TW201146155A - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TW201146155A
TW201146155A TW99119575A TW99119575A TW201146155A TW 201146155 A TW201146155 A TW 201146155A TW 99119575 A TW99119575 A TW 99119575A TW 99119575 A TW99119575 A TW 99119575A TW 201146155 A TW201146155 A TW 201146155A
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Taiwan
Prior art keywords
heat dissipation
dissipation module
dust
zone
heat
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TW99119575A
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Chinese (zh)
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TWI404494B (en
Inventor
Cheng-Pang Wang
Yi-Tung Chiang
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Acer Inc
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Publication of TWI404494B publication Critical patent/TWI404494B/en

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Abstract

A heat dissipation module is mounted in a housing. The heat dissipation module includes a fan cover, a fan and a heat dissipation fin set, and a dust-disposal device. The fan cover has an air inlet area, an air outlet area and an air conducting area between the air inlet area and the air outlet area. The air conducting area has a main channel and a secondary channel located between the fan cover and the housing. The fan is disposed in the air inlet area, and the heat-dissipation fin set is disposed in the air outlet area. In addition, the dust-disposal device is disposed at the secondary channel for cleaning the dust away from the fan cover.

Description

201146155 Λ ir iNrti-ινχι-υ 176-TWXX 33197twf.doc/l 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種散熱模組,且特別是有關於一種 具有除塵功能的散熱模組。 【先前技術】 近年來隨著電腦科技的突飛猛進,使得電腦之運作速 ' * · 度不bff地提向,並且電腦内部之電子元件的發熱功率亦不 斷地攀升,為了預防電腦内部的電子元件過熱,而導致電 子元件發生暫時性或永久性的失效,必須提供足夠的散熱 效能予電腦内部的電子元件。 一般而言’散熱模組主要由風扇(fan)、散熱鰭片組 (cooling fins)及熱管(heat pipe)所組成。散熱鰭片組 配置在風罩的出風口,並與熱管連接,用以吸收由熱管所 傳導的廢熱。散熱鰭片組由多數個平行排列的金屬片所組 成,而相鄰之金屬片之間具有一定的間隙,提供廢熱經由 對流的方式散逸到空氣中。因此,當風扇處於運作狀態下, 冷卻氣流可經由風罩的出風口流向散熱鰭片組,並通過金 屬片之間的間隙,以將廢熱經對流而排出機體之外,進而 降低内部電子元件的工作溫度。 值得注意的是,當散熱器經過長時間使用之後,空氣 中的灰塵會漸漸地堆積在散熱鰭片組及風罩内。若不清理 的話,一旦過多的灰塵累積在散熱鰭片組或風罩内,容易 造成氣流不易將廢熱自散熱鰭片組移除,導致散熱模組的201146155 Λ ir iNrti-ινχι-υ 176-TWXX 33197twf.doc/l VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having a dust removal function group. [Prior Art] In recent years, with the rapid advancement of computer technology, the speed of computer operation has been improved, and the heating power of electronic components inside the computer has been continuously rising, in order to prevent overheating of electronic components inside the computer. In order to cause temporary or permanent failure of electronic components, sufficient heat dissipation performance must be provided to the electronic components inside the computer. Generally speaking, the heat dissipation module is mainly composed of a fan, a cooling fins and a heat pipe. The fin assembly is disposed at the air outlet of the hood and is connected to the heat pipe to absorb waste heat conducted by the heat pipe. The heat sink fin group is composed of a plurality of metal sheets arranged in parallel, and a gap is provided between adjacent metal sheets to provide waste heat to escape into the air via convection. Therefore, when the fan is in operation, the cooling airflow can flow to the heat dissipation fin group through the air outlet of the wind hood, and pass through the gap between the metal sheets to discharge the waste heat out of the body by convection, thereby reducing the internal electronic components. Operating temperature. It is worth noting that when the heat sink is used for a long time, the dust in the air will gradually accumulate in the heat sink fin set and the windshield. If it is not cleaned, if too much dust accumulates in the heat sink fin group or the windshield, it is easy to cause airflow to remove the waste heat from the heat sink fin group, resulting in the heat dissipation module.

