201145728 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種接觸接腳支架，其固持用以將一電子 裝置（諸如-處理器、記憶體或其他半導體積體電路）之端 子電連接至一電路板之接觸接腳。 【先前技術】 近年來，已利用各種電子裝置。-電子裝置大體上包 括：複數個信號端子，其等用於自操作該電子裝置之—電 路板接收各錢型電路或將自料子裝置輸出之信號發送 至該電路板—電力供應端子，其將電力供應至該電子裝 置；及-接地端子。端子間之節距因該電子裝置而不同。 因此，為將用於操作一電子裝置之—電路板（例如一電子 裝置檢驗板）用以操作具有端子間之不同節距的複數種類 型之電子裝置，利用-電子裝置接觸接腳支架，其具有經 配置以匹配端子間之節距的複數個接觸接腳以電連接一電 子裝置之端子與該電路板之對應端子。 例如，專利文獻1揭示一端子節距轉換板。此外，專利 文獻1描述「端子節距轉換板係設置在一板體丨之一中心部 分處’該板體1具有與個別端子接腳2a連接以便匹配一預 燒插座2之端子接腳2a之部分的複數個插座端子插孔3，其 中一 BGA封裝已***塞並設置在該板體丨之一周邊處（該板 體1具有與端子連接孔4a連接以便匹配設置在印刷電路板4 中之該等端子連接孔4a之部分的複數個連接接腳5)且藉此 實現該預燒插座2與具有互不相同端子節距之印刷電路板4 153615.doc 201145728 之間之端子連接」。 此外，專利文獻2描述（關於插座）「亦可自前電極22之 配置之節距放大背電極23之配置之節距」》 此外，專利文獻3中所揭示之1(：插座具有「_下托架 11、一上托架20、一調整托架3〇、一蓋罩4〇、一下各向異 性導電片50、一墊節距轉換板6〇及一上各向異性導電片 70」。此外，專利文獻3描述「墊節距轉換板6〇包含在其頂 面上配置成一格子圖案之半導體裝置側墊81及類似物及在 其底面上配置成一格子圖案（轉換為約為半導體裝置側墊 之間之節距兩倍的一節距）之母板裝置側墊。以節距墊轉 換板60之母板側墊之節距配置母板之墊」。 [PTL 1]日本專利公開案（八）第11 67396號 [PTL 2]日本專利公開案（A)第2〇〇〇 82553號 [PTL 3]日本專利公開案（A)第2〇〇7·8〇592號 【發明内容】 近年來，由電子裝置使用之信號頻率隨著電子裝置之處 理速度的加快而變高。根據裝置而使用頻率高於十億赫兹 (GHz)之信號。因此，回應於信號之更高頻率，亦已追求 自接觸接腳支架傳輸高頻率信號之能力。 因此本發明提供一種接觸接腳支架，其將具有不同於 電路板之端子節距之—端子節距的_電子裝置之端子連接 至電路板之對應端子並能夠傳輸高頻率信號。 根據本發明之—態樣，提供—種接觸接腳支架。此接觸 接腳支架包含基板，其具有形成於該基板之—第一表 153615.doc 201145728 面上之複數個第-子L及形成於該基板之一第二表面上之複 數個第二孔；複數個第一接觸接腳，該等第一接觸接腳之 各者***至該等第一孔之任一者中丨複數個第二接觸接 腳，該等第二接觸接腳之各者***至該等第二孔之任一者 中，及連接構件，其佈置在該基板中且將該等第一接觸 接腳之至少一者電連接至該等第二接觸接腳之至少一者且 具有匹配兩個電連接接觸接腳之阻抗的一阻抗。 根據本發明，可提供一種接觸接腳支架，其連接具有不 同於電路板之端子間之節距之一端子節距的一電子裝置之 端子與電路板之對應端子並能夠傳輸高頻率信號。 【實施方式】 以下將參考圖式而解釋根據本發明之若干實施例之一接 觸接腳支架。此接觸接腳支架包含：一基板；一第一群組 複數個接觸接腳，其等設置在將附接電子裝置之基板側之 表面上，及一第二群組複數個接觸接腳，其等設置在操作 電子裝置之電路板之基板侧之表面上。此外，即使電子裝 置之端子節距及端子配置不同於電路板之端子節距及端子 配置，該第一群組接觸接腳之節距及配置亦不同於該第二 群組接觸接腳之節距及配置，使得電子裝置之端子可電連 接至電路板之對應端子。藉由佈置在該基板中之一連接構 件而將包含在該第一群組中之接觸接腳電連接至包含在該 第一群組中之對應接觸接腳。此外，此連接構件具有（例 如）一帶狀線結構，藉由該帶狀線結構而使在該第一群組 接觸接腳中發送信號之信號接腳之阻抗與該第二群組接觸 153615.doc 201145728 接腳中之對應接觸接腳之阻抗匹配。由此，此接觸接腳支 架減少附接至該接觸接腳支架之電子裝置與電路板之間之 高頻率信號之傳輸損耗。 圖1係展示根據本發明之一第一實施例之一導引型接觸 接腳支架100的一透視圖。圖2係展示沿圖該導引 4接觸接腳支架1〇〇之一橫截面的一視圖。該導引型接觸 接腳支架1〇0具有一接觸接腳支架1及一導引體8,該導引 體8設置在該接觸接腳支架丨之周邊處並支撐該接觸接腳支 架1該接觸接腳支架1具有：一基板2;複數個接觸接腳 4其等为別***至形成於該基板2之一頂面2a上的複數個 孔中；複數個接觸接腳6，其等分別***至形成於該基板2 之底面2b上的複數個孔中；及一連接構件7，其用於電 連接接觸接腳4與對應接觸接腳6。該導引體8具有在該基 板上之一預定位置處用於配置一電子裝置（圖中未展示）之 導引部分或導引壁8 1，並具有在操作電子裝置之一系統 (例如用於檢驗電子裝置之一檢驗系統（圖中未展示））之電 路板之一預定位置處用於定位該接觸接腳支架丨之一定位 部分（在本實施例中為圖2中所示之定位銷82)。應注意，根 據需要而將該導引體8安裝至該接觸接腳支架〗。此外，該 基板2可具有與實施定位之該定位部分一起使用之一孔或 凹口。 此外，為將電子裝置安裝至相對於接觸接腳支架丨之一 準確位置，可使用經設置而與接觸接腳支架1隔開之一定 位裝置。在此情況中，省略導引體8。 153615.doc 201145728 圖3展示基板2之一平面圖，而圖4展示基板2之一仰視 圖此外，圖5係展示連接構件7之結構的基板2之一平面 透明圖。圖6係展示沿圖5之H-II之基板2之一側向橫截面 的視圖。此外，圖7係展示沿圖5之Ιπ·ιπ之基板2之一側 向橫截面的一視圖。 如圖3中所不，基板2之頂面2a具有配置成沿縱向方向各 八有相等間隔之八個接腳之兩列的複數個接觸接腳4，以 便刀別電連接至附接至接觸接腳支架丨之一電子裝置之端 另方面，如圖4中所示，基板2之底面2b具有配置成 沿縱向方向各具有四個接腳及沿橫向方向各具有四個接腳 之一陣列的複數個接觸接腳6，以便分別電連接至附接接 觸接腳支架1之電路板之端子。 此外，沿橫向方向相鄰之接觸接腳6之間之節距窄於沿 橫向方向相鄰之接觸接腳4之間之節距。應注意，沿縱向 方向相鄰之接觸接腳4之間之節距亦可不同於沿縱向方向 相鄰之接觸接腳6之間之節距。 U此方式，接觸接腳4之節距及配置不同於接觸接腳6之 節距及配置。此外’如圖5中所示，藉由連接構件7而將接 觸接腳4電連接至接觸接腳6中之對應接觸接腳。因此，接 觸接腳支架!可將具有不同於電路板之端子之節距及配置 之鸲子之一 g纟距及配置的一電子裝置之端子電連接至電路 板之對應端子。 如圖6及圖7中所示，基板2具有佈置（較佳地嵌入）在由 一玻璃環氧樹脂或其他介電材料組成之一基底材料21上之 153615.doc •9- 201145728 至少-（所繪不實例中為兩個）片狀電介質22、23，各片狀 電介質具有形成於其兩側上之—鋼或其他導電層。即，在 基板2中，該基純料21具有依如下順㈣置在立上之一 導電層、-片狀電介質及另一導電層。由此，各片狀介電 質與在該片狀介電質兩側上之導電層_起工作以形成一電 容器。此外，各片狀電介質22、23之介電常數越高越好以 提升該電容器之電容。較佳地，各片狀電介f係具有高於 該基底材料21之介電常數之一介電常數的一高介電材料。 例如，由3M製成之一嵌入式雪 肷八式電谷态材料（ECM)可用作為一 片狀電介質。該ECM由形成為—挽性片y提供α Ply(例如相對介電常數為16)的一高介電材料組成。可藉由 (例如）使用蝕刻或其他製造技術而製造基板2之層。 形成基板2之材料可包含紙以取代玻璃纖維，且可包含 苯酚樹脂或聚醯胺樹脂以取代環氧樹脂。此外，除銅以 外’銀、金、鎳或其等之合金可用作為形成導電層之材 料。片狀電介質可包含聚合物。較佳地，片狀電介質包含 -聚合物及複數個顆粒，具體而言，片狀電介質由樹脂與 顆粒之-混合物製成。環氧樹脂、聚醯亞胺、聚偏二氟乙 稀、氰基乙基支鍵澱粉、苯並環謂、聚降冰片烯、聚四 氟乙稀、丙稀酸醋及其等之混合物可用作為較佳樹脂。該 等顆粒包含介電（或絕緣）顆粒。鈦酸鋇、鈦酸鋇鳃、氧化 鈦、鍅鈦酸鉛及其等之混合物可用作為此等之典型實例。 例如’各片狀電介質22、23之厚度可為（例如）〇 5微米或 更大，且可為20微米或更小。較佳地，厚度為更薄以允許 153615.doc 201145728 電容Is之靜電電容更高。例如，厚度可為15微米或更小或 10微米或更小。然％，自接合強度之觀點，介電材料22、 23之層厚度越厚越好，且（例如）可為丨微米或更大。 此外，片狀介電材料22、23之相對介電常數越高越好。 例如’其可為H)或更大或12或更大。然而，未特定設定相 對介電常數之上限，其可為45或更小、3〇或更小、2〇或更 小或小於16。 如圖5及圖7中所示，在形成於片狀電介㈣、23之兩側 處之導電層中’ £靠近基板2之表面的導電層24、％係分 別電連接至在接觸接腳4、6中連接至電子裝置及電路板之 電力供應端子的電力供應接腳42a、62a。另一方面，自片 狀電介質22、23定位在基板2之内側處的導電層25、27係 分別電連接至在接觸接腳4、6中連接至電子裝置及電路板 之接地端子的接地接腳43a、63a。更詳細而言，靠近基板 2之未展示電子裝置側之表面（圖2中之頂面2勾的導電層 24(其鄰接第一片狀電介質22之頂面）係形成為一第一電力 供應層，而|電層25(其鄰接片狀電介質22之底面）係形成 為一第一接地層。類似地，靠近基板2之未展示電路板側 之表面（圖2中之底面2b)的導電層26(其鄰接靠近第二片狀 電介質23之基板2之底面的側之表面）係形成為一第二電力 供應層，而在片狀電介質23之相對側之表面上，導電層27 係形成為一第二接地層。此處，該第一電力供應層Μ與該 第二電力供應層26之電位大致相同。類似地，該第一接地 層25與該第二接地層27之電位大致相同。 153615.doc 201145728 應注意，片狀電介質及其等兩側上之導電層係配置在整 個基板2上。因此，可形成具有大致等於基板2之面積之面 積的電容器。 以此方式’接觸接腳支架1具有連接於電力供應接腳與 接地接腳之間之電容器’且藉此可減小各接觸接腳處所產 生之阻抗。 此外’如圖6及圖7中所示’較佳為基板2具有由在儘可 能靠近基板2之頂面2a及底面2b之各者（即，表面層側）之一 位置處夾著一片狀電介質的一電力供應層與接地層形成之 一電容器。這是因為基板2之表面與導電層之間之一較小 距離給予較佳信號傳輸特性。更具體而言，基板2之頂面 2a與片狀電介質22之間之距離越短，附接至接觸接腳支架 1之電子裝置之輸入靈敏度提升越大，而基板2之底面2b與 片狀電介質23之間之距離越短，電子裝置之輸出靈敏度提 升越大。在本實施例中’基板係組態為包含夾於電力供應 層與接地層之間之介電層的一大致單一結構，所以可容易 地實現其中電容器係配置在基板2之表面附近的一組態。 因此’接觸接腳支架1可給予更佳信號傳輸特性。 此外’藉由配置比接地層更靠近基板2之表面層的電力 供應層，接觸接腳支架1可給予更佳信號傳輸特性。 應注意，取決於附接至接觸接腳支架1之電子裝置，基 板2僅需要具有基板2之頂面2a側上之電容器或底面2b側上 之電容器》替代地，基板2可不具有電容器。 如圖5中所示，接觸接腳4包含連接至電子裝置之信號端 153615.doc 12 201145728 子的彳§说接腳41a至411、連接至電子裝置之電力供應端子 的電力供應接8§p42a、42b及連接至電子裝置之接地端子的 接地接腳43a、43b。類似地，接觸接腳6包含連接至電路 板之彳s號端子的信號接腳61a至611、連接至電路板之電力 供應端子的電力供應接腳62a、62b及連接至電路板之接地 端子的接地接腳63 a、63b » 各接觸接腳4、6係由具有導電性之一構件形成並具有一 預定特性阻抗。應注意’對於發送至附接至接觸接腳支架 1之電子裝置的信號之頻率，各接觸接腳4之特性阻抗較佳 地約等於電子裝置之各端子之特性阻抗。此外，對於發送 至電子裝置的彳^號之頻率’各接觸接腳6之特性阻抗較佳 地約等於附接至接觸接腳支架之電路板之各端子之特性阻 抗。由此’接觸接腳支架1匹配電子裝置或電路板之端子 與接觸接腳4、6之間之阻抗，所以其可減少發生在一端子 與接觸接腳之間傳輸一高頻率信號時之傳輸損耗。 如圖6及圖7中所示，在形成於基板2之頂面2&側處且一 接觸接腳4係***至其中的各孔3之内表面上，使用（例如） 電鍍等等來提供一導體31。類似地，在形成於基板2之底 面2b側處且一接觸接腳6係***至其中的各孔5之内表面 上，提供一導體51。該等導體31、51係由（例如）一金屬（諸 如銅、金、銀、鎳或其等之合金）或具有導電性之其他材 料形成。此等導體3 1、5 1係分別電連接至連接構件7。 各接觸接腳4係壓配裝至孔3中之一對應孔中，由此接觸 接腳4接觸導體31。類似地，各接觸接腳6係壓配裝至孔$ 153615.doc 13 201145728 中之一對應孔中，由此接觸接腳6接觸導體51。 藉由壓配裝接觸接腳4、6以使其等接觸設置在形成於基 板2中之孔3、5之内壁上的導體3〗、51，接觸接腳4、6與 導體31、51係電連接且無需使用焊接。由此，將不再需要 將具有不同於接觸接腳之阻抗之一阻抗的一材料插置於接 觸接腳4、6與導體31、51之間。因此，接觸接腳支架1可 減少接觸接腳4、6與導體31、51之間之高頻率信號之傳輸 損耗。 孔3、5之尺寸係經判定使得孔中所固持之接觸接腳*、6 不會掉落’這是因為當將接觸接腳支架1放置在檢驗系統 之電路板上時接觸接腳4、6之内建彈簧產生反作用力。例 如，接觸接腳4、6之壓配裝固持力較佳為不小於牛 頓。此外，孔3、5之尺寸係經判定使得可自孔取出接觸接 腳4、ό且較易於接觸接腳4、6之維修、更換等等，此外， 孔3、5之尺寸係經判定使得當自基板2拉出接觸接腳4、6 時’孔3、5之内表面上之導體31、51不會脫落。例如，接 觸接腳4、6之壓配裝固持力較佳為不大於2.〇牛頓。 如圖5至圖7中所示，連接構件7將複數個接觸接腳4中之 任何接觸接腳電連接至複數個接觸接腳6中之一對應接觸 接腳》 為此，連接構件7具有基板2中之至少一導電層71及設置 在該導電層71之頂侧及底側鄰近處以便夾著該導電層7丨之 導電層72及73 ^該等導電層71至73係分別由（例如）一金屬 (諸如銅、金、銀、鎳或其等之合金）或具有導電性之另一 153615.doc 14· 201145728 材料形成。使用（例如）蝕刻、光微影或其他製造技術，該 等導電層71至73係形成於基板2中。 導電層71係由將接觸接腳4之信號接腳41a至411電連接 至接觸接腳6之信號接腳61a至611之任一者的複數個導電 路徑711a至7111形成。此外，導電層71係由將接觸接腳4之 電力供應接腳42a、42b分別電連接至接觸接腳6之電力供 應接腳62a、62b的導電路徑712a、712b形成。 導電層72、73係分別電連接至接觸接腳4之接地接腳 43a、43b及接觸接腳6之接地接腳63a、63b。此外，導電 層72、73較佳地具有足以將導電路徑7lla至7111夾於該等 導電層之間之面積。在本實施例中，導電層72、73係經配 置使得其等分別覆蓋基板2之整個水平表面。然而，導電 層72、73係經配置使得其等係與除接地接腳以外之接觸接 腳絕緣。 以此方式’連接構件7具有傳輸信號之導電路徑711 a至 7111及接地至兩側之導電層72及73，所以充當一帶狀線。 此外’藉由根據導電路徑之導電率及基板2之相對介電常 數而適當設定導電路徑之寬度及相鄰導電層之間之距離， 使各信號接腳與電連接信號接腳之連接構件7之間之一信 號之反射保持為相對於發送至電子裝置之信號之頻率的_ 最小值。由此’連接構件7可減少發生在通過導電路徑 711a至7111於信號接腳之間傳輸一高頻率信號時之傳輸損 耗。 應注意’若使連接構件7之阻抗充分匹配信號接腳之阻 153615.doc • 15- 201145728 抗，則在某種程度上一電子裝置及電路板之一者可自另一 者接收-高頻率信號。根據本發明之接觸接腳支架係不限 於連接構件7之阻抗完全匹配於該電子裝置及電路板之阻 抗的情況。 應注意’信號接腳之第一端部係較佳連接至連接構件7 之導電路徑7lla至71U。因此，在本實施例中在孔卜 5(信號接腳係插人至孔3、5中）之底面處，導電路徑711a至 7111係電連接至形成於孔3、5之内表面處的導體η、μ。 藉由將信號接腳之第一端部連接至導電路徑 防止***至基板2之孔中的信號接腳之部分充當與導電路 徑711a至71U平行連接之短柱。因此，接觸接腳支架工可防 止於信號接腳之部分處發生由自感或自電容引起的由信號 接腳及連接構件7形成之路徑之阻抗與電子裝置或電路板 之特性阻抗的不匹配。 替代地，當一信號接腳之特性阻抗與連接構件7之特性 阻抗不同時，連接構件7之導電路徑亦可在與孔之底面恰 好相隔一預定距離使得信號接腳之一端部充當一短柱的一 位置處連接至形成於孔（k號接腳係***至孔中）之側壁上 的導體。由此，由信號接腳及連接構件7形成之路徑之特 性阻抗可經調整使得路徑之阻抗可與電子裝置或電路板之 特性阻抗完全匹配。 如上所解釋，根據第一實施例之接觸接腳支架可電連接 具有不同於電路板之端子之節距及配置之端子之一節距及 配置的一電子裝置之端子與電路板之對應端子。此外，此 153615.doc -16- 201145728 接觸接腳支架通過經組態（諸如）以使連接至電子裝置之俨 號端子的接觸接腳之阻抗與連接至電路板之信號端子的接 觸接腳之阻抗匹配（對於發送至電子裝置的信號之頻率）的 連接構件而連接該等端子。因此，此接觸接腳支架可減少 於電子裝置與電路板之間發送的一信號之傳輸損耗。 圖8係展示連接構件7之另一實例的基板2之_平面透明 圖。此外，圖9係展示沿圖8之1¥_1¥之基板2之一側向橫截 面的一視圖。在此實例中，導電路徑741&至741f係形成於 第一導電層74中，且導電路徑7513至751£係形成於第二導 電層75中。此外，電連接至接地接腳43a、43b、633及631) 之導電層76係形成於第一導電層74與第二導電層75之間。 此外，第一導電層74之上側及第二導電層75之下側亦由連 接至接地接腳之導電層77、78形成。然而，導電層％至78 係經配置使得其等係與除接地接腳以外之接觸接腳絕緣。 導電層74至78係分別由（例如）一金屬（諸如銅、金、銀或鎳 或其等之合金）或具有導電性之其他材料形成。 甚至在此情況中，傳輸信號之導電路徑741 a至741 f及於 兩側處接地之導電層76及77充當一帶狀線^類似地，傳輸 信號之導電路徑751a至75 If及於兩側處接地之導電層76及 78亦充當一帶狀線。此外’藉由適當設計導電路徑之寬度 及導電路徑與導電層之間之距離，可使該帶狀線與信號接 腳之間的彳虎之反射保持為一最小值。 此外’導電路徑741a至741f及751a至751f係經形成使得 導電路徑之長度變為彼此相等。因此，由信號接腳形成之 153615.doc •17· 201145728 路徑與連接電子裝置之信號端子及電路板之對應端子之導 電路授的長度變為相同。因此，通過路徑所傳輸之信號之 延遲時間亦相等。由此，接觸接腳支架可防止輸入至電子 裝置或電路板之信號端子的信號之時序偏離。 接著，將解釋根據一第二實施例之一接觸接腳支架。根 據該第一貫施例之該接觸接腳支架將具有不同於操作一電 子裝置之一電路板之端子配置之一端子配置的該電子裝置 之鳊子電連接至該電路板之對應端子。因此，此接觸接腳 支架電連接該等端子，使得連接至該電路板之端子的接觸 接腳（其等係分別連接至該電子裝置之端子所連接的接觸 接腳）之配置不同於連接至該電子裝置之端子的接觸接腳 之配置。 相較於根據第一實施例之接觸接腳支架，根據第二實施 例之接觸接腳支架具有接觸接腳之一不同配置。因此，以 下將解釋接觸接腳之配置及相關内容。對於其他内容，參 考與第一實施例相關之解釋。 圖ίο係根據第二實施例之接觸接腳支架之基板2之一平 面圖。此外，圖π係根據第二實施例之接觸接腳支架之基 板2之仰視圖。應注意，在圖1〇、圖11中，根據第二實 施例之接觸接腳支架之元件被指派與圖丨至圖7中所示之根 據第一實施例之接觸接腳支架之對應元件相同的元件符 號。 如圖10中所示，基板2之頂面2a係由沿縱向方向各具有 相等間隔之八個孔的兩列形成。此外，複數個接觸接腳4 153615.doc -18· 201145728 係分別***至孔中，使得其等係電連接至附接至接觸接腳 支架1的電子板之端子。 類似地，如圖11中所示，基板2之底面2b係由沿縱向方 向各具有相等間隔之八個孔的兩列形成。此外，複數個接 觸接腳6係分別***至孔中，使得其等係電連接至附接至 接觸接腳支架1的電路板之端子。此外，相鄰接觸接腳4之 間之節距等於相鄰接觸接腳6之間之節距。 此外，取代在基板2之頂面2a及底面2b中單獨形成孔， 等於接觸接腳4之數量的一定數量通孔可形成於基板2中。 在此情況中，各通孔係自基板2之兩側與接觸接腳4之一者 及接觸接腳6之一者壓配裝。此外，為使***至一通孔中 之該兩個接觸接腳彼此絕緣，例如，在兩接觸接腳均不接 觸之通孔之内表面的一區域中不設置導體。 圖12係展示連接構件7之結構的基板2之一平面透明圖。 此外，圖13係展示沿圖12之線ν·ν之基板之一側向橫截 面的一視圖。 如圖12及圖13中所示，連接構件7將複數個接觸接腳4中 之接觸接腳之任一者電連接至複數個接觸接腳6中之對應 接觸接腳。 因此，在基板2内，連接構件7具有複數個導電路徑7Ua 至7111及導電路徑712a、712b。 導電路徑711a將接觸接腳4中之一信號接腳電連接至 接觸接腳6中之-信號接腳61b。導電路徑川⑽―信號接 腳41b電連接至一仏號接腳61a。導電路徑將一信號接 153615.doc •19· 201145728 腳41c電連接至一信號接腳61d»導電路徑711 d將一信號接 腳41d電連接至一信號接腳61e。導電路徑7Ue將一信號接 腳41e電連接至一信號接腳61f。導電路徑7Uf將一信號接 腳41f電連接至—信號接腳61e。導電路徑711g將一信號接 腳41g電連接至一信號接腳61h。導電路徑711 h將一信號接 腳41h電連接至一信號接腳61g。導電路徑7Ui將一信號接 腳411電連接至一信號接腳61j。導電路徑711j將一信號接 腳41j電連接至一信號接腳6U。導電路徑7uk將一信號接 腳41k電連接至一信號接腳611 ^此外，導電路徑yin將一 信號接腳411電連接至一信號接腳61k。 此外’導電路徑7123導電性連接電力供應接腳42a與電 力供應接腳62a，而導電路徑712b導電性連接電力供應接 腳42b與電力供應接腳62b。 