201145672 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種藉由在相對向之一對電極間之電磁 柄*、進行資訊通訊的天線裝置、以及組裝有該天線裝置 的通訊裝置。 【先前技術】 近年來，已開發一種系統，用以在電腦或小型可攜式 終端機等電子機器間，不透過纜線或媒體而以無線進行音 樂、圖像等之資料的傳送。在此種無線傳送***，係有可 在數cm之近距離進行最大56〇Mbps左右的高速傳送者。在 此種可円速傳送之傳送系統中，Transferjet(註冊商標）係具 有通訊距離較短、被竊聽之可能性低且傳送速度快的優點。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna device for performing information communication by an electromagnetic handle* opposed to a pair of electrodes, and a communication device incorporating the antenna device. [Prior Art] In recent years, a system has been developed for wirelessly transmitting data such as music and images between electronic devices such as computers and small portable terminals without using cables or media. In such a wireless transmission system, it is possible to perform high-speed transmission of up to 56 Mbps at a short distance of several cm. In such a transport system capable of idling, the Transferjet (registered trademark) has the advantages of a short communication distance, a low probability of being eavesdropped, and a high transfer speed.
Transferjet(註冊商標）中，係可藉由隔著超近距離相對 應之高頻耦合器的電磁耦合進行，其訊號品質則取決於高 頻耦合器之性能。例如，專利文獻丨所記述之高頻耦合器 係由在一面形成有接地之印刷基板、形成在印刷基板之另 一面之微帶狀（microstrip)構造的短柱（stub)、耦合用電極、 以及連接該耦合用電極與截線（stub)的金屬線所構成。又， 專利文獻1所記述之通訊裝置中，在構成高頻耦合器之印 刷基板上，亦形成有收發訊電路。 專利文獻1 :曰本特開2008 - 3 1 1 8 1 6號公報 【發明内容】 3 201145672 然而，如專利文獻丨所記 面構裝组裝之之通°R裝置般，將藉由表 ^組裝之收發訊電路與構^ 3維之高_合器 於同一印刷基板上，從構裝製# -置 m 技製程之觀點，有步驟既複雜且 :知作上亦必需注意等而導致生產效率變差的問題… 。。利文獻1所記述之通訊裝置中，在欲另外作成高頻輕合 2，不受收發訊電路之配置位置限制，以更自由地配置叙 =電極’連接於收發訊電路的情況下…將高頻轉合 盗連接於《訊電路，在印刷基板料必需另有連接 境線等連接手段，而有零件或步驟會增加的問題。 本發明係有鑑於此種情形而提出，以提供一種可實現 高生產效率，同時與進行收發訊處理之收發訊電路維持良 好連接性，而且不受收發訊電路之配置位置限制，能自由 地配置耦合用電極的天線裝置為目的。又，本發明係以提 供一種組裝有該天線裝置的通訊裝置為目的。 作為用以解決上述課題之手段’本發明之天線裝置， 係藉由在相對向之一對電極間的電磁耦合以進行資訊通 汛，其特徵在於，具備：印刷基板，係透過電介質於一面 的導電層形成有接地層，於另一面之導電層則形成有傳送 5扎號的訊號線；耗合用電極’係由大致平面狀之導體構成， 可與配置於相對向之位置之其他天線裝置的電極電磁耗合 以進行通訊；以及電極柱，係使形成於該印刷基板之訊號 線與該耦合用電極，於該印刷基板之厚度方向離開既定距 離而電氣連接；在該訊號線之一端，係形成有可與進行訊 號之收發訊處理的收發訊裝置電氣連接的連接用端子部； 4 201145672 该印刷基板之中’至少形成有 取有該連接用端子部之端 部具有撓性。 子形成 又，本發明之通訊裝置 ^ „ 係藉由在配置於相對向之位 置之其他通訊裝置之電極間的 位 j幻電磁耦合進行資訊通 特徵在於，具備··印刷基板 ° '、 . 係透過電介質於一面的導雷 層形成有接地層，於另一面之道 € 訊號線，·耦合用電極，係由+ τ 錢的 ^ ^係、由大致平面狀之導體構成，可盥 配置於相對向之位置之其他 ，、 —、 大線裝置的電極電磁耦合以進 行通訊；電極柱’係使形成於 於w亥印刷基板之訊號線與該耦 合用電極，於該印刷基板之厘 、土 4厚度方向離開既定距離而電氣 連接’·以及收發訊處理部，係 你遵過形成於該訊號線之一端 的連接用端子部電氣連接以進行訊號之收發訊處理；該印 刷基板之中’至少形成有該連接用端子部之端子形成部具 有撓性。 本發明’由於藉由電極柱電氣連接訊號線與搞合用電 且印刷基板之中至少形成有連接用端子部之端子形成 有撓性’因此可實現高生產效率’同時與進行收發訊 處理之收發訊電路維持良好連接性，而且不受收發訊電路 之配置位置限制’能自由地配置耦合用電極。 【實施方式】 以下，針對用以實施本發明之形態，一邊參照圖式一 邊詳、’、田地加以說明。此外，本發明並非僅限制於以下之實 施形‘i、在不超出本發明之要旨的範圍内，當然可作各種 201145672 變更。 <通訊系統〉 應用本發明之天線裝置係一種藉由在相對向之一對電 極間之電磁耦合以進行資訊通訊的裝置，例如如圖丨所示 之組裝於可進行560Mbps左右之高速傳送的通訊系統1〇〇 使用者。 通訊系統100係由2個進行資料通訊之通訊裝置丨〇 i， W5構成。此處，通訊裝置1〇1係具備具有電極1〇3之高頻 輕合器102、以及收發訊電路1〇4。又，通訊裝置1〇5係具 備具有電極107之高頻耦合器1〇6、以及收發訊電路1〇8。 如圖1所示，使通訊裝置1〇1，105各自所具備之高頻 麵合器10 2，10 6相向配置時，2個電極1 〇 3，1 〇 7係作為1 個電容器動作’整體即以帶通濾波器般地動作，藉此在2 個高頻耦合器102，106之間，便可高效率地傳達用以實現 例如560Mbps左右之高速傳送之4〜5ghz頻帶的高頻訊 號。 此處’高頻耦合器102，106各自所具有之收發訊用電 極103，107，例如係離開3cm左右且相對向配置而可進行 電場麵合。 通訊系統100中，例如，從高階應用程式產生發訊要 求時’連接於高頻耦合器102之收發訊電路部104,即根據 發訊資料產生高頻發訊訊號，將訊號從電極丨〇3傳輸往電 極107°接著’連接於收訊側之高頻耦合器1〇6的收發訊電 路部108 ’即對收訊後之高頻訊號進行解調及解碼處理，再 6 201145672 將重現後之資料交付給高階應用程式。 此外，應用本發明之天線裝置並不限制於上述之傳達4 〜5GHz頻帶的高頻訊號者’亦可應用於其他頻帶之訊號傳 達，不過以下之具體例中，係以4〜5GHz頻帶之高頻訊號 作為傳達對象加以說明。 <第1實施形態> -作為組裝於此種通訊***1〇〇之天線裝置，針對圖2A 所示之第1實施形態的高頻耦合器〗1〇加以說明。 亦即’高頻搞合器110係具備撓性印刷基板丨、耦合用 電極8、以及將形成於撓性印刷基板i上之訊號線3與輕合 用電極8予以電氣連接的電極柱7。 撓性印刷基板1係—種將銅箔配置於具有電介質功能 之基材4之兩面且具有撓性的雙面印刷基板，以一面的導 電層為接地2,於另一面的導電層則藉由圖案處理形成有訊 號線3。 撓I1生印刷基板1之基材4係介電性較導電層更優異之 物質’例如係25〜125 " m厚度之具有撓性的介電性材料， 尤-以由聚醯亞胺、液晶聚合物、及鐵氟龍等低介電係數 且介電損失較小之材料構成者較佳。 耦合用電極8係由大致平面狀之導體構成，可與配置 於相對向之位置之其他天線裝置的電極電磁#合以進行通 訊。此種耗合用電⑮8如上述般係以大致平面狀之導體設 置成圓形、四角形、多角形等之形狀，就材料而言，較佳 為使用鋼、黃銅、及不銹鋼等具有剛性之良導體。 201145672 電極柱7係使其在撓性印刷基板丨之厚度方向h離開 既定距離，並將形成於撓性印刷基板丨之訊號線3、以及耦 合用電極8予以電氣連接。此種電極柱7係具有與耦合用 電極8同樣剛性之良導體，以焊料等具有導電性之接合材 分別接合耦合用電極8與訊號線3 » 為了提升此種連接材之電氣可靠性、及機械強度，較 佳為在被接合部分較電極柱7之徑更擴大訊號線3之線寬 並以導電性材料設置成可獲得充分之接合強度，進一步實 施以有機接著劑等來補強接合後之部分之周圍等的處置亦 佳。 電極柱7係可與耦合用電極8分別地製作再予以連 接或者將麵合用電極8之一部分予以加工以與_合用電 極8製作成一體物。又，在圖2A中所示之高頻柄合器丨丨〇， 電極柱7雖設為丨支’不過由於亦擔負支承耦合用電極8 之功能’因此為了提升強度亦可設為複數支。又，電極柱7 雖接合於耦合用電極8之中心附近，不過在以複數支使用 時’較佳為亦接合於耦合用電極8之中心附近。例如，如 圖2B所不’在使用複數支電極柱’具體而言使用2支時， 當考量到電極柱71，72與訊號線3之連接狀態時，雖有訊 號線3之線寬較狹窄而無法納入線寬内的情形，不過此時 係將訊號線3之中，接合部3b之線寬局部地擴大來加以接 合。 由以上之構成所形成之高頻柄合器110中，針對形成 於挽性印刷基板1上之訊號線3的構成具體 地加以說明。 201145672 讯號線3係於其一端將可與進行訊號之收發訊處理之收發 訊電路部電氣連接的連接用端子部9,形成在撓性印刷基板 1之端子形成部la，另一端則藉由通孔5與接地2作短路處 理。例如，訊號線3係藉由設於通孔5之導電性鍍膜或導 電性糊等來貫通基# 4以接合於接& 2，II此作μ路處理。 此外，與接地2之連接係為了電氣短路，亦可藉由貫通帶 等之導電性之柱來連接訊號線3與接地2。 又，圖2Α及圖2Β中所示之高頻耦合器11〇中，為了 提高通訊感度’訊號線3之中，具有共振線3a之功能，該 共振線3a係將從藉由通孔5作短路處理之端部起至與電極 柱7之連接點為止的距離設為離開通訊頻率之大致4分之^ 波長的整數倍。 以此方式’共振線3a係、用以提升其他高頻麵合器所具 備之耦合用電極與該高頻耦合器11〇之耦合用電極8的耦 合效率’如上述般藉由連接於接地2，而成為短路截線㈣州 ，由於在該部分電壓因此若從該部分起在線上將 電極柱7連接於通訊頻率之大致4分< i波長的距離，則 在該連接點電壓會最大而使耦合效率良好。以此方式，共 振線3a係擔負著提升高頻耦合器間之耦合效率的功能。 此外’圖2A及圖2B所示之高頻耗合器ιι〇中，雖將 訊號線3之共振線3a#1的端部作為透過通孔$之短路截線 ，不過亦可作為設置成開路端之開路截線（open 。然*，在該開路截線的情況下，亦必需如上述般調 整共振線3a之長度，以在共振線3a與電極柱7之接μ使 9 201145672 電壓最大。又，圖2A及圖2B所示之高頻耦合器ho中， 雖於撓性印刷基板1上形成有丨個透過通孔5設為短路截 線之共振線3 a，不過亦可使用複數個，藉此可引起更強之 共振。 又，訊號線3之線形狀並不一定要設置成直線狀，亦 可設置成使其具有曲率之曲線狀，或者彎折成如圖2A及圖 2B所不般使用。 由於連接用端子部9，如上述般，係形成於訊號線3之 舳°卩，且形成在具有撓性之撓性印刷基板1上的端子形 成部la，因此易於與連接於高頻耦合器11〇之收發訊電路 的基板連接。 此處，連接用端子部9之端子形狀，係配合與收發訊 電路。P之連接方法來設計。從實現良好之連接性的觀點， 連接用端子部9之端子形狀，較佳為例如如圖3a及圖3B 所示之對應連接器之連接的端子構造。 圓3A所不之具體例之連接用端子部29,係對應QSG(接 地/ 號/接地）配置之連接器，為了將接地與訊號線配置於 同平面，6又有與連接器電氣嵌合用之訊號端子5〇與接地 端子51、以及補強板2〇。 汛號端子5 0係藉由在構成於撓性印刷基板21之單面 的訊號線23之端部’將線寬調整成連接器連接用而形成。 接地端子51係從形成於撓性印刷基板21之一面的接 地22透過形成於通孔25内側之導電性材料電氣連接。 補強板20係為了使其在連接用端子部29具有機械強 201145672 度而接著於接地22，以易於進行對連接器之插拔，並且可 確保嵌合之穩定性、及可靠性。就補強板2G之材料而言， 一般係使用硬質之樹脂、及陶究等。 