201142231 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係為一種散熱器’尤指一種可利用水冷及風 冷方式，達成提升散熱效率之目的者。 [0002] Θ 【先前技術】 隨著科技及半導體製程的進步，積體電路也不斷的 往高性能化的趨勢發展，如中央處理器或電腦晶片等相 關電子元件，其運算速度越來越快，相對的，也使產生 的熱量增加。爲了避免熱量影響電子元件的運作，直接 將散熱裝置設置在電子元件義，是目前普遍的技術手段 [0003] 因此，諸多業者不斷的針對散熱問題加以研發及設 計出各式散熱裝置；習用之散熱方式大都走在電子元件 的上表面設置風扇或散熱器，藉助散熱器之導熱及散埶 材質’再利用風扇產生空氣對流將熱能驅散。 [0004] 〇 另，亦有利用水冷散熱之方式’其通常設置一内部 具有容室之散熱器，並藉由其與容室形成貫通之進、出 水口’令冷卻液於其容室内流動產生循環，以帶走熱量 :其目的都是爲了令熱量能有效的散逸，以維持電子元 件的壽命及運作之穩定性。 [0005] 然，上述習用散熱裝置在產業應用上仍具有改進之 空間，本發明人基於研究創新及精益求精之精神，乃積 極努力研究，經多方測試及改良，終於精心設計出極富 產業;ί賈值之本發明，本發明提出一種具有高效能與效率 099117382 ，足以解決習知散熱問題的兼具水冷及風冷方式之散熱 表單編號A0101 S 3頁/共25頁 ‘隱030877-0 201142231 器。 【發明内容】 [0006] [0007] 本發明的目的係提供一種兼具水冷及風冷方式之散 熱器，可以使冷卻液或氣體在其内部循環流動，延長流 動路徑，藉以提高散熱效率。 爲了達成上述之目的，本發明之兼具水冷及風冷方 式之散熱器，包括一基座、一散熱組件及一上蓋，其中 ，該基座中央設有一容室；該散熱組件包含有一冷卻槽 及一熱管組，該冷卻槽設有至少一中空腔室，該中空腔 室設有二向外貫穿之穿孔；又，本發明之較佳實施例為 左右分別設置相互對應之二中空腔室，令其中間形成一 區隔部，二中空腔室近上緣處分別設有一向外貫穿之穿 孔，該冷卻槽係與基座對應結合呈密封狀，該區隔部下 端與基座容室之間隔處形成一流動通道；該熱管組，包 括至少一熱管及複數個散熱鰭片，該熱管一端係貼附於 基座之容室底部，另端為一立部，其穿伸入中空腔室内 ，複數個散熱鰭片係套設於該立部，該散熱鰭片之周緣 與中空腔室之内壁緣形成間隔流道；該上蓋係抵靠結合 於冷卻槽之上緣呈密封狀；組配完成後，將冷卻槽之二 穿孔與外接管路或泵浦連接，令其形成一入口端及一出 口端，當冷卻液或如空氣之氣體由入口端之穿孔注入， 會沿著散熱鰭片之空隙及間隔流道往基座流動，注滿入 口端之中空腔室後，經由基座容室處之流動通道流入出 口端之另一中空腔室，並循著散熱鰭之缝隙及間隔流 道往上流動，最後從出口端之穿孔向外排出，形成一冷 099117382 表單編號A0101 第4頁/共25頁 0992030877-0 201142231 [0008] [0009] [0010] D [0011] [0012]201142231 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention is a heat sink, especially one that can utilize water cooling and air cooling to achieve improved heat dissipation efficiency. [0002] 先前 [Prior Art] With the advancement of technology and semiconductor processes, integrated circuits are constantly evolving toward high-performance trends, such as CPUs and computer chips, which are becoming faster and faster. Relatively, it also increases the amount of heat generated. In order to avoid the influence of heat on the operation of electronic components, it is a common technical means to directly set the heat sink to the electronic components. [0003] Therefore, many manufacturers have continuously developed and designed various heat sinks for heat dissipation problems; Most of the ways are to set up a fan or a heat sink on the upper surface of the electronic component. The heat conduction and the material of the heat sink are used to re-use the fan to generate air convection to dissipate the heat. [0004] In addition, it is also advantageous to use water cooling to dissipate heat. 'It is usually provided with a heat sink having a chamber inside, and through which the inlet and outlet ports are formed with the chamber to cause the coolant to flow in the chamber. Circulating to remove heat: The purpose is to make the heat dissipate effectively to maintain the life and stability of the electronic components. [0005] However, the above-mentioned conventional heat dissipating device still has room for improvement in industrial application, and the present inventors actively researched and researched and improved the spirit of research and innovation, and finally designed a very rich industry through multi-party testing and improvement; According to the invention of the present value, the present invention proposes a heat-dissipating form with high efficiency and efficiency of 099117382, which is sufficient for solving the conventional heat dissipation problem, and has a water-cooling and air-cooling method. A0101 S 3 pages/total 25 pages 'hidden 030877-0 201142231 . SUMMARY OF THE INVENTION [0006] The object of the present invention is to provide a heat sink having both a water-cooling and an air-cooling mode, which can circulate a coolant or a gas inside