以此方式，接觸接腳4之配置中的信號接腳41&至41丨之 次序與電連接至信號接腳41&至411的信號接腳613至61丨之 次序係不同。因此，根據第二實施例之接觸接腳支架可將 具有不同於電路板之端子配置之一端子配置的一電子裝置 之端子連接至電路板之對應端子。 應注意’接觸接腳之間之連接係不限於以上實例。根據 附接至接觸接腳支架的電子裝置之端子配置及電路板之端 子配置而足以判定連接。 此外，接觸接腳4、6可（例如）配置成一栅格陣列以便能 夠用球狀栅格陣列（ball grid array)、基板栅格陣列（][and grid array)、接腳柵格陣列（pin grid array)或其他端子配置 153615.doc -20- 201145728 來處置電子裝置及電路板。 此外，連接構件7具有電連接至接觸接腳4之接地接腳 43a、43b及接觸接腳6之接地接腳63a、63b的導電層72、 73、76及77。導電層72、73、76、77係經形成使得其等將 導電路徑711a至7111夾在中間。因此，導電層72、73、 76、77及導電路徑711a至7111可形成帶狀線。此外，導電 路徑之寬度及導電路徑與導電層之間之距離係經設定，使 得信號接腳與連接構件7之間的信號之反射變為一最小 值。由此’連接構件7可減少由通過導電路徑7丨丨a至7丨丨1於 信號接腳之間發送一高頻率信號引起之傳輸損耗。 應注意，導電路徑及導電層係分別由（例如）一金屬（諸如 銅、金、銀或鎳或其等之合金）或具有導電性之其他材料 形成。此外，使用（例如）蝕刻、光微影或其他製造技術， 導電路徑及導電層係形成於基板2中。 如上所解釋，根據第一貫施例之接觸接腳支架可將具有 不同於一電路板之端子配置之一端子配置的一電子裝置之 端子連接至該電路板之對應端子。 接著，將解釋根據一第三實施例之一接觸接腳支架。根 據該第三實施例之該接觸接腳支架具有由接觸接腳支架形 式之同軸傳輸線_之信號接腳，以藉此使信號接腳之特 性阻抗匹配電子裝置及操作電子裝置之電路板的阻抗。 根據第二實施例之接觸接腳支架與根據第—實施例之接 接腳支架的不同點在於’信號接腳構成一同軸傳輸線。 因此’以下將解釋信號接腳及與孔（信號接腳係***至孔 153615.doc -21· 201145728 中）相關之内容。對於其他内容，參考與第一實施例相關 之解釋》 圖14係展示根據第三實施例之接觸接腳支架之基板之一 側向橫截面的一視圖。 孔30(接觸接腳4之信號接腳41 a係***至孔30中）之長度 短於信號接腳41 a之縱向長度。因此，信號接腳41a係經固 持使得信號接腳41a之一端部連接孔30之底面30d，且在基 板2上方’另一端部自孔3〇突出。此外，孔3〇之中心部分 30a之内徑大於信號接腳413之下部分412之外徑。此外， 上端部30b之内徑及孔30之下端部30c之内徑小於中心部分 30a之内徑。此外’下端部3〇1：)之内徑約等於信號接腳4U 之上部分411之外徑，且小於信號接腳41 a之下部分412之 外徑。此外，孔30之下端部30e之内徑約等於信號接腳41a 之下部分412之外徑》因此，信號接腳41a係由孔30之上端 部30b及下端部30e固持。 此外，一導體32係形成於孔30之中心部分3 11 a之内表面 處。此導體3 2係通過連接構件7之導電層7 2而導電性連接 至接地接腳43a及接地接腳63a ^因此’導體32係接地。此 外，信號接腳41a係藉由被配置在導體32之遠處而與導體 32絕緣。由此，信號接腳4ia與導體32構成一同軸傳輸 線。應注意’可用樹脂或其他電介質填充導體32與信號接 腳41a之間之空間。 藉由適當設定信號接腳41 a之直徑及信號接腳41a與導體 32之間之距離，可給予由信號接腳41a及導體32形成之同 153615.doc •22- 201145728 軸傳輸線約等於在發送至連接至信號接腳41a之電子裝置 的信號之頻率下之特性阻抗的一特性阻抗。因此，此接觸 接腳支架可使電子裝置之信號端子之特性阻抗匹配由信號 接腳41a及導體32構成之同軸傳輸線之特性阻抗，所以可 減少通過信號接腳41 a而傳輸的信號之傳輸損耗。 類似地，孔50(接觸接腳6之信號接腳61a係***至孔5〇 中）之中心部分50a之内徑大於信號接腳61a之上部分61丨之 外徑。此外，孔50之中心部分50a之内表面係由一導體52 心成。此導體52係通過連接構件7之導電層73而導電性連 接至接地接腳43a及接地接腳63a。因此，導體52係接地。 此外，信號接腳61a係藉由被配置在導體52之遠處而與導 體52絕緣。由此，信號接腳61a與導體52構成一同軸傳輸 線。 導體33係形成於孔3〇之底面3〇d上。導體33係與導體 32絕緣。另一方面’信號接腳41a具有接觸導體33之一尖 端’由此信號接腳41a與導體33係電連接。類似地，孔5〇 之頂面50d係由一導體53形成。導體53係與導體52絕緣。 另一方面’信號接腳61a具有接觸導體53之一尖端，由此 信號接腳61a與導體53係電連接。 此外’連接構件7之導電路徑71電連接導體33與導體 53。此外’導電路徑71係配置於接地導電層72與之間。 因此，連接構件7可形成一帶狀線。 應注意’在基板2之表面層附近’根據此實施例之接觸 接腳支架亦可具有由連接至電力供應接腳之導電層（即， 153615.doc -23· 201145728 電力供應層24、26)、連接至接地接腳之導電層（即，接地 層25、27)及夾於電力供應層24、26與接地層25、27之間 之介電層22、23組態之一電容器。 如上所解釋’根據第三實施例之接觸接腳支架可由連接 至電子裝置或電路板之一信號端子的一信號接腳及形成於 一孔（該信號接腳係***至該孔中且接地）之内表面上的一 導體形成一同轴傳輸線。因此，此接觸接腳支架可使各信 號端子與信號接腳之間之阻抗匹配（對於發送至電子裝置 的信號之頻率），所以可減少通過信號接腳而傳輸的信號 之傳輸損耗。此外，此接觸接腳支架亦可使連接構件（其 將連接至一電子裝置之一信號端子的一信號接腳連接至電 路板之一信號端子所連接的一信號接腳）成為一帶狀線結 構且可因此抑制信號接腳與連接構件之間之信號反射。以 此方式’此接觸接腳支架可使電子裝置之一信號端子與電 路板之信號端子之間的總路徑之阻抗匹配各信號端子之阻 杬。因此’充分減少此接觸接腳支架中所傳輸的信號之傳 輸損耗。 應注意’本發明係不限於以上實施例。 例如，在以上實施例中’亦可省略鄰接連接至信號接腳 之導電路徑的連接構件7之兩個接地導電層之一者。在此 情況中，連接構件之導電路徑與一接地導電層可形成一微 型帶狀線。因此，藉由根據導電路徑之導電率及基底材料 21之相對介電常數而調整連接構件7之導電路徑之寬度及 導電路徑與接地導電層之間之距離，可使連接構件7與信 153615.doc -24- 201145728 號接腳之間之一信號之反射保持為一最小值。 此外’連接構件7可具有一不同組態以實現與一特定頻 率下之彳§號接腳之特性阻抗近似相同的一特性阻抗。 此外，能夠用在以上實施例中之接觸接腳可具有一所謂 之「彈簧接腳（pogopin)」組態。 圖15係展示可用在根據以上實施例之接觸接腳支架中之 一接觸接腳400之一側向橫截面的一視圖。接觸接腳4〇〇具 有··一近似圓柱形接腳體401，其***至基板中；一第一 接觸構件402，其自接腳體401之一端部（所繪示實例中之 下端部）突出並能夠緊靠形成於基板上之一孔（例如圖6之孔 3)之底面或一未展示電路板之一端子；及一第二接觸構件 403，其自接腳體401之一端部（所繪示實例中之上端部）突 出並能夠緊靠形成於基板上之一孔（例如圖6之孔5)之頂面 或一未展示電子裝置之一端子。接腳體4〇1及接觸構件 402、403係由具有導電性之材料形成。此外，接腳體4〇ι 之上端部及下端部上的開口之内徑窄於接腳體4〇1之中心 部分處的内徑。此外，接觸構件4〇2、4〇3之側係由自内側 緊靠接腳體401之下端部或上端部並防止接觸構件4〇2、 403自接腳體401掉落的凸緣形成。 此外，接腳體40 1之内側具有一 性），諸如一金屬彈簧404。此外， 402、403兩者分別偏置至接腳體4〇1之下端部或上端部 彈性構件（具有導電 彈簧404將接觸構件201145728 VI. Description of the Invention: [Technical Field] The present invention relates to a contact pin holder for holding a terminal of an electronic device such as a processor, a memory or other semiconductor integrated circuit. Connect to the contact pins of a board. [Prior Art] In recent years, various electronic devices have been utilized. The electronic device generally comprises: a plurality of signal terminals for self-operating the electronic device - the circuit board receives the money type circuit or sends a signal output from the material device to the circuit board - the power supply terminal, which will Power is supplied to the electronic device; and - a ground terminal. The pitch between the terminals differs depending on the electronic device. Therefore, in order to operate a circuit board (for example, an electronic device verification board) for operating an electronic device, a plurality of types of electronic devices having different pitches between terminals are used, and the electronic device contacts the pin holder, A plurality of contact pins configured to match the pitch between the terminals to electrically connect the terminals of an electronic device to corresponding terminals of the circuit board. For example, Patent Document 1 discloses a terminal pitch conversion board. Further, Patent Document 1 describes that "the terminal pitch conversion board is disposed at a central portion of a board body" which has connection with the individual terminal pins 2a to match the terminal pins 2a of a burn-in socket 2. a plurality of socket terminal jacks 3, wherein a BGA package has been plugged and disposed at a periphery of the board body (the board body 1 has a connection with the terminal connection hole 4a for matching in the printed circuit board 4) The terminals are connected to a plurality of connecting pins 5) of the hole 4a and thereby realize the pre-burning socket 2 and the printed circuit board 4 153615 having mutually different terminal pitches. Terminal connection between doc 201145728". Further, Patent Document 2 describes (with respect to the socket) "the pitch of the arrangement of the back electrodes 23 from the pitch of the arrangement of the front electrodes 22". Further, the one disclosed in Patent Document 3 (: the socket has "_lower support" The frame 11, an upper bracket 20, an adjusting bracket 3〇, a cover 4〇, a lower anisotropic conductive sheet 50, a pad pitch conversion plate 6〇 and an upper anisotropic conductive sheet 70”. Patent Document 3 describes that "the pad pitch conversion plate 6" includes semiconductor device side pads 81 and the like which are arranged in a lattice pattern on the top surface thereof, and is arranged in a lattice pattern on the bottom surface thereof (converted to be about a semiconductor device side pad). The mother pad device side pad is twice the pitch of the pitch. The pad of the motherboard is configured with the pitch of the side pad of the mother pad of the pitch pad conversion plate 60. [PTL 1] Japanese Patent Publication (Eight) Japanese Patent Publication (A) No. 2, No. 82553 [PTL 3] Japanese Patent Publication (A) No. 2-77.8592 [Invention] In recent years The frequency of the signal used by the electronic device becomes higher as the processing speed of the electronic device increases. The device uses signals with a frequency higher than one billion hertz (GHz). Therefore, in response to the higher frequency of the signal, the ability to transmit high frequency signals from the contact pin holder has also been pursued. Therefore, the present invention provides a contact pin holder, The terminal of the electronic device having a terminal pitch different from the terminal pitch of the circuit board is connected to a corresponding terminal of the circuit board and capable of transmitting a high frequency signal. According to the aspect of the invention, a contact pin is provided. The contact pin holder comprises a substrate having a first table 153615 formed on the substrate. Doc 201145728 a plurality of first-sub-Ls on the surface and a plurality of second holes formed on a second surface of the substrate; a plurality of first contact pins, each of the first contact pins being inserted into the And a plurality of second contact pins in any one of the first holes, each of the second contact pins being inserted into any of the second holes, and a connecting member disposed on the substrate And electrically connecting at least one of the first contact pins to at least one of the second contact pins and having an impedance that matches an impedance of the two electrical connection contact pins. According to the present invention, there can be provided a contact pin holder which is connected to a terminal of an electronic device having a pitch of one of the terminals between the terminals of the circuit board and a corresponding terminal of the circuit board and capable of transmitting a high frequency signal. [Embodiment] A contact pin holder according to some embodiments of the present invention will be explained below with reference to the drawings. The contact pin holder includes: a substrate; a first group of a plurality of contact pins disposed on a surface of the substrate side to which the electronic device is to be attached, and a second plurality of contact pins, And the like is disposed on a surface of the substrate side of the circuit board on which the electronic device is operated. In addition, even if the terminal pitch and the terminal configuration of the electronic device are different from the terminal pitch and the terminal configuration of the circuit board, the pitch and configuration of the first group of contact pins are different from the section of the second group contact pin. The distance and configuration enable the terminals of the electronic device to be electrically connected to corresponding terminals of the circuit board. The contact pins included in the first group are electrically connected to corresponding contact pins included in the first group by one of the connection members disposed in the substrate. In addition, the connecting member has, for example, a strip line structure, and the impedance of the signal pin transmitting the signal in the first group contact pin is in contact with the