由以上方式構成之連接用端子部29，為了實現與連接 益銷之良好連接性，若使訊號端子5〇與接地端子5 1之線 寬一定，則在連接用端子部29特性阻抗會與訊號線23大 幅不同，有時會因阻抗不匹配而顯著地降低高頻輕合器之 耦合效率。在此種情況下’如圖3B所示，視需要藉由以適 切之比例於訊號端子50正下方之接地22設置切口 27，即 可調整連接用端子部29之特性阻抗，以防止高頻耗合器之 效率降低。以此方式製作之高頻耗合器11〇，係透過配置於 收發訊電路之連接器與收發訊電路部連接。將具體之連接 例表示於圖4及圖5。 圖4係表示朝向同一方向配置高頻耦合器ιι〇、以及透 過連接器m與高頻輕合n 11G連接之㈣訊電路基板ιΐ2 的情形。又’圖5係表示以背靠背配置高頻耦合器ιι〇、以 及透過連接器m與高頻麵合器110連接之收發訊電路基 板m的情形。從該等2種配置可知，由於高頻耗合器ιι〇 係使用具有撓性之撓性印刷基板丨所構成，因此可自由地 彎折使用，對設置場所之自由度極高。 以此方式，由於應用本發明之高頻耦合器n〇，係藉由 電極柱7使形成於撓性印刷基…之一面的訊號線3、以及 耦合用《 8電氣連接’連接用端子部9係形成^具有挽 性之撓性印刷基板i，因此可實現高生產效率㈣與進行收 201145672 良好之連接性，而且不因收發 ’自由地配置耦合用電極。 發訊處理之收發訊電路維持 訊電路之配置位置而受限制 此外，在高頻耦合器110,欲如上述般可自由地彎折使 用’以實現提高對設置場所之自由度’構裝訊號線3之印 刷基板中，只要在具有撓性之基板上，形成有至少形成有 連接用端子部9的端子形成部la即可。例如，如硬質挽性 基板般，亦可使用將環氧樹脂等硬質材料與撓性材料予以 複合之基板’於硬質基板上構裝電極柱等，於撓性基板上 構裝連接端子部。以此方式，雖亦可使用硬質撓性基板， 不過高頻輕合H 11〇係藉由全部使用具有撓性之撓性印刷 基板1作為印刷基板，在可將構件共通化以簡化製造步驟 之點尤佳。 又，高頻耦合器11"，除了如上述般將連接用端 部9設置成連接器連接用之端子構造以外亦可藉由例 使用異向性導電膜（ACF)、異向性導電糊（Acp)等^導電 糊的方法接合。尤其，在使用此種導電性糊時，由於無 確保端子之剛性，因此可省略㈣板2G，在可謀求薄型 之點較佳。 此種使用導電性糊之接合方法中，由於一般係使接合 面相對向連接，因此與上述圖4所示之配置同樣地，在使 收發訊電路基板112與高頻耦合器11〇朝向同—方向配置 的情況下，如圖6所示，必需將收發訊電路基板ιΐ2之與 構裝面112a相反侧的底面i12b作為接合部U3連接。、 又，在收發訊電路基112冑，當無法於與該構裝面 12 201145672 相反側之面構裝連接用端子，或者因高頻耦合器11()之配 置的問題’而欲將接合部113設置於收發訊電路基板112 之構裝面112a的情況下，藉由使用圖7A及圖7B所示之連 接用端子部39，即可進行端子面之正反面切換。 連接用子部39係具有以下之端子構造。亦即，如圖 7A及圖7B所示，連接用端子部39係藉由將接地32圖案 化以製作訊號端子60與接地端子61，訊號端子6〇係藉由 通孔35内之導體與形成在與接地32相對向之面的訊號線 33連接。在連接用端子部39,為了提升高頻耦合器ιι〇之 耦合效率，亦以配合特性阻抗較佳，訊號端子6〇與接地端 子61之間隔，係考量該特性阻抗來決定。尤其，連接用端 子邻39係具有共面構造之端子構造，由於端子間之間隔變 乍’因此在特性阻抗整合困難的情況下，可將藉由通孔與 接地32接合之接地端子設置於與訊號線33同一面，以調 整特性阻抗°又’在端子間之間隔相較於訊號端子60及接 地端子61之端子寬度過窄的情況下，由於以acf等之連接 中’接著材之埋設部分會變少而無法確保充分之連接強 :因此較佳為將訊號端子6〇及接地端子61設為雙股構 ^ ,以增加接著材之埋設部分。 具有此種端子構造之連接用端子部39，如圖8所示， 接：進行與準備在收發訊電路基板112之構裝面112a之連 配=⑴相對向的連接，而可構成與使用連接器時同樣的 、為了 5周查第1實施形態之高頻耦合器i 1〇的性 13 201145672 能，使用Ansoft公司製之3維電磁場模擬器HFSS進行了 通訊特性之解析。 解析模式，係具體之條件為使用以下者，以作為圖2a 之構成的高頻耦合器110。亦即，設想撓性印刷基板丨係在 基材4使用50/zm之液晶聚合物的雙面銅箔基板耦合用 電極8係直徑i〇mm之薄銅板，電極柱7則為直徑〇 4mm、 高度2.4mm之鐵製柱。此外，連接用端子部9係設置成嵌 合於〇.5mm間距之低高度連接器的構造。 解析了在使以此方式構成之2個高頻耦合器u〇a, 1 l〇b,如圓9所示般相對向，於一高頻耦合器丨i〇a之端子 施加輸入訊號，並以另一高頻耦合器11〇1)之端子收受訊號 時的耦合強度❶此處，耦合強度係使用3參數之透射特性 S21來評估。 圖1〇係表示將圖9之相對向之高頻耦合器之耦合用電 極間的對向距離分別設置成15随、1〇〇_時之耦合強度 S 2 1的頻率特性。 例如，Transferjet(註冊商標）之通訊中，雖使用以 4.48GHz為中心之頻率，不過在該頻帶中，在對向距離15職 之耦合狀態下’ S21係從—_至一細而在通訊頻率附 近可獲得平坦頻率特性。又，在對向距離⑽咖之非搞合 狀態下，S2H系-42dB而可獲得通訊阻斷性。 從該頻率特性可知，第1實施形態之高頻耗合器110 在刀離lGGmm左右之狀態下，並無串擾同時在15_左右 之近距離亦可進行利用電磁麵合之資訊通訊。 201145672 <第2實施形態> 其次，作為應用本發明之天線裝置的另一實施形態， 針對圖11所示之第2實施形態之高頻耦合器120的構成加 以說明。 與上述第1實施形態之高頻耦合器Π 0同樣地，高頻 耦合器1 20係具備撓性印刷基板1、耗合用電極8、以及將 形成於撓性印刷基板1上之訊號線3與耗合用電極8予以 電氣連接的電極柱7。此外，高頻耦合器12〇係具備用以保 持耦合用電極8之作為固定構件的上部基板16。 此處，相對於第1實施形態之高頻耦合器n〇中，由 於耦合用電極8係透過較細之電極柱7保持，因此強度較 弱，在使完成品移動時必需加以注意，而本實施形態之高 頻柄120’自於係藉由上部基板16牢固地保持搞合用 電極8,因此可提高耦合用電極8之物理性強度，以防止因 衝擊或加壓等所造成的變形。亦即，易於高頻柄合器12〇 之移動的操作。 此外本實施形態之高頻輕合器12〇，除了具有上部基 板6以外由於與上述第4施形態之高頻搞合器所 具備之構成相同’因此在圖u中賦予同樣之符號並省略 針對各元件之說明。 a田-裡構成所形成之高頻耗合器12〇中，由於藉由 邛基板16保持耦合用電極8， U此藉由例如以下之連接 來連接耦合用電極8與訊號線3。 亦即，高頻耦合器120中，係蘊 ^ α _ 你鞴由於上部基板16之 15 201145672 面，亦即圊η所示之上面16a實施鍍覆處理等，而形成耦 合用電極8。接著’高頻耦合器120中，係對耦合用電極8 之中心與上部基板16 一起藉由開貫通孔處理而形成通孔 7a。該通孔73係配合訊號線3之既定位置使上部基板a 2 一面，亦即圖η之下面16b接著於撓性印刷基板卜接 著，藉由透過該ii?L 7a t鑛覆處理或導電性糊等所形成的 電極柱7,將耦合用電極8與訊號線3予以電氣連接。 此外，上述連接方法係電氣連接方法之一例，亦可使 用例如將與麵合用電極8連接之針狀電極柱7***至經過 链覆處理之具有通孔7a之上部基板16的通孔部，或者藉由 導電性糊與訊號線3連接等的方法。又，圖u所示之高頻 耦合器120巾，搞合用電極8雖直接形成於上部基板16之 上面16a’不過亦可設置成將耦合用電極8形成於在單面形 成有銅羯等導電層之撓性基板之導電層並貼附於上面16& 的構造，或者如上述圖2A及圖2B所示，設置成以導電性 金屬薄板為耦合用電極8並貼附於上面16a的構造。亦即， 兩頻耦合器120中，只要能使耦合用電極8與訊號線3，以 隔著屬介電體基板之上部基板16而離開既定距離之狀態電 氣連接，則使用任一種連接方法皆可。 就上部基板1 6之材料而言，尤其係以使用介電係數較 低之材料較佳。例如，圖12係表示將上部基板16之介電 係數設定於1.5、2.0，其以外之條件則設成與在圖u所獲 得之結果相同，來解析時之耦合強度S21的頻率特性。從 "亥解析結果可知，若提高上部基板丨6之介電係數，則因波 16 201145672In Transferjet (registered trademark), the electromagnetic coupling is performed by a high-frequency coupler corresponding to a super close distance, and the signal quality depends on the performance of the high-frequency coupler. For example, the high-frequency coupler described in the patent document is a stub, a coupling electrode, and a microstrip structure formed on one surface of a printed circuit board, and a microstrip structure formed on one surface of the printed circuit board. The coupling electrode and the metal wire of the stub are connected. Further, in the communication device described in Patent Document 1, a transmission circuit is also formed on the printed circuit board constituting the high frequency coupler. Patent Document 1: 曰本特开 2008 - 3 1 1 8 1 6 (Invention) 3 201145672 However, as in the case of the assembly and assembly of the patent document, it will be by the table ^ The assembled transceiver circuit and the three-dimensional high-synthesis device are on the same printed circuit board. From the viewpoint of the manufacturing process, the steps are complicated and the production must be paid attention to, etc., resulting in production. The problem of poor efficiency... . In the communication device described in the document 1, in order to separately create the high frequency light combination 2, it is not restricted by the arrangement position of the transmission circuit, and the case where the connection electrode is connected to the transmission circuit is more freely arranged... The frequency conversion thief is connected to the "information circuit, and there must be a connection means such as a connecting line in the printed substrate material, and there are problems that the parts or steps may increase. The present invention has been made in view of such circumstances to provide a high-efficiency, while maintaining good connectivity with a transceiver circuit for performing transmission and reception processing, and is freely configured