201140614 六、發明說明： 【發明所屬之技術領威】 [0001] 本發明係有關於一種發泡材及其製造方法，尤指一 種抗靜電/緩衝發泡材及其連續式製造方法。 【先前彳支術】 [0002] 目前電子裝置的製造大多是以分工的方式，由不同 製造商生產零組件，再予以整合製成成品’其中各零組 件的生產地及組裝地可能分布在不同國家’如何降低零 組件在運送過程所造成的損害’是生產業者所需解決的 重要課題，尤其是玻璃棊板的製造廠。常見的玻璃基板 可包括液晶玻璃基板、背光板、偏光板、電P且式觸控基 板、彩色濾光板或一般的玻璃板等，以玻璃為基材的板 體。 玻璃是一種脆性材料，當受到外力碰撞或是掉落地 面時，很容易破裂以致於不能使用。所以玻螭基板的運 送問題相當重要。在玻璃基板@運送過程中，其易受化 學污染，且當玻璃基板之間聲差ί摩擦而產生靜電感應時 ，玻璃基板内部的電路會受到凌壞。另玻璃基板於運送 過程中’玻璃基板間容易因碰撞而受損。 習知之玻璃基板運送主要是將玻璃基板放置在包裝 盒中’並由隔板分隔每個玻璃基板以運送。依據玻璃基 板包裝盒材料之不同，可分為下列兩種類型：一種玻璃 基板包裝盒係採用丙烯腈-丁二烯-苯乙烯 (Acrylonitrile Butadiene Styrene, ABS)樹脂及 聚氯乙烯（Poly Vinyl Chloride, PVC)製成。然而由 於該種用於運送玻璃基板的包裝盒材料並不具有緩衝性 099114844 表單編號A0101 第4頁/共13頁 0992026317-0 201140614 ，所以在玻璃基板包裝盒落下或者震動時，該包裝方式 基本沒有緩衝能力，易造成玻璃基板破裂或者包裳盒各 體受損壞之問題。且包裝盒本身重量約為5_6公斤，也同 時造成在移動、堆積及輸送的不方便。另外，用以製造 玻璃基板包裝盒之射出成型模具成本較高，且相當消= 樹脂成本。 另一種玻璃基板包裝盒係採用發泡倍率為3_3〇倍之 樹脂發泡材料製成。而以該種玻璃基板包裝盒運送，該 包裝盒係由樹脂發泡材料所製成，該材料雖具有緩衝性 月b佳重量輕及模具成本猶低的優點，但仍然具有以下 缺點：首先，該包裝盒内表面結構均一，緩衝能力差， 當受外力衝擊時，玻璃基板容易因應力集中造成損壞或 者破裂，降低運送過程中的安全係數。其二欠，採用該包 裝方式’朗基板容易與包裝盒摩擦歳過多碎屬影 響玻璃基板之潔淨度。 但包裝電子元件時，所使用的發泡材除了提供可緩 衝吸震的倾包覆外，更要避免發泡㈣積靜電導致所 述的電子元件受損，因此必須使用兼具高緩衝性及良好 的抗靜電性之發泡材。 有鑒於上述内容，本發明提供一種發泡材，發泡材 可用於封裝易受靜電影響之電子元件，有效保護電子元 件’吸收運料所產生之碰撞，防止模組化時所產生之 靜電。 【發明内容】 W)03] 本發明之主要目的，係在於提供-種抗靜電/緩衝發 泡材及其連續式製造方法，抗靜電/緩衝發泡材具有抗靜 09920263： 099114844 表單編號A0101 第5頁/共13頁 201140614 電特性及吸收碰撞特性，可躲封裝易受靜㉞變之電 子元件，有效㈣電子元件，吸收料時所產生^碰撞 ，防止模組化時所產生之靜電。 為了達到上述之目的’本發明係提供—種抗靜電/緩 衝發泡材及其㈣式料方法，該抗靜電/緩衝發泡材之 組成物係包含—種以上之鹼性樹脂、相對於驗性樹脂之 重量百分比介於六分之一與二十分之一之間之一碳系導 電材（含白碳及黑碳）及相對於樹脂之重量百分比介於〇 5 與5 %之間之一發泡劑。 該抗靜電/緩衝發泡材之連續式製造方法係先混合該 树月曰及έ亥碳系導電材，形成一比例均勻的混合母體物， 接著加入該欲達到發泡材倍率之適當發泡劑至該混合母 體物内混合成一發泡樹脂，將該發泡樹脂製成平均粒徑 為2-5mm的複數粒狀體，將適當重量之該些粒狀體置於一 螺桿押出機内製成適合於下階段於連續熱爐中進行發泡 之複數片狀母板，該些片狀母板完成後經過電子照射架 橋後才開始進行連續式熱爐發泡(非模内發泡之非連續式 一次發泡成型物），得到該坑鲁電/缓衝發泡材。 此抗靜電/緩衝發泡材可依所需未來成蜇產品的形狀 、大小及特殊需求，如貼、淋膜、壓紋及裁切等再做二 次加工，其可應用性及製造成本皆優於模内發泡之非連 續式一次發泡成型物。本發明之抗靜電/緩衝發泡材具有 抗靜電特性及吸收碰揸與緩衝特性，該抗靜電/緩衝發泡 材可用於封裝電子元件，以保護電子元件，益可做為液 晶螢幕等產品的填縫材。 【實施方式】 表單編號A0101 第6 099114844 0992026317-0 頁/共13頁 201140614 [0004] 故為使責審查委員對本發明之結構特徵及所達成 之功效有更進一步之瞭解與認識，謹佐以較佳之實施例 及配合詳細之說明，說明如後： 晴參閱第一圖，係本發明之一較佳實施例之流轾杀 意圖。如圖所示，本實施例提供—種抗靜電/緩衝發泡材 及其連續式製造方法，抗靜電/緩衝發泡材用於封裝易受 靜電影響之電子元件，電子元件係如玻璃盤'彩色遽光 片、薄面電晶體基板或用於各種面板之玻璃基板。電子 Ο 元件於模組化時容易受靜電損害，另電子元件於運送時 容易因碰撞而損壞’所_發魏供—種抗靜電/缓衡發 泡材’抗靜電/緩衝發泡材封裝電子元件，可梭保護電 子元件，吸收運送時所產生之碰撞，'.防止模組化時所產 生之靜電。 組成抗靜電/緩衝發泡材之材料係仏备―樹脂 '一碳 系導電材及—發泡劑。樹脂祕性樹脂，如：聚稀煙。 碳黑係具有導電特性，碳系導電材相麟樹脂之重量畜 ο 卜刀之間’碳系導電材包 含白碳及黑碳。發泡劑相對於樹脂之重量百分比係介於 0. 5%與5%之間。 而抗靜電/緩衝發崎之連續絲造料係練行步 驟S10 ’混合樹脂與碳轉電材，形成—比例均勻之混合 母鱧物。接著執行步驟S12，加人欲達到發泡材倍率之適 當發泡劑至混合母體物中混合成—發泡樹脂，並將該發 泡樹脂製成平均粒料2_5mm之複數粒狀體。 ----*无〜蝴公视狀體置於- 099114844 螺桿壓出機製成適合於連續樂爐中進行發泡之兮 表單編號删1 第7頁/共13頁 X二乃狀 0992026317-0 201140614 母板，該些片狀母板經電子照射架橋後進行連續式熱爐 發泡，最後得到抗靜電/緩衝發泡材。 最後得到之抗靜電/緩衝發泡材之發泡倍率控制於六 倍與二十倍之間，控制抗靜電/緩衝發泡材之發泡倍率可 提升抗靜電/緩衝發泡材之吸收碰撞特性，若抗靜電/緩 衝發泡材之發泡倍率過強時，導致抗靜電/緩衝發泡材之 強度及彈性不足。若抗靜電/緩衝發泡材之發泡倍率過低 時，導致抗靜電/緩衝發泡材之質量較輕，無法給予電子 元件完整的保護。另為了維持良好的碰撞吸收特性與抗 靜電特性及封裝次數，更控制抗靜電/緩衝發泡材之厚度 ，抗靜電人緩衝發泡材之厚度控制於0. 5mni與4_之間。 由上述連續式製造方法所製造之抗靜電/緩衝發泡材 之表面電阻率介於104與10e12歐姆/cm2，抗靜電/緩衝發 泡材之體積電阻率介於1〇4與l〇e12歐姆/cm3，本發明之 抗靜電/緩衝發泡材具有表面電阻率及體積電阻率，使電 子元件間所產生之靜電往四方流動，以提升抗靜電/缓衝 發泡材之抗靜電特性。 本發明之抗靜電/緩衝發泡材之表面具有複數微結構 ，該些微結構圍繞碳系導電材之複數碳顆粒，所以於長 時間使用後碳系導電材之該些碳顆粒不會減少，以維持 抗靜電/緩衝發泡材之抗靜電特性。而於抗靜電/緩衝發 泡材之表面之該些微結構使抗靜電/緩衝發泡材進行真空 吸附時，可容易地從一吸嘴移開。另，抗靜電/緩衝發泡 材之該些微結構亦可防止該抗靜電/緩衝發泡材黏於電子 元件之表面，更可讓抗靜電/緩衝發泡材容易從電子元件 之表面移除。 099114844 表單編號A0101 第8頁/共13頁 0992026317-0 201140614 由上述可知，本發明提供一種抗靜電/緩衝發泡材及 其連續式製造方法，抗靜電/緩衝發泡材之組成物包含樹 脂、相對於樹脂之重量百分比介於六分之一與二十分之 一之間之碳系導電材及相對於樹脂之重量百分比介於〇. 5 %與5%之間之發泡劑，抗靜電/緩衝發泡材之製造方法 係先混合樹脂及碳系導電材，形成混合物，接著加入發 泡劑至混合物進行發泡，得到抗靜電人緩衝發泡材。本發 明之抗靜電/緩衝發泡材具有抗靜電特性及吸收碰撞特性 。