thereof, and prolong the flow path, thereby improving heat dissipation efficiency. In order to achieve the above object, a water-cooling and air-cooling heat sink of the present invention includes a base, a heat dissipating component and an upper cover, wherein a central portion of the base is provided with a chamber; the heat dissipating component includes a cooling slot And a heat pipe group, the cooling groove is provided with at least one hollow chamber, and the hollow chamber is provided with two through holes; and a preferred embodiment of the present invention provides two hollow chambers corresponding to each other on the left and right sides. A partition is formed in the middle portion, and an outer through hole is respectively arranged at the upper edge of the second hollow chamber, and the cooling groove is sealed with the base, and the lower end of the partition and the base chamber are Forming a flow channel at the interval; the heat pipe group includes at least one heat pipe and a plurality of heat dissipation fins, the heat pipe end is attached to the bottom of the chamber of the base, and the other end is a vertical portion, which penetrates into the hollow cavity a plurality of heat dissipating fins are sleeved on the vertical portion, and a peripheral edge of the heat dissipating fin forms a spaced flow path with an inner wall edge of the hollow chamber; the upper cover is sealed and coupled to the upper edge of the cooling groove to be sealed; Upon completion, will The two perforations of the cooling trough are connected to the external pipeline or the pump to form an inlet end and an outlet end. When the coolant or the gas such as air is injected through the perforation of the inlet end, the gap and the interval along the fins are separated. The flow path flows toward the pedestal, fills the cavity in the inlet end, flows into the other hollow chamber at the outlet end through the flow passage at the accommodating chamber, and flows upward along the slit of the heat dissipating fin and the interval flow path And finally discharged from the perforation of the outlet end to form a cold 099117382 Form No. A0101 Page 4 / Total 25 Page 0992030877-0 201142231 [0008] [0010] D [0011] [0012]
[0013] [0014] [0015] 099117382 熱循環流動路徑。 由上述說明，本發明具有下列各項有益功效： 1、 提升散熱速率：藉由循環流動路徑與散熱鰭片的 配置，有效延長及增加冷卻液或氣體於散熱器内部之流 動範圍與接觸面積，可快速且更有效率將發熱源的熱能 導出。 2、 應用範圍廣泛：本發明於冷卻槽内部設置熱管和 散熱鰭片，結合風冷與水冷散熱之優點，可達成最佳之 熱交換冷卻循環功效，不僅適用於電子元件，更可擴大 應用範圍至其它發熱源，具有極佳之產業實用性。 【實施方式】 有關本發明為達成目的所運用之技術手段，茲配合 圖式並列舉實施例於下文進行詳細說明，俾利鈞上瞭解 並認同本發明： 首先，請參閱第1至第2圖所示，本發明兼具水冷及 風冷方式之散熱器1，包括有： 一基座2，其中央處具有下凹部21，其内形成容室22 ，該基座2之周緣設有複數個第一鎖固孔23 ; 一散熱組件3，請一併配合第3至第9圖所示，包含有 一冷卻槽4及一熱管組5，其中： 該冷卻槽4，係結合固定於基座2上緣，設有至少一 中空腔室41，其設有二向外貫穿之穿孔42，本發明之較 佳實施例（如第2圖所示），係設有二中空腔室41，其近上 表單編號A0101 第5頁/共25頁 0992030877-0 201142231 緣處分別設有一向外貫穿之穿孔42，該穿孔42設有内螺 紋421，二中空腔室41中間形成一區隔部43，該冷卻槽4 之上、下表面分別環設有一環狀溝槽44、45，該環狀溝 槽44、45係圍繞二中空腔室41之外緣，供密封墊圈46、 47對應嵌合，該冷卻槽4下端及上端之外周緣並環設有複 數個第二鎖固孔48及第三鎖固孔49。 [0016] 該熱管組5，包括至少一熱管51及複數個散熱鰭片52 ，該熱管51可呈L型，其底端511係貼附於基座2之容室 22底部，該底端511之橫切面係呈三角型（如第8圖所示） ，該熱管之另端為一立部512，係穿伸入一中空腔室41内 :複數個散熱鰭片52，其中央設有一通孔521，供套設並 固定於該立部512，該通孔521周緣設有凸緣522，可令 複數個散熱鰭片52相互抵接，該散熱鰭片52環設有複數 個透孔523，可供冷卻液或如空氣之氣體流通。 [0017] 一上蓋6，係為一板體，其周緣設有複數個第四鎖固 孔61，該上蓋6係抵靠結合並固定於該散熱組件3之冷卻 槽4上緣。 [0018] 上述構件在組設時，係於熱管組5熱管51之立部512 套設複數個散熱鰭片52後，將熱管51底端511貼附固定於 基座2之容室22底部，上述之貼附方式可為焊接，以本較 佳實施例而言（如第10、11圖所示），係設有二熱管51， 其底端511之一侧邊可相互抵靠，且該底端511之橫切面 呈三角型，可有效增加其下表面與容室22底部之接觸面 積，二熱管51之二立部512係分別穿伸入冷卻槽4之二中 空腔室41内，再將密封墊圈46、47分別嵌合於冷卻槽4之 099117382 表單編號A0101 第6頁/共25頁 0992030877-0 201142231 二環狀溝槽44、45後’藉由如螺絲之固定件62將基座2之 第-鎖固孔23與冷卻槽4之第二鎖固孔她互螺固結合， 取後，將上蓋6蓋合於該散熱組件3之冷卻槽4上緣以固 定件62螺固結合上蓋6之第四鎖固孔61及冷卻槽*之第三 鎖固孔49 ’即組設完成散熱器1。 [0019] Ο ❹ 實際使用時，請再參閲第2、第12至第14圖所示，係 將散熱組件3冷卻#4之二穿孔42以外接管路或泵浦（圖未 示出）連接，令其形成一入口端及—出口端，以便驅動冷 卻液或氣體於散熱器1内部形成循環流動，該冷卻液可為 水或冷媒等散熱用鎳介，該氣體可為空氣；該穿孔42更 可利用快速接頭63螺接，以增加其外接管路或泵浦時之 便利性；當冷卻液或氣體由入口端之穿孔42進入散熱器j 内部，其會沿著該複數個散熱鰭片52之透孔523以及散熱 鰭片52與中空腔室41之内壁緣形成之間隔流道64注滿該 入口端之中空腔室41後，經由基座2容室22處之流動通道 65流入並注滿出口端之中空腔室41，最後從該出口端中 空腔室41之穿孔42排出，此流動路徑係可有效增加冷卻 液或氧體於散熱器1内部之流動與接觸面積，使冷卻液或 氣體能穩定且均勻提高其吸熱量，其持續熱交換之冷熱 循環過程，使本發明確實能達到較佳冷卻降溫之散熱目 的0 [0020] 综上，本發明特徵所達之功效，已卓越的達成，申 請人爰依法提呈申請。惟以上所述者，僅為本發明之較 佳實施例而已’當不能以此限定本發明，任何熟習此技 藝者，在不脫離本發明之精神和範圍内，當可作各種之 099117382 表單編號Α0101 第7頁/共25頁 0992030877-0 201142231 更動與修改。凡依本發明申請專利範圍及發明說明内容 所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋 之範圍内。 【圖式簡單說明】 [0021] 第1圖：係本發明之立體圖。 [0022] 第2圖：係本發明較佳實施例之立體分解圖。 [0023] 第3圖：係本發明較佳實施例冷卻槽之立體圖。 [0024] 第4圖：係第3圖另一角度之立體圖。 [0025] 第5圖：係第3圖之前視剖面圖。 [0026] 第6圖：係本發明熱管之立體圖。 [0027] 第7圖：係第6圖之俯視圖。 [0028] 第8圖：係第7圖於A-A位置之剖面圖。 [0029] 第9圖：係本發明鰭片之立體圖。 [0030] 第10圖：係本發明較佳實施例熱管組之立體圖。 [0031] 第11圖：係第1 0圖之仰視圖。 [0032] 第12圖：係本發明較佳實施例之散熱組件與基座結合之 立體圖。 [0033] 第13圖：係本發明較佳實施例冷卻液或氣體流動路徑之 立體示意圖。 [0034] 第1 4圖：係述明第1 3圖冷卻液或氣體於内部流動過程之 立體示意圖。 099117382 表單編號A0101 第8頁/共25頁 0992030877-0 201142231[0015] [0015] 099117382 Thermal cycling flow path. From the above description, the present invention has the following beneficial effects: 1. Increase the heat dissipation rate: effectively extend and increase the flow range and contact area of the coolant or gas inside the heat sink by the arrangement of the circulating flow path and the heat dissipation fins, The heat energy of the heat source can be derived quickly and more efficiently. 2, a wide range of applications: the present invention is provided with heat pipes and fins inside the cooling tank, combined with the advantages of air cooling and water cooling, can achieve the best heat exchange cooling cycle effect, not only for electronic components, but also expand the scope of application It has excellent industrial applicability to other heat sources. [Embodiment] The technical means for achieving the object of the present invention will be described in detail below with reference to the drawings and examples, and the present invention will be understood and recognized by the following: First, please refer to Figures 1 to 2. As shown, the heat sink 1 of the present invention has both a water-cooling and an air-cooling method, and includes: a base 2 having a recessed portion 21 at the center thereof, and a chamber 22 is formed therein, and the periphery of the base 2 is provided with a plurality of The first locking hole 23; a heat dissipating component 3, together with the third to the ninth figure, includes a cooling groove 4 and a heat pipe group 5, wherein: the cooling groove 4 is fixedly coupled to the base 2 The upper edge is provided with at least one hollow chamber 41 provided with two outwardly extending perforations 42. The preferred embodiment of the invention (as shown in Fig. 2) is provided with two hollow chambers 41, which are adjacent Form No. A0101, page 5 / page 25 0992030877-0 201142231 The edge is provided with an outwardly extending perforation 42 , the perforation 42 is provided with an internal thread 421 , and a compartment 43 is formed in the middle of the two hollow chambers 41 . An annular groove 44, 45 is annularly arranged on the upper surface and the lower surface of the cooling groove 4, and the ring is annularly The grooves 44 and 45 surround the outer edges of the two hollow chambers 41, and the sealing washers 46 and 47 are correspondingly fitted. The lower end of the cooling groove 4 and the outer periphery of the upper end are