without being limited by the configuration position of the transceiver circuit. The antenna device for the coupling electrode is for the purpose. Further, the present invention has an object of providing a communication device in which the antenna device is assembled. As an means for solving the above problems, the antenna device of the present invention is configured to perform information communication by electromagnetic coupling between a pair of opposing electrodes, and is characterized in that: the printed circuit board is provided with a dielectric substrate on one side. The conductive layer is formed with a ground layer, and the conductive layer of the other surface is formed with a signal line transmitting 5 horns; the consuming electrode ' is composed of a substantially planar conductor and can be disposed with other antenna devices disposed at opposite positions. The electrode is electromagnetically coupled for communication; and the electrode column is configured such that the signal line formed on the printed substrate and the coupling electrode are electrically connected away from a predetermined distance in a thickness direction of the printed substrate; at one end of the signal line A terminal portion for connection that can be electrically connected to a transceiver device that performs signal transmission and reception processing is formed. 4 201145672 In the printed circuit board, at least an end portion in which the terminal portion for connection is formed is formed to have flexibility. Further, the communication device of the present invention is characterized in that the information is transmitted by the positional electromagnetic coupling between the electrodes of the other communication devices disposed at the opposite positions, and the printed circuit board is provided. A grounding layer is formed on the conductive layer on one side of the dielectric, and the signal line on the other side is a signal line of + τ money, which is composed of a substantially planar conductor, and can be disposed on the opposite side. To the other positions, the electrodes of the large-line device are electromagnetically coupled for communication; the electrode column 'is the signal line formed on the printed circuit board and the coupling electrode, and the electrode 4 of the printed substrate The thickness direction is away from the predetermined distance and is electrically connected. The transmission and reception processing unit is electrically connected to the connection terminal portion formed at one end of the signal line for signal transmission and reception processing; at least the formation of the printed substrate The terminal forming portion having the terminal portion for the connection has flexibility. The present invention 'is electrically connected to the signal line by the electrode column and is used for at least the printed circuit board. The terminal having the terminal portion for connection is formed with flexibility 'so that high productivity can be achieved' while maintaining good connectivity with the transceiver circuit for performing transmission and reception processing, and is freely configured without being limited by the arrangement position of the transceiver circuit. [Embodiment] Hereinafter, the embodiment for carrying out the present invention will be described with reference to the drawings, and the description will be made in detail. The present invention is not limited to the following embodiment of the present invention. Within the scope of the gist of the present invention, of course, various changes can be made to 201145672. <Communication System> The antenna device to which the present invention is applied is a device for performing information communication by electromagnetic coupling between a pair of opposite electrodes, for example, The communication system 100 is composed of two communication devices 丨〇i, W5 for data communication, as shown in Fig. 1. The communication system 100 is composed of two communication devices 进行i, W5 for data communication. 1 is a high-frequency combiner 102 having an electrode 1〇3, and a transceiver circuit 1〇4. Further, the communication device 1〇5 is provided with electricity. The high frequency coupler 1〇6 of 107 and the transceiver circuit 1〇8. As shown in Fig. 1, when the high frequency plane units 10 2 and 106 of the communication devices 1〇1 and 105 are arranged facing each other, The two electrodes 1 〇3,1 〇7 are operated as one capacitor, and the whole is operated like a band-pass filter, thereby enabling efficient communication between the two high-frequency couplers 102 and 106. A high-frequency signal of a frequency of 4 to 5 GHz which is transmitted at a high speed of, for example, about 560 Mbps. Here, the transmitting and receiving electrodes 103 and 107 of the high-frequency couplers 102 and 106 are separated from each other by, for example, about 3 cm. In the communication system 100, for example, when a transmission request is generated from a high-order application, the transmission and reception circuit unit 104 connected to the high-frequency coupler 102 generates a high-frequency transmission signal according to the transmission data, and the signal is transmitted from The electrode 丨〇3 is transmitted to the electrode 107°, and then the 'transceiver circuit unit 108' connected to the high frequency coupler 1〇6 of the receiving side demodulates and decodes the high frequency signal after receiving the signal, and then 6 201145672 Deliver the regenerated