second group by the strip line structure 153615 . Doc 201145728 The impedance matching of the corresponding contact pins in the pins. Thus, the contact pin holder reduces the transmission loss of high frequency signals between the electronic device attached to the contact pin holder and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing a guide type contact pin holder 100 according to a first embodiment of the present invention. Fig. 2 is a view showing a cross section of the guide pin contact 1 沿 along the drawing. The guiding contact pin holder 1〇0 has a contact pin holder 1 and a guiding body 8 disposed at a periphery of the contact pin holder and supporting the contact pin holder 1 The contact pin holder 1 has: a substrate 2; a plurality of contact pins 4 are inserted into a plurality of holes formed on one of the top surfaces 2a of the substrate 2; a plurality of contact pins 6 are respectively respectively Inserted into a plurality of holes formed on the bottom surface 2b of the substrate 2; and a connecting member 7 for electrically connecting the contact pins 4 and the corresponding contact pins 6. The guiding body 8 has a guiding portion or guiding wall 181 for arranging an electronic device (not shown) at a predetermined position on the substrate and has a system for operating the electronic device (for example, At a predetermined position of one of the circuit boards of the inspection system (not shown) of the inspection electronic device, a positioning portion of the contact pin holder ( is positioned (in the present embodiment, the positioning shown in FIG. 2) Pin 82). It should be noted that the guide body 8 is mounted to the contact pin holder as needed. Additionally, the substrate 2 can have a hole or recess for use with the positioning portion that is positioned. In addition, to mount the electronic device to an exact position relative to the contact pin holder ,, a positional device that is configured to be spaced from the contact pin holder 1 can be used. In this case, the guide body 8 is omitted. 153615. Doc 201145728 Figure 3 shows a plan view of one of the substrates 2, while Figure 4 shows a bottom view of one of the substrates 2. Further, Figure 5 shows a planar transparent view of the substrate 2 of the structure of the connecting member 7. Fig. 6 is a view showing a lateral cross section of the substrate 2 taken along line H-II of Fig. 5. Further, Fig. 7 is a view showing a lateral cross section of the substrate 2 taken along the line π ππ of Fig. 5. As shown in FIG. 3, the top surface 2a of the substrate 2 has a plurality of contact pins 4 arranged in two columns of eight pins equally spaced in the longitudinal direction so that the blades are electrically connected to the contacts to the contacts. The other end of the electronic device of the pin holder 另, as shown in FIG. 4, the bottom surface 2b of the substrate 2 has an array of four pins each having a longitudinal direction and four pins in the lateral direction. The plurality of contact pins 6 are electrically connected to the terminals of the circuit board to which the contact pin holder 1 is attached, respectively. Further, the pitch between the contact pins 6 adjacent in the lateral direction is narrower than the pitch between the contact pins 4 adjacent in the lateral direction. It should be noted that the pitch between the contact pins 4 adjacent in the longitudinal direction may also be different from the pitch between the contact pins 6 adjacent in the longitudinal direction. In this manner, the pitch and configuration of the contact pins 4 are different from the pitch and configuration of the contact pins 6. Further, as shown in Fig. 5, the contact pins 4 are electrically connected to the corresponding contact pins in the contact pins 6 by the connecting members 7. Therefore, the contact pin holder can be electrically connected to the corresponding terminal of an electronic device having a pitch different from the terminal of the circuit board and a configuration of one of the dice and the arrangement of the electronic device. As shown in Figures 6 and 7, the substrate 2 has a 153,615 arrangement (preferably embedded) on a substrate material 21 consisting of a glass epoxy or other dielectric material. Doc • 9- 201145728 At least - (two in the depicted example) sheet dielectrics 22, 23, each sheet dielectric having a steel or other conductive layer formed on both sides thereof. That is, in the substrate 2, the base pure material 21 has a conductive layer, a sheet-like dielectric, and another conductive layer disposed thereon in the following manner. Thus, each of the sheet-like dielectrics operates with a conductive layer on both sides of the sheet-like dielectric to form a capacitor. Further, the higher the dielectric constant of each of the sheet-like dielectrics 22, 23, the better the capacitance of the capacitor is raised. Preferably, each of the sheet dielectrics f has a high dielectric material having a dielectric constant higher than a dielectric constant of the base material 21. For example, an embedded snowy eight-state electric grain material (ECM) made of 3M can be used as a sheet dielectric. The ECM consists of a high dielectric material that is formed as a pull-up sheet y that provides alpha Ply (e.g., a relative dielectric constant of 16). The layers of substrate 2 can be fabricated, for example, using etching or other fabrication techniques. The material forming the substrate 2 may comprise paper instead of glass fibers, and may comprise a phenol resin or a polyamide resin in place of the epoxy resin. Further, an alloy of silver, gold, nickel or the like other than copper may be used as the material for forming the conductive layer. The sheet dielectric may comprise a polymer. Preferably, the sheet dielectric comprises - a polymer and a plurality of particles, in particular, the sheet dielectric is made of a mixture of resin and particles. Epoxy resin, polyimide, polyvinylidene fluoride, cyanoethyl branched starch, benzocycloid, polynorbornene, polytetrafluoroethylene, acrylic acid vinegar and the like As a preferred resin. The particles comprise dielectric (or insulating) particles. A mixture of barium titanate, barium titanate, titanium oxide, lead strontium titanate, and the like can be used as a typical example for this. For example, the thickness of each of the sheet-like dielectrics 22, 23 may be, for example, 〇 5 μm or more, and may be 20 μm or less. Preferably, the thickness is thinner to allow 153,615. Doc 201145728 Capacitance Is has a higher electrostatic capacitance. For example, the thickness can be 15 microns or less or 10 microns or less. However, from the viewpoint of the bonding strength, the thicker the layer thickness of the dielectric materials 22, 23, the better, and for example, may be 丨micron or larger. Further, the higher the relative dielectric constant of the sheet-like dielectric materials 22, 23, the better. For example, 'which may be H) or greater or 12 or greater. However, the upper limit of the relative dielectric constant is not specifically set, which may be 45 or less, 3 Å or less, 2 Å or less, or less than 16. As shown in FIG. 5 and FIG. 7, in the conductive layers formed on both sides of the chip dielectrics (4), 23, the conductive layers 24, % near the surface of the substrate 2 are electrically connected to the contact pins, respectively. 4, 6 are power supply pins 42a, 62a connected to the power supply terminals of the electronic device and the circuit board. On the other hand, the conductive layers 25, 27 located at the inner side of the substrate 2 from the chip dielectrics 22, 23 are electrically connected to the ground connections of the ground terminals connected to the electronic device and the circuit board in the contact pins 4, 6, respectively. Feet 43a, 63a. In more detail, the surface of the substrate 2 not showing the electronic device side (the conductive layer 24 of the top surface 2 hook in FIG. 2 (which is adjacent to the top surface of the first sheet dielectric 22) is formed as a first power supply. The layer, and the electrical layer 25 (which is adjacent to the bottom surface of the sheet dielectric 22) is formed as a first ground layer. Similarly, the conductive surface of the substrate 2 (the bottom surface 2b in FIG. 2) is not shown on the side of the circuit board. The layer 26 (which is adjacent to the side of the side of the bottom surface of the substrate 2 adjacent to the second sheet-like dielectric 23) is formed as a second power supply layer, and on the surface on the opposite side of the sheet-like dielectric 23, the conductive layer 27 is formed. a second ground layer. Here, the first power supply layer Μ is substantially the same potential as the second power supply layer 26. Similarly, the first ground layer 25 and the second ground layer 27 have substantially the same potential. 