201207312 六、發明說明： 【明 屬4¾.彳·*!^·^員:】 發明領域 本發明涉及具備散熱結構的照明裝置，所述散熱結構 能用實裝裸晶片狀態的LED(Light Emitting Diode)為主的 發光元件的密封環箍等控制發光元件並能將由於實裝發光 元件而產生的熱量輸送到遠離的位置而放出。 C ^tr ~Ji 發明背景 作為取代現有的螢光燈和白熾燈的新光源，使用以 LED為主的發光元件的照明裝置在增加。使用以led為主 的半導體的發光元件具有如下優勢：小型、消耗電力小、 發光色和發光圖案容易控制。 在習知技術中’對將單個的LED密封於包裝中的 LED ’施以樹脂外形而進行發光控制（例如，參照專利文獻 1)。而且’也有公開了將用於液晶畫面的背光(back light) 的LED在液晶晝面上集光的技術的文獻(例如，參照專利文 獻2)。 另一方面，為了容易生成各種各樣的發光色和發光圖 案’實裝多個LED的情況比較方便。在排列密封了各個LED 的發光單元時，會有如下的不利，即，由於每個LED的密 封狀態的不均勻而致使無法得到控制側預想的發光圖案和 發光色。 近年來，人們排列多個led，使用電腦程序來控制複 201207312 雜的發光色和發光圖案，在排列個別封裝而密封的LED 時，會產生密封不均勻所導致的不良影響。該等尤其是在 信號裝置等領域比較突出。 因此，就要求實裝多個LED並將實裝的多個LED集中 密封、及控制密封的多個LED的發光。尤其是為了降低實 裝成本和密封成本，就要求同時實現多個LED的密封和對 LED光的控制。 在這樣的狀況下，提出了實裝多個發光元件的技術(例 如，參照專利文獻3、4)。 此處，實裝多個發光元件時，給發光元件足夠的電力， 想使其進行高亮度的發光。但是，由於發光元件在其實裝 面產生高熱量，所以不能給予發光元件足夠的電力。結果， 實裝了多個發光元件的照明裝置就不能發出高亮度的光。 因此，就需要將實裝發光元件的實裝面產生的熱量發出的 結構。具備這樣的散熱結構的照明裝置被提出（例如，參照 專利文獻5、6)。 習知技術文獻 專利文獻 專利文獻1 : 專利文獻2 : 專利文獻3 : 專利文獻4 : 專利文獻5 : 專利文獻6 : 特開2007-88098號公報 特開2006-100575號公報 特開平11-162232號公報 特開2007-227679號公報 特開2010-49830號公報 特開2005-340065號公報 4 201207312 【明内3 發明概要 發明欲解決之課題 專利文獻1、2公開了密封單個LED的技術。專利文獻J 公開了使用炮彈型箱子密封單個LED的技術。雖然公開了 使用樹脂或透鏡構成炮彈型箱子的技術，但炮彈型箱子只 能用於單個LED，難以進行多個LED的密封。 另外’專利文獻2公開了在單個LED的前方設置凹透鏡 並將LED發出的光集中在液晶晝面上的技術。該技術也難 以用於在密封多個LED的同時控制集光的情況。 專利文獻3公開了實裝多個裸晶片狀態的LED，並在實 裝的LED上形成樹脂密封部件和微透鏡的技術。專利文獻3 通過解決樹脂構成的密封部件來實裝多個LED的問題和配 置與多個LED分別對應的位置上配置的透鏡群(透鏡群為微 透鏡），以解決將各個LED發出的光引導至外部的問題。 但疋’為了使微透鏡的各個透鏡根據多個LED的各 LED分別控制光’就會產生控制不均勻的問題。如信號或 集魚燈等那樣，各個透鏡的不均勻會給生成基於多個LEd 整體的發光色和發光圖案的必要性產生不良影響。而且， 使用微透鏡會有成本上升的問題。 專利文獻3不能解決分別具有密封LED的結構和控制 光的結構使得光控制不均勻和成本上升的問題。 專利文獻4公開了如下結構：以密封多個LED的大型透 鏡板為基礎，在透鏡板内部與LED接觸的部分填充樹脂， 201207312 該樹脂用以保護led。 但是’由於專利文獻4的技術係以透鏡板為基準密封多 個LED，所以存在led的發光控制依賴透鏡板的精度的問 題。而且’也有LED的密封也依賴透鏡板的大小和财久性 的問題，還有不適合集中多個LED並密封的同時控制發光 的問題。 專利文獻5公開了實裝LED的實裝基板具有散熱結構 或散熱片的照明裝置。通過這樣的散熱結構或散熱片，led 實裝面產生的熱量被放出。 但是’專利文獻5公開的照明裝置只具有在實裝lED的 基板上放出熱量的構造。因此，從散熱片放出的熱量滯留 在LED附近’實裝LED的空間整體的溫度無法降低，就不 月匕給予LED較局的電力。如專利文獻5那樣，如果只是實芽· 早體LED ’只通過這樣直接設置在實裝基板上的散熱片來 散熱就足夠了，在實裝多LED並想給予各LED較高電力 時’如果是專利文獻5那樣的構成，散熱能力就不夠。 另外，專利文獻6公開了通過並列了多個發光二極體的 基板來輸送發光二極體發出的熱量並用風扇散熱的照明& 置。但是，專利文獻6公開的照明裝置，由於只是將排成__ 列的發光二極體的熱量輸送到一個方向，所以實裝多個發 光二極體時熱量的輸送就不充分。尤其是，如果是需要高 亮度的照明裝置，發光元件容易以格子狀實裝，僅由向— 個方向輸送熱量的結構就不能充分輸送熱量。另外，如專 利文獻6那樣，僅僅通過普通的實裝基板來輸送熱量，可以 6 201207312 說熱量輸送係不充分的，實裝發光元件多時料適合。而 且，由於疋在平面上輸送熱量並用風扇散熱的構成，所以 也存在熱量容易滯留在發力二極體的實裝基板附近的問 題。 即，專利文獻5、6的技術存在不能實裝多個發光元件 並使該等熱量遠離實裝基板附近而放^的問題。 如上所述，習知技術的照明裝置分別具有密封多個 LED的、纟。構和控制光的結構，存在光的控制不均勻或成本 上升的問題。尤其是，像卫程用照明裝置、路燈、隧道内 照明裝置、信號裝置或集魚燈等那樣用多個led整體控制 照明時’需要在集巾？個LED並密封的同時均勻地控制多 個LED的發光。習知技術存在無法滿足這樣的要求的問題。 另外，密封多個發光元件坐在照明裝置時，要求適用 於像工程用照明裝置、路燈、隧道内照明裝置、信號裝置 或集魚燈等那樣需要高亮度的裝置。即，為了㈣高亮度， 需要給予多個發光元件較高的電力。 如果給予多個發光元件較高的電力，發光元件就會發 出间熱量。照明裝置需要使該等熱量遠離發光元件周邊並 被放出。如果不使該等熱量遠離發光元件周邊並被放出， 發光元件周邊的溫度就會上升，就不能給予發光元件足夠 的電力。 如上所述，習知技術的照明裝置存在如下問題：〇)不 能以低成本實裝多個發光元件、（2)不能給予多個發光元件 較冋的電力以使其高亮度發光、（3)不能使多個發光元件發 201207312 出的熱量遠離發光元件的實裝空間而被放出。 本發明鑒於以上問題，目的在於提高一種照明裝置， 該照明裝置適合用於工程用照明裝置、路燈、隧道内照明 裝置、信號裝置或集魚燈等，能在降低實裝成本的同時實 現最適合多個led的發光控制，並且即使以高亮度發光也 能將發光元件的熱量放出。 用以欲解決課題之手段 為解決所述課題，本發明的照明裝置，其具備：實裝 基板；安裝於實裝基板上的多個發光元件；密封環箍，設 置於實裝基板上並圍繞多個發光元件周圍；密封部件，填 充於密封環箱内部並在與發Μ件接觸的同時密封發光元 件；熱擴散部，包含於實裝基板，將發光Μ的熱量從多 個發光元件的實裝區域擴散到周邊區域；錢送部，將來 自熱擴散部的熱量向規定方向輸送；散熱部，將由熱輸送 部輸輯熱量向外部散出；並且_部件透明或半透明， 且其上面具有凹狀及凸狀中的至少—種形狀，密封部件實 ^對發光元件發出的光進行擴散及集中中的至少一種操 發明效果 1發_㈣裝置㈣過密封職、密封部件及透鏡 =兼顧裸晶片狀態的發光元件的密封和對發光元件發出 善=控制。其結果，能降低發光元件的實裝成本。通過 兼顧須的要素進而發光控制所必須的要素，能在 兼在封和發光控制的同時削減成本。尤其是，由於實裝 8 201207312 工序簡易化，所以進一步削減了實裝成本。 另外，本發明的照明裝置能通過密封環箍、密封部件 及透鏡板來一體控制多個發光元件，所說義不會產生發光 狀態的不均勻，能適用於信號裝置或集魚燈等。 另外，從發光元件放出到實裝基板的熱量，通過熱擴 散部從發光元件的實裝區域擴散到周邊區域，被擴散的熱 量在三維方向被輸送而放出。因此，多個發光元件發出的 熱量在遠離發光元件的空間被放出，所以能抑制發光元件 及其周圍的溫度上升。結果，就能給予發光元件較高的電 力，照明裝置就能以高亮度照射光。 而且，本發明的照明裝置能將發光元件在發光面產生 的熱量和發光元件在實裝面產生的熱量分別在三維方向放 出。結果，熱量不會滯留在發光元件附近，就能抑制發光 元件發熱，就能給予發光元件較高的電力。 尤其是，能適用於需要高亮度的信號裝置、工程用照 明裝置、隧道内照明裝置、路燈或集魚燈等。 圖式簡單說明 圖1係本發明的實施方式1的照明裝置的側視圖。 圖2係將本發明的實施方式1的照明裝置的主視圖。 圖3係本發明的實施方式1的照明裝置的側視圖。 圖4係本發明的實施方式1的照明裝置的側視圖。 圖5係本發明的實施方式1的照明裝置的一部分的側視 圖。 圖6係將本發明的實施方式1的照明裝置的主視圖。 201207312 圖7係將本發明的實施方式1的熱擴散部的側視分解 圖。 圖8係將本發明的實施方式1的熱擴散部的内部主視 圖。 圖9係本發明的實施方式1的照明裝置的側視圖。 圖10係本發明的實施方式2的照明裝置的側視圖。 圖11係本發明的實施方式2的照明裝置的側視圖。 圖12係顯示本發明的實施方式3的集魚燈的使用方式 的概略圖。 圖13係與本發明的實施方式4的比較例對應的照明裝 置模型的概略圖。 圖14係與本發明的實施方式4的實施例對應的照明裝 置模型的概略圖。 I：實施方式3 用以實施發明之形態 本發明的第1發明的照明裝置，其具備：實裝基板；安 裝於實裝基板上的多個發光元件；密封環箍，設置於實裝 基板上並圍繞多個發光元件周圍；密封部件填充於密封環 箍内部並在與發光元件接觸的同時密封發光元件；熱擴散 部，包含於實裝基板，將發光元件的熱量從多個發光元件 的實裝區域擴散到周邊區域；熱輸送部，將來自熱擴散部 的熱量向規定方向輸送；散熱部，將由熱輸送部輸送的熱 量向外部散出；並且密封部件透明或半透明，且其上面具 有凹狀及凸狀中的至少一種形狀，密封部件實行對發光元 10 201207312 件發出的光進行擴散及集中中的至少一種操作。 若採用該構成，照明裝置能以低成本及簡易的構成安 裝多個發光元件的同時抑制發光元件的溫度上升。其結 果’照明裝置能照射高亮度的光。 本發明的第2發明的照明裝置，在第1發明的基礎上 多個發光元件被安裝在沿著某個平面的該實裝平面，熱 散部沿著該實裝平面的方向將發光元件的發出的熱二汽 散，熱輸送部沿著與該實裝平面交叉的方向輸送 擴 散部擴散的熱量。 ，、'、擴 若採用該構成，照明裝置能將發光元件的執旦 放出至三維且分_區域。 “，、里輪送並 本發明的第3發明的照明裝置，在第1或第2發 上，進一步具有在密封部件上層層積的透鏡板，密j ^礎 及透鏡板透明或半透明，當透鏡板為凸透鏡時，密件 及透鏡板的積層將光集中，當透鏡板為凹透鏡時进2部件 件及透鏡板的積層將光擴散。 兄、，费封部 若採用該構成，通過具備透鏡板，照 心- 我置能切督 制發光元件發出的光。 貫控 本發明的第4發明的照明裝置，在第i至第3任 基礎上，密封部件進一步具備將來自發光元件卢發明的 的至少-部分的熱量傳導至密封環箍的熱傳導邹=封。1^件 若採用該構成，照明裝置能將發光元件 在發光面生成的熱量放出外部。 的熱量中 本發明的第5發明的照明裝置，在第i 芏第4任-發明的 201207312 基礎上，密封環箍在其表面及側面的至少一部分上進一步 具備散熱片，散熱片將從熱傳導部件傳導來的熱量向外部 散出。 若採用該構成，照明裝置能有效地將發光元件發出的 熱量中在發光面生成的熱量放出外部。其結果，發光元件 發出的熱量中，無論是在發光面生成的熱量還是在安裝面 生成的熱量，照明裝置都能將其放出外部。結果就能抑制 發光元件的溫度上升。 本發明的第6發明的照明裝置，在第1至第5任一發明的 基礎上，熱擴散部具備上部板、與上部板相對向的下部板 及在上部板和下部板之間層積的單個或多個的中間板，製 冷劑能夠被密封在由上部板、下部板及中間板形成的内部 空間中，中間板形成使氣化的製冷劑移動的單個或多個蒸 汽擴散通路和使凝縮的製冷劑移動的單個或多個毛細管流 路。 若採用該構成，熱擴散部能使發光元件的熱量在沿著 發光元件的安裝平面的方向上有效擴散。 本發明的第7發明的照明裝置，在第6發明的基礎上， 中間板具有形成蒸汽擴散通路的切槽部和形成毛細管流路 的内部貫通孔，切槽部從熱擴散部的大致中心位置以放射 狀形成。 若採用該構成，熱擴散部易於以放射狀將熱量擴散。 本發明的第8發明的照明裝置，在第6或第7發明的基礎 上，在内部空間的同一平面上，多個蒸汽擴散通路分別與 12 201207312 多個毛細管流路相鄰接。 若採用該構成，熱擴散部能高效地擴散熱量。 本發明的第9發明的照明裝置，在第1至第8任一發明的 基礎上，熱輸送部在熱擴散部周邊與熱擴散部熱接觸。 若採用該構成，熱輸送部能有效地接收從熱擴散部放 出的熱量。 本發明的第10發明的照明裝置，在第1至第9任一發明 的基礎上，熱輸送部具有能密封製冷劑的内部空間，内部 空間具備使氣化的製冷劑移動的蒸汽通路和使凝縮的製冷 劑移動的毛細管流路。 若採用該構成，熱輸送部能有效地將熱量輸送至規定 方向。 發明的第11發明的照明裝置，在第1至第10任一發明的 基礎上，進一步具備容納熱擴散部並使熱擴散部與熱輸送 部熱連接的安裝部。 若採用該構成，能切實使熱擴散部與熱輸送部熱連接。 本發明的第12發明的照明裝置，在第11發明的基礎 上，安裝部具備容納熱擴散部的插座、基座及壓板中的至 少一個。 若採用該構成，能容易實現熱擴散部和熱輸送部之間 的熱接觸。 本發明的第13發明的照明裝置，在第1至第12任一發明 的基礎上，散熱部具有散熱片（heat sink)、冷卻風扇、珀爾 帖(Peltier)元件、散熱板及液冷套管中的至少一個。 13 201207312 若採用該構成，散熱部能有效地將熱輸送部放出的熱 量向外部散出。 (實施方式1) 對實施方式1進行說明。 (全體概要） 首先，使用圖1、圖2對實施方式1的照明裝置的整體概 要進行說明。圖1係本發明的實施方式1的照明裝置的側視 圖。圖2係將本發明.的實施方式1的照明裝置的主視圖。圖1 係從側面看的照明裝置的狀態，是將密封環箍和密封部件 内部存在的發光元件設為可視狀態而顯示的。另外，圖2係 從上面看的照明裝置的狀態，是將密封環箍和密封部件内 部存在的發光元件設為可視狀態而顯示的。 照明裝置1具備：實裝基板2 ;以裸晶片狀態安裝於實 裝基板2上的多個發光元件3 ;密封環箍4，圍繞多個發光元 件3周圍；密封部件5，在密封環箍4内部在與發光元件3接 觸的同時密封發光元件3。而且，照明裝置1具備：熱擴散 部7，包含於實裝基板2 ;熱輸送部8，將從熱擴散部7放出 的熱向規定方向輸送；散熱部9，將由熱輸送部8輸送的熱 量放出外部。 並且，密封部件5為透明或半透明，密封部件5的表面 具有凹狀及凸狀中的至少一個。根據該構成，密封部件5進 行將發光元件3發出的光擴散及集中的操作中的至少一 個。根據該構成，照明裝置1可以利用密封發光元件3的部 件，將以裸晶片狀態實裝的多個發光元件3發出的光適當照 14 201207312 射至外部。 多個發光元件3實裝於實農基板2的實農面，但如圖蜥 示，適合以矩陣狀配置並㈣。這係由於通過這樣的矩陣 狀實裝照明裝置1能高亮度、高照射力照射對象物。 (發光元件的散熱） 另外，實裝多個發光元件3的實褒基板2包含熱擴散部 7。可以將實裝基板2自身作為熱擴散部7(與實裝基板2一體 形成）’也可以在實裝基板2内部設置熱擴散部7。熱擴散部 7將從發光7L件3的實褒面發丨的熱量從實|多個發光元件 3的實裝區域向周邊區域擴散。 由於熱擴散部7與熱輸送部8熱連接，所以熱擴散部鳩 散的熱向熱輸送部8傳導。熱輸送部8將從熱擴散部7傳導來 的熱量輸送至規定方向。輸送來的熱量到達與熱輸送部8熱 接觸的散熱部9，散熱部9將到達的熱量放出外部。 、 多個發光元件3實裝於實裝基板2,給予多個發光元件3 較高的電力以使其能以高亮度發光時，多個發光元件^會在 實裝基板2的實裝Φ發較高的熱4。該熱量從實裝面傳導 至實裝基板2，但由於實裝基板2包含熱擴散部7，所以該等 熱量將通祕織部7擴首先散至周邊區域。通過將熱量擴 散至周邊區域，就能抑制實裝發光元件3的區域（在=區 域，只要發光元件3發光，就會發熱)發出的熱量過大。而 且，由於被擴散的熱量通過熱輸送部8及散熱部9放出外 部，所以發光元件3所產生的熱量連續地被放出。 這樣，實裝基板2包含熱擴散部7，熱量被從熱擴散部7 15 201207312 輸送至與發光元件3的發光方向相反側被放出外部，由此能 防止熱量滯留在發光元件3上及發光元件3周圍。其結果， 能抑制發光元件3的發熱過大現象，所以就能給予發光元件 3較高的電力，發*元件3就能以非常高的亮度發光。結果， 照明裝置m能照射高亮度的光。圖i、圖2所示的照明敦置 i能將由於實裝多個發光元件3及高功率所產生的從發光元 件3到實裝基板2的熱量有效放出，所以能解決由於向發光 元件3供給電力產生熱量的問題。 即，多個發光元件3在沿著某個平面的實裝平面（由實 裝基板2形成的平面）上被實裝，熱擴散^沿著該實裝平面 將多個發光元件3的發出的熱量擴散，熱輸送部⑽著與該 實裝平面交叉的方向輸送從熱擴散部7擴散來的熱量，散熱 部9將其放出外部。這樣，照明裝置丨能將實裝於實裝平面 上的多個發光元件3發出的熱量向三維方向輸送並放出。結 果’不會使熱量㈣在多個發光元件3的朋，易於向發光 元件3供給較高電力。 尤其是發光元件3發出的熱量多數都產生實裝面上（即 實裝基板2上）。通過熱擴散部7、熱輸送部8及散熱部9將該 實裝面產生的熱量在由發光元件3三維分割的區域放出外 部。結果，發光元件3及發光元件3附近不易滯留熱量，抑 制了發光元件3的溫度上升。該抑制的結果，能給予發光元 件3較南的電力，照明襄置1就能以高亮度照射光。 (由照明裝置照射的光） 對發光7L件3發光和照明裝置1照射光的情況進行說 201207312 明。 ^多個發光元件3通過引線結合法或球栅(baU_gdd)實農 於實裝基板2上。由該實裝給發光元件3供給電力。: 給的觉 _ 却碭供 — 力，發光70件3發光。另外，多個發光元件3分別有 藍紅、綠等固有顏色。通過向具有各自的固有顏色的發 光元件3供給電力’多個發光元件3發出藍色、紅色 混合色的光。 ”巴、 a在多個發光元件3的周圍設有密封環箍4,該密封環箱4 P填充有以樹脂等為原材料的密封部件5。密封部件5與 多個^光元件3的表φ或側面相接觸，並密封多個發光元件 进封部件5通過該密封來保護發光元件3。料，在設置 衣箱4的基礎上，填充有密封部件5，所以密封部件5具 有與:封環箱4的形狀、大小相對應的形狀和大小。’、 密封部件5的表面（上面）具有凹狀及凸狀中的至少〆 此"亥达封轉在進行將從多個發光元件3發出的光集 中及擴相細作中的至少__個的同時使光發向外部。即， 密封部件5發揮對發光元件3的發光㈣魏，將從發光元 件3發出的光照射至外部。 密封％姬4、挽封部件5具有保護例如裸晶片狀態的發 ^件3免於露出外部的密封魏，輸t魏原本是密封 %抠4等的作為。但密封環箍4和密封部件5除了具有密封功 能還有密封·4、密封部件5控财個發光元件谱出的光 的集中或擴散的功能。 不需要添加夕餘的部件就能實現密封和發光，所 17 201207312 以心、明#置1不需要多餘的成本。而且，照明裝置1係在集 中並密封多個發光元件3的基礎上控制發光，因此不會每個 發光元件3發光和密封的不均勻。並且，由於密封和發光控 制能同時在同—個部件巾實現，就不會有密封和發光控制 的不I衡’從而防止發光的不均^特別是，由於是在集 中並^封多個發光元件3的狀態τ進行發光控制所以照明 裝置1能在料多個發光元件3並使其發光的基礎上實現集 光或擴散。 (透鏡板的積層） 另外，照明裝置％可以具有在密封部件5上積層透鏡 糾的構成。通過具有透鏡板6，密封板5和透鏡板6能更切 貫地將多個發光元件3發出的光集中或擴散。結果，照明裝 置1能更切實地控制由多個發光元件3向外部的光照射。 圖3 '圖4係本發明的實施方式1的照明裝置的側視圖。 圖3、圖4顯示了在密封部件5上積層透鏡板6的構成。 '如圖3、圖4所示那樣，透鏡板6在密封部件5上積層。 透鏡板6具有凸透鏡或凹透鏡形狀，在密封部件5的積層面 上丄根據透鏡板6的曲面的形狀來積層。將密封部件5填充 =密封環114中時，由於密封料5__脂等所以就 :易根據透鏡板6的形狀形成密封部件5的積層面的形狀。 、、’。果’密封部件5與透鏡板6就能以順流暢的曲面相接觸。 a在圖3中’密封部件5的表面具有凹狀的曲面，在密封 #件5上層積的透鏡板6為凸透鏡。另—方面，在圖*中，密 封部件5上層積的透鏡板6為凹透鏡。 18 201207312 密封部件5及透鏡板6為半透明或透明，使從發光元件3 發出的光透過。此時’發光元件3通過密封部件5及透鏡板6 形成的折射曲面將發出的光照射至外部。此時，密封部件5 及透鏡板6根據曲面形狀進行將發光元件3發出的光擴散及 集中的操作中的至少一個。即，照明裝置丨通過一個集光功 能或擴散功能將多個發光元件3發出的光集中並照射至外 部。 即，岔封部件5和透鏡板6合起來控制多個發光元件3發 出的光並使其照射至外部。與只有密封部件5的情沉相比， 結合了透鏡板6的情況下，能實現更精細的發光控制。 而且’在密封部件5上積層透鏡板6，透鏡板6還發揮保 遵密封部件5的仙。該等情況的結果，通過密封部件5及 透鏡板6,照明裝41能集中並密封多個發光元件理且集中 進行發光控制而將光照射至外部。 利用圖2,對在從照明裝η的上面（正面）看的狀離下由 照明裝置m行光照射的情況進行說明。圖2顯示了從上面 看照明裝置的狀態，存在於密封環箍4和密封環箍4内部的 發光元件3以可視狀態顯示。 在圖2所示的照明裝置1中，密封環箍4圍繞與多個發光 疋件3為—體的周圍。此處，密封環箍4從上面看時大致呈 _。大致圓形的㈣·4的内部實裝有多個發光元件 3’所以多個發光元件3發出的光以大致圓形擴散或集中， 易調整照明裝置1的發光方向和發光角度。當然，密封 %箍4也可以是大致橢圓形或多邊形。 201207312 擴散或集中 另外，從上面看時，是以透鏡板6、密封部件5、發光 元件3的順序積層，但由於透鏡板6及密封部件5係半透明或 透明的，所以能夠透過兩者看到發光元件3。钟果，發光S_ 件3發出的光透過透鏡板6及密封部件5照射至外部。此時& 發光元件3發出的光通過透鏡板6及密封部件5形成的曲面 此時，如圖3所示那樣，透鏡板6為凸透鏡時，由於凸 透鏡的折射’發光元件3發出的光集中於照射物件上而照 射。這種情況如箭頭A所示。密封部件5和透鏡板S沿著箭頭 A將發光元件3發出的光照射至外部。透鏡板6為凸透鏡的情 況在想從遠處目視確認照明時有效。 另一方面，如圖4所示那樣，透鏡板6為凹透鏡時，由 於凹透鏡的折射，發光元件3發出的光擴散至照射物件上而 照射》這鐘情況如箭頭B所示。密封部件5和透鏡板6沿著箭 頭B將發光it件3發出的光照射至外部。透鏡板6為凹透鏡的 情況在想看的範圍内同等程度照射時有效。 這樣，照明I置1根據密封部件5的表面形狀（曲面)及透 鏡板6的形狀將發光元件3發出的光集中或擴散並照射至外 部。 另外’在實裝基板2上從密封環箍4至透鏡板S為實裝的 狀態下構成照明裝置卜所以，照明裝置丨可移動性優異， 可以作為一個單元組合在各種各樣的機器中。由於照明裝 置1能集中並密封多個發光元件3並且集中進行發光控制: 所以最適合組合在信號裝置、集魚燈、隧道内的照明^置、 20 201207312 路燈等需要較高發光量的裝置中。 如上所述，實施方 。 集中並密封在-個密封针照明裝置卜將多個發光元件3 件3密封的不均勻。另外长栖4内部’由此能防止各個發光元 部件5和透鏡板6，能將通過在密封環箍4内部積層密封 制。尤其是，密封環箍4 ^固發光元件3發出的光集中而控 不表示不需要非常嚴密的和透鏡板6分別接觸（並 分離狀態)狀態，由此密：叫^ 兼顧_個㈣件心::=::鏡_ 件3的密封功能和發光月以較少的部件實現對發光元 尤控制功能。結果就能降低成本。 此外，在圖1姻中’為確保_清楚，對多個發光元 口牛中的-個發光科用符號“3”表示，對其他的發光元件也 可以用同樣的符號來理解。 (從發光元件向發光面的熱量控制） 接著，參照圖5對從照明裝置1的發光元件3傳導至發光 面的熱量的放出進行說明。圖5係本發明的實施方式i的照 明裴置的一部分的側視圖。 要求照明裝置1適合用於需要高亮度的工程用照明裝 置、路燈、隧道内的照明裝置、信號裝置或集魚燈等。因 此，為使發光元件3以高亮度發光，就需要給予發光元件3 較高的電流值或較高的電壓值。由於這樣高亮度的發光， 發光7L件3會產生高熱量，此處，多個發光元件3會從實裝 面、發光面及側面發出熱量。 21 201207312 發光元件3發出的該等熱量中，從實裝面發出的熱量通 過熱擴散部7擴散，並介由熱輸送部8從散熱部9放出外部。 該熱量的放出如上所述。 另—方面’發光元件3發出的該等熱量中’從發光面及 側面發出的熱量，傳導至密封部件5 。這係由於密封部件5 通過费封發光元件3的發光面和側面與發光元件3的發光面 和側面熱接觸的緣故。由此，密封部件5接收發光元件3發 出的熱量。 另外，為了密封發光元件3，密封部件5採用熔融樹脂 專由於炼融樹脂等與金屬等相比熱傳導性差，所以多數 情况下密封部件5會蓄積從發光元件3發出的熱量。如果密 封邛件5蓄積從發光元件3發出的熱量，照明裝置丨會出現許 誤動作、出現損害或故障。為避免這樣的問題，就需要降 低給予發光元件3的電流值或電壓值。但是，如果降低給予 發光元件3的電流值或電壓值，發光元件3的發光亮声就會 降低，照明裝置1就難以適用於需要高亮度的工程用照明^ 置、路燈、隧道内的照明裝置、信號裝置或集魚燈等。 密封部件5在其内部具有熱傳導部件5〇。熱傳導1卡 接收密封部件5内部的熱量，將其傳導至密封環箍4為 熱傳導部件50適合具有由熱傳導性高的材料形成的格/ 狀。例如，金屬網等❶ 熱傳導部件5〇設於密封部件5内部並血 ^ , 一在封環箍4熱接 觸。由此，熱傳導部件50能將由密封部件5而 從發光元件3發出的熱量）傳導至密封環箍4。a :里（即 进封環箍4露 22 201207312 出於二部’能將從熱傳導部件爾收的熱量放出到外部。 疋由於密封j錢4由金屬、合金或熱傳導性高的樹脂 等形成，所以密封環箍4能將傳導來的熱量放出至外部、基 板、筐體等。這樣的結果，從發光元件3的發光面及側面的 至少—部分發出的熱量料會f積在密封料5内部，而經 由熱傳導部件5G及輯賴4而放出外部。 策’、’、傳導。卩件5〇能將容易積存熱量的密封部件5内 部的熱量有效放出外部。 ^另外，密封環箱4在其表面及側面的至少一部分上具有 is，由此’能將從熱傳導部件5〇傳導來的熱量放出外 =圖6係、本發日㈣實施方式1的照日购的主視圖。圖6顯 ;半:照明裝置1的光照射方向看的狀態。即，將透視透明 =6透中明的密封部件5而實裝的多個發先元幻的狀態表示 從封在其側面具有散熱片4 藉4的側面延伸。餘 在輯環 —與也 傳導部靖導至密封她的熱量放出;:熱:：二 Γ=:::光元件3發光時作為發一封部件5 另外，如圖6所示，熱傳導部件％具有不與多個 件3的實裝位置重複的格子形狀。通過這樣的 = 不妨礙發光元件3的發光。 成 (向實裝面的熱量的放出和向發光面的熱量的放出） 23 201207312 如上所述’實施方式【的照明裝置】通過熱擴散部7、熱 輸达部8和散熱部9的組合，能將多個發光元件3所發出的熱 S中產生在實裂面上熱量在與發光元件3相分離的區域被 放出。即，在實I面產生的熱#在與發光元件3三維分離的 區域被放出。而且，在㈣部件5上設置有㈣導部件50 時’通過熱傳導部件5〇、密封環箍4及散熱片4()，能將多個 發光兀件3所發出的熱量中產生在發光面上熱量在與發光 τΜ牛3相分離的區域被放出。即，在發光面產生的熱量在與 •fx光元件二維分離的區域被放出。 /在圖5中’用箭頭G、箭顧來表示該等熱量的放出路 徑。在發光7G件3的發光面產生的熱量沿著箭頭〇被放出外 4，在發光元件3的實裝面產生的熱量沿著箭頭11被放出外 部。通過這兩個系統的散熱，在發光元件3的附近就不易滞 留熱量，就能抑制發光元件3及發光元件3周圍的溫度上 升。即，通過由箭頭G、箭頭Η混合的系統的散熱，就能進 —步提高對發光元件3的溫度上升的抑制。 這樣’通過抑制發光元件3的溫度上升，就能給予發光 元件3較高的電力，照明裝置丨就能以高亮度照射光。通過 以β亥咼亮度照射光，照明裝置i就適用於例如工程用照明裝 置、路燈、隧道内的照明裝置、信號裝置或集魚燈等。 當然’由熱傳導部件50、密封環箍4及散熱片4〇構成的 沿箭頭G的路徑的散熱不是必須的構成。 接著，對各部件進行詳細說明。 (實裝基板） 24 201207312 首先，對實裝基板進行說明。 實裝基板2用於實裝多個發光元件3。像玻璃環氧板那 樣，貫裝基板2係能通常用於電子部件和半導體積體電路實 裝的基板，也可以是具備能進行電氣信號的傳輸的配線層。 實裝基板2可以只貫裝用於照明裝置丨的多個發光元件 3，也可以貫裝除發光元件3以外的電子部件和半導體積體 電路。例如，«基板2先餘具有控制功能和加工功能的 半導體積體電路和必要的電子部件，在該等以外的區域上 貫裝多個發光元件3也可以。 —另外’實裝基板2能通過引線接合、倒裝片或球柵等電 實裝發光元件3，並將設置於實裝额其他電路 的電jg號給予發光元件3。 即，實裝基板2形成㈣裝置丨的基本，並給予多 個發光元件3電信號。實裝基板2的形狀和大小可以根據多 個發光科數來設定，也可崎據制於照明裝置丄 時的使用狀態來設定。另外，實裝基板2具有除了發光元件 3之外還能實裝㈣《轉樣的_面也有觀本發 實施。 另外’實裝基板2包含熱擴散部7。例如，可以是在實 裝基板2内部容納熱擴散部7,可以是在實裝基板2上積層執 擴散部7，也可以是實裝基板2自身作為能實裝電子部件等 的熱擴散部7。這種情況下，熱擴散部7表面具有能實裝以 電子元件3為首㈣子料和好元件㈣㈣等比較 25 201207312 (發光元件） 接著’對發光7〇件3進行說明。通過在實裝基板2上實 裝多個發光元件3，照明裝置1能以高亮度照射光。向多個 發光元件3分別供給電力而使其發光，照明裝置丨將多個發 光元件3各自的光集中而照射高亮度的光。 心光元件3係'接收電信號而發光的元件。只要是具有接 收電信號而發光功能的元件什麼都可以，但從實裝和控制 的容易性來看，適合使用LED。這係由於㈣具有能根據 給予的電信號的電流·電壓來控制發光狀態且具有藍色、紅 色、綠色等固有色從而容易控制發光顏色的圖案的優點。 多個發光元件3被實裝於實裝基板2。發光元件3的個數 根據照明裝置1的樣子適當設定就可以，將幾個到幾百個 (或幾千個)發光元件3實«裝基板2上。發光元件3通過引 線接合或球柵實裝於實裝基板2，與實裝基板2(進一步與實 裝於實裝基板2上的其他電子部件）電連接。通過該電連 接’發光元件3接收電信號而發光。 發光元件3根據接收的電信號的電流值.電壓值或信號 的波形圖案來發光，並進行基於發光元件3所具有的固有顏 色的發光。根據該等發光變化，發光元件3實現各種發光圖 案。根據實裝基板2或與實裝基板2分開設置的具有控制功 能的部件，發光元件3實現依據顏色、發光水平、發光間隔 等各種各樣標準的發光。 各發光元件3也多以裸晶片狀態實裝於實裝基板2上。 通過以裸晶片狀態實裝，能削減發光元件3的成本和體積， 26 201207312 從而削減照明裝置1的成本和體積。而且，通過以裸晶片狀 態實裝發光元件3，密封部件5及透鏡板6能直接接收發光元 件3發出的光，就需要多餘的發光控制。因此，以裸晶片狀 態實裝發光元件3有利於本發明的實施。 另外，由於發光元件3為裸晶片狀態，發光元件3就具 有表面、裡面和側面。裡面成為與實裝基板2的實裝面，從 表面個侧面的至少一部分上發光。另外，由於實裝基板2上 實裝有多㈣光元件3,發光元件3與_的發光元件3之 也可能會產生光的反射。 .Α Θ …u 似佩尸/Γ施加的電 I”而：發广可以將具有相同固有顏色的發光元 外，各多鮮光元：照不同的固有顏色來排列。另 夕個毛先兀件3可以並聯也可以串聯。去缺 疋在並聯和串觀合的狀態τ:’也可以 (密封環箍） 赞尤及*件3電連接。 二令，蚵社、封環箍4進行說明。 密封環箍4圍繞實裝於實 的周固。如圖2所示，密封Ζ基板2上的多個發光元件3 兀件3的周圍。優選密封環箍 冑裝的多個發光 形的同時職發光元件3 ，/从1®形、大致糖圓 形:同時圍繞發光元件圍但也::在形成方形或多邊 =的周圍而形成，因此，利用;二， 仃光照射的基本外形。 衣捆4形成照明裝置1 另外，密封環箍4的 度和開口面積中至少1要根據 27 201207312 jfT" //1 的個數來確定。由於如果發光元件3的個數多密 且環^的外周變大，所以密封環H4的開口面積變大。而 大士果發光tl件3的個數多來自發光元件3的發光量就變 因此為反射較多的光’密封環箱4的高度就變高。 由於进封環箍4中填充有密封部件5，所以優選密封環 箍4的外周鈕 _ 4。這係由於密封部件5多為熔融樹脂，處於 防充的熔融樹脂漏出密封環箍4外部的需要。因此，密 封％牺4為環H轉，卩、要該抑部件設置於實裝基板2上 就可以。 岔封％箍4可以由樹脂、金屬、合金等形成，粘接或熔 接於實裝某 板2上。粘接的情況下使用粘接劑就可以。密封 衣細4將攸熱傳導部件5叫導來的熱量放出外部 ，所以適合 由‘、，、傳導性'^的材料形成該密封環箱。 密封環箍4透明或半透明，但為將發光元件3發出的光 反射到Φ封部件5和透鏡板6而為能反射光的非透明狀態也 適。這疋由於密封環箍4充當填充密封部件5時的環箍並 作為發光元件3發出的光的反射部位的緣故。 另外，密封環箍4根據需要具備散熱片4〇。散熱片4〇介 由密封部件5(根據情況也可能是通過熱傳導部件5G)將發光 疋件3在發光面產生的熱量放出外部。散熱片如可以與密封 環箱4-體形成’也可以之後在密封環箍4上將其枯接、枯 合等。 (密封部件） 密封部件5填充由密封環箱4圍成的區域。密封部件妯 28 201207312 熔融樹^等構成，料的職流人％ 箍4内部形成密封部件5。 由此在” ％ 二：，=r後’㈣樹脂流入密， 充裝置比較好。流人後，泡’❹自動填 固’與密封環箍4的外升”目八：低，熔融的樹脂熒 „ 卜形相&而形成固體的密封部件5。 ，也可以在事先設置熱料 密封部件5係向密封環糾填充二: 如果事*設置熱料部件 會密封發光一熱Si 埴通，密封了熱料部件％的狀態的密封部件5 、二在密封環箱4内部來形成密封部件5也可以。 社封部件5單獨或與密封環||4及透鏡板6 一起將發光 兀件3七出的光集中或擴散。因此，密封部件$係使發光元 件3發出的光集中或擴散的基本部件。 雄件5為不透明或半透明，其為透明或半透明，由 此能使發光元件3發出的光透過。透過的光通過下述的透鏡 板6的集中或擴散作用被放射至外部，從而多個發光元件3 發出的光被放射至外部。. 牛5具有凹狀或凸狀的上面（表面）。這係為了進 订將:夕個發光元件3發出的光集中或擴散中的至少一 個。在封部件5的上面為凹狀時，密封部件5集t發光元件3 *相反，畨封部件5的上面為凸狀時，密封部件5 29 201207312 將發光元件3發出的光擴散。 .不处規败(5的形狀來確定 ^這係_透鏡板6在㈣部件⑽上層層1面的形 讀部件5的上㈣狀由該透鏡板6的形狀來確^况下， 例如’透鏡板6為凸透鏡時，㈣部件5的上的緣故。 曲面’透鏡板6為凹透鏡時，密封部件5的 具有凹狀 曲面。 向具有凸狀 (熱傳導部件) 宁…、傳導部件50進行說明 熱傳導部件50設置於密封部件5内部。 由發光元件3傳導至密封部件5的熱量傳導 部件50將 導至密封環箍4的熱量由密封環箍4放出外部。封環植4。傳 為了將密封部件5内部存在的熱量傳 熱傳導部件5__純接觸。@ 测端部與密封她相接觸也有利於本熱〜傳導部件 導部物將由發光元件3傳導至密封部件的旦熱傳 封環箍4,因此镝人 …里傳導至密 件。例如，金屬、°Λ •，’、傳導部 5金專。作為其中一個例+ ㈣由銅、結、銀、紹合金、鐵、鐵合金^傳導部 導率高或防錄性(或耐久性)高的金屬形成。鋼等熱傳 另外熱傳導部件5〇擔當將密封部 封環箍4的功能q❼熱里傳導至密 至外部的不便。因Γ 發光元件3發出的光照射 因此，如圖3所示，熱傳導部件 傳導性材料形成的格 牛5〇具有由熱 千$狀也適合。例如，熱傳導部件5〇 30 201207312 也可以具有由金屬、合金或熱傳導性高的樹脂形成的網 狀熱傳導部件5〇具有格子形狀，由此能將密封部件5的熱 里傳導至达、封％魅4並且不會阻礙從發光元件3發出的光的 照射。這係由於從發光元件3發出的光可以從格子形狀空隙 區域漏出去。尤其是給予發光元件3高電流值或電壓值發光 元件3以高亮度發光時，格子形狀的熱傳導部件50就不易阻 礙發光。特別是照明裝置1用於信號裝置、工程用照明裝 置、隨道内照明裝置、路燈及集魚燈等那樣的要求亮度但 不要求高精度的發光或發色的機器時’熱傳導部件50就不 易成為阻礙發光元件3發光的原因。 此外’熱傳導部件5〇具有格子形狀時，只要具有符合 發光元件3的個數、發光元件3的排列間隔的格子形狀。例 如，格子形狀的空隙區域的個數和面積符合發光元件3的排 列間隔也合適。另外，熱傳導部件50除了可以具有方形的 框組成的格子形狀，還可以具有圓形、橢圓形、多邊形等 的框構成的格子形狀。當然，只要是能傳導密封部件5的熱 量且不會阻礙從發光元件3發出的光的照射的形狀，什麼形 狀都可以。 熱傳導部件50可以設置於密封部件5的内部，但也可以 設置在密封部件5上的發光元件3與上面之間的任一個位置 上。例如，在發光元件3與上面的大致中間位置上，將熱傳 導部件50設置於密封部件5内部就可以。 如上所述，熱傳導部件5〇設置於密封部件5内部，將發 光元件3及密封部件5的至少一部分的熱量傳導至密封環箍 31 201207312 I。傳導至密封環箍4的熱量從密封環箍4放出外部並且也從 叹置於㈣環f|4上的散熱片嫩出外部。這樣，熱傳導部 件5〇將發光元件3在發光面產生的熱量有效傳導至與外部 ^的社、封環|i4。尤其是將容易滯留在密封部件$内部的 2量傳導至密封環箍4，因此，發光元件3的周圍變得不易 滯留熱量。 (透鏡板） 六接者’董子透鏡板6進行說明。透鏡板6根據需要積層於 进封部件5的上層n透鏡板6為形成密封料5的:面 形狀而在照明裝置1製造時使用。透鏡板6在密封部件5的上 層積層。透鏡板6與密封環箍4及密封部件5 —起將多個發光 疋件3發出的光集中或擴散。透鏡板6的形狀及構造 制發光元件3發出的光。 1 透鏡板6由玻璃或樹脂等構成。透鏡板6為透明或半透 明’與密封部件5_起使發光元件3發出的光透過4該光 透過的過程中，根據密封部件5及透鏡板6的形狀，照明裝 置1將發光元件3發出的光集中或擴散並將其輪出外部。 透鏡板6可以具有與密封環箍4的外周—致的外周也 可以具有《封環箱4的外周小的外周。