TW201144685A - LED lamp incorporating remote phosphor with heat dissipation features - Google Patents

Abstract

An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote planar phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphor arranged according to the present invention can operate at lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor.

Description

201144685 六、發明說明： 【發明所屬之技術領域】 本發明係關於固態燈及燈泡，且尤其係關於包含具有熱 耗散特徵之遠端磷光體的有效率且可靠之基於發光二極體 (LED)的燈及燈泡。 本申請案主張以下各申請案之權利：2〇1〇年3月3曰申請 之美國臨時專利申請案第61/339,5 16號；2010年3月3曰申 凊之美國臨時專利申請案第61/339 515號；2〇1〇年9月24曰 申凊之美國臨時專利申請案第61/386,437號；2〇1〇年12月 19曰申請之美國臨時申請案第61/424,665號；2〇1〇年12月 19曰申請之美國臨時申請案第61/424 67〇號；2〇11年1月19 曰申請之美國臨時專利申請案第61/434,355號；2011年1月 23曰申請之美國臨時專利申請案第61/435,326號；2〇11年1 月24曰申請之美國臨時專利申請案第61/435,759號。本申 請案亦為以下各申請案之部分接續申請案且主張以下各申 請案之權利：20 1 〇年8月2曰申請之美國專利申請案第 12/848,825號；2010年9月24日申請之美國專利申請案第 12/889,719號；及2010年12月22日申請之美國專利申請案 第 12/975,820 號。 本發明係在政府支援下依據美國能源部第de_FC26_ 08NT01577號合約進行。政府具有本發明中之特定權利。 【先前技術】 發光一極體（LED)為將電能轉換成光之固態器件，且大 體上包含夾於摻雜類型相反之層之間的半導體材料之一或 J54446.doc 201144685 多個作用層。當跨越该等播雜層施加偏廢時，電洞及電子 被注入至作用層中’在作用層中，電洞與電子重新組合以 產生光。自作用層且自LED之所有表面發射光。 為了在電路或其他類似配置令使用LED晶片，已知將 LED晶片封入於封裝_以提供環境及/或機械保護、色彩選 擇、光t焦及其類似者。LED封裝亦包括用於將led封裝 電連接至外部電路之電導線、接點或跡線。在圖丨中所說 明之典型LED封裝10中，借助於焊料結合或導電環氧樹脂 將單-LED晶片12安裝於反射杯13上。一或多個線結合u 將LED晶片12之歐姆接觸連接至導線15A及/或15B，導線 15A及/或15B可附接至反射杯13或與反射杯13形成一體。 反射杯可填充有囊封劑材料16，囊封劑材料16可含有諸如 磷光體之波長轉換材料。由LED發射的在第一波長下之光 可由磷光體吸收，填光體可回應於此而發射在第二波長下 之光。接著將整個裝配件囊封於清激保護樹脂⑽，清澈 保護樹脂u可模製為透鏡之形狀錢自led^i2發射之 光準直。雖然反射杯13可在向上方向上導引光，但當光被 射時（亦即，-些光可被反射杯吸收，歸因於實際反射 器表面之小於⑽％的反射率），可能發生光損失。另外， 熱滞留可為封裝（諸如，圖丨中 τ所展不之封裝10)的問題，此 係由於可能難以經由導線15Α、15Β提取熱。201144685 VI. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to solid state lamps and light bulbs, and more particularly to efficient and reliable light-emitting diodes (LEDs) comprising a remote phosphor having heat dissipation characteristics. ) lights and bulbs. This application claims the rights of the following applications: US Provisional Patent Application No. 61/339, 5 16, filed March 3, 2010; March 3, 2010, US Patent Application for Application US Provisional Patent Application No. 61/386, 437, filed on September 24, 2002, and US Provisional Application No. 61/424,665, filed December 19, 2010 US Provisional Application No. 61/424 67 曰, filed on December 19, 2013; US Provisional Patent Application No. 61/434,355, filed January 19, 2011; January 23, 2011 U.S. Provisional Patent Application Serial No. 61/435,326, filed on Jan. 24, 2011. This application is also a part of the following applications and claims the following applications: 20 1 US Patent Application No. 12/848,825, filed on August 2, 2010; application on September 24, 2010 U.S. Patent Application Serial No. 12/889,719; and U.S. Patent Application Serial No. 12/975,820, filed on Dec. 22, 2010. This invention was made with government support under Contract No. FC__08NT01577 of the US Department of Energy. The government has certain rights in the invention. [Prior Art] A light-emitting diode (LED) is a solid-state device that converts electrical energy into light, and generally comprises one of semiconductor materials sandwiched between layers of opposite doping type or a plurality of active layers of J54446.doc 201144685. When a waste is applied across the miscellaneous layers, holes and electrons are injected into the active layer' in the active layer, and the holes recombine with the electrons to produce light. Self-acting layer and emit light from all surfaces of the LED. In order to use LED wafers in circuits or other similar configurations, it is known to enclose LED wafers in a package to provide environmental and/or mechanical protection, color selection, optical t-focus, and the like. The LED package also includes electrical leads, contacts or traces for electrically connecting the led package to an external circuit. In the exemplary LED package 10 illustrated in the drawings, the single-LED wafer 12 is mounted on the reflective cup 13 by means of solder bonding or conductive epoxy. One or more wire bonds u connect the ohmic contacts of the LED wafer 12 to wires 15A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflector cup can be filled with an encapsulant material 16, which can contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength can be absorbed by the phosphor, and the light emitter can emit light at the second wavelength in response thereto. Next, the entire assembly is encapsulated in a clear protective resin (10), and the clear protective resin u can be molded into the shape of a lens. The light collimated from the LED emitted by the LED^i2. Although the reflective cup 13 can direct light in an upward direction, it may occur when light is emitted (ie, some of the light may be absorbed by the reflective cup due to less than (10)% of the reflectivity of the actual reflector surface). Light loss. In addition, thermal retention can be a problem with packages such as package 10 in which τ does not exhibit, as it may be difficult to extract heat via wires 15 , 15 .

二所說明之習知LED封裝2。可能更適合於可產生更 功率操作。在LED封裝辦，—或W 载體上，該載體諸如印刷電路板（PCB)載體、 154446.doc 201144685 基板或子基板23。安裝於子基板23上之金屬反射器24環繞 該（等）LED晶片22且反射由LED晶片22發射之光使光遠離 封裝20 »反射器24亦提供對LED晶片22之機械保護。在 LED晶片22上之歐姆接觸與子基板23上之電跡線25 A、25B 之間形成一或多個線結合連接件27。接著以囊封劑26覆蓋 所安裝之LED晶片22，囊封劑26可提供對晶片之環境及機 械保護同時亦充當透鏡。金屬反射器24通常借助於焊料或 環氧樹脂結合而附接至載體》 LED晶片（諸如’可見於圖2之LED封裝20中的彼等LED 晶片）可塗佈以包含一或多個構光體之轉換材料，其中該 等磷光體吸收LED光中之至少一些LED光。轉換材料可發 射不同波長之光，以使得LED封裝發射來自LED晶片之光 與來自磷光體之光的組合。可使用許多不同方法來將該 (等）LED晶片塗佈以碌光體’其中一種合適方法描述於美 國專利申請案第Π/656,759號及第11/899,790號中，該兩個 申請案為Chitnis等人之申請案且皆題為「wafer LevelThe conventional LED package 2 is described. May be more suitable for producing more powerful operation. On an LED package, or a W carrier, the carrier such as a printed circuit board (PCB) carrier, 154446.doc 201144685 substrate or sub-substrate 23. A metal reflector 24 mounted on the submount 23 surrounds the LED wafer 22 and reflects the light emitted by the LED wafer 22 away from the package 20 » reflector 24 also provides mechanical protection of the LED wafer 22. One or more wire bond connectors 27 are formed between the ohmic contacts on the LED wafer 22 and the electrical traces 25A, 25B on the submount 23. The mounted LED wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer while also acting as a lens. Metal reflectors 24 are typically attached to a carrier by means of solder or epoxy bonding. LED wafers (such as 'the LED wafers visible in LED package 20 of FIG. 2') may be coated to include one or more light-emitting elements. A conversion material of the body, wherein the phosphors absorb at least some of the LED light. The conversion material can emit light of different wavelengths such that the LED package emits a combination of light from the LED wafer and light from the phosphor. A number of different methods can be used to coat the (or the like) LED wafers in the form of a phosphor. One of the suitable methods is described in U.S. Patent Application Serial No. 656/759, the entire disclosure of which is incorporated herein by reference. Etc.'s application and both are entitled "wafer Level

Phosphor Coating Method and Devices Fabricated UtilizingPhosphor Coating Method and Devices Fabricated Utilizing

Method」。或者’可使用諸如電泳沈積（EPD)之其他方法來 塗佈LED ’其中一合適之EPD方法描述於Tarsa等人之題為 「Close Loop Electrophoretic Deposition of SemiconductorMethod". Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat the LEDs. One suitable EPD method is described in Tarsa et al. entitled "Close Loop Electrophoretic Deposition of Semiconductor"

Devices」之美國專利申請案第11/473,〇89號中。 此等類型之LED晶片已用於不同燈中，但遭遇到基於器 件之結構之一些限制《磷光體材料位於led磊晶層上或極 接近於LED磊晶層，且在一些例子中，麟光體材料包含 154446.doc 201144685 LED之上的保形塗層。在此等配置中，磷光體材料經受直 接晶片加熱，此係歸因於缺乏熱耗散路徑（除了經由晶片 自身之外)。因此，磷光體材料可在高於led晶片之溫度下 操作此升n之操作溫度可造成磷光體材料 '黏合材料及/ 或囊封騎料隨著時間之降級。該升高之操作溫度亦可造 成磷光體轉換效率之降低’且因此常常造成LED光之經感 知色彩的偏移。 亦已開發利用具有轉換材料之固態光源（諸如，led)的 燈°亥轉換材料與LED分離或位於LED之遠端。此等配置 揭示於Tarsa等人之題為「High 〇utput Radial DispersingUS Patent Application Serial No. 11/473, No. 89. These types of LED chips have been used in different lamps, but have encountered some limitations based on the structure of the device. "The phosphor material is on the LED epitaxial layer or very close to the LED epitaxial layer, and in some cases, Lin Guang The bulk material contains a conformal coating over the 154446.doc 201144685 LED. In such configurations, the phosphor material is subjected to direct wafer heating due to the lack of a heat dissipation path (other than via the wafer itself). Thus, operating the phosphor at a temperature above the temperature of the led wafer can cause the phosphor material 'adhesive material and/or encapsulated rider to degrade over time. This elevated operating temperature can also result in a decrease in phosphor conversion efficiency' and thus often results in a shift in the perceived color of the LED light. Lamps utilizing solid state light sources (e.g., led) with conversion materials have also been developed that are separate from or disposed at the distal end of the LED. These configurations are disclosed in Tarsa et al. entitled "High 〇utput Radial Dispersing"