153615. Doc 201145728 It should be noted that the sheet dielectric and its conductive layers on both sides are disposed on the entire substrate 2. Therefore, a capacitor having an area substantially equal to the area of the substrate 2 can be formed. In this way, the contact pin holder 1 has a capacitor 'connected between the power supply pin and the ground pin' and thereby reduces the impedance generated at each contact pin. Further, 'as shown in FIGS. 6 and 7', it is preferable that the substrate 2 has a sheet sandwiched at a position as close as possible to each of the top surface 2a and the bottom surface 2b of the substrate 2 (ie, the surface layer side). A power supply layer of the dielectric forms a capacitor with the ground layer. This is because a small distance between the surface of the substrate 2 and the conductive layer gives better signal transmission characteristics. More specifically, the shorter the distance between the top surface 2a of the substrate 2 and the sheet-like dielectric 22, the greater the input sensitivity of the electronic device attached to the contact pin holder 1 is increased, and the bottom surface 2b and the sheet of the substrate 2 are increased. The shorter the distance between the dielectrics 23, the greater the increase in output sensitivity of the electronic device. In the present embodiment, the 'substrate system is configured to include a substantially single structure of a dielectric layer sandwiched between the power supply layer and the ground layer, so that a group in which the capacitor system is disposed near the surface of the substrate 2 can be easily realized. state. Therefore, the contact pin holder 1 can give better signal transmission characteristics. Further, the contact pin holder 1 can impart better signal transmission characteristics by arranging a power supply layer closer to the surface layer of the substrate 2 than the ground layer. It should be noted that, depending on the electronic device attached to the contact pin holder 1, the substrate 2 only needs to have a capacitor on the side of the top surface 2a of the substrate 2 or a capacitor on the side of the bottom surface 2b. Alternatively, the substrate 2 may have no capacitor. As shown in Figure 5, the contact pin 4 includes a signal terminal 153615 connected to the electronic device. Doc 12 201145728 § § says pins 41a to 411, power supply connections 8 § p42a, 42b connected to the power supply terminals of the electronic device, and ground pins 43a, 43b connected to the ground terminals of the electronic device. Similarly, the contact pin 6 includes signal pins 61a to 611 connected to the s terminal of the circuit board, power supply pins 62a, 62b connected to the power supply terminal of the circuit board, and a ground terminal connected to the circuit board. Grounding Pins 63 a, 63b » Each of the contact pins 4, 6 is formed of one of electrically conductive members and has a predetermined characteristic impedance. It should be noted that the characteristic impedance of each contact pin 4 is preferably approximately equal to the characteristic impedance of each terminal of the electronic device for the frequency of the signal transmitted to the electronic device attached to the contact pin holder 1. Further, the characteristic impedance of each of the contact pins 6 for the frequency of the transmission to the electronic device is preferably approximately equal to the characteristic impedance of each terminal of the circuit board attached to the contact pin holder. Thus, the 'contact pin holder 1 matches the impedance between the terminal of the electronic device or the circuit board and the contact pins 4, 6, so that it can reduce the transmission when a high frequency signal is transmitted between a terminal and the contact pin. loss. As shown in FIGS. 6 and 7, on the inner surface of each of the holes 3 formed at the top surface 2& side of the substrate 2 and a contact pin 4 is inserted therein, for example, plating or the like is provided. A conductor 31. Similarly, a conductor 51 is provided on the inner surface of each of the holes 5 formed at the side of the bottom surface 2b of the substrate 2 and into which a contact pin 6 is inserted. The conductors 31, 51 are formed of, for example, a metal such as an alloy of copper, gold, silver, nickel or the like or other materials having electrical conductivity. These conductors 3 1 , 5 1 are electrically connected to the connecting member 7, respectively. Each of the contact pins 4 is press-fitted into a corresponding one of the holes 3, whereby the contact pins 4 contact the conductors 31. Similarly, each contact pin 6 is press-fitted to the hole $ 153615. One of the doc 13 201145728 corresponds to the hole, whereby the contact pin 6 contacts the conductor 51. The contact pins 4, 6 are press-fitted to contact the conductors 3, 51 disposed on the inner walls of the holes 3, 5 formed in the substrate 2, the contact pins 4, 6 and the conductors 31, 51 Electrical connection and no soldering required. Thus, it is no longer necessary to insert a material having an impedance different from that of the contact pins between the contact pins 4, 6 and the conductors 31, 51. Therefore, the contact pin holder 1 can reduce the transmission loss of the high frequency signal between the contact pins 4, 6 and the conductors 31, 51. The dimensions of the holes 3, 5 are determined such that the contact pins *, 6 held in the holes do not fall 'this is because the contact pins 4 are contacted when the contact pin holder 1 is placed on the circuit board of the inspection system, The built-in spring of 6 produces a reaction force. For example, the press-fit holding force of the contact pins 4, 6 is preferably not less than Newton. Furthermore, the dimensions of the holes 3, 5 are determined such that the contact pins 4 are removed from the holes, and the repair, replacement, etc. of the pins 4, 6 are easier to access, and further, the dimensions of the holes 3, 5 are determined such that When the contact pins 4, 6 are pulled out from the substrate 2, the conductors 31, 51 on the inner surfaces of the holes 3, 5 do not fall off. For example, the press-fit retention force of the contact pins 4, 6 is preferably not more than 2. 〇 Newton. As shown in FIGS. 5 to 7, the connecting member 7 electrically connects any one of the plurality of contact pins 4 to one of the plurality of contact pins 6 for the corresponding contact pin. To this end, the connecting member 7 has At least one conductive layer 71 in the substrate 2 and adjacent to the top side and the bottom side of the conductive layer 71 so as to sandwich the conductive layers 72 and 73 of the conductive layer 7 ^ the conductive layers 71 to 73 are respectively For example) a metal (such as copper, gold, silver, nickel or alloys thereof) or another 153615 with conductivity. Doc 14· 201145728 Material formation. The conductive layers 71 to 73 are formed in the substrate 2 using, for example, etching, photolithography, or other fabrication techniques. The conductive layer 71 is formed by a plurality of conductive paths 711a to 7111 which electrically connect the signal pins 41a to 411 of the contact pins 4 to any of the signal pins 61a to 611 of the contact pins 6. Further, the conductive layer 71 is formed by electrically connecting the power supply pins 42a, 42b of the contact pins 4 to the conductive paths 712a, 712b of the power supply pins 62a, 62b of the contact pins 6, respectively. The conductive layers 72, 73 are electrically connected to the ground pins 43a, 43b of the contact pins 4 and the ground pins 63a, 63b of the contact pins 6, respectively. Furthermore, the conductive layers 72, 73 preferably have an area sufficient to sandwich the conductive paths 7lla through 7111 between the conductive layers. In the present embodiment, the conductive layers 72, 73 are configured such that they cover the entire horizontal surface of the substrate 2, respectively. However, the conductive layers 72, 73 are configured such that they are insulated from contact pins other than the ground pins. In this manner, the connecting member 7 has the conductive paths 711 a to 7111 for transmitting signals and the conductive layers 72 and 73 which are grounded to both sides, so as a strip line. In addition, by appropriately setting the width of the conductive path and the distance between adjacent conductive layers according to the conductivity of the conductive path and the relative dielectric constant of the substrate 2, the connecting members of the signal pins and the electrical connection signal pins 7 The reflection of one of the signals is maintained at a _ minimum relative to the frequency of the signal transmitted to the electronic device. Thus, the connecting member 7 can reduce the transmission loss occurring when a high frequency signal is transmitted between the signal pins through the conductive paths 711a to 7111. It should be noted that if the impedance of the connecting member 7 is sufficiently matched to the resistance of the signal pin 153615. Doc • 15- 201145728, to some extent, one of the electronic devices and the circuit board can receive the high frequency signal from the other. The contact pin holder according to the present invention is not limited to the case where the impedance of the connecting member 7 is completely matched to the impedance of the electronic device and the circuit board. It should be noted that the first end of the 'signal pin is preferably connected to the conductive paths 7lla to 71U of the connecting member 7. Therefore, in the present embodiment, at the bottom surface of the hole 5 (the signal pin is inserted into the holes 3, 5), the conductive paths 711a to 7111 are electrically connected to the conductors formed at the inner surfaces of the holes 3, 5. η, μ. The portion of the signal pin inserted into the hole of the substrate 2 is prevented from acting as a stub connected in parallel with the conductive paths 711a to 71U by connecting the first end of the signal pin to the conductive path. Therefore, the contact pin holder can prevent the impedance of the path formed by the signal pin and the connecting member 7 caused by the self-inductance or the self-capacitance from being mismatched with the characteristic impedance of the electronic device or the circuit board at the portion of the signal pin. . Alternatively, when the characteristic impedance of a signal pin is different from the characteristic impedance of the connecting member 7, the conductive path of the connecting member 7 may also be exactly a predetermined distance from