不過，透鏡糾具 有與密封環M4的外周—致的形狀’密封部件5與密封環箱: 和透鏡板6被密封，就有提高照明裝置1的耐久性和強声@的4 透鏡板6積層於密封部件5的上層，所以根據透鏡板6的 形狀確定密封部件5的形狀（密封部件5的與透鏡板6的積層 32 201207312 面的形狀）。料’根據透鏡板6和密封部件5合起來的形狀 來、疋多個發光7L件3的光被集中還是被擴散。根據透鏡板 6的形狀來確定密封部件5的形狀並且確定發光元件3的光 被集中或被擴散的情況如用圖3、圖4說明的那樣。 層^明裝置1财密封環如、密封料5及透鏡板6的積 行發I:成本貫裝多個發光元件3的同時將其密封並進 (熱擴散部） 熱擴散部7包含於實裝基板 板2自奋铷达此 土瑕2中。例如，可以是實裝基 身作為熱擴散部7(這種情^ 表面㈣ ^下’熱擴散部7具有能在 衣面貫裂以發光元件3為主的電 實妒其电于邛件的構成），也可以在 貝扳暴板2内部容納熱擴散部7， 積層_料7。 可以在實裝基板2的底面 熱擴散部7將從發光元件3值 錄。此時，將熱量擴散向卵 面略平行的平面。尤其是_散=個發光元件3的實裝平 從實裝發熱體3的實裝區域向_料統件3發出的光 子，多個發光元件3如圖2所示那:區域擴散。作為-個例 陣狀實震時’從發光元件3發出沾地以矩陣狀實裝。以矩 (實裝區域）。因此，熱擴散部7首的/量集巾在實裝的區域 熱量向周圍擴散，由此降低發^將集中在該實裝區域的 度。 ％件3及其實裝區域的溫 熱擴散部7係能將熱量從實 部件，因此，使麟如熱傳H區域向周邊區域擴散的 向的銅、鋁等金屬·合金的 33 201207312 板狀部件。但是，為更有效地擴散熱量，_散部7為平板 狀的熱導管也適合。 熱導管具有通過密封於周圍被遮蔽的内部空間中的製 冷劑的反復的氣化凝縮來奪取散熱體的熱量並將其擴散的 功能。 對具有熱導管構造的熱擴散部7的—個例子進行說 明。例如，熱擴散部7具備上部板、與上部板對向的下部板、 在上部板和下部板之間層積的單個或多個中間板。由上部 板、下部板及中間板形成的内部空間能密封製冷劑，氣化 的製冷劑在中間板形成的蒸汽擴散通路上移動，凝縮的製 冷劑在中間板形成的毛細管流路上移動。另外蒸汽擴散 通路和毛細管流路將發光元件3的熱量從熱擴散部中心附 近以放射狀擴散《此時，氣化的製冷劑在蒸汽擴散通路的 水平方向和垂直方向的至少一個方向上移動，凝縮的製冷 劑在毛細管流路的水平方向和垂直方向的至少一個方向上 移動。不過，由於内部空間係由於上部板和下部板的積層 形成的平板空間，所以熱擴散部7沿著實裝平面的方向擴散 熱量。 利用圖7、圖8說明熱擴散部7的詳細情況。 圖7係本發明的實施方式1的熱擴散部的側面分解圖。 圖8係本發明的實施方式1的熱擴散部的内部主視圖。圖7係 分別將上部板、下部板及中間板分離的狀態顯示的，圖8係 拆掉熱擴散部7的上部板以能看到内部的方式顯示的。 熱擴散部7係上部板71、與上部板71對向的下部板72、 34 201207312 在上部板71和下部板72之間層積的單個或多個中間板73積 層而形成的。此時，上部板71、下部板72及中間板73積層 時，通過設置於各接合部位上的突起，接合各部件。通過 該接合，熱擴散部7形成内部空間79。在内部空間中製冷劑 被密封。例如，從注入口（未圖示）向内部空間79中注入製冷 劑，封閉注入口則製冷劑就被密封。此時，通過在真空下 或減壓狀態下注入製冷劑，製冷劑就變得容易氣化，.熱擴 散部7就能以高效率擴散熱量。 上部板71、下部板72及多個中間板73(在圖7中中間板 73係4塊）分別符合在同一位置上重合的位置關係。而且， 多個中間板73符合只與分別設置在多個中間板73上的内部 貫通孔76的一部分分別重合的位置關係。 上部板71、下部板72及多個中間板73的至少一個具有 接合突起。上部板71、下部板72和多個中間板73在位置關 係相合的基礎上積層，通過熱壓直接接合而一體化。此時， 各部件通過接合突起直接接合。 此處，直接接合係指，在使要接合的兩個部件的面密 合的狀態下加壓的同時進行熱處理，是通過在面部之間作 用的原子間力使原子之間牢固地接合，所述直接接合不使 用接合劑而能使兩個部件的面之間一體化。此時，接合突 起實現牢固的接合。其結果，能製造熱擴散部7。 另外，中間板73具有切槽部74和内部貫通孔76。在圖8 中，顯示了以放射狀切掉的切槽部74，並且顯示了設置在 切槽部74以外的部件上的内部貫通孔76。切槽部74形成蒸 35 201207312 汽擴散通路75 ’㈣貫軌76形成毛細管流路77。蒸汽擴 散通路75從熱擴散部7的大致中心形成放射狀。該放射狀形 成的纽擴散通路75的餘下的部分成為形成毛細管流路η 的區域。 由此，在内部空間79的沿内部空間79的平面方向的平 面上夕個蒸汽擴散通路75和多個毛細管流路”分別鄰接。 尤其是’如圖8所示那樣，蒸汽擴散通路75和毛細 Γ交㈣接的方式排列也適合。這樣，在沿著熱擴散部7擴 政熱置的方向的平面上，以多個蒸汽擴散通路乃分別與多 一 S机路77父互鄰接的方式排列，在熱擴散部7的大致 中心氣化的製冷劑以放射狀向周邊區域移動，在熱擴散部7 的周邊H域凝縮的製冷顯放射狀向大致巾心、移動。通過 錢化的製冷劑和凝縮的製冷劑的移動，熱擴散部7能以^ 射狀擴散熱量。 -此時，與㈣散部7的大致巾讀向的位置係時裝發光 :件3的f農區域，所以熱擴散部7能將發光元件3的執 貫展發光元件3的實裝區域擴散至周邊區域。 ’、、、里 _ ’ _示的蒸汽擴散通路75和毛細管流路π的形 ^個例子，只要能擴散發光元件3的熱量，其他的構成 '另外，根據實裝的情況，發光元件3實穿 ^7端部對向的區域時，以能從制部向周邊擴散熱量的 式形成蒸汽擴散通路75和毛細管流路77就可以。 另外， 散通路75和 上部板71及下雜72的至少—個具備將蒸汽擴 毛細管流路7 7的至少一個連通的凹部7 8也適 36 201207312 合。通過凹部78 ,氣化的製冷齊丨或、妄 從蒸汽擴散通路75向毛細f^的製冷劑變得容易 的-部分向其他區域移動。結果動或從毛細管流物 量。 熟擴散部7能快讀擴散熱 對構成熱擴散部7的各部分谁〜 (上部板） 知詳細說明。 對上部板71進行說明。上 熱擴散部7的外形形狀一致的形狀、+板狀，具有與 等形成，但也可以由銅n 部板71以金屬、樹脂 不錢鋼等熱傳導率高或防錢性(二= 上部板71和下部板72_π /久‘）的金屬形成。 部板71或下 ’成内部空間79。例如，上 部或壁:ρ件 ㈣緣上具有用於形成内部空間79的凸 等而接板72介由該等^部或壁部件 79。當#、、板71和下部板72之間形成内部空間 形成内部空=層中間板73由該中間板73形成的厚度來 化 因為施)上，、有金屬鍍膜也適合。這係 的移動。={表面狀態改性，能促進氣化的製冷劑 等的合金等令凰屬錄膜’從金、銀、銅、銘、鎳、姑及該 、屬中選擇就可以。當然，單層賴 膜電，、非電鑛膜任—個都可以。 ^ 物理上的:71雖，f “上部”的稱呼’但並不是必須配置於 方，只是方便起見的稱呼。實裝發光元件3的實 37 201207312 裝基板2可以與上部板71相接也可以與下部板72相接。或 者，在熱擴散部7上直接實裝發光元件3時，在上部板71的 表面或下部板72的表面上實裝發光元件3。 (下部板） 下部板72係與上部板71對向的部件，與上部板71具有 相同的構造和形狀。因此，下部板72也具有與上部板71相 同的平板狀，具有與熱擴散部7的外形形狀一致的形狀。另 外，具有與上部板71相同的材料和構造。另外，下部板72 也可以與上部板71同樣地具有製冷劑注入口。 下部板72雖具有“下部”的稱呼，但並不是必須在物理 上向下配置，只是方便起見的稱呼。實裝基板2可以與下部 板72相接也可以與上部板71相接。 (中間板） 單個或多個中間板73在上部板71和下部板72之間積 層。中間板73在上部板71和下部板72之間積層，所以適合 具有與上部板71相同的平板狀、由與上部板71相同的材料 形成。另外，由於積層，其適合具有與上部板71及下部板 72相同的尺寸，但也可以是稍小的尺寸用以形成内部空間 Ί9。 中間板73具備切槽部74和内部貫通孔76。如上所述， 切槽部7 4作為空隙形成使氣化的製冷劑移動的蒸汽擴散通 路75。内部貫通孔76為非常小的細孔，該細孔的組合形成 毛細管力。毛細管流路77通過該毛細管力使凝縮的製冷劑 移動。 38 201207312 此處切槽部74形成如圖s所示那樣的放射狀，由 π擴政通路75切成放㈣，氣化的製冷劑放射狀移二 當然’凝㈣製冷劑也以放射狀㈣。如果改變切。 的形狀，熱概奶職㈣氣化的製冷齡賤的製 的移動方向’從而能改變發光元件3的熱量擴散方向。：： 由於毛，、’® e 路77形成在t讀部74以外的部分上。S '、 此處毛細官流路77通過内部貫通孔76形成，所 中間板73的積層狀@來決定毛細管流路π的構造。 例如，如果中間板73為單個時，就有設置於中間板乃 上的内部貫通孔76整個形成毛細管流路。 由此相對’中間板73為多個時，分別設置於多個中 板73上的内部貫通孔76僅有-部分重合，就形成剖面面二 比内部貫通孔76的水平方向的剖面面積小的毛細管流路 77 ^樣，中間板73為多個時’形成剖面面積比内部貫通 孔76自身的剖面面積小的毛細管流路77，所以毛細管流路 77中的凝縮的製冷劑更有效轉動。尤其是，通過多個中 間板73的積層’㈣卩貫軌76在熱擴散部7的厚度方向上重 合。由於該重合，形成沿水平方向和垂直方向的毛細管流 路77。結果’凝縮的製冷劑能沿著毛細f流路π在水平方 向和垂直方向上移動。其結果，熱擴散部7能使凝縮的製冷 劑快速移動。 此外，在這裡，在中間板73上設置有多個内部貫通孔 76。這係由於為了發揮作為毛細管流路乃的功能具有多 個内部貫通孔76有利於本發明的實施。 39 201207312 内部貫通孔76從中間板73的表面向裡面貫通，其形狀 可以係圓形' 橢圓形、方形。内部貫通孔76的一部分之間 重合而形成毛細管流路77 ’所以内部貫通孔76為方形比較 口適。這從製造的容易度上來說也比較適合。 内部貫通孔76可以通過掘鑿、加壓、濕式蝕刻、幹式 蝕刻等形成，從微笑加工及加工精度方面來講，由濕式蝕 刻幹式触刻等触刻加工來形成比較適合。 中間板73為多個時’内部貫通孔76分別設置於多個中 間板73上。此處，多個中間板73以僅有該内部貫通孔76的 一部分之間重合的方式積層，所以内部貫通孔76的位置偏 各鄰接的中間板73比較合適。例如，位於某個中間板π 上的内部貫通孔76的位置與位於與該巾間板73鄰接的其他 :間板73上的内部貫通孔76的位置以内部貫通孔％的面積 重5的方式相偏離。這樣，每個鄰接的中間板73上的 内。P貫通孔76的位置相偏離，由此，多個中間板乃積層時， 说形成剖面面積小於内部貫通孔76的水平方向上的剖面面 積的毛細管流路77。 此外，在毛細管流路77中有凝縮的製冷劑移動，但也 可能有氣化的製冷劑移動。 另外，毛細管流路77的凹部78的角部和切槽部”的角 4為倒角’但也可以設置尺。也細管流路乃的剖面可以具有 六邊形 ' 圓形' _形、方形、多邊形等各種各樣的形狀。 毛細官流路77的剖面形狀由内部貫通孔⑽形狀和内部貫 通孔76之_4合方式來決定。另外，剖面面積也由同樣 40 201207312 的因素來決定。 如上所述’熱擴散部7將實裝於其大 區域傻瓜的發光元件3的熱量擴散到周邊實裝 量被傳導至與其熱接觸的熱輸送部S。 破擴政的熱 (熱輸送部） 熱輸达部8將從熱擴散部7料來的熱量輸送到規 向（在圖1中為Y軸方向熱擴散部7將熱量從實裝發疋 3的區域擴散到周邊區域。這係由於為抑制發光元件3 = 度上升’熱擴散部7將發光元件3發出的熱量擴散使其遠: 發光元件3很重要。因此，熱輸送部8位於熱擴散部了周^並 與熱擴散部7熱接觸有利於本發明的實施。 熱輸送部8將從熱擴散部7傳導來的熱量輸送到規定方 向。此處’熱擴散部7沿著實裝平面的方向將熱量擴散，因 此，熱輪送部8沿著與實裝平面交又的方向輸送熱量有利於 本發明的實施。如圖1所示，熱擴散部7沿X軸方向擴散熱 量熱輪送部8沿Y軸方向輸送熱量。這樣，熱擴散部7與熱 輸送。卩8使熱量在交叉方向上移動’發光元件3的熱量就三 動結果，熱量就容易遠離發光元件3 ’並且照明裝置 幻如不會只在X軸方向上變得過大或只在Y轴方向上變得 過大。 熱輪送部8例如也可以是熱傳導性高的金屬或合金的 棒狀°卩件。通過這樣的棒狀部件’熱輸送部8能將從熱擴散 °P7來的熱4輸送到規定方向。 或者’為提高熱輸送效率’熱輸送部8與熱擴散部7同 201207312 樣地具有熱導管構造也適合。例如，如圖1所示那樣，熱輸 送部8具有棒狀形狀。該棒狀形狀的内部具有能密封製冷劑 的内部空間，内部空間具備使氣化的製冷劑移動的蒸汽通 路和使凝縮的製冷劑移動的毛細管流路。尤其是，熱輸送 部8沿Y軸方向具有蒸汽通路和毛細管流路，由此能使氣化 的製冷劑和凝縮的製冷劑沿Y軸方向移動。 例如，在熱輸送部8的内部空間的中心設置毛細管流 路，在其周圍設置蒸汽通路也可以，相反情況也可以。這 樣，通過將熱輸送部8的内部空間分成蒸汽通路和毛細管流 路，能產生氣化的製冷劑和凝縮的製冷劑的移動，熱輸送 部8救你呢個將熱量輸送到規定方向。 (散熱部） 對散熱部9進行說明。 散熱部9係與熱輸送部8熱接觸的部件，將熱輸送部8輸 送的熱量放出外部。通過該散熱部9的散熱，發光元件3發 出的傳導至内實裝面的熱量被放出外部。結果，發光元件3 的溫度上升被抑制。 散熱部9只要具有能夠使熱量放出外部的構成什麼都 可以。 例如，散熱部9具有散熱片（heater sink)、冷卻風扇、珀 爾帖元件、散熱板及液冷套管中的至少一個。通過該等部 件，將熱輸送部8輸送的熱量放出外部。在圖1中，例如， 散熱部9具有散熱片91。散熱片91能從熱輸送部8的底面沿 著與熱輸送部8的熱輸送方向相同的方向（Y軸）將熱量放出 42 201207312 那 A d散熱片91也可以在與熱輸送部8交叉的方向上 =伸’只絲據Μ裝41的樣子和整體構成定散熱片 91的構成就可以。 另外’如圖9所*月欠熱部9具有散熱板％和冷卻風扇 %的組合也適合。圖9係本發明的實施方式ι的照明裝置的 側視圖。 散熱部9具有散熱板92。散熱板92與熱輸送部8熱接 觸’接收減送部8輸送來的熱量。冷卻風扇％向該散熱板 92人風，使散熱板92内。[5產生對流來促進散熱。結果，散 熱板92能有效地排出熱量。 當然’不是散熱板92而是散熱片91與冷卻風扇％組合 也可以。使用拍爾帖元件時，在王白爾帖元件的輸出側設置 液冷套管，冷卻使珀爾帖元件移動的熱量也適合。 這樣，散熱部9具有各種各樣的部件，由此散熱部9能 將熱輸送部8輸送的熱量放出外部。結果，發光元件3發出 的熱量能放出外部，就能發光元件3的溫度上升。抑制的結 果，就能供給發光元件3較高的電力，照明裝置丨就能以高 亮度照射光。 如上所述，實施方式1的照明裝置丨能將發光元件3產生 的熱量中在發光面上產生的熱量和在實裝面上產生的熱量 分別放出外部。結果’就能向發光元件3供給較高的電力， 照明裝置1就能以南党度照射光。這樣的照明裝置1就能在 需要高亮度的光但又因為溫度問題等而使用鹵素燈或白織 燈的照明領域使用LED等低功率且操作性強的發光元件。 43 201207312 例如，照明裝置1適合用於使用LED等的發光元件的集# 燈、工程用照明裝置、路燈、隧道内照明裝置、信號褒置 或集魚燈等。 (實施方式2) 接著，對實施方式2進行說明。 實施方式2係對進一步具有容納熱擴散部7,熱擴散部7 與熱輸送部8熱接觸的安裝部的照明裝置進行說明。 圖10係本發明的實施方式2的照明裝置的側視圖。此 外’在圖10中，在照明裝置1中省略了發光元件3的密封結 構。對於發光元件3的密封與用圖1等說明的情況相同。安 裝部10容納熱擴散部7。因此，安裝部1〇具有凹部1〇1，該 凹部101容納熱擴散部7。熱擴散部7包含於實裝基板2中戍 與實裝基板2—體，或在實裝基板2上積層，但熱擴散部了也 有可能如圖10所示那樣在實裝基板2上積層。 這樣，在實裝基板2上積層熱擴散部7時，熱擴散部7露 出外部。安裝部10容納該熱擴散部7。通過安裝部1〇容納該 熱擴散部7，熱擴散部7與熱輸送部8容易連接。 例如，女裝部1〇具備凹部，由此在該凹部中容納 告奉狀的熱輸送部8。由此，熱輸送部8也可以事先安裝在安裝 的凹部1〇2上。在該熱輸送部8被安裝的狀態下，安裝部 部:熱擴散部7安裝於凹部1Q1上，通過絲部1G，熱輸送 熱擴^擴散部7容易連接。在該連接時，如圖1〇所示那樣， 過向Ϊ邹7與熱輸送部8接觸時，熱擴散部7與熱輸送部8通 °骏。卩10的安襄，能實現熱接觸。或者，即使在熱擴 44 201207312 散部7與熱輸送部8在安裝部ι〇内部分離的情況下，熱擴散 部7與熱輸送部8也能介由安裝部1〇實現熱接觸。該熱接觸 的結果’能有效地將熱量從熱擴散部7傳導至熱輸送部8。 這樣’通過安裝部1〇，熱擴散部7被安裝（進而，熱輸 送部8被安裝），熱擴散部7與熱輸送部8就能實現熱接觸。 安裝部10例如具有容納熱擴散部7的插座、基座及壓板 中的至少一個。通過具有這樣的部件和構成，安裝部1〇能 容易地安裝熱擴散部7。 另外，如圖11所示，安裝部10也可以具有支撐熱擴散 部7的同時安裝熱輸送部8的基座1〇5。圖丨丨係本發明的實施 方式2的照明裝置的側視圖。基座1〇5使熱量有效地從熱擴 散部7傳導至熱輸送部8。這係由於熱擴散部7與熱輸送部8 通過基座105切實實現了熱接觸。在圖丨丨中，與圖1〇的情況 不同係顯示了實裝基板2包含熱擴散部7的情況。基座1〇5在 支撐該熱擴散部7的同時使熱擴散部7與熱輸送部8熱接觸。 這樣，安裝部10使從熱擴散部7向熱輸送部8的熱量傳 導效率化。 實施方式2的㈣裝置丨缺熱㈣部樓熱輸送部㈣ 安裝和連接容胃’並能使發光元件3的熱量輸送效率化。 (實施方式3) 實施方式3係對在實施方式卜2中說明的照明裂置組合 了筐體而使㈣㈣機H進行說明。照明㈣具備在實施 方式卜2中說明的照明裝置卜容納該照㈣置㈣望體和 向照明裝置1供給電力的電力供給部，由此照明機器能根據 45 201207312 耑要來照射光。這樣的照明機器能用於工程用照明裝置、 随道内照明裝置、路燈、信號裝置及集魚燈等。 使用圖12對將照明機器用於集魚燈的情況進行說明。 圖12係顯不本發明的實施方式3的集魚燈的使用狀態的概 略圖。圖12顯示了使從船舶202上使用電線等吊下的集魚燈 110照射海中200的狀態。 集魚燈110具備在貫施方式1、2中說明的照明裝置1。 照明裝置1在實裝多個發光元件3的實裝基板上具備用於擴 散發光元件3的熱量的熱擴散部7等。如在實施方式丨、2中 說明的那樣，熱擴散部7等將發光元件3發出的熱量擴散、 接著輸送並放出。 集魚燈110將具有這樣構成的照明裝置丨容納在筐體 111内部。另外，如圖12所示，集魚燈11〇也有可能投入海 中200，所以筐體π 1需要進行防水加工。另外集魚燈η〇 具備向照明裝置1 (即發光元件3)供給必要的電力的電力供 給部112。在圖12中，電力供給部112設置於筐體hi的外 側，但也可以設置於内部。或者，通過將集魚燈u〇與由電 源線設置於船舶202上的電力供給部相連接來向集魚燈11() 供給電力。 集魚燈110照射海中2〇〇或海面2〇1。在圖12中，集魚燈 110的邛为投入海中200，發光元件3發出的光如箭頭μ、 箭頭Ν所示那樣照射海中2〇〇内部。這係由於以發光元件3 面向海中200的方式將集魚燈〗1〇投入海中2〇〇的緣故。當 然，不投入海中200而是固定集魚燈11〇以使發光元件3照射 46 201207312 海面201也可以。 ^ = %出的熱量通過熱擴散部7擴散。熱擴散和 ::由熱輸送部8輸送到規定方向。如圖12明示的那 =；：部8將熱量輸送到遠離海面2G1的方向。這係由 將熱量輸送至與熱擴散部7擴散的擴散方向也 :部：熱量在散熱，具備散熱片.冷卻風扇、散: 片液冷套管、ϊ白爾帖元件笼：、^ 專破放出。放出的空間係與海 =反一:’散熱部9放出的熱量能與外部氣體間接接 讀愧更有效地放㈣量。當然，根體 熱部9放出的㈣也能料《體直接接觸 或”海水接觸。或根據值體lu的構造，將海 内部使得散熱部9直接或_與海水接觸， 有效放出熱量。 π…I y此 集魚燈110照射海中2⑽或海面2〇1時發光元件3 的熱里通過遠離海面201的外部氣體被放出。即，钱燈110 能將發光鱗3的熱量放出到與發光側相反的—側。尤其 是，遠離海面2 01的外部氣體空間多數情況溫度較低，散熱 部9就能有效地放出熱量。因此，照明裝置（能將發光元件3 的熱量有效放出至外部氣體。結果，發光元件3的溫度上升 被抑制，集魚燈110能以高亮度照射光。 尤其是’集魚燈11 〇係以長時間使用為前提的，所說義 如果發光元件3的溫度上外過高，就不得不控制發光元件3 的亮度。但是，如果採用實施方式3的集魚燈110，通過將 47 201207312 海中200作為照射側、外界作為散熱側而區分使用，能抑制 發光元件3的溫度上升。當然，即使即使將包含散熱部9在 内的集魚燈投入海中200，散熱部9也能將熱量放出到海中 200的海水中，所以能有效地放出熱量。 另外，工程用照明裝置、隧道内照明裝置、信號裝置、 路燈也同樣。 (實施方式4) 在實施方式4中，對實施方式1-3中說明的照明裝置的 散熱效果的模擬結果進行說明。 發明人分別對比較例和實施例製作模型，根據模型假 定熱源發光元件發熱，計算照明裝置各部位的溫度狀態。 (比較例） 如圖13所示，假定比較例為具備實裝熱源3〇1的熱擴散 部302、支撐熱擴散部3〇2的基座3〇3、和從基座3〇3伸出的 熱輸送部304的照明裝置300。圖丨3係與本發明的實施方式4 的比較例相對應的照明裝置模型的概略圖。圖13(a)表示從 上方傾斜看照明裝置300的狀態，圖13(b)表示從下方傾斜看 照明裝置300的狀態。如圖13(b)所示，照明裝置300具有裡 面 305。 在這樣的模擬模型中’在熱源301發熱的狀態下，分別 測定在以下各位置的最大值(ΜΑχ)、平均值(τγρ)、最小值 (ΜΙΝ)三個溫度值.測定結果如表丨所示。 ⑴照明裝置3〇〇整體 (2)熱擴散部3〇2表面 48 201207312 (3) 基座303表面 (4) 熱輸送部304 (5) 裡面305 【表1】 部位 Tmi„(K) T,觀(κ) zlT(K) Rthth (K/W) 整體 293.19 364.91 71.72 0.36 FGHP表面 347.17 364.91 17.75 0.08 銅基座(插座部） 340.74 348.04 2.31 0.01 熱導管 341.86 346.70 4.84 0.02 蓋 293.19 343.41 50.22 0.25 (實施例） 另一方面，如圖14所示，假定實施例為具備實裝熱源 301的熱擴散部302、支撐熱擴散部302的基座303、從基座 3〇3伸出的熱輸送部304和散熱部306的照明裝置310。圖14 係與本發明的實施方式4的實施例相對應的照明裝置模型 的概略圖。在圖14中，為明確實施例具備散熱部306，顯示 了從下方傾斜看照明裝置310的狀態。 在如圖14所示的實施例中，也與比較例同樣地，分別 測定在以下各位置的最大值(MAX)、平均值(TYP)、最小值 (MIN)三個溫度值。測定結果如表2所示。 (1) 照明裝置300整體 (2) 熱擴散部302表面 (3) 基座3〇3表面 (4) 熱輸送部304 (5) 散熱部306 49 201207312 【表2】 部位 Tmin(K) τ_(κ) Ζ1Τ(Κ) Rlhth(K7W) 整體 293.06 327.15 34.09 0.17 FGHP表面 309.46 327.15 17.69 0.08 銅基座(插座部） 308.02 310.20 2.18 0.01 熱導管 301.83 308.76 6.84 0.03 散熱片 296.46 301.94 5.48 0.04 此處，比較表1和表2可知，與比較例相比實施例更能 抑制由熱源301產生的溫度上升。尤其是可知通過散熱部 306，溫度上升被抑制。 這樣可知，能抑制溫度上升，由此就能抑制實施方式 1-3中的照明裝置的發光元件的發熱。結果，就能給予發光 元件較高的電力。從而照明裝置就能以高亮度照射光。 如上所述，實施方式1-4中說明的照明裝置及照明機器 係說明本發明的宗旨的一個例子，也包含在不脫離本發明 的宗旨範圍内的變形和改造。 【圖式簡單說明3 圖1係本發明的實施方式1的照明裝置的側視圖。 圖2係將本發明的實施方式1的照明裝置的主視圖。 圖3係本發明的實施方式1的照明裝置的側視圖。 圖4係本發明的實施方式1的照明裝置的側視圖。 圖5係本發明的實施方式1的照明裝置的一部分的側視 圖。 圖6係將本發明的實施方式1的照明裝置的主視圖。 圖7係將本發明的實施方式1的熱擴散部的側視分解 50 201207312 圖。 圖8係將本發明的實施方式1的熱擴散部的内部主視 圖。 圖9係本發明的實施方式1的照明裝置的側視圖。 圖10係本發明的實施方式2的照明裝置的側視圖。 圖11係本發明的實施方式2的照明裝置的側視圖。 圖12係顯示本發明的實施方式3的集魚燈的使用方式 的概略圖。 圖13係與本發明的實施方式4的比較例對應的照明裝 置模型的概略圖。 圖14係與本發明的實施方式4的實施例對應的照明裝 置模型的概略圖。 【主要元件符號說明】 1...照明裝置 50...熱傳導部件 2...實裝基板 71...上部板 3...發·光元件 72...下部板 4...密封環箍 73...中間板 5...密封部件 74...切槽部 6...透鏡板 75...蒸汽擴散通路 7...熱擴散部 76...内部貫通孔 8...熱輸送部 77...毛細管流路 9...散熱部 78...凹部 10...安裝部 79...内部空間 40...散熱片 91...散熱片 51 201207312 92...散熱板 202.. 93...冷卻風扇 300.. 101、102...凹部 301.. 105...基座 302.· 110...集魚燈 303·. 111...筐體 304.. 112…電力供給部 305.. 200...海中 306. _ 201...海面 船舶 照明裝置 .實裝熱源 .熱擴散部 .基座 .熱輸送部 .裡面 .散熱部 52201207312 VI. Description of the invention: [Ming 43⁄4. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illumination device having a heat dissipation structure capable of using a sealing hoop of a light-emitting element such as an LED (Light Emitting Diode) in a bare bare state. The light-emitting element is controlled and the heat generated by the mounting of the light-emitting element can be discharged to a distant position. C ^tr ~Ji BACKGROUND OF THE INVENTION As a new light source that replaces existing fluorescent lamps and incandescent lamps, lighting devices using LED-based light-emitting elements are increasing. A light-emitting element using a semiconductor mainly based on led has the advantages of small size, low power consumption, illuminating color, and illuminating pattern are easily controlled. In the prior art, the LED shape of a single LED sealed in a package is subjected to light emission control (for example, refer to Patent Document 1). Further, there has been disclosed a technique of collecting light for a backlight of a liquid crystal panel on a liquid crystal panel (for example, refer to Patent Document 2). On the other hand, it is convenient to mount a plurality of LEDs in order to easily generate various illuminating colors and illuminating patterns. When the light-emitting units in which the respective LEDs are sealed are arranged, there is a disadvantage that the light-emitting patterns and the light-emitting colors which are expected on the control side cannot be obtained due to the unevenness of the sealing state of each of the LEDs. In recent years, people have arranged multiple LEDs and used computer programs to control the illuminating colors and illuminating patterns of the 201207312. When the LEDs sealed in individual packages are arranged, the adverse effects caused by uneven sealing are generated. This is especially true in areas such as signal devices. Therefore, it is required to mount a plurality of LEDs and collectively seal a plurality of mounted LEDs, and control the illumination of a plurality of sealed LEDs. In particular, in order to reduce the cost of mounting and sealing, it is required to simultaneously seal multiple LEDs and control LED light. Under such circumstances, a technique of mounting a plurality of light-emitting elements has been proposed (for example, refer to Patent Documents 3 and 4). Here, when a plurality of light-emitting elements are mounted, sufficient power is supplied to the light-emitting elements to cause high-luminance light emission. However, since the light-emitting element generates high heat in the actual mounting surface, sufficient power cannot be given to the light-emitting element. As a result, an illumination device in which a plurality of light-emitting elements are mounted cannot emit high-intensity light. Therefore, it is necessary to have a structure in which the heat generated by the mounting surface of the light-emitting element is emitted. A lighting device having such a heat dissipation structure has been proposed (for example, refer to Patent Documents 5 and 6). CITATION LIST Patent Literature Patent Literature 1: Patent Document 2: Patent Document 3: Patent Document 4: Patent Document 5: Patent Document 6: JP-A-2007-88098, JP-A-2006-100575, JP-A No. 11-162232 Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. 