330之基本規格之例子如下表1 〇 [0084] 【表1】 精確度 ±2μιη 測定時間(玻璃厚度+ 2D碼) 1秒以内 頭部(head)與測定物件之間 約 20min 表單編號A0101 第20頁/共50頁 1002050922-0 100130033 201211500 之距離 ^_ 測定對象 厚度測定區域 ---___ 厚度測定位置 鐳射 -~~__ 測定資料 —-------- ***頭部大小 〇 · 2~1. 5mra~~~~ — 外中央 可見紅光,1 m w 電腦自動記錄及處理 250x70x120 (mm3) Ο [〇〇86]〈測定玻璃基板之厚度之第一方法> [0087] [0088] 凊參閱第16圖,其係為本發明之甩轸戴明由玻璃基板之 厚度測定儀測定玻璃基板之厚度之第一方法之說明圖。 如第16圖所示,由該玻璃基板之厚度測定儀測定破螭基 板之厚度之第一方法為,當該第一鐳射振盪器322和該第 二鐳射振盪器332朝該玻璃基板20之上表面以及下表面分 別照射入射光時,該入射光在該玻璃基板20之上表面和Code). [0078] The glass substrate 20 measured in the thickness measurement of the glass substrate and the two-dimensional flaw detection system may be at least 600 x 406 mm to a maximum of 699. 6 x ❹ 440 mm, but is not limited thereto. The thickness measurement and two-dimensional code detection system can measure all of the transparent and translucent material glass substrates 2, and in addition to the glass substrate 20, the thickness of the transparent or translucent material of other materials can be measured. <First Embodiment of Thickness Measuring Instrument> [0〇8〇] Refer to Fig. 13 and Fig. 14 for details of the thickness measuring instrument of the glass substrate A perspective view and a cross-sectional view of an embodiment. In addition, please refer to Fig. 15, which is an explanatory diagram of the internal structure and the thickness measuring method of the thickness measuring instrument of the glass substrate, which is the invention of the glass 100130033, the form number A0101, the 19th page, the 50th page, the 1002050922-0201211500 glass substrate. . [0081] The first embodiment of the thickness measuring instrument for the glass substrate, as shown in FIGS. 13 to 15, has one or more upper and lower portions on one side and the lower portion of the glass substrate 20, respectively. The analyzers 32, 330. The upper and lower measuring instruments 320, 330 are formed in the frame 301 so as to be vertically symmetrical and parallel. The distance s between the upper and lower measuring instruments 320 and 330 and the glass substrate 20 is preferably about 2 〇. The upper and lower measuring instruments 32A and 33B are respectively provided with the first laser oscillator 322 that irradiates the incident light L1 toward the upper surface G1 or the lower surface G2 of the glass substrate 20 as shown in FIG. And the second laser oscillator 332 and the reflected light L2 reflected from the upper surface G1 or the lower surface G2 of the glass substrate 20 or the point where the laser beam is reflected on the upper surface G1 or the lower surface G2 of the glass substrate 2 S2 is taken as the first image sensor 321 and the second image sensor 3 31 of the image. And the upper and lower measuring instruments 3 2 0 and 3 3 0 further have therein to convert the diffusion laser into a laser when the lasers of the first laser oscillator 322 and the second laser oscillator 332 are diffused lasers. A direct laser or a spot laser passes through the lenses 323, 333. [0083] Examples of the basic specifications of the upper and lower analyzers 320, 330 are as follows: Table 1 [0084] [Table 1] Accuracy ± 2 μιη Measurement time (glass thickness + 2D code) Head and head within 1 second Measure the object between about 20 minutes Form No. A0101 Page 20 / Total 50 Page 1002050922-0 100130033 201211500 Distance ^_ Measurement object thickness measurement area ---___ Thickness measurement position Laser -~~__ Measurement data -------- --- System head size 〇 · 2~1. 5mra~~~~ — Red light visible in the center, 1 mw computer automatic recording and processing 250x70x120 (mm3) Ο [〇〇86]<Measurement of the thickness of the glass substrate A Method [0088] Referring to Figure 16, it is an explanatory view of a first method for measuring the thickness of a glass substrate by a thickness measuring instrument for a glass substrate of the present invention. As shown in FIG. 16, the first method for measuring the thickness of the broken substrate by the thickness measuring instrument of the glass substrate is when the first laser oscillator 322 and the second laser oscillator 332 face the glass substrate 20 When the surface and the lower surface respectively illuminate the incident light, the incident light is on the upper surface of the glass substrate 20 and
