201137436 六、發明說明： 【發明所屬之技術領域】 本發明係關於適用於製造電子紙、有機E L元件等的 顯示面板的基板的貼合方法及裝置。 【先前技術】 作爲基板的貼合方法，如專利文獻1之記載，存在透 過基板用接著劑使第一基板和第二基板重疊後，使該基板 用接著劑固化的方法。 在這種習知的基板的貼合方法中，首先，使第—基板 和第二基板透過塗佈在一個基板上的基板用接著劑而相重 疊。接著，相重疊的第一基板和第二基板在進行加熱、加 壓的固化裝置即一對加熱輥之間被搬送通過，使基板用接 著劑固化而完成貼合。 (先前技術文獻） (專利文獻） (專利文獻1)日本特開2009-230955 【發明內容】 (發明所欲解決之課題） 在習知技術中，使相重疊的第一基板和第二基板通過 一對輥之間’使介於這些基板之間的基板用接著劑固化， 而完成這些基板的貼合。因此，相重疊的第一基板和第二 基板，可能會由於在從重疊工序至加熱工序的這些基板的 -5- 201137436 搬送過程中所產生的振動等導致位置偏移，或由於在一對 輥之間對這些基板所施加的熱的影響、外力的作用等導致 位置偏移，進而導致這些基板的貼合位置的精度下降。 本發明的課題在於，在使第一基板和第二基板重疊後 ，藉由使介於這些基板之間的基板接著劑固化來完成這些 基板的貼合時，提高這些基板的貼合位置精度。 (解決課題之手段） 請求項1之發明係一種貼合基板的製造方法，在將用 於製造顯示面板的第一基板和第二基板透過基板用接著劑 而相重疊後，使該基板用接著劑固化，由此製造貼合基板 ’該貼合基板的製造方法的特徵在於：將第一基板支承在 外形尺寸比該第一基板大的第~支承構件的中央區域，將 第二基板支承在外形尺寸比該第二基板大的第二支承構件 的中央區域’在上述第一支承構件的支承前述第一基板的 支承面側和前述第二支承構件的支承前述第二基板的支承 面側中的至少一方’以包圍前述第一基板或第二基板的方 式’塗敷與前述基板用接著劑相比固化前的黏著力更大的 支承用接著劑’在將由前述第一支承構件所支承的前述第 ~基板和由前述第二支承構件所支承的前述第二基板相重 疊時，利用前述支承用接著劑將前述第一支承構件和第二 支承構件相貼合。 請求項2之發明是在請求項】之發明中，在前述基板 用接著劑固化後，在前述第一基板和第二基板與前述支承 -6 - 201137436 用接著劑之間，將第一支承構件和第二支承構件切斷。 請求項3之發明是在請求項1或2之發明中，在減壓 氣氛下，利用支承用接著劑將前述第一支承構件和第二支 承構件相貼合。 請求項4之發明是在請求項3之發明中，前述第一基 板是顯示模組基板，前述第二基板是彩色濾光片基板。 請求項5之發明係一種貼合基板的製造方法，在將用 於製造顯示面板的、外周具有餘白部的第一基板和第二基 板透過基板用接著劑而相重疊後，使該基板用接著劑固化 ，由此製造貼合基板，該貼合基板的製造方法的特徵在於 :將前述第二基板支承在外形尺寸比該第二基板大的支承 構件的中央區域，在前述支承構件的支承前述第二基板的 支承面側和前述第一基板的餘白部的與前述第二基板相重 疊的面側中的至少一方，以包圍前述第二基板的大小，塗 敷與前述基板用接著劑相比固化前的接著力更大的支承用 接著劑，在將前述第一基板和第二基板相重疊時，利用前 述支承用接著劑將前述支承構件和上述第一基板相貼合。 請求項6之發明是在請求項5之發明中，在前述基板 用接著劑固化後，在前述第二基板與前述支承用接著劑之 間，將支承構件和前述第一基板切斷。 請求項7之發明是在請求項5或6之發明中，在減壓 氣氛下，利用支承用接著劑將前述支承構件和前述第一基 板相貼合。 請求項8之發明是在請求項7之發明中，前述第一基 201137436 板是顯示模組基板，前述第二基板是彩色濾光片基板。 請求項9之發明係一種貼合基板的製造裝置，在將用 於製造顯示面板的第一基板和第二基板透過基板用接著劑 而相重鹽後，使該基板用接著劑固化，由此製造貼合基板 ，該貼合基板的製造裝置的特徵在於，具備有：第一基台 ，其支承外形尺寸比前述第一基板的外形尺寸大的第一支 承構件，在該第一支承構件的中央區域支承前述第一基板 :第二基台，其支承外形尺寸比前述第二基板的外形尺寸 大的第二支承構件，在該第二支承構件的中央區域支承前 述第二基板：驅動部，其使前述第一基台和第二基台在相 對地接近或遠離的方向上移動；和控制部，其控制驅動部 ，以使前述第一基台和第二基台接近地移動，由此在將前 述第一基板和前述第二基板相重疊時，利用以包圍前述第 一基板或第二基板的方式塗敷在前述第一支承構件的支承 前述第一基板的支承面側、和前述第二支承構件的支承前 述第二基板的支承面側中的至少一方的、與前述基板用接 著劑相比固化前的接著力更大的支承用接著劑，將前述第 一支承構件和第二支承構件相貼合。 請求項1 〇之發明是在請求項9之發明中，還具備有 切除裝置，該切除裝置在前述基板用接著劑固化後，在前 述第一基板和第二基板與前述支承用接著劑之間，將前述 第一支承構件和第二支承構件切斷。 請求項1 1之發明是在請求項9或1 0之發明中，還具 備有：能夠減壓的腔室’該腔室能夠在減壓氣氛下，利用 -8 - 201137436 支承用接著劑將前述第一支承構件和第二支承構件相貼合 0 請求項12之發明是在請求項11之發明中，前述第一 支承構件和前述第二支承構件中的至少一方由可撓性膜所 形成。 請求項13之發明是在請求項12之發明中，支承由前 述可撓性膜所形成的支承構件的前述基台，係在與該支承 構件的塗敷支承用接著劑的部分相對應的部分，設置有高 度比與該支承構件的其他部分相對應的部分爲更高的支承 面。 請求項14之發明是在請求項13之發明中，前述第一 基板是顯示模組基板，前述第二基板是彩色濾光片基板。 請求項15之發明係一種貼合基板的製造裝置，在將 用於製造顯示面板的、外周具有餘白部的第一基板和第二 基板透過基板用接著劑而相重疊後，使該基板用接著劑固 化，由此製造貼合基板，該貼合基板的製造裝置的特徵在 於，具備有：支承前述第一基板的第一基台；第二基台， 其支承外形尺寸比前述第二基板的外形尺寸大的支承構件 ，在該支承構件的中央區域支承前述第二基板；驅動部， 其使上述第一基台和第二基台在相對地接近或遠離的方向 上移動；和貼合裝置，其控制驅動部，以使前述第一基台 和第二基台接近地移動，由此，在將前述第一基板和第二 基板相重疊時，利用以包圍前述第二基板的大小塗敷在前 述第一基板的餘白部的與前述第二基板相重疊的面側和前 -9 - 201137436 述支承構件的支承前述第二基板的支承面側中的至少一方 的、與前述基板用接著劑相比固化前的接著力更大的支承 用接著劑，將前述支承構件和上述第一基板相貼合。 請求項1 6之發明是在請求項1 5之發明中，還具備有 切除裝置，該切除裝置在前述基板用接著劑固化後，在前 述第二基板與前述支承用接著劑之間，將支承構件和前述 第一基板切斷。 請求項1 7之發明是在請求項1 5或1 6之發明中，還 具備有：能夠減壓的腔室，該腔室能夠在減壓氣氛下，利 用支承用接著劑將前述支承構件和上述第一基板相貼合。 請求項18之發明是在請求項17之發明中，前述支承 構件由可撓性膜形成》 請求項1 9之發明是在請求項1 8之發明中，前述第一 基板是顯示模組基板，前述第二基板是彩色濾光片基板。 (發明之效果） 根據本發明，能夠在將用於製造顯示面板的第一基板 和第二基板相重疊後，藉由使介於這些基板之間的基板用 接著劑固化而完成這些基板的貼合時，提高這些基板的貼 合位置精度。 【實施方式】 (實施例1)(第1圖〜第9圖） 第1圖所示的顯示面板製造生產線係將第一基板〗和 -10- 201137436 第二基板2透過塗敷在第一基板1上所形成的膜狀的基板 用接著劑3而相重疊後，使基板用接著劑3固化（藉由溶 劑蒸發所造成的固化以及藉由化學反應所造成的硬化）， 由此組裝基板模組4者，該生產線具有重疊裝置1 00、固 化裝置200和切除裝置3 00。重疊裝置1〇〇係在將第一基 板1和第二基板2分別支承在第一支承構件5和第二支承 構件6的中央區域的狀態下，透過設置於第一基板1的基 板用接著劑3，以預定的位置重疊精度將第一基板1和第 二基板2相重疊。固化裝置200係使被重疊裝置100所重 疊的基板1、2之間的基板用接著劑3固化。切除裝置3 00 係在藉由固化裝置200而使基板用接著劑3固化後，將第 一支承構件5和第二支承構件6在比支承第一基板1和第 二基板2的中央區域更靠外側的外周部進行切除，取出基 板模組4。另外’此處，第一基板1是顯示模組基板，該 顯示模組基板係具有：呈矩陣狀配置有複數個微囊 (micro capsule )的電泳片、和與微囊相對應形成有切換元件等的 元件基板所構成，該微囊封入有電泳粒子。另外，第二基 板2是彩色濾光片基板。 另外，此處，第一支承構件5和第二支承構件6中支 承有第一基板1、第二基板2的區域是中央區域。並且， 外周部是比中央區域更靠外側的至第一支承構件5和第二 支承構件6的外邊緣爲止的區域。亦即，第—支承構件5 、第二支承構件6具有比第一基板1、第二基板2爲更大 的外形尺寸（輪廓），第—基板1、第二基板2係以各自 -11 - 201137436 的中央分別與第一支承構件5和第二支承構件6相一致的 方式被支承。另外，在該實施例中，第一基板1和第二基 板2的大小相同，第一支承構件5和第二支承構件6的大 小相同。 重疊裝置1〇〇如第2圖所示，具有用減壓泵11減壓 的腔室12»亦即，腔室12內係由減壓泵η被減壓至預定 的壓力，例如1 Pa左右。在腔室12的一側形成有藉由擋 門13作開閉的出入口 14，由第一支承構件5所支承的上 述第一基板1和由第二支承構件6所支承的第二基板2從 該出入口 14被放入取出。 在上述腔室12內設置有第一基台20。該第一基台20 藉由第~驅動源21而在X、Y和Θ方向被驅動。支承塗 敷有基板用接著劑3的上述第_基板1的第一支承構件5 ’以使第一基板1的支承面向上的方式，透過彈性支承構 件22而被支承在第一基台20的保持面（上表面）上。 在第一基台20的上方設置有第二基台30。該第二基 台30係藉由第二驅動源31而在相對第一基台20接近或 遠離的Ζ方向上被驅動。在第二基台30的下表面的保持 面，透過靜電保持構件32，利用靜電力保持支承上述第二 基板2的第二支承構件6。另外，各基台20、30的保持面 的面積形成爲比支承基板1、2的支承構件5、6的面積稍 大。並且，第二基台30對基板2的保持並不限於利用靜 電保持構件32，也可以利用真空吸附保持構件、黏著保持 構件等其他保持構件。 12- 201137436 透過第一支承構件5和第二支承構件6而被保持在第 一基台20和第二基台30的第一基板1和第二基板2，其 四角部分別被設置在上述腔室1 2的下方的4組攝像手段 4 0 (只圖示2組）拍攝。各攝像手段4 〇包括：粗對位用 的第一攝像相機4 1 :和攝像倍率比該第一攝像相機4 1高 的精密對位用的第二攝像相機42。 各攝像手段40的第一、第二攝像相機41、42由具有 X、Y和Z平臺（table)的定位裝置43在X、Y和Z方向 上驅動，各定位裝置43係被設置在被配置於上述腔室12 的下方的載置板44上。 上述腔室12的底壁的至少各定位裝置43相對向的部 位係形成在透明窗45。在配置於上述腔室12內的第一基 台20 '彈性支承構件22之與上述透明窗45相對應的部位 係形成有空洞部46，其可藉由上述第一、第二攝像相機 41、42來拍攝透過第一支承構件5(支承構件5係由透光 性的材料所形成，較佳爲由透明材料所形成）被保持在第 一基台2〇、彈性支承構件22的保持面的第一基板1的四 角部、及透過該第一基板1被保持在上述第二基台30的 保持面的第二基板2的四角部。 在上述第一基板1和第二基板2的外側的四角部，分 別設置有未圖示的粗對位標記和精密對位標記。藉由使各 基板1、2的粗對位標記相一致，能夠對第一基板1和第 二基板2進行粗對位，藉由使各精密對位標記相一致，能 夠對一對基板1、2進行精密對位。 -13- 201137436 其中，爲了拍攝第一、第二基板1、2，在第一基台 2〇和彈性支承構件20形成有空洞部46，但也可以不形成 空洞部46 ’而使第一基台20和彈性支承構件22整體由透 明的材料形成。 第一攝像相機4 1和第二攝像相機42的攝像信號被輸 入到未圖示的圖像處理部。圖像處理部對所被輸入的攝像 信號使用公知的圖像處理技術進行處理，計算各基板1、2 的對位標記的相對的位置偏移。亦即，圖像處理部對第一 攝像相機41的攝像信號進行圖像處理，對第一基板1的 粗對位標記與第二基板2的粗對位標記進行圖像識別，計 算兩標記的相對的位置偏移。另外，圖像處理部對第二攝 像相機42的攝像信號進行圖像處理，對第一基板1的精 密對位標記與第二基板2的精密對位標記進行圖像識別， 計算兩標記的相對的位置偏移。圖像處理部將計算結果發 送到設置於控制裝置47的未圖示的運算處理部。在運算 處理部中，根據由圖像處理部所計算出的分別設置在第一 基板1和第二基板2的四角部的各一對粗對位標記或精密 對位標記的相對的位置偏移，計算這些基板1、2的X、Y 和Θ方向上的相對的位置偏移。 當藉由上述運算處理部計算出一對基板1、2的位置 偏移時，將該位置偏移記億在設置於控制裝置47的未圖 示的記憶部中，另一方面也向驅動部（同樣未圖示）輸出 。由此，驅動部向驅動第一基台2 0的第一驅動源2 1輸出 驅動信號，將上述第一基板20在X方向、Y方向和θ方 -14- 201137436 向上驅動，將第一基板1和第二基板2對位。 第一基板1和第二基板2的對位，係進行基於來自第 —攝像相機4 1的攝像信號的粗對位、和基於來自第二攝 像相機4 2的攝像信號的精密對位。另外，在進行第一基 板1和第二基板2的粗對位和精密對位時，第一基板1和 第二基板2的間隔可以相同，也可以與粗對位相比，在該 等基板1、2的間隔更近時進行精密對位。第一基板丨和 第二基板2的間隔，由上述控制裝置47的驅動部控制上 述第一驅動源31來進行。 在上述腔室1 2係透過流量調整閥5 1連接有供給例如 氮等被加壓後的氣體的氣體供給源5 0。藉由調整流量調整 閥5 1的開度來調整向腔室：2內供給的氣體的流量，能夠 使藉由減壓泵11減壓後的腔室12內的壓力根據預定的上 升曲線上升。上述流量調整閥5 1的開度由上述控制裝置 47的驅動部調整。 以下，對使用重疊裝置100、固化裝置200和切除裝 置300製造由第一基板1和第二基板2所形成的基板模組 4的方法，連同這些裝置結構一起進行說明。 (1)第一基板1的貼合準備工序（第3圖） 在第一基板1的上表面預先塗敷基板用接著劑3而形 成基板用接著劑3的膜，並透過雙面接著膠帶等，將該第 —基板1的下表面（設置有基板用接著劑3的面的相反側 的面）載置在具有比第一基板1的輪廓大的輪廓的第一支 承構件5上進行支承（第3圖（A ))。在本實施例中， -15- 201137436 基板用接著劑3具有被加熱後固化的熱固化性’由於黏度 低等原因，在常溫下並不會發揮黏著性、或黏著性極弱。 另外，第一支承構件5係由透光性的可撓性膜所形成。另 外，此處，就基板用接著劑3而言，既可以塗敷液狀或膏 狀的接著劑，也可以貼附片狀的接著劑。另外’在形成基 板用接著劑3的膜之前，可以使第一支承構件5的內周部 支承第一基板1。 在第一支承構件5的外周部，以在圓周方向呈環狀相 連的方式塗敷塗敷裝置7所吐出的支承用接著劑8(第3 圖（B) 、 ( C))。在本實施例中，支承用接著劑是藉由 紫外線照射而硬化的UV硬化型（UV固化型）。另外， 支承用接著劑8是具有硬化（固化）前的狀態下的黏著力 比基板用接著劑3更大的特性的接著劑。 (2) 第二基板2的貼合準備工序（第4圖） 透過雙面接著膠帶等，將第二基板2的下表面（與第 一基板1貼合的面的相反側的面）載置在具有比第二基板 2的輪廓大的輪廓的第二支承構件6的內周部進行支承（ 第4圖）。其中，第二支承構件6係由透光性的玻璃基板 或樹脂基板所形成。 (3) 將上述（〗）的第一基板1和上述（2)的第二 基板2設置到重疊裝置100的工序（第5圖） 將支承第一基板1的第一支承構件5載置在重疊裝置 100的腔室12內的第一基台20的彈性支承構件22上加以 支承。第一支承構件5係藉由摩擦力而由第一基台20的 -16- 201137436 彈性支承構件22所保持。 此時，在本實施例中，由於上述（1 )中在 構件5的外周部所塗敷的支承用接著劑8的塗敷 一基板1和第二基板2的總板厚小，所以在支承 構件5的第一基台20的彈性支承構件22的外周 與該第一支承構件5的塗敷支承用接著劑8的部 的外周部，設置具有高階差支承面2 3 A的框狀的 23。由此’第一支承構件5中塗敷有支承用接著 分的下表面由彈性凸部23所支承，在第一支承彳 支承第一基板1的部分的下表面，形成高階差支 的階差高度的空隙。利用後述（4 )之由可撓性 的第一支承構件5的撓曲來補足支承用接著劑8 敷高度的不足。另外，此處在彈性凸部23處的 承面2 3 A ’沿著彈性凸部2 3的框形狀形成有複 示的真空吸附孔，能夠真空吸附第一支承構件5 。另外’也可以將彈性支承構件2 2的位於彈性己 內側的上表面形成爲與彈性凸部23的高階差支 相同的尚度’在第一支承構件5的下表面與彈性 2 2的上表面之間不形成空隙。此時，可以利用比 23更軟的彈性材料來形成彈性支承構件22 ,使 所述將第一基板1與第二基板2相重疊時，彈性 22中與第一基板1相對應的支承面能夠相對於高 面23A下陷。 另一方面’將支承桌一基板2的第二支承構 第一支承 高度比第 第一支承 部、且爲 分相對應 彈性凸部 劑8的部 冓件5的 承面2 3 A 膜所形成 的上述塗 高階差支 數個未圖 的周緣部 b部23的 承面 23 A 支承構件 彈性凸部 得在如後 支承構件 階差支承 件6靜電 -17- 201137436 吸附於重疊裝置100的腔室12內的第二基台.30的 持構件32加以保持。 接著，將如上所述被支承於第一基台20的第一 、與如上所述被支承於第二基台30的第二基板2 位置對位。亦即，控制裝置47的運算處理部係根 手段40的第一攝像相機41或第二攝像相機42所 的第一基板1和第二基板2的四角部的各一對粗對 或精密對位標記的攝像信號，計算這些基板1、2纪 和Θ方向上的相對的位置偏移。控制裝置47的驅 以消除該位置偏移的方式在X方向、Y方向和Θ方 動第一基台20，對第一基板1和第二基板2進行對 (4)重疊裝置100進行的第一基板1和第二 的重疊工序（第6圖） 藉由控制裝置47的驅動部將第二基台30在Z 下方向）驅動，使第一基板1和第二基板2以上S 的對位狀態相重疊，並藉由支承用接著劑8貼合第 構件5和第二支承構件6。由此，第一基板1和第 2係構成夾在第一支承構件5和第二支承構件6之 保持的基板模組4。 另外，腔室1 2內係從第·一基板1和第二基板 述重疊前起藉由減壓泵11被減壓’在該減壓.氣氛 第一基板1和第二基板2相重疊’並利用支承用接 將第一支承構件5和第二支承構件6貼合。由此， 第一基板1和第二基板2而形成的基板模組4夾在 靜電保 基板1 的重疊 據攝像 拍攝到 位標記 J X、Y 動部係 向上驅 位。 基板2 方向（ ί ( 3 ) —支承 二基板 間並被 2的上 下，將 著劑8 將重疊 第一支 -18- 201137436 承構件5和第二支承構件6之間，密封在由第一 5、第二支承構件6和支承用接著劑8所形成的 中〇 此時，由可撓性膜所形成的第一支承構件5 3)的支承用接著劑8的塗敷高度不足的量相應 在第一基台20的由彈性支承構件22的高階差支 所包圍的內周側階差部，與相對的第二支承構件 承用接著劑8被接著而被貼合。亦即，重疊裝置 爲第一、第二支承構件5、6的貼合裝置而發揮功 將第一基板1和第二基板2夾在第一支承構 二支承構件6之間加以保持的基板模組4構成之 從氣體供給源5 0所被供給的氣體，腔室1 2內返 壓。由此，構成基板模組4的第一基板1和第二 受到大氣的外壓的第一支承構件5和第二支承構 被牢固地重疊並被保持，可靠地維持前述（3) 能° /〇|> (5)支承用接著劑8的硬化工序（第7圖） 解除藉由第二基台30的靜電保持構件32所 電保持，使構成基板模組4的第二支承構件6離 台30的靜電保持構件32，使第二基台30上升。 擋門1 3打開，從出入口 14取出基板模組4，搬 與固化裝置200之間的UV照射位置。另外，藉 台30的靜電保持構件32所進行的靜電保持的解 以在將第一基板1和第二基板2重疊之後進行， 支承構件 減壓氣氛 與前述（ 地被壓入 承面2 3 A 6藉由支 1〇〇亦作 丨能。 件5和第 後，利用 回到大氣 基板2在 件6之間 的對位狀 進行的靜 開第二基 接著，將 送至位於 由第二基 除，也可 亦即，也 -19- 201137436 可以在將第一支承構件5和第二支承構件6貼合後 氣體供給源5 0向腔室1 2內開始供給氣體爲止的期 行。 在UV照射位置，利用未圖示的紫外線照射裝 基板模組4的上方向整個基板模組4進行紫外線照 支承用接著劑8硬化。此時’爲了防止紫外線照射 基板1、第二基板2、以及兩基板1、2之間的基板 劑3，在基板模組4中與第一基板1、第二基板2 ' 1 ' 2之間的基板用接著劑3相對應的部分配置遮罩 此，使第一支承構件5和第二支承構件6夾持第一 和第二基板2的保持狀態牢固，可靠地維持前述< 第一基板1和第二基板2的對位狀態。 (6) 採用固化裝置200所進行的基板用接著費 固化工序（第8圖） 將基板模組4搬送至固化裝置200，在固化裝 的加熱爐2 0 1內對基板模組4進行加熱，並且將基 4的第一基板1和第一支承構件5以及第二基板2 支承構件6藉由加壓構件202而在與支承台2 03之 夾壓，對第一基板1和第二基板2之間的基板用接 進行加熱、加壓並使之固化。由此，第一基板1和 板2保持在前述（3)的重疊裝置100被重疊的位 的狀態被貼合完成，構成基板模組4的第一基板1 基板2的貼合位置精度被提高。 (7) 採用切除裝置300所進行的基板模組4 ，至從 間內進 置，從 射，使 到第一 用接著 兩基板 9。由 基板1 3 )的 丨!1 3的 置200 板模組 和第二 間進行 著劑3 第二基 置精度 和第二 的取出 -20- 201137436 工序（第9圖） 在利用固化裝置200使基板用接著劑3固化後的基板 模組4中，將第一支承構件5和第二支承構件6的外周部 與支承用接著劑8 —倂切除。具體來說’在第一支承構件 5和第二支承構件6的外周部中前述第一基板和第二基板 與前述支承用接著劑之間，沿著其外周邊預先設定切斷除 去線（第9圖的C表示切斷除去線）。使未圖示的切斷手 段所具備的進行旋轉驅動的圓盤狀的切斷齒，沿著預先設 定的切斷除去線移動，將第一支承構件5和第二支承構件 6中比切斷除去線更靠外側的部分與支承用接著劑8 —倂 切除。由此，基板模組4被取出，因此將第一支承構件5 從第一基板1剝離，將第二支承構件6從第二基板2剝離 ，完成基板模組4。 藉由本實施例，達成以下的作用效果。 (a)在重疊裝置1〇〇中，將第一基板1和第二基板2 對位並進行重疊時，利用支承用接著劑8將對第一基板1 進行支承的第一支承構件5、和對第二基板2進行支承的 第二支承構件6相貼合。第一基板1和第二基板2係藉由 在固化前的狀態下黏度（黏著力）比基板用接著劑3高的 支承用接著劑8被牢固地接著。因此，藉由重疊裝置ι〇〇 被對位並被重疊的第一基板1和第二基板2係被夾持在第 —支承構件5和第二支承構件6之間並被保持，該第一支 承構件5和第二支承構件6比第一基板1和第二基板2之 間被更牢固地接著在相互之間無位置偏離的狀態。由此， -21 - 201137436 第一基板1和第二基板2在第一支承構件5和第二支承構 件6之間重疊保持爲無位置偏離的狀態，即使在介於兩基 板1、2之間的接著劑3由於黏度低等原因而在加熱前未 發揮黏著力的情況下，在被搬送到用於對塗敷在這些基板 1、2之間的基板用接著劑進行固化的固化裝置200時，即 使受到振動等，位置也不偏離，在固化裝置200中即使受 到對這些基板1、2所施加的熱量的影響、外力的作用等 ，也無位置偏離，能夠使基板用接著劑3固化並完成貼合 。