2005-. Patent Document J discloses a technique of sealing a single LED using a cannon-type case. Although a technique of forming a cannonball type case using a resin or a lens is disclosed, a cannon type box can be used only for a single LED, and it is difficult to seal a plurality of LEDs. Further, Patent Document 2 discloses a technique in which a concave lens is provided in front of a single LED and light emitted from the LED is concentrated on a liquid crystal pupil plane. This technique is also difficult to control the case of collecting light while sealing a plurality of LEDs. Patent Document 3 discloses a technique of mounting a plurality of LEDs in a bare wafer state and forming a resin sealing member and a microlens on the mounted LED. Patent Document 3 solves the problem of mounting a plurality of LEDs by solving a sealing member made of a resin, and arranging a lens group (a lens group is a microlens) disposed at a position corresponding to each of the plurality of LEDs to solve the problem of guiding the light emitted from each LED. To external issues. However, in order to control the light of each lens of the microlens according to each of the LEDs of the plurality of LEDs, there is a problem that control unevenness occurs. As with signals or fishlights, the unevenness of each lens adversely affects the necessity of generating illuminating colors and illuminating patterns based on a plurality of LEds as a whole. Moreover, the use of microlenses has a problem of rising costs. Patent Document 3 cannot solve the problem of a structure having a sealed LED and a structure for controlling light, respectively, such that light control is uneven and cost rises. Patent Document 4 discloses a structure in which a portion of a lens plate that is in contact with an LED is filled with a resin based on a large lens plate that seals a plurality of LEDs, and 201207312 is used to protect a led. However, since the technique of Patent Document 4 seals a plurality of LEDs with reference to a lens plate, there is a problem that the light emission control of the LED depends on the accuracy of the lens plate. Moreover, the sealing of the LED also depends on the size and longevity of the lens plate, and it is not suitable for concentrating a plurality of LEDs and sealing them while controlling the illumination. Patent Document 5 discloses an illumination device in which a mounting substrate on which an LED is mounted has a heat dissipation structure or a heat sink. With such a heat dissipation structure or heat sink, the heat generated by the led mounting surface is released. However, the illumination device disclosed in Patent Document 5 has only a structure in which heat is released on the substrate on which the IED is mounted. Therefore, the heat released from the heat sink stays in the vicinity of the LED. The temperature of the entire space in which the LED is mounted cannot be lowered, and the power of the LED is not given. As in Patent Document 5, it is sufficient if only the solid buds and the early-body LEDs are used to dissipate heat only by the heat sinks directly disposed on the mounting substrate. When mounting multiple LEDs and wanting to give each LED a higher power, In the configuration of Patent Document 5, the heat dissipation capability is insufficient. Further, Patent Document 6 discloses an illumination & for dissipating heat generated by a light-emitting diode by a substrate in which a plurality of light-emitting diodes are arranged in parallel and dissipating heat by a fan. However, in the illumination device disclosed in Patent Document 6, since only the heat of the light-emitting diodes arranged in the __ column is transported in one direction, the heat transfer during the mounting of the plurality of light-emitting diodes is insufficient. In particular, in the case of an illumination device requiring high brightness, the light-emitting elements are easily mounted in a lattice shape, and heat is not sufficiently transferred only by a structure that transfers heat in one direction. Further, as in Patent Document 6, the heat is transferred only by the ordinary mounting substrate, and it is possible to say that the heat transfer system is insufficient in the case of the 201207312, and the light-emitting element is suitable for a long time. Further, since the crucible transports heat on the plane and dissipates heat by the fan, there is also a problem that heat is likely to remain in the vicinity of the mounting substrate of the force generating diode. That is, the techniques of Patent Documents 5 and 6 have a problem that a plurality of light-emitting elements cannot be mounted and the heat is released from the vicinity of the mounting substrate. As described above, the lighting devices of the prior art each have a crucible that seals a plurality of LEDs. The structure of the light is controlled and controlled, and there is a problem that the control of light is uneven or the cost rises. In particular, when lighting is controlled by a plurality of LEDs, such as a lighting device for a process, a street lamp, an in-tunnel lighting device, a signal device, or a fish-collecting lamp, the need for a towel is required. The LEDs are sealed while uniformly controlling the illumination of the plurality of LEDs. Conventional techniques have problems that cannot meet such requirements. Further, when a plurality of light-emitting elements are sealed and placed in a lighting device, it is required to be applied to a device requiring high brightness such as a lighting device for a project, a street lamp, an in-tunnel lighting device, a signal device, or a fishing light. That is, in order to (4) high brightness, it is necessary to give a plurality of light-emitting elements with higher electric power. If a plurality of light-emitting elements are given higher power, the light-emitting elements emit heat. The illuminating device needs to keep the heat away from the periphery of the illuminating element and be discharged. If the heat is not released from the periphery of the light-emitting element and is released, the temperature around the light-emitting element rises, and sufficient power cannot be given to the light-emitting element. As described above, the lighting device of the prior art has problems in that 〇) cannot mount a plurality of light-emitting elements at low cost, and (2) cannot supply relatively high power of a plurality of light-emitting elements to cause high-intensity light emission, (3) The heat generated by the plurality of light-emitting elements 201207312 cannot be released away from the mounting space of the light-emitting elements. The present invention has been made in view of the above problems, and an object thereof is to improve a lighting device which is suitable for use in an engineering lighting device, a street lamp, a tunnel inner lighting device, a signal device, or a fish collecting lamp, etc., and can realize the most suitable while reducing the cost of mounting. The LEDs are controlled by the light emission, and the heat of the light-emitting elements can be released even if the light is emitted with high brightness. Means for Solving the Problem In order to solve the above problems, an illumination device according to the present invention includes: a mounting substrate; a plurality of light emitting elements mounted on the mounting substrate; and a sealing hoop provided on the mounting substrate and surrounding a plurality of light-emitting elements; a sealing member filled in the inside of the seal ring case and sealing the light-emitting element while being in contact with the hairpin; the heat diffusion portion is included in the mounting substrate, and the heat of the light-emitting device is obtained from the plurality of light-emitting elements The loading area is diffused to the surrounding area; the money sending part transports the heat from the heat diffusion part to a predetermined direction; the heat radiating part transmits heat to the outside by the heat transfer part; and the component is transparent or translucent, and has a surface thereon At least one of a concave shape and a convex shape, and the sealing member is effective for at least one of diffusing and concentrating light emitted from the light-emitting element. 1 (4) Device (4) Over-sealing, sealing member, and lens = both naked The sealing of the light-emitting elements in the wafer state and the good control of the light-emitting elements. As a result, the mounting cost of the light-emitting element can be reduced. By taking into account the essential elements and the elements necessary for lighting control, it is possible to reduce costs while sealing and lighting control. In particular, since the process of mounting 8 201207312 is simplified, the cost of mounting is further reduced. Further, the illuminating device of the present invention can integrally control a plurality of light-emitting elements by sealing the hoop, the sealing member, and the lens plate, and the meaning is not uneven in the state of light emission, and can be applied to a signal device, a fishing lamp, or the like. Further, the heat radiated from the light-emitting element to the mounting substrate is diffused from the mounting region of the light-emitting element to the peripheral region by the thermal diffusion portion, and the heat to be diffused is transported and released in the three-dimensional direction. Therefore, the heat generated by the plurality of light-emitting elements is released in a space away from the light-emitting elements, so that the temperature rise of the light-emitting elements and their surroundings can be suppressed. As a result, a higher power can be given to the light-emitting element, and the illumination device can illuminate the light with high brightness. Further, the illumination device of the present invention can discharge the heat generated by the light-emitting element on the light-emitting surface and the heat generated by the light-emitting element on the mounting surface in the three-dimensional direction, respectively. As a result, heat is not retained in the vicinity of the light-emitting element, and heat generation of the light-emitting element can be suppressed, and high power can be given to the light-emitting element. In particular, it can be applied to signal devices requiring high brightness, lighting devices for engineering, lighting devices in tunnels, street lamps or fishing lights. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view of a lighting device according to a first embodiment of the present invention. Fig. 2 is a front view of the lighting device according to Embodiment 1 of the present invention. Fig. 3 is a side view of the lighting device according to Embodiment 1 of the present invention. Fig. 4 is a side view of the lighting device according to Embodiment 1 of the present invention. Fig. 5 is a side elevational view showing a part of the lighting device according to Embodiment 1 of the present invention. Fig. 6 is a front view of the lighting device according to Embodiment 1 of the present invention. 201207312 Fig. 7 is a side elevational view showing the heat diffusion portion according to Embodiment 1 of the present invention. Fig. 8 is a front elevational view showing the inside of a heat diffusion portion according to Embodiment 1 of the present invention. Fig. 9 is a side view of the lighting device according to Embodiment 1 of the present invention. Fig. 10 is a side view of the lighting device according to Embodiment 2 of the present invention. Fig. 11 is a side view of the lighting device according to Embodiment 2 of the present invention. Fig. 12 is a schematic view showing a manner of use of the fishing light according to the third embodiment of the present invention. Fig. 13 is a schematic view showing a lighting device model corresponding to a comparative example of the fourth embodiment of the present invention. Fig. 14 is a schematic view showing a lighting device model corresponding to the embodiment of the fourth embodiment of the present invention. (Embodiment 3) The illuminating device according to the first aspect of the present invention includes: a mounting substrate; a plurality of light-emitting elements mounted on the mounting substrate; and a sealing hoop provided on the mounting substrate And surrounding the plurality of light-emitting elements; the sealing member is filled inside the sealing hoop and seals the light-emitting element while being in contact with the light-emitting element; the heat-diffusion portion is included in the mounting substrate, and the heat of the light-emitting element is obtained from the plurality of light-emitting elements The charging region is diffused to the peripheral region; the heat transporting portion transports heat from the heat diffusing portion in a predetermined direction; the heat radiating portion dissipates heat transferred from the heat transporting portion to the outside; and the sealing member is transparent or translucent, and has thereon At least one of a concave shape and a convex shape, the sealing member performs at least one of diffusing and concentrating light emitted from the illuminating element 10 201207312. According to this configuration, the illumination device can suppress the temperature rise of the light-emitting element while mounting the plurality of light-emitting elements at a low cost and in a simple configuration. As a result, the illumination device can illuminate high-intensity light. According to a second aspect of the invention, in the illuminating device according to the first aspect of the invention, the plurality of light-emitting elements are mounted on the mounting plane along a certain plane, and the heat-dissipating portion is configured to illuminate the light-emitting element along the mounting plane. The emitted heat is dissipated, and the heat transfer portion transports the heat diffused by the diffusing portion in a direction crossing the mounting plane. ,, ', and expansion. With this configuration, the illumination device can discharge the luminescent element to a three-dimensional and sub-region. In the illuminating device according to the third aspect of the present invention, the illuminating device according to the third aspect of the present invention further includes a lens plate laminated on the sealing member, and the lens plate is transparent or translucent. When the lens plate is a convex lens, the laminate of the dense member and the lens plate concentrates the light, and when the lens plate is a concave lens, the layer of the two component members and the lens plate diffuses the light. In the illuminating device according to the fourth aspect of the present invention, the illuminating device according to the fourth aspect of the present invention further includes the sealing member further comprising the illuminating member. At least part of the heat is transmitted to the heat transfer of the seal hoop. If the configuration is adopted, the illuminating device can release the heat generated by the light-emitting element on the light-emitting surface to the outside. The heat of the fifth invention of the present invention In the illumination device, in addition to the 201207312 of the fourth invention-invention, the sealing hoop further has a heat sink on at least a part of the surface and the side surface thereof, and the heat sink transmits heat from the heat conducting member. With this configuration, the illumination device can effectively discharge the heat generated by the light-emitting element from the light generated on the light-emitting surface to the outside. As a result, the heat generated by the light-emitting element, whether generated on the light-emitting surface or The heat generated by the mounting surface can be released from the outside by the illuminating device. As a result, the illuminating device according to the sixth aspect of the present invention can be thermally diffused based on any of the first to fifth inventions. The unit has an upper plate, a lower plate facing the upper plate, and a single or a plurality of intermediate plates stacked between the upper plate and the lower plate, and the refrigerant can be sealed by the upper plate, the lower plate and the intermediate plate. In the internal space, the intermediate plate forms a single or a plurality of vapor diffusion passages for moving the vaporized refrigerant and a single or a plurality of capillary flow paths for moving the condensed refrigerant. If this configuration is adopted, the thermal diffusion portion enables the light-emitting elements The heat of the seventh aspect of the present invention is based on the sixth aspect of the present invention. The intermediate plate has a slit portion that forms a vapor diffusion passage and an internal through hole that forms a capillary flow passage, and the slit portion is formed radially from a substantially central position of the thermal diffusion portion. With this configuration, the thermal diffusion portion is likely to be radially In the illuminating device according to the eighth aspect of the present invention, in the sixth aspect or the seventh aspect of the invention, the plurality of vapor diffusion paths are adjacent to the plurality of 201207312 plurality of capillary channels on the same plane of the internal space. According to the ninth aspect of the invention, in the illuminating device according to the ninth aspect of the invention, the heat transfer unit is thermally distributed around the heat diffusion portion and the heat diffusion portion. According to the first aspect of the invention, the heat transfer unit can efficiently receive the heat released from the heat diffusion unit. The internal space of the refrigerant is sealed, and the internal space is provided with a steam passage for moving the vaporized refrigerant and a capillary flow path for moving the condensed refrigerant. According to this configuration, the heat transfer portion can efficiently transfer heat to a predetermined direction. In addition to the first to tenth aspects of the invention, the lighting device according to the first aspect of the invention, further comprising the mounting portion that accommodates the heat diffusion portion and thermally connects the heat diffusion portion to the heat transfer portion. According to this configuration, the thermal diffusion portion and the heat transfer portion can be reliably thermally connected. According to a ninth aspect of the invention, in the lighting device of the eleventh aspect of the invention, the mounting portion includes at least one of a socket, a susceptor, and a pressure plate that accommodate the heat diffusion portion. According to this configuration, thermal contact between the heat diffusion portion and the heat transfer portion can be easily achieved. In a lighting device according to a thirteenth aspect of the invention, the heat dissipating portion includes a heat sink, a cooling fan, a Peltier element, a heat sink, and a liquid cooling jacket. At least one of the tubes. 