下表面反射’從而反射光輸出到該第一影像感測器321和 該第二影像感測器331。此時,該第一影像感測器32^名 爽面及下赛 該第二影像感測器331將從該玻璃基板20之上,、 #發送矣 面反射而入射進來之反射光分別拍攝為影像’ 該測定終端機400 ° <^21和該第二 [0089]該測定終端機400分別對該第一影像感測器、根據下述 影像感測器331所拍攝之影像進行影像處癦\下表面反 關係式1計算出分別從該玻璃基板20之上表面寿 1〇〇2〇5〇922Ό 100130033 表單編號A0101 第21頁/共50頁 201211500 射而入射到該第一影像感測器3 21和該第二影像感測器 331之反射光之變化量。 [0090] [0091] 【關係式1】 5 d}= ά XjCos θ } δ d2= δ x2cos θ 2 在此,該占d!及Jd〗為與基準玻璃基板G之厚度d進行比 較時該玻璃基板20之厚度變化量。此時,該占d及占d 根據玻璃基板而可以大於或小於該基準玻璃基板G之厚^ d,也可以與該基準玻璃基板g之厚度d相同。該θ及0 為從該第-鐳射振盡器322和該第二鐘射振盈器^朝該2 玻璃基板20入射之入射光之_角度.。 [0092] 根據該關係式1求出該^及“,,可以如下述關係式 2求出遠破璃基板2〇之厚度t。 [0093] [0094] 【關係式2】 t=d+ δά^δ d2=d+ δχ cos0 A δ x cos θ 1 ώ 2在此’該《基準玻璃基抓之厚度d,在敎作為測定樣 品之玻璃基板20之厚度之前實現儲存之基準值。 [0095] 在該關係式2中假設知。%和該⑽'為如下述關 3之A、B。此時’由於朝該玻璃基板2〇入射之入射光—一 ,因此該Λ、B具有一定之值。 —定 [0096] 【關係式3】 A=cos Θ j B = cos θ 2 100130033 表單編號Α0101 第22頁/共50頁 1002050922-0 Ο !_』,?〇當將該關係式3代入到該關係式2時’可真理為如下述之 [0098] 關係式4。 【關係式4】 t=d+5d1+<5d =d + A5Xl+B^x2 1 u [0099] 在此,該Ah及表示對應於樣品之厚度變化量之 在該第-影像L則器如和該第二影像感測器331内雷射 光束(反射光)之位置變化量,通過補償變為厚度變化 量。 〇 [〇1〇〇] 如果,在該關係式4中若假設該Β5χ2為“〇(Zero)’’, 則只有該儿5~對樣品厚度變化產生影響。相反,若假設 該Λδχ為‘‘〇 (zero),’ ,則只有該65\對樣品厚度變 1 化產生影響。 " [0101] 如此,在本發明中,通過檢測分別從作為樣品之該玻璃 基板20之上表面及下表面反射而入射至該第一影像感測 器321和該第二影像感測器331之反射光之變化量,可根 G 據該關係式1至關係式4而簡單地求出該玻璃基板20之厚 度t。 [0102] 因此,如果知道該入射光L1在該玻璃基板2〇之上表面以 及下表面G2反射之反射光之變化量(<5d及(5d ),則 可利用預先儲存之該基準玻璃基板G之厚度d計算出該玻 璃基板20之厚度。這種方法與待測物之材質或透明以及 半透明無關,可測定平板狀之所有待測物之厚度。 [0103] <測定玻璃基板之厚度之第二方法> 100130033 表單編號A0101 第23頁/共50頁 1002050922-0 201211500 [0104] 請參閱第17圖和第18圖,其係為本發明之用於說明由破 璃基板之厚度測定儀測定玻璃基板之厚度之第二方法之 說明圖。 [0105] 由該玻璃基板之厚度測定儀測定玻璃基板之厚度之第二 方法如第17圖和第18圖所示,該玻璃基板20之一側上部 或下部具備一個或兩個以上之上部測定儀320。該上部測 定儀320設置於框架301,並根據該操縱桿413可分別朝X 軸和Y軸以及Z軸方向移動±20mm〜±50mm。該上部測定儀 320與該玻璃基板20之間之距離s最佳為20mm左右。 [0106] 如第17圖所示,該上部測定儀320包括:第一鐳射振盪器 322,朝該玻璃基板20之上表面G1 (或者下表面G2)照 射入射光L1 ;第一影像感測器321,將該入射光L1在該破 璃基板20之上表面G1 (或者下表面G2)反射之第一點S1 和該入射光L1從該玻璃基板20之下表面G2 (或者上表面 G1)反射過來而通過該玻璃基板20之上表面G1 (或者下 表面G2)之第二點S2拍攝為影像。該上部測定儀320之内 部還具備當該第一鐳射振盪器322之鐳射為擴散鐳射時, 將該擴散鐳射變為准直鐳射或點狀鐳射之透過透鏡323。 [0107] 作為該測定樣品之玻璃基板20放置於測定位置之狀態下 ,當該作業員10操作該輸入部410開始測定厚度時,該第 一鐳射振盪器322根據該控制部420而運轉,以使入射光 L1傾斜預定角度Θ而朝該玻璃基板20之上表面G1照射。 如此’朝該玻璃基板20之上表面G1照射入射光L1時,朝 該玻璃基板20之上表面G1照射之入射光L1分為在該玻璃 基板20之上表面G1直接反射之第一反射光L2和朝該玻璃 100130033 表單編號A0101 第24頁/共50頁 1002050922-0 201211500 基板20之内部折射而在該玻璃基板20之下表面反射並通 過該玻璃基板2〇之上表面G1朝外部折射之第二反射光L3 。此時,在該玻璃基板20之上表面G1,該入射光L1反射 之第一點S1和該反射光L3通過之第二點S2顯示得比較亮 〇 [0108] 該第一影像感測器321將該入射光L1在該玻璃基板20之上 表面G1反射之第一點S1與該入射光L1在該玻璃基板20之 下表面G2反射而通過該玻璃基板20之上表面G1之第二點 S2之間之間隔距離k拍攝為影像。 〇 [0109] 該測定終端機400之控制部420對該第一影像感測器321 所拍攝之影像進行影像處理,以自動測定該第一點Si與 該第二點S2之間之間隔距離k。然後,以下面之關係式5 為媒介,計算該玻璃基板20之厚度t。 [0110] 【關係式5】 t=^XkXtan[sin J(nXsin(90 — Θj))] Ο [0111 ] 在此’该π為大氣狀態下之該玻璃基板20之折射率,該θ 1為該入射光L1之入射角度。 [0112] <測定玻璃基板之厚度之第三方法> [0113] 請參閱第19圖和第20圖’其係為本發明之用於說明由玻 璃基板之厚度測定儀測定玻璃基板之厚度之第三方法之 說明圖。 [0114] 由玻璃基板之厚度測定儀測定玻璃基板之厚度之第三方 100130033 表單編號Α0101 第25頁/共50 1 1002050922-0 201211500 法如第19圖和第20圖所示,在該玻璃基板2〇之一側上部 或下部具備一個或兩個以上之上部測定儀32〇。該上部測 疋儀3 2 0 6又置於框架3 01,並根據該操縱桿41 3可分別朝χ 軸和Y軸以及Z軸方向移動±2〇mm〜±5〇mm。該上部測定儀 320與該玻璃基板20之間之距離s最佳為2〇mm左右。 [0115] 如第19圖所示,該上部測定儀320包括:第一鐳射振盪器 322,朝該玻璃基板20之上表面G1 (或者下表面G2)照 射入射光L1 ;螢幕324,投影該入射光L1在該玻璃基板 20之上表面G1 (或者下表面G2)反射之第一反射光[2和 該入射光L1通過該玻璃基板2〇在下表面G2 (或者上表面 G1)反射之第二反射光L3 ;第一影像感測器321,將投影 到該螢幕324之該第一反射光L2之點S3和該第二反射光 L3之點S4拍攝為影像。當該第一鐳射振盪器322之鐳射為 擴散鐳射時,該上部測定儀320之内部還具備將該擴散鐳 射變為准直鐳射或點狀鐳射之透過透鏡323。 [0116] 作為該測定樣品之玻璃基板2 0放置於測定位置之狀態下 ’當該作業員10操作該輸入部410開始測定厚度時,該第 一鐳射振盪器322根據該控制部420而運轉,以使入射光 L1傾斜預定角度0而朝該玻璃基板2〇之上表面G1照射。 如此,朝該玻璃基板20之上表面G1照射入射光L1時,朝 該玻璃基板20之上表面G1照射之入射光L1分為在該玻璃 基板20之上表面G1直接反射之第一反射光L2和朝該玻璃 基板20之内部折射而在該玻璃基板20之下表面反射並通 過該玻璃基板20之上表面G1朝外部折射之第二反射光L3 。此時,在該玻璃基板20之上表面G1,該入射光L1反射 100130033 表單編號A0101 第26頁/共50頁 1002050922-0 201211500 之第一點S1和該反射光L3通過之第二點S2顯示得比較亮 0 [0117] 〇 [0118] 〇 [0119] [0120] 另外,該入射光L1在該玻璃基板20上反射而產生之該第 一反射光L2和該第二反射光L3投影到設置於該上部測定 儀320内部之該螢幕324。此時,形成於該螢幕324之由 該第一反射光L2投影而產生之第三點S3和由該第二反射 光L3投影而產生之第四點S4相比於形成於該玻璃基板20 之上表面G1之第一點S1和第二點S2顯示得更加明顯。因 此,該控制部420在進行影像處理時,可使點之間之距離 之測定更加準確。 但是,這樣之方法’該第三點S3與該第四點S4之間之位 置將隨著該螢幕324之位置而發生變化。因此,為了精確 地測定該玻璃基板之厚度,最佳為使該螢幕324之設置角 度02與該入射光L1之照射角度—致。由此,使得從 該玻璃基板20反射之該第一反射光L2以及該第二反射光 L3之方向於直接拍攝該螢幕324之該第一影像感測器321 之光軸之方向相互平行地排列。 該第一影像感測器321將投影到該螢幕324之該第一反射 光L2之點S3與該第二反射光L3之點S4之間之間隔距離X 拍攝為影像。 該測定終端機4〇〇之控制部420對該第一影像感測器321 所拍攝之影像進行影像處理,並根據下面之關係式6計算 該第一點S1與第二點S2之間之間隔距離X。 100130033 【關係式6】 表單編號A0101 第27頁/共50頁 1002050922-0 [0121] 201211500 κ= XX sine ---------sin(18〇^(Qi + 02)) [0122] [0123] [0124] [0125] [0126] [0127] [0128] 100130033 將上述關係式6代入到上述數關係式5,可以得出計算該 玻璃基板20之厚度t之下面之關係式7。由此,以下面之 關係式7為媒介,計算該玻璃基板20之厚度t。 