因此，在保持這些基板1、2在重疊裝置100中被重疊 的對位精度的狀態完成貼合時，能夠提高這些基板1、2 的貼合位置精度，提高由這些基板1、2所構成的面板品 質。具體來說，在製造電子紙時，利用重疊裝置而高精度 地對作爲顯示模組部的第一基板1和作爲彩色濾光片基板 的第二基板2進行對位並加以重疊之後，直至利用固化裝 置2 00使介於兩基板1、2之間的接著劑3固化爲止的期 間內，因爲兩基板1、2之間的對位狀態被維持，所以能 夠將彩色濾光片基板高精度地接著固定在顯示模組部。因 此，能夠得到顯示品質良好的電子紙，該電子紙能夠防止 由彩色濾光片基板的位置偏離所引起的顯示色不均等。 (b)在減壓氣氛下，利用支承用接著劑8將第一支 承構件5和第二支承構件6相貼合。因此，在減壓氣氛下 利用支承用接著劑8將第一支承構件5和第二支承構件6 相貼合的結果，如上述（a )那樣將第一基板1和第二基 板2夾在第一支承構件5和第二支承構件6之間加以保持 -22- 201137436 而構成基板模組4，在減壓氣氛下密封該基板模組4。然 後，腔室12內返回至大氣壓，即使第一支承構件5和第 二支承構件6等暴露在大氣下，被夾入保持在第一支承構 件5和第二支承構件6之間的第一基板1和第二基板2依 然被密封在減壓氣氛下，這些基板1、2在受到大氣的外 壓的第一支承構件5和第二支承構件6之間進一步被牢固 地重疊並被保持，位置不會偏離，直至如上述（a)那樣 完成貼合，提高其貼合位置精度。 (c )第一支承構件5由可撓性膜所構成。由可撓性 膜所構成的支承構件5陷入到如上述（a )、（ b )那樣被 夾入保持的基板1的外周角和外周面地加以密封，能夠進 一步牢固地重疊並保持這些基板1、2。 (d )在對支承構件5進行支承的第一基台20上設置 彈性支承構件22的彈性凸部23。在對支承構件5進行支 承的第一基台20的保持面（上表面）上有變形時，彈性 支承構件2 2的彈性凸部2 3會吸收該變形。因此，重疊裝 置100能夠藉由第一和第二基台20、30，對第一基板1、 第二基板2及這些基板1、2之間的基板用接著劑3、以及 第一支承構件5和第二支承構件6的整個面均勻地施加重 疊負荷、貼合負荷，能夠提高由這些基板1、2所構成的 面板品質。 (e )在對由可撓性膜所構成的支承構件5進行支承 的第一基台20的外周部，即在與該支承構件5的塗敷支 承用接著劑8的部分相對應的外周部，設置高階差支承面 -23- 201137436 23A。因此，在利用塗敷在第一支承構件5和第二 件6的外周部的支承用接著劑8包圍第一基板1和 板2時，當支承用接著劑8的塗敷高度小於第一基 第二基板2的合計板厚時’能夠利用由可撓性膜所 支承構件5的彎曲來補充支承用接著劑8的塗敷高 足。由可撓性膜所構成的支承構件5’與支承用接 的塗敷高度不足的量相應地’被壓入對該支承構件 支承的第一基台20的外周部的高階差支承面23A 的內周側階差部，藉由支承用接著劑8與相對的另 支承構件6相貼合。因此，能夠利用支承用接著劑 可靠地接著第一支承構件5和第二支承構件6。 (f)基板用接著劑3具有熱固化性。將在重 100中如上述的方式重疊並保持的第—基板〗和第 2搬送至固化裝置200，對塗敷在這些基板1、2之 板用接著劑3進行加熱、加壓並進行固化。保持這 1、2在重疊裝置100中被重疊的對位精度的狀態而 合。 (g )基板用接著劑3固化後’切除第一支承 的外周部和第二支承構件6的外周部’能夠將以高 置精度所貼合的基板模組4提供給顯示用面板等。 另外，在實施例〗中，雖然在第一支承構件5 部塗敷支承用接著劑8，但是支承用接著劑8也可 在第一支承構件5及/或第二支承構件6的外周部》 支承構 第二基 板1和 構成的 度的不 著劑8 5進行 所包圍 一方的 8更加 疊裝置 二基板 間的基 些基板 完成貼 構件5 貼合位 的外周 以塗敷 -24- 201137436 (實施例2 )(第1 〇圖） 第1 〇圖所示的實施例2與實施例1不同之處是’在 重疊裝置100中，將第一基台20的彈性支承構件22上的 彈性凸部23撤去，第一支承構件5的整個下表面與形成 爲同樣平面的彈性支承構件22的上表面相接並被該彈性 支承構件22所支承。 (實施例3 )(第1 1圖、第1 2圖） 第11圖、第12圖所示的實施例3與實施例1的不同 之處是，僅使用1個支承構件6(也可以僅使用支承構件 5)。亦即，第一基板1被形成爲其外形大於第二基板2 的外形，從第二基板2伸出的部分是製造上所使用的餘白 部，是作爲製品所不需要的部分。在使用與實施例1相同 的重疊裝置100時，重疊裝置100能夠在第二基台30(具 有靜電保持構件32)對支承構件6進行支承，該支承構件 6對第二基板2進行支承，並且該重疊裝置丨〇〇能夠在第 一基台20直接對第一基板1進行支承。另外，在第一基 板1的外周部（餘白部）塗敷有支承用接著劑8(也可以 在支承構件6的外周部塗敷支承用接著劑8 )。在重疊裝 置1〇〇中’將第一基板1和第二基板2重疊時，將第一基 板1支承在第一基台20上，並且將支承構件6支承在第 二基台30上，利用支承用接著劑將第一基板1和支承構 件6相貼合。 藉由本實施例，達成以下的作用效果。 -25- 201137436 在重疊裝置】〇〇中，將第一基板1和第二基板2對位 並重疊時，利用支承用接著劑8將第一基板1和對第二基 板2進行支承的支承構件6相貼合。因此，藉由重疊裝置 1〇〇而被對位並被重疊的第一基板1和第二基板2係將第 二基板2夾持並保持在第一基板1和支承構件6之間，其 中，該第一基板〗和支承構件6藉由在固化前的狀態下其 黏度（接著力）比基板用接著劑3爲更高的支承用接著劑 8而被接著在比第一基板1和第二基板2之間更牢固且相 互之間沒有位置偏離的狀態。由此，第一基板1和第二基 板2在第一基板1和支承構件6之間被重疊保持在不會使 第二基板2發生位置偏離的狀態，在被搬送到用於對塗敷 在這些基板1、2之間的基板用接著劑3進行固化的固化 裝置200時，即使受到振動等，位置也不偏離，在固化裝 置2 00中即使受到對這些基板1、2施加的熱量的影響、 外力的作用等，位置也無偏離，使基板用接著劑3固化， 從而完成貼合。因此，能夠使這些基板1、2在重疊裝置 1 〇〇中保持重疊對位精度的狀態下完成貼合，能夠提高這 些基板1、2的貼合位置精度，提高由這些基板1、2所構 成的面板的品質。具體來說，在製造電子紙時，利用重疊 裝置將作爲顯示模組部的第一基板1和作爲彩色濾光片基 板的第二基板2高精度地對位並進行重疊之後，至利用固 化裝置2 00使介於兩基板1、2之間的接著劑3固化爲止 的期間，因爲兩基板1、2之間的對位狀態被維持，所以 能夠將彩色濾光片基板高精度地接著固定在顯示模組部。 -26- 201137436 因此’能夠得到能夠防止由於彩色濾光片的位置偏離所導 致的顯示色不均等的顯示品質良好的電子紙。 而且，即使是實施例3，也能夠在重疊裝置1 0 0的腔 室12內，在減壓氣氛下，利用支承用接著劑8將第一基 板1和支承構件6相貼合。達成與實施例1的前述（b ) 相同的作用效果。 另外’支承構件6也能夠是由可撓性膜所構成的構件 。達成與實施例1的前述（c)相同的作用效果。 另外’在對支承構件6進行支承的台3 0上也能夠設 置彈性支承面。達成與實施例1的前述（d )相同的作用 效果。 另外，能夠在對由可撓性膜所構成的支承構件6進行 支承的基台30的外周部，即在與該支承構件6的塗敷支 承用接著劑8的部分相對應的外周部，設置高階差支承面 。達成與實施例1的前述（e )相同的作用效果。 另外’也能夠使塗敷在第一基板和第二基板之間的基 板用接著劑3具有熱固化性，設置使基板用接著劑3固化 的加熱固化裝置2 0 0。採用與實施例1相同的固化裝置 2〇〇 ’達成與前述（f)相同的作用效果。 另外，也能夠設置切除裝置3 00，在利用固化裝置 200使基板用接著劑3固化後，利用該切除裝置300將支 承構件6的外周部和第一基板1的外周部切除。採用與實 施例1相同的固化裝置3 00，達成與前述（g )相同的作用 效果。 -27- 201137436 (實施例4) 實施例4與實施例1的不同之處是，採用由改善基板 模組4的光學特性的光學樹脂所構成者來作爲基板用接著 劑3。由光學樹脂所構成的基板用接著劑3是藉由照射紫 外線而硬化的UV硬化型（UV固化型），藉由紫外線照 射裝置而被固化。基板用接著劑3在由光學樹脂所構成的 情況下，亦由於黏度低等原因，基板用接著劑3在常溫下 不發揮接著性或其接著性非常弱，既可以塗敷液體狀或膏 狀者，也可以是黏貼片狀者。 因此，在實施例4中，亦能夠採用重疊裝置1 〇 〇、紫 外線照射裝置和切除裝置3 00 (不需要具有加熱爐20 1的 固化裝置200 )，以實施例1的（1 )〜（5 ) 、（ 7 )的結 構製造包括第一基板1和第二基板2的基板模組4。 另外’在實施例1的（5 )中，在紫外線照射裝置使 UV固化型的支承用接著劑8固化時，同樣由UV固化型 的光學樹脂所構成的本實施例的基板用接著劑3也同時進 行固化。然後’藉由實施例1的（7 )的切除裝置3 0 0，將 第一支承構件5和第二支承構件6的外周部與支承用接著 劑8 —起切除，取出基板模組4，將第一支承構件5從第 一基板1剝離’將第二支承構件6從第二基板2剝離，完 成基板模組4。 而根據本實施例，在重疊裝置1〇〇中，將第—基板i 和第二基板2對位並重疊時，利用支承用接著劑8將對第 -28- 201137436 一基板1進行支承的第一支承構件5、和對第二基板2進 行支承的第二支承構件6相貼合。第一基板1和第二基板 2藉由支承用接著劑8被牢固地貼合，其中，該支承用接 著劑8與基板用接著劑3相比，在固化前的狀態下其黏度 (黏著力）爲更高。因此，藉由重疊裝置100被對位並被 重疊的第一基板1和第二基板2被夾持在第一支承構件5 和第二支承構件6之間並被保持，該第一支承構件5和第 二支承構件6被接著在與第一基板1和第二基板2相比更 牢固地黏貼且相互之間無位置偏離的狀態。由此，第一基 板1和第二基板2在第一支承構件5和第二支承構件6之 間重疊保持在無位置偏離的狀態，即使在介於兩基板1、2 之間的接著劑3由於黏度低等原因而不發揮接著力的情況 下，被搬送到用於對塗敷在這些基板1、2之間的基板用 接著劑3進行UV硬化的紫外線照射裝置時，即使受到振 動等，位置也不偏離，在藉由紫外線照射裝置對接著劑3 施加的紫外線的照射而硬化的過程中，即使該接著劑3收 縮等’基板1、2的位置也不偏離，使基板用接著劑3固 化，從而完成貼合。因此，能夠使這些基板1、2保持在 重疊裝置1 00中被重疊的對位精度的狀態而完成貼合，能 夠提高這些基板1、2的貼合位置精度，提高包括這些基 板1、2的面板的品質。具體來說，在製造電子紙時，利 用重疊裝置高精度地將作爲顯示模組部的第一基板1和作 爲彩色濾光片基板的第二基板2對位並進行重疊之後，在 藉由固化裝置200使介於兩基板1、2之間的接著劑3固 -29- 201137436 化爲止的期間，因爲兩基板1、2之間的對位狀 ，所以能夠將彩色濾光片基板高精度地接著固定 組部。因此，能夠得到能夠防止由於彩色濾光片 離所導致的顯示色不均等的顯示品質良好的電子 另外，在減壓氣氛下，利用支承用接著劑8 承構件5和第二支承構件6相貼合。因此，在 100的減壓氣氛下利用支承用接著劑8將第一支 和第二支承構件6相貼合的結果，如上所述那樣 板1和第二基板2夾入保持在第一支承構件5和 構件6之間而形成基板模組4，且將該基板模組 減壓氣氛下。之後，腔室12內返回至大氣壓， 支承構件5和第二支承構件6等暴露在大氣下， 持在第一支承構件5和第二支承構件6之間的第 和第二基板2依然被密封在減壓氣氛下，因此這 、2在受到大氣的外壓的第一支承構件5和第二 6之間被更牢固地重疊保持，位置不會偏離，直 述那樣完成貼合’能夠提商第一基板1和第二基 合位置精度。 另外，由於使基板用接著劑3具有U V固化 重疊裝置100中如上述那樣重疊保持的第一基板 蕋板2搬送至紫外線照射裝置，使塗敷在這些3 之間的基板用接著劑3進行UV硬化並固化。使 】.、2保持在重疊裝置1〇〇中被重疊的對位精度的 成貼合。 態被維持 在顯示模 的位置偏 紙。 將第一支 重疊裝置 承構件5 將第一基 第二支承 4密封在 即使第一 被夾入保 ;一基板1 些基板1 支承構件 至如上所 板2的貼 性，將在 1和第二 !板卜2 這些基板 狀態而完 -30- 201137436 以上’雖然根據附圖對本發明的實施例進行了詳細說 明’但是本發明的具體結構並不被限定於該實施例，在不 脫離本發明的趣旨的範圍內進行的設計的變更等也包含於 本發明。 例如，在實施例1中，雖然在彈性支承構件22上設 置有彈性凸部2 3，但是也可以將兩者個別設置。例如，以 與支承用接著劑8對第一支承構件5的塗敷位置相對應的 矩陣框形狀的形狀設置預定高度的彈性凸部23，在彈性凸 部23的框區域的內側設置由比彈性凸部23更柔軟的彈性 材料所形成的彈性支承構件22。藉由採用這種結構，在藉 由第二基台30的下降，第二基板2隔著基板用接著劑3 而被按壓在第一基板1上時，即使彈性支承構件22被壓 垮，也由於彈性凸部23與彈性支承構件22被獨立地形成 ，且第一支承構件5由可撓性膜所構成，因此彈性凸部23 不會被壓垮而維持原來的形狀。因此，即使在塗敷在第一 支承構件5上的支承用接著劑8的塗敷高度小於兩基板1 、2的合計板厚的情況下，也能夠使支承用接著劑8確實 地接觸第二支承構件6並進行接著。另外，也可以利用彈 性材料代替彈性支承構件22，利用彈簧22S等彈性支承 具有對第一支承構件5進行支承的支承面的能夠升降的平 板2 2 P (第1 3圖）。 另外，在使第一支承構件5的下表面或第一基板1的 下表面接觸彈性支承構件22的上表面進行支承的情況下 ，也可以在彈性支承構件2 2的上表面設置真空吸附孔等 -31 - 201137436 吸附手段。 另外，雖然在減壓氣氛下進行第一基板1和第 2的重疊以及第一支承構件5和第二支承構件6的 但是並不限制於此，也可以在大氣壓下進行。即使 情況下，相重疊的第一基板1和第二基板2之間的 態係藉由被支承用接著劑8所接著的第一支承構件 二支承構件6予以維持，因此，在由固化裝置200 用接著劑3固化爲止的期間內，能夠防止相重疊的 板1和第二基板2之間的對位狀態被損壞。另外， 壓下進行第一基板1和第二基板2的重疊時，支承 劑8不需要連續塗敷爲封閉環狀，只要能夠得到能 第一基板1和第二基板2的位置偏離的程度的黏著 ，因此也可以斷續地進行塗敷。 另外，雖然對支承用接著劑8爲UV (紫外線 型的接著劑的例子進行了說明，但是並不限制於此 在固化前的狀態下具有比基板用接著劑爲更高的黏 著性）即可，因此也可以是熱固化性的接著劑、熱 用硬化型等。例如，在上述的實施例1中，在使支 著劑8爲熱固化性的情況下，省略在工序（5 )中 支承用接著劑8的硬化工序，而在工序（6)中與 接著劑3的固化同時進行支承用接著劑8的固化。 這種情況下，也因爲支承用接著劑8具有比基板用 3爲更高的黏度（黏著性），所以能夠利用其黏著 止第一支承構件5和第二支承構件6之間的位置偏 二基板 接著， 在這種 對位狀 5和第 使基板 第一基 在大氣 用接著 夠防止 力即可 )硬化 ，只要 度（黏 UV倂 承用接 所示的 基板用 即使是 接著劑 力來防 離，因 -32- 201137436 此也能夠防止夾在第一支承構件5和第二支承構件6之間 的第一基板1和第二基板2間的位置偏離，能夠防止在從 重疊開始到基板用接著劑3被固化爲止的期間在搬送中等 第一基板1和第二基板2之間的對位狀態被破壞。 另外，在重疊裝置100中，也可以設置支承用接著劑 8的臨時硬化用UV照射手段。例如，可以在第一基台20 或第二基台30中與支承用接著劑8的塗敷位置相對應的 一個部位或複數個部位設置連接UV光源的UV照射口， 在將第一基板1和第二基板2相重疊後，且在解除藉由靜 電保持構件3 2對第二支承構件6的保持之前，從UV照 射口向支承用接著劑8照射紫外線，使支承用接著劑8部 分硬化。另外，也可以與支承用接著劑8的塗敷位置的整 個區域相對應配置UV照射口，能夠使支承用接著劑8的 整個區域固化，來代替配置在重疊位置1 00和固化裝置 2 00之間的紫外線照射裝置。 另外，雖然以熱固化性的例子對介於第一基板1和第 二基板2之間的基板用接著劑3進行了說明，但是也能夠 使用藉由紫外線的照射而固化的UV硬化性的接著劑、或 藉由加壓而固化的加壓固化性的接著劑等。 另外’在實施例1〜4中’雖然在第一基板1和第二 基板2中的至少一方設置有支承構件，但是在第一基板1 和第二基板2雙方在其外周部具有餘白部等作爲製品所不 需要的部分的情況下，也可以使用第一基板1和第二基板 2雙方的餘白部作爲支承構件。 -33- 201137436 (產業上可利用性） 採用本發明，在將用於製造顯示面板的第一基板和第 二基板對位並重疊後，藉由對介於這些基板之間的基板用 接著劑進行固化，在完成這些基板的貼合時，能夠提高這 些基板的貼合位置精度。 【圖式簡單說明】 第1圖是表示顯示面板製造生產線的示意圖。 第2圖是表示實施例1的連板的貼合方法的示意圖。 第3圖是表示第一基板的貼合準備工序的示意圖。 第4圖是表示第二基板的貼合準備工序的示意圖。 第5圖是表示將第一基板和第二基板設置到貼合裝置 的工序的示意圖。 第6圖是表示貼合裝置中的第一基板和第二基板的重 疊工序的示意圖。 第7圖是表示利用支承用接著劑所進行的臨時固定工 序的示意圖。 第8圖是表示利用固化裝置所進行的基板用接著劑的 固化工序的示意圖》 .第9圖是表示利用切除裝置所進行的基板模組的取出 二序的示意圖。 第1 0圖是表示實施例2的基板的貼合方法的示意圖 -34- 201137436 第11圖是表示實施例3的基板的貼合方法的示意圖 〇 第12圖（A) 、（B)是表示基板的貼合準備工序的 不意圖。 第1 3圖是表示貼合裝置的變形例的示意圖。 【主要元件符號說明】 1 :第一基板 2 :第二基板 3 :基板用接著劑 4 :基板模組 5 :第一支承構件 6 :第二支承構件 7 :塗敷裝置 8 :支承用接著劑 9 :遮罩 1 1 :減壓泵 1 2 :腔室 1 3 :擋門 1 4 :出入口 20 :第一基台 2 1 :第一驅動源 22 :彈性支承構件 2 2 P :平板 -35- 201137436 2 2 S :彈簧 2 3 :彈性凸部 23A :高階差支承面 30 :第二基台 3 1 :第二驅動源 32 :靜電保持構件 4 0 :攝像手段 4 1 :第一攝像相機 42 :第二攝像相機 43 :定位裝置 44 :載置板 4 5 :透明窗 46 :空洞部 47 :控制裝置 5 0 :氣體供給源 5 1 :流量調整閥 1 00 :重疊裝置 2 0 0 :固化裝置 2 0 1 :加熱爐 2 0 2 :加壓構件 2 0 3 :支承台 3 00 :切除裝置 -36-[Technical Field] The present invention relates to a bonding method and apparatus for a substrate suitable for manufacturing a display panel such as an electronic paper or an organic EL element. [Prior Art] As a method of bonding a substrate, as disclosed in Patent Document 1, there is a method in which the substrate is cured by an adhesive after the first substrate and the second substrate are overlapped by an adhesive for the substrate. In the conventional bonding method of the substrate, first, the first substrate and the second substrate are passed through a substrate coated on one substrate by an adhesive. Then, the first substrate and the second substrate which are overlapped are transported between the pair of heating rolls, which are heating and pressing means, and the substrate is cured by the adhesive to complete the bonding. (Prior Art Document) (Patent Document 1) Japanese Laid-Open Patent Publication No. 2009-230955 (Problem to be Solved by the Invention) In the prior art, the first substrate and the second substrate which are overlapped are passed The substrate between the pair of rolls is cured by an adhesive between the substrates to complete the bonding of the substrates. Therefore, the first substrate and the second substrate which are overlapped may be displaced due to vibration or the like generated during the transfer from -5 to 201137436 of the substrates from the overlapping process to the heating process, or due to a pair of rollers The influence of the heat applied to these substrates, the action of an external force, and the like cause a positional shift, which in turn leads to a decrease in the accuracy of the bonding position of these substrates. An object of the present invention is to improve the bonding position accuracy of these substrates by laminating the first substrate and the second substrate and then curing the substrate adhesive between the substrates. (Means for Solving the Problem) The invention of claim 1 is a method for manufacturing a bonded substrate, in which a first substrate and a second substrate for