13 201207312 With this configuration, the heat radiating portion can effectively dissipate the heat released from the heat transport portion to the outside. (Embodiment 1) Embodiment 1 will be described. (Overall Outline) First, the overall outline of the lighting device of the first embodiment will be described with reference to Figs. 1 and 2 . Fig. 1 is a side elevational view of a lighting device according to a first embodiment of the present invention. Figure 2 is the invention. A front view of the lighting device of Embodiment 1. Fig. 1 shows the state of the lighting device viewed from the side, in which the light-emitting elements present inside the sealing hoop and the sealing member are displayed in a visible state. Further, Fig. 2 shows the state of the illuminating device as seen from above, in which the light-emitting elements existing inside the seal hoop and the sealing member are displayed in a visible state. The illuminating device 1 includes: a mounting substrate 2; a plurality of light-emitting elements 3 mounted on the mounting substrate 2 in a bare wafer state; a sealing hoop 4 surrounding the plurality of light-emitting elements 3; and a sealing member 5 in the sealing hoop 4 The light-emitting element 3 is sealed while being in contact with the light-emitting element 3. Further, the illuminating device 1 includes a thermal diffusion portion 7 included in the mounting substrate 2, and a heat transfer portion 8 for transporting heat emitted from the thermal diffusion portion 7 in a predetermined direction, and a heat radiating portion 9 for transferring heat transferred from the heat transport portion 8. Release the outside. Further, the sealing member 5 is transparent or translucent, and the surface of the sealing member 5 has at least one of a concave shape and a convex shape. According to this configuration, the sealing member 5 performs at least one of the operation of diffusing and concentrating the light emitted from the light-emitting element 3. According to this configuration, the illuminating device 1 can emit light emitted from the plurality of light-emitting elements 3 mounted in the bare wafer state to the outside as appropriate by means of the components that seal the light-emitting elements 3. The plurality of light-emitting elements 3 are mounted on the solid surface of the solid substrate 2, but are arranged in a matrix as shown in Fig. 3 (4). This is because the object-like illumination device 1 can illuminate the object with high luminance and high illuminating power. (Heat Dissipation of Light Emitting Element) Further, the solid substrate 2 on which the plurality of light emitting elements 3 are mounted includes the thermal diffusion portion 7. The mounting substrate 2 itself may be used as the thermal diffusion portion 7 (formed integrally with the mounting substrate 2). The thermal diffusion portion 7 may be provided inside the mounting substrate 2. The heat diffusion portion 7 diffuses heat from the solid surface of the light-emitting 7L member 3 from the mounting region of the plurality of light-emitting elements 3 to the peripheral region. Since the thermal diffusion portion 7 is thermally connected to the heat transfer portion 8, the heat dissipated by the thermal diffusion portion is conducted to the heat transfer portion 8. The heat transfer portion 8 transports the heat conducted from the heat diffusion portion 7 to a predetermined direction. The transferred heat reaches the heat radiating portion 9 which is in thermal contact with the heat transport portion 8, and the heat radiating portion 9 discharges the generated heat to the outside. When a plurality of light-emitting elements 3 are mounted on the mounting substrate 2, and a plurality of light-emitting elements 3 are given high electric power so that they can emit light with high luminance, the plurality of light-emitting elements can be mounted on the mounting substrate 2 Higher heat 4. This heat is conducted from the mounting surface to the mounting substrate 2. However, since the mounting substrate 2 includes the thermal diffusion portion 7, the heat is spread to the peripheral region first. By diffusing the heat to the peripheral region, it is possible to suppress an excessively large amount of heat generated in the region where the light-emitting element 3 is mounted (in the = region, as long as the light-emitting element 3 emits light, it generates heat). Further, since the heat to be diffused is discharged to the outside through the heat transport portion 8 and the heat radiating portion 9, the heat generated by the light-emitting element 3 is continuously discharged. In this way, the mounting substrate 2 includes the thermal diffusion portion 7, and heat is transferred from the thermal diffusion portion 7 15 201207312 to the outside opposite to the light-emitting direction of the light-emitting element 3, thereby preventing heat from remaining on the light-emitting element 3 and the light-emitting element. 3 around. As a result, the excessive heat generation of the light-emitting element 3 can be suppressed, so that the light-emitting element 3 can be supplied with higher electric power, and the light-emitting element 3 can emit light with a very high luminance. As a result, the illumination device m can illuminate high-intensity light. The illumination device i shown in FIG. 2 and FIG. 2 can efficiently discharge the heat from the light-emitting element 3 to the mounting substrate 2 due to the mounting of the plurality of light-emitting elements 3 and the high power, so that the light-emitting element 3 can be solved. The problem of supplying electricity to generate heat. That is, a plurality of light-emitting elements 3 are mounted on a mounting plane (a plane formed by the mounting substrate 2) along a certain plane, and heat diffusion is performed along the mounting plane to emit a plurality of light-emitting elements 3. The heat is diffused, and the heat transfer portion (10) transports the heat diffused from the heat diffusion portion 7 in a direction intersecting the mounting plane, and the heat radiating portion 9 discharges the heat. Thus, the illumination device can transport and discharge the heat generated by the plurality of light-emitting elements 3 mounted on the mounting plane in three dimensions. As a result, the heat (four) is not allowed to be supplied to the light-emitting element 3 at a high level in the plurality of light-emitting elements 3. In particular, most of the heat generated by the light-emitting element 3 is generated on the mounting surface (i.e., on the mounting substrate 2). The heat generated by the mounting surface by the heat diffusion portion 7, the heat transport portion 8, and the heat radiating portion 9 is discharged to the outside in a region where the light emitting element 3 is three-dimensionally divided. As a result, heat is less likely to be retained in the vicinity of the light-emitting element 3 and the light-emitting element 3, and the temperature rise of the light-emitting element 3 is suppressed. As a result of this suppression, power to the south of the light-emitting element 3 can be given, and the illumination device 1 can illuminate the light with high luminance. (Light irradiated by the illumination device) The case where the light-emitting 7L member 3 emits light and the illumination device 1 emits light is described 201207312. The plurality of light-emitting elements 3 are grown on the mounting substrate 2 by a wire bonding method or a ball grid (baU_gdd). Electric power is supplied to the light-emitting element 3 by the mounting. : Giving Sense _ But 砀 — - force, illuminating 70 pieces 3 illuminates. Further, each of the plurality of light-emitting elements 3 has an intrinsic color such as blue red or green. By supplying electric power to the light-emitting elements 3 having respective intrinsic colors, the plurality of light-emitting elements 3 emit light of a mixed color of blue and red. A sealing hoop 4 is provided around the plurality of light-emitting elements 3, and the sealing ring case 4P is filled with a sealing member 5 made of a resin or the like. The sealing member 5 and the plurality of optical elements 3 are φ. Or contacting the side surfaces and sealing the plurality of light-emitting elements. The sealing member 5 protects the light-emitting elements 3 by the sealing. The material is filled with the sealing member 5 on the basis of the installation of the clothes box 4, so the sealing member 5 has: The shape and size of the box 4 correspond to the shape and size. ', the surface (upper surface) of the sealing member 5 has at least a concave shape and a convex shape. The Heda sealing is performed from a plurality of light emitting elements 3 At least one of the light concentration and the phase-expansion is made to emit light to the outside. That is, the sealing member 5 emits light to the light-emitting element 3, and the light emitted from the light-emitting element 3 is irradiated to the outside. Ji 4, the sealing member 5 has a function of protecting the hair piece 3 in a state of, for example, a bare wafer from being exposed to the outside, and the transmission is originally a seal % 抠 4 or the like. However, the sealing hoop 4 and the sealing member 5 have Sealing function and sealing · 4, sealing parts 5 control money The function of concentrating or diffusing the light emitted by the optical element. Sealing and illuminating can be realized without adding the spare parts. 17 201207312 It is not necessary to add extra cost to the heart and the light. Moreover, the lighting device 1 is The illumination is controlled on the basis of concentrating and sealing a plurality of light-emitting elements 3, so that unevenness of illumination and sealing of each of the light-emitting elements 3 is not obtained. Moreover, since the sealing and illumination control can be realized simultaneously in the same component towel, there is no The sealing and the illuminating control are not balanced to prevent the unevenness of the illuminating. In particular, since the illuminating control is performed in a state τ where the plurality of illuminating elements 3 are concentrated and sealed, the illuminating device 1 can feed the plurality of illuminating elements 3 and In addition, the illumination device % may have a configuration in which a lens correction is laminated on the sealing member 5. By having the lens plate 6, the sealing plate 5 and the lens plate 6 can be formed. The light emitted from the plurality of light-emitting elements 3 is concentrated or diffused more visibly. As a result, the illumination device 1 can more reliably control the light irradiation from the plurality of light-emitting elements 3 to the outside. A side view of the illuminating device of Embodiment 1. Fig. 3 and Fig. 4 show a configuration in which a lens plate 6 is laminated on the sealing member 5. As shown in Figs. 3 and 4, the lens plate 6 is laminated on the sealing member 5. The lens plate 6 has a convex lens or a concave lens shape, and is laminated on the layer of the sealing member 5 in accordance with the shape of the curved surface of the lens plate 6. When the sealing member 5 is filled = in the sealing ring 114, the sealing material is 5__lipid or the like. It is easy to form the shape of the layer of the sealing member 5 according to the shape of the lens plate 6. The 'sealing member' and the lens plate 6 can be brought into contact with a smooth curved surface. The surface of 5 has a concave curved surface, and the lens plate 6 laminated on the sealing member 5 is a convex lens. On the other hand, in Fig. 6, the lens plate 6 laminated on the sealing member 5 is a concave lens. 18 201207312 The sealing member 5 and the lens plate 6 are translucent or transparent, and transmit light emitted from the light-emitting element 3. At this time, the light-emitting element 3 illuminates the emitted light to the outside through the refractive curved surface formed by the sealing member 5 and the lens plate 6. At this time, the sealing member 5 and the lens plate 6 perform at least one of the operation of diffusing and concentrating the light emitted from the light-emitting element 3 in accordance with the curved shape. That is, the illumination device 集中 concentrates and illuminates the light emitted from the plurality of light-emitting elements 3 by a light collecting function or a diffusion function to the outside. That is, the sealing member 5 and the lens plate 6 are combined to control the light emitted from the plurality of light-emitting elements 3 and to illuminate the outside. In the case where the lens plate 6 is combined as compared with the case of only the sealing member 5, finer lighting control can be achieved. Further, the lens plate 6 is laminated on the sealing member 5, and the lens plate 6 also functions as a sealing member 5. As a result of the above, the illuminating member 41 can concentrate and seal the plurality of illuminating elements by the sealing member 5 and the lens plate 6, and concentrate the illuminating control to illuminate the outside. The case where the illumination device m is irradiated with light from the upper surface (front surface) of the illumination device η will be described with reference to Fig. 2 . Fig. 2 shows the state of the lighting device viewed from above, and the light-emitting elements 3 present inside the sealing hoop 4 and the sealing hoop 4 are displayed in a visible state. In the lighting device 1 shown in Fig. 2, the seal hoop 4 surrounds the periphery of the plurality of light-emitting elements 3. Here, the seal hoop 4 is substantially _ when viewed from above. The plurality of light-emitting elements 3' are mounted inside the substantially circular (four)·4, so that the light emitted from the plurality of light-emitting elements 3 is diffused or concentrated in a substantially circular shape, and the light-emitting direction and the light-emitting angle of the illumination device 1 are easily adjusted. Of course, the seal % hoop 4 can also be substantially elliptical or polygonal. 