the bottom surface of the hole such that one end of the signal pin acts as a short post A position is connected to the conductor formed on the side wall of the hole (the k-pin is inserted into the hole). Thus, the characteristic impedance of the path formed by the signal pins and the connecting member 7 can be adjusted so that the impedance of the path can be perfectly matched to the characteristic impedance of the electronic device or board. As explained above, the contact pin holder according to the first embodiment can electrically connect the terminal of the electronic device having a pitch and a pitch different from the terminal of the circuit board and the corresponding terminal of the circuit board. In addition, this 153615. Doc -16- 201145728 The contact pin holder is configured such that the impedance of the contact pin connected to the nickname terminal of the electronic device matches the impedance of the contact pin connected to the signal terminal of the circuit board (for transmission The terminals are connected to the connecting members of the frequency of the signals of the electronic device. Therefore, the contact pin holder can reduce the transmission loss of a signal transmitted between the electronic device and the circuit board. Fig. 8 is a view showing a plane transparent view of the substrate 2 of another example of the connecting member 7. Further, Fig. 9 is a view showing a lateral cross section of one of the substrates 2 of 1 ¥_1 of Fig. 8. In this example, conductive paths 741 & 741f are formed in first conductive layer 74, and conductive paths 7513 through 751 are formed in second conductive layer 75. Further, a conductive layer 76 electrically connected to the ground pins 43a, 43b, 633, and 631) is formed between the first conductive layer 74 and the second conductive layer 75. Further, the upper side of the first conductive layer 74 and the lower side of the second conductive layer 75 are also formed by the conductive layers 77, 78 connected to the ground pins. However, the conductive layers % to 78 are configured such that they are insulated from contact pins other than the ground pins. The conductive layers 74 to 78 are respectively formed of, for example, a metal such as copper, gold, silver or nickel or the like, or other materials having electrical conductivity. Even in this case, the conductive paths 741 a to 741 f of the transmission signal and the conductive layers 76 and 77 grounded at both sides serve as a strip line. Similarly, the conductive paths 751a to 75 of the transmission signal are on both sides. Conductive layers 76 and 78 that are grounded also serve as a stripline. In addition, by properly designing the width of the conductive path and the distance between the conductive path and the conductive layer, the reflection of the ridge between the strip line and the signal pin can be kept to a minimum. Further, the conductive paths 741a to 741f and 751a to 751f are formed such that the lengths of the conductive paths become equal to each other. Therefore, formed by the signal pin 153615. Doc •17· 201145728 The length of the path and the signal terminal of the connected electronic device and the corresponding terminal of the circuit board are the same. Therefore, the delay times of the signals transmitted through the path are also equal. Thus, the contact pin holder prevents timing deviation of signals input to the signal terminals of the electronic device or the board. Next, a contact pin holder according to a second embodiment will be explained. The contact pin holder according to the first embodiment electrically connects a die having the electronic device different from a terminal configuration for operating a circuit board of one of the electronic devices to a corresponding terminal of the circuit board. Therefore, the contact pin holder electrically connects the terminals such that the configuration of the contact pins connected to the terminals of the circuit board, which are respectively connected to the contact pins connected to the terminals of the electronic device, is different from the connection to The arrangement of the contact pins of the terminals of the electronic device. The contact pin holder according to the second embodiment has a different configuration of one of the contact pins than the contact pin holder according to the first embodiment. Therefore, the configuration of the contact pins and related content will be explained below. For other contents, reference is made to the explanation related to the first embodiment. Figure ίο is a plan view of a substrate 2 of a contact pin holder according to a second embodiment. Further, Fig. π is a bottom view of the substrate 2 of the contact pin holder according to the second embodiment. It should be noted that in FIGS. 1A and 11, the elements of the contact pin holder according to the second embodiment are assigned the same as the corresponding elements of the contact pin holder according to the first embodiment shown in FIG. Component symbol. As shown in Fig. 10, the top surface 2a of the substrate 2 is formed by two columns of eight holes each having an equal interval in the longitudinal direction. In addition, a plurality of contact pins 4 153615. Doc -18· 201145728 are respectively inserted into the holes such that they are electrically connected to the terminals of the electronic board attached to the contact pin holder 1. Similarly, as shown in Fig. 11, the bottom surface 2b of the substrate 2 is formed by two columns each having eight holes equally spaced in the longitudinal direction. Further, a plurality of contact pins 6 are respectively inserted into the holes such that they are electrically connected to the terminals of the circuit board attached to the contact pin holder 1. Furthermore, the pitch between adjacent contact pins 4 is equal to the pitch between adjacent contact pins 6. Further, instead of separately forming holes in the top surface 2a and the bottom surface 2b of the substrate 2, a certain number of through holes equal to the number of the contact pins 4 may be formed in the substrate 2. In this case, each of the through holes is press-fitted from one of the sides of the substrate 2 to one of the contact pins 4 and one of the contact pins 6. Further, in order to insulate the two contact pins inserted into a through hole from each other, for example, a conductor is not provided in an area of the inner surface of the through hole where the two contact pins are not in contact. Figure 12 is a plan transparent view of the substrate 2 showing the structure of the connecting member 7. Further, Fig. 13 is a view showing a lateral cross section of one of the substrates along the line ν·ν of Fig. 12. As shown in Figures 12 and 13, the connecting member 7 electrically connects any one of the contact pins of the plurality of contact pins 4 to a corresponding one of the plurality of contact pins 6. Therefore, in the substrate 2, the connecting member 7 has a plurality of conductive paths 7Ua to 7111 and conductive paths 712a, 712b. The conductive path 711a electrically connects one of the signal pins of the contact pin 4 to the signal pin 61b of the contact pin 6. The conductive path Chuan (10) - signal pin 41b is electrically connected to an apostrophe pin 61a. The conductive path connects a signal to 153615. Doc • 19· 201145728 The foot 41c is electrically connected to a signal pin 61d»the conductive path 711d electrically connects a signal pin 41d to a signal pin 61e. The conductive path 7Ue electrically connects a signal pin 41e to a signal pin 61f. The conductive path 7Uf electrically connects a signal pin 41f to the signal pin 61e. The conductive path 711g electrically connects a signal pin 41g to a signal pin 61h. The conductive path 711 h electrically connects a signal pin 41h to a signal pin 61g. The conductive path 7Ui electrically connects a signal pin 411 to a signal pin 61j. The conductive path 711j electrically connects a signal pin 41j to a signal pin 6U. The conductive path 7uk electrically connects a signal pin 41k to a signal pin 611. Further, the conductive path yin electrically connects a signal pin 411 to a signal pin 61k. Further, the conductive path 7123 is electrically connected to the power supply pin 42a and the power supply pin 62a, and the conductive path 712b is electrically connected to the power supply pin 42b and the power supply pin 62b. In this manner, the order of the signal pins 41 & to 41 中 in the configuration of the contact pins 4 is different from the order of the signal pins 613 to 61 电 electrically connected to the signal pins 41 & 411. Therefore, the contact pin holder according to the second embodiment can connect the terminals of an electronic device having a terminal configuration different from the terminal configuration of the circuit board to the corresponding terminals of the circuit board. It should be noted that the connection between the contact pins is not limited to the above examples. It is sufficient to determine the connection according to the terminal configuration of the electronic device attached to the contact pin holder and the terminal configuration of the board. In addition, the contact pins 4, 6 can be configured, for example, as a grid array to enable use of a ball grid array, a grid array, and a pin grid array (pin) Grid array) or other terminal configuration 153615. Doc -20- 201145728 to dispose of electronic devices and boards. Further, the connecting member 7 has conductive layers 72, 73, 76 and 77 electrically connected to the ground pins 43a, 43b of the contact pins 4 and the ground pins 63a, 63b of the contact pins 6. The conductive layers 72, 73, 76, 77 are formed such that they sandwich the conductive paths 711a to 7111 