manufacturing a display panel are superposed on each other through an adhesive for a substrate, and then the substrate is used A method of manufacturing a bonded substrate by curing the agent is characterized in that the first substrate is supported by a central portion of the first support member having an outer dimension larger than the first substrate, and the second substrate is supported by a central portion 'the second support member having a larger outer dimension than the second substrate is in a support surface side of the first support member that supports the first substrate and a support surface side of the second support member that supports the second substrate At least one of the 'attachment of the first substrate or the second substrate' is applied to the support adhesive agent which is more adhesive than the substrate adhesive before curing, and is supported by the first support member When the first substrate and the second substrate supported by the second supporting member overlap each other, the first supporting member and the first supporting member are used by the supporting adhesive The support member are bonded together. The invention of claim 2, wherein in the invention of claim 1, after the substrate adhesive is cured, the first support member is disposed between the first substrate and the second substrate and the support -6 - 201137436 adhesive It is cut off from the second support member. According to the invention of claim 1 or 2, in the invention of claim 1 or 2, the first support member and the second support member are bonded together by a supporting adhesive under a reduced pressure atmosphere. The invention of claim 3 is the invention of claim 3, wherein the first substrate is a display module substrate, and the second substrate is a color filter substrate. The invention of claim 5 is a method for producing a bonded substrate, wherein the first substrate and the second substrate having a margin portion on the outer periphery of the display panel are superposed on each other through an adhesive for the substrate, and then the substrate is used. A bonding substrate is produced by curing the adhesive, and the method of manufacturing the bonded substrate is characterized in that the second substrate is supported by a central portion of a supporting member having an outer dimension larger than the second substrate, and supported by the supporting member. At least one of the support surface side of the second substrate and the surface side of the first substrate that overlaps the second substrate surrounds the second substrate and is coated with the substrate adhesive When the first substrate and the second substrate are overlapped with each other, the supporting member and the first substrate are bonded together by the supporting adhesive when the first substrate and the second substrate are overlapped. According to the invention of claim 5, in the invention of claim 5, after the substrate adhesive is cured, the support member and the first substrate are cut between the second substrate and the support adhesive. According to the invention of claim 5, in the invention of claim 5 or 6, the support member and the first substrate are bonded together by a supporting adhesive under a reduced pressure atmosphere. The invention of claim 7 is the invention of claim 7, wherein the first base 201137436 is a display module substrate, and the second substrate is a color filter substrate. The invention of claim 9 is a manufacturing apparatus for a bonded substrate, wherein the first substrate and the second substrate for manufacturing the display panel are heavily salted by an adhesive for the substrate, and then the substrate is cured with an adhesive. A manufacturing apparatus for manufacturing a bonded substrate, comprising: a first base supporting a first supporting member having an outer shape larger than an outer shape of the first substrate; and the first supporting member at the first supporting member The central region supports the first substrate: a second base supporting a second supporting member having an outer dimension larger than an outer dimension of the second substrate, and supporting the second substrate: a driving portion in a central region of the second supporting member It moves the aforementioned first base and the second base in a relatively close or distant direction; and a control portion that controls the drive portion to move the first base and the second base adjacently, thereby When the first substrate and the second substrate are overlapped, the first substrate is supported by the first support member so as to surround the first substrate or the second substrate. At least one of the bearing surface side and the supporting surface side of the second supporting member that supports the second substrate, and the supporting adhesive agent having a larger adhesive force before curing than the substrate adhesive, A support member and the second support member are attached. The invention of claim 1 is the invention of claim 9, further comprising: a cutting device, wherein the substrate is cured with an adhesive, and between the first substrate and the second substrate and the supporting adhesive The first support member and the second support member are cut off. The invention of claim 1 is the invention of claim 9 or 10, further comprising: a chamber capable of decompressing the chamber, wherein the chamber can be used in a reduced pressure atmosphere using an adhesive for -8 - 201137436 The first support member and the second support member are bonded to each other. In the invention of claim 11, the at least one of the first support member and the second support member is formed of a flexible film. According to the invention of claim 12, in the invention of claim 12, the base supporting the support member formed of the flexible film is a portion corresponding to a portion of the support member for applying the support for the support member. A portion having a height higher than that corresponding to other portions of the support member is provided with a higher bearing surface. The invention of claim 13 is the invention of claim 13, wherein the first substrate is a display module substrate, and the second substrate is a color filter substrate. The invention of claim 15 is a manufacturing apparatus for a bonded substrate, wherein the first substrate and the second substrate having a margin portion on the outer periphery of the display panel are superposed on each other through an adhesive for the substrate, and then the substrate is used. The bonding substrate is manufactured by curing the adhesive, and the manufacturing apparatus of the bonding substrate is characterized in that: the first substrate is supported by the first substrate; and the second substrate is supported by the second substrate. a support member having a large outer dimension, the second substrate being supported in a central region of the support member; a driving portion moving the first base and the second base in a relatively close or distant direction; and fitting a device that controls the driving portion to move the first base and the second base adjacently, thereby coating the first substrate and the second substrate by overlapping with the size of the second substrate a surface side of the remaining portion of the first substrate that overlaps the second substrate, and at least one of the support surface of the support member that supports the second substrate Then the substrate bearing force greater before curing agent then, will be the first support member and the substrate are bonded together with adhesive compared. The invention of claim 1 is the invention of claim 15 further comprising a cutting device for supporting the substrate between the second substrate and the supporting adhesive after the substrate adhesive is cured The member is cut off from the aforementioned first substrate. The invention of claim 1 or claim 6 further comprising: a chamber capable of depressurizing, wherein the chamber is capable of supporting the support member with a supporting adhesive under a reduced pressure atmosphere The first substrate is bonded to each other. The invention of claim 18, wherein the support member is formed of a flexible film, the invention of claim 18, wherein the first substrate is a display module substrate, The second substrate is a color filter substrate. (Effect of the Invention) According to the present invention, after the first substrate and the second substrate for manufacturing the display panel are overlapped, the substrate between the substrates can be cured by an adhesive to complete the bonding of the substrates. In time, the bonding position accuracy of these substrates is improved. [Embodiment] (Example 1) (Fig. 1 to Fig. 9) The display panel manufacturing line shown in Fig. 1 transmits a first substrate and a -10-201137436 second substrate 2 to a first substrate. The film-form substrate formed on the first substrate is laminated with the adhesive 3, and then the substrate is cured with the adhesive 3 (curing by evaporation of the solvent and hardening by chemical reaction), thereby assembling the substrate mold. In the group 4, the production line has an overlapping device 100, a curing device 200, and a cutting device 300. In the state in which the first substrate 1 and the second substrate 2 are supported by the central regions of the first support member 5 and the second support member 6, respectively, the overlapping device 1 transmits the substrate adhesive for the substrate provided on the first substrate 1. 