抗靜電/緩衝發泡材可用於封裝易受靜電影響之電子元 〇 件，可有效保護電子元件’吸收運送時所產生之碰撞， . ..... ... 防止模組化時所產生之靜電。 綜上所述，本發明係實為一真有新穎性、進步性及 可供產業利用者，應符合我國專利法所規定之專利申請 要件無疑，爰依法提出發明專利申請，祈鈞局早曰賜 准利，至感為禱。 惟以上所述者，僅為本發明之一較佳實施例而已， 並非用來限定本聲明實施之範圍，舉凡依本發明申請專 Ο 利範圍所述之形狀、構造、特徵及精神所為之均等變化 與修飾，均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 [0005] 第一圖：本發明之一較佳實施例之流程示意圖。 099114844 表單編號A0101 第9頁/共13頁 0992026317-0 201140614201140614 VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a foamed material and a method of manufacturing the same, and more particularly to an antistatic/buffered foamed material and a continuous manufacturing method thereof. [Previous 彳 术 】 [0002] At present, the manufacture of electronic devices is mostly in the form of division of labor, and the components are produced by different manufacturers, and then integrated into finished products. The production sites and assembly sites of the components may be distributed differently. The country 'how to reduce the damage caused by the components in the transportation process' is an important issue that the manufacturer needs to solve, especially the glass slab manufacturing plant. A common glass substrate may include a liquid crystal glass substrate, a backlight plate, a polarizing plate, an electric P-type touch substrate, a color filter plate, or a general glass plate, and the like, and a glass-based substrate. Glass is a brittle material that breaks easily when it is hit by an external force or falls off the floor. Therefore, the transport problem of the glass substrate is very important. In the glass substrate @transport process, it is susceptible to chemical contamination, and when the acoustic aberration is generated by friction between the glass substrates, the circuit inside the glass substrate is damaged. In addition, during the transportation of the glass substrate, the glass substrates are easily damaged by collision. Conventional glass substrate transports are primarily by placing a glass substrate in a package' and each glass substrate is separated by a separator for transport. According to the material of the glass substrate packaging box, it can be divided into the following two types: a glass substrate packaging box is made of Acrylonitrile Butadiene Styrene (ABS) resin and Poly Vinyl Chloride (Poly Vinyl Chloride). Made of PVC). However, since the packaging material for transporting the glass substrate does not have the cushioning property 099114844, the form number A0101, the fourth page/the total 13 page 0992026317-0 201140614, the packaging method is substantially absent when the glass substrate package is dropped or shaken. The buffering capacity is easy to cause the glass substrate to be broken or the body of the bag to be damaged. Moreover, the weight of the package itself is about 5-6 kg, which also causes inconvenience in moving, stacking and conveying. In addition, the injection molding die used to manufacture the glass substrate package is costly and relatively inexpensive. Another glass substrate package is made of a resin foamed material having a foaming ratio of 3 to 3 times. The package is made of the glass substrate package, which is made of a resin foam material. Although the material has the advantages of good cushioning weight and light weight and low mold cost, it still has the following disadvantages: First, The inner surface structure of the packaging box is uniform, and the buffering ability is poor. When impacted by an external force, the glass substrate is easily damaged or broken due to stress concentration, and the safety factor during transportation is reduced. The second is owed, and the packaging method is used. 