201207312 Diffusion or concentration Further, when viewed from above, the lens plate 6, the sealing member 5, and the light-emitting element 3 are laminated in this order. However, since the lens plate 6 and the sealing member 5 are translucent or transparent, they can be seen through both. To the light-emitting element 3. The clock light emitted from the light-emitting S_piece 3 is radiated to the outside through the lens plate 6 and the sealing member 5. At this time, the light emitted from the light-emitting element 3 passes through the curved surface formed by the lens plate 6 and the sealing member 5. At this time, as shown in FIG. 3, when the lens plate 6 is a convex lens, the light emitted by the light-emitting element 3 is refracted by the convex lens. Irradiation on the illuminated object. This situation is shown by arrow A. The sealing member 5 and the lens plate S irradiate the light emitted from the light-emitting element 3 to the outside along the arrow A. The case where the lens plate 6 is a convex lens is effective when it is desired to visually recognize the illumination from a distance. On the other hand, as shown in Fig. 4, when the lens plate 6 is a concave lens, the light emitted from the light-emitting element 3 is diffused onto the irradiated object and illuminates due to the refraction of the concave lens. The sealing member 5 and the lens plate 6 illuminate the light emitted from the light-emitting element 3 to the outside along the arrow B. The case where the lens plate 6 is a concave lens is effective when it is irradiated to the same extent within the intended range. Thus, the illumination I is set to 1 to concentrate or diffuse the light emitted from the light-emitting element 3 according to the surface shape (curved surface) of the sealing member 5 and the shape of the lens plate 6, and to illuminate the outside. Further, the illuminating device is configured in a state in which the sealing hoop 4 and the lens plate S are mounted on the mounting board 2, and the illuminating device is excellent in movability, and can be combined as a single unit in various devices. Since the illuminating device 1 can concentrate and seal a plurality of illuminating elements 3 and centrally perform illuminating control: it is most suitable for combination in a signal device, a fish collecting lamp, a lighting device in a tunnel, a 20 201207312 street lamp, and the like which require a relatively high illuminating amount. As mentioned above, the implementer. Concentrating and sealing the unevenness of the sealing of the plurality of light-emitting elements 3 in the sealing needle illumination device. Further, the interior of the permanent habitat 4 can prevent each of the light-emitting elements 5 and the lens plate 6 from being sealed by laminating inside the sealing hoop 4. In particular, the concentration of the light emitted by the sealing hoop 4 and the light-emitting element 3 does not mean that the lens plate 6 is not in contact with each other (and in a separated state) state, and thus the density is called _ (four) pieces. ::=:: Mirror_ Part 3's sealing function and illuminating month achieves a special control function for illuminating elements with fewer components. As a result, costs can be reduced. Further, in Fig. 1, in order to ensure _clearness, one of the plurality of illuminating elements is indicated by the symbol "3", and the other illuminating elements can be understood by the same symbols. (Control of Heat from Light-Emitting Element to Light-Emitting Surface) Next, the release of heat conducted from the light-emitting element 3 of the illumination device 1 to the light-emitting surface will be described with reference to Fig. 5 . Fig. 5 is a side view showing a part of the illumination device of the embodiment i of the present invention. The lighting device 1 is required to be suitable for use in engineering lighting devices, street lamps, lighting devices in tunnels, signal devices, or fishing lights, which require high brightness. Therefore, in order to cause the light-emitting element 3 to emit light with high luminance, it is necessary to give the light-emitting element 3 a higher current value or a higher voltage value. Due to such high-intensity light emission, the light-emitting 7L member 3 generates high heat, and here, the plurality of light-emitting elements 3 emit heat from the mounting surface, the light-emitting surface, and the side surface. 21 201207312 Among the heat generated by the light-emitting element 3, the heat generated from the mounting surface is diffused by the overheat diffusion portion 7, and is discharged from the heat radiating portion 9 to the outside through the heat transfer portion 8. The release of this heat is as described above. On the other hand, the heat emitted from the light-emitting surface and the side surface of the heat generated by the light-emitting element 3 is transmitted to the sealing member 5. This is because the sealing member 5 is in thermal contact with the light-emitting surface and the side surface of the light-emitting element 3 by the light-emitting surface and the side surface of the sealed light-emitting element 3. Thereby, the sealing member 5 receives the heat generated by the light-emitting element 3. Further, in order to seal the light-emitting element 3, the sealing member 5 is made of a molten resin, and the heat-transfer property is inferior to that of a metal or the like due to a refining resin or the like. Therefore, in many cases, the sealing member 5 accumulates heat generated from the light-emitting element 3. If the sealing member 5 accumulates heat generated from the light-emitting element 3, the lighting device may exhibit a malfunction, damage or malfunction. In order to avoid such a problem, it is necessary to lower the current value or voltage value given to the light-emitting element 3. However, if the current value or the voltage value given to the light-emitting element 3 is lowered, the illumination of the light-emitting element 3 is reduced, and the illumination device 1 is difficult to apply to an illumination device for a project requiring high brightness, a street lamp, or a lighting device in a tunnel. , signal devices or fish lights, etc. The sealing member 5 has a heat conducting member 5〇 inside thereof. The heat conduction 1 card receives the heat inside the sealing member 5 and conducts it to the sealing hoop 4. The heat conducting member 50 is adapted to have a lattice/shape formed of a material having high thermal conductivity. For example, a heat transfer member 5 such as a metal mesh is disposed inside the sealing member 5 and is in contact with the heat. Thereby, the heat conduction member 50 can conduct the heat emitted from the light-emitting element 3 by the sealing member 5 to the seal hoop 4. a :in (ie, the inlet ring hoop 4 dew 22 201207312 for the second part 'can release the heat from the heat conduction part to the outside. 疋 Because the seal j money 4 is formed of metal, alloy or resin with high thermal conductivity, Therefore, the seal hoop 4 can discharge the conducted heat to the outside, the substrate, the casing, etc. As a result, at least a part of the heat emitted from the light-emitting surface and the side surface of the light-emitting element 3 is accumulated in the sealant 5 The external heat is emitted from the heat conducting member 5G and the splicing 4, and the heat is discharged to the outside of the sealing member 5, which is easy to accumulate heat. ^ In addition, the sealing ring case 4 is in the At least a part of the surface and the side surface has is, whereby the heat that can be conducted from the heat conduction member 5 is released. Fig. 6 is a front view of the first embodiment of the present invention. Half: a state in which the light irradiation direction of the illuminating device 1 is viewed. That is, a plurality of imaginary states in which the transparent member 6 is transparent and transparent, and the singular state of the illuminating device 5 is shown to have a heat sink 4 from the side of the sealing device. The side of the 4 extends. Also, the conduction part is guided to seal her heat release;: heat:: two Γ =::: when the light element 3 emits light as a light-emitting part 5 In addition, as shown in FIG. 6, the heat-conductive part % has a plurality of parts The lattice shape in which the mounting position of 3 is repeated. The above-mentioned = does not hinder the light emission of the light-emitting element 3. (release of heat to the mounting surface and release of heat to the light-emitting surface) 23 201207312 As described above, the embodiment [ Illumination device] The heat generated by the plurality of light-emitting elements 3 can be separated from the light-emitting element 3 by the combination of the heat diffusion portion 7, the heat transfer portion 8, and the heat dissipation portion 9 in the heat S generated by the plurality of light-emitting elements 3. The area is discharged. That is, the heat # generated on the real surface is discharged in a region three-dimensionally separated from the light-emitting element 3. Further, when the (four) guide member 50 is provided on the (four) member 5, the heat-conducting member 5 is sealed and the hoop is sealed. 4 and the heat sink 4 (), the heat generated by the plurality of light-emitting elements 3 can be emitted on the light-emitting surface in a region separated from the light-emitting Μ Μ 3, that is, the heat generated on the light-emitting surface is • The two-dimensionally separated area of the fx optical element is released. In the middle of 'the arrow G, the arrow indicates the release path of the heat. The heat generated on the light-emitting surface of the light-emitting 7G member 3 is discharged outside the arrow 4, and the heat generated on the mounting surface of the light-emitting element 3 follows. The arrow 11 is discharged to the outside. By the heat dissipation of the two systems, heat is not easily retained in the vicinity of the light-emitting element 3, and the temperature rise around the light-emitting element 3 and the light-emitting element 3 can be suppressed. That is, by the arrow G, the arrow Η is mixed. The heat dissipation of the system can further increase the suppression of the temperature rise of the light-emitting element 3. Thus, by suppressing the temperature rise of the light-emitting element 3, the light-emitting element 3 can be supplied with higher electric power, and the illumination device can be made high. The illumination device i is applied to, for example, a lighting device for engineering, a street lamp, an illumination device in a tunnel, a signal device, a fish-collecting lamp, or the like. Of course, heat dissipation by the path of the arrow G composed of the heat conducting member 50, the sealing hoop 4, and the fins 4 is not essential. Next, each component will be described in detail. (Solid board) 24 201207312 First, the mounting board will be described. The mounting substrate 2 is used to mount a plurality of light-emitting elements 3. Like the glass epoxy board, the package substrate 2 can be generally used for a substrate on which an electronic component and a semiconductor integrated circuit are mounted, or a wiring layer capable of transmitting an electrical signal. The mounting substrate 2 may be provided with only a plurality of light-emitting elements 3 for the illumination device, or an electronic component other than the light-emitting elements 3 and a semiconductor integrated circuit. For example, the substrate 2 may have a semiconductor integrated circuit having a control function and a processing function, and necessary electronic components, and a plurality of light-emitting elements 3 may be mounted in other regions. Further, the mounting substrate 2 can be electrically mounted on the light-emitting element 3 by wire bonding, flip chip or ball grid, and the electric jg number provided in another circuit of the mounting amount is given to the light-emitting element 3. That is, the mounting substrate 2 forms the basis of (4) device turns, and gives electrical signals to the plurality of light-emitting elements 3. The shape and size of the mounting substrate 2 can be set according to a plurality of light-emitting units, or can be set in accordance with the state of use of the lighting device. Further, the mounting substrate 2 can be mounted in addition to the light-emitting element 3 (4). Further, the mounting substrate 2 includes a thermal diffusion portion 7. For example, the thermal diffusion portion 7 may be housed inside the mounting substrate 2, and the diffusion portion 7 may be laminated on the mounting substrate 2, or the mounting substrate 2 itself may be used as a thermal diffusion portion 7 capable of mounting an electronic component or the like. . In this case, the surface of the thermal diffusion portion 7 can be mounted with the electronic component 3 as the first (four) sub-material and the good component (four) (four). 25 201207312 (Light-emitting device) Next, the light-emitting device 7 will be described. By mounting a plurality of light-emitting elements 3 on the mounting substrate 2, the illumination device 1 can illuminate light with high luminance. Electric power is supplied to each of the plurality of light-emitting elements 3 to emit light, and the illumination device 集中 concentrates the light of each of the plurality of light-emitting elements 3 to emit high-intensity light. The core light element 3 is an element that emits an electric signal and emits light. As long as it is a component having a light-emitting function that receives an electric signal, it is suitable for use in terms of ease of mounting and control. This is because (4) there is an advantage that it is possible to control the pattern of the luminescent color by controlling the illuminating state according to the current and voltage of the electric signal to be supplied and having an inherent color such as blue, red or green. The plurality of light emitting elements 3 are mounted on the mounting substrate 2. The number of the light-emitting elements 3 can be appropriately set in accordance with the state of the illumination device 1, and several to several hundred (or several thousand) light-emitting elements 3 can be mounted on the substrate 2. The light-emitting element 3 is mounted on the mounting substrate 2 by wire bonding or ball grid, and is electrically connected to the mounting substrate 2 (further further to other electronic components mounted on the mounting substrate 2). Light is emitted by the electrical connection by the light-emitting element 3 receiving the electrical signal. The light-emitting element 3 is based on the current value of the received electrical signal. A voltage value or a waveform pattern of the signal emits light, and light emission based on the inherent color of the light-emitting element 3 is performed. According to these illuminating changes, the illuminating element 3 realizes various illuminating patterns. The light-emitting element 3 realizes light emission according to various standards such as color, light-emitting level, and light-emitting interval, depending on the mounting substrate 2 or a member having a control function provided separately from the mounting substrate 2. Each of the light-emitting elements 3 is also mounted on the mounting substrate 2 in a bare wafer state. By mounting in the bare wafer state, the cost and volume of the light-emitting element 3 can be reduced, and 26 201207312, thereby reducing the cost and volume of the illumination device 1. Further, by mounting the light-emitting element 3 in a bare wafer state, the sealing member 5 and the lens plate 6 can directly receive the light emitted from the light-emitting element 3, and unnecessary light emission control is required. Therefore, mounting the light-emitting element 3 in a bare wafer state is advantageous for the practice of the present invention. Further, since the light-emitting element 3 is in a bare wafer state, the light-emitting element 3 has a surface, an inner surface, and a side surface. The inside is a mounting surface of the mounting substrate 2, and emits light from at least a part of the side surfaces. Further, since the plurality of (four) optical elements 3 are mounted on the mounting substrate 2, the light-emitting elements 3 and the light-emitting elements 3 of _ may also reflect light. . Α Θ ...u Like the electric I applied by the corpse / Γ : : 发 发 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 3 can be connected in parallel or in series. In the state of parallel and series connection τ: 'Also (sealing hoop) Zanyou and * 3 electrical connection. Second, the company, seal ring hoop 4 to explain. The sealing hoop 4 is mounted around the solid circumference. As shown in Fig. 2, the periphery of the plurality of light-emitting elements 3 on the crucible substrate 2 is sealed. It is preferable to seal the plurality of luminous shapes of the hoop armor. The light-emitting element 3, / from the 1® shape, roughly the sugar circle: at the same time around the light-emitting element but also:: formed around the square or the polygon =, and therefore, the second shape, the basic shape of the sunlight illumination. 4 Forming the illuminating device 1 In addition, at least 1 of the degree and the opening area of the sealing hoop 4 is determined according to the number of 27 201207312 jfT" //1. Since the number of the light-emitting elements 3 is small and the outer circumference of the ring ^ is changed Large, so the opening area of the sealing ring H4 becomes larger. The amount of light emitted from the light-emitting element 3 is changed so that the amount of light that is more reflected is higher. The height of the seal ring case 4 becomes higher. Since the seal ring 5 is filled with the seal member 5, it is preferable to seal the outer circumference of the hoop 4 4. This is because the sealing member 5 is mostly molten resin, and the molten resin which is prevented from being filled out of the sealing hoop 4 is required. Therefore, the sealing % is 4 turns into a ring H, and the member is placed on the mounting substrate. 