in the middle. Therefore, the conductive layers 72, 73, 76, 77 and the conductive paths 711a to 7111 can form a strip line. Further, the width of the conductive path and the distance between the conductive path and the conductive layer are set such that the reflection of the signal between the signal pin and the connecting member 7 becomes a minimum value. Thus, the connecting member 7 can reduce the transmission loss caused by transmitting a high frequency signal between the signal pins through the conductive paths 7a to 7丨丨1. It should be noted that the conductive path and the conductive layer are respectively formed of, for example, a metal such as copper, gold, silver or nickel or the like, or other materials having electrical conductivity. In addition, conductive paths and conductive layers are formed in the substrate 2 using, for example, etching, photolithography, or other fabrication techniques. As explained above, the contact pin holder according to the first embodiment can connect a terminal of an electronic device having a terminal configuration different from a terminal configuration of a circuit board to a corresponding terminal of the circuit board. Next, a contact pin holder according to a third embodiment will be explained. The contact pin holder according to the third embodiment has a signal pin of a coaxial transmission line in the form of a contact pin holder, thereby making the characteristic impedance of the signal pin match the impedance of the electronic device and the circuit board of the operating electronic device. . The contact pin holder according to the second embodiment is different from the connector leg holder according to the first embodiment in that the 'signal pin constitutes a coaxial transmission line. Therefore, the signal pins and the holes will be explained below (the signal pins are inserted into the holes 153615. Doc -21· 201145728) Relevant content. For other contents, reference is made to the explanation relating to the first embodiment. Fig. 14 is a view showing a lateral cross section of one of the substrates of the contact pin holder according to the third embodiment. The length of the hole 30 (the signal pin 41a of the contact pin 4 is inserted into the hole 30) is shorter than the longitudinal length of the signal pin 41a. Therefore, the signal pin 41a is held such that one end of the signal pin 41a is connected to the bottom surface 30d of the hole 30, and the other end portion of the substrate 2 protrudes from the hole 3'. Further, the inner diameter of the central portion 30a of the hole 3 is larger than the outer diameter of the lower portion 412 of the signal pin 413. Further, the inner diameter of the upper end portion 30b and the inner diameter of the lower end portion 30c of the hole 30 are smaller than the inner diameter of the central portion 30a. Further, the inner diameter of the 'lower end portion 3〇1:) is approximately equal to the outer diameter of the upper portion 411 of the signal pin 4U and smaller than the outer diameter of the lower portion 412 of the signal pin 41a. Further, the inner diameter of the lower end portion 30e of the hole 30 is approximately equal to the outer diameter of the lower portion 412 of the signal pin 41a. Therefore, the signal pin 41a is held by the upper end portion 30b and the lower end portion 30e of the hole 30. Further, a conductor 32 is formed at the inner surface of the central portion 3 11 a of the hole 30. The conductor 32 is electrically connected to the ground pin 43a and the ground pin 63a through the conductive layer 72 of the connecting member 7 so that the conductor 32 is grounded. In addition, signal pin 41a is insulated from conductor 32 by being disposed remotely from conductor 32. Thereby, the signal pin 4ia and the conductor 32 constitute a coaxial transmission line. It should be noted that the space between the conductor 32 and the signal pin 41a may be filled with a resin or other dielectric. By appropriately setting the diameter of the signal pin 41a and the distance between the signal pin 41a and the conductor 32, the same 153615 can be given by the signal pin 41a and the conductor 32. Doc • 22- 201145728 The shaft transmission line is approximately equal to a characteristic impedance of the characteristic impedance at the frequency of the signal sent to the electronic device connected to signal pin 41a. Therefore, the contact pin holder can match the characteristic impedance of the signal terminal of the electronic device to the characteristic impedance of the coaxial transmission line formed by the signal pin 41a and the conductor 32, thereby reducing the transmission loss of the signal transmitted through the signal pin 41a. . Similarly, the inner diameter of the central portion 50a of the hole 50 (the signal pin 61a of the contact pin 6 is inserted into the hole 5A) is larger than the outer diameter of the upper portion 61 of the signal pin 61a. Further, the inner surface of the central portion 50a of the hole 50 is formed of a conductor 52. The conductor 52 is electrically connected to the ground pin 43a and the ground pin 63a through the conductive layer 73 of the connecting member 7. Therefore, the conductor 52 is grounded. Further, the signal pin 61a is insulated from the conductor 52 by being disposed at a distance from the conductor 52. Thereby, the signal pin 61a and the conductor 52 constitute a coaxial transmission line. The conductor 33 is formed on the bottom surface 3〇d of the hole 3〇. The conductor 33 is insulated from the conductor 32. On the other hand, the signal pin 41a has a tip end of the contact conductor 33, whereby the signal pin 41a is electrically connected to the conductor 33. Similarly, the top surface 50d of the hole 5 is formed by a conductor 53. The conductor 53 is insulated from the conductor 52. On the other hand, the signal pin 61a has a tip end of the contact conductor 53, whereby the signal pin 61a is electrically connected to the conductor 53. Further, the conductive path 71 of the connecting member 7 electrically connects the conductor 33 with the conductor 53. Further, the conductive path 71 is disposed between the ground conductive layer 72 and the ground. Therefore, the connecting member 7 can form a strip line. It should be noted that 'the vicinity of the surface layer of the substrate 2'. The contact pin holder according to this embodiment may also have a conductive layer connected to the power supply pin (ie, 153615. Doc -23· 201145728 power supply layer 24, 26), conductive layer connected to ground pin (ie, ground layer 25, 27) and dielectric sandwiched between power supply layers 24, 26 and ground layer 25, 27 Layers 22, 23 configure one of the capacitors. As explained above, the contact pin holder according to the third embodiment can be connected to a signal pin of a signal terminal of an electronic device or a circuit board and formed in a hole into which the signal pin is inserted and grounded. A conductor on the inner surface forms a coaxial transmission line. Therefore, the contact pin holder can match the impedance between each signal terminal and the signal pin (for the frequency of the signal transmitted to the electronic device), so that the transmission loss of the signal transmitted through the signal pin can be reduced. In addition, the contact pin holder can also be a connecting member (which connects a signal pin connected to a signal terminal of one electronic device to a signal pin connected to a signal terminal of one of the circuit boards) into a strip line. The structure and thus the signal reflection between the signal pins and the connecting member can be suppressed. In this manner, the contact pin holder can match the impedance of the total path between the signal terminal of one of the electronic devices and the signal terminal of the circuit board to the resistance of each signal terminal. Therefore, the transmission loss of the signal transmitted in the contact pin holder is sufficiently reduced. It should be noted that the present invention is not limited to the above embodiment. For example, in the above embodiment, one of the two grounded conductive layers adjacent to the connecting member 7 connected to the conductive path of the signal pin may be omitted. In this case, the conductive path of the connecting member and a grounded conductive layer may form a micro strip line. Therefore, by adjusting the width of the conductive path of the connecting member 7 and the distance between the conductive path and the grounded conductive layer according to the conductivity of the conductive path and the relative dielectric constant of the base material 21, the connecting member 7 and the letter 153615 can be obtained. Doc -24- 201145728 The signal reflection between one pin remains at a minimum. Furthermore, the connecting member 7 can have a different configuration to achieve a characteristic impedance that is approximately the same as the characteristic impedance of the 彳§ pin at a particular frequency. Furthermore, the contact pins that can be used in the above embodiments can have a so-called "pogopin" configuration. Figure 15 is a view showing a lateral cross section of one of the contact pins 400 that can be used in the contact pin holder according to the above embodiment. The contact pin 4A has an approximately cylindrical pin body 401 inserted into the substrate; a first contact member 402, one end of the self-pinning body 401 (the lower end portion of the illustrated example) Projecting and capable of abutting against a bottom surface of one of the holes formed in the substrate (for example, the hole 3 of FIG. 6) or a terminal of the circuit board not shown; and a second contact member 403 which is one end of the self-pinning body 401 ( The upper end of the illustrated example protrudes and can abut against a top surface of one of the apertures formed in the substrate (e.g., aperture 5 of Figure 6) or a terminal that does not exhibit an electronic device. The pin body 4〇1 and the contact members 402 and 403 are formed of a material having electrical conductivity. Further, the inner diameter of the opening at the upper end portion and the lower end portion of the pin body 4〇 is narrower than the inner diameter at the central portion of the leg body 4〇1. Further, the side of the contact members 4〇2, 4〇3 is formed by a flange which abuts against the lower end portion or the upper end portion of the leg body 401 from the inner side and prevents the contact members 4, 2, 403 from falling from the leg body 401. Further, the inner side of the pin body 40 1 has a property such as a metal spring 404. Further, both 402 and 403 are respectively biased to the lower end or upper end of the pin body 4〇1. The elastic member (having the conductive spring 404 to contact the member)