data to high-end applications . In addition, the antenna device to which the present invention is applied is not limited to the above-mentioned high-frequency signal transmitting the frequency band of 4 to 5 GHz, and can be applied to signal transmission in other frequency bands, but in the following specific example, it is high in the 4 to 5 GHz band. The frequency signal is explained as a communication object. <First Embodiment> - As an antenna device incorporated in such a communication system, the high frequency coupler of the first embodiment shown in Fig. 2A will be described. That is, the high frequency combiner 110 includes a flexible printed circuit board 丨, a coupling electrode 8, and an electrode post 7 for electrically connecting the signal line 3 formed on the flexible printed circuit board i and the light combining electrode 8. The flexible printed circuit board 1 is a double-sided printed circuit board in which a copper foil is disposed on both sides of a substrate 4 having a dielectric function and has flexibility. The conductive layer on one surface is grounded 2, and the conductive layer on the other side is used. The pattern processing is formed with a signal line 3. The substrate 4 of the flexible printed substrate 1 is a material having a dielectric property superior to that of the conductive layer, for example, a flexible dielectric material having a thickness of 25 to 125 " m, in particular, by polyimine, Liquid crystal polymers, and materials such as Teflon which have a low dielectric constant and a small dielectric loss are preferred. The coupling electrode 8 is formed of a substantially planar conductor and can be combined with the electrode electromagnetic # of another antenna device disposed at a position facing the communication. As described above, the consumable power 158 is formed in a substantially planar shape in a circular shape, a quadrangular shape, a polygonal shape, or the like. In terms of material, it is preferable to use rigidity such as steel, brass, or stainless steel. Good conductor. 201145672 The electrode post 7 is separated from the thickness direction h of the flexible printed circuit board by a predetermined distance, and the signal line 3 formed on the flexible printed circuit board and the coupling electrode 8 are electrically connected. The electrode post 7 is a good conductor having the same rigidity as the coupling electrode 8, and the coupling electrode 8 and the signal line 3 are bonded to each other by a conductive material such as solder to improve the electrical reliability of the connecting material. The mechanical strength is preferably such that the diameter of the electrode column 7 is wider than the diameter of the electrode column 7 and is made of a conductive material so that sufficient bonding strength can be obtained, and further bonding is performed by an organic adhesive or the like. Part of the surrounding treatment is also good. The electrode column 7 can be separately formed and connected to the coupling electrode 8 or a part of the surface electrode 8 can be processed to form an integral body with the _ combination electrode 8. Further, in the high-frequency shank 丨丨〇 shown in Fig. 2A, the electrode column 7 is provided as a dam, but the function of supporting the coupling electrode 8 is also taken. Therefore, it is also possible to set a plurality of branches for the purpose of improving the strength. Further, the electrode post 7 is joined to the vicinity of the center of the coupling electrode 8, but it is preferably joined to the vicinity of the center of the coupling electrode 8 when used in a plurality of branches. For example, as shown in FIG. 2B, when two columns are used, in particular, when two electrodes are used, when the connection between the electrode columns 71, 72 and the signal line 3 is considered, the line width of the signal line 3 is narrow. However, it is not possible to incorporate the line width. However, in this case, the line width of the joint portion 3b is partially expanded and joined in the signal line 3. In the high-frequency shank 110 formed by the above configuration, the configuration of the signal line 3 formed on the flexible printed circuit board 1 will be specifically described. 201145672 The signal line 3 is formed at one end of the terminal portion 9 for electrically connecting to the transmission and reception circuit portion for performing signal transmission and reception processing, and is formed at the terminal forming portion 1a of the flexible printed circuit board 1 at the other end. The through hole 5 and the ground 2 are short-circuited. For example, the signal line 3 is connected to the base #4 by a conductive plating film or a conductive paste provided in the via hole 5 to be bonded to the junction & 2, II for the μ path processing. Further, the connection to the ground 2 is for electrical shorting, and the signal line 3 and the ground 2 may be connected by a conductive column such as a through tape. Further, in the high-frequency coupler 11A shown in FIG. 2A and FIG. 2A, in order to improve the communication sensitivity, the signal line 3 has the function of the resonance line 3a, and the resonance line 3a will be made by the through hole 5. The distance from the end portion of the short-circuit treatment to the connection point with the electrode post 7 is set to be an integral multiple of the wavelength of approximately four minutes from the communication frequency. In this way, the 'resonance line 3a is used to improve the