201146155 riNm-ivii-0176-TWXX 33197twf.doc/I 散熱能力大幅地降低 【發明内容】 本發明提供-種散熱模組,以避免灰塵累積在 片組上或風罩内。 狀…、鳍 本發明提出-種散熱模組,組裝於一殼體内,散 組包括-風罩、-風扇、—散熱則組以及—除麈裝置。、 =具Ϊ一入風區、一出風區以及位於入風區與出風區 之間的-導流區’導流區財—主通道以及—位於 殼體之間的次通道。風扇配置於人風區。散滅片^ 於出風區。除塵裝置配置於次通道。 ’—置 在本發明之一實施例中,上述風罩的底面具有一開η 以及-導流板’位於導流區的下方,而次通道的:端:: 開口’且導流板沿著風罩的底面延伸且 間,以形成找道。 尋與设體之 ^本發明之-實_巾,上料频於開卩 應具有一斜面以及連接斜面的一水平面。 乃對 於風或組裝 在本發明之-實施例中,上述除塵裝置包括 裝置,以供電給導流板,並使導流板上帶有靜電。 在本發明之一實施例中,上述除塵裝置包括 可调 在本發明之-實關中,上述除塵裝置包括除塵渡網。 201146155201146155 riNm-ivii-0176-TWXX 33197twf.doc/I The heat dissipation capability is greatly reduced. SUMMARY OF THE INVENTION The present invention provides a heat dissipation module to prevent dust from accumulating on a sheet set or in a hood. The present invention proposes a heat dissipating module which is assembled in a casing, and the air stack includes a windshield, a fan, a heat dissipating group and a deburring device. = There is an ingress zone, an outwind zone, and a diversion zone between the inflow zone and the outflow zone. The diversion zone is the main channel and the secondary channel is located between the casings. The fan is placed in the crowded area. Dispel the film ^ in the wind zone. The dust removal device is disposed in the secondary channel. In an embodiment of the invention, the bottom surface of the hood has an opening η and a baffle is located below the flow guiding zone, and the end of the secondary channel: an opening: and the deflector is along The bottom surface of the windshield extends and is spaced to form a seek. The present invention is a solid-skin, which has a bevel and a horizontal plane connecting the bevels. For wind or assembly In an embodiment of the invention, the dust removal device comprises means for supplying power to the baffle and for causing static electricity on the baffle. In an embodiment of the invention, the dust removing device comprises an adjustable dust-collecting device comprising a dust removing network. 201146155

„ 176-TWXX 33197twf.doc/I 在本發明之一實施例中,上述除塵裝置包括除塵袋。 在本發明之一實施例中,上述除塵裝置包括靜電除塵 席丨J ° 在本發明之一實施例中,上述散熱模組更包括一熱管 以及政熱片,熱管的一端連接散熱鰭片組,而另一端連 接散熱片。 基於上述,本發明的散熱模組於風罩的導流區設有次 通道,可將未到達散熱鰭片組的冷卻氣流中夹帶的灰塵經 由次通道排出於風罩之外。因此,可減少灰塵累積於散熱 鰭片組或風罩内,以提高散熱模組的散熱效能。 為讓本發明之上述特徵和優點能更明顯易懂,下文特 舉實施例’並配合所附圖式作詳細說明如下。 【實施方式】 圖1為本發明一實施例之散熱模組的示意圖。圖2A 及圖2B為本發明二實施例之散熱模組沿著圖】之A_A線 的剖面示意圖。 請參考圖1、圖2A及圖2B,散熱模組1〇包括一風罩 1〇〇、一風扇110、一散熱鰭片組120以及一除塵裝置130。 風罩100内具有一入風區1〇2、一出風區1〇4以及位於入 風區102與出風區1〇4之間的一導流區1〇6。風扇ι10配 置於入風區102 ’而散熱鰭片組12〇配置於出風區1〇4。此 外’散熱模組10還可包括一熱管140以及一散熱片150, 其中熱管140的一端連接散熱鰭片組no,而另一端連接176-TWXX 33197 twf.doc/I In one embodiment of the invention, the dust removing device comprises a dust bag. In one embodiment of the invention, the dust removing device comprises an electrostatic dusting seat J ° in one of the embodiments of the invention In the example, the heat dissipation module further includes a heat pipe and a heat management piece, one end of the heat pipe is connected to the heat dissipation fin set, and the other end is connected to the heat sink. Based on the above, the heat dissipation module of the present invention is disposed in the flow guiding area of the wind cover. The secondary channel can discharge dust entrained in the cooling airflow that does not reach the heat dissipation fin group to the outside of the air hood through the secondary channel. Therefore, dust can be accumulated in the heat dissipation fin group or the air hood to improve the heat dissipation module. In order to make the above features and advantages of the present invention more comprehensible, the following detailed description of the embodiments will be described in detail below with reference to the accompanying drawings. FIG. 2A and 2B are cross-sectional views of the heat dissipation module of the second embodiment of the present invention taken along line A_A of the drawing. Referring to FIG. 1, FIG. 2A and FIG. 2B, the heat dissipation module 1 includes a wind. Cover 1〇〇 a fan 110, a heat sink fin set 120 and a dust removing device 130. The windshield 100 has an air inlet area 1-2, an air outlet area 〇4, and an air inlet area 102 and an air outlet area 1-4. A heat conduction zone 140 is disposed between the air inlet area 102' and the heat dissipation fin group 12' is disposed in the air outlet area 1〇4. Further, the heat dissipation module 10 may further include a heat pipe 140 and a The heat sink 150, wherein one end of the heat pipe 140 is connected to the heat dissipation fin group no, and the other end is connected