'Lang substrate is easy to rub with the package. Too much damage affects the cleanliness of the glass substrate. However, when packaging electronic components, the foamed material used in addition to providing a cushioning that absorbs shock absorption, and avoiding foaming (4) accumulation of static electricity causes damage to the electronic components, so it is necessary to use both high cushioning properties and good Antistatic foaming material. In view of the above, the present invention provides a foamed material which can be used for packaging electronic components which are susceptible to static electricity, effectively protecting the electronic component from colliding with the transport material and preventing static electricity generated during modularization. SUMMARY OF THE INVENTION W) 03] The main object of the present invention is to provide an antistatic / buffer foam material and a continuous manufacturing method thereof, the antistatic / buffer foam material has anti-static 09920263: 099114844 Form No. A0101 5 pages / total 13 pages 201140614 Electrical characteristics and absorption collision characteristics, can hide the electronic components that are susceptible to static 34, effective (four) electronic components, the collision generated when the material is absorbed, to prevent static electricity generated during modularization. In order to achieve the above object, the present invention provides an antistatic/buffer foaming material and a method thereof (4), wherein the composition of the antistatic/buffering foaming material comprises more than one kind of basic resin, relative to the test. The weight percentage of the resin is between one-sixth and one-twentieth of a carbon-based conductive material (containing white carbon and black carbon) and the weight percentage relative to the resin is between 〇5 and 5%. A blowing agent. The continuous manufacturing method of the antistatic/buffer foaming material is to first mix the tree and the carbon-based conductive material to form a uniform proportion of the mixed parent material, and then add the appropriate foaming to achieve the foaming material magnification. Mixing the agent into the mixed matrix to form a foamed resin, and forming the foamed resin into a plurality of granules having an average particle diameter of 2 to 5 mm, and placing the granules of appropriate weight in a screw extruder It is suitable for a plurality of sheet-shaped mother boards which are foamed in a continuous hot furnace in the next stage. After the sheet-shaped mother boards are completed, the continuous hot-melt foaming is started after the electron irradiation is bridged (non-in-mold foaming is discontinuous). A primary foam molding) was obtained to obtain the pit-lubricated/buffered foam. The antistatic/buffer foaming material can be further processed according to the shape, size and special needs of the future product, such as affixing, laminating, embossing and cutting, and its applicability and manufacturing cost are all A discontinuous primary foam molding that is superior to in-mold foaming. The antistatic/buffer foaming material of the invention has antistatic property and absorption absorbing and buffering property, and the antistatic/buffering foaming material can be used for packaging electronic components to protect electronic