Lamp Using a Solid State Light Source」之美國專利第 6’350,041號中。此專利中所描述之燈可包含經由分離器將 光透射至具有磷光體之分散器的固態光源。該分散器可使 光以所要圖案分散，及/或藉由經由磷光體轉換光中之至 少一些光而改變光之色彩。在一些實施例中’分離器將光 源與分散器隔開足夠距離，以使得當光源載運室内照明所 必要之升高電流時，來自光源之熱將並不轉移至分散器。 額外遠端磷光體技術描述於Negley等人之題為「Lighting Device」之美國專利第7,614,759號中。 然而’磷光體在光轉換過程期間產生熱，且此磷光體轉 換加熱可佔LED封裝中之總熱產生的20%至30°/。。在磷光 體位於極接近於晶片處（例如，磷光體保形地塗佈至晶片 上）的應用中，自晶片表面射出之激勵光子之高局部密度 σΓ導致非常向的局部加熱且因此導致礙光層中之高峰值溫 154446.doc 201144685 度。在許多遠端磷光體應用中，此光子密度散佈於較大鱗 光體區域之上，大體上導致降低之局部溫度。然而，在許 多遠端磷光體配置中，來自磷光體轉換加熱之熱大體上具 有不足的用以耗散磷光體轉換熱之熱耗散路徑。在無有效 熱耗散路徑之情況下，熱隔離之遠端磷光體可遭受升高之 操作溫度，在一些例子中，該等升高之操作溫度可能甚至 比可比較的保形塗佈層中之溫度更高。此情形可導致降 級、轉換效率低下及色彩偏移，此等缺點中之一些者是打 算藉由具有一遠端碟光體來避免的。 【發明内容】 本發明提供有效率的、可靠的且節省成本之燈及燈泡之 各種實施例。該等不同實施例可配置有遠端轉換材料，該 遠端轉換材料幫助降低或消除自發光器至磷光體材料之熱 散佈。該等燈及燈泡亦可包含熱管理特徵，以考慮到將轉 換產生之熱有效率地傳導遠離該遠端轉換材料。此情形降 低或消除了升南之溫度可能對該轉換材料之效率及可靠性 具有的負面影響。在不同實施例中，彼轉換材料可包含一 可經2-維成形之磷光體載體。 一根據本發明之燈之一實施例包含一光源，及一位於該 光源之遠端之平面磷光體載體。該磷光體載體可包含一導 熱材料及一轉換材料，該導熱材料對於來自該光源之光至 少部分透明，且該轉換材料吸收來自該光源之光並發射一 不同波長之光。包括一散熱片結構，其中該磷光體載體熱 耦合至該散熱片結構。 154446.doc 201144685 根據本發明之基於LED之燈的一實施例包含一 LED光 源’及一配置於該光源之遠端之平面磷光體。自該光源發 射之光穿過該磷光體且至少一些光被該磷光體轉換。該燈 進一步包含一導熱路徑，該導熱路徑用以將磷光體轉換熱 傳導遠離該磷光體且耗散該熱。 一根據本發明之燈之另一實施例包含一散熱片結構及一 基於LED之光源。一轉換材料配置於該光源之遠端且經配 置以吸收來自該光源之光並重新發射不同波長之光。一第 一導熱路徑將轉換產生之熱傳導遠離該轉換材料至該散熱 片° 根據本發明之燈之再一實施例包含一光源及一光學 腔，該光學腔包含一位於該空腔之一開口之上的磷光體載 體。该光源安裝於該光學腔中位於該磷光體載體之遠端， 其中來自该光源之光穿過該磷光體載體。該光學腔進一步 包含反射表面以反射來自該光源及該磷光體載體之光。一 導熱路徑使璘光體轉換熱傳導遠離該磷光體以耗散該熱。 本發明之此等及其他態樣及優點將自以下詳細描述及附 圖變得顯而易見’該等附圖借助於實例說明本發明之特 徵。 【實施方式】 ^發明係針對包含-遠端轉換材料之燈或燈泡結構之不 同實化例’該遠端轉換材料可經配置以使得來自發光器之 較少熱加熱該轉換材料，其中該遠端轉換材料亦能夠在該 轉換材料中無實質熱累積（歸因於光轉換過程）之情況下操 154446.doc •9- 201144685 :及= = = ::高::度可能__之效 . 有的負面〜響。本發明亦係針對包含特徵之 燈.5玄等特徵遮蔽轉換材料從而使得轉換材料不被燈使用 者看到’且亦可將來自遠端轉換材料及/或燈之光源的光 分散或重新分佈成所要發射圆案。 :之不同實施例可具有許多不同形狀及大小，且在不同 燈實施例中’轉換材料可包含一或多個轉換材料（諸如， 峨光體）。可包括熱路徑，以用於在操作期間使熱自轉換 材料耗散，同時保持轉換材料位於錢之遠端，以使得來 自光源之大多數或所有熱並不進人轉換材料中且降低碟光 層之入射激勵光子之局部密度。與缺之用以耗散轉換熱之 導熱路徑之轉換材料相比較，此情形允許遠端轉換材料在 較低溫度及降低之光子激勵密度下操作。 藉由位於遠端且保持相對較冷，轉換材料可更有效率地 操作且並不遭受與熱有關之色彩偏移。在較低溫度下操作 亦降低轉換材料之與熱有關之降級，且可增加轉換材料之 長期可靠性。根據本發明之不同遠端配置亦可允許轉換材 料在較低激勵密度下操作，此情形可降低磷光體將由於來 自光源之入射光而達到光學上飽和的可能性。 在根據本發明之一些燈實施例中，轉換材料可包含一鱗 光體載體’該磷光體載體包括配置於載體層或材料上或與 載體層或材料成一體之一或多個磷光體《載體層可包含許 多不同導熱材料’該等導熱材料對於所要波長之光（諸如 由燈之發光器發射之光）實質上透明。在一些實施例中， 154446.doc •10- 201144685 構，體載體可具備用於耗散轉換加熱之累積的構件，且在 實施例中磷光體載體與散熱片結構良好地熱接觸。磷 光體載體可“㈣光體㈣之邊㈣之熱制而安裝至 散熱片。一光源可安裝於燈中(諸如，散熱片結構中或散 熱片結構上）一々Γ里$ . 置處’以使得在光源與填光體材料之間 存在刀離’亦即，磷光體載體及其磷光體位於光源之遠 端。 °亥光源亦經配置，以使得該光源所發射之光中之至少一 些光穿過碟光體載體及㈣光體，其中來自光源之光中之 夕二光被碟光體轉換。在一些實施例中，此轉換可包 3光子降頻轉換’叾中經轉換之光之波長比光源光之波長 長。在其他實施例中，此轉換可包含增頻轉換，其中經轉 換之光之波長比光源光之波長短。在任一狀況下，該轉換 可造成由於轉換過程而在磷光體中產生熱。磷光體轉換熱 可經由導熱載體層傳導且傳導至散熱片結構中，在散熱片 結構中，磷光體轉換熱可耗散至環境中。在一些實施例 中載體層可收集自磷光層產生之熱，使熱在橫向上散 佈，且將熱傳導至散熱片結構。散熱片結構可配置有不同 特徵，該等特徵幫助將熱耗散至環境中，且此熱管理配置 允卉遠端磷光層維持一較低操作溫度，從而導致上文所提 及之益處。 如下文進一步描述，根據本發明之燈可以許多不同方式 來配置。在一些實施例中，光源可包含固態光源，諸如不 同類型之LED、具有不同透鏡或光學器件配置之led晶片 154446.doc 201144685 或LED封裝。在其他實施例中，可使用單一 led晶片或封 裝，而在其他實施例中，可以不同類型之陣列來使用及配 置多個LED晶片或封裝。藉由使磷光體與LED晶片熱隔離 或不直接熱接觸且具有良好熱耗散，可藉由較高電流位準 來驅動LED晶片，而不造成對磷光體之轉換效率及磷光體 之長期可罪性的有害影響。此情形可考慮到過激勵LED晶 片之靈活性，以使得可使用較低數目個LED來產生所要發 光通量，此情形又可降低燈之成本及/或複雜性。此等led 封裝亦可包含囊封有可承受升高之發光通量之材料的 LED，或可包含未經囊封之led » 在一些實施例中’光源可包含一或多個藍色發光led , 且填光體載體中之填光體可包含一或多個材料，該一或多 個材料吸收藍光之一部分且發射一或多個不同波長之光， 以使得燈發射來自藍色LED及轉換材料之白光組合。轉換 材料可吸收藍色LED光且發射不同色彩之光，包括（但不限 於）黃色及綠色。光源亦可包含發射不同色彩之光的不同 LED及轉換材料’以使得燈發射具有所要特性（諸如，色溫 及演色性）之光。 對於一些應用’可能需要（為了滿足色點/色溫及/或演色 性之特定要求）使由光源及/或峨光層發射之光之某一部分 基本上包含紅光。併有紅色LED晶片與藍色LED晶片兩者 之習知燈可經受在不同操作溫度及調光下的色彩不穩定 性。此情形可係歸因於紅色LED與藍色LED在不同溫度及 操作功率（電流/電壓）下之不同行為，以及隨著時間之不同 154446.doc •12· 201144685 操作特性。此效應可經由實施主動式控制系統來稍微減 輕’該主動式控制系統可能添加整個燈之成本及複雜性。 根據本發明之不同實施例可藉由使一具有相同類型之發光 器的光源與一遠端磷光體組合來解決此問題，該遠端碟光 體可包含經由本文中所揭示之熱耗散配置而保持相對較冷 的多個類型或層及/或區之磷光體。遠端磷光體載體可吸 收來自發光器之光且可重新發射不同色彩之光（包括紅 光），同時仍經歷磷光體之降低的操作溫度的效率及可靠 性。 磷光體元件與LED之分離提供了添加之優點：更容易且 更一致的色彩分選。此情形可以若干方式來達成。可將來 自各種分選等級之LED(例如，來自各種分選等級之藍色 LED)裝配在—起以達成可用於不同燈中的實質上波長均句 之激勵源。可接著將此等LED與具有實質上相同轉換特性 之墙光體载體组合，以提供發射在所要分選等級内之光的 二：外’可製造眾多磷光體載體及根據磷光體載體之不 同轉換特性來預先分選該等填 靜企㈣尤體載體。可將不同磷光體 載體與發射不同特性之光源 分選等級内之光的燈。 仏供發射在目標色彩 在根據本發明之不同實施例中 結構及材料散熱L構可包含不同 耗散特徵1 ，散熱片結構可包含具有熱 弟放特徵（堵如，，續片或熱 施例中，散哉片社禮導.、、、材科。在另外其他實 m 籌匕3不同類型之燈套環，該等燈套 私可女裝至諸如單獨散熱片 =以燈套 J特徵。根據本發明之不 J54446.doc -13· 201144685 同麟光體載體可以不同方式來配置’諸如，配置於載體層 之不同表面上的填光層、於載體層之（多個）表面上圖案化 的磷光體區，或均勻地或非均勻地跨越或貫穿載體層分佈 之磷光體區《磷光體載體亦可包括諸如散射粒子之其他材 料’而在其他實施例中’磷光體載體可包含一個以上磷光 體材料。 根據本發明之燈亦可藉由用反射表面環繞光源而提供改 良之發射效率。此情形可藉由使自轉換材料重新發射之大 量光向光源反射回而導致增強之光子再循環。為了進一步 增強效率且提供所要發光概況，磷光層或載體層之表面可 為平滑的或散射的。在一些實施例中，載體層之内表面可 為光學上平滑的以促進全内反射行為，該全内反射行為降 低了自磷光層向後導引之光（經降頻轉換之光或散射光）的 量。相應地，在一些狀況下，可使載體層或磷光層之一或 多個外表面粗糙化或以其他方式改質以促進自此外表面之 光發射。另外，可使用一或多個粗糙化外表面與平滑内表 面之組合來促進在較佳方向上的穿過載體及磷光層之光發 射。載體層及磷光層之諸如表面粗糙度、反射率及折射率 之性質大體上可用以將由載體/磷光層發射或傳送穿過載 體/磷光層之光引導或導引至較佳方向上，（例如）以藉由降 低可由燈之LED晶片、相關聯之基板或在燈内部内的其他 非理想反射表面吸收的向後發射之光的量，改良光束強度 概況及色形均勻性等而提供改良之效率。麟光層及/或載 體層可包含基本上二維幾何形狀’諸如平面或圓盤狀輪 154446.doc -14- 201144685 幕p °平面形狀可促進磷光層之製造及塗覆且降低製造成 〇 本文中參考特定實施例描述本發明，但應理解，本發明 可以許多不同形式來體現且不應被解釋為限於本文中所闡 述之實施例。詳言之’下文關於不同組態的具有LED或 LED晶片或LED封裝之特定燈來描述本發明，但應理解， 本發明可用於具有許多不同陣列組態之許多其他燈。根據 本發明的以不同方式配置之不同燈的實例描述於下文中， 及Le等人於2011年i月μ曰申請的題為「s〇lid以价 Lamp」之美國臨時專利申請案第61/435,759號中，且該申 請案以引用的方式併入本文中。 下文之實施例係參考一或多個LED進行描述，但應理 解，此情形意欲涵蓋LED晶片及LED封裝。組件可具有除 所展不之彼等形狀及大小之外的不同形狀及大小，且可包 括不同數目個LED。亦應理解，下文所描述之實施例可能 使用共平面光源，但應理解，亦可使用非共平面光源。 本文中參考轉換材料、磷光層及磷光體載體描述本發 明，所有此等組件位於該光源或LED之「遠端」。此内容 脈絡中之遠端指代間隔開及/或不直接熱接觸。 亦應理解，當諸如層、區或基板之元件被稱作在另一元 件「上」時，該元件可直接在另一元件上或亦可存在介入 兀件。此外，諸如r内」、「外」、「上部」、「上方」、「下 部」、「…之下」及「下方」之相對術語及類似術語可能在 本文中用以描述一層或另一區之關係。應理解，此等術語 154446.doc -15· 201144685 思欲涵蓋諸圖中所描繪之定向以及器件之其他不同定向。 雖然術5吾「第一」、「第二」等可能在本文中用以描述各 種元件、組件、區、層及/或區段，但此等元件、組件、 區、層及/或區段不應受此等術語限制。此等術語僅用以 區分一元件、組件、區、層或區段與另一區、層或區段。 因此，在不偏離本發明之教示之情況下，可將下文所論述 之第一元件、組件、區、層或區段稱為第二元件、組件、 區、層或區段。 本文中參考；^截面圖說明描述本發明之實施例，該等橫 截面圖說明為本發明之實施例之示意性說明。因而，該等 層之實際厚度可為不同的，且預期作為（例如）製造技術及/ 或公差之結果的與說明之形狀的差異。本發明之實施例不 應被解釋為限於本文中所說明之區的特定形狀，而應包括 由（例如）製造導致的形狀之偏差。說明為或描述為正方形 或矩形之區通常將具有歸因於正常製造公差而產生的圓化 或彎曲特徵。因此，諸圖中所說明之區本質上為示意性的 且該等區之形狀不意欲說明器件之區的精確形狀，且不意 欲限制本發明之範疇。U.S. Patent No. 6'350,041, the entire disclosure of which is incorporated herein by reference. The lamp described in this patent can include a solid state light source that transmits light through a splitter to a disperser having a phosphor. The disperser allows the light to be dispersed in a desired pattern and/or to change the color of the light by converting at least some of the light through the phosphor. In some embodiments the "separator separates the light source from the disperser a sufficient distance such that when the source carries the elevated current necessary for illumination in the room, heat from the source will not be transferred to the disperser. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. However, the phosphor generates heat during the light conversion process, and this phosphor conversion heating can account for 20% to 30°/ of the total heat generated in the LED package. . In applications where the phosphor is located in close proximity to the wafer (eg, the phosphor is conformally applied to the wafer), the high local density σ 激励 of the excitation photons emerging from the surface of the wafer results in very localized local heating and thus hinders light. The peak temperature in the layer is 154446.doc 201144685 degrees. In many remote phosphor applications, this photon density is spread over a larger scale region, generally resulting in a reduced local temperature. However, in many remote phosphor configurations, the heat from the phosphor conversion heating generally has insufficient heat dissipation paths to dissipate the heat of conversion of the phosphor. In the absence of an effective heat dissipation path, the thermally isolated distal phosphor can be subjected to elevated operating temperatures, and in some instances, such elevated operating temperatures may even be comparable to comparable conformal coatings. The temperature is higher. This situation can result in degradation, inefficient conversion, and color shifting, some of which are avoided by having a remote disc. SUMMARY OF THE INVENTION The present invention provides various embodiments of efficient, reliable, and cost effective lamps and bulbs. The various embodiments can be configured with a distal conversion material that helps reduce or eliminate thermal spread from the illuminator to the phosphor material. The lamps and bulbs may also include thermal management features to allow for efficient transfer of heat generated by the conversion away from the distal conversion material. This situation reduces or eliminates the negative effects of rising temperatures on the efficiency and reliability of the conversion material. In various embodiments, the conversion material can comprise a phosphor carrier that can be formed in a 2-dimensional shape. An embodiment of a lamp according to the invention comprises a light source and a planar phosphor carrier located at the distal end of the light source. The phosphor support can comprise a thermally conductive material and a conversion material that is at least partially transparent to light from the source, and the conversion material absorbs light from the source and emits light of a different wavelength. A heat sink structure is included wherein the phosphor carrier is thermally coupled to the heat sink structure. 154446.doc 201144685 An embodiment of an LED-based lamp in accordance with the present invention includes an LED light source' and a planar phosphor disposed at a distal end of the light source. Light emitted from the light source passes through the phosphor and at least some of the light is converted by the phosphor. The lamp further includes a thermally conductive path for conducting the heat transfer of the phosphor away from the phosphor and dissipating the heat. A further embodiment of a lamp according to the invention comprises a heat sink structure and an LED based light source. A conversion material is disposed at the distal end of the source and is configured to absorb light from the source and re-emit light of different wavelengths. A first heat conduction path transmits the heat generated by the conversion away from the conversion material to the heat sink. According to still another embodiment of the lamp of the present invention, a light source and an optical cavity are included, the optical cavity including an opening in the cavity Phosphor support on. The light source is mounted in the optical cavity at a distal end of the phosphor carrier, wherein light from the source passes through the phosphor carrier. The optical cavity further includes a reflective surface to reflect light from the source and the phosphor carrier. A thermally conductive path causes the phosphor conversion heat to be conducted away from the phosphor to dissipate the heat. These and other aspects and advantages of the present invention will be apparent from the description and appended claims. [Embodiment] ^Inventives are directed to different embodiments of a lamp or bulb structure comprising a - distal conversion material - the distal conversion material can be configured such that less heat from the illuminator heats the conversion material, wherein the distal The end-converting material can also be operated without any substantial heat accumulation (due to the light conversion process) in the conversion material. 