201146155 »J-0176-TWXX 33197twf.doc/I 散熱片150。散熱片15〇可直接貼附在一電子元件(未繪 示)上,例如是中央處理器或高功率晶片,並且散熱片^曰〇 可將電子元件内的廢熱經由熱管140傳導至散熱鰭片組 120。當風扇11〇被驅動而處於運作狀態時,冷卻氣流f 可經由風罩1〇〇的入風區1〇2流向位於出風區1〇4的散熱 鰭片組120,並通過散熱鰭片組12〇之間的間隙,以將^ 熱經對流而排出殼體2〇的出風口 22之外,進而降低殘^ 内部的電子元件的工作溫度。 ^ 值付’主思的是,導流區106位於入風區1〇2與出風區 104之間,且導流區I%具有一主通道1〇如,用以引導大 部分的冷卻氣流打由入風區102流向出風區1〇4。此外, 導流區106還具有一次通道i〇6b,位於風罩1〇〇與殼體2〇 (下设體)之間,可將另一冷卻氣流F2中夾帶的灰塵D 排出於風罩1〇〇之外’因此次通道1〇6b亦可稱為除塵通道。 凊參考圖2A及圖2B,在本實施例中,風罩1〇〇的底 面可具有一開口 112以及一導流板114,位於導流區 106的下方。次通道1〇6b的一端連接開口 112,且導流板 114 /σ著風罩100的底面108延伸且位於風罩1〇〇與殼體 20,間,以形成次通道1〇6b。導流板114的材質可為絕緣 塑膠、金屬或其組合’且導流板114可一體成形於風罩1〇〇 的底面108或以鎖固或焊接的方式固定於風罩1〇〇的底面 108。舉例而言,導流板114於開口 112的下方對應具有一 斜面114a以及連接斜面U4a的一水平面U4b。對此,本 發明不加以限制。導流板H4的功能除了引導氣流移動的 201146155201146155 »J-0176-TWXX 33197twf.doc/I Heat sink 150. The heat sink 15 can be directly attached to an electronic component (not shown), such as a central processing unit or a high power chip, and the heat sink can conduct waste heat in the electronic component to the heat sink fin via the heat pipe 140. Group 120. When the fan 11 is driven to be in operation, the cooling airflow f can flow through the air inlet region 1〇2 of the hood 1〇〇 to the heat dissipation fin group 120 located in the air outlet region 1〇4, and passes through the heat dissipation fin group. The gap between the 12 turns is to convect the heat out of the air outlet 22 of the casing 2, thereby reducing the operating temperature of the electronic components inside the residual. ^ The value of the main thinking is that the diversion zone 106 is located between the inlet zone 1〇2 and the outlet zone 104, and the diversion zone I% has a main channel 1, for example, to guide most of the cooling airflow. It is flowed from the inlet zone 102 to the outlet zone 1〇4. In addition, the flow guiding area 106 further has a primary passage i 〇 6b between the hood 1 〇〇 and the casing 2 下 (lower body), and the dust D entrained in the other cooling airflow F2 can be discharged to the hood 1 Outside the ' 'Therefore the secondary channel 1 〇 6b can also be called a dust removal channel. Referring to Figures 2A and 2B, in the present embodiment, the bottom surface of the hood 1b may have an opening 112 and a baffle 114 located below the flow guiding zone 106. One end of the secondary passage 1〇6b is connected to the opening 112, and the bottom surface 108 of the deflector 114/σ windshield 100 extends and is located between the hood 1〇〇 and the casing 20 to form the secondary passage 1〇6b. The baffle 114 may be made of insulating plastic, metal or a combination thereof. The baffle 114 may be integrally formed on the bottom surface 108 of the hood 1 or fixed to the bottom surface of the hood 1 by locking or welding. 108. For example, the baffle 114 has a slope 114a and a horizontal plane U4b connecting the slope U4a below the opening 112. In this regard, the invention is not limited. The function of the deflector H4 is in addition to guiding the movement of the airflow 201146155