components, and can be used as products of liquid crystal screens and the like. Filling material. [Embodiment] Form No. A0101 No. 6 099114844 0992026317-0 Page 13 of 201140640614 [0004] Therefore, in order to make the reviewer have a better understanding and understanding of the structural features and the effects achieved by the reviewer, The preferred embodiment and the detailed description are as follows: Clearly referring to the first figure, it is an intention of a preferred embodiment of the present invention. As shown in the figure, the present embodiment provides an antistatic/buffer foaming material and a continuous manufacturing method thereof. The antistatic/buffer foaming material is used for packaging electronic components susceptible to static electricity, such as a glass disk. Color calender, thin-faced transistor substrate or glass substrate for various panels. The electronic Ο component is easily damaged by static electricity when it is modularized, and the electronic component is easily damaged by collision during transportation. _ 魏 wei wei - antistatic / retarding foaming material 'antistatic / cushioning foam packaging electronic The component can shuttle the electronic component to absorb the collision generated during transportation. '. Prevent static electricity generated during modularization. The material constituting the antistatic/buffer foaming material is a resin-a resin-based conductive material and a foaming agent. Resin secret resin, such as: concentrated smoke. The carbon black has electrical conductivity, and the carbon-based conductive material has the weight of the resin. The carbon-based conductive material contains white carbon and black carbon. The 5% by weight of the foaming agent is between 0.5% and 5%. The antistatic/buffering squid continuous filament making system is carried out in the step S10 'mixing the resin and the carbon-converting material to form a uniform proportion of the parent material. Next, step S12 is performed to add a suitable foaming agent to the mixed parent material to form a foaming resin, and the foaming resin is made into a plurality of granules having an average pellet of 2 to 5 mm. ----* No ~ Butterfly public view placed - 099114844 Screw extruder made suitable for foaming in continuous furnaces Form No. 1 Page 7 of 13 X II is 0992026317- 0 201140614 Motherboard, these sheet-shaped mother boards are subjected to continuous heating furnace foaming after electron irradiation, and finally an antistatic/buffer foaming material is obtained. Finally, the expansion ratio of the antistatic/buffer foam material is controlled between six and twenty times, and the expansion ratio of the antistatic/buffer foam material can be improved to improve the absorption and collision characteristics of the antistatic/buffer foam material. If the expansion ratio of the antistatic/buffer foam material is too strong, the strength and elasticity of the antistatic/buffer foam material are insufficient. If the expansion ratio of the antistatic/buffer foam material is too low, the quality of the antistatic/buffer foam material is light, and the electronic component cannot be completely protected. 5mni与4_之间。 In order to maintain a good impact absorption characteristics and anti-static properties and the number of times of the package, and more to control the thickness of the antistatic / buffer foaming material, the thickness of the antistatic human buffer foam is controlled between 0. 