154446.doc •9- 201144685 : and == = :: high::degree may be __ effect. Some negative ~ ring. The present invention also conceals the conversion material for a feature including a lamp, such as a lamp, such that the conversion material is not visible to the lamp user' and can also disperse or redistribute light from the source of the distal conversion material and/or the lamp. Cheng is going to launch a round case. Different embodiments may have many different shapes and sizes, and in different lamp embodiments the 'conversion material' may include one or more conversion materials (such as a phosphor). A thermal path may be included for dissipating the thermal self-converting material during operation while maintaining the conversion material at the far end of the money such that most or all of the heat from the source does not enter the conversion material and reduces the dishing The local density of the incident excitation photons of the layer. This situation allows the remote conversion material to operate at lower temperatures and reduced photon excitation densities than the conversion materials that are used to dissipate the heat transfer path of the heat of conversion. By being located at the distal end and remaining relatively cold, the conversion material can operate more efficiently and does not suffer from heat-related color shifts. Operating at lower temperatures also reduces the heat-related degradation of the conversion material and increases the long-term reliability of the conversion material. Different distal configurations in accordance with the present invention may also allow the conversion material to operate at lower excitation densities, which may reduce the likelihood that the phosphor will be optically saturated due to incident light from the source. In some embodiments of the lamp according to the invention, the conversion material may comprise a scale carrier comprising: one or more phosphors "carriers" disposed on or integral with the carrier layer or material The layer may comprise a plurality of different thermally conductive materials that are substantially transparent to light of a desired wavelength, such as light emitted by an illuminator of the lamp. In some embodiments, the body carrier can be provided with means for dissipating the accumulation of conversion heating, and in embodiments the phosphor carrier is in good thermal contact with the fin structure. The phosphor carrier can be mounted to the heat sink by the heat of the side of the (4) light body (4). A light source can be mounted in the lamp (such as in the heat sink structure or on the heat sink structure). So that there is a knife gap between the light source and the filler material, that is, the phosphor carrier and its phosphor are located at the far end of the light source. The light source is also configured such that at least some of the light emitted by the light source Passing through the optical carrier and the (4) light body, wherein the light from the light source is converted by the light body. In some embodiments, the conversion can include 3 photon down conversion "the converted light" The wavelength is longer than the wavelength of the source light. In other embodiments, the conversion can include an upconversion wherein the wavelength of the converted light is shorter than the wavelength of the source light. In either case, the conversion can result in a conversion process Heat is generated in the phosphor. Phosphor conversion heat can be conducted through the thermally conductive carrier layer and conducted into the heat sink structure, where the phosphor conversion heat can be dissipated into the environment. In some embodiments the carrier layer can be collected. Self phosphorus The heat generated by the light layer causes the heat to spread in the lateral direction and conduct heat to the heat sink structure. The heat sink structure can be configured with different features that help dissipate heat into the environment, and the thermal management configuration allows the plant to be far away. The phosphorescent layer maintains a lower operating temperature, resulting in the benefits mentioned above. As further described below, the lamp according to the present invention can be configured in many different ways. In some embodiments, the light source can comprise a solid state light source, such as Different types of LEDs, led wafers 154446.doc 201144685 or LED packages with different lens or optics configurations. In other embodiments, a single led wafer or package may be used, while in other embodiments, different types of arrays may be used. Use and configure multiple LED wafers or packages. By thermally or not thermally contacting the phosphor with the LED wafer and having good heat dissipation, the LED wafer can be driven by a higher current level without causing phosphorescence The conversion efficiency of the body and the detrimental effects of the long-term sin of the phosphor. This situation can take into account the flexibility of over-exciting the LED chip so that a lower number of LEDs to produce the desired luminous flux, which in turn reduces the cost and/or complexity of the lamp. Such led packages may also include LEDs encapsulating materials that can withstand elevated luminous flux, or An unencapsulated led may be included. In some embodiments the 'light source may comprise one or more blue illuminated LEDs, and the fill in the fill carrier may comprise one or more materials, the one or more The material absorbs a portion of the blue light and emits one or more different wavelengths of light such that the lamp emits a combination of white light from the blue LED and the conversion material. The conversion material can absorb the blue LED light and emit light of different colors, including (but not Limited to yellow and green. The light source may also contain different LEDs and conversion materials that emit light of different colors to cause the lamp to emit light having desired characteristics such as color temperature and color rendering. For some applications, it may be desirable (to meet the specific requirements of color point/color temperature and/or color rendering) that a portion of the light emitted by the light source and/or the phosphor layer substantially comprises red light. Conventional lamps having both red and blue LED chips can withstand color instability at different operating temperatures and dimming. This situation can be attributed to the different behavior of the red and blue LEDs at different temperatures and operating power (current/voltage), and over time 154446.doc •12· 201144685 Operating characteristics. This effect can be slightly mitigated by implementing an active control system. The cost and complexity of the active control system may add to the entire lamp. This problem can be solved by combining a light source having the same type of illuminator with a remote phosphor, which can include the heat dissipation configuration disclosed herein, in accordance with various embodiments of the present invention. While maintaining relatively cold multiple types or layers and/or regions of phosphors. The distal phosphor carrier absorbs light from the illuminator and can re-emit light of different colors (including red light) while still experiencing the reduced efficiency and reliability of the operating temperature of the phosphor. The separation of the phosphor element from the LED provides the added advantage of easier and more consistent color sorting. This situation can be achieved in several ways. LEDs from various sorting levels (e.g., blue LEDs from various sorting levels) can be assembled in the future to achieve an excitation source of substantially wavelength uniformity that can be used in different lamps. These LEDs can then be combined with a wall carrier having substantially the same conversion characteristics to provide a second emission of light that can be produced within the desired classification level: a plurality of phosphor carriers can be fabricated and different depending on the phosphor carrier The conversion characteristics are used to pre-select the static storage enterprises (4). Different phosphor carriers can be used to classify light within the class with light sources that emit different characteristics.仏 for emission in target color. In various embodiments according to the present invention, the structure and material heat dissipation L structure may comprise different dissipative features 1 , and the heat sink structure may include a heat sink feature (blocking, sigma or thermal example) In the middle, the 哉 哉 社 社 社 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , According to the invention, J54446.doc -13· 201144685 can be configured in different ways, such as a light-filling layer disposed on different surfaces of the carrier layer, patterned on the surface(s) of the carrier layer a phosphor region, or a phosphor region that is uniformly or non-uniformly distributed across or through the carrier layer. "The phosphor carrier may also include other materials such as scattering particles." In other embodiments, the phosphor carrier may comprise more than one. Phosphor material. The lamp according to the present invention can also provide improved emission efficiency by surrounding the light source with a reflective surface. This can be achieved by reflecting a large amount of light re-emitted from the conversion material back toward the source. Enhanced photon recycling. To further enhance efficiency and provide a desired illumination profile, the surface of the phosphor layer or carrier layer can be smooth or scattered. In some embodiments, the inner surface of the carrier layer can be optically smooth to facilitate Total internal reflection behavior that reduces the amount of light (down-converted or scattered light) that is directed backwards from the phosphor layer. Accordingly, in some cases, the carrier layer or phosphor layer can be One or more outer surfaces are roughened or otherwise modified to promote light emission from the otherwise surface. Additionally, a combination of one or more roughened outer surfaces and a smooth inner surface may be used to promote penetration in a preferred direction. Light emission through the carrier and the phosphor layer. The properties of the carrier layer and the phosphor layer such as surface roughness, reflectivity and refractive index can generally be used to direct or direct light emitted or transmitted by the carrier/phosphor layer through the carrier/phosphor layer. Leading in a preferred direction, for example, by reducing the backwards absorption by the LED chip of the lamp, the associated substrate, or other non-ideal reflective surfaces within the interior of the lamp The amount of light, improved beam intensity profile and color uniformity, etc., provides improved efficiency. The lining layer and/or carrier layer may comprise a substantially two-dimensional geometry such as a flat or disc-shaped wheel 154446.doc -14 - 201144685 Curtain p ° planar shape may facilitate fabrication and coating of phosphor layers and reduce manufacturing. The invention is described herein with reference to specific embodiments, but it should be understood that the invention may be embodied in many different forms and should not be construed as limited Embodiments set forth herein. DETAILED DESCRIPTION OF THE INVENTION The present invention is described below with respect to different configurations of particular lamps having LED or LED wafers or LED packages, but it should be understood that the present invention can be used with many different array configurations. Other lamps. Examples of different lamps configured in different ways according to the present invention are described below, and U.S. Provisional Patent Application entitled "s〇lid for Price" by Le et al. No. 61/435,759, the disclosure of which is incorporated herein by reference. The embodiments below are described with reference to one or more LEDs, but it should be understood that this scenario is intended to encompass LED wafers and LED packages. The components may have different shapes and sizes than those of their shape and size, and may include a different number of LEDs. It should also be understood that the embodiments described below may use coplanar light sources, but it should be understood that non-coplanar light sources may also be used. The invention is described herein with reference to a conversion material, a phosphor layer, and a phosphor carrier, all of which are located at the "distal end" of the source or LED. The distal end of the context refers to spacing and/or direct thermal contact. It is also understood that when an element such as a layer, a layer or a substrate is referred to as being "on" another element, the element can be directly on the other element or the intervening element can also be present. In addition, relative terms such as r, "outside", "upper", "above", "lower", "below" and "below" may be used herein to describe a layer or another. Relationship. It should be understood that these terms 154446.doc -15· 201144685 are intended to encompass the orientation depicted in the figures and other different orientations of the device. Although the terms "first", "second" and the like may be used herein to describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or sections It should not be limited by these terms. The terms are used to distinguish one element, component, region, layer, Therefore, a first element, component, region, layer or layer discussed below may be referred to as a second element, component, region, layer, or section, without departing from the teachings of the invention. The cross-sectional views are illustrative of the embodiments of the present invention. Thus, the actual thickness of the layers can be varied and is expected to differ from the illustrated shapes as a result of, for example, manufacturing techniques and/or tolerances. The embodiment of the invention should not be construed as being limited to the particular shapes of the regions described herein, but should include variations in the shape resulting from, for example, manufacturing. Zones that are described or described as square or rectangular will typically have rounded or curved features that result from normal manufacturing tolerances. Accordingly, the regions illustrated in the figures are illustrative in nature and are not intended to limit the scope of the invention.