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33197twf.d〇c/I 方向之外,還能帶電荷,以吸引帶電荷的灰塵D往導流板 114移動。 請參考圖2A,除塵裝置130a可配置於導流板114的 外側,例如是靜電產生裝置或電壓可調式靜電產生裳置, 其可供電給導流板114,以使導流板114.上帶有靜電,並 可視環境中灰塵量的多募,調整供電的電壓,以決定導流 板114上的靜電量。此外,請參考圖2B,除塵裝置13% 也可直接崾置於次通道l〇6b内,以吸附的方式來清除灰塵 D。除塵裝置130b例如是除塵濾網、除塵袋或是靜電除塵 刷等。對此,本發明不加以限制。 承上所述,當冷卻氣流F通過導流區1〇6時,夾帶的 灰塵D受到重力的牽引會逐漸往下墜落,以使部分的灰塵 D經由次通道l〇6b而吸附在除塵濾網、除塵袋或是靜電除 塵刷,而除塵濾網、除塵袋或是靜電除塵刷可以手動的方 式定期移除,以保持清潔。或是,讓夾帶的灰塵D帶有負 電荷,並於通過導流區106時受到導流板114上的正電荷 (靜電)的吸引而往下墜落,以吸附在導流板114上。當 靜電產生裝置關閉電源,以使導流板114上的靜電消失 時,導流板114上的灰塵不再附著而可經由氣流F2帶走 而排出於風罩1GG之外。因此,本發明可減少灰塵D累積 在散熱則組120上或風罩丨⑻内,以提高散熱模組1〇 的散熱效能。 紅上所述,本發明的散熱模組於風罩的導流區設有次 通道,可將未到達散熱鰭片組的冷卻氣流中夾帶的灰塵經In addition to the 33197twf.d〇c/I direction, it is also chargeable to attract charged dust D to the deflector 114. Referring to FIG. 2A, the dust removing device 130a may be disposed outside the deflector 114, such as an electrostatic generating device or a voltage-adjustable static generating device, which can supply power to the deflector 114 to bring the deflector 114. There is static electricity, and depending on the amount of dust in the environment, the voltage of the power supply is adjusted to determine the amount of static electricity on the deflector 114. In addition, referring to FIG. 2B, the dust removing device 13% can also be directly placed in the secondary channel l〇6b to remove the dust D by adsorption. The dust removing device 130b is, for example, a dust removing filter, a dust removing bag, or an electrostatic dust removing brush. In this regard, the invention is not limited. As described above, when the cooling airflow F passes through the diversion zone 1〇6, the entrained dust D is gradually pulled down by gravity, so that part of the dust D is adsorbed on the dust filter through the sub-channel l〇6b. Dust bags or electrostatic dust removers, while dust filters, dust bags or electrostatic dust brushes can be removed manually in a manual manner to keep them clean. Alternatively, the entrained dust D is negatively charged and falls downward by the positive electric charge (electrostatic) on the deflector 114 when passing through the flow guiding area 106 to be adsorbed on the deflector 114. When the static electricity generating means turns off the power supply so that the static electricity on the deflector 114 disappears, the dust on the deflector 114 is no longer attached and can be carried away by the air flow F2 to be discharged outside the hood 1GG. Therefore, the present invention can reduce the accumulation of dust D on the heat dissipation group 120 or the hood (8) to improve the heat dissipation performance of the heat dissipation module 1〇. As described above, the heat dissipation module of the present invention is provided with a secondary passage in the flow guiding area of the hood to collect dust from the cooling airflow that does not reach the heat dissipation fin group.