2 can be used. The 岔 % % hoop 4 can be formed of resin, metal, alloy, etc., bonded or welded to a plate 2 for mounting. In the case of bonding, an adhesive can be used. The heat conduction member 5 calls the heat to be discharged to the outside, so that the seal ring case is formed of a material of ',,, conductivity'. The seal hoop 4 is transparent or translucent, but reflects the light emitted from the light-emitting element 3 to The sealing member 5 and the lens plate 6 are also in a non-transparent state capable of reflecting light. This is because the sealing hoop 4 serves as a hoop when the sealing member 5 is filled and serves as a reflection portion of the light emitted from the light-emitting element 3. In addition, the sealing hoop 4 is provided as needed The heat sink 4〇. The heat sink 4〇 releases the heat generated by the light-emitting element 3 on the light-emitting surface through the sealing member 5 (may also be through the heat-conducting member 5G). The heat sink can be combined with the sealing ring box 4-body. Forming ' can also be dried, dried, etc. on the sealing hoop 4 later. (Sealing member) The sealing member 5 is filled with a region surrounded by the sealing ring case 4. Sealing member 妯 28 201207312 Molten tree ^ etc. The flow of the person% of the hoop 4 forms a seal member 5. Thus, after "% two:, =r" (four) resin flows into the dense, the charging device is better. After the flow of the person, the bubble is automatically filled and the outer rise of the seal hoop 4 is lowered: the molten resin is fluoresced and the solid sealing member 5 is formed. It is also possible to set the hot seal member 5 in advance to correct the filling of the seal ring by two: If the hot material member is set to seal the light, a heat Si is sealed, and the seal member 5 in the state in which the hot material member is sealed is It is also possible to form the sealing member 5 inside the seal ring case 4. The sealing member 5 concentrates or diffuses the light emitted from the light-emitting element 3 alone or together with the sealing ring||4 and the lens plate 6. Therefore, the sealing member $ is a basic member that concentrates or diffuses light emitted from the light-emitting element 3. The male member 5 is opaque or translucent, which is transparent or translucent, whereby the light emitted from the light-emitting element 3 can be transmitted. The transmitted light is radiated to the outside by the concentration or diffusion of the lens plate 6 described later, so that the light emitted from the plurality of light-emitting elements 3 is radiated to the outside. . The cow 5 has a concave or convex upper surface (surface). This is for the purpose of ordering at least one of the concentration or diffusion of light emitted by the light-emitting elements 3. When the upper surface of the sealing member 5 is concave, the sealing member 5 collects the light-emitting element 3*. Conversely, when the upper surface of the sealing member 5 is convex, the sealing member 5 29 201207312 diffuses the light emitted from the light-emitting element 3. . Not to be defeated (the shape of 5 is determined). The upper (four) shape of the shape reading member 5 on the surface of the upper layer 1 of the (4) member (10) is determined by the shape of the lens plate 6, for example, a lens When the plate 6 is a convex lens, (4) the upper part of the member 5. When the curved surface lens plate 6 is a concave lens, the sealing member 5 has a concave curved surface. The convex conductive member (heat conducting member) is used, and the conductive member 50 is described as a heat conducting member. 50 is disposed inside the sealing member 5. The heat conducting member 50 conducted to the sealing member 5 by the light emitting member 3 discharges heat to the sealing hoop 4 from the sealing hoop 4. The sealing ring 4 is transmitted. The heat transfer conduction member 5__ is in contact with the inside. @ The end of the measuring end is in contact with the sealing member. It is also advantageous for the heat-conducting member to be conducted by the light-emitting element 3 to the heat-transfer sealing hoop 4 of the sealing member. Conducted to a dense member. For example, metal, °Λ,, ', conductive part 5 gold. As one of the examples + (four) from copper, knot, silver, Shao alloy, iron, iron alloy ^ high conductivity or Metal shape with high anti-recording (or durability) The heat transfer member 5 such as steel heats the heat transfer member 5 to conduct the function of sealing the seal ring hoop 4 to the outside. Because of the light emitted from the light-emitting element 3, as shown in Fig. 3, the heat conductive member It is also suitable for the conductive material to form a zebra 5 。. For example, the heat conduction member 5 〇 30 201207312 may also have a mesh heat conduction member 5 formed of a metal, an alloy or a resin having high thermal conductivity, having a lattice shape. Thereby, the heat of the sealing member 5 can be conducted to reach the seal 4 and does not hinder the irradiation of the light emitted from the light-emitting element 3. This is because the light emitted from the light-emitting element 3 can leak from the lattice-shaped void region. In particular, when the light-emitting element 3 is given a high current value or a voltage value of the light-emitting element 3 to emit light with high luminance, the lattice-shaped heat conduction member 50 is less likely to hinder light emission. In particular, the illumination device 1 is used for a signal device, an engineering illumination device, In the case of a device that requires brightness but does not require high-precision illumination or color development, such as an indoor lighting device, a street lamp, or a fish-collecting lamp, the heat-conducting member 50 is not easily formed. The reason why the light-emitting element 3 is prevented from emitting light. When the heat-conducting member 5 has a lattice shape, it has a lattice shape that matches the number of the light-emitting elements 3 and the arrangement interval of the light-emitting elements 3. For example, the number of lattice-shaped void regions is The area is also suitable for the arrangement interval of the light-emitting elements 3. In addition, the heat-conductive member 50 may have a lattice shape of a square frame shape, and may have a lattice shape of a frame such as a circle, an ellipse or a polygon. The shape of the heat of the sealing member 5 is not hindered from the irradiation of the light emitted from the light-emitting element 3. Any shape may be used. The heat-conducting member 50 may be disposed inside the sealing member 5, but may also be provided on the sealing member 5. Any position between the element 3 and the top. For example, the heat transfer member 50 may be disposed inside the sealing member 5 at a substantially intermediate position between the light-emitting element 3 and the upper surface. As described above, the heat conducting member 5 is disposed inside the sealing member 5, and conducts heat of at least a part of the light emitting element 3 and the sealing member 5 to the sealing hoop 31 201207312 I. The heat conducted to the seal hoop 4 is discharged from the seal hoop 4 and is also externally ejected from the fins which are placed on the (four) ring f|4. Thus, the heat conducting member 5 有效 effectively conducts the heat generated by the light-emitting element 3 on the light-emitting surface to the external and sealing ring |i4. In particular, the amount of 2 which is likely to remain in the inside of the sealing member $ is transmitted to the sealing hoop 4, so that the periphery of the light-emitting element 3 becomes less likely to retain heat. (Lens Plate) The six-receiver 'Dongzi lens plate 6 will be described. The lens plate 6 is laminated on the upper n-lens plate 6 of the sealing member 5 as needed to form the surface shape of the sealing material 5, and is used in the manufacture of the illuminating device 1. The lens plate 6 is laminated on the upper layer of the sealing member 5. The lens plate 6 together with the seal hoop 4 and the sealing member 5 concentrates or diffuses the light emitted from the plurality of light-emitting elements 3. The shape and configuration of the lens plate 6 is the light emitted from the light-emitting element 3. 1 The lens plate 6 is made of glass, resin, or the like. In the process in which the lens plate 6 is transparent or translucent and the light emitted from the light-emitting element 3 is transmitted through the light, the illumination device 1 emits the light-emitting element 3 according to the shape of the sealing member 5 and the lens plate 6. The light concentrates or spreads and turns it out of the way. The lens plate 6 may have an outer circumference that is the same as the outer circumference of the seal hoop 4, or may have an outer circumference that is small on the outer circumference of the seal ring 4. However, the lens is corrected to have the shape of the outer circumference of the seal ring M4. The sealing member 5 and the seal ring case: and the lens plate 6 are sealed, and the 4 lens plate 6 which improves the durability and the strong sound of the illumination device 1 is laminated. Since the upper layer of the sealing member 5 is formed, the shape of the sealing member 5 (the shape of the surface of the sealing member 5 and the laminated layer 32 201207312 of the lens plate 6) is determined in accordance with the shape of the lens plate 6. According to the shape in which the lens plate 6 and the sealing member 5 are combined, the light of the plurality of light-emitting elements 7L is concentrated or diffused. The shape of the sealing member 5 is determined in accordance with the shape of the lens plate 6 and it is determined that the light of the light-emitting element 3 is concentrated or diffused as explained with reference to Figs. The stacking of the first sealing ring, such as the sealing material 5 and the lens plate 6, is performed by sealing the plurality of light-emitting elements 3 while sealing them (thermal diffusion portion). The thermal diffusion portion 7 is included in the mounting. The substrate board 2 is self-defeating in this soil 2 . For example, it may be a mounting base as the heat diffusion portion 7 (this kind of surface (4) ^ lower heat diffusion portion 7 has an electric body which can be cracked by the light-emitting element 3 in the clothing surface, and is electrically connected to the element. In the configuration, the heat diffusion portion 7 may be accommodated inside the shell plate 2, and the material 7 may be laminated. The thermal diffusion portion 7 can be recorded on the bottom surface of the mounting substrate 2 from the light-emitting element 3. At this point, the heat is spread to a plane that is slightly parallel to the surface of the egg. In particular, the mounting level of the light-emitting elements 3 is from the mounting area of the mounting heat generating body 3 to the photons emitted from the material unit 3, and the plurality of light-emitting elements 3 are as shown in Fig. 2: the area is diffused. In the case of a case-like actual earthquake, 'the light is emitted from the light-emitting element 3 in a matrix. Take the moment (the mounting area). Therefore, the heat/diffuser of the first portion of the heat diffusion portion 7 is diffused to the surroundings in the area where the heat is applied, thereby reducing the degree of concentration of the hair in the mounting area. The % element 3 and the warm diffusing portion 7 of the actual mounting area are capable of transferring heat from the solid member, and therefore, the metal member such as copper or aluminum, which is a heat-transfering H region to the peripheral region, is a 2012 201212 plate-shaped member. However, in order to diffuse heat more efficiently, it is also suitable that the scatter portion 7 is a flat heat pipe. The heat pipe has a function of taking heat of the heat sink and diffusing it by repeated gasification condensation of the refrigerant sealed in the inner space shielded by the surroundings. An example of the heat diffusion portion 7 having a heat pipe structure will be described. For example, the thermal diffusion portion 7 includes an upper plate, a lower plate that faces the upper plate, and a single or a plurality of intermediate plates that are stacked between the upper plate and the lower plate. The internal space formed by the upper plate, the lower plate, and the intermediate plate can seal the refrigerant, and the vaporized refrigerant moves on the vapor diffusion path formed by the intermediate plate, and the condensed refrigerant moves on the capillary flow path formed by the intermediate plate. Further, the vapor diffusion path and the capillary flow path radially diffuse heat of the light-emitting element 3 from the vicinity of the center of the heat diffusion portion. At this time, the vaporized refrigerant moves in at least one of the horizontal direction and the vertical direction of the vapor diffusion path. The condensed refrigerant moves in at least one of a horizontal direction and a vertical direction of the capillary flow path. However, since the internal space is a flat space formed by the accumulation of the upper plate and the lower plate, the heat diffusion portion 7 diffuses heat in the direction of the mounting plane. The details of the thermal diffusion portion 7 will be described with reference to Figs. 7 and 8 . Fig. 7 is a side exploded view of the heat diffusion portion according to Embodiment 1 of the present invention. Fig. 8 is an internal front view of the heat diffusion portion according to Embodiment 1 of the present invention. Fig. 7 shows the state in which the upper plate, the lower plate, and the intermediate plate are separated, respectively, and Fig. 8 shows the upper plate in which the heat diffusion portion 7 is removed so as to be visible inside. The heat diffusion portion 7 is formed by laminating an upper plate 71 and a single or a plurality of intermediate plates 73 stacked between the upper plate 71 and the lower plate 72 of the lower plates 72, 34 201207312 opposed to the upper plate 71. At this time, when the upper plate 71, the lower plate 72, and the intermediate plate 73 are laminated, the respective members are joined by the projections provided at the respective joint portions. The heat diffusion portion 7 forms the internal space 79 by this joining. The refrigerant is sealed in the internal space. For example, a refrigerant is injected into the internal space 79 from an injection port (not shown), and the refrigerant is sealed by closing the injection port. At this time, the refrigerant becomes easily vaporized by injecting the refrigerant under vacuum or under reduced pressure. The heat diffusion portion 7 can diffuse heat with high efficiency. The upper plate 71, the lower plate 72, and the plurality of intermediate plates 73 (four intermediate plates 73 in Fig. 7) respectively conform to the positional relationship in which they overlap at the same position. Further, the plurality of intermediate plates 73 conform to a positional relationship in which only a part of the internal through holes 76 respectively provided in the plurality of intermediate plates 73 are overlapped. At least one of the upper plate 71, the lower plate 72, and the plurality of intermediate plates 73 has engagement projections. The upper plate 71, the lower plate 72, and the plurality of intermediate plates 73 are laminated on the basis of the positional relationship, and are directly joined by hot pressing. At this time, the respective members are directly joined by the engaging projections. Here, the direct bonding means that the heat treatment is performed while pressurizing the surfaces of the two members to be joined, and the atoms are firmly joined by the interatomic force acting between the faces. Direct bonding can be achieved by integrating the faces of the two members without using a bonding agent. At this time, the joint projection achieves a firm joint. As a result, the thermal diffusion portion 7 can be manufactured. Further, the intermediate plate 73 has a slit portion 74 and an internal through hole 76. In Fig. 8, a groove portion 74 cut away in a radial shape is shown, and an internal through hole 76 provided in a member other than the groove portion 74 is shown. The grooving portion 74 forms a vapor 35 201207312 The vapor diffusion passage 75' (four) the cross rail 76 forms a capillary flow path 77. The vapor diffusion passage 75 is formed radially from the substantially center of the heat diffusion portion 7. The remaining portion of the radially formed neon diffusion passage 