圖3展示根據本發明之燈50之一實施例，燈5〇包含具有 光學腔54之散熱片結構52，該光學腔54具有用於固持光源 58之平台56。雖然此實施例及下文之一些實施例係參考光 學腔來描述，但應理解，可提供無光學腔之許多其他實施 例。光源58可包含許多不同發光器，所展示之實施例包含 LED，該LED可包含許多不同的可購得之lED晶片或lED 154446.doc •16· 201144685 封裝，包括（但不限於）可自位於North Car〇Hna之Durham的3 shows an embodiment of a lamp 50 according to the present invention, the lamp 5A including a heat sink structure 52 having an optical cavity 54 having a platform 56 for holding the light source 58. While this embodiment and some of the following examples are described with reference to an optical cavity, it should be understood that many other embodiments without an optical cavity can be provided. Light source 58 can include a number of different illuminators, and the illustrated embodiment includes LEDs that can include many different commercially available lED wafers or lED 154446.doc • 16· 201144685 packages, including but not limited to North Car〇Hna of Durham

Cree，Inc·購得的彼等LED晶片或LED封裝。可使用許多不 同的已知安裝方法及材料將光源58安裝至平台56，其中來 自光源58之光自空腔54之頂部開口發射出。在一些實施例 中，可將光源58直接安裝至平台56，而在其他實施例中， 可將光源包括於子基板或㈣電路板（pCB)上，接著將該 子基板或印刷電路板（PCB)安裝至平台56。平台56及散熱 片’·、。構52可包含用於將電信號施加至光源5 8之導電路徑， 其中-些導電路徑為導電跡線或電線。平台％之全部或部 分亦可由導熱材料製成，且可將導熱材料熱Μ至散熱片 結構52或使導熱材料與散熱片結構52成一體。 在二貫施例中’可以共平面之發光器之陣列的形式提 供燈之光源，纟中該等發光器安裝於平坦或平面表面上。 八平面光源可降低發光器配置之複雜性，從而使得發光器 2衣k更谷易且更便宜。然而，共平面光源傾向於主要在 引向方向上發射（諸如，按照朗伯（Lambertian)發射圖案）。 政熱片結構52可至少部分包含一導熱材料，且可使用包 括：同金屬(諸如，銅或鋁)或金屬合金之許多不同的導熱 时料在一些實施例中’散熱片可包含高純度鋁，高純度 在至恤下可具有約21〇 w/m_k之熱導率。在其他實施例 散熱片結構可包含壓鑄鋁，壓鑄鋁具有約200 W/m-k 、熱導率°散熱片結構52亦可包含其他熱耗散特徵（諸 政熱籍片60)，該等其他熱耗散特徵增加散熱片之表 積以促進熱更有效率地耗散至環境中。在一些實施例 154446.doc 201144685 中’散熱錯片60可由具有比散熱片之剩餘部分高的熱導率 之材料製成。在所展示之實施例中，韓片6〇係以大體上水 平定向來展示，但應理解，在其他實施例中，該等鰭片可 具有垂直或成角度定向。 反射層53亦可包括於散熱片結構52上，諸如，包括於光 學腔54之表面上。在一些實施例中，該等表面可塗佈有對 於由光源58及/或波長轉換材料發射的可見波長之光（「燈 光」）具有約75%或75%以上之反射率的材料，而在其他實 施例中’該材料對於燈光可具有約85%或85%以上之反射 率。在另外其他實施财，㉟材料對於燈光可具有約95% 或95%以上之反射率。 散熱片結構52亦可包含用於連接至電源（諸如，至不同 電插座）之特徵。在一些實施例中，散熱片結構可包含用 以裝設於習知電插座中之類型的特徵。舉例而言，散熱片 結構可包括用於安裝至標準螺紋旋座（Edis〇n挪㈣之特 徵丄該特徵可包含可擰緊至螺紋旋座中之螺紋部分。在其 他實施例中’散熱片結構可包括標準插塞且電插座可為標 準插口 ’或散熱片結構可包含GU24底座單元，或散熱片 結構可為夾片且電插座可為接納及保持該夾片之插座（例 如’如許多螢光燈中所使用）。此等僅為用於散熱片結構 及插座之選項中的少數’且亦可使用安全地將電自插座遞 送至燈50之其他配置。根據本發明之燈可包含一電力轉換 單凡’ β亥電力轉換單元可包含驅動器以允許燈泡由ac線 路電壓/電流供f且提供光源調光能力。在—些實施例 154446.doc 201144685 中，電源供應器可包含使用非隔離之準諧振返驰拓撲之離 線恆定電流LED驅動器。LED驅動器可裝設於燈内且在一 些實施例中，LED驅動器可包含一小於25立方公分之體 積，而在其他實施例中，LED驅動器可包含一約2〇立方公 分之體積。在一些實施例中，電源供應器可為非可調光 的，但成本較低。應理解，所使用之電源供應器可具有不 同拓撲或幾何形狀，且亦可為可調光的。 磷光體載體62被包括於空腔54之頂部開口之上，且在所 展示之貫細< 例中，填光體載體62覆蓋整個開口 β空腔開口 經展不為圓形的且磷光體载體62為圓盤，但應理解，空腔 開口及磷光體载體可為許多不同形狀及大小。亦應理解， 磷光體載體62可不覆蓋整個空腔開口。可將根據本發明之 磷光體載體特徵化為包含轉換材料及導熱透光材料。該透 光材料可對於自光源58發射之光透明，且該轉換材料應為 吸收來自光源之波長之光且重新發射不同波長之光的類 型。在所展示之實施例中，導熱透光材料包含一載體層 64，且轉換材料包含載體層64上之磷光層66。如下文進一 步描述，不同實施例可包含載體層及磷光層之許多不同配 置。 §來自光源58之光被填光層66中之鱗光體吸收時，光在 各向同性方向上被重新發射，其中約5〇%之光係向前發射 且50%之光係向後發射至空腔54中。在具有保形磷光層之 先則LED中，向後發射之光之顯著部分可被導引回至lED 中且光逃逸之可能性受LED結構之提取效率限制。對於一 154446.doc •19· 201144685 些LED，提取效率可為約7〇%，因此自轉換材料導引回至 LED中之光的某百分比可能損失。在根據本發明之具有遠 端磷光體組態之燈中，LED位於空腔54之底部處的平台56 上’向後發射之磷光體光中之較高百分比的光撞擊空腔之 表面而非LED。對此等表面塗佈以反射層53增加了反射回 至磷光層66(在磷光層66處，光可自燈發射）中之光的百分 比。此等反射層53允許光學腔使光子有效地再循環，且增 加燈之發射效率。應理解，反射層可包含許多不同材料及 結構，包括（但不限於）反射金屬或多層反射結構（諸如，分 佈式布拉格（Bragg)反射器）。在不具有光學腔之實施例中 亦可包括反射層。在將LED安裝於平面表面上或基座上的 實施例中，亦可在LED周圍包括反射層，以按照與具有光 學腔之實施例中之反射層非常相同的方式增加效率。 載體層64可由具有〇_5 w/m-k或〇5 w/mk以上之熱導率 的許多不同材料製成，諸如石英、碳化矽（Sic)(熱導率為 120 W/m k)、玻璃（熱導率為m·4 w/m_k)或藍寶石（熱 導率為〜40 W/m-k)。磷光體載體亦可取決於所使用之材料 而具有不同厚度，其中合適之厚度範圍為〇1 mm至1〇 或10 mm以上。應理解，亦可取決於用於載體層之材料之 特I"生而使用其他厚度。材料應厚得足以針對特定操作條件 提供足夠的橫向散熱。大體而言’材料之熱導率愈高，材 料可忐愈薄，同時仍提供必要之熱耗散。不同因素可影響 使用那種載體層材料，不同因素包括（但*限於）成本及對 光源光之透明度。一些材料亦可能更適合於較大直徑，諸 154446.doc •20· 201144685 如玻璃或石英。藉由在較大直徑之載體層上形成磷光層且 接著將載體層單切（singulation)成較小載體層，此等材料 可提供降低之製造成本。 許多不同磷光體可用於磷光層66中，其中本發明特別適 應於發射白光之燈。如上文所描述，在一些實施例中，光 源58可為基於LED之光源且可發射藍色波長光譜之光。磷 光層可吸收一些藍光且重新發射黃光。此情形允許燈發射 藍光與黃光之白光組合。在一些實施例中，藍色LED光可 由使用可購得之YAG:Ce磷光體之黃色轉換材料來轉換， 但使用由基於（Gd’YMALGahOaCe系統（諸如，Cree, Inc. purchased their LED chips or LED packages. Light source 58 can be mounted to platform 56 using a number of different known mounting methods and materials, with light from source 58 being emitted from the top opening of cavity 54. In some embodiments, the light source 58 can be mounted directly to the platform 56, while in other embodiments, the light source can be included on a sub-substrate or (4) circuit board (pCB), which is then printed on the sub-substrate or printed circuit board (PCB) ) is mounted to platform 56. Platform 56 and heat sink '·,. The structure 52 can include conductive paths for applying electrical signals to the light source 58, wherein the conductive paths are conductive traces or wires. All or part of the platform % may also be made of a thermally conductive material and the thermally conductive material may be thermally bonded to the heat sink structure 52 or integrated with the heat sink structure 52. In a two-part embodiment, the light sources of the lamps can be provided in the form of an array of coplanar illuminators that are mounted on a flat or planar surface. The eight-plane light source reduces the complexity of the illuminator configuration, making the illuminator 2 easier and less expensive. However, coplanar light sources tend to emit primarily in the directing direction (such as in accordance with the Lambertian emission pattern). The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials including: the same metal (such as copper or aluminum) or a metal alloy can be used. In some embodiments, the heat sink can comprise high purity aluminum. The high purity may have a thermal conductivity of about 21 〇 w/m_k under the shirt. In other embodiments, the heat sink structure may comprise die cast aluminum, the die cast aluminum has a heat conductivity of about 200 W/mk, and the heat sink structure 52 may also include other heat dissipation features (Justice hot sheets 60), such other heats. The dissipation feature increases the surface area of the heat sink to promote more efficient dissipation of heat into the environment. In some embodiments 154446.doc 201144685 the heat sinking strip 60 may be made of a material having a higher thermal conductivity than the remainder of the heat sink. In the illustrated embodiment, the Korean tabs are shown in a generally horizontal orientation, although it should be understood that in other embodiments, the fins may have a vertical or angled orientation. Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of optical cavity 54. In some embodiments, the surfaces may be coated with a material having a reflectance of about 75% or more for visible wavelength light ("light") emitted by light source 58 and/or wavelength converting material. In other embodiments, the material may have a reflectivity of about 85% or more for the light. In still other implementations, the 35 material may have a reflectivity of about 95% or more for the light. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type used in conventional electrical sockets. For example, the fin structure can include features for mounting to a standard threaded mount (four) that can include a threaded portion that can be screwed into the threaded seat. In other embodiments, the fin structure It may include a standard plug and the electrical socket may be a standard socket' or the heat sink structure may comprise a GU24 base unit, or the heat sink structure may be a clip and the electrical socket may be a socket for receiving and holding the clip (eg 'like many fires Used in light fixtures. These are only a few of the options for heat sink construction and sockets' and other configurations that safely deliver electricity from the socket to the lamp 50. The lamp according to the invention may comprise a The power conversion unit can include a driver to allow the bulb to be supplied by the ac line voltage/current and provide light source dimming capability. In some embodiments 154446.doc 201144685, the power supply can include non-isolated An off-line constant current LED driver of a quasi-resonant flyback topology. The LED driver can be mounted within the lamp and in some embodiments, the LED driver can comprise a less than 25 cubic centimeters Volume, while in other embodiments, the LED driver can comprise a volume of about 2 cubic centimeters. In some embodiments, the power supply can be non-dimmable, but at a lower cost. It should be understood that The power supply can have a different topology or geometry and can also be dimmable. The phosphor carrier 62 is included over the top opening of the cavity 54, and in the thinness shown, in the example, fills the light The body carrier 62 covers the entire opening. The cavity opening is not circular and the phosphor carrier 62 is a disk, but it should be understood that the cavity opening and the phosphor carrier can be of many different shapes and sizes. The phosphor carrier 62 may not cover the entire cavity opening. The phosphor carrier according to the present invention may be characterized as comprising a conversion material and a thermally conductive light transmissive material. The light transmissive material may be transparent to light emitted from the light source 58, and the conversion The material should be of the type that absorbs light from the wavelength of the source and re-emits light of different wavelengths. In the illustrated embodiment, the thermally conductive light transmissive material comprises a carrier layer 64 and the conversion material comprises a carrier layer 64 Light layer 66. As further described below, different embodiments may include many different configurations of the carrier layer and the phosphor layer. § Light from source 58 is absorbed by the scales in fill layer 66, and the light is in an isotropic direction. Re-emitted, wherein about 5% of the light is emitted forward and 50% of the light is emitted back into the cavity 54. In a pre-LED with a conformal phosphor layer, a significant portion of the back-emitting light can be The possibility of guiding back into lED and the light escape is limited by the extraction efficiency of the LED structure. For some LEDs, the extraction efficiency can be about 7〇%, so the self-converting material is guided back to the LED. A percentage of the light in the light may be lost. In a lamp having a remote phosphor configuration in accordance with the present invention, the LED is located on the platform 56 at the bottom of the cavity 54 at a higher percentage of the phosphor light that is emitted backwards. Light strikes the surface of the cavity rather than the LED. The surface coating with the reflective layer 53 increases the percentage of light that is reflected back to the phosphor layer 66 (at the phosphor layer 66, the light can be emitted from the lamp). These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. A reflective layer can also be included in embodiments that do not have an optical cavity. In embodiments where the LEDs are mounted on a planar surface or on a pedestal, a reflective layer can also be included around the LED to increase efficiency in much the same manner as a reflective layer in an embodiment having an optical cavity. The carrier layer 64 may be made of many different materials having a thermal conductivity of 〇_5 w/mk or more than 5 w/mk, such as quartz, tantalum carbide (Sic) (thermal conductivity: 120 W/mk), glass ( The thermal conductivity is m·4 w/m_k) or sapphire (thermal conductivity is ~40 W/mk). The phosphor support may also have different thicknesses depending on the materials used, with suitable thicknesses ranging from 〇1 mm to 1 或 or more. It should be understood that other thicknesses may also be used depending on the particular material used for the material of the carrier layer. The material should be thick enough to provide adequate lateral heat dissipation for specific operating conditions. In general, the higher the thermal conductivity of the material, the thinner the material, while still providing the necessary heat dissipation. Different factors can influence the use of that carrier layer material, and different factors include (but are limited to) cost and transparency to the source light. Some materials may also be more suitable for larger diameters, such as glass or quartz. Such materials can provide reduced manufacturing costs by forming a phosphor layer on a larger diameter carrier layer and then singulating the carrier layer into smaller carrier layers. A number of different phosphors can be used in the phosphor layer 66, with the invention being particularly suitable for emitting white light lamps. As described above, in some embodiments, light source 58 can be an LED based light source and can emit light of a blue wavelength spectrum. The phosphor layer absorbs some blue light and re-emits yellow light. This situation allows the lamp to emit a combination of blue and yellow light. In some embodiments, the blue LED light can be converted by a yellow conversion material using a commercially available YAG:Ce phosphor, but is used based on (Gd'YMALGahOaCe system (such as,

YsAlsOaCMYAG))之磷光體製成之轉換粒子，可能獲得全YsAlsOaCMYAG)) Phosphors made of converted particles, may get full

範圍之寬廣黃光光譜發射。可用於在與基於藍色發光LED 之發光器一起使用時產生白光的其他黃色磷光體包括（但 不限於）：A wide range of broad yellow light emission. Other yellow phosphors that can be used to produce white light when used with an illuminator based on a blue LED include, but are not limited to:

Tb3.xREx012:Ce(TAG) ; RE=Y，Gd，La，Lu ;或Tb3.xREx012: Ce(TAG); RE=Y, Gd, La, Lu; or

Sr2-x-yBaxCaySi〇4:Eu 〇 磷光層亦可配置有一個以上磷光體，該一個以上磷光體 混合於磷光層66中抑或作為單獨的磷光層/區垂直地或橫 向地位於載體層64上。在-些實施例中，該兩㈣光體中 之每-者可吸收LED光且可重新發射不同色彩之光。在此 等實施例中，可將來自該兩㈣光層之色彩組合以用於達 成具有不同自色色調之較高CRI白色（暖白色）。此情形可 el括可與來自紅色麟光體之光組合的上文之來自黃色峨光 體之光。可使用不同紅色磷光體，包括： 154446.doc •21 · 201144685The Sr2-x-yBaxCaySi〇4:Eu 〇 phosphor layer may also be provided with more than one phosphor, the one or more phosphors being mixed in the phosphor layer 66 or being placed vertically or laterally on the carrier layer 64 as a separate phosphor layer/region. . In some embodiments, each of the two (four) light bodies can absorb LED light and can re-emit light of different colors. In such embodiments, the colors from the two (four) light layers can be combined for achieving a higher CRI white (warm white) with a different self-color hue. In this case, the light from the yellow phosphor can be combined with the light from the red plexisphere. Different red phosphors can be used, including: 154446.doc •21 · 201144685

SrxCa^xSiEu，Υ ; 卣化物；SrxCa^xSiEu, Υ; telluride;

CaSiAlN3:Eu ;或CaSiAlN3:Eu; or

Sr2-yCaySi〇4:Eu 〇 其他磷光體可用以藉由將實質上所有光轉換成一特定色 彩而產生彩色發光。舉例而言，以下磷光體可用以產生綠 光：Sr2-yCaySi〇4:Eu 〇 Other phosphors can be used to produce colored luminescence by converting substantially all of the light into a particular color. For example, the following phosphors can be used to produce green light:

SrGa2S4：Eu ； Sr2-yBaySi〇4:Eu ;或 SrSi2〇2N2:Eu。 下文列出一些額外的適合用作磷光層66之轉換粒子的磷 光體’但可使用其他鱗光體。每—填光體展現在藍色及/ 或UV發光光譜中之敏勵， 效率的光轉換，且具有 shift): 提供一所要峰值發光，具有有 可接受之斯托克位移（St〇kes 黃色/綠色 (Sr，Ca，Ba)(Al，Ga)2S4:Hu2+SrGa2S4: Eu; Sr2-yBaySi〇4: Eu; or SrSi2〇2N2: Eu. Some additional phosphors suitable for use as the conversion particles of the phosphor layer 66 are listed below, but other scales may be used. Each-filler exhibits sensitization in the blue and/or UV luminescence spectrum, efficient light conversion, and has shift): Provides a desired peak luminescence with an acceptable Stokes shift (St〇kes yellow) /Green (Sr,Ca,Ba)(Al,Ga)2S4:Hu2+