201146155 iJI-0176-TWXX 33197twf.doc/I 由次通道排出於風罩之外。因此,可減少灰塵累積於散熱 鰭片組或風罩内,以提高散熱模組的散熱效能。 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明’任何所屬技術領域中具有通常知識者,在不脫離 本發明之精神和範圍内,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單説明】. 圖1為本發明一實施例之散熱模組的示意圖。 圖2A及圖2B為本發明二實施例之散熱模組沿著圖 之A-A線的剖面示意圖。 【主要元件符號說明】 10 : 散熱模組 20 : 殼體 22 : 出風口 100 =風罩 102 • 風區 104 :出風區 106 :導流區 106a :主通道 106b :次通道 108 :底面 110 :風扇 201146155201146155 iJI-0176-TWXX 33197twf.doc/I is discharged from the hood by the secondary channel. Therefore, dust accumulation in the heat dissipation fin group or the hood can be reduced to improve the heat dissipation performance of the heat dissipation module. The present invention has been disclosed in the above embodiments, and it is not intended to limit the invention to those skilled in the art, and it is possible to make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a heat dissipation module according to an embodiment of the present invention. 2A and 2B are cross-sectional views of the heat dissipation module of the second embodiment of the present invention taken along line A-A of the drawing. [Main component symbol description] 10 : Thermal module 20 : Housing 22 : Air outlet 100 = Windshield 102 • Wind zone 104 : Outlet zone 106 : Diversion zone 106a : Main channel 106b : Secondary channel 108 : Bottom 110 : Fan, 201146155

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33197twf.doc/I 112 :開口 114 :導流板 114a :斜面 114b ··水平面 120 :散熱鰭片組 130 ··除塵款置 130a :除塵裝置 130b :除塵裝置 140 :熱管 150 :散熱片 F:冷卻氣流 F1 :冷卻氣流 F2 :冷卻氣流 D :灰塵33197twf.doc/I 112 : Opening 114 : deflector 114a : inclined surface 114b · · horizontal plane 120 : heat dissipation fin set 130 · dust removal section 130a : dust removal device 130b : dust removal device 140 : heat pipe 150 : heat sink F : cooling Airflow F1: Cooling airflow F2: Cooling airflow D: Dust

Claims (2)