3. The first substrate 1 and the second substrate 2 are overlapped with a predetermined positional overlap accuracy. The curing device 200 cures the substrate between the substrates 1 and 2 overlapped by the overlapping device 100 with the adhesive 3. The cutting device 300 is configured to cure the substrate adhesive 3 by the curing device 200, and then the first support member 5 and the second support member 6 are closer to the central region than the first substrate 1 and the second substrate 2. The outer peripheral portion of the outer side is cut out, and the substrate module 4 is taken out. Further, here, the first substrate 1 is a display module substrate having an electrophoretic sheet in which a plurality of microcapsules are arranged in a matrix, and a switching element is formed corresponding to the microcapsules. It is composed of an element substrate such as an electrophoretic particle. Further, the second substrate 2 is a color filter substrate. Further, here, a region in which the first substrate 1 and the second substrate 2 are supported in the first support member 5 and the second support member 6 is a central region. Further, the outer peripheral portion is a region outside the central portion to the outer edges of the first support member 5 and the second support member 6. That is, the first support member 5 and the second support member 6 have a larger outer dimension (contour) than the first substrate 1 and the second substrate 2, and the first substrate 1 and the second substrate 2 are each -11 - The center of 201137436 is supported in a manner consistent with the first support member 5 and the second support member 6, respectively. Further, in this embodiment, the first substrate 1 and the second substrate 2 are the same size, and the first support member 5 and the second support member 6 have the same size. The overlapping device 1 has a chamber 12» which is depressurized by the decompression pump 11 as shown in Fig. 2, that is, the inside of the chamber 12 is decompressed by a decompression pump η to a predetermined pressure, for example, about 1 Pa. . An inlet and outlet 14 opened and closed by a shutter 13 is formed on one side of the chamber 12, and the first substrate 1 supported by the first supporting member 5 and the second substrate 2 supported by the second supporting member 6 are The entrance 14 is taken in and taken out. A first base 20 is disposed in the chamber 12 described above. The first base 20 is driven in the X, Y, and Θ directions by the first drive source 21. The first support member 5' supporting the first substrate 1 coated with the substrate adhesive 3 is supported by the first base 20 through the elastic support member 22 so that the support surface of the first substrate 1 faces upward. Keep the face (upper surface) on. A second base 30 is disposed above the first base 20. The second base 30 is driven in the weir direction approaching or away from the first base 20 by the second drive source 31. The holding surface of the lower surface of the second base 30 passes through the electrostatic holding member 32, and the second supporting member 6 that supports the second substrate 2 is held by electrostatic force. Further, the area of the holding surface of each of the bases 20, 30 is formed to be slightly larger than the area of the supporting members 5, 6 of the support substrates 1, 2. Further, the holding of the substrate 2 by the second base 30 is not limited to the use of the electrostatic holding member 32, and other holding members such as a vacuum suction holding member and an adhesive holding member may be used. 12-201137436 The first substrate 1 and the second substrate 2 held by the first base member 20 and the second base member 30 through the first support member 5 and the second support member 6, the four corner portions of which are respectively disposed in the cavity Four sets of imaging means 40 (only two sets of illustrations) below the chamber 1 2 are taken. Each of the imaging means 4 includes a first imaging camera 4 1 for coarse alignment and a second imaging camera 42 for precise alignment in which the imaging magnification is higher than that of the first imaging camera 4 1 . The first and second camera cameras 41, 42 of the respective imaging means 40 are driven in the X, Y and Z directions by positioning means 43 having X, Y and Z tables, and each positioning means 43 is arranged to be configured. On the mounting plate 44 below the chamber 12. At least the opposing portions of the bottom wall of the chamber 12 are formed in the transparent window 45. A portion of the first base 20 'elastic support member 22 disposed in the chamber 12 corresponding to the transparent window 45 is formed with a cavity portion 46 by the first and second camera cameras 41, The photographing of the first support member 5 (the support member 5 is formed of a light transmissive material, preferably formed of a transparent material) is held by the holding surface of the first base 2 and the elastic support member 22 . The four corners of the first substrate 1 and the four corners of the second substrate 2 that are transmitted through the first substrate 1 are held by the holding surface of the second base 30. A thick alignment mark and a precision alignment mark (not shown) are provided at the four corners on the outer sides of the first substrate 1 and the second substrate 2, respectively. By aligning the coarse alignment marks of the substrates 1 and 2, the first substrate 1 and the second substrate 2 can be roughly aligned, and by matching the precision alignment marks, the pair of substrates 1 can be aligned. 2 Perform precise alignment. -13-201137436 Here, in order to photograph the first and second substrates 1, 2, the cavity portion 46 is formed in the first base 2A and the elastic supporting member 20, but the first base may be formed without forming the cavity portion 46'. The table 20 and the elastic support member 22 are integrally formed of a transparent material. The image pickup signals of the first camera 4 1 and the second camera 42 are input to an image processing unit (not shown). The image processing unit processes the input imaging signal using a known image processing technique, and calculates the relative positional shift of the alignment marks of the substrates 1 and 2. That is, the image processing unit performs image processing on the image pickup signal of the first image pickup camera 41, and performs image recognition on the coarse alignment mark of the first substrate 1 and the coarse alignment mark of the second substrate 2, and calculates the two marks. Relative positional offset. Further, the image processing unit performs image processing on the imaging signal of the second imaging camera 42 to perform image recognition on the precise alignment mark of the first substrate 1 and the precise alignment mark of the second substrate 2, and calculates the relative orientation of the two markers. The position is offset. The image processing unit transmits the calculation result to an arithmetic processing unit (not shown) provided in the control device 47. In the arithmetic processing unit, the relative positional offsets of the pair of coarse alignment marks or the fine alignment marks respectively provided at the four corners of the first substrate 1 and the second substrate 2, which are calculated by the image processing unit, are Calculate the relative positional shifts in the X, Y, and Θ directions of these substrates 1, 2. When the positional shift of the pair of substrates 1 and 2 is calculated by the arithmetic processing unit, the positional shift is set in the memory unit (not shown) provided in the control device 47, and is also applied to the drive unit. (also not shown) output. Thereby, the driving unit outputs a driving signal to the first driving source 21 driving the first base 20, and drives the first substrate 20 upward in the X direction, the Y direction, and the θ side-14-201137436 to the first substrate. 1 is aligned with the second substrate 2. The alignment of the first substrate 1 and the second substrate 2 is performed by a coarse alignment based on an image pickup signal from the first camera camera 41 and a precise alignment based on an image pickup signal from the second camera 42. In addition, when the coarse alignment and the fine alignment of the first substrate 1 and the second substrate 2 are performed, the intervals of the first substrate 1 and the second substrate 2 may be the same, or may be compared with the coarse alignment, on the substrates 1 When the interval between 2 is closer, precise alignment is performed. The interval between the first substrate 丨 and the second substrate 2 is controlled by the drive unit of the control device 47 to control the first drive source 31. A gas supply source 50 for supplying a pressurized gas such as nitrogen is connected to the chamber 12 through the flow rate adjusting valve 51. By adjusting the opening degree of the flow rate adjusting valve 51, the flow rate of the gas supplied into the chamber 2 is adjusted, and the pressure in the chamber 12 decompressed by the pressure reducing pump 11 can be raised in accordance with a predetermined rising curve. The opening degree of the flow rate adjusting valve 51 is adjusted by the driving unit of the control device 47. Hereinafter, a method of manufacturing the substrate module 4 formed of the first substrate 1 and the second substrate 2 using the overlapping device 100, the curing device 200, and the cutting device 300 will be described together with these device configurations. (1) Bonding preparation step of the first substrate 1 (Fig. 3) The substrate adhesive 3 is applied to the upper surface of the first substrate 1 to form a film for the substrate adhesive 3, and the double-sided adhesive tape or the like is passed through. The lower surface of the first substrate 1 (the surface on the opposite side to the surface on which the substrate adhesive 3 is provided) is placed on the first support member 5 having a profile larger than the outline of the first substrate 1 ( Figure 3 (A)). In the present embodiment, the adhesive for substrate 3 of -15-201137436 has heat-curing property after being cured by heating, and the adhesiveness is not exhibited at normal temperature or the adhesion is extremely weak due to low viscosity. Further, the first support member 5 is formed of a translucent flexible film. Further, here, as the adhesive for the substrate 3, a liquid or paste-like adhesive may be applied, or a sheet-shaped adhesive may be attached. Further, the inner peripheral portion of the