TW201144944A - Positive type resist composition and method for producing microlens - Google Patents
Positive type resist composition and method for producing microlensInfo
- Publication number
- TW201144944A TW201144944A TW100102644A TW100102644A TW201144944A TW 201144944 A TW201144944 A TW 201144944A TW 100102644 A TW100102644 A TW 100102644A TW 100102644 A TW100102644 A TW 100102644A TW 201144944 A TW201144944 A TW 201144944A
- Authority
- TW
- Taiwan
- Prior art keywords
- resist composition
- group
- type resist
- positive type
- alkali
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/02—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
- C07D405/06—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a carbon chain containing only aliphatic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010014505 | 2010-01-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201144944A true TW201144944A (en) | 2011-12-16 |
| TWI548943B TWI548943B (zh) | 2016-09-11 |
Family
ID=44319178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100102644A TWI548943B (zh) | 2010-01-26 | 2011-01-25 | 正型光阻組成物及微透鏡之製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8722311B2 (zh) |
| EP (1) | EP2530524B1 (zh) |
| JP (1) | JP5673963B2 (zh) |
| KR (1) | KR101852523B1 (zh) |
| CN (1) | CN102725691B (zh) |
| TW (1) | TWI548943B (zh) |
| WO (1) | WO2011093188A1 (zh) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8940470B2 (en) * | 2007-05-17 | 2015-01-27 | Nissan Chemical Industries, Inc. | Photosensitive resin and process for producing microlens |
| CN102317343B (zh) * | 2009-02-10 | 2013-07-31 | 日产化学工业株式会社 | 含有长链亚烷基的环氧化合物 |
| EP2530098A4 (en) * | 2010-01-26 | 2015-09-09 | Nissan Chemical Ind Ltd | HARDENABLE EPOXY RESIN COMPOSITION WITH LOW-CHAIN ALKYLENE |
| DE102010028062A1 (de) * | 2010-04-22 | 2011-10-27 | Evonik Degussa Gmbh | Verfahren zur Herstellung vernetzter organischer Polymere |
| JP5804282B2 (ja) * | 2010-08-05 | 2015-11-04 | 日産化学工業株式会社 | 窒素含有環を有するエポキシ化合物 |
| KR101734189B1 (ko) | 2010-08-05 | 2017-05-11 | 닛산 가가쿠 고교 가부시키 가이샤 | 시아누르산 골격을 갖는 에폭시 화합물의 제조방법 |
| KR101252063B1 (ko) | 2011-08-25 | 2013-04-12 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도 |
| EP2762517A4 (en) * | 2011-09-29 | 2015-05-06 | Nissan Chemical Ind Ltd | LIGHT-CURING RESIN COMPOSITION |
| KR101456025B1 (ko) * | 2011-11-01 | 2014-11-03 | 한국생산기술연구원 | 알콕시실릴기를 갖는 이소시아누레이트 에폭시 화합물, 이의 제조 방법 및 이를 포함하는 조성물과 경화물 및 이의 용도 |
| KR101992845B1 (ko) | 2012-03-14 | 2019-06-27 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 화합물, 이를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법 |
| EP2835373B1 (en) | 2012-04-02 | 2019-09-11 | Korea Institute of Industrial Technology | Epoxy compound having alkoxysilyl group, composition and hardened material comprising same, use for same, and production method for epoxy compound having alkoxysilyl group |
| KR101863111B1 (ko) | 2012-07-06 | 2018-06-01 | 한국생산기술연구원 | 노볼락계 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도 |
| US9464074B2 (en) * | 2012-10-25 | 2016-10-11 | Nissan Chemical Industries, Ltd. | Method for producing epoxy compound |
| KR102229661B1 (ko) * | 2013-10-21 | 2021-03-18 | 닛산 가가쿠 가부시키가이샤 | 포지티브형 감광성 수지 조성물 |
| KR20150068899A (ko) * | 2013-12-12 | 2015-06-22 | 제이엔씨 주식회사 | 포지티브형 감광성 조성물 |
| EP3034527B1 (de) | 2014-12-19 | 2017-05-31 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Bis-(alkenylamid)-Verbindungen |
| CN104892586B (zh) * | 2015-05-31 | 2017-05-10 | 黄山华惠科技有限公司 | 制备异氰脲酸三缩水甘油酯的新方法 |
| KR20190056088A (ko) * | 2017-11-16 | 2019-05-24 | 롬엔드하스전자재료코리아유한회사 | 감광성 수지 조성물 및 이로부터 제조된 경화막 |
| KR20210052452A (ko) | 2018-08-30 | 2021-05-10 | 닛산 가가쿠 가부시키가이샤 | 네가티브형 감광성 수지조성물 |
| KR102232340B1 (ko) | 2019-11-15 | 2021-03-26 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체 |