Ba2(Mg,Zn)Si2〇7：Eu2+Ba2(Mg,Zn)Si2〇7:Eu2+

Gd〇.46Sr〇.3iAl,.23〇xF,.38：Eu2+0 06 (Bai.x.ySrxCay)Si04：EuGd〇.46Sr〇.3iAl,.23〇xF,.38:Eu2+0 06 (Bai.x.ySrxCay)Si04:Eu

Ba2Si04：Eu2+ 紅色Ba2Si04: Eu2+ red

Lu2〇3 :Eu3 + (Sr2.xLax)(CeI.xEux)04Lu2〇3 :Eu3 + (Sr2.xLax)(CeI.xEux)04

Sr2Cei.xEux04 154446.doc •22- 201144685Sr2Cei.xEux04 154446.doc •22- 201144685

Sr2.xEuxCe04 SrTi03：Pr3 + 5Ga3 +Sr2.xEuxCe04 SrTi03:Pr3 + 5Ga3 +

CaAlSiN3:Eu2+CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ 可使用不同大小之填光體粒子，包括（但不限於）在1〇奈 米（nm)至30微米（Mm)或30微米（μϊη)以上之範圍内的粒子。 在散射及混合色彩方面，較小粒子大小通常比較大之粒子 更佳，以提供更均勻之光。與較小粒子相比較，較大粒子 通常在轉換光方面更有效率，但發射較不均勻之光。在一 些實施例中，磷光體可在黏合劑中提供於磷光層66中，且 磷光體亦可具有在黏合劑中的不同濃度或負載之磷光體材 料。典型濃度在30重量％至70重量％之範圍内。在一實施 例中，碌光體濃度為約65重量％，且較佳均勻地分散於整 個退端磷光體中。磷光層66亦可具有具不同轉換材料及不 同濃度之轉換材料的不同區。 不同材料可用於黏合劑，其中材料較佳在固化之後堅固 且實質上在可見波長光譜内為透明的。合適材料包括聚矽 氧、環氧樹脂、玻璃、無機玻璃、介電質、BCB、聚醯 • 胺、聚合物及其混成物，其中較佳材料為聚矽氧（此係由 . 於聚矽氧在高功率LED中之高透明度及可靠性）。合適之基 方、本基及甲基之聚石夕氧可自D〇w® Chemical購得。可使用 許多不同的固化方法來使黏合劑固化，此取決於諸如所使 用之黏合劑之類型的不同因素。不同固化方法包括（但不 限於）熱固化、紫外線（UV)固化、紅外線（IR)固化或空氣固 154446.doc •23· 201144685 化。 可使用不同製程來塗覆磷光層66，不同製程尤其包括 (但不限於）噴塗、旋塗、濺鍍、印刷、粉末塗佈、電泳沈 積（EPD)、靜電沈積。如上文所提及，磷光層66可連同黏 合劑材料一起塗覆’但應理解’不要求黏合劑。在另外其 他實施例中’可分開地製造磷光層66且接著將磷光層66安 裝至載體詹64。 在一實施例中’可將磷光體-黏合劑混合物喷塗或分散 於載體層64之上’接著使黏合劑固化以形成磷光層66。在 此等實施例中之一些實施例中，可將磷光體_黏合劑混合 物噴塗或分散於經加熱之載體層64上，以使得當磷光體黏 合劑混合物接觸載體層64時’來自載體層64之熱散佈於黏 合劑中且使黏合劑固化。此等製程亦可包括磷光體-黏合 齊J /¾合物甲之溶劑，該溶劑可使混合物液化且降低混合物 之黏度，從而使得混合物可更適合於喷塗。可使用許多不 同溶劑，包括（但不限於）甲苯、苯、二f苯（2>?1^6)或可自 Dow Corning®購得之os_2〇，且可使用不同濃度之溶劑。 當將溶劑-磷光體-黏合劑混合物喷塗或分散於經加熱之載 體層64上時，來自載體層64之熱使溶劑蒸發，其中載體層 之溫度影響溶劑蒸發之迅速程度.來自載體層64之熱亦可 使混合物_之黏合劑固化，從而在載體層上留下固定的磷 光層。可將載體層64加熱至許多不同溫度，此取決於所使 用之材料及所要之溶劑蒸發及黏合劑固化速度。合適之溫 度範圍為90eC至150t，但應理解，亦可使用其他溫度。 I54446.doc •24- 201144685 各種沈積方法及系統描述於Donofrio等人之題為「Systems and Methods for Application of Optical Materials to Optical Elements」之美國專利申請公開案第2010/0155763號中， 而且該公開案已讓與給Cree，Inc.且該公開案之全部内容併 入本文中。 填光層66可具有許多不同厚度，此取決於構光體材料之 濃度及待由磷光層66轉換的所要光量。根據本發明之礙光 層可以高於30%之濃度位準（磷光體負載）來塗覆。其他實 施例可具有高於50°/。之濃度位準，而在另外其他實施例 中，濃度位準可咼於60%。在一些實施例中，破光層可具 有在10微米至100微米之範圍内的厚度，而在其他實施例 中，磷光層可具有在40微米至50微米之範圍内的厚度。 上文所描述之方法可用以塗覆相同或不同填光體材料的 多個層，且可使用已知遮蔽及/或印刷製程在載體層之不 同區域/區中塗覆不同磷光體材料。上文所描述之方法提 供針對磷光層66之某種厚度控制，但對於甚至更大之厚度 控制’可使用已知方法來研磨磷光層以降低磷光層66之厚 度或整平整個層之上的厚度《此研磨特徵提供附加之優 點：能夠產生在CIE色度圖上之單一分選等級内發射的 燈。分選大體上為此項技術中已知的且意欲確保提供給終 端客戶之LED或燈發射在可接受之色彩範圍内的光。可測 試該等LED或燈並按色彩或亮度來將該等LED或燈分類成 不同分選等級（在此項技術中大體上稱作分選）。每一分選 等級通常含有來自一個色彩及亮度群組之LED或燈，且通 154446.doc •25· 201144685 常係由一分選等級碼來識別。可藉由色度（色彩）及發光通 量（亮度）來分類白色發光LED或燈。對磷光層之厚度控制 藉由控制由磷光層轉換之光源光之量而在產生發射在目標 分選等級内之光的燈之方面提供較大控制。可提供具有相 同厚度之磷光層66的多個磷光體載體62。藉由使用具有實 質上相同發光特性之光源58，可製造具有幾乎一色點 (color point)之燈，該色點在一些例子中可屬於單一色彩 分選等級内。在一些實施例中，燈發光屬於自CIE圖上之 點的標準偏差内，且在一些實施例中，該標準偏差包含小 於10-步階（10-step)麥克亞當橢圓（McAdams ellipse)。在一 些實施例中，燈之發光屬於以CIExy(〇_313，0.323)為中心 之4-步階麥克亞當橢圓内。 可使用不同的已知方法或材料（諸如，導熱結合材料或 熱油脂）將破光體載體62安裝及結合於空腔54中之開口之 上。習知的導熱油脂可含有諸如氧化鈹及氮化鋁之陶瓷材 料，或諸如膠質銀之金屬粒子。在其他實施例中，可使用 導熱器件（諸如，夾鉗機構、螺絲或熱黏著劑）將磷光體載 體安裝於開口之上，從而將磷光體載體62緊緊地固持至散 熱片結構’以使熱導率最大化。在一實施例中，使用具有 約μηι之厚度&k=0.5 w/m_k之熱導率的熱油脂層。此配 置提供用於耗散來自磷光層66之熱的有效率之導熱路徑。 在燈50之操作期間，磷光體轉換加熱集中於磷光層μ中， 諸如集中於罐光層66之中心中，大多數LED光在鱗光層66 中撞擊罐光體載體62且穿過碟光體載體62。載體層64 154446.doc -26· 201144685 之導熱性冑使此熱在橫向上 佈，如由第-熱流顺示。在;VI載體62之邊緣散 且進入散熱片結構52中，如藉由\邊緣處熱穿過熱油脂層 片結構52中，埶可有效座—熱流72展示，在散熱 …、了有效率地耗散至環境中。 如上文所論述’在燈5〇中， 接< 耦人.,^ α 56與散熱片結構52熱連 接次耦σ。此耦合配置導致磷 邱八丘田m 尤體載體62與彼光源58至少 4刀共用用於耗散熱之導埶路 56夕丄 ‘、 來自光源58的穿過平台 56之熱（如由第三熱流74 /、）亦可散佈至散敎片仕構52。 自磷光體載體62流入至散孰片^52φ /U52 Α ”乃、構52中之熱亦可流入至平 〇 。如下文進-步描述’在其他實施例中，磷光體載 體=光源58可具有用於耗散熱之單獨的導熱路徑，其中 此等單獨路徑被稱作「解耦」。 應理解，填光體載體可以除圖3中所展示之實施例之外 的許多不同方式來配置。此等不同實施例中之一些實施例 展示於圖4至圖10中，但應理解’在其他實施例中，可能 有夕得夕的配置。圖4展示根據本發明之麟光體載體8〇之 另一實施例，磷光體載體80包含載體層82及磷光層84，載 體層82與磷光層84可由上文所描述之相同材料製成且可使 用相同製程來形成。在此實施例中，磷光層84在載體層82 之底面上’以使得來自LED光源之光首先穿過磷光層84» 經轉換之光及穿過磷光層84洩漏之LED光接著穿過載體層 82。在此配置中，載體層82應對於來自磷光層84與LED光 源兩者之光透明。在此實施例中，磷光層84不需要覆蓋載 體層82之整個底面。實情為，載體層82之邊緣可不被磷光 154446.doc -27- 201144685 層84覆蓋以允許與散熱片良好熱接觸。然而，在一些實施 例中，磷光層84可覆蓋載體層82之整個底面。 圖5展示根據本發明之磷光體載體1〇〇之再一實施例，磷 光體載體100並非包含單獨的磷光層及載體層，而是包含 載體層102,其中磷光體1〇4分散於整個載體層1〇2中。正 如同先前實施例，當磷光體在轉換期間產生熱時，熱在橫 向上散佈於整個載體層1〇2内，在載體層丨〇2中熱可耗散於 散熱片中》在此實施例中，磷光體1〇4以幾乎均勻之濃度 分散於載體層中，但應理解，在其他實施例中，磷光體 1〇4在載體層102之不同區中可具有不同濃度。亦應理解， 一個以上磷光體可包括於載體層中，其均勻地分散抑或分 散於不同濃度之區中。 圖6展示根據本發明之磷光體載體12〇之另一實施例，磷 光體載體120亦包含載體層122及磷光層124，載體層122及 磷光層124類似於上文所描述及圖3中所展示之彼等相同元 件。在此實施例中，散射粒子層126可包括於載體層122上 且經展示於磷光層124上。應理解，散射粒子層126可位於 載體層上或載體層中之許多不同位置中。包括該散射粒子 層以使光在自填光體載體層120發射時分散，以賦予光所 要發射圖案。在此實施例中，散射粒子經配置以使光以大 體上均勻圖案分散。 在一些實施例中，可使用上文參考磷光層之沈積所描述 之方法來沈積散射粒子層，且散射粒子層可包含密集充填 之粒子。散射粒子亦可包括於黏合劑材料中，該黏合劑材 154446.doc • 28 · 201144685 料可與上文參考與磷光層一起使用之黏合劑所描述的彼等 黏σ劑材料相同。散射粗子層可取決於所使用之塗覆及材 料而”有不同濃度之散射粒子。合適之散射粒子濃度範圍 為0_01 /。至0.2% ’但應理解濃度可更高或更低。在一些 實施例中，濃度可低❹卿/。。亦應理.解，散射粒子層 126在不同區中可具有不同濃度之散射粒子。對於-些散 射粒子，可能存在歸因於較 权円，辰度之吸收而產生的損失之 增加。因此，可選擇散射粒 失蓊宝η * ± 子之濃度以便維持可接受之損 失數子，㈣時使光分散以提供所要發射圖案。 散射粒子可包含許多不同 矽膠； 匕括（但不限於）： 氧化辞（ΖηΟ); 氧化釔（Υ203); 二氧化鈦（Ti02); 硫酸鋇（BaS04); 氧化鋁（A1203); 熔融二氧化石夕（Si02); 煙霧狀二氧化矽（Si02); 氮化鋁； 玻璃微珠； 二氧化鍅（Zr02); 碳化矽（SiC); 氧化钽（Ta05); 氮化矽（Si3N4); 154446.doc -29· 201144685 氧化鈮（Nb205); 氮化硼（BN);或 碌光體粒子（例如，YAG:Ce, b〇se) 可使用呈各種材料組合或相同材料之不同形式之組合的一 種以上散射材料㈣柄定散射效應。應轉，在立他實 施例中，散射粒子可包括於载體層122、磷光層124或載體 層122與碌光層124兩者中。 圖7展示根據本發明之磷光體載體140之另一實施例，鱗 光體載體M0具有載體層142及磷光體⑷，載體層142及鱗 光體144類似於上文所描述及圖5中所展示之相同元件。在 此實施例中’散射粒子146分散於載體層M2中以使穿過載 體層M2之㈣光與碟光體光兩者分散。可使用與上文所 描述之彼等散射粒子相同的散射粒子，且在不同實施例 中’可以不同濃度來包括該等散射粒子。其他實施例可包 含不同濃度之區’以便使穿過載體層之光散射成所要發射 圖案。 圖8展示根據本發明之磷光體載體16〇之另一實施例，磷 光體載體160包含载體層！ 62及在載體層162之底面上的磷 光層164，載體層162與磷光層164兩者係以類似於上文所 描述及圖4中所展示之相同元件的方式配置。在此實施例 中’散射粒子層166包括於載體層162之頂面上，且可具有 以與圖6中之散射粒子層126相同之方式沈積的相同材料。 在一些實施例中’散射粒子層i 66中之散射粒子可經配置 以使來自磷光層164之光以及穿過磷光層164洩漏之LED光 -30- 154446.doc 201144685 兩者散射。在另外其他實施例中，散射粒子可經配置以僅 使此等光中之一者散射。應理解，散射粒子亦可分散於載 體層162或磷光層164或載體層162與磷光層164兩者中。 磷光體載體之其他實施例亦可包含用以增強自燈之光提 取的特徵。特定量之光可在逃逸角之外撞擊載體層或破光 層之表面，使得光將被朝向散熱片結構之空腔反射回。此 光中之一些光可被吸收’而光之其他部分可經歷全内反射 (TIR)。圖9展示磷光體載體18〇之一實施例，磷光體載體 180具有經配置以降低此等損失之特徵^類似上述實施 例’磷光體載體包含載體層182及磷光層184❶在此實施例 中’磷光層之表面經粗糙化或成形以提供變化之表面角。 此情形可增加光將在光之逃逸角内撞擊該表面之可能性以 使得光可有助於有用的發射。可使用已知的粗糙化或蝕刻 ‘程來成形s亥表面。鱗光體載體層18〇亦可在不同位置處 配置有散射粒子以使光分散，如上文所描述。 可在根據本發明之磷光體載體之不同表面上包括成形或 粗糙化。圖10展示根據本發明之磷光體載體2〇〇之另一實 施例’磷光體載體200包含載體層202及磷光層204。在此 實施例中’經成形/粗糙化之層被提供於載體層2〇2之頂面 上’同時磷光層提供於粗糙化表面上。經成形/粗糙化之 表面提供變化之表面，從而增加光穿過磷光體載體2〇〇逃 逸之可能性。粗糙化表面可包括於載體層2〇2之其他表面 上’且磷光體載體2〇〇亦可配置有如上文所描述之散射粒 子。應進一步理解，粗糙化表面可包括於上文所描述的不 154446.doc 201144685 同磷光體載體層實施例之表面中之任一者上。 根據本發明之燈可包含除上文所描述之彼等特徵之外的 許多不同特徵。再次參看圖3，在一些實施例中空腔^ 可填充有透明熱材料以S-步增強燈之熱耗散。空腔 傳導材料可提供用於耗散來自光源58之熱的次要路徑。來 自光源之熱仍將經由平台56傳導，<旦亦可穿過空腔材料至 散熱片結構52。此情形將允許光源58之較低操作溫度，但 對於磷光體載體62造成升高之操作溫度的危險。此配置可 用於許多不同實施例中，但特別適用於具有較高光源操作 溫度之燈（與磷光體載體之操作溫度相比較）。此配置在可 谷忍對磷光體載體層之額外加熱的應用中允許更有效率地 自光源散佈熱。 如上文所論述，根據本發明之不同燈實施例可配置有許 多不同類型之光源。圖u展示燈21〇之另一實施例，燈21〇 類似於上文所描述且在圖3中所展示之燈5〇。燈21〇包含具 有空腔214之散熱片結構212，空腔214配置有平台216以固 持光源218。磷光體載體22〇可包括於空腔214之開口之上 且至少部分覆蓋該開口。在此實施例中，光源21 8可包含 複數個LED，該複數個LED配置於單獨LED封辱中或配置 於單-多LED封裝中之陣财^在每—實施例中，發光器 可以不同的串聯及並聯配置耗接。在一實施例中，可使用 八個LED，該八個LED藉由兩個電線而串聯連接至電路 板。可接著將該等電線連接至上文所描述之電源供應器單 元。在其他貫施例中，可使用八個以上或八個以下led， 154446.doc •32· 201144685 且如上文所提及，可使用可自Cree, Inc.購得之LED，包括 八個 XLamp® XP-E LED或四個 XLamp® XP-G LED。不同 的單串LED電路描述於以下美國專利申請案中：van de Ven 等人之題為「Color Control of Single String Light Emitting Devices Having Single String Color Control」之 美國專利申請案第12/566,195號，及van de Ven等人之題為 「Solid State Lighting Apparatus with Compensation Bypass Circuits and Methods of Operation Thereof」之美國 專利申請案第12/704,730號，該兩個申請案皆以引用的方 式併入本文中。 對於包含單獨LED封裝之實施例，該等LED中之每一者 可包含其自身之LED主要光學器件或透鏡222。在具有單 一多LED封裝之實施例中，單一主要光學器件或透鏡224 可覆蓋所有LED。應理解，該等LED可不具備透鏡，且在 陣列實施例中’該等LED中之每一者可具有其自身之透 鏡。同樣地，可以「散熱片上晶片」或「板上晶片」組態 來提供未封裝之LED。亦應理解，每一 LED可具備以不同 方式配置之次要光學器件。類似燈5〇 ’散熱片結構及平台 〒配置有必要之電跡線或電線以將電信號提供至光源 218。 在上文所描述之燈5〇及21〇中，光源與磷光體載體共用 用於耗散熱之熱路徑（稱作熱耦合）。在一些實施例中，若 用於磷光體載體與光源之熱路徑未熱連接（稱作熱解耦）， 則磷光體載體之熱耗散可得以增強。圖12展示根據本發明 154446.doc •33- 201144685 之燈240之另一實施例，燈240亦包含具有空腔244之散熱 片結構242，該空腔244具有用於安裝光源248之平台246。 罐光體載體250藉由導熱材料而安裝於空腔244之開口之上 且至少部分覆蓋該開口 ’以使得來自光源之光中之至少一 些光穿過磷光體載體250。在此實施例中，散熱片結構242 及平台246具有實質上彼此熱隔離之單獨熱耗散路徑（雖然 對流可造成兩個路徑之間的某種熱耦合）。來自光源248之 熱沿著第四熱流252傳導且穿過平台246，在平台246中， 熱可耗散至環境中或另一散熱片結構（未展示）（諸如，燈之 連接件）中。來自磷光體載體250之熱沿著第五熱流254傳 導且進入散熱片結構242中，在散熱片結構242中，熱耗散 至環境中。散熱片結構242與平台246之間的熱分離可藉由 以下途徑來提供：藉由該兩者之實體分離，或藉由在該兩 者之間提供熱阻材料’諸如經由已知之熱絕緣體（例如， 介電質）。 圖13為展示與具有載體層之遠端磷光體載體的操作溫度 相比較的保形磷光體材料之峰值操作溫度的曲線圖26〇， 該等載體層具有不同熱導率且經配置以使得熱可經由如上 文所描述之熱路徑耗散。曲線圖260進一步比較熱輕合及 熱解耗之散熱片的此等不同配置之熱效能。第一實線262 展示具有如上文所描述熱解耦之散熱片的發光器之接面溫 度’且第二貫線264展示針對熱搞合之散熱片的發光器之 接面溫度。耦合配置之操作溫度稍微低於解耦配置之操作 溫度。第一虛線266展示具有具保形磷光體塗層之LED與 154446.doc -34 - 201144685 熱解耦之散熱片的燈的峰值磷光體溫度。第二虛線268展 不具有熱輕合之散熱片之相同燈的峰值磷光體溫度。在保 形塗層配置中’磷光體在大體上一致之峰值磷光體溫度下 操作’且熱耦合之燈在低於解耦配置之峰值磷光體溫度的 峰值磷光體溫度下操作。 比較地’第三實線270展示配置於熱搞合之散熱片上之 遠端磷光體載體的峰值磷光體溫度，其中溫度係針對具有 在〇,2 w/m-K至1〇〇 w/m-K以上之範圍内之不同熱導率的載 體層量測。第四實線272展示相同的遠端磷光體載體及相 同的熱導率範圍，其中磷光體載體位於熱解耦之散熱片 上。具有具高於1.05 W/m-k之熱導率的載體層且配置於熱 解輕之散熱片上的遠端磷光體載體可以較低磷光體溫度操 作’因此達成比保形構光體塗佈之LED高的轉換效率。此 情形允許使用諸如常規玻璃、熔融石英、藍寶石及碳化矽 之材料。可使用熱耦合之散熱片，但熱耦合之散熱片要求 稍微較高之熱導率且在比熱耦合之配置高的溫度下操作。 圖14展示根據本發明之燈270之另一實施例，燈270係以 不同方式配置以提供所要之遠端磷光體及填光體載體之 熱特性。燈270包含安裝於散熱片結構274之頂面上的光源 272。散熱片結構可由如上文所描述之導熱材料製成，且 包含諸如鰭片275之熱耗散結構，在操作期間，熱自光源 272散佈至散熱片結構274中，在散熱片結構274中熱散 佈至鰭片275及環境中。 燈270亦包含具有套環空腔278之燈套環276，燈套環276 154446.doc -35- 201144685 女裝於散熱片結構274之頂面上。套環空腔278延伸穿過燈 套環，使得其在底部及頂部處為開放的。當燈套環276安 裝至散熱片結構274時，光源272經配置以使得光源272自 套環空腔278之頂部開口發出光。在此實施例中，光源272 亦經配置以使得光源272在套環空腔278内。 磷光體載體280藉由如上文所描述之導熱材料或器件而 安裝於套環空腔278之頂部開口之上。磷光體載體28〇經配 置以使得來自光源272之光穿過磷光體載體28〇，在磷光體 載體280中’光中之至少—些光被轉換光體載體綱可 配置有上文所描述之不同實施例中所描述的結構及特徵， 包括（但不限於）載體層、磷光體、散射粒子及/或粗糙化/ 成形。燈套環276亦係由導熱材料製成’以使得來自磷光 體載體280之熱散佈至燈套環276中。來自燈套環276之熱 可直接耗散至環境中或可散佈至散熱片結構274中，在散 熱片結構274中，熱可散佈至環境中。用於磷光體載體及 光源之熱路徑經耦合，以使得來自磷光體載體之熱及來自 燈套環276之熱可散佈至散熱片結構274中’且光源熱可自 散熱片結構274散佈至燈套環27卜燈套環276亦具有裙部 282，裙部282緊密地裝設於散熱片結構274之頂部部分周 圍以允許燈套環276與散熱片結構274之間 -為展示用於燈27。中之不同遠端碟光體載=作 特性的曲線圖285。第-虛線286展示燈之底座或板溫度， 對於解輕之散熱片，該底座或板溫度保持恆定處於約 74.7°C。第二虛線288展示根據本發明之遠端鱗光體載體 I54446.doc -36 · 201144685 之不同π施例中的磷光體之峰值溫度。對於具有旋塗之磷 光層的5 mm厚之玻璃及對於具有旋塗之磷光層的〇.5 mm 厚之藍寶石，峰值磷光體操作溫度低於底座之溫度。類似 :上文此情形允許碌光體的較大之發射效率及較少的與 熱有關之降級。 雖然已參考本發明之特定較佳組態詳細描述本發明，但 八他版本係可能的。因此，本發明之精神及範疇不應限於 上文所描述之版本。 【圖式簡單說明】 圖1展示先前技術LED燈之一實施例的截面圖； 圖2展示先前技術LED燈之另一實施例的截面圖； 圖3為根據本發明之燈之一實施例的截面圖； 圖4為根據本發明之磷光體載體之另一實施例的截面 圖； 圖5為根據本發明之磷光體載體之另一實施例的截面 圖； 圖6為根據本發明之磷光體載體之另一實施例的截面 圖； 圖7為根據本發明之磷光體載體之另一實施例的截面 圖； 圖8為根據本發明之磷光體載體之另一實施例的截面 圖； 圖9為根據本發明之磷光體載體之另一實施例的戴面 圖； 154446.doc • 37- 201144685 圖ίο為根據本發明之磷光體載體之再一實施例的截面 圖； 圖11為根據本發明之燈之另一實施例的截面圖； 圖12為根據本發明之燈之另一實施例的截面圖； 圖13為展示根據本發明之燈之不同發光器及特徵的操作 溫度的曲線圖； 圖14為根據本發明之燈之另一實施例的側視圖；及 圖1 5為展示根據本發明之燈之一實施例的穩態操作溫度 的曲線圖。 【主要元件符號說明】 10 典型發光二極體（led)封裝 11 線結合 12 LED晶片 13 反射杯 14 清澈保護樹脂 15Α 導線 15Β 導線 16 囊封劑材料 20 LED封裝 22 led晶片 23 子基板 24 金屬反射器 25Α 電跡線 25Β 電跡線 154446.doc -38- 201144685 27 線結合連接件 50 燈 52 散熱片結構 53 反射層 54 光學腔 56 平台 58 光源 60 散熱鰭片 62 磷光體載體 64 載體層 66 磷光層 70 第一熱流 72 第二熱流 74 第三熱流 80 磷光體載體 82 載體層 84 磷光層 100 磷光體載體 102 載體層 104 磷光體 120 填光體載體 122 載體層 124 磷光層 126 散射粒子層 154446.doc · 39 201144685 140 構光體載體 142 載體層 144 磷光體 146 散射粒子 160 磷光體載體 162 載體層 164 磷光層 166 散射粒子層 180 構光體載體 182 載體層 184 磷光層 200 峨光體載體 202 載體層 204 磷光層 210 燈 212 散熱片結構 214 空腔 216 平台 218 光源 220 磷光體載體 222 LED主要光學器件或透鏡 224 單一主要光學器件或透鏡 240 燈 242 散熱片結構 154446.doc -40- 201144685 244 空腔 246 平台 248 光源 250 磷光體載體 252 第四熱流 254 第五熱流 260 曲線圖 262 第一實線 264 第二實線 266 第一虛線 268 第二虛線 270 第三實線/燈 272 第四實線/光源 274 散熱片結構 275 鰭片 276 燈套環 278 套環空腔 280 磷光體載體 282 裙部 285 曲線圖 286 苐一虛線 288 第二虛線 154446.doc -41 -Sr2Si5N8:Eu2+ may use filler particles of different sizes including, but not limited to, particles in the range of from 1 nanometer (nm) to 30 micrometers (Mm) or more than 30 micrometers (μm). In terms of scattering and mixing colors, smaller particles are usually better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer 66 in a binder, and the phosphor may also have a different concentration or loading of phosphor material in the binder. Typical concentrations range from 30% to 70% by weight. In one embodiment, the concentration of the phosphor is about 65% by weight and is preferably uniformly dispersed throughout the extruding phosphor. The phosphor layer 66 can also have different regions of different conversion materials and conversion materials of different concentrations. Different materials can be used for the adhesive, wherein the material is preferably strong after curing and substantially transparent in the visible wavelength spectrum. Suitable materials include polyfluorene oxide, epoxy resin, glass, inorganic glass, dielectric, BCB, polyamine, amine, polymer and their blends. The preferred material is polyfluorene (this is composed of polyfluorene). High transparency and reliability of oxygen in high power LEDs). Suitable base, base and methyl polyoxo oxygen are commercially available from D〇w® Chemical. Many different curing methods can be used to cure the adhesive depending on various factors such as the type of adhesive used. Different curing methods include, but are not limited to, thermal curing, ultraviolet (UV) curing, infrared (IR) curing, or air solidation. 