first supporting member 5 can be supported by the first substrate 1 before the film of the adhesive 3 for the substrate is formed. The support adhesive 8 (Fig. 3 (B), (C)) discharged from the coating device 7 is applied to the outer peripheral portion of the first support member 5 so as to be annularly connected in the circumferential direction. In the present embodiment, the supporting adhesive is a UV curing type (UV curing type) which is cured by ultraviolet irradiation. Further, the supporting adhesive 8 is an adhesive having a property of being stronger than that of the substrate adhesive 3 in a state before curing (curing). (2) Bonding preparation step of the second substrate 2 (Fig. 4) The lower surface of the second substrate 2 (the surface opposite to the surface to which the first substrate 1 is bonded) is placed by a double-sided adhesive tape or the like. The inner peripheral portion of the second support member 6 having a profile larger than the outline of the second substrate 2 is supported (Fig. 4). Among them, the second supporting member 6 is formed of a translucent glass substrate or a resin substrate. (3) The step of providing the first substrate 1 of the above (1) and the second substrate 2 of the above (2) to the overlapping device 100 (Fig. 5), placing the first supporting member 5 supporting the first substrate 1 on The elastic support members 22 of the first base 20 in the chamber 12 of the overlapping device 100 are supported. The first support member 5 is held by the -16-201137436 elastic support member 22 of the first base 20 by friction. At this time, in the present embodiment, since the total thickness of the substrate 1 and the second substrate 2 coated by the supporting adhesive 8 applied to the outer peripheral portion of the member 5 in the above (1) is small, the support is supported. The outer periphery of the elastic supporting member 22 of the first base 20 of the member 5 and the outer peripheral portion of the portion of the first supporting member 5 to which the supporting adhesive 8 is applied are provided with a frame-like shape having a high-order-difference supporting surface 2 3 A 23 . Thus, the lower surface of the first support member 5 coated with the support sub-portion is supported by the elastic convex portion 23, and the lower surface of the portion where the first support yoke supports the first substrate 1 forms a step height of the high-order differential branch. The gap. The shortage of the height of the supporting adhesive 8 is complemented by the deflection of the flexible first supporting member 5 (4) described later. Further, the bearing surface 2 3 A ' at the elastic convex portion 23 is formed with a vacuum suction hole in the frame shape of the elastic convex portion 23, and the first supporting member 5 can be vacuum-adsorbed. In addition, the upper surface of the elastic supporting member 22 on the inner side of the elastic body may be formed to be the same as the higher-order difference branch of the elastic convex portion 23 on the lower surface of the first supporting member 5 and the upper surface of the elastic 2 2 No gaps are formed between them. At this time, the elastic supporting member 22 can be formed by using an elastic material softer than 23, and when the first substrate 1 and the second substrate 2 are overlapped, the supporting surface of the elastic 22 corresponding to the first substrate 1 can be Sag with respect to the high face 23A. On the other hand, the first supporting height of the second supporting structure of the supporting table-substrate 2 is formed by the film of the bearing surface 2 3 A of the portion 5 corresponding to the first supporting portion and corresponding to the elastic convex portion 8 The bearing surface 23 A of the peripheral portion b portion 23 of the uncoated portion is coated with the upper portion of the support member. The elastic portion of the support member is adsorbed to the chamber of the overlapping device 100 as the back support member step support member 6 is static -17-201137436. The holding member 32 of the second abutment .30 in 12 is held. Next, the first substrate supported on the first base 20 as described above is aligned with the second substrate 2 supported by the second base 30 as described above. In other words, the pair of rough pairs or precise alignment of the four corners of the first substrate 1 and the second substrate 2 of the first imaging camera 41 or the second imaging camera 42 of the arithmetic processing unit of the control device 47 The marked imaging signals are used to calculate the relative positional shifts in the direction of the substrates 1, 2 and Θ. The control device 47 drives the first substrate 20 in the X direction, the Y direction, and the first substrate 20 in the X direction, the Y direction, and the second substrate 2 to perform the (4) superposition device 100 on the first substrate 1 and the second substrate 2 The substrate 1 and the second overlapping step (Fig. 6) drive the second substrate 30 in the Z-down direction by the driving portion of the control device 47 to align the first substrate 1 and the second substrate 2 with S The states overlap and the first member 5 and the second support member 6 are attached by the supporting adhesive 8. Thereby, the first substrate 1 and the second system constitute the substrate module 4 sandwiched between the first support member 5 and the second support member 6. Further, the inside of the chamber 12 is decompressed by the decompression pump 11 from the time before the overlap of the first substrate 1 and the second substrate. In the decompression atmosphere, the first substrate 1 and the second substrate 2 overlap. The first support member 5 and the second support member 6 are bonded together by a support joint. As a result, the substrate module 4 formed by the first substrate 1 and the second substrate 2 is sandwiched by the electrostatic protection substrate 1 and captured by the image capture marks J X and Y. The direction of the substrate 2 ( ί ( 3 ) - between the two substrates is supported by the upper and lower sides of the substrate 2, and the agent 8 will overlap between the first member -18-201137436 between the member member 5 and the second supporting member 6, sealed by the first 5 In the case where the second support member 6 and the support adhesive 8 are formed, the amount of application of the support adhesive 8 of the first support member 533 formed by the flexible film is insufficient. The inner circumferential side step portion of the first base 20 surrounded by the high-order differential branch of the elastic supporting member 22 is bonded to the opposing second supporting member-receiving adhesive 8 . That is, the overlapping device is a bonding device of the first and second supporting members 5, 6, and functions as a substrate mold in which the first substrate 1 and the second substrate 2 are sandwiched between the first supporting members 2 and the supporting members 6 The gas supplied from the gas supply source 50 in the group 4 is back pressure in the chamber 12. Thereby, the first supporting member 5 and the second supporting structure constituting the first substrate 1 of the substrate module 4 and the second external pressure of the atmosphere are firmly overlapped and held, and the aforementioned (3) energy can be reliably maintained / (5) The curing step of the supporting adhesive 8 (Fig. 7) is released by the electrostatic holding member 32 of the second base 30, and the second supporting member 6 constituting the substrate module 4 is removed. The electrostatic holding member 32 of the stage 30 raises the second base 30. The shutter 1 3 is opened, and the substrate module 4 is taken out from the entrance and exit 14 to carry the UV irradiation position between the curing device 200 and the curing device 200. Further, the solution of the electrostatic holding by the electrostatic holding member 32 of the stage 30 is performed after the first substrate 1 and the second substrate 2 are overlapped, and the supporting member is decompressed with the atmosphere and the above (the ground is pressed into the bearing surface 2 3 A 6 is also enabled by the support. The fifth and the second, the static second base is returned to the alignment between the members 6 by returning to the atmospheric substrate 2, and then sent to the second base. In addition, -19-201137436 may be a period in which the supply of gas is started in the chamber 12 after the first support member 5 and the second support member 6 are bonded together. At the irradiation position, the ultraviolet-ray-imparting adhesive 8 is cured by the entire substrate module 4 in the upper direction of the ultraviolet-irradiated substrate module 4 (not shown). At this time, the substrate 1, the second substrate 2, and the two are prevented from being irradiated with ultraviolet rays. The substrate agent 3 between the substrates 1 and 2 is disposed in a portion of the substrate module 4 corresponding to the substrate 3 with the adhesive 3 between the first substrate 1 and the second substrate 2' 1 '2. A support member 5 and a second support member 6 hold the first and second substrates 2 Hold the state firmly and reliably maintain the foregoing < The alignment state of the first substrate 1 and the second substrate 2. (6) The substrate module 4 is transferred to the curing device 200 by the substrate curing process (Fig. 8) by the curing device 200, and the substrate module 4 is heated in the curing furnace 20 1 . And the first substrate 1 and the first supporting member 5 and the second substrate 2 supporting member 6 of the base 4 are pressed by the pressing member 202 to the first substrate 1 and the second substrate 2 by the pressing member 202. The substrate is heated, pressurized, and cured. Thereby, the first substrate 1 and the plate 2 are bonded together in a state in which the overlapping device 100 of the above (3) is overlapped, and the bonding position accuracy of the first substrate 1 and the substrate 2 constituting the substrate module 4 is improved. . (7) The substrate