153615.doc -25- 201145728 軸向方向按壓接觸接腳400之一端部，則與按壓方向相反 之一力作用在接觸構件402、403上，所以使接觸構件 402、403與端子之間之接觸更可靠。因此，接觸接腳400 係可靠地導電性連接至接觸接觸構件402或403(等等）之端 子β 圖16係展示能夠用在根據以上實施例之一接觸接腳支架 中之根據另一實例之一接觸接腳41 0之一側向橫截面的一 視圖。 接觸接腳410具有：一近似圓柱形接腳體411，其由一導 電金屬形成並***至基板中；一細長接腳形柱塞412;及 一盤簧413。柱塞412與盤簧413兩者係由導電金屬形成並 包含在接腳體411内側。 接腳體411具有：一第一部分411 a ,其於下側處敞開； 一第二部分411c，其與第一部分4lia同軸配置；及一傾斜 部分411 b，其具有沿接腳體411之延伸方向逐漸改變並將 第一部分411a與第二部分411c連接在一起的一内徑。接近 接腳體411之下表面開口（例如面向孔或電路板之底面的開 口）的第一部分411a之内徑小於第二部分4Uc(其係接腳體 411之中心部分）之内徑。此外，接腳體411具有在第二部 分411c上方連接至第二部分4Uc並具有窄於第二部分 之一内徑的一第三部分411(1。第三部分411(1係由一頂面開 口形成。 包含在接腳體4U中之盤簧413具有包含在接腳體4ιι之 第二部分4Hc中的一上部分4Ua及與上部分““連接之一 1536I5.doc •26· 201145728 下部分413b ^上部分413a具有實現沿轴向方向（即，接腳 體411之延伸方向）壓縮之彈力。此外，上部分413&具有近 似等於或小於接腳體411之第二部分4Uc之内徑的一外 徑。形成與上部分413a連接之下部分4 13b。相比於在上部 分413a處，彈簧在下部分413b中被更厚地螺旋。此外，下 部分413b之外徑小於上部分4丨3a且近似等於或小於接腳體 411之第一部分41 la之内徑。因此，盤簧413之上部分 413a(即，定位在接腳體411之第二部分4Uc内側的部分）之 直徑大於接腳體411之第一部分4iia之内徑。因此，接腳 體411可防止盤簧413自接腳體411掉落。此外，盤簧413之 上部分413a之長度具有與接腳體411之第二部分4Uc之長 度近似相同之長度。另一方面，盤簧413之下部分41%之 長度長於接腳體411之第一部分4iia。因此’***至接腳 體411中之盤簧413係經設定使得其下部分413b自接腳體 411之下部分之開口突出，且盤簧413之下端部接觸一電路 板之端子或一孔之底面並係電連接。此外，待隨後解釋之 一柱塞412係處於沿向上方向由盤簧413不斷偏置之一狀 態。 此外，盤簧413之下部分413b係經組態使得盤簧4丨3係處 於一自由狀態（未接收壓縮力之狀態）時，彈簧之相鄰圈接 觸。因此，在盤簧413之下部分413b處，由盤簧413及接腳 體411形成的導電路徑之橫截面積變寬，且可使導電路徑 之導電電阻更小。此外，可不是在一螺旋狀態下而是沿近 似平行於盤簧413之延伸方向的一直線形成導電路徑。因 153615.doc 27· 201145728 此，即使將一高頻率信號施加至接觸接 八旁#‘ # ^ ^亦可抑制在此 气處產生電感。在本貫施例中，藉由改變-彈*之外徑 及線圈節距而組態上部分413a及下部分他。因此，可以 低成本製造具有較少數量之部分的彈性構件。 此外’盤簧之下部分亦可經組態使得當彈菁係處於一自 由狀態時彈簧之相鄰圈不接觸，且當電子裝置或電路板係 附接至接觸接腳支架且盤簧被壓縮 ^ 了 I «之下部分之相鄰 圈接觸。當盤簧係經組態使得盤脊 育 < 卜。(W刀之相鄰圈接觸 時’不管盤簧之壓縮程度如何，均形成近似平行於盤寄之 延伸方向的—導電路徑’所以可更可靠地縮短導電替。 另一方面，在接腳體411之第二部分川C處，盤簧413係 稀疏地螺旋，所以盤箬4 1 q目·* Μ “ U盤脊413具有沿接腳體川之縱向方向的 彈力。 在本實施例中，—盤簧係用以形成彈性構件1而，彈 ^構件亦可以其他形式組態。例如’具有不同外徑或彈簧 常數之兩個盤簧可串聯***至接腳體4ιι中。此外， 盤簧可組合成一體。 替代地，盤簧之下部分可由一金屬套管或金屬桿製成。 々卜S上女而附近，可藉由一已知方法而連接該金屬套 管或金屬桿與盤簧之上部分。作為一連接方法，可使用 (例如)機械地接合此等部分之-方法或藉由-導電點著劑 而結合該等部分之—方法。此外’盤簧之上部分足以為具 有導電性之-彈性構件。上部分可由（例如）具有導電性之 彈！·生體i導電材料組態之一氣彈簧、可沿接腳體 J53615.doc -28- 201145728 411之延伸方向壓縮之一板彈簧等等組態。 此外，包含在接腳體411中之一柱塞412電連接電子裝置 之端子或設置在形成於一基板中之一孔之頂面處的一導體 與盤簧413及接腳體411。 柱塞412之上端部自接腳體411之上部分之開口突出，使 得其可靠地接觸電子裝置之端子或設置在形成於基板中之 孔之頂面上的導體。另一方面，柱塞412之下端部係*** 至盤簧413中。此外，沿柱塞412之縱向方向之接近中心部 分係由具有大於柱塞412之其他部分之一直徑的一凸緣 412a形成。柱塞412之底端撞擊盤簧413之頂端。因此，若 藉由電子裝置之一端子或類似物而按壓柱塞412，則柱塞 412向下移動且柱塞412沿接腳體411之縱向方向壓縮盤酱 413。由此’柱塞412與盤簧413可靠地接觸且可防止柱塞 412與盤簧413之間之弱接觸。此外，增加柱塞412及盤簣 413與接腳體411之接觸面積，所以可使通過接腳體411之 來自柱塞412及盤簧413之導電路徑之電阻更小。 應注意’柱塞41 2之長度係經較佳設計使得即使被定位 在柱塞412之運動範圍之下端部處，柱塞412之下端部亦包 含在具有一大内徑的接腳體411之部分（即，第二部分4Uc) 中。藉由以此方式設定柱塞412之長度，可防止柱塞412之 下端部陷入具有一窄直徑的盤簧413之部分中，且當自接 觸接腳支架移除電子裝置或電路板時防止移除柱塞412之 下端部。 此外，當盤簧413係處於一壓縮狀態時，柱塞412之下端 153615.doc -29- 201145728 部較佳地接觸盤簧413之稀疏纏繞部分。若柱塞412接觸盤 簧413之内圓周，則盤簧413彎曲且藉由此彈性反作用力而 由盤簧413推回柱塞412。若此彈性反作用力較大，則盤簧 413與柱塞412之間之摩擦力變大且容易使柱塞412之上下 運動受阻。盤簧413之稀疏纏繞部分之剛度變得低於密集 纏繞部分之剛度。因此’當柱塞412之下端部接觸盤簧413 時’若所接觸之盤簧413之部分係稀疏纏繞，則可減小作 用在柱塞412上之彈性反作用力，由此可使柱塞412之上下 運動平滑。 此外，盤簧413之密集纏繞部分越短越好。較佳地，盤 蒉413之上部分413 a僅包括大致稀疏纏繞之部分。 盤簧413之密集纏繞部分越短，可使展示沿縱向方向之 彈力的部分（即’盤簧413之稀疏纏繞部分）之尺寸越長。因 此’盤簧413之密集纏繞部分越短，柱塞412之運動量越 大。此外，若可使柱塞412之運動量更大，則可使稀疏纏 繞部分之彈簧係數更小。因此，例如，即使沿接觸固持在 接觸接腳支架中之複數個接觸接腳410之上端部的電子裝 置之端子之高度方向（接觸接腳41 0之縱向方向）存在一位置 差異’柱塞412至不同接觸接腳之間之電子裝置端之端子 的接觸壓力波動亦變小，且可獲得一穩定接觸狀態。 此外，接腳體411具有在上部分之開口附近變小之一内 徑。此薄部分鎖住一柱塞41 2之凸緣412a之上端部並限制 柱塞412之運動範圍之上端部》 應注意，根據另一實施例’形成於接觸接腳支架之基板 153615.doc -30· 201145728 中的各孔之内側形狀可形成類似於圖16中所示之接觸接腳 410之接腳體411之内側形狀。此外，亦可在各孔中形成一 導體並配置圖16中所示之接觸接腳410之柱塞412及盤簧 413，如圖16中所示。在此情況中，柱塞412及盤簧413構 成接觸接腳。 如上所解釋’熟習技術者可根據使用模式而在本發明之 範圍内作出各種改變。 【圖式簡單說明】 圖1係根據本發明之一第一實施例之一接觸接腳支架之 一透視圖； 圖2係展示沿圖i之線之一接觸接腳支架之一側向橫截 面的一視圖； 圖3係根據第一實施例之一接觸接腳支架之一基板之一 平面圖； 圖4係根據第一實施例之接觸接腳支架之一基板之一仰 視圖； 圖5係展示一基板（展示一連接構件之結構）之平面透明 圖的一視圖； 圖6係展示沿圖5之„_„之一基板之一側向橫截面的一視 圖； 圖7係展示沿圖siuwn之一基板之一側向橫截面的— 視圖； 圖8係根據第一實施例之一修改方案之一基板之一平面 透明圖； 153615.doc •31- 201145728 圖9係展示沿圖8之IV-IV之一基板之一側向橫截面的一 視圖； 圖1 〇係根據一第二實施例之一接觸接腳支架之一基板之 一平面圖； 圖Π係根據第二實施例之接觸接腳支架之一基板之一仰 視圖； 圖12係展示一連接構件7之結構的一基板之一平面透明 圖； 圖13係展示沿圖12之一線V-V之一基板之一側向橫截 面的一視圖； 圖14係展示根據一第三實施例之一接觸接腳支架之一基 板之一側向橫截面的一視圖； 圖15係展示能夠用在根據若干實施例之接觸接腳支架中 之一接觸接腳之一側向橫截面的一視圖； 圖16係展示能夠用在根據若干實施例之接觸接腳支架中 之一接觸接腳之另一實例之一側向橫截面的一視圖。 【主要元件符號說明】 1 接觸接腳支架 2 基板 3, 5, 30, 50 孔 4, 6, 400, 410 接觸接腳 7 連接構件 8 導引體 21 基底材料 153615.doc •32· 201145728 22, 23 介電層 24, 25, 26, 27 導電層 41a 至 411, 61a 至 611 信號接腳 42a, 42b, 62a, 62b 電力供應接腳 43a, 43b, 63a, 63b 接地接腳 71 至 78 導電層 711a至 7111, 741a至 741f，751a至 751f 導電路徑 100 導引型接觸接腳支架 153615.doc -33-153615.doc -25- 201145728 When one end of the contact pin 400 is pressed in the axial direction, a force opposite to the pressing direction acts on the contact members 402, 403, so that the contact between the contact members 402, 403 and the terminal is further improved. reliable. Thus, the contact pin 400 is a terminal that is reliably electrically conductively coupled to the contact contact member 402 or 403 (and the like). FIG. 16 shows another embodiment that can be used in contact with the pin holder according to one of the above embodiments. A view of a lateral cross section of one of the contact pins 41 0 . The contact pin 410 has an approximately cylindrical pin body 411 formed of a conductive metal and inserted into the substrate; an elongated pin-shaped plunger 412; and a coil spring 413. Both the plunger 412 and the coil spring 413 are formed of a conductive metal and are contained inside the pin body 411. The pin body 411 has a first portion 411a that is open at the lower side, a second portion 411c that is coaxially disposed with the first portion 4lia, and a sloped portion 411b that has an extension direction along the pin body 411. An inner diameter that gradually changes and connects the first portion 411a with the second portion 411c. The inner diameter of the first portion 411a adjacent to the lower surface opening of the pin body 411 (e.g., the opening facing the bottom surface of the hole or the circuit board) is smaller than the inner diameter of the second portion 4Uc (which is the central portion of the leg body 411). Further, the pin body 411 has a third portion 411 (1. The third portion 411 is connected to the second portion 4Uc above the second portion 411c and has an inner diameter narrower than the one of the second portions. The opening is formed. The coil spring 413 included in the pin body 4U has an upper portion 4Ua included in the second portion 4Hc of the pin body 4ι and a portion connected to the upper portion "1536I5.doc •26·201145728 The upper portion 413a has an elastic force that is compressed in the axial direction (i.e., the extending direction of the pin body 411.) Further, the upper portion 413& has an inner diameter approximately equal to or smaller than the inner diameter of the second portion 4Uc of the pin body 411. An outer diameter, forming a portion 4 13b connected to the upper portion 413a. The spring is spirally thicker in the lower portion 413b than at the upper portion 413a. Further, the outer diameter of the lower portion 413b is smaller than the upper portion 4丨3a and It is approximately equal to or smaller than the inner diameter of the first portion 41 la of the pin body 411. Therefore, the diameter of the upper portion 413a of the coil spring 413 (i.e., the portion positioned inside the second portion 4Uc of the pin body 411) is larger than the pin body. The inner diameter of the first part of 411, 4iia. Therefore, The body 411 prevents the coil spring 413 from falling from the leg body 411. Further, the length of the upper portion 413a of the coil spring 413 has a length approximately the same as the length of the second portion 4Uc of the pin body 411. On the other hand, the coil spring 41% of the lower portion of 413 is longer than the first portion 4iia of the pin body 411. Therefore, the coil spring 413 inserted into the pin body 411 is set such that the lower portion 413b protrudes from the opening of the lower portion of the leg body 411. And the lower end portion of the coil spring 413 contacts the terminal of a circuit board or the bottom surface of a hole and is electrically connected. Further, one of the plungers 412 to be explained later is in a state of being constantly biased by the coil spring 413 in the upward direction. Further, the lower portion 413b of the coil spring 413 is configured such that the coil spring 4丨3 is in a free state (a state in which the compressive force is not received), and the adjacent rings of the spring are in contact. Therefore, the portion below the coil spring 413 At 413b, the cross-sectional area of the conductive path formed by the coil spring 413 and the pin body 411 is widened, and the conductive resistance of the conductive path can be made smaller. Further, instead of being in a spiral state, it is approximately parallel to the disk. The straight line forming of the extending direction of the spring 413 Electrical path. Because 