5mni and 4_. The surface resistivity of the antistatic/buffer foaming material produced by the above continuous manufacturing method is between 104 and 10e12 ohm/cm2, and the volume resistivity of the antistatic/buffer foaming material is between 1〇4 and l〇e12 ohm. /cm3, the antistatic/buffer foaming material of the present invention has surface resistivity and volume resistivity, so that static electricity generated between electronic components flows in all directions to enhance the antistatic property of the antistatic/buffer foaming material. The surface of the antistatic/buffer foaming material of the present invention has a plurality of microstructures, and the microstructures surround the plurality of carbon particles of the carbon-based conductive material, so that the carbon particles of the carbon-based conductive material are not reduced after long-term use, Maintain antistatic properties of antistatic/buffer foam. The microstructures on the surface of the antistatic/buffered foam material can be easily removed from a nozzle when the antistatic/buffer foam material is vacuum adsorbed. In addition, the microstructures of the antistatic/buffered foam can prevent the antistatic/buffer foam from sticking to the surface of the electronic component, and the antistatic/buffer foam can be easily removed from the surface of the electronic component. 099114844 Form No. A0101 Page 8 of 13 0992026317-0 201140614 It is known from the above that the present invention provides an antistatic/buffer foaming material and a continuous manufacturing method thereof, and the composition of the antistatic/buffering foaming material comprises a resin, A carbon-based conductive material having a weight percentage of between one-sixth and one-twentieth of the resin and a foaming agent having a weight percentage relative to the resin of between 5% and 5%, antistatic The method for producing the buffer foam material is to first mix a resin and a carbon-based conductive material to form a mixture, and then add a foaming agent to the mixture to foam, thereby obtaining an antistatic human buffer foam material. The antistatic/buffered foam of the present invention has antistatic properties and absorption shock characteristics. The antistatic/buffer foam material can be used to package electronic components that are susceptible to static electricity, which can effectively protect the electronic components from absorbing the collisions generated during transportation. ..... ... to prevent the occurrence of modularization Static electricity. In summary, the present invention is truly novel, progressive, and available to the industry. It should be in accordance with the patent application requirements stipulated in the Patent Law of China, and the invention patent application is filed according to law. Quasi-profit, to the feeling of prayer. However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the shapes, structures, features, and spirits described in the application scope of the present invention are equally uniform. Variations and modifications are intended to be included within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0005] First Embodiment: A schematic flowchart of a preferred embodiment of the present invention. 099114844 Form No. A0101 Page 9 of 13 0992026317-0 201140614
【主要元件符號說明】 099114844 表單編號A0101 第10頁/共13頁 0992026317-0 [0006][Main component symbol description] 099114844 Form No. A0101 Page 10 of 13 0992026317-0 [0006]