| CN114945611A (zh) * | 2020-02-03 | 2022-08-26 | 太阳油墨制造株式会社 | 固化性组合物、其干膜和固化物 |
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| US5101264A (en) | 1988-03-31 | 1992-03-31 | Mitsui Petrochemical Ind. | Light-emitting or receiving device with smooth and hard encapsulant resin |
| JPH01251745A (ja) * | 1988-03-31 | 1989-10-06 | Mitsui Petrochem Ind Ltd | 発光または受光装置および発光または受光素子用封止剤 |
| JPH04166944A (ja) * | 1990-10-31 | 1992-06-12 | Mitsubishi Kasei Corp | 感光性樹脂組成物 |
| JPH0695386A (ja) * | 1992-09-11 | 1994-04-08 | Tosoh Corp | マイクロレンズ用ポジ型感光材料 |
| JP3482753B2 (ja) * | 1994-11-28 | 2004-01-06 | 日産化学工業株式会社 | 粉体塗料用樹脂組成物 |
| CN1073603C (zh) * | 1994-11-28 | 2001-10-24 | 日产化学工业株式会社 | 用于粉末涂料的树脂组合物 |
| SE9704643D0 (sv) * | 1997-12-12 | 1997-12-12 | Astra Ab | Inhalation apparatus and method |
| CN1237400C (zh) * | 2001-09-27 | 2006-01-18 | Az电子材料（日本）株式会社 | 感光树脂组合物 |
| WO2003087941A1 (fr) * | 2002-04-18 | 2003-10-23 | Nissan Chemical Industries, Ltd. | Composition de resine positivement photosensible et procede de formation de motifs |
| JP4692219B2 (ja) * | 2004-10-29 | 2011-06-01 | Ｊｓｒ株式会社 | ポジ型感光性絶縁樹脂組成物およびその硬化物 |
| DE602005021812D1 (de) * | 2004-10-29 | 2010-07-22 | Jsr Corp | Positiv lichtempfindliche isolierende harzzusammensetzung und ausgehärtetes produkt davon |
| JP2008007782A (ja) * | 2006-06-27 | 2008-01-17 | Lumination Llc | オプトエレクトロニックデバイス |
| US20070295983A1 (en) | 2006-06-27 | 2007-12-27 | Gelcore Llc | Optoelectronic device |
| US20070299162A1 (en) | 2006-06-27 | 2007-12-27 | Gelcore Llc | Optoelectronic device |
| US20070295956A1 (en) | 2006-06-27 | 2007-12-27 | Gelcore Llc | Optoelectronic device |
| US7745104B2 (en) * | 2006-08-10 | 2010-06-29 | Shin-Etsu Chemical Co., Ltd. | Bottom resist layer composition and patterning process using the same |
| JP4823959B2 (ja) * | 2006-08-10 | 2011-11-24 | 信越化学工業株式会社 | レジスト下層膜材料及びパターン形成方法 |
| JP4973876B2 (ja) * | 2007-08-22 | 2012-07-11 | 信越化学工業株式会社 | パターン形成方法及びこれに用いるパターン表面コート材 |
| EP2216355A4 (en) * | 2007-11-29 | 2012-07-18 | Nissan Chemical Ind Ltd | EPOXY CURING AGENT CONTAINING SILICA AND EPOXY RESIN CURED BODY |
| JP5158430B2 (ja) * | 2008-06-23 | 2013-03-06 | Ｄｉｃ株式会社 | エポキシ化合物及びエポキシ硬化物 |
| EP2302456B1 (en) * | 2008-07-16 | 2015-09-02 | Nissan Chemical Industries, Ltd. | Positive resist composition;patttern forming method; microlens and planarization film therefrom; solid-state imaging device, liquid crystal display device and led display device comprising the same |
| CN102317343B (zh) * | 2009-02-10 | 2013-07-31 | 日产化学工业株式会社 | 含有长链亚烷基的环氧化合物 |
| JP5515399B2 (ja) * | 2009-05-12 | 2014-06-11 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、硬化膜、パターン硬化膜の製造方法及び電子部品 |
-
2011
- 2011-01-19 JP JP2011551818A patent/JP5673963B2/ja active Active
- 2011-01-19 CN CN201180007042.2A patent/CN102725691B/zh active Active
- 2011-01-19 US US13/574,938 patent/US8722311B2/en not_active Expired - Fee Related
- 2011-01-19 WO PCT/JP2011/050854 patent/WO2011093188A1/ja active Application Filing
- 2011-01-19 KR KR1020127021815A patent/KR101852523B1/ko active IP Right Grant
- 2011-01-19 EP EP11736902.5A patent/EP2530524B1/en active Active
- 2011-01-25 TW TW100102644A patent/TWI548943B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2011093188A1 (ja) | 2013-06-06 |
| EP2530524B1 (en) | 2019-05-29 |
| WO2011093188A1 (ja) | 2011-08-04 |
| KR20120127609A (ko) | 2012-11-22 |
| CN102725691B (zh) | 2014-06-11 |
| CN102725691A (zh) | 2012-10-10 |
| KR101852523B1 (ko) | 2018-04-27 |
| TWI548943B (zh) | 2016-09-11 |
| US8722311B2 (en) | 2014-05-13 |
| JP5673963B2 (ja) | 2015-02-18 |
| EP2530524A4 (en) | 2015-03-04 |
| US20120292487A1 (en) | 2012-11-22 |
| EP2530524A1 (en) | 2012-12-05 |
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