provided with a plurality of second locking holes 48 and a third ring. Locking hole 49. [0016] The heat pipe group 5 includes at least one heat pipe 51 and a plurality of heat dissipation fins 52. The heat pipe 51 can be L-shaped, and the bottom end 511 is attached to the bottom of the chamber 22 of the base 2, and the bottom end 511 is attached. The cross section is triangular (as shown in Fig. 8), and the other end of the heat pipe is a vertical portion 512 which penetrates into a hollow chamber 41: a plurality of heat dissipating fins 52, and a central portion thereof is provided The hole 521 is sleeved and fixed to the vertical portion 512. The through hole 521 is provided with a flange 522 at the periphery thereof, so that the plurality of heat dissipation fins 52 abut each other, and the heat dissipation fin 52 is provided with a plurality of through holes 523. It can be used to circulate a coolant or a gas such as air. An upper cover 6 is a plate body having a plurality of fourth locking holes 61 at its periphery, and the upper cover 6 is abutted against and fixed to the upper edge of the cooling groove 4 of the heat dissipation assembly 3. [0018] When the components are assembled, the plurality of heat dissipation fins 52 are disposed on the vertical portion 512 of the heat pipe 51 of the heat pipe group 5, and the bottom end 511 of the heat pipe 51 is attached and fixed to the bottom of the chamber 22 of the base 2. The above attachment manner may be welding. In the preferred embodiment (as shown in FIGS. 10 and 11), two heat pipes 51 are provided, and one side of the bottom end 511 can abut each other, and the The cross-section of the bottom end 511 is triangular, which can effectively increase the contact area between the lower surface and the bottom of the chamber 22. The two vertical portions 512 of the two heat pipes 51 respectively penetrate into the two hollow chambers 41 of the cooling tank 4, and then The sealing gaskets 46 and 47 are respectively fitted to the cooling groove 4 of 099117382. Form No. A0101 Page 6 / Total 25 pages 0992030877-0 201142231 After the two annular grooves 44, 45 'the base is fixed by the fixing member 62 such as a screw The first locking hole 23 of the second locking hole 23 and the second locking hole of the cooling groove 4 are screwed together, and the upper cover 6 is closed to the upper edge of the cooling groove 4 of the heat dissipating component 3 to be screwed and fixed by the fixing member 62. The fourth locking hole 61 of the upper cover 6 and the third locking hole 49' of the cooling groove * are assembled to complete the heat sink 1. [0019] Ο ❹ In actual use, please refer to the second, twelfth to fourteenth drawings, which is to connect the heat dissipating component 3 to the #4 of the two perforations 42 to connect the external pipe or pump (not shown). And forming an inlet end and an outlet end for driving a coolant or a gas to form a circulating flow inside the radiator 1. The coolant may be a nickel for heat dissipation such as water or a refrigerant, and the gas may be air; the perforation 42 The quick connector 63 can also be screwed to increase the convenience of its external piping or pumping; when the coolant or gas enters the interior of the heat sink j through the through hole 42 of the inlet end, it will follow the plurality of heat sink fins. The through hole 523 of the 52 and the spacing channel 64 formed by the heat dissipation fin 52 and the inner wall edge of the hollow chamber 41 fill the cavity 41 in the inlet end, and then flow through the flow passage 65 at the chamber 