coupling efficiency of the coupling electrode provided in the other high-frequency combiner and the coupling electrode 8 of the high-frequency coupler 11' as described above by being connected to the ground 2 And become a short-circuit stub (4) state, because the voltage is at this portion, if the electrode column 7 is connected to the communication frequency at a distance of approximately 4 minutes < i wavelength from the portion, the voltage at the connection point will be the largest. The coupling efficiency is good. In this way, the resonance line 3a is responsible for improving the coupling efficiency between the high frequency couplers. In addition, in the high-frequency power absorbing device shown in FIG. 2A and FIG. 2B, the end portion of the resonance line 3a#1 of the signal line 3 is used as a short-circuited line through the through-hole $, but it can also be set as an open circuit. The open cut line of the end (open *, *, in the case of the open cut line, it is also necessary to adjust the length of the resonant line 3a as described above, so that the resonance of the resonant line 3a and the electrode column 7 maximizes the voltage of 9 201145672. Further, in the high-frequency coupler ho shown in FIG. 2A and FIG. 2B, a plurality of resonance lines 3a which are short-circuited by the through-holes 5 are formed in the flexible printed circuit board 1, but a plurality of them may be used. Therefore, the shape of the signal line 3 does not have to be linear, and may be set to have a curvature curve or be bent as shown in FIGS. 2A and 2B. Since the terminal portion 9 for connection is formed in the signal line 3 and formed on the terminal forming portion 1a on the flexible printed circuit board 1 as described above, it is easy to be connected to The substrate of the transmission and reception circuit of the high frequency coupler 11 is connected. Here, the terminal portion 9 for connection The shape of the terminal is designed in accordance with the connection method of the transceiver circuit P. From the viewpoint of achieving good connectivity, the terminal shape of the terminal portion 9 for connection is preferably a corresponding connection as shown, for example, in FIGS. 3a and 3B. Terminal structure for connecting the device. The terminal portion 29 for the specific example of the circle 3A is a connector corresponding to the QSG (ground/number/ground) arrangement. In order to arrange the ground and the signal line in the same plane, 6 The signal terminal 5〇 and the ground terminal 51 for electrically fitting the connector, and the reinforcing plate 2〇. The nickname terminal 50 is formed by the end portion of the signal line 23 formed on one side of the flexible printed circuit board 21 The line width is adjusted to be connected to the connector. The ground terminal 51 is electrically connected to the conductive material formed inside the through hole 25 from the ground 22 formed on one surface of the flexible printed circuit board 21. The reinforcing plate 20 is for The terminal portion 29 for connection has a mechanical strength of 201145672 degrees and is connected to the ground 22 to facilitate the insertion and removal of the connector, and to ensure the stability and reliability of the fitting. In terms of the material of the reinforcing plate 2G, generally use In the connection terminal portion 29 which is configured as described above, in order to achieve good connection with the connection pin, if the line width between the signal terminal 5〇 and the ground terminal 51 is constant, the connection is made. The characteristic impedance of the terminal portion 29 is significantly different from that of the signal line 23, and the coupling efficiency of the high-frequency combiner is sometimes significantly reduced due to impedance mismatch. In this case, as shown in FIG. 3B, By providing the slit 27 at a proper ratio to the ground 22 immediately below the signal terminal 50, the characteristic impedance of the terminal portion 29 for connection can be adjusted to prevent the efficiency of the high-frequency dissipator from being lowered. 11〇, connected to the transceiver circuit unit through a connector disposed in the transceiver circuit. Specific connection examples are shown in Figs. 4 and 5. Fig. 4 shows a case where the high-frequency coupler ιι 朝向 is disposed in the same direction, and the (four)-channel circuit board ι 2 is connected to the high-frequency light-fitting n 11G through the connector m. Further, Fig. 5 shows a case where the high-frequency coupler ιι is disposed back to back, and the transmission circuit board m is connected to the high-frequency combiner 110 through the connector m. As can be seen from these two types of configurations, since the high-frequency accommodator is configured by using a flexible flexible printed circuit board, it can be freely bent and used, and the degree of freedom in the installation place is extremely high. In this manner, since the high-frequency coupler n〇 of the present invention is applied, the signal line 3 formed on one surface of the flexible printed substrate by the electrode post 7 and the terminal portion 9 for connection of the "8 electrical connection" for coupling are used. Since the flexible printed circuit board i having the tractability is formed, it is possible to achieve high productivity (4) and good connection with the 201145672, and the coupling electrode is not freely disposed by the transmission and reception. In addition, in the high-frequency coupler 