154446.doc • 23· 201144685. The phosphor layer 66 can be applied using a variety of processes including, but not limited to, spray coating, spin coating, sputtering, printing, powder coating, electrophoretic deposition (EPD), electrostatic deposition. As mentioned above, the phosphor layer 66 can be coated with the binder material 'but it should be understood' that no binder is required. Phosphor layer 66 can be fabricated separately in yet other embodiments and phosphor layer 66 is then mounted to carrier J. In one embodiment, the phosphor-adhesive mixture can be sprayed or dispersed over the carrier layer 64. The adhesive is then cured to form the phosphor layer 66. In some of these embodiments, the phosphor_binder mixture can be sprayed or dispersed onto the heated carrier layer 64 such that when the phosphor binder mixture contacts the carrier layer 64, 'from the carrier layer 64 The heat is dispersed in the adhesive and the adhesive is cured. These processes may also include a solvent for the phosphor-bonded J/3⁄4 compound which liquefies the mixture and lowers the viscosity of the mixture, thereby making the mixture more suitable for spraying. Many different solvents can be used including, but not limited to, toluene, benzene, di-f-benzene (2>?1^6) or os_2(R) available from Dow Corning®, and different concentrations of solvent can be used. When the solvent-phosphor-adhesive mixture is sprayed or dispersed on the heated carrier layer 64, the heat from the carrier layer 64 evaporates the solvent, wherein the temperature of the carrier layer affects the extent to which the solvent evaporates. From the carrier layer 64 The heat can also cure the binder of the mixture, leaving a fixed phosphor layer on the carrier layer. Carrier layer 64 can be heated to a number of different temperatures depending on the materials used and the desired solvent evaporation and adhesive cure rate. Suitable temperatures range from 90eC to 150t, although it should be understood that other temperatures may be used. I54446.doc •24- 201144685 Various deposition methods and systems are described in US Patent Application Publication No. 2010/0155763, entitled "Systems and Methods for Application of Optical Materials to Optical Elements" by Donofrio et al., and the disclosure It has been assigned to Cree, Inc. and the entire contents of this publication. The fill layer 66 can have a number of different thicknesses depending on the concentration of the illuminant material and the desired amount of light to be converted by the phosphor layer 66. The barrier layer according to the present invention can be applied at a concentration level (phosphor load) of more than 30%. Other embodiments may have greater than 50°/. The concentration level is, while in still other embodiments, the concentration level can be as high as 60%. In some embodiments, the light-breaking layer can have a thickness in the range of 10 microns to 100 microns, while in other embodiments, the phosphor layer can have a thickness in the range of 40 microns to 50 microns. The methods described above can be used to coat multiple layers of the same or different filler materials, and different phosphor materials can be applied in different regions/regions of the carrier layer using known masking and/or printing processes. The method described above provides some thickness control for the phosphor layer 66, but for even greater thickness control 'a known method can be used to grind the phosphor layer to reduce the thickness of the phosphor layer 66 or level the entire layer. Thickness "This abrasive feature provides the added advantage of being able to produce a lamp that emits within a single sorting level on the CIE chromaticity diagram. Sorting is generally light known in the art and intended to ensure that the LEDs or lamps provided to the end customer emit light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to as sorting in the art) by color or brightness. Each sorting level usually contains LEDs or lights from a group of colors and brightness, and 154446.doc •25· 201144685 is often identified by a sorting level code. White LEDs or lamps can be classified by chromaticity (color) and luminous flux (brightness). Thickness control of the phosphor layer provides greater control in producing a lamp that emits light within the target sorting level by controlling the amount of source light converted by the phosphor layer. A plurality of phosphor carriers 62 having phosphor layers 66 of the same thickness can be provided. By using a light source 58 having substantially the same illumination characteristics, a lamp having a nearly one color point can be fabricated, which in some instances can fall within a single color sorting level. In some embodiments, the illumination of the lamp is within a standard deviation from a point on the CIE map, and in some embodiments, the standard deviation comprises less than a 10-step McAdams ellipse. In some embodiments, the illumination of the lamp belongs to a 4-step MacAdam ellipse centered at CIExy (〇_313, 0.323). The light-breaking body carrier 62 can be mounted and bonded to the opening in the cavity 54 using a different known method or material, such as a thermally conductive bonding material or thermal grease. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, a phosphor carrier can be mounted over the opening using a thermally conductive device such as a clamp mechanism, a screw or a thermal adhesive to hold the phosphor carrier 62 tightly to the heat sink structure ' Maximum thermal conductivity. In one embodiment, a thermal grease layer having a thermal conductivity of about ηηι thickness & k = 0.5 w/m_k is used. This configuration provides an efficient thermally conductive path for dissipating heat from the phosphor layer 66. During operation of the lamp 50, phosphor conversion heating is concentrated in the phosphor layer μ, such as concentrated in the center of the can light layer 66, with most of the LED light striking the canister carrier 62 in the scale layer 66 and passing through the dish Body carrier 62. The thermal conductivity of the carrier layer 64 154446.doc -26· 201144685 causes the heat to be distributed in the transverse direction, as indicated by the first heat flow. At the edge of the VI carrier 62, and into the heat sink structure 52, if the heat at the edge passes through the thermal grease layer structure 52, the heat can be effectively displayed - the heat flow 72 is displayed, and the heat is dissipated. Dissipated into the environment. As discussed above, in the lamp 5, the junction is coupled to the heat sink structure 52 thermally coupled to the secondary coupling σ. This coupling configuration causes the Phosphorus Qiuqiu Tian m esthetic carrier 62 to share at least 4 knives with the light source 58 for the heat dissipation of the guide channel 56, the heat from the light source 58 through the platform 56 (as by the third The heat flow 74 /, can also be distributed to the bulk film. From the phosphor carrier 62 flowing into the heat sinking film ^52φ / U52 Α ”, the heat in the structure 52 can also flow into the flat 〇. As described in the following paragraphs, 'in other embodiments, the phosphor carrier=light source 58 can be There are separate thermally conductive paths for dissipating heat, wherein such individual paths are referred to as "decoupling." It should be understood that the fill carrier can be configured in many different ways than the embodiment shown in FIG. Some of these different embodiments are illustrated in Figures 4 through 10, but it should be understood that in other embodiments, there may be a configuration of the evening. 4 shows another embodiment of a spheroidal carrier 8 according to the present invention. The phosphor carrier 80 comprises a carrier layer 82 and a phosphor layer 84. The carrier layer 82 and the phosphor layer 84 can be made of the same materials as described above and It can be formed using the same process. In this embodiment, the phosphor layer 84 is on the bottom surface of the carrier layer 82 such that the light from the LED source first passes through the phosphor layer 84. The converted light and the LED light that leaks through the phosphor layer 84 then pass through the carrier layer. 82. In this configuration, the carrier layer 82 should be transparent to light from both the phosphor layer 84 and the LED light source. In this embodiment, the phosphor layer 84 need not cover the entire bottom surface of the carrier layer 82. Rather, the edges of the carrier layer 82 may not be covered by the phosphor 154446.doc -27- 201144685 layer 84 to allow good thermal contact with the heat sink. However, in some embodiments, the phosphor layer 84 can cover the entire bottom surface of the carrier layer 82. Figure 5 shows still another embodiment of a phosphor support 1 according to the present invention. The phosphor support 100 does not comprise a separate phosphor layer and a carrier layer, but comprises a carrier layer 102 in which the phosphor 1〇4 is dispersed throughout the carrier. Layer 1〇2. As with the previous embodiment, when the phosphor generates heat during the conversion, the heat is dispersed in the lateral direction over the entire carrier layer 1〇2, and the heat in the carrier layer 丨〇2 can be dissipated in the heat sink. In the phosphor layer 1〇4, it is dispersed in the carrier layer at a nearly uniform concentration, but it should be understood that in other embodiments, the phosphors 1〇4 may have different concentrations in different regions of the carrier layer 102. It should also be understood that more than one phosphor may be included in the carrier layer that is uniformly dispersed or dispersed in zones of different concentrations. 6 shows another embodiment of a phosphor carrier 12A according to the present invention. The phosphor carrier 120 also includes a carrier layer 122 and a phosphor layer 124. The carrier layer 122 and the phosphor layer 124 are similar to those described above and illustrated in FIG. Show the same components. In this embodiment, a scattering particle layer 126 can be included on the carrier layer 122 and displayed on the phosphor layer 124. It should be understood that the scattering particle layer 126 can be located on the carrier layer or in many different locations in the carrier layer. The scattering particle layer is included to disperse light as it is emitted from the filler carrier layer 120 to impart a pattern of light to be emitted. In this embodiment, the scattering particles are configured to disperse the light in a substantially uniform pattern. In some embodiments, the scattering particle layer can be deposited using the methods described above with reference to the deposition of the phosphor layer, and the scattering particle layer can comprise densely packed particles. The scattering particles may also be included in the binder material, which may be the same as the viscous material described above with reference to the binder used with the phosphor layer. The scattering of the coarse sub-layer may vary depending on the coating and material used. "There are different concentrations of scattering particles. Suitable scattering particle concentrations range from 0_01 /. to 0.2% 'but it should be understood that the concentration can be higher or lower. In some In the embodiment, the concentration may be lower than that of the smear. The scattering particle layer 126 may have different concentrations of scattering particles in different regions. For some scattering particles, there may be attribution to the weighting. The increase in loss due to the absorption of the degree. Therefore, the concentration of the scattering particles can be selected to maintain an acceptable loss number, and (4) the light is dispersed to provide the desired emission pattern. The scattering particles can contain many Different silicones; including but not limited to: oxidation (ΖηΟ); yttrium oxide (Υ203); titanium dioxide (Ti02); barium sulfate (BaS04); alumina (A1203); molten silica (X02); Cerium oxide (SiO 2 ); aluminum nitride; glass microbead; cerium oxide (Zr02); lanthanum carbide (SiC); lanthanum oxide (Ta05); tantalum nitride (Si3N4); 154446.doc -29· 201144685 oxidation铌(Nb205); boron nitride (BN); or huguang Particles (eg, YAG:Ce, b〇se) may use one or more scattering materials in various combinations of materials or a combination of different forms of the same material to determine the scattering effect. In the embodiment, the scattering particles may be used. Included in carrier layer 122, phosphor layer 124, or both carrier layer 122 and light layer 124. Figure 7 shows another embodiment of a phosphor carrier 140 having a carrier layer 142 and phosphorescence in accordance with another embodiment of the present invention. Body (4), carrier layer 142 and scale 144 are similar to the same elements described above and illustrated in Figure 5. In this embodiment, 'scattering particles 146 are dispersed in carrier layer M2 to pass through carrier layer M2. (d) Dispersion of both light and dish light. The same scattering particles as those described above may be used, and in different embodiments 'the scattering particles may be included in different concentrations. Other embodiments may include Zones of different concentrations' to scatter light passing through the carrier layer into the desired emission pattern. Figure 8 shows another embodiment of a phosphor carrier 16 according to the present invention, the phosphor carrier 160 comprising a carrier layer! 62 and a carrier layer Phosphor layer 164 on the bottom surface of 162, both carrier layer 162 and phosphor layer 164 are configured in a manner similar to the same elements described above and illustrated in Figure 4. In this embodiment, 'scattering particle layer 166 includes On the top surface of the carrier layer 162, and may have the same material deposited in the same manner as the scattering particle layer 126 of Figure 6. In some embodiments, the scattering particles in the scattering particle layer i 66 can be configured to The light from the phosphor layer 164 and the LED light leaking through the phosphor layer 164 -30-154446.doc 201144685 both scatter. In still other embodiments, the scattering particles can be configured to scatter only one of the lights. It should be understood that the scattering particles may also be dispersed in either the carrier layer 162 or the phosphor layer 164 or both the carrier layer 162 and the phosphor layer 164. Other embodiments of the phosphor carrier may also include features to enhance light extraction from the lamp. A certain amount of light can strike the surface of the carrier layer or the light-breaking layer outside of the escape angle such that the light will be reflected back toward the cavity of the heat sink structure. Some of this light can be absorbed' while other parts of the light can undergo total internal reflection (TIR). Figure 9 shows an embodiment of a phosphor carrier 18 having a feature configured to reduce such losses. Similar to the above embodiment, the phosphor carrier comprises a carrier layer 182 and a phosphor layer 184, in this embodiment. The surface of the phosphor layer is roughened or shaped to provide a varying surface angle. This situation increases the likelihood that light will strike the surface within the escape angle of the light such that the light can contribute to useful emissions. A known roughening or etching process can be used to shape the surface. The scale carrier layer 18 can also be provided with scattering particles at different locations to disperse the light, as described above. Forming or roughening may be included on different surfaces of the phosphor support according to the present invention. Figure 10 shows another embodiment of a phosphor support 2 according to the present invention. Phosphor support 200 comprises a support layer 202 and a phosphor layer 204. In this embodiment, a "formed/roughened layer is provided on the top surface of the carrier layer 2" while a phosphor layer is provided on the roughened surface. The shaped/roughened surface provides a varying surface to increase the likelihood of light escaping through the phosphor carrier 2 . The roughened surface may be included on the other surface of the carrier layer 2' and the phosphor carrier 2' may also be provided with scattering particles as described above. It is to be further understood that the roughened surface can be included on any of the surfaces of the embodiment of the phosphor support layer described above, not 154446.doc 201144685. Lamps in accordance with the present invention may include many different features in addition to those described above. Referring again to Figure 3, in some embodiments the cavity ^ can be filled with a transparent thermal material to enhance the heat dissipation of the lamp in an S-step. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. The heat from the source will still be conducted via the platform 56, <RTI ID=0.0>>> This situation will allow for a lower operating temperature of the source 58, but a risk of an elevated operating temperature for the phosphor carrier 62. This configuration can be used in many different embodiments, but is particularly well suited for lamps with higher light source operating temperatures (compared to the operating temperature of the phosphor carrier). This configuration allows for more efficient heat dissipation from the source in applications where the additional heating of the phosphor support layer can be achieved. As discussed above, different lamp embodiments in accordance with the present invention can be configured with many different types of light sources. Figure u shows another embodiment of a lamp 21A similar to the lamp 5〇 described above and shown in Figure 3. Lamp 21A includes a fin structure 212 having a cavity 214 that is configured with a platform 216 to hold light source 218. Phosphor support 22A can be included over the opening of cavity 214 and at least partially cover the opening. In this embodiment, the light source 218 may include a plurality of LEDs disposed in a separate LED smear or disposed in a single-multiple LED package. In each of the embodiments, the illuminators may be different. The series and parallel configurations are consumable. In one embodiment, eight LEDs can be used that are connected in series to the circuit board by two wires. The wires can then be connected to the power supply unit described above. In other embodiments, more than eight or less LEDs can be used, 154446.doc •32· 201144685 and as mentioned above, LEDs available from Cree, Inc., including eight XLamp® XP-E LED or four XLamp® XP-G LEDs. The different single-string LED circuits are described in the following U.S. Patent Application: U.S. Patent Application Serial No. 12/566,195, entitled,,,,,,,,,,, U.S. Patent Application Serial No. 12/704,730, the entire disclosure of which is incorporated herein by reference. For embodiments that include a separate LED package, each of the LEDs can include its own LED primary optics or lens 222. In embodiments having a single multi-LED package, a single primary optic or lens 224 can cover all of the LEDs. It should be understood that the LEDs may not have lenses, and in an array embodiment, each of the LEDs may have its own lens. Similarly, an unpackaged LED can be provided on a "on-wafer chip" or "on-wafer" configuration. It should also be understood that each LED can be provided with secondary optics that are configured in different ways. Similar to the lamp 5' heat sink structure and platform, the necessary electrical traces or wires are provided to provide electrical signals to the light source 218. In the lamps 5A and 21A described above, the light source shares a heat path (referred to as thermal coupling) for dissipating heat with the phosphor carrier. In some embodiments, if the thermal path for the phosphor carrier and the source is not thermally coupled (referred to as thermal decoupling), the heat dissipation of the phosphor carrier can be enhanced. Figure 12 shows another embodiment of a lamp 240 in accordance with the invention 154446.doc • 33- 201144685. The lamp 240 also includes a heat sink structure 242 having a cavity 244 having a platform 246 for mounting the light source 248. The can carrier 250 is mounted over the opening of the cavity 244 by a thermally conductive material and at least partially covers the opening' such that at least some of the light from the source passes through the phosphor carrier 250. In this embodiment, the fin structure 242 and the platform 246 have separate heat dissipation paths that are substantially thermally isolated from one another (although convection can result in some thermal coupling between the two paths). Heat from source 248 is conducted along fourth heat stream 252 and through platform 246 where heat can be dissipated into the environment or another fin structure (not shown), such as a connector of the lamp. Heat from the phosphor carrier 250 is conducted along the fifth heat stream 254 and into the fin structure 242 where it is dissipated into the environment. Thermal separation between the fin structure 242 and the platform 246 can be provided by physical separation of the two, or by providing a thermally resistive material between the two, such as via a known thermal insulator ( For example, dielectric). Figure 13 is a graph showing the peak operating temperature of a conformal phosphor material compared to the operating temperature of a remote phosphor carrier having a carrier layer, the carrier layers having different thermal conductivities and configured to heat It can be dissipated via a thermal path as described above. Graph 260 further compares the thermal performance of these different configurations of heat-smoothing and pyrolysis heat sinks. The first solid line 262 shows the junction temperature of the illuminator having the heat decoupled fins as described above and the second line 264 shows the junction temperature of the illuminator for the heat sink. The operating temperature of the coupled configuration is slightly lower than the operating temperature of the decoupling configuration. The first dashed line 266 shows the peak phosphor temperature of a lamp having a conformal phosphor coated LED and a 154446.doc -34 - 201144685 thermally decoupled heat sink. The second dashed line 268 shows the peak phosphor temperature of the same lamp that does not have a heat-and-light heat sink. In a conformal coating configuration 'phosphor operates at substantially uniform peak phosphor temperature' and the thermally coupled lamp operates at a peak phosphor temperature that is lower than the peak phosphor temperature of the decoupled configuration. Comparatively, 'the third solid line 270 shows the peak phosphor temperature of the remote phosphor carrier disposed on the heat sinking heat sink, wherein the temperature is for a range of 2 w/mK to 1 〇〇 w/mK or more. Carrier layer measurements of different thermal conductivities within the range. The fourth solid line 272 shows the same distal phosphor support and the same range of thermal conductivity, with the phosphor carrier on the thermally decoupled heat sink. A remote phosphor carrier having a carrier layer with a thermal conductivity greater than 1.05 W/mk and disposed on a pyrolytic heat sink can be operated at a lower phosphor temperature 'thus achieving a coated LED with a conformal photobody coating High conversion efficiency. This situation allows the use of materials such as conventional glass, fused silica, sapphire and tantalum carbide. Thermally coupled heat sinks can be used, but thermally coupled heat sinks require slightly higher thermal conductivity and operate at higher temperatures than thermally coupled configurations. Figure 14 shows another embodiment of a lamp 270 in accordance with the present invention, the lamp 270 being configured in a different manner to provide the desired thermal characteristics of the distal phosphor and the filler carrier. Lamp 270 includes a light source 272 mounted to the top surface of fin structure 274. The heat sink structure can be made of a thermally conductive material as described above and includes a heat dissipating structure such as fins 275, during operation, heat is diffused from light source 272 into heat sink structure 274, and heat spreads in heat sink structure 274. To the fins 275 and the environment. Lamp 270 also includes a collar 276 having a collar cavity 278 that is worn on the top surface of the heat sink structure 274. The collar cavity 278 extends through the socket so that it is open at the bottom and at the top. When the light collar 276 is mounted to the heat sink structure 274, the light source 272 is configured such that the light source 272 emits light from the top opening of the collar cavity 278. In this embodiment, light source 272 is also configured such that light source 272 is within collar cavity 278. Phosphor carrier 280 is mounted over the top opening of collar cavity 278 by a thermally conductive material or device as described above. The phosphor carrier 28 is configured such that light from the source 272 passes through the phosphor carrier 28, and at least some of the light in the phosphor carrier 280 is configured by the converter carrier as described above. The structures and features described in the different embodiments include, but are not limited to, carrier layers, phosphors, scattering particles, and/or roughening/forming. The lamp collar 276 is also made of a thermally conductive material 'to dissipate heat from the phosphor carrier 280 into the lamp collar 276. Heat from the lamp collar 276 can be dissipated directly into the environment or can be dispersed into the fin structure 274 where heat can be dissipated into the environment. The thermal path for the phosphor carrier and the light source is coupled such that heat from the phosphor carrier and heat from the lamp collar 276 can be dispersed into the heat sink structure 274 and the light source heat can be spread from the heat sink structure 274 to the lamp The collar 27 bushing 276 also has a skirt 282 that is tightly mounted about the top portion of the fin structure 274 to allow the lamp collar 276 to be coupled to the fin structure 274 - for display purposes. . A graph 285 of the characteristics of the different far-end discs in the middle. The first dashed line 286 shows the base or plate temperature of the lamp. For a light dissipating fin, the base or plate temperature remains constant at about 74.7 °C. The second dashed line 288 shows the peak temperature of the phosphor in the different π embodiments of the distal scale carrier I54446.doc-36 · 201144685 according to the present invention. For 5 mm thick glass with a spin-on phosphor layer and 〇.5 mm thick sapphire with a spin-coated phosphor layer, the peak phosphor operating temperature is lower than the temperature of the base. Similar: This situation above allows for greater emission efficiency and less heat-related degradation of the phosphor. Although the invention has been described in detail with reference to a particular preferred configuration of the invention, the eight versions are possible. Therefore, the spirit and scope of the present invention should not be limited to the versions described above. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; Figure 2 shows a cross-sectional view of another embodiment of a prior art LED lamp; Figure 3 is an embodiment of a lamp in accordance with the present invention Figure 4 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 5 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 6 is a phosphor in accordance with the present invention; Figure 7 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 8 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; A front view of a further embodiment of a phosphor carrier according to the invention; 154446.doc • 37- 201144685 Figure 395 is a cross-sectional view of a further embodiment of a phosphor carrier according to the invention; Figure 12 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; Figure 13 is a graph showing the operating temperatures of different illuminators and features of a lamp in accordance with the present invention; Figure 14 is based on this Side view of another embodiment of a lamp out; and FIG 15 is a graph showing steady state operating temperature in accordance with one embodiment of the lamp according to the present invention. [Main component symbol description] 10 typical light-emitting diode (LED) package 11 wire bonding 12 LED chip 13 reflective cup 14 clear protective resin 15 导线 wire 15 导线 wire 16 encapsulant material 20 LED package 22 led wafer 23 sub-substrate 24 metal reflection 25 Α Electrical Trace 25Β Electrical Trace 154446.doc -38- 201144685 27 Wire Bonding Connector 50 Lamp 52 Heatsink Structure 53 Reflective Layer 54 Optical Cavity 56 Platform 58 Light Source 60 Heat Sink 62 Phosphor Carrier 64 Carrier Layer 66 Phosphor Layer 70 First heat flow 72 Second heat flow 74 Third heat flow 80 Phosphor carrier 82 Carrier layer 84 Phosphor layer 100 Phosphor carrier 102 Carrier layer 104 Phosphor 120 Filler carrier 122 Carrier layer 124 Phosphor layer 126 Scatter particle layer 154446. Doc · 39 201144685 140 Photostructure carrier 142 Carrier layer 144 Phosphor 146 Scatter particles 160 Phosphor carrier 162 Carrier layer 164 Phosphor layer 166 Scatter particle layer 180 Light carrier carrier 182 Carrier layer 184 Phosphor layer 200 Phosphor carrier 202 Carrier Layer 204 Phosphor layer 210 Lamp 212 Heat sink structure 214 Cavity 2 16 Platform 218 Light source 220 Phosphor carrier 222 LED main optics or lens 224 Single main optics or lens 240 Lamp 242 Heat sink structure 154446.doc -40- 201144685 244 Cavity 246 Platform 248 Light source 250 Phosphor carrier 252 Fourth heat flow 254 fifth heat flow 260 curve 262 first solid line 264 second solid line 266 first dashed line 268 second dashed line 270 third solid line / lamp 272 fourth solid line / light source 274 heat sink structure 275 fin 276 light ring 278 collar cavity 280 phosphor carrier 282 skirt 285 curve 286 苐 a dashed line 288 second dashed line 154446.doc -41 -