【關係式7】The lower surface reflects 'and the reflected light is output to the first image sensor 321 and the second image sensor 331. At this time, the first image sensor 32 and the second image sensor 331 respectively image the reflected light incident on the glass substrate 20 and reflected by the transmission surface as The image 'the measurement terminal 400 ° < ^ 21 and the second [0089] the measurement terminal 400 respectively performs image processing on the image captured by the first image sensor according to the image sensor 331 described below. \The lower surface inverse relationship 1 is calculated from the surface of the glass substrate 20, respectively, 1 〇〇 2 〇 5 〇 922 Ό 100130033 Form No. A0101 Page 21 / Total 50 pages 201211500 shot and incident on the first image sensor 3 21 and the amount of change in reflected light of the second image sensor 331. [Relational expression 1] 5 d}= ά XjCos θ } δ d2= δ x2cos θ 2 Here, the ratio d· and Jd are compared with the thickness d of the reference glass substrate G. The thickness variation of the substrate 20. In this case, the d and d may be larger or smaller than the thickness of the reference glass substrate G depending on the glass substrate, and may be the same as the thickness d of the reference glass substrate g. The θ and 0 are angles of incident light incident from the first laser vibrator 322 and the second pyroelectric vibrator toward the 2 glass substrate 20. [0092] According to the relational expression 1, the thickness and the thickness of the far-glass substrate 2〇 can be obtained by the following relational expression 2. [0093] [Relationship 2] t=d+ δά^ δ d2=d+ δχ cos0 A δ x cos θ 1 ώ 2 Here, the thickness d of the reference glass base is used as a reference value for storage before the thickness of the glass substrate 20 as the measurement sample. [0095] It is assumed in the relationship 2 that % and the (10)' are A and B as shown in the following section 3. At this time, 'the incident light of the incident on the glass substrate 2 is one, so the Λ and B have a certain value. [0096] [Relationship 3] A=cos Θ j B = cos θ 2 100130033 Form number Α0101 Page 22 of 50 page 1002050922-0 Ο !_』,?〇 When the relationship 3 is substituted into the relationship In the case of Equation 2, the truth is as follows [0098] Relation 4 [Relationship 4] t=d+5d1+<5d=d + A5Xl+B^x2 1 u [0099] Here, the Ah and The amount of change in the position of the laser beam (reflected light) in the first image sensor 331 and the second image sensor 331 corresponding to the thickness variation of the sample is changed by the compensation to the thickness variation amount. 〇 1〇〇] If, in the relation 4, the Β5χ2 is assumed to be “Zero”, only the 5~ influence on the thickness variation of the sample. On the contrary, if the Λδχ is assumed to be ‘‘〇 (zero),’, then only the 65\ has an effect on the thickness of the sample. In the present invention, the first image sensor 321 and the second image sensor 331 are incident on the surface and the lower surface of the glass substrate 20 as samples. The amount of change in the reflected light can be simply obtained by determining the thickness t of the glass substrate 20 based on the relational expression 1 to the relational expression 4. Therefore, if the amount of change (<5d and (5d)) of the reflected light reflected by the incident light L1 on the upper surface of the glass substrate 2 and the lower surface G2 is known, the reference glass substrate stored in advance can be utilized. The thickness d of G is used to calculate the thickness of the glass substrate 20. This method is independent of the material of the object to be tested or transparent and translucent, and the thickness of all the objects to be tested can be determined. [0103] <Measurement of glass substrate Second Method of Thickness> 100130033 Form No. A0101 Page 23/Total 50 Page 1002050922-0 201211500 [0104] Please refer to FIG. 17 and FIG. 18, which are diagrams for describing the thickness of the substrate by the glass. An explanatory diagram of a second method for measuring the thickness of a glass substrate by a measuring instrument. [0105] A second method for measuring the thickness of a glass substrate by the thickness measuring instrument of the glass substrate is as shown in FIGS. 17 and 18, and the glass substrate 20 is shown. One of the upper portions or the lower portion is provided with one or more upper measuring instruments 320. The upper measuring instrument 320 is disposed on the frame 301, and is movable by ±20 mm in the X-axis and the Y-axis and the Z-axis direction according