110, the high-frequency coupler 110 can be freely bent and used as described above to realize the purpose of improving the degree of freedom in the installation place. In the printed circuit board of 3, the terminal forming portion 1a in which at least the connection terminal portion 9 is formed may be formed on the flexible substrate. For example, as in the case of a hard-drawing substrate, a substrate which is a composite material of a hard material such as an epoxy resin and a flexible material may be used, and an electrode column or the like may be formed on a rigid substrate, and a terminal portion may be formed on the flexible substrate. In this way, although a rigid flexible substrate can be used, the high-frequency light-bonding H 11 藉 is made by using all of the flexible flexible printed circuit board 1 as a printed substrate, and the components can be commonized to simplify the manufacturing steps. Point is especially good. Further, the high-frequency coupler 11" may be provided by using an anisotropic conductive film (ACF) or an anisotropic conductive paste (Example), except that the connection end portion 9 is provided as a terminal structure for connector connection as described above. Acp) is a method of bonding a conductive paste. In particular, when such a conductive paste is used, since the rigidity of the terminal is not ensured, the (4) plate 2G can be omitted, and it is preferable to be thin. In the bonding method using the conductive paste, since the bonding faces are generally connected to each other, the transmitting circuit board 112 and the high-frequency coupler 11 are oriented in the same manner as in the arrangement shown in FIG. 4 described above. In the case of the directional arrangement, as shown in FIG. 6, it is necessary to connect the bottom surface i12b of the transmission circuit board ι2 on the opposite side to the structuring surface 112a as the joint portion U3. Further, in the transmission/reception circuit base 112, the connection terminal is not mounted on the surface opposite to the mounting surface 12201145672, or the joint portion 113 is intended due to the problem of the arrangement of the high-frequency coupler 11(). When the mounting surface 112a of the transmission circuit board 112 is provided, the terminal surface 39 shown in FIGS. 7A and 7B can be used to switch the front and back surfaces of the terminal surface. The connection sub-portion 39 has the following terminal structure. That is, as shown in FIG. 7A and FIG. 7B, the terminal portion 39 for connection is patterned by the ground 32 to form the signal terminal 60 and the ground terminal 61, and the signal terminal 6 is formed by the conductors in the through hole 35. Connected to the signal line 33 facing the ground 32. In the connection terminal portion 39, in order to improve the coupling efficiency of the high-frequency coupler, the matching characteristic impedance is also preferable, and the interval between the signal terminal 6A and the ground terminal 61 is determined by considering the characteristic impedance. In particular, the connection terminal adjacent 39 has a terminal structure having a coplanar structure, and since the interval between the terminals is changed, the ground terminal connected to the ground 32 by the through hole can be disposed in a case where the characteristic impedance is difficult to integrate. The signal line 33 is on the same side to adjust the characteristic impedance. In addition, when the interval between the terminals is too narrow compared to the terminal width of the signal terminal 60 and the ground terminal 61, the buried portion of the bonding material is connected in the connection of acf or the like. There will be less and it is impossible to ensure a sufficient connection: therefore, it is preferable to set the signal terminal 6〇 and the ground terminal 61 to a double-strand structure to increase the buried portion of the bonding material. As shown in FIG. 8, the connection terminal portion 39 having such a terminal structure is connected to the connection surface 112a to be mounted on the interface 112a of the transmission circuit board 112, and can be connected to the connection. In the same manner, the frequency of the high-frequency coupler i 1〇 of the first embodiment was examined for five weeks. 201145672 The communication characteristics of the three-dimensional electromagnetic field simulator HFSS manufactured by Ansoft Co., Ltd. were used. The analysis mode is specifically a condition in which the following is used as the high frequency coupler 110 of the configuration of Fig. 2a. In other words, it is assumed that the flexible printed circuit board is a double-sided copper foil substrate coupling electrode 8 having a liquid crystal polymer of 50/zm in the base material 4, and a thin copper plate having a diameter of i〇mm, and the electrode column 7 has a diameter of 〇4 mm. Iron column with a height of 2.4mm. Further, the terminal portion 9 for connection is provided in a structure in which it is fitted to a low-height connector having a pitch of mm5 mm. It is analyzed that the two high-frequency couplers u〇a, 1 l〇b configured in this manner are opposed to each other as shown by the circle 9, and an input signal is applied to the terminals of a high-frequency coupler 丨i〇a, and The coupling strength at the time when the terminal of the other high frequency coupler 11 〇 1) receives the signal ❶ Here, the coupling strength is evaluated using the transmission characteristic S21 of the three