module 4 by the cutting device 300 is used to carry out the inter-substrate and eject the first substrate 9 to be used. The substrate of the substrate 1 3) is placed in a 200-plate module and the second portion is subjected to the agent 3, the second substrate is set to be accurate, and the second is removed. The process -20-201137436 (Fig. 9) is made by the curing device 200. In the substrate module 4 in which the substrate adhesive 3 is cured, the outer peripheral portions of the first support member 5 and the second support member 6 and the supporting adhesive 8 are cut off. Specifically, in the outer peripheral portion of the first support member 5 and the second support member 6 , a cutting and removing line is set in advance along the outer periphery of the first substrate and the second substrate and the supporting adhesive (the first) C in Fig. 9 indicates cutting off the line). The disk-shaped cutting teeth that are rotationally driven by the cutting means (not shown) are moved along a predetermined cutting and removing line, and the first supporting member 5 and the second supporting member 6 are cut off. The portion on the outer side of the removal line is cut off from the support adhesive 8 . Thereby, since the substrate module 4 is taken out, the first support member 5 is peeled off from the first substrate 1, and the second support member 6 is peeled off from the second substrate 2 to complete the substrate module 4. According to this embodiment, the following effects are achieved. (a) When the first substrate 1 and the second substrate 2 are aligned and overlapped in the overlapping device 1A, the first supporting member 5 supporting the first substrate 1 and the supporting adhesive 8 are used. The second support member 6 that supports the second substrate 2 is bonded to each other. The first substrate 1 and the second substrate 2 are firmly adhered to each other by the supporting adhesive 8 having a higher viscosity (adhesion) than the substrate adhesive 3 in the state before curing. Therefore, the first substrate 1 and the second substrate 2, which are aligned and overlapped by the overlapping device ι, are sandwiched between the first support member 5 and the second support member 6 and held, the first The support member 5 and the second support member 6 are more firmly connected to each other than the first substrate 1 and the second substrate 2 without being displaced from each other. Thereby, -21 - 201137436, the first substrate 1 and the second substrate 2 are overlapped and held in a state of no positional deviation between the first support member 5 and the second support member 6, even between the two substrates 1, 2 When the adhesive 3 does not exert an adhesive force before heating due to a low viscosity or the like, when it is conveyed to the curing device 200 for curing the substrate adhesive applied between the substrates 1 and 2, Even if it is subjected to vibration or the like, the position does not deviate. In the curing device 200, even if it is affected by the heat applied to the substrates 1 and 2, or the external force, there is no positional deviation, and the substrate adhesive 3 can be cured. Finish the fit. Therefore, when the bonding of the substrates 1 and 2 in the overlapping accuracy of the superimposing apparatus 100 is completed, the bonding position accuracy of the substrates 1 and 2 can be improved, and the substrates 1 and 2 can be improved. Panel quality. Specifically, when manufacturing the electronic paper, the first substrate 1 as the display module portion and the second substrate 2 as the color filter substrate are aligned and superimposed with high precision by the overlapping device, and then used until use. In the period from the curing device 200 to the curing of the adhesive 3 between the substrates 1 and 2, the alignment state between the substrates 1 and 2 is maintained, so that the color filter substrate can be accurately mounted. Then fixed to the display module section. Therefore, it is possible to obtain electronic paper of good display quality, which can prevent display color unevenness caused by the positional deviation of the color filter substrate. (b) The first support member 5 and the second support member 6 are bonded together by a supporting adhesive 8 in a reduced pressure atmosphere. Therefore, as a result of bonding the first support member 5 and the second support member 6 by the supporting adhesive 8 in a reduced pressure atmosphere, the first substrate 1 and the second substrate 2 are sandwiched as in the above (a). The substrate module 4 is constructed by holding a support member 5 and a second support member 6 between -22 and 201137436, and the substrate module 4 is sealed under a reduced pressure atmosphere. Then, the inside of the chamber 12 is returned to the atmospheric pressure, and even if the first supporting member 5 and the second supporting member 6 and the like are exposed to the atmosphere, the first substrate held between the first supporting member 5 and the second supporting member 6 is sandwiched. 1 and the second substrate 2 are still sealed under a reduced pressure atmosphere, and the substrates 1, 2 are further firmly overlapped and held between the first support member 5 and the second support member 6 which are subjected to the external pressure of the atmosphere, at a position It does not deviate until the bonding is completed as in the above (a), and the fitting position accuracy is improved. (c) The first support member 5 is composed of a flexible film. The support member 5 made of the flexible film is sealed by the outer peripheral angle and the outer peripheral surface of the substrate 1 sandwiched and held as described in the above (a) and (b), and the substrate 1 can be further firmly stacked and held. ,2. (d) The elastic convex portion 23 of the elastic supporting member 22 is provided on the first base 20 supporting the supporting member 5. When there is deformation on the holding surface (upper surface) of the first base 20 supporting the support member 5, the elastic convex portion 23 of the elastic supporting member 2 2 absorbs the deformation. Therefore, the overlapping device 100 can apply the adhesive 3 for the substrate between the first substrate 1 and the second substrate 2 and the substrates 1 and 2, and the first supporting member 5 by the first and second substrates 20 and 30. The overlapping load and the bonding load are uniformly applied to the entire surface of the second support member 6, and the quality of the panel formed by the substrates 1 and 2 can be improved. (e) an outer peripheral portion of the first base 20 that supports the support member 5 made of a flexible film, that is, an outer peripheral portion corresponding to a portion of the support member 5 for applying the support adhesive 8 , set the high-order difference bearing surface -23- 201137436 23A. Therefore, when the first substrate 1 and the plate 2 are surrounded by the supporting adhesive 8 applied to the outer peripheral portions of the first supporting member 5 and the second member 6, the coating height of the supporting adhesive 8 is smaller than that of the first substrate. When the total thickness of the second substrate 2 is large, the coating of the supporting adhesive 8 can be supplemented by the bending of the member 5 supported by the flexible film. The support member 5' composed of the flexible film is pressed into the high-order-difference support surface 23A of the outer peripheral portion of the first base 20 supported by the support member in accordance with the amount of the coating height of the support joint being insufficient. The inner circumferential side step portion is bonded to the opposing other supporting member 6 by the supporting adhesive 8 . Therefore, the first support member 5 and the second support member 6 can be reliably followed by the supporting adhesive. (f) The adhesive for substrate 3 has thermosetting property. The first substrate and the second substrate which are superposed and held in the above-described manner in the weight 100 are transferred to the curing device 200, and the adhesive 3 for the plates applied to the substrates 1 and 2 is heated, pressurized, and cured. The state in which these 1, 2 are overlapped in the overlapping device 100 is maintained. (g) After the substrate adhesive 3 is cured, the outer peripheral portion of the first support and the outer peripheral portion of the second support member 6 are removed, and the substrate module 4 bonded with high precision can be supplied to the display panel or the like. Further, in the embodiment, the support adhesive 8 is applied to the first support member 5, but the support adhesive 8 may be on the outer peripheral portion of the first support member 5 and/or the second support member 6. Supporting the second substrate 1 and the degree of non-adhesive agent 8 5 of the structure, the base of the substrate between the two substrates is surrounded by the substrate, and the outer periphery of the bonding member 5 is adhered to apply -24-201137436 Example 2) (Fig. 1) The second embodiment shown in Fig. 1 differs from the first embodiment in that 'in the overlapping device 100, the elastic convex portion on the elastic supporting member 22 of the first base 20 is 23 is removed, and the entire lower surface of the first support member 5 is in contact with and supported by the upper surface of the elastic support member 22 formed in the same plane. (Embodiment 3) (Fig. 1 and Fig. 1 2) The third embodiment shown in Fig. 11 and Fig. 12 is different from the first embodiment in that only one support member 6 is used (may be only A support member 5) is used. That is, the first substrate 1 is formed to have an outer shape larger than that of the second substrate 2, and the portion protruding from the second substrate 2 is a margin portion used in manufacturing, which is an unnecessary portion of the article. When the same overlapping apparatus 100 as in Embodiment 1 is used, the overlapping apparatus 100 can support the support member 6 on the second base 30 (having the