to the operating lever 413. ±50mm. The distance s between the measuring instrument 320 and the glass substrate 20 is preferably about 20 mm. [0106] As shown in FIG. 17, the upper measuring instrument 320 includes a first laser oscillator 322 facing the glass substrate 20 The surface G1 (or the lower surface G2) illuminates the incident light L1; the first image sensor 321, the first point S1 of the incident light L1 reflected on the upper surface G1 (or the lower surface G2) of the glass substrate 20 and the The incident light L1 is reflected from the lower surface G2 (or the upper surface G1) of the glass substrate 20 and is imaged as an image through the second point S2 of the upper surface G1 (or the lower surface G2) of the glass substrate 20. The upper meter 320 Further, when the laser of the first laser oscillator 322 is a diffused laser, the diffused laser is converted into a collimated laser or a spotted laser through the lens 323. [0107] The glass substrate 20 as the measurement sample is placed on In the state where the position is measured, when the operator 10 operates the input unit 410 to start measuring the thickness, the first laser oscillator 322 operates according to the control unit 420 to incline the incident light L1 by a predetermined angle 朝 toward the glass substrate. 20 above the surface G1 illumination. When the incident light L1 is irradiated onto the upper surface G1 of the glass substrate 20, the incident light L1 irradiated toward the upper surface G1 of the glass substrate 20 is divided into the first reflected light L2 directly reflected on the upper surface G1 of the glass substrate 20 and To the glass 100130033 Form No. A0101 Page 24 / Total 50 Page 1002050922-0 201211500 The internal refraction of the substrate 20 is reflected on the lower surface of the glass substrate 20 and is refracted toward the outside through the upper surface G1 of the glass substrate 2 Reflected light L3. At this time, on the upper surface G1 of the glass substrate 20, the first point S1 reflected by the incident light L1 and the second point S2 reflected by the reflected light L3 are displayed brighter [0108] The first image sensor 321 The first point S1 of the incident light L1 reflected on the upper surface G1 of the glass substrate 20 and the incident light L1 are reflected on the lower surface G2 of the glass substrate 20 and pass through the second point S2 of the upper surface G1 of the glass substrate 20. The distance k between them is taken as an image.控制[0109] The control unit 420 of the measurement terminal 400 performs image processing on the image captured by the first image sensor 321 to automatically measure the separation distance between the first point Si and the second point S2. . Then, the thickness t of the glass substrate 20 is calculated by using the following relational expression 5 as a medium. [Relationship 5] t=^XkXtan[sin J(nXsin(90 — Θj))] Ο [0111] Here, the π is the refractive index of the glass substrate 20 in an atmospheric state, and the θ 1 is The incident angle of the incident light L1. <Third Method of Measuring Thickness of Glass Substrate> [0113] Referring to FIG. 19 and FIG. 20, it is a description of the thickness of the glass substrate measured by a thickness gauge of a glass substrate. An illustration of the third method. [0114] Third party 100130033 for measuring the thickness of the glass substrate by the thickness gauge of the glass substrate Form No. 1010101 Page 25/Total 50 1 1002050922-0 201211500 As shown in Figs. 19 and 20, on the glass substrate 2 One or more upper gauges 32〇 are provided on one of the upper side or lower side of the crucible. The upper meter 3 2 06 is again placed in the frame 3 01, and can be moved by ±2〇mm~±5〇mm in the direction of the χ axis and the Y axis and the Z axis, respectively, according to the joystick 41 3 . The distance s between the upper measuring instrument 320 and the glass substrate 20 is preferably about 2 〇 mm. [0115] As shown in FIG. 19, the upper analyzer 320 includes a first laser oscillator 322 that illuminates the incident light L1 toward the upper surface G1 (or the lower surface G2) of the glass substrate 20; the screen 324 projects the incident The first reflected light [2] of the light L1 reflected on the upper surface G1 (or the lower surface G2) of the glass substrate 20 and the second reflection of the incident light L1 reflected by the