parameters. Fig. 1 is a view showing the frequency characteristics of the coupling strength S 2 1 when the opposing distance between the coupling electrodes of the high-frequency coupler of Fig. 9 is set to 15 and 1 〇〇, respectively. For example, in the communication of Transferjet (registered trademark), although the frequency centered on 4.48 GHz is used, in this frequency band, in the coupling state of the opposite distance 15, the S21 system is from -_ to a fine communication frequency. Flat frequency characteristics are available nearby. Further, in the state of the opposite distance (10), the S2H system is -42 dB, and the communication blocking property can be obtained. As is apparent from the frequency characteristics, the high-frequency inductor 110 of the first embodiment can perform information communication using electromagnetic surface bonding without a crosstalk at a distance of about 15 gram in a state where the blade is separated by about GGmm. 201145672 <Second Embodiment> Next, a configuration of the high frequency coupler 120 according to the second embodiment shown in Fig. 11 will be described as another embodiment of the antenna device to which the present invention is applied. In the same manner as the high-frequency coupler Π 0 of the first embodiment, the high-frequency coupler 208 includes the flexible printed circuit board 1, the consuming electrode 8, and the signal line 3 formed on the flexible printed circuit board 1. The electrode column 7 for electrically connecting the electrode 8 is electrically connected. Further, the high frequency coupler 12 is provided with an upper substrate 16 as a fixing member for holding the coupling electrode 8. Here, in the high-frequency coupler n〇 of the first embodiment, since the coupling electrode 8 is held by the thin electrode column 7, the strength is weak, and it is necessary to pay attention to the movement of the finished product. Since the high-frequency handle 120' of the embodiment firmly holds the engaging electrode 8 by the upper substrate 16, the physical strength of the coupling electrode 8 can be improved to prevent deformation due to impact or pressurization. That is, it is easy to operate the movement of the high-frequency gripper 12〇. In addition, the high-frequency combiner 12A of the present embodiment is the same as the configuration of the high-frequency combiner of the fourth embodiment except for the upper substrate 6, and therefore the same reference numerals are given to the drawings in FIG. Description of each component. In the high-frequency dissipator 12A formed by the field structure, the coupling electrode 8 is held by the crucible substrate 16, and the coupling electrode 8 and the signal line 3 are connected by, for example, the following connection. That is, in the high-frequency coupler 120, the coupling electrode 8 is formed by performing a plating treatment or the like on the upper surface 16a of the upper substrate 16 on the surface of 201145672. Next, in the high-frequency coupler 120, the center of the coupling electrode 8 is processed together with the upper substrate 16 by the open via hole to form the via hole 7a. The through hole 73 is matched with the predetermined position of the signal line 3 so that one side of the upper substrate a 2 , that is, the lower surface 16 b of the figure η is next to the flexible printed circuit board, and then through the ii?L 7a t ore treatment or conductivity The electrode column 7 formed by paste or the like electrically connects the coupling electrode 8 and the signal line 3. Further, the connection method is an example of an electrical connection method, and for example, a needle electrode column 7 connected to the surface-sealing electrode 8 may be inserted into a through-hole portion of the upper substrate 16 having the through hole 7a subjected to the chain treatment, or A method in which a conductive paste is connected to the signal line 3 or the like. Further, the high-frequency coupler 120 shown in Fig. u is formed directly on the upper surface 16a' of the upper substrate 16, but the coupling electrode 8 may be formed to have a conductive such as a copper bead formed on one surface. The conductive layer of the flexible substrate of the layer is attached to the structure of the upper surface 16 & or as shown in FIG. 2A and FIG. 2B described above, the conductive metal thin plate is provided as the coupling electrode 8 and attached to the upper surface 16a. In other words, in the two-frequency coupler 120, any one of the connection methods can be used as long as the coupling electrode 8 and the signal line 3 can be electrically connected to each other with a predetermined distance apart from the upper substrate 16 of the dielectric substrate. can. As far as the material of the upper substrate 16 is concerned, it is particularly preferable to use a material having a low dielectric constant. For example, Fig. 12 shows that the dielectric constant of the upper substrate 16 is set to 1.5 and 2.0, and the other conditions are the same as those obtained in Fig. u, and the frequency characteristics of the coupling strength S21 at the time of analysis are obtained. From the results of the "Hai analysis, if the dielectric constant of the upper substrate 丨6 is increased, the wave is 16 201145672