75 is a region where the capillary flow path η is formed. Thereby, in the plane of the internal space 79 along the plane direction of the internal space 79, the vapor diffusion passages 75 and the plurality of capillary flow passages are respectively adjacent to each other. In particular, as shown in Fig. 8, the vapor diffusion passage 75 and the capillary The arrangement of the Γ (4) connection is also suitable. Thus, in a plane along the direction in which the thermal diffusion portion 7 is expanded, the plurality of vapor diffusion paths are respectively arranged adjacent to the parent of the S-path 77. The refrigerant vaporized at the substantially center of the heat diffusion portion 7 is radially moved to the peripheral region, and the cooling condensed in the peripheral region H of the thermal diffusion portion 7 is radially radiated toward the center of the towel. And the movement of the condensed refrigerant, the heat diffusion portion 7 can diffuse heat in a sprayed manner. - At this time, the position of the (4) bulk portion 7 in the direction in which the towel is read is the fashion light: the agricultural region of the member 3, so the heat diffusion The portion 7 can spread the mounting region of the light-emitting element 3 to the peripheral region. The examples of the vapor diffusion path 75 and the capillary channel π shown in ',, _' are as long as Diffusion of the heat of the light-emitting element 3, other In addition, when the light-emitting element 3 is actually worn in the region where the end portion of the light-emitting element 3 is opposed to the mounting, the vapor diffusion path 75 and the capillary flow path 77 may be formed in such a manner that heat can be diffused from the manufacturing portion to the periphery. At least one of the diffuser passage 75 and the upper plate 71 and the lower block 72 is provided with a recess 7 8 that communicates with at least one of the steam expansion capillary channel 73. The recess 72 is used to vaporize or cool the gas. The 妄 is moved from the vapor diffusion passage 75 to the portion where the refrigerant of the capillary is easy to move to another region. As a result, the amount of the fluid is transferred from the capillary. The cooked diffusion portion 7 can quickly read the diffusion heat to each of the heat diffusion portions 7 . The upper plate 71 will be described in detail. The upper plate 71 will be described. The shape of the upper heat diffusion portion 7 having the same outer shape and the shape of the + plate are formed by the same or the like, but the copper n plate 71 may be made of metal. The resin is made of a metal having high thermal conductivity or anti-money property (two = upper plate 71 and lower plate 72_π / long'). The plate 71 or the lower portion is an internal space 79. For example, the upper portion or the wall: ρ pieces (4) The edge has a space for forming internal space The convex or the splicing plate 72 of the 79 is formed by the above-mentioned portion or wall member 79. When #, the plate 71 and the lower plate 72 form an internal space to form an inner void = the thickness of the intermediate plate 73 formed by the intermediate plate 73 It is also suitable for the application of metal coatings. The movement of this system is: {{surface state modification, alloys such as refrigerants that can promote gasification, etc., such as phoenix film' from gold, silver, copper, Ming, nickel, and the choice of the genus can be. Of course, a single layer of membrane electricity, non-electrical mineral film can be any one. ^ Physical: 71, although f "upper" name 'but and It is not necessary to be placed on the side, but is a convenient name. The actual mounting of the light-emitting element 3 201207312 The mounting substrate 2 may be in contact with the upper plate 71 or may be in contact with the lower plate 72. Alternatively, when the light-emitting element 3 is directly mounted on the thermal diffusion portion 7, the light-emitting element 3 is mounted on the surface of the upper plate 71 or the surface of the lower plate 72. (Lower Plate) The lower plate 72 is a member that faces the upper plate 71 and has the same structure and shape as the upper plate 71. Therefore, the lower plate 72 also has the same flat shape as the upper plate 71, and has a shape that matches the outer shape of the heat diffusion portion 7. In addition, it has the same material and construction as the upper plate 71. Further, the lower plate 72 may have a refrigerant injection port similarly to the upper plate 71. Although the lower plate 72 has the name "lower", it does not have to be physically disposed downward, but is a convenient name. The mounting substrate 2 may be in contact with the lower plate 72 or may be in contact with the upper plate 71. (Intermediate Plate) A single or a plurality of intermediate plates 73 are laminated between the upper plate 71 and the lower plate 72. Since the intermediate plate 73 is laminated between the upper plate 71 and the lower plate 72, it is preferably formed in the same flat shape as the upper plate 71 and formed of the same material as the upper plate 71. Further, since it is laminated, it is preferably of the same size as the upper plate 71 and the lower plate 72, but may be of a slightly smaller size to form the internal space Ί9. The intermediate plate 73 includes a grooved portion 74 and an internal through hole 76. As described above, the grooving portion 74 forms a vapor diffusion passage 75 for moving the vaporized refrigerant as a void. The inner through hole 76 is a very small fine hole, and the combination of the fine holes forms a capillary force. The capillary channel 77 moves the condensed refrigerant by the capillary force. 38 201207312 Here, the groove portion 74 is formed in a radial shape as shown in FIG. s, and is cut into four by the π expansion passage 75. The vaporized refrigerant is radially displaced. Of course, the condensation (four) refrigerant is also radial (four). . If you change the cut. The shape of the heat is used to change the direction of heat transfer of the light-emitting element 3. :: Due to the hair, the '® e path 77 is formed on a portion other than the t-reading portion 74. In the above, the capillary flow path 77 is formed by the internal through hole 76, and the laminated shape of the intermediate plate 73 determines the structure of the capillary flow path π. For example, if the intermediate plate 73 is single, the inner through hole 76 provided on the intermediate plate is entirely formed into a capillary flow path. Therefore, when there are a plurality of intermediate plates 73, the internal through-holes 76 provided in the plurality of intermediate plates 73 are only partially overlapped, and the cross-sectional surface 2 is formed to have a smaller cross-sectional area in the horizontal direction than the internal through-holes 76. When the intermediate flow plate 73 is plural, the capillary flow path 77 having a smaller cross-sectional area than the internal through-hole 76 itself is formed, and the condensed refrigerant in the capillary flow path 77 is more effectively rotated. In particular, the buildup of the plurality of intermediate plates 73 (four) through rails 76 overlaps in the thickness direction of the heat diffusion portion 7. Due to this coincidence, the capillary flow path 77 in the horizontal direction and the vertical direction is formed. As a result, the condensed refrigerant can move in the horizontal direction and the vertical direction along the capillary f flow path π. As a result, the heat diffusion portion 7 can rapidly move the condensed refrigerant. Further, here, a plurality of internal through holes 76 are provided in the intermediate plate 73. This is advantageous in that the present invention is implemented by having a plurality of internal through holes 76 in order to function as a capillary flow path. 39 201207312 The inner through hole 76 penetrates from the surface of the intermediate plate 73 to the inside, and may have a circular shape of an ellipse or a square. A part of the inner through-holes 76 are overlapped to form a capillary channel 77'. Therefore, the inner through-holes 76 are square-shaped. This is also suitable from the ease of manufacture. The inner through hole 76 can be formed by digging, pressurizing, wet etching, dry etching, or the like. From the viewpoint of smile processing and processing precision, it is suitable to form by wet etching or dry etching. When the intermediate plate 73 is plural, the inner through holes 76 are provided in the plurality of intermediate plates 73, respectively. Here, since the plurality of intermediate plates 73 are laminated so that only a part of the internal through holes 76 overlap each other, the position of the internal through holes 76 is preferably biased to the adjacent intermediate plates 73. For example, the position of the inner through hole 76 located in a certain intermediate plate π and the position of the inner through hole 76 on the other interposed plate 73 adjacent to the tread plate 73 are 5 in the area of the inner through hole %. Deviated. Thus, each of the adjacent intermediate plates 73 is inside. When the positions of the P through holes 76 are shifted, when a plurality of intermediate plates are laminated, it is said that the capillary flow path 77 having a cross-sectional area smaller than the cross-sectional area of the internal through holes 76 in the horizontal direction is formed. Further, the condensed refrigerant moves in the capillary channel 77, but there may be a vaporized refrigerant moving. Further, the corner portion of the concave portion 78 of the capillary flow path 77 and the angle 4 of the grooving portion are chamfered, but a ruler may be provided. The cross section of the thin tube flow path may have a hexagonal 'circular' shape and a square shape. Various shapes such as polygons, etc. The cross-sectional shape of the capillary channel 77 is determined by the combination of the shape of the inner through hole (10) and the inner through hole 76. The cross-sectional area is also determined by the same factor of 40 201207312. As described above, the heat diffusion portion 7 diffuses the heat of the light-emitting element 3 mounted on the large area fool to the heat transfer portion S in which the peripheral mounting amount is conducted to the thermal contact portion S. The heat of the heat expansion (heat transfer portion) The heat transfer portion 8 transports the heat from the heat diffusion portion 7 to the normal direction (the heat diffusion portion 7 in the Y-axis direction in FIG. 1 diffuses heat from the region where the heat is generated 3 to the peripheral region. Suppressing the light-emitting element 3 = increasing the degree 'The heat-diffusing portion 7 diffuses the heat emitted from the light-emitting element 3 to the far side: The light-emitting element 3 is important. Therefore, the heat transport portion 8 is located at the periphery of the heat diffusion portion and is thermally heated with the heat diffusion portion 7. Contact is advantageous for the implementation of the invention. The heat conducted from the heat diffusion portion 7 is sent to a predetermined direction. Here, the heat diffusion portion 7 diffuses heat in the direction of the mounting plane, and therefore, the heat transfer portion 8 transfers heat in a direction intersecting the mounting plane. It is advantageous for the practice of the present invention. As shown in Fig. 1, the heat diffusion portion 7 diffuses the heat transfer portion 8 in the X-axis direction to transfer heat in the Y-axis direction. Thus, the heat diffusion portion 7 and heat are transported. As a result of the three movements of the heat of the light-emitting element 3 moving in the cross direction, the heat is easily separated from the light-emitting element 3' and the illumination device does not become too large in the X-axis direction or becomes too large only in the Y-axis direction. The heat transfer portion 8 may be, for example, a rod or a metal rod having a high thermal conductivity. The heat transfer portion 8 can transport the heat 4 from the heat diffusion portion P7 to a predetermined direction. Alternatively, the heat transfer unit 8 and the heat diffusion unit 7 may have a heat pipe structure in order to improve the heat transfer efficiency. For example, as shown in Fig. 1, the heat transfer unit 8 has a rod shape. Sealable refrigeration The internal space is provided with a steam passage for moving the vaporized refrigerant and a capillary flow path for moving the condensed refrigerant. In particular, the heat transport portion 8 has a vapor passage and a capillary flow path in the Y-axis direction, thereby The vaporized refrigerant and the condensed refrigerant can be moved in the Y-axis direction. For example, a capillary flow path may be provided at the center of the internal space of the heat transport portion 8, and a steam passage may be provided around the heat transfer portion 8, and vice versa. By dividing the internal space of the heat transport portion 8 into a vapor passage and a capillary flow passage, movement of the vaporized refrigerant and the condensed refrigerant can be generated, and the heat transport portion 8 can save heat to a predetermined direction. The heat radiating portion 9 is a member that is in thermal contact with the heat transport portion 8, and the heat transferred from the heat transport portion 8 is released to the outside. The heat radiated from the heat radiating portion 9 causes the heat emitted from the light-emitting element 3 to be radiated to the inner mounting surface to be released to the outside. As a result, the temperature rise of the light-emitting element 3 is suppressed. The heat radiating portion 9 may have any configuration that allows heat to be released to the outside. For example, the heat radiating portion 9 has at least one of a heat sink, a cooling fan, a Peltier element, a heat radiating plate, and a liquid cooling jacket. The heat transferred from the heat transport portion 8 is released to the outside by the components. In FIG. 1, for example, the heat radiating portion 9 has a heat sink 91. The heat sink 91 can discharge heat from the bottom surface of the heat transport portion 8 in the same direction (Y-axis) as the heat transport direction of the heat transport portion 8 . 