glass substrate 2 on the lower surface G2 (or the upper surface G1) The light L3; the first image sensor 321 captures a point S3 of the first reflected light L2 projected to the screen 324 and a point S4 of the second reflected light L3 as an image. When the laser of the first laser oscillator 322 is a diffused laser, the upper measuring instrument 320 further includes a transmissive lens 323 which converts the diffused laser into a collimated laser or a spot laser. [0116] When the glass substrate 20 of the measurement sample is placed at the measurement position, when the worker 10 operates the input unit 410 to start measuring the thickness, the first laser oscillator 322 operates according to the control unit 420. The incident light L1 is irradiated to the upper surface G1 of the glass substrate 2 by tilting the incident light L1 by a predetermined angle 0. When the incident light L1 is irradiated onto the upper surface G1 of the glass substrate 20, the incident light L1 irradiated toward the upper surface G1 of the glass substrate 20 is divided into the first reflected light L2 directly reflected on the upper surface G1 of the glass substrate 20. And a second reflected light L3 that is refracted toward the inside of the glass substrate 20 and is reflected on the lower surface of the glass substrate 20 and refracted toward the outside through the upper surface G1 of the glass substrate 20. At this time, on the upper surface G1 of the glass substrate 20, the incident light L1 reflects 100130033. The first point S1 of the form number A0101 page 26/50 pages 1002050922-0 201211500 and the reflected light L3 are displayed through the second point S2. Brighter 0 [0117] 〇[0118] 〇[0119] [0120] In addition, the incident light L1 is reflected on the glass substrate 20 and the first reflected light L2 and the second reflected light L3 are projected to the setting. The screen 324 inside the upper meter 320. At this time, the third point S3 formed by the projection of the first reflected light L2 on the screen 324 and the fourth point S4 generated by the projection of the second reflected light L3 are formed on the glass substrate 20 The first point S1 and the second point S2 of the upper surface G1 are more apparent. Therefore, the control unit 420 can more accurately measure the distance between the points when performing image processing. However, the position between the third point S3 and the fourth point S4 will change with the position of the screen 324. Therefore, in order to accurately measure the thickness of the glass substrate, it is preferable to make the set angle 02 of the screen 324 and the irradiation angle of the incident light L1. Therefore, the direction of the first reflected light L2 and the second reflected light L3 reflected from the glass substrate 20 are arranged in parallel with each other in the direction of the optical axis of the first image sensor 321 directly capturing the screen 324. . The first image sensor 321 captures the distance X between the point S3 of the first reflected light L2 projected on the screen 324 and the point S4 of the second reflected light L3 as an image. The control unit 420 of the measurement terminal unit 4 performs image processing on the image captured by the first image sensor 321 and calculates the interval between the first point S1 and the second point S2 according to the following relational expression 6. Distance X. 100130033 [Relationship 6] Form No. A0101 Page 27/Total 50 Page 1002050922-0 [0121] 201211500 κ= XX sine ---------sin(18〇^(Qi + 02)) [0122] [0128] [0128] 100130033 By substituting the above relational expression 6 into the above-described number relational expression 5, the relational expression 7 below the thickness t of the glass substrate 20 can be calculated. Thus, the thickness t of the glass substrate 20 is calculated by using the following relational expression 7 as a medium. [Relationship 7]