electrostatic holding member 32), which supports the second substrate 2, and The overlapping device 丨〇〇 can directly support the first substrate 1 on the first base 20 . Further, the outer peripheral portion (the remaining portion) of the first substrate 1 is coated with the supporting adhesive 8 (the supporting adhesive 8 may be applied to the outer peripheral portion of the supporting member 6). When the first substrate 1 and the second substrate 2 are overlapped in the overlapping device 1 , the first substrate 1 is supported on the first base 20 and the support member 6 is supported on the second base 30, using The first substrate 1 and the support member 6 are bonded to each other by a bonding agent for support. According to this embodiment, the following effects are achieved. -25-201137436 In the case of a superimposing device, when the first substrate 1 and the second substrate 2 are aligned and overlapped, the first substrate 1 and the supporting member for supporting the second substrate 2 are supported by the supporting adhesive 8 6 phase fit. Therefore, the first substrate 1 and the second substrate 2 which are aligned and overlapped by the overlapping device 1 are sandwiched and held between the first substrate 1 and the support member 6, wherein The first substrate and the support member 6 are subsequently bonded to the first substrate 1 and the second by a bonding adhesive 8 having a higher viscosity (adhesion force) than the substrate adhesive 3 in a state before curing. The substrates 2 are stronger and have no positional deviation from each other. Thereby, the first substrate 1 and the second substrate 2 are overlapped and held between the first substrate 1 and the support member 6 in a state in which the second substrate 2 is not displaced, and is transported to be used for coating When the substrate between the substrates 1 and 2 is cured by the adhesive 3, the position is not deviated even when subjected to vibration or the like, and even the heat applied to the substrates 1 and 2 is affected by the curing device 200. The action of the external force, etc., does not deviate from the position, and the substrate is cured with the adhesive 3 to complete the bonding. Therefore, the substrates 1 and 2 can be bonded together while maintaining the overlapping alignment accuracy in the stacking device 1 , and the bonding position accuracy of the substrates 1 and 2 can be improved, and the substrates 1 and 2 can be improved. The quality of the panel. Specifically, when the electronic paper is manufactured, the first substrate 1 as the display module portion and the second substrate 2 as the color filter substrate are accurately aligned and overlapped by the overlapping device, and then the curing device is used. In the period from the time when the adhesive 3 between the two substrates 1 and 2 is cured, the alignment state between the two substrates 1 and 2 is maintained, so that the color filter substrate can be accurately fixed next to each other. Display module part. -26-201137436 Therefore, it is possible to obtain an electronic paper which is excellent in display quality capable of preventing display color unevenness due to positional deviation of the color filter. Further, even in the third embodiment, the first substrate 1 and the support member 6 can be bonded together by the supporting adhesive 8 in the chamber 12 of the stacking device 100 in a reduced pressure atmosphere. The same effects as the above (b) of Example 1 were achieved. Further, the support member 6 can also be a member made of a flexible film. The same effects as the above (c) of the first embodiment were achieved. Further, the elastic support surface can be provided on the table 30 that supports the support member 6. The same effects as the above (d) of the first embodiment were achieved. In addition, the outer peripheral portion of the base 30 that supports the support member 6 made of the flexible film, that is, the outer peripheral portion corresponding to the portion of the support member 6 for applying the support adhesive 8 can be provided. High step difference bearing surface. The same effects as the above (e) of the first embodiment were achieved. Further, the substrate adhesive 3 applied between the first substrate and the second substrate can be thermally cured, and a heat curing device 200 for curing the substrate adhesive 3 can be provided. The same effect as the above (f) was achieved by using the same curing apparatus as in Example 1. Further, the cutting device 300 can be provided, and after the substrate adhesive 3 is cured by the curing device 200, the outer peripheral portion of the support member 6 and the outer peripheral portion of the first substrate 1 are cut off by the cutting device 300. The same effect as the above (g) was achieved by using the same curing apparatus 300 as in the first embodiment. -27-201137436 (Embodiment 4) The fourth embodiment differs from the first embodiment in that an optical resin which improves the optical characteristics of the substrate module 4 is used as the substrate adhesive 3. The substrate adhesive 3 composed of an optical resin is a UV curing type (UV curing type) which is cured by irradiation with ultraviolet rays, and is cured by an ultraviolet irradiation device. In the case where the substrate adhesive 3 is composed of an optical resin, the substrate adhesive 3 does not exhibit adhesiveness at normal temperature or its adhesion is extremely weak, and may be applied in a liquid or paste form. It can also be a patch. Therefore, in Embodiment 4, it is also possible to employ the overlapping device 1 〇〇, the ultraviolet ray irradiation device, and the cutting device 300 (the curing device 200 having the heating furnace 20 1 is not required), and (1) to (5) of the embodiment 1. The structure of (7) manufactures the substrate module 4 including the first substrate 1 and the second substrate 2. In the case of (5) of the first embodiment, when the UV-curable support adhesive 8 is cured by the ultraviolet irradiation device, the substrate adhesive 3 of the present embodiment which is also composed of the UV-curable optical resin is also used. Curing is carried out simultaneously. Then, the outer peripheral portion of the first support member 5 and the second support member 6 is cut off together with the support adhesive 8 by the cutting device 300 of the seventh embodiment (7), and the substrate module 4 is taken out. The first support member 5 is peeled off from the first substrate 1 'the second support member 6 is peeled off from the second substrate 2 to complete the substrate module 4. According to the present embodiment, when the first substrate i and the second substrate 2 are aligned and overlapped in the overlapping device 1A, the substrate -28-201137436 is supported by the bonding agent 8 for support. A support member 5 and a second support member 6 that supports the second substrate 2 are bonded to each other. The first substrate 1 and the second substrate 2 are firmly bonded by the supporting adhesive 8 which has a viscosity (adhesion force) in a state before curing as compared with the substrate adhesive 3 ) is higher. Therefore, the first substrate 1 and the second substrate 2, which are aligned and overlapped by the overlapping device 100, are sandwiched between and held by the first supporting member 5 and the second supporting member 6, the first supporting member 5 The second supporting member 6 is then adhered more firmly than the first substrate 1 and the second substrate 2 without being displaced from each other. Thereby, the first substrate 1 and the second substrate 2 are overlapped and held in a state of no positional deviation between the first supporting member 5 and the second supporting member 6, even in the adhesive 3 interposed between the two substrates 1, 2. When the ultraviolet ray irradiation device for UV-curing the substrate adhesive 3 applied between the substrates 1 and 2 is carried out, the vibration is not transmitted, and the vibration is applied to the substrate. In the process of hardening by the irradiation of the ultraviolet rays applied to the adhesive 3 by the ultraviolet irradiation device, the position of the substrates 1 and 2 does not deviate even if the adhesive 3 shrinks, and the substrate adhesive 3 is used. Cured to complete the fit. Therefore, the substrates 1 and 2 can be held in the state of the alignment accuracy in which the superimposing apparatus 100 is superimposed, and the bonding position accuracy of the substrates 1 and 2 can be improved, and the substrate including the substrates 1 and 2 can be improved. The quality of the panel. Specifically, when the electronic paper is manufactured, the first substrate 1 as the display module portion and the second substrate 2 as the color filter substrate are aligned and superposed by the overlapping device with high precision, and then cured by curing. In the period in which the device 200 is fixed between the two substrates 1 and 2, -29-201137436, since the alignment between the two substrates 1 and 2 is performed, the color filter substrate can be accurately positioned. Then fix the group. Therefore, it is possible to obtain an electron having excellent display quality capable of preventing display color unevenness due to the color filter from being separated, and attaching the support adhesive member 8 and the second support member 6 in a reduced pressure atmosphere. Hehe. Therefore, as a result of bonding the first branch and the second supporting member 6 by the supporting adhesive 8 under a reduced pressure atmosphere of 100, the sheet 1 and the second substrate 2 are sandwiched and held by the first supporting member as described above. The substrate module 4 is formed between the 5 and the member 6, and the substrate module is subjected to a reduced pressure atmosphere. Thereafter, the inside of the chamber 12 is returned to the atmospheric pressure, the support member 5 and the second support member 6 and the like are exposed to the atmosphere, and the first and second substrates 2 held between the first support member 5 