Claims (1)

201144685 七、申請專利範圍： ][· 一種燈，其包含： 一光源； 平面私光體載體，該平面罐光體載體位於該光源之 遠端且包含-導熱材料及一轉換材料，該導熱材料對於 * 來自該光源之光至少邮八、* n “ ^ 刀透明，且該轉換材料吸收來自 該光源之光並發射不同波長之光；及 一散熱片結構’該磷光體載體熱耦合至該散熱片結 構。 2·如請求項1之燈，其中該磷光體載體包含-載體層及- 鱗光層D 士凊求項1之燈’其中該磷光體載體包含散射粒子。 4. 如明求項！之燈，其中該璘錢载體包含—經粗趟化或 成形之表面。 5. 如1求項1之燈’其巾來自該磷光體載體層之熱經由該 熱耦合而傳導至該散熱片結構中。 6. 如明求項丨之燈，其中該光源包含一藍色發光且該磷 光體載體包含一磷光體，該磷光體吸收藍光且重新發射 • 一不同波長之光’該燈發射藍色LED光與轉換材料光的 ' 經感知之白光組合。 7·如凊求項1之燈，其進一步包含一光學腔，該磷光體載 體安裝於該空腔中之一開口之上，該光源安裝於該空腔 内’其中來自該光源之光穿過該磷光體載體。 8·—種基於發光二極體（LED)之燈，該燈包含： 154446.doc 201144685 一 LED光源； 一平面磷光體，該平面磷光體配置於該光源之遠端以 使得自該光源發射之光穿過該磷光體且被該磷光體轉 換；及 一導熱路徑，該導熱路徑用以使磷光體轉換熱傳導遠 離該磷光體且耗散該熱。 9.如請求項8之燈，其進一步包含一散熱片，該導熱路秤 至少部分包含該散熱片。 10· —種燈，其包含： 一散熱片結構； 一基於發光二極體（led)之光源； 一轉換材料’該轉換材料位於該光源之遠端且經配置 以吸收來自該光源之光並重新發射不同波長之光；及 一第—導熱路徑’該第-導熱路徑用以使轉換產生之 熱傳導遠離該轉換材料至該散熱片。 11. 如請求項10之燈，其中來自 τ木目°亥第-光源之熱係經由-第 一導熱路徑而傳導遠離該光源。 12. 如请求項1〇之燈，其中該第— 導熱路徑與該第二導熱路 ίίτ•祸合*。 傳導路徑與該第二傳導路 13.如請求項10之燈，其中該第— 徑解輕》 14. 一種燈，其包含： 一光源； 空腔之一開口之上的一 一光學腔，該光學腔包含在該 154446.doc 201144685 磷光體載體，該光源安裝於該光學腔中位於該磷光體載 體之遠端，其中來自該光源之光穿過該磷光體載體’該 光學腔進一步包含反射表面以反射來自該光源及該磷光 體載體之光；及 一導熱路徑’該導熱路徑用以使磷光體轉換熱傳導遠 離該磷光體且耗散該熱。 1 5 ·如請求項14之燈，其進 …1 昇中該光學 腔與該散熱片形成一體且該導熱路徑係穿過兮散熱 154446.doc201144685 VII. Patent application scope: ][· A lamp comprising: a light source; a planar private body carrier, the planar can body carrier being located at a distal end of the light source and comprising a heat conductive material and a conversion material, the heat conductive material For *light from the source at least eight, * n "^ knife transparent, and the conversion material absorbs light from the source and emits light of different wavelengths; and a heat sink structure 'the phosphor carrier is thermally coupled to the heat sink A lamp according to claim 1, wherein the phosphor carrier comprises a carrier layer and a lamp of the scale layer D of the first item, wherein the phosphor carrier comprises scattering particles. The lamp, wherein the money carrier comprises a roughened or shaped surface. 5. The lamp of claim 1 wherein the heat from the phosphor carrier layer is conducted to the heat through the thermal coupling. 6. In the sheet structure, wherein the light source comprises a blue light emitting light and the phosphor carrier comprises a phosphor which absorbs blue light and re-emits • a different wavelength of light 'the light is emitted blue The LED light is combined with the perceived white light of the conversion material light. 7. The lamp of claim 1, further comprising an optical cavity mounted on an opening in the cavity, the light source being mounted In the cavity, wherein light from the light source passes through the phosphor carrier. 8. A lamp based on a light-emitting diode (LED), the lamp comprising: 154446.doc 201144685 an LED light source; a planar phosphor The planar phosphor is disposed at a distal end of the light source such that light emitted from the light source passes through the phosphor and is converted by the phosphor; and a heat conduction path for causing phosphor conversion heat conduction away from the phosphorescence 9. The lamp of claim 8 further comprising a heat sink, the heat shield having at least a portion of the heat sink. 10 - a lamp comprising: a heat sink structure; a light source of a light emitting diode; a conversion material 'the conversion material is located at a distal end of the light source and configured to absorb light from the light source and re-emit light of different wavelengths; and a first heat conduction path The first heat conduction path is used to conduct heat generated by the conversion away from the conversion material to the heat sink. 11. The lamp of claim 10, wherein the heat from the τ Mumu hai hai- light source is conducted via the first heat conduction path 12. The light source of claim 1 wherein the first heat conduction path and the second heat conduction path are *. The conductive path and the second conductive path 13. The light of claim 10, wherein The first path is lighter. 14. A lamp comprising: a light source; an optical cavity above one of the openings of the cavity, the optical cavity being included in the 154446.doc 201144685 phosphor carrier, the light source being mounted thereon An optical cavity is located at a distal end of the phosphor carrier, wherein light from the light source passes through the phosphor carrier'. The optical cavity further includes a reflective surface to reflect light from the light source and the phosphor carrier; and a thermally conductive path The thermally conductive path is used to cause the phosphor conversion heat to be conducted away from the phosphor and dissipate the heat. 1 5 • The lamp of claim 14, wherein the optical cavity is integrated with the heat sink and the heat conduction path is passed through the heat sink 154446.doc