!(nX 8111(90-6^)] ΧΧβίηθ! .,二 Xtanisin 8111(180-(0^02)) 在此’該η為在大氣狀態下之該玻璃基板2〇之折射率,該 為該入射光L1之入射角度,該02為該螢幕324之傾斜 角度。 在本發明中,可通過連接到該測定終端機400之通信埠 432之通信網將由該上部測定儀320所測定之該玻璃基板 2 0之厚度和2 D代碼資訊向外部傳送。以及,可利用設置 於該玻璃基板20之上部之該第一鐳射振盪器322和該第一 影像感測器321以非接觸方式測定該玻璃基板2〇之厚度, 且可自由地測定該玻璃基板2 0之所有位置之厚度。 根據本發明之玻璃板厚度測定方法,其使用領域並不限 定於玻璃板之厚度測定,顯然也可適用於測定透明材質 之板材厚度。 <玻璃基板之厚度測定和2 D碼檢測方法> 請參閱第21圖,其係為本發明之最佳實施例之玻璃基板 之厚度測定以及2D碼檢測方法之工作流程圖。 表單編號A0101 第28頁/共50頁 1002050922-0 201211500 Liuzy」 [0130] Ο [0131] [0132] Ο [0133] [0134] 首先,如第9圖所s兒明,本發明提供_種安置玻璃基板別 之三個安置台40同時旋轉迴圈於裝載及卸載部1〇〇、清洗 部200、測定部300之狀態下,可以同時進行裝載及卸載 、清洗、厚度和2D碼測定之厚度測定和二維碼檢測系統 〇 根據本發明之玻璃基板之厚度測定和21)碼檢測方法如第 21圖所示,在該裝載及卸載部1〇〇之安置台4〇安置該玻璃 基板20之後(步驟S100),同時旋轉該三個安置台4〇, 以將該玻璃基板20移送到清洗部2〇〇 (步驟sii〇)。 然後,在該清洗部200清洗從該裝載及卸載部1〇〇移送過 來之該玻璃基板20之後(步驟S12〇),同時旋轉該三個 安置台40,以將該玻璃基板2〇移送到該測定部3〇()(步驟 S130)。 然後,在該測定部300對準並真空加壓從該清洗部2〇〇移 送過來之該玻璃基板20之後(步驟sl4〇),搜尋⑽碼( 步驟S150)。此時,當發現該2D碼時(步驟sl5〇之“是 ),由該上部測定儀320檢測該玻璃基板2〇之2j)碼之後 ,測定該玻璃基板20之厚度(步驟sl7〇),當沒有發現 該2D碼時(步驟S150之“否”),利用該操縱桿413將 该上部測定儀320朝X軸和γ軸移動,以搜尋2])碼。 由該測定部3〇〇檢測該玻璃基板2〇之21)碼和測定厚度(步 驟S170)之後,同時旋轉該三個安置台4〇,以將該玻璃 基板20移送到該裝載及卸載部100 (步驟S180)。 然後,在該裝載及卸載部1〇〇進行該玻璃基板2〇是否黏上 100130033 表單編號A0101 第29頁/共50頁 1002050922-0 201211500 異物等之外觀檢查,然後卸載該玻璃基板2〇之後(步驟 S190) ’反復進行該步驟S100至步驟si9〇。 [0135] [0136] 如此構成之根據本發明之玻璃基板之厚度測量和2])碼檢 測系統及其方法可通過同時自動進行裝載及卸載、清先 作業、2D碼檢測和厚度測定作業來解決本發明之技術問 題。 以上所說明之本發明之最佳實施例是為了解決技術問題 而公開之,如果是本發明該技術領域之具有通常知識之 人(技術人員),可在本發明之思想和範圍内進行各種 修改、變更、添加等,但這種修改變更等應當視為屬於 權利要求書所記載之範圍。 本發明之破璃基板之厚度測定和2 D碼檢測系統及其方法 可應用於製造玻璃晶片之行業領域,且可作為提供玻璃 晶片測定相關標準化之技術來應用。 【圖式簡單說明】 第1圖係為本發明之現有之測定平板平坦度之商用菲佐干 涉儀之產品照片; 第2圖係為本發明之示出Zyg〇公司之Ver iF ire MST干涉 儀以及工作原理之圖; 第3圖係為本發明之示出用Zyg〇公司之VeriFire MST干 涉儀測定破螭晶片之測定結果之圖; 第4圖係為本發明之根據現有技術之大面積玻螭基板之厚 度测定裝置之構成圖; 第5圖係為本發明之根據現有技術之坡螭基板之厚度測定 裝置之構成圖; 100130033 表單編號A0101 第30頁/共50頁 1002050922-0 201211500 第6圖係為本發明之根據現有技術之根據鐳射之非接觸方 式之鏡面物體的形狀及厚度測定系統之構成圖; 第7圖係為本發明之根據現有技術之多層膜塗布玻璃之厚 度測定裝置之構成圖; 第8圖係為本發明之根據現有技術之玻璃晶片形狀測定裝 置之構成圖; 第9圖係為本發明之根據發明最佳實施例之玻璃基板之厚 度測定和二維碼(以下稱為“2D碼”)檢測系統之構成圖(nX 8111(90-6^)] ΧΧβίηθ! ., two Xtanisin 8111 (180-(0^02)) Here, η is the refractive index of the glass substrate 2〇 in the atmospheric state, which is The incident angle of the incident light L1, which is the tilt angle of the screen 324. In the present invention, the glass substrate measured by the upper meter 320 can be measured by a communication network connected to the communication port 432 of the measurement terminal 400. The thickness of the 20 and the 2 D code information are transmitted to the outside. And the first laser oscillator 322 disposed on the upper portion of the glass substrate 20 and the first image sensor 321 can be used to measure the glass substrate in a non-contact manner. The thickness of each of the glass substrates 20 can be freely measured. The method for measuring the thickness of the glass plate according to the present invention is not limited to the thickness measurement of the glass plate, and is obviously applicable to the measurement. Thickness of sheet material of transparent material. <Measurement of thickness of glass substrate and method for detecting 2D code> Refer to Fig. 21, which is a measurement of thickness of a glass substrate and a method of detecting a 2D code according to a preferred embodiment of the present invention. Flow chart. No. A0101 Page 28 / Total 50 pages 1002050922-0 201211500 Liuzy" [0130] Ο [0133] First, as shown in FIG. 9, the present invention provides a glass for arranging When the three other mounting stages 40 of the substrate are simultaneously rotated and recirculated in the loading and unloading unit 1 , the cleaning unit 200, and the measuring unit 300, the thickness measurement of the loading and unloading, cleaning, thickness and 2D code measurement can be simultaneously performed. The two-dimensional code detecting system 厚度 the thickness measurement of the glass substrate according to the present invention and the 21) code detecting method are as shown in FIG. 21, after the glass substrate 20 is placed on the mounting table 4 of the loading and unloading unit 1 (step S100), the three placement stages 4 are simultaneously rotated to transfer the glass substrate 20 to the cleaning unit 2 (step sii). Then, after the cleaning unit 200 cleans the glass substrate 20 transferred from the loading and unloading unit 1 (step S12A), the three placement stages 40 are simultaneously rotated to transfer the glass substrate 2 to the The measuring unit 3 () (step S130). Then, after the measurement unit 300 is aligned and vacuum-presses the glass substrate 20 transferred from the cleaning unit 2 (step sl14), the code is searched for (10) (step S150). At this time, when the 2D code is found (YES in step s15), after the upper measuring instrument 320 detects the 2j) code of the glass substrate 2, the thickness of the glass substrate 20 is measured (step s17), when When the 2D code is not found (NO in step S150), the upper measuring instrument 320 is moved toward the