and the second support member 6 are still sealed. In a reduced-pressure atmosphere, therefore, 2 is more firmly overlapped between the first support member 5 and the second 6 which are subjected to the external pressure of the atmosphere, and the position does not deviate, and the fitting is completed as described above. First substrate 1 and second base position accuracy. In addition, the substrate substrate 3 has the first substrate raft 2 which is superposed and held as described above in the UV curing superposition apparatus 100, and is transported to the ultraviolet ray irradiation apparatus by the adhesive 3, and the substrate 3 coated between the three is subjected to UV. Hardens and cures. Between the two, the alignment accuracy of the overlapping alignments in the overlapping device 1 is maintained. The state is maintained at the position where the display mode is offset. The first overlapping device bearing member 5 seals the first base second support 4 even if the first one is clamped; the substrate 1 substrate 1 supporting member to the above-mentioned board 2 will be in the first and second The board is in the state of the substrate -30-201137436 or more. Although the embodiment of the present invention has been described in detail with reference to the drawings, the specific structure of the present invention is not limited to the embodiment, without departing from the invention. Changes in design made in the scope of the present invention are also included in the present invention. For example, in the first embodiment, although the elastic convex portion 23 is provided on the elastic supporting member 22, both of them may be separately provided. For example, the elastic convex portion 23 having a predetermined height is provided in a shape of a matrix frame shape corresponding to the application position of the first supporting member 5 by the supporting adhesive 8, and the elastic convex portion is provided on the inner side of the frame region of the elastic convex portion 23. The elastic support member 22 formed by the softer elastic material of the portion 23. By adopting such a configuration, when the second substrate 2 is pressed against the first substrate 1 via the substrate adhesive 3 via the lowering of the second substrate 30, even if the elastic supporting member 22 is crushed, Since the elastic convex portion 23 and the elastic supporting member 22 are independently formed, and the first supporting member 5 is constituted by the flexible film, the elastic convex portion 23 is not compressed and maintains the original shape. Therefore, even when the coating height of the supporting adhesive 8 applied to the first supporting member 5 is smaller than the total thickness of the two substrates 1 and 2, the supporting adhesive 8 can surely contact the second The support member 6 is then carried on. Further, instead of the elastic supporting member 22, an elastic material may be used to elastically support the flat plate 2 2 P (Fig. 3) having the supporting surface for supporting the first supporting member 5 by the spring 22S or the like. Further, when the lower surface of the first support member 5 or the lower surface of the first substrate 1 is supported by the upper surface of the elastic support member 22, a vacuum suction hole or the like may be provided on the upper surface of the elastic support member 22. -31 - 201137436 Adsorption means. Further, although the first substrate 1 and the second overlap and the first support member 5 and the second support member 6 are carried out under a reduced pressure atmosphere, the present invention is not limited thereto, and may be carried out under atmospheric pressure. Even in the case where the state between the first substrate 1 and the second substrate 2 which are overlapped is maintained by the first supporting member 2 supporting member 6 followed by the supporting adhesive 8, the curing device 200 is used. During the period from the curing of the adhesive 3, it is possible to prevent the alignment state between the stacked plates 1 and 2 to be damaged. Further, when the overlap of the first substrate 1 and the second substrate 2 is performed by pressing, the support agent 8 does not need to be continuously applied in a closed ring shape as long as the positional deviation of the first substrate 1 and the second substrate 2 can be obtained. Adhesive, so it can also be applied intermittently. In addition, although the support adhesive 8 is UV (an example of an ultraviolet type adhesive agent, it is not limited to this, it has a higher adhesiveness than a substrate adhesive in a state before curing). Therefore, it may be a thermosetting adhesive, a heat curing type, or the like. For example, in the first embodiment described above, when the anchoring agent 8 is thermosetting, the curing step of the supporting adhesive 8 in the step (5) is omitted, and in the step (6), the adhesive is used. The curing of 3 simultaneously performs the curing of the supporting adhesive 8 . Also in this case, since the supporting adhesive 8 has a higher viscosity (adhesiveness) than the substrate 3, it is possible to adhere to the position between the first supporting member 5 and the second supporting member 6 by the adhesion thereof. The substrate is then cured in such a directional shape 5 and the first substrate of the first substrate is used in the atmosphere to prevent the force, as long as the degree of adhesion (the adhesion of the substrate is improved by the adhesion of the substrate). Therefore, the positional deviation between the first substrate 1 and the second substrate 2 sandwiched between the first support member 5 and the second support member 6 can be prevented, and it is possible to prevent the substrate from being overlapped to the substrate. In the period until the adhesive 3 is cured, the alignment state between the first substrate 1 and the second substrate 2 during the transfer is broken. Further, in the overlapping device 100, the temporary curing UV for the supporting adhesive 8 may be provided. For example, a UV irradiation port to which a UV light source is connected may be provided in one or a plurality of portions of the first base 20 or the second base 30 corresponding to the application position of the supporting adhesive 8 a substrate 1 and After the two substrates 2 are overlapped, and before the holding of the second supporting member 6 by the electrostatic holding member 32, the ultraviolet rays are irradiated to the supporting adhesive 8 from the UV irradiation port, and the supporting adhesive 8 is partially cured. Alternatively, the UV irradiation port may be disposed corresponding to the entire application position of the bonding agent 8 for support, and the entire region of the supporting adhesive 8 may be cured instead of being disposed between the overlapping position 100 and the curing device 200. Further, although the substrate adhesive 3 interposed between the first substrate 1 and the second substrate 2 has been described as an example of thermosetting property, it can be cured by irradiation with ultraviolet rays. a UV-curable adhesive or a pressure-curable adhesive which is cured by pressurization, etc. Further, in the first to fourth embodiments, at least one of the first substrate 1 and the second substrate 2 is provided. In the case where both the first substrate 1 and the second substrate 2 have a portion where the white portion or the like is not required as a product in the outer peripheral portion, both the first substrate 1 and the second substrate 2 may be used. The remaining white portion is used as a supporting member. -33- 201137436 (Industrial Applicability) According to the present invention, after the first substrate and the second substrate for manufacturing the display panel are aligned and overlapped, The substrate between the substrates is cured with an adhesive, and when the bonding of the substrates is completed, the bonding position accuracy of the substrates can be improved. [Schematic Description] Fig. 1 is a schematic view showing a display panel manufacturing line. Fig. 3 is a schematic view showing a bonding step of the first substrate. Fig. 4 is a schematic view showing a bonding preparation step of the second substrate. The figure is a schematic view showing a process of providing a first substrate and a second substrate to a bonding apparatus. Fig. 6 is a schematic view showing a process of overlapping the first substrate and the second substrate in the bonding apparatus. Fig. 7 is a schematic view showing a temporary fixing process by an adhesive for support. Fig. 8 is a schematic view showing a curing step of the substrate adhesive used in the curing device. Fig. 9 is a schematic view showing the second order of removal of the substrate module by the cutting device. FIG. 10 is a schematic view showing a method of bonding a substrate of Example 2. -34-201137436 FIG. 11 is a schematic view showing a method of bonding a substrate of Example 3. FIG. 12(A) and FIG. The process of preparing the bonding of the substrates is not intended. Fig. 13 is a schematic view showing a modification of the bonding apparatus. [Description of main component symbols] 1 : First substrate 2 : Second substrate 3 : Substrate for substrate 4 : Substrate module 5 : First support member 6 : Second support member 7 : Coating device 8 : Adhesive for support 9: mask 1 1 : decompression pump 1 2 : chamber 1 3 : shutter 1 4 : inlet and outlet 20 : first base 2 1 : first drive source 22: elastic support member 2 2 P : flat plate - 35- 201137436 2 2 S : Spring 2 3 : Elastic convex portion 23A : High-order differential support surface 30 : Second base 3 1 : Second drive source 32 : Electrostatic holding member 40 : Imaging means 4 1 : First camera 42 : Second camera 23 : positioning device 44 : mounting plate 4 5 : transparent window 46 : cavity portion 47 : control device 5 0 : gas supply source 5 1 : flow rate adjustment valve 1 00 : overlapping device 2 0 0 : curing device 2 0 1 : heating furnace 2 0 2 : pressurizing member 2 0 3 : support table 3 00 : cutting device - 36-