長縮短效應而導致县苜+ & A ”’…、耦s強度為尖峰之頻率會移動至低 頻侧，而且耗合強唐ς 9 ] ' 會變小。尖峰頻率雖可藉由變更 共振線3 a或其他尺寸& 寸而調整成在4.48GHZ附近，不過卻 無法將上部基板16之介雷從奴私a ± 電係數較向時之耦合強度S21的位 準，提升至與上部基板16之介電係數較低時的位準。 從此、’。果可知，較佳為於上部基板丄6盡可能使用介電 糸數較低之材料’例如可舉介電係數為有效數$【位且2 早位之鐵氣龍、液晶聚合物等為候選，不過尤其在欲提升 T強度的情況下’較佳為使用使屬低介電材料之敗樹 月曰、聚乙烯、聚醯亞胺等發泡所製作之介電係數有效數字丄 位且1單位之多孔質材料。 士以上般’第2實施形態之高頻耗合器120中，由於 輕。用電極8與§fL號線3係隔著上部基板16離開既定距離 電氣連接’因此可保持通訊特性同時提高輕合用電極8之 物理性強度，以防止因衝擊或加壓等所造成的變形。 【圖式簡單說明】 圖1係表示組裝有應用本發明之天線裝置之通訊系統 的構成。 一圖2A係表不屬應用本發明之天線裝置之第丨實施形態 之高頻耦合器的構成’圖⑼係表示屬應用本發明之天線裝 之第1實施形態之變形例之高頻耦合器的構成。 圖3A係表不第丨實施形態之高頻耦合器的端子構造， 圖3B係表示第1實施形態之高頻耦合器的端子構造。 17 201145672 圖4係表示將高頻搞合薄读 路之配置的簡略圖。 ° “連接於收發訊電 圖5係表示將高頻耦合器透過連接 路之另—配置㈣略圖。 ^連接於收發訊電 圖6係表示將高頻 發訊電路之配置的簡略藉由導電性接著劑連接於收 造，施形態之高頻輕合器的另-端子構 造。’、不丨實施形態之高頻耦合器的另一端子構 圖 發Λ電路之另一配置的簡略圖 係表示將高頻耦合器藉由導電性接著劑連接於收 I 另一？5?.番 ΛΑ 系表不在阿頻耦合器間之通訊狀態的立體圖。 率特性：係表示高頻耦合器間之耦合強度之解析結果的頻 :11係表示應用本發明之天線裝置之第2實施形態之 问頻耦合器的構成。 之缸4圖12係表不第2實施形態之高頻耦合器間之耦合強度 之解析結果的頻率特性圖。 【主要元件符號說明】 1 撓性印刷基板 端子形成部 接地 訊號線 1 a 2 3 18 201145672 3a 共振線 3b 接合部 4 基材 5 通孔 7 電極柱 7a 通孔 8 耦合用電極 9 連接用端子部 16 上部基板 16a 上面 16b 下面 20 補強板 21 撓性印刷基板 22 接地 23 訊號線 25 通孔 27 切口 29 連接用端子部 32 接地 33 訊號線 35 通孔 39 連接用端子部 50 訊號端子 51 接地端子 19 201145672 60 61 71，72 100 101, 105 102, 106 103, 107 104, 108The long shortening effect causes the county 苜+ & A ′′..., the frequency of the coupling s intensity to be a peak will move to the low frequency side, and the consumption of strong ς ς 9 ] ' will become smaller. The peak frequency can be changed by changing the resonance line. 3 a or other dimensions & inch is adjusted to be near 4.48 GHZ, but it is impossible to raise the level of the dielectric constant of the upper substrate 16 from the slave a ± electrical coefficient to the coupling strength S21 to the upper substrate 16 The level at which the dielectric constant is low. From this, it is understood that it is preferable to use a material having a lower dielectric constant as much as possible in the upper substrate '6, for example, a dielectric constant is a significant number of $[bits. And 2 early iron gas dragons, liquid crystal polymers, etc. are candidates, but especially in the case of increasing the T intensity, it is better to use the low dielectric material of the tree, polyethylene, polyimine A porous material having a dielectric constant of a number of units and having a dielectric constant of 1 unit is used. The high-frequency inductor 120 of the second embodiment is lighter. The electrode 8 and the §fL line 3 are used. Electrically connected away from the upper substrate 16 by a predetermined distance' thus maintaining communication characteristics The physical strength of the light-combining electrode 8 is increased to prevent deformation due to impact or pressurization, etc. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the configuration of a communication system in which an antenna device to which the present invention is applied is assembled. 2A is a configuration of a high-frequency coupler according to a second embodiment of the antenna device to which the present invention is applied. FIG. 9 shows a configuration of a high-frequency coupler according to a modification of the first embodiment to which the antenna package of the present invention is applied. Fig. 3A shows the terminal structure of the high frequency coupler according to the embodiment of the present invention, and Fig. 3B shows the terminal structure of the high frequency coupler according to the first embodiment. 17 201145672 Fig. 4 shows that the high frequency is combined with the thin reading path. A simplified diagram of the configuration. ° "Connecting to the transmission and reception diagram 5 is a diagram showing the arrangement of the high-frequency coupler through the connection path (four). Connection to Transceiver 6 Fig. 6 is a diagram showing the arrangement of a high-frequency transmission circuit by means of a conductive adhesive to a further terminal structure of a high-frequency combiner. The other terminal configuration of the high-frequency coupler of the embodiment is a schematic diagram showing another configuration of the circuit, which means that the high-frequency coupler is connected to the other by the conductive adhesive. 5?. Fan ΛΑ is not a perspective view of the communication state between the A/F couplers. Rate characteristic: a frequency indicating an analysis result of the coupling strength between the high-frequency couplers: 11 is a configuration of a frequency-frequency coupler according to the second embodiment to which the antenna device of the present invention is applied. Fig. 12 is a frequency characteristic diagram showing an analysis result of the coupling strength between the high frequency couplers of the second embodiment. [Description of main component symbols] 1 Flexible printed circuit board terminal forming part grounding signal line 1 a 2 3 18 201145672 3a Resonance line 3b Bonding part 4 Substrate 5 Through hole 7 Electrode post 7a Through hole 8 Coupling electrode 9 Connection terminal part 16 Upper substrate 16a Upper surface 16b Lower surface 20 Reinforcement plate 21 Flexible printed circuit board 22 Ground 23 Signal line 25 Through hole 27 Notch 29 Connection terminal part 32 Grounding 33 Signal line 35 Through hole 39 Connection terminal part 50 Signal terminal 51 Ground terminal 19 201145672 60 61 71,72 100 101, 105 102, 106 103, 107 104, 108
110, 110a, 110b, 120 111 112 112a 112b 113 H 訊號端子 接地端子 電極柱 通訊糸統 通訊裝置 高頻耦合器 電極 收發訊電路 高頻耦合器 連接器 收發訊電路基板 構裝面 底面 接合部 厚度方向 20110, 110a, 110b, 120 111 112 112a 112b 113 H signal terminal ground terminal electrode column communication system communication device high frequency coupler electrode transceiver circuit high frequency coupler connector transceiver circuit board assembly surface bottom joint thickness direction 20