X-axis and the γ-axis by the joystick 413 to search for the 2] code. The measuring unit 3 detects the After the glass substrate 2 is 21) coded and the thickness is measured (step S170), the three placement stages 4 are simultaneously rotated to transfer the glass substrate 20 to the loading and unloading unit 100 (step S180). Then, The loading and unloading unit 1 〇〇 whether the glass substrate 2 is adhered to 100130033 Form No. A0101 Page 29 / Total 50 pages 1002050922-0 201211500 Visual inspection of foreign matter, etc., and then unloading the glass substrate 2 (step S190) ' This step S100 to step si9〇 is repeated. [0136] The thickness measurement of the glass substrate and the 2] code detection system and method thereof according to the present invention can be automatically loaded and unloaded at the same time, and the first operation is performed. , 2D code detection and thickness measurement The technical problem of the present invention is solved by the above-described preferred embodiments of the present invention, which are disclosed in order to solve the technical problem, and if it is a person having ordinary knowledge (technician) in the technical field of the present invention, Various modifications, changes, additions and the like are made within the spirit and scope of the invention, but such modifications and the like should be considered as falling within the scope of the claims. The thickness measurement and 2D code detection system of the glass substrate of the present invention The method can be applied to the industrial field of manufacturing glass wafers, and can be applied as a technology for providing standardization of glass wafer measurement. [Simplified Schematic] FIG. 1 is a conventional commercial Fizo interference for measuring flatness of a flat plate of the present invention. Photograph of the product of the instrument; Fig. 2 is a diagram showing the operation of the Zyg〇 company's Ver iF ire MST interferometer and the working principle; and Fig. 3 is the VeriFire MST interferometer of the Zyg〇 company shown in the present invention. A graph for measuring the measurement results of the broken wafer; FIG. 4 is a configuration of the thickness measuring device for the large-area glass substrate according to the prior art of the present invention. Figure 5 is a structural diagram of a thickness measuring device for a sloping substrate according to the prior art; 100130033 Form No. A0101 Page 30 of 50 1002050922-0 201211500 Figure 6 is based on the present invention. The technical diagram of the shape and thickness measurement system of the mirror object according to the non-contact method of laser; FIG. 7 is a structural diagram of the thickness measuring device of the multilayer film-coated glass according to the prior art of the present invention; FIG. 9 is a structural diagram of a glass wafer shape measuring apparatus according to the prior art; FIG. 9 is a thickness measurement and a two-dimensional code (hereinafter referred to as "2D code") detection of a glass substrate according to a preferred embodiment of the present invention. System composition diagram
第1 0圖係為本發明之根據本發明的玻璃基板之厚度測定 和2D碼檢測系統之設計圖; 第11圖係為本發明之第9圖以及第1〇圖所示之測定部3〇〇 之構成圖; 第12圖係為本發明之示出玻璃基板2〇之測定位置以及位 置之圖; ο 第13圖係為本發明之概略地示出玻璃基板之厚度測定儀 之第一實施例之立體圖; 第14圖係為本發明之概略地示出玻璃基板之厚度測定儀 之第一實施例之剖面圖; 第1 5圖係為本發明之用於說明玻璃基板之厚度測定儀之 内部構成和厚度測定方法之說明圖; 第16圖係為本發明之用於說明由玻璃基板之厚度測定儀 測定玻璃基板之厚度之第一方法之說明圖; 第1 7圖和第18圖係分別係為本發明之用於說明由玻璃基 板之厚度測定儀測定玻璃基板之厚度之第二方法之說明 ΞΙ · 圖, 100130033 表單編號Α0Ι01 第31頁/共50頁 1002050922-0 201211500 第1 9圖和第20圖係分別為本發明之用於說明由玻璃基板 之厚度測定儀測定玻璃基板的厚度之第三方法之說明圖 ;以及 第21圖係為本發明之關於根據本發明最佳實施例的玻璃 基板之厚度測定以及2D碼檢測方法之工作流程圖。 【主要元件符號說明】 [0137] 1 〇 :作業員; 20 :玻璃基板; 21 ·晶片, 22 :二維碼(以下稱為“2D碼”)(code); 30 :旋轉軸; 40 :旋轉安置台; 41 :安置部; 50 :安全壁; 60 :包裝產品; 100 :裝載及卸載部; 200 :清洗部; 300 :測定部; 301 :框架; 310 : X軸和Y軸對準裝置; 320 :玻璃基板之上部測定儀; 321 :第一影像感測器; 322 :第一鐳射振盪器; 323 :第一透鏡; 324 :蝥幕(screen ); 330 :玻璃基板之下部測定儀; 100130033 表單編號 A0101 第 32 頁/共 50 頁 1002050922-0 201211500 331 :第二影像感測器; 332 :第二鐳射振盪器; 333 :第二透鏡; 340 : 2D碼檢測器; 341 :照明裝置; 342 : 2D碼影像感測器; 400 :測定終端機; 410 :輸入部; 411 :鍵盤; 412 :滑鼠; 413 :操縱桿; 420 :控制部; 430 :輸出部; 431 :監視器; 432 :通信埠; B :玻璃基板上部測定儀320之厚度測定位置; C :玻璃基板上部測定儀320之密封位置(測定間距); G:基準玻璃基板; G1 :玻璃基板20之上表面; G2 :玻璃基板20之下表面; L1 :入射光; L2 :第一反射光; L3 :第二反射光; 51 :第一反射光L2反射到上表面G1之反射點; 52 :第二反射光L3反射到上表面G1之反射點; 53 :第一反射光L2投影到螢幕324之點; 100130033 表單編號A0101 第33頁/共50頁 1002050922-0 201211500 s4 :第二反射光L3投影到螢幕324之點; d :基準玻璃基板G之厚度; k :第一反射光L2反射到上表面G1之反射點si和當_ 乐一反射 光L3反射到上表面G1之反射點S2之間之間隔距離. t :玻璃基板20之厚度; 一反射光L3 X :第一反射光L2投影到螢幕324之點S3和第 投影到螢幕324之點S4之間之間隔距離; 行比較時 :入射光L1之入射角;02:螢幕324之傾斜角产 :玻璃基板20與基準玻璃基板G之厚度d進 之厚度變化量;以及 <5 d2 :玻璃基板20與基準玻璃基板G之厚度d 之厚度變化量。 