153615.doc 27· 201145728, even if a high frequency signal is applied to the contact side #' # ^ ^ can also suppress the generation of inductance at this gas. In this example, by changing - The upper part 413a and the lower part are configured by the outer diameter of the bomb * and the pitch of the coil. Therefore, the elastic member having a smaller number of parts can be manufactured at a low cost. In addition, the lower part of the coil spring can also be configured to be When the elastic crystal system is in a free state, the adjacent loops of the spring are not in contact, and when the electronic device or the circuit board is attached to the contact pin holder and the coil spring is compressed, the adjacent ring of the lower part of I « is contacted. When the coil spring is configured to make the disc spine < (When the adjacent rings of the W-knife are in contact, the conductive path is formed approximately parallel to the direction in which the disk is extended regardless of the degree of compression of the coil spring. Therefore, the conductive substitution can be shortened more reliably. On the other hand, in the pin body In the second part of 411, at the C, the coil spring 413 is sparsely spiraled, so the disk 箬 4 1 q mesh·* Μ "The U disk ridge 413 has an elastic force in the longitudinal direction of the pin body. In this embodiment, - The coil spring is used to form the elastic member 1. The elastic member can also be configured in other forms. For example, two coil springs having different outer diameters or spring constants can be inserted in series into the pin body 4 ι. In addition, the coil spring Alternatively, the lower portion of the coil spring may be made of a metal sleeve or a metal rod. In the vicinity of the female, the metal sleeve or the metal rod and the disc may be connected by a known method. The upper portion of the spring. As a joining method, for example, a method of mechanically joining the parts or a method of combining the parts by a conductive pointing agent may be used. Conductive-elastic member. The upper part can be For example, a conductive bomb! · A body gas conductive material configuration, a gas spring, can be configured along the extension of the pin body J53615.doc -28- 201145728 411 to compress a plate spring, etc. In addition, included in One of the pins 412 of the pin body 411 is electrically connected to the terminal of the electronic device or a conductor and the coil spring 413 and the pin body 411 disposed at the top surface of one of the holes formed in a substrate. The opening from the upper portion of the leg body 411 protrudes such that it reliably contacts the terminal of the electronic device or the conductor disposed on the top surface of the hole formed in the substrate. On the other hand, the lower end portion of the plunger 412 is inserted into Further, the central portion in the longitudinal direction of the plunger 412 is formed by a flange 412a having a diameter larger than one of the other portions of the plunger 412. The bottom end of the plunger 412 strikes the top end of the coil spring 413. Therefore, if the plunger 412 is pressed by one terminal or the like of the electronic device, the plunger 412 moves downward and the plunger 412 compresses the dish sauce 413 in the longitudinal direction of the pin body 411. Thus, the 'plunger 412' Reliable contact with the coil spring 413 and preventing the plunger The weak contact between the 412 and the coil spring 413. In addition, the contact area between the plunger 412 and the cartridge 413 and the pin body 411 is increased, so that the conductive path from the plunger 412 and the coil spring 413 can be passed through the pin body 411. The resistance is smaller. It should be noted that the length of the plunger 41 2 is preferably designed such that even if it is positioned at the end below the range of motion of the plunger 412, the lower end of the plunger 412 is included in a larger inner diameter. In the portion of the pin body 411 (i.e., the second portion 4Uc), by setting the length of the plunger 412 in this manner, the lower end portion of the plunger 412 can be prevented from sinking into a portion of the coil spring 413 having a narrow diameter, and The lower end of the plunger 412 is prevented from being removed when the electronic device or circuit board is removed from the contact pin holder. Further, when the coil spring 413 is in a compressed state, the lower end 153615.doc -29-201145728 of the plunger 412 preferably contacts the sparsely wound portion of the coil spring 413. If the plunger 412 contacts the inner circumference of the coil spring 413, the coil spring 413 is bent and pushed back to the plunger 412 by the coil spring 413 by the elastic reaction force. If the elastic reaction force is large, the frictional force between the coil spring 413 and the plunger 412 becomes large and the upper and lower movement of the plunger 412 is easily blocked. The rigidity of the sparsely wound portion of the coil spring 413 becomes lower than the rigidity of the densely wound portion. Therefore, 'when the lower end of the plunger 412 contacts the coil spring 413', if the portion of the coil spring 413 that is in contact is sparsely wound, the elastic reaction force acting on the plunger 412 can be reduced, thereby making the plunger 412 The motion above and below is smooth. Further, the densely wound portion of the coil spring 413 is as short as possible. Preferably, the upper portion 413a of the cartridge 413 includes only a portion that is substantially sparsely wound. The shorter the densely wound portion of the coil spring 413, the longer the size of the portion showing the elastic force in the longitudinal direction (i.e., the sparsely wound portion of the coil spring 413). Therefore, the shorter the densely wound portion of the coil spring 413, the larger the amount of movement of the plunger 412. Further, if the amount of movement of the plunger 412 can be made larger, the spring coefficient of the sparsely wound portion can be made smaller. Therefore, for example, there is a positional difference 'plunger 412' even in the height direction of the terminal of the electronic device (the longitudinal direction of the contact pin 41 0) of the electronic device held at the upper end portion of the plurality of contact pins 410 in the contact pin holder. The contact pressure fluctuations to the terminals of the electronic device terminals between the different contact pins are also small, and a stable contact state can be obtained. Further, the pin body 411 has an inner diameter which becomes smaller near the opening of the upper portion. The thin portion locks the upper end of the flange 412a of the plunger 41 2 and limits the upper end of the range of movement of the plunger 412. Note that, according to another embodiment, the substrate 153615.doc formed on the contact pin holder is The inner shape of each of the holes in 30·201145728 can form an inner shape similar to the pin body 411 of the contact pin 410 shown in FIG. Further, a conductor may be formed in each of the holes and the plunger 412 and the coil spring 413 of the contact pin 410 shown in Fig. 16 may be disposed as shown in Fig. 16. In this case, the plunger 412 and the coil spring 413 constitute contact pins. As explained above, the skilled person can make various changes within the scope of the invention depending on the mode of use. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a contact pin holder according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view showing one of the contact pin holders along the line of FIG. Figure 3 is a plan view of one of the substrates of the contact pin holder according to the first embodiment; Figure 4 is a bottom view of one of the substrates of the contact pin holder according to the first embodiment; Figure 5 is a view A view of a planar transparent view of a substrate (showing the structure of a connecting member); Fig. 6 is a view showing a lateral cross section of one of the substrates along the line of Fig. 5; Fig. 7 is a view along the siuwn of Fig. A side cross-section of a substrate; FIG. 8 is a plan transparent view of a substrate according to one of the modifications of the first embodiment; 153615.doc • 31- 201145728 FIG. 9 shows an IV along FIG. A view of a lateral cross section of one of the substrates of FIG. 1; FIG. 1 is a plan view of a substrate of one of the contact pin holders according to a second embodiment; FIG. 1 is a contact pin holder according to the second embodiment One of the substrates is a bottom view; Figure 12 is a connection A planar transparent view of a substrate of the structure of the structure 7; FIG. 13 is a view showing a lateral cross section of one of the substrates along a line VV of FIG. 12; FIG. 14 is a view showing a contact according to a third embodiment. A view of a lateral cross-section of one of the substrates of the foot support; Figure 15 is a view showing a lateral cross-section of one of the contact pins that can be used in a contact pin holder in accordance with several embodiments; A view showing a lateral cross-section of one of the other examples of contact pins of one of the contact pin supports according to several embodiments is shown. [Main component symbol description] 1 Contact pin holder 2 Substrate 3, 5, 30, 50 Hole 4, 6, 400, 410 Contact pin 7 Connection member 8 Guide body 21 Base material 153615.doc •32· 201145728 22, 23 dielectric layer 24, 25, 26, 27 conductive layers 41a to 411, 61a to 611 signal pins 42a, 42b, 62a, 62b power supply pins 43a, 43b, 63a, 63b ground pins 71 to 78 conductive layer 711a To 7111, 741a to 741f, 751a to 751f Conductive path 100 Guide type contact pin holder 153615.doc -33-