201207312. The heat sink 91 can also be intersected with the heat transport portion 8. In the direction of the extension, it is possible to form the heat sink 91 as a whole. Further, a combination of the heat dissipation plate % and the cooling fan % as shown in Fig. 9 is also suitable. Fig. 9 is a side view of a lighting device according to an embodiment ι of the present invention. The heat radiating portion 9 has a heat radiating plate 92. The heat radiating plate 92 is in thermal contact with the heat transport portion 8 to receive the heat transferred from the reducing portion 8. The cooling fan% is directed to the heat sink 92 to make the heat sink 92 inside. [5 produces convection to promote heat dissipation. As a result, the heat radiating plate 92 can efficiently discharge heat. Of course, it is not the heat sink 92 but the heat sink 91 and the cooling fan % combination. When the Peltier element is used, a liquid-cooled sleeve is provided on the output side of the Wang Baier's element, and the heat that moves the Peltier element is also suitable for cooling. Thus, the heat radiating portion 9 has various members, whereby the heat radiating portion 9 can discharge the heat transferred from the heat transport portion 8 to the outside. As a result, the heat generated by the light-emitting element 3 can be released to the outside, and the temperature of the light-emitting element 3 can be raised. As a result of the suppression, the light source 3 can be supplied with higher electric power, and the illumination device can illuminate the light with high brightness. As described above, the illumination device of the first embodiment can discharge the heat generated on the light-emitting surface and the heat generated on the mounting surface of the heat generated by the light-emitting element 3 to the outside. As a result, higher power can be supplied to the light-emitting element 3, and the illumination device 1 can illuminate the light at the southern party. Such a lighting device 1 can use a low-power and highly operable light-emitting element such as an LED in the field of illumination in which a high-brightness light is required but a halogen lamp or a white-woven lamp is used because of a temperature problem or the like. 43 201207312 For example, the illuminating device 1 is suitably used for a concentrating light using a light-emitting element such as an LED, an engineering illuminating device, a street lamp, an in-tunnel illuminating device, a signal device, or a fish collecting lamp. (Embodiment 2) Next, Embodiment 2 will be described. In the second embodiment, an illumination device having a mounting portion that accommodates the thermal diffusion portion 7 and the thermal diffusion portion 7 in thermal contact with the thermal transfer portion 8 will be described. Fig. 10 is a side view of the lighting device according to Embodiment 2 of the present invention. Further, in Fig. 10, the sealing structure of the light-emitting element 3 is omitted in the illumination device 1. The sealing of the light-emitting element 3 is the same as that described with reference to Fig. 1 and the like. The mounting portion 10 houses the heat diffusion portion 7. Therefore, the mounting portion 1 has a recess 1〇, which accommodates the thermal diffusion portion 7. The thermal diffusion portion 7 is included in the mounting substrate 2 and the mounting substrate 2, or is laminated on the mounting substrate 2. However, the thermal diffusion portion may be laminated on the mounting substrate 2 as shown in Fig. 10 . Thus, when the thermal diffusion portion 7 is laminated on the mounting substrate 2, the thermal diffusion portion 7 is exposed to the outside. The mounting portion 10 houses the heat diffusion portion 7. The heat diffusion portion 7 is accommodated by the mounting portion 1 and the heat diffusion portion 7 is easily connected to the heat transfer portion 8. For example, the wearing portion 1 is provided with a recess in which the heat transfer portion 8 of the adjoining shape is accommodated. Thereby, the heat transport portion 8 can also be attached to the mounted recessed portion 1〇2 in advance. In the state in which the heat transport unit 8 is mounted, the attachment portion: the heat diffusion portion 7 is attached to the recess portion 1Q1, and the heat transfer heat diffusion portion 7 is easily connected by the wire portion 1G. At the time of this connection, as shown in Fig. 1A, when the overfeed 7 is in contact with the heat transport portion 8, the heat diffusion portion 7 and the heat transport portion 8 pass through. The 襄10's ampoule can achieve thermal contact. Alternatively, even in the case where the heat spread portion 7 and the heat transport portion 8 are separated inside the mounting portion ι, the heat diffusion portion 7 and the heat transport portion 8 can be brought into thermal contact via the mounting portion 1A. The result of this thermal contact is effective in transferring heat from the heat diffusion portion 7 to the heat transfer portion 8. Thus, the thermal diffusion portion 7 is mounted by the mounting portion 1 (and the heat transfer portion 8 is mounted), and the thermal diffusion portion 7 and the heat transfer portion 8 can be brought into thermal contact. The mounting portion 10 has, for example, at least one of a socket, a base, and a pressure plate that accommodate the heat diffusion portion 7. By having such a member and configuration, the mounting portion 1 can easily mount the heat diffusion portion 7. Further, as shown in Fig. 11, the mounting portion 10 may have a susceptor 1 〇 5 that supports the heat transfer portion 8 while supporting the heat diffusion portion 7. Fig. 1 is a side view of a lighting device according to a second embodiment of the present invention. The susceptor 1 〇 5 allows heat to be efficiently conducted from the thermal diffusion portion 7 to the heat transfer portion 8. This is because the thermal diffusion portion 7 and the heat transfer portion 8 are reliably brought into thermal contact by the susceptor 105. In the figure, unlike the case of Fig. 1A, the case where the mounting substrate 2 includes the thermal diffusion portion 7 is shown. The susceptor 1 〇 5 thermally contacts the thermal diffusion portion 7 and the heat transfer portion 8 while supporting the thermal diffusion portion 7. Thus, the mounting portion 10 makes the heat transfer from the heat diffusion portion 7 to the heat transfer portion 8 efficient. In the second embodiment, the device (4) lacks heat (four), and the heat transfer portion (four) installs and connects the stomach and the heat transfer of the light-emitting element 3 is made efficient. (Embodiment 3) In the third embodiment, the (four) (four) machine H will be described with respect to the illumination split described in the second embodiment. The illumination (4) includes the illumination device described in the second embodiment, and the power supply unit that supplies the illumination to the illumination device 1 and the illumination device can emit light according to 45 201207312. Such a lighting machine can be used for engineering lighting devices, on-channel lighting devices, street lamps, signal devices, and fishing lights. A case where the lighting device is used for the fish collecting lamp will be described with reference to Fig. 12 . Fig. 12 is a schematic view showing a state of use of the fishing light according to the third embodiment of the present invention. Fig. 12 shows a state in which the fish-carrying lamp 110 suspended from the ship 202 by using a wire or the like is irradiated to the sea 200. The fish finder lamp 110 includes the illuminating device 1 described in the first and second embodiments. The illuminating device 1 includes a heat diffusion portion 7 or the like for diffusing heat of the light-emitting element 3 on a mounting substrate on which a plurality of light-emitting elements 3 are mounted. As described in the second and second embodiments, the heat diffusion portion 7 and the like diffuse the heat generated by the light-emitting element 3, and then convey and discharge the heat. The fish finder lamp 110 accommodates the illuminating device 具有 having the above configuration inside the casing 111. Further, as shown in Fig. 12, it is also possible that the fishing lamp 11〇 is put into the sea 200, so that the casing π 1 needs to be subjected to waterproof processing. Further, the fish collecting lamp η has a power supply unit 112 that supplies necessary electric power to the lighting device 1 (i.e., the light-emitting element 3). In Fig. 12, the power supply unit 112 is provided on the outer side of the housing hi, but may be provided inside. Alternatively, electric power is supplied to the fishing light 11() by connecting the fishing light u〇 to the power supply unit provided on the ship 202 by the power supply line. The fish-fishing lamp 110 illuminates 2 inches in the sea or 2 inches in the sea. In Fig. 12, the enthalpy of the fish-collecting lamp 110 is placed in the sea 200, and the light emitted from the light-emitting element 3 is irradiated to the inside of the sea 2 as indicated by an arrow μ and an arrow Ν. This is because the fish light is placed in the sea 2 方式 in such a manner that the light-emitting element 3 faces the sea 200. Of course, it is also possible to fix the fishlight 11 by not charging the sea 200, so that the light-emitting element 3 is irradiated 46 201207312. The heat generated by ^ = % is diffused through the heat diffusion portion 7. The heat diffusion and :: are transported by the heat transfer portion 8 to a prescribed direction. As shown in Fig. 12, the portion 8 transmits heat to a direction away from the sea surface 2G1. This is caused by the heat transfer to the diffusion direction of the diffusion with the heat diffusion portion 7. Also: the heat is dissipated, and the heat sink is provided. Cooling fan, scattered: liquid cooling sleeve, ϊ 尔 帖 post component cage:, ^ special break and release. The released space system and the sea = reverse one: The heat released by the heat radiating portion 9 can be indirectly connected with the external gas, and the amount is more effectively placed. Of course, the root heat part 9 emits (four) can also be expected to "direct contact with the body or seawater contact. Or according to the structure of the value body lu, the interior of the sea is made to directly contact the seawater portion 9 or _ seawater, effectively releasing heat. π... When the fish lamp 110 is irradiated to the sea 2 (10) or the sea surface 2〇1, the heat of the light-emitting element 3 is discharged through the outside air far from the sea surface 201. That is, the money lamp 110 can discharge the heat of the light-emitting scale 3 to the opposite side to the light-emitting side. In particular, the external gas space away from the sea surface 2 01 is often at a lower temperature, and the heat dissipating portion 9 can effectively release heat. Therefore, the illuminating device can effectively discharge the heat of the illuminating element 3 to the outside air. As a result, The temperature rise of the light-emitting element 3 is suppressed, and the fish-carrying lamp 110 can illuminate light with high brightness. In particular, the 'fishing lamp 11' is based on the premise that it is used for a long time, and if the temperature of the light-emitting element 3 is too high, The brightness of the light-emitting element 3 has to be controlled. However, if the fish-collecting lamp 110 of the third embodiment is used, by using the 47 201207312 sea-side 200 as the irradiation side and the outside as the heat-dissipating side, it is possible to distinguish The temperature of the light-emitting element 3 rises. Of course, even if the fish-collecting lamp including the heat-dissipating portion 9 is put into the sea 200, the heat-dissipating portion 9 can release heat into the seawater of the sea 200, so that heat can be efficiently released. The same applies to the illumination device, the in-tunnel illumination device, the signal device, and the street lamp. (Embodiment 4) In the fourth embodiment, the simulation result of the heat dissipation effect of the illumination device described in Embodiment 1-3 will be described. A model was prepared for the comparative example and the example, and the temperature state of each part of the illumination device was calculated based on the assumption that the heat source light-emitting element was heated. (Comparative Example) As shown in Fig. 13, it is assumed that the comparative example is a heat diffusion having the mounted heat source 3〇1. The portion 302, the illuminating device 300 supporting the pedestal 3〇3 of the thermal diffusion unit 3〇2, and the heat transfer portion 304 extending from the pedestal 3〇3. Fig. 3 is a comparative example of the fourth embodiment of the present invention. Fig. 13(a) shows a state in which the illuminating device 300 is viewed obliquely from above, and Fig. 13(b) shows a state in which the illuminating device 300 is tilted from the lower side, as shown in Fig. 13(b). The illuminating device 300 has an inner surface 305. In such a simulation model, three temperature values of maximum value (ΜΑχ), average value (τγρ), and minimum value (ΜΙΝ) at the following positions are measured in a state where the heat source 301 is heated. . The measurement results are shown in Table 。. (1) Illumination device 3〇〇 Overall (2) Thermal diffusion portion 3〇2 surface 48 201207312 (3) Base 303 surface (4) Heat transfer portion 304 (5) Inside 305 [Table 1] Part Tmi „(K) T, View (κ) zlT(K) Rthth (K/W) Overall 293. 19 364. 91 71. 72 0. 36 FGHP surface 347. 17 364. 91 17. 75 0. 08 copper base (socket part) 340. 74 348. 04 2. 31 0. 01 Heat pipe 341. 86 346. 70 4. 84 0. 02 Cover 293. 19 343. 41 50. 22 0. 25 (Embodiment) On the other hand, as shown in Fig. 14, the embodiment is assumed to be a heat diffusion portion 302 having a mounted heat source 301, a susceptor 303 supporting the heat diffusion portion 302, and heat extending from the susceptor 3? The conveying unit 304 and the lighting device 310 of the heat radiating portion 306. Fig. 14 is a schematic view showing a model of a lighting device corresponding to the embodiment of the fourth embodiment of the present invention. In Fig. 14, in order to clarify the embodiment, the heat radiating portion 306 is provided, and the state in which the lighting device 310 is viewed obliquely from below is displayed. In the example shown in Fig. 14, similarly to the comparative example, three temperature values of the maximum value (MAX), the average value (TYP), and the minimum value (MIN) at the following positions were measured. The measurement results are shown in Table 2. (1) Overall illuminating device 300 (2) Surface of thermal diffusing portion 302 (3) Surface of pedestal 3 〇 3 (4) Heat transfer portion 304 (5) Heat radiating portion 306 49 201207312 [Table 2] Part Tmin(K) τ_( κ) Ζ1Τ(Κ) Rlhth(K7W) Overall 293. 06 327. 15 34. 09 0. 17 FGHP surface 309. 46 327. 15 17. 69 0. 08 copper base (socket part) 308. 02 310. 20 2. 18 0. 01 Heat pipe 301. 83 308. 76 6. 84 0. 03 heat sink 296. 46 301. 94 5. 48 0. 04 Here, comparing Table 1 and Table 2, it is understood that the temperature rise by the heat source 301 can be suppressed more than the comparative example. In particular, it is understood that the temperature rise is suppressed by the heat radiating portion 306. As described above, it is understood that the temperature rise can be suppressed, whereby the heat generation of the light-emitting element of the illumination device in the embodiment 1-3 can be suppressed. As a result, it is possible to give the illuminating element a higher electric power. Thereby the illumination device can illuminate the light with high brightness. As described above, the lighting device and the lighting device described in the first to fourth embodiments are illustrative of the gist of the present invention, and modifications and modifications are also included without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a lighting device according to Embodiment 1 of the present invention. Fig. 2 is a front view of the lighting device according to Embodiment 1 of the present invention. Fig. 3 is a side view of the lighting device according to Embodiment 1 of the present invention. Fig. 4 is a side view of the lighting device according to Embodiment 1 of the present invention. Fig. 5 is a side elevational view showing a part of the lighting device according to Embodiment 1 of the present invention. Fig. 6 is a front view of the lighting device according to Embodiment 1 of the present invention. Fig. 7 is a side elevational view of the thermal diffusion portion according to Embodiment 1 of the present invention 50 201207312. Fig. 8 is a front elevational view showing the inside of a heat diffusion portion according to Embodiment 1 of the present invention. Fig. 9 is a side view of the lighting device according to Embodiment 1 of the present invention. Fig. 10 is a side view of the lighting device according to Embodiment 2 of the present invention. Fig. 11 is a side view of the lighting device according to Embodiment 2 of the present invention. Fig. 12 is a schematic view showing a manner of use of the fishing light according to the third embodiment of the present invention. Fig. 13 is a schematic view showing a lighting device model corresponding to a comparative example of the fourth embodiment of the present invention. Fig. 14 is a schematic view showing a lighting device model corresponding to the embodiment of the fourth embodiment of the present invention. [Main component symbol description] 1. . . Lighting device . . Heat conduction component 2. . . Mounting substrate 71. . . Upper plate 3. . . Hair and light components 72. . . Lower plate 4. . . Sealing hoop 73. . . Intermediate board 5. . . Sealing member 74. . . Grooving section 6. . . Lens plate 75. . . Steam diffusion path 7. . . Thermal diffusion unit 76. . . Internal through hole 8. . . Heat transfer unit 77. . . Capillary flow path 9. . . Heat sink 78. . . Concave 10. . . Installation section 79. . . Interior space 40. . . Heat sink 91. . . Heat sink 51 201207312 92. . . Heat sink 202. . 93. . . Cooling fan 300. . 101, 102. . . Concave 301. . 105. . . Base 302. · 110. . . Fish light 303·. 111. . . Housing 304. . 112... Power Supply Department 305. . 200. . . The sea 306. _ 201. . . Ship lighting equipment on the sea surface . Installed heat source . Thermal diffusion part. Pedestal . Heat transfer department . Inside . Heat sink 52