進行比較 時 100130033 表單編號A0101 第34頁/共50頁 1〇〇2〇5〇922~0Fig. 10 is a plan view showing a thickness measurement and a 2D code detecting system of a glass substrate according to the present invention; and Fig. 11 is a measuring portion 3 shown in Fig. 9 and Fig. 1 of the present invention. FIG. 12 is a view showing the measurement position and position of the glass substrate 2 of the present invention; FIG. 13 is a first embodiment of the thickness gauge of the glass substrate schematically shown in the present invention. Fig. 14 is a cross-sectional view showing a first embodiment of a thickness measuring instrument for a glass substrate according to the present invention; and Fig. 15 is a thickness measuring instrument for explaining a glass substrate of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 16 is an explanatory view showing a first method for measuring the thickness of a glass substrate by a thickness measuring instrument for a glass substrate; FIG. 7 and FIG. The following is a description of a second method for determining the thickness of a glass substrate by a thickness measuring instrument for a glass substrate according to the present invention. 图 · Fig., 100130033 Form No. Ι0Ι01 Page 31/Total 50 Page 1002050922-0 201211500 Fig. 9 And 2nd 0 is an explanatory view for explaining a third method for measuring the thickness of a glass substrate by a thickness measuring instrument for a glass substrate, and FIG. 21 is a glass according to a preferred embodiment of the present invention. The working flow chart of the thickness measurement of the substrate and the 2D code detecting method. [Description of main component symbols] [0137] 1 〇: operator; 20: glass substrate; 21 · wafer, 22: two-dimensional code (hereinafter referred to as "2D code") (code); 30: rotary axis; 40: rotation Placement table; 41: Placement section; 50: Safety wall; 60: Packaged product; 100: Loading and unloading section; 200: Cleaning section; 300: Measuring section; 301: Frame; 310: X-axis and Y-axis alignment device; 320: glass substrate upper measuring instrument; 321 : first image sensor; 322: first laser oscillator; 323: first lens; 324: screen; 330: glass substrate lower measuring instrument; 100130033 Form No. A0101 Page 32 of 50 1002050922-0 201211500 331: Second Image Sensor; 332: Second Laser Oscillator; 333: Second Lens; 340: 2D Code Detector; 341: Illumination Device; : 2D code image sensor; 400: measurement terminal; 410: input; 411: keyboard; 412: mouse; 413: joystick; 420: control; 430: output; 431: monitor; Communication 埠; B: thickness measurement position of the glass substrate upper measuring instrument 320; C: glass substrate The sealing position of the measuring instrument 320 (measuring pitch); G: reference glass substrate; G1: upper surface of the glass substrate 20; G2: lower surface of the glass substrate 20; L1: incident light; L2: first reflected light; L3: Second reflected light; 51: a reflected point of the first reflected light L2 reflected to the upper surface G1; 52: a reflected point of the second reflected light L3 reflected to the upper surface G1; 53: a point at which the first reflected light L2 is projected onto the screen 324 100130033 Form No. A0101 Page 33 of 50 1002050922-0 201211500 s4: Point of projection of the second reflected light L3 to the screen 324; d: Thickness of the reference glass substrate G; k: Reflection of the first reflected light L2 to the upper surface The distance between the reflection point si of G1 and the reflection point S2 of the reflection light L3 reflected to the upper surface G1. t: the thickness of the glass substrate 20; a reflected light L3 X: the first reflected light L2 is projected onto the screen The distance between the point S3 of 324 and the point S4 projected to the screen 324; when comparing the line: the incident angle of the incident light L1; 02: the angle of inclination of the screen 324: the thickness d of the glass substrate 20 and the reference glass substrate G Increment in thickness; and <5 d2 : glass substrate 20 and reference glass base The thickness variation of the thickness d G. When comparing 100130033 Form No. A0101 Page 34 of 50 1〇〇2〇5〇922~0