201146155 r ι>^-ιυιΙ-0 176-TWXX 33197twf.doc/I 七、申請專利範圍: I 一種散熱模組,組裝於一殼體内,該散熱模組包括: 一風罩’該風罩内具有一入風區、一出風區以及位於 5亥入風區與該出風區之間的一導流區,該導流區具有一主 通道以及一位於該風罩埤該殼體之間的次通道; 一風扇,配置於該入風區;201146155 r ι>^-ιυιΙ-0 176-TWXX 33197twf.doc/I VII. Patent application scope: I A heat dissipation module assembled in a casing, the heat dissipation module comprising: a windshield 'in the hood Having an air inlet zone, an air outlet zone, and a flow guiding zone between the 5 ing wind inlet zone and the wind venting zone, the flow guiding zone has a main channel and a hood between the casing Secondary channel; a fan disposed in the air inlet zone; 一散熱鰭片組’配置於該出風區;以及 一除塵裝置’配置於該次通道。 2.如申請專利範圍第1項所述之散熱模組,其中該風 罩的底面具有一開口以及一導流板,位於該導流區的下 方’而該次通道的-端連接該開口,且該導流板沿著該風 罩的底面延伸錄於觀罩與職體之間,以形成該次通 道。 3.如申請專利範圍第2項所述之散熱模組,其中該導 j於該開口的下㈣應具有—斜面以及連接該斜面的一 水平面。 、必板4· 範圍第2項所述之散熱模組’其中該導 机板-體成械崎於觀罩的底面。 塵裝置靜圍第1項所述之散熱模組,其中該除 流板上帶有靜電。H以供電給該導流板,並使該導 塵褒6置5項所&散熱模組’其中雜 衣置包括電討調式靜電產生裝置。 7.如申請專利軸1項所述之散熱模組,其中制 11 201146155A heat sink fin group is disposed in the air outlet region; and a dust removing device is disposed in the secondary channel. 2. The heat dissipation module of claim 1, wherein the bottom surface of the hood has an opening and a deflector located below the flow guiding zone and the end of the secondary channel is connected to the opening. And the baffle extends along the bottom surface of the hood to be recorded between the cover and the body to form the secondary passage. 3. The heat dissipation module of claim 2, wherein the guide (b) of the opening has a bevel and a horizontal plane connecting the bevel. The heat dissipation module of the second aspect of the invention, wherein the conductor plate is formed on the bottom surface of the cover. The dust device is a heat dissipation module according to the above item 1, wherein the current removal plate is provided with static electricity. H supplies power to the baffle, and the dust damper 6 is placed in the 5 & heat dissipation module' wherein the hoisting device includes an electrically-regulated static electricity generating device. 7. For example, the heat dissipation module described in claim 1 of the patent axis, wherein the system 11 201146155 176-TWXX 33197twf.doc/I 塵裝置包括除塵濾網。 8. 如申請專利範圍第1項所述之散熱模組,其中該除 塵裝置包括除塵袋。 9. 如申請專利範圍第1項所述之散熱模組,其中該除 塵裝置包括靜電除塵刷。 10. 如申請專利範圍第1項所述之散熱模組,更包括 一熱管以及一散熱片,該熱管的一端連接該散熱鰭片組, 而另一端連接該散熱片。176-TWXX 33197twf.doc/I The dust device includes a dust filter. 8. The heat dissipation module of claim 1, wherein the dust removal device comprises a dust bag. 9. The heat dissipation module of claim 1, wherein the dust removal device comprises an electrostatic dust removal brush. 10. The heat dissipation module of claim 1, further comprising a heat pipe and a heat sink, one end of the heat pipe being connected to the heat dissipation fin set and the other end being connected to the heat sink.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8934243B2 (en) * 2011-07-25 2015-01-13 Panasonic Intellectual Property Management Co., Ltd. Electronic device
TWI776662B (en) * 2021-09-01 2022-09-01 奇鋐科技股份有限公司 Centrifugal fan noise-lowering structure

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TWI651039B (en) * 2017-08-17 2019-02-11 仁寶電腦工業股份有限公司 Heat dissipation module and electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM244718U (en) * 2003-08-22 2004-09-21 Hon Hai Prec Ind Co Ltd Heat dissipating device employing air duct
TW200823637A (en) * 2006-11-23 2008-06-01 Inventec Corp Heat-dissipation device having dust-disposal mechanism
TWM322012U (en) * 2007-04-11 2007-11-11 Aopen Inc Personal computer with clapboard
TWI338830B (en) * 2008-01-11 2011-03-11 Wistron Corp Heat-dissipating module having a dust-removing mechanism and assembly of an electronic device and the heat-dissipating module
TWM350977U (en) * 2008-10-01 2009-02-11 Inventec Corp Fan device capable of electrostatic dust removal
TWM360552U (en) * 2009-03-13 2009-07-01 Giga Byte Tech Co Ltd Heat sink with circumlocutory air channel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8934243B2 (en) * 2011-07-25 2015-01-13 Panasonic Intellectual Property Management Co., Ltd. Electronic device
TWI776662B (en) * 2021-09-01 2022-09-01 奇鋐科技股份有限公司 Centrifugal fan noise-lowering structure

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