22 of the base 2 and Filling the hollow chamber 41 in the outlet end, and finally discharging from the through hole 42 of the hollow chamber 41 in the outlet end, the flow path can effectively increase the flow and contact area of the coolant or oxygen inside the radiator 1, so that the coolant Or the gas can stably and evenly increase its heat absorption, The hot and cold cycle process of the heat exchange enables the present invention to achieve a better cooling and cooling temperature. [0020] In summary, the functions achieved by the features of the present invention have been excellently achieved, and the applicant submits an application according to law. However, the above description is only for the preferred embodiment of the present invention, and the present invention is not limited thereto, and any one of the 099117382 form numbers can be used without departing from the spirit and scope of the present invention. Α0101 Page 7 of 25 Page 0992030877-0 201142231 Change and modification. The simple equivalent changes and modifications made by the scope of the invention and the description of the invention are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0021] Fig. 1 is a perspective view of the present invention. 2 is a perspective exploded view of a preferred embodiment of the present invention. 3 is a perspective view of a cooling bath in accordance with a preferred embodiment of the present invention. [0024] FIG. 4 is a perspective view of another angle of FIG. 3. [0025] Fig. 5 is a front cross-sectional view of Fig. 3. Figure 6 is a perspective view of a heat pipe of the present invention. [0027] FIG. 7 is a plan view of FIG. 6. 8 is a cross-sectional view of the seventh diagram at the A-A position. [0029] Figure 9 is a perspective view of a fin of the present invention. 10 is a perspective view of a heat pipe set in accordance with a preferred embodiment of the present invention. [0031] FIG. 11 is a bottom view of FIG. 12 is a perspective view showing a heat dissipating component in combination with a susceptor according to a preferred embodiment of the present invention. Figure 13 is a perspective view showing a flow path of a cooling liquid or a gas according to a preferred embodiment of the present invention. [0034] Fig. 14 is a perspective view showing the flow of the coolant or gas in the internal flow of Fig. 13. 099117382 Form No. A0101 Page 8 of 25 0992030877-0 201142231
【主要元件符號說明】 [0035] 1.散熱器 2.基座 [0036] 21.下凹部 22.容室 [0037] 23.第一鎖固孔 3.散熱組件 [0038] 4.冷卻槽 41.中空腔室 [0039] 42.穿孔 421.内螺紋 [0040] 43.曲隔部 44.環狀溝槽 [0041] 45.環狀溝槽 46.密封墊圈 [0042] 47.密封墊圈 48.第二鎖固孔 [0043] 49.第三鎖固孔 5.熱管組 [0044] 51.熱管 511.底端 [0045] 512.立部 52.散熱鰭片 [0046] 521.通孔 522.凸緣 [0047] 523.透孔 6.上蓋 [0048] 61.第四鎖固孔 62.固定件 [0049] 63.快速接頭 64.間隔流道 [0050] 65.流動通道 099117382 表單編號A0101 第9頁/共25頁 0992030877-0[Main component symbol description] [0035] 1. Heat sink 2. Base [0036] 21. Lower recess 22. Housing [0037] 23. First locking hole 3. Heat dissipating assembly [0038] 4. Cooling groove 41 . hollow chamber [0039] 42. perforation 421. internal thread [0040] 43. curved partition 44. annular groove [0041] 45. annular groove 46. sealing gasket [0042] 47. sealing gasket 48. Second locking hole [0043] 49. Third locking hole 5. Heat pipe group [0044] 51. Heat pipe 511. Bottom end [0045] 512. Vertical portion 52. Heat sink fin [0046] 521. Through hole 522. Flange [0047] 523. Through hole 6. Upper cover [0048] 61. Fourth locking hole 62. Fixing member [0049] 63. Quick joint 64. Interval flow path